Circuit board shaping device and circuit board shaping method

Abstract

The present invention discloses a circuit board shaping device, which relates to the technical field of circuit boards, and includes a frame with a positioning platform provided on the frame; a first clamping mechanism and a second clamping mechanism, the first clamping mechanism and the second clamping mechanism being used to clamp the left and right edges of the circuit board on the positioning platform, respectively; a linear drive mechanism, the linear drive mechanism being used to drive the first clamping mechanism and the second clamping mechanism to move away from or toward each other; a first rotary drive mechanism and a second rotary drive mechanism, the first rotary drive mechanism being used to drive the first clamping mechanism to rotate so that the first clamping mechanism can break off excess sheet material on the left edge of the circuit board, and the second rotary drive mechanism being used to drive the second clamping mechanism to rotate so that the second clamping mechanism can break off excess sheet material on the right edge of the circuit board. The circuit board shaping device can simultaneously break off excess sheet material on the left and right edges of the circuit board, thereby improving the shaping efficiency of the circuit board and facilitating the subsequent assembly efficiency of the circuit board.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and in particular to a circuit board shaping device and a circuit board shaping method. Background Art

[0002] After the circuit board is installed, the operator will use pliers to grab the excess material on the edge of the circuit board and break it off to obtain a circuit board that meets the specified shape, thus completing the circuit board shaping. The circuit board that meets the specified shape can then be shelled. This method of using pliers to break off the excess material on the edge of the circuit board is slow, reduces the efficiency of circuit board shaping, and is not conducive to improving the efficiency of subsequent circuit board shelling. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a circuit board shaping device that can quickly break off excess board material on the edge of the circuit board, thereby improving the efficiency of subsequent circuit board casing.

[0004] The present invention also provides a circuit board shaping method having the circuit board shaping device.

[0005] A circuit board shaping device according to a first embodiment of the present invention includes:

[0006] A frame, wherein a positioning platform is provided on the frame, and the positioning platform is used to position the circuit board;

[0007] A transport mechanism, the transport mechanism being provided on the frame and being used to transport the circuit board to the positioning platform or to move the circuit board away from the positioning platform;

[0008] a first clamping mechanism and a second clamping mechanism, wherein the first clamping mechanism and the second clamping mechanism are respectively arranged on the left and right sides of the positioning platform, and the first clamping mechanism and the second clamping mechanism are both slidably connected to the frame along the left and right directions, and the first clamping mechanism and the second clamping mechanism are respectively used to clamp excess plate materials on the left and right edges of the circuit board on the positioning platform;

[0009] a linear drive mechanism, the linear drive mechanism being disposed on the frame and configured to drive the first clamping mechanism and the second clamping mechanism to move away from or toward each other, so that the transport mechanism can transport the circuit board to the positioning table, or the first clamping mechanism and the second clamping mechanism can respectively clamp excess plate materials on the left and right edges of the circuit board;

[0010] A first rotary drive mechanism and a second rotary drive mechanism, wherein the first rotary drive mechanism is used to drive the first clamping mechanism to rotate, and the second rotary drive mechanism is used to drive the second clamping mechanism to rotate, so that the first clamping mechanism and the second clamping mechanism can rotate in opposite directions, and the first clamping mechanism and the second clamping mechanism can respectively break off the excess plate materials on the left and right edges of the circuit board.

[0011] It has at least the following beneficial effects:

[0012] When excess sheet material on the left and right edges of a circuit board needs to be broken off and removed, the linear drive mechanism first drives the first and second clamping mechanisms away from each other, and then the transport mechanism transports the circuit board to the positioning table. The positioning table positions the circuit board. The linear drive mechanism then drives the first and second clamping mechanisms toward each other, so that the first clamping mechanism holds the excess sheet material on the left edge of the circuit board, and the second clamping mechanism holds the excess sheet material on the right edge. The first rotary drive mechanism then rotates the first clamping mechanism, while the second rotary drive mechanism rotates the second clamping mechanism. The first and second clamping mechanisms now rotate in opposite directions, allowing the first rotary drive mechanism to break off the excess sheet material on the left edge of the circuit board, and the second rotary drive mechanism to break off the excess sheet material on the right edge of the circuit board, thereby completing the circuit board's shaping. After the circuit board is shaped, the linear drive mechanism drives the first and second clamping mechanisms away from each other, and the transport mechanism then removes the shaped circuit board from the positioning table to allow for the next circuit board to be shaped. The circuit board shaping device can simultaneously break off excess plate materials on the left and right edges of the circuit board, thereby improving the shaping efficiency of the circuit board and further facilitating the improvement of the subsequent assembly efficiency of the circuit board.

[0013] According to the circuit board shaping device of the first aspect of the present invention, the first clamping mechanism includes a first lower clamping block, a first upper clamping block, a first lifting cylinder and a first bracket, the first bracket is arranged on the left side of the positioning platform, the first bracket can be slidably connected to the frame in the left and right directions, the front and rear ends of the first lower clamping block can be rotatably connected to the first bracket, the cylinder body of the first lifting cylinder is connected to the first lower clamping block, the piston rod of the first lifting cylinder is connected to the first upper clamping block, the gap between the first upper clamping block and the first lower clamping block is used for passing the excess plate on the left edge of the circuit board, the first lifting cylinder is used to drive the first upper clamping block close to or away from the first lower clamping block, so that the first upper clamping block and the first lower clamping block can clamp the excess plate on the left edge of the circuit board, and the first lower clamping block is connected to the output end of the first rotation drive mechanism.

[0014] According to the circuit board shaping device of the first aspect of the present invention, the second clamping mechanism includes a second lower clamping block, a second upper clamping block, a second lifting cylinder and a second bracket, the second bracket is arranged on the right side of the positioning platform, the second bracket can be slidably connected to the frame in the left and right directions, the front and rear ends of the second lower clamping block can be rotatably connected to the second bracket, the cylinder body of the second lifting cylinder is connected to the second lower clamping block, the piston rod of the second lifting cylinder is connected to the second upper clamping block, the gap between the second upper clamping block and the second lower clamping block is used for passing the excess plate on the right edge of the circuit board, the second lifting cylinder is used to drive the second upper clamping block close to or away from the second lower clamping block, so that the second upper clamping block and the second lower clamping block can clamp the excess plate on the right edge of the circuit board, and the second lower clamping block is connected to the output end of the second rotation drive mechanism.

[0015] According to the circuit board shaping device of the first aspect embodiment of the present invention, it also includes two pushing mechanisms, one of which is connected to the first lower clamping block, and the other is connected to the second lower clamping block. One of the pushing mechanisms is used to push the excess plate on the left edge of the circuit board between the first upper clamping block and the first lower clamping block, so that the excess plate on the left edge of the circuit board falls from the gap between the first upper clamping block and the first lower clamping block, and the other is used to push the excess plate on the right edge of the circuit board between the second upper clamping block and the second lower clamping block, so that the excess plate on the right edge of the circuit board falls from the gap between the second upper clamping block and the second lower clamping block.

[0016] According to the circuit board shaping device of the first aspect of the present invention, the two pushing mechanisms each include a pushing block and a linear cylinder, wherein the cylinder body of one of the linear cylinders is connected to the first lower clamping block, and one of the pushing blocks is connected to the piston rod of one of the linear cylinders, and one of the linear cylinders is used to drive one of the pushing blocks close to or away from the positioning platform so that one of the pushing blocks can pass between the first upper clamping block and the first lower clamping block, and push the excess plate on the left edge of the circuit board toward the positioning platform, the cylinder body of the other linear cylinder is connected to the second lower clamping block, and the other pushing block is connected to the piston rod of the other linear cylinder, and the other linear cylinder is used to drive the other pushing block close to or away from the positioning platform so that the other pushing block can pass between the second upper clamping block and the second lower clamping block, and push the excess plate on the right edge of the circuit board toward the positioning platform.

[0017] According to the circuit board shaping device of the first aspect of the present invention, it also includes a conveyor belt and a waste box. The conveyor belt is arranged on the frame, and the right end of the conveyor belt is arranged below the first lower clamping block and the second lower clamping block, so that excess plates on the left and right edges of the circuit board can fall onto the conveyor belt, and the left end of the conveyor belt is arranged above the waste box. The conveyor belt is used to convey the excess plates on the left and right edges of the circuit board from right to left, so that the excess plates on the left and right edges of the circuit board can fall into the waste box.

[0018] The circuit board shaping device according to the first embodiment of the present invention further includes a pressing mechanism, which is provided on the frame and is used to fix the circuit board on the positioning platform.

[0019] According to the circuit board shaping device of the first aspect of the present invention, the pressing mechanism includes two pressing cylinders and two pressing blocks. The cylinder bodies of the two pressing cylinders are respectively arranged on the front and rear sides of the positioning platform. The two pressing blocks are respectively connected to the piston rods of the two pressing cylinders. The two pressing cylinders are respectively used to drive the two pressing blocks close to the positioning platform so that the two pressing blocks are pressed against the middle part of the circuit board.

[0020] According to the circuit board shaping device of the first aspect of the present invention, the conveying mechanism includes a first clamping jaw assembly, a second clamping jaw assembly and an XZ-axis drive assembly, the first clamping jaw assembly and the second clamping jaw assembly are both arranged above the positioning table, the first clamping jaw assembly is arranged in front of the second clamping jaw assembly, the first clamping jaw assembly and the second clamping jaw assembly are both used to clamp or release the circuit board, and the XZ-axis drive assembly is used to drive the first clamping jaw assembly and the second clamping jaw assembly to move in the front-to-back direction and the up-down direction, so that the first clamping jaw assembly can convey the circuit board to the positioning table, and the second clamping jaw assembly can move the circuit board on the positioning table off the positioning table.

[0021] The circuit board shaping method according to the second embodiment of the present invention includes the circuit board shaping device according to the first embodiment of the present invention, including the following steps:

[0022] Step 1: The linear drive mechanism drives the first clamping mechanism and the second clamping mechanism to move away from each other;

[0023] Step 2: The transport mechanism transports the circuit board to be shaped to the positioning platform;

[0024] Step 3: The pressing mechanism fixes the circuit board on the positioning platform;

[0025] Step 4: The linear drive mechanism drives the first clamping mechanism and the second clamping mechanism to approach each other, so that the first clamping mechanism clamps the left edge of the circuit board, and the second clamping mechanism clamps the right edge of the circuit board;

[0026] Step 5: The first rotary drive mechanism drives the first clamping mechanism to rotate, and the second rotary drive mechanism drives the second clamping mechanism to rotate, so that the rotation directions of the first clamping mechanism and the second clamping mechanism are opposite, the first clamping mechanism bends the excess sheet material on the left edge of the circuit board upward, and the second clamping mechanism bends the excess sheet material on the right edge of the circuit board upward, so that the excess sheet material on both the left and right edges of the circuit board is broken off, thereby completing the shaping of the circuit board;

[0027] Step 6: The pressing mechanism releases the circuit board;

[0028] Step 7: The linear drive mechanism drives the first clamping mechanism and the second clamping mechanism to move away from each other;

[0029] Step 8: The transport mechanism moves the shaped circuit board away from the positioning platform.

[0030] It has at least the following beneficial effects:

[0031] The circuit board shaping method has all the beneficial effects brought about by the above-mentioned circuit board shaping device, and will not be described again here.

[0032] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which:

[0034] Figure 1 This is a schematic structural diagram of a circuit board to be shaped according to an embodiment of the present invention;

[0035] Figure 2 This is a schematic diagram of the structure of the circuit board after shaping according to an embodiment of the present invention;

[0036] Figure 3 This is a schematic structural diagram of a circuit board shaping device according to an embodiment of the present invention;

[0037] Figure 4 This is a partial structural diagram of a circuit board shaping device according to an embodiment of the present invention;

[0038] Figure 5 for Figure 4 A partial enlarged schematic diagram of point A in the middle;

[0039] Figure 6 Schematic diagram of the structure of the first clamping mechanism and the second clamping mechanism in the circuit board shaping device according to an embodiment of the present invention;

[0040] Figure 7 Schematic diagram of the structure of the transport mechanism in the circuit board shaping device according to an embodiment of the present invention;

[0041] Reference numerals:

[0042] Frame 100; positioning platform 110; conveyor belt 120;

[0043] First clamping mechanism 200; first lower clamping block 210; first upper clamping block 220; first avoidance slope 221; first lifting cylinder 230; first bracket 240;

[0044] Second clamping mechanism 300; second lower clamping block 310; second upper clamping block 320; second avoidance slope 321; second lifting cylinder 330; second bracket 340;

[0045] Linear drive mechanism 400;

[0046] A first rotation drive mechanism 500;

[0047] Second rotation drive mechanism 600;

[0048] Pushing mechanism 700; ejector block 710; linear cylinder 720;

[0049] Pressing mechanism 800; pressing cylinder 810; pressing block 820; cushion 821;

[0050] Transport mechanism 900 ; first clamping jaw assembly 910 ; second clamping jaw assembly 920 ; XZ axis drive assembly 930 . DETAILED DESCRIPTION

[0051] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0052] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0053] In the description of the present invention, "a plurality" refers to more than two. The use of "first" or "second" is solely for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of the indicated technical features, or implicitly indicating the order of the indicated technical features.

[0054] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0055] refer to Figures 1 to 5 According to an embodiment of the present invention, a circuit board shaping device includes:

[0056] A frame 100 is provided with a positioning platform 110, which is used to position the circuit board;

[0057] The transport mechanism 900 is provided on the frame 100 and is used to transport the circuit board to the positioning platform 110 or to move the circuit board away from the positioning platform 110;

[0058] A first clamping mechanism 200 and a second clamping mechanism 300 are respectively provided on the left and right sides of the positioning platform 110. The first clamping mechanism 200 and the second clamping mechanism 300 can be slidably connected to the frame 100 in the left and right directions. The first clamping mechanism 200 and the second clamping mechanism 300 are respectively used to clamp excess plate materials on the left and right edges of the circuit board on the positioning platform 110;

[0059] The linear drive mechanism 400 is provided on the frame 100 and is used to drive the first clamping mechanism 200 and the second clamping mechanism 300 to move away from or toward each other, so that the transport mechanism 900 can transport the circuit board to the positioning table 110, or enable the first clamping mechanism 200 and the second clamping mechanism 300 to respectively clamp excess plate materials on the left and right edges of the circuit board;

[0060] The first rotary drive mechanism 500 and the second rotary drive mechanism 600, the first rotary drive mechanism 500 is used to drive the first clamping mechanism 200 to rotate so that the first clamping mechanism 200 can break off the excess plate on the left edge of the circuit board, and the second rotary drive mechanism 600 is used to drive the second clamping mechanism 300 to rotate so that the second clamping mechanism 300 can break off the excess plate on the right edge of the circuit board.

[0061] It is understood that when it is necessary to break off and remove excess sheet material from the left and right edges of the circuit board, the linear drive mechanism 400 first drives the first clamping mechanism 200 and the second clamping mechanism 300 away from each other, and then the transport mechanism 900 transports the circuit board to the positioning platform 110. The positioning platform 110 can position the circuit board, and then the linear drive mechanism 400 drives the first clamping mechanism 200 and the second clamping mechanism 300 toward each other, so that the first clamping mechanism 200 clamps the excess sheet material on the left edge of the circuit board, and the second clamping mechanism 300 clamps the excess sheet material on the right edge of the circuit board. Then the first rotary drive mechanism 500 drives the first clamping mechanism 200 to rotate, and the second rotary drive mechanism 600 drives the second clamping mechanism 300 to rotate. At this time, the first clamping mechanism 200 and the second clamping mechanism 300 rotate in opposite directions, so that the first rotary drive mechanism 500 can break off the excess sheet material on the left edge of the circuit board, and the second rotary drive mechanism 600 can break off the excess sheet material on the right edge of the circuit board, thereby making the circuit board conform to the specified shape to complete the shaping of the circuit board. After the shaping of the circuit board is completed, the linear drive mechanism 400 drives the first clamping mechanism 200 and the second clamping mechanism 300 away from each other, and then the transport mechanism 900 moves the shaped circuit board on the positioning platform 110 away so that the next circuit board can be shaped. The circuit board shaping device can simultaneously break off the excess sheet material on the left and right edges of the circuit board, thereby improving the shaping efficiency of the circuit board, and thus helping to improve the assembly efficiency of subsequent circuit boards.

[0062] It should be explained that the reference Figure 1 and Figure 2 In order to improve the efficiency of circuit board insertion, the circuit boards usually used for insertion are square, with cutting holes left on the circuit boards. The shape of the intermittent cutting holes is the edge shape of the subsequent circuit board that meets the specified shape. The cutting holes on the circuit board in the embodiment of the present invention are the cutting holes on the left and right edges of the circuit board, and the left and right sides of the cutting holes are the excess sheet materials. The first clamping mechanism 200 clamps the excess sheet material on the left edge of the circuit board and then rotates, so that the connection between the excess sheet material on the left edge of the circuit board and the middle sheet material of the circuit board can be broken. Similarly, the second clamping mechanism 300 clamps the excess sheet material on the right edge of the circuit board and then rotates, so that the connection between the excess sheet material on the right edge of the circuit board and the middle sheet material of the circuit board can be broken. The remaining middle part of the circuit board is the circuit board body, and the resulting circuit board meets the specified shape.

[0063] In an embodiment of the present invention, after the first clamping mechanism 200 and the second clamping mechanism 300 respectively clamp the excess plate materials on the left and right edges of the circuit board, the first rotary drive mechanism 500 and the second rotary drive mechanism 600 respectively drive the first clamping mechanism 200 and the second clamping mechanism 300 to rotate, so that the first clamping mechanism 200 and the second clamping mechanism 300 rotate in opposite directions. This ensures that the circuit board remains balanced during the breaking process, avoids distortion or damage to the circuit board, and is conducive to improving the yield rate of the circuit board.

[0064] In an embodiment of the present invention, the first rotary drive mechanism 500 and the second rotary drive mechanism 600 respectively drive the first clamping mechanism 200 and the second clamping mechanism 300 to rotate, so that the first clamping mechanism 200 and the second clamping mechanism 300 can respectively bend upward the excess sheet material on the left and right edges of the circuit board, and the first clamping mechanism 200 and the second clamping mechanism 300 can respectively break the excess sheet material on the left and right edges of the circuit board. It can be understood that under the action of the first rotary drive mechanism 500 and the second rotary drive mechanism 600, the first clamping mechanism 200 can bend upward the excess sheet material on the left edge of the circuit board, and the second clamping mechanism 300 can bend upward the excess sheet material on the right edge of the circuit board. The first clamping mechanism 200 and the second clamping mechanism 300 simultaneously bend the excess sheet material upward, so that a downward force can be generated during the shaping process of the circuit board. This downward force can press the circuit board against the positioning platform 110, effectively preventing the circuit board from shaking during the shaping process, further improving the stability of the circuit board during the shaping process, and facilitating an increase in the yield rate of the circuit board.

[0065] refer to Figure 6The first clamping mechanism 200 includes a first lower clamping block 210, a first upper clamping block 220, a first lifting cylinder 230 and a first bracket 240. The first bracket 240 is arranged on the left side of the positioning platform 110, and the first bracket 240 can be slidably connected to the frame 100 in the left and right directions. The front and rear ends of the first lower clamping block 210 are rotatably connected to the first bracket 240. The cylinder body of the first lifting cylinder 230 is connected to the first lower clamping block 210, and the piston rod of the first lifting cylinder 230 is connected to the first upper clamping block 220. The gap between the first upper clamping block 220 and the first lower clamping block 210 is used for passing the excess plate on the left edge of the circuit board. The first lifting cylinder 230 is used to drive the first upper clamping block 220 to approach or move away from the first lower clamping block 210, so that the first upper clamping block 220 and the first lower clamping block 210 can clamp the excess plate on the left edge of the circuit board. The first lower clamping block 210 is connected to the output end of the first rotation drive mechanism 500. It can be understood that one of the output ends of the linear drive mechanism 400 is connected to the first bracket 240, and the linear drive mechanism 400 drives the first bracket 240 to approach the positioning platform 110, so that the excess plate on the left edge of the circuit board on the positioning platform 110 is passed between the first upper clamping block 220 and the first lower clamping block 210, and then the first lifting cylinder 230 drives the first upper clamping block 220 to approach the first lower clamping block 210, so that the first upper clamping block 220 and the first lower clamping block 210 clamp the excess plate on the left edge of the circuit board, and then the first rotary drive mechanism 500 drives the first lower clamping block 210 to rotate, and the first lower clamping block 210 drives the first lifting cylinder 230 and the first upper clamping block 220 to rotate. At this time, the first upper clamping block 220 and the first lower clamping block 210 drive the excess plate on the left edge of the circuit board to rotate, and the excess plate on the left edge of the circuit board can be broken off.

[0066] refer to Figure 6The second clamping mechanism 300 includes a second lower clamping block 310, a second upper clamping block 320, a second lifting cylinder 330 and a second bracket 340. The second bracket 340 is arranged on the right side of the positioning platform 110, and the second bracket 340 can be slidably connected to the frame 100 in the left and right directions. The front and rear ends of the second lower clamping block 310 are rotatably connected to the second bracket 340. The cylinder body of the second lifting cylinder 330 is connected to the second lower clamping block 310, and the piston rod of the second lifting cylinder 330 is connected to the second upper clamping block 320. The gap between the second upper clamping block 320 and the second lower clamping block 310 is used for passing the excess plate on the right edge of the circuit board. The second lifting cylinder 330 is used to drive the second upper clamping block 320 to move closer to or away from the second lower clamping block 310, so that the second upper clamping block 320 and the second lower clamping block 310 can clamp the excess plate on the right edge of the circuit board. The second lower clamping block 310 is connected to the output end of the second rotation drive mechanism 600. It can be understood that the other output end of the linear drive mechanism 400 is connected to the second bracket 340, and the linear drive mechanism 400 drives the second bracket 340 to approach the positioning platform 110, so that the excess plate on the right edge of the circuit board on the positioning platform 110 is passed between the second upper clamping block 320 and the second lower clamping block 310, and then the second lifting cylinder 330 drives the second upper clamping block 320 to approach the second lower clamping block 310, so that the second upper clamping block 320 and the second lower clamping block 310 clamp the excess plate on the right edge of the circuit board, and then the second rotary drive mechanism 600 drives the second lower clamping block 310 to rotate, and the second lower clamping block 310 drives the second lifting cylinder 330 and the second upper clamping block 320 to rotate. At this time, the second upper clamping block 320 and the second lower clamping block 310 drive the excess plate on the right edge of the circuit board to rotate, and the excess plate on the right edge of the circuit board can be broken off.

[0067] The first rotation driving mechanism 500 and the second rotation driving mechanism 600 may be a first motor and a second motor respectively, and the output ends of the first motor and the second motor are transmission-connected to the first lower clamping block 210 and the second lower clamping block 310 respectively.

[0068] In the embodiment of the present invention, reference Figure 6 A first avoidance slope 221 is provided on the side of the first upper clamping block 220 close to the positioning platform 110, and a second avoidance slope 321 is provided on the side of the second upper clamping block 320 close to the positioning platform 110. It is understandable that the first avoidance slope 221 on the first upper clamping block 220 can prevent the first upper clamping block 220 from colliding with electronic components on the circuit board during rotation, and the first avoidance slope 221 on the second upper clamping block 320 can prevent the second upper clamping block 320 from colliding with electronic components on the circuit board during rotation, thereby preventing the first upper clamping block 220 and the second upper clamping block 320 from damaging the electronic components on the circuit board, which is conducive to improving the yield rate of the circuit board.

[0069] refer to Figure 4 and Figure 6 The circuit board shaping device also includes two pushing mechanisms 700, one of which is connected to the first lower clamping block 210, and the other is connected to the second lower clamping block 310. One of the pushing mechanisms 700 is used to push the excess plate on the left edge of the circuit board between the first upper clamping block 220 and the first lower clamping block 210, so that the excess plate on the left edge of the circuit board can fall from the gap between the first upper clamping block 220 and the first lower clamping block 210, and the other pushing mechanism 700 is used to push the excess plate on the right edge of the circuit board between the second upper clamping block 320 and the second lower clamping block 310, so that the excess plate on the right edge of the circuit board can fall from the gap between the second upper clamping block 320 and the second lower clamping block 310. It can be understood that after the first upper clamping block 220 and the first lower clamping block 210 break the excess plate on the left edge of the circuit board, and the second upper clamping block 320 and the second lower clamping block 310 break the excess plate on the right edge of the circuit board, the first lifting cylinder 230 drives the first upper clamping block 220 away from the first lower clamping block 210, and the second lifting cylinder 330 drives the second upper clamping block 320 away from the second lower clamping block 310, so that the first upper clamping block 220 and the first lower clamping block 210 release the excess plate on the left edge of the circuit board, and the second upper clamping block 320 and the second lower clamping block 310 release the excess plate on the right edge of the circuit board. Then, the two pushing mechanisms 700 push the excess sheet materials on the left and right edges of the circuit board toward the positioning platform 110 respectively, so that the excess sheet materials on the left edge of the circuit board fall from the gap between the first upper clamping block 220 and the first lower clamping block 210, and the excess sheet materials on the right edge of the circuit board fall from the gap between the second upper clamping block 320 and the second lower clamping block 310, so as to facilitate shaping of the next circuit board.

[0070] refer to Figure 6, the two pushing mechanisms 700 each include a push block 710 and a linear cylinder 720, wherein the cylinder body of one linear cylinder 720 is connected to the first lower clamping block 210, and one push block 710 is connected to the piston rod of one linear cylinder 720, and one linear cylinder 720 is used to drive one push block 710 toward or away from the positioning platform 110, so that one push block 710 can pass between the first upper clamping block 220 and the first lower clamping block 210, and move one push block 710 toward the positioning platform 110. The cylinder body of another linear cylinder 720 is connected to the second lower clamping block 310, and the other push block 710 is connected to the piston rod of another linear cylinder 720. The other linear cylinder 720 is used to drive the other push block 710 close to or away from the positioning table 110, so that the other push block 710 can be inserted between the second upper clamping block 320 and the second lower clamping block 310, and the other push block 710 pushes the excess plate on the right edge of the circuit board toward the positioning table 110. It can be understood that after the first upper clamping block 220 and the first lower clamping block 210 release the excess sheet material on the left edge of the circuit board, and the second upper clamping block 320 and the second lower clamping block 310 release the excess sheet material on the right edge of the circuit board, the two linear cylinders 720 respectively drive the two top blocks 710 to approach each other, so that one of the top blocks 710 is passed between the first upper clamping block 220 and the first lower clamping block 210 and pushes the remaining excess sheet material toward the positioning platform 110, and the other top block 710 is passed between the second upper clamping block 320 and the second lower clamping block 310 and pushes the remaining excess sheet material toward the positioning platform 110, thereby causing the remaining excess sheet material between the first lower clamping block 210 and the first upper clamping block 220 and between the second lower clamping block 310 and the second upper clamping block 320 to fall off, so that the next circuit board can be shaped.

[0071] refer to Figure 3 The circuit board shaping device further includes a conveyor belt 120 and a waste bin. The conveyor belt 120 is disposed on the frame 100. The right end of the conveyor belt 120 is disposed below the first lower clamping block 210 and the second lower clamping block 310 so that excess sheet material on the left and right edges of the circuit board can fall onto the conveyor belt 120. The left end of the conveyor belt 120 is disposed above the waste bin. The conveyor belt 120 is used to convey the excess sheet material on the left and right edges of the circuit board from right to left so that the excess sheet material on the left and right edges of the circuit board can fall into the waste bin. It is understood that the excess sheet material on the left and right edges of the circuit board that falls can fall onto the conveyor belt 120. The conveyor belt 120 then transports the excess sheet material from right to left so that the excess sheet material on the left and right edges of the circuit board can fall into the waste bin, thereby preventing the excess sheet material from affecting the normal operation of the circuit board shaping device. Specifically, a blanking hole (not shown) is provided on the frame so that the excess sheet material on the left and right edges of the circuit board can pass through the blanking hole and fall onto the conveyor belt 120.

[0072] In an embodiment of the present invention, after the excess plates on the left and right edges of the circuit board are broken off, the linear drive mechanism 400 drives the first bracket 240 and the second bracket 340 to move away from each other, and then the first lifting cylinder 230 and the second lifting cylinder 330 respectively drive the first upper clamping block 220 and the second upper clamping block 320 to rise, so that the first upper clamping block 220 and the second upper clamping block 320 can both loosen the broken excess plates, and then the two linear cylinders 720 are started, so that the two top blocks 710 can respectively retract the two excess plates, so that the two excess plates can fall onto the conveyor belt 120.

[0073] refer to Figure 4 and Figure 5 The circuit board shaping device also includes a clamping mechanism 800, which is mounted on the frame 100 and is used to secure the circuit board to the positioning platform 110. As will be appreciated, after the circuit board is placed on the positioning platform 110, the clamping mechanism 800 activates and secures the circuit board, preventing it from shaking during the process of breaking off the excess sheet material on the left and right edges, thereby improving the stability of the circuit board shaping process. After the circuit board shaping is completed, the clamping mechanism 800 releases the circuit board.

[0074] refer to Figure 5 The clamping mechanism 800 includes two clamping cylinders 810 and two clamping blocks 820. The cylinder bodies of the two clamping cylinders 810 are respectively located on the front and rear sides of the positioning platform 110. The two clamping blocks 820 are respectively connected to the piston rods of the two clamping cylinders 810. The two clamping cylinders 810 are used to drive the two clamping blocks 820 toward the positioning platform 110 so that the two clamping blocks 820 press against the middle of the circuit board. A soft pad 821 is provided on the clamping block 820, through which the clamping block 820 abuts against the middle of the circuit board.

[0075] refer to Figure 7The conveying mechanism 900 includes a first clamping jaw assembly 910, a second clamping jaw assembly 920 and an XZ-axis drive assembly 930. The first clamping jaw assembly 910 and the second clamping jaw assembly 920 are both arranged above the positioning platform 110, and the first clamping jaw assembly 910 is arranged in front of the second clamping jaw assembly 920. The first clamping jaw assembly 910 and the second clamping jaw assembly 920 are both used to clamp or release the circuit board. The XZ-axis drive assembly 930 is used to drive the first clamping jaw assembly 910 and the second clamping jaw assembly 920 to move in the up and down directions and the front and back directions, so that the first clamping jaw assembly 910 can convey the circuit board to the positioning platform 110, and the second clamping jaw assembly 920 can move the circuit board on the positioning platform 110 off the positioning platform 110. It can be understood that the first clamping jaw assembly 910 is arranged on the left side of the second clamping jaw assembly 920, and the XZ-axis drive assembly 930 can drive the first clamping jaw assembly 910 and the second clamping jaw assembly 920 to move in the up and down directions and the front and back directions, so that when the first clamping jaw assembly 910 is in the process of transporting the circuit board to be shaped to the positioning table 110, the second clamping jaw assembly 920 is in the process of moving the shaped circuit board away from the positioning table 110, which shortens the shaping cycle of the circuit board and is conducive to improving the shaping efficiency of the circuit board.

[0076] According to another aspect of the present invention, a circuit board shaping method is provided. The circuit board shaping method is implemented using the circuit board shaping device in the above embodiment. The specific process is as follows:

[0077] Step 1: The linear drive mechanism 400 drives the first clamping mechanism 200 and the second clamping mechanism 300 to move away from each other;

[0078] Step 2: The transport mechanism 900 transports the circuit board to be shaped onto the positioning platform 110;

[0079] Step 3: The pressing mechanism 800 fixes the circuit board on the positioning platform 110;

[0080] Step 4: The linear drive mechanism 400 drives the first clamping mechanism 200 and the second clamping mechanism 300 to approach each other, so that the first clamping mechanism 200 clamps the left edge of the circuit board and the second clamping mechanism 300 clamps the right edge of the circuit board;

[0081] Step 5: The first rotary drive mechanism 500 drives the first clamping mechanism 200 to rotate, and the second rotary drive mechanism 600 drives the second clamping mechanism 300 to rotate, so that the rotation directions of the first clamping mechanism 200 and the second clamping mechanism 300 are opposite. The first clamping mechanism 200 bends the excess plate on the left edge of the circuit board upward, and the second clamping mechanism 300 bends the excess plate on the right edge of the circuit board upward, so that the excess plate on both the left and right edges of the circuit board are broken off, thereby completing the reshaping of the circuit board;

[0082] Step 6: The pressing mechanism 800 releases the circuit board;

[0083] Step 7: The linear drive mechanism 400 drives the first clamping mechanism and the second clamping mechanism 300 to move away from each other;

[0084] Step 8: The transport mechanism 900 moves the shaped circuit board away from the positioning platform 110 .

[0085] The circuit board shaping method has all the beneficial effects brought about by the above-mentioned circuit board shaping device, and will not be described again here.

[0086] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0087] Of course, the present invention is not limited to the above-mentioned embodiments. Those skilled in the art may make equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A circuit board shaping device, characterized in that: include: A frame, wherein a positioning platform is provided on the frame, and the positioning platform is used to position the circuit board; A transport mechanism, the transport mechanism being provided on the frame and being used to transport the circuit board to the positioning platform or to move the circuit board away from the positioning platform; a first clamping mechanism and a second clamping mechanism, wherein the first clamping mechanism and the second clamping mechanism are respectively arranged on the left and right sides of the positioning platform, and the first clamping mechanism and the second clamping mechanism are both slidably connected to the frame along the left and right directions, and the first clamping mechanism and the second clamping mechanism are respectively used to clamp excess plate materials on the left and right edges of the circuit board on the positioning platform; a linear drive mechanism, the linear drive mechanism being disposed on the frame and configured to drive the first clamping mechanism and the second clamping mechanism to move away from or toward each other, so that the transport mechanism can transport the circuit board to the positioning table, or the first clamping mechanism and the second clamping mechanism can respectively clamp excess plate materials on the left and right edges of the circuit board; A first rotary drive mechanism and a second rotary drive mechanism, wherein the first rotary drive mechanism is used to drive the first clamping mechanism to rotate, and the second rotary drive mechanism is used to drive the second clamping mechanism to rotate, so that the first clamping mechanism and the second clamping mechanism can rotate in opposite directions, and the first clamping mechanism and the second clamping mechanism can respectively break off the excess plate materials on the left and right edges of the circuit board.

2. The circuit board shaping device according to claim 1, characterized in that: The first clamping mechanism includes a first lower clamping block, a first upper clamping block, a first lifting cylinder and a first bracket, the first bracket being arranged on the left side of the positioning platform, the first bracket being slidably connected to the frame in the left and right directions, the front and rear ends of the first lower clamping block being rotatably connected to the first bracket, the cylinder body of the first lifting cylinder being connected to the first lower clamping block, the piston rod of the first lifting cylinder being connected to the first upper clamping block, the gap between the first upper clamping block and the first lower clamping block being used for passing the excess plate on the left edge of the circuit board, the first lifting cylinder being used to drive the first upper clamping block close to or away from the first lower clamping block so that the first upper clamping block and the first lower clamping block can clamp the excess plate on the left edge of the circuit board, and the first lower clamping block being connected to the output end of the first rotation drive mechanism.

3. The circuit board shaping device according to claim 2, characterized in that: The second clamping mechanism includes a second lower clamping block, a second upper clamping block, a second lifting cylinder and a second bracket, the second bracket is arranged on the right side of the positioning platform, the second bracket can be slidably connected to the frame in the left and right directions, the front and rear ends of the second lower clamping block can be rotatably connected to the second bracket, the cylinder body of the second lifting cylinder is connected to the second lower clamping block, the piston rod of the second lifting cylinder is connected to the second upper clamping block, the gap between the second upper clamping block and the second lower clamping block is used to allow the excess plate on the right edge of the circuit board to pass through, the second lifting cylinder is used to drive the second upper clamping block close to or away from the second lower clamping block, so that the second upper clamping block and the second lower clamping block can clamp the excess plate on the right edge of the circuit board, and the second lower clamping block is connected to the output end of the second rotation drive mechanism.

4. The circuit board shaping device according to claim 3, characterized in that: It also includes two pushing mechanisms, one of which is connected to the first lower clamping block, and the other is connected to the second lower clamping block. One of the pushing mechanisms is used to push the excess plate on the left edge of the circuit board between the first upper clamping block and the first lower clamping block, so that the excess plate on the left edge of the circuit board falls from the gap between the first upper clamping block and the first lower clamping block, and the other pushing mechanism is used to push the excess plate on the right edge of the circuit board between the second upper clamping block and the second lower clamping block, so that the excess plate on the right edge of the circuit board falls from the gap between the second upper clamping block and the second lower clamping block.

5. The circuit board shaping device according to claim 4, characterized in that: The two pushing mechanisms each include a push block and a linear cylinder, wherein the cylinder body of one of the linear cylinders is connected to the first lower clamping block, and one of the push blocks is connected to the piston rod of one of the linear cylinders, and one of the linear cylinders is used to drive one of the push blocks close to or away from the positioning platform, so that one of the push blocks can pass between the first upper clamping block and the first lower clamping block, and push the excess plate on the left edge of the circuit board toward the positioning platform, the cylinder body of the other linear cylinder is connected to the second lower clamping block, and the other push block is connected to the piston rod of the other linear cylinder, and the other linear cylinder is used to drive the other push block close to or away from the positioning platform, so that the other push block can pass between the second upper clamping block and the second lower clamping block, and push the excess plate on the right edge of the circuit board toward the positioning platform.

6. The circuit board shaping device according to claim 4, characterized in that: It also includes a conveyor belt and a waste box. The conveyor belt is arranged on the frame. The right end of the conveyor belt is arranged below the first lower clamping block and the second lower clamping block, so that excess plates on the left and right edges of the circuit board can fall onto the conveyor belt. The left end of the conveyor belt is arranged above the waste box. The conveyor belt is used to transport the excess plates on the left and right edges of the circuit board from right to left, so that the excess plates on the left and right edges of the circuit board can fall into the waste box.

7. The circuit board shaping device according to claim 1, characterized in that: It also includes a pressing mechanism, which is arranged on the frame and is used to fix the circuit board on the positioning platform.

8. The circuit board shaping device according to claim 7, characterized in that: The clamping mechanism includes two clamping cylinders and two clamping blocks. The cylinder bodies of the two clamping cylinders are respectively arranged on the front and rear sides of the positioning platform. The two clamping blocks are respectively connected to the piston rods of the two clamping cylinders. The two clamping cylinders are respectively used to drive the two clamping blocks close to the positioning platform so that the two clamping blocks are pressed against the middle of the circuit board.

9. The circuit board shaping device according to claim 8, characterized in that: The conveying mechanism includes a first clamping jaw assembly, a second clamping jaw assembly and an XZ-axis drive assembly. The first clamping jaw assembly and the second clamping jaw assembly are both arranged above the positioning platform, and the first clamping jaw assembly is arranged in front of the second clamping jaw assembly. The first clamping jaw assembly and the second clamping jaw assembly are both used to clamp or release the circuit board. The XZ-axis drive assembly is used to drive the first clamping jaw assembly and the second clamping jaw assembly to move in the front-to-back direction and the up-down direction, so that the first clamping jaw assembly can convey the circuit board to the positioning platform, and the second clamping jaw assembly can move the circuit board on the positioning platform off the positioning platform.

10. A circuit board shaping method, characterized in that: The circuit board shaping method is implemented using the circuit board shaping device according to claim 7, comprising the following steps: Step 1: The linear drive mechanism drives the first clamping mechanism and the second clamping mechanism to move away from each other; Step 2: The transport mechanism transports the circuit board to be shaped to the positioning platform; Step 3: The pressing mechanism fixes the circuit board on the positioning platform; Step 4: The linear drive mechanism drives the first clamping mechanism and the second clamping mechanism to approach each other, so that the first clamping mechanism clamps the left edge of the circuit board, and the second clamping mechanism clamps the right edge of the circuit board; Step 5: The first rotary drive mechanism drives the first clamping mechanism to rotate, and the second rotary drive mechanism drives the second clamping mechanism to rotate, so that the rotation directions of the first clamping mechanism and the second clamping mechanism are opposite, the first clamping mechanism bends the excess sheet material on the left edge of the circuit board upward, and the second clamping mechanism bends the excess sheet material on the right edge of the circuit board upward, so that the excess sheet material on both the left and right edges of the circuit board is broken off, thereby completing the shaping of the circuit board; Step 6: The pressing mechanism releases the circuit board; Step 7: The linear drive mechanism drives the first clamping mechanism and the second clamping mechanism to move away from each other; Step 8: The transport mechanism moves the shaped circuit board away from the positioning platform.

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