Control method, medium, device and wire cutting machine

Abstract

The present application relates to the technical field of cutting equipment, and specifically to a control method, medium, device and wire cutting machine for a wire cutting machine. It aims to solve the problem of low processing efficiency of existing wire cutting machines. To this end, the wire cutting machine of the present application is additionally provided with a collecting component, a first drive component and a second drive component. During processing, the first drive component is controlled to raise the collecting component to a position at a set distance from the wire mesh; the feeding device is controlled to feed the crystal rod toward the wire mesh; the silicon wafer is debonded so that the silicon wafer is collected in the collecting component; when the workpiece is debonded, the first drive component is controlled to lower the collecting component to the discharge position; the second drive component is controlled to move the collecting component from the discharge port to the outside of the cutting chamber. Through the above-mentioned setting, continuous cutting can be achieved, thereby improving processing efficiency, and the second drive component and the first drive component are used to drive the collection component to move, so that the degree of automation is higher, which can further improve processing efficiency.

Description

Technical Field

[0001] The present application relates to the technical field of cutting equipment, and in particular to a control method, medium, device and wire cutting machine. Background Art

[0002] Wire cutting is a processing method in which the cutting wire is moved back and forth at high speed and moves relative to the workpiece to be cut (such as photovoltaic silicon rods, semiconductors, silicon carbide, sapphire or magnetic materials) to cut the workpiece.

[0003] Taking diamond wire cutting as an example, during the cutting process, the workpiece is bonded to the wafer holder, which is mounted on a feed mechanism. The feed mechanism feeds the workpiece in a direction close to the cutting line. Once the cutting line has completely penetrated the workpiece, the feed mechanism retracts the workpiece to its initial position. The wafer holder is then removed and transported to a debonding mechanism for debonding, separating the slice from the wafer holder. After debonding, the loading and unloading operations are repeated for the next cut. This current cutting method requires both loading and unloading and debonding for each cut, severely impacting processing efficiency.

[0004] Accordingly, this field requires a new technical solution to solve the above problems. Summary of the Invention

[0005] In order to solve at least one of the above problems in the prior art, that is, to solve the problem of low processing efficiency of the existing wire cutting machine.

[0006] In a first aspect, the present application provides a control method for a wire cutting machine, the wire cutting machine comprising:

[0007] A cutting frame having a cutting chamber formed therein, and a discharge port communicating with the cutting chamber provided on the cutting frame;

[0008] a main roller assembly mounted on the cutting frame, the main roller assembly being used to wind the cutting wire to form a wire web;

[0009] A feeding device, which is mounted on the cutting frame, on which a crystal rod can be mounted, and is used to drive the crystal rod to feed toward the wire mesh;

[0010] A collecting member is located in the cutting chamber and is used to receive the debonded silicon wafer;

[0011] A first driving assembly capable of driving the collecting member to move back and forth in a feeding direction; and

[0012] a second driving assembly capable of driving the collecting member to move from the discharge port to the outside of the cutting chamber;

[0013] The control method includes:

[0014] controlling the first driving assembly to move the collecting member to a position at a set distance from the wire web;

[0015] Controlling the feeding device to feed the crystal rod toward the wire mesh;

[0016] performing a degumming operation on the cut silicon wafers so as to collect the silicon wafers in the collecting member;

[0017] controlling the first driving assembly to move the collecting member to a discharging position;

[0018] The second driving assembly is controlled to move the collecting member from the discharge port to the outside of the cutting chamber.

[0019] Through the above-mentioned settings, the wire cutting machine of the present application can realize continuous cutting of double-layer silicon rods and multi-layer silicon rods, debond the silicon rods that have been cut first, and continue to cut the silicon rods that have not been cut, and continue cutting while debonding, realizing the new function of cutting and debonding at the same time. The debonded silicon wafers are collected by the unloading device and transported to the outside of the cutting chamber. Multiple crystal rods are continuously cut in one cycle, and the silicon wafers are debonded and unloaded while cutting, thereby greatly improving the processing efficiency of the wire cutting machine. The collection component is driven to move by the first drive component and the second drive component, and the degree of automation is higher, which can further improve the processing efficiency.

[0020] In a preferred technical solution of the above control method, when performing a debonding operation on the cut silicon wafer, the distance between the bottom of the silicon wafer and the collecting member is not greater than a safety distance.

[0021] By keeping the silicon wafers at a safe distance from the collecting member, damage to the silicon wafers when they fall into the collecting member can be avoided.

[0022] In a preferred technical solution of the above control method, a plurality of the crystal ingots are mounted on the feeding device, and the plurality of the crystal ingots are bonded together along the feeding direction. The control method further comprises:

[0023] The plurality of crystal rods are cut, debonded, collected and transported one by one to the outside of the cutting chamber, and the feeding device does not stop during the debonding, collecting and transporting processes.

[0024] Through the above arrangement, multiple crystal rods can be cut continuously in one cutting cycle, thereby greatly improving the processing efficiency.

[0025] In the preferred technical solution of the above control method, the control method further includes: when the distance between the bottom of the crystal rod being cut and the collecting member reaches a safe distance, controlling the first driving component to move the collecting member along the feeding direction according to the feeding speed of the feeding device.

[0026] Through the above-mentioned setting, continuous feeding can be achieved, thereby further improving processing efficiency. In addition, the silicon wafer can always maintain a safe distance from the collecting component during the debonding process, avoiding damage to the silicon wafer when it falls on the collecting component.

[0027] In a preferred technical solution of the above control method, the set distance is equal to the sum of the height of the crystal ingot, the set cutting depth of the bonding plate and the safety distance.

[0028] By limiting the set distance to the sum of the height of the crystal ingot, the set cutting depth of the bonding plate and the safety distance, the distance between the bottom of the crystal ingot and the collecting member can be just the safety distance when the crystal ingot is cut, and the position is optimal.

[0029] In the preferred technical solution of the above control method, the safety distance is 5 mm to 10 mm.

[0030] By limiting the safety distance to 5 to 10 mm, it is possible to avoid affecting the feeding due to a safety distance that is too small, and to avoid damaging the silicon wafer when it falls due to an excessive safety distance.

[0031] In a preferred technical solution of the above control method, the control method further comprises:

[0032] After the tail crystal ingot is cut, the feeding device is controlled to carry the tail crystal ingot to perform a retraction operation;

[0033] Wherein, the tail crystal rod is the crystal rod close to one end of the feeding device among the multiple crystal rods.

[0034] The above arrangement is helpful to avoid cutting accidents caused by contact between the feeding device and the wire mesh, thereby improving cutting safety.

[0035] In a preferred technical solution of the above control method, the cutting assembly further includes a degumming device mounted on the cutting frame, and the step of "degumming the cut silicon wafer" further includes:

[0036] The degumming device is controlled to perform a degumming operation on the cut silicon wafer.

[0037] By controlling the degumming device to perform degumming operations on the workpiece, the degumming efficiency can be improved, thereby further improving the processing efficiency.

[0038] In a preferred technical solution of the above control method, the degumming device is a laser generator, and the step of "controlling the degumming device to perform a degumming operation on the cut silicon wafer" further includes:

[0039] The laser generator is controlled to emit laser light toward the adhesive layer bonded to the silicon wafer formed by cutting.

[0040] Through the above arrangement, higher degumming efficiency and better degumming effect can be obtained.

[0041] In a preferred technical solution of the above control method, the degumming device is a spray degumming device, and the step of "controlling the degumming device to perform a degumming operation on the cut silicon wafer" further includes:

[0042] The spray degumming device is controlled to spray the degumming liquid onto the glue layer bonded to the silicon wafer formed by cutting.

[0043] Through the above arrangement, the cost can be effectively reduced while ensuring the degumming efficiency.

[0044] In a preferred technical solution of the above control method, the control method further comprises:

[0045] After controlling the spray degumming device to spray the degumming liquid onto the adhesive layer bonded to the silicon wafer formed by cutting, obtaining the spraying duration of the spray degumming device;

[0046] Determine whether the spray duration is greater than or equal to a preset spray duration threshold;

[0047] If yes, the spray degumming device is controlled to stop spraying the degumming liquid onto the glue layer.

[0048] Through the above arrangement, the spray degumming device can be stopped in time when degumming is completed, which is more energy-saving.

[0049] In a preferred technical solution of the above control method, the temperature of the degumming solution is any value between 15°C and 80°C.

[0050] By limiting the temperature of the degumming solution to 15 to 80°C, higher degumming efficiency can be achieved.

[0051] In a second aspect of the present application, a computer-readable storage medium is provided, which stores a plurality of program codes, wherein the program codes are suitable for being loaded and run by a processor to execute the above-mentioned control method.

[0052] In a third aspect, the present application further provides a control device, comprising:

[0053] processor;

[0054] A memory, wherein the memory is suitable for storing a plurality of program codes, wherein the program codes are suitable for being loaded and run by the processor to execute the above-mentioned control method.

[0055] In a fourth aspect of the present application, a wire cutting machine is further provided, which includes the control device described in the above technical solution. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] The wire cutting machine of the present application is described below with reference to the accompanying drawings.

[0057] Figure 1 This is a schematic structural diagram of the wire cutting machine of this application;

[0058] Figure 2 This is a schematic diagram of the structure of the cutting assembly of this application Figure 1 ;

[0059] Figure 3 This is a schematic diagram of the structure of the cutting assembly of this application Figure 2 ;

[0060] Figure 4 This is a schematic structural diagram of the debris box device of the present application;

[0061] Figure 5 This is a schematic structural diagram of the spray degumming device of the present application;

[0062] Figure 6 This is a schematic diagram of the structure of the cutting assembly of this application Figure 3 ;

[0063] Figure 7 This is a schematic diagram of the structure of the cutting assembly of this application Figure 4 ;

[0064] Figure 8 This is a schematic diagram of the structure of the cutting assembly of this application Figure 5 ;

[0065] Figure 9 This is a schematic diagram of the structure of the cutting assembly of this application Figure 6 ;

[0066] Figure 10 A schematic diagram of the structure of the track beam, track trolley and chain of the cutting assembly of this application;

[0067] Figure 11 This is a schematic structural diagram of the chain of the second drive assembly of the present application;

[0068] Figure 12 This is a schematic diagram of the structure of the water retaining device of this application Figure 1 ;

[0069] Figure 13 This is a schematic diagram of the structure of the water retaining device of this application Figure 2 ;

[0070] Figure 14 A cross-sectional view of the water retaining device of the present application;

[0071] Figure 15 A top view of the guide plate of the water retaining device of the present application;

[0072] Figure 16 A top view of a water retaining block of the water retaining device of the present application;

[0073] Figure 17 This is a flow chart of the control method of the wire cutting machine of the present application.

[0074] Reference Signs List

[0075] 10. Cutting frame; 11. Discharge port; 13. Upper main roller; 14. Lower main roller; 15. Wire mesh; 16. Collecting member; 17. Crystal rod; 161. Receiver surface;

[0076] 20. Feeding device;

[0077] 21. Air deflector; 22. Debris box; 211. Long board; 212. Short board; 213. Hanging ear; 2111. Flanged structure; 221. Water retaining plate; 222. Box bottom plate; 223. Box side plate; 2211. First water retaining flange; 2212. Second water retaining flange; 2221. Connecting flange; 2222. Connecting column;

[0078] 3. Spray degumming device; 31. Spray pipe; 32. Nozzle; 33. Protective component; 331. First guard plate; 332. Second guard plate;

[0079] 41. Track; 42. Moving trolley; 43. Sprocket; 44. Chain; 45. Second motor; 46. Driving pulley; 47. Driven pulley; 48. Synchronous belt; 49. Storage box; 411. Horizontal guide rail; 412. Strip groove; 4121. Straight segment; 4122. Arc segment; 441. Main body; 442. Rotating shaft; 443. Roller;

[0080] 51. Lifting seat; 52. First motor; 53. Lifter; 54. Guide column; 55. Linear bearing; 56. Fixed seat;

[0081] 6. Clamping assembly; 61. Airbag; 62. Clamping plate; 621. Elastic buffer pad;

[0082] 7. Water retaining device; 71. First water retaining member; 72. Second water retaining member; 73. Third water retaining member; 74. Guide plate; 75. Fixing frame; 711. First water retaining plate; 712. Second water retaining plate; 713. Connecting plate; 714. Third water retaining plate; 741. First guide groove; 742. Second guide groove; 743. Guide rib; 731. Third guide groove; 751. Water receiving trough;

[0083] 81. First guide plate; 82. Second guide plate; 83. Guide box; 811. First bottom plate; 812. First side plate; 813. First end plate; 814. First guide opening; 821. Second bottom plate; 822. Second side plate; 823. Second end plate. DETAILED DESCRIPTION

[0084] The preferred embodiments of the present application are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principles of the present application and are not intended to limit the scope of protection of the present application.

[0085] It should be noted that, in the description of this application, terms such as "left" and "right" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. This is for ease of description only and does not indicate or imply that the device or component described must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, it should not be understood as limiting this application. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance.

[0086] Furthermore, it should be noted that, in the description of this application, unless otherwise expressly specified or limited, the terms "installed," "set," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, or internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0087] Specifically, the present application provides a wire cutting machine, such as Figure 1 As shown, the wire cutting machine of the present application includes a cutting assembly, a feeding device 20 and a winding assembly (not shown in the figure).

[0088] The cutting assembly includes multiple main rollers and main roller motors for driving them. These rollers are typically arranged in parallel within the wire saw's cutting chamber. Each of these motors is connected to its corresponding main roller, driving its own rotation. Cutting wires are arranged on the main rollers, spirally spaced at regular intervals across the rollers to form a wire mesh 15. Multi-wire cutting is achieved through grinding between the wire mesh 15 and the ingot 17.

[0089] It should be noted that the number of main rollers can be three or four, etc. Correspondingly, the number of main roller motors used to drive the main rollers to rotate can also be three or four, etc. Such adjustment and change of the specific number of main rollers does not deviate from the principle and scope of this application, and should be limited within the scope of protection of this application.

[0090] The winding assembly includes a pay-out and take-up mechanism and a tension mechanism. The pay-out and take-up mechanism is used to pay out and take up the cutting line. There are two pay-out and take-up mechanisms, one on either side of the cutting assembly. During operation, one pays out the cutting line and the other takes it up. The tension mechanism controls the tension of the cutting line, ensuring that the entire cutting line is stretched and taut during operation.

[0091] Among them, the wire-reeling and wire-winding mechanism includes a wire roller and a wire roller motor for driving the wire roller to rotate. The cutting wire is wound on the wire roller. When the wire roller motor drives the wire roller to rotate forward, the wire roller is in a wire-reeling state. When the wire roller motor drives the wire roller to rotate backward, the wire roller is in a wire-reeling state.

[0092] Among them, the tension mechanism includes a tension rocker, a tension guide wheel and a rocker motor for driving the tension rocker to swing. The bottom end of the tension rocker is fixedly connected to the output shaft of the rocker motor, and the tension guide wheel is rotatably installed on the top end of the tension rocker.

[0093] It should be noted that the winding assembly includes, in addition to the aforementioned retractable and retractable mechanisms and tensioning mechanism, a wire arranging mechanism and a steering wheel mechanism. The wire arranging mechanism is installed between the wire roller and the tensioning mechanism to arrange the cutting wire on the wire roller at a certain pitch. The steering wheel mechanism is installed between the tensioning mechanism and the main roller to change the direction of the cutting wire so that the cutting wire can be smoothly wound around the main roller. The wire cutting machine of this application can adopt any structural form of wire arranging mechanism and steering wheel mechanism used in the prior art.

[0094] In order to solve the problem of low cutting efficiency of existing wire cutting machines, this application provides a new cutting assembly, such as Figure 1 、 Figure 2 、 Figure 3 and Figure 7As shown, the cutting assembly of the present application includes a cutting frame 10 , a material unloading device, and a main roller assembly and a degumming device installed on the cutting frame 10 .

[0095] Among them, a cutting chamber is formed in the cutting frame 10, and a discharge port 11 connected to the cutting chamber is provided on the cutting frame 10. The main roller assembly is located in the cutting chamber. Each main roller in the main roller assembly is rotatably arranged between two side walls of the cutting frame 10 arranged opposite to each other. The cutting wire is wound around the main roller assembly to form a wire net 15. A feed opening connected to the cutting chamber is formed at the top of the cutting frame 10. The feeding device 20 of the wire cutting machine is installed at the feed opening at the top and can feed in the vertical direction.

[0096] It should be noted that the feeding direction is not limited to the vertical direction, for example, the feeding can also be in the horizontal direction or in the oblique direction. The following takes the feeding in the vertical direction as an example to further introduce the technical solution of the present application.

[0097] The feeding device 20 can be equipped with a crystal rod assembly, such as Figure 3 As shown, the crystal rod assembly includes multiple crystal rods 17 bonded together in the vertical direction. The feeding device 20 is used to feed the crystal rod assembly toward the wire mesh 15. The wire mesh 15 can cut the crystal rod into multiple silicon wafers. The degumming device can degumming the cut silicon wafers. The unloading device can receive the degummed silicon wafers and transport the silicon wafers to the outside of the cutting chamber.

[0098] It should be noted that, in actual applications, those skilled in the art may also install only one crystal rod on the feeding device 20 .

[0099] Preferably, if Figure 3 and Figure 7 As shown, the unloading device includes a collecting member 16, which is located in the cutting chamber and corresponds to the discharge port 11. More specifically, the collecting member 16 is located in the space formed by the wire mesh 15. The collecting member 16 is used to collect the silicon wafers that have completed degumming, and the collecting member 16 can pass through the discharge port 11 to transport the collected silicon wafers to the outside of the cutting chamber.

[0100] It should be noted that multiple crystal rods 17 (for example, two, three or four, etc.) are bonded together along the feeding direction to form a crystal rod assembly. Adjacent crystal rods 17 are bonded together with glue to form a glue layer. The axes of all crystal rods 17 are arranged in the vertical direction. The feeding device 20 drives the crystal rod assembly to feed toward the wire mesh 15. During the feeding process, multiple crystal rods 17 are cut into multiple silicon wafers in turn by the wire mesh 15, thereby improving the cutting efficiency.

[0101] Preferably, if Figure 2 and Figure 3As shown, the main roller assembly of the present application includes a first main roller 13 and a second main roller 14. The first main roller 13 and the second main roller 14 are spaced apart along the vertical direction (i.e., the feeding direction). The number of the first main rollers 13 is two and they are spaced apart along the horizontal direction. The number of the second main rollers 14 is two and they are spaced apart along the horizontal direction.

[0102] That is to say, the main roller assembly of the present application includes four parallel main rollers, of which two first main rollers are located above and two second main rollers are located below. An upper wire mesh is formed between the two first main rollers 13 and a lower wire mesh is formed between the two second main rollers 14. The upper wire mesh is used to cut the crystal rod 17 and can also be called a cutting section. The collecting component 16 is located between the upper wire mesh and the lower wire mesh and is used to collect silicon wafers.

[0103] It should be noted that the number of the lower main rollers 14 is not limited to the two mentioned above. For example, only one lower main roller may be provided.

[0104] In addition, it should be noted that the present application does not limit the specific structural form of the collecting member 16. For example, those skilled in the art may set the collecting member 16 as a shell structure ( Figure 7 The collecting member 16 shown in FIG is a shell structure), or the collecting member 16 can also be set as a frame structure ( Figure 8 The collecting member 16 shown in the figure is a frame structure), or alternatively, the collecting member 16 can be set as a flat plate structure, etc. Such adjustments and changes to the specific structural form of the collecting member 16 do not deviate from the principles and scope of this application and should be limited within the scope of protection of this application.

[0105] Preferably, if Figure 3 As shown, the wire web wrap angle of the upper main roller 13 and / or the wire web wrap angle of the lower main roller 14 is not less than 80°.

[0106] By limiting the wire mesh wrap angle of the main rollers (upper main roller 13 and lower main roller 14) to no less than 80°, sufficient friction can be ensured between the main rollers and the wire mesh 15, avoiding wire jumping and slipping, and ensuring the normal operation of the main roller assembly.

[0107] Among them, such as Figure 3 As shown, taking the upper main roller 13 as an example, there are two tangent points between the cutting line and the upper main roller 13. The angle α between the two tangent points and the axis of the upper main roller 13 is the wire mesh wrap angle of the upper main roller 13, or it can also be understood as the angle corresponding to the contact arc length between the cutting line and the upper main roller 13. The same applies to the lower main roller 14.

[0108] Preferably, if Figure 7 As shown, the collecting member 16 of the present application is a shell with a bottom and four sides closed, and the top of the shell has an opening allowing the crystal rod 17 to pass through.

[0109] That is to say, the bottom and four sides of the shell are closed. By setting the collecting member 16 as a closed shell, some cutting fluid can be injected into the shell. When the silicon wafer falls into the shell, the cutting fluid can act as a buffer to prevent the silicon wafer from being damaged.

[0110] Exemplarily, the collecting member 16 is a rectangular shell with a receiving cavity formed inside the shell to receive the silicon wafers after cutting. The top of the receiving cavity is open, and the cut silicon wafers can fall directly into the receiving cavity of the shell after debonding.

[0111] Preferably, if Figure 3 As shown, the horizontal distance between the two lower main rollers 14 is greater than the horizontal distance between the two upper main rollers 13 .

[0112] By increasing the horizontal distance between the two lower main rollers 14 , the collecting member 16 has a larger installation space, which is convenient for arrangement, collection of silicon wafers, and transportation of silicon wafers to the outside of the cutting chamber.

[0113] Preferably, if Figures 2 to 4 As shown, the cutting assembly of the present application further comprises a chip box device, which is installed in the cutting chamber.

[0114] The debris box device is fixedly connected to the cutting frame 10 , the main body of the debris box device is also located in the space surrounded by the wire mesh 15 , and the collecting component 16 is located in the debris box device.

[0115] Preferably, if Figure 3 and Figure 4 As shown, the debris box device of the present application includes a flow guide cover 21 and a debris box 22 located below the flow guide cover 21 .

[0116] The top and bottom of the air deflector 21 are both open. The air deflector 21 is located between the two upper main rollers 13 . The debris box 22 is located between the two lower main rollers 14 . The collecting member 16 is located in the debris box 22 .

[0117] That is to say, the guide cover 21 is through from top to bottom. This arrangement allows the crystal rod 17 to pass through the guide cover 21. The guide cover 21 and the debris box 22 both extend along the axial direction of the upper main roller 13. The guide cover 21 is located below the upper wire mesh and is mainly used to guide the cutting liquid. The cutting liquid can drip into the debris box 22 along the inner wall of the guide cover 21 to prevent the cutting liquid from flowing onto the upper main roller 13. The two ends of the debris box 22 in the longitudinal direction are preferably set to be open, so that the cutting liquid in the debris box 22 can flow back to the bottom of the cutting chamber and allow the collecting member 16 to pass through. The bottom of the debris box 22 is closed, which can prevent the cutting liquid from dripping onto the wire mesh at the bottom of the lower main roller 14.

[0118] Preferably, if Figure 3 and Figure 4 As shown, the debris box 22 of the present application is provided with water baffles 221 extending toward the outside of the debris box 22 on both sides along the width direction thereof, and the water baffles 221 are located above the lower main roller 14 .

[0119] By providing the water baffle 221 on the chip box 22 and positioning the water baffle 221 above the lower main roller 14 , it is possible to prevent the cutting fluid from dripping onto the lower main roller 14 .

[0120] Preferably, if Figure 3 and Figure 4 As shown, the top opening of the air deflector 21 is larger than the bottom opening of the air deflector 21 .

[0121] By increasing the size of the top opening of the flow guide cover 21 , more cutting fluid can enter the flow guide cover 21 , and at the same time, it is more conducive to the crystal ingot 17 passing through the flow guide cover 21 smoothly.

[0122] For example, Figure 4 As shown, the air guide 21 includes two relatively arranged long plates 211 and two relatively arranged short plates 212. The short plates 212 are provided with hanging ears 213, and the hanging ears 213 are fixedly connected to the inner wall of the cutting chamber. The two long plates 211 and the two short plates 212 together form a box structure. The cross-section of the box structure is rectangular. The top of the two long plates 211 is respectively provided with a flange structure 2111 extending outwardly and obliquely, thereby increasing the size of the top opening of the air guide 21.

[0123] Preferably, if Figure 3 and Figure 4 As shown, the water baffle 221 of the present application is arranged upwardly and tilted in a direction away from the debris box 22 .

[0124] By arranging the water baffle 221 at an angle, the cutting fluid can flow smoothly into the debris box 22 . In addition, the horizontal space occupied by the debris box 22 can be reduced, making it easier to arrange.

[0125] For example, Figure 3 As shown, two water baffles 221 are provided on the top of the debris box 22. The water baffle 221 on the left is inclined toward the upper left, and the water baffle 221 on the right is inclined toward the upper right. The two water baffles 221 are arranged in an inverted "eight" shape, and the cutting fluid dripping from the top is converged into the debris box 22.

[0126] Preferably, if Figure 3 and Figure 4 As shown, the edge of the water retaining plate 221 of the present application is provided with a water retaining structure extending upward.

[0127] By arranging a water retaining structure at the edge of the water retaining plate 221 and extending the water retaining structure upward, it is possible to ensure that the cutting fluid on the water retaining plate 221 flows smoothly to the debris box 22 .

[0128] It should be noted that the water retaining structure can be a flange formed by bending the edge of the water retaining plate upward, or it can be set as a raised water retaining rib, etc. Such adjustment and change of the specific structural form of the water retaining structure does not deviate from the principle and scope of this application, and should be limited within the scope of protection of this application.

[0129] Preferably, if Figure 3 and Figure 4 As shown, the water retaining structure of the present application includes two first water retaining flanges 2211 distributed at intervals. The first water retaining flanges 2211 extend from one end of the water retaining plate 221 away from the debris box 22 to the top of the debris box 22 .

[0130] That is, each of the two edges distributed along the length direction of the water retaining plate 221 is provided with a first water retaining flange 2211, and the first water retaining flange 2211 extends along the width direction of the water retaining plate 221, extending from the top of the water retaining plate 221 to the top of the debris box 22.

[0131] Preferably, if Figure 3 and Figure 4 As shown, the first water retaining flange 2211 of the present application is arranged perpendicular to the water retaining plate 221.

[0132] By arranging the first water-blocking flange 2211 perpendicularly to the water-blocking plate 221 , a better water-blocking effect can be achieved.

[0133] Preferably, if Figure 3 and Figure 4 As shown, the water retaining structure of the present application further includes a second water retaining flange 2212 located between the two first water retaining flanges 2211 , and the extension direction of the second water retaining flange 2212 is perpendicular to the extension direction of the first water retaining flange 2211 .

[0134] That is to say, the second water retaining flange 2212 extends along the length direction of the water retaining plate 221, and the two ends of the second water retaining flange 2212 are preferably connected to the two first water retaining flanges 2211 respectively. In this way, the water retaining plate 221 can be surrounded, and the water retaining effect is better.

[0135] Preferably, if Figure 3 and Figure 4 As shown, the second water retaining flange 2212 of the present application is tilted toward the outside of the debris box 22 .

[0136] By tilting the second water retaining flange 2212 outward, the water retaining plate 221 can receive more cutting fluid.

[0137] The inclination angle of the second water retaining flange 2212 (the angle with the vertical direction) is smaller than the inclination angle of the water retaining plate 221. For example, the inclination angle of the water retaining plate 221 is 45 degrees, and the inclination angle of the second water retaining flange 2212 is 10 degrees.

[0138] Preferably, if Figure 4 As shown, the debris box 22 of the present application includes a box bottom plate 222 and two oppositely arranged box side plates 223. The bottom of the box side plates 223 are fixedly connected to or integrally arranged with the box bottom plate 222, and the water retaining plate 221 extends from the top of the box side plates 223 toward the outside of the debris box 22.

[0139] For example, Figure 4 As shown, the box bottom plate 222 is a rectangular plate and is arranged horizontally, the two box side plates 223 are also rectangular plates and are spaced apart along the width direction of the box bottom plate 222, the two box side plates 223 are arranged vertically and are respectively connected to the two sides of the width direction of the box bottom plate 222, and the collecting member 16 is located between the two box side plates 223. The top of each box side plate 223 is provided with a water retaining plate 221 extending outwardly and tilted, and the debris box 22 is open at both ends along the length direction. A downward-bent connecting flange 2221 is provided at each end of the box bottom plate 222, and a horizontally extending connecting column 2222 is provided on the connecting flange 2221. The connecting column 2222 is fixedly connected to the cutting frame 10, and the two ends of the second water retaining flange 2212 are also fixedly connected to the cutting frame 10, for example, by screws.

[0140] Preferably, if Figure 1 and Figure 3 As shown, the degumming device of the present application is arranged between the upper main roller and the lower main roller, and is also located between the guide cover 21 and the debris box 22. When the crystal rod 17 is cut or is close to being cut, the degumming device is started to degumming the crystal rod 17, so that the crystal rod 17 falls into the collecting component 16 below.

[0141] In the technical solution of the present application, by arranging a debonding device and a collecting component 16 on the cutting frame 10, the debonding and collection of the cut crystal rod 17 can be achieved without stopping the machine during the cutting process, which is beneficial to greatly improve the cutting efficiency of the wire cutting machine and reduce the process flow.

[0142] It should be noted that the present application does not limit the specific type of degumming device. For example, those skilled in the art may use a laser degumming device or a spray degumming device.

[0143] In addition, it should be noted that those skilled in the art may also cancel the degumming device in actual application. In this case, degumming can be performed by spraying cutting fluid during the cutting process. Of course, the cutting assembly of the present application is preferably provided with a degumming device to speed up the degumming speed and improve work efficiency.

[0144] In a first preferred embodiment, Figure 5 and Figure 6 As shown, the degumming device of the present application is configured as a spray degumming device 3. The spray degumming device 3 is connected to the cutting frame 10 and is used to spray a degumming liquid onto the crystal ingot 17 to degumming the cut crystal ingot 17. In the present application, the degumming liquid can be selected according to the specific type of the adhesive layer, and those skilled in the art can flexibly select it. For example, when the adhesive layer uses a water-soluble adhesive, the degumming liquid can be selected from pure water, tap water, or cutting fluid.

[0145] Furthermore, if Figure 3 、 Figure 5 and Figure 6 As shown, the spray degumming device 3 of the present application includes a spray assembly connected to the cutting frame 10 , the spray assembly is connected to the degumming liquid source, and the spray assembly is used to spray the degumming liquid onto the crystal rod 17 .

[0146] The spray assembly is located between the upper main roller 13 and the lower main roller 14 . When the crystal rod 17 is cut or nearly cut, the spray debonding device 3 is started to spray the cutting fluid toward the adhesive layer of the crystal rod 17 .

[0147] It should be noted that the present application does not limit the structural form of the spray assembly. For example, those skilled in the art may set the spray assembly to a structure of a spray pipe + nozzle, or to a structure in which a spray hole is opened on the spray pipe, or to a structure in which a shower head is sprayed, and so on.

[0148] Furthermore, if Figure 3 and Figure 5 As shown, the spray assembly of the present application includes a spray pipe 31 and a nozzle 32 connected to the cutting frame 10 , the spray pipe 31 is connected to the degumming liquid source, and one end of the nozzle 32 is connected to the spray pipe 31 .

[0149] For example, Figure 3 and Figure 5 As shown, the spray pipe 31 is located between the upper main roller 13 and the lower main roller 14, and is arranged closer to the upper main roller 13. The spray pipe 31 extends along the axial direction of the upper main roller 13. After the spray degumming device 3 is started, the degumming liquid from the degumming liquid source enters the spray pipe 31 and is then sprayed out by the nozzle 32 to the adhesive layer of the crystal rod 17.

[0150] The water flow sprayed from the nozzle 32 is a conical jet surface, and the taper of the conical jet surface is preferably 60°, which has a large coverage range and is conducive to improving processing efficiency.

[0151] Furthermore, if Figure 3 and Figure 5As shown, the nozzle 32 is arranged toward the cutting section of the wire web 15 .

[0152] The cutting section of the wire web 15 refers to the wire web between the two first main rollers 13, which is used for cutting. Figure 3 As seen from above, the cutting section of the wire web 15 is located above the nozzle 32 , and therefore the nozzle 32 is arranged to be tilted upward.

[0153] By arranging the nozzle 32 toward the cutting section of the wire mesh 15 , the debonding liquid sprayed from the nozzle 32 can contact the adhesive layer on the crystal rod 17 as early as possible, which is beneficial to improving processing efficiency.

[0154] It should be noted that the present application does not limit the angle between the nozzle 32 and the horizontal direction (i.e., the inclination angle of the nozzle 32). For example, those skilled in the art can set the angle between the nozzle 32 and the horizontal direction to 20°, 50° or 70°, etc.

[0155] Furthermore, if Figure 3 As shown, the angle between the nozzle 32 and the horizontal direction is 30° to 60°.

[0156] By limiting the included angle of the nozzle 32 to the horizontal direction to 30° to 60°, the nozzle 32 can cover a larger degumming range, thereby further improving the processing efficiency.

[0157] The angle between the nozzle 32 and the horizontal direction is the angle between the axis direction of the nozzle 32 and the horizontal direction.

[0158] It should be noted that the present application does not limit the specific number of nozzles 32. For example, a person skilled in the art may set multiple nozzles 32 in actual application, or may only set one nozzle 32. In the case of setting one nozzle 32, it is preferred to set a sliding mechanism to move the nozzle 32 back and forth along the length direction of the collecting member 16.

[0159] Furthermore, if Figure 5 As shown, there are multiple nozzles 32 , and the multiple nozzles 32 are distributed at intervals along the length direction of the spray pipe 31 .

[0160] The spray pipe 31 extends along the length direction of the collecting member 16 , and a plurality of nozzles 32 are spaced apart along the length direction of the spray pipe 31 . The distance between two adjacent nozzles 32 can be determined according to the coverage range of the nozzles 32 .

[0161] Furthermore, if Figure 3 As shown, there are two spray pipes 31 and they are spaced apart in the horizontal direction.

[0162] Among them, the two spray pipes 31 are respectively located on both sides of the width direction of the collecting component 16, and the nozzles 32 on the two spray pipes 31 are arranged opposite to each other, and both spray toward the side close to the collecting component 16. In this way, degumming can be achieved from two directions at the same time, thereby greatly improving the degumming efficiency.

[0163] It should be noted that, in the present application, the length direction of the collecting member 16 is parallel to the axial direction of the upper main roller 13 , and the width direction of the collecting member 16 is perpendicular to the axial direction of the upper main roller 13 and along the horizontal direction.

[0164] Furthermore, if Figure 3 and Figure 5 As shown, the spray degumming device 3 of the present application further includes a protective component 33, which is located between the spray assembly and the main roller assembly. The protective component 33 can prevent the degumming liquid sprayed from the spray assembly from being sprayed onto the main roller assembly.

[0165] By arranging the protective component 33 between the spray assembly and the main roller assembly, the cutting liquid can be blocked to prevent the cutting liquid from being sprayed onto the main roller assembly, thereby effectively protecting the main roller assembly.

[0166] Specifically, if Figure 3 As shown, the protective component 33 is located between the nozzle 32 and the upper main roller 13, and can effectively protect the upper main roller 13. When two spray pipes 31 are provided, the number of protective components 33 is also two, and the two protective components 33 are respectively located between the corresponding nozzle 32 and the upper main roller 13 to protect both upper main rollers 13.

[0167] Furthermore, the protective component 33 is connected to the spray pipe 31 .

[0168] For example, Figure 5 and Figure 6 As shown, both ends of the spray pipe 31 are fixedly mounted on the cutting frame 10 through connectors, and the protective component 33 is fixedly mounted on the spray pipe 31 .

[0169] It should be noted that, in actual applications, technical personnel in this field can connect the protective component 33 to the cutting frame 10 through a connecting piece, and fix the spray pipe 31 on the protective component 33, or the protective component 33 and the spray pipe 31 can be set to be split, and the protective component 33 can be directly connected to the cutting frame 10 through a connecting piece, and so on.

[0170] Of course, the present application preferably connects the protective component 33 and the spray pipe 31 together, and then installs them together on the cutting frame 10. This is beneficial to ensure a stable positional relationship between the protective component 33 and the nozzle 32, thereby providing better protection and improving assembly efficiency.

[0171] Furthermore, if Figure 3 As shown, the top of the protective member 33 extends to the air duct 21 .

[0172] By extending the top of the protective member 33 to the air deflector 21 , there is no gap between the two in the vertical direction, which can achieve a better protective effect.

[0173] It should be noted that, in actual application, the top of the protective component 33 can be connected to the bottom of the air deflector 21, or the top of the protective component 33 can be connected to the side of the air deflector 21, that is, the two partially overlap in the vertical direction.

[0174] Furthermore, if Figure 3 and Figure 5 As shown, the protective component 33 of the present application includes a first guard plate 331, which is located above the spray pipe 31, and the extension direction of the cross section of the first guard plate 331 is inclined toward the wire mesh between the two first main rollers 13, and the first guard plate 331 is located between the nozzle 32 and the upper main roller 13.

[0175] Compared to arranging the first guard plate 331 horizontally or vertically, arranging the first guard plate 331 upward at an angle can reduce the impact on the spray range of the nozzle 32 and reduce the vertical space occupied by the first guard plate 331, thereby facilitating layout. Preferably, the top of the first guard plate 331 extends to the shroud 21. Furthermore, the first guard plate 331 extends along the length of the spray pipe 31, and the length of the first guard plate 331 is preferably greater than or equal to the length of the spray pipe 31.

[0176] Furthermore, the angle between the first guard plate 331 and the horizontal direction is greater than the angle between the nozzle 32 and the horizontal direction.

[0177] That is to say, the inclination direction of the first guard plate 331 is not parallel to the inclination direction of the nozzle 32, and the inclination angle of the first guard plate 331 is greater than the inclination angle of the nozzle 32. In this way, the impact on the spray range of the nozzle 32 can be further reduced or even eliminated, ensuring that the nozzle 32 has the largest spray range.

[0178] The specific value of the angle between the extension direction of the first guard plate 331 and the extension direction of the nozzle 32 can be determined through experiments.

[0179] Furthermore, if Figure 3 and Figure 5As shown, the protective component 33 of the present application also includes a second protective plate 332, which is located on the side of the spray pipe 31 away from the nozzle 32. The top of the second protective plate 332 is fixedly connected to or integrally arranged with the bottom of the first protective plate 331, and the extension direction of the second protective plate 332 intersects with the extension direction of the first protective plate 331.

[0180] That is to say, the second guard plate 332 extends downward from the bottom of the first guard plate 331. In this way, it can prevent the cutting liquid reflected from the crystal rod 17 from splashing onto the wire mesh 15 between the upper main roller 13 and the lower main roller 14. In addition, it can also guide the degumming liquid blocked by the first guard plate 331 to the bottom of the cutting chamber.

[0181] Furthermore, if Figure 3 and Figure 5 As shown, the second guard plate 332 is arranged in the vertical direction.

[0182] By arranging the second guard plate 332 in the vertical direction, the second guard plate 332 can have a maximum protection range.

[0183] It should be noted that, in actual application, those skilled in the art may also set the second guard plate 332 to be tilted downward toward the side close to the nozzle 32, so as to Figure 3 Looking from above, the second guard plate 332 on the left is tilted toward the lower right, and the second guard plate 332 on the right is tilted toward the lower left. This is more conducive to guiding the cutting fluid to the bottom of the cutting chamber and preventing the cutting fluid from dripping onto the lower main roller 14.

[0184] In addition, it should be noted that the protective component 33 includes a first protective plate 331 and a second protective plate 332. Only the first protective plate 331 or the second protective plate 332 can be connected to the spray pipe 31, or the first protective plate 331 and the second protective plate 332 can be connected to the spray pipe 31 at the same time.

[0185] In the second preferred embodiment, the degumming device of the present application is a laser generator. There are two laser generators, which are respectively located on both sides of the width direction of the collecting component 16. A sliding mechanism is provided between the two side walls opposite to the length direction of the cutting frame 10 and the collecting component 16. The sliding mechanism uses an electric cylinder, and the two laser generators are respectively fixed on the corresponding sliding mechanisms.

[0186] During the debonding process, two electric cylinders drive two laser generators to move along the length direction of the collecting component 16. The two laser generators respectively emit lasers from both sides of the crystal rod assembly to the same glue layer, and use the cavitation effect of the laser to destroy the chemical bonds of the glue, causing cavitation inside the glue layer and generating tiny holes. The liquid can quickly enter the glue layer, causing the glue layer to fall off from the silicon wafer, and finally achieving the debonding of the silicon wafer.

[0187] Of course, the specific setting mode of the above-mentioned laser generator is not static, and those skilled in the art can adjust it so that the present application is applicable to more specific application scenarios. For example, the laser generator can also be fixed or rotated around a rotating axis, etc., instead of being movable. When it is fixed, it is necessary to set multiple laser generators, or control the laser range generated by the laser generator to be sufficient to make the entire adhesive layer fall off. For another example, the number of laser generators can be set to at least one, and of course more can be set. In addition to being distributed on both sides of the collecting component 16, the setting position of the laser generator can also be located on the same side, or on the outside of the two ends of the length direction of the collecting component 16. Of course, being located on the same side or on the outside of the two ends of the length direction of the collecting component 16 will not be conducive to achieving rapid degumming. For another example, in addition to using an electric cylinder, the sliding mechanism can also use a pneumatic cylinder or a hydraulic cylinder.

[0188] Preferably, if Figure 7 and Figure 8 As shown, the unloading device of the present application further includes a first driving assembly, which can drive the collecting member 16 to move up and down in a vertical direction.

[0189] By setting up a first driving component to drive the collecting member 16 to move up and down, it is convenient to adjust the vertical distance between the collecting member 16 and the crystal rod 17 according to specific circumstances, which is conducive to safely collecting silicon wafers and preventing the silicon wafers from being damaged due to the excessive distance between them and the collecting member 16.

[0190] It should be noted that the present application does not limit the specific structural form of the first drive component. For example, a person skilled in the art may set the first drive component to be a motor drive component, a hydraulic drive component or a pneumatic drive component, etc. Such adjustment and change to the specific structural form of the first drive component does not deviate from the principle and scope of the present application and should be limited within the scope of protection of the present application.

[0191] Preferably, if Figure 2 、 Figures 7 to 11 As shown, the unloading device of the present application further includes a second driving assembly, which can drive the collecting member 16 to move from the discharge port 11 to the outside of the cutting chamber.

[0192] After all the debonded silicon wafers fall into the collecting member 16 , the collecting member 16 is driven by the second driving assembly through the discharge port 11 and moved to the outside of the cutting chamber.

[0193] It should be noted that the present application does not limit the specific structural form of the second drive component. For example, a person skilled in the art may set the second drive component to be a motor drive component, a hydraulic drive component or a pneumatic drive component, etc. Such adjustment and change of the specific structural form of the second drive component does not deviate from the principle and scope of the present application and should be limited within the scope of protection of the present application.

[0194] Preferably, if Figures 7 to 10 As shown, the unloading device of the present application also includes a track 41 and a moving trolley 42, wherein the collecting component 16 is placed on the moving trolley 42, the moving trolley 42 is located on the track 41, a part of the track 41 passes through the discharge port 11 and extends into the cutting chamber, and the second drive assembly is connected to the moving trolley 42 and can drive the moving trolley 42 to move along the track 41.

[0195] For example, Figure 3 、 Figures 7 to 10 As shown, the second drive assembly is installed on the track 41, and a horizontal guide rail 411 is provided on the track 41. The second drive assembly can drive the mobile trolley 42 to move along the horizontal guide rail 411. A fragment box 22 is installed between the two lower main rollers 14, and the discharge port 11 on the cutting frame 10 is arranged opposite to the fragment box 22. The track 41 is arranged horizontally, and a part of the track 41 passes through the discharge port 11 and extends into the fragment box 22. The first drive assembly is located outside the cutting chamber and is supported under the other part of the track 41. Under the drive of the first drive assembly, the track 41, the mobile trolley 42, the second drive assembly and the collecting member 16 move up and down together. The discharge port 11 is rectangular and extends in the vertical direction, allowing the track 41 to move up and down. Wheels are installed on both sides of the bottom of the mobile trolley 42, so that the mobile trolley 42 can move smoothly on the horizontal guide rail 411.

[0196] When the silicon wafer falls into the collecting component 16, the first driving component drives the track 41 and the second driving component, the moving cart 42 and the collecting component 16 on the track 41 to move downward. After moving to the set initial position, the first driving component stops running and starts the second driving component to pull the moving cart 42 and the collecting component 16 on the moving cart 42 to move along the track 41 and pass through the discharge port 11 to the outside of the cutting chamber. Then, the collecting component 16 and the silicon wafer on the collecting component 16 are removed from the moving cart 42 together, and then an empty collecting component 16 is placed on the moving cart 42. The collecting component 16 removed from the moving cart 42 is transferred to a special wafer removal station, and then the silicon wafer is taken out of the collecting component 16.

[0197] It should be noted that, in actual applications, those skilled in the art may cancel the provision of the mobile trolley 42 . In this case, the second driving assembly may be directly connected to the collecting member 16 .

[0198] Preferably, if Figure 7 and Figure 8 As shown, the unloading device of the present application also includes a lifting seat 51 and a guide mechanism. The track 41 is installed on the lifting seat 51. The first driving assembly is connected to the lifting seat 51 and can drive the lifting seat 51 to move up and down in the vertical direction. The guide mechanism is used to guide the lifting seat 51.

[0199] For example, Figure 7 and Figure 8 As shown, the unloading device of the present application also includes a fixed seat 56, which is fixedly connected to the cutting frame 10, and the lifting seat 51 is fixedly installed at the bottom of the track 41. The guide mechanism includes a plurality of vertically arranged guide columns 54 and a linear bearing 55 sleeved on each guide column 54. The top of the guide column 54 is fixedly connected to the lifting seat 51, and the linear bearing 55 and the first drive assembly are fixedly installed on the fixed seat 56. In the process of the first drive assembly driving the lifting seat 51 to move up and down, the guide column 54 slides up and down in the linear bearing 55 to guide the lifting seat 51.

[0200] It should be noted that the guide mechanism is not limited to the combination of the guide column 54 and the linear bearing 55 introduced above. For example, the linear bearing 55 can be replaced by a guide cylinder, or the guide mechanism can be set to a structural form in which a guide groove formed on the cutting frame 10 cooperates with a guide block provided on the lifting seat 51, etc. Such adjustments and changes to the specific structural form of the guide mechanism do not deviate from the principle and scope of this application, and should be limited within the scope of protection of this application.

[0201] In addition, it should be noted that the fixing seat may be omitted. In this case, the first driving assembly and the guide mechanism may be installed on the base of the wire cutting machine.

[0202] In addition, it should be noted that the present application does not limit the structural form of the first drive component. For example, those skilled in the art may set the first drive component to be a motor drive component, a hydraulic drive component or a pneumatic drive component, etc. Such adjustments and changes to the specific structural form of the first drive component do not deviate from the principles and scope of the present application and should be limited within the scope of protection of the present application.

[0203] Preferably, if Figure 7 and Figure 8 As shown, the first driving assembly of the present application includes a first motor 52 and a lift 53 connected to the lifting seat 51 , and the first motor 52 is drivingly connected to the lift 53 .

[0204] Exemplarily, the elevator 53 is a ball screw elevator, and the first motor 52 drives the lifting seat 51 to move up and down through the ball screw elevator.

[0205] It should be noted that the elevator 53 is not limited to the above-mentioned ball screw elevator. For example, a worm gear screw elevator may also be used.

[0206] Preferably, if Figures 7 to 11 As shown, the second drive assembly of the present application includes a second drive mechanism, a sprocket 43 and a chain 44 engaged with the sprocket 43, the chain 44 is connected to the moving trolley 42, and the second drive mechanism is connected to the sprocket 43 and can drive the sprocket 43 to rotate.

[0207] When the collecting member 16 needs to be moved outside the cutting chamber, the second driving mechanism drives the sprocket 43 to rotate, and the sprocket 43 moves with the chain 44, and the chain 44 pulls the moving trolley 42 and the collecting member 16 on the moving trolley 42 to move together.

[0208] For example, Figure 7 and Figure 8 As shown, the sprocket 43 is pivotally mounted on the track 41 and is located at the outer end of the track 41 (from Figure 7 The second drive mechanism is also mounted on the track 41, and the right end of the chain 44 is connected to the outer end of the mobile trolley 42 (from the left end). Figure 7 Left end when viewed from above) is fixedly connected.

[0209] It should be noted that the present application does not limit the structural form of the second drive mechanism. For example, a person skilled in the art may set the second drive mechanism to be in the structural form of a motor + gear transmission group, or to be in the structural form of a motor + synchronous belt transmission group, etc. Such adjustment and change of the specific structural form of the second drive mechanism does not deviate from the principle and scope of the present application, and should be limited within the scope of protection of the present application.

[0210] Preferably, if Figure 7 and Figure 8 As shown, the second driving mechanism of the present application includes a second motor 45, a driving pulley 46, a driven pulley 47 and a synchronous belt 48 for connecting the driving pulley 46 and the driven pulley 47. The driving shaft of the second motor 45 is connected to the driving pulley 46, and the driven pulley 47 is installed on the sprocket 43.

[0211] For example, Figure 7 and Figure 8As shown, the second motor 45 is fixedly mounted at the bottom of the track 41. The drive shaft of the second motor 45 is arranged horizontally, specifically extending along the width direction of the track 41. A driving pulley 46 is fixedly mounted on the drive shaft. A driven pulley 47 is fixedly mounted on the side of the sprocket 43. The driving pulley 46 and the driven pulley 47 are connected by a synchronous belt 48. The second motor 45 drives the driving pulley 46 to rotate, and the driving pulley 46 drives the driven pulley 47 and the sprocket 43 to rotate synchronously through the synchronous belt 48.

[0212] Preferably, if Figures 9 to 11 As shown, the chain 44 of the present application includes a plurality of pivotally connected chain monomers, each of which includes a body 441, a rotating shaft 442 horizontally installed in the body 441, and rollers 443 installed at both ends of the rotating shaft 442. A chain guide is also provided on the track 41, and the chain guide includes two strip grooves 412 spaced apart along the width direction of the track 41, and the side where the two strip grooves 412 are close to each other is open. The roller 443 is located in the strip groove 412, and the size of the strip groove 412 along the vertical direction matches the size of the roller 443 along the vertical direction to confine the roller 443 in the strip groove 412.

[0213] For example, Figures 9 to 11 As shown, the chain monomer extends along the length direction of the track 41, and two adjacent chain monomers are pivotally connected. A mounting hole is provided in the middle position of each chain monomer, and the mounting hole extends along the width direction of the track 41. The shaft 442 is installed in the mounting hole and can rotate. Two strip grooves 412 are provided on the track 41. The two strip grooves 412 are spaced apart along the width direction of the track 41. The chain 44 is located between the two strip grooves 412. The side of the two strip grooves 412 close to each other is open, that is, the strip grooves 412 are spaced apart. 2 has a cross-section that is approximately C-shaped, so that the roller 443 can extend into the corresponding strip groove 412. The vertical dimension of the strip groove 412, that is, the distance between the top wall and the bottom wall of the strip groove 412, matches the height of the roller 443. In this way, the chain 44 also has the function of pushing the movable carriage 42. After the silicon wafer on the collecting member 16 is taken out, the movable carriage 42 and the collecting member 16 on the movable carriage 42 can be pushed back into the cutting chamber by the chain 44 under the drive of the second driving mechanism.

[0214] Preferably, if Figure 7 As shown, the strip groove 412 on the track 41 includes a straight segment 4121 and an arc segment 4122 . One end of the straight segment 4121 is connected to the top of the arc segment 4122 . The arc segment 4122 is arranged corresponding to the sprocket 43 .

[0215] For example, Figure 7As shown, the arc segment 4122 is located at the outer end of the track 41 , the sprocket 43 is located between the two arc segments 4122 , and the other end of the chain 44 extends from the bottom end of the arc segment 4122 .

[0216] Preferably, if Figure 7 and Figure 8 As shown, the second drive assembly of the present application further includes a storage box 49 for storing the chain 44. The storage box 49 is located below the sprocket 43, and the top of the storage box 49 has an opening allowing the chain 44 to pass through.

[0217] By providing a storage box 49 below the sprocket 43 , the chain 44 extending from the bottom end of the arc segment 4122 enters the storage box 49 , preventing the chain 44 from swinging at will.

[0218] Preferably, if Figure 9 As shown, the unloading device of the present application further includes a clamping mechanism installed on the collecting member 16 , and the clamping mechanism is used to clamp the crystal rod 17 located on the collecting member 16 .

[0219] Clamping the silicon wafer with a clamping mechanism can prevent the silicon wafer from tipping over and thus avoid damage to the silicon wafer.

[0220] It should be noted that the present application does not limit the structural form of the clamping mechanism. For example, a person skilled in the art may set the clamping mechanism to a motor clamping mechanism, a hydraulic clamping mechanism or a pneumatic clamping mechanism, etc. Such adjustment and change of the specific structural form of the clamping mechanism does not deviate from the principle and scope of the present application and should be limited within the scope of protection of the present application.

[0221] Preferably, if Figure 9 As shown, the clamping mechanism of the present application includes two clamping assemblies 6 arranged opposite to each other. The two clamping assemblies 6 can generate relative movement in the direction of approaching / moving away from each other to clamp / release the silicon wafer.

[0222] Exemplarily, the two clamping assemblies 6 are arranged opposite to each other along the width direction of the collecting member 16. When the silicon wafer falls into the collecting member 16, the two clamping assemblies 6 move relative to each other in a direction close to each other, thereby clamping the silicon wafer in the collecting member 16. When the second driving assembly moves the collecting member 16 to the outside of the cutting chamber and transfers the collecting member 16 and the silicon wafer to a special wafer removal station, the two clamping assemblies 6 move away from each other, thereby loosening the silicon wafer, and then taking out the silicon wafer in the collecting member 16.

[0223] It should be noted that the two clamping assemblies 6 can also be arranged relative to each other along the length direction of the collecting member 16. Of course, it is preferred that the two clamping assemblies 6 are arranged relative to each other along the width direction of the collecting member 16. This arrangement is less likely to cause damage to the silicon wafer.

[0224] Preferably, if Figure 9 As shown, the clamping assembly 6 of the present application includes an airbag 61 , an air pump (not shown in the figure) connected to the airbag 61 , and a clamping plate 62 , one side of the clamping plate 62 is connected to the airbag 61 .

[0225] Exemplarily, the airbag 61 is fixedly mounted on the inner side wall of the collecting member 16 distributed along the width direction. The airbag 61 is connected to the air pump through an air pipe. The clamping plate 62 is fixedly connected to the inner side of the airbag 61. The clamping plate 62 is located between the silicon wafer and the airbag 61 and can provide rigid support for the silicon wafer. For example, it is set to a rectangular steel plate, etc. The clamping plate 62 extends along the length direction of the collecting member 16. The length of the clamping plate 62 is slightly larger than the length of the crystal rod 17. When the silicon wafer in the collecting member 16 needs to be clamped, the air pumps of the two clamping assemblies 6 inflate their respective airbags 61 respectively, so that the two clamping plates 62 move toward the silicon wafer at the same time to clamp the silicon wafer. When the silicon wafer needs to be taken out, the exhaust valve on the airbag 61 can be opened to discharge the gas in the airbag 61, thereby loosening the silicon wafer.

[0226] It should be noted that the airbag 61 can realize the clamping and loosening functions by switching between positive pressure and negative pressure modes, or a spring can be installed inside the airbag 61 or between the airbag 61 and the collecting member 16, and the airbag 61 can be expanded by positive pressure to clamp the silicon wafer, and the spring can compress the airbag 61 to loosen the silicon wafer after the air supply is stopped, etc. Such flexible adjustments and changes do not deviate from the principles and scope of this application and should be limited within the scope of protection of this application.

[0227] Preferably, if Figure 9 As shown, the other side (ie, the inner side) of the clamping plate 62 of the present application is provided with an elastic buffer structure.

[0228] By providing an elastic buffer structure on the inner side surface of the clamping plate 62 (the side surface close to the silicon wafer), the silicon wafer can be better protected and prevented from being damaged.

[0229] It should be noted that the present application does not limit the specific structural form of the elastic buffer structure. For example, the elastic buffer structure can be set as a plurality of elastic point-shaped protrusions, or as an elastic buffer pad, etc.

[0230] Preferably, if Figure 9 As shown, the elastic buffer structure of the present application is an elastic buffer pad 621.

[0231] Exemplarily, the elastic buffer pad 621 is made of polyurethane material.

[0232] Preferably, if Figure 2 and Figure 7As shown, the cutting assembly of the present application further includes a water retaining device 7 , which is installed at the discharge port 11 to prevent the cutting fluid in the cutting chamber from overflowing from the discharge port 11 .

[0233] The water retaining device 7 is arranged around the track 41 of the feeding device to prevent the cutting fluid in the cutting chamber from overflowing from the gap between the discharge port 11 and the track 41 . The water retaining device 7 can move up and down in the vertical direction along the track 41 .

[0234] It should be noted that, in actual applications, those skilled in the art can set the water retaining device 7 to be an integral annular structure, which is arranged around the track 41, or the water retaining device 7 can be set to include multiple split water retaining structures, which are respectively arranged on the top, bottom and sides of the track 41, etc. Such flexible adjustments and changes do not deviate from the principles and scope of this application, and should be limited within the scope of protection of this application.

[0235] Preferably, if Figure 7 、 Figures 12 to 14 As shown, the water retaining device 7 of the present application includes a first water retaining component 71, which is located above the track 41. The bottom of the first water retaining component 71 abuts against the top surface of the track 41, and the first water retaining component 71 can move up and down in the vertical direction together with the track 41.

[0236] With such an arrangement, when the discharge port 11 needs to be opened, it is only necessary to lift the first water retaining member 71 without any other operations, thereby improving work efficiency.

[0237] The first water retaining member 71 rests against the top surface of the track 41 under the action of its own gravity. When the track 41 rises, the track 41 lifts the first water retaining member 71 up together. When the track 41 falls, the first water retaining member 71 falls together with the track 41 under the action of its own gravity.

[0238] Preferably, if Figure 7 、 Figures 12 to 14 As shown, the water retaining device 7 of the present application further includes a second water retaining member 72 , which is located below the track 41 , and the top of the second water retaining member 72 is connected to the bottom surface of the track 41 , and the second water retaining member 72 can be extended and retracted as the track 41 rises and falls.

[0239] Among them, the bottom of the second water retaining member 72 is fixed. When the track 41 rises, the second water retaining member 72 stretches and lengthens as the track 41 rises, closing the part of the discharge port 11 located below the track 41. When the track 41 descends, the second water retaining member 72 is compressed and shortened.

[0240] Preferably, if Figure 7 、 Figures 12 to 14As shown, the water retaining device 7 of the present application also includes a third water retaining component 73, which is located on the side of the track 41 and is connected to the side of the track 41. The third water retaining component 73 can move up and down in the vertical direction together with the track 41.

[0241] Among them, the first water-blocking component 71, the second water-blocking component 72 and the third water-blocking component 73 are three independent components, which are respectively used to block water on the top, bottom and sides of the track 41. When the first driving component drives the track 41 to move up and down, the first water-blocking component 71, the second water-blocking component 72 and the third water-blocking component 73 can all move up and down with the track 41. In this way, during the cutting process, the discharge port 11 is always in a closed state, and the water-blocking effect is better.

[0242] Preferably, if Figures 12 to 14 As shown, the water retaining device 7 of the present application further includes a guide member, which is used to guide the first water retaining member 71 , the second water retaining member 72 and the third water retaining member 73 during their up and down movement.

[0243] By providing a guide member to guide the first water retaining member 71, the second water retaining member 72 and the third water retaining member 73, the first water retaining member 71, the second water retaining member 72 and the third water retaining member 73 will not deviate during the up and down movement, thereby achieving a more stable water retaining effect.

[0244] It should be noted that the present application does not limit the specific structural forms of the first water retaining member 71, the second water retaining member 72 and the third water retaining member 73. For example, they can be set as water retaining plates, water retaining blocks or water retaining covers, etc., as long as they can achieve the water retaining function.

[0245] In addition, it should be noted that, in actual applications, those skilled in the art may install the first water retaining member 71, the second water retaining member 72 and the third water retaining member 73 inside the cutting chamber, or may install the first water retaining member 71, the second water retaining member 72 and the third water retaining member 73 between the track 41 and the inner wall of the discharge port 11, or may install the first water retaining member 71, the second water retaining member 72 and the third water retaining member 73 outside the cutting chamber, and so on. Such flexible adjustments and changes do not deviate from the principles and scope of the present application and should be limited within the scope of protection of the present application.

[0246] Preferably, if Figures 12 to 15 As shown, the guide member of the present application is provided with a first guide groove 741 on the side facing the track 41 . The first guide groove 741 extends in the vertical direction, and the edge of the first water retaining member 71 is located in the first guide groove 741 .

[0247] For example, Figures 12 to 15 As shown, the guide member and the first water retaining member 71 are both located outside the cutting chamber, and the guide member includes two vertically arranged guide plates 74, and the two guide plates 74 are respectively located on both sides of the track 41. The guide plate 74 is provided with a vertically extending first guide groove 741 on the side facing the track 41. The left edge and the right edge of the first water retaining member 71 are respectively located in the corresponding first guide groove 741, and the width of the first guide groove 741 matches the thickness of the edge of the first water retaining member 71. By adopting the first guide groove 741 to guide the first water retaining member 71, it is beneficial to prevent the cutting fluid on the inside of the first water retaining member 71 from flowing along the edge of the first water retaining member 71 to the outside of the first water retaining member 71, and the waterproof effect is better.

[0248] Preferably, if Figures 12 to 15 As shown, the guide member of the present application is provided with a second guide groove 742 on the side facing the track 41 . The second guide groove 742 extends in the vertical direction, and the edge of the second water retaining member 72 is located in the second guide groove 742 .

[0249] For example, Figures 12 to 15 As shown, the second water retaining member 72 is also located outside the cutting chamber, and the guide plate 74 is further provided with a second guide groove 742 extending vertically on the side facing the track 41. The left edge and the right edge of the second water retaining member 72 are respectively located in the corresponding second guide groove 742. The first guide groove 741 and the second guide groove 742 can be located in the same vertical plane, and the bottom end of the first guide groove 741 is connected to the top end of the second guide groove 742, or, as shown in FIG. Figure 15 As shown, the first guide groove 741 and the second guide groove 742 can be staggered in the horizontal direction.

[0250] Preferably, if Figures 12 to 16 As shown, the guide member of the present application is provided with a guide rib 743 on the side facing the track 41, and the guide rib 743 extends in the vertical direction. The third water retaining member 73 is provided with a third guide groove 731 at a position corresponding to the guide rib 743, and the guide rib 743 is adapted to the third guide groove 731.

[0251] For example, Figures 12 to 16As shown, the first guide groove 741 and the second guide groove 742 on the guide plate 74 are spaced apart in the horizontal direction, and the portion between the first guide groove 741 and the second guide groove 742 forms a guide rib 743. A portion of the third water retaining member 73 is located between the side of the track 41 and the side wall of the discharge port 11, and is in contact with the side wall of the discharge port 11. Another portion of the third water retaining member 73 is located outside the cutting chamber and between the track 41 and the guide plate 74. A vertically extending third guide groove 731 is provided at this portion, and the guide rib 743 is located in the third guide groove 731. While playing a guiding role, it can also play a waterproof role.

[0252] Preferably, the first water blocking member 71 of the present application is located outside the cutting chamber.

[0253] By arranging the first water retaining member 71 outside the cutting chamber, when the collecting member 16 needs to be moved outside the cutting chamber, the first water retaining member 71 can be easily lifted to open the discharge port 11. In other words, the first water retaining member 71 is equivalent to a door, closing the portion of the discharge port 11 above the track 41. When the discharge port 11 needs to be opened, the first water retaining member 71 can be lifted manually, automatically, or semi-automatically.

[0254] Preferably, if Figures 12 to 14 As shown, the first water retaining member 71 of the present application includes a vertically arranged first water retaining plate 711, a vertically arranged second water retaining plate 712, and a connecting plate 713 for connecting the first water retaining plate 711 and the second water retaining plate 712. The first water retaining plate 711 and the second water retaining plate 712 are spaced apart along the length direction of the track 41, and the first water retaining plate 711 is located between the second water retaining plate 712 and the cutting frame 10.

[0255] By arranging the first water retaining plate 711 and the second water retaining plate 712 spaced apart along the length direction of the track 41 , double protection can be formed, and the water retaining effect is better.

[0256] For example, Figures 12 to 14 As shown, the tops of the first water baffle 711 and the second water baffle 712 are connected by a horizontally arranged connecting plate 713, and the two sides of the first water baffle 711 and the second water baffle 712 are respectively connected by a vertically arranged connecting plate 713, the width of the second water baffle 712 is greater than the width of the first water baffle 711, and the edge of the second water baffle 712 is located in the first guide groove 741.

[0257] Preferably, if Figure 10 and Figure 12As shown, the horizontal guide rail 411 on the track 41 is a track groove formed on the top surface of the track 41, and the first water retaining member 71 also includes a third water retaining plate 714, which is installed on the second water retaining plate 712. The third water retaining plate 714 can move up and down relative to the second water retaining plate 712 so that the bottom of the third water retaining plate 714 can abut against the bottom wall of the track groove.

[0258] Under normal working conditions, there is relatively little cutting fluid on the track 41, and the bottom of the third water baffle 714 is flush with or slightly higher than the bottom of the second water baffle 712. When there is relatively much cutting fluid on the track 41, the third water baffle 714 can be moved down so that the bottom of the third water baffle 714 passes over the bottom of the second water baffle 712 and abuts against the bottom wall of the track groove on the track 41, thereby blocking the cutting fluid and preventing it from flowing outward, thereby achieving a better water-blocking effect.

[0259] For example, Figure 10 As shown, two track grooves are formed on the top surface of the track 41, and the two track grooves are spaced apart along the width direction of the track 41, as shown in FIG. Figure 12 As shown, the third water baffle 714 is arranged in an inverted U shape, which can be inserted into the two track grooves.

[0260] Preferably, if Figures 12 to 14 As shown, the second water retaining member 72 of the present application is an accordion shield, and the top of the accordion shield is fixedly connected to the bottom surface of the track 41.

[0261] Among them, the accordion shield can be stretched / compressed in the vertical direction, and the bottom end of the accordion shield is fixed. When the track 41 rises, the accordion shield stretches and becomes longer as the track 41 rises, closing the part of the discharge port 11 located below the track 41. When the track 41 descends, the accordion shield is compressed and shortened.

[0262] It should be noted that, in actual applications, those skilled in the art can install the accordion guard inside the cutting chamber, or can install the accordion guard between the track 41 and the bottom wall of the discharge port 11, or can install the accordion guard outside the cutting chamber. Such adjustments and changes to the specific installation position of the accordion guard do not deviate from the principles and scope of this application, and should be limited within the scope of protection of this application.

[0263] Preferably, the accordion shield of the present application is located outside the cutting chamber.

[0264] Preferably, if Figures 12 to 14As shown, the water retaining device 7 of the present application also includes a fixing frame 75 fixedly connected to the cutting frame 10, the guide member and the second water retaining member 72 are installed on the fixing frame 75, and a water receiving groove 751 is provided at the bottom of the fixing frame 75, and the bottom of the guide member and the bottom of the second water retaining member 72 are both connected to the water receiving groove 751.

[0265] For example, Figures 12 to 14 As shown, the fixing frame 75 is located outside the cutting chamber. The fixing frame 75 has a flange on one side close to the cutting frame 10, which is fixedly connected to the cutting frame 10 by bolts. The bottom end of the accordion shield is fixedly connected to the inner bottom wall of the water receiving trough 751. The cutting fluid blocked by the accordion shield can flow along the accordion shield into the water receiving trough 751, effectively preventing the cutting fluid from flowing out. Furthermore, two guide plates 74 are fixedly mounted on the fixing frame 75. The first guide groove 741 and the second guide groove 742 provided on the guide plates 74 are both connected to the water receiving trough 751 on the fixing frame 75. If any cutting fluid enters the first guide groove 741 and the second guide groove 742, it will also flow into the water receiving trough 751, effectively preventing the cutting fluid from flowing out.

[0266] Preferably, if Figures 12 to 16 As shown, the third water retaining member 73 of the present application includes two water retaining blocks, which are respectively located on both sides of the track 41 .

[0267] That is to say, a water block is installed on the left and right sides of the track 41, for example, the water block can be fixed to the side of the track 41 by screws, wherein a part of the water block is located between the track 41 and the side wall of the discharge port 11, and the other part of the water block is located outside the cutting chamber, and the side of this part facing away from the track 41 is provided with a third guide groove 731 adapted to the guide rib 743 on the guide plate 74.

[0268] Preferably, if Figure 8 and Figure 9 As shown, the cutting assembly of the present application further includes a flow guide component, which is used to receive part of the cutting fluid during the cutting process and / or the blanking process.

[0269] The cutting process refers to the process of cutting the crystal rod, and the unloading process refers to the process of removing the collecting component 16 and the silicon wafers in the collecting component 16 from the moving cart 42. When the collecting component 16 and the silicon wafers in the collecting component 16 are removed from the moving cart 42, the cutting fluid on the outer surface of the collecting component 16 will drip, and the dripping cutting fluid can be received by the guide component.

[0270] The flow guide component can be installed on the track 41 and / or the mobile trolley 42 of the blanking device. Furthermore, the flow guide component can be connected to the cutting chamber to guide the received cutting fluid back to the cutting chamber.

[0271] By setting up a diversion component, during the cutting process, it can receive the cutting fluid dripping from above, acting as a buffer for the cutting fluid to prevent the cutting fluid from splashing everywhere. In the process of removing the collecting component 16 from the mobile cart 42, the cutting fluid dripping from the collecting component 16 can be collected and diverted back into the cutting chamber to avoid waste due to outflow of the cutting fluid. In addition, when a first drive component is provided, it can also prevent the cutting fluid from falling onto the first drive component located below the track 41, thereby effectively protecting the first drive component and avoiding pollution of the working environment.

[0272] Preferably, if Figure 8 and Figure 9 As shown, the guide assembly of the present application includes a first guide plate 81 installed on the blanking device, and a first collecting port is provided on the top of the first guide plate 81, and the cutting fluid can enter the first guide plate 81 through the first collecting port.

[0273] Exemplarily, the first guide plate 81 is installed on the moving trolley 42 of the unloading device. During the process of removing the collecting member 16 from the moving trolley 42, the cutting fluid dripping from the collecting member 16 can be collected to prevent the cutting fluid from dripping to other places. In addition, when the first driving assembly is provided, when the collecting member 16 is located inside the cutting chamber, the first guide plate 81 can also rise with the track 41 to receive the cutting fluid dripping from above, thereby playing the role of a cutting fluid buffer.

[0274] For example, Figure 9 and Figure 10 As shown, the moving trolley 42 is a flatbed trolley, and the first guide plate 81 is installed on the top surface of the moving trolley 42 .

[0275] Preferably, if Figure 8 and Figure 9 As shown, the lower portion of the collecting member 16 is located within the first guide plate 81 , and the width of the first guide plate 81 is greater than the width of the collecting member 16 .

[0276] In this way, a space for storing the cutting fluid can be formed between the first guide plate 81 and the side wall of the collecting member 16 .

[0277] Preferably, if Figure 8 and Figure 9 As shown, the first guide plate 81 is provided with a first guide opening 814 , and the cutting fluid in the first guide plate 81 can flow out from the first guide opening 814 and drip onto the track 41 or the bottom of the cutting chamber.

[0278] In which, when the first guide plate 81 is located inside the cutting chamber, the cutting fluid flowing out from the first guide opening 814 can directly drip to the bottom of the cutting chamber; when the first guide plate 81 is located outside the cutting chamber, the cutting fluid flowing out from the first guide opening 814 can directly drip onto the track 41.

[0279] For example, the first guide opening 814 is provided at the inner end of the first guide plate 81 (from Figure 8 The right end when viewed from above) and the inner end of track 41 (from Figure 8 The cutting fluid flows onto the track 41 and then flows out from the opening at the inner end of the track 41 and falls to the bottom of the cutting chamber. Alternatively, an opening may be provided in the middle of the track 41, which is connected to the cutting chamber through a drainage pipe.

[0280] Preferably, if Figure 8 and Figure 9 As shown, the first guide plate 81 includes a first bottom plate 811, two oppositely arranged first side plates 812 and two oppositely arranged first end plates 813. The first bottom plate 811, the two first side plates 812 and the two first end plates 813 together form a water-containing space. The first bottom plate 811 is fixedly connected to the moving trolley 42, and the first side plate 812 extends along the length direction of the moving trolley 42. The bottom end of the first side plate 812 is fixedly connected to or integrally arranged with the first bottom plate 811. The first end plate 813 extends along the width direction of the moving trolley 42. The bottom end of the first end plate 813 is fixedly connected to or integrally arranged with the first bottom plate 811. The first guide opening 814 is formed on the inner side of the first end plate 813.

[0281] It should be noted that, in actual applications, those skilled in the art may also cancel the first end plate 813 located on the inner side, that is, the inner end of the first guide plate 81 is open, and the opening between the two first side plates 812 forms the first guide opening 814.

[0282] Preferably, if Figure 8 and Figure 9 As shown, the diversion assembly of the present application also includes a diversion box 83 installed on the track 41, and a second diversion opening (not shown in the figure) is provided on the track 41. The diversion box 83 is located below the track 41 and is connected to the second diversion opening. The diversion box 83 is connected to the cutting chamber through a drain pipe.

[0283] Exemplarily, the second diversion opening is preferably arranged in the middle position in the length direction of the track 41, the diversion box 83 is fixedly installed at the bottom of the track 41, and the top of the diversion box 83 is open, so as to be connected with the second diversion opening on the track 41. The bottom of the diversion box 83 has a drain outlet connected to the drain pipe. The cutting fluid on the track 41 enters the diversion box 83 through the second diversion opening, and then flows back into the cutting chamber along the drain pipe.

[0284] Preferably, if Figure 8 and Figure 9 As shown, the guide assembly of the present application also includes a second guide plate 82 installed on the track 41. A second collecting port is provided on the top of the second guide plate 82. The cutting fluid dripping from the collecting member 16 can pass through the second collecting port into the second guide plate 82. The second guide plate 82 is located on the side of the track 41.

[0285] For example, Figure 8 and Figure 9 As shown, a second guide plate 82 is installed on the left and right sides of the track 41. The length of the second guide plate 82 is shorter than that of the track 41 and is located outside the cutting chamber. During the process of removing the silicon wafer from the collecting member 16, the cutting fluid dripping from the silicon wafer will fall onto the second guide plate 82. Of course, in actual applications, those skilled in the art may also install the second guide plate 82 on only one side of the track 41.

[0286] It should be noted that, in actual applications, those skilled in the art can extend the second guide plate 82 into the inside of the cutting chamber and set the inner end of the second guide plate 82 to be open, so that the cutting fluid in the second guide plate 82 can flow directly back into the cutting chamber, or the second guide plate 82 can be connected to the cutting chamber through a drain pipe.

[0287] Preferably, if Figure 8 and Figure 9 As shown, the second guide plate 82 of the present application is connected to the cutting chamber through a drainage pipe.

[0288] For example, Figure 8 and Figure 9 As shown, a drain port is provided in the middle position of the bottom of the second guide plate 82, and the drain port is connected to the drain pipe. The cutting fluid in the second guide plate 82 enters the drain pipe through the drain port and flows back to the cutting chamber along the drain pipe.

[0289] Preferably, if Figure 8 and Figure 9As shown, the second guide plate 82 of the present application includes a second base plate 821, a second side plate 822 and two oppositely arranged second end plates 823, one side of the second base plate 821 is fixedly connected to the side wall of the track 41, the second side plate 822 extends along the length direction of the track 41, the bottom end of the second side plate 822 is fixedly connected to or integrally arranged with the other side of the second base plate 821, the bottom end of the second end plate 823 is fixedly connected to or integrally arranged with the second base plate 821, and the left and right ends of the second end plate 823 are respectively connected to the side wall of the track 41 and the second side plate 822.

[0290] That is to say, the front and rear ends of the second guide plate 82 are both blocked, and all the cutting fluid in the second guide plate 82 flows back into the cutting chamber through the drain pipe. For example, a drain outlet connected to the drain pipe is provided in the middle position of the second bottom plate 821.

[0291] Preferably, if Figure 8 and Figure 9 As shown, the second side plate 822 of the present application is tilted in a direction away from the track 41 .

[0292] By tilting the second side plate 822 of the second guide plate 82 , the receiving area of ​​the second guide plate 82 is increased, thereby being able to receive more cutting fluid.

[0293] This application also provides a control method for a wire cutting machine, such as Figure 17 As shown, the control method of the present application includes the following steps:

[0294] S100: Control the first driving assembly to raise the collecting member 16 to a position at a set distance from the wire mesh 15;

[0295] S200: Control the feeding device 20 to feed the crystal ingot 17 toward the wire mesh 15;

[0296] S300: performing a debonding operation on the cut silicon wafers so that the silicon wafers are collected in the collecting member 16;

[0297] S400: Control the first driving assembly to lower the collecting member 16 to the discharge position;

[0298] S500: Control the second driving assembly to move the collecting member 16 from the discharge port 11 to the outside of the cutting chamber.

[0299] When cutting the crystal rod 17, by controlling the first drive component to raise the collecting member 16 to a position at a set distance from the wire mesh 15, the distance between the collecting member 16 and the crystal rod 17 can be reduced, which is safer. The crystal rod 17 is cut into multiple silicon wafers, and the silicon wafers formed by the cut are debonded. After the silicon wafers are debonded, they fall into the collecting member 16 below, and then the first drive component is controlled to lower the collecting member 16 and the collected silicon wafers to the discharge position. In addition, by controlling the second drive component to move the collecting member 16 to the outside of the cutting chamber, the cutting efficiency can be improved.

[0300] It should be noted that the distance between the collecting member 16 and the wire mesh 15 refers to the distance between the receiving surface 161 of the collecting member 16 for receiving the silicon wafer and the wire mesh 15. Figure 9 As shown, taking the above-mentioned collecting member 16 as an example, the inner bottom wall of the shell is a receiving surface 161 for receiving the silicon wafer. In step S100, when the distance between the inner bottom wall of the shell and the wire mesh 15 reaches the set distance, the collecting member 16 stops rising.

[0301] Furthermore, it should be noted that this application does not limit the specific value of the set distance. Those skilled in the art may set the set distance to a fixed value, such as any value between 180 mm and 220 mm, or may set the specific value of the set distance based on the height of the crystal ingot 17. Of course, it is preferred that the set distance be no less than the height of the crystal ingot 17.

[0302] In a preferred embodiment in which a degumming device is provided, the above step S300 specifically includes: controlling the degumming device to perform a degumming operation on the cut silicon wafer.

[0303] Wherein, when the degumming device is a laser generator, the step of controlling the degumming device to perform a degumming operation on the cut silicon wafer further includes: controlling the laser generator to emit laser light toward the adhesive layer bonded to the cut silicon wafer.

[0304] In the case where the degumming device is a spray degumming device 3, the step of controlling the degumming device to perform a degumming operation on the cut silicon wafer further includes: controlling the spray degumming device 3 to spray a degumming liquid onto the adhesive layer bonded to the cut silicon wafer.

[0305] Specifically, this step includes: controlling the nozzle 32 to spray the debonding liquid toward the adhesive layer bonded to the silicon wafer formed by cutting.

[0306] In a preferred embodiment, the control method of the present application also includes: after controlling the spray degumming device 3 to spray the degumming liquid onto the glue layer bonded to the silicon wafer formed by cutting, obtaining the spraying duration of the spray degumming device 3; judging whether the spraying duration is greater than or equal to a preset spraying duration threshold; if so, controlling the spray degumming device 3 to stop spraying the degumming liquid onto the glue layer.

[0307] For example, different glues and adhesive layer thicknesses require different spray times. Experiments can determine the appropriate spray time for each type of glue and adhesive layer thickness, and use this time as the preset spray duration threshold. Once debonding begins, the system accumulates the duration of the spray and compares it with the preset spray duration threshold. If the duration of the spray is greater than or equal to the preset spray duration threshold, debonding of the wafer is complete; otherwise, debonding is not complete. By accumulating the duration of the spray, debonding can be stopped promptly after debonding is complete, avoiding energy waste.

[0308] The temperature of the degumming solution is preferably any value between 15°C and 80°C. More preferably, the temperature of the degumming solution is any value between 15°C and 30°C.

[0309] For example, when a cutting fluid is used as the degumming fluid, it can be heated during its circulation process to achieve temperature control. This application does not limit the heating method, as long as it effectively heats the cutting fluid. For example, a heating device can be installed in the fluid supply cylinder, or a heat exchange device can be installed in the fluid path.

[0310] Preferably, the control method of the present application further comprises: when performing a debonding operation on the cut silicon wafer, the distance between the bottom of the silicon wafer and the collecting member 16 is not greater than a safety distance.

[0311] During the debonding operation on the silicon wafer, by keeping the silicon wafer at a safe distance from the collecting member 16 , damage to the silicon wafer when it falls into the collecting member 16 can be avoided.

[0312] It should be noted that the distance between the bottom of the silicon wafer and the collecting member 16 refers to the distance between the bottom of the silicon wafer and the receiving surface 161 of the collecting member 16. The receiving surface 161 of the collecting member 16 has been introduced before and will not be repeated here. In addition, the distance between the bottom of the silicon wafer and the collecting member 16 mentioned later refers to the distance between the bottom of the silicon wafer and the receiving surface 161 of the collecting member 16.

[0313] In addition, it should be noted that the present application does not limit the specific value of the safety distance. In actual applications, those skilled in the art may set the safety distance to 3mm, 5mm, 7mm, 9mm, or 12mm, etc. Of course, the present application preferably sets the safety distance to any value between 5mm and 10mm.

[0314] Preferably, the set distance is equal to the sum of the height of the crystal ingot 17 , the set cutting depth of the bonding plate, and the safety distance.

[0315] Among them, the adhesive plate is set between the crystal drag and the crystal rod 17, which is used to adhere the crystal rod 17 to the crystal drag. The crystal drag is installed on the feeding device 20. In order to ensure that the crystal rod 17 can be cut through, the wire mesh 15 needs to be cut into the adhesive plate according to the set cutting depth.

[0316] For example, the height of the crystal rod 17 is 182 mm, the cutting depth is set to 7 mm, and the safety distance is 7 mm, then the set distance = 182 + 7 + 7 = 196 mm.

[0317] It should be noted that, during each cutting, only one crystal ingot 17 may be mounted on the feeding device 20 , or a plurality of crystal ingots 17 may be mounted simultaneously.

[0318] Preferably, a plurality of crystal rods 17 are mounted on the feeding device 20, and the plurality of crystal rods 17 are bonded together along the feeding direction. The control method of the present invention further includes:

[0319] Multiple crystal rods are cut, debonded, collected and transported one by one to the outside of the cutting chamber, and the feeding device does not stop during the debonding, collecting and transporting processes.

[0320] Among them, the feeding direction is the vertical direction, and multiple crystal rods 17 are bonded together along the vertical direction to form a crystal rod assembly. Adjacent crystal rods 17 are bonded by glue to form a glue layer. The number of crystal rods 17 can be two, three or five, etc. The crystal rod at the bottom is defined as the head crystal rod, and the crystal rod at the top is defined as the tail crystal rod. The tail crystal rod is close to the feeding device, the head crystal rod is cut first, and the tail crystal rod is cut last.

[0321] Preferably, the control method of the present application further comprises: when the distance between the bottom of the crystal rod 17 being cut and the collecting member 16 reaches a safe distance, controlling the first driving assembly to lower the collecting member 16 at the feeding speed of the feeding device 20 .

[0322] That is to say, when cutting just starts, the collecting member 16 is stationary. As the feeding device 20 feeds the crystal rod 17 toward the wire mesh 15, the distance between the bottom of the crystal rod 17 and the collecting member 16 gradually decreases. When the distance between the bottom of the crystal rod 17 and the collecting member 16 is reduced to a safe distance, the first drive assembly begins to descend with the collecting member 16, and the moving speed of the first drive assembly is the same as the feeding speed of the feeding device 20, so that the bottom of the crystal rod 17 and the collecting member 16 are always maintained at a safe distance.

[0323] Preferably, the control method of the present application further includes: after the tail crystal rod is cut, controlling the feeding device 20 to perform a retraction operation with the tail crystal rod; wherein the tail crystal rod is the crystal rod close to one end of the feeding device 20 among the multiple crystal rods.

[0324] That is to say, the silicon wafers cut from the last crystal rod do not enter the collecting component 16. After the cutting is completed, the crystal rod is directly moved upward by the feeding device 20. After the knife retraction operation is completed, the last crystal rod is removed from the feeding device 20 and can be debonded according to the traditional debonding method. Compared with transporting the tail crystal rod to the outside of the cutting chamber through the collecting component 16, this arrangement can further improve work efficiency. In addition, by not performing the debonding operation on the tail crystal rod, it is beneficial to avoid cutting accidents caused by contact between the feeding device 20 and the wire mesh 15, thereby improving cutting safety.

[0325] The present application does not limit the method of detecting whether it is the tail crystal rod, and the determination can be based on the cutting duration, the rotation angle of the driving motor of the feeding device 20, or the image captured by the image recognition device.

[0326] The control method of the present application is described in detail below using a crystal rod assembly including three crystal rods 17 as an example, wherein the crystal rod 17 located at the bottom of the crystal rod assembly is the head crystal rod, the crystal rod 17 located in the middle is the middle crystal rod, and the crystal rod 17 located at the top is the tail crystal rod.

[0327] When cutting begins, the first drive assembly is controlled to raise the collection member 16. When the distance between the collection member 16 and the wire mesh 15 reaches a set distance (e.g., 196 mm), the process stops. The feed device 20 is then controlled to feed the ingot assembly toward the wire mesh 15. It should be noted that the two steps above can also be performed simultaneously. That is, while the first drive assembly is controlled to raise the collection member 16, the feed device 20 can be controlled to feed the ingot assembly toward the wire mesh 15 to improve work efficiency.

[0328] The head crystal rod is the first to be cut by the wire mesh 15. When the distance between the bottom of the head crystal rod and the collecting member 16 reaches a safe distance (for example, 7 mm), the first drive assembly is controlled to lower the collecting member 16. The moving speed of the first drive assembly remains the same as the feeding speed of the feeding device 20.

[0329] After the head ingot is cut, the adhesive layer on the head ingot moves to the debonding range of the debonding device, and the debonding device performs the debonding operation on the head ingot. During the debonding operation of the head ingot, the feeding device 20 can be stopped or continued. In this case, the debonding time needs to be determined based on experiments to determine the feeding speed and ensure that the debonding operation is completed within the set debonding range.

[0330] After the head crystal rod completes the debonding operation, it falls into the collecting member 16 below. The first drive component is controlled to bring the collecting member 16 down to the discharge position, and then the second drive component is controlled to move the collecting member 16 to the outside of the cutting chamber. The collecting member 16 and the silicon wafer are removed from the moving cart 42 together, and then an empty collecting member 16 is placed on the moving cart 42. The second drive component is controlled to move the empty collecting member 16 into the cutting chamber, and then the first drive component is controlled to bring the collecting member 16 up. When the distance between the collecting member 16 and the bottom of the middle crystal rod (being cut) reaches a safe distance, it stops, and then descends with the collecting member 16. During the entire above process, the feeding device 20 continues to feed.

[0331] After the middle crystal ingot is cut and debonded, it is transported to the outside of the cutting chamber by the collecting member 16. After the tail crystal ingot is cut, the tail crystal ingot is moved upward by the feeding device 20 to perform the knife retraction operation.

[0332] It should be noted that during the cutting process, cutting process information can be obtained, and then based on the cutting process information, it is determined whether the crystal ingot 17 has been cut. For example, the cutting process information can be time information related to the cutting process, motor parameter information of the feeding device 20, image information containing the crystal ingot assembly, etc. After the cutting starts, the above information can be obtained in real time or at regular intervals. Among them, the specific method of obtaining the above information is relatively conventional and will not be repeated in this application.

[0333] In this application, the head ingot is the first ingot to be cut in the ingot assembly 17. After obtaining the cutting process information, the cutting process information is used to determine whether the head ingot is cut. When the head ingot is cut, the head ingot is debonded to separate the multiple silicon wafers contained in the head ingot from the adhesive layer and collect them in the collection member 16 for easy removal as a whole.

[0334] Preferably, the cutting assembly of the present application further includes a detection device, which is disposed on the cutting frame 10 and is used to collect cutting process information during the cutting process. Preferably, the detection device is a visual recognition device, such as a camera, etc., and is fixedly mounted on the side wall of the cutting frame 10 opposite to the longitudinal direction of the collection member 16, and is used to collect cutting process images during the cutting process.

[0335] During the cutting process, the visual recognition device collects images of the cutting process. For example, the image may include the crystal rod assembly, the wire mesh 15 and the collecting component 16, so as to judge whether the head crystal rod of the crystal rod assembly has been cut through the collected image, and perform the debonding operation on the head crystal rod when the cutting is completed.

[0336] More specifically, based on the cutting process image, it is determined whether the lowest point of the wire mesh 15 along the feeding direction is higher than the highest point of the head crystal ingot; if so, it is determined that the head crystal ingot is cut; otherwise, it is determined that the head crystal ingot is not cut.

[0337] During the cutting process, the wire mesh 15 will form a wire bow under the downward pressure of the crystal rod assembly. If the lowest point of the wire bow in the vertical direction is higher than the highest point of the head crystal rod in the vertical direction, it proves that the head crystal rod has been cut and the debonding operation can be performed; otherwise, it proves that the head crystal rod has not been cut. Among them, the lowest point of the wire bow can be approximately regarded as the lowest point of the exposed part of the wire bow in the image (part of the wire bow is hidden in the crystal rod 17), and it can also be calculated based on the lowest point of the exposed part. The above-mentioned image processing process belongs to the conventional means in this field and will not be described in detail in this application.

[0338] It should be noted that those skilled in the art can also use other methods to determine whether the cutting of the head crystal rod is completed based on the obtained cutting process image. For example, according to the cutting process image, it is determined whether the coordinate value of the highest point of the head crystal rod along the feed direction is less than or equal to the first preset coordinate value; if so, it is determined that the cutting of the head crystal rod is completed; otherwise, it is determined that the cutting of the head crystal rod is not completed. In this way, the image coordinate system can be calibrated in advance, with the opposite direction of the feed direction as the positive direction of the coordinate axis, and the height coordinate of the head crystal rod when the cutting is completed is experimentally determined as the first preset coordinate value. When the actual cutting is performed, if the coordinate of the highest point of the head crystal rod obtained is less than the first preset coordinate value, it is determined that the cutting is completed; otherwise, it is determined that the cutting is not completed.

[0339] By setting up a detection device, the cutting process information can be collected by the detection device to determine the debonding time and improve the debonding accuracy. The detection device uses a visual recognition device, which is conducive to improving the judgment accuracy.

[0340] Of course, the specific configuration of the above-mentioned detection device is not fixed, and those skilled in the art can adjust it so that the present application is applicable to more specific application scenarios.

[0341] For example, the detection device may not be provided, but other methods may be used to determine whether the cutting of the crystal ingot 17 is complete. For another example, the detection device may be provided in other locations, such as the side of the collection member 16 in the width direction, as long as it can effectively determine the degree of cutting of the crystal ingot 17. For another example, in addition to the visual recognition device, the detection device may be any other possible device, as long as it can effectively collect and determine whether the cutting of the crystal ingot 17 is complete. For example, the detection device may also be a laser scanning device, which scans the surface to obtain an image of the crystal ingot assembly and the wire mesh 15, and determines whether the cutting is complete based on the image.

[0342] When the detection device is not provided, it is possible to determine whether the crystal rod 17 has been cut completely by other means.

[0343] For example, the cutting process information is the cutting duration. When judging, it is determined whether the cutting duration is greater than or equal to the preset cutting duration threshold based on the cutting duration; if so, it is determined that the cutting of the head crystal rod is completed; otherwise, it is determined that the cutting of the head crystal rod is not completed.

[0344] Before cutting, the time it takes for each crystal ingot 17 in the crystal ingot assembly to be cut can be determined experimentally, and this time can be used as a preset cutting time threshold. Once cutting begins, the system accumulates the cutting duration and compares it with the preset cutting time threshold. If the cutting duration is greater than or equal to the preset cutting time threshold, the head crystal ingot has been cut; otherwise, the head crystal ingot is determined to be incomplete. Using the cutting duration to determine whether the head crystal ingot has been cut is simple and low-cost.

[0345] For example, the cutting process information can also be the rotation angle of the driving motor of the feeding device 20. When judging, it is determined whether the rotation angle is greater than or equal to the preset angle threshold; if so, it is determined that the cutting of the head crystal rod is completed; otherwise, it is determined that the cutting of the head crystal rod is not completed.

[0346] The depth of the feed device 20 driven by the drive motor corresponds to the movement distance of the crystal ingot assembly. If the feed depth of the feed device 20 is calculated, the movement distance of the head crystal ingot can be known. Similarly, the rotation angle of the drive motor of the feed device 20 can be determined through experiments when each crystal ingot 17 in the crystal ingot assembly is cut, and this angle is used as a preset angle threshold. When the rotation angle of the drive motor is greater than or equal to the preset angle threshold, it proves that the head crystal ingot has been cut; otherwise, it is determined that the head crystal ingot has not been cut. Using the rotation angle to determine whether the head crystal ingot has been cut is beneficial to balancing control accuracy and cost.

[0347] Preferably, the cutting assembly of the present application further includes a verification device, which is disposed on the cutting frame 10 and is used to collect degumming result information during the cutting process. Preferably, the verification device can also be a visual recognition device, and the visual recognition device can be shared with the detection device. That is, the verification device is disposed on the side wall of the cutting frame 10 opposite to the longitudinal direction of the collection member 16, and is used to collect degumming result images during the degumming process.

[0348] During the debonding process, the visual recognition device collects images of the debonding process so as to determine whether all silicon wafers have been debonded through the collected images.

[0349] By setting up a verification device, the debonding effect can be verified to determine whether all silicon wafers have been debonded. This is conducive to improving the debonding effect and ensuring that all silicon wafers are debonded smoothly. The verification device uses a visual recognition device to improve the accuracy of debonding verification.

[0350] Of course, the specific configuration of the above-mentioned verification device is not fixed, and those skilled in the art can adjust it so that the present application is applicable to more specific application scenarios.

[0351] For example, the verification device may not be provided, or may be provided separately from the detection device. For example, the verification device may be movably provided between two side walls of the cutting frame 10 opposite to the length direction of the collecting member 16 by means of an electric cylinder, a pneumatic cylinder, or the like. For another example, the verification device may be a laser sensor provided on the side wall of the cutting frame 10 opposite to the length direction of the collecting member 16, and used to measure the ranging length during the degumming process so as to determine whether the degumming is completed based on the measured ranging length. The use of a laser sensor in the verification device can increase the judgment speed and thereby improve the degumming efficiency.

[0352] In one possible embodiment, the control method of the present application further includes: after controlling the degumming device to perform a degumming operation on the cut silicon wafer, obtaining degumming result information through a verification device; judging whether the degumming is completed based on the degumming result information; if so, stopping the degumming operation; otherwise, continuing to perform the degumming operation on the silicon wafer.

[0353] Specifically, the verification device and the inspection device share a visual recognition device. The above steps further include: first, obtaining a debonding result image using the visual recognition device; then, based on the debonding result image, determining whether debonding is complete. More specifically, based on the debonding result image, determining whether the distance between the adhesive layer and the silicon wafer is greater than or equal to a preset distance threshold; if so, debonding is determined to be complete; otherwise, debonding is determined to be incomplete.

[0354] Since the silicon wafers will fall into the collection member 16 after degumming, a large gap will be generated between the silicon wafers and the adhesive layer. At this time, the degumming result image collected by the visual recognition device is used to calculate whether the distance between the adhesive layer and all silicon wafers is greater than or equal to the preset distance threshold, and it can be determined whether all silicon wafers have been degummed. When the distance between the adhesive layer and the silicon wafer is greater than or equal to the preset distance threshold, it is proved that the silicon wafer has been degummed, and the current degumming operation is stopped. Otherwise, it is determined that the silicon wafer has not been degummed, and the degumming device is controlled to continue the degumming operation. The preset distance threshold can be determined based on experiments or empirical values.

[0355] Of course, the above method for determining the completion of degumming is not the only one, and those skilled in the art can adjust it.

[0356] For example, the debonding result image can be used to determine whether the coordinate value of the highest point of all silicon wafers along the feed direction is less than or equal to a second preset coordinate value; if so, debonding is determined to be complete; otherwise, debonding is determined to be incomplete. In this method, the image coordinate system can be calibrated in advance, with the direction opposite to the feed direction as the positive direction of the coordinate axis, and the second preset coordinate value is determined based on the height coordinate of all silicon wafers when debonding is complete. When debonding is performed, if the coordinate value of the highest point of all silicon wafers obtained is less than or equal to the second preset coordinate value, debonding is determined to be complete; otherwise, debonding is determined to be incomplete.

[0357] Of course, when the verification device is not provided, other methods can also be used to determine whether the debonding is completed. For example, it can be determined by determining whether the cumulative debonding time is greater than a preset time.

[0358] For another example, although the above judgment method is described in conjunction with the verification device and the detection device, the above judgment method is also valid when the verification device and the detection device are not shared and two visual recognition devices are set up at the same time.

[0359] For example, in another embodiment, when the verification device is a laser sensor, the distance measurement length can be first obtained by the laser sensor; then, based on the distance measurement length, it is determined whether the debonding is completed. Specifically, it is determined whether the distance measurement length is greater than or equal to the preset length threshold; if so, it is determined that the debonding is completed; otherwise, it is determined that the debonding is not completed. In this method, the laser sensor determines the distance of the obstacle based on the time it takes for the emitted laser to be reflected back from the obstacle. In this way, the distance measurement length of the laser sensor when all silicon wafers are debonded can be measured through experiments as the preset length threshold. When debonding is carried out, if the distance measurement length obtained is greater than or equal to the preset length threshold, it proves that all silicon wafers are debonded; otherwise, it proves that some silicon wafers are not debonded. The verification device uses a laser sensor, which can increase the judgment speed and thereby improve the debonding efficiency.

[0360] It should be noted that, in the case where no additional degumming device is provided, the degumming can be performed by immersion. Figure 7 and Figure 9 As shown, the collecting member 16 of this embodiment is a shell with a closed bottom and four sides, and the top of the shell has an opening allowing the crystal rod 17 to pass through. That is, the collecting member 16 has a accommodating cavity with an open top, which is used to store degumming liquid so as to soak and degumming the cut crystal rod 17 and collect the degummed silicon wafers.

[0361] In addition, it should be noted that although the various steps in the above embodiment are described in the above-mentioned order, those skilled in the art can understand that in order to achieve the effect of this embodiment, different steps do not have to be executed in such an order. They can be executed simultaneously (in parallel) or in a reverse order. These simple changes are within the scope of protection of this application.

[0362] Furthermore, those skilled in the art will appreciate that although some embodiments described herein include certain features included in other embodiments but not other features, combinations of features from different embodiments are intended to be within the scope of this application and to form different embodiments. For example, in the claims of this application, any of the claimed embodiments may be used in any combination.

[0363] The present application also provides a computer-readable storage medium. In a computer-readable storage medium embodiment according to the present application, the computer-readable storage medium can be configured to store a program for executing the control method of any of the above-mentioned method embodiments, and the program can be loaded and run by the processor to implement the above-mentioned control method. For ease of explanation, only the parts related to the embodiments of the present application are shown. For specific technical details not disclosed, please refer to the method part of the embodiment of the present application. The computer-readable storage medium can be a storage device formed by various electronic devices. Optionally, the computer-readable storage medium in the embodiment of the present application is a non-temporary computer-readable storage medium.

[0364] The present application also provides a control device. In a control device embodiment according to the present application, the control device includes a processor and a memory. The memory can be configured to store a program for executing the control method of any of the above-mentioned method embodiments, and the processor can be configured to execute the program in the memory, which includes but is not limited to a program for executing the control method of the above-mentioned method embodiment. For ease of explanation, only the parts related to the embodiment of the present application are shown. For specific technical details not disclosed, please refer to the method part of the embodiment of the present application. The control device can be a device device formed by various electronic devices.

[0365] The present application also provides a wire cutting machine. The wire cutting machine of the present application includes the above-mentioned control device. The wire cutting machine can realize cutting control of the crystal rod through the above-mentioned control device.

[0366] Furthermore, those skilled in the art will appreciate that although some embodiments described herein include certain features included in other embodiments but not other features, combinations of features from different embodiments are intended to be within the scope of this application and to form different embodiments. For example, in the claims of this application, any of the claimed embodiments may be used in any combination.

[0367] Thus far, the technical solutions of the present application have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is readily understood by those skilled in the art that the scope of protection of the present application is obviously not limited to these specific embodiments. Without departing from the principles of the present application, those skilled in the art may make equivalent changes or substitutions to the relevant technical features, and the technical solutions after such changes or substitutions will fall within the scope of protection of the present application.

Claims

1. A control method for a wire cutting machine, characterized in that: The wire cutting machine comprises: A cutting frame having a cutting chamber formed therein, and a discharge port communicating with the cutting chamber provided on the cutting frame; a main roller assembly mounted on the cutting frame, the main roller assembly being used to wind the cutting wire to form a wire web; A feeding device, which is mounted on the cutting frame, on which a crystal rod can be mounted, and is used to drive the crystal rod to feed toward the wire mesh; A collecting member is located in the cutting chamber and is used to receive the debonded silicon wafer; a first driving assembly capable of driving the collecting member to reciprocate along a feeding direction; and a second driving assembly capable of driving the collecting member to move from the discharge port to the outside of the cutting chamber; The control method includes: controlling the first driving assembly to move the collecting member to a position at a set distance from the wire web; Controlling the feeding device to feed the crystal rod toward the wire mesh; performing a degumming operation on the cut silicon wafers so as to collect the silicon wafers in the collecting member; controlling the first driving assembly to move the collecting member to a discharging position; controlling the second driving assembly to move the collecting member from the discharge port to the outside of the cutting chamber; The feeding device is provided with a plurality of crystal rods, and the plurality of crystal rods are bonded together along a feeding direction. The control method further comprises: Cutting, degumming, collecting and transporting the plurality of crystal ingots one by one to the outside of the cutting chamber, and the feeding device does not stop during the degumming, collecting and transporting processes; The cutting assembly further includes a degumming device mounted on the cutting frame, and the step of "degumming the cut silicon wafer" further includes: The degumming device is controlled to perform a degumming operation on the cut silicon wafer.

2. The control method according to claim 1, characterized in that: When the silicon wafer formed by cutting is subjected to a debonding operation, the distance between the bottom of the silicon wafer and the collecting member is not greater than the safety distance.

3. The control method according to claim 1, characterized in that: The control method further includes: when the distance between the bottom of the crystal ingot being cut and the collecting member reaches a safe distance, controlling the first driving assembly to move the collecting member along a feeding direction at a feeding speed of the feeding device.

4. The control method according to claim 2, characterized in that: The set distance is equal to the sum of the height of the crystal rod, the set cutting depth of the bonding plate and the safety distance.

5. The control method according to claim 2, characterized in that: The safety distance is 5 mm to 10 mm.

6. The control method according to claim 2, characterized in that: The control method further includes: After the tail crystal ingot is cut, the feeding device is controlled to carry the tail crystal ingot to perform a retraction operation; Wherein, the tail crystal rod is the crystal rod close to one end of the feeding device among the multiple crystal rods.

7. The control method according to claim 1, characterized in that: The degumming device is a laser generator, and the step of "controlling the degumming device to perform a degumming operation on the cut silicon wafer" further includes: The laser generator is controlled to emit laser light toward the adhesive layer bonded to the silicon wafer formed by cutting.

8. The control method according to claim 1, characterized in that: The degumming device is a spray degumming device, and the step of "controlling the degumming device to perform a degumming operation on the cut silicon wafer" further includes: The spray degumming device is controlled to spray the degumming liquid onto the glue layer bonded to the silicon wafer formed by cutting.

9. The control method according to claim 8, characterized in that: The control method further includes: After controlling the spray degumming device to spray the degumming liquid onto the adhesive layer bonded to the silicon wafer formed by cutting, obtaining the spraying duration of the spray degumming device; Determine whether the spray duration is greater than or equal to a preset spray duration threshold; If yes, the spray degumming device is controlled to stop spraying the degumming liquid onto the glue layer.

10. The control method according to claim 8, characterized in that: The temperature of the degumming solution is any value between 15°C and 80°C.

11. A computer-readable storage medium storing a plurality of program codes, characterized in that: The program code is suitable for being loaded and run by a processor to execute the control method according to any one of claims 1 to 10.

12. A control device, characterized in that: include: processor; A memory, wherein the memory is adapted to store a plurality of program codes, wherein the program codes are adapted to be loaded and run by the processor to execute the control method according to any one of claims 1 to 10.

13. A wire cutting machine, characterized in that: The wire cutting machine includes the control device according to claim 12.

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