Wafer trimming device and method

Abstract

The present application relates to the technical field of wafer processing, and in particular to a wafer trimming device and method, including a base, the base including a flat edge, a positioning groove is provided on the upper surface of the base, the positioning groove includes an arc edge and a straight edge; a pressing block; a scribing knife; a splitting fixture, including a clamping block, and a splitting groove is formed on the clamping block. The operator places the wafer in the positioning groove of the base, and the edge of the wafer naturally extends out of the base from the edge of the straight edge. The operator scribes the wafer along the straight edge with the scribing knife to mark the processing line that needs to be split. The operator aligns the splitting fixture with the edge of the wafer, inserts the edge of the wafer into the splitting groove, tilts the splitting fixture, and the splitting fixture applies a force to the edge of the wafer to break it off, thereby achieving the purpose of splitting and slicing. During the splitting process, the splitting fixture applies a force once to trim and split the wafer, and the vibration force generated between the two is small, thereby improving the cutting accuracy of the wafer.

Description

Technical Field

[0001] The present application relates to the technical field of wafer processing, and in particular to a wafer edge trimming device and method. Background Art

[0002] A portion of the outer periphery of the circular wafer 100 is usually provided with a straight oriented edge 110, such as Figure 1 As shown, the position and direction of the wafer 100 are indicated. The oriented edge 110 of the wafer 100 is usually processed by cutting. Before the wafer 100 is cut, the whole is circular, and a positioning notch 120 is provided on the arc edge.

[0003] At present, wafer 100 is cut by cutting edges of the wafer using tools such as a cutter. When the tool touches the wafer during rotation and cutting, it is easy to cause the wafer 100 to shake. Especially when the cutting surface of the tool is not smooth and has burrs, the vibration caused by the cutting is greater. When the wafer 100 shakes, it is easy to cause its own position to deviate, thereby affecting the cutting accuracy of the oriented edge 110. Summary of the invention

[0004] In order to improve cutting accuracy, the present application provides a wafer edge trimming device and method.

[0005] One of the purposes of the present application is to provide a wafer trimming device, which adopts the following technical solution:

[0006] Wafer trimming device, including

[0007] A base, the base comprising at least one flat edge, a positioning groove for accommodating a wafer is provided on an upper surface of the base, the positioning groove is connected to the flat edge, and the positioning groove comprises an arc edge and a straight edge;

[0008] A pressing block, used to press on the wafer;

[0009] Scribing knife, used to draw the processing line of the directional edge on the wafer;

[0010] The wafer splitting fixture comprises a clamping block, on which a wafer splitting groove for clamping an edge of a wafer is provided.

[0011] By adopting the above technical solution, the operator places the wafer in the positioning groove of the base, and the edge of the wafer naturally extends out of the base from the edge of the straight edge. The operator scribes the wafer along the straight edge with a scriber to mark the processing line that needs to be split. The operator aligns the splitting fixture with the edge of the wafer, and inserts the edge of the wafer into the splitting groove, tilts the splitting fixture, and the splitting fixture applies a force to the edge of the wafer to break it off, thereby achieving the purpose of splitting and slicing. During the splitting process, the splitting fixture applies a force once to trim the wafer and split it. The vibration force generated between the two is small, thereby improving the cutting accuracy of the wafer. The part of the wafer exposed from the fixture is along the crystal direction of the wafer, which is easy to split and achieve crystal direction positioning.

[0012] Preferably, a positioning block which protrudes inwards and matches with the positioning notch is provided on the arc edge.

[0013] By adopting the above technical solution, when the wafer is placed in the positioning groove, the positioning block is embedded in the positioning notch, so as to position and limit the wafer, directly positioning it to the natural crystal direction of the wafer, and further improving the stability of the wafer during the splitting process.

[0014] Preferably, a pressing groove cooperating with a pressing block is provided on the upper surface of the base near the straight edge, a limiting step is provided on the side of the pressing groove near the straight edge, at least one side of the pressing block is a plane parallel to the straight edge, the scratching knife includes a knife body and a knife head, the knife body includes a straight surface parallel to the straight edge, and the distance between the knife head and the straight surface is equal to the width of the limiting step.

[0015] By adopting the above technical solution, the pressing block is embedded in the pressing groove, with the plane facing the straight edge, and the pressing groove limits the position of the pressing block, thereby improving the stability of the wafer during the splitting process. When scribing, the straight surface of the knife body fits with the plane of the pressing block, the knife head is aligned with the wafer, and the knife body slides along the plane of the pressing block to scribing, which has high stability and high precision of the processed line.

[0016] Preferably, a plurality of mutually connected adsorption grooves are evenly arranged at the bottom of the positioning groove, an adsorption hole connected to the adsorption groove is arranged at the center of the bottom of the positioning groove, and a negative pressure channel connected to the adsorption hole is arranged on the base.

[0017] By adopting the above technical solution, the wafer is placed in the positioning groove, the negative pressure channel is connected to the external negative pressure machine, and air is evacuated to the negative pressure channel, thereby generating negative pressure suction in the negative pressure channel, the adsorption holes and the adsorption groove to adsorb the wafer, thereby further improving the stability of the wafer.

[0018] Preferably, the clamping block comprises a connecting edge parallel to the straight edge, the opening of the split groove is located at the connecting edge, and a liner for clamping an edge of a wafer is detachably connected in the split groove.

[0019] By adopting the above technical solution, the lining protects the wafer and prevents the wafer from being scratched.

[0020] Preferably, the lining comprises two facing linings, a clamping gap for clamping the edge of the wafer is formed between the two linings, the lining is made of soft elastic material, and when the lining is in a natural state, the thickness of the clamping gap is less than the thickness of the wafer.

[0021] By adopting the above technical solution, the elastic lining ensures the protection effect of the wafer, and clamps the edge of the wafer through its own deformation, thereby improving the stability of clamping the edge of the wafer.

[0022] Preferably, a deformation groove parallel to the direction of the wafer is provided in the lining, the side of the deformation groove away from the connecting edge is open and communicated with the outside, a reinforcing sheet penetrating the deformation groove is slidably connected in the clamping block, a reset spring is provided between the reinforcing sheet and the clamping block, and when the reset spring is in a natural state, a gap is left between the end of the reinforcing sheet close to the connecting edge and the bottom of the deformation groove, and the length of the gap is not less than the length of the wafer located inside the clamping gap;

[0023] The clamp block is provided with a lobe hole which is perpendicular to and connected to the lobe groove, a lobe column is slidably connected in the lobe hole, two extension plates are provided on the lobe column, the extension plate is located at the end of the reinforcing plate away from the connecting edge, the two extension plates are respectively matched with the two reinforcing plates and each extension plate is located above the corresponding reinforcing plate, the side of the reinforcing plate facing the extension plate includes a base surface and a contact surface, the contact surface is located on the side of the base surface close to the extension plate, the thickness of the reinforcing plate at the contact surface is less than the thickness of the reinforcing plate at the base surface, and the base surface and the contact surface are connected by an inclined extension surface.

[0024] By adopting the above technical solution, when the liner does not clamp the wafer, there is a certain distance between the end of the reinforcing sheet and the end of the deformation groove close to the connecting edge, thereby ensuring that the end of the reinforcing sheet close to the connecting sheet has better deformation ability. When the wafer is inserted into the crack gap, the connecting edge conflicts with the flat edge, the deformation groove is compressed and deformed, and the lining clamps the wafer. At this time, the operator presses the crack column, and the crack column moves downward under pressure and drives the two extension sheets to move downward synchronously. When the extension sheet contacts the extension surface on the reinforcing sheet and continues to move downward, the reinforcing sheet is pushed by the extension sheet under the action of the extension surface and moves toward the connecting edge until the end is inserted into the bottom of the deformation groove, and the deformation groove is filled with the reinforcing sheet, thereby greatly weakening the deformation ability of the lining. And at this time, the extension sheet conflicts with the contact surface. When the reinforcing plate extension piece continues to move downward under the drive of the splitting column, the deformation ability of the lining is greatly weakened by the reinforcing plate, and the end of the lining piece away from the connecting edge is subjected to the downward force of the extension piece. The lining piece gradually tilts and applies force to the part of the wafer inserted into the splitting gap until the part is broken. After the operator inserts the wafer into the splitting groove with the splitting clamp, there is almost no rotation space between the clamp block and the base due to the conflict between the connecting edge and the flat edge of the base. It is difficult for the operator to break the wafer by rotating the clamp block. At this time, only the splitting column needs to be pressed to break the wafer inside the clamp block, which is convenient to use.

[0025] Preferably, a return spring is provided between the bottom of the lobe column and the bottom of the lobe groove.

[0026] By adopting the above technical solution, after the wafer is split by marking, the splitting column is reset under the action of the reset spring to prepare for the next splitting operation.

[0027] Preferably, the split column is provided with two sections of thread grooves with opposite rotation directions, and the two extension plates are respectively threadedly connected to the two thread grooves. A limiting column parallel to the split column is fixed in the split groove, and the limiting column passes through the two extension plates and is slidably connected to the two extension plates. The lining includes a high deformation layer and a low deformation layer located on both sides of the deformation groove, and the low deformation layer is located on the side close to the clamping gap.

[0028] By adopting the above technical solution, after the splitting is completed, the operator rotates the splitting column while keeping pressing the splitting column, and the two extension plates move towards each other under the action of the two thread grooves. At this time, the ends of the two reinforcing plates away from the connection edge are forced to approach each other, while the other end of the reinforcing plate is less stressed, so that the reinforcing plate gradually tilts. That is, the ends of the two reinforcing plates away from the wafer are close to each other, while the ends close to the wafer are away from each other, and the reinforcing plates squeeze the high deformation layer, thereby gradually forming an open opening, so that it is easy to remove the split part of the wafer from the clamping gap.

[0029] Another object of the present application is to provide a wafer trimming method, which adopts the following technical solution:

[0030] A wafer trimming method, using the above-mentioned wafer trimming device, comprises the following steps:

[0031] S1. Place the wafer in the positioning groove of the base, with the positioning block and the positioning notch facing each other, the positioning block embedded in the positioning notch, and the edge of the wafer extending out of the base from the straight edge;

[0032] S2, pressing the pressing block onto the upper surface of the wafer;

[0033] S3, using a scribing knife to draw a processing line along a straight edge on the wafer surface;

[0034] S4. Align the splitting fixture to the edge of the wafer extending out of the base, embed the edge of the wafer in the splitting groove, and use the splitting fixture to break the edge of the wafer to split.

[0035] In summary, this application includes the following beneficial technical effects:

[0036] During the wafer splitting process, the wafer splitting fixture applies a force to cut the wafer edge and split it, and the vibration force generated between the two is small, thereby improving the wafer cutting accuracy;

[0037] The cut edges of the wafer are smooth and burr-free. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 is a schematic diagram of the structure of a wafer after splitting in the background technology;

[0039] Figure 2 is a schematic diagram of the overall structure of the first embodiment;

[0040] Figure 3 is a schematic structural diagram of the base in the first embodiment;

[0041] Figure 4 is a schematic diagram of the structure of the cutter in the first embodiment;

[0042] Figure 5 is a schematic structural diagram of the splitting clamp in the first embodiment;

[0043] Figure 6 It is a schematic diagram of the internal structure of the split clamp in the second embodiment.

[0044] Description of reference numerals:

[0045] 100, wafer; 110, directional edge; 120, positioning notch; 1, base; 11, flat edge; 12, positioning groove; 121, arc edge; 122, straight edge; 13, positioning block; 14, pressing groove; 141, limiting step; 15, adsorption groove; 16, adsorption hole; 17, negative pressure channel; 2, pressing block; 21, plane; 3, scratching knife; 31, knife body; 311, straight surface; 32, knife head; 4, splitting fixture ; 41. Clamping block; 411. Split groove; 412. Connecting edge; 413. Split hole; 42. Inner lining; 43. Lining; 431. Deformation groove; 432. High deformation layer; 433. Low deformation layer; 44. Clamping gap; 45. Reinforcing plate; 451. Base surface; 452. Contact surface; 453. Extension surface; 46. Reset spring; 47. Split column; 471. Extension plate; 48. Reset spring; 49. Limit column. DETAILED DESCRIPTION

[0046] The present application is further described in detail below in conjunction with all the accompanying drawings.

[0047] Example

[0048] The present application embodiment discloses a wafer trimming device, referring to Figures 2 to 3 , including a base 1, a pressing block 2, a scribing knife 3 and a splitting fixture 4. The base 1 carries and accommodates the wafer 100, the pressing block 2 presses on the upper surface of the wafer 100 to fix the wafer 100, the scribing knife 3 scribes the surface of the wafer 100 to generate a processing line to be cut, and the splitting tool breaks the wafer 100 into pieces.

[0049] Reference Figures 2 to 3 The base 1 is square and has at least one flat edge 11. A positioning groove 12 for accommodating the wafer 100 is provided on the upper surface of the base 1. The positioning groove 12 is connected to one of the flat edges 11, so that the positioning groove 12 forms an arc edge 121 and a straight edge 122. The wafer 100 is placed in the positioning groove 12, and the edge of the wafer 100 extends out of the base 1 from the straight edge 122, which is the portion that needs to be cut.

[0050] Reference Figures 1 to 3 The side wall of the positioning groove 12 is fixed with a positioning block 13 protruding inward, and the positioning block 13 matches the positioning notch 120. When the wafer 100 is placed in the positioning groove 12, the positioning block 13 is embedded in the positioning notch 120, thereby limiting the position of the wafer 100.

[0051] Reference Figure 3A plurality of mutually connected adsorption grooves 15 are evenly arranged at the bottom of the positioning groove 12, and the adsorption grooves 15 can be radially spread. An adsorption hole 16 connected to the adsorption groove 15 is vertically arranged at the center of the bottom of the positioning groove 12, and a negative pressure channel 17 connected to the adsorption hole 16 is horizontally arranged on the base 1. The base 1 is connected to an external negative pressure machine through the negative pressure channel 17, so that negative pressure suction is generated in the negative pressure channel 17, the adsorption hole 16 and the adsorption groove 15, thereby adsorbing and fixing the wafer 100, and improving the stability of the wafer 100 during the splitting process.

[0052] Reference Figure 2 and Figure 3 A pressing groove 14 matching with the pressing block 2 is provided on the upper surface of the base 1 near the straight edge 122. When the pressing block 2 is placed in the pressing groove 14, both ends of the pressing block 2 extend out of the wafer 100 and are embedded in the pressing groove 14. The pressing groove 14 limits the position of the pressing block 2 to prevent the pressing block 2 from sliding during the splitting process and affecting the stability of the wafer 100.

[0053] Reference Figure 2 and Figure 3 The pressing groove 14 is provided with a limiting step 141 on one side close to the straight edge 122. The pressing block 2 is a square column, and the four sides are planes 21 parallel to the straight edge 122. The pressing block 2 is in the pressing groove 14, and one of the planes 21 faces the straight edge 122.

[0054] Reference Figure 2 and Figure 4 The scribing knife 3 includes a knife body 31 and a knife head 32. The knife body 31 is cylindrical, and the four sides are straight surfaces 311 parallel to the straight edge 122. The distance between the knife head 32 and the straight surface 311 is equal to the width of the limiting step 141. When the scribing knife 3 is scribing, the straight surface 311 of the knife body 31 is closely attached to the plane 21 of the pressing block 2, and the knife head 32 at the lower end contacts the wafer 100. The knife body 31 slides along the pressing block 2, and during the sliding process, the knife body 31 is always attached to the pressing block 2. The knife head 32 draws the processing line that needs to be cut on the wafer 100, and the processing line just coincides with the straight edge 122, with high precision and convenient scribing.

[0055] Reference Figures 2 to 5The split clamp 4 includes a clamp block 41 and an inner liner 42. A split groove 411 is provided inside the clamp block 41, and the inner liner 42 is detachably connected to the split groove 411. For example, the inner liner 42 can be connected to the clamp block 41 by bolts or the like. The clamp block 41 includes a connecting edge 412 parallel to the straight edge 122, and the opening of the split groove 411 is located at the connecting edge 412. The inner liner 42 includes two facing linings 43, and a clamping gap 44 for clamping the edge of the wafer 100 is formed between the two linings 43. The operator faces and contacts the connecting edge 412 of the clamp block 41 with the flat edge 11 of the base 1, and the edge of the wafer 100 is inserted into the clamping gap 44, and the two linings 43 clamp and fix the wafer 100. The operator applies an upward or downward force to the end of the clamp block 41 away from the connecting edge 412 , so that the clamp block 41 tilts and breaks off the edge of the wafer 100 , thereby completing the splitting and edge cutting.

[0056] The implementation principle of the wafer trimming device of the embodiment of the present application is as follows: the wafer 100 is placed in the positioning groove 12, the pressing block 2 is placed in the pressing groove 14 and pressed on the upper surface of the wafer 100, the scribing knife 3 is vertically attached to the side of the pressing block 2 to scribe the wafer 100, the splitting clamp 4 is facing the edge of the wafer 100, and the edge of the wafer 100 is embedded in the clamping gap 44, and the wafer 100 is split and trimmed by the splitting clamp 4.

[0057] Example

[0058] The difference between the second embodiment and the first embodiment is that the structure of the splitting fixture 4 is different: Figure 6 The liner 43 is made of a soft elastic material, such as polytetrafluoroethylene. When the liner 43 is in a natural state, the thickness of the clamping gap 44 is less than the thickness of the wafer 100. The liner 43 squeezes and clamps the wafer 100 through its own elasticity, and has high stability.

[0059] Reference Figure 6 A deformation groove 431 parallel to the direction of the wafer 100 is provided in the middle of the lining 43, and the side of the deformation groove 431 away from the connecting edge 412 is open and connected to the outside. The deformation groove 431 provides a deformation space for the deformation of the lining 43, thereby enhancing the deformation ability of the lining 43.

[0060] Reference Figure 6, a reinforcing sheet 45 is slidably connected in the split groove 411 and penetrates the deformation groove 431. A reset spring 46 is arranged between the reinforcing sheet 45 and the clamping block 41. When the reset spring 46 is in a natural state, a gap is left between the end of the reinforcing sheet 45 close to the connecting edge 412 and the bottom of the deformation groove 431, and the length of the gap is not less than the length of the wafer 100 located in the clamping gap 44. Under normal conditions, one end of the deformation groove 431 close to the connecting edge 412 is in a hollow state. When the wafer 100 is inserted into the clamping gap 44, the lining sheet 43 squeezes and deforms the deformation groove 431, and the deformation groove 431 is a deformation enhancement space for the lining sheet 43.

[0061] Reference Figure 6 The clamp block 41 is provided with a sliver hole 413 which is perpendicular to and connected to the sliver groove 411. A sliver column 47 is slidably connected in the sliver hole 413. A return spring 48 is provided between the bottom of the sliver column 47 and the bottom of the sliver groove 411. When the return spring 48 is in a natural state, the sliver column 47 is located at the top of its sliding stroke. The sliver column 47 is provided with two extension pieces 471 which correspond to the two reinforcement pieces 45 respectively. The two extension pieces 471 are respectively located above the corresponding reinforcement pieces 45.

[0062] Reference Figure 6 The side of the reinforcing sheet 45 facing the extension sheet 471 includes a base surface 451 and a contact surface 452, and both the base surface 451 and the contact surface 452 are parallel to the lower surface of the extension sheet 471. The contact surface 452 is located on the side of the base surface 451 close to the extension sheet 471, and the thickness of the reinforcing sheet 45 at the contact surface 452 is less than the thickness of the reinforcing sheet 45 at the base surface 451, and the base surface 451 and the contact surface 452 are connected by the inclined extension surface 453. When the reset tension spring 46 is in the natural state, the contact surface 452 and the contact surface 452 extend out of the deformation groove 431 and are located below the extension sheet 471.

[0063] Reference Figure 6, the connecting edge 412 of the clamp 41 is directly opposite to and in conflict with the flat edge 11 of the base 1. When the edge of the wafer 100 is inserted into the clamping gap 44, the clamp 41 is in conflict with the base 1, and the space for the clamp 41 to rotate is small, making it difficult to break the wafer 100 by rotating the clamp 41. At this time, the operator presses the split column 47, and the split column 47 overcomes the elastic force of the reset spring 48 and descends, driving the extension sheet 471 to descend. The extension sheet 471 first contacts the inclined extension surface 453, and the extension sheet 471 applies a lateral thrust to the reinforcing sheet 45 through the extension surface 453, and the reinforcing sheet 45 gradually moves toward the bottom of the deformation groove 431. Until the extension sheet 471 conflicts with the contact surface 452, at this time, the end of the reinforcing sheet 45 is located at the bottom of the deformation groove 431, the deformation groove 431 is filled with the reinforcing sheet 45, and the deformation ability of the lining sheet 43 is greatly weakened. The operator continues to press down the splitting column 47, the extension sheet 471 drives the reinforcing sheet 45 to press down, and the two lining sheets 43 away from the ends of the wafer 100 tilt downward, applying a vertical thrust to the wafer 100, thereby breaking the wafer 100. During the whole process, the operator only needs to press the splitting column 47, which is convenient to operate.

[0064] Reference Figure 6 The lobe column 47 is provided with two sections of thread grooves with opposite rotation directions, and two extension pieces 471 are respectively connected with the two thread grooves by threads, and a limiting column 49 parallel to the lobe column 47 is fixed in the lobe groove 411, and the limiting column 49 passes through the two extension pieces 471 and is slidably connected with the two extension pieces 471, and the lining 43 includes a high deformation layer 432 and a low deformation layer 433 located on both sides of the deformation groove 431, and the low deformation layer 433 is located on the side close to the clamping gap 44. The high deformation layer 432 has a stronger deformation ability than the low deformation layer 433, and is also more likely to deform.

[0065] Reference Figure 6 When the operator presses the splitting column 47 to the bottom to break the wafer 100, the operator presses the splitting column 47 and rotates the splitting column 47 at the same time, and the two extension pieces 471 move toward each other under the action of the thread groove. At this time, the ends of the reinforcing sheet 45 away from the wafer 100 are close to each other, and the other end of the reinforcing sheet 45 is under less pressure and will not have a tendency to approach each other, causing the reinforcing sheet 45 to gradually tilt, and the end of the reinforcing sheet 45 close to the wafer 100 squeezes the high deformation layer 432. Under the action of the two reinforcing sheets 45, the two linings 43 gradually become "V"-shaped, and the opening on the side close to the wafer 100 gradually increases, so that it is convenient for the operator to take the broken wafer 100 out of the clamping gap 44 for easy use.

[0066] Example

[0067] The embodiment of the present application discloses a wafer trimming method, using the wafer trimming device of the above embodiment, comprising the following steps:

[0068] S1. Place the wafer in the positioning groove of the base, with the positioning block and the positioning notch facing each other, the positioning block embedded in the positioning notch, and the edge of the wafer extending out of the base from the straight edge;

[0069] S2, negative pressure is generated in the negative pressure channel, and the adsorption groove adsorbs and fixes the wafer;

[0070] S3, pressing the pressing block onto the upper surface of the wafer and embedding it into the pressing groove;

[0071] S4, the side of the scribing knife is in contact with the side of the pressing block, and the knife head draws a processing line on the surface of the wafer along the plane of the pressing block. The scribing knife is always in contact with the pressing block during the scribing process;

[0072] S5. Align the splitting clamp with the edge of the wafer extending out of the base, embed the edge of the wafer in the splitting groove, apply pressure to the edge of the wafer through the splitting clamp to break the wafer and perform splitting and edge cutting.

[0073] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A wafer trimming device, characterized in that: include A base (1), the base (1) comprising at least one flat edge (11), a positioning groove (12) for accommodating a wafer (100) being provided on an upper surface of the base (1), the positioning groove (12) being connected to the flat edge (11), and the positioning groove (12) comprising a circular arc edge (121) and a straight edge (122); A pressing block (2) used for pressing on the wafer (100); A scribing knife (3) for scribing a processing line of an oriented edge (110) on a wafer (100); A chip splitting fixture (4), comprising a clamping block (41), the clamping block (41) being provided with a chip splitting groove (411) for clamping an edge of a wafer (100); the clamping block (41) comprising a connecting edge (412) parallel to the straight edge (122), the opening of the chip splitting groove (411) being located at the connecting edge (412), and a lining (42) for clamping an edge of a wafer (100) being detachably connected in the chip splitting groove (411); The inner liner (42) comprises two facing lining sheets (43), a clamping gap (44) for clamping the edge of the wafer (100) is formed between the two lining sheets (43), the lining sheets (43) are made of a soft elastic material, and when the lining sheets (43) are in a natural state, the thickness of the clamping gap (44) is less than the thickness of the wafer (100); The lining (43) is provided with a deformation groove (431) parallel to the direction of the wafer (100); the side of the deformation groove (431) facing away from the connecting edge (412) is open and communicated with the outside; a reinforcing sheet (45) penetrating the deformation groove (431) is slidably connected to the clamping block (41); a reset spring (46) is provided between the reinforcing sheet (45) and the clamping block (41); when the reset spring (46) is in a natural state, a gap is left between the end of the reinforcing sheet (45) close to the connecting edge (412) and the bottom of the deformation groove (431), and the length of the gap is not less than the length of the wafer (100) located inside the clamping gap (44); The clamp block (41) is provided with a split hole (413) which is perpendicular to and connected to the split groove (411); a split column (47) is slidably connected in the split hole (413); two extension pieces (471) are provided on the split column (47); the extension pieces (471) are located at one end of the reinforcing piece (45) away from the connecting edge (412); the two extension pieces (471) are respectively matched with the two reinforcing pieces (45); and each extension piece (471) is located at the corresponding reinforcing piece ( 45), a side of the reinforcing sheet (45) facing the extension sheet (471) comprises a base surface (451) and a contact surface (452), the contact surface (452) is located on a side of the base surface (451) close to the extension sheet (471), the thickness of the reinforcing sheet (45) at the contact surface (452) is less than the thickness of the reinforcing sheet (45) at the base surface (451), and the base surface (451) and the contact surface (452) are connected via an inclined extension surface (453); A return spring (48) is provided between the bottom of the split column (47) and the bottom of the split groove (411); The split column (47) is provided with two sections of thread grooves with opposite rotation directions, and the two extension pieces (471) are respectively threadedly connected to the two thread grooves. A limiting column (49) parallel to the split column (47) is fixed in the split groove (411), and the limiting column (49) passes through the two extension pieces (471) and is slidably connected to the two extension pieces (471). The lining (43) includes a high deformation layer (432) and a low deformation layer (433) located on both sides of the deformation groove (431), and the low deformation layer (433) is located on a side close to the clamping gap (44).

2. The wafer trimming device according to claim 1, characterized in that: The arc edge (121) is provided with a positioning block (13) which protrudes inwards and matches the positioning notch (120).

3. The wafer trimming device according to claim 1, characterized in that: A pressing groove (14) cooperating with the pressing block (2) is provided on the upper surface of the base (1) near the straight edge (122); a limiting step (141) is provided on one side of the pressing groove (14) near the straight edge (122); at least one side of the pressing block (2) is a plane (21) parallel to the straight edge (122); the cutting knife (3) comprises a knife body (31) and a knife head (32); the knife body (31) comprises a straight surface (311) parallel to the straight edge (122); and the distance between the knife head (32) and the straight surface (311) is equal to the width of the limiting step (141).

4. The wafer trimming device according to claim 1, characterized in that: A plurality of mutually connected adsorption grooves (15) are evenly arranged at the bottom of the positioning groove (12); an adsorption hole (16) connected to the adsorption groove (15) is arranged at the center of the bottom of the positioning groove (12); and a negative pressure channel (17) connected to the adsorption hole (16) is arranged on the base (1).

5. A wafer trimming method, characterized in that: Using the wafer trimming device as described in any one of claims 1 to 4 comprises the following steps: S1. Place the wafer in the positioning groove of the base, with the positioning block and the positioning notch facing each other, the positioning block embedded in the positioning notch, and the edge of the wafer extending out of the base from the straight edge; S2, pressing the pressing block onto the upper surface of the wafer; S3, using a scribing knife to draw a processing line along a straight edge on the wafer surface; S4, aligning the splitting fixture with the edge of the wafer extending out of the base, the edge of the wafer is embedded in the splitting groove, and the edge of the wafer is broken off by the splitting fixture to split.

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