Bidirectional braking device and method of manufacturing thereof

Abstract

The application provides a bidirectional braking device and a manufacturing method thereof, comprising a peripheral fixed frame with a cavity, a movable support suspended in the cavity, the movable support being connected with the peripheral fixed frame through a first elastic connector; the movable support is a hollow structure, a load core plate is suspended in the hollow position, the load core plate being connected with the movable support through a second elastic connector; the first elastic connecting device and the second elastic connecting device are vertically arranged, so that the moving direction of the movable support relative to the peripheral fixed support and the moving direction of the load core plate are vertical in the same plane; a chip structure is arranged in the load core plate. The bidirectional braking device provided by the application greatly reduces the manufacturing cost and has higher impact resistance.

Description

Technical Field

[0001] This application relates to the semiconductor field, and more particularly to a bidirectional braking device and its manufacturing method. Background Technology

[0002] High-resolution cameras have become standard equipment in various mobile electronic devices, primarily smartphones, as well as security equipment, in-vehicle systems, and other mobile devices. As applications continue to demand higher imaging resolution and performance, the technical requirements for camera modules are becoming increasingly stringent.

[0003] With the increasing demands for resolution and image quality, the bidirectional micro-braking function of the camera module with a translation braking carrier chip has become essential for camera anti-shake and achieving higher image quality phase imaging.

[0004] Previously, bidirectional translation braking micro-platforms made from all-silicon wafers met the requirements in terms of braking accuracy, stroke, and response speed, but their high cost greatly hindered their application range, and their impact resistance also needed further improvement. Summary of the Invention

[0005] To address the aforementioned product performance issues, this invention provides a bidirectional braking device and its manufacturing method.

[0006] This invention provides a bidirectional braking device, including an outer fixed frame having a cavity, a movable support suspended inside the cavity, the movable support being connected to the outer fixed frame via a first elastic connecting device; the movable support has a hollow structure inside, a core plate being suspended in the hollow position, the core plate being connected to the movable support via a second elastic connecting device.

[0007] The first elastic connecting device and the second elastic connecting device are arranged vertically, so that the movable bracket moves relative to the outer fixed bracket in the X direction, and the core plate moves relative to the movable bracket in the Y direction, with the X direction perpendicular to the Y direction.

[0008] The core carrier board contains a chip structure.

[0009] The bidirectional braking device provided by this invention significantly reduces manufacturing costs and has higher impact resistance. Attached Figure Description

[0010] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 This is a top view of an embodiment of the bidirectional braking device of the present invention;

[0012] Figure 2 This is a cross-sectional schematic diagram along the AB direction of an embodiment of the bidirectional braking device of the present invention;

[0013] Figures 3a to 3j This is a schematic diagram of the manufacturing method of the bidirectional braking device of the present invention. Detailed Implementation

[0014] Preferred embodiments of the invention will now be described in more detail. While preferred embodiments of the invention are described below, it should be understood that the invention can be implemented in various forms and should not be limited to the embodiments set forth herein.

[0015] In this invention, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower parts of the device in its normal operating state, while "inner" and "outer" refer to the parts relative to the outline of the device. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified. Since this invention pertains to electrical devices, connection and interconnection both refer to conductive interconnections. Because the accompanying drawings describe the same device, the same reference numerals denote the same components.

[0016] The bidirectional braking device of the present invention includes an outer fixed frame having a cavity, within which a movable support is suspended. The movable support is connected to the outer fixed frame via a first elastic connecting device. The movable support has a hollow structure inside, and a core plate is suspended in the hollow position. The core plate is connected to the movable support via a second elastic connecting device. The first and second elastic connecting devices are arranged perpendicularly, such that the movable support moves relative to the outer fixed frame in the X direction, and the core plate moves relative to the movable support in the Y direction, with the X direction perpendicular to the Y direction. A chip structure is disposed inside the core plate.

[0017] The present invention will now be described in further detail with reference to the accompanying drawings, including specific examples. Figures 1 to 2 Its structure will be explained in detail, and the specific materials will be explained in the subsequent manufacturing steps.

[0018] Figure 1 This is a top view of the first embodiment of the bidirectional braking device of the present invention. Figure 2This is a cross-sectional schematic diagram along the AB direction of an embodiment of the bidirectional braking device of the present invention. In this embodiment, it includes an outer fixed frame 100 having a cavity 110. A movable support 200 is suspended within the cavity 110, and the movable support 200 is connected to the outer fixed frame 100 via a first elastic connecting device 210. In this embodiment, four first elastic connecting devices 210 are respectively connected to the outer sides of the four corners of the movable support 200 and the inner sides of the outer frame 100. Figure 1 As shown, in this embodiment, the first elastic connecting device 210 is U-shaped, with two pins at the U-shaped opening, one end of which is connected to the outer fixed frame 100 and the other end is connected to the movable bracket 200. In other embodiments, it can also be a zigzag shape, thus having elasticity in the folding direction.

[0019] The movable support 200 has a hollow internal structure. In this embodiment, the movable support 200 is barrel-shaped and has no bottom surface. In other embodiments, it can be a groove with a bottom surface. A core plate 300 is suspended in the hollow position of the movable support 200. The core plate 300 is connected to the movable support 200 through a second elastic connecting device 310. The first elastic connecting device 210 and the second elastic connecting device 310 are arranged vertically, so that the movable support 200 moves relative to the outer fixed support 100 in the X direction, and the core plate 300 moves relative to the movable support 200 in the Y direction, with the X direction perpendicular to the Y direction. A chip structure is disposed inside the core plate 300. In this embodiment, four second elastic connecting devices 310 are respectively connected to the inner sides of the four corners of the movable support 200 and the outer sides of the core plate 300. In this embodiment, the second elastic connecting device 310 is U-shaped, with two pins at the U-shaped opening, one end of which is connected to the movable bracket 200 and the other end is connected to the core plate 300. In other embodiments, it can also be zigzag-shaped, thus having elasticity in the folding direction.

[0020] In this embodiment, the peripheral fixing frame 100, the movable bracket 200, and the core plate 300 are electrically interconnected, such as... Figure 2 As shown, metallic conductive interconnects 330 can be formed on its material layer.

[0021] An imaging chip 400 is connected to the core carrier plate 300, and is electrically interconnected with the core carrier plate 300.

[0022] In this embodiment, a first unidirectional micro-braking device 220 is also included, connected to the two outer sides of the movable bracket 200 and the two inner sides of the corresponding peripheral fixing frame 100. In this embodiment, the sides of the two first unidirectional micro-braking devices 220 are set to be parallel and opposite. The first unidirectional micro-braking device 220 is strip-shaped and formed of stretchable shape memory metal. The peripheral fixing frame 100, the movable bracket 200, and the core plate 300 are electrically interconnected with the first unidirectional micro-braking device 220. In other embodiments, the first unidirectional micro-braking device 220 may not be provided.

[0023] In this embodiment, a second unidirectional micro-braking device 320 is also included, connected to the two inner sides of the movable bracket 200 and the two outer sides of the corresponding core plate 300. The second unidirectional micro-braking device 320 is strip-shaped and formed of stretchable shape memory metal. The outer fixing frame 100, the movable bracket 200, and the core plate 300 are electrically interconnected with the second unidirectional micro-braking device 320. In other embodiments, the second unidirectional micro-braking device 320 may not be provided.

[0024] In this embodiment, the peripheral fixing frame, the movable bracket, and the carrier board are all composed of a silicon-based semiconductor material layer and a dielectric material layer. The dielectric material layer is a thermoplastic polymer dielectric material. The bottom of the imaging chip 400 is bonded to the carrier board via a dry film. Alternatively, the imaging chip can be interconnected to the conductive layer of the carrier board via bottom solder balls.

[0025] The bidirectional braking device of the present invention has movable bracket 200 and core plate 300 both disposed in a cavity with a cavity gap between them. Furthermore, the first elastic connecting device is extendable in the X direction, and the second elastic connecting device is extendable in the Y direction. Simultaneously, the first unidirectional micro-braking device is extendable in the X direction, and the second unidirectional micro-braking device is extendable in the Y direction. Therefore, when the outer fixed frame shakes, the movement of the movable bracket in the X direction will be significantly reduced, or even cease, due to inertia. Similarly, the movement of the core plate in the Y direction will be significantly reduced, or even cease. This technology, when applied to image stabilization devices, such as camera image stabilization, can greatly improve product performance. It also has good compatibility with semiconductor processes, a simple process, and high precision.

[0026] The following is combined Figures 3a to 3j The manufacturing method of the bidirectional braking device of the present invention will be described in detail below. The manufacturing method of the bidirectional braking device of the present invention includes the following steps:

[0027] First, refer to Figure 3a A first substrate 100 is provided; in this embodiment, the first substrate may be a silicon substrate or a substrate of other materials.

[0028] Next, refer to Figure 3b The first substrate 100 is etched to form a first groove 110 corresponding to the cavity in the first substrate, specifically including etching a rectangular groove 110 on the surface of the first substrate.

[0029] Next, refer to Figure 3c A first sacrificial layer 110a is formed within the first groove 110. Specifically, the first sacrificial layer is formed on the first substrate 100, and then the sacrificial layer material on the surface of the first substrate is removed; the material of the first sacrificial layer can be a photoresist material.

[0030] Next, refer to Figure 3d The first sacrificial layer 110a is etched to form a second groove 200a corresponding to the movable bracket and a third groove 210a corresponding to the first elastic connecting device.

[0031] Next, refer to Figure 3e The second groove is filled to form a movable support 200, and the third groove is filled to form a first elastic connecting device 210. The first elastic connecting device 210 connects the first substrate 100 and the movable support 200. The material of the movable support 200 can be silicon nitride, silicon oxide, etc.

[0032] Next, refer to Figure 3f The movable support is etched to form a fourth groove 300a within it. In this embodiment, the etching extends to expose the first sacrificial layer at the bottom of the movable support, effectively etching through the material layer of the movable support to form a frame structure, which is more conducive to subsequent movement. Optionally, in this embodiment, a strip-shaped first micro-braking device 410 connecting the first substrate and the movable support is formed on the first sacrificial layer, with both ends of the first micro-braking device covering the first substrate and the movable support, respectively.

[0033] Next, refer to Figure 3g A second sacrificial layer 310a is formed within the fourth groove. Specifically, the second sacrificial layer is deposited, and then the sacrificial layer material outside the fourth groove region is removed; the material of the second sacrificial layer can be a photoresist material.

[0034] Next, refer to Figure 3h The second sacrificial layer 310a is etched to form the fifth groove 320a corresponding to the core plate 300. In this embodiment, the fifth and sixth grooves are etched to expose the first sacrificial layer at the bottom of the movable support, that is, the material layer of the second sacrificial layer is completely etched through, which is more conducive to subsequent compatibility. In other embodiments, a certain depth can also be etched.

[0035] Next, refer to Figure 3iThe fifth groove is filled to form a core carrier 300, and the sixth groove is filled to form a second elastic connecting device 310, which connects the movable support and the core carrier. The core carrier can be made of silicon nitride, silicon oxide, etc., and then the semiconductor material layer outside the fifth and sixth groove regions is removed. In this embodiment, a metal conductive interconnect 330 is also included to form the conductive interconnects between the peripheral fixing frame 100, the movable support 200, and the core carrier 300. Optionally, in this embodiment, a strip-shaped second micro-braking device 320 connecting the movable support and the core carrier is formed on the second sacrificial layer, with both ends of the second micro-braking device covering the movable support and the core carrier, respectively.

[0036] Next, refer to Figure 3j Remove the first and second sacrificial layers to form cavity 110, which can be achieved by wet chemical etching or ashing.

[0037] The method described above in this invention is formed using semiconductor technology, in other words, it is formed within a semiconductor chip. Therefore, it possesses the advantages of small size, low cost, high precision, and good compatibility with semiconductor technology.

[0038] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, such as the combination of technical features between embodiments, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A bidirectional braking device, characterized in that, The device includes an outer fixed frame with a cavity, within which a movable support is suspended. The movable support is connected to the outer fixed frame via a first elastic connecting device. The movable support has a hollow interior, in which a core plate is suspended. The core plate is connected to the movable support via a second elastic connecting device. The first and second elastic connecting devices are vertically arranged, allowing the movable support to move relative to the outer fixed frame in the X direction, and the core plate to move relative to the movable support in the Y direction, with the X direction perpendicular to the Y direction. A chip structure is disposed inside the core plate.

2. The bidirectional braking device as described in claim 1, characterized in that, The peripheral fixed frame, movable bracket, and core plate are electrically interconnected.

3. The bidirectional braking device as described in claim 1, characterized in that, The chip structure on the carrier board is an imaging chip, which is electrically interconnected with the carrier board.

4. The bidirectional braking device as described in claim 1, characterized in that, It includes four first elastic connection devices that are respectively connected to the outer sides of the four corners of the movable bracket and the inner side of the outer frame.

5. The bidirectional braking device as described in claim 1, characterized in that, The first elastic connecting device is U-shaped or zigzag-shaped.

6. The bidirectional braking device as described in claim 1, characterized in that, It includes four second elastic connecting devices, which are respectively connected to the inner sides of the four corners of the movable bracket.

7. The bidirectional braking device as described in claim 1, characterized in that, The second elastic connecting device is U-shaped or zigzag-shaped.

8. The bidirectional braking device as described in claim 1, characterized in that, It also includes a first one-way micro-brake device connected to the two outer sides of the movable bracket and the two inner sides of the corresponding outer fixed frame; It also includes a second unidirectional micro-braking device connected to the two inner sides of the movable bracket and the two outer sides of the corresponding core plate.

9. The bidirectional braking device as described in claim 8, characterized in that, The first unidirectional micro-braking device and the second unidirectional micro-braking device are strip-shaped.

10. The bidirectional braking device as described in claim 8, characterized in that, The first unidirectional micro-braking device and the second unidirectional micro-braking device are formed of stretchable shape memory metal.

11. The bidirectional braking device as claimed in claim 1, characterized in that, The peripheral fixing frame is electrically interconnected through a conductive layer disposed on the first elastic connector, and the core plate is electrically interconnected with the movable bracket through a conductive layer disposed on the second elastic connector.

12. The bidirectional braking device as claimed in claim 1, characterized in that, The peripheral fixed frame, the movable bracket, and the core plate are all composed of a semiconductor material layer and a dielectric material layer.

13. The bidirectional braking device as described in claim 12, characterized in that, The dielectric material layer is a thermoplastic polymer dielectric material.

14. The bidirectional braking device as described in claim 3, characterized in that, The bottom of the imaging chip is bonded to the carrier plate via a dry film.

15. The bidirectional braking device as described in claim 3, characterized in that, The imaging chip is interconnected with the conductive layer of the carrier board via bottom solder balls.

16. The bidirectional braking device as described in claim 12, characterized in that, The semiconductor material layer is silicon-based.

17. A method for manufacturing a bidirectional braking device according to any one of claims 1-16, characterized in that, The steps include: providing a first substrate; etching the first substrate to form a first groove corresponding to the cavity within the first substrate; and forming a first sacrificial layer within the first groove. The first sacrificial layer is etched to form a second groove corresponding to the movable bracket and a third groove corresponding to the first elastic connection device; the second groove is filled to form the movable bracket, and the third groove is filled to form the first elastic connection device, which connects the first substrate and the movable bracket. The movable support is etched to form a fourth groove within the movable support; a second sacrificial layer is formed within the fourth groove; the second sacrificial layer is etched to form a fifth groove corresponding to the core plate and a sixth groove corresponding to the second elastic connecting device; the fifth groove is filled to form the core plate, and the sixth groove is filled to form the second elastic connecting device, which connects the movable support and the core plate; the first and second sacrificial layers are removed.

18. The method for manufacturing the bidirectional braking device as described in claim 17, characterized in that, The steps include: forming a strip-shaped first micro-braking device on a first sacrificial layer, connecting a first substrate and a movable support, wherein the two ends of the first micro-braking device respectively cover the first substrate and the movable support.

19. The method for manufacturing the bidirectional braking device as described in claim 17, characterized in that, The steps include: forming a strip-shaped second micro-brake device on the second sacrificial layer, which connects the movable support and the core plate, with the two ends of the second micro-brake device covering the movable support and the core plate respectively.

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