A ball-holding structure test stand

Abstract

This invention provides a ball-holding type test socket. The connecting terminal is Y-shaped, with two elastic locking tabs formed at the upper end of the terminal. The opposing surfaces of the upper ends of the elastic locking tabs are arc-shaped. During pressing down, the upper cover drives the two arc-shaped structures of the connecting terminal to engage via a movable plate. The two arc-shaped structures are tightly attached to and electrically connected to the solder balls of the chip under test. This overcomes the technical problem in existing technologies where the connecting terminal is prone to fatigue during long-term repeated pressing, and insufficient elasticity can lead to failure to form electrical contact with the solder balls. Furthermore, the interlocking connection between the two arc-shaped structures of the connecting terminal and the solder balls facilitates precise alignment, ensuring a good electrical connection. This overcomes the drawback of existing technologies where misalignment between the claw and the solder balls can affect the stability of the electrical connection.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, and more specifically to a pressure test socket for chip testing. Background Technology

[0002] Integrated circuit chips are the core of the hardware circuits in various electronic products. During and after chip manufacturing, various performance and quality tests are required. For automated chip testing equipment, the chip test socket is a key component for placing, fixing, and electrically connecting the chip under test. How to reliably and stably connect the testing equipment to the chip under test is a key technology in this field.

[0003] Patent document CN217931942U discloses a chip testing pressure test socket, including an upper cover and a base. The upper cover is a square frame structure with openings at the top and bottom. The upper cover and the base are slidably connected. The upper side of the base is provided with a mounting groove aligned with the opening of the upper cover. A probe assembly is installed in the mounting groove. Fasteners for pressing the chip onto the upper side of the probe assembly are rotatably connected to the opposite sides of the mounting groove on the base. The rotation of the fasteners is driven by the up and down movement of the upper cover. The probe assembly is provided with a movable cavity. A stamped spring pin is installed in the movable cavity. The upper and lower ends of the stamped spring pin pass through the movable cavity through the upper and lower connecting holes, respectively, and are positioned above and below the probe assembly. The middle part of the upper end of the stamped spring pin is recessed downward to form a claw head.

[0004] The above solution uses the claws of the stamped spring pin to electrically connect with the solder balls of the chip under test, which improves the stability of the connection to a certain extent. However, there are some problems: the stamped spring pin generates elastic force through its curved part in the middle, so that the claws at the upper end do not bring strong impact force when they contact the solder balls. However, the curved part in the middle of the stamped spring pin is prone to fatigue during long-term repeated pressing. When the elastic force is insufficient, the stamped spring pin will not be able to form an electrical contact with the solder balls. On the other hand, each claw and each solder ball need to be precisely aligned to achieve a good electrical connection. Since the chip test socket itself is very small, the alignment of the claws and solder balls is prone to deviation due to the limited processing precision of the chip test socket itself, which affects the stability of the electrical connection. Summary of the Invention

[0005] To address the aforementioned technical problems in the existing technology, the present invention provides a ball-holding structure test base with higher stability.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution:

[0007] This invention provides a ball-holding structure test socket, including an upper cover, a base, multiple arrays of connection terminals, a fixing mechanism for fixing the chip under test, and a movable plate. The upper cover and the base are slidably connected vertically. The lower end of the connection terminal is fixed inside the base, and its lower top is electrically connected to the test equipment. The connection terminal has a Y-shaped structure, and the upper end of the connection terminal is forked to form two elastic fastening pieces. The opposite upper surfaces of the elastic fastening pieces are arc-shaped structures. During the downward pressing process, the upper cover drives the two arc-shaped structures of the connection terminal to fasten through the movable plate. The two arc-shaped structures are tightly attached to and electrically connected to the solder balls of the chip under test.

[0008] Preferably, the upper cover and the base are square frame structures, the movable plate is nested in the base, the movable plate is provided with an array of limiting holes, the elastic fastening piece passes through the limiting holes, the upper cover is provided with a wedge-shaped driving part, the wedge-shaped driving part drives the movable plate to move and thereby drives the two arc-shaped structures of the connecting terminal to fasten.

[0009] Preferably, the direction of movement of the movable plate is at a 45-degree angle to the straight edge of the base.

[0010] Preferably, the limiting hole is rectangular, and the elastic fastening piece moves relative to the long side of the limiting hole, with the long side of the limiting hole forming a 45-degree angle with the straight side of the base.

[0011] The advantage of the above-mentioned preferred setting of a 45-degree angle is that, since the chip under test is very small and the solder ball is also very small, the processing accuracy requirements of the internal components of the ball-holding structure test socket are very high. Compared with the movement direction of the movable plate at a 45-degree angle to the straight edge of the base, compared with the movement along the straight edge of the base, the movement stroke of the internal limiting hole of the movable plate can be increased, the processing accuracy can be reduced, and thus the stability and yield can be improved.

[0012] Preferably, the fixing mechanism includes two fasteners. The front end of the fastener is a fixing part, the middle part has a rotating shaft, and the rear end is a clamping part. The fastener is fixed in the base by the rotating shaft. The fixing part is used to fix the chip under test. The upper cover has a lower pressure plate. After the lower pressure plate moves downward with the upper cover, it abuts against the clamping part and opens the fixing part.

[0013] Preferably, the base has a guide groove on its side, and the top cover has a guide plate on its side, with the guide plate nested within the guide groove. The guide plate and guide groove improve the stability and fatigue resistance of the top cover under repeated pressure, preventing misalignment.

[0014] Preferably, the base consists of an upper shell and a lower shell, which together form a cavity for accommodating the fastener, the movable plate, the connecting terminal, and the chip under test.

[0015] Preferably, three wedge-shaped drive units are provided. Providing three wedge-shaped drive units can improve the stability and reliability of the movement of the movable plate driven by the wedge-shaped drive units.

[0016] Specifically, a return spring is provided between the upper cover and the base.

[0017] The beneficial effects of this invention are as follows: By arranging the connecting terminal into a Y-shaped structure, with the upper end of the connecting terminal forked to form two elastic fastening tabs, and the opposing upper surfaces of the elastic fastening tabs being arc-shaped structures, the upper cover, during the pressing process, drives the two arc-shaped structures of the connecting terminal to fasten together via the movable plate. The two arc-shaped structures then tightly adhere to and electrically connect with the solder balls of the chip under test. This overcomes the technical problem in the prior art where the connecting terminal is prone to fatigue during long-term repeated pressing, and insufficient elasticity leads to a failure to form electrical contact with the solder balls. Furthermore, the interlocking connection between the two arc-shaped structures of the connecting terminal and the solder balls facilitates precise alignment, ensuring a good electrical connection. This overcomes the drawback of the prior art where misalignment between the claw and the solder balls easily occurs, affecting the stability of the electrical connection. Attached Figure Description

[0018] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0019] Figure 1 This is a first-view overall structural diagram of the ball-holding structure test stand of the embodiment;

[0020] Figure 2 This is a second-view overall structural diagram of the ball-holding structure test stand in the embodiment;

[0021] Figure 3 This is a first-view exploded view of the ball-holding structure test stand of the embodiment;

[0022] Figure 4 This is an exploded view of the second-angle structure of the ball-shaped test stand in the embodiment.

[0023] Figure 5 This is a structural diagram of the connection terminals;

[0024] Figure 6 This is a cross-sectional view of the ball-holding structure test stand of the embodiment;

[0025] Figure 7 This is a diagram showing the combination of the movable plate and the connecting terminals in an embodiment.

[0026] Figure 8 yes Figure 7 A magnified view of a portion of the image;

[0027] Figure 9 This is a structural diagram of the fastener in the embodiment;

[0028] In the diagram: 1. Top cover; 11. Wedge-shaped drive unit; 12. Lower pressure plate; 13. Guide plate; 2. Base; 21. Guide groove; 22. Upper shell; 23. Lower shell; 3. Connecting terminal; 31. Arc-shaped structure; 4. Chip under test; 41. Solder ball; 5. Movable plate; 51. Limiting hole; 6. Fastener; 61. Fixing part; 62. Rotating shaft; 63. Clamping part; 7. Return spring. Detailed Implementation

[0029] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0030] For a first-view overall structural diagram of the ball-shaped test stand in this embodiment, please refer to the attached diagram. Figure 1 For a second-person view of the overall structure, please refer to the attached diagram. Figure 2 See the attached first-person perspective exploded view diagram. Figure 3 See the attached diagram for a second-person structural breakdown. Figure 4 See attached diagram for connection terminal structure. Figure 5 See attached structural cross-sectional view of the ball-holding test stand. Figure 6 See attached diagram for the combination of the movable plate and the connecting terminals. Figure 7 , Figure 8 for Figure 7 The enlarged view A shows a top cover 1, a base 2, multiple arrays of connection terminals 3, a fixing mechanism for fixing the chip under test 4, and a movable plate 5. The top cover 1 and the base 2 are slidably connected. The lower end of the connection terminal 3 is fixed inside the base 2 and its lower top is electrically connected to the test equipment. The connection terminal 3 has a Y-shaped structure. The upper end of the connection terminal 3 is forked to form two elastic fastening pieces. The opposite surface of the upper end of the elastic fastening pieces is an arc-shaped structure 31. During the pressing process, the upper cover 1 drives the two arc-shaped structures 31 of the connection terminal 3 to fasten through the movable plate 5. The two arc-shaped structures 31 are tightly attached to and electrically connected to the solder balls 41 of the chip under test 4.

[0031] In this embodiment, the upper cover 1 and the base 2 are rectangular structures. The movable plate 5 is nested inside the base 2. The movable plate 5 is provided with an array of limiting holes 51. The elastic fastening piece passes through the limiting holes 51. The upper cover 1 is provided with three wedge-shaped driving parts 11. The three wedge-shaped driving parts 11 drive the movable plate to move, thereby driving the two arc-shaped structures 31 of the connecting terminal 3 to fasten. The limiting hole 51 is rectangular. The elastic fastening piece moves relative to the long side of the limiting hole 51. The long side of the limiting hole 51 forms a 45-degree angle with the straight side of the base 2. The movement direction of the movable plate 5 forms a 45-degree angle with the straight side of the base 2. The advantage of setting a 45-degree angle is that, since the chip under test is very small and the solder ball is also very small, the processing accuracy requirements of the internal components of the ball-holding structure test socket are very high. Compared with moving in the same direction along the straight side of the base, the movement direction of the movable plate at a 45-degree angle with the straight side of the base can increase the movement stroke of the limiting hole inside the movable plate, reduce the processing accuracy, and thus improve stability and yield.

[0032] In this embodiment, the fixing mechanism includes two fasteners 6. See attached diagram for the structural diagram of the fasteners. Figure 9 The fastener 6 has a fixing part 61 at the front end, a rotating shaft 62 in the middle, and a clamping part 63 at the rear end. The fastener 6 is fixed in the base 2 by the rotating shaft 62. The fixing part 63 is used to fix the chip 4 to be tested. The upper cover 1 has a lower pressure plate 12. After the lower pressure plate 1 moves downward with the upper cover 1, it abuts against the clamping part 63 and opens the fixing part 63.

[0033] In this embodiment, a guide groove 21 is provided on the side of the base 2, and a guide piece 13 is provided on the side of the upper cover 1. The guide piece 13 is nested within the guide groove 21. The guide piece 13 and the guide groove 21 can improve the stability and fatigue resistance of the upper cover 1 under repeated pressing and prevent misalignment.

[0034] In this embodiment, the base 2 consists of an upper shell 22 and a lower shell 23. The upper shell 22 and the lower shell 23 are combined to form a cavity for accommodating the fastener 6, the movable plate 5, the connecting terminal 3, and the chip under test 4. Specifically, four return springs 7 are provided at the four corners between the upper cover 1 and the base 2 to realize the reset after the upper cover 1 is pressed down.

[0035] The working principle of the test socket in this embodiment is as follows: First, the upper cover 1 is pressed down by a robotic arm or manual operation. Its pressing plate 12 abuts against the fastening part 63 of the fastener 6. After the fastening part 63 is pressed down, it drives the fixing part 61 to open, placing the chip under test 4 above the movable plate 2. At the same time, during the pressing process, the upper cover 1 drives the movable plate 5 to move along the 45-degree angle of the straight side of the square test socket through the wedge-shaped driving part 11. The movement of the movable plate 5 causes the elastic fastening piece of the connecting terminal 3 to open. After the chip under test 4 is placed, the upper cover 1 is reset under the action of the return spring 7, and the movable plate 5 is reset under the action of the elastic fastening piece. The two arc-shaped structures 31 of the elastic fastening piece are fastened and tightly attached to the solder ball 41 of the chip under test 4 to achieve electrical connection. Compared with the existing technology where the top of the connecting terminal moves upward to meet the solder ball, this method of fastening the solder ball from the side in this embodiment has higher stability. Through the limiting hole 51 of the movable plate 5, the connecting terminal and the solder ball are less likely to misalign.

[0036] The beneficial effects of this invention are as follows: By arranging the connecting terminal into a Y-shaped structure, with the upper end of the connecting terminal forked to form two elastic fastening tabs, and the opposing upper surfaces of the elastic fastening tabs being arc-shaped structures, the upper cover, during the pressing process, drives the two arc-shaped structures of the connecting terminal to fasten together via the movable plate. The two arc-shaped structures then tightly adhere to and electrically connect with the solder balls of the chip under test. This overcomes the technical problem in the prior art where the connecting terminal is prone to fatigue during long-term repeated pressing, and insufficient elasticity leads to a failure to form electrical contact with the solder balls. Furthermore, the interlocking connection between the two arc-shaped structures of the connecting terminal and the solder balls facilitates precise alignment, ensuring a good electrical connection. This overcomes the drawback of the prior art where misalignment between the claw and the solder balls easily occurs, affecting the stability of the electrical connection.

[0037] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A ball-shaped test fixture, comprising an upper cover (1), a base (2), multiple arrays of connection terminals (3), a fixing mechanism for fixing a chip under test (4), and a movable plate (5), wherein the upper cover (1) and the base (2) are slidably connected vertically, and the lower end of the connection terminal (3) is fixed inside the base (2) and its lower top end is electrically connected to a test device, characterized in that: The connecting terminal (3) has a Y-shaped structure. The upper end of the connecting terminal (3) is forked to form two elastic fastening pieces. The opposite surfaces of the upper ends of the elastic fastening pieces are arc-shaped structures (31). During the pressing process, the upper cover (1) drives the two arc-shaped structures (31) of the connecting terminal (3) to fasten through the movable plate (5). The two arc-shaped structures (31) are tightly attached to and electrically connected to the solder balls (41) of the chip under test (4). The upper cover (1) and the base (2) The structure is a square frame. The movable plate (5) is nested inside the base (2). The movable plate (5) is provided with an array of limiting holes (51). The elastic fastening piece passes through the limiting holes (51). The upper cover (1) is provided with a wedge-shaped driving part (11). The wedge-shaped driving part (11) drives the movable plate (5) to move and then drives the two arc-shaped structures (31) of the connecting terminal (3) to fasten. The movement direction of the movable plate (5) is at a 45-degree angle to the straight edge of the base (2).

2. The ball-holding type test stand according to claim 1, characterized in that, The limiting hole (51) is rectangular, and the elastic fastening piece moves relative to the long side of the limiting hole (51). The long side of the limiting hole (51) forms a 45-degree angle with the straight side of the base (2).

3. The ball-holding type test stand according to claim 1, characterized in that, The fixing mechanism includes two fasteners (6). The front end of the fastener (6) is a fixing part (61), the middle part has a rotating shaft (62), and the rear end is a clamping part (63). The fastener (6) is fixed in the base (2) by the rotating shaft (62). The fixing part (61) is used to fix the chip under test (4). The upper cover (1) has a lower pressure plate (12). After the lower pressure plate (12) moves downward with the upper cover (1), it abuts against the clamping part (63) and causes the fixing part (61) to open.

4. The ball-holding type test stand according to claim 1, characterized in that, The base (2) has a guide groove (21) on its side, and the top cover (1) has a guide piece (13) on its side. The guide piece (13) is nested in the guide groove (21).

5. A ball-holding structure test stand according to claim 3, characterized in that, The base (2) consists of an upper shell and a lower shell, which together form a cavity for accommodating the fastener (6), the movable plate (5), the connecting terminal (3), and the chip under test (4).

6. The ball-holding type test stand according to claim 1, characterized in that, The wedge-shaped drive unit (11) is provided in three parts.

7. A ball-holding type test stand according to claim 1, characterized in that, A reset spring is provided between the upper cover (1) and the base (2).

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