Optical-electrical performance test assembly and method for optical module in high-temperature environment

Abstract

The application provides a kind of high-temperature environment optical module photoelectric performance test assembly, comprising: box, the box includes creating high-temperature environment shell, experiment table and the equipment warehouse arranged below experiment table;Mobile plate, the mobile plate includes top plate, side plate assembly and hydraulic lifting rod, the top plate is located above experiment table, the end face of the top plate away from experiment table is connected with shell by hydraulic lifting rod, the side plate assembly slides between top plate and experiment table;The experiment table and mobile plate form test area in shell, the top plate is driven to deform side plate assembly in the process of pressing down, change the size of test area formed by experiment table and mobile plate.The application simulates the influence of practical high-temperature environment on optical module performance to the greatest extent by testing the photoelectric performance change of optical module in different volume size space under high-temperature state.

Description

Technical Field

[0001] The present invention belongs to the technical field of photoelectric performance testing of optical modules, and in particular relates to a photoelectric performance testing component and a testing method for an optical module under a high temperature environment. Background Art

[0002] An optical module consists of optoelectronic components, functional circuits, and optical interfaces. The optoelectronic components include both transmitter and receiver components. Simply put, an optical module converts electrical signals into optical signals at the transmitter end. After transmission through optical fiber, the optical signals are then converted back into electrical signals at the receiver end.

[0003] Generally speaking, high temperatures will affect electronic components. Therefore, we will test the optoelectronic performance of optical modules in a high-temperature environment. However, the existing technical testing method only simply considers the impact of temperature factors during the test process. In actual applications, optical modules are usually set up inside devices or environments of different sizes. Different sizes of spaces will also affect the optoelectronic performance of optical modules under the same high temperature conditions. Simple temperature changes cannot truly reflect the impact of high temperature on optical modules in actual environments. Summary of the Invention

[0004] The present invention provides a test assembly for the photoelectric performance of optical modules in a high-temperature environment, aiming to solve the problem that in actual applications, optical modules are usually installed inside devices of different sizes, and the high-temperature environment inside the devices of different sizes affects the photoelectric performance of the optical modules. A simple temperature change test cannot truly reflect the impact of high temperature on the optical modules in the actual environment.

[0005] The present invention is implemented as follows: a photoelectric performance test assembly for an optical module in a high temperature environment, comprising:

[0006] The box body includes an outer shell for creating a high-temperature environment, a test bench, and an equipment compartment located below the test bench;

[0007] A movable plate, comprising a top plate, a side plate assembly and a hydraulic lifting rod, wherein the top plate is located above the experimental table, an end surface of the top plate away from the experimental table is connected to the outer shell through the hydraulic lifting rod, and the side plate assembly slides between the top plate and the experimental table;

[0008] The test bench and the movable plate form a test area inside the outer shell, and the downward pressing process of the top plate drives the side plate assembly to deform on the top plate, thereby changing the size of the test area formed by the test bench and the movable plate.

[0009] Preferably, the side panel assembly includes a first side panel and a second side panel; the first side panel and the second side panel have the same structure and are arranged opposite to each other between the top panel and the laboratory table.

[0010] Preferably, a driving structure is provided on the top plate, and the driving structure is connected to the first side plate and the second side plate respectively, and the first side plate and the second side plate are driven by the driving structure to move closer to or away from each other.

[0011] Preferably, the driving structure includes a driving assembly and a transmission assembly;

[0012] The transmission assembly is arranged inside the top plate; the transmission assembly includes a first driving arm, a driving wheel and a second driving arm; a driving chute is provided below the top plate, and the first side plate and the second side plate extend into the driving chute and are respectively connected to the first driving arm and the second driving arm inside the top plate;

[0013] The drive assembly is arranged on the top of the top plate, the drive assembly includes a motor and a gear transmission structure, the gear transmission structure includes a first bevel gear and a second bevel gear, the drive wheel is provided with a rotating shaft, the rotating shaft extends out of the top plate, the second bevel gear is arranged on the portion of the rotating shaft extending out of the top plate, the first bevel gear is arranged on the motor shaft of the motor, and the first bevel gear and the second bevel gear are meshed and connected;

[0014] Preferably, the first driving arm includes a driving rod and a rack rod, the driving rod and the rack rod are arranged perpendicularly, the rack rod is meshed with the driving wheel, and the first driving arm, the driving wheel and the second driving arm have the same structure.

[0015] Preferably, the first side panel comprises a lower panel and an upper panel, and the lower panel and the upper panel are nested and connected;

[0016] The upper plate body is provided with an insertion slot on the end surface facing the experimental table, and the lower plate body extends from the end of the insertion slot to the interior of the upper plate body;

[0017] A spring is provided in the insertion groove, and the spring is connected to the lower plate body and the upper plate body at the same time. When the top plate is pressed down, the lower plate body will shrink into the interior of the upper plate body.

[0018] Preferably, an upper slider is provided on a side of the upper plate away from the lower plate, and the upper slider slides in the driving slide groove and is connected to the first driving arm;

[0019] An upper sliding block is provided on a side of the lower plate body away from the upper plate body, and the upper sliding block slides in a guide sliding groove provided on the experimental table.

[0020] Preferably, the second side panel is identical to the first side panel.

[0021] Preferably, a back plate is further provided on one side of the experimental table, and heat dissipation holes are provided on the back plate; a fan is provided on the end face of the back plate away from the test area, and the fan sends air flow into the test area through the heat dissipation holes.

[0022] The present invention also provides a method for testing the photoelectric performance test assembly of an optical module under a high temperature environment, characterized in that the testing method comprises:

[0023] Step 1: Place the optical module to be tested inside the test area and connect it to the equipment connection station through a cable. The test line is connected and enters the waiting state;

[0024] Step 2: Select appropriate temperature variables and spatial data variables and start preparation.

[0025] Step 3: Raise the temperature inside the box to the test temperature, adjust the movable panels in sequence to change the spatial data variables of the test area, and obtain the photoelectric performance data of multiple sets of optical modules;

[0026] Step 4: Start the fan to create a ventilated environment, move the panel again to change the spatial data variables of the test area, and obtain the photoelectric performance data of multiple sets of optical modules;

[0027] Step 5. Change the internal temperature of the box again and repeat steps 3 and 4.

[0028] Compared with the prior art, the embodiments of the present application have the following beneficial effects:

[0029] 1. The optical module photoelectric performance test assembly provided by the present invention under high temperature environment simulates semi-enclosed spaces of different sizes through a test bench and a movable plate. By testing the changes in the photoelectric performance of the optical module in spaces of different sizes under high temperature conditions, the impact of a real high temperature environment on the performance of the optical module is simulated to the greatest extent.

[0030] 2. The photoelectric performance test component of the optical module in a high-temperature environment provided by the present invention simulates the photoelectric performance data of the optical module in a ventilated high-temperature environment by controlling the fan to send in the air flow, and uses the actual simulated environment to obtain more accurate photoelectric performance data in a high-temperature environment, thereby comprehensively evaluating the photoelectric performance of the optical module in a high-temperature state. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a structural schematic diagram of a photoelectric performance test assembly for an optical module in a high temperature environment provided by the present invention.

[0032] Figure 2 This is a schematic diagram of the structure of a movable plate of an optical module photoelectric performance test assembly under a high temperature environment provided by the present invention.

[0033] Figure 3 This is a schematic diagram of the test area structure of a photoelectric performance test component for an optical module in a high temperature environment provided by the present invention.

[0034] Figure 4It is a structural schematic diagram of a middle transmission component of an optical module photoelectric performance test component under a high temperature environment provided by the present invention.

[0035] Figure 5 This is a schematic diagram of the backplane structure of an optical module photoelectric performance test component in a high temperature environment provided by the present invention.

[0036] Figure 6 This is a structural schematic diagram of the first side plate and the second side plate of an optical module photoelectric performance test assembly under high temperature environment provided by the present invention.

[0037] Figure 7 This is a schematic structural diagram of a first side panel of an optical module photoelectric performance test assembly under a high temperature environment provided by the present invention.

[0038] Figure 8 This is a schematic diagram of the internal structure of the first side panel of an optical module photoelectric performance test assembly in a high temperature environment provided by the present invention.

[0039] Description of reference numerals:

[0040] 100, box body; 110, outer shell; 120, laboratory table; 130, equipment compartment; 140, back panel; 141, heat dissipation holes; 142, fan; 150, guide chute;

[0041] 200, movable plate; 210, top plate; 211, drive chute; 220, side plate assembly; 221, first side plate; 2211, lower plate; 2212, lower slider; 2213, position-limiting ridge; 2214, upper plate; 2215, upper slider; 222, second side plate; 230, hydraulic lift rod; 240, drive assembly; 251, first drive arm; 252, drive wheel; 253, second drive arm;

[0042] 300. Equipment connection station. DETAILED DESCRIPTION

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meanings as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of the application are only for the purpose of describing specific embodiments and are not intended to limit this application. The terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0044] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0045] The embodiment of the present invention provides a photoelectric performance test component for an optical module under a high temperature environment, such as Figures 1-8 As shown, the optical module photoelectric performance test component under a high temperature environment includes:

[0046] The box 100 includes an outer shell 110, a test bench 120, and an equipment compartment 130 located below the test bench 120. A double-door structure (not shown) is provided on the outside of the outer shell 110. An electric heating coil for creating a high-temperature environment is provided inside the outer shell 110. The electric heating coil creates a high-temperature environment inside the outer shell 110 to meet testing requirements.

[0047] The movable panel 200 includes a top plate 210, a side plate assembly 220, and a hydraulic lifting rod 230. The top plate 210 is located above the test bench 120. The end surface of the top plate 210 away from the test bench 120 is connected to the outer shell 110 via the hydraulic lifting rod 230. The side plate assembly 220 slides between the top plate 210 and the test bench 120.

[0048] The test bench 120 and the movable plate 200 form a test area inside the outer shell 110. The test bench 120 and the movable plate 200 simulate semi-enclosed spaces of different sizes. By testing the photoelectric performance changes of the optical module in the semi-enclosed spaces of different sizes under high temperature conditions, the effects of the environment and high temperature on the performance of the optical module are simulated to the greatest extent.

[0049] The experimental table 120 is also provided with a device connection table 300. The optical module is connected to the device connection table 300 via a cable. The device connection table 300 is electrically connected to the test instrument inside the device compartment 130. The device compartment 130 is independently provided with a heat insulation layer and a heat dissipation component. The arrangement of the test instruments and supporting equipment in the device compartment 130 is all existing technology.

[0050] As a preferred implementation in this embodiment, the side panel assembly 220 includes a first side panel 221 and a second side panel 222 ; the first side panel 221 and the second side panel 222 have the same structure and are arranged opposite to each other between the top panel 210 and the experimental table 120 ;

[0051] The first side plate 221 and the second side plate 222 are driven to move closer to or away from each other by a driving structure provided on the top plate 210, and the driving structure includes a driving assembly 240 and a transmission assembly;

[0052] The transmission assembly is arranged inside the top plate 210; the transmission assembly includes a first driving arm 251, a driving wheel 252 and a second driving arm 253, and the first driving arm 251 and the second driving arm 253 are connected to the driving wheel 252 via a gear rack structure, wherein the first driving arm 251 includes a driving rod and a rack rod, the driving rod and the rack rod are arranged perpendicularly, and the rack rod is meshed and connected with the driving wheel 252, and a driving slot 211 is provided below the top plate 210, and the first side plate 221 and the second side plate 222 extend into the driving slot 211 and are respectively connected to the first driving arm 251 and the second driving arm 253 inside the top plate 210;

[0053] The drive assembly 240 is disposed on the top of the top plate 210. The drive assembly 240 includes a motor and a gear transmission structure. The gear transmission structure includes a first bevel gear and a second bevel gear. The drive wheel 252 is provided with a rotating shaft, which extends out of the top plate 210. The second bevel gear is disposed on the portion of the rotating shaft extending out of the top plate 210. The first bevel gear is disposed on the motor shaft of the motor. The first bevel gear and the second bevel gear are meshed and connected.

[0054] The driving assembly 240 generates power to drive the first driving arm 251 and the second driving arm 253 to move closer to or away from each other. During the process of the first driving arm 251 and the second driving arm 253 moving closer to or away from each other, the first side plate 221 and the second side plate 222 are pulled closer to or away from each other.

[0055] As a preferred embodiment of this embodiment, the first side plate 221 includes a lower plate 2211 and an upper plate 2214; the lower plate 2211 and the upper plate 2214 are nested and connected, and the upper plate 2214 has an insertion groove on its end surface facing the experimental table 120; the lower plate 2211 extends from the insertion groove to the interior of the upper plate 2214; the lower plate 2211 is elastically connected to the side of the insertion groove away from the insertion groove end by a spring, and when the top plate 210 is pressed downward, the lower plate 2211 will retract into the interior of the upper plate 2214;

[0056] The insertion slot end is provided with a limit stop bar, and the lower plate 2211 is inserted into the upper plate 2214 and provided with a limit rib 2213. The limit rib 2213 will prevent the lower plate 2211 from sliding out of the upper plate 2214 with the help of the limit stop bar.

[0057] An upper slider 2215 is provided on the side of the upper plate 2214 away from the lower plate 2211. The upper slider 2215 slides in the driving slot 211 and is connected to the first driving arm 251. The second side plate 222 is the same as the first side plate 221 and is connected to the second driving arm 253 using the same technical method.

[0058] An upper slider 2215 is provided on the side of the lower plate 2211 away from the upper plate 2214. The upper slider 2215 slides in a guide slot 150 provided on the experimental table 120.

[0059] In this embodiment, the upper plate 2214 and the lower plate 2211 are elastically connected by the action of a spring. When the top plate 210 approaches the side of the experimental table 120 through the hydraulic lifting rod 230, the lower plate 2211 shrinks into the interior of the upper plate 2214 to adapt to the height change between the top plate 210 and the experimental table 120. After the height adjustment is completed, the first side plate 221 and the second side plate 222 will move closer to each other under the action of the driving structure to further reduce the volume of the test area. The movable plate 200 is used to construct test areas of different sizes to test the effect of high temperature on the optoelectronic performance of optical modules in different volumes.

[0060] As a preferred implementation in this embodiment, the experimental table 120 is further provided with a back plate 140 on the side away from the door body, and the back plate 140 is provided with heat dissipation holes 141; the end surface of the back plate 140 away from the test area is provided with a fan 142;

[0061] In this embodiment, the back plate 140 blocks the movable plate 200 and the other end surface of the test table 120. The fan 142 is disposed on the back plate 140 and maintains a certain distance from the outer shell 110 to facilitate air intake. The heat dissipation holes 141 are connected to the air outlet of the fan 142. When the fan 142 rotates, the fan 142 delivers air into the test area through the heat dissipation holes 141.

[0062] In this application, the photoelectric performance data of the optical module in a ventilated high-temperature environment is simulated by controlling the fan 142 to send in airflow, so as to comprehensively evaluate the photoelectric performance of the optical module in a high-temperature state;

[0063] An embodiment of the present invention further provides a method for testing the optoelectronic performance test assembly of an optical module in a high-temperature environment, the method comprising:

[0064] Step 1: Place the optical module to be tested inside the test area and connect it to the device connection station 300 via a cable. The test line is connected and enters the waiting state.

[0065] Step 2: Select appropriate sets of temperature variables and spatial data variables and start preparation.

[0066] Step 3: Raise the internal temperature of the box 100 to the test temperature, and sequentially adjust the movable plate 200 to change the spatial data variables of the test area to obtain the photoelectric performance data of multiple sets of optical modules;

[0067] Step 4: Start the fan 142 to create a ventilated environment, and move the plate 200 again to change the spatial data variables of the test area to obtain the optoelectronic performance data of multiple sets of optical modules;

[0068] Step 5: Change the internal temperature of the box 100 again and repeat steps 3 and 4.

[0069] This embodiment obtains photoelectric performance data of the optical module in an actual scenario in a high-temperature environment by using a controlled variable method, and uses the obtained data to comprehensively evaluate the performance of the optical module.

[0070] It should be noted that for the aforementioned embodiments, for simplicity of description, they are all expressed as a series of action combinations. However, those skilled in the art should be aware that the present invention is not limited by the order of the actions described, because according to the present invention, certain steps may be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in this specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the present invention.

[0071] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the scope of protection of the invention. Obviously, the embodiments described are only some embodiments of the present invention, rather than all embodiments. Based on these embodiments, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Although the present invention has been described in detail with reference to the above embodiments, ordinary technicians in this field can still combine, add, delete or make other adjustments to the features in the various embodiments of the present invention according to the circumstances without conflict, without making creative work, so as to obtain different other technical solutions that do not deviate from the concept of the present invention in essence, and these technical solutions also fall within the scope of protection of the present invention.

Claims

1. A photoelectric performance test component for optical modules in a high temperature environment, characterized in that: include: A box (100), the box (100) comprising an outer shell (110) for creating a high-temperature environment, a test bench (120), and an equipment compartment (130) disposed below the test bench (120); A movable plate (200), the movable plate (200) comprising a top plate (210), a side plate assembly (220) and a hydraulic lifting rod (230), the top plate (210) being located above the experimental table (120), the end surface of the top plate (210) away from the experimental table (120) being connected to the outer shell (110) via the hydraulic lifting rod (230), and the side plate assembly (220) sliding between the top plate (210) and the experimental table (120); The test bench (120) and the movable plate (200) form a test area inside the outer shell (110); the top plate (210) is pressed downward to drive the side plate assembly (220) to deform on the top plate (210), thereby changing the size of the test area formed by the test bench (120) and the movable plate (200); The side panel assembly (220) comprises a first side panel (221) and a second side panel (222); the first side panel (221) and the second side panel (222) have the same structure and are arranged opposite each other between the top panel (210) and the laboratory table (120); A driving structure is provided on the top plate (210), and the driving structure is connected to the first side plate (221) and the second side plate (222) respectively, and the first side plate (221) and the second side plate (222) are driven by the driving structure to move closer to or farther from each other; The provided optical module photoelectric performance test assembly under a high temperature environment simulates semi-enclosed spaces of different sizes through a test bench (120) and a movable plate (200), and by testing the photoelectric performance changes of the optical module in spaces of different sizes under a high temperature state, the influence of a real high temperature environment on the performance of the optical module is simulated to the greatest extent.

2. The optical module photoelectric performance test assembly under high temperature environment according to claim 1, characterized in that: The driving structure includes a driving component (240) and a transmission component; The transmission assembly is arranged inside the top plate (210); the transmission assembly includes a first driving arm (251), a driving wheel (252) and a second driving arm (253); a driving chute (211) is provided below the top plate (210); the first side plate (221) and the second side plate (222) extend into the driving chute (211) and are respectively connected to the first driving arm (251) and the second driving arm (253) inside the top plate (210); The drive assembly (240) is arranged on the top of the top plate (210), and the drive assembly (240) includes a motor and a gear transmission structure, and the gear transmission structure includes a first bevel gear and a second bevel gear. The drive wheel (252) is provided with a rotating shaft, and the rotating shaft extends out of the top plate (210). The second bevel gear is arranged on the portion of the rotating shaft extending out of the top plate (210). The first bevel gear is arranged on the motor shaft of the motor, and the first bevel gear and the second bevel gear are meshed and connected.

3. The optical module photoelectric performance test assembly under high temperature environment according to claim 2, characterized in that: The first driving arm (251) comprises a driving rod and a rack rod, wherein the driving rod and the rack rod are arranged vertically, and the rack rod is meshedly connected with the driving wheel (252). The first driving arm (251) and the second driving arm (253) have the same structure.

4. The optical module photoelectric performance test assembly under high temperature environment according to claim 3, characterized in that: The first side plate (221) comprises a lower plate body (2211) and an upper plate body (2214), and the lower plate body (2211) and the upper plate body (2214) are nested and connected; The upper plate body (2214) is provided with an insertion groove on its end surface facing the experimental table (120), and the lower plate body (2211) extends from the end of the insertion groove to the interior of the upper plate body (2214); A spring is provided in the insertion groove, and the spring is connected to the lower plate body (2211) and the upper plate body (2214) at the same time. When the top plate (210) is pressed downward, the lower plate body (2211) will shrink toward the inside of the upper plate body (2214).

5. The optical module photoelectric performance test assembly in a high temperature environment according to claim 4, characterized in that: An upper slider (2215) is provided on a side of the upper plate (2214) away from the lower plate (2211), and the upper slider (2215) slides in the driving slide groove (211) and is connected to the first driving arm (251); An upper sliding block (2215) is provided on a side of the lower plate (2211) away from the upper plate (2214), and the upper sliding block (2215) slides in a guide slot (150) provided on the experimental table (120).

6. The optical module photoelectric performance test assembly in a high temperature environment according to claim 5, characterized in that: The second side plate (222) is identical to the first side plate (221).

7. The optical module photoelectric performance test assembly in a high temperature environment according to claim 6, characterized in that: A back plate (140) is further provided on one side of the test bench (120), and a heat dissipation through hole (141) is provided on the back plate (140); a fan (142) is provided on the end surface of the back plate (140) away from the test area, and the fan (142) sends airflow to the test area through the heat dissipation through hole (141).

8. A method for testing the photoelectric performance test assembly of an optical module under a high temperature environment according to claim 7, characterized in that: The test method includes: Step 1: Place the optical module to be tested inside the test area and connect it to the device connection station (300) via a cable, and the test line is connected to enter the waiting state; Step 2: Select appropriate temperature variables and spatial data variables and start preparation. Step 3: Raise the internal temperature of the box (100) to the test temperature, and sequentially adjust the movable plate (200) to change the spatial data variables of the test area to obtain photoelectric performance data of multiple groups of optical modules; Step 4: Start the fan (142) to create a ventilated environment, and move the plate (200) again to change the spatial data variables of the test area, and obtain the photoelectric performance data of multiple groups of optical modules; Step 5: Change the internal temperature of the box (100) and repeat steps 3 and 4.

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