An intelligent circuit board quality detection system

Abstract

The invention discloses an intelligent circuit board quality detection system, which specifically relates to the field of artificial intelligence, and comprises a target key determination module, a circuit board quality parameter acquisition module, a circuit board module quality data analysis module, an electrical performance parameter acquisition module, an electrical performance data analysis module, a comprehensive quality analysis module, an early warning module, and a human-computer interaction module. The target key determination module is used to divide a target intelligent circuit board into n sub-areas, and each circuit board is divided into sub-areas by target key division, and marked as 1, 2, ..., k in sequence. The circuit board quality and electrical performance of the circuit board are analyzed by obtaining parameters from various aspects, and a comprehensive quality qualified index is obtained in combination with the above coefficients, which greatly avoids quality problems caused by incomplete detection and provides important suggestions for circuit board quality detection.

Description

Technical Field

[0001] The present invention relates to the field of artificial intelligence technology, and more specifically, to an intelligent circuit board quality detection system. Background Art

[0002] With the rapid development and widespread application of electronic products, the quality requirements for circuit boards are getting higher and higher. The market demand for high-quality and high-reliability electronic products is growing, which also prompts circuit board manufacturers to continuously improve the level of quality inspection. The quality of circuit boards is not only related to the functional realization of the product, but also involves the product's service life, safety performance and user experience. Therefore, quality inspection of circuit boards has become a key link in ensuring product quality and reliability.

[0003] With the continuous application of automation and intelligent technology, the development of circuit board quality inspection technology has experienced a transition from manual visual inspection to automated inspection. The traditional circuit board quality inspection system includes a sub-area division module, a circuit board data acquisition module, a circuit board data analysis module and a human-computer interaction module. The sub-area division module divides the circuit board into n sub-areas for data collection; the circuit board data acquisition module collects circuit board data through tools such as multimeters and oscilloscopes; the circuit board data analysis module converts, integrates and processes the collected data, and analyzes it to obtain the quality status of the circuit board, providing a basis for the efficiency and accuracy of circuit board quality inspection; the human-computer interaction module displays the quality status of the circuit board in a visual way and provides suggestions for circuit board quality judgment; the electrical performance of the circuit board is a comprehensive indicator. When designing and manufacturing circuit boards, these electrical performance indicators need to be fully considered and optimized to ensure efficient and stable operation of the circuit board.

[0004] However, it still has some shortcomings in actual use. With the advancement of science and technology, most circuit board quality inspection systems focus on the electrical properties of circuit boards, covering aspects such as circuit board insulation performance and signal amplitude. Only focusing on the electrical performance of circuit boards can no longer meet the accuracy of circuit board quality inspection. For example, intelligent circuit boards may be used in high temperature and high humidity environments, and the environmental adaptability of the circuit boards needs to be considered. In addition, intelligent circuit boards require extremely high precision. Therefore, it is essential to detect the quality of circuit boards in multiple dimensions. The application of automated inspection technology and intelligent data analysis will further optimize the circuit board quality inspection process and improve inspection efficiency and accuracy. Summary of the invention

[0005] In order to overcome the above-mentioned defects of the prior art, an embodiment of the present invention provides an intelligent circuit board quality detection system, which solves the problems raised in the above-mentioned background technology through the following scheme.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] The target key determination module is used to divide the target intelligent circuit board into n sub-areas, and divide each circuit board into sub-areas by target key division, and mark them as 1, 2, ..., k in sequence;

[0008] The circuit board quality parameter acquisition module is used to collect circuit board production parameters, including circuit board measurement parameters, circuit board connectivity parameters and circuit board temperature parameters, and transmit the collected data to the circuit board quality data analysis module;

[0009] The circuit board quality data analysis module includes a circuit board metric analysis unit, a circuit board connectivity analysis unit and a temperature analysis unit, which are used to analyze the data transmitted by the circuit board quality acquisition module, calculate the circuit board quality assessment coefficient, and transmit the analysis results to the comprehensive quality analysis module;

[0010] The electrical performance parameter acquisition module is used to acquire the electrical performance parameters of the circuit board, including the insulation performance and current load of the circuit board, and transmit the acquired data to the circuit board electrical performance data analysis module;

[0011] The electrical performance data analysis module includes an insulation performance analysis unit and a current load analysis unit, which are used to analyze the data transmitted by the electrical performance parameter acquisition module, calculate the circuit board electrical performance evaluation coefficient, and transmit the analysis results to the comprehensive quality analysis module;

[0012] The comprehensive quality analysis module is used to establish a comprehensive quality analysis model, import the data of the circuit board quality data analysis module, the electrical performance data analysis module and the environmental adaptation data analysis module into the comprehensive quality analysis model, and calculate the comprehensive quality qualification index of the target time zone;

[0013] The early warning module is used to establish a preset value of the comprehensive quality qualified index, make a judgment based on the preset value of the comprehensive quality qualified index and the comprehensive quality qualified index of the target circuit board, and issue an early warning signal according to the judgment result;

[0014] The human-computer interaction module is used to send signals to circuit boards with abnormal quality. The circuit board quality detection system transmits the warning signal to the management control panel through artificial intelligence technology, and manually judges and processes the results displayed on the control panel.

[0015] Preferably, the circuit board measurement parameters are measured using a two-dimensional image measuring instrument, which is automatically measured after programming. The measurement parameters include the drilling hole diameter, the distance between the hole point and the nearest edge of the circuit board, and the etching area, which are respectively recorded as l, d and s. Find n points on the circuit board and record the copper thickness of the i-th point, which is recorded as t miThe connectivity parameters of the circuit board are measured by a multimeter, and the current and voltage of the circuit board in the connectivity period are recorded according to the connectivity time, which are recorded as I i and U i The temperature parameters of the circuit board are measured by temperature sensors, including the surface temperature of the circuit board and the critical temperature point where the circuit board material changes, which are recorded as Q m and QT.

[0016] Preferably, the circuit board measurement analysis unit is used to establish a circuit board measurement analysis model, import the circuit board measurement data transmitted by the circuit board quality parameter acquisition module into the circuit board measurement analysis model, and calculate the drilling hole diameter deviation rate, which is specifically expressed as: in Indicates the preset circuit board drilling hole diameter, l m ' represents the aperture deviation rate of the mth circuit board, l m represents the drilling hole diameter of the mth circuit board; the distance deviation rate between the hole point and the nearest edge of the circuit board is specifically expressed as: in Indicates the distance between the preset circuit board hole point and the nearest edge of the circuit board, d m ' represents the distance between the mth circuit board hole point and the nearest edge of the circuit board, d m Indicates the distance between the mth circuit board hole point and the nearest edge of the circuit board; the etching area deviation rate is specifically expressed as: Indicates the preset etching area, s m ' represents the etching area deviation rate of the mth circuit board, s m represents the etching area of ​​the mth circuit board; the copper deposition thickness fluctuation rate is specifically expressed as: where t m ' represents the fluctuation rate of copper plating thickness of the mth circuit board, t mi Indicates the copper thickness of the ith search point of the mth circuit board; the circuit board measurement rationality index is calculated by combining the circuit board drilling aperture deviation rate, distance deviation rate, etching area deviation rate and copper thickness deviation rate, and the calculation formula is:

[0017] Preferably, the circuit board connectivity analysis unit is used to establish a circuit board connectivity data analysis model, import the circuit board connectivity data transmitted by the circuit board quality parameter acquisition module into the circuit board connectivity analysis model, and calculate the current fluctuation rate, which is specifically expressed as: Among them I m ' represents the current fluctuation rate of the mth circuit board, I mi represents the current of the mth circuit board in the i-th time period; the voltage fluctuation rate is specifically expressed as: Among them U m' represents the voltage fluctuation rate of the mth circuit board, U mi represents the voltage of the mth circuit board in the i-th time period; the circuit board connectivity rationality index is calculated by combining the current fluctuation index and the voltage fluctuation index, and the calculation formula is:

[0018] Preferably, the temperature analysis unit is used to establish a temperature analysis model, import the temperature data transmitted by the circuit board quality parameter acquisition module into the temperature analysis model, and calculate the temperature change index. The specific analysis formula is: Where Q m Indicates the surface temperature of the circuit board in the mth sub-time zone, QT m Indicates the critical value of the board material change of the mth circuit board.

[0019] Preferably, the circuit board quality evaluation coefficient includes a circuit board metric rationality index, a connectivity rationality index, and a temperature variation index, and the specific analysis formula is: where ω 1m represents the metric rationality index of the mth circuit board, ω 2m represents the connectivity rationality index of the mth circuit board, ω 3m Represents the temperature variation index of the mth circuit board.

[0020] Preferably, the insulation of the circuit board is measured by an insulation resistance tester, the length and width of the insulation resistance are recorded as L and W respectively, and the voltage applied to the insulation resistance and the current measured after the voltage is applied are measured by a multimeter, which are recorded as Vc and Ic respectively; the current load of the circuit board is connected in series to the break of the current path of the circuit board by an ammeter, the current value is read, recorded as Il, and according to the design specifications and current path of the circuit board, the area of ​​the main area where the current passes is calculated by artificial intelligence technology, which is recorded as Sl.

[0021] Preferably, the insulation performance analysis unit is used to establish an insulation performance analysis model, import the insulation performance data transmitted by the electrical performance parameter acquisition module into the insulation performance analysis model, and calculate the insulation index. The specific analysis formula is: in represents the surface resistivity of the mth circuit board, Represents the volume resistivity of the mth circuit board.

[0022] Preferably, the current load analysis unit is used to establish a current load analysis model, import the current load data transmitted by the electrical performance parameter acquisition module into the current load analysis model, and calculate the current load index. The specific analysis formula is Among them m Indicates the current value measured by the mth circuit board, Sl mIndicates the area through which the current of the mth circuit board flows, WL i Indicates the width of the i-th wire on the m-th circuit board, Wl min Indicates the minimum line width that can be connected to the circuit board.

[0023] Preferably, the circuit board electrical performance evaluation coefficient includes an insulation index and a current load index, and the specific analysis formula is: where ζ 1m represents the insulation index of the mth circuit board, ζ 2m Represents the current load index of the mth circuit board.

[0024] Preferably, the comprehensive quality index is specifically expressed as follows: Where φ represents the comprehensive quality index of the circuit board, ω m represents the mth circuit board quality assessment coefficient, ζ m represents the mth circuit board electrical performance evaluation coefficient, λ1 represents the influencing factor of the circuit board surface quality, and λ2 represents the influencing factor of the circuit board electrical performance.

[0025] Preferably, the preset value of the comprehensive quality index is marked as φ Def , when φ Def <φ, it means that the comprehensive qualified index of the target circuit board is greater than the preset value of the comprehensive quality qualified index, indicating that there is no abnormality in the quality of the target circuit board. Then, the collection and analysis of the surface quality parameters and electrical performance parameters of the circuit board are maintained. When φ Def >φ, it means that the comprehensive quality qualification index of the target circuit board is greater than the preset value of the comprehensive quality qualification index, indicating that the quality of the target circuit board is abnormal, and an early warning signal is sent to the human-computer interaction module.

[0026] Technical effects and advantages of the present invention:

[0027] 1. The present invention collects the surface quality parameters of the circuit board through the circuit board quality parameter collection module, including the circuit board measurement parameters, the circuit board connectivity parameters and the circuit board temperature parameters. These data are important bases for evaluating the quality of the circuit board, and the collected data are imported into the analysis model through the circuit board quality data analysis module. The circuit board measurement rationality index, connectivity rationality index and temperature change index are calculated to intuitively reflect the quality status of the circuit board; the insulation index and current load index of the circuit board are obtained through electrical performance parameter acquisition and data analysis, and the electrical performance of the circuit board is accurately observed, which provides an important reference for comprehensive quality monitoring;

[0028] 2. The results of the circuit board quality data analysis module and the electrical performance data analysis module are imported into the comprehensive quality module through the comprehensive quality analysis module to calculate the comprehensive quality qualified index, which can comprehensively reflect the overall quality of the circuit board and provide more comprehensive and efficient quality assurance for intelligent manufacturing. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the overall structure of the present invention. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] As attached Figure 1 An intelligent circuit board quality inspection system shown includes a target key determination module, a circuit board quality parameter acquisition module, a circuit board quality data analysis module, an electrical performance parameter acquisition module, an electrical performance data analysis module, a comprehensive quality analysis module, an early warning module, and a human-computer interaction module.

[0032] The output end of the target key determination module is connected to the input ends of the circuit board quality parameter acquisition module and the electrical performance parameter acquisition module, the output end of the circuit board quality parameter acquisition module is connected to the input end of the circuit board quality data analysis module, the output end of the electrical performance parameter acquisition module is connected to the input end of the electrical performance data analysis module, the input end of the comprehensive quality analysis module is connected to the output ends of the circuit board quality data analysis module and the electrical performance data analysis module respectively, the input end of the comprehensive quality analysis module is connected to the input end of the early warning module, and the input end of the early warning module is connected to the output end of the human-computer interaction module.

[0033] The target key determination module is used to divide the target intelligent circuit board into n sub-areas, and divide each circuit board into sub-areas by target key division, and mark them as 1, 2, ..., k in sequence.

[0034] The circuit board quality parameter acquisition module is used to acquire circuit board production parameters, including circuit board measurement parameters, circuit board connectivity parameters and circuit board temperature parameters, and transmit the acquired data to the circuit board quality data analysis module.

[0035] In this embodiment, it should be specifically explained that the circuit board measurement parameters are measured using a two-dimensional image measuring instrument, which is automatically measured after programming. The measurement parameters include the drilling hole diameter, the distance between the hole point and the nearest edge of the circuit board, and the etching area, which are respectively recorded as l, d and s. Find n points on the circuit board and record the copper thickness of the i-th point, which is recorded as t mi The connectivity parameters of the circuit board are measured by a multimeter, and the current and voltage of the circuit board in the connectivity period are recorded according to the connectivity time, which are respectively recorded as I i and U i The temperature parameters of the circuit board are measured by temperature sensors, including the surface temperature of the circuit board and the critical temperature point where the circuit board material changes, which are recorded as Q m and QT.

[0036] The circuit board quality data analysis module includes a circuit board metric analysis unit, a circuit board connectivity analysis unit and a temperature analysis unit, which are used to analyze the data transmitted by the circuit board quality acquisition module, calculate the circuit board quality evaluation coefficient, and transmit the analysis results to the comprehensive quality analysis module.

[0037] In this embodiment, it should be specifically explained that the circuit board measurement analysis unit is used to establish a circuit board measurement analysis model, import the circuit board measurement data transmitted by the circuit board quality parameter acquisition module into the circuit board measurement analysis model, and calculate the drilling hole diameter deviation rate, which is specifically expressed as: in Indicates the preset circuit board drilling hole diameter, l m ' represents the aperture deviation rate of the mth circuit board, l m represents the drilling hole diameter of the mth circuit board; the distance deviation rate between the hole point and the nearest edge of the circuit board is specifically expressed as: in Indicates the distance between the preset circuit board hole point and the nearest edge of the circuit board, d m ' represents the distance between the mth circuit board hole point and the nearest edge of the circuit board, d m Indicates the distance between the mth circuit board hole point and the nearest edge of the circuit board; the etching area deviation rate is specifically expressed as: Indicates the preset etching area, s m ' represents the etching area deviation rate of the mth circuit board, s m represents the etching area of ​​the mth circuit board; the copper deposition thickness fluctuation rate is specifically expressed as: where t m ' represents the fluctuation rate of copper plating thickness of the mth circuit board, t miIndicates the copper thickness of the ith search point of the mth circuit board; the circuit board measurement rationality index is calculated by combining the circuit board drilling aperture deviation rate, distance deviation rate, etching area deviation rate and copper thickness deviation rate, and the calculation formula is:

[0038] In this embodiment, it should be specifically explained that the circuit board connectivity analysis unit is used to establish a circuit board connectivity data analysis model, import the circuit board connectivity data transmitted by the circuit board quality parameter acquisition module into the circuit board connectivity analysis model, and calculate the current fluctuation rate, which is specifically expressed as: Among them I m ' represents the current fluctuation rate of the mth circuit board, I mi represents the current of the mth circuit board in the i-th time period; the voltage fluctuation rate is specifically expressed as: Among them U m ' represents the voltage fluctuation rate of the mth circuit board, U mi represents the voltage of the mth circuit board in the i-th time period; the circuit board connectivity rationality index is calculated by combining the current fluctuation index and the voltage fluctuation index, and the calculation formula is:

[0039] In this embodiment, it should be specifically explained that the temperature analysis unit is used to establish a temperature analysis model, import the temperature data transmitted by the circuit board quality parameter acquisition module into the temperature analysis model, and calculate the temperature change index. The specific analysis formula is: Where Q m Indicates the surface temperature of the circuit board in the mth sub-time zone, QT m Indicates the critical value of the board material change of the mth circuit board, QT m The higher the value, the smaller the temperature fluctuation of the circuit board and the better the stability of the circuit board.

[0040] In this embodiment, it should be specifically explained that the circuit board quality evaluation coefficient includes the circuit board measurement rationality index, the connectivity rationality index and the temperature change index, and the specific analysis formula is: where ω 1m represents the metric rationality index of the mth circuit board, ω 2m represents the connectivity rationality index of the mth circuit board, ω 3m It represents the temperature variation index of the mth circuit board. The larger the circuit board measurement rationality index is, the greater the connectivity rationality is, the smaller the temperature variation index is, and the better the quality of the circuit board is.

[0041] The electrical performance parameter acquisition module is used to acquire the electrical performance parameters of the circuit board, including the insulation performance and current load of the circuit board, and transmit the acquired data to the circuit board electrical performance data analysis module.

[0042] In this embodiment, it should be specifically explained that the insulation of the circuit board is measured by an insulation resistance tester, the length and width of the insulation resistance are respectively recorded as L and W, and the voltage applied to the insulation resistance and the current measured after the voltage is applied are measured by a multimeter, which are recorded as Vc and Ic respectively; the current load of the circuit board is connected in series to the break of the current path of the circuit board by an ammeter, the current value is read, recorded as Il, and according to the design specifications and current path of the circuit board, the area of ​​the main area where the current passes is calculated by artificial intelligence technology, recorded as Sl.

[0043] The electrical performance data analysis module includes an insulation performance analysis unit and a current load analysis unit, which are used to analyze the data transmitted by the electrical performance parameter acquisition module, calculate the circuit board electrical performance evaluation coefficient, and transmit the analysis results to the comprehensive quality analysis module.

[0044] In this embodiment, it should be specifically explained that the insulation performance analysis unit is used to establish an insulation performance analysis model, import the insulation performance data transmitted by the electrical performance parameter acquisition module into the insulation performance analysis model, and calculate the insulation index. The specific analysis formula is: in represents the surface resistivity of the mth circuit board, Represents the volume resistivity of the mth circuit board.

[0045] In this embodiment, it should be specifically explained that the current load analysis unit is used to establish a current load analysis model, import the current load data transmitted by the electrical performance parameter acquisition module into the current load analysis model, and calculate the current load index. The specific analysis formula is: Among them m Indicates the current value measured by the mth circuit board, Sl m Indicates the area through which the current of the mth circuit board flows, WL i Indicates the width of the i-th wire on the m-th circuit board, Wl min It indicates the minimum line width that can be connected to the circuit board. The larger the measured current value and the larger the cross-sectional area, the greater the current carrying capacity of the circuit board.

[0046] In this embodiment, it should be specifically explained that the circuit board electrical performance evaluation coefficient includes an insulation index and a current load index, and the specific analysis formula is: where ζ 1m represents the insulation index of the mth circuit board, ζ 2m It represents the current load index of the mth circuit board. The larger the insulation index is, the larger the current load index is, and the better the electrical performance of the circuit board is.

[0047] The comprehensive quality analysis module is used to establish a comprehensive quality analysis model, import the data of the circuit board quality data analysis module, the electrical performance data analysis module and the environmental adaptation data analysis module into the comprehensive quality analysis model, and calculate the comprehensive quality qualification index of the target time zone.

[0048] In this embodiment, it should be specifically explained that the specific expression formula of the comprehensive quality index is: Where φ represents the comprehensive quality index of the circuit board, ω m represents the mth circuit board quality assessment coefficient, ζ m represents the mth circuit board electrical performance evaluation coefficient, λ1 represents the influencing factors of the circuit board surface quality, such as the surface roughness and cleanliness of the circuit board, which affect the movement and distribution of charges on the circuit board surface, and λ2 represents the influencing factors of the circuit board electrical performance, such as material composition and structure. The composition and structure of different materials will affect the transmission and flow of electrons or ions inside them.

[0049] The early warning module is used to establish a preset value of the comprehensive quality qualified index, make a judgment based on the preset value of the comprehensive quality qualified index and the comprehensive quality qualified index of the target circuit board, and issue an early warning signal according to the judgment result.

[0050] In this embodiment, it should be specifically noted that the preset value of the comprehensive quality index is marked as φ Def , when φ Def <φ, it means that the comprehensive qualified index of the target circuit board is greater than the preset value of the comprehensive quality qualified index, indicating that there is no abnormality in the quality of the target circuit board. Then, the collection and analysis of the surface quality parameters and electrical performance parameters of the circuit board are maintained. When φ Def >φ, it means that the comprehensive quality qualification index of the target circuit board is greater than the preset value of the comprehensive quality qualification index, indicating that the quality of the target circuit board is abnormal, and an early warning signal is sent to the human-computer interaction module.

[0051] The human-computer interaction module is used to send signals to circuit boards with abnormal quality. The circuit board quality detection system transmits the warning signal to the management control panel through artificial intelligence technology, and manually judges and processes the results displayed on the control panel.

[0052] The present invention collects the surface quality of the circuit board through the circuit board quality parameter collection module, including the circuit board measurement parameters, the circuit board connectivity parameters and the circuit board temperature parameters, which are important bases for evaluating the quality of the circuit board, and imports the collected data into the analysis model through the circuit board quality data analysis module, obtains the circuit board measurement rationality index, the connectivity rationality index and the temperature change index through calculation, and can intuitively reflect the quality status of the circuit board; obtains the insulation index and the current load index of the circuit board through electrical performance parameter acquisition and data analysis, accurately observes the electrical performance of the circuit board, and provides an important reference for comprehensive quality monitoring; imports the results of the circuit board quality data analysis module and the electrical performance data analysis module into the comprehensive quality module through the comprehensive quality analysis module, and calculates the comprehensive quality qualified index. By analyzing these data, the system can timely discover potential problems of the circuit board, provide a scientific basis for preventive maintenance and comprehensively reflect the overall quality of the circuit board, and provide more comprehensive and efficient quality assurance for intelligent detection.

[0053] Secondly: In the drawings of the embodiments disclosed in the present invention, only the structures related to the embodiments disclosed in the present invention are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present invention can be combined with each other;

[0054] Finally: The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An intelligent circuit board quality inspection system, comprising a target key determination module, a circuit board quality parameter acquisition module, a circuit board quality data analysis module, an electrical performance parameter acquisition module, an electrical performance data analysis module, a comprehensive quality analysis module, an early warning module, and a human-computer interaction module, characterized in that: The target key determination module is used to divide the target intelligent circuit board into n sub-areas, and divide each circuit board into sub-areas by target key division, and mark them as 1, 2, ..., k in sequence; The circuit board quality parameter acquisition module is used to collect circuit board production parameters, including circuit board measurement parameters, circuit board connectivity parameters and circuit board temperature parameters, and transmit the collected data to the circuit board quality data analysis module; The circuit board quality data analysis module includes a circuit board metric analysis unit, a circuit board connectivity analysis unit and a temperature analysis unit, which are used to analyze the data transmitted by the circuit board quality acquisition module, calculate the circuit board quality assessment coefficient, and transmit the analysis results to the comprehensive quality analysis module; The circuit board measurement and analysis unit is used to establish a circuit board measurement and analysis model, import the circuit board measurement data transmitted by the circuit board quality parameter acquisition module into the circuit board measurement and analysis model, and calculate the drilling hole diameter deviation rate, which is specifically expressed as: in Indicates the preset circuit board drilling hole diameter, l m ' represents the aperture deviation rate of the mth circuit board, l m represents the drilling hole diameter of the mth circuit board; the distance deviation rate between the hole point and the nearest edge of the circuit board is specifically expressed as: in Indicates the distance between the preset circuit board hole point and the nearest edge of the circuit board, d m ' represents the distance between the mth circuit board hole point and the nearest edge of the circuit board, d m Indicates the distance between the mth circuit board hole point and the nearest edge of the circuit board; the etching area deviation rate is specifically expressed as: Indicates the preset etching area, s m ' represents the etching area deviation rate of the mth circuit board, s m represents the etching area of ​​the mth circuit board; the copper deposition thickness fluctuation rate is specifically expressed as: where t m ' represents the fluctuation rate of copper plating thickness of the mth circuit board, t mi Indicates the copper thickness of the ith search point of the mth circuit board; the circuit board measurement rationality index is calculated by combining the circuit board drilling aperture deviation rate, distance deviation rate, etching area deviation rate and copper thickness deviation rate, and the calculation formula is: The electrical performance parameter acquisition module is used to acquire the electrical performance parameters of the circuit board, including the insulation performance and current load of the circuit board, and transmit the acquired data to the circuit board electrical performance data analysis module; The electrical performance data analysis module includes an insulation performance analysis unit and a current load analysis unit, which are used to analyze the data transmitted by the electrical performance parameter acquisition module, calculate the circuit board electrical performance evaluation coefficient, and transmit the analysis results to the comprehensive quality analysis module; The comprehensive quality analysis module is used to establish a comprehensive quality analysis model, import the data of the circuit board quality data analysis module, the electrical performance data analysis module and the environmental adaptation data analysis module into the comprehensive quality analysis model, and calculate the comprehensive quality qualification index of the target time zone; The specific expression formula of the comprehensive quality index is: Where φ represents the comprehensive quality index of the circuit board, ω m represents the mth circuit board quality assessment coefficient, ζ m represents the mth circuit board electrical performance evaluation coefficient, λ1 represents the influencing factor of the circuit board surface quality, and λ2 represents the influencing factor of the circuit board electrical performance; The early warning module is used to establish a preset value of the comprehensive quality qualified index, make a judgment based on the preset value of the comprehensive quality qualified index and the comprehensive quality qualified index of the target circuit board, and issue an early warning signal according to the judgment result; The human-computer interaction module is used to send signals to circuit boards with abnormal quality. The circuit board quality detection system transmits the warning signal to the management control panel through artificial intelligence technology, and manually judges and processes the results displayed on the control panel.

2. The intelligent circuit board quality detection system according to claim 1, characterized in that: The circuit board measurement parameters are measured using a two-dimensional image measuring instrument, which is automatically measured after programming. The measurement parameters include the drilling hole diameter, the distance between the hole point and the nearest edge of the circuit board, and the etching area, which are recorded as l, d, and s respectively. Find n points on the circuit board and record the copper thickness of the i-th point, which is recorded as t mi The connectivity parameters of the circuit board are measured by a multimeter, and the current and voltage of the circuit board in the connectivity period are recorded according to the connectivity time, which are recorded as I i and U i The temperature parameters of the circuit board are measured by temperature sensors, including the surface temperature of the circuit board and the critical temperature point where the circuit board material changes, which are recorded as Q m and QT.

3. The intelligent circuit board quality detection system according to claim 1, characterized in that: The circuit board connectivity analysis unit is used to establish a circuit board connectivity data analysis model, import the circuit board connectivity data transmitted by the circuit board quality parameter acquisition module into the circuit board connectivity analysis model, and calculate the current fluctuation rate, which is specifically expressed as: Among them I m ' represents the current fluctuation rate of the mth circuit board, I mi represents the current of the mth circuit board in the i-th time period; the voltage fluctuation rate is specifically expressed as: Among them U m ' represents the voltage fluctuation rate of the mth circuit board, U mi represents the voltage of the mth circuit board in the i-th time period; the circuit board connectivity rationality index is calculated by combining the current fluctuation index and the voltage fluctuation index, and the calculation formula is:

4. The intelligent circuit board quality detection system according to claim 1, characterized in that: The temperature analysis unit is used to establish a temperature analysis model, import the temperature data transmitted by the circuit board quality parameter acquisition module into the temperature analysis model, and calculate the temperature change index. The specific analysis formula is: Where Q m Indicates the surface temperature of the circuit board in the mth sub-time zone, QT m Indicates the critical value of the board material change of the mth circuit board.

5. The intelligent circuit board quality detection system according to claim 1, characterized in that: The circuit board quality evaluation coefficient includes the circuit board measurement rationality index, connectivity rationality index and temperature change index, and the specific analysis formula is: where ω 1m represents the metric rationality index of the mth circuit board, ω 2m represents the connectivity rationality index of the mth circuit board, ω 3m Represents the temperature variation index of the mth circuit board.

6. The intelligent circuit board quality detection system according to claim 1, characterized in that: The insulation property of the circuit board is measured by an insulation resistance tester, the length and width of the insulation resistance are recorded as L and W respectively, and the voltage applied to the insulation resistance and the current measured after the voltage is applied are measured by a multimeter, which are recorded as Vc and Ic respectively; the current load of the circuit board is connected in series to the break of the current path of the circuit board by an ammeter, the current value is read, recorded as Il, and according to the design specifications and current path of the circuit board, the area of ​​the main area where the current passes is calculated by artificial intelligence technology, which is recorded as Sl.

7. The intelligent circuit board quality detection system according to claim 1, characterized in that: The insulation performance analysis unit is used to establish an insulation performance analysis model, import the insulation performance data transmitted by the electrical performance parameter acquisition module into the insulation performance analysis model, and calculate the insulation index. The specific analysis formula is: in represents the surface resistivity of the mth circuit board, Represents the volume resistivity of the mth circuit board.

8. The intelligent circuit board quality detection system according to claim 1, characterized in that: The current load analysis unit is used to establish a current load analysis model, import the current load data transmitted by the electrical performance parameter acquisition module into the current load analysis model, and calculate the current load index. The specific analysis formula is Among them m Indicates the current value measured by the mth circuit board, Sl m Indicates the area through which the current of the mth circuit board flows, WL i Indicates the width of the i-th wire of the m-th circuit board, Wl min Indicates the minimum line width that can be connected to the circuit board.

9. The intelligent circuit board quality detection system according to claim 1, characterized in that: The circuit board electrical performance evaluation coefficient includes an insulation index and a current load index, and the specific analysis formula is: where ζ 1m represents the insulation index of the mth circuit board, ζ 2m Represents the current load index of the mth circuit board.

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