A chip inductor production line

Abstract

The present invention discloses a chip inductor production line, which relates to the field of chip inductor processing technology. The production line includes a skeleton feeding device, a winding device, a first clamping and transporting device, a second clamping and transporting device, a clamping and soldering device, a jig feeding device, a jig transporting device, and a jig moving device; a base feeding device and a base transporting device, the base transporting device being used to sequentially transport multiple bases on the base feeding device to a positioning jig on the jig moving device; a clamping and inserting device being used to respectively insert multiple skeletons into multiple bases on the positioning jig on the jig moving device; and a glue dripping device being used to sequentially drip glue onto the multiple bases on the positioning jig on the jig moving device, so that the multiple skeletons are respectively bonded to the multiple bases. The chip inductor production line eliminates the need for manual transfer, thereby improving the production efficiency of high-quality chip inductors.

Description

Technical Field

[0001] The present invention relates to the technical field of chip inductors, and in particular to a chip inductor production line. Background Art

[0002] Chip inductors are miniaturized electronic components primarily used for filtering, oscillation, and other functions in circuits. Their compact design achieves high inductance and low resistance, helping to stabilize circuit signals and provide the required frequency response. Due to their small size, easy installation, and stable performance, chip inductors are widely used in electronic devices. Chip inductors typically consist of a bobbin and a base. Their production typically requires winding, soldering, and assembly. In existing technology, operators first place the bobbin in a winding machine to wind the copper wire. After the winding process is complete, the bobbin is transferred to a soldering machine for soldering the pins. Finally, the operator inserts the soldered bobbin into the base, completing the chip inductor production. This method, which requires manual bobbin transfer and assembly, is slow and reduces chip inductor production efficiency. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a chip inductor production line that can improve the production efficiency of chip inductors.

[0004] A chip inductor production line according to an embodiment of the present invention includes:

[0005] A skeleton feeding device, wherein the skeleton feeding device is used to feed a plurality of skeletons;

[0006] A winding device, the winding device is arranged in front of the skeleton feeding device, and the winding device is used to wind a plurality of the skeletons;

[0007] a first clamping and transporting device, the first clamping and transporting device being used to clamp the plurality of skeletons on the skeleton feeding device and feed the plurality of skeletons into the winding device;

[0008] a second clamping and transporting device, the second clamping and transporting device being used to clamp the plurality of the skeletons on the winding device and transport the plurality of the skeletons from back to front;

[0009] A clamping and soldering device, the clamping and soldering device is arranged in front of the winding device, the clamping and soldering device is used to clamp the multiple skeletons on the second clamping and transporting device, and solder the multiple pins on the multiple skeletons;

[0010] A jig feeding device, a jig transporting device and a jig moving device, wherein the jig feeding device is used to supply a plurality of positioning jigs, the positioning jigs are used to position a plurality of bases, the jig transporting device is used to transport the positioning jigs on the jig feeding device to the jig moving device, and the jig moving device is used to move the positioning jigs from back to front;

[0011] A base feeding device and a base transporting device, wherein the base feeding device is used to supply a plurality of the bases, and the base transporting device is used to transport the plurality of bases on the base feeding device to the positioning jig on the jig moving device in sequence;

[0012] A clamping and inserting device, the clamping and inserting device is used to clamp the multiple skeletons on the clamping and soldering device and drive the multiple skeletons to move in the front-back direction, and respectively insert the multiple skeletons into the multiple bases on the positioning fixture on the fixture moving device;

[0013] A glue dripping device is provided in front of the clamping soldering device, and is used to drip glue to the multiple bases on the positioning jig on the jig moving device in sequence, so that the multiple skeletons are respectively bonded to the multiple bases. The jig transporting device is provided in front of the glue dripping device, so that the jig transporting device can move the positioning jig away from the jig moving device.

[0014] It has at least the following beneficial effects:

[0015] The skeleton feeding device is used to supply multiple skeletons. The first gripping and transporting device first moves to the skeleton feeding device and grips the multiple skeletons on it. The first gripping and transporting device then moves the multiple skeletons from back to front to the winding device, where they are fed into the winding device. The winding device then simultaneously winds the multiple skeletons. After the multiple skeletons are wound, the second gripping and transporting device moves to the winding device, gripping the multiple skeletons in the winding device and moving from back to front to the gripping and soldering device. The gripping and soldering device grips the multiple skeletons on the second gripping device and solders the pins on the multiple skeletons.

[0016] While the clamping and soldering device is soldering the skeleton pins, the jig feeding device is used to supply multiple positioning jigs, which are used to position multiple bases. The jig transporting device transports the positioning jig on the jig feeding device to the jig moving device, and then the jig moving device moves backward and drives the positioning jig to the unloading position of the base transporting device. The base transporting device transports the multiple bases on the base feeding device to the positioning jig on the jig moving device in sequence, so that multiple bases can be positioned on the positioning jig. After the clamping and soldering device completes soldering of the pins of the multiple skeletons, the clamping and inserting device clamps the multiple skeletons on the clamping and soldering device and moves them to the jig moving device, and then inserts the multiple skeletons into the multiple bases on the positioning jig on the jig moving device.

[0017] The jig moving device then drives the positioning jig from back to front, so that the multiple bases and multiple skeletons on the positioning jig move to the glue dispensing device. The jig moving device drives the positioning jig forward at a certain distance, so that the glue dispensing device can sequentially dispense glue to the multiple bases on the positioning jig, so that the multiple skeletons can be glued to the multiple bases respectively, thereby obtaining multiple chip inductors. The jig moving device continues to drive the positioning jig forward, so that the positioning jig and the multiple chip inductors on the positioning jig move to the jig moving device. The jig moving device removes the positioning jig from the jig moving device to complete the production process of multiple chip inductors. This chip inductor production line does not require manual transfer, thereby improving the production efficiency of high-end chip inductors.

[0018] According to an embodiment of the present invention, the chip inductor production line also includes a shaping device, which is arranged below the clamping and soldering device. The shaping device includes a support and multiple bending components. The multiple bending components are all arranged on the support, and the multiple bending components are respectively used to bend the multiple pins on the multiple skeletons clamped by the clamping and soldering device.

[0019] According to an embodiment of the present invention, the patch inductor production line, the bending assembly includes a special-shaped guide hole, a positioning column, an elastic member and a plurality of rolling wheels, the special-shaped guide hole is opened on the support, the positioning column is passed through the special-shaped guide hole, a plurality of avoidance grooves extending in the up and down directions are opened on the side wall of the positioning column, the upper end of the positioning column is opened with a first positioning groove connected with the plurality of avoidance grooves, the first positioning groove is used for one of the bodies of the skeleton clamped by the clamping soldering device to extend therein, so that the plurality of pins of the skeleton are respectively extended to the top of the plurality of avoidance grooves, the plurality of rolling wheels are rotatably connected to the support, the plurality of rolling wheels are respectively abutted against the inner walls of the plurality of avoidance grooves, the elastic member is provided in the special-shaped guide hole, the upper and lower ends of the elastic member are respectively abutted against the positioning column and the bottom wall of the special-shaped guide hole, so that the positioning column can descend and the plurality of rolling wheels can respectively bend the plurality of pins of the skeleton.

[0020] According to the chip inductor production line of an embodiment of the present invention, the shaping device further includes a shielding component, and the shielding component is used to shield the top of the multiple bending components.

[0021] According to the chip inductor production line of an embodiment of the present invention, the shielding assembly includes a shielding plate and a first linear drive member, the shielding plate is connected to the output end of the first linear drive member, and the first linear drive member can drive the shielding plate to move above the multiple bending assemblies so that the tin liquid dripping from the clamping soldering device can fall on the shielding plate.

[0022] According to the chip inductor production line of an embodiment of the present invention, the base conveying device includes a first base clamping assembly, a second base clamping assembly, a base positioning assembly and a first YZ-axis driving assembly, the first base clamping assembly is arranged to the right of the second base clamping assembly, the base positioning assembly is arranged below the first base clamping assembly and the second base clamping assembly, the base positioning assembly is used to position the base, and the first YZ-axis driving assembly is used to drive the first base clamping assembly and the second base clamping assembly to move in the left and right directions and the up and down directions, so that the second base clamping assembly conveys the base on the base feeding device to the base positioning assembly, and the first base clamping assembly conveys the base on the base positioning assembly to the positioning jig on the jig moving device.

[0023] According to the chip inductor production line of an embodiment of the present invention, the base positioning assembly includes a rotary clamping cylinder and four positioning blocks. The rotary clamping cylinder is used to drive the four positioning blocks to approach each other and drive the four positioning blocks to rotate, so that the four positioning blocks can clamp the base and drive the base to rotate.

[0024] According to the chip inductor production line of an embodiment of the present invention, the jig moving device includes a second X-axis drive assembly, a support plate and two positioning rods. Two positioning holes are provided on the bottom surface of the positioning jig. The two positioning rods are both provided on the support plate. The two positioning rods are respectively used to pass through the two positioning holes. The support plate is used to support the positioning jig. The second X-axis drive assembly is used to drive the support plate to move in the forward and backward directions.

[0025] According to the chip inductor production line of an embodiment of the present invention, a plurality of second positioning grooves distributed along the front-to-back direction are provided on the top surface of the positioning jig, and the second positioning grooves are used to accommodate the base. A clamping groove is provided on the side of the positioning jig, and the clamping groove is used for the output end of the jig handling device to extend into.

[0026] According to the chip inductor production line of an embodiment of the present invention, the clamping and soldering device includes a first XYZ-axis drive assembly, a tin melting furnace, a first rotary drive member and a plurality of third pneumatic clamps, the tin melting furnace is used to melt tin and store liquid tin, the third pneumatic clamps are used to clamp the skeleton, the first XYZ-axis drive assembly is used to drive the plurality of third pneumatic clamps to move in the front-to-back direction, the left-to-right direction and the up-down direction, the first rotary drive member is used to drive the plurality of third pneumatic clamps to rotate, so that the plurality of third pneumatic clamps can clamp the plurality of skeletons on the second clamping and transporting device, and the plurality of pins on the skeletons clamped by the plurality of third pneumatic clamps can extend into the liquid tin in the tin melting furnace.

[0027] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which:

[0029] Figure 1 This is a schematic structural diagram of the skeleton of an embodiment of the present invention;

[0030] Figure 2 This is a schematic structural diagram of a base according to an embodiment of the present invention;

[0031] Figure 3 This is a schematic diagram of the structure of a chip inductor production line according to an embodiment of the present invention;

[0032] Figure 4 This is a schematic structural diagram of a clamping and soldering device in a chip inductor production line according to an embodiment of the present invention;

[0033] Figure 5 for Figure 4 Schematic diagram of the local enlarged structure at A in the middle;

[0034] Figure 6 This is a schematic structural diagram of a shaping device in a chip inductor production line according to an embodiment of the present invention;

[0035] Figure 7 for Figure 6 Schematic diagram of the local enlarged structure at B in the middle;

[0036] Figure 8 This is a schematic structural diagram of a skeleton feeding device and a first clamping and transporting device in a chip inductor production line according to an embodiment of the present invention;

[0037] Figure 9 This is a schematic structural diagram of a winding device in a chip inductor production line according to an embodiment of the present invention;

[0038] Figure 10 This is a schematic structural diagram of a second clamping and handling device in a chip inductor production line according to an embodiment of the present invention;

[0039] Figure 11 This is a schematic structural diagram of a clamping and inserting device in a chip inductor production line according to an embodiment of the present invention;

[0040] Figure 12 This is a schematic structural diagram of a clamping and inserting device, a fixture moving device, a glue dispensing device, and a fixture transporting device in a chip inductor production line according to an embodiment of the present invention;

[0041] Figure 13 This is a schematic structural diagram of a base transport device in a chip inductor production line according to an embodiment of the present invention;

[0042] Figure 14 for Figure 13 Schematic diagram of the local enlarged structure at C in the middle;

[0043] Figure 15 This is a schematic diagram of the structure of a fixture moving device in a chip inductor production line according to an embodiment of the present invention;

[0044] Figure 16 This is a schematic structural diagram of a support plate in a chip inductor production line according to an embodiment of the present invention;

[0045] Figure 17 This is a schematic diagram of the structure of a positioning fixture in a chip inductor production line according to an embodiment of the present invention;

[0046] Reference numerals:

[0047] Skeleton feeding device 100; winding device 200;

[0048] Clamping soldering device 300; third pneumatic clamp 310; first XYZ axis drive assembly 320; first rotary drive member 330; tin melting furnace 340;

[0049] Shaping device 400; support 410; bending assembly 420; special-shaped guide hole 421; positioning column 422; avoidance groove 423; first positioning groove 424; elastic member 425; rolling wheel 426;

[0050] Jig feeding device 500; Jig transport device 600;

[0051] Fixture moving device 700; second X-axis driving assembly 710; support plate 720; positioning rod 730; positioning fixture 740; second positioning slot 741; clamping slot 742;

[0052] Base feeding device 800;

[0053] Base transport device 900; first base clamping assembly 910; second base clamping assembly 920; base positioning assembly 930; rotary clamping cylinder 931; positioning block 932; first YZ axis driving assembly 940;

[0054] Clamping and inserting device 1000; fourth pneumatic gripper 1010; second XYZ axis drive assembly 1020; second rotary drive member 1030;

[0055] Glue dispensing device 1100;

[0056] First gripping and transporting device 1200; first XY axis drive assembly 1210; skeleton positioning assembly 1220; first gripping manipulator 1230;

[0057] A second gripping and transporting device 1300 ; a second pneumatic gripper 1310 ; and a second XY-axis driving assembly 1320 . DETAILED DESCRIPTION

[0058] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0059] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0060] In the description of the present invention, "a plurality" refers to more than two. The use of "first" or "second" is solely for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of the indicated technical features, or implicitly indicating the order of the indicated technical features.

[0061] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0062] For convenience of explanation, in the present invention, the Z axis is parallel to the up-down direction, the X axis is parallel to the front-back direction, and the Y axis is parallel to the left-right direction.

[0063] refer to Figures 1 to 3 According to an embodiment of the present invention, a chip inductor production line includes:

[0064] The skeleton feeding device 100 is used to feed a plurality of skeletons;

[0065] The winding device 200 is provided in front of the skeleton feeding device 100 and is used to wind a plurality of skeletons;

[0066] The first clamping and transporting device 1200 is used to clamp the multiple skeletons on the skeleton feeding device 100 and feed the multiple skeletons into the winding device 200;

[0067] The second clamping and transporting device 1300 is used to clamp the multiple skeletons on the winding device 200 and transport the multiple skeletons from the back to the front;

[0068] The clamping and soldering device 300 is provided in front of the winding device 200. The clamping and soldering device 300 is used to clamp the multiple frames on the second clamping and transporting device 1300 and solder the multiple pins on the multiple frames;

[0069] A jig feeding device 500, a jig transporting device 600, and a jig moving device 700. The jig feeding device 500 is used to supply multiple positioning jigs 740. The positioning jigs 740 are used to position multiple bases. The jig transporting device 600 is used to transport the positioning jigs 740 on the jig feeding device 500 to the jig moving device 700. The jig moving device 700 is used to move the positioning jigs 740 from back to front.

[0070] A base feeding device 800 and a base transporting device 900, wherein the base feeding device 800 is used to supply a plurality of bases, and the base transporting device 900 is used to sequentially transport the plurality of bases on the base feeding device 800 to the positioning fixture 740 on the fixture moving device 700;

[0071] The clamping and inserting device 1000 is used to clamp the multiple frames on the soldering device 300 and drive the multiple frames to move in the front-to-back direction, and respectively insert the multiple frames into the multiple bases on the positioning fixture 740 on the fixture moving device 700;

[0072] The glue dripping device 1100 is arranged in front of the clamping soldering device 300. The glue dripping device 1100 is used to drip glue on multiple bases on the positioning jig 740 on the jig moving device 700 in sequence, so that the multiple skeletons are respectively bonded to the multiple bases. The jig conveying device 600 is arranged in front of the glue dripping device 1100, so that the jig conveying device 600 can move the positioning jig 740 away from the jig moving device 700.

[0073] It can be understood that the workflow of the chip inductor production line of the embodiment of the present invention is as follows: the skeleton feeding device 100 is used to supply multiple skeletons, the first clamping and transporting device 1200 first moves to the skeleton feeding device 100 and clamps the multiple skeletons on the skeleton feeding device 100, then the first clamping and transporting device 1200 drives the multiple skeletons from back to front to move to the winding device 200, and feeds the multiple skeletons into the winding device 200. The winding device 200 then performs winding processing on the multiple skeletons at the same time. After the winding of the multiple skeletons is completed, the second clamping and transporting device 1300 moves to the winding device 200, the second clamping and transporting device 1300 clamps the multiple skeletons in the winding device 200 and moves from back to front to the clamping and soldering device 300. The clamping and soldering device 300 clamps the multiple skeletons on the second clamping device and solders the pins on the multiple skeletons.

[0074] While the soldering device 300 is holding and soldering the skeleton pins, the jig feeding device 500 is used to supply multiple positioning jigs 740. The positioning jigs 740 are used to position multiple bases. The jig transporting device 600 transports the positioning jigs 740 from the jig feeding device 500 to the jig moving device 700. The jig moving device 700 then moves backward and drives the positioning jigs 740 to the unloading position of the base transporting device 900. The base transporting device 900 sequentially transports multiple bases from the base feeding device 800 to the positioning jigs 740 on the jig moving device 700, allowing multiple bases to be positioned on the positioning jigs 740. After the clamping and soldering device 300 completes soldering of the pins of multiple skeletons, the clamping and inserting device 1000 clamps the multiple skeletons on the clamping and soldering device 300 and moves them to the jig moving device 700, and then inserts the multiple skeletons into the multiple bases on the positioning jig 740 on the jig moving device 700.

[0075] Then, the jig moving device 700 drives the positioning jig 740 to move from back to front, so that the multiple bases and multiple skeletons on the positioning jig 740 move to the glue dripping device 1100. The jig moving device 700 drives the positioning jig 740 forward at a certain distance, so that the glue dripping device 1100 can drip glue on the multiple bases on the positioning jig 740 in turn, so that the multiple skeletons can be glued to the multiple bases respectively through glue, thereby obtaining multiple chip inductors. The jig moving device 700 continues to drive the positioning jig 740 forward, so that the positioning jig 740 and the multiple chip inductors on the positioning jig 740 move to the jig moving device 700. The jig moving device 700 removes the positioning jig 740 from the jig moving device 700 to complete the production process of multiple chip inductors. This chip inductor production line does not require manual transfer, thereby improving the production efficiency of high-quality chip inductors.

[0076] refer to Figure 4 and Figure 5 The clamping soldering device 300 includes a first XYZ-axis drive assembly 320, a tin melting furnace 340, a first rotary drive member 330 and a plurality of third pneumatic clamps 310. The tin melting furnace 340 is used to melt tin and store liquid tin. The third pneumatic clamps 310 are used to clamp the skeleton. The first XYZ-axis drive assembly 320 is used to drive the plurality of third pneumatic clamps 310 to move in the front-to-back direction, the left-to-right direction and the up-down direction. The first rotary drive member 330 is used to drive the plurality of third pneumatic clamps 310 to rotate so that the plurality of third pneumatic clamps 310 can clamp the plurality of skeletons on the second clamping and transporting device 1300, and enable the plurality of pins on the skeletons clamped by the plurality of third pneumatic clamps 310 to extend into the liquid tin in the tin melting furnace 340.

[0077] It should be explained that the reference Figure 1The skeleton consists of a body and multiple pins, which are connected to the body. The pins on the skeleton are usually long. If they are directly installed in the base, they may interfere with the base due to their excessive length, affecting the stability of the entire chip inductor.

[0078] refer to Figure 6 and Figure 7 The chip inductor production line also includes a shaping device 400, which is arranged below the clamping and soldering device 300. The shaping device 400 includes a support 410 and a plurality of bending components 420. The plurality of bending components 420 are all arranged on the support 410. The plurality of bending components 420 are respectively used to bend the plurality of pins on the plurality of skeletons clamped by the clamping and soldering device 300.

[0079] Specifically, refer to Figure 6 and Figure 7 The bending assembly 420 includes a special-shaped guide hole 421, a positioning column 422, an elastic member 425 and a plurality of rolling wheels 426. The special-shaped guide hole 421 is opened on the support 410, and the positioning column 422 is inserted into the special-shaped guide hole 421. The side wall of the positioning column 422 is provided with a plurality of avoidance grooves 423 extending in the up-down direction. The upper end of the positioning column 422 is provided with a first positioning groove 424 connected to the plurality of avoidance grooves 423. The first positioning groove 424 is used for clamping the soldering device 300. The body of a skeleton is extended so that multiple pins of the skeleton are respectively extended to the top of multiple avoidance grooves 423, and multiple rolling wheels 426 are rotatably connected to the support 410. Multiple rolling wheels 426 are respectively abutted against the inner walls of multiple avoidance grooves 423. The elastic member 425 is provided in the special-shaped guide hole 421. The upper and lower ends of the elastic member 425 are respectively abutted against the positioning column 422 and the bottom wall of the special-shaped guide hole 421, so that the positioning column 422 can be lowered and the multiple rolling wheels 426 can bend the multiple pins of the skeleton respectively.

[0080] Understandably, the reference Figures 4 to 7After the tin liquid on the skeleton pins clamped by the multiple third pneumatic clamps 310 solidifies, the first rotary drive component 330 drives the multiple third pneumatic clamps 310 to rotate, so that the skeletons clamped by the multiple third pneumatic clamps 310 face downward. Then the first XYZ axis drive component 320 drives the multiple third pneumatic clamps 310 to move in the left and right directions, so that the multiple skeletons are respectively aligned with the multiple bending components 420. Here, the bending process of one of the skeletons is explained. After the skeleton is aligned with the positioning column 422 in the bending component 420, the first XYZ axis drive component 320 drives the multiple third pneumatic clamps 310 to descend, so that the skeleton body clamped by the third pneumatic clamps 310 can extend into the first positioning groove 424 at the upper end of the positioning column 422. Under the positioning action of the third pneumatic clamps 310 and the first positioning groove 424, the multiple pins on the skeleton extend to the top of the multiple avoidance grooves 423 respectively. The first XYZ-axis drive assembly 320 continues to drive the multiple third pneumatic grippers 310 downward. Under the downward thrust of the third pneumatic grippers 310, the elastic member 425 compresses, causing the positioning post 422 and the frame mounted on it to descend. Because the multiple rolling wheels 426 abut the inner walls of the multiple avoidance grooves 423, as the positioning post 422 descends, the multiple rolling wheels 426 press against the multiple pins on the frame, gradually bending the pins and completing the pin bending step. This bending allows for smooth subsequent frame assembly.

[0081] As an embodiment of the present invention, the shaping device 400 further includes a shielding assembly, which is used to shield the top of the multiple bending assemblies 420. Specifically, the shielding assembly includes a shielding plate and a first linear drive member, and the shielding plate is connected to the output end of the first linear drive member. The first linear drive member can drive the shielding plate to move above the multiple bending assemblies 420 so that the tin liquid dripping from the clamping soldering device 300 can fall on the shielding plate. It can be understood that the first XYZ-axis drive assembly 320 and the first rotary drive are used to drive the multiple third pneumatic clamps 310 to rotate and move, so that the multiple pins on the skeleton clamped by the multiple third pneumatic clamps 310 can extend into the tin melting furnace 340, so that the pins on the multiple skeletons are all covered with unsolidified tin liquid. While waiting for the tin liquid to solidify, the first linear drive component drives the shielding plate to move above the multiple bending components 420. The unsolidified tin liquid may fall. Under the shielding effect of the shielding plate, the fallen tin liquid can only fall onto the shielding plate, preventing the tin liquid from falling onto the bending component 420 and causing the bending component 420 to fail.

[0082] As an embodiment of the present invention, the clamping soldering device 300 further includes a tin scraping assembly, which is used to scrape off the tin crust on the surface of the liquid tin in the tin melting furnace 340. It is understood that the tin scraping assembly is used to scrape off the tin crust on the surface of the liquid tin in the tin melting furnace 340, so as to scrape the tin crust to one side of the molten tin or outside the tin melting furnace 340, thereby preventing the skeleton pins from contacting the tin crust, so that the tin liquid can more easily adhere to the skeleton pins.

[0083] As an embodiment of the present invention, the clamping and soldering device 300 further includes a cooling assembly for reducing the temperature of the molten tin attached to the frame pins to accelerate solidification of the molten tin attached to the frame pins. It is understood that by providing a cooling assembly, the solidification of the molten tin on the frame pins can be accelerated, preventing unsolidified molten tin from affecting subsequent insertion processing, thereby improving the yield rate of the chip inductor. The cooling assembly can be a downward-blowing air cooler, and the air blown out can be directed toward the frame on the plurality of third pneumatic clamps 310.

[0084] refer to Figure 10 The second clamping and handling device 1300 includes a second XY-axis drive assembly 1320 and a plurality of second pneumatic grippers 1310. It is understood that after the frame is wound, the second XY-axis drive assembly 1320 can drive the plurality of second pneumatic grippers 1310 to move backward to the winding device 200. The second XY-axis drive assembly 1320 then drives the plurality of second pneumatic grippers 1310 to extend leftward into the winding device 200, so that the plurality of second pneumatic grippers 1310 each grip the wound frame. The second XY-axis drive assembly 1320 then drives the plurality of second pneumatic grippers 1310 forward to the clamping and soldering device 300, and drives the plurality of second pneumatic grippers 1310 to move leftward toward the clamping and soldering device 300. The plurality of third pneumatic grippers 310 in the clamping and soldering device 300 then grip the frame held by the plurality of second pneumatic grippers and perform soldering.

[0085] refer to Figure 11The clamping and inserting device 1000 includes a second XYZ-axis drive assembly 1020, a second rotary drive member 1030, and a plurality of fourth pneumatic grippers 1010. The second XYZ-axis drive assembly 1020 is used to drive the plurality of fourth pneumatic grippers to move in the front-to-back direction, the left-to-right direction, and the up-to-down direction. After the plurality of skeletons clamped by the clamping and soldering device 300 are soldered and shaped, the second XYZ-axis drive assembly 1020 drives the plurality of fourth pneumatic grippers to move backward to the clamping and soldering device 300. Then, the second rotary drive member 1030 drives the plurality of fourth pneumatic grippers 1010 to rotate to adjust the posture of the plurality of fourth pneumatic grippers 1010. The second XYZ-axis drive assembly 1020 drives the plurality of fourth pneumatic grippers to move leftward close to the plurality of third pneumatic grippers 310 in the clamping and soldering device 300, so that the plurality of fourth pneumatic grippers can respectively clamp the skeletons on the plurality of third pneumatic grippers. After the base transporting device 900 transports the multiple bases on the base feeding device 800 to the positioning fixture 740 on the fixture moving device 700, the second XYZ axis driving assembly 1020 drives the multiple fourth pneumatic clamps to move forward to the positioning fixture 740 on the fixture moving device 700.

[0086] Next, the second rotary drive 1030 drives the plurality of fourth pneumatic grippers 1010 to rotate, and the second XYZ-axis drive assembly 1020 drives the plurality of fourth pneumatic grippers 1010 to move, so that the skeletons held by the plurality of fourth pneumatic grippers 1010 face downward and move above the positioning jig 740 on the jig moving device 700. Finally, the second XYZ-axis drive assembly 1020 drives the plurality of fourth pneumatic grippers 1010 to descend, allowing the plurality of fourth pneumatic grippers 1010 to insert the plurality of skeletons into the plurality of bases on the positioning jig 740.

[0087] In the present invention, reference is made to Figure 8 and Figure 9The first clamping and transporting device 1200 is used to transport the skeleton back and forth between the skeleton feeding device 100 and the winding device 200, and the second clamping and transporting device 1300 is used to transport the skeleton back and forth between the winding device 200 and the clamping and soldering device 300. In an embodiment of the present invention, the skeleton feeding device 100 can be a first circular vibration feeder and a first linear vibration feeder for the skeleton. The first clamping and transporting device 1200 includes a first XY-axis driving assembly 1210, a first clamping manipulator 1230, and a plurality of skeleton positioning assemblies 1220. The plurality of skeleton positioning assemblies 1220 are distributed along the front-to-back direction. The plurality of skeleton positioning assemblies 1220 are respectively used to accommodate and position the skeleton. The first XY-axis driving assembly 1210 is used to drive the plurality of skeleton positioning assemblies 1220 to move along the front-to-back direction and the left-to-right direction. The first circular vibration feeder and the first linear vibration feeder form a combination to accommodate and transport the skeleton. The first clamping manipulator 1230 can sequentially carry the skeleton at the discharge end of the first linear vibration feeder to the multiple skeleton positioning assemblies 1220, so that the multiple skeletons are arranged in the front-to-back direction. Then the first XY axis drive assembly 1210 can drive the multiple skeleton positioning assemblies 1220 to move forward to the clamping soldering device 300, and drive the multiple skeleton positioning assemblies 1220 to move to the left and extend into the winding device 200. The winding device 200 is also provided with multiple pneumatic clamps. The multiple pneumatic clamps in the winding device 200 can respectively clamp the skeletons on the multiple skeleton positioning assemblies 1220 and wind the skeletons. In the embodiment of the present invention, the winding device 200 is a common copper wire winding device and will not be further discussed here.

[0088] refer to Figures 15 to 17 The jig moving device 700 includes a second X-axis drive assembly 710, a support plate 720, and two positioning rods 730. Two positioning holes are provided on the bottom surface of the positioning jig 740. The two positioning rods 730 are both provided on the support plate 720. The two positioning rods 730 are respectively used to pass through the two positioning holes. The support plate 720 is used to support the positioning jig 740. The second X-axis drive assembly 710 is used to drive the support plate 720 to move in the front-to-back direction. A plurality of second positioning grooves 741 distributed in the front-to-back direction are provided on the top surface of the positioning jig 740. The second positioning grooves 741 are used to accommodate the base. A clamping groove 742 is provided on the side of the positioning jig 740. The clamping groove 742 is used to allow the output end of the jig transport device 600 to extend into.

[0089] It is understood that the second X-axis drive assembly 710 first drives the support plate 720 to move forward to the jig transport device 600. The jig transport device 600 transports the positioning jig 740 from the jig feeding device 500 to the support plate 720, so that the two positioning rods 730 on the support plate 720 are respectively inserted into the two positioning holes on the positioning jig 740, and the support plate 720 supports the positioning jig 740. The second X-axis drive assembly 710 then drives the support plate 720 to move backward to the base transport device 900. The second X-axis drive assembly 710 drives the support plate 720 and the positioning jig 740 to move forward a certain distance each time, so that the base transport device 900 can sequentially transport multiple bases on the base feeding device 800 to the multiple second positioning slots 741 on the positioning jig 740. Then the second X-axis drive assembly 710 stops driving the support plate 720 and the positioning fixture 740 to move, and the two XYZ-axis drive assemblies in the clamping and insertion device 1000 drive the multiple fourth pneumatic clamps 1010 to move forward to the support plate 720, so that the multiple fourth pneumatic clamps 1010 in the clamping and insertion device 1000 can respectively insert the multiple skeletons into the multiple bases on the positioning fixture 740.

[0090] After the skeleton is installed, refer to Figure 12 The second X-axis drive assembly 710 drives the support plate 720 and the positioning jig 740 forward to the glue dispensing device 1100. The second X-axis drive assembly 710 then drives the support plate 720 and the positioning jig 740 forward a certain distance each time, allowing the glue dispensing device 1100 to sequentially dispense glue onto the multiple bases on the positioning jig 740. Multiple skeletons are bonded to the multiple bases, resulting in multiple chip inductors. Finally, the second X-axis drive assembly 710 continues to drive the support plate 720 and the positioning jig 740 forward to the jig transport device 600. The jig transport device 600 removes the positioning jig 740 and the multiple chip inductors on the positioning jig 740 from the support plate 720, completing the production of a batch of chip inductors.

[0091] In an embodiment of the present invention, the jig feeding device 500 can be a second linear vibration feeder, which is used to transport multiple positioning jigs 740, and the jig transporting device 600 can be a second clamping robot. The second clamping robot extends its clamping end into the clamping groove 742 on the side of the positioning jig 740 on the second linear vibration feeder, so that the second clamping robot can stably clamp the positioning jig 740. The second clamping robot then transports the positioning jig 740 to the support plate 720 in the jig moving device 700. After the glue is applied, the second clamping robot removes the positioning jig 740 from the support plate 720.

[0092] refer to Figure 13 and Figure 14The base transport device 900 includes a first base clamping assembly 910, a second base clamping assembly 920, a base positioning assembly 930 and a first YZ-axis driving assembly 940. The first base clamping assembly 910 is arranged to the right of the second base clamping assembly 920, and the base positioning assembly 930 is arranged below the first base clamping assembly 910 and the second base clamping assembly 920. The base positioning assembly 930 is used to position the base, and the first YZ-axis driving assembly 940 is used to drive the first base clamping assembly 910 and the second base clamping assembly 920 to move in the left and right directions and the up and down directions, so that the second base clamping assembly 920 transports the base on the base feeding device 800 to the base positioning assembly 930, and the first base clamping assembly 910 transports the base on the base positioning assembly 930 to the positioning fixture 740 on the fixture moving device 700.

[0093] It is understood that first, the jig moving device 700 drives the positioning jig 740 to move backward to the first YZ-axis drive assembly 940. The first YZ-axis drive assembly 940 drives the first base clamping assembly 910 and the second base clamping assembly 920 to move leftward, so that the first base clamping assembly 910 moves above the base positioning assembly 930 and the second base clamping assembly 920 moves above the base feeding device 800. Then, the first YZ-axis drive assembly 940 drives the first base clamping assembly 910 and the second base clamping assembly 920 to descend, so that the first base clamping assembly 910 clamps the base on the base positioning assembly 930 and the second base clamping assembly 920 clamps the base on the base feeding device 800. Next, the first YZ-axis drive assembly 940 drives the first base clamping assembly 910 and the second base clamping assembly 920 to rise and then move to the right, so that the first base clamping assembly 910 moves above the positioning fixture 740 on the fixture moving device 700, and the second base clamping assembly 920 moves above the base positioning assembly 930. Next, the first YZ-axis drive assembly 940 drives the first base clamping assembly 910 and the second base clamping assembly 920 to descend, so that the first base clamping assembly 910 moves the base into the positioning slot on the positioning fixture 740, and the second base clamping assembly 920 moves the base onto the base positioning assembly 930.

[0094] By repeating the above process, the second base clamping assembly 920 can continuously transfer the bases on the base feeding device 800 to the base positioning assembly 930. Under the action of the jig moving device 700 driving the positioning jig 740, the first base clamping assembly 910 can continuously transfer the bases on the base positioning assembly 930 to the multiple positioning slots on the positioning jig 740. It is not difficult to understand that by providing the first base clamping assembly 910 and the second base clamping assembly 920, the time required to transfer multiple bases to the multiple positioning slots on the positioning jig 740 is shortened, thereby facilitating improved production efficiency of chip inductors.

[0095] refer to Figure 13 and Figure 14 The base positioning assembly 930 includes a rotary clamping cylinder 931 and four positioning blocks 932. The rotary clamping cylinder 931 is used to drive the four positioning blocks 932 closer to each other and drive the four positioning blocks 932 to rotate, so that the four positioning blocks 932 can clamp the base and drive the base to rotate. It can be understood that the gap between the four positioning blocks 932 is used to accommodate the base. The rotary clamping cylinder 931 first drives the four positioning blocks 932 away from each other, and the second base clamping assembly 920 moves the base between the four positioning blocks 932. Then the rotary clamping cylinder 931 drives the four positioning blocks 932 closer to each other, so that the four positioning blocks 932 clamp the base to complete the positioning of the base, so that the first base clamping assembly 910 can accurately clamp the base. Then, the rotating clamping cylinder 931 drives the four positioning blocks 932 and the base clamped by the four positioning blocks 932 to rotate, so as to adjust the posture of the base so that the subsequent skeleton pins can be accurately inserted into the base.

[0096] The side walls of the base are provided with pin grooves for receiving the pins of the frame. In the embodiment of the present invention, the base is rotated by rotating the clamping cylinder 931 so that the base is in the correct posture so that the pins of the frame can be directly inserted into the pin grooves during the subsequent frame insertion process.

[0097] In an embodiment of the present invention, the base feeding device 800 can be a third straight vibration feeder and a third circular vibration feeder. The third circular vibration feeder and the third straight vibration feeder form a combination to accommodate and transport the base. The second base clamping assembly 920 can transport the base at the discharge end of the third straight vibration feeder to the base positioning assembly 930. The glue dripping device 1100 is a needle tube glue dripping device 1100. The glue dripping device 1100 includes a syringe and an air pump. Glue is stored in the syringe, and the air pump is connected to the syringe through an air pipe. When the air pump is started, the glue in the syringe flows from the needle on the syringe under the action of air pressure. The needle is aligned with the gap between the base and the skeleton on the positioning fixture 740, so that the glue flows through the needle into the gap between the base and the skeleton, thereby bonding the skeleton to the base.

[0098] In an embodiment of the present invention, the first base clamping assembly 910, the second base clamping assembly 920, the first clamping robot 1230 and the second clamping robot all include a clamping cylinder and a plurality of clamping claws. The clamping cylinder drives the plurality of clamping claws to approach each other, thereby completing the clamping of the skeleton, the base and the positioning fixture 740. No further details will be given here.

[0099] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0100] Of course, the present invention is not limited to the above-mentioned embodiments. Those skilled in the art may make equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A chip inductor production line, characterized in that: include: A skeleton feeding device, wherein the skeleton feeding device is used to feed a plurality of skeletons; A winding device, the winding device is arranged in front of the skeleton feeding device, and the winding device is used to wind a plurality of the skeletons; a first clamping and transporting device, the first clamping and transporting device being used to clamp the plurality of skeletons on the skeleton feeding device and feed the plurality of skeletons into the winding device; a second clamping and transporting device, the second clamping and transporting device being used to clamp the plurality of the skeletons on the winding device and transport the plurality of the skeletons from back to front; A clamping and soldering device, the clamping and soldering device is arranged in front of the winding device, the clamping and soldering device is used to clamp the multiple skeletons on the second clamping and transporting device, and solder the multiple pins on the multiple skeletons; A jig feeding device, a jig transporting device and a jig moving device, wherein the jig feeding device is used to supply a plurality of positioning jigs, the positioning jigs are used to position a plurality of bases, the jig transporting device is used to transport the positioning jigs on the jig feeding device to the jig moving device, and the jig moving device is used to move the positioning jigs from back to front; A base feeding device and a base transporting device, wherein the base feeding device is used to supply a plurality of the bases, and the base transporting device is used to transport the plurality of bases on the base feeding device to the positioning jig on the jig moving device in sequence; A clamping and inserting device, the clamping and inserting device is used to clamp the multiple skeletons on the clamping and soldering device and drive the multiple skeletons to move in the front-back direction, and respectively insert the multiple skeletons into the multiple bases on the positioning fixture on the fixture moving device; A glue dripping device is provided in front of the clamping soldering device, and is used to drip glue to the multiple bases on the positioning jig on the jig moving device in sequence, so that the multiple skeletons are respectively bonded to the multiple bases. The jig transporting device is provided in front of the glue dripping device, so that the jig transporting device can move the positioning jig away from the jig moving device.

2. The chip inductor production line according to claim 1, characterized in that: It also includes a shaping device, which is arranged below the clamping and soldering device. The shaping device includes a support and multiple bending components. The multiple bending components are all arranged on the support, and the multiple bending components are respectively used to bend the multiple pins on the multiple skeletons clamped by the clamping and soldering device.

3. The chip inductor production line according to claim 2, characterized in that: The cam is secured to a position 520° and has a locking plate, the cam being secured to a location where the cam is secured to a position 540° and a position 550° from the center of the support frame. The cam is secured to a location where the cam is secured to a position 540° and a position 550° from the center of the support frame. The cam is secured to a location where the cam is secured to a position 540° and a position 550° from the center of the support frame.

4. The chip inductor production line according to claim 2, characterized in that: The shaping device further comprises a shielding component, which is used to shield the top of the plurality of bending components.

5. The chip inductor production line according to claim 4, characterized in that: The shielding assembly includes a shielding plate and a first linear drive member, the shielding plate is connected to the output end of the first linear drive member, and the first linear drive member can drive the shielding plate to move above the multiple bending assemblies so that the tin liquid dripping from the clamping soldering device can fall on the shielding plate.

6. The chip inductor production line according to claim 1, characterized in that: The base conveying device includes a first base clamping assembly, a second base clamping assembly, a base positioning assembly and a first YZ-axis driving assembly. The first base clamping assembly is arranged to the right of the second base clamping assembly, and the base positioning assembly is arranged below the first base clamping assembly and the second base clamping assembly. The base positioning assembly is used to position the base, and the first YZ-axis driving assembly is used to drive the first base clamping assembly and the second base clamping assembly to move in the left and right directions and the up and down directions, so that the second base clamping assembly conveys the base on the base feeding device to the base positioning assembly, and the first base clamping assembly conveys the base on the base positioning assembly to the positioning jig on the jig moving device.

7. The chip inductor production line according to claim 6, characterized in that: The base positioning assembly includes a rotary clamping cylinder and four positioning blocks. The rotary clamping cylinder is used to drive the four positioning blocks to approach each other and drive the four positioning blocks to rotate, so that the four positioning blocks can clamp the base and drive the base to rotate.

8. The chip inductor production line according to claim 1, characterized in that: The jig moving device includes a second X-axis drive assembly, a support plate and two positioning rods. Two positioning holes are provided on the bottom surface of the positioning jig. The two positioning rods are both provided on the support plate. The two positioning rods are respectively used to pass through the two positioning holes. The support plate is used to support the positioning jig. The second X-axis drive assembly is used to drive the support plate to move in the front and rear directions.

9. The chip inductor production line according to claim 8, characterized in that: A plurality of second positioning grooves distributed along the front-to-back direction are provided on the top surface of the positioning jig, and the second positioning grooves are used to accommodate the base. A clamping groove is provided on the side of the positioning jig, and the clamping groove is used for the output end of the jig transport device to extend into.

10. The chip inductor production line according to claim 1, characterized in that: The clamping and soldering device includes a first XYZ-axis drive assembly, a tin melting furnace, a first rotary drive member and a plurality of third pneumatic clamps. The tin melting furnace is used to melt tin and store liquid tin. The third pneumatic clamps are used to clamp the skeleton. The first XYZ-axis drive assembly is used to drive the plurality of third pneumatic clamps to move in the front-to-back direction, the left-to-right direction and the up-down direction. The first rotary drive member is used to drive the plurality of third pneumatic clamps to rotate so that the plurality of third pneumatic clamps can clamp the plurality of skeletons on the second clamping and transporting device, and the plurality of pins on the skeletons clamped by the plurality of third pneumatic clamps can extend into the liquid tin in the tin melting furnace.

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