IC substrate BGA solder ball flattening machine

Abstract

The present invention discloses an IC substrate BGA solder ball flattening machine, comprising a frame, a loading and unloading magazine positioning mechanism, a substrate loading and unloading mechanism, a transfer manipulator mechanism, a first flattening and loading and unloading transport mechanism, a first CCD detection and alignment mechanism, and a solder ball heating and flattening mechanism. The present invention features a rational structural design and can perform a series of automated operations, including automatic substrate loading, automatic solder ball position detection, automatic hot pressing and flattening of solder balls, and automatic unloading of substrates into magazines. The machine operates stably and reliably, with a high degree of automation, improving the yield rate and production efficiency of the production process, reducing production costs, and ensuring high-precision production requirements.

Description

Technical Field

[0001] The present invention relates to the technical field of IC substrate processing equipment, and more particularly to an IC substrate BGA solder ball flattening machine. Background Art

[0002] IC substrates have evolved with the continuous advancement of semiconductor packaging technology. In high-end packaging, IC substrates not only provide support, heat dissipation, and protection for the chip, but also provide the electronic connection between the chip and the PCB motherboard, playing a bridging role. The rapid development of new packaging technologies such as BGA, CSP, and FC has placed higher demands on the line width, line spacing, and through-hole characteristics of the packaging substrate. Previous low- and mid-range wire-bonded substrates have been gradually replaced by high-end flip-chip substrates, and then evolved from wire bonding to solder ball through-holes. Solder ball diameters have also increased from over 100 microns to the current 40-60 microns, with a high-precision pitch of 60-80 microns. To ensure reliable connectivity between each IO on the chip and substrate within the package and to prevent inter-connection between adjacent IOs, higher requirements have been placed on the overall flatness and height of the solder balls on the chip and substrate after ball implantation. However, existing solder ball leveling methods, such as those disclosed in Taiwan Patent No. I223373, typically require a flip chip substrate to first pass through a reflow furnace to form solder ball bumps. A metal weight is then applied to the flip chip substrate with a force of nearly 1,500 kg to level the solder ball bumps. However, this method can easily damage the flip chip substrate during the pressure application process and cannot guarantee the required precision, resulting in a high scrap rate, low yield, and high costs. Summary of the Invention

[0003] The purpose of the present invention is to overcome the above-mentioned defects in the prior art and provide an IC substrate BGA solder ball flattening machine that can complete a series of automated operations such as automatic loading of the substrate, automatic detection of the solder ball position, automatic hot pressing and flattening of the solder balls, and automatic unloading of the substrate into a box, and can solve the difficult problem of solder ball flatness requirements in IC chip and substrate packaging.

[0004] To achieve the above-mentioned purpose, the present invention provides an IC carrier BGA solder ball flattening machine, comprising a frame, an upper and lower material box positioning mechanism for layering and positioning a loading magazine box filled with IC carriers and an empty unloading magazine box, a carrier board in-and-out box conveying mechanism for taking out the IC carrier board in the loading magazine box and sending the flattened IC carrier board into the unloading magazine box, a transfer robot mechanism for transporting the IC carrier board taken out by the carrier board in-and-out box conveying mechanism to a first flattening in-and-out material transport mechanism and transporting the IC carrier board outputted by the first flattening in-and-out material transport mechanism back to the carrier board in-and-out box conveying mechanism, a transfer robot mechanism for transporting the IC carrier board to the flattening station of the solder ball heating and flattening mechanism and outputting the flattened IC carrier board to the solder ball heating and flattening mechanism. The first flattening feed-in and feed-out transport mechanism outside the flattening mechanism, the first CCD detection alignment mechanism for target alignment of the IC carrier conveyed by the first flattening feed-in and feed-out transport mechanism, and the solder ball heating and flattening mechanism for flattening the solder balls on the IC carrier, the upper and lower material box positioning mechanism, the carrier feed-in and feed-out box conveying mechanism, the first flattening feed-in and feed-out transport mechanism and the solder ball heating and flattening mechanism are arranged in sequence inside the frame, one end of the first flattening feed-in and feed-out transport mechanism extends into the interior of the solder ball heating and flattening mechanism, the transfer robot mechanism is installed above the carrier feed-in and feed-out box conveying mechanism and the first flattening feed-in and feed-out transport mechanism, and the first CCD detection alignment mechanism is installed above the first flattening feed-in and feed-out transport mechanism.

[0005] Preferably, the flattening machine also includes a flattening station for conveying another IC carrier to the solder ball heating and flattening mechanism and a second flattening feed and discharge transport mechanism for outputting the flattened another IC carrier to the outside of the solder ball heating and flattening mechanism, and a second CCD detection alignment mechanism for target alignment of the another IC carrier conveyed by the second flattening feed and discharge transport mechanism. The second flattening feed and discharge transport mechanism and the second CCD detection alignment mechanism are respectively installed inside the frame. The direction of the second flattening feed and discharge transport mechanism is perpendicular to that of the first flattening feed and discharge transport mechanism. One end of the second flattening feed and discharge transport mechanism extends into the interior of the solder ball heating and flattening mechanism. The second CCD detection alignment mechanism is located above the second flattening feed and discharge transport mechanism.

[0006] Compared with the prior art, the present invention has the following beneficial effects:

[0007] 1. The structural design of the present invention is reasonable, and can complete a series of automated operations such as automatic loading of carrier boards, automatic detection of solder ball positions, automatic hot pressing and leveling of solder balls, and automatic unloading of carrier boards into boxes. It has stable and reliable operation and a high degree of automation, which can improve the yield rate and production efficiency of the production process, reduce production costs, and meet high-precision production requirements.

[0008] 2. The present invention can automatically adjust the width and can adapt to a variety of carriers of different sizes. It can also be equipped with a second flattening feed and discharge transport mechanism and a second CCD detection and alignment mechanism. The second flattening feed and discharge transport mechanism can transport large-size carriers that cannot be accommodated by the magazine-type magazine, which greatly improves the compatibility or flexibility of the machine and has high production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 This is a schematic diagram of the structure of the IC substrate BGA solder ball flattening machine;

[0010] Figure 2 This is a schematic diagram of the internal structure of the IC substrate BGA solder ball flattening machine;

[0011] Figure 3 This is the structural diagram of the positioning mechanism of the loading and unloading material box Figure 1 ;

[0012] Figure 4 This is the structural diagram of the positioning mechanism of the loading and unloading material box Figure 2 ;

[0013] Figure 5 It is a structural diagram of the mechanism for transporting the carrier in and out of the box;

[0014] Figure 6 It is a structural diagram of the in-and-out material handling plate, the material handling plate moving drive device and the material clamp;

[0015] Figure 7 It is a structural diagram of the guide limit plate and the limit plate spacing adjustment device;

[0016] Figure 8 It is a structural diagram of the transfer manipulator mechanism;

[0017] Figure 9 It is a structural diagram of the gripping plate portion of the transfer manipulator mechanism;

[0018] Figure 10 It is a structural diagram of the first flattening feeding and discharging transportation mechanism and the first CCD detection alignment mechanism;

[0019] Figure 11 This is a schematic diagram of the structure of the main part of the first flattening feeding and discharging transportation mechanism Figure 1 ;

[0020] Figure 12 This is an exploded view of the main body of the first flattening feeding and discharging transport mechanism;

[0021] Figure 13 This is a schematic diagram of the structure of the main part of the first flattening feeding and discharging transportation mechanism Figure 2 ;

[0022] Figure 14is a schematic structural diagram of a first clamping plate device or a second clamping plate device;

[0023] Figure 15 This is a structural diagram of the solder ball heating and flattening mechanism;

[0024] Figure 16 This is a structural diagram of the mold frame part of the solder ball heating and flattening mechanism;

[0025] Figure 17 This is a structural diagram of the upper mold part of the solder ball heating and flattening mechanism;

[0026] Figure 18 This is a structural diagram of the lower die portion of the solder ball heating and flattening mechanism;

[0027] Figure 19 It is a structural diagram of the second flattening feeding and discharging transport mechanism and the second CCD detection alignment mechanism;

[0028] Figure 20 This is a schematic diagram of the structure of the main part of the second flattening feeding and discharging transportation mechanism Figure 1 ;

[0029] Figure 21 This is a schematic diagram of the structure of the main part of the second flattening feeding and discharging transportation mechanism Figure 2 ;

[0030] Figure 22 This is an exploded view of the main body of the second flattening feeding and discharging transport mechanism;

[0031] Figure 23 It is a structural schematic diagram of the third clamping plate device or the fourth clamping plate device. DETAILED DESCRIPTION

[0032] Example 1

[0033] Please refer to Figure 1 and Figure 2 Embodiment 1 of the present invention provides an IC carrier BGA solder ball flattening machine, including a frame 1, a loading and unloading magazine positioning mechanism 2, a carrier in-and-out box conveying mechanism 3, a transfer robot mechanism 4, a first flattening in-and-out material transport mechanism 5, a first CCD detection and alignment mechanism 6, and a solder ball heating and flattening mechanism 7. The loading and unloading magazine positioning mechanism 2, the carrier in-and-out box conveying mechanism 3, the first flattening in-and-out material transport mechanism 5, and the solder ball heating and flattening mechanism 7 are sequentially arranged inside the frame 1, one end of the first flattening in-and-out material transport mechanism 5 extends into the interior of the solder ball heating and flattening mechanism 7, the transfer robot mechanism 4 is installed above the carrier in-and-out box conveying mechanism 3 and the first flattening in-and-out material transport mechanism 5, and the first CCD detection and alignment mechanism 6 is installed above the first flattening in-and-out material transport mechanism 5.

[0034] The various components of this embodiment are described in detail below with reference to the accompanying drawings.

[0035] like Figure 3 and Figure 4 As shown, the loading and unloading magazine positioning mechanism 2 may include a lower magazine support 21, an upper magazine support 22, and a magazine positioning device 23. The upper magazine support 22 is mounted on the lower magazine support 21, and the magazine positioning device 23 is mounted on the lower magazine support 21 and the upper magazine support 22, respectively. The loading magazine 100 filled with IC substrates to be processed can be placed on the upper magazine support 22, and the empty lower magazine 101 can be placed on the lower magazine support 21.

[0036] Specifically, both sets of magazine positioning devices 23 may include a fixed base plate 231, a fixed limiting bar 232, an end limiting block 233, a movable base plate 234, a movable limiting bar 235, and a base plate transverse movement driving device. The fixed limiting bar 232 is fixedly mounted on the fixed base plate 231, the movable base plate 234 is mounted in a movable groove provided on the fixed base plate 231, the movable limiting bar 235 is mounted on the movable base plate 234 and is parallel to the fixed limiting bar 232, the end limiting block 233 is mounted on the side of the fixed base plate 231 and is located between the fixed limiting bar 232 and the movable limiting bar 235. The end limiting block 233 can limit the inlet and outlet ends of the magazine. The base plate transverse movement driving device is transmission-connected to the movable base plate 234 and can drive it to move laterally. The fixed limiting bar 232 and the movable limiting bar 235 can cooperate to press the material tray.

[0037] Furthermore, the bottom plate transverse movement drive device may include a handwheel 236, a bottom plate transverse movement drive screw 237, a bottom plate drive screw mounting seat 238, and a bottom plate drive screw nut seat 239. The bottom plate transverse movement drive screw 237 is respectively mounted on the unloading box bracket 21 and the loading box bracket 22 through the bottom plate drive screw mounting seat 238. The handwheel 236 is connected to one end of the bottom plate transverse movement drive screw 237, and the bottom plate transverse movement drive screw 237 is threadedly connected to the bottom plate drive screw nut seat 239. The upper end of the bottom plate drive screw nut seat 239 is connected to the movable bottom plate 234. Of course, in other embodiments, the handwheel 236 can be replaced by a motor or other electric or pneumatic drive device.

[0038] When the loading magazine box 100 and the unloading magazine box 101 are placed on the loading and unloading box positioning mechanism 2, the operator can turn the hand wheel 236 of the bottom plate transverse movement drive device to adjust the position of the movable limit bar 235 to adapt to the compaction positioning of boxes of different widths.

[0039] The flattening machine of this embodiment adopts a clip-type material box to store the carriers in layers, which can ensure that the carrier products are not touched or scratched.

[0040] like Figure 5 、 Figure 6 and Figure 7 As shown, the carrier plate in-and-out box conveying mechanism 3 may include a Z-axis lifting drive module 31, a Z-axis lifting seat 32, an in-and-out box advance and retreat drive module 33, an L-shaped in-and-out material handling plate 34, a material handling plate movement drive device 35, a clamp 36, a clamp movement adjustment device 37, a clamp mounting bracket 38, a guide limit plate 310 and a limit plate spacing adjustment device 39. The Z-axis lifting drive module 31 is transmission-connected to the Z-axis lifting seat 32 and can drive it to move up and down. The in-and-out box advance and retreat drive module 33 is horizontally installed on the Z-axis lifting seat 32. The in-and-out box advance and retreat drive module 33 is transmission-connected to the material handling plate movement drive device 35 and can drive it to move horizontally. The material handling plate movement drive device 35 is transmission-connected to the in-and-out material handling plate 34 and can drive it to move horizontally. Movement, the clamp movement adjustment device 37 is installed on the material moving plate movement drive device 35 through the clamp mounting bracket 38, the clamp movement adjustment device 37 is connected to the clamp 36 and can drive it to move horizontally, the clamping part of the clamp 36 is located in the avoidance hole opened on the in-and-out material moving plate 34, the clamp 36 can clamp one side of the carrier plate, the guide limit plates 310 are located on both sides of the in-and-out material moving plate 34, the guide limit plates 310 can limit and guide the two sides of the carrier plate to prevent the carrier plate from separating from the in-and-out material moving plate 34, the limit plate spacing adjustment device 39 is installed on the Z-axis lifting seat 32, the limit plate spacing adjustment device 39 is connected to the two guide limit plates 310 in transmission and can drive the two guide limit plates 310 to move away from or approach each other.

[0041] like Figure 6As shown, the material moving plate driving device 35 may include a driving device bracket 351, a material moving plate driving motor 352, a material moving plate driving synchronous wheel 353, a material moving plate driving synchronous belt 354, a material moving plate driving screw 355, a material moving plate driving screw mounting seat 356, a material moving plate driving nut seat 357, a material moving plate moving guide rail 358, a material moving plate moving slider 359, a material moving plate driving connector 3510 and a material moving plate mounting seat 3511. The material moving plate driving motor 352 is installed on the in-and-out box forward and backward driving module 33 through the driving device bracket 351, and the material moving plate driving screw 355 is installed on the driving plate through the material moving plate driving screw mounting seat 356. On the driving device bracket 351, the material moving plate driving motor 352 is connected to the material moving plate driving screw 355 through the material moving plate driving synchronous wheel 353 and the material moving plate driving synchronous belt 354 and drives it to rotate. The material moving plate driving nut seat 357 is installed on the material moving plate driving screw 355. The material moving plate mounting seat 3511 is slidingly connected to the material moving plate moving guide rail 358 installed on the top of the driving device bracket 351 through the material moving plate moving slider 359. The material moving plate driving nut seat 357 is connected to the material moving plate moving slider 359 through the material moving plate driving connecting piece 3510, and the tail end of the material moving plate 34 is installed on the material moving plate mounting seat 3511. The material moving plate driving motor 352 can drive the in-and-out material moving plate 34 on the material moving plate mounting seat 3511 to move to the inside or outside of the magazine box through the material moving plate driving synchronous wheel 353, the material moving plate driving synchronous belt 354, the material moving plate driving screw 355 and the material moving plate driving connecting piece 3510.

[0042] In this embodiment, the clamp movement adjustment device 37 can be preferably configured as a clamp movement cylinder. The clamp 36 can be preferably configured as a clamp cylinder, which is provided with a first clamp 361 and a second clamp 362 .

[0043] like Figure 7As shown, the limit plate spacing adjustment device 39 may include a limit plate adjustment bracket 391, a limit plate adjustment drive motor 392, a limit plate adjustment drive screw 393, a limit plate adjustment screw mounting seat 394, a first limit plate adjustment nut seat 395, a second limit plate adjustment nut seat 396, a limit plate adjustment synchronous wheel 397 and a limit plate adjustment synchronous belt 398. The limit plate adjustment bracket 391 is installed on the Z-axis lifting seat 32, the limit plate adjustment drive motor 392 is installed on one side of the limit plate adjustment bracket 391, and the limit plate adjustment drive screw 393 is installed on one end surface of the limit plate adjustment bracket 391 through the limit plate adjustment screw mounting seat 394 and is engaged with the limit plate adjustment bracket 391. The direction of movement of the material delivery plate 34 is perpendicular. The limit plate adjustment drive motor 392 is connected to the limit plate adjustment drive screw 393 through the limit plate adjustment synchronous wheel 397 and the limit plate adjustment synchronous belt 398, and can drive its rotation. The limit plate adjustment drive screw 393 has two sections of external threads in opposite directions. The first limit plate adjustment nut seat 395 is mounted on the first section of the external threads of the limit plate adjustment drive screw 393, and the second limit plate adjustment nut seat 396 is mounted on the second section of the external threads of the limit plate adjustment drive screw 393. The guide limit plates 310 are respectively mounted on the top of the first limit plate adjustment nut seat 395 and the second limit plate adjustment nut seat 396. The limit plate adjustment drive motor 392 can drive the two guide limit plates 310 to move through the limit plate adjustment drive screw 393 to achieve width adjustment function. In this way, the carrier plate in and out box handling mechanism 3 can accommodate a variety of carrier plates with different widths.

[0044] In order to ensure smooth movement of the guide limit plates 310 , the two guide limit plates 310 can be slidably connected to the limit plate guide rails 312 installed on the top of the limit plate adjustment bracket 391 through the limit plate sliders 311 .

[0045] Better, such as Figure 7 As shown, the outer side surfaces of the head ends of the two guide limit plates 310 are each provided with a limit plate lifting drive device 313. A material retrieving limit plate 314 is mounted on the limit plate lifting drive device 313. The limit plate lifting drive device 313 can drive the material retrieving limit plate 314 to move up and down. The limit plate lifting drive device 313 can preferably be configured as a limit plate lifting cylinder. The material retrieving limit plate 314 can limit the carrier plate in the vertical direction.

[0046] When taking the plate, the material moving plate moving drive device 35 can drive the in-and-out material moving plate 34 to move to the inside of the loading magazine box and pull the specified carrier plate toward the clamp 36. Then the clamp moving adjustment device 37 drives the clamp 36 to move and clamp the carrier plate. The material moving drive device 35 drives the in-and-out material moving plate 34 to reset. When the transfer robot mechanism 4 moves over to take the material, the clamp 36 releases the carrier plate. The clamp moving adjustment device 37 drives the clamp 36 to reset. Subsequently, the transfer robot mechanism 4 clamps the carrier plate.

[0047] When the transfer robot mechanism 4 conveys the processed carrier plate, the clamp movement adjustment device 37 drives the clamp 36 to move and clamp the carrier plate, and the material moving plate movement drive device 35 drives the in-and-out material moving plate 34 to move toward the clamp 36, and then the Z-axis lifting drive module 31 drives the in-and-out material moving plate 34 and the carrier plate placed on the in-and-out material moving plate 34 to move downward, so that it moves to the entrance of the lower-level unloading magazine box. After moving into place, the clamp 36 releases the carrier plate, and the material moving plate movement drive device 35 drives the in-and-out material moving plate 34 to transport the carrier plate to the inside of the unloading magazine box.

[0048] The carrier board in and out box handling mechanism 3 can stably take out the carrier board from the inside of the loading magazine box, and can also smoothly transport the processed carrier board to the unloading magazine box. It has an online automatic width adjustment and transportation function and is suitable for carrier board products with different board widths.

[0049] like Figure 8 and Figure 9 As shown, the transfer robot mechanism 4 can include a transfer transverse driving module 41, a transfer lifting driving device 42, a transfer mounting plate 43, a clamp spacing adjustment device 44, a clamp mounting plate 45 and a carrier clamp 46. The transfer transverse driving module 41 is transmission-connected to the transfer lifting driving device 42 and can drive it to move laterally. The transfer lifting driving device 42 is transmission-connected to the transfer mounting plate 43 and can drive it to move up and down. The clamp spacing adjustment device 44 is installed at the bottom of the transfer mounting plate 43. The clamp mounting plates 45 are provided with two pieces and are parallel to each other. The clamp spacing adjustment device 44 is transmission-connected to the two clamp mounting plates 45 and can drive the two clamp mounting plates 45 to move closer to or away from each other. There are several carrier clamps 46 and they are respectively installed on the two clamp mounting plates 45. The inner side of the lower end of each carrier clamp 46 is respectively provided with a card edge groove 461 for inserting the edge of the carrier plate.

[0050] In this embodiment, the transfer lifting drive device 42 can preferably be set as a transfer lifting cylinder.

[0051] like Figure 9As shown, the jaw spacing adjustment device 44 may include a jaw adjustment drive motor 441, a jaw adjustment drive screw 442, a jaw adjustment screw mounting seat 443, a first jaw adjustment nut seat 444 and a second jaw adjustment nut seat 445. The jaw adjustment drive motor 441 is installed at the bottom of the transfer mounting plate 43, and the jaw adjustment drive screw 442 is installed at the bottom of the transfer mounting plate 43 through the jaw adjustment screw mounting seat 443. The output shaft of the jaw adjustment drive motor 441 is connected to the jaw adjustment drive screw 442 and can drive it to rotate. The jaw adjustment drive screw 442 is provided with two sections of external threads in opposite directions. The first jaw adjustment nut seat 444 is installed on the first section of the external thread of the jaw adjustment drive screw 442, and the second jaw adjustment nut seat 445 is installed on the second section of the external thread of the jaw adjustment drive screw 442. The jaw mounting plate 45 is respectively installed at the bottom of the first jaw adjustment nut seat 444 and the second jaw adjustment nut seat 445. The clamping jaw spacing adjustment device 44 can adjust the spacing between the carrier clamping jaws 46 on both sides to adapt to carrier products with different board widths.

[0052] Preferably, the first jaw adjustment nut seat 444 and the second jaw adjustment nut seat 445 can be slidably connected to the jaw adjustment guide rail 48 installed at the bottom of the transfer mounting plate 43 through the jaw adjustment slider 47 respectively.

[0053] The transfer robot mechanism 4 adopts a card edge type robot design, which ensures smooth transfer of products, and prevents them from slipping and loosening.

[0054] like Figure 10As shown, the first flattening feed and discharge transport mechanism 5 may include a first feed and discharge moving module 51, a first feed and discharge lifting drive device 52, a first feed and discharge lifting seat 53, a first angle fine-tuning rotation drive device 54, a first angle fine-tuning mounting plate 55, a first angle fine-tuning arc guide rail 56, a first angle fine-tuning arc slider 57, a first X-axis moving plate 58, a first X-axis transverse sliding slider 59, a first X-axis transverse guide rail 510, a first X-axis transverse driving device 511, a first Y-axis distance adjustment driving device 512, a first Y-axis distance adjustment moving plate 513, a first Y-axis transverse sliding slider 51 4. The first Y-axis lateral guide rail 515, the first clamping plate device 516 and the second clamping plate device 517, the first feed and discharge moving module 51 is connected to the first feed and discharge lifting drive device 52 and can drive it to move horizontally, the first feed and discharge lifting drive device 52 is connected to the first feed and discharge lifting seat 53 and can drive it to move up and down, the first angle fine-tuning mounting plate 55 is connected to the first angle fine-tuning arc guide rail 56 installed on the top of the first feed and discharge lifting seat 53 through the first angle fine-tuning arc slider 57, the first angle fine-tuning rotation drive device 54 is installed on the first feed and discharge On one side of the lifting seat 53, the first angle fine-tuning rotation driving device 54 is connected to the first angle fine-tuning mounting plate 55 through transmission and can drive it to rotate, the first X-axis moving plate 58 is slidably connected to the first X-axis lateral guide rail 510 installed on the first angle fine-tuning mounting plate 55 through the first X-axis lateral sliding block 59, the first X-axis lateral driving device 511 is installed on the first angle fine-tuning mounting plate 55, the first X-axis lateral driving device 511 is connected to the first X-axis moving plate 58 through transmission and can drive it to move along the X-axis direction, the first Y-axis distance adjustment moving plate 513 is connected to the first Y-axis lateral sliding block Block 514 is slidably connected to a first Y-axis traverse guide rail 515 mounted on one side of the first X-axis movable plate 58. A first Y-axis pitch adjustment drive 512 is mounted on the first X-axis movable plate 58. The first Y-axis pitch adjustment drive 512 is transmission-connected to the first Y-axis pitch adjustment movable plate 513 and can drive it to move along the Y-axis. A first clamping plate 516 is mounted on one side of the first Y-axis pitch adjustment movable plate 513, and a second clamping plate 517 is mounted on the other side of the first X-axis movable plate 58. The first clamping plate 516 and the second clamping plate 517 are symmetrically arranged on the same side. The first clamping plate 516 and the second clamping plate 517 can clamp both sides of the carrier plate.

[0055] like Figure 12 and Figure 13As shown, the first feed and unload lifting drive device 52 may include a first feed and unload lifting base plate 521, a first feed and unload lifting motor 522, a first feed and unload lifting driving screw 523, a first feed and unload lifting screw mounting seat 524, a first feed and unload lifting threaded seat 525, a first feed and unload lifting synchronous wheel 526 and a first feed and unload lifting synchronous belt 527. The first feed and unload lifting motor 522 is installed on the first feed and unload moving module 51 through the first feed and unload lifting base plate 521, and the first feed and unload lifting driving screw 523 is installed on the first feed and unload lifting base plate 521 through the first feed and unload lifting screw mounting seat 524. The first feed and unload lifting motor 522 is connected to the first feed and unload lifting driving screw 523 through the first feed and unload lifting synchronous wheel 526 and the first feed and unload lifting synchronous belt 527 and can drive it to rotate. The first feed and unload lifting driving screw 523 is connected to the first feed and unload lifting seat 53 through the first feed and unload lifting threaded seat 525.

[0056] Preferably, the first material inlet and outlet lifting seat 53 can be slidably connected to the first material inlet and outlet lifting guide rail 520 installed on the first material inlet and outlet lifting base plate 521 through the first material inlet and outlet lifting slider 519.

[0057] like Figure 12 and Figure 13 As shown, the first angle fine-tuning rotary drive device 54 may include a first angle fine-tuning rotary drive cylinder 541, a first angle fine-tuning drive block 542, a first floating joint 543, and a first angle fine-tuning rotary connection block 544. The first angle fine-tuning rotary drive cylinder 541 is mounted on the first feed-in / out lift 53, the first angle fine-tuning drive block 542 is mounted on the first angle fine-tuning rotary drive cylinder 541, the first angle fine-tuning rotary connection block 544 is mounted on the bottom of the first angle fine-tuning mounting plate 55, and the first floating joint 543 is connected between the first angle fine-tuning drive block 542 and the first angle fine-tuning rotary connection block 544. During fine-tuning, the first angle fine-tuning rotary drive cylinder 541 can drive the first angle fine-tuning drive block 542 to move, thereby rotating the first angle fine-tuning mounting plate 55 to a certain angle via the first floating joint 543 and the first angle fine-tuning rotary connection block 544, thereby facilitating the angular position adjustment of the solder balls on the carrier board.

[0058] In this embodiment, the first X-axis traverse drive device 511 may be preferably configured as a first X-axis traverse drive electric cylinder with a stroke, and the first Y-axis distance adjustment drive device 512 may be preferably configured as a first Y-axis traverse drive electric cylinder with a stroke.

[0059] like Figure 14As shown, the first clamping plate device 516 and the second clamping plate device 517 may include a first clamping plate base plate 5161, a first clamping plate driving cylinder 5162, a first articulated seat 5163, a first V-shaped driving block 5164, a first clamping plate transverse movement plate 5165, a first bearing seat 5166, a first clamping plate transverse movement guide rod 5167, a first clamping plate lifting plate 5168, a first clamping plate lifting slider 5169, a first clamping plate lifting guide rail 5170, a first clamping plate pressure block 5171 and a first clamping plate limiting seat 5172, the first clamping plate driving cylinder 5162 and the first bearing seat 5166 are both installed on the first clamping plate base plate 5161, the first bearing seat 5166 is located on both sides of the first clamping plate driving cylinder 5162, and the first clamping plate driving cylinder 5162 is hinged to one end of the first V-shaped driving block 5164 through the first articulated seat 5163. The other end of the first V-shaped drive block 5164 passes through the first splint transverse plate 5165 and is hinged to the first splint lifting plate 5168. One end of the first splint transverse guide rod 5167 is connected to the first splint transverse plate 5165. The other end of the first splint transverse guide rod 5167 is movably installed in the hole of the first bearing seat 5166. The first splint lifting plate 5168 is slidingly connected to the first splint lifting guide rail 5170 installed on the first splint transverse plate 5165 through the first splint lifting slider 5169. The first splint pressure block 5171 is installed on the first splint lifting plate 5168. The first splint driving cylinder 5162 can drive the first splint pressure block 5171 to move laterally and up and down. The first splint limit seat 5172 is installed on the side of the first splint bottom plate 5161 and is located below the first splint pressure block 5171. The first clamping plate limiting seat 5172 can limit the two sides of the carrier plate, and the first clamping plate driving cylinder 5162 can drive the first clamping plate pressing block 5171 to press the carrier plate for positioning.

[0060] The first flattening feed and discharge transport mechanism features micro-stretching in both the X and Y directions, ensuring flat, warp-free carriers. Mounted on a high-precision transfer module, it ensures precise positioning and prevents interference. Furthermore, the first flattening feed and discharge transport mechanism features width adjustment to accommodate carriers of varying widths.

[0061] like Figure 10 As shown, the first CCD detection alignment mechanism 6 may include a first CCD mounting bracket 61 , a first CCD camera 62 and a first CCD lens 63 . The first CCD camera 62 is mounted inside the frame 1 through the first CCD mounting bracket 61 , and the first CCD lens 63 is mounted on the first CCD camera 62 .

[0062] The first CCD detection alignment mechanism 6 uses a high-resolution camera, which can accurately locate and improve the success rate of flattening the IC carrier.

[0063] like Figure 15As shown, the solder ball heating and flattening mechanism 7 may include a hot pressing die frame 71, a hot pressing driving device 72, a lifting middle plate 73, an upper heat insulation plate 74, an upper heating plate 75, an upper pressure head 76, a gyroscope 77, a lower heat insulation plate 78, a lower heating plate 79 and a lower pressure head 710. The hot pressing driving device 72 is installed on the die frame top plate 711 of the hot pressing die frame 71. The output shaft of the hot pressing driving device 72 passes through the die frame top plate 711 of the hot pressing die frame 71 and is transmission-connected to the lifting middle plate 73 and can Drive it to move up and down, the upper heat insulation plate 74 is installed at the bottom of the lifting middle plate 73, the upper heating plate 75 is installed at the bottom of the upper heat insulation plate 74, the upper pressure head 76 is installed at the bottom of the upper heating plate 75, the gyroscope 77 is installed on the mold base plate 712 of the hot pressing mold frame 71, the lower heat insulation plate 78 is installed on the top of the gyroscope 77, the lower heating plate 79 is installed on the top of the lower heat insulation plate 78, and the lower pressure head 710 is installed on the top of the lower heating plate 79 and is located below the upper pressure head 76.

[0064] In this embodiment, the hot pressing driving device 72 may be preferably configured as a hot pressing driving electric cylinder, and the gyroscope 77 may be preferably configured as an air gyroscope calibration instrument.

[0065] like Figure 15 and Figure 16 As shown, four bushings 713 can be provided on the mold frame top plate 711 of the hot pressing mold frame 71, and each bushing 713 is provided with a guide column 714. The lower end of each guide column 714 is connected to the lifting middle plate 73, and the upper end of each guide column 714 passes through the bushing 713 upward, and the upper end of each guide column 714 is connected to the square guide column linkage bracket 715.

[0066] like Figure 17 As shown, the upper pressure head 76 can be installed at the bottom of the upper heating plate 75 by the upper pressure head fixing devices 715 located on both sides thereof. The upper pressure head fixing device 715 may include an upper pressure head fixed driving cylinder 7151, a cylinder heat insulation seat 7152, a connecting rod 7153, a connecting rod mounting bracket 7154 and an upper pressure head positioning and fixing block 7155. The upper pressure head fixed driving cylinder 7151 and the connecting rod mounting bracket 7154 are respectively installed at the bottom of the lifting middle plate 73. The upper pressure head fixed driving cylinder 7151 is connected to one end of the connecting rod 7153 through the cylinder heat insulation seat 7152. The other end of the connecting rod 7153 passes through the through hole of the connecting rod mounting bracket 7154 and is connected to the upper pressure head positioning and fixing block 7155. The upper pressure head positioning and fixing block 7155 can contact the bottom side of the upper pressure head 76, thereby positioning the upper pressure head 76. The upper pressure head fixing device 715 can facilitate the installation, fixation, replacement and maintenance of the upper pressure head.

[0067] like Figure 18As shown, the top of the lower heating plate 79 is provided with a lower pressure head limit seat 716 located on both sides of the lower pressure head 710, and the two side surfaces of the lower pressure head 710 are respectively provided with lower pressure head bosses 7101, and the two lower pressure head bosses 7101 are respectively inserted into the limiting grooves of the lower pressure head limit seat 716, and each lower pressure head limit seat 716 is respectively provided with a longitudinally arranged ball screw 717, and the lower end of the ball screw 717 can be extended into the limiting groove of the lower pressure head limit seat 716 and limit the corresponding lower pressure head boss 7101.

[0068] The solder ball heating and flattening mechanism adopts a high-power four-column servo electric cylinder, which has smooth movement and constant and adjustable pressure. The pressure head mold is made of high-strength special mold steel, which has minimal deformation under high temperature conditions. It can also be controlled by a servo system to achieve precise opening and closing width and smooth operation.

[0069] The working principle of the present invention is as follows:

[0070] Before working, the operator can place the loading magazine box 100 filled with IC carriers and the empty unloading magazine box 101 on the loading and unloading magazine positioning mechanism 2 respectively. During working, the carrier in and out box conveying mechanism 3 takes out the IC carrier in the loading magazine box 100, and the transfer robot mechanism 4 transports the IC carrier taken out from the carrier in and out box conveying mechanism 3 to the first flattening in and out material transporting mechanism 5. The first flattening in and out material transporting mechanism 5 transports the IC carrier to the first CCD detection alignment mechanism 6. After the target is aligned, the IC carrier is transported to the flattening station of the solder ball heating and flattening mechanism 7 for hot pressing and flattening operation. When the hot pressing and flattening operation is completed, the first flattening in-and-out material transport mechanism 5 outputs the flattened IC carrier to the outside of the solder ball heating and flattening mechanism 7. The transfer robot mechanism 4 transports the IC carrier output by the first flattening in-and-out material transport mechanism back to the carrier in-and-out box transport mechanism 3. The carrier in-and-out box transport mechanism 3 sends the IC carrier into the blanking magazine box 101.

[0071] Example 2

[0072] Please refer to Figure 1 and Figure 19, Embodiment 2 of the present invention provides an IC carrier BGA solder ball flattening machine, which, on the basis of the above-mentioned embodiment 1, can also include a flattening station for conveying another IC carrier to the solder ball heating and flattening mechanism 7 and a second flattening in-and-out material transport mechanism 8 for outputting the flattened another IC carrier to the outside of the solder ball heating and flattening mechanism 7, and a second CCD detection and alignment mechanism 9 for performing target alignment on the another IC carrier conveyed by the second flattening in-and-out material transport mechanism 8. The second flattening in-and-out material transport mechanism 8 and the second CCD detection and alignment mechanism 9 are respectively installed inside the frame 1, the direction of the second flattening in-and-out material transport mechanism 8 is perpendicular to the first flattening in-and-out material transport mechanism 5, one end of the second flattening in-and-out material transport mechanism 8 extends into the interior of the solder ball heating and flattening mechanism 7, and the second CCD detection and alignment mechanism 9 is located above the second flattening in-and-out material transport mechanism 8.

[0073] like Figures 19 to 22 As shown, the second flattening feed and discharge transport mechanism 8 may include a second feed and discharge moving module 81, a second feed and discharge lifting drive device 82, a second feed and discharge lifting seat 83, a second angle fine-tuning rotating drive device 84, a second angle fine-tuning mounting plate 85, a second angle fine-tuning arc guide rail 86, a second angle fine-tuning arc slider 87, a second X-axis moving plate 88, a second X-axis transverse sliding slider 89, a second X-axis transverse sliding guide rail 810, a second X-axis transverse driving device 811, a third clamping plate device 812 and a fourth clamping plate device 813. The second feed and discharge moving module 81 is transmission-connected to the second feed and discharge lifting drive device 82 and can drive it to move laterally. The second feed and discharge lifting drive device 82 is transmission-connected to the second feed and discharge lifting seat 83 and can drive it to move up and down. The second angle fine-tuning mounting plate 85 is connected to the second angle fine-tuning arc slider 87 installed on the top of the second feed and discharge lifting seat 83. The second X-axis fine-tuning curved guide rail 86 is slidably connected to the second angle fine-tuning rotary drive 84 mounted on one side of the second loading and unloading lifting base 83. The second angle fine-tuning rotary drive 84 is transmission-connected to the second angle fine-tuning mounting plate 85 and can drive its rotation. The second X-axis movable plate 88 is slidably connected to the second X-axis traverse guide rail 810 mounted on the second angle fine-tuning mounting plate 85 via a second X-axis traverse slider 89. The second X-axis traverse drive 811 is mounted on the second angle fine-tuning mounting plate 85 and transmission-connected to the second X-axis movable plate 88 and can drive it to move along the X-axis. At least two third clamping plate assemblies 812 are arranged side by side on one side of the second X-axis movable plate 88, and at least two fourth clamping plate assemblies 813 are arranged side by side on the other side of the second X-axis movable plate 88. The third clamping plate assemblies 812 and the fourth clamping plate assemblies 813 are symmetrically arranged. The third clamping plate assemblies 812 and the fourth clamping plate assemblies 813 can clamp both sides of the carrier plate.

[0074] like Figure 22 As shown, the second feed and unload lifting drive device 82 may include a second feed and unload lifting base plate 821, a second feed and unload lifting motor 822, a second feed and unload lifting drive screw 823, a second feed and unload lifting screw mounting seat 824, a second feed and unload lifting threaded seat 825, a second feed and unload lifting synchronous wheel 826 and a second feed and unload lifting synchronous belt 827. The second feed and unload lifting motor 822 is installed on the second feed and unload moving module 81 through the second feed and unload lifting base plate 821, and the second feed and unload lifting drive screw 823 is installed on the second feed and unload lifting base plate 821 through the second feed and unload lifting screw mounting seat 824. The second feed and unload lifting motor 822 is connected to the second feed and unload lifting drive screw 823 through the second feed and unload lifting synchronous wheel 826 and the second feed and unload lifting synchronous belt 827 and can drive it to rotate. The second feed and unload lifting drive screw 823 is connected to the second feed and unload lifting seat 83 through the second feed and unload lifting threaded seat 825.

[0075] Preferably, the second material inlet and outlet lifting seat 83 can be slidably connected to the second material inlet and outlet lifting guide rail 815 installed on the second material inlet and outlet lifting base plate 821 through the second material inlet and outlet lifting slider 814.

[0076] like Figure 21 and Figure 22 As shown, the second angle fine-tuning rotation drive device 84 may include a second angle fine-tuning rotation drive electric cylinder 841, a second angle fine-tuning drive block 842, a second floating joint 843 and a second angle fine-tuning rotation connecting block 844. The second angle fine-tuning rotation drive electric cylinder 841 is installed on the second feed and discharge lifting seat 83, the second angle fine-tuning drive block 842 is installed on the second angle fine-tuning rotation drive electric cylinder 841, the second angle fine-tuning rotation connecting block 844 is installed at the bottom of the second angle fine-tuning mounting plate 85, and the second floating joint 843 is connected between the second angle fine-tuning drive block 842 and the second angle fine-tuning rotation connecting block 844.

[0077] In this embodiment, the second X-axis lateral movement driving device 811 can preferably be configured as a second X-axis lateral movement driving electric cylinder with a stroke.

[0078] like Figure 23As shown, the third clamping plate device 812 and the fourth clamping plate device 813 may include a second clamping plate driving cylinder 8121, a second articulated seat 8122, a second V-shaped driving block 8123, a second clamping plate transverse movement plate 8124, a second bearing seat 8125, a second clamping plate transverse movement guide rod 8126, a second clamping plate lifting plate 8127, a second clamping plate lifting slider 8128, a second clamping plate lifting guide rail 8129 and a second clamping plate pressing block 8130, the second clamping plate driving cylinder 8121 and the second bearing seat 8125 are both installed on the second X-axis moving plate 88, the second bearing seat 8125 is located on both sides of the second clamping plate driving cylinder 8121, the second clamping plate driving cylinder 8121 is hinged to one end of the second V-shaped driving block 8123 through the second articulated seat 8122, and the other end of the second V-shaped driving block 8123 passes through the second clamping plate transverse movement plate 8124 It is hinged with the second splint lifting plate 8127, one end of the second splint transverse guide rod 8126 is connected to the second splint transverse plate 8124, and the other end of the second splint transverse guide rod 8126 is movably installed in the hole of the second bearing seat 8125. The second splint lifting plate 8127 is slidingly connected with the second splint lifting guide rail 8129 installed on the second splint transverse plate 8124 through the second splint lifting slider 8128. The second splint pressure block 8130 is installed on the second splint lifting plate 8127. The second splint driving cylinder 8121 can drive the second splint pressure block 8130 to move laterally and up and down. The second X-axis moving plate 88 has a second splint limit seat 817 on both sides, which is located below the second splint pressure block 8130 of the third splint device 812 and below the second splint pressure block 8130 of the fourth splint device 813.

[0079] It should be noted here that, according to actual needs, the second flattening feed and discharge transport mechanism 8 of the second embodiment can also be provided with a width adjustment function like the first flattening feed and discharge transport mechanism of the first embodiment.

[0080] like Figure 19 As shown, the second CCD detection alignment mechanism 9 may include a second CCD mounting bracket 91, a second CCD camera 92 and a second CCD lens 93. The second CCD camera 92 is mounted inside the frame 1 through the second CCD mounting bracket 91, and the second CCD lens 93 is mounted on the second CCD camera 92.

[0081] The second flattening feeding and discharging transport mechanism can transport large-sized carrier plates that cannot be accommodated by the magazine-type magazine, which greatly improves the compatibility or flexibility of the machine and has high production efficiency.

[0082] The present invention has the following advantages:

[0083] 1. It can complete a series of automated operations such as automatic loading of carrier boards, automatic detection of solder ball positions, automatic hot pressing and leveling of solder balls, and automatic unloading of carrier boards into boxes. It operates stably and reliably, with a high degree of automation. It can improve the yield rate and production efficiency of the production process, reduce production costs, and ensure high-precision production requirements.

[0084] 2. Through sequential control, PLC controls the servo drive, precise camera positioning, constant flattening pressure control, and synchronous heating of the upper and lower temperature zones to complete the flattening work. Simple operating software ensures easy use, no long-term training required, and no consumables.

[0085] 3. Online adjustable width transport system: It can achieve automatic transport, automatic width adjustment, and automatic positioning of IC carriers, eliminating the need for manual placement, further improving work efficiency and safety protection;

[0086] 4. X and Y axis gantry system: adopt high-precision screw guide rail positioning and brand servo motor drive to further improve the accuracy of the whole machine and further improve the success rate of welding;

[0087] 5. Automatic heating system: works synchronously with the lower preheating temperature zone to further improve work efficiency, reduce time consumption and improve production efficiency;

[0088] 6. Four-column servo electric cylinder: works in conjunction with the high-precision air gyro calibrator to ensure flattening accuracy;

[0089] 7. CCD camera system: precise positioning to improve the success rate of IC substrate flattening;

[0090] 8. Machine control software: Just import the IC substrate file, set the area to be flattened, the visual system automatically locates, and the robot module automatically reaches the area to be flattened to start working, ensuring the stability of product flattening.

Claims

1. An IC substrate BGA solder ball flattening machine, characterized by: The invention comprises a frame, a loading and unloading magazine positioning mechanism for layering and positioning a loading magazine box filled with IC carriers and an empty unloading magazine box, a carrier in-and-out box conveying mechanism for taking out the IC carrier in the loading magazine box and sending the flattened IC carrier into the unloading magazine box, a transfer robot mechanism for transporting the IC carrier taken out by the carrier in-and-out box conveying mechanism to the first flattening in-and-out material transport mechanism and transporting the IC carrier output by the first flattening in-and-out material transport mechanism back to the carrier in-and-out box conveying mechanism, a first flattening in-and-out material transport mechanism for transporting the IC carrier to the flattening station of the solder ball heating flattening mechanism and outputting the flattened IC carrier to the outside of the solder ball heating flattening mechanism. The transport mechanism comprises a first CCD detection and alignment mechanism for performing target point alignment on the IC carrier conveyed by the first flattening in-and-out material transport mechanism, and a solder ball heating and flattening mechanism for flattening the solder balls on the IC carrier. The upper and lower material box positioning mechanism, the carrier in-and-out box conveying mechanism, the first flattening in-and-out material transport mechanism, and the solder ball heating and flattening mechanism are sequentially arranged inside the frame, one end of the first flattening in-and-out material transport mechanism extends into the interior of the solder ball heating and flattening mechanism, the transfer robot mechanism is installed above the carrier in-and-out box conveying mechanism and the first flattening in-and-out material transport mechanism, and the first CCD detection and alignment mechanism is installed above the first flattening in-and-out material transport mechanism. The upper and lower material box positioning mechanism includes a lower material box bracket, a upper material box bracket and a material box positioning device, the upper material box bracket is installed on the lower material box bracket, the material box positioning device is respectively installed on the lower material box bracket and the upper material box bracket, and the two sets of material box positioning devices include a fixed base plate, a fixed limit bar, an end limit block, a movable base plate, a movable limit bar and a base plate transverse movement driving device, the fixed limit bar is fixedly installed on the fixed base plate, the movable base plate is installed in a movable groove opened on the fixed base plate, the movable limit bar is installed on the movable base plate and is parallel to the fixed limit bar, the end limit block is installed on the side of the fixed base plate and is located between the fixed limit bar and the movable limit bar, and the base plate transverse movement driving device is transmission-connected to the movable base plate and can drive it to move laterally; The first CCD detection alignment mechanism includes a first CCD mounting bracket, a first CCD camera and a first CCD lens. The first CCD camera is mounted inside the frame through the first CCD mounting bracket, and the first CCD lens is mounted on the first CCD camera.

2. The IC substrate BGA solder ball flattening machine according to claim 1, characterized in that: The carrier in-and-out box handling mechanism includes a Z-axis lifting drive module, a Z-axis lifting seat, an in-and-out box advance and retreat drive module, an L-shaped in-and-out material handling plate, a material handling plate movement drive device, a clamp, a clamp movement adjustment device, a clamp mounting bracket, a guide limit plate and a limit plate spacing adjustment device. The Z-axis lifting drive module is transmission-connected to the Z-axis lifting seat and can drive it to move up and down. The in-and-out box advance and retreat drive module is horizontally installed on the Z-axis lifting seat. The in-and-out box advance and retreat drive module is transmission-connected to the material handling plate movement drive device and can drive it to move laterally. The material handling plate movement drive The device is transmission-connected to the in-and-out material moving plate and can drive it to move laterally. The clamp movement adjustment device is installed on the material moving plate movement drive device through the clamp mounting bracket. The clamp movement adjustment device is connected to the clamp and can drive it to move laterally. The clamping part of the clamp is located in the avoidance hole opened on the in-and-out material moving plate. The guide limit plates are located on both sides of the in-and-out material moving plate. The limit plate spacing adjustment device is installed on the Z-axis lifting seat. The limit plate spacing adjustment device is transmission-connected to the two guide limit plates and can drive the two guide limit plates to move away from or closer to each other.

3. The IC substrate BGA solder ball flattening machine according to claim 1, characterized in that: The transfer robot mechanism includes a transfer transverse driving module, a transfer lifting driving device, a transfer mounting plate, a clamp spacing adjustment device, a clamp mounting plate and a carrier clamp. The transfer transverse driving module is transmission-connected to the transfer lifting driving device and can drive it to move laterally. The transfer lifting driving device is transmission-connected to the transfer mounting plate and can drive it to move up and down. The clamp spacing adjustment device is installed at the bottom of the transfer mounting plate. The clamp mounting plates are provided with two pieces and are parallel to each other. The clamp spacing adjustment device is transmission-connected to the two clamp mounting plates and can drive the two clamp mounting plates to approach or move away from each other. There are several carrier clamps and they are respectively installed on the two clamp mounting plates. The inner side of the lower end of each carrier clamp is provided with a card edge groove.

4. The IC substrate BGA solder ball flattening machine according to claim 1, characterized in that: The first flattening feed and unloading transport mechanism includes a first feed and unloading moving module, a first feed and unloading lifting drive device, a first feed and unloading lifting seat, a first angle fine-tuning rotary drive device, a first angle fine-tuning mounting plate, a first angle fine-tuning arc guide rail, a first angle fine-tuning arc slider, a first X-axis moving plate, a first X-axis transverse sliding slider, a first X-axis transverse guide rail, a first X-axis transverse driving device, a first Y-axis distance adjustment driving device, a first Y-axis distance adjustment moving plate, a first Y-axis transverse sliding slider, a first Y-axis transverse guide rail, a first clamping plate device and a second clamping plate device, the first feed and unloading moving module is transmission-connected to the first feed and unloading lifting drive device and can drive it to move laterally, the first feed and unloading lifting drive device is transmission-connected to the first feed and unloading lifting seat and can drive it to move up and down, the first angle fine-tuning mounting plate is slidingly connected to the first angle fine-tuning arc guide rail installed on the top of the first feed and unloading lifting seat through the first angle fine-tuning arc slider, and the first angle fine-tuning rotary drive device is installed on one side of the first feed and unloading lifting seat. The first guide plate is connected to the first X-axis movable plate through the first X-axis movable plate and is slidably connected to the first X-axis movable plate by the first X-axis transverse slider. The first X-axis transverse drive device is installed on the first angle fine-tuning mounting plate. The first X-axis transverse drive device is connected to the first X-axis movable plate through the first X-axis transverse slider and is slidably connected to the first Y-axis transverse guide rail installed on one side of the first X-axis movable plate. The first Y-axis distance adjustment drive device is installed on the first X-axis movable plate. The first Y-axis distance adjustment drive device is connected to the first Y-axis distance adjustment movable plate and is capable of driving it to move along the Y-axis direction. The first clamping plate device is installed on one side of the first Y-axis distance adjustment movable plate, and the second clamping plate device is installed on the other side of the first X-axis movable plate. The first clamping plate device and the second clamping plate device are on the same side and are symmetrically arranged.

5. The IC substrate BGA solder ball flattening machine according to claim 1, characterized in that: The solder ball heating and flattening mechanism includes a hot pressing mold frame, a hot pressing drive device, a lifting middle plate, an upper heat insulation plate, an upper heating plate, an upper pressure head, a gyroscope, a lower heat insulation plate, a lower heating plate and a lower pressure head. The hot pressing drive device is installed on the mold frame top plate of the hot pressing mold frame, and the output shaft of the hot pressing drive device passes through the mold frame top plate of the hot pressing mold frame and is transmission-connected to the lifting middle plate and can drive it to move up and down. The upper heat insulation plate is installed at the bottom of the lifting middle plate, the upper heating plate is installed at the bottom of the upper heat insulation plate, the upper pressure head is installed at the bottom of the upper heating plate, the gyroscope is installed on the mold frame bottom plate of the hot pressing mold frame, the lower heat insulation plate is installed on the top of the gyroscope, the lower heating plate is installed on the top of the lower heat insulation plate, and the lower pressure head is installed on the top of the lower heating plate and is located below the upper pressure head.

6. The IC substrate BGA solder ball flattening machine according to claim 1, characterized in that: It also includes a flattening station for conveying another IC carrier to the solder ball heating and flattening mechanism and a second flattening feed and discharge transport mechanism for outputting the flattened another IC carrier to the outside of the solder ball heating and flattening mechanism, and a second CCD detection and alignment mechanism for performing target alignment on the another IC carrier conveyed by the second flattening feed and discharge transport mechanism. The second flattening feed and discharge transport mechanism and the second CCD detection and alignment mechanism are respectively installed inside the frame. The direction of the second flattening feed and discharge transport mechanism is perpendicular to that of the first flattening feed and discharge transport mechanism. One end of the second flattening feed and discharge transport mechanism extends into the interior of the solder ball heating and flattening mechanism. The second CCD detection and alignment mechanism is located above the second flattening feed and discharge transport mechanism.

7. The IC substrate BGA solder ball flattening machine according to claim 6, characterized in that: The second flattening feed and unloading transport mechanism includes a second feed and unloading moving module, a second feed and unloading lifting drive device, a second feed and unloading lifting seat, a second angle fine-tuning rotation drive device, a second angle fine-tuning mounting plate, a second angle fine-tuning arc guide rail, a second angle fine-tuning arc slider, a second X-axis moving plate, a second X-axis transverse sliding slider, a second X-axis transverse guide rail, a second X-axis transverse driving device, a third clamping plate device and a fourth clamping plate device. The second feed and unloading moving module is transmission-connected to the second feed and unloading lifting drive device and can drive it to move laterally. The second feed and unloading lifting drive device is transmission-connected to the second feed and unloading lifting seat and can drive it to move up and down. The second angle fine-tuning mounting plate is connected to the second angle fine-tuning arc slider and the second angle fine-tuning arc guide rail installed on the top of the second feed and unloading lifting seat. The second angle fine-tuning rotation drive device is installed on one side of the second feed and unloading lifting seat, the second angle fine-tuning rotation drive device is connected to the second angle fine-tuning mounting plate by transmission and can drive it to rotate, the second X-axis movable plate is slidably connected to the second X-axis transverse guide rail installed on the second angle fine-tuning mounting plate through the second X-axis transverse slider, the second X-axis transverse drive device is installed on the second angle fine-tuning mounting plate, the second X-axis transverse drive device is connected to the second X-axis movable plate by transmission and can drive it to move along the X-axis direction, the third clamping plate device is provided with at least two and arranged side by side on one side of the second X-axis movable plate, the fourth clamping plate device is provided with at least two and arranged side by side on the other side of the second X-axis movable plate, and the third clamping plate device and the fourth clamping plate device are symmetrically arranged.

8. The IC substrate BGA solder ball flattening machine according to claim 6, characterized in that: The second CCD detection alignment mechanism includes a second CCD mounting bracket, a second CCD camera and a second CCD lens. The second CCD camera is mounted inside the frame through the second CCD mounting bracket, and the second CCD lens is mounted on the second CCD camera.

Images