Dual-station edge-finding mechanism and wafer positioning device

Abstract

The present application discloses a dual-station edge-finding mechanism and a wafer positioning device. The wafer positioning device comprises a dual-station edge-finding mechanism, a working chamber and a wafer conveying mechanism. The dual-station edge-finding mechanism comprises a first carrier, a first rotation drive component, a second carrier, a second rotation drive component and a detection component. The first carrier and the second carrier are used to receive wafers. After the carrier receives the wafer, it is driven to rotate with the wafer by the corresponding rotation drive component. When the wafer is rotated to the point where the notch thereon is in the detection position, the detection component can capture the notch information, thereby confirming that the wafer is adjusted to a preset state. The first carrier comprises a first connecting portion and a supporting claw, the supporting claw is arranged on the lower surface of the first connecting portion, the second carrier comprises a second connecting portion and a top column, the top column is arranged on the upper surface of the second connecting portion, and the two groups of carriers are arranged relatively to each other in the vertical direction so that two wafers to be edge-finded can be placed nearby, which can not only optimize the equipment structure, but also help to improve the edge-finding efficiency.

Description

Technical Field

[0001] The present application relates to the technical field of wafer manufacturing equipment, and in particular to a double-station edge-finding mechanism and a wafer positioning device. Background Art

[0002] Wafers usually need to be edge-finding and positioned before etching and coating to ensure that the wafers are in a preset state to facilitate continuous standardized operations downstream.

[0003] The semiconductor industry often uses notches to determine the position of wafers and achieve the opposite edge of wafers. A notch refers to a missing corner deliberately formed on the wafer. In current processes, optical laser sensors are often used to achieve edge finding; specifically, the wafer is placed on the sample table. Assuming that the laser is blocked by the wafer at this time, the wafer starts to rotate. When it rotates to the notch position, the laser can be captured by the laser collector through the notch. In this way, the position information of the wafer can be obtained through calculation.

[0004] In the prior art, a single wafer needs to be sent into an edge-finding chamber by a robot arm for edge-finding. Since edge-finding can only be performed on one wafer each time, the edge-finding efficiency is low. Summary of the invention

[0005] The purpose of the present application is to overcome the deficiencies in the prior art and to provide a dual-station edge-finding mechanism and a wafer positioning device.

[0006] To achieve the above technical objectives, the present application provides a dual-station edge-finding mechanism, comprising: a first carrier and a first rotation drive assembly, the first carrier is used to receive a wafer, and the first rotation drive assembly is used to drive the first carrier to rotate; a second carrier and a second rotation drive assembly, the second carrier is used to receive a wafer, and the second rotation drive assembly is used to drive the second carrier to rotate; wherein the first carrier comprises: a first connecting portion, used to connect the first rotation drive assembly; at least two supporting claws, at least two supporting claws are spaced apart on the lower surface of the first connecting portion, and can cooperate to support a wafer; the second carrier comprises: a second connecting portion, Used to connect the second rotation drive component; at least two top pillars, at least two top pillars are arranged at intervals on the upper surface of the second connecting part, and can cooperate to support a wafer; the first carrier and the second carrier are arranged relatively to each other in the vertical direction; the double-station edge-finding mechanism also includes a detection component, and the detection component is used to detect the notch of the wafer; during the edge-finding process, when the first rotation drive component drives the first carrier to rotate until the notch of the wafer is located at the first preset position, or when the second rotation drive component drives the second carrier to rotate until the notch of the wafer is located at the second preset position, the detection component can detect the notch, thereby confirming that the wafer has achieved edge-finding positioning.

[0007] Furthermore, a limiting groove is provided on the supporting claw, and the groove wall of the limiting groove is arranged in an arc shape. When the supporting claw supports the wafer, the wafer is restricted in the limiting groove, and the groove wall of the limiting groove can fit the outer circumference of the wafer; and / or, the surface of the supporting claw and / or the top column for contacting the wafer is provided with an anti-slip structure.

[0008] Furthermore, the second carrier also includes a limiting assembly, which includes an extreme limiting column, which is arranged on the wafer loading path and can prevent the wafer from continuing to move forward.

[0009] Furthermore, the limiting assembly also includes two auxiliary limiting columns, which are arranged opposite to each other along the diameter direction of the wafer; the two auxiliary limiting columns and one extreme limiting column are respectively arranged at three corners of an isosceles triangle.

[0010] Furthermore, the side surfaces of the limit limiting column and / or the auxiliary limit limiting column facing the top column are arranged in an arc shape to accommodate the wafer; or, the side surfaces of the limit limiting column and / or the auxiliary limit limiting column close to the top column are provided with limit notches, and when the top column supports the wafer, at least part of the wafer can be inserted into the limit notches.

[0011] Furthermore, the first preset position and the second preset position are arranged opposite to each other in the vertical direction; the detection component includes: a first detection member, which is arranged above the first preset position, and the detection signal emitted by the first detection member can extend obliquely toward the first preset position; a second detection member, which is arranged below the second preset position, and the detection signal emitted by the second detection member can extend obliquely toward the second preset position; a multi-faceted reflector, which is arranged between the first preset position and the second preset position; the multi-faceted reflector includes: a first reflecting surface, the first reflecting surface is opposite to the first detection member, and the detection signal emitted by the first detection member can be vertically emitted to the first reflecting surface; a second reflecting surface, the second reflecting surface is opposite to the second detection member, and the detection signal emitted by the second detection member can be vertically emitted to the second reflecting surface.

[0012] Furthermore, the double-station edge-finding mechanism also includes a lifting component, which is used to lift the wafer away from the supporting claw; after completing the edge-finding of a wafer, if the supporting claw is in the wafer loading and unloading path, the wafer is first lifted up by the lifting component, and after the wafer is separated from the supporting claw, the first carrier is driven to rotate by the first rotating drive component to facilitate the supporting claw to avoid the wafer loading and unloading path.

[0013] Furthermore, the lifting assembly includes: a mounting plate, which is arranged around the second connecting part; at least two lift rods, which are arranged on the mounting plate at intervals; a lifting drive member, which is connected to the mounting plate and is used to drive the lift rods to move in a vertical direction; wherein the lift rod includes: a avoidance portion, the lift column is surrounded by the avoidance portions, and the height of the avoidance portion is greater than the height of the lift column, and when the lift column supports the wafer, the avoidance portion is outside the wafer; a lifting portion, which is arranged on the avoidance portion, and when the supporting claws support the wafer, the lifting portion is below the wafer, and when the lifting portion lifts the wafer, it is surrounded between the supporting claws.

[0014] The present application also provides a wafer positioning device, including the above-mentioned dual-station edge-finding mechanism, and also includes: a working chamber, the dual-station edge-finding mechanism is arranged in the working chamber, and a wafer inlet and outlet are arranged on one side of the working chamber; a wafer conveying mechanism, which can dock with the dual-station edge-finding mechanism through the wafer inlet and outlet, thereby realizing the delivery or receipt of the wafer.

[0015] Furthermore, the wafer conveying mechanism includes: a robot for receiving wafers; a translation drive assembly for driving the robot to move horizontally so that the robot can enter and exit the working chamber; and a lifting drive assembly for driving the robot to move vertically so that the robot can cooperate with the first carrier or the second carrier to pick up and place wafers.

[0016] The present application provides a dual-station edge-finding mechanism, including a first carrier, a first rotation drive component, a second carrier, a second rotation drive component and a detection component. The first carrier and the second carrier can both receive wafers. After the carrier receives the wafer, it is driven to rotate with the wafer by the corresponding rotation drive component. When the wafer is rotated to the point where the notch on it is at the detection position where the detection component works, the detection component can capture the notch information, thereby confirming that the wafer is adjusted to a preset state. The first carrier includes a first connecting portion and a supporting claw, the supporting claw is arranged on the lower surface of the first connecting portion, the second carrier includes a second connecting portion and a top column, the top column is arranged on the upper surface of the second connecting portion, the first carrier and the second carrier are arranged relative to each other in the vertical direction, so that two wafers to be edge-finded can be placed on the first carrier. The two wafers are placed close to each other, which is beneficial to reducing the space occupied by the equipment, facilitating the wafer conveying mechanism to pick up and place the wafers, and can also set the two inspection stations required for the two wafers on the same vertical line to facilitate the operation of the inspection component; the double-station edge-finding mechanism provided in the present application can simultaneously find and position the edges of two wafers by setting two groups of carriers, and the edge-finding efficiency is high; since each group of carriers has an independent rotation drive component to drive it, the rotational edge-finding of the two wafers does not interfere with each other; after the notch reaches the corresponding preset position and is captured by the inspection component, the corresponding rotation drive component can stop the rotation of the carrier to facilitate the loading and unloading of the wafers; in actual operation, the two groups of carriers can work independently or in coordination, which can meet various wafer edge-finding needs.

[0017] The present application also provides a wafer positioning device, including the above-mentioned dual-station edge-finding mechanism, and also including a working chamber and a wafer conveying mechanism. The dual-station edge-finding mechanism is arranged in the working chamber, and the wafer conveying mechanism can dock with the dual-station edge-finding mechanism through the wafer inlet and outlet to realize the delivery or reception of the wafer; the structure for contacting the wafer is arranged in the working chamber, and the working chamber can not only protect the wafer, but also maintain the working environment and promote wafer operation; the driving structure is arranged outside the working chamber, which is conducive to the installation, debugging, maintenance and replacement of the driving structure; cooperating with the wafer conveying mechanism to pick up and place the wafer, the automation degree and work efficiency of the wafer edge-finding positioning can be further improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of the structure of the double-station edge-finding mechanism provided for this application;

[0019] Figure 2 for Figure 1 A schematic structural diagram of a first carrier, a second carrier and a lifting assembly in a double-station edge-finding mechanism shown;

[0020] Figure 3 for Figure 2 A schematic diagram of the structure when the middle supporting claw is in the wafer loading path and the lifting assembly lifts the wafer;

[0021] Figure 4 for Figure 2 Schematic diagram of the structure after the middle supporting claw turns away from the wafer loading path;

[0022] Figure 5 A schematic diagram of the structure of a first carrier provided in this application;

[0023] Figure 6 A schematic diagram of the structure of a second carrier provided in this application;

[0024] Figure 7 A top view of the structure of another second carrier provided by the present application;

[0025] Figure 8 A schematic structural diagram of a wafer positioning device provided in this application. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0027] The present application provides a dual-station edge-finding mechanism, including: a first carrier 10 and a first rotation drive assembly 30, the first carrier 10 is used to receive the wafer, and the first rotation drive assembly 30 is used to drive the first carrier 10 to rotate; a second carrier 20 and a second rotation drive assembly 40, the second carrier 20 is used to receive the wafer, and the second rotation drive assembly 40 is used to drive the second carrier 20 to rotate; a detection assembly 50, used to detect the notch of the wafer.

[0028] Specifically, both the first carrier 10 and the second carrier 20 can receive wafers; after the carrier receives the wafer, it is driven to rotate with the wafer through the corresponding rotation drive component. When the wafer is rotated to the point where the notch on it is at the inspection position where the inspection component 50 works, the inspection component 50 can capture the notch information, thereby confirming that the wafer is adjusted to a preset state.

[0029] The first rotating drive assembly 30 and the second rotating drive assembly 40 may adopt any driving structure that can conveniently drive the carrier to rotate, such as a motor, a rotating cylinder, etc. The detection assembly 50 may adopt any detection device that can obtain gap information, such as a reflective sensor, a through-beam sensor, a CCD camera, etc.

[0030] To facilitate the detection component 50 to capture the notch information of the two groups of wafers, the first carrier 10 further includes: a first connecting portion 11, used to connect the first rotation drive component 30; at least two supporting claws 12, at least two supporting claws 12 are spaced apart on the lower surface of the first connecting portion 11, and can cooperate to support a wafer; the second carrier 20 includes: a second connecting portion 21, used to connect the second rotation drive component 40; at least two top columns 22, at least two top columns 22 are spaced apart on the upper surface of the second connecting portion 21, and can cooperate to support a wafer; the first carrier 10 and the second carrier 20 are arranged relative to each other in the vertical direction.

[0031] For details, please refer to Figure 1 In the illustrated embodiment, the first carrier 10 and the second carrier 20 are arranged opposite to each other in the vertical direction; the first carrier 10 is arranged on the top and is in an inverted form compared to the second carrier 20, and the claw 12 is arranged in a hook shape for conveniently holding up the wafer; when the first carrier 10 receives the wafer, the wafer is suspended above the second carrier 20. The second carrier 20 is arranged at the bottom, and when the second carrier 20 receives the wafer, the top column 22 can support the wafer from bottom to top, so that the wafer is under the first carrier 10.

[0032] Continue to refer to Figure 1 When both the first carrier 10 and the second carrier 20 are loaded with wafers, the two wafers are arranged side by side in the vertical direction. The first carrier 10 and the second carrier 20 are arranged relative to each other so that the two wafers can be arranged close to each other, which is beneficial to reducing the space occupied by the equipment, and is convenient for the wafer conveying mechanism 2 to take and place the wafers. The two inspection stations required for the two wafers can also be arranged on the same vertical line, which is convenient for the inspection component 50 to operate.

[0033] Furthermore, during the edge finding process, when the first rotary drive component 30 drives the first carrier 10 to rotate until the notch of the wafer is located at the first preset position, or when the second rotary drive component 40 drives the second carrier 20 to rotate until the notch of the wafer is located at the second preset position, the detection component 50 can detect the notch, thereby confirming that the wafer has achieved edge finding positioning.

[0034] The first preset position and the second preset position may be in different orientations. At this time, the detection component 50 includes two groups of detection structures, one group of which corresponds to the first preset position, and the other group of which corresponds to the second preset position; when the wafer is rotated to the notch on it is in the corresponding preset position, the corresponding detection structure can capture the notch information of the wafer, thereby confirming that the wafer is adjusted in place.

[0035] Alternatively, the first preset position and the second preset position may be in a straight line. Figure 1 In the illustrated embodiment, the first preset position and the second preset position are both located on the right side of the first carrier 10 and the second carrier 20 , and the two are arranged side by side in the vertical direction.

[0036] In one embodiment, the detection component 50 includes a signal transmitting unit and a signal receiving unit, one of which is arranged above the first preset position and the other is arranged below the second preset position, and the signal transmitting unit and the signal receiving unit are arranged opposite to each other in the vertical direction. During the edge finding process, the detection signal emitted by the signal transmitting unit can be emitted vertically to the signal receiving unit along a straight line. When the notches of the two wafers are rotated to the corresponding preset positions, the first preset position and the second preset position are no longer blocked, and the signal receiving unit can receive the detection signal, thereby confirming that the two wafers are adjusted in place, so that the first rotation drive component 30 and the second rotation drive component 40 stop working, and the two wafers can be maintained in the preset state where the notches are at the preset positions.

[0037] In summary, the dual-station edge-finding mechanism provided in the present application can simultaneously find and position the edges of two wafers by setting up two groups of carriers, and the edge-finding efficiency is high; since each group of carriers has an independent rotation drive component for driving, the rotational edge-finding of the two wafers does not interfere with each other; after the notch reaches the corresponding preset position and is captured by the detection component 50, the corresponding rotation drive component can stop the rotation of the carrier to facilitate loading and unloading of wafers; in actual operation, the two groups of carriers can work independently or in coordination, which can meet the diverse wafer edge-finding needs.

[0038] Optionally, a limiting groove is provided on the supporting claw 12, and the groove wall of the limiting groove is arranged in an arc shape. When the supporting claw 12 supports the wafer, the wafer is restricted in the limiting groove, and the groove wall of the limiting groove can fit the outer circumference of the wafer.

[0039] For details, please refer to Figure 5In the illustrated embodiment, the first connection part 11 is arranged in a cylindrical shape, the upper end of the first connection part 11 is used to connect the first rotation drive assembly 30, and the lower end is provided with three groups of claws 12, and the three groups of claws 12 are arranged at intervals along the circumferential direction. The claws 12 include a vertical connection part and a horizontal receiving part, the upper end of the vertical connection part is connected to the first connection part 11, and the lower end is connected to the horizontal receiving part, and the horizontal receiving part extends horizontally inward and is used to support the wafer. The surface of the horizontal receiving part for contacting the wafer is provided with a limiting groove. When the first carrier 10 receives the wafer, the wafer is supported by the three horizontal receiving parts and is limited in the three limiting grooves. Since the groove wall of the limiting groove is arranged in an arc shape and can fit the outer circumference of the wafer, the three limiting grooves can reliably contain the wafer; in this way, the position of the wafer can be limited, ensuring that the wafer is in the preset position, and the gap can be captured by the detection assembly 50, and the displacement of the wafer can be prevented, and the stability of the wafer during the rotation edge search process can be ensured.

[0040] Optionally, the surfaces of the claws 12 and / or the top pillars 22 that are used to contact the wafer are provided with an anti-slip structure.

[0041] The anti-skid structure may be a rough surface, densely arranged anti-skid blocks, anti-skid stripes, or any other structure that can increase the friction between the wafer and the claws 12 , or between the wafer and the top column 22 .

[0042] The anti-slip structure can enhance the stability of the first carrier 10 and the second carrier 20 in receiving the wafer, and reduce the possibility of displacement or movement of the wafer during the rotation and edge finding process.

[0043] Optionally, the second carrier 20 further includes a limiting assembly, which includes a limit limiting column 23 , and the limit limiting column 23 is disposed on the wafer loading path and can prevent the wafer from continuing to move forward.

[0044] For details, please refer to Figure 6 In the illustrated embodiment, the wafer loading path extends from left to right. When the wafer conveying mechanism 2 delivers the wafer to the second carrier 20, the wafer can gradually approach the preset station from left to right along the wafer loading path.

[0045] Continue to refer to Figure 6 The limit stopper 23 is arranged on the right side of the top column 22. The wafer continues to move to the right and will eventually be intercepted by the top column 22, which can prevent the wafer from continuing to move to the right.

[0046] It is easy to understand that the limit limit column 23 is used to limit the limit position of wafer loading, ensuring that the wafer is delivered close to or even in contact with the limit limit column 23, thereby ensuring that the wafer is transported to the preset workstation; at the same time, since the wafer loading path is cut off, it can also prevent the wafer from being transported offside.

[0047] By ensuring that the wafer is at the preset position when the second carrier 20 receives the wafer, it can be ensured that during the wafer rotation and edge finding process, the notch on the wafer can appear at the second preset position and can be captured by the detection component 50 .

[0048] Furthermore, the limiting assembly further includes two auxiliary limiting posts 24 , which are arranged opposite to each other along the diameter direction of the wafer; the two auxiliary limiting posts 24 and one extreme limiting post 23 are arranged at three corners of an isosceles triangle.

[0049] For details, please refer to Figure 7 In the illustrated embodiment, three top columns 22 are provided on the second connection portion 21, and the three top columns 22 are arranged at intervals along the circumferential direction and can cooperate to support the middle part of the wafer. An extreme limit column 23 and two auxiliary limit columns 24 are also provided on the second connection portion 21; the three top columns 22 are surrounded by the three limit columns. The extreme limit column 23 is provided on the vertex of the isosceles triangle, and the two auxiliary limit columns 24 are respectively provided on the two bottom corners of the isosceles triangle. When the top column 22 supports the wafer (the wafer is indicated by a dotted line in the figure), the upper end of the wafer can abut against the extreme limit column 23, and the left and right sides of the wafer can abut against the two auxiliary limit columns 24.

[0050] Figure 7 In the embodiment shown, the wafer loading path extends from bottom to top. Since the two auxiliary limit posts 24 are located on the left-right diameter of the wafer, when the wafer conveying mechanism 2 delivers the wafer to the second carrier 20 from bottom to top, the limit assembly will not hinder the entry and exit of the wafer. When the upper end of the wafer abuts against the limit limit post 23, it can be confirmed that the wafer has been transported to the right position. By ensuring that the upper end of the wafer abuts against the limit limit post 23 and the left and right ends abut against the auxiliary limit posts 24, it can be ensured that the wafer is restricted to the preset position and is not easily displaced or moved.

[0051] Optionally, the side surfaces of the limit limiting pillars 23 and / or the auxiliary limiting pillars 24 facing the top pillar 22 are arranged in an arc shape to accommodate the wafer.

[0052] Specific reference reference Figure 7 In the illustrated embodiment, the lower surface of the limit limiting column 23 is set to be a curved surface and has a certain length, which can fit a section of the outer circumference of the upper end of the wafer. The right side surface of the group of auxiliary limiting columns 24 set on the left is set to be a curved surface and has a certain length, which can fit a section of the outer circumference of the left end of the wafer. The left side surface of the group of auxiliary limiting columns 24 set on the right is set to be a curved surface and has a certain length, which can fit a section of the outer circumference of the right end of the wafer.

[0053] The limiting pillars can be attached to and contain the wafer, which can improve the limiting reliability of the wafer by the limiting pillars, and can avoid the problem of excessive pressure when the limiting pillars and the wafer are in point contact, which is beneficial to protecting the wafer.

[0054] Optionally, the extreme limiting column 23 and / or the auxiliary limiting column 24 are provided with limiting notches on the sides close to the top column 22, and when the top column 22 supports the wafer, at least part of the wafer can be inserted into the limiting notches.

[0055] For details, please refer to Figure 6 In the illustrated embodiment, a limiting notch is provided on the left side of the limit limiting column 23, and the height of the limiting notch in the vertical direction is greater than the thickness of the wafer. When the wafer conveying mechanism 2 delivers the wafer from left to right, the right end of the wafer can be inserted into the limiting notch. The limiting notch can prevent the wafer from continuing to move to the right so that the wafer stays at the preset position, and can also prevent the wafer from moving up and down.

[0056] In addition, the lower wall of the limiting notch is made to be at the same height as the top column 22 . When the second carrier 20 supports the wafer, the top column 22 can support the middle of the wafer, and the limiting column can support the edge of the wafer.

[0057] In one embodiment, the first preset position and the second preset position are arranged opposite to each other in the vertical direction; the detection component 50 includes: a first detection member 51, which is arranged above the first preset position, and the detection signal emitted by the first detection member 51 can extend obliquely toward the first preset position; a second detection member 52, which is arranged below the second preset position, and the detection signal emitted by the second detection member 52 can extend obliquely toward the second preset position; a multi-faceted reflector 53, which is arranged between the first preset position and the second preset position; the multi-faceted reflector 53 includes: a first reflecting surface, the first reflecting surface is opposite to the first detection member 51, and the detection signal emitted by the first detection member 51 can be vertically emitted to the first reflecting surface; a second reflecting surface, the second reflecting surface is opposite to the second detection member 52, and the detection signal emitted by the second detection member 52 can be vertically emitted to the second reflecting surface.

[0058] For details, please refer to Figure 1 In the illustrated embodiment, both the first detection member 51 and the second detection member 52 use laser reflectors. When the first carrier 10 receives the wafer, the first preset position is at the right end of the wafer; when the second carrier 20 receives the wafer, the second preset position is at the right end of the wafer; the first preset position and the second preset position are directly opposite to each other in the up-down direction. The laser signal emitted by the first detection member 51 can be emitted from top to bottom and tilted to the right toward the first preset position; the laser signal emitted by the second detection member 52 can be emitted from bottom to top and tilted to the right toward the second preset position.

[0059] Continue to refer to Figure 1, the multi-faceted reflector 53 is arranged in a triangular shape. The upper inclined surface of the multi-faceted reflector 53 is its first reflective surface, and the first reflective surface extends from bottom to top and tilted to the right. When the wafer carried by the first carrier 10 rotates to the notch thereon and reaches the first preset position, the first preset position is no longer blocked, and the laser signal emitted by the first detection component 51 can pass through the first preset position and shoot toward the first reflective surface. Since the laser signal emitted by the first detection component 51 is perpendicular to the first reflective surface, the laser signal can be reflected back along the original path after contacting the first reflective surface, so that the first detection component 51 can receive the reflected signal.

[0060] Similarly, continue to refer to Figure 1 The lower slope of the multi-faceted reflector 53 is its second reflective surface, and the second reflective surface extends from top to bottom and tilted to the right. When the wafer carried by the second carrier 20 rotates to the notch thereon and reaches the second preset position, the second preset position is no longer blocked, and the laser signal emitted by the second detection member 52 can pass through the second preset position and shoot toward the second reflective surface. Since the laser signal emitted by the second detection member 52 is perpendicular to the second reflective surface, the laser signal can be reflected back along the original path after contacting the second reflective surface, so that the second detection member 52 can receive the reflected signal.

[0061] Since the detection signal emitted by the detection component extends obliquely toward the preset position, and the extension direction of the detection signal is perpendicular to the corresponding reflection surface, even if the preset position is blocked, the detection signal contacts the non-notch part of the wafer and is reflected by the wafer, the reflected signal will not be captured by the detection component, and there will be no problems such as false detection.

[0062] In addition, the detection element and the multi-faceted reflector 53 are arranged relative to each other in an inclined direction, so that the vertical space occupied by the detection component 50 can be reduced; at the same time, since the multi-faceted reflector 53 has a small structure and does not require external cables, and the multi-faceted structure allows one reflector to reflect the signals of two detection elements, the spatial layout of the equipment is further optimized.

[0063] It is easy to imagine that when the first carrier 10 supports the wafer through the claws 12, during the process of rotating and finding the edge, the claws 12 will move to the wafer loading and unloading path.

[0064] For details, please refer to Figure 8 In the illustrated embodiment, the double-station edge-finding mechanism is arranged in the working chamber 1, and a wafer inlet and outlet are arranged on the left side of the working chamber 1. The wafer conveying mechanism 2 can convey the wafer from left to right into the first carrier 10 through the wafer inlet and outlet. After completing the edge-finding of a wafer, if there is a claw 12 on the left side of the first carrier 10, because the claw 12 is facing the wafer inlet and outlet and is on the wafer loading and unloading path, it will prevent the wafer conveying mechanism 2 from receiving the wafer.

[0065] In order to avoid interference from the supporting claws 12 , in one embodiment, the double-station edge-finding mechanism provided in the present application further includes a lifting assembly 60 , which is used to lift the wafer away from the supporting claws 12 .

[0066] Specifically, after completing the edge finding of a wafer, if there is a claw 12 on the wafer loading and unloading path, the wafer is first lifted up by the lifting mechanism. After the wafer is separated from the claw 12, the first carrier 10 is driven to rotate by the first rotating drive component 30 so that the claw 12 can avoid the wafer loading and unloading path.

[0067] The lifting mechanism includes a lifting tool and a lifting drive assembly, and the lifting drive assembly is used to drive the lifting tool to move in the vertical direction so that the lifting tool can lift the wafer away from the supporting claw 12. The lifting tool can be any structure that can lift the wafer, such as a plate, a block, a rod, etc. The lifting drive assembly can be any structure that can drive the lifting tool to rise and fall, such as a cylinder, an electric cylinder, etc.

[0068] The present application does not limit the specific configuration of the lifting assembly 60 .

[0069] In a specific embodiment, the lifting assembly 60 includes: a mounting plate 61, which is arranged around the second connecting portion 21; at least two lift rods 62, which are arranged on the mounting plate 61 at intervals; a lifting driving member 63, which is connected to the mounting plate 61 and is used to drive the lift rod 62 to move in the vertical direction; wherein the lift rod 62 includes: a avoiding portion 62a, the top column 22 is surrounded by the avoiding portion 62a, and the height of the avoiding portion 62a is greater than the height of the top column 22, and when the top column 22 supports the wafer, the avoiding portion 62a is outside the wafer. side; the lifting portion 62b is arranged on the avoiding portion 62a, and when the supporting claws 12 support the wafer, the lifting portion 62b is under the wafer, and when the lifting portion 62b lifts the wafer, it is surrounded by the supporting claws 12; after completing the edge finding of a wafer, if the supporting claws 12 are in the wafer loading and unloading path, the lifting drive component 63 can drive the ejector rod 62 to rise, so that the lifting portion 62b contacts and lifts the wafer. After the wafer is separated from the supporting claws 12, the first rotating drive component 30 drives the first carrier 10 to rotate, and the supporting claws 12 can avoid the wafer loading and unloading path.

[0070] The lifting drive member 63 may be any driving structure such as a pneumatic cylinder or an electric cylinder that can conveniently realize the lifting movement of the mounting plate 61 and the push rod 62 in the vertical direction.

[0071] For details, please refer to Figure 2In the illustrated embodiment, the second connection part 21 is provided in a cylindrical shape, the mounting plate 61 is provided in a circular ring shape, the mounting plate 61 is provided outside the second connection part 21, and the second connection part 21 is located in the central circular hole of the mounting plate 61. The lifting assembly 60 is provided around the second carrier 20, which is convenient for the lifting assembly 60 to lift the wafer from bottom to top, and convenient for arranging the lifting drive 63 outside the working chamber 1, and also makes the lifting assembly 60 not occupy additional vertical space, which is beneficial to the equipment layout.

[0072] Continue to refer to Figure 2 The second connecting portion 21 is provided with three top columns 22, which are spaced apart along the circumferential direction; the mounting plate 61 is provided with three top rods 62, which are spaced apart along the circumferential direction of the mounting plate 61. The three top columns 22 are surrounded by the three top rods 62.

[0073] Combined with reference Figure 3 and Figure 4 When the second carrier 20 receives the wafer, the projection area of ​​the wafer on the horizontal plane can completely cover the projection area of ​​the second carrier 20 on the horizontal plane, that is, the second carrier 20 supports the wafer at the center, and the edge of the wafer is outside the second carrier 20. In this way, it is convenient to arrange the detection component 50 to capture the gap information.

[0074] Reference Figures 1 to 4 , the avoidance portion 62a is set away from the top column 22; the circle where the three avoidance portions 62a are located is concentric with the circle where the three top columns 22 are located, and the diameter of the circle where the three avoidance portions 62a are located is larger than the diameter of the wafer; because the avoidance portion 62a is higher than the top column 22, when the top column 22 supports the wafer, the wafer is also surrounded by the three avoidance portions 62a; ensuring that the three avoidance portions 62a are not in the wafer loading and unloading path, the avoidance design of the avoidance portion 62a can ensure that the setting and movement of the lifting assembly 60 will not interfere with the normal operation of the second carrier 20.

[0075] Continue to refer to Figures 1 to 4 The top rod 62 also includes a horizontal connecting portion 62c, one end of which is connected to the top of the top rod 62, and the other end of which extends inward toward the center of the circle and is connected to the lifting portion 62b.

[0076] Reference Figure 1 The lower surface of the first connecting portion 11 is provided with three claws 12, and the three claws 12 are arranged at intervals along the circumferential direction. The three lifting portions 62b are located between the three claws 12. The horizontal connecting portion 62c is always lower than the claws 12. In the non-lifting state, the lifting portion 62b is also lower than the claws 12.

[0077] Combined with reference Figure 3 and Figure 4In the lifting state, the lifting portion 62b can move vertically to be higher than the claws 12, thereby lifting the wafer. Since the lifting portion 62b is surrounded by the claws 12 and the horizontal connection portion 62c is lower than the claws 12, the claws 12 and the ejector rod 62 will not interfere with each other; after the wafer is lifted, the claws 12 can rotate under the drive of the first rotation drive assembly 30; after the claws 12 are out of position, the ejector rod 62 can descend under the drive of the lifting drive member 63.

[0078] In one embodiment, the double-station edge-finding mechanism further includes an avoidance detection mechanism for confirming whether the wafer loading and unloading paths are unobstructed.

[0079] Specifically, after a wafer on the first carrier 10 completes edge finding and positioning, a position avoidance detection mechanism (which may use a photoelectric sensor, a distance sensor, a CCD camera, etc.) is used to confirm whether the wafer loading and unloading path is unobstructed. If there is a supporting claw 12 on the wafer loading and unloading path, the lifting assembly 60 is started, and the lifting drive component 63 drives the lifting rod 62 to rise, so that the lifting rod 62 lifts the wafer. Subsequently, the first rotation drive assembly 30 drives the first carrier 10 to rotate, so that the supporting claw 12 leaves the wafer loading and unloading path; after the wafer loading and unloading path is unobstructed, the wafer conveying mechanism 2 can take away the wafer that has completed edge finding and positioning.

[0080] In another embodiment, the first rotation driving assembly 30 has a reset procedure.

[0081] Specifically, after the first carrier 10 receives the wafer, the first rotary drive component 30 drives the first carrier 10 to rotate forward N° so that the notch of the wafer reaches the first preset position; the detection component 50 confirms that the wafer has completed edge positioning, the lifting component 60 is started, and the lifting drive component 63 drives the lift rod 62 to rise so that the lift rod 62 lifts the wafer, and then, the first rotary drive component 30 drives the first carrier 10 to rotate reverse N° so that the first carrier 10 returns to its initial position.

[0082] In this embodiment, it is ensured that when the first carrier 10 is in the initial position, the claws 12 avoid the wafer loading and unloading path and do not interfere with the wafer loading and unloading. After completing the edge positioning of a wafer, the first carrier 10 is restored to the initial position through the reset procedure, thereby ensuring the smooth loading and unloading path of the wafer.

[0083] The present application also provides a wafer positioning device, including the above-mentioned dual-station edge-finding mechanism, and also includes: a working chamber 1, the dual-station edge-finding mechanism is arranged in the working chamber 1, and a wafer inlet and outlet are arranged on one side of the working chamber 1; a wafer conveying mechanism 2, which can dock with the dual-station edge-finding mechanism through the wafer inlet and outlet, thereby realizing the delivery or receipt of the wafer.

[0084] For details, please refer to Figure 8In the illustrated embodiment, the first rotary drive assembly 30 is disposed outside the working chamber 1 and above the working chamber 1. The movable end of the first rotary drive assembly 30 extends from top to bottom into the working chamber 1 and is connected to the first carrier 10. The second rotary drive assembly 40 is disposed outside the working chamber 1 and below the working chamber 1. The movable end of the second rotary drive assembly 40 extends from bottom to top into the working chamber 1 and is connected to the second carrier 20. The lifting drive member 63 is also disposed outside the working chamber 1 and below the working chamber 1. The movable end of the lifting drive member 63 extends from bottom to top into the working chamber 1 and is connected to the mounting plate 61.

[0085] The structure for contacting the wafer is arranged in the working chamber 1, and the working chamber 1 can protect the wafer, maintain the working environment and promote the wafer operation.

[0086] Arranging the driving structure outside the working chamber 1 is convenient for installation, commissioning, maintenance and replacement of the driving structure.

[0087] The wafer conveying mechanism 2 may adopt any structure that is convenient for conveying wafers, such as a manipulator, a robot, a conveyor belt, etc.

[0088] In one embodiment, the wafer conveying mechanism 2 includes: a robot for receiving wafers; a translation drive component for driving the robot to move horizontally to facilitate the robot to enter and exit the working chamber 1; and a lifting drive component for driving the robot to move vertically to facilitate the robot to cooperate with the first carrier 10 or the second carrier 20 to pick up and place wafers.

[0089] Among them, the manipulator can adopt any structure such as plates, blocks, etc. that are convenient for supporting wafers, and the translation drive component and the lifting drive component can adopt any drive structure such as electric cylinders, linear modules, etc. that are convenient for driving the manipulator to move horizontally or vertically.

[0090] For details, please refer to Figure 8In the illustrated embodiment, the manipulator is provided in a sheet shape, and fingers are provided at the front end of the manipulator facing the working chamber 1, and the fingers are spaced apart to facilitate insertion into the top column 22. A wafer inlet and outlet are provided on the left side of the working chamber 1. When delivering a wafer to the second carrier 20, the manipulator supports a wafer, and the translation drive assembly drives the manipulator from left to right, through the wafer inlet and outlet, and approaches the second carrier 20; after the wafer is suspended above the top column 22, the lifting drive assembly drives the manipulator to descend so that the wafer falls on the top column 22; the front end of the manipulator and the space between the fingers can play a role in avoiding the top column 22; when the manipulator is lower than the top column 22, the wafer is separated from the manipulator, and the translation drive assembly drives the manipulator to move from right to left so that the manipulator leaves the working chamber 1. After the wafer on the second carrier 20 completes edge positioning, the translation drive assembly drives the robot from left to right, through the wafer inlet and outlet, and approaches the second carrier 20; after the robot is inserted into the top column 22 and is under the wafer, the lifting drive assembly drives the robot to rise so that the robot can hold up the wafer; after the wafer is separated from the top column 22, the translation drive assembly drives the robot to move from right to left so that the robot can carry the wafer out of the working chamber 1.

[0091] Similarly, when delivering the wafer to the first carrier 10, the robot arm can translate, approach the claws 12, and then descend to allow the wafer to fall onto the claws 12; after the wafer on the first carrier 10 completes edge positioning, the robot arm can translate, approach the claws 12, and then rise to lift the wafer and carry the wafer out of the working chamber.

[0092] Optionally, the wafer positioning device includes only one set of wafer conveying mechanisms 2, and the set of wafer conveying mechanisms 2 can dock with the first carrier 10 and the second carrier 20 in sequence and as needed to achieve the placement and loading of wafers at the dual stations.

[0093] Optionally, the wafer positioning device includes two sets of wafer conveying mechanisms 2, one set of wafer conveying mechanisms 2 is used to dock with the first carrier 10, and the other set of wafer conveying mechanisms 2 is used to dock with the second carrier 20. At this time, the two sets of wafer conveying mechanisms 2 can independently perform wafer placement at the required workstations.

[0094] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A double-station edge-finding mechanism, characterized in that: include: A first carrier (10) and a first rotation drive assembly (30), wherein the first carrier (10) is used to receive a wafer, and the first rotation drive assembly (30) is used to drive the first carrier (10) to rotate; a second carrier (20) and a second rotation drive assembly (40), wherein the second carrier (20) is used to receive the wafer, and the second rotation drive assembly (40) is used to drive the second carrier (20) to rotate; Wherein, the first carrier (10) comprises: A first connecting portion (11), used for connecting to the first rotation driving assembly (30); At least two supporting claws (12), the at least two supporting claws (12) being arranged at intervals on the lower surface of the first connecting portion (11) and being capable of supporting a wafer in cooperation; The second carrier (20) comprises: A second connecting portion (21), used for connecting to the second rotation driving assembly (40); At least two top pillars (22), at least two of the top pillars (22) are arranged at intervals on the upper surface of the second connecting portion (21) and are capable of supporting a wafer; The first carrier (10) and the second carrier (20) are arranged opposite to each other in a vertical direction; The dual-station edge-finding mechanism further comprises a detection component (50), wherein the detection component (50) is used to detect a notch in the wafer; During the edge finding process, when the first rotation driving component (30) drives the first carrier (10) to rotate until the notch of the wafer is located at a first preset position, or when the second rotation driving component (40) drives the second carrier (20) to rotate until the notch of the wafer is located at a second preset position, the detection component (50) is able to detect the notch, thereby confirming that the wafer has achieved edge finding positioning; The first preset position and the second preset position are arranged opposite to each other along the vertical direction; The detection component (50) comprises: A first detection member (51) is disposed above the first preset position, and a detection signal emitted by the first detection member (51) is capable of extending obliquely toward the first preset position; A second detection member (52) is disposed below the second preset position, and a detection signal emitted by the second detection member (52) is capable of extending obliquely toward the second preset position; A multi-faceted reflector (53) is arranged between the first preset position and the second preset position; The multi-faceted reflector (53) comprises: a first reflecting surface, the first reflecting surface facing the first detecting element (51), and the detection signal emitted by the first detecting element (51) being able to be emitted vertically toward the first reflecting surface; A second reflecting surface, the second reflecting surface directly faces the second detecting element (52), and the detection signal emitted by the second detecting element (52) can be emitted vertically toward the second reflecting surface.

2. The double-station edge-finding mechanism according to claim 1, characterized in that: The supporting claw (12) is provided with a limiting groove, the groove wall of the limiting groove is arranged in an arc shape, when the supporting claw (12) supports the wafer, the wafer is restricted in the limiting groove, and the groove wall of the limiting groove can fit the outer circumference of the wafer; And / or, the surfaces of the supporting claws (12) and / or the top pillars (22) for contacting the wafer are provided with an anti-slip structure.

3. The double-station edge-finding mechanism according to claim 1, characterized in that: The second carrier (20) further comprises a limiting assembly, wherein the limiting assembly comprises a limit limiting column (23), and the limit limiting column (23) is arranged on the wafer loading path and can prevent the wafer from continuing to move forward.

4. The double-station edge-finding mechanism according to claim 3, characterized in that: The limiting assembly further comprises two auxiliary limiting columns (24), wherein the two auxiliary limiting columns (24) are arranged opposite to each other along the diameter direction of the wafer; The two auxiliary limiting columns (24) and the one limit limiting column (23) are respectively arranged at three corners of an isosceles triangle.

5. The double-station edge-finding mechanism according to claim 4, characterized in that: The side surfaces of the limit limiting pillar (23) and / or the auxiliary limiting pillar (24) facing the top pillar (22) are arranged in an arc shape so as to accommodate the wafer; Alternatively, the extreme limiting column (23) and / or the auxiliary limiting column (24) are provided with limiting notches on the side surfaces close to the top column (22), and when the top column (22) supports the wafer, at least part of the wafer can be inserted into the limiting notches.

6. The double-station edge-finding mechanism according to any one of claims 1 to 5, characterized in that: It also includes a lifting assembly (60), wherein the lifting assembly (60) is used to lift the wafer away from the supporting claw (12); After completing the edge finding of a wafer, if the supporting claw (12) is on the wafer loading and unloading path, the wafer is first lifted up by the lifting component (60), and after the wafer is separated from the supporting claw (12), the first carrier (10) is driven to rotate by the first rotating drive component (30) so that the supporting claw (12) avoids the wafer loading and unloading path.

7. The double-station edge-finding mechanism according to claim 6, characterized in that: The lifting assembly (60) comprises: A mounting plate (61) disposed around the second connecting portion (21); at least two push rods (62), wherein at least two of the push rods (62) are arranged on the mounting plate (61) at intervals; A lifting drive member (63) connected to the mounting plate (61) and used for driving the lift rod (62) to move along the vertical direction; Wherein, the push rod (62) comprises: The top column (22) is surrounded by the avoidance portions (62a), and the height of the avoidance portions (62a) is greater than the height of the top column (22); when the top column (22) supports a wafer, the avoidance portions (62a) are located outside the wafer; The lifting portion (62b) is arranged on the avoiding portion (62a); when the supporting claws (12) support the wafer, the lifting portion (62b) is located below the wafer; when the lifting portion (62b) lifts the wafer, it is surrounded by the supporting claws (12).

8. The double-station edge-finding mechanism according to claim 6, characterized in that: The double-station edge-finding mechanism also includes a position avoidance detection mechanism, which is used to confirm whether the wafer loading and unloading path is unobstructed; Alternatively, the first rotary drive component (30) has a reset procedure. After the first carrier (10) receives the wafer, the first rotary drive component (30) drives the first carrier (10) to rotate N° in the forward direction so that the notch of the wafer reaches the first preset position. The detection component (50) confirms that the wafer has completed edge positioning. The lifting component (60) is started to lift the wafer off the claw (12). The first rotary drive component (30) drives the first carrier (10) to rotate N° in the reverse direction so that the first carrier (10) returns to its initial position.

9. A wafer positioning device, characterized in that: The dual-station edge-finding mechanism comprises the dual-station edge-finding mechanism according to any one of claims 1 to 8, further comprising: A working chamber (1), wherein the double-station edge-finding mechanism is arranged in the working chamber (1), and a wafer inlet and outlet are arranged on one side of the working chamber (1); The wafer conveying mechanism (2) can be connected to the double-station edge-finding mechanism through the wafer inlet and outlet, thereby achieving the delivery or reception of the wafer.

10. The wafer positioning device according to claim 9, characterized in that: The wafer conveying mechanism (2) comprises: A robot arm for receiving wafers; A translation drive assembly, used for driving the manipulator to move horizontally, so as to facilitate the manipulator to enter and exit the working chamber (1); The lifting drive assembly is used to drive the robot arm to move vertically, so that the robot arm cooperates with the first carrier (10) or the second carrier (20) to pick up and place wafers.

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