Combined package structure and method of forming the same

Abstract

The application discloses a combined packaging structure and a forming method thereof. The forming method comprises the following steps: providing a packaging frame, electronic components and a silicon steel sheet; the packaging frame comprises a first limiting opening, a second limiting opening and a limiting part between the first limiting opening and the second limiting opening; the electronic components comprise a plastic sealing part and a plurality of pins extending from the side of the plastic sealing part; the silicon steel sheet has an open end; the electronic components are placed into the first limiting opening, so that the plastic sealing part of the electronic components is close to the side of the limiting part, and the front end of the pin of the electronic components is close to the part of the packaging frame away from the limiting part; the silicon steel sheet is placed into the second limiting opening, and the open end of the silicon steel sheet faces the limiting part; UV glue is formed to fix the plastic sealing part, the silicon steel sheet and the limiting part; and the front end of the pin and the part of the packaging frame close to the front end are welded together. The silicon steel sheet cannot sink, and the position is not easy to deviate and fall off, so that the assembly requirement is met, the performance of the product is improved, and the appearance defect of the product is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor packaging, in particular to a combined packaging structure and a forming method thereof. BACKGROUND

[0002] The existing IMD (In-Mold Decoration) product in the market is a combined packaging. The components of the IMD product generally include a silicon steel sheet, a frame, a TO (Transistor Outline) device and a plastic package.

[0003] The packaging process of the existing IMD product generally includes: bonding the TO device and the silicon steel sheet after plastic packaging and without electroplating on the frame through curing glue; forming a plastic package covering the TO device, the silicon steel sheet and part of the frame; electrically connecting the pins of the TO device and the frame through copper wire or conductive glue, and electroplating protective metal on the pins of the TO device and the pins of the frame; cutting off the webs in the frame to form a shaped packaging product.

[0004] The packaging scheme of the existing IMD product has the following problems: the existing curing glue cannot be quickly cured, and the silicon steel sheet will sink during the packaging process, so that the position of the silicon steel sheet cannot meet the assembly requirements, affecting the performance of the product; the curing glue of the TO device will melt during the plastic packaging preheating process, polluting the plastic packaging mold or the pins of the TO device; the organic matter in the existing curing glue is easy to volatilize during electroplating and baking, so that the product will have color difference, yellow spots and other poor appearance of the plating layer; when the TO device is electrically connected with the frame, the point conductive glue will pollute the plating solution, the organic matter will cause the plating layer to turn black and flower, and the copper wire will have poor contact and cause copper leakage, and the copper wire end may form a jam during electroplating. SUMMARY

[0005] The technical problem to be solved by the present application is to provide a combined packaging structure and a forming method thereof, to improve the assembly position accuracy of the silicon steel sheet, prevent the curing glue from polluting the plastic packaging mold or the pins of the TO device, and maintain the good appearance of the packaging product.

[0006] To solve the above problems, the present application provides a forming method of a combined packaging structure, comprising:

[0007] A packaging frame, an electronic component and a silicon steel sheet are provided. The packaging frame comprises a first limiting opening and a second limiting opening arranged oppositely, and a limiting portion between the first limiting opening and the second limiting opening. The electronic component comprises a plastic package and a plurality of pins extending from the side surface of the plastic package. The silicon steel sheet has an open end.

[0008] placing the electronic component into the first limiting opening, so that the plastic package of the electronic component is close to the side of the limiting part, and the front end of the pin of the electronic component is close to the part of the packaging frame away from the limiting part;

[0009] placing the silicon steel sheet into the second limiting opening, and the opening end of the silicon steel sheet is towards the limiting part;

[0010] forming the UV glue for fixing the plastic package of the electronic component, the silicon steel sheet and the limiting part of the packaging frame, and when the UV glue is formed, the silicon steel sheet is pushed towards the limiting part so that the limiting part is clamped in the opening end of the silicon steel sheet;

[0011] welding the front end of the pin of the electronic component and the part of the packaging frame close to the front end.

[0012] In some embodiments, after the front end of the pin of the electronic component and the part of the packaging frame close to the front end are welded together, the method further comprises: forming a plastic package layer covering the plastic package of the electronic component, the silicon steel sheet and the limiting part of the packaging frame; and electroplating the pin of the electronic component.

[0013] In some embodiments, the packaging frame further comprises a middle rib and a pin, the middle rib surrounds the first limiting opening and the second limiting opening, two ends of the limiting part are connected to the middle ribs, the pin is two in number and is located on both sides of the first limiting opening, one end of the pin is connected to the middle rib, and the other end of the pin is connected to the limiting part.

[0014] In some embodiments, the pin of the electronic component is electroplated at the same time as the pin is electroplated, and the electroplating current is applied through the packaging frame.

[0015] In some embodiments, after the electroplating is completed, the middle rib is cut off so that the pin and the pin are separated from the middle rib.

[0016] In some embodiments, the process of forming the UV glue for fixing the plastic package of the electronic component, the silicon steel sheet and the limiting part of the packaging frame comprises: applying the UV glue on the surface points of the limiting part; rapidly curing the UV glue by UV light irradiation; and baking the UV glue after the UV light irradiation.

[0017] In some embodiments, the power of the UV light is 2000±500 mw / cm 2 when the UV light is irradiated, and the curing rate of the UV glue is 20%-30% after the UV light irradiation.

[0018] In some embodiments, the baking temperature of the baking process is 150±5℃, the baking time is 5-10min, and the curing rate of the UV glue after the baking process is 100%.

[0019] In some embodiments, the front end of the pin of the electronic component and the part of the packaging frame close to the front end are welded together by laser welding.

[0020] In some embodiments, the laser power during the laser welding is 0.5-1kw, and the time is 0.05-0.15ms.

[0021] In some embodiments, the silicon steel sheet is a "U" type silicon steel sheet, and the electronic component includes a power device.

[0022] The application also provides a combined packaging structure, characterized in that it comprises:

[0023] A packaging frame, which comprises a first limiting opening and a second limiting opening arranged oppositely, and a limiting part between the first limiting opening and the second limiting opening;

[0024] An electronic component, which comprises a plastic encapsulation part and a plurality of pins extending from the side of the plastic encapsulation part, the electronic component is located in the first limiting opening, the plastic encapsulation part of the electronic component is fixed to the side of the limiting part by UV glue, and the front end of the pin of the electronic component is welded to the part of the packaging frame away from the limiting part;

[0025] A silicon steel sheet, which has an open end, the silicon steel sheet is located in the second limiting opening, and the open end of the silicon steel sheet is clamped to the limiting part by UV glue.

[0026] In some embodiments, it further comprises a plastic encapsulation layer covering the plastic encapsulation part of the electronic component, the silicon steel sheet and the limiting part of the packaging frame.

[0027] In some embodiments, the packaging frame further comprises a middle rib and a pin, the middle rib surrounds the first limiting opening and the second limiting opening, the two ends of the limiting part are connected to the middle ribs on both sides, the number of the pins is two, which are respectively located on both sides of the first limiting opening, one end of the pin is connected to the middle rib, and the other end is connected to the limiting part.

[0028] The technical scheme of the application has the following advantages:

[0029] The combination packaging structure and the forming method thereof in some embodiments of the present application, the forming method thereof, provides a packaging frame, an electronic component and a silicon steel sheet, the packaging frame comprises a first limiting opening and a second limiting opening arranged oppositely, and a limiting part between the first limiting opening and the second limiting opening, the electronic component comprises a plastic encapsulation part and a plurality of pins extending from the side of the plastic encapsulation part, and the silicon steel sheet has an open end; the electronic component is placed into the first limiting opening, the plastic encapsulation part of the electronic component is close to the side of the limiting part, and the front end of the pin of the electronic component is close to the part of the packaging frame away from the limiting part; the silicon steel sheet is placed into the second limiting opening, and the open end of the silicon steel sheet faces the limiting part; the UV glue is formed to fix the plastic encapsulation part of the electronic component, the silicon steel sheet and the limiting part of the packaging frame, and when the UV glue is formed, the silicon steel sheet is pushed towards the limiting part so that the limiting part is clamped in the open end of the silicon steel sheet; and the front end of the pin of the electronic component and the part of the packaging frame close to the front end are welded together. In the present application, when the electronic component and the silicon steel sheet are assembled, the plastic encapsulation part of the electronic component, the silicon steel sheet and the limiting part of the packaging frame are fixed by the UV glue, and when the UV glue is formed, the UV glue is quickly cured (the curing rate is 20%-30%) after being irradiated by UV light, so that the silicon steel sheet does not sink during the assembly process, and when the product after assembly vibrates during movement, the silicon steel sheet is not easy to deviate or fall off, so that the position of the silicon steel sheet meets the assembly requirements, and the performance of the product is improved. Moreover, since the composition of the UV glue is relatively simple, the curing time is shortened (from more than 30 minutes to 5-10 minutes), the delamination (cavity) defect caused by the deviation of the silicon steel sheet during curing is also reduced, and the appearance defect of the product caused by the volatilization of organic matter in the UV glue is also reduced. Moreover, in the present application, the front end of the pin of the electronic component and the part of the packaging frame close to the front end are welded together by the laser welding process, the labor cost and material cost of the copper wire or the point conductive glue are reduced, the product appearance abnormality (such as reducing the pollution of organic matter to the plating solution, preventing the blackening and blooming of the plating layer caused by the organic matter, such as preventing the copper leakage caused by the poor contact of the copper wire and the wire end of the copper wire that may form the jamming during electroplating) is also reduced, and the product quality is improved. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figures 1-7 The structural schematic diagram of the forming process of the combination packaging structure in some embodiments of the present application. DETAILED DESCRIPTION

[0031] In order to make the above objectives, characteristics and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application are described in detail below with reference to the drawings. In the detailed description of the embodiments of the present application, the schematic diagrams are partially enlarged without the general proportion for the convenience of description, and the schematic diagrams are only examples which should not limit the protection scope of the present application herein. In addition, the three-dimensional spatial dimensions including length, width and depth should be included in the actual manufacture.

[0032] The embodiments of the present application first provide a forming method of a combined packaging structure, which is described in detail below with reference to the drawings.

[0033] Reference Figures 1-3 , a packaging frame 100 (reference Figure 1 ), an electronic component 200 (reference Figure 2 ) and a silicon steel sheet 300 (reference Figure 3 ) are provided, the packaging frame 100 includes a first limiting opening 101 and a second limiting opening 102 arranged oppositely, and a limiting portion 103 located between the first limiting opening 101 and the second limiting opening 102, the electronic component 200 includes a plastic packaging portion 201 and a plurality of pins 202 extending from the side of the plastic packaging portion 201, and the silicon steel sheet 300 has an open end.

[0034] The first limiting opening 101 of the packaging frame 100 is used for subsequent installation of the electronic component 200, and the second limiting opening 102 is used for subsequent installation of the silicon steel sheet 300.

[0035] In some embodiments, the size of the first limiting opening 101 is greater than the size of the second limiting opening 102. The first limiting opening 101 can include a first part, a second part and a third part in communication with each other, the first part is close to the limiting portion 103, the third part is away from the limiting portion 103, the size of the first part and the third part is smaller than the size of the second part, when the electronic component 200 is subsequently installed, the first part of the first limiting opening 101 is used for subsequent definition of the position of the plastic packaging portion of the electronic component 200, and the third part of the first limiting opening 101 is used for subsequent definition of the position of the front end of the pin of the electronic component 200. The second limiting opening 102 includes a fourth part and a fifth part in communication with each other, the fourth part is close to the limiting portion 103, the size of the fourth part is smaller than the size of the fifth part, and the fourth part is used for subsequent definition of the installation position of the silicon steel sheet 300.

[0036] The first limiting opening 101 and the second limiting opening 102 have a limiting portion 103 therebetween, which is used for the definition of the installation position of the electronic component 200 and the silicon steel sheet 300 when the electronic component 200 and the silicon steel sheet 300 are installed.

[0037] In some embodiments, the packaging frame 100 further comprises a middle rib 104 surrounding the first limiting opening 101 and the second limiting opening 102, and two pins 105, each of which is located on the left and right sides of the first limiting opening 102, one end of each pin 105 is connected to the middle rib 104, and the other end of each pin 105 is connected to the limiting part 103. In some embodiments, there can be a gap 106 between the pin 105 and the middle rib 104 on the side, and there can also be a gap 106 between the limiting part 103 and the middle rib 104 on the side, so as to reduce the weight of the packaging frame 100.

[0038] In some embodiments, the packaging frame 100 comprises a plurality of packaging areas, which can be arranged in an array, a row or a column, and adjacent packaging areas are connected by a middle rib 104. Each packaging area comprises a first limiting opening 101 and a second limiting opening 102 arranged oppositely, a limiting part 103 located between the first limiting opening 101 and the second limiting opening 102, a middle rib 104 located on both sides of the first limiting opening 102, one end of a pin 105 connected to the middle rib 104, and the other end of the pin 105 connected to the limiting part 103. The two ends of the limiting part 103 are connected to the middle ribs 104 on both sides.

[0039] In some embodiments, the material of the packaging frame 100 is metal or alloy. Specifically, the material of the middle rib 104, the pin 105 and the limiting part 103 is metal or alloy.

[0040] The electronic component 200 comprises a plastic packaging part 201 and a plurality of pins 202 extending from one side of the plastic packaging part 201. The plastic packaging part 201 encapsulates the main structure of the circuit or component by plastic packaging material, and the pins 202 are electrically connected to the main structure of the circuit or component in the plastic packaging part 201.

[0041] The pin 202 has a plurality of pins. The end of the pin 202 away from the plastic packaging part 201 is the front end of the pin 202. In some embodiments, the front ends of the plurality of pins 202 are connected together by a metal block, which facilitates the welding of the front ends of the pins 202 to the packaging frame during the subsequent packaging process of the electronic component 200, so as to plate a protective metal on the surface of the pin 202.

[0042] In some embodiments, the electronic component 200 is a power device. In a specific embodiment, the electronic component 200 is a TO packaging power device.

[0043] The silicon steel sheet 300 serves as a magnetic device. After the silicon steel sheet 300 is packaged in a combined packaging structure, when current is applied through the pins 105 and the limiting portion 103 on the packaging frame 100, the silicon steel sheet 300 generates an induced magnetic field, thereby providing a stable magnetic field environment for the electronic component 200 packaged in the combined packaging structure, and thus continuously stabilizing the drive voltage and drive current in the electronic component 200, thereby improving the reliability of the combined packaging structure.

[0044] The silicon steel sheet 300 has an open end 301. During installation of the silicon steel sheet 300, the limiting portion 103 of the packaging frame and the plastic packaging portion 201 of the electronic component 200 can be clamped in the open end 301, so that the silicon steel sheet 300 can better provide a magnetic field for the electronic component 200. In some embodiments, the silicon steel sheet 300 is a "U"-shaped silicon steel sheet.

[0045] Reference Figure 4 The electronic component 200 is placed in the first limiting opening 101, so that the plastic packaging portion 201 of the electronic component 200 is close to the side of the limiting portion 103, and the front end of the pin 202 of the electronic component 200 is close to the part of the packaging frame away from the limiting portion 103; the silicon steel sheet 300 is placed in the second limiting opening 102, and the open end 301 of the silicon steel sheet 300 (refer to Figure 3 ) faces the limiting portion 103.

[0046] In some embodiments, part of the packaging process of the present application is carried out on an assembly line. The assembly line has a track for conveying packaging products, which includes a stainless steel track and an anti-scalding track connected to the stainless steel track. Different functional device modules are arranged along the track, such as a feeding gripper, a dispensing device, a baking device, and a spot welding device. The feeding gripper is used to place the electronic component 200 and the silicon steel sheet 300 on the packaging frame. The dispensing device is used to dispense UV glue on the limiting portion of the packaging frame 100 and to cure the UV glue. The baking device is used to bake the formed UV glue. The spot welding device is used to weld the front end of the pin 202 of the electronic component 200 to the part of the packaging frame 100 close to the front end. The placement of the electronic component 200 and the silicon steel sheet 300, the dispensing of the UV glue, the baking process, and the spot welding are carried out on the stainless steel track and the anti-scalding track.

[0047] In an embodiment, the packaging frame 100 is placed in an assembly mold before the electronic component 200 and the silicon steel sheet 300 are placed, and then the electronic component 200 and the silicon steel sheet 300 are placed in the first limiting opening 101 and the second limiting opening 102 of the packaging frame 100 respectively, and then the packaging structure is taken out of the assembly mold after the UV glue is formed.

[0048] With reference to Figure 4 and Figure 5 , the UV glue 108 is formed to fix the plastic encapsulation part 201 of the electronic component 200, the silicon steel sheet 300 and the limiting part 103 of the packaging frame 100, and when the UV glue 108 is formed, the silicon steel sheet 300 is pushed towards the limiting part 103 so that the limiting part 103 is clamped in the open end of the silicon steel sheet 300.

[0049] In some embodiments, the process of forming the UV glue 108 to fix the plastic encapsulation part 201 of the electronic component 200, the silicon steel sheet 300 and the limiting part 103 of the packaging frame 100 includes: applying the UV glue 108 on the surface points of the limiting part 103 (with reference to Figure 3 ), and in a specific embodiment, the UV glue 108 can be applied on the upper surface and the lower surface of the limiting part 103; in an embodiment, after the UV glue 108 is applied, the silicon steel sheet 300 is pushed towards the limiting part 103 so that the limiting part 103 is clamped in the open end of the silicon steel sheet 300, and the UV glue 108 is filled between the limiting part 103 and the silicon steel sheet 300 and the plastic encapsulation part 201 of the electronic component 200; the UV glue 108 is quickly cured by UV light irradiation; and after the UV light irradiation, the UV glue 108 is subjected to baking treatment.

[0050] In some embodiments, when the UV light irradiation is performed, the power of the UV light is 2000±500 mw / cm 2 , and the curing rate of the UV glue 108 after the UV light irradiation is 20%-30%. The UV glue 108 is quickly cured.

[0051] In some embodiments, the baking temperature of the baking treatment is 150±5℃, the baking time is 5-10 min, and the curing rate of the UV glue 108 after the baking treatment is 100%. The UV glue is completely cured in a short time.

[0052] In this application, during the assembly of electronic components 200 and silicon steel sheets 300, UV adhesive 108 is used to fix the encapsulation portion 201 of the electronic components 200, the silicon steel sheet 300, and the limiting portion 103 of the packaging frame 100. When UV adhesive 108 is formed, it cures rapidly after UV irradiation (curing rate 20%-30%), preventing the silicon steel sheet from sinking during assembly. Furthermore, when the assembled product vibrates during movement, the silicon steel sheet is less prone to shifting or falling off. This ensures that the position of the silicon steel sheet 300 meets assembly requirements, improving product performance. Moreover, because UV adhesive 108 has a relatively simple composition, the curing time is shortened (from over 30 minutes to 5-10 minutes), reducing delamination (void) defects caused by silicon steel sheet shifting during curing, and also reducing product appearance defects caused by the volatilization of organic matter in UV adhesive 108.

[0053] refer to Figure 5 The front end of the pin 202 of the electronic component 200 and a portion of the package frame 100 near the front end 202 are welded together to form a welding area 109.

[0054] The purpose of soldering the front end of the pin 202 of the electronic component 200 and the portion of the package frame 100 near the front end 202 is to subsequently electroplate a metal layer on the surface of the pin 202 and the surface of the lead 105, and to use the package frame as a conductive layer during the electroplating process.

[0055] In some embodiments, welding the front end of the pin 202 of the electronic component 200 to a portion of the encapsulation frame 100 near the front end 202 includes, in some embodiments, welding the front end of the pin 202 of the electronic component 200 to a center rib 104 on a portion of the encapsulation frame 100 near the front end 202.

[0056] In some embodiments, laser welding is used to weld the front end of the pin 202 of the electronic component 200 and a portion of the packaging frame 100 near the front end 202 together. During laser welding, the pin 202 of the electronic component 200 is fused to the central rib of the packaging frame 100, thereby welding them together.

[0057] In some embodiments, the laser power during laser welding is 0.5-1 kW, and the duration is 0.05-0.15 ms.

[0058] In the present application, the front end of the pin 202 of the electronic component 200 and the part of the packaging frame 100 close to the front end 202 are welded together by a laser welding process, which reduces the labor cost and material cost of winding copper wire or applying conductive glue, and also reduces the abnormal appearance of the product (such as reducing the pollution of organic matter to the plating solution, preventing the plating layer from turning black and flaky due to organic matter, preventing copper leakage caused by poor copper wire contact, and preventing the copper wire tail from being stuck during electroplating), and improves the product quality.

[0059] In some embodiments, in combination with reference to Figure 5 and Figure 6 , it further comprises: forming a plastic sealing layer 110 covering the plastic sealing part 201 of the electronic component 200, the silicon steel sheet 300 and the limiting part 103 of the packaging frame 100; electroplating the pin 202 of the electronic component 200 to form a metal plating layer on the surface of the pin 202.

[0060] In some embodiments, the material of the plastic sealing layer 110 can be a filler-containing epoxy resin, polyimide resin, benzocyclobutene resin or polybenzoxazole resin; or it can also be a filler-containing polybutylene terephthalate, polycarbonate, polyethylene terephthalate, polyethylene, polypropylene, polyolefin, polyurethane, polyolefin, polyether sulfone, polyamide, polyurethane, ethylene-vinyl acetate copolymer or polyvinyl alcohol. In some embodiments, the filler can be an inorganic filler or an organic filler. In some embodiments, the process of forming the plastic sealing layer includes compression molding or transfer molding.

[0061] In some embodiments, while electroplating the pin 202 of the electronic component 200, the pin 105 is also electroplated to form a metal plating layer on the surface of the pin 105, and the electroplating is performed by applying an electroplating current to the packaging frame 100.

[0062] The metal plating layer is used to protect the pins 105 and 202, so that the pins 105 and 202 have good electrical conductivity, corrosion resistance and reliability.

[0063] In some embodiments, the material of the metal plating layer is one or more of tin, gold, silver, copper or nickel.

[0064] In some embodiments, in combination with reference to Figure 6 and Figure 7 , after electroplating is completed, the middle rib 104 is cut off, so that the pins 105 and 202 are separated from the middle rib 104, forming a plurality of discrete combined packaging structures.

[0065] In some embodiments, after the cutting, the method further comprises: performing a bending process on the pins 105 and the legs 202.

[0066] The embodiments of the present application also provide a combined packaging structure, which refers to Figure 5 , and comprises:

[0067] a packaging frame 100, which comprises a first limiting opening 101 and a second limiting opening 102 arranged oppositely, and a limiting part 103 between the first limiting opening 101 and the second limiting opening 102;

[0068] an electronic component 200, which comprises a plastic encapsulation part 201 and a plurality of legs 202 extending from the side of the plastic encapsulation part 201, the electronic component 200 is located in the first limiting opening 101, the plastic encapsulation part 201 of the electronic component 200 is fixed with the side of the limiting part 103 through UV glue 108, and the front end part of the legs 202 of the electronic component 200 is welded with the part of the packaging frame 100 (middle rib 104) away from the limiting part 103;

[0069] a silicon steel sheet 300, which has an open end 301 (refer to Figure 3 ), the silicon steel sheet 300 is located in the second limiting opening 102, and the open end 301 of the silicon steel sheet 300 is clamped on the limiting part 103 through UV glue 108.

[0070] In some embodiments, referring to Figure 6 , the method further comprises: coating a plastic encapsulation layer 110 on the plastic encapsulation part 201 of the electronic component 200, the silicon steel sheet 300 and the limiting part 103 of the packaging frame 100.

[0071] In some embodiments, referring to Figure 5 , the packaging frame 100 further comprises a middle rib 104 and a pin 105, the middle rib 104 surrounds the first limiting opening 101 and the second limiting opening 102, the two ends of the limiting part 103 are connected with the middle ribs 104 on two sides, the pin 105 is two in number and is located on the two sides of the first limiting opening 102 respectively, one end of the pin 105 is connected with the middle rib 104, and the other end is connected with the limiting part 103.

[0072] It should be noted that the terms "comprise" and "have" and their conjugations, as used in the present application, are intended to cover non-exclusive inclusion. The terms "first", "second", etc. are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence, unless the context clearly indicates otherwise. It should be understood that the data thus used can be interchanged in appropriate circumstances. In addition, the embodiments and features in the present application can be combined with each other, provided there is no conflict. Furthermore, in the above description, the description of well-known components and techniques has been omitted to avoid unnecessarily obscuring the concept of the present application. In each of the above embodiments, each embodiment focuses on the differences from other embodiments, and the same / similar parts between each embodiment can be referred to each other (or reference).

[0073] Although the present application has been disclosed in the above preferred embodiments, it is not intended to limit the present application, and any person skilled in the art can make possible changes and modifications to the technical solutions of the present application using the disclosed methods and technical contents without departing from the spirit and scope of the present application. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present application, without departing from the technical solutions of the present application, shall fall within the protection scope of the present application.

Claims

1. A method for forming a combined package structure, comprising: include: A packaging frame, electronic components, and silicon steel sheets are provided. The packaging frame includes a first limiting port and a second limiting port disposed opposite to each other, and a limiting portion located between the first limiting port and the second limiting port. The electronic components include a molding portion and a plurality of pins extending from the side of the molding portion. The silicon steel sheets have open ends. The electronic component is placed into the first limiting opening, with the plastic encapsulation portion of the electronic component close to the side of the limiting portion, and the front end of the pin of the electronic component close to the portion of the encapsulation frame away from the limiting portion. The silicon steel sheet is placed in the second limiting opening, with the open end of the silicon steel sheet facing the limiting part; A UV adhesive is formed to fix the plastic encapsulation portion of the electronic component, the silicon steel sheet, and the limiting portion of the packaging frame. When the UV adhesive is formed, the silicon steel sheet is pushed towards the limiting portion so that the limiting portion is locked in the open end of the silicon steel sheet. The front end of the pin of the electronic component is soldered together with a portion of the package frame near the front end; The process of forming a UV adhesive that fixes the plastic encapsulation portion of the electronic component, the silicon steel sheet, and the limiting portion of the packaging frame includes: applying UV adhesive to the surface of the limiting portion; irradiating the UV adhesive with UV light for 5-10 minutes to prevent the silicon steel sheet from sinking during assembly; and baking the UV adhesive after irradiation, wherein the power of the UV light is 2000±500mw / cm², the curing rate of the UV adhesive after irradiation is 20%-30%, the baking temperature is 150±5℃, the baking time is 5-10 minutes, and the curing rate of the UV adhesive after baking is 100%.

2. The method of claim 1, wherein After welding the front end of the pin of the electronic component and the portion of the packaging frame near the front end together, the method further includes: forming a plastic encapsulation layer covering the plastic encapsulation portion of the electronic component, the silicon steel sheet and the limiting portion of the packaging frame; and electroplating the pin of the electronic component.

3. The method of forming a combined package structure according to claim 1 or 2, wherein The packaging frame also includes a central rib and pins. The central rib surrounds the first limiting port and the second limiting port. Both ends of the limiting portion are connected to the central ribs on both sides. There are two pins, which are located on both sides of the first limiting port. One end of the pin is connected to the central rib, and the other end of the pin is connected to the limiting portion.

4. The method of claim 3, wherein While electroplating the pins of the electronic components, the leads are also electroplated, and an electroplating current is applied through the packaging frame during the electroplating process.

5. The method of claim 4, wherein After electroplating is completed, the central rib is removed, so that the pins and leads are separated from the central rib.

6. The method of claim 1, wherein Laser welding is used to weld the front end of the pin of the electronic component to a portion of the package frame near the front end.

7. The method of claim 6, wherein The laser power used in the laser welding process is 0.5-1 kW, and the duration is 0.05-0.15 ms.

8. The method of claim 1, wherein The silicon steel sheet is a "U"-shaped silicon steel sheet, and the electronic components include power devices.

9. A combined package structure, characterized by include: An encapsulation frame, the encapsulation frame comprising a first limiting opening and a second limiting opening arranged oppositely, and a limiting part between the first limiting opening and the second limiting opening; An electronic component, the electronic component comprising a plastic encapsulation part and a plurality of pins extending from a side of the plastic encapsulation part, the electronic component being located in the first limiting opening, the plastic encapsulation part of the electronic component being fixed with a side of the limiting part by UV glue, and the front end of the pin of the electronic component being welded with a part of the encapsulation frame away from the limiting part; A silicon steel sheet, the silicon steel sheet having an open end, the silicon steel sheet being located in the second limiting opening, and the open end of the silicon steel sheet being clamped on the limiting part by UV glue; A process of forming the UV glue for fixing the plastic encapsulation part of the electronic component, the silicon steel sheet, and the limiting part of the encapsulation frame comprises the following steps: applying UV glue on the surface points of the limiting part; curing the UV glue by UV light irradiation for 5-10 min, so that the silicon steel sheet does not sink during assembly; and performing baking treatment on the UV glue after the UV light irradiation, the power of the UV light being 2000±500 mw / cm2 during the UV light irradiation, the curing rate of the UV glue being 20%-30% after the UV light irradiation, the baking temperature of the baking treatment being 150±5℃, the baking time being 5-10 min, and the curing rate of the UV glue being 100% after the baking treatment.

10. The combined package structure of claim 9, wherein, Further comprising: A plastic encapsulation layer covering the plastic encapsulation part of the electronic component, the silicon steel sheet, and the limiting part of the encapsulation frame.

11. The combined package structure of claim 9, wherein, The encapsulation frame further comprises a middle rib and a pin, the middle rib surrounding the first limiting opening and the second limiting opening, the limiting part being connected with the middle ribs at both ends and both sides, the number of the pin being two, the pin being located on both sides of the first limiting opening, one end of the pin being connected with the middle rib, and the other end of the pin being connected with the limiting part.

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