Composite material cutting temperature measuring tool and its temperature measuring circuit preparation method and temperature measuring method

Abstract

The present invention discloses a composite material cutting temperature measuring tool and a method for preparing its temperature measuring circuit and a temperature measuring method, which relate to the technical field of cutting processing temperature measurement and are used to solve the technical problems of existing cutting temperature monitoring methods, such as poor measurement accuracy, inability to be reused multiple times, and impact on tool performance. In the composite material cutting temperature measuring tool, a temperature measuring circuit is provided on the front face of the cutting tool, and the temperature measuring circuit is obtained by coating graphene and silver on the front face. The method for preparing the temperature measuring circuit comprises: coating an insulating dielectric layer on the front face of the cutting tool; mixing graphene with nanosilver, and then coating the front face of the cutting tool to form a temperature measuring circuit layer; sintering the cutting tool to solidify the temperature measuring circuit layer; coating a protective layer on the surface of the temperature measuring circuit layer to complete the preparation of the temperature measuring circuit. The technical solution of the present invention is used to provide a composite material cutting temperature measuring tool, a method for preparing a temperature measuring circuit, and a temperature measuring method thereof.

Description

Technical Field

[0001] The present invention relates to the technical field of cutting temperature measurement, and in particular to a composite material cutting temperature measurement tool, a temperature measurement circuit preparation method, and a temperature measurement method. Background Art

[0002] A large amount of cutting heat will be generated during the cutting process of composite materials, and the cutting heat will gradually accumulate as the processing progresses, thereby gradually increasing the cutting temperature.

[0003] The increase in cutting temperature will have many adverse effects on the cutting process: on the one hand, composite materials are more sensitive to changes in cutting temperature. Taking carbon fiber reinforced resin-based composite materials as an example, the resin matrix is ​​prone to obvious changes in physical and chemical properties when the cutting temperature exceeds its glass transition temperature, which changes the constraint state of the resin matrix on the fiber. Excessive cutting temperature will also aggravate the occurrence of cutting damage such as fiber burrs, fiber debonding and resin coating; on the other hand, excessively high cutting temperature will cause thermal deformation of the tool, and produce diffusion wear and adhesive wear, which seriously affects the cutting accuracy of the tool and the service life of the tool.

[0004] During the cutting process of composite materials, monitoring cutting temperature changes can provide real-time tool status and wear information, enabling optimization of machining parameters and significant process control. Existing methods for monitoring cutting temperature primarily include infrared thermal imaging and thermocouples. In particular, when using auxiliary processes such as minimal lubrication and liquid nitrogen cooling, the auxiliary medium can obscure the tool's actual temperature. For example, when using an infrared thermal imager for temperature measurement, the use of cutting fluid can obscure the tool's actual maximum temperature, preventing the infrared camera from accurately measuring the tool's maximum temperature. The thermocouple method typically requires slotting a thin-film thermocouple into the tool surface. This alters the tool's original structure, affecting its strength and rigidity. Furthermore, the thermocouple becomes ineffective after wear. Once the thermocouple is slotted and embedded, the tool's slot location (temperature measurement location) is fixed. Once a tool has been measured, it is difficult to reuse it in a new cutting environment. Adjusting the temperature measurement point to accommodate the actual working environment is difficult, resulting in relatively low tool utilization. It can be seen that the existing methods for monitoring cutting temperature have technical problems such as poor measurement accuracy, inability to be reused multiple times, and affecting the performance of the tool. Summary of the Invention

[0005] The present invention provides a composite material cutting temperature measurement tool, a method for preparing a temperature measurement circuit, and a temperature measurement method. These tools are designed to address the technical issues of existing cutting temperature monitoring methods, such as poor measurement accuracy, limited reuse, and reduced tool performance. In light of these issues, the present invention is implemented through the following technical solutions.

[0006] In a first aspect, the present invention provides a composite material cutting temperature measuring tool, the tool having a rake face, the rake face being provided with a temperature measuring circuit, and the temperature measuring circuit being obtained by coating graphene and silver on the rake face.

[0007] Compared with the prior art, in the composite material cutting temperature measuring tool of the present invention, a temperature measuring circuit is set on the rake face of the tool by coating. Compared with the existing infrared thermal imager and thermocouple measurement, the temperature measurement accuracy of the temperature measuring circuit is not affected by the cutting fluid and will not damage the original structure of the tool. Furthermore, the temperature measuring circuit is obtained by coating graphene and silver on the rake face of the tool. Both graphene and silver have good thermal conductivity. On the one hand, the combination of graphene and silver can form a more effective heat conduction path. On the other hand, the combination of graphene and silver can also form a continuous and dense conductive network, further improving the conductivity and temperature measurement accuracy of the temperature measuring circuit. At the same time, the high specific surface area and excellent physical properties of graphene can increase the adhesion between the coating layer and the tool surface, while the chemical stability of silver helps to maintain the long-term stability of the coating layer, ensuring that the temperature measuring circuit can be used repeatedly. Through the above technical solution of the present invention, the technical problems of poor measurement accuracy, inability to be reused multiple times, and impact on tool performance of the existing method for monitoring cutting temperature are solved.

[0008] In a second aspect, the present invention provides a method for preparing the above-mentioned temperature measurement circuit, comprising:

[0009] applying an insulating dielectric layer to the rake face of the cutting tool;

[0010] After mixing graphene and nanosilver, coating the insulating dielectric layer to form a temperature measurement circuit layer; wherein the mass ratio of the graphene to the nanosilver is 1: (20-50);

[0011] sintering the cutting tool to solidify the temperature measurement circuit layer;

[0012] A protective layer is coated on the surface of the temperature measurement circuit layer to complete the preparation of the temperature measurement circuit; wherein the minimum feature size in the temperature measurement circuit is less than or equal to 10 μm.

[0013] Compared with the prior art, the beneficial effects of the method for preparing the temperature measuring circuit of the present invention are the same as the beneficial effects of the composite material cutting temperature measuring tool described in the above technical solution, and will not be repeated here.

[0014] Furthermore, in the method for preparing the temperature measuring circuit of the present invention, the insulating dielectric layer comprises electromagnetic shielding resin ink or heat dissipation resin ink; and / or,

[0015] The protective layer includes electromagnetic shielding resin ink or heat dissipation resin ink.

[0016] Furthermore, in the method for preparing the temperature measurement circuit of the present invention, before coating the insulating dielectric layer on the rake face of the cutting tool, the method further comprises:

[0017] The cutting tool is subjected to surface treatment; the surface treatment method includes one or more of cleaning, grinding and surface modification.

[0018] Furthermore, in the method for preparing the temperature measuring circuit of the present invention, after mixing the graphene and nanosilver, coating the insulating dielectric layer to form the temperature measuring circuit layer comprises:

[0019] After the graphene ink and the nano silver ink are mixed, aerosol inkjet printing is performed on the insulating dielectric layer to form a temperature measurement circuit layer.

[0020] Furthermore, in the method for preparing the temperature measuring circuit of the present invention, during the aerosol inkjet printing process, the vertical distance between the print head and the rake surface is 1 to 5 mm; and / or,

[0021] The concentration of the graphene ink is 10-50 mg / ml, and the concentration of the nanosilver ink is 1-5 g / ml.

[0022] Furthermore, in the method for preparing the temperature measuring circuit of the present invention, the viscosity of the graphene ink and / or the nanosilver ink is 1-20 cp; and / or,

[0023] The deposition rate of the graphene ink is 1 to 2 times that of the nanosilver ink.

[0024] Furthermore, in the method for preparing the temperature measuring circuit of the present invention, the deposition rate of the graphene ink is (4-8)×10 -4 mm 3 / s; the deposition rate of the nanosilver ink is (1~4)×10 -4 mm 3 / s; and / or,

[0025] The thickness of the insulating dielectric layer, the temperature measuring circuit layer or the protective layer is 50-120 μm.

[0026] Furthermore, in the method for preparing the temperature measuring circuit of the present invention, the sintering process is performed by step-by-step heating and sintering. The sintering process is as follows:

[0027] heating the cutting tool at a temperature of 130-150° C. for 0.5-1 h;

[0028] Continue to heat up to 220~260℃ and sinter for 30~60min;

[0029] Continue to heat up to 280~320℃, sinter for 10~40min, and then cool to room temperature.

[0030] In a third aspect, the present invention provides a temperature measurement method, utilizing a chuck, a signal converter, a display device, a wire, and the composite material cutting temperature measurement tool described above, wherein the cutting temperature measurement tool is provided with a temperature measurement circuit, the temperature measurement method comprising:

[0031] securing a workpiece to the chuck;

[0032] Connecting the signal input end of the signal converter to the wire of the temperature measuring circuit, and connecting the signal output end to the wire of the display device;

[0033] The workpiece is processed using the composite material cutting temperature measuring tool. The temperature signal on the tool surface is expressed as an electrical signal in the temperature measuring circuit and is differentially amplified and converted into a temperature signal by the signal converter before being displayed on the display device.

[0034] Compared with the prior art, the beneficial effects of the temperature measurement method of the present invention are the same as the beneficial effects of the composite material cutting temperature measurement tool described in the above technical solution, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0036] Figure 1 This is a schematic structural diagram of a composite material cutting and temperature measuring tool in a specific embodiment of the present invention;

[0037] Figure 2 This is a schematic diagram of the connection relationship between the various components in the temperature measurement method in a specific embodiment of the present invention;

[0038] Figure 3 The figure is a flow chart of a method for preparing a temperature measurement circuit in a specific embodiment of the present invention.

[0039] Reference numerals:

[0040] 1. Tool handle; 2. Tool; 3. Temperature measurement circuit; 4. Screw; 5. Chuck; 6. Workpiece; 7. Signal converter; 8. Wire; 9. Display device. DETAILED DESCRIPTION

[0041] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0042] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0043] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined. "Several" means one or more, unless otherwise specifically defined.

[0044] During the cutting process of composite materials, monitoring cutting temperature changes can provide real-time tool status and wear information, enabling optimization of machining parameters and significant process control. Existing methods for monitoring cutting temperature primarily include infrared thermal imaging and thermocouples. In particular, when using auxiliary processes such as minimal lubrication and liquid nitrogen cooling, the auxiliary medium can obscure the tool's actual temperature. For example, when using an infrared thermal imager for temperature measurement, the use of cutting fluid can obscure the tool's actual maximum temperature, preventing the infrared camera from accurately measuring the tool's maximum temperature. The thermocouple method typically requires slotting a thin-film thermocouple into the tool surface. This alters the tool's original structure, affecting its strength and rigidity. Furthermore, the thermocouple becomes ineffective after wear. Once the thermocouple is slotted and embedded, the tool's slot location (temperature measurement location) is fixed. Once a tool has been measured, it is difficult to reuse it in a new cutting environment. Adjusting the temperature measurement point to accommodate the actual working environment is difficult, resulting in relatively low tool utilization. It can be seen that the existing methods for monitoring cutting temperature have technical problems such as poor measurement accuracy, inability to be reused multiple times, and affecting the performance of the tool.

[0045] In order to solve the above technical problems, in a first aspect, the present invention provides a composite material cutting temperature measuring tool, the tool having a rake face, the rake face being provided with a temperature measuring circuit, and the temperature measuring circuit being obtained by coating graphene and silver on the rake face.

[0046] By adopting the above technical solution, in the composite material cutting temperature measuring tool of the present invention, a temperature measuring circuit is set on the rake face of the tool by coating. Compared with the existing infrared thermal imager and thermocouple measurement, the temperature measurement accuracy of the temperature measuring circuit is not affected by the cutting fluid and will not damage the original structure of the tool. Furthermore, the temperature measuring circuit is obtained by coating graphene and silver on the rake face of the tool. Both graphene and silver have good thermal conductivity. On the one hand, the combination of graphene and silver can form a more effective heat conduction path. On the other hand, the combination of graphene and silver can also form a continuous and dense conductive network, further improving the conductivity and temperature measurement accuracy of the temperature measuring circuit. At the same time, the high specific surface area and excellent physical properties of graphene can increase the adhesion between the coating layer and the tool surface, while the chemical stability of silver helps to maintain the long-term stability of the coating layer, ensuring that the temperature measuring circuit can be used repeatedly. Through the above technical solution of the present invention, the technical problems of poor measurement accuracy, inability to be reused multiple times, and impact on tool performance of existing methods for monitoring cutting temperature are solved.

[0047] See also Figure 3 In a second aspect, the present invention provides a method for preparing the above-mentioned temperature measurement circuit, comprising:

[0048] applying an insulating dielectric layer to the rake face of the cutting tool;

[0049] After mixing graphene and nanosilver, coating the insulating dielectric layer to form a temperature measurement circuit layer; wherein the mass ratio of the graphene to the nanosilver is 1: (20-50);

[0050] Sintering the cutting tool to solidify the temperature measurement circuit layer;

[0051] A protective layer is coated on the surface of the temperature measurement circuit layer to complete the preparation of the temperature measurement circuit; wherein the minimum feature size in the temperature measurement circuit is less than or equal to 10 μm.

[0052] By adopting the above-mentioned technical solution, in the preparation method of the temperature measuring circuit of the present invention, after the insulating dielectric layer is coated on the front cutting edge of the cutting tool, the insulating dielectric layer can isolate the electrical contact between the temperature measuring circuit layer and the tool substrate, prevent the current from directly passing through the tool substrate, protect the tool from electrical damage, and avoid the tool substrate from affecting the temperature measurement results. The coating of the insulating dielectric layer also reduces the heat conduction between the temperature measuring circuit layer and the tool substrate, so that the temperature measuring circuit layer can more accurately reflect the temperature changes in the cutting area, effectively improving the temperature measurement accuracy. At the same time, the insulating dielectric layer also provides a stable base for the temperature measuring circuit layer, enhancing the stability and reliability of the temperature measuring circuit during the cutting process.

[0053] Furthermore, in the method for preparing a temperature measurement circuit of the present invention, the temperature measurement circuit layer is formed by coating the rake face with graphene and silver. Both graphene and silver have excellent thermal conductivity. The combination of graphene and silver creates a more efficient heat conduction path and forms a continuous and dense conductive network, further improving the conductivity and temperature measurement accuracy of the temperature measurement circuit. Graphene's high specific surface area and excellent physical properties enhance the adhesion of the coating layer to the tool surface, while silver's chemical stability helps maintain the long-term stability of the coating layer, ensuring the repeated use of the temperature measurement circuit. To further improve the performance of the temperature measurement circuit, the present invention controls the mass ratio of graphene to nanosilver to be 1:(20-50). For example, the mass ratio of graphene to nanosilver can be 1:20, 1:40, or 1:50.

[0054] Furthermore, in the method for preparing the temperature measurement circuit of the present invention, after the temperature measurement circuit layer is solidified by sintering, a protective layer is coated on the surface of the temperature measurement circuit layer. This protective layer can protect the temperature measurement circuit layer from factors such as mechanical damage, chemical corrosion, and high-temperature oxidation, thereby extending the service life of the temperature measurement circuit. The temperature measurement circuit obtained by this preparation method has a minimum feature size of less than or equal to 10 μm and has high temperature measurement accuracy.

[0055] It should be understood that in the method for preparing the temperature measurement circuit of the present invention, in order to further improve the performance of the temperature measurement circuit, it is necessary to further control the material types of the insulating dielectric layer and the protective layer. For example, the insulating dielectric layer includes electromagnetic shielding resin ink or heat dissipation resin ink; and the protective layer includes electromagnetic shielding resin ink or heat dissipation resin ink. In another example, the insulating dielectric layer may be electromagnetic shielding resin ink or heat dissipation resin ink, and the protective layer may be electromagnetic shielding resin ink or heat dissipation resin ink. In another example, the insulating dielectric layer or the protective layer may be polyimide resin.

[0056] As a possible embodiment, in the method for preparing a temperature measurement circuit of the present invention, before coating the insulating dielectric layer on the rake face of the cutting tool, the method further includes:

[0057] The cutting tool is subjected to surface treatment; the surface treatment method includes one or more of cleaning, grinding and surface modification.

[0058] By adopting the above technical solution, in the method for preparing the temperature measurement circuit of the present invention, after the cutting tool is surface treated, the temperature measurement circuit can be more easily applied to the tool surface. For example, the surface treatment method includes one or more of cleaning, polishing, and surface modification. In another example, when the surface treatment method is cleaning, the surface treatment process is as follows:

[0059] The cutting tool is ultrasonically treated in an alcohol solution or an acetone solution for 10 to 18 minutes to remove oil stains and dust on the surface of the cutting tool; the cleaning solvent attached to the surface of the ultrasonically treated cutting tool is blown away by an air pump to prevent the oil stains and dust attached to the surface of the cutting tool from affecting the conductivity and adhesion of the temperature measuring circuit formed by the coating, so that the temperature measuring circuit is easier to spray on the front cutting edge of the tool; for example, during the above-mentioned surface treatment process, the concentration of the alcohol solution can be 75v / v%, and the concentration of the acetone solution can be 5v / v%.

[0060] As a possible embodiment, in the method for preparing a temperature measurement circuit of the present invention, after mixing graphene and nanosilver, coating the insulating dielectric layer to form a temperature measurement circuit layer includes:

[0061] After the graphene ink and the nano silver ink are mixed, aerosol inkjet printing is performed on the insulating dielectric layer to form a temperature measurement circuit layer.

[0062] Using the above technical solution, in the preparation method of the temperature measurement circuit of the present invention, the coating method adopts aerosol inkjet printing. Aerosol inkjet printing technology has a high printing resolution and can realize the printing of circuit patterns with a feature size less than or equal to 10μm. This high-precision feature enables the temperature measurement circuit to more accurately capture the temperature changes during the cutting process and improve the temperature measurement accuracy. At the same time, aerosol inkjet printing is a non-contact processing method and will not cause mechanical damage to the substrate of the cutting tool or produce scratches on the substrate; compared with traditional coating methods, aerosol inkjet printing generates less thermal impact during the printing process, which can reduce the problem of tool deformation caused by thermal stress.

[0063] It should be understood that in the preparation method of the temperature measurement circuit of the present invention, in order to further improve the performance of the temperature measurement circuit, it is also necessary to control the vertical distance between the print head and the front blade during the aerosol inkjet printing process, as well as the concentrations of the graphene ink and the nanosilver ink within a reasonable range; for example, the vertical distance between the print head and the front blade can be 1-5 mm, and a layer-by-layer printing method can be adopted, with the printing being vertically sprayed on the previously printed structure. The concentration of the graphene ink can be 10-50 mg / ml, and the concentration of the nanosilver ink can be 1-5 g / ml; for another example, the vertical distance between the print head and the front blade can be 1 mm, 3 mm, or 5 mm, the concentration of the graphene ink can be 10 mg / ml, 25 mg / ml, or 50 mg / ml, and the concentration of the nanosilver ink can be 1 g / ml, 3 g / ml, or 5 g / ml. In the present invention, the material of the aerosol inkjet printed temperature measurement circuit is graphene / nanosilver conductive ink. This conductive ink is composed of conductive silver particles and graphene. Compared with silver paste conductive ink, this conductive ink composed of conductive silver particles and graphene has higher conductivity and better adhesion, and is also better in processing and weather resistance.

[0064] It should also be understood that in the preparation method of the temperature measuring circuit of the present invention, in order to further improve the performance of the temperature measuring circuit and ensure the normal progress of the aerosol inkjet printing process, it is also necessary to control the viscosity of the graphene ink and the nanosilver ink within a reasonable range, and the deposition rate ratio between the graphene ink and the nanosilver ink within a reasonable range; for example, the viscosity of the graphene ink and / or the nanosilver ink can be 1-20 cp; the deposition rate of the graphene ink is 1-2 times the deposition rate of the nanosilver ink; for another example, the viscosity of the graphene ink and / or the nanosilver ink can be 1 cp, 10 cp or 20 cp; the deposition rate of the graphene ink is 1 times, 1.5 times or 2 times the deposition rate of the nanosilver ink; for example, the deposition rate of the graphene ink can be (4-8)×10 -4 mm 3 / s; the deposition rate of the nanosilver ink can be (1~4)×10 -4 mm 3 / s; In another example, the deposition rate of the graphene ink can be 4×10 -4 mm 3 / s, 6×10 -4 mm 3 / s or 8×10 -4 mm 3 / s; the deposition rate of the nanosilver ink can be 1×10 -4 mm 3 / s, 2×10 -4 mm3 / s or 4×10 -4 mm 3 / s.

[0065] It should also be understood that in the preparation method of the temperature measuring circuit of the present invention, in order to further improve the performance of the temperature measuring circuit, it is also necessary to control the thickness of the insulating dielectric layer, the temperature measuring circuit layer and the protective layer within a reasonable range; for example, the thickness of the insulating dielectric layer, the temperature measuring circuit layer or the protective layer can be 50~120μm, and for another example, the thickness of the insulating dielectric layer, the temperature measuring circuit layer or the protective layer can be 50μm, 80μm or 120μm.

[0066] As a possible embodiment, in the method for preparing the temperature measuring circuit of the present invention, the sintering process is performed by step-by-step heating and sintering. The sintering process is as follows:

[0067] heating the cutting tool at a temperature of 130-150° C. for 0.5-1 h;

[0068] Continue to heat up to 220~260℃ and sinter for 30~60min;

[0069] Continue to heat up to 280~320℃, sinter for 10~40min, and then cool to room temperature.

[0070] By adopting the above technical solution, in the preparation method of the temperature measuring circuit of the present invention, the sintering treatment is carried out by step-by-step heating and sintering. The sintering treatment is allowed to be carried out at multiple temperature stages. The sintering temperature and sintering time can be precisely controlled in each stage, which can effectively reduce the thermal stress during the sintering process and prevent the temperature measuring circuit layer from cracking or deformation caused by excessive temperature changes. Specifically, by controlling the step-by-step heating, the material migration and diffusion during the sintering process can be carried out more fully. At each sintering temperature stage, the contact area between the particles of the temperature measuring circuit layer gradually increases, which is conducive to forming a denser bond, thereby improving the density of the temperature measuring circuit layer. Step-by-step heating and sintering also helps to control the growth rate and shape of the grains. At lower temperatures, the grains begin to form and gradually grow, while at higher temperatures, the growth rate of the grains will be suppressed, thereby obtaining a more uniform and fine grain structure. It helps to improve the mechanical properties and thermal stability of the temperature measuring circuit. During the step-by-step heating and sintering process, due to the accuracy of temperature control and the sufficiency of material migration, defects such as pores and cracks in the temperature measurement circuit layer can be reduced, which helps to improve the overall performance of the temperature measurement circuit.

[0071] For example, the sintering process can be carried out in a thermostat. For example, the temperature of the thermostat is controlled to be 130-150°C, the cutting tool is placed in the thermostat, and sintered within this temperature range for 0.5-1 hour. For another example, the temperature of the thermostat can be 130-140°C or 150°C, and the sintering time can be 0.5 hour, 0.8 hour or 1 hour. The thermostat is then heated to 220-260°C, and sintered within this temperature range for 30-60 minutes. The heating rate during the heating process can be controlled at 8-10°C / min. For another example, the temperature of the thermostat can be 220-240°C or 260°C, and the sintering time can be 30 minutes, 45 minutes or 60 minutes. The heating rate can be 8°C / min, 9°C / min or 10°C / min. Continue to heat the constant temperature box to 280-320°C, sinter within this temperature range for 10-40 minutes, and then cool to room temperature to complete the sintering process of the temperature measurement circuit layer; the heating rate during the heating process can be controlled at 6-8°C / min; when cooling to room temperature, the cutting tool can be taken out of the constant temperature box and naturally cooled to 20-25°C at room temperature; as another example, the temperature of the constant temperature box can be 280°C, 300°C or 320°C, and the sintering time can be 10 minutes, 25 minutes or 40 minutes; the heating rate can be 6°C / min, 7°C / min or 8°C / min. It can also be understood that in order to speed up the cooling speed, the cutting tool can be cooled to room temperature by air cooling; as another example, the cutting tool can be naturally cooled or air cooled to 20°C, 23°C or 25°C.

[0072] In a third aspect, the present invention provides a temperature measurement method, utilizing a chuck, a signal converter, a display device, a wire, and the composite material cutting temperature measurement tool described above, wherein the cutting temperature measurement tool is provided with a temperature measurement circuit, the temperature measurement method comprising:

[0073] securing a workpiece to the chuck;

[0074] Connecting the signal input end of the signal converter to the wire of the temperature measuring circuit, and connecting the signal output end to the wire of the display device;

[0075] The workpiece is processed using the composite material cutting temperature measuring tool. The temperature signal on the tool surface is expressed as an electrical signal in the temperature measuring circuit and is differentially amplified and converted into a temperature signal by the signal converter before being displayed on the display device.

[0076] By adopting the above technical solution, the temperature measurement method of the present invention utilizes the composite material cutting temperature measuring tool described in the above technical solution. The tool has a rake face, and the rake face is provided with a temperature measuring circuit. The temperature measuring circuit is obtained by coating graphene and silver on the rake face. The temperature measuring circuit is prepared by the preparation method of the temperature measuring circuit described in the above technical solution. In the temperature measurement method of the present invention, the workpiece is fastened to the chuck, which can ensure the stability of the processing process and improve the safety of the processing. The signal input end of the signal converter is connected to the temperature measuring circuit wire, and the signal output end is connected to the display device wire. The composite material cutting temperature measuring tool is used to process the workpiece. The temperature signal on the tool surface is expressed as an electrical signal in the temperature measuring circuit, and is differentially amplified and converted into a temperature signal by the signal converter, and then displayed on the display device. Due to the use of the temperature circuit prepared by the preparation method of the temperature measuring circuit described in the above technical solution, the temperature measurement method of the present invention has the characteristics of high precision and easy operation.

[0077] In order to better understand the present invention, the content of the present invention is further explained below in conjunction with specific examples, but the content of the present invention is not limited to the following examples.

[0078] Unless otherwise specified, the raw materials used in the following examples are commercially available. Example 1

[0079] This embodiment provides a composite material cutting temperature measuring tool, the tool having a rake face, the rake face being provided with a temperature measuring circuit, and the temperature measuring circuit being obtained by coating graphene and silver on the rake face.

[0080] This embodiment also provides a method for preparing a temperature measurement circuit in the composite material cutting temperature measurement tool, comprising:

[0081] S100, obtaining a cutting tool, coating a polyimide resin on a rake face of the cutting tool, forming a polyimide resin layer on the rake face of the cutting tool, wherein the thickness of the polyimide resin layer is 50 μm;

[0082] S200, using an aerosol inkjet printing method, after mixing graphene ink and nano silver particle ink, aerosol inkjet printing is performed on the rake face of the cutting tool to form a temperature measurement circuit layer, wherein the temperature measurement circuit layer has a thickness of 50 μm;

[0083] The mass ratio of graphene to silver is 1:20; the concentration of the graphene ink is 25 mg / ml, the viscosity is 20 cp, and the deposition rate is 8×10 -4 mm 3 / s; the concentration of the nano silver particle ink is 1g / ml, the viscosity is 20cp, and the deposition rate is 4×10 -4 mm3 / s; the printing nozzle adopts a conical dispensing nozzle, and the vertical distance between the conical dispensing nozzle and the rake surface is 1mm;

[0084] S300: Control the temperature of the thermostat to 130°C. Place the cutting tool with the temperature measuring circuit layer in the thermostat in step S200 and keep it there for 1 hour. Then, raise the temperature of the thermostat to 220°C and keep it there for 60 minutes at a heating rate of 8°C / min. Continue to raise the temperature of the thermostat to 280°C at a heating rate of 7°C / min and keep it there for 40 minutes. Then, remove the tool from the thermostat and allow it to cool naturally to 25°C. This completes the curing of the temperature measuring circuit layer.

[0085] S400 , coating the surface of the temperature measuring circuit layer cured in step S300 with polyimide resin to form a polyimide resin layer with a thickness of 50 μm on the surface of the temperature measuring circuit layer, thereby completing the preparation of the temperature measuring circuit.

[0086] The minimum characteristic size of the temperature measurement circuit prepared in this embodiment is less than or equal to 10 μm. Example 2

[0087] This embodiment provides another composite material cutting temperature measuring tool, wherein the tool has a rake face, and the rake face is provided with a temperature measuring circuit, wherein the temperature measuring circuit is obtained by coating graphene and silver on the rake face.

[0088] This embodiment also provides a method for preparing a temperature measurement circuit in the composite material cutting temperature measurement tool, comprising:

[0089] S100, obtaining a cutting tool, coating a polyimide resin on a rake face of the cutting tool, forming a polyimide resin layer on the rake face of the cutting tool, wherein the thickness of the polyimide resin layer is 100 μm;

[0090] S200, using an aerosol inkjet printing method, after mixing graphene ink and nanosilver particle ink, aerosol inkjet printing is performed on the rake face of the cutting tool to form a temperature measurement circuit layer, wherein the temperature measurement circuit layer has a thickness of 100 μm;

[0091] The mass ratio of graphene to silver is 1:40; the concentration of the graphene ink is 25 mg / ml, the viscosity is 10 cp, and the deposition rate is 8×10 -4 mm 3 / s; the concentration of the nano silver particle ink is 2g / ml, the viscosity is 10cp, and the deposition rate is 4×10 -4 mm 3 / s; the printing nozzle adopts a conical dispensing nozzle, and the vertical distance between the conical dispensing nozzle and the rake surface is 3mm;

[0092] S300: Control the temperature of the thermostat to 140°C. Place the cutting tool with the temperature measuring circuit layer in step S200 in the thermostat for 0.8 hours. Then, raise the temperature of the thermostat to 240°C and hold it for 40 minutes at a heating rate of 9°C / min. Continue to raise the temperature of the thermostat to 300°C at a heating rate of 6°C / min and hold it for 25 minutes. Then, remove the tool from the thermostat and allow it to cool naturally to 25°C. This completes the curing of the temperature measuring circuit layer.

[0093] S400 , coating the surface of the temperature measuring circuit layer cured in step S300 with polyimide resin to form a polyimide resin layer with a thickness of 100 μm on the surface of the temperature measuring circuit layer, thereby completing the preparation of the temperature measuring circuit.

[0094] The minimum characteristic size of the temperature measurement circuit prepared in this embodiment is less than or equal to 10 μm.

[0095] In this embodiment, step S200 may further include:

[0096] S201, modeling the aerosol inkjet printing trajectory in mapping software, performing path analysis on the established model using path planning and analysis mapping software, outputting G code, and inputting the G code into a machine tool controller for compilation and standby;

[0097] S202, performing aerosol inkjet printing on the front blade face of the tool with electrostatic charge according to the set path to obtain a temperature measurement circuit layer; specifically, adding the graphene / nanosilver ink to be printed into the aerosol inkjet printing device, wherein the graphene and nanosilver ink are respectively added to the left ink tank and the right ink tank of the aerosol inkjet printing device, setting the printing program and printing parameters of the aerosol inkjet printing to achieve uniform mixing of the two material sols, performing aerosol inkjet printing on the front blade face of the tool with electrostatic charge, and obtaining a temperature measurement circuit layer on the front blade face of the tool.

[0098] The printing parameters of step S202 include the left and right carrier gas flow rates, as well as the sheath gas flow rate. Specifically, during pre-adjustment of the printing parameters, the left and right carrier gas flow rates and the sheath gas flow rates can be adjusted to 20 sccm, 35 sccm, and 30 sccm, respectively. The atomization voltage of the left atomization system can be adjusted to 25 mV, and the atomization voltage of the right atomization system can be adjusted to 30 mV. Aerosol inkjet printing is performed on the rake face of the cutting tool, including executing G code on the rake face of the tool for aerosol inkjet printing. During this process, the command execution speed can be 0.6 mm / s, and the repeatability accuracy can be ±0.1 μm. Example 3

[0099] This embodiment provides another composite material cutting temperature measuring tool, wherein the tool has a rake face, and the rake face is provided with a temperature measuring circuit, wherein the temperature measuring circuit is obtained by coating graphene and silver on the rake face.

[0100] This embodiment also provides a method for preparing a temperature measurement circuit in the composite material cutting temperature measurement tool, comprising:

[0101] S100, obtaining a cutting tool, ultrasonically treating the cutting tool in an alcohol solution for 15 minutes to remove oil stains and dust on the surface of the cutting tool; using an air pump to blow away the cleaning solvent adhering to the surface of the ultrasonically treated cutting tool, thereby completing the surface treatment of the cutting tool; wherein the concentration of the alcohol solution is 75%;

[0102] S200, coating a polyimide resin on the rake face of the cutting tool to form a polyimide resin layer on the rake face of the cutting tool, wherein the thickness of the polyimide resin layer is 120 μm;

[0103] S300, using an aerosol inkjet printing method, after mixing graphene ink and nano silver particle ink, aerosol inkjet printing is performed on the rake face of the cutting tool to form a temperature measurement circuit layer, wherein the temperature measurement circuit layer has a thickness of 120 μm;

[0104] The mass ratio of graphene to silver is 1:20; the concentration of the graphene ink is 50 mg / ml, the viscosity is 20 cp, and the deposition rate is 4×10 -4 mm 3 / s; the concentration of the nano silver particle ink is 1g / ml, the viscosity is 20cp, and the deposition rate is 4×10 -4 mm 3 / s; the printing nozzle adopts a conical dispensing nozzle, and the vertical distance between the conical dispensing nozzle and the rake surface is 5mm;

[0105] S400: Control the temperature of the thermostat to 150°C. Place the cutting tool with the temperature measuring circuit layer in the thermostat in step S300 and keep it there for 0.5 hours. Then, raise the temperature of the thermostat to 260°C and keep it there for 30 minutes at a heating rate of 10°C / min. Continue to raise the temperature of the thermostat to 320°C at a heating rate of 8°C / min and keep it there for 10 minutes. Then, remove the tool from the thermostat and allow it to cool naturally to 20°C. This completes the curing of the temperature measuring circuit layer.

[0106] S500 , coating the surface of the temperature measuring circuit layer cured in step S400 with polyimide resin to form a polyimide resin layer with a thickness of 120 μm on the surface of the temperature measuring circuit layer, thereby completing the preparation of the temperature measuring circuit.

[0107] The minimum characteristic size of the temperature measurement circuit prepared in this embodiment is less than or equal to 10 μm.

[0108] It should be noted that when the tool is cutting a workpiece, the highest cutting temperature does not appear on the cutting edge of the tool, but appears on the front face of the tool at a short distance from the cutting edge of the tool; at the same time, the cutting edge of the tool will produce greater wear during the cutting process, which makes it inconvenient to coat the temperature measuring circuit on and near the cutting edge. Based on this, the present invention chooses to spray the temperature measuring circuit within a certain range close to the cutting edge on the front face of the tool. Furthermore, in order to detect the highest surface temperature of the cutting tool during the process of machining the workpiece, in the composite material cutting temperature measuring tool of the present invention, the temperature measuring circuit can be set at the highest temperature point on the surface of the cutting tool. For example, simulation software can be used to simulate the process of the tool cutting the workpiece, and the temperature field distribution on the surface of the tool during the cutting process can be obtained, thereby determining the highest temperature point on the surface of the tool, and then the temperature measuring circuit is prepared at the highest temperature point using the preparation method of the temperature measuring circuit of the present invention. Example 4

[0109] See also Figure 1 and Figure 2 This embodiment provides a temperature measurement method, which utilizes a chuck 5, a signal converter 7, a display device 9, and a wire 8, and the composite material cutting temperature measurement tool of the above embodiment 1, wherein the tool 2 is connected to the tool handle 1 via a screw 4; the temperature measurement method includes:

[0110] Step 1, fastening the workpiece on the chuck;

[0111] Step 2: Connect the signal input end of the signal converter 7 to the temperature measuring circuit 3 with a wire, and connect the signal output end to the display device 9 with a wire;

[0112] In step 3, the workpiece 6 is processed using the composite material cutting and temperature measuring tool. The temperature signal on the surface of the tool 2 is expressed as an electrical signal in the temperature measuring circuit, and is differentially amplified and converted into a temperature signal by the signal converter 7 and then displayed on the display device 9.

[0113] It should be noted that the composite material cutting and temperature measuring tool of this embodiment can also be the composite material cutting and temperature measuring tool of the aforementioned embodiment 2 or 3, where "composite material" refers to a cutting and temperature measuring tool that can be used to cut composite materials. During the process of machining a workpiece using the composite material cutting and temperature measuring tool, the cutting heat generated causes the temperature of the cutting zone to rise, thereby changing the resistance of the temperature measuring circuit, and the electrical signal is transmitted to a signal converter via a wire. Furthermore, the signal converter is connected to the positive and negative electrodes of the temperature measuring circuit via a wire, provides a stable constant current source to the temperature measuring circuit, receives the electrical signal transmitted by the temperature measuring circuit, differentially amplifies the voltage signal of the temperature measuring circuit, converts it into a temperature signal, and transmits it to a display device for display. The user can read the real-time cutting temperature during the cutting process on the display device. Furthermore, the principle of the signal converter is mainly based on the Peltier effect and Seebeck thermoelectric temperature measurement principle, realizing the conversion of thermal energy into electrical energy. Specifically, the temperature measuring circuit can be printed on an experimental substrate, and a calibration experiment can be performed on the temperature measuring circuit to obtain the function of the ambient temperature of the temperature measuring circuit as a function of the circuit resistance. The temperature-resistance change function is imported into the signal converter. By measuring the resistance value between the two end points of the temperature measurement circuit, the electrical signal can be converted into a temperature signal at the temperature measurement circuit according to the temperature-resistance change function, and then transmitted to the display device through a wire to realize real-time monitoring and display of the temperature.

[0114] Comparative Example 1

[0115] In order to verify the accuracy of the temperature measurement of the composite material cutting temperature measuring tool in the static process, a static calibration method is used for verification. Taking the temperature measuring tool of Example 1 as an example, the specific steps are as follows:

[0116] Step S1: eight temperature points are selected between room temperature (25°C) and the highest temperature generally reached during composite material cutting (200°C), namely, 25°C, 50°C, 75°C, 100°C, 125°C, 150°C, 175°C, and 200°C;

[0117] Step S2: Using a hot end device, adjusting the temperature of the hot end device to 25° C. for temperature measurement;

[0118] Step S3: Use a temperature measuring tool to measure the temperature of the hot end device to verify the deviation between the working reading of the temperature measuring tool and the theoretical temperature in a static state;

[0119] Step S4: Repeat the operations of step S2 and step S3 at 25°C, 50°C, 75°C, 100°C, 125°C, 150°C, 175°C and 200°C respectively.

[0120] In this comparative example, the working readings of the temperature measuring tools are 24.9°C, 49.6°C, 74.6°C, 99.8°C, 124.7°C, 149.5°C, 174.6°C and 199.7°C respectively. It can be seen that the working readings of the above temperature measuring tools are all lower than the actual values, but the error is not higher than 0.5°C, which is close to the theoretical temperature. The temperature measuring tool of the present invention has high temperature measurement accuracy and can be used for temperature measurement in cutting processing in practice.

[0121] Comparative Example 2

[0122] In order to verify the accuracy of the temperature measurement of the composite material cutting temperature measuring tool in the above embodiment during the cutting process, a temperature measurement comparison is performed with an infrared thermal imager. Taking the temperature measuring tool in Example 1 as an example, the specific steps are as follows:

[0123] Step 1: Clamp the workpiece on the machine tool through a chuck;

[0124] Step 2: Mount the composite material cutting temperature measuring tool on a tool handle and connect it to a signal converter and a display device to measure the temperature during the cutting process;

[0125] Step 3: Adjust the infrared thermal imager so that it can measure the temperature of the cutting area;

[0126] Step 4: The tool cuts the workpiece, and the temperature readings of the tool and the infrared thermal imager are read at the same time. Take five groups of different cutting parameters and compare the deviations of the temperature readings of the two at the same time.

[0127] Taking the temperature readings from a single temperature measurement in this comparative example as an example, at a certain point in time after the tool stabilized in cutting, the temperature readings of the tool and the infrared thermal imager were read under five sets of machining parameters. The infrared thermal imager displayed temperatures of 39.7°C, 46.2°C, 56.4°C, 64.6°C, and 73.4°C, respectively, while the display device showed temperatures of 40.2°C, 47.3°C, 56.8°C, 65.2°C, and 74.6°C, respectively. It can be seen that during the above process, the temperature values ​​collected by the temperature-measuring tool were higher than those of the infrared thermal imager. Combined with the above-mentioned Example 1 (the working readings of the temperature-measuring tool were all lower than the actual values, but the error was no greater than 0.5°C), it can be concluded that the temperature-measuring tool of the present invention has higher accuracy than the infrared thermal imager and can be used for temperature measurement in cutting processes.

[0128] In summary, given the technical issues with existing cutting temperature monitoring methods, such as poor measurement accuracy, limited reuse, and poor tool performance, the present invention provides a composite material cutting temperature measurement tool, a method for preparing a temperature measurement circuit, and a temperature measurement method. First, the present invention addresses the technical issue of infrared thermal imagers being unable to directly and accurately measure tool temperature due to obstruction of the tool by chips and cutting fluid. Secondly, in the temperature measurement process of the embedded thin film thermocouple method, it is necessary to groove the tool and embed the thermocouple, which changes the original tool structure, affects the strength of the tool, and reduces the service life of the tool. The technical solution of the present invention will not destroy the original structure of the tool, and improves the service life of the tool compared to the embedded thin film thermocouple method; furthermore, the preparation process of the thin film thermocouple is relatively complicated, and it is difficult to continue to measure the temperature through subsequent repair processes after the thermocouple is worn and damaged. It is acceptable in laboratory applications, but it is difficult to achieve mass production and engineering applications; after the thin film thermocouple tool and the integrated ceramic tool are prepared, the temperature measurement point is a fixed position. After one temperature measurement, it is difficult to reuse the tool in a new cutting environment. It is difficult to readjust the temperature measurement point according to the actual working environment on site, and the utilization rate is relatively low. In the composite material cutting temperature measuring tool of the present invention, the temperature measuring circuit can be repeatedly sprayed by an aerosol inkjet device. If the original temperature measuring circuit is damaged by wear and tear, and the tool still does not reach the scrap standard, the temperature measuring circuit can be repeatedly sprayed on the front cutting edge of the tool to achieve the temperature measurement effect. Without destroying the original structure of the tool, the tool can be reused, thereby improving the utilization rate of the tool. The present invention adopts aerosol inkjet printing to print the temperature measuring circuit on demand. The printing process is simple and can be printed directly on the tool substrate.

[0129] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0130] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A method for preparing a temperature measuring circuit, characterized in that: include: applying an insulating dielectric layer to the rake face of the cutting tool; After mixing graphene ink and nanosilver ink, aerosol inkjet printing is performed on the insulating dielectric layer to form a temperature measurement circuit layer; wherein the mass ratio of the graphene to the nanosilver is 1: (20-50); sintering the cutting tool to solidify the temperature measurement circuit layer; Coating a protective layer on the surface of the temperature measurement circuit layer to complete the preparation of the temperature measurement circuit; wherein the minimum feature size in the temperature measurement circuit is less than or equal to 10 μm; The insulating dielectric layer comprises electromagnetic shielding resin ink or heat dissipation resin ink; the protective layer comprises electromagnetic shielding resin ink or heat dissipation resin ink; The viscosity of the graphene ink and / or the nanosilver ink is 1-20 cp; the deposition rate of the graphene ink is 1-2 times the deposition rate of the nanosilver ink; The deposition rate of the graphene ink is (4~8)×10 -4 mm 3 / s; the deposition rate of the nanosilver ink is (1~4)×10 -4 mm 3 / s; the thickness of the insulating dielectric layer, temperature measuring circuit layer or protective layer is 50~120μm.

2. The method for preparing a temperature measuring circuit according to claim 1, wherein: Before coating the insulating dielectric layer on the rake face of the cutting tool, the method further comprises: The cutting tool is subjected to surface treatment; the surface treatment method includes one or more of cleaning, grinding and surface modification.

3. The method for preparing a temperature measuring circuit according to claim 2, wherein: During the aerosol inkjet printing process, the vertical distance between the print head and the rake surface is 1 to 5 mm; and / or, The concentration of the graphene ink is 10-50 mg / ml, and the concentration of the nanosilver ink is 1-5 g / ml.

4. The method for preparing a temperature measuring circuit according to claim 3, wherein: The sintering process is carried out by step-by-step heating and sintering, and the process of the sintering process is as follows: heating the cutting tool at a temperature of 130-150° C. for 0.5-1 h; Continue to heat up to 220~260℃ and sinter for 30~60min; Continue to heat up to 280~320℃, sinter for 10~40min, and then cool to room temperature.

5. A temperature measurement method, characterized in that: A composite material cutting temperature measuring tool is manufactured using a chuck, a signal converter, a display device, a wire, and the method for preparing a temperature measuring circuit according to any one of claims 1 to 4. The composite material cutting temperature measuring tool is provided with a temperature measuring circuit. The temperature measuring method includes: securing a workpiece to the chuck; Connecting the signal input end of the signal converter to the wire of the temperature measuring circuit, and connecting the signal output end to the wire of the display device; The workpiece is processed using the composite material cutting temperature measuring tool. The temperature signal on the tool surface is expressed as an electrical signal in the temperature measuring circuit and is differentially amplified and converted into a temperature signal by the signal converter before being displayed on the display device.

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