Silicon wafer cutting device with disconnection alarm function

Abstract

The present application discloses a silicon wafer cutting device with a wire break alarm function, including a chassis, a lifting seat, a lifting unit, a cutting roller unit, a driving unit, a wire release unit, a wire take-up unit, a tensioning roller unit and a plurality of guide roller units; the cutting roller unit includes two rotating rollers; a wire break detection unit facing one of the rotating rollers is installed in the chassis. The silicon wafer cutting device of the present application has two first detection units. After the cutting line breaks, whether the upper cutting line or the lower cutting line is thrown out, it can be detected, so as to alarm and remind timely maintenance. In addition to the detection signal generated by the break of the first connecting line, the signal change of the tension sensor of the second detection unit can also detect whether the cutting line is broken, so that multiple means of detection are adopted, and the detection is more accurate. And it is possible to detect the position of the broken cutting line, and even fix the broken cutting line, so as to provide convenience for subsequent processing.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon wafer cutting devices, and more specifically, to a silicon wafer cutting device with a disconnection alarm function. Background Art

[0002] The silicon wafer cutting device is an industrial equipment used to cut silicon materials. It is widely used in semiconductor manufacturing, optoelectronic technology, new energy fields, semiconductor lighting and other fields. In the semiconductor manufacturing industry, the silicon wafer cutting device is one of the necessary equipment for manufacturing semiconductor chips; in optoelectronic technology, a large number of silicon wafer cutting devices are needed to process silicon wafers to produce various optoelectronic components; in the field of new energy, such as the production process of solar panels, silicon wafer cutting devices are also needed to process silicon wafers.

[0003] Although some existing patents have the function of wire break alarm, the detection means are relatively simple. Some mainly rely on the method of breaking the detection line when the cutting line is broken and thrown out for detection. This method has great uncertainty because the force of the throwing may vary depending on various factors (such as the material, tension, breaking method, etc. of the cutting line). If the throwing force is not enough and the detection line cannot be broken, the wire break may not be detected. In addition, even if the wire break can be detected, the specific break position of the cutting line cannot be detected, which requires manual search and judgment, which not only increases the work intensity but also reduces the work efficiency. Summary of the invention

[0004] The present invention aims to overcome the defects of the prior art and provide a silicon wafer cutting device with a wire break alarm function.

[0005] In order to achieve the above-mentioned purpose, the present invention provides the following technical solutions: a silicon wafer cutting device, comprising a chassis, a lifting seat, a lifting unit for driving the lifting seat to lift and lower, a cutting roller unit, a driving unit for driving the cutting roller unit to rotate, a wire-releasing unit, a wire-reeling unit, a tensioning roller unit and a plurality of guide roller units; the cutting roller unit comprises two rotating rollers; a wire-break detection unit facing one of the rotating rollers is installed in the chassis; the wire-break detection unit comprises a first mounting plate and a second mounting plate, a first detection unit is installed between the first mounting plate and the second mounting plate, the first detection unit comprises a first spring connected to the first mounting plate, a movable block connected to the first spring, a first connecting line connected between the movable block and the second mounting plate, a convex plate connected to the first mounting plate and a proximity switch for detecting the position of the movable block.

[0006] Furthermore, it also includes a cutting liquid supply unit, which can spray cutting coolant on the silicon rod.

[0007] Thereby, the cutting process can be cooled, the cutting wire can be effectively tensioned, and the silicon rod can be cut.

[0008] Further, the tensioning roller unit includes a first tensioning roller and a second tensioning roller, the multiple guide roller units include multiple first guide rollers and multiple second guide rollers, the first tensioning roller is located between the pay-off unit and the cutting roller unit, the second tensioning roller is located between the cutting roller unit and the take-up unit, the multiple first guide rollers are located between the pay-off unit and the cutting roller unit, and the multiple second guide rollers are located between the cutting roller unit and the take-up unit.

[0009] The diamond cutting wire is reciprocatingly wound between two rotating rollers to form multiple parallel cutting lines for cutting the silicon rod into silicon wafers.

[0010] Furthermore, the rotating roller of the two rotating rollers close to the broken wire detection part is the first rotating roller, and the other rotating roller is the second rotating roller; there are two first detection units, and the first connecting lines of the two first detection units are in a horizontal state, and the horizontal height of the first connecting line of one of the first detection units is higher than the axis of the first rotating roller, and the horizontal height of the first connecting line of the other first detection unit is lower than the axis of the first rotating roller.

[0011] Furthermore, the wire break detection part also includes a second detection unit, which is located between the two first detection units, and the second detection unit includes a second connecting line, a mounting frame fixedly connected to the first mounting plate, a substrate fixedly connected to the first mounting plate, a tension sensor installed at the substrate, a second spring connected to the tension sensor, a movable seat connected to the second spring, and a movable pulley fixed at the movable seat; the first fixed pulley, the second fixed pulley, the third fixed pulley and the fourth fixed pulley are installed on the mounting frame, both ends of the second connecting line are fixedly connected to the second mounting plate, and the second connecting line passes through the first fixed pulley, the second fixed pulley, the movable pulley, the third fixed pulley and the fourth fixed pulley in sequence.

[0012] Furthermore, the first connecting wire is a metal wire or a nylon wire.

[0013] There is no special requirement on the material of the first connecting line, as long as the first connecting line can be broken when the cutting line is broken and thrown out.

[0014] Furthermore, the second connecting wire is a steel wire.

[0015] There is no special material requirement for the second connecting line, as long as it ensures that it will not break when hit by the cutting line thrown out by the break.

[0016] Furthermore, the base plate has a plurality of horizontal guide rods, and the movable seat has a plurality of guide holes matched with the horizontal guide rods.

[0017] Thereby limiting the movement of the movable seat.

[0018] Furthermore, the second connecting line is penetrated by two strip arc panels, both of which are passed through by the second connecting line and fixedly connected to the second connecting line, wherein one of the strip arc panels is located between the second mounting plate and the first fixed pulley, and the other strip arc panel is located between the second mounting plate and the fourth fixed pulley.

[0019] Thereby, the strip arc panel can bear the force better, so that the strip arc panel can shake more greatly, and the detection of the tension sensor is more sensitive.

[0020] In some embodiments, the surface of the strip-shaped curved panel is coated with a glue layer.

[0021] As a result, the broken diamond wire hits the strip arc panel and adheres to the strip arc panel.

[0022] In other embodiments, the surface of the strip arc panel is coated with powder ash.

[0023] Thus, the applied powder ash will leave stripe marks when hit by the broken diamond wire.

[0024] Furthermore, a liquid receiving tank is installed in the chassis, the liquid receiving tank is connected to a liquid lowering pipe, and a filter is installed at the liquid receiving tank.

[0025] It is used to receive the coolant, and the filter can filter the finely divided silicon material and impurities.

[0026] Furthermore, the side of the chassis has a side opening for placing silicon rods; the chassis is also equipped with a sliding door, which faces the wire break detection unit.

[0027] Thereby, it is convenient to install the silicon rod from the side opening, and open the translational door to perform corresponding operations.

[0028] Beneficial effects:

[0029] 1) The silicon wafer cutting device of the present application has two first detection units. After the cutting line breaks, whether the upper cutting line or the lower cutting line is thrown out, it can be detected, thereby alarming and reminding timely maintenance.

[0030] 2) In the silicon wafer cutting device of the present application, in addition to the detection signal generated by the breakage of the first connecting line, the signal change of the tension sensor of the second detection unit can also detect whether the cutting line is broken, thereby adopting multiple detection means, and the detection is more accurate.

[0031] 3) The silicon wafer cutting device of the present application can detect the position of the broken cutting line and can even fix the broken cutting line, thereby facilitating subsequent processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic diagram of the cutting device from the first perspective;

[0033] Figure 2 This is an enlarged view of area A;

[0034] Figure 3 This is an enlarged view of area B;

[0035] Figure 4 is a schematic diagram of the cutting device from a second viewing angle;

[0036] Figure 5 It is a schematic diagram of the cutting device from the third perspective.

[0037] For the sake of simplicity, only part of the chassis is drawn, while the tensioning roller unit, the pay-off unit, the take-up unit and the multiple guide roller units are not drawn.

[0038] Explanation of the reference numerals: 1 chassis; 1.1 side opening; 2.1 first rotating roller; 2.2 second rotating roller; 3.1 first mounting plate; 3.2 second mounting plate; 4.1 first spring; 4.2 movable block; 4.3 first connecting line; 4.4 convex plate; 4.5 proximity switch; 5.1 second connecting line; 5.1.1 strip arc panel; 5.2 mounting frame; 5.2.1 first fixed pulley; 5.2.2 second fixed pulley; 5.2.3 third fixed pulley; 5.2.4 fourth fixed pulley; 5.3 substrate; 5.3.1 horizontal guide rod; 5.4 tension sensor; 5.5 second spring; 5.6 movable seat; 5.7 movable pulley; 6 silicon rod; 7 diamond wire. DETAILED DESCRIPTION

[0039] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0040] The present invention provides Figure 1-5A silicon wafer cutting device with a wire break alarm function shown in the figure comprises a chassis 1, a lifting seat, a lifting unit for driving the lifting seat to lift, a cutting roller unit, a driving unit for driving the cutting roller unit to rotate, a wire unwinding unit, a wire take-up unit, a tensioning roller unit and a plurality of guide roller units; the cutting roller unit comprises two rotating rollers; a wire break detection unit facing one of the rotating rollers is installed in the chassis 1; the wire break detection unit comprises a first mounting plate 3.1 and a second mounting plate 3.2, a first detection unit is installed between the first mounting plate 3.1 and the second mounting plate 3.2, the first detection unit comprises a first spring 4.1 connected to the first mounting plate 3.1, a movable block 4.2 connected to the first spring 4.1, a first connecting line 4.3 connected between the movable block 4.2 and the second mounting plate 3.2, a convex plate 4.4 connected to the first mounting plate 3.1 and a proximity switch 4.5 for detecting the position of the movable block 4.2.

[0041] The silicon wafer cutting device also includes a cutting liquid supply unit, which can spray cutting coolant on the silicon rod 6; the tensioning roller unit includes a first tensioning roller and a second tensioning roller, and the multiple guide roller units include multiple first guide rollers and multiple second guide rollers. The first tensioning roller is located between the pay-off unit and the cutting roller unit, the second tensioning roller is located between the cutting roller unit and the take-up unit, the multiple first guide rollers are located between the pay-off unit and the cutting roller unit, and the multiple second guide rollers are located between the cutting roller unit and the take-up unit.

[0042] The rotating rollers of the two rotating rollers close to the broken wire detection part are the first rotating rollers 2.1, and the other rotating roller is the second rotating roller 2.2; the first detection units have two, and the first connecting lines 4.3 of the two first detection units are both in a horizontal state, wherein the horizontal height of the first connecting line 4.3 of one first detection unit is higher than the axis of the first rotating roller 2.1, and the horizontal height of the first connecting line 4.3 of the other first detection unit is lower than the axis of the first rotating roller 2.1; the broken wire detection part also includes a second detection unit, which is located between the two first detection units, and the second detection unit includes a second connecting line 5.1, a mounting frame 5.2 fixedly connected to the first mounting plate 3.1, and a mounting frame 5.3 fixedly connected to the first mounting plate The base plate 3.1 is fixedly connected to the base plate 5.3, the tension sensor 5.4 installed at the base plate 5.3, the second spring 5.5 connected to the tension sensor 5.4, the movable seat 5.6 connected to the second spring 5.5, and the movable pulley 5.7 fixed to the movable seat 5.6; the first fixed pulley 5.2.1, the second fixed pulley 5.2.2, the third fixed pulley 5.2.3 and the fourth fixed pulley 5.2.4 are installed at the mounting frame 5.2, both ends of the second connecting line 5.1 are fixedly connected to the second mounting plate 3.2, and the second connecting line 5.1 passes through the first fixed pulley 5.2.1, the second fixed pulley 5.2.2, the movable pulley 5.7, the third fixed pulley 5.2.3 and the fourth fixed pulley 5.2.4 in sequence.

[0043] The base plate 5.3 is provided with a plurality of horizontal guide rods 5.3.1, and the movable seat 5.6 is provided with a plurality of guide holes cooperating with the horizontal guide rods 5.3.1; the second connecting line 5.1 is penetrated by two strip arc panels 5.1.1, and the two strip arc panels 5.1.1 are both passed through by the second connecting line and fixedly connected with the second connecting line, one of the strip arc panels 5.1.1 is located between the second mounting plate 3.2 and the first fixed pulley 5.2.1, and the other strip arc panel 5.1.1 is located between the second mounting plate 3.2 and the fourth fixed pulley 5.2.4; the surface of the strip arc panel 5.1.1 is coated with a glue layer, or the surface of the strip arc panel 5.1.1 is coated with powder ash.

[0044] The chassis 1 is also provided with a liquid receiving tank, the liquid receiving tank is connected with a liquid down pipe, and a filter is installed at the liquid receiving tank; the side of the chassis 1 has a side opening 1.1 for placing the silicon rod 6; the chassis 1 is also provided with a sliding door, which faces the wire break detection unit.

[0045] Working principle: When the silicon wafer cutting device of the present application is in use, the lifting seat can be installed with a whole consisting of a silicon rod and a crystal support, and the lifting unit drives the lifting seat to slowly descend, so that the diamond wire reciprocatingly wound between the two rotating rollers can slice the silicon rod. After the cutting wire moves forward for a certain distance, it will move backward for a certain distance (smaller than the distance moved forward), and so on, until a roll of diamond wire is completely used, so that both sides of each end of the diamond wire are actually used, thereby saving the use of diamond wire. Therefore, in actual use, the rotation direction of the two rotating rollers will change.

[0046] The present application sets up two first detection units, so that it can detect whether the diamond wire is thrown out from the top or the bottom after breaking. When the first connecting wire is broken, the first spring will cause the position of the movable block to change, which will be detected by the proximity switch and an alarm will be sounded.

[0047] In addition, when the swung diamond wire hits the first connecting wire (even if the first connecting wire is broken, the first connecting wire will still give the diamond wire a force when hitting, forcing the end of the diamond wire to swing toward the strip arc panel), due to the resistance, the swing direction of its end will be toward the strip arc panel, which will produce a second hit on the strip arc panel, so that the strip arc panel will shake, and the measurement value of the tension sensor will change, so that the break of the diamond wire can also be detected. Therefore, even if the first connecting wire is not broken due to a fault, it will not affect the detection of the broken wire.

[0048] In addition, when the end of the diamond wire is thrown onto the strip arc panel, due to the glue layer or powder on the strip arc panel, it will stick to the strip arc panel, or leave a mark on the powder, which makes it easy to determine the location of the broken wire, thereby facilitating subsequent operations.

[0049] Although the present invention has been illustrated and described with respect to the preferred embodiments, it will be appreciated by those skilled in the art that various changes and modifications may be made to the present invention without departing from the scope of the present invention as defined by the claims.

Claims

1. A silicon wafer cutting device with a disconnection alarm function, characterized in that: The invention comprises a chassis, a lifting seat, a lifting unit for driving the lifting seat to lift, a cutting roller unit, a driving unit for driving the cutting roller unit to rotate, a wire-releasing unit, a wire-retrieving unit, a tensioning roller unit and a plurality of guide roller units; the cutting roller unit comprises two rotating rollers; a wire-breaking detection unit facing one of the rotating rollers is installed in the chassis; the wire-breaking detection unit comprises a first mounting plate and a second mounting plate, a first detection unit is installed between the first mounting plate and the second mounting plate, the first detection unit comprises a first spring connected to the first mounting plate, a movable block connected to the first spring, a first connecting line connected between the movable block and the second mounting plate, a convex plate connected to the first mounting plate and a proximity switch for detecting the position of the movable block; The rotating roller of the two rotating rollers close to the wire breakage detection part is a first rotating roller, and the other rotating roller is a second rotating roller; there are two first detection units, and the first connecting lines of the two first detection units are both in a horizontal state, wherein the horizontal height of the first connecting line of one first detection unit is higher than the axis of the first rotating roller, and the horizontal height of the first connecting line of the other first detection unit is lower than the axis of the first rotating roller; The wire break detection part also includes a second detection unit, which is located between the two first detection units, and includes a second connecting line, a mounting frame fixedly connected to the first mounting plate, a substrate fixedly connected to the first mounting plate, a tension sensor installed at the substrate, a second spring connected to the tension sensor, a movable seat connected to the second spring, and a movable pulley fixed at the movable seat; the first fixed pulley, the second fixed pulley, the third fixed pulley and the fourth fixed pulley are installed at the mounting frame, both ends of the second connecting line are fixedly connected to the second mounting plate, and the second connecting line passes through the first fixed pulley, the second fixed pulley, the movable pulley, the third fixed pulley and the fourth fixed pulley in sequence.

2. The silicon wafer cutting device with disconnection alarm function according to claim 1, characterized in that: It also includes a cutting liquid supply unit, which can spray cutting coolant on the silicon rod; the tensioning roller unit includes a first tensioning roller and a second tensioning roller, and the multiple guide roller units include multiple first guide rollers and multiple second guide rollers. The first tensioning roller is located between the pay-off unit and the cutting roller unit, the second tensioning roller is located between the cutting roller unit and the take-up unit, the multiple first guide rollers are located between the pay-off unit and the cutting roller unit, and the multiple second guide rollers are located between the cutting roller unit and the take-up unit.

3. The silicon wafer cutting device with disconnection alarm function according to claim 1, characterized in that: The base plate is provided with a plurality of horizontal guide rods, and the movable seat is provided with a plurality of guide holes matched with the horizontal guide rods.

4. The silicon wafer cutting device with disconnection alarm function according to claim 1, characterized in that: The second connecting line is penetrated by two strip arc panels, both of which are penetrated by the second connecting line and fixedly connected to the second connecting line, one of the strip arc panels is located between the second mounting plate and the first fixed pulley, and the other strip arc panel is located between the second mounting plate and the fourth fixed pulley; the surface of the strip arc panel is coated with a glue layer, or the surface of the strip arc panel is coated with powder ash.

5. The silicon wafer cutting device with disconnection alarm function according to claim 2, characterized in that: A liquid receiving tank is also installed in the chassis, the liquid receiving tank is connected to a liquid lowering pipe, and a filter screen is installed at the liquid receiving tank.

6. The silicon wafer cutting device with disconnection alarm function according to claim 2, characterized in that: The side of the chassis is provided with a side opening for placing silicon rods; the chassis is also provided with a translationally movable door, which faces the wire break detection unit.

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