Antistatic heat-sealing cover tape and preparation method thereof

Abstract

The present invention discloses a heat-sealed cover tape capable of preventing static electricity and a preparation method thereof, and belongs to the technical field of preparation of layered products for electronic component packaging. The preparation method comprises the following steps: a composite substrate layer and an adhesive antistatic coating are processed by lamination pressure of 0.5MPa to 2MPa. The present invention obtains a composite substrate layer with good flexibility and wear resistance by composite modification of the substrate layer of the cover tape, and then uses a thermoplastic elastomer with good thermal processing plasticity as an adhesive base material, and prepares an adhesive antistatic coating with antistatic function and good flowability through a nucleophilic addition grafting reaction. Finally, the composite substrate layer and the adhesive antistatic coating are laminated to form a heat-sealed cover tape with good low-temperature heat sealing and antistatic functions.

Description

Technical Field

[0001] The invention belongs to the technical field of preparation of layered products for electronic component packaging, and particularly relates to an antistatic heat-sealing cover tape and a preparation method thereof. Background Art

[0002] Cover tape, commonly known as "cover film" or "package cover tape," is an important material used to protect components during the electronic component packaging process. It is generally made of plastic, metal, or other composite materials, and is primarily used to cover and protect electronic components such as chips, sensors, and discrete components. Cover tape is primarily used in the electronic component assembly industry. It is used in conjunction with carrier tape to carry and store electronic components such as resistors, capacitors, transistors, and diodes in pockets on the carrier tape. The cover tape is sealed over the pockets formed by the carrier tape to form a closed package that protects the electronic components from contamination and damage during transportation. When electronic components are being mounted, the cover tape is peeled off, and the automatic mounting equipment uses the precise positioning of the carrier tape's index holes to take out the components in the pockets one by one, and then mounts them on the integrated circuit board.

[0003] Sealing carrier tape with cover tape is typically done using two methods: pressure-sensitive and heat-sensitive. Pressure-sensitive sealing involves applying continuous pressure via the sealer's rollers, causing the pressure-sensitive adhesive on the cover tape to adhere to the carrier tape, thereby wrapping the electronic components. However, this method requires high pressure resistance from the carrier tape material. If the pressure resistance is low, the carrier tape can easily be crushed during pressure-sensitive sealing, potentially damaging the electronic components. Heat-sensitive sealing is a more common method. A sealer applies a certain temperature and pressure, causing the hot-melt adhesive in the cover tape to melt and press onto the sealing surface of the carrier tape. The advantage of this method is that the heat-sensitive tape used for heat-sensitive sealing is non-sticky at room temperature and only becomes sticky when heated. Furthermore, the required sealing pressure is low, preventing damage to the carrier tape. Friction during peeling of the cover tape can easily accumulate charge, generating static electricity. This static electricity can attract dust and damage electronic components, making the development of anti-static cover tape of great value.

[0004] Patent CN107791638A discloses a cover tape and a method for using the same. The invention provides dotted cuts on the cover tape body near both side edges. The cover tape body between the two dotted cuts is a peeling area, and the cover tape body outside the two dotted cuts is a heat-sealing area. The cover tape body includes a substrate layer, and an antistatic film and a protective wax layer are sequentially arranged upward on the upper surface of the substrate layer, and an antistatic agent is distributed in the antistatic film. A pressure-sensitive adhesive layer and a mask layer are sequentially arranged downward in the central area of ​​the peeling area corresponding to the lower surface of the substrate layer, and the upper surface of the pressure-sensitive adhesive layer is bonded to the lower surface of the substrate layer, and the lower surface of the pressure-sensitive adhesive layer is bonded to the upper surface of the mask layer. A polyurethane glue layer, a composite layer, a bearing layer and a heat-sealing layer are sequentially arranged downward in the two side areas of the lower surface of the substrate layer corresponding to the heat-sealing areas on both sides. The anti-static function is achieved by adjusting the material proportions of the mask layer, the composite layer, the bearing layer and the heat-sealing layer.

[0005] Patent CN115027115A discloses an environmentally friendly composite cover tape and its preparation process. The invention designs a composite cover tape having a PET layer, a PE layer and a TPE layer, and then composites the raw materials used for the PE layer and the TPE layer. By controlling the weight ratio of the ethylene / sodium methacrylate copolymer in the TPE layer raw material, the antistatic property is achieved.

[0006] Although the above two patents achieve the anti-static function of the cover tape, since the heat sealing temperature is mostly above 100°C, within this temperature range, if the heat cannot be dissipated to the environment in time, it is easy to have a "fatal effect" on the electronic components, causing the electronic components to be damaged and unusable.

[0007] Therefore, it is of great significance to develop an anti-static device that can avoid the adverse effects of excessively high heat sealing temperatures on electronic components. Summary of the Invention

[0008] In response to the shortcomings of the prior art, the present invention compositely modifies the base material layer of the cover tape to obtain a composite base material layer with good flexibility and wear resistance. A thermoplastic elastomer with good thermal processing plasticity is then used as the adhesive base material. Through a nucleophilic addition grafting reaction, an adhesive antistatic coating with antistatic function and good flow properties is prepared. Finally, the composite base material layer and the adhesive antistatic coating are laminated to form a heat-sealed tape cover, thereby solving the technical problems raised in the background art. Specifically, the technical solution of the present invention includes the following:

[0009] The invention discloses an antistatic heat-sealing cover tape, which consists of a composite substrate layer and an adhesive antistatic coating layer.

[0010] Furthermore, the method for preparing the composite substrate layer comprises the following steps:

[0011] Aramid material, polyurethane material and epoxy resin material are mixed in a weight ratio of 1:2-3:1-2, and then blended in a temperature environment of 170°C-200°C for 10min-15min to obtain a blend, and the blend is poured into a mold and naturally cooled to form the composite substrate layer.

[0012] Furthermore, the aramid material is aramid chopped fibers, the polyurethane material is polyester TPU2, and the epoxy resin material is HY604-810 solid epoxy resin, HY604-820 solid epoxy resin, or HY604-850 solid epoxy resin.

[0013] Furthermore, the preparation method of the adhesive antistatic coating comprises the following steps:

[0014] The thermoplastic elastomer is treated with oxygen plasma to obtain a hydroxylated thermoplastic elastomer;

[0015] The hydroxylated thermoplastic elastomer, the conductive polymer containing a secondary amine structure and the diisocyanate coupling agent are mixed and dispersed in an organic solvent in a weight ratio of 1-2:0.05-0.1:2-4 to form a reaction liquid. The reaction liquid is mixed and stirred with an organic weak base catalyst in a weight ratio of 1:0.1-0.2, and then heated to 70°C-80°C for reaction for 4h-8h to obtain the adhesive antistatic coating.

[0016] Furthermore, the thermoplastic elastomer is polystyrene butadiene copolymer or polystyrene-block-polyisoprene-block-polystyrene.

[0017] Furthermore, the conditions of the oxygen plasma treatment include an oxygen flow rate of 60 sccm to 100 sccm, a voltage of 300 V to 320 V, a treatment distance of 20 mm to 25 mm, and a treatment time of 60 s to 150 s.

[0018] Furthermore, the conductive polymer containing a secondary amine structure is polyaniline or polypyrrole.

[0019] Furthermore, the diisocyanate coupling agent is isophorone diisocyanate, 4,4'-diisocyanate dicyclohexylmethane, hexamethylene diisocyanate or trimethylhexamethylene diisocyanate.

[0020] Furthermore, the organic solvent includes N-methylpyrrolidone or N,N-dimethylformamide.

[0021] Furthermore, the usage amount of the organic solvent is 1 to 2 times the total weight of the hydroxylated thermoplastic elastomer, the conductive polymer containing a secondary amine structure, and the diisocyanate coupling agent.

[0022] Furthermore, the organic weak base catalyst includes triethylamine, diethanolamine or pyridine.

[0023] A method for preparing an antistatic heat-sealing cover tape, the method comprising the following steps:

[0024] The composite substrate layer and the adhesive antistatic coating are processed by laminating under a pressure of 0.5 MPa to 2 MPa.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] The present invention first modifies the base material layer of the cover tape, utilizing the properties of a high-strength, tear-resistant aramid material, and polyurethane and epoxy resin materials with good flexibility. Through compounding and high-temperature blending, a composite base material layer with both flexibility and strength is obtained. The thermoplastic elastomer, which is easy to process at high temperatures, is then plasma-oxidized to obtain hydroxyl groups on its surface. The secondary amine groups on the conductive polymer containing a secondary amine structure act as nucleophiles, initiating nucleophilic addition to the carbon atoms of the isocyanate groups, a reactive group of a diisocyanate coupling agent, to form a urea structure. The hydroxyl groups on the hydroxylated thermoplastic elastomer obtained after plasma oxidation then act as nucleophiles to initiate nucleophilic attack on the carbon atoms of another isocyanate group, forming an amide structure. Through a nucleophilic addition grafting reaction system, the conductive polymer containing a secondary amine structure, which has conductive properties, is introduced into the thermoplastic elastomer, achieving antistatic modification. Thermoplastic elastomers and diisocyanate coupling agents have flexible structures such as longer and more free carbon chains and saturated carbon ring structures with good freedom, which make it easy for the polymer to bend and rotate freely. As a result, the final adhesive antistatic coating has good flow properties. The adhesive antistatic coating with good flow can achieve good adhesion at lower temperatures, reducing the adverse effects of heat sealing at excessively high temperatures that can easily damage electronic components. DETAILED DESCRIPTION

[0027] The following will clearly and completely describe the technical solutions of the present invention through the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making any creative efforts shall fall within the scope of protection of the present invention.

[0028] Unless otherwise specified, the raw materials and reagents used in the present invention are commercially available or can be prepared by known methods.

[0029] Aramid chopped fiber was purchased from Yantai Taihexing Materials Technology Co., Ltd.;

[0030] Polyester TPU2 was purchased from Zhejiang Huafeng Thermoplastic Polyurethane Co., Ltd.

[0031] HY604-810 solid epoxy resin, HY604-820 solid epoxy resin or HY604-850 solid epoxy resin are purchased from Anhui Hengyuan Technology Co., Ltd.

[0032] Preparation Example 1:

[0033] The preparation method of the composite substrate layer specifically includes the following steps:

[0034] 1 part by weight of aramid chopped fiber, 2 parts by weight of polyester TPU2, and 1 part by weight of HY604-810 solid epoxy resin were dried in a vacuum drying oven at 60°C for 12 hours. The mixture was then placed in an extruder, heated to 170°C, and blended at 50 rpm for 10 minutes. After blending, the resulting blend was poured into a flat mold and naturally cooled to form a composite substrate layer.

[0035] Preparation Example 2:

[0036] The preparation method of the composite substrate layer specifically includes the following steps:

[0037] 1 part by weight of aramid chopped fiber, 2.5 parts by weight of polyester TPU2, and 1 part by weight of HY604-810 solid epoxy resin were dried in a vacuum drying oven at 60°C for 12 hours. The mixture was then placed in an extruder, heated to 180°C, and blended at 50 rpm for 12 minutes. After blending, the resulting blend was poured into a flat mold and naturally cooled to form a composite substrate layer.

[0038] Preparation Example 3:

[0039] The preparation method of the composite substrate layer specifically includes the following steps:

[0040] 1 part by weight of aramid chopped fiber, 2.5 parts by weight of polyester TPU2, and 1.5 parts by weight of HY604-820 solid epoxy resin were dried in a vacuum drying oven at 60°C for 12 hours. The mixture was then placed in an extruder, heated to 190°C, and blended at 100 rpm for 12 minutes. After blending, the resulting blend was poured into a flat mold and naturally cooled to form a composite substrate layer.

[0041] Preparation Example 4:

[0042] The preparation method of the composite substrate layer specifically includes the following steps:

[0043] 1 part by weight of aramid chopped fiber, 3 parts by weight of polyester TPU2, and 1.5 parts by weight of HY604-820 solid epoxy resin were dried in a vacuum drying oven at 60°C for 12 hours. The mixture was then placed in an extruder, heated to 200°C, and blended at 100 rpm for 14 minutes. After blending, the resulting blend was poured into a flat mold and naturally cooled to form a composite substrate layer.

[0044] Preparation Example 5:

[0045] The preparation method of the composite substrate layer specifically includes the following steps:

[0046] 1 part by weight of aramid chopped fiber, 3 parts by weight of polyester TPU2, and 2 parts by weight of HY604-850 solid epoxy resin were dried in a vacuum drying oven at 60°C for 12 hours. The mixture was then placed in an extruder, heated to 200°C, and blended at 150 rpm for 15 minutes. After blending, the resulting blend was poured into a flat mold and naturally cooled to form a composite substrate layer.

[0047] Preparation Example 6:

[0048] The preparation method of the composite substrate layer specifically includes the following steps:

[0049] 2 parts by weight of aramid chopped fibers, 3 parts by weight of polyester TPU2, and 2 parts by weight of HY604-850 solid epoxy resin were dried in a vacuum drying oven at 60°C for 12 hours. The mixture was then placed in an extruder, heated to 200°C, and blended at 150 rpm for 15 minutes. After blending, the resulting blend was poured into a flat mold and naturally cooled to form a composite substrate layer.

[0050] Preparation Example 7:

[0051] The preparation method of the composite substrate layer specifically includes the following steps:

[0052] 3 parts by weight of polyester TPU2 and 2 parts by weight of HY604-850 solid epoxy resin were dried in a vacuum drying oven at 60°C for 12 hours. The mixture was then placed in an extruder, heated to 200°C, and blended at 150 rpm for 15 minutes. After blending, the resulting mixture was poured into a flat mold and naturally cooled to form a composite substrate layer.

[0053] The composite substrate layers obtained in Preparation Examples 1 to 7 were tested for impact and bending properties according to GB / T 2571-1995 Impact Test Method for Cast Resin Bodies and GB / T 2570-1995 Flexural Test Method for Cast Resin Bodies, and deformation was observed. The results are shown in the following table:

[0054]

[0055] in conclusion:

[0056] (1) From the data in the above table, it can be seen that under certain preparation conditions, Preparation Examples 1 to 5 exhibit good bending toughness and impact strength. This property helps to reduce the adverse effects of damage to electronic components caused by deformation or breakage of the cover tape due to external forces.

[0057] (2) In Preparation Example 6, due to the excessive use of high-strength aramid short-cut fibers, the strength of the composite substrate layer is increased, but the flexibility is greatly reduced, the impact resistance is reduced, and it is easy to crack and break when impacted.

[0058] (3) In Preparation Example 7, due to the removal of the aramid chopped fibers, the obtained composite substrate layer has good impact strength, but due to its high bending toughness, it may cause excessive deformation of the material during stretching or compression, causing damage to electronic components, and the high bending toughness makes it difficult to be molded and utilized.

[0059] Preparation Example 8:

[0060] The preparation method of the adhesive antistatic coating specifically includes the following steps:

[0061] Oxygen was introduced into the plasma processor at a flow rate of 60 sccm and a voltage of 300 V was applied for test spraying. After adjustment, a polystyrene butadiene copolymer was placed 20 mm below the plasma processor nozzle and subjected to oxygen plasma treatment for 60 seconds. After the treatment, the mixture was allowed to cool naturally to obtain the hydroxylated polystyrene butadiene copolymer.

[0062] 1 part by weight of hydroxylated polystyrene butadiene copolymer, 0.05 parts by weight of polyaniline, and 2 parts by weight of isophorone diisocyanate were placed in 3.05 parts by weight of N-methylpyrrolidone and stirred to disperse uniformly to obtain a reaction solution. The reaction solution was then mixed with 0.305 parts by weight of triethylamine and stirred, and heated to 70°C for a timed reaction of 4 hours. After the reaction, the solution was poured into icy ethanol and allowed to settle. The solution was then filtered, separated, and air-dried to obtain an adhesive antistatic coating.

[0063] Preparation Example 9:

[0064] The preparation method of the adhesive antistatic coating specifically includes the following steps:

[0065] Oxygen was introduced into the plasma processor at a flow rate of 70 sccm and a voltage of 300 V was applied for test spraying. After adjustment, a polystyrene butadiene copolymer was placed 20 mm below the plasma processor nozzle and subjected to oxygen plasma treatment for 90 seconds. After the treatment, the mixture was allowed to cool naturally to obtain the hydroxylated polystyrene butadiene copolymer.

[0066] 1 part by weight of hydroxylated polystyrene butadiene copolymer, 0.06 parts by weight of polyaniline, and 2.5 parts by weight of isophorone diisocyanate were placed in 3.56 parts by weight of N-methylpyrrolidone and stirred to disperse uniformly to obtain a reaction solution. The reaction solution was then mixed with 0.356 parts by weight of triethylamine and stirred, and the mixture was heated to 72°C and reacted for 5 hours. After the reaction, the solution was poured into icy ethanol and allowed to settle. The solution was then filtered, separated, and air-dried to obtain an adhesive antistatic coating.

[0067] Preparation Example 10:

[0068] The preparation method of the adhesive antistatic coating specifically includes the following steps:

[0069] Oxygen was introduced into the plasma processor at a flow rate of 80 sccm and a voltage of 310 V was applied for test spraying. After adjustment, a polystyrene butadiene copolymer was placed 23 mm below the plasma processor nozzle and subjected to oxygen plasma treatment for 90 seconds. After the treatment, the mixture was allowed to cool naturally to obtain the hydroxylated polystyrene butadiene copolymer.

[0070] 1.5 parts by weight of hydroxylated polystyrene butadiene copolymer, 0.07 parts by weight of polyaniline, and 3 parts by weight of 4,4'-diisocyanate dicyclohexylmethane were placed in 4.57 parts by weight of N-methylpyrrolidone and stirred to disperse uniformly to obtain a reaction solution. The reaction solution was then stirred with 0.457 parts by weight of diethylaminoethanolamine and heated to 74°C for a timed reaction of 6 hours. After the reaction, the solution was poured into icy ethanol and allowed to settle. The solution was then filtered, separated, and air-dried to obtain an adhesive antistatic coating.

[0071] Preparation Example 11:

[0072] The preparation method of the adhesive antistatic coating specifically includes the following steps:

[0073] Oxygen was introduced into the plasma processor at a flow rate of 90 sccm, and a test spray was performed at 310 V. After adjustment, a polystyrene-block-polyisoprene-block-polystyrene was placed 23 mm below the plasma processor nozzle and treated with oxygen plasma for 120 seconds. After the treatment, the product was allowed to cool naturally to obtain hydroxylated polystyrene-block-polyisoprene-block-polystyrene.

[0074] 1.5 parts by weight of hydroxylated polystyrene-block-polyisoprene-block-polystyrene, 0.08 parts by weight of polypyrrole, and 3.5 parts by weight of hexamethylene diisocyanate were placed in 10.16 parts by weight of N,N-dimethylformamide and stirred to disperse uniformly to obtain a reaction solution. The reaction solution was then stirred with 2.032 parts by weight of diethylamine and heated to 76°C for a timed reaction of 7 hours. After the reaction, the solution was poured into icy ethanol and allowed to settle. The solution was then filtered, separated, and air-dried to obtain an adhesive antistatic coating.

[0075] Preparation Example 12:

[0076] The preparation method of the adhesive antistatic coating specifically includes the following steps:

[0077] Oxygen was introduced into the plasma processor at a flow rate of 100 sccm and a test spray was performed at 320 V. After adjustment, a polystyrene-block-polyisoprene-block-polystyrene was placed 25 mm below the plasma processor nozzle and treated with oxygen plasma for 120 seconds. After the treatment, the product was cooled naturally to obtain hydroxylated polystyrene-block-polyisoprene-block-polystyrene.

[0078] 2 parts by weight of hydroxylated polystyrene-block-polyisoprene-block-polystyrene, 0.09 parts by weight of polypyrrole, and 4 parts by weight of hexamethylene diisocyanate were placed in 12.18 parts by weight of N,N-dimethylformamide and stirred to disperse uniformly to obtain a reaction solution. The reaction solution was then stirred with 2.436 parts by weight of pyridine and heated to 78°C for a timed reaction of 8 hours. After the reaction, the solution was poured into icy ethanol and allowed to settle. The solution was then filtered, separated, and air-dried to obtain an adhesive antistatic coating.

[0079] Preparation Example 13:

[0080] The preparation method of the adhesive antistatic coating specifically includes the following steps:

[0081] Oxygen was introduced into the plasma processor at a flow rate of 100 sccm and a test spray was performed at 320 V. After adjustment, a polystyrene-block-polyisoprene-block-polystyrene was placed 25 mm below the plasma processor nozzle and treated with oxygen plasma for 150 seconds. After the treatment, the product was cooled naturally to obtain hydroxylated polystyrene-block-polyisoprene-block-polystyrene.

[0082] 2 parts by weight of hydroxylated polystyrene-block-polyisoprene-block-polystyrene, 0.1 parts by weight of polypyrrole, and 4 parts by weight of trimethylhexamethylene diisocyanate were placed in 12.2 parts by weight of N,N-dimethylformamide and stirred to disperse uniformly to obtain a reaction solution. The reaction solution was then stirred with 2.44 parts by weight of pyridine and heated to 80°C for a timed reaction of 8 hours. After the reaction, the solution was poured into icy ethanol and allowed to settle. The solution was then filtered, separated, and air-dried to obtain an adhesive antistatic coating.

[0083] Preparation Example 14:

[0084] The preparation method of the adhesive antistatic coating specifically includes the following steps:

[0085] The trimethylhexamethylene diisocyanate in Preparation Example 13 was replaced with toluene diisocyanate, and the other conditions remained the same as those in Preparation Example 13.

[0086] Preparation Example 15:

[0087] The preparation method of the adhesive antistatic coating specifically includes the following steps:

[0088] The trimethylhexamethylene diisocyanate in Preparation Example 13 was replaced with diphenylmethane-4,4'-diisocyanate, and the other conditions remained the same as those in Preparation Example 13.

[0089] Preparation Example 16:

[0090] The preparation method of the adhesive antistatic coating specifically includes the following steps:

[0091] The polypyrrole in Preparation Example 13 was replaced by carbon black, and the other conditions remained the same as those in Preparation Example 13.

[0092] Preparation Example 17:

[0093] The preparation method of the adhesive antistatic coating specifically includes the following steps:

[0094] The polypyrrole in Preparation Example 13 was replaced with conductive graphene, and the other conditions remained the same as those in Preparation Example 13.

[0095] Preparation Example 18:

[0096] The preparation method of the adhesive antistatic coating specifically includes the following steps:

[0097] 2 parts by weight of polystyrene-block-polyisoprene-block-polystyrene, 0.1 parts by weight of polypyrrole, and 4 parts by weight of trimethylhexamethylene diisocyanate were placed in 12.2 parts by weight of N,N-dimethylformamide and stirred to disperse uniformly to obtain a reaction solution. The reaction solution was then stirred with 2.44 parts by weight of pyridine and heated to 80°C for a timed reaction of 8 hours. After the reaction, the solution was poured into icy ethanol and allowed to settle. The solution was then filtered, separated, and air-dried to obtain an adhesive antistatic coating.

[0098] Example 1:

[0099] A method for preparing an antistatic heat-sealing cover tape specifically comprises the following steps:

[0100] The composite substrate layer obtained in Preparation Example 1 and the adhesive antistatic coating obtained in Preparation Example 8 were respectively controlled to have a thickness of 20 μm and 10 μm using a blade coater, and then the 20 μm thick composite substrate layer and the 10 μm thick adhesive antistatic coating were obtained by lamination pressure processing at 0.5 MPa.

[0101] Example 2:

[0102] A method for preparing an antistatic heat-sealing cover tape specifically comprises the following steps:

[0103] The composite substrate layer obtained in Preparation Example 2 and the adhesive antistatic coating obtained in Preparation Example 9 were respectively controlled to have a thickness of 22 μm and 12 μm using a blade coater, and then the 22 μm thick composite substrate layer and the 12 μm thick adhesive antistatic coating were obtained by lamination pressure processing at 0.5 MPa.

[0104] Example 3:

[0105] A method for preparing an antistatic heat-sealing cover tape specifically comprises the following steps:

[0106] The composite substrate layer obtained in Preparation Example 3 and the adhesive antistatic coating obtained in Preparation Example 10 were respectively controlled to have a thickness of 24 μm and 14 μm using a blade coater, and then the 24 μm thick composite substrate layer and the 14 μm thick adhesive antistatic coating were obtained by lamination pressure processing at 1 MPa.

[0107] Example 4:

[0108] A method for preparing an antistatic heat-sealing cover tape specifically comprises the following steps:

[0109] The composite substrate layer obtained in Preparation Example 4 and the adhesive antistatic coating obtained in Preparation Example 11 were respectively controlled to have a thickness of 26 μm and 16 μm using a blade coater, and then the 26 μm thick composite substrate layer and the 16 μm thick adhesive antistatic coating were obtained by lamination pressure processing at 1 MPa.

[0110] Example 5:

[0111] A method for preparing an antistatic heat-sealing cover tape specifically comprises the following steps:

[0112] The composite substrate layer obtained in Preparation Example 5 and the adhesive antistatic coating obtained in Preparation Example 12 were respectively controlled to have a thickness of 28 μm and 18 μm using a blade coater, and then the 28 μm thick composite substrate layer and the 18 μm thick adhesive antistatic coating were obtained by lamination pressure processing at 1.5 MPa.

[0113] Example 6:

[0114] A method for preparing an antistatic heat-sealing cover tape specifically comprises the following steps:

[0115] The composite substrate layer obtained in Preparation Example 5 and the adhesive antistatic coating obtained in Preparation Example 13 were respectively controlled to have a thickness of 28 μm and 20 μm using a blade coater, and then the 28 μm thick composite substrate layer and the 20 μm thick adhesive antistatic coating were obtained by lamination pressure processing at 2 MPa.

[0116] Comparative Example 1:

[0117] A method for preparing an antistatic heat-sealing cover tape specifically comprises the following steps:

[0118] The adhesive antistatic coating in Example 6 was replaced by the adhesive antistatic coating obtained in Preparation Example 14, and the other conditions remained the same as in Example 6.

[0119] Comparative Example 2:

[0120] A method for preparing an antistatic heat-sealing cover tape specifically comprises the following steps:

[0121] The adhesive antistatic coating in Example 6 was replaced by the adhesive antistatic coating obtained in Preparation Example 15, and the other conditions remained the same as in Example 6.

[0122] Comparative Example 3:

[0123] A method for preparing an antistatic heat-sealing cover tape specifically comprises the following steps:

[0124] The adhesive antistatic coating in Example 6 was replaced by the adhesive antistatic coating obtained in Preparation Example 16, and the other conditions remained the same as in Example 6.

[0125] Comparative Example 4:

[0126] A method for preparing an antistatic heat-sealing cover tape specifically comprises the following steps:

[0127] The adhesive antistatic coating in Example 6 was replaced by the adhesive antistatic coating obtained in Preparation Example 17, and the other conditions remained the same as in Example 6.

[0128] Comparative Example 5:

[0129] A method for preparing an antistatic heat-sealing cover tape specifically comprises the following steps:

[0130] The adhesive antistatic coating in Example 6 was replaced by the adhesive antistatic coating obtained in Preparation Example 18, and the other conditions remained the same as in Example 6.

[0131] Comparative Example 6:

[0132] The thickness of the composite substrate layer and the adhesive antistatic coating in Example 6 were increased to 30 μm and 22 μm, respectively, and the other conditions remained the same as in Example 6.

[0133] The surface resistance values ​​of the antistatic heat-sealing cover tapes obtained in Examples 1 to 6 and Comparative Examples 1 to 6 were measured using an AS982 surface resistance tester. The heat-sealing and peel strength tests were performed at 50° C. The results are shown in the following table:

[0134]

[0135] From the data in the above table we can see that:

[0136] (1) The antistatic heat-sealing cover tapes of Examples 1 to 6 have low surface resistance, good electrical conductivity, are conducive to the release of static electricity, have good antistatic function, and can be heat-sealed at a relatively low temperature of 50°C, reducing the adverse effects of high-temperature sealing on electronic components. The peel strength after sealing is good, indicating that the heat sealing effect can be achieved.

[0137] (2) It can be seen from Comparative Examples 1 and 2 that although they have low surface resistance and good antistatic effect, due to the rigid benzene ring structure of toluene diisocyanate and diphenylmethane-4,4'-diisocyanate, the material has poor fluidity and cannot be heat-sealed at lower temperatures. It may be necessary to further increase the heat-sealing temperature. Higher heat-sealing temperatures will have an adverse effect on electronic components.

[0138] (3) It can be seen from Comparative Examples 3 and 4 that although carbon black and conductive graphene have good conductive properties, conventional mixing easily produces agglomeration, resulting in uneven distribution of carbon black and conductive graphene, making it difficult to form a continuous and uniform conductive path, and thus the anti-static effect is poor.

[0139] (4) Comparative Example 5 shows that since polystyrene-block-polyisoprene-block-polystyrene does not have a functional group that can react with trimethylhexamethylene diisocyanate, it is difficult to improve the antistatic effect by simple mixing.

[0140] (5) It can be seen from Comparative Example 6 that a cover tape that is too thick may require a higher temperature to achieve heat sealing, and high temperature is not conducive to the protection of electronic components.

[0141] The embodiments described above provide a detailed description of the technical solutions and beneficial effects of the present invention. It should be understood that the above descriptions are merely specific embodiments of the present invention and are not intended to limit the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and modifications fall within the scope of the present invention as claimed.

Claims

1. A heat-sealing cover tape capable of preventing static electricity, characterized in that: The heat-sealing cover tape is composed of a composite substrate layer and an adhesive antistatic coating; The composite substrate layer and the adhesive antistatic coating are processed by laminating at a pressure of 0.5 MPa to 2 MPa; The preparation method of the composite substrate layer comprises the following steps: An aramid material, a polyurethane material, and an epoxy resin material are mixed in a weight ratio of 1:2 to 3:1 to 2, and then blended in a temperature environment of 170° C. to 200° C. for 10 to 15 minutes to obtain a blend, and the blend is poured into a mold and naturally cooled to form the composite substrate layer; The aramid material is aramid chopped fibers, the polyurethane material is polyester TPU2, and the epoxy resin material is HY604-810 solid epoxy resin, HY604-820 solid epoxy resin, or HY604-850 solid epoxy resin; The preparation method of the adhesive antistatic coating comprises the following steps: The thermoplastic elastomer is treated with oxygen plasma to obtain a hydroxylated thermoplastic elastomer; The hydroxylated thermoplastic elastomer, the conductive polymer containing a secondary amine structure, and the diisocyanate coupling agent are mixed and dispersed in an organic solvent in a weight ratio of 1-2:0.05-0.1:2-4 to form a reaction solution, the reaction solution is mixed and stirred with an organic weak base catalyst in a weight ratio of 1:0.1-0.2, and then heated to 70° C. to react for 4 h to 8 h to obtain the adhesive antistatic coating; The thermoplastic elastomer is polystyrene butadiene copolymer or polystyrene-block-polyisoprene-block-polystyrene; The conductive polymer containing a secondary amine structure is polyaniline or polypyrrole; The diisocyanate coupling agent is isophorone diisocyanate, 4,4'-diisocyanate dicyclohexylmethane, hexamethylene diisocyanate or trimethylhexamethylene diisocyanate.

2. The antistatic heat-sealing cover tape according to claim 1, characterized in that: The conditions of the oxygen plasma treatment include an oxygen flow rate of 60 sccm to 100 sccm, a voltage of 300 V to 320 V, a treatment distance of 20 mm to 25 mm, and a treatment time of 60 s to 150 s.

3. The antistatic heat-sealing cover tape according to claim 1, characterized in that: The organic weak base catalyst includes triethylamine, diethanolamine or pyridine.

4. A method for preparing an antistatic heat-sealing cover tape as claimed in any one of claims 1 to 3, characterized in that: The preparation method comprises the following steps: The composite substrate layer and the adhesive antistatic coating are processed by laminating under a pressure of 0.5 MPa to 2 MPa.

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