Display module and manufacturing method thereof

Abstract

The present application relates to a display module and a method for manufacturing the same. The method comprises: providing an initial display module, wherein the initial display module comprises a display screen body and an on-screen film layer group and a under-screen film layer group respectively bonded to the two side surfaces of the display screen body via bonding adhesive layers, wherein the on-screen film layer group and the under-screen film layer group respectively protrude relative to the display screen body in a direction parallel to the display screen body; removing at least the on-screen film layer group and the under-screen film layer group in a target area of ​​the initial display module to obtain a display module, wherein the cut surface of the display module is a flush plane, and the target area is the edge area of ​​the other side surfaces of the initial display module except the side surface where the bonding area is located; thereby reducing the risk of cracks in the display screen body and improving the display effect of the display module.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a manufacturing method thereof. Background Art

[0002] With the advent of the full-screen era, large-sized and easy-to-carry electronic devices are increasingly favored by users, and electronic devices with foldable display modules have also emerged. Electronic devices with foldable display modules can be unfolded when in use to provide a larger display area, and switched to a foldable shape when not in use, making it easier for users to carry. In related technologies, the display module is composed of a display screen and multiple film layers adhered to the surfaces of both sides of the display screen. The multiple film layers are, for example, a cover layer, an optical adhesive layer, a backplane film, etc. At present, during the use of the display module, the display screen is very prone to cracks, resulting in a decrease in display effect. Summary of the Invention

[0003] Based on this, it is necessary to provide a display module and a manufacturing method thereof that can reduce the risk of cracks in the display screen in order to address the above technical problems.

[0004] In a first aspect, the present application provides a method for manufacturing a display module, the method comprising:

[0005] An initial display module is provided, wherein the initial display module includes a display screen body and an on-screen film layer group and a under-screen film layer group respectively attached to two side surfaces of the display screen body via adhesive layers, wherein the on-screen film layer group and the under-screen film layer group respectively protrude relative to the display screen body in a direction parallel to the display screen body;

[0006] At least the on-screen film layer group and the under-screen film layer group of the target area of ​​the initial display module are cut away to obtain a display module, wherein the cutting surface of the display module is a flush plane, and the target area is the edge area of ​​other sides of the initial display module except the side where the bonding area is located.

[0007] In one embodiment, the initial display module includes a folding area and a non-folding area adjacent to the folding area, and the under-screen film layer group is located on the backlight surface of the display screen; wherein, cutting off the under-screen film layer group of the target area of ​​the initial display module includes:

[0008] Cutting the under-screen film layer group located in the non-folding area of ​​the target area based on a first laser cutting parameter set;

[0009] The under-screen film layer group located in the folding area of ​​the target area is cut off based on the second laser cutting parameter set, wherein the numerical values ​​of the parameters in the first laser cutting parameter set are at least partially different from the numerical values ​​of the parameters in the second laser cutting parameter set.

[0010] In one embodiment, the under-screen film layer group located in the non-folding area includes a supporting substrate layer, the under-screen film layer group located in the folding area includes a titanium alloy layer, the first laser cutting parameter set and the second laser cutting parameter set both include at least cutting power, and the value of the cutting power in the first laser cutting parameter set is less than the value of the cutting power in the second laser cutting parameter set.

[0011] In one embodiment, the step of removing at least the on-screen film layer group and the under-screen film layer group in the target area of ​​the initial display module includes:

[0012] The on-screen film layer group in the target area is cut off based on the third laser cutting parameter set, and the under-screen film layer group in the target area is cut off based on the fourth laser cutting parameter set, wherein the numerical values ​​of the parameters in the third laser cutting parameter set are at least partially different from the numerical values ​​of the parameters in the fourth laser cutting parameter set.

[0013] In one embodiment, the removing of the on-screen film layer group in the target area based on the third laser cutting parameter set, and the removing of the under-screen film layer group in the target area based on the fourth laser cutting parameter set, include:

[0014] Along the direction from the on-screen film layer group to the display screen, the on-screen film layer group and the under-screen film layer group of the target area are respectively removed by a laser cutting process;

[0015] Alternatively, the under-screen film layer group and the on-screen film layer group of the target area are respectively removed by a laser cutting process along the direction in which the under-screen film layer group points to the display screen;

[0016] Alternatively, the on-screen film layer group of the target area is removed along the direction in which the on-screen film layer group points to the display screen, and the under-screen film layer group of the target area is removed along the direction in which the under-screen film layer group points to the display screen.

[0017] In one embodiment, the removing of the on-screen film layer group in the target area based on the third laser cutting parameter set, and the removing of the under-screen film layer group in the target area based on the fourth laser cutting parameter set, include:

[0018] Using a laser cutting process to remove the on-screen film layer group in the target area, adjusting characteristic parameters of a laser light source in the laser cutting process to calibrate the laser light source, and using the calibrated laser light source to remove the under-screen film layer group in the target area;

[0019] Alternatively, a laser cutting process is used to remove the under-screen film layer group in the target area, characteristic parameters of the laser light source in the laser cutting process are adjusted to calibrate the laser light source, and the calibrated laser light source is used to remove the on-screen film layer group in the target area.

[0020] In one embodiment, the step of removing at least the on-screen film layer group and the under-screen film layer group in the target area of ​​the initial display module includes:

[0021] The on-screen film layer group and the display screen body in the target area are cut off based on the fifth laser cutting parameter set, and the under-screen film layer group in the target area is cut off based on the sixth laser cutting parameter set, wherein the numerical values ​​of the parameters in the fifth laser cutting parameter set are at least partially different from the numerical values ​​of the parameters in the sixth laser cutting parameter set.

[0022] In one embodiment, in the initial display module, the on-screen film layer assembly is adhered to the light-emitting surface of the display screen body via a first adhesive layer, and the first adhesive layer is concave relative to the display screen body in a direction parallel to the display screen body;

[0023] The method further comprises:

[0024] When the on-screen film layer group in the target area is removed, the first bonding adhesive layer and the display screen body in the target area are also removed integrally.

[0025] In one embodiment, in the initial display module, the under-screen film layer assembly is adhered to the backlight surface of the display screen body via a second adhesive layer, and the second adhesive layer protrudes relative to the display screen body in a direction parallel to the display screen body;

[0026] The method further comprises:

[0027] While the under-screen film layer group in the target area is cut off, the second bonding adhesive layer in the target area is also cut off as a whole.

[0028] In a second aspect, the present application further provides a display module, which is manufactured using the manufacturing method of the display module provided in the first aspect above.

[0029] In the above-mentioned display module and its manufacturing method, the on-screen film layer group and the under-screen film layer group attached to the two side surfaces of the display screen of the initial display module protrude relative to the display screen in the direction parallel to the display screen. The embodiment of the present application produces a display module by at least cutting off the on-screen film layer group and the under-screen film layer group in the target area of ​​the initial display module, so that the on-screen film layer group and the under-screen film layer group on the two side surfaces of the display screen of the produced display module no longer protrude relative to the display screen, but are flush with the display screen. In this way, when foreign objects squeeze the display module from the side of the display module, the on-screen film layer group and the under-screen film layer group on the two side surfaces of the display screen can divide the pressure and absorb the squeezing force on the display screen, so that the squeezing force borne by the display screen is very small, so that it will not cause cracks in the display screen, thereby reducing the risk of cracks in the display screen and further improving the display effect of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following briefly introduces the drawings required for use in the embodiments of the present application or related technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying any creative work.

[0031] Figure 1 is a flow chart of a method for manufacturing a display module in one embodiment;

[0032] Figure 2A is a schematic top view of an initial display module in one embodiment;

[0033] Figure 2B for Figure 2A Section along line CC';

[0034] Figure 3A is a schematic top view of a display module in one embodiment;

[0035] Figure 3B for Figure 3A Section along line CC';

[0036] Figure 4 It is a schematic diagram of the process of S104;

[0037] Figures 5A to 5B A structural diagram of the process of cutting the initial display module along the direction of the on-screen film layer group pointing to the display screen;

[0038] Figures 6A to 6B A structural diagram of the process of cutting the initial display module along the direction of the under-screen film layer group pointing to the display screen;

[0039] 7A to 7B A diagram of the structures involved in the anisotropic cutting process of the initial display module. DETAILED DESCRIPTION

[0040] To facilitate understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The accompanying drawings provide embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to make the disclosure of the present application more thorough and comprehensive.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0042] It will be understood that the terms "first," "second," etc., used herein may be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish a first element from another element. For example, a first resistor may be referred to as a second resistor, and similarly, a second resistor may be referred to as a first resistor without departing from the scope of this application. The first resistor and the second resistor are both resistors, but they are not the same resistor.

[0043] It can be understood that the “connection” in the following embodiments should be understood as “electrical connection”, “communication connection”, etc. if there is transmission of electrical signals or data between the connected circuits, modules, units, etc.

[0044] It is understood that “at least one” refers to one or more, “a plurality” refers to two or more, and “at least a portion of an element” refers to a portion or all of an element.

[0045] As used herein, the singular forms "a," "an," and "the" may also include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include," "comprising," "having," and the like specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof. Furthermore, the term "and / or" as used in this specification includes any and all combinations of the relevant listed items.

[0046] As mentioned in the background technology, in the related art, the display screen in the display module is very prone to cracks. After research, the inventors found that the reason is that the multiple film layers adhered to the surfaces of both sides of the display screen have a large fitting tolerance relative to the display screen. As a result, when a foreign object squeezes the display module from the side, basically all the squeezing force is borne by the display screen, causing the display screen to crack due to squeezing.

[0047] In view of this, embodiments of the present application provide a display module and a manufacturing method thereof to reduce the risk of cracks on a display screen.

[0048] In an exemplary embodiment, referring to Figure 1 , provides a method for manufacturing a display module, the method comprising the following S102~S104.

[0049] S102, providing an initial display module, wherein the initial display module includes a display screen body and an on-screen film layer group and a under-screen film layer group respectively adhered to the two side surfaces of the display screen body through bonding adhesive layers, and in a direction parallel to the display screen body, the on-screen film layer group and the under-screen film layer group respectively protrude relative to the display screen body.

[0050] Combine Figure 2A and Figure 2B The initial display module includes a display 200, and an on-screen film assembly 210 and an under-screen film assembly 220 attached to both sides of the display 200. Due to large lamination tolerances, the on-screen film assembly 210 and the under-screen film assembly 220 protrude relative to the display 200 in a direction parallel to the display 200. The display 200 may be, but is not limited to, an organic light emitting diode (OLED) display 200. The display 200 may include a display panel (PANEL) and a polarizer (POL) located on the light-emitting surface of the display panel. The on-screen film assembly 210 may be located on the light-emitting surface of the display 200 (the light-emitting surface is located on the image display side). The on-screen film assembly 210 may include, for example, a cover layer, which may be made of at least one of transparent polyimide (CPI) and ultra-thin glass (UTG). The under-screen film layer group 220 may be located on the backlight side of the display screen 200 (the backlight side faces away from the screen display side). The under-screen film layer group 220 may include, for example, a backplane film BP and / or a support layer.

[0051] S104, at least the on-screen film layer group and the under-screen film layer group of the target area of ​​the initial display module are removed to obtain a display module, wherein the cut surface of the display module is a flush plane, and the target area is the edge area of ​​the other side surfaces of the initial display module except the side surface where the bonding area is located.

[0052] Continue to refer Figure 2AThe bonding area of ​​the initial display module is used to bond with circuit boards such as chip-on-film (COF) and flexible circuit boards (FPC) to drive the display screen 200. The initial display module has an upper edge, a lower edge, a left edge, and a right edge. Usually, the bonding area is located at the lower edge, so the target area OB includes the upper edge, the left edge, and the right edge.

[0053] There are many methods for removing the initial display module, such as using a laser process for removal, which is not specifically limited in this embodiment.

[0054] Combine Figure 3A and Figure 3B , and compare Figure 3A and Figure 2A ,contrast Figure 3B and Figure 2B , at least the on-screen film layer group 210 and the under-screen film layer group 220 of the initial display module target area OB (i.e., the upper edge, left edge, and right edge) are removed to produce a display module, so that the on-screen film layer group 210 and the under-screen film layer group 220 on both sides of the display screen body 200 of the produced display module are no longer protruding relative to the display screen body 200, but are flush with the display screen body 200. In this way, when a foreign object squeezes the display module from the side of the display module, the on-screen film layer group 210 and the under-screen film layer group 220 on both sides of the display screen body 200 can divide and absorb the squeezing force on the display screen body 200, so that the squeezing force borne by the display screen body 200 is very small, thereby not causing cracks in the display screen body 200, thereby reducing the risk of cracks in the display screen body 200, and further improving the display effect of the display module.

[0055] In an exemplary embodiment, the initial display module includes a folding area FO and a non-folding area NFO adjacent to the folding area FO, and the under-screen film layer group 220 is located on the backlight surface of the display screen body 200; wherein, the under-screen film layer group for cutting off the target area of ​​the initial display film group in S104 includes the following S402~S404.

[0056] S402: Cutting off the under-screen film layer group in the non-folding area of ​​the target region based on the first laser cutting parameter set.

[0057] refer to Figure 3A or Figure 2A, the initial display module can be folded along the folding area FO. For the initial display module with a folding function, in order to ensure that the initial display module can be well folded along the folding area FO under the support of the under-screen film layer group 220, usually the material and / or structure of the under-screen film layer group 220 of the folding area FO is not exactly the same as the material and / or structure of the under-screen film layer group 220 of the folding area FO and the non-folding area NFO of the target area OB. In order to ensure the reliable and good removal of the under-screen film layer group 220 of the folding area FO of the target area OB and the under-screen film layer group 220 of the folding area FO and the non-folding area NFO of the target area OB, and to avoid cutting problems such as cutting cracks, cutting deterioration, cutting damage, cutting burrs, and inability to cut, this embodiment uses different laser cutting parameter sets to remove the under-screen film layer group 220 of the folding area FO and the non-folding area NFO of the target area OB and the under-screen film layer group 220 of the folding area FO of the target area OB.

[0058] The first laser cutting parameter set may include multiple parameters, including but not limited to cutting speed, cutting heat impact, cutting power and / or cutting energy, etc.; wherein each parameter includes a unit size and a numerical size.

[0059] S404, based on the second laser cutting parameter set, the under-screen film layer group located in the folding area of ​​the target area is cut off, wherein the numerical value of each parameter in the first laser cutting parameter set is at least partially different from the numerical value of each parameter in the second laser cutting parameter set.

[0060] The second laser cutting parameter set may include multiple parameters, including but not limited to cutting speed, cutting heat impact, cutting power and / or cutting energy, etc.; wherein each parameter includes a unit size and a numerical size.

[0061] In this embodiment, by controlling the numerical values ​​of the various parameters in the laser cutting parameter set, the reliable and good removal of the under-screen film layer group 220 in the folding area FO of the target area OB and the under-screen film layer group 220 in the folding area FO and non-folding area NFO of the target area OB is ensured, thereby avoiding cutting problems such as cutting cracks, cutting deterioration, cutting damage, cutting burrs, and inability to cut. In addition, considering that the area of ​​the folding area FO and non-folding area NFO is larger than the area of ​​the folding area FO, and the folding area FO and non-folding area NFO are located outside the folding area FO, the under-screen film layer group 220 in the folding area FO and non-folding area NFO of the target area OB can be removed first based on the first laser cutting parameter set, and then the under-screen film layer group 220 in the folding area FO of the target area OB can be removed based on the second laser cutting parameter set, so as to ensure that the removal of the folding area FO and non-folding area NFO of the target area OB and the removal of the folding area FO of the target area OB affect each other. Of course, the cutting order of the under-screen film layer group 220 of the folding area FO and the non-folding area NFO of the target area OB and the under-screen film layer group 220 of the folding area FO of the target area OB can also be adjusted according to actual conditions, actual needs, the area sizes of the folding area FO, the non-folding area NFO and the folding area FO, and the relative position relationship between the folding area FO, the non-folding area NFO and the folding area FO.

[0062] In an exemplary embodiment, the under-screen film layer group 220 located in the folding area FO and the non-folding area NFO includes a supporting substrate layer, and the under-screen film layer group 220 located in the folding area FO includes a titanium alloy layer. The first laser cutting parameter set and the second laser cutting parameter set both include at least cutting power, and the value of the cutting power in the first laser cutting parameter set is less than the value of the cutting power in the second laser cutting parameter set.

[0063] In this embodiment, the titanium alloy layer in the folding area FO can have a mesh structure to facilitate folding of the display module. The supporting substrate layer, for example, the backplane film BP, is relatively rigid and high-density. Using high cutting power to remove the titanium alloy layer in the folding area FO of the target area OB facilitates fracture of the titanium alloy layer. Using low cutting power to remove the backplane film BP in the folding area FO and non-folding area NFO of the target area OB helps reduce the risk of film cracking during the removal process.

[0064] In an exemplary embodiment, the material and / or structure of the on-screen film layer group 210 of the folding area FO is exactly the same as the material and / or structure of the on-screen film layer group 210 of the folding area FO and the non-folding area NFO, and the same set of laser cutting parameters can be used to cut the on-screen film layer group 210 of the folding area FO and the non-folding area NFO of the target area OB and the on-screen film layer group 210 of the folding area FO of the target area OB.

[0065] In an exemplary embodiment, S104 includes: cutting off the on-screen film layer group in the target area based on a third laser cutting parameter set, and cutting off the under-screen film layer group in the target area based on a fourth laser cutting parameter set, wherein the numerical value of each parameter in the third laser cutting parameter set is at least partially different from the numerical value of each parameter in the fourth laser cutting parameter set.

[0066] In this embodiment, the third laser cutting parameter set may include multiple parameters, including but not limited to cutting speed, cutting heat impact, cutting power, and / or cutting energy, wherein each parameter includes a unit size and a numerical value. The fourth laser cutting parameter set may include multiple parameters, including but not limited to cutting speed, cutting heat impact, cutting power, and / or cutting energy, wherein each parameter includes a unit size and a numerical value. Typically, the material and / or structure of the on-screen film layer group 210 of the display screen 200 is not exactly the same as the material and / or structure of the under-screen film layer group 220. To ensure reliable and good removal of the on-screen film layer group 210 and the under-screen film layer group 220 in the target area OB, and to avoid cutting problems such as cutting cracks, cutting deterioration, cutting damage, cutting burrs, and inability to cut, this embodiment uses different laser cutting parameter sets to remove the on-screen film layer group 210 and the under-screen film layer group 220 in the target area OB.

[0067] In an exemplary embodiment, the on-screen film layer group of the target area is cut off based on the third laser cutting parameter set, and the under-screen film layer group of the target area is cut off based on the fourth laser cutting parameter set, including: along the direction of the on-screen film layer group pointing to the display screen, using a laser cutting process to respectively cut off the on-screen film layer group and the under-screen film layer group of the target area.

[0068] In this embodiment, combined Figures 5A to 5B , along the direction of the on-screen film layer group 210 pointing to the display screen 200, the on-screen film layer group 210 of the target area OB is cut off based on the third laser cutting parameter set, and then the on-screen film layer group 210 continues to point to the display screen 200, and the under-screen film layer group 220 of the target area OB is cut off based on the fourth laser cutting parameter set. This same-direction cutting method is simple and low-cost, and usually the thickness of the on-screen film layer group 210 is greater than the thickness of the under-screen film layer group 220. Cutting off the on-screen film layer group 210 first is beneficial to avoid problems such as cutting misalignment and deviation when cutting off the under-screen film layer group 220.

[0069] In an exemplary embodiment, the on-screen film layer group of the target area is cut off based on the third laser cutting parameter set, and the under-screen film layer group of the target area is cut off based on the fourth laser cutting parameter set, including: along the direction of the under-screen film layer group pointing to the display screen, the under-screen film layer group and the on-screen film layer group of the target area are cut off respectively by using a laser cutting process.

[0070] In this embodiment, combined Figures 6A to 6B , along the direction of the under-screen film layer group 220 pointing to the display screen 200, the under-screen film layer group 220 of the target area OB is removed based on the fourth laser cutting parameter set, and then the under-screen film layer group 220 continues to point to the display screen 200, and the on-screen film layer group 210 of the target area OB is removed based on the third laser cutting parameter set. This same-direction cutting method is simple and low-cost, and usually the material density of the under-screen film layer group 220 is greater than the material density of the on-screen film layer group 210. Cutting off the under-screen film layer group 220 first is beneficial to avoid problems such as cutting dislocation, deviation, cutting damage, and cutting burrs when cutting off the on-screen film layer group 210.

[0071] In an exemplary embodiment, the on-screen film layer group of the target area is cut off based on the third laser cutting parameter set, and the under-screen film layer group of the target area is cut off based on the fourth laser cutting parameter set, including: using a laser cutting process to cut off the on-screen film layer group of the target area along the direction of the on-screen film layer group pointing to the display screen, and using a laser cutting process to cut off the under-screen film layer group of the target area along the direction of the under-screen film layer group pointing to the display screen.

[0072] In this embodiment, combined 7A to 7B , along the direction of the on-screen film layer group 210 pointing to the display screen 200, the on-screen film layer group 210 of the target area OB is cut off based on the third laser cutting parameter set, and then the initial display module is reversed to point along the direction of the under-screen film layer group 220 pointing to the display screen 200, and the on-screen film layer group 210 of the target area OB is cut off based on the fourth laser cutting parameter set. This anisotropic cutting method is more conducive to avoiding problems such as cutting misalignment, deviation, cutting damage, and cutting burrs when cutting the on-screen film layer group 210 or the under-screen film layer group 220.

[0073] In an exemplary embodiment, the on-screen film layer group of the target area is cut off based on the third laser cutting parameter set, and the under-screen film layer group of the target area is cut off based on the fourth laser cutting parameter set, including: using a laser cutting process to cut off the on-screen film layer group of the target area, adjusting the characteristic parameters of the laser light source in the laser cutting process to calibrate the laser light source, and using the calibrated laser light source to cut off the under-screen film layer group of the target area.

[0074] In this embodiment, after the on-screen film layer group 210 of the target area OB is cut off based on the third laser cutting parameter set, the characteristic parameters of the laser light source in the laser cutting process are adjusted to calibrate the laser light source, and then the calibrated laser light source is used and the under-screen film layer group 220 of the target area OB is cut off based on the fourth laser cutting parameter set to further avoid problems such as cutting misalignment, deviation, cutting damage, cutting burrs, inability to cut, and cutting cracks when cutting off the on-screen film layer group 210 or the under-screen film layer group 220.

[0075] In an exemplary embodiment, the on-screen film layer group of the target area is cut off based on the third laser cutting parameter set, and the under-screen film layer group of the target area is cut off based on the fourth laser cutting parameter set, including: using a laser cutting process to cut off the under-screen film layer group of the target area, adjusting the characteristic parameters of the laser light source in the laser cutting process to calibrate the laser light source, and using the calibrated laser light source to cut off the on-screen film layer group of the target area.

[0076] In this embodiment, after the under-screen film layer group 220 of the target area OB is cut off based on the fourth laser cutting parameter set, the characteristic parameters of the laser light source in the laser cutting process are also adjusted to calibrate the laser light source. Then, the calibrated laser light source is used and the on-screen film layer group 210 of the target area OB is cut off based on the third laser cutting parameter set to further avoid problems such as cutting misalignment, deviation, cutting damage, cutting burrs, inability to cut, and cutting cracks when cutting off the on-screen film layer group 210 or the under-screen film layer group 220.

[0077] In an exemplary embodiment, S104 includes: cutting off the on-screen film layer group and the display screen body in the target area based on the fifth laser cutting parameter set, and cutting off the under-screen film layer group in the target area based on the sixth laser cutting parameter set, wherein the numerical value of each parameter in the fifth laser cutting parameter set is at least partially different from the numerical value of each parameter in the sixth laser cutting parameter set.

[0078] In this embodiment, taking into account some actual situations, the initial display module may still have the on-screen film layer group 210 that is concave relative to the display body 200 in a direction parallel to the display body 200, or the user requires the display module to have a narrower frame, in this case, the on-screen film layer group 210 and the display body 200 of the target area OB can be cut off based on the fifth laser cutting parameter set, and the under-screen film layer group 220 of the target area OB can be cut off based on the sixth laser cutting parameter set; or, the initial display module may still have the under-screen film layer group 220 that is concave relative to the display body 200 in a direction parallel to the display body 200, or the user requires the display module to have a narrower frame, in this case, the on-screen film layer group 210 of the target area OB can be cut off based on the fifth laser cutting parameter set, and the under-screen film layer group 220 and the display body 200 of the target area OB can be cut off based on the sixth laser cutting parameter set.

[0079] In an exemplary embodiment, in the initial display module, the on-screen film layer group 210 is adhered to the light-emitting surface of the display screen body 200 through a first bonding adhesive layer, and in a direction parallel to the display screen body 200, the first bonding adhesive layer is concave relative to the display screen body 200; the method also includes: while cutting off the on-screen film layer group in the target area, the first bonding adhesive layer and the display screen body in the target area are also cut off as a whole.

[0080] In this embodiment, the on-screen film assembly 210 is bonded to the light-emitting surface of the display screen 200 via a first bonding adhesive layer. In a direction parallel to the display screen 200, regardless of whether the first bonding adhesive layer is convex or concave relative to the on-screen film assembly 210 or concave relative to the display screen 200, when the first bonding adhesive layer needs to be removed, it can be removed simultaneously with the on-screen film assembly 210, simultaneously with the on-screen film assembly 210 and the display screen 200, or separately after the on-screen film assembly 210 is removed. Furthermore, the first bonding adhesive layer can be flush with the display screen 200 or concave relative to the display screen 200, depending on user needs.

[0081] In an exemplary embodiment, in the initial display module, the under-screen film layer group 220 is adhered to the backlight surface of the display screen body 200 through the second bonding adhesive layer, and the second bonding adhesive layer protrudes relative to the display screen body 200 in a direction parallel to the display screen body 200; the method also includes: while cutting off the under-screen film layer group in the target area, the second bonding adhesive layer in the target area is also cut off as a whole.

[0082] In this embodiment, the under-screen film layer assembly 220 can be bonded to the backlight surface of the display screen 200 via a second bonding adhesive layer. In a direction parallel to the display screen 200, regardless of whether the second bonding adhesive layer is convex or concave relative to the under-screen film layer assembly 220, or convex or concave relative to the display screen 200, when the second bonding adhesive layer needs to be removed, the second bonding adhesive layer can be removed simultaneously with the under-screen film layer assembly 220, or simultaneously with the under-screen film layer assembly 220 and the display screen 200, or separately after the under-screen film layer assembly 220 is removed. Furthermore, the second bonding adhesive layer can be flush with the display screen 200 or concave relative to the display screen 200, and can be removed accordingly based on user needs.

[0083] It should be understood that, although the various steps in the flowcharts involved in the various embodiments described above are displayed in sequence according to the instructions of the arrows, these steps are not necessarily executed in sequence in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and these steps can be executed in other orders. Moreover, at least a portion of the steps in the flowcharts involved in the various embodiments described above can include multiple steps or multiple stages, and these steps or stages are not necessarily executed and completed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a portion of steps or stages in other steps.

[0084] In an exemplary embodiment, reference may be made to Figure 3B , provides a display module, which is manufactured by the manufacturing method of the display module provided by any of the above embodiments.

[0085] The display module and the method for manufacturing the display module provided in the embodiments of the present application both belong to the same inventive concept, can solve the same technical problems, and thus achieve the same technical effects, and the repeated contents will not be repeated here.

[0086] The technical features of the above embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0087] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present application shall be determined by the appended claims.

Claims

1. A method for manufacturing a display module, characterized in that: The method comprises: An initial display module is provided, wherein the initial display module includes a display screen body and an on-screen film layer group and a under-screen film layer group respectively attached to two side surfaces of the display screen body via adhesive layers, wherein the on-screen film layer group and the under-screen film layer group respectively protrude relative to the display screen body in a direction parallel to the display screen body; At least the on-screen film layer group and the under-screen film layer group of the target area of ​​the initial display module are cut away to obtain a display module, wherein the cutting surface of the display module is a flush plane, and the target area is the edge area of ​​other sides of the initial display module except the side where the bonding area is located.

2. The method according to claim 1, characterized in that The initial display module includes a folding area and a non-folding area adjacent to the folding area, and the under-screen film layer group is located on the backlight surface of the display screen. The under-screen film layer group of the target area of ​​the initial display module is cut off, including: Cutting the under-screen film layer group located in the non-folding area of ​​the target area based on a first laser cutting parameter set; The under-screen film layer group located in the folding area of ​​the target area is cut off based on the second laser cutting parameter set, wherein the numerical values ​​of the parameters in the first laser cutting parameter set are at least partially different from the numerical values ​​of the parameters in the second laser cutting parameter set.

3. The method according to claim 2, characterized in that The under-screen film layer group located in the non-folding area includes a supporting substrate layer, and the under-screen film layer group located in the folding area includes a titanium alloy layer. The first laser cutting parameter set and the second laser cutting parameter set both include at least cutting power, and the value of the cutting power in the first laser cutting parameter set is less than the value of the cutting power in the second laser cutting parameter set.

4. The method according to claim 1, wherein The step of removing at least the on-screen film layer group and the under-screen film layer group from the target area of ​​the initial display module includes: The on-screen film layer group in the target area is cut off based on the third laser cutting parameter set, and the under-screen film layer group in the target area is cut off based on the fourth laser cutting parameter set, wherein the numerical values ​​of the parameters in the third laser cutting parameter set are at least partially different from the numerical values ​​of the parameters in the fourth laser cutting parameter set.

5. The method according to claim 4, characterized in that The step of removing the on-screen film layer group in the target area based on the third laser cutting parameter set and removing the under-screen film layer group in the target area based on the fourth laser cutting parameter set includes: Along the direction from the on-screen film layer group to the display screen, the on-screen film layer group and the under-screen film layer group of the target area are respectively removed by a laser cutting process; Alternatively, the under-screen film layer group and the on-screen film layer group of the target area are respectively removed by a laser cutting process along the direction in which the under-screen film layer group points to the display screen; Alternatively, the on-screen film layer group of the target area is removed along the direction in which the on-screen film layer group points to the display screen, and the under-screen film layer group of the target area is removed along the direction in which the under-screen film layer group points to the display screen.

6. The method according to claim 4, characterized in that The step of removing the on-screen film layer group in the target area based on the third laser cutting parameter set and removing the under-screen film layer group in the target area based on the fourth laser cutting parameter set includes: Using a laser cutting process to remove the on-screen film layer group in the target area, adjusting characteristic parameters of a laser light source in the laser cutting process to calibrate the laser light source, and using the calibrated laser light source to remove the under-screen film layer group in the target area; Alternatively, a laser cutting process is used to remove the under-screen film layer group in the target area, characteristic parameters of the laser light source in the laser cutting process are adjusted to calibrate the laser light source, and the calibrated laser light source is used to remove the on-screen film layer group in the target area.

7. The method according to claim 1, characterized in that The step of removing at least the on-screen film layer group and the under-screen film layer group from the target area of ​​the initial display module includes: The on-screen film layer group and the display screen body in the target area are cut off based on the fifth laser cutting parameter set, and the under-screen film layer group in the target area is cut off based on the sixth laser cutting parameter set, wherein the numerical values ​​of the parameters in the fifth laser cutting parameter set are at least partially different from the numerical values ​​of the parameters in the sixth laser cutting parameter set.

8. The method according to claim 1, characterized in that In the initial display module, the on-screen film layer group is attached to the light-emitting surface of the display screen body via a first bonding adhesive layer, and the first bonding adhesive layer is concave relative to the display screen body in a direction parallel to the display screen body; The method further comprises: When the on-screen film layer group in the target area is removed, the first bonding adhesive layer and the display screen body in the target area are also removed integrally.

9. The method according to claim 1, characterized in that In the initial display module, the under-screen film layer group is adhered to the backlight surface of the display screen body via a second adhesive layer, and the second adhesive layer protrudes relative to the display screen body in a direction parallel to the display screen body; The method further comprises: While the under-screen film layer group in the target area is cut off, the second bonding adhesive layer in the target area is also cut off as a whole.

10. A display module, characterized in that: The display module is manufactured by the manufacturing method of any one of claims 1 to 8.

Images