Convection and water cooling linked heat dissipation method and system for IGBT devices

Abstract

The present invention provides a convection and water-cooling linked heat dissipation method and system for an IGBT device, which detects and analyzes working heat-related data of the IGBT device, obtains its surface thermal radiation divergence characteristic information, and globally characterizes the surface heat divergence of the IGBT device, thereby identifying the surface heat dissipation abnormal area; based on the cooling water state data of the water-cooling heat dissipation device, estimates the heat absorption characteristics of the water-cooling heat dissipation device for the surface heat dissipation abnormal area, thereby adjusting the working state of the water-cooling heat dissipation device, improving the water-cooling heat dissipation intensity of the surface heat dissipation abnormal area, maximizing the heat absorption efficiency of the cooling water, and avoiding the rapid accumulation of heat in the surface heat dissipation abnormal area; also updates the detection working heat-related data, determines the change trend information of the surface heat dissipation abnormal area, thereby adjusting the airflow output state of the air-cooling heat dissipation device, and realizing the water-cooling and air-cooling convection linked control of the IGBT device, effectively avoiding local overheating of the IGBT surface and improving the heat exchange efficiency and sustainability between the IGBT and the outside world.

Description

Technical Field

[0001] The present invention relates to the field of high-power electronic devices, and in particular to a convection and water-cooling linked heat dissipation method and system for IGBT devices. Background Art

[0002] As a key component of power electronic devices, insulated gate bipolar transistors (IGBTs) are widely used in high-power scenarios. IGBTs generate a lot of heat during operation. Once the operating temperature of the IGBT is too high, it will cause the IGBT to malfunction and stop, and even cause irreversible overheating damage to the IGBT and its adjacent electronic devices, affecting the working stability and continuity of the electronic equipment where the IGBT is located. In order to dissipate the heat of the IGBT in a timely and effective manner, the IGBT is equipped with water-cooling and air-cooling devices to quickly dissipate the working heat generated by the IGBT. However, the water-cooling and air-cooling devices operate independently of each other. The two cannot perform targeted enhanced linkage heat dissipation treatment on the local surface area of ​​the IGBT according to the actual surface heat dissipation of the IGBT itself, and cannot effectively reduce the probability of local overheating of the IGBT surface and the continuity and stability of the heat exchange between the IGBT and the outside world. Summary of the invention

[0003] The purpose of the present invention is to provide a convection and water-cooling linkage heat dissipation method and system for IGBT devices, which detects and analyzes the working heat-related data of the IGBT device, obtains the characteristic information of its surface thermal radiation dissipation, and globally characterizes the surface heat dissipation of the IGBT device, thereby identifying the abnormal surface heat dissipation area, and defining the range for the subsequent improvement of the active heat dissipation state for the local surface area of ​​the IGBT device; based on the cooling water state data of the water-cooling heat dissipation device, the heat absorption characteristics of the water-cooling heat dissipation device for the abnormal surface heat dissipation area are estimated, thereby adjusting the working state of the water-cooling heat dissipation device, improving the water-cooling heat dissipation intensity of the abnormal surface heat dissipation area, maximizing the heat absorption efficiency of the cooling water, and avoiding the rapid accumulation of heat in the abnormal surface heat dissipation area; it also updates the detection of working heat-related data, determines the change trend information of the abnormal surface heat dissipation area, and adjusts the airflow output state of the air-cooling heat dissipation device, realizes the water-cooling and air-cooling convection linkage control of the IGBT device, effectively avoids local overheating of the IGBT surface and improves the heat exchange efficiency and sustainability between the IGBT and the outside world.

[0004] The present invention is achieved through the following technical solutions:

[0005] The convection and water cooling combined heat dissipation method for IGBT devices includes:

[0006] Detecting the IGBT device to obtain working heat related data of the IGBT device; analyzing the working heat related data to obtain surface heat radiation divergence characteristic information of the IGBT device, thereby identifying the surface heat dissipation abnormality area of ​​the IGBT device;

[0007] The water-cooling heat dissipation device inside the IGBT device is monitored to obtain cooling water status data of the water-cooling heat dissipation device; based on the cooling water status data, characteristic information of heat absorption from the abnormal surface heat dissipation area by the water-cooling heat dissipation device is estimated, so as to adjust the working state of the water-cooling heat dissipation device;

[0008] The working heat related data is updated and detected to determine the change trend information of the surface heat dissipation abnormal area during the working state adjustment of the water-cooled heat dissipation device; based on the change trend information, the airflow output state of the air-cooled heat dissipation device corresponding to the IGBT device is adjusted.

[0009] Optionally, detecting an IGBT device to obtain working heat related data of the IGBT device; analyzing the working heat related data to obtain surface thermal radiation divergence characteristic information of the IGBT device, thereby identifying an abnormal surface heat dissipation area of ​​the IGBT device, including:

[0010] Performing surface operating temperature detection and thermal infrared dynamic imaging on the IGBT device to obtain surface operating temperature data and thermal infrared dynamic images of the IGBT device; wherein the surface operating temperature data includes dynamic temperature data of several position points on the surface of the IGBT device and their vicinity;

[0011] Analyze the thermal infrared dynamic image to obtain the thermal radiation field distribution state information of the spatial area where the IGBT device is located; based on the surface operating temperature data, identify the thermal radiation propagation state of the thermal radiation field distribution state information to obtain the surface thermal radiation divergence direction information and surface thermal radiation divergence rate information of the IGBT device, which are used as the surface thermal radiation divergence characteristic information;

[0012] Based on the surface heat radiation dissipation direction information and the surface heat radiation dissipation rate information, the heat dissipation efficiency values ​​of different areas on the surface of the IGBT device are obtained; and the heat dissipation efficiency values ​​are compared by threshold values ​​to identify and locate the abnormal surface heat dissipation area of ​​the IGBT device.

[0013] Optionally, monitoring a water-cooling heat dissipation device inside the IGBT device to obtain cooling water status data of the water-cooling heat dissipation device; estimating heat absorption characteristic information of the water-cooling heat dissipation device from the abnormal surface heat dissipation area based on the cooling water status data, thereby adjusting the working state of the water-cooling heat dissipation device, including:

[0014] Performing global cooling water temperature and flow rate monitoring of the water cooling pipeline of the water cooling heat dissipation device inside the IGBT device, obtaining temperature distribution data and flow rate distribution data of the cooling water of the water cooling heat dissipation device along the extension path of the water cooling pipeline, and using them as the cooling water state data;

[0015] Based on the temperature distribution data and the flow velocity distribution data, a heat exchange characterization model between the water cooling pipeline and the outside world is generated; based on the position information of the surface heat dissipation abnormality area, the heat exchange characterization model is estimated in the corresponding area range to obtain the heat absorption rate of the water cooling device from the surface heat dissipation abnormality area;

[0016] Based on the heat absorption rate, determine whether the pipe section of the water cooling pipe corresponding to the abnormal surface heat dissipation area has reached the heat absorption saturation state; if not, reduce the cooling water flow rate inside the pipe section; if so, keep the current cooling water flow rate inside the pipe section unchanged

[0017] Optionally, adjusting the working state of the water cooling device includes:

[0018] Step S1, establishing a plane rectangular coordinate system on the surface of the IGBT device, with the Y axis to the left of the bottom edge of the surface of the IGBT device and the X axis to the top of the left edge. There are four ways for the cooling water to enter the surface of the IGBT device for water cooling, namely, entering from the lower right, upper right, lower left, and upper left of the surface of the IGBT device. The following formula (1) is used to control the entry state of the cooling water according to the distribution point situation of the abnormal heat dissipation area on the surface of the IGBT device.

[0019] (1)

[0021] In the above formula (1), A control array representing the entry status of the cooling water; The first region indicating the abnormal heat dissipation area on the surface of the IGBT device Coordinate values ​​of distribution points; Indicates the maximum value of the abscissa among the points distributed on the surface of the IGBT device; Indicates the maximum value of the ordinate among the points distributed on the surface of the IGBT device; Indicates the total number of distribution points of the abnormal heat dissipation area on the surface of the IGBT device; Represents a judgment function. If the equation in the brackets is true, the function value of the judgment function is 1, otherwise the function value of the judgment function is 0;

[0022] like , it means that the cooling water enters from the lower right corner of the surface of the IGBT device;

[0023] like , it means that the cooling water enters from the upper right corner of the surface of the IGBT device;

[0024] like , it means that the cooling water enters from the lower left corner of the surface of the IGBT device;

[0025] like , it means that the cooling water enters from the upper left corner of the surface of the IGBT device;

[0026] Step S2, using the following formula (2), according to the distribution of the abnormal heat dissipation area on the surface of the IGBT device, the flow rate of the cooling water of the water-cooling device inside the IGBT device is controlled.

[0027] (2)

[0028] In the above formula (2), Indicates the flow rate control value of cooling water of the water-cooling heat dissipation device inside the IGBT device; Indicates the maximum flow rate value of the cooling water; Indicates the water inlet point coordinates of the cooling water (obtained in step S1); Indicates obtaining coordinate points With coordinate points The distance value between Indicates the distance between the lower right corner and the upper left corner of the surface of the IGBT device; Indicated in Get the maximum value in brackets under the condition of ;

[0029] Step S3, using the following formula (3), according to the cooling water temperature of the water cooling device inside the IGBT device and the flow rate of the cooling water of the water cooling device inside the IGBT device, determine the circulation path length during water cooling,

[0030] (3)

[0031] In the above formula (3), Indicates the length of the circulation path when water cooling is performed; Indicates the first The length of the cycle path; Indicates the total number of circulation paths when water cooling is performed; Indicates the cooling water temperature of the water-cooling heat dissipation device inside the IGBT device; Indicates the maximum water temperature for water cooling; It means to find the absolute value; Indicated in Under the conditions of When the minimum value is obtained value Indicates the first The length of the cycle path; Indicates the maximum length of all water cooling circulation paths.

[0032] Optionally, updating and detecting the working heat related data to determine the change trend information of the abnormal surface heat dissipation area during the working state adjustment of the water cooling heat dissipation device; and adjusting the airflow output state of the air cooling heat dissipation device corresponding to the IGBT device based on the change trend information, including:

[0033] Performing periodic update detection on the working heat related data to obtain a working heat related data queue; analyzing the working heat related data to obtain the area of ​​the surface heat dissipation abnormal area corresponding to all update detection time points during the working state adjustment process of the water cooling and heat dissipation device, thereby determining the area change trend information of the surface heat dissipation abnormal area;

[0034] Based on the regional area change trend information, the location points where heat is excessively concentrated on the surface of the IGBT device are determined; based on the distribution positions of the location points where heat is excessively concentrated on the surface of the IGBT device, the airflow jet output direction and / or output speed of the jet airflow cooling device corresponding to the IGBT device is adjusted.

[0035] Convection and water cooling system for IGBT devices, including:

[0036] A working heat detection module, used to detect the IGBT device and obtain working heat related data of the IGBT device;

[0037] A surface heat dissipation abnormal area identification module is used to analyze the working heat related data to obtain the surface heat radiation divergence characteristic information of the IGBT device, thereby identifying the surface heat dissipation abnormal area of ​​the IGBT device;

[0038] A cooling water status monitoring module is used to monitor the water cooling and heat dissipation equipment inside the IGBT device to obtain cooling water status data of the water cooling and heat dissipation equipment;

[0039] A water-cooling heat dissipation device adjustment module, used to estimate the heat absorption characteristic information of the water-cooling heat dissipation device from the surface heat dissipation abnormality area based on the cooling water state data, so as to adjust the working state of the water-cooling heat dissipation device;

[0040] A surface heat dissipation abnormal area change trend determination module, used to update and detect the working heat related data, and determine the change trend information of the surface heat dissipation abnormal area during the working state adjustment process of the water cooling and heat dissipation device;

[0041] The air-cooling heat dissipation device adjustment module is used to adjust the airflow output state of the air-cooling heat dissipation device corresponding to the IGBT device based on the change trend information.

[0042] Optionally, the working heat detection module is used to detect the IGBT device to obtain working heat related data of the IGBT device, including:

[0043] Performing surface operating temperature detection and thermal infrared dynamic imaging on the IGBT device to obtain surface operating temperature data and thermal infrared dynamic images of the IGBT device; wherein the surface operating temperature data includes dynamic temperature data of several position points on the surface of the IGBT device and their vicinity;

[0044] The surface heat dissipation abnormal area identification module is used to analyze the working heat related data to obtain the surface heat radiation divergence characteristic information of the IGBT device, thereby identifying the surface heat dissipation abnormal area of ​​the IGBT device, including:

[0045] Analyze the thermal infrared dynamic image to obtain the thermal radiation field distribution state information of the spatial area where the IGBT device is located; based on the surface operating temperature data, identify the thermal radiation propagation state of the thermal radiation field distribution state information to obtain the surface thermal radiation divergence direction information and surface thermal radiation divergence rate information of the IGBT device, which are used as the surface thermal radiation divergence characteristic information;

[0046] Based on the surface heat radiation dissipation direction information and the surface heat radiation dissipation rate information, the heat dissipation efficiency values ​​of different areas on the surface of the IGBT device are obtained; and the heat dissipation efficiency values ​​are compared by threshold values ​​to identify and locate the abnormal surface heat dissipation area of ​​the IGBT device.

[0047] Optionally, the cooling water status monitoring module is used to monitor the water cooling device inside the IGBT device to obtain cooling water status data of the water cooling device, including:

[0048] Performing global cooling water temperature and flow rate monitoring of the water cooling pipeline of the water cooling heat dissipation device inside the IGBT device, obtaining temperature distribution data and flow rate distribution data of the cooling water of the water cooling heat dissipation device along the extension path of the water cooling pipeline, and using them as the cooling water state data;

[0049] The water-cooling heat dissipation device adjustment module is used to estimate the heat absorption characteristic information of the water-cooling heat dissipation device from the surface heat dissipation abnormality area based on the cooling water state data, so as to adjust the working state of the water-cooling heat dissipation device, including:

[0050] Based on the temperature distribution data and the flow velocity distribution data, a heat exchange characterization model between the water cooling pipeline and the outside world is generated; based on the position information of the surface heat dissipation abnormality area, the heat exchange characterization model is estimated in the corresponding area range to obtain the heat absorption rate of the water cooling device from the surface heat dissipation abnormality area;

[0051] Based on the heat absorption rate, determine whether the pipeline section of the water-cooling pipeline corresponding to the surface heat dissipation abnormality area has reached the heat absorption saturation state; if not, reduce the cooling water flow rate inside the pipeline section; if so, keep the current cooling water flow rate inside the pipeline section unchanged.

[0052] Optionally, the surface heat dissipation abnormal area change trend determination module is used to update and detect the working heat related data to determine the change trend information of the surface heat dissipation abnormal area during the working state adjustment of the water cooling heat dissipation device, including:

[0053] Performing periodic update detection on the working heat related data to obtain a working heat related data queue; analyzing the working heat related data to obtain the area of ​​the surface heat dissipation abnormal area corresponding to all update detection time points during the working state adjustment process of the water cooling and heat dissipation device, thereby determining the area change trend information of the surface heat dissipation abnormal area;

[0054] The air-cooling and heat dissipation device adjustment module is used to adjust the airflow output state of the air-cooling and heat dissipation device corresponding to the IGBT device based on the change trend information, including:

[0055] Based on the regional area change trend information, the location points where heat is excessively concentrated on the surface of the IGBT device are determined; based on the distribution positions of the location points where heat is excessively concentrated on the surface of the IGBT device, the airflow jet output direction and / or output speed of the jet airflow cooling device corresponding to the IGBT device is adjusted.

[0056] Compared with the prior art, the present invention has the following beneficial effects:

[0057] The convection and water-cooling linkage heat dissipation method and system for IGBT devices provided in the present application detect and analyze the working heat-related data of the IGBT device, obtain the characteristic information of its surface thermal radiation dissipation, and globally characterize the surface heat dissipation of the IGBT device, so as to identify the abnormal surface heat dissipation area, and define the range for the subsequent improvement of the active heat dissipation state for the local surface area of ​​the IGBT device; based on the cooling water state data of the water-cooling heat dissipation device, estimate the heat absorption characteristics of the water-cooling heat dissipation device for the abnormal surface heat dissipation area, so as to adjust the working state of the water-cooling heat dissipation device, improve the water-cooling heat dissipation intensity of the abnormal surface heat dissipation area, maximize the heat absorption efficiency of the cooling water, and avoid the rapid accumulation of heat in the abnormal surface heat dissipation area; also update the detection working heat-related data, determine the change trend information of the abnormal surface heat dissipation area, so as to adjust the airflow output state of the air-cooling heat dissipation device, realize the water-cooling and air-cooling convection linkage control of the IGBT device, effectively avoid local overheating of the IGBT surface and improve the heat exchange efficiency and sustainability between the IGBT and the outside world. BRIEF DESCRIPTION OF THE DRAWINGS

[0058] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the prior art descriptions. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Among them:

[0059] Figure 1 A schematic flow chart of a convection and water cooling linked heat dissipation method for an IGBT device provided by the present invention.

[0060] Figure 2 A schematic diagram of the structure of a convection and water-cooling linked heat dissipation system for IGBT devices provided by the present invention. DETAILED DESCRIPTION

[0061] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. It is to be understood that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application. It should also be noted that, for ease of description, only some structures related to the present application are shown in the accompanying drawings, rather than all structures. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0062] The terms "including" and "having" and any variations thereof in this application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products or devices.

[0063] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0064] See also Figure 1 As shown, an embodiment of the present application provides a convection and water cooling linkage heat dissipation method for an IGBT device. The convection and water cooling linkage heat dissipation method for an IGBT device includes:

[0065] Detecting the IGBT device to obtain working heat related data of the IGBT device; analyzing the working heat related data to obtain surface thermal radiation divergence characteristic information of the IGBT device, thereby identifying the surface heat dissipation abnormality area of ​​the IGBT device;

[0066] The water-cooling heat dissipation device inside the IGBT device is monitored to obtain cooling water status data of the water-cooling heat dissipation device; based on the cooling water status data, characteristic information of heat absorption from the abnormal surface heat dissipation area by the water-cooling heat dissipation device is estimated, so as to adjust the working state of the water-cooling heat dissipation device;

[0067] The working heat related data is updated and detected to determine the change trend information of the surface heat dissipation abnormal area of ​​the water-cooled heat dissipation device during the working state adjustment process; based on the change trend information, the airflow output state of the air-cooled heat dissipation device corresponding to the IGBT device is adjusted.

[0068] The beneficial effects of the above embodiments are as follows: the convection and water-cooling linkage heat dissipation method for IGBT devices detects and analyzes the working heat-related data of the IGBT devices, obtains the characteristic information of the surface thermal radiation divergence, and globally characterizes the surface heat divergence of the IGBT devices, thereby identifying the abnormal surface heat dissipation area, and defining the range for the subsequent improvement of the active heat dissipation state for the local surface area of ​​the IGBT device; based on the cooling water state data of the water-cooling heat dissipation device, the heat absorption characteristics of the water-cooling heat dissipation device for the abnormal surface heat dissipation area are estimated, thereby adjusting the working state of the water-cooling heat dissipation device, improving the water-cooling heat dissipation intensity of the abnormal surface heat dissipation area, maximizing the heat absorption efficiency of the cooling water, and avoiding the rapid accumulation of heat in the abnormal surface heat dissipation area; it also updates the detection of working heat-related data, determines the change trend information of the abnormal surface heat dissipation area, and adjusts the airflow output state of the air-cooling heat dissipation device, realizes the water-cooling and air-cooling convection linkage control of the IGBT device, effectively avoids local overheating of the IGBT surface and improves the heat exchange efficiency and sustainability between the IGBT and the outside world.

[0069] In another embodiment, an IGBT device is detected to obtain working heat related data of the IGBT device; the working heat related data is analyzed to obtain surface thermal radiation divergence characteristic information of the IGBT device, thereby identifying the surface heat dissipation abnormal area of ​​the IGBT device, including:

[0070] Performing surface operating temperature detection and thermal infrared dynamic imaging on the IGBT device to obtain surface operating temperature data and thermal infrared dynamic images of the IGBT device; wherein the surface operating temperature data includes dynamic temperature data of several position points on the surface of the IGBT device and the surrounding areas;

[0071] The thermal infrared dynamic image is analyzed to obtain the thermal radiation field distribution state information of the spatial area where the IGBT device is located; based on the surface operating temperature data, the thermal radiation propagation state of the thermal radiation field distribution state information is identified to obtain the surface thermal radiation divergence direction information and the surface thermal radiation divergence rate information of the IGBT device, which are used as the surface thermal radiation divergence characteristic information;

[0072] Based on the surface thermal radiation dissipation direction information and the surface thermal radiation dissipation rate information, the heat dissipation efficiency values ​​of different areas on the surface of the IGBT device are obtained; and the heat dissipation efficiency values ​​are compared with thresholds to identify and locate the abnormal surface heat dissipation areas of the IGBT device.

[0073] The beneficial effects of the above embodiments are that the IGBT device has a large volume and surface area. In order to effectively dissipate the heat of the IGBT device, a cooling water pipe loop is arranged in all directions inside the IGBT device to form a water-cooled heat dissipation device, and air flow ejectors are arranged at different positions inside the IGBT device to form an air-cooled heat dissipation device. In addition, when the air flow ejectors under the air-cooled heat dissipation device eject air flow into the interior of the IGBT device, a convection environment is formed inside the device, which quickly dissipates the heat inside the IGBT device. Due to the different working power and material types of electronic devices, different areas inside the IGBT device have different working heat generation and working heat dissipation transmission conditions in different areas inside the IGBT device. To accurately determine the working heat distribution of the entire range of the IGBT device, the surface working temperature of the IGBT device is first detected and thermal infrared dynamic imaging is performed on the IGBT device to obtain the surface working temperature data and thermal infrared dynamic image of the IGBT device; the surface working temperature detection of the IGBT device can be achieved by pre-setting a number of SMD temperature sensors at different positions on the surface of the IGBT device, and each SMD temperature sensor can obtain the dynamic temperature data of its own position and its surrounding area (i.e., temperature change data over a period of time); and the thermal infrared camera can be used to dynamically shoot the entire IGBT device to obtain the corresponding thermal infrared dynamic image. There is also a thermal radiation dynamic analysis of the thermal infrared dynamic image to obtain the thermal radiation field distribution state information of the spatial area where the IGBT device is located, so as to fully identify the thermal radiation field formed by the heat emitted by the IGBT device in the spatial area where the IGBT device is located. The higher the temperature at a certain point, the greater the intensity of thermal radiation emitted by the point. Based on the surface operating temperature data, the thermal radiation propagation state is identified for the thermal radiation field distribution state information. This can quantitatively determine the thermal radiation emission transmission conditions of the spatial area where the IGBT device is located, and obtain the surface thermal radiation divergence direction information and surface thermal radiation divergence rate information of the IGBT device. This can dually characterize the transmission direction and transmission flow rate of the thermal radiation divergence of the global surface of the IGBT device, providing a reliable basis for subsequent adjustment of the working state of the water-cooled heat dissipation equipment.

[0074] In another embodiment, the water-cooling heat dissipation device inside the IGBT device is monitored to obtain cooling water status data of the water-cooling heat dissipation device; based on the cooling water status data, characteristic information of heat absorption from the abnormal surface heat dissipation area by the water-cooling heat dissipation device is estimated, so as to adjust the working state of the water-cooling heat dissipation device, including:

[0075] The water-cooling heat dissipation device inside the IGBT device performs global cooling water temperature and flow rate monitoring of the water-cooling pipeline, and obtains the temperature distribution data and flow rate distribution data of the cooling water of the water-cooling heat dissipation device along the extension path of the water-cooling pipeline, which are used as the cooling water state data;

[0076] Based on the temperature distribution data and the flow velocity distribution data, a heat exchange characterization model between the water cooling pipeline and the outside world is generated; based on the position information of the surface heat dissipation abnormality area, the heat exchange characterization model is estimated in the corresponding area range to obtain the heat absorption rate of the water cooling device from the surface heat dissipation abnormality area;

[0077] Based on the heat absorption rate, determine whether the pipeline section of the water-cooling pipeline corresponding to the surface heat dissipation abnormality area has reached the heat absorption saturation state; if not, reduce the cooling water flow rate inside the pipeline section; if so, keep the current cooling water flow rate inside the pipeline section unchanged.

[0078] The beneficial effects of the above embodiments are that the state of cooling water inside the water-cooling pipeline of the water-cooling heat dissipation device inside the IGBT device directly affects the heat absorption performance of the water-cooling heat dissipation device for the IGBT device. Generally speaking, the lower the temperature of the cooling water, the more heat it absorbs from the IGBT device; the smaller the flow rate of the cooling water, the longer the contact time with the corresponding area inside the IGBT device, and the more heat the corresponding IGBT device absorbs. It can be seen that the temperature and flow rate state of the cooling water directly affect the heat dissipation performance of the water-cooling heat dissipation device for the IGBT device. For this reason, the water-cooling heat dissipation device inside the IGBT device performs global cooling water temperature and flow rate monitoring of the water-cooling pipeline, and obtains the temperature distribution data and flow rate distribution data of the cooling water of the water-cooling heat dissipation device along the extension path of the water-cooling pipeline, which is used as the cooling water state data, thereby providing a reliable data basis for the construction of the heat dissipation working model of the water-cooling heat dissipation device. In addition, based on the temperature distribution data and the flow rate distribution data, a heat exchange characterization model between the water-cooling pipeline and the outside world is generated, wherein the construction and generation of the heat exchange characterization model is a conventional technical means in this field, and will not be described in detail here. Combined with the location information of the abnormal surface heat dissipation area, the heat exchange characterization model is used to estimate the heat exchange of the corresponding area, and the heat absorption rate of the water-cooled heat dissipation device from the abnormal surface heat dissipation area is obtained, and the actual heat dissipation situation of the abnormal surface heat dissipation area of ​​the IGBT device is accurately and quantitatively characterized, providing a reliable basis for whether the operation mode of the corresponding pipeline section of the water-cooled heat dissipation device needs to be adjusted in the future. In addition, the heat absorption rate is compared with the preset rate threshold. If the heat absorption rate exceeds the preset rate threshold, it indicates that the pipeline section of the water-cooled pipeline corresponding to the abnormal surface heat dissipation area has reached the heat absorption saturation state; otherwise, it is judged that the pipeline section of the water-cooled pipeline corresponding to the abnormal surface heat dissipation area has not reached the heat absorption saturation state. When the corresponding pipeline section has not reached the heat absorption saturation state, the cooling water flow rate inside the pipeline section is reduced, so that the cooling water inside the pipeline section can increase the contact time with the surface heat dissipation abnormality area, thereby maximizing the heat absorption efficiency of the cooling water to the surface heat dissipation abnormality area; when the corresponding pipeline section reaches the heat absorption saturation state, the current cooling water flow rate inside the pipeline section is maintained unchanged, thereby ensuring the stable circulation of cooling water inside the water-cooled heat dissipation equipment.

[0079] In another embodiment, adjusting the working state of the water cooling device includes:

[0080] Step S1, establishing a plane rectangular coordinate system on the surface of the IGBT device, with the Y axis to the left of the bottom edge of the surface of the IGBT device and the X axis to the top of the left edge. There are four ways for the cooling water to enter the surface of the IGBT device for water cooling, namely, entering from the lower right, upper right, lower left, and upper left of the surface of the IGBT device. The following formula (1) is used to control the entry state of the cooling water according to the distribution point situation of the abnormal heat dissipation area on the surface of the IGBT device.

[0081] (1)

[0082] In the above formula (1), Indicates the cooling water entry status control array; The first area indicating the abnormal heat dissipation area on the surface of the IGBT device Coordinate values ​​of distribution points; Indicates the maximum value of the horizontal coordinate among the points distributed on the surface of the IGBT device; Indicates the maximum value of the ordinate among the points distributed on the surface of the IGBT device; Indicates the total number of distribution points of the abnormal heat dissipation area on the surface of the IGBT device; Represents a judgment function. If the equation in the brackets is true, the function value of the judgment function is 1, otherwise the function value of the judgment function is 0;

[0083] like , it means that the cooling water enters from the lower right corner of the IGBT device surface;

[0084] like , it means that the cooling water enters from the upper right corner of the IGBT device surface;

[0085] like , it means that the cooling water enters from the lower left corner of the IGBT device surface;

[0086] like , it means that the cooling water enters from the upper left corner of the IGBT device surface;

[0087] Step S2, using the following formula (2), according to the distribution of the abnormal heat dissipation area on the surface of the IGBT device, the flow rate of the cooling water of the water-cooling device inside the IGBT device is controlled.

[0088] (2)

[0089] In the above formula (2), Indicates the flow rate control value of the cooling water of the water-cooling heat dissipation device inside the IGBT device; Indicates the maximum flow rate of the cooling water; Indicates the water inlet point coordinates of the cooling water (obtained in step S1); Indicates obtaining coordinate points With coordinate points The distance value between Indicates the distance between the lower right corner and the upper left corner of the IGBT device surface; Indicated in Get the maximum value in brackets under the condition of ;

[0090] Step S3, using the following formula (3), according to the cooling water temperature of the water cooling device inside the IGBT device and the flow rate of the cooling water of the water cooling device inside the IGBT device, determine the circulation path length during water cooling,

[0091] (3)

[0092] In the above formula (3), Indicates the length of the circulation path when water cooling is performed; Indicates the first The length of the cycle path; Indicates the total number of circulation paths when water cooling is performed; Indicates the cooling water temperature of the water-cooling heat dissipation device inside the IGBT device; Indicates the maximum water temperature for water cooling; It means to find the absolute value; Indicated in Under the conditions of When the minimum value is obtained value Indicates the first The length of the cycle path; Indicates the maximum length of all water cooling circulation paths.

[0093] The beneficial effect of the above embodiment is that the following formula (1) is used to control the entry state of the cooling water according to the distribution point situation of the abnormal heat dissipation area on the surface of the IGBT device, so as to give priority to water cooling to the places where the abnormal heat dissipation areas are concentrated; then the following formula (2) is used to control the flow rate of the cooling water of the water-cooling heat dissipation device inside the IGBT device according to the distribution point situation of the abnormal heat dissipation area on the surface of the IGBT device, and then the flow rate is accelerated when the abnormal heat dissipation areas are relatively dispersed, so as to ensure that all the abnormal heat dissipation areas can be cooled by cold water, and the flow rate is slowed down when the abnormal heat dissipation areas are relatively concentrated, so as to ensure the reliability of heat dissipation; then the following formula (3) is used to determine the length of the circulation path during water cooling according to the cooling water temperature of the water-cooling heat dissipation device inside the IGBT device and the cooling water flow rate of the water-cooling heat dissipation device inside the IGBT device, so as to ensure that the cooling water after heat dissipation can be cooled autonomously during external circulation, thereby improving the efficiency of system water cooling.

[0094] In another embodiment, the working heat related data is updated and detected to determine the change trend information of the abnormal surface heat dissipation area of ​​the water-cooled heat dissipation device during the working state adjustment process; based on the change trend information, the airflow output state of the air-cooled heat dissipation device corresponding to the IGBT device is adjusted, including:

[0095] Perform periodic update detection on the working heat related data to obtain a working heat related data queue; analyze the working heat related data to obtain the area of ​​the surface heat dissipation abnormal area corresponding to all update detection time points during the working state adjustment process of the water-cooled heat dissipation device, so as to determine the area change trend information of the surface heat dissipation abnormal area;

[0096] Based on the area change trend information of the region, the location point where heat is excessively concentrated on the surface of the IGBT device is determined; based on the distribution position of the location point where heat is excessively concentrated on the surface of the IGBT device, the airflow jet output direction and / or output speed of the jet airflow cooling device corresponding to the IGBT device is adjusted.

[0097] The beneficial effect of the above embodiment is that as the water-cooling heat dissipation device performs heat dissipation operations on the IGBT device, the surface temperature of the IGBT device will also decrease accordingly. In order to accurately identify the change trend of the abnormal surface heat dissipation area of ​​the IGBT device itself during the working state adjustment of the water-cooling heat dissipation device, the working heat-related data is periodically updated and detected to obtain a working heat-related data queue, and the working heat-related data queue is analyzed for time evolution to obtain the area area corresponding to the abnormal surface heat dissipation area at all update detection time points during the working state adjustment of the water-cooling heat dissipation device, thereby determining the area area change trend information of the abnormal surface heat dissipation area. If the area area change trend information indicates that the area area of ​​the abnormal surface heat dissipation area is gradually decreasing, it means that the location point corresponding to the abnormal surface heat dissipation area does not belong to the location point where heat is excessively concentrated; if The trend information of the area change shows that the area of ​​the abnormal surface heat dissipation area remains unchanged or gradually increases, which means that the corresponding position point of the abnormal surface heat dissipation area is a heat excessive concentration position point, and based on the distribution position of the heat excessive concentration position point on the surface of the IGBT device, the airflow jet output direction and / or output speed of the jet airflow cooling device corresponding to the IGBT device is adjusted, so that the jet airflow cooling device can perform airflow cooling for all heat excessive concentration position points, quickly reduce the heat accumulation at the heat excessive concentration position points, and control the water cooling and air cooling convection linkage of the IGBT device, so as to effectively avoid local overheating of the IGBT surface and improve the efficiency and continuity of heat exchange between the IGBT and the outside world.

[0098] See also Figure 2 As shown, an embodiment of the present application provides a convection and water cooling linkage heat dissipation system for an IGBT device. The convection and water cooling linkage heat dissipation system for an IGBT device includes:

[0099] The working heat detection module is used to detect the IGBT device and obtain the working heat related data of the IGBT device;

[0100] A surface heat dissipation abnormal area identification module is used to analyze the working heat related data to obtain the surface heat radiation divergence characteristic information of the IGBT device, thereby identifying the surface heat dissipation abnormal area of ​​the IGBT device;

[0101] A cooling water status monitoring module is used to monitor the water cooling and heat dissipation equipment inside the IGBT device and obtain the cooling water status data of the water cooling and heat dissipation equipment;

[0102] A water-cooling heat dissipation device adjustment module is used to estimate the heat absorption characteristic information of the water-cooling heat dissipation device from the abnormal surface heat dissipation area based on the cooling water state data, so as to adjust the working state of the water-cooling heat dissipation device;

[0103] A surface heat dissipation abnormal area change trend determination module is used to update and detect the working heat related data to determine the change trend information of the surface heat dissipation abnormal area during the working state adjustment process of the water cooling and heat dissipation device;

[0104] The air-cooling heat dissipation device adjustment module is used to adjust the airflow output state of the air-cooling heat dissipation device corresponding to the IGBT device based on the change trend information.

[0105] The beneficial effects of the above embodiments are as follows: the convection and water-cooling linkage heat dissipation system for IGBT devices detects and analyzes the working heat-related data of the IGBT devices, obtains the characteristic information of the surface thermal radiation dissipation, and globally characterizes the surface heat dissipation of the IGBT devices, thereby identifying the abnormal surface heat dissipation area, and defining the range for the subsequent improvement of the active heat dissipation state for the local surface area of ​​the IGBT device; based on the cooling water state data of the water-cooling heat dissipation device, the heat absorption characteristics of the water-cooling heat dissipation device for the abnormal surface heat dissipation area are estimated, thereby adjusting the working state of the water-cooling heat dissipation device, improving the water-cooling heat dissipation intensity of the abnormal surface heat dissipation area, maximizing the heat absorption efficiency of the cooling water, and avoiding the rapid accumulation of heat in the abnormal surface heat dissipation area; it also updates the detection of working heat-related data, determines the change trend information of the abnormal surface heat dissipation area, and adjusts the airflow output state of the air-cooling heat dissipation device, realizes the water-cooling and air-cooling convection linkage control of the IGBT device, effectively avoids local overheating of the IGBT surface and improves the heat exchange efficiency and sustainability between the IGBT and the outside world.

[0106] In another embodiment, the working heat detection module is used to detect the IGBT device to obtain working heat related data of the IGBT device, including:

[0107] Performing surface operating temperature detection and thermal infrared dynamic imaging on the IGBT device to obtain surface operating temperature data and thermal infrared dynamic images of the IGBT device; wherein the surface operating temperature data includes dynamic temperature data of several position points on the surface of the IGBT device and the surrounding areas;

[0108] The surface heat dissipation abnormal area identification module is used to analyze the working heat related data to obtain the surface heat radiation divergence characteristic information of the IGBT device, thereby identifying the surface heat dissipation abnormal area of ​​the IGBT device, including:

[0109] The thermal infrared dynamic image is analyzed to obtain the thermal radiation field distribution state information of the spatial area where the IGBT device is located; based on the surface operating temperature data, the thermal radiation propagation state of the thermal radiation field distribution state information is identified to obtain the surface thermal radiation divergence direction information and the surface thermal radiation divergence rate information of the IGBT device, which are used as the surface thermal radiation divergence characteristic information;

[0110] Based on the surface thermal radiation dissipation direction information and the surface thermal radiation dissipation rate information, the heat dissipation efficiency values ​​of different areas on the surface of the IGBT device are obtained; and the heat dissipation efficiency values ​​are compared with thresholds to identify and locate the abnormal surface heat dissipation areas of the IGBT device.

[0111] The beneficial effects of the above embodiments are that the IGBT device has a large volume and surface area. In order to effectively dissipate the heat of the IGBT device, a cooling water pipe loop is arranged in all directions inside the IGBT device to form a water-cooled heat dissipation device, and air flow ejectors are arranged at different positions inside the IGBT device to form an air-cooled heat dissipation device. In addition, when the air flow ejectors under the air-cooled heat dissipation device eject air flow into the interior of the IGBT device, a convection environment is formed inside the device, which quickly dissipates the heat inside the IGBT device. Due to the different working power and material types of electronic devices, different areas inside the IGBT device have different working heat generation and working heat dissipation transmission conditions in different areas inside the IGBT device. To accurately determine the working heat distribution of the entire range of the IGBT device, the surface working temperature of the IGBT device is first detected and thermal infrared dynamic imaging is performed on the IGBT device to obtain the surface working temperature data and thermal infrared dynamic image of the IGBT device; the surface working temperature detection of the IGBT device can be achieved by pre-setting a number of SMD temperature sensors at different positions on the surface of the IGBT device, and each SMD temperature sensor can obtain the dynamic temperature data of its own position and its surrounding area (i.e., temperature change data over a period of time); and the thermal infrared camera can be used to dynamically shoot the entire IGBT device to obtain the corresponding thermal infrared dynamic image. There is also a thermal radiation dynamic analysis of the thermal infrared dynamic image to obtain the thermal radiation field distribution state information of the spatial area where the IGBT device is located, so as to fully identify the thermal radiation field formed by the heat emitted by the IGBT device in the spatial area where the IGBT device is located. The higher the temperature at a certain point, the greater the intensity of thermal radiation emitted by the point. Based on the surface operating temperature data, the thermal radiation propagation state is identified for the thermal radiation field distribution state information. This can quantitatively determine the thermal radiation emission transmission conditions of the spatial area where the IGBT device is located, and obtain the surface thermal radiation divergence direction information and surface thermal radiation divergence rate information of the IGBT device. This can dually characterize the transmission direction and transmission flow rate of the thermal radiation divergence of the global surface of the IGBT device, providing a reliable basis for subsequent adjustment of the working state of the water-cooled heat dissipation equipment.

[0112] In another embodiment, the cooling water status monitoring module is used to monitor the water cooling and heat dissipation device inside the IGBT device to obtain cooling water status data of the water cooling and heat dissipation device, including:

[0113] The water-cooling heat dissipation device inside the IGBT device performs global cooling water temperature and flow rate monitoring of the water-cooling pipeline, and obtains the temperature distribution data and flow rate distribution data of the cooling water of the water-cooling heat dissipation device along the extension path of the water-cooling pipeline, which are used as the cooling water state data;

[0114] The water-cooling heat dissipation device adjustment module is used to estimate the heat absorption characteristic information of the water-cooling heat dissipation device from the surface heat dissipation abnormality area based on the cooling water state data, so as to adjust the working state of the water-cooling heat dissipation device, including:

[0115] Based on the temperature distribution data and the flow velocity distribution data, a heat exchange characterization model between the water cooling pipeline and the outside world is generated; based on the position information of the surface heat dissipation abnormality area, the heat exchange characterization model is estimated in the corresponding area range to obtain the heat absorption rate of the water cooling device from the surface heat dissipation abnormality area;

[0116] Based on the heat absorption rate, determine whether the pipeline section of the water-cooling pipeline corresponding to the surface heat dissipation abnormality area has reached the heat absorption saturation state; if not, reduce the cooling water flow rate inside the pipeline section; if so, keep the current cooling water flow rate inside the pipeline section unchanged.

[0117] The beneficial effects of the above embodiments are that the state of cooling water inside the water-cooling pipeline of the water-cooling heat dissipation device inside the IGBT device directly affects the heat absorption performance of the water-cooling heat dissipation device for the IGBT device. Generally speaking, the lower the temperature of the cooling water, the more heat it absorbs from the IGBT device; the smaller the flow rate of the cooling water, the longer the contact time with the corresponding area inside the IGBT device, and the more heat the corresponding IGBT device absorbs. It can be seen that the temperature and flow rate state of the cooling water directly affect the heat dissipation performance of the water-cooling heat dissipation device for the IGBT device. For this reason, the water-cooling heat dissipation device inside the IGBT device performs global cooling water temperature and flow rate monitoring of the water-cooling pipeline, and obtains the temperature distribution data and flow rate distribution data of the cooling water of the water-cooling heat dissipation device along the extension path of the water-cooling pipeline, which is used as the cooling water state data, thereby providing a reliable data basis for the construction of the heat dissipation working model of the water-cooling heat dissipation device. In addition, based on the temperature distribution data and the flow rate distribution data, a heat exchange characterization model between the water-cooling pipeline and the outside world is generated, wherein the construction and generation of the heat exchange characterization model is a conventional technical means in this field, and will not be described in detail here. Combined with the location information of the abnormal surface heat dissipation area, the heat exchange characterization model is used to estimate the heat exchange of the corresponding area, and the heat absorption rate of the water-cooled heat dissipation device from the abnormal surface heat dissipation area is obtained, and the actual heat dissipation situation of the abnormal surface heat dissipation area of ​​the IGBT device is accurately and quantitatively characterized, providing a reliable basis for whether the operation mode of the corresponding pipeline section of the water-cooled heat dissipation device needs to be adjusted in the future. In addition, the heat absorption rate is compared with the preset rate threshold. If the heat absorption rate exceeds the preset rate threshold, it indicates that the pipeline section of the water-cooled pipeline corresponding to the abnormal surface heat dissipation area has reached the heat absorption saturation state; otherwise, it is judged that the pipeline section of the water-cooled pipeline corresponding to the abnormal surface heat dissipation area has not reached the heat absorption saturation state. When the corresponding pipeline section has not reached the heat absorption saturation state, the cooling water flow rate inside the pipeline section is reduced, so that the cooling water inside the pipeline section can increase the contact time with the surface heat dissipation abnormality area, thereby maximizing the heat absorption efficiency of the cooling water to the surface heat dissipation abnormality area; when the corresponding pipeline section reaches the heat absorption saturation state, the current cooling water flow rate inside the pipeline section is maintained unchanged, thereby ensuring the stable circulation of cooling water inside the water-cooled heat dissipation equipment.

[0118] In another embodiment, the surface heat dissipation abnormal area change trend determination module is used to update and detect the working heat related data, and determine the change trend information of the surface heat dissipation abnormal area during the working state adjustment of the water cooling heat dissipation device, including:

[0119] Perform periodic update detection on the working heat related data to obtain a working heat related data queue; analyze the working heat related data to obtain the area of ​​the surface heat dissipation abnormal area corresponding to all update detection time points during the working state adjustment process of the water-cooled heat dissipation device, so as to determine the area change trend information of the surface heat dissipation abnormal area;

[0120] The air-cooling heat dissipation device adjustment module is used to adjust the airflow output state of the air-cooling heat dissipation device corresponding to the IGBT device based on the change trend information, including:

[0121] Based on the area change trend information of the region, the location point where heat is excessively concentrated on the surface of the IGBT device is determined; based on the distribution position of the location point where heat is excessively concentrated on the surface of the IGBT device, the airflow jet output direction and / or output speed of the jet airflow cooling device corresponding to the IGBT device is adjusted.

[0122] The beneficial effect of the above embodiment is that as the water-cooling heat dissipation device performs heat dissipation operations on the IGBT device, the surface temperature of the IGBT device will also decrease accordingly. In order to accurately identify the change trend of the abnormal surface heat dissipation area of ​​the IGBT device itself during the working state adjustment of the water-cooling heat dissipation device, the working heat-related data is periodically updated and detected to obtain a working heat-related data queue, and the working heat-related data queue is analyzed for time evolution to obtain the area area corresponding to the abnormal surface heat dissipation area at all update detection time points during the working state adjustment of the water-cooling heat dissipation device, thereby determining the area area change trend information of the abnormal surface heat dissipation area. If the area area change trend information indicates that the area area of ​​the abnormal surface heat dissipation area is gradually decreasing, it means that the location point corresponding to the abnormal surface heat dissipation area does not belong to the location point where heat is excessively concentrated; if The trend information of the area change shows that the area of ​​the abnormal surface heat dissipation area remains unchanged or gradually increases, which means that the corresponding position point of the abnormal surface heat dissipation area is a heat excessive concentration position point, and based on the distribution position of the heat excessive concentration position point on the surface of the IGBT device, the airflow jet output direction and / or output speed of the jet airflow cooling device corresponding to the IGBT device is adjusted, so that the jet airflow cooling device can perform airflow cooling for all heat excessive concentration position points, quickly reduce the heat accumulation at the heat excessive concentration position points, and control the water cooling and air cooling convection linkage of the IGBT device, so as to effectively avoid local overheating of the IGBT surface and improve the efficiency and continuity of heat exchange between the IGBT and the outside world.

[0123] In general, the convection and water-cooling linked heat dissipation method and system for IGBT devices detects and analyzes the working heat-related data of the IGBT devices, obtains the characteristic information of its surface thermal radiation dissipation, and globally characterizes the surface heat dissipation of the IGBT devices, thereby identifying the abnormal surface heat dissipation area, and defining the scope for the subsequent improvement of the active heat dissipation state for the local surface area of ​​the IGBT device; based on the cooling water state data of the water-cooling heat dissipation device, the heat absorption characteristics of the water-cooling heat dissipation device for the abnormal surface heat dissipation area are estimated, thereby adjusting the working state of the water-cooling heat dissipation device, improving the water-cooling heat dissipation intensity of the abnormal surface heat dissipation area, maximizing the heat absorption efficiency of the cooling water, and avoiding the rapid accumulation of heat in the abnormal surface heat dissipation area; it also updates the detection of working heat-related data, determines the change trend information of the abnormal surface heat dissipation area, and adjusts the airflow output state of the air-cooling heat dissipation device, realizes the water-cooling and air-cooling convection linked control of the IGBT device, effectively avoids local overheating of the IGBT surface and improves the efficiency and continuity of heat exchange between the IGBT and the outside world.

[0124] The above is only a specific implementation of the present invention, and any other improvements made based on the concept of the present invention are considered to be within the protection scope of the present invention.

Claims

1. A convection and water cooling linkage heat dissipation method for IGBT devices, characterized in that: include: Detecting an IGBT device to obtain working heat related data of the IGBT device; Analyzing the working heat related data to obtain surface heat radiation divergence characteristic information of the IGBT device, thereby identifying the abnormal surface heat dissipation area of ​​the IGBT device; The water-cooling heat dissipation device inside the IGBT device is monitored to obtain cooling water status data of the water-cooling heat dissipation device; based on the cooling water status data, characteristic information of heat absorption from the abnormal surface heat dissipation area by the water-cooling heat dissipation device is estimated, so as to adjust the working state of the water-cooling heat dissipation device; Performing update detection on the working heat related data to determine the change trend information of the abnormal surface heat dissipation area during the working state adjustment process of the water cooling and heat dissipation device; Based on the change trend information, adjusting the airflow output state of the air-cooling heat dissipation device corresponding to the IGBT device; Wherein, adjusting the working state of the water cooling device includes: Step S1, establishing a plane rectangular coordinate system on the surface of the IGBT device, with the Y axis to the left of the bottom edge of the surface of the IGBT device and the X axis to the top of the left side. There are four ways for the cooling water to enter the surface of the IGBT device for water cooling, namely, entering from the lower right, upper right, lower left, and upper left of the surface of the IGBT device. The following formula (1) is used to control the entry state of the cooling water according to the distribution point situation of the abnormal heat dissipation area on the surface of the IGBT device. In the above formula (1), (P, q) represents the cooling water entry state control array; [x(a), Y(a)] represents the coordinate value of the ath distribution point in the abnormal heat dissipation area on the surface of the IGBT device; max represents the maximum value of the horizontal coordinate among the points distributed on the surface of the IGBT device; max represents the maximum value of the ordinate among the points distributed on the surface of the IGBT device; N represents the total number of distribution points in the abnormal heat dissipation area on the surface of the IGBT device; F[] represents a judgment function, and if the formula in the brackets is established, the function value of the judgment function is 1, otherwise the function value of the judgment function is 0; If (P, q) = (1, 1), it means that the cooling water enters from the lower right corner of the surface of the IGBT device; If (P, q) = (1, 0), it means that the cooling water enters from the upper right corner of the surface of the IGBT device; If (P, q) = (0, 1), it means that the cooling water enters from the lower left corner of the surface of the IGBT device; If (P, q) = (0, 0), it means that the cooling water enters from the upper left corner of the surface of the IGBT device; Step S2, using the following formula (2), according to the distribution of the abnormal heat dissipation area on the surface of the IGBT device, the flow rate of the cooling water of the water-cooling device inside the IGBT device is controlled. In the above formula (2), V represents the flow rate control value of the cooling water of the water cooling device inside the IGBT device; v max represents the maximum flow rate of the cooling water; (x0, y0) represents the coordinates of the cooling water inlet point; L{[X(a), Y(a)], (x0, y0)} represents the distance between the coordinate point [X(a), Y(a)] and the coordinate point (x0, y0); D represents the distance between the lower right corner point and the upper left corner point on the surface of the IGBT device; It means that the maximum value in the brackets is obtained under the condition of 1≤a≤N; Step S3, using the following formula (3), according to the cooling water temperature of the water cooling device inside the IGBT device and the flow rate of the cooling water of the water cooling device inside the IGBT device, determine the circulation path length during water cooling, In the above formula (3), S′ represents the length of the circulation path when water cooling is performed; S(k) represents the length of the kth circulation path when water cooling is performed; H represents the total number of circulation paths when water cooling is performed; w e represents the cooling water temperature of the water-cooling heat dissipation device inside the IGBT device; w represents the maximum water temperature value for water cooling; || represents obtaining the absolute value; It means that under the condition of 1≤k≤H, we can get The k value S when the minimum value is obtained Indicates the first The length of a circulation path; S represents the maximum length value of all water cooling circulation paths.

2. The convection and water cooling linkage heat dissipation method for IGBT devices according to claim 1, characterized in that: Detecting an IGBT device to obtain working heat related data of the IGBT device; Analyzing the working heat related data to obtain surface heat radiation divergence characteristic information of the IGBT device, thereby identifying the abnormal surface heat dissipation area of ​​the IGBT device, including: Performing surface operating temperature detection and thermal infrared dynamic imaging on the IGBT device to obtain surface operating temperature data and thermal infrared dynamic images of the IGBT device; wherein the surface operating temperature data includes dynamic temperature data of several position points on the surface of the IGBT device and their vicinity; Analyze the thermal infrared dynamic image to obtain the thermal radiation field distribution state information of the spatial area where the IGBT device is located; based on the surface operating temperature data, identify the thermal radiation propagation state of the thermal radiation field distribution state information to obtain the surface thermal radiation divergence direction information and surface thermal radiation divergence rate information of the IGBT device, which are used as the surface thermal radiation divergence characteristic information; Based on the surface heat radiation dissipation direction information and the surface heat radiation dissipation rate information, the heat dissipation efficiency values ​​of different areas on the surface of the IGBT device are obtained; and the heat dissipation efficiency values ​​are compared by threshold values ​​to identify and locate the abnormal surface heat dissipation area of ​​the IGBT device.

3. The convection and water cooling linkage heat dissipation method for IGBT devices according to claim 1, characterized in that: The water-cooling heat dissipation device inside the IGBT device is monitored to obtain cooling water status data of the water-cooling heat dissipation device; based on the cooling water status data, characteristic information of heat absorption from the abnormal surface heat dissipation area by the water-cooling heat dissipation device is estimated, so as to adjust the working state of the water-cooling heat dissipation device, including: Performing global cooling water temperature and flow rate monitoring of the water cooling pipeline of the water cooling heat dissipation device inside the IGBT device, obtaining temperature distribution data and flow rate distribution data of the cooling water of the water cooling heat dissipation device along the extension path of the water cooling pipeline, and using them as the cooling water state data; Based on the temperature distribution data and the flow velocity distribution data, a heat exchange characterization model between the water cooling pipeline and the outside world is generated; based on the position information of the surface heat dissipation abnormality area, the heat exchange characterization model is estimated in the corresponding area range to obtain the heat absorption rate of the water cooling device from the surface heat dissipation abnormality area; Based on the heat absorption rate, determine whether the pipeline section of the water-cooling pipeline corresponding to the surface heat dissipation abnormality area has reached the heat absorption saturation state; if not, reduce the cooling water flow rate inside the pipeline section; if so, keep the current cooling water flow rate inside the pipeline section unchanged.

4. The convection and water cooling linkage heat dissipation method for IGBT devices according to claim 1, characterized in that: Performing update detection on the working heat related data to determine the change trend information of the abnormal surface heat dissipation area during the working state adjustment process of the water cooling and heat dissipation device; Based on the change trend information, adjusting the airflow output state of the air-cooling heat dissipation device corresponding to the IGBT device includes: Performing periodic update detection on the working heat related data to obtain a working heat related data queue; analyzing the working heat related data to obtain the area of ​​the surface heat dissipation abnormal area corresponding to all update detection time points during the working state adjustment process of the water cooling and heat dissipation device, thereby determining the area change trend information of the surface heat dissipation abnormal area; Based on the regional area change trend information, the location points where heat is excessively concentrated on the surface of the IGBT device are determined; based on the distribution positions of the location points where heat is excessively concentrated on the surface of the IGBT device, the airflow jet output direction and / or output speed of the jet airflow cooling device corresponding to the IGBT device is adjusted.

5. A convection and water cooling linkage heat dissipation system for IGBT devices, characterized in that: include: A working heat detection module, used to detect the IGBT device and obtain working heat related data of the IGBT device; A surface heat dissipation abnormal area identification module is used to analyze the working heat related data to obtain the surface heat radiation divergence characteristic information of the IGBT device, thereby identifying the surface heat dissipation abnormal area of ​​the IGBT device; A cooling water status monitoring module is used to monitor the water cooling and heat dissipation equipment inside the IGBT device to obtain cooling water status data of the water cooling and heat dissipation equipment; A water-cooling heat dissipation device adjustment module, used to estimate the heat absorption characteristic information of the water-cooling heat dissipation device from the surface heat dissipation abnormality area based on the cooling water state data, so as to adjust the working state of the water-cooling heat dissipation device; A surface heat dissipation abnormal area change trend determination module, used to update and detect the working heat related data, and determine the change trend information of the surface heat dissipation abnormal area during the working state adjustment process of the water cooling and heat dissipation device; The air cooling device adjustment module is used to adjust the IGBT based on the change trend information. The airflow output status of the air-cooling device corresponding to the device; Wherein, adjusting the working state of the water cooling device includes: Step S1, establishing a plane rectangular coordinate system on the surface of the IGBT device, with the Y axis to the left of the bottom edge of the surface of the IGBT device and the X axis to the top of the left side. There are four ways for the cooling water to enter the surface of the IGBT device for water cooling, namely, entering from the lower right, upper right, lower left, and upper left of the surface of the IGBT device. The following formula (1) is used to control the entry state of the cooling water according to the distribution point situation of the abnormal heat dissipation area on the surface of the IGBT device. In the above formula (1), (P, q) represents the cooling water entry state control array; [x(a), Y(a)] represents the coordinate value of the ath distribution point in the surface heat dissipation abnormality area of ​​the IGBT device; x max represents the maximum value of the horizontal coordinate among the points distributed on the surface of the IGBT device; max represents the maximum value of the ordinate among the points distributed on the surface of the IGBT device; N represents the total number of distribution points in the abnormal heat dissipation area on the surface of the IGBT device; F[] represents a judgment function, and if the formula in the brackets is established, the function value of the judgment function is 1, otherwise the function value of the judgment function is 0; If (P, q) = (1, 1), it means that the cooling water enters from the lower right corner of the surface of the IGBT device; If (P, q) = (1, 0), it means that the cooling water enters from the upper right corner of the surface of the IGBT device; If (P, q) = (0, 1), it means that the cooling water enters from the lower left corner of the surface of the IGBT device; If (P, q) = (0, 0), it means that the cooling water enters from the upper left corner of the surface of the IGBT device; Step S2, using the following formula (2), according to the distribution of the abnormal heat dissipation area on the surface of the IGBT device, the flow rate of the cooling water of the water-cooling device inside the IGBT device is controlled. In the above formula (2), V represents the flow rate control value of the cooling water of the water cooling device inside the IGBT device; v max represents the maximum flow rate of the cooling water; (x0, y0) represents the coordinates of the cooling water inlet point; L{[X(a), Y(a)], (x0, y0)} represents the distance between the coordinate point [X(a), Y(a)] and the coordinate point (x0, y0); D represents the distance between the lower right corner point and the upper left corner point on the surface of the IGBT device; It means that the maximum value in the brackets is obtained under the condition of 1≤a≤N; Step S3, using the following formula (3), according to the cooling water temperature of the water cooling device inside the IGBT device and the flow rate of the cooling water of the water cooling device inside the IGBT device, determine the circulation path length during water cooling, In the above formula (3), S′ represents the length of the circulation path when water cooling is performed; S(k) represents the length of the kth circulation path when water cooling is performed; H represents the total number of circulation paths when water cooling is performed; w e represents the cooling water temperature of the water-cooling heat dissipation device inside the IGBT device; w represents the maximum water temperature value for water cooling; || represents obtaining the absolute value; It means that under the condition of 1≤k≤H, we can get The k value S when the minimum value is obtained Indicates the first The length of a circulation path; S represents the maximum length value of all water cooling circulation paths.

6. The convection and water cooling linkage heat dissipation system for IGBT devices according to claim 5, characterized in that: The working heat detection module is used to detect the IGBT device and obtain working heat related data of the IGBT device, including: Performing surface operating temperature detection and thermal infrared dynamic imaging on the IGBT device to obtain surface operating temperature data and thermal infrared dynamic images of the IGBT device; wherein the surface operating temperature data includes dynamic temperature data of several position points on the surface of the IGBT device and their vicinity; The surface heat dissipation abnormal area identification module is used to analyze the working heat related data to obtain the surface heat radiation divergence characteristic information of the IGBT device, thereby identifying the surface heat dissipation abnormal area of ​​the IGBT device, including: Analyze the thermal infrared dynamic image to obtain the thermal radiation field distribution state information of the spatial area where the IGBT device is located; based on the surface operating temperature data, identify the thermal radiation propagation state of the thermal radiation field distribution state information to obtain the surface thermal radiation divergence direction information and surface thermal radiation divergence rate information of the IGBT device, which are used as the surface thermal radiation divergence characteristic information; Based on the surface heat radiation dissipation direction information and the surface heat radiation dissipation rate information, the heat dissipation efficiency values ​​of different areas on the surface of the IGBT device are obtained; and the heat dissipation efficiency values ​​are compared by threshold values ​​to identify and locate the abnormal surface heat dissipation area of ​​the IGBT device.

7. The convection and water cooling linkage heat dissipation system for IGBT devices according to claim 5, characterized in that: The cooling water status monitoring module is used to monitor the water cooling and heat dissipation equipment inside the IGBT device to obtain cooling water status data of the water cooling and heat dissipation equipment, including: Performing global cooling water temperature and flow rate monitoring of the water cooling pipeline of the water cooling heat dissipation device inside the IGBT device, obtaining temperature distribution data and flow rate distribution data of the cooling water of the water cooling heat dissipation device along the extension path of the water cooling pipeline, and using them as the cooling water state data; The water-cooling heat dissipation device adjustment module is used to estimate the heat absorption characteristic information of the water-cooling heat dissipation device from the surface heat dissipation abnormality area based on the cooling water state data, so as to adjust the working state of the water-cooling heat dissipation device, including: Based on the temperature distribution data and the flow velocity distribution data, a heat exchange characterization model between the water cooling pipeline and the outside world is generated; based on the position information of the surface heat dissipation abnormality area, the heat exchange characterization model is estimated in the corresponding area range to obtain the heat absorption rate of the water cooling device from the surface heat dissipation abnormality area; Based on the heat absorption rate, determine whether the pipeline section of the water-cooling pipeline corresponding to the surface heat dissipation abnormality area has reached the heat absorption saturation state; if not, reduce the cooling water flow rate inside the pipeline section; if so, keep the current cooling water flow rate inside the pipeline section unchanged.

8. The convection and water cooling linkage heat dissipation system for IGBT devices according to claim 5, characterized in that: The surface heat dissipation abnormal area change trend determination module is used to update and detect the working heat related data, and determine the change trend information of the surface heat dissipation abnormal area during the working state adjustment process of the water cooling heat dissipation device, including: Performing periodic update detection on the working heat related data to obtain a working heat related data queue; analyzing the working heat related data to obtain the area of ​​the surface heat dissipation abnormal area corresponding to all update detection time points during the working state adjustment process of the water cooling and heat dissipation device, thereby determining the area change trend information of the surface heat dissipation abnormal area; The air-cooling and heat dissipation device adjustment module is used to adjust the airflow output state of the air-cooling and heat dissipation device corresponding to the IGBT device based on the change trend information, including: Based on the regional area change trend information, the location points where heat is excessively concentrated on the surface of the IGBT device are determined; based on the distribution positions of the location points where heat is excessively concentrated on the surface of the IGBT device, the airflow jet output direction and / or output speed of the jet airflow cooling device corresponding to the IGBT device is adjusted.

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