Universal suction cup device for circuit board installation

By designing a universal suction cup device and using a drive motor and telescopic mechanism to achieve precise positioning and angle adjustment of the circuit board, the problems of inaccurate positioning and insufficient applicability of fixtures in traditional circuit board installation are solved, and production efficiency and flexibility are improved.

CN119053033BActive Publication Date: 2025-09-12LONGNAN CHAMPION ASIA PRECISION CIRCUIT CO LTD
View PDF 2 Cites 0 Cited by

Patent Information

Application Number
CN202411208732.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-08-30
Publication Date
2025-09-12
Estimated Expiration
2044-08-30

AI Technical Summary

Technical Problem

In the traditional circuit board installation process, manual positioning is inaccurate and the applicability of the fixture is limited, making it difficult to adapt to circuit boards of different sizes and shapes, resulting in low production efficiency and increased costs.

Method used

A universal suction cup device was designed, which includes a rotating disk driven by a drive motor, a telescopic mechanism and an adsorption head. By adjusting the position and angle of the adsorption head, precise positioning and fixation of circuit boards of different sizes and shapes can be achieved.

Benefits of technology

It improves the flexibility and accuracy of circuit board installation, reduces tool replacement time, reduces production costs, avoids circuit board damage, and is suitable for stable adsorption and positioning of various circuit boards.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN119053033B_ABST
    Figure CN119053033B_ABST
Patent Text Reader

Abstract

The present invention relates to the technical field of adsorption devices for circuit board assembly, and specifically to a universal suction cup device for circuit board installation, comprising a mounting table, a mounting mechanism and a mounting box provided on the mounting table, a support plate provided on the mounting box, a bearing seat and a mounting plate provided on the top of the support plate, a rotating plate provided on the bearing seat, and the rotating plate located above the mounting plate. A driving motor is provided inside the mounting box, and the output end of the driving motor is connected to the rotating plate. A fastening groove is provided on the supporting plate, and a first telescopic mechanism is provided on the fastening groove. A tooth block is provided at the output end of the first telescopic mechanism, and a gear ring is provided at the bottom end of the rotating plate. This structure adjusts the position of the adsorption head through the second telescopic mechanism, and is suitable for circuit boards of different sizes and types. The adsorption head can move linearly in the adjustment groove on the iron plate, ensuring the stability and accuracy of the adsorption head in different positions.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present invention relates to the technical field of adsorption devices for circuit board assembly, in particular to a universal suction cup device for circuit board installation. Background Art

[0002] As we all know, in the traditional circuit board installation process, manual positioning and fixing of circuit boards are often relied upon. This method is not only time-consuming and labor-intensive, but also easily leads to inaccurate positioning of circuit boards, affecting the quality of the final product. In order to improve positioning accuracy, specific fixtures are sometimes used to fix circuit boards. However, these fixtures are often only suitable for circuit boards of specific sizes or types. When encountering products of different specifications, the fixtures need to be replaced, which increases production costs and reduces production efficiency. For automated production lines, it is required to be able to quickly adapt to circuit boards of different sizes and shapes. Traditional methods are difficult to meet this requirement, especially when dealing with non-standard sized circuit boards. In some cases, the circuit boards need to be adjusted slightly at an angle to be installed correctly. Traditional fixing methods make it difficult to achieve precise angle adjustment, which limits the flexibility of installation. Therefore, it is necessary to propose a solution to this technical problem. Summary of the Invention

[0003] In view of the deficiencies in the prior art, the present invention provides a universal suction cup device for mounting a circuit board.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a universal suction cup device for mounting a circuit board, comprising a mounting platform, a mounting mechanism and a mounting box provided on the mounting platform, a supporting plate provided on the mounting box, a bearing seat and a mounting plate provided on the top of the supporting plate, a rotating plate provided on the bearing seat, the rotating plate being located above the mounting plate, a driving motor provided inside the mounting box, an output end of the driving motor being connected to the rotating plate, a fastening groove provided on the supporting plate, a first telescopic mechanism provided on the fastening groove, a tooth block provided on the output end of the first telescopic mechanism, and a gear block provided at the bottom end of the rotating plate. There is a gear ring, which is located in the fastening groove, and the tooth block is engaged with the gear ring. The rotating disk is provided with an adsorption mechanism, which includes a hose and an adjustment groove. The adjustment groove is opened at the top of the rotating disk, and a second telescopic mechanism is provided on the adjustment groove. An adsorption head is provided between the output end of the second telescopic mechanism and the adjustment groove. An iron plate is provided on one side of the adjustment groove, and an electromagnetic lock is provided between the adsorption head and the iron plate. The hose is installed on the mounting disk, and the hose is connected to the adsorption head. The adsorption mechanism is provided in multiple and arranged in a ring array, and a heat dissipation mechanism is provided on the mounting box.

[0005] Furthermore, the present invention is improved in that the mounting mechanism includes a mounting hole, the mounting hole is opened on the mounting platform, and a plurality of the mounting holes are provided.

[0006] Furthermore, the present invention is improved in that the heat dissipation mechanism includes a heat dissipation hole, the heat dissipation hole is opened on the outside of the installation box, and a plurality of the heat dissipation holes are provided.

[0007] Furthermore, the present invention is improved in that a thread groove is opened on one side of the adjustment groove, the second telescopic mechanism is threadedly connected to the thread groove, and a bearing is provided between the output end of the second telescopic mechanism and the adsorption head.

[0008] Furthermore, the present invention is improved in that the driving motor is a servo motor.

[0009] Furthermore, the present invention is improved in that both the first telescopic mechanism and the second telescopic mechanism are electric telescopic rods.

[0010] Furthermore, the present invention is improved in that the adsorption head is adapted to the adjustment tank.

[0011] Furthermore, the present invention is improved in that a plurality of heat dissipation hole arrays are arranged around the installation box.

[0012] Compared with the prior art, the present invention provides a universal suction cup device for mounting a circuit board, which has the following beneficial effects:

[0013] The universal suction cup device for installing circuit boards can adjust the position of the suction head through the second telescopic mechanism, and is suitable for circuit boards of different sizes and types. The suction head can move linearly in the adjustment slot on the iron plate, ensuring the stability and accuracy of the suction head in different positions. Opening the electromagnetic lock can fix the position of the suction head to ensure the stability of the circuit board during the installation process. The driving motor drives the rotating disk to rotate, and the angle of the circuit board can be adjusted as needed to achieve more accurate positioning. The rotating disk can stably adjust the angle through the bearing seat, and the operation is smooth and jitter-free, reducing damage to the circuit board caused by improper operation. It is suitable for a variety of circuit boards, reduces the time for changing tools, and improves the flexibility of the overall production line. It can fine-tune the angle of the rotating disk to ensure accurate suction and positioning of circuit boards of different shapes. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 Schematic diagram of the structure of the present invention Figure 1 ;

[0015] Figure 2 Schematic diagram of the structure of the present invention Figure 2 ;

[0016] Figure 3 It is a half-section front view of the structure of the present invention;

[0017] Figure 4 It is a top view of a half-section of the structure of the present invention.

[0018] In the figure: 1. Mounting table; 2. Mounting box; 3. Support plate; 4. Bearing seat; 5. Mounting plate; 6. Rotating plate; 7. Driving motor; 8. First telescopic mechanism; 9. Gear block; 10. Gear ring; 11. Hose; 12. Second telescopic mechanism; 13. Adsorption head; 14. Iron plate; 15. Electromagnetic lock; 16. Mounting hole; 17. Heat dissipation hole. DETAILED DESCRIPTION

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0020] See also Figure 1-4The present invention is a universal suction cup device for mounting a circuit board, comprising a mounting platform 1, a mounting mechanism and a mounting box 2 being provided on the mounting platform 1, a supporting plate 3 being provided on the mounting box 2, a bearing seat 4 and a mounting plate 5 being provided on the top of the supporting plate 3, a rotating plate 6 being provided on the bearing seat 4, and the rotating plate 6 being located above the mounting plate 5, a driving motor 7 being provided inside the mounting box 2, and the output end of the driving motor 7 being connected to the rotating plate 6, a fastening groove being provided on the supporting plate 3, a first telescopic mechanism 8 being provided on the fastening groove, a tooth block 9 being provided at the output end of the first telescopic mechanism 8, a tooth ring 10 being provided at the bottom end of the rotating plate 6, the tooth ring 10 being located in the fastening groove, and the tooth block 9 being engaged with the tooth block 9. On the gear ring 10, an adsorption mechanism is provided on the rotating disk 6, and the adsorption mechanism includes a hose 11 and an adjustment slot. The adjustment slot is opened at the top of the rotating disk 6, and a second telescopic mechanism 12 is provided on the adjusting slot. A suction head 13 is provided between the output end of the second telescopic mechanism 12 and the adjusting slot, and an iron plate 14 is provided on one side of the adjusting slot. An electromagnetic lock 15 is provided between the adsorption head 13 and the iron plate 14. The hose 11 is installed on the mounting disk 5, and the hose 11 is connected to the adsorption head 13. The adsorption mechanism is provided in multiple and annular arrays. A heat dissipation mechanism is provided on the mounting box 2. In this embodiment, the mounting platform 1 is assembled on a manipulator or other equipment by using the mounting mechanism, and then Then, the circuit board is placed on the rotating disk 6, and the suction equipment is connected through the hose 11, so that the suction head 13 absorbs the surrounding air, which can make the circuit board adsorbed by the suction head 13, making it easy to assemble the circuit board and position it in the specified installation position. When assembling circuit boards of different sizes or types, the suction head 13 is moved by controlling the output end of the second telescopic mechanism 12 to move the suction head 13 linearly in the adjustment slot, so that it is convenient to adjust multiple suction heads 13 arranged in a circular array according to the size and position of the circuit board. The suction head 13 moves linearly on the iron plate 14, so that the suction head 13 moves linearly stably. After adjusting the suction head 13 to the specified position, the electromagnetic lock 15 is opened, and the electromagnetic lock 15 adsorbs the iron plate 14, thereby making the suction head 13 The attached head 13 is firmly fixed, which is convenient for adjustment according to the size and type of the circuit board. By using the output end of the first telescopic mechanism 8, the tooth block 9 is moved away from the gear ring 10. By turning on the drive motor 7, the output end of the drive motor 7 rotates the rotating disk 6. The rotating disk 6 can stably adjust the angle through the bearing seat 4, so that it is convenient to fine-tune the angle of the rotating disk 6, thereby facilitating the adjustment of the adsorption operation of circuit boards of different shapes, realizing the all-round adaptation of circuit boards for adsorption operation, and facilitating the positioning and assembly of the circuit board in the specified installation position. After adjusting the rotating disk 6 to the specified angle, the output end of the first telescopic mechanism 8 is controlled to reset, so that the tooth block 9 engages with the gear ring 10, thereby fixing the rotating disk 6, which is convenient for stable and reliable use of the rotating disk 6.

[0021] In this solution, the mounting mechanism includes a mounting hole 16, which is opened on the mounting platform 1. There are multiple mounting holes 16. The multiple mounting holes 16 opened on the mounting platform 1 facilitate the assembly of this structure onto equipment such as a robot, thereby facilitating the adsorption operation of the circuit board.

[0022] In this solution, the heat dissipation mechanism includes a heat dissipation hole 17, which is opened on the outside of the installation box 2. There are multiple heat dissipation holes 17. The multiple heat dissipation holes 17 opened on the outside of the installation box 2 facilitate heat dissipation of the drive motor 7.

[0023] In this solution, a threaded groove is provided on one side of the adjustment groove, and the second telescopic mechanism 12 is threadedly connected to the threaded groove. A bearing is provided between the output end of the second telescopic mechanism 12 and the adsorption head 13. The threaded groove is threadedly connected through the second telescopic mechanism 12, and a bearing is provided between the output end of the second telescopic mechanism 12 and the adsorption head 13. The second telescopic mechanism 12 can be threadedly assembled on the threaded groove by rotating it. The adsorption head 13 can be stably located in the adjustment groove through the bearing, which facilitates the rotation of the second telescopic mechanism 12.

[0024] In this solution, the driving motor 7 is a servo motor. The servo motor has the characteristic of high rotation accuracy, thereby improving the rotation accuracy of the driving motor 7.

[0025] In this solution, the first telescopic mechanism 8 and the second telescopic mechanism 12 are both electric telescopic rods, which have the characteristic of high movement accuracy, thereby improving the operating accuracy of the first telescopic mechanism 8 and the second telescopic mechanism 12.

[0026] In this solution, the adsorption head 13 is adapted to the adjustment groove. By adapting the adsorption head 13 to the adjustment groove, the stability of the adsorption head 13 when moving in the adjustment groove can be improved.

[0027] In this solution, a plurality of heat dissipation holes 17 are arranged in an array around the installation box 2. By arranging a plurality of heat dissipation holes 17 around the installation box 2, the heat dissipation efficiency of the drive motor 7 inside the installation box 2 can be improved.

[0028] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A universal suction cup device for mounting a circuit board, comprising a mounting platform (1), wherein the mounting platform (1) is provided with a mounting mechanism and a mounting box (2), characterized in that: The mounting box (2) is provided with a support plate (3), the top of the support plate (3) is provided with a bearing seat (4) and a mounting plate (5), the bearing seat (4) is provided with a rotating plate (6), the rotating plate (6) is located above the mounting plate (5), a driving motor (7) is provided inside the mounting box (2), the output end of the driving motor (7) is connected to the rotating plate (6), a fastening groove is provided on the support plate (3), a first telescopic mechanism (8) is provided on the fastening groove, a tooth block (9) is provided at the output end of the first telescopic mechanism (8), a tooth ring (10) is provided at the bottom end of the rotating plate (6), the tooth ring (10) is located in the fastening groove, and the tooth block (9) is engaged with the tooth ring (10). On the gear ring (10), an adsorption mechanism is provided on the rotating disk (6), the adsorption mechanism includes a hose (11) and an adjustment slot, the adjustment slot is opened at the top of the rotating disk (6), a second telescopic mechanism (12) is provided on the adjustment slot, an adsorption head (13) is provided between the output end of the second telescopic mechanism (12) and the adjustment slot, an iron plate (14) is provided on one side of the adjustment slot, an electromagnetic lock (15) is provided between the adsorption head (13) and the iron plate (14), the hose (11) is installed on the mounting disk (5), the hose (11) is connected to the adsorption head (13), a plurality of adsorption mechanisms are provided and arranged in a ring array, and a heat dissipation mechanism is provided on the mounting box (2).

2. The universal suction cup device for mounting a circuit board according to claim 1, characterized in that: The mounting mechanism comprises a mounting hole (16), the mounting hole (16) being opened on the mounting platform (1), and a plurality of the mounting holes (16) are provided.

3. The universal suction cup device for mounting a circuit board according to claim 2, characterized in that: The heat dissipation mechanism comprises a heat dissipation hole (17), the heat dissipation hole (17) is opened on the outside of the installation box (2), and a plurality of the heat dissipation holes (17) are provided.

4. The universal suction cup device for mounting a circuit board according to claim 3, characterized in that: A threaded groove is provided on one side of the adjustment groove, the second telescopic mechanism (12) is threadably connected to the threaded groove, and a bearing is provided between the output end of the second telescopic mechanism (12) and the adsorption head (13).

5. The universal suction cup device for mounting a circuit board according to claim 4, characterized in that: The driving motor (7) is a servo motor.

6. The universal suction cup device for mounting a circuit board according to claim 5, characterized in that: The first telescopic mechanism (8) and the second telescopic mechanism (12) are both electric telescopic rods.

7. The universal suction cup device for mounting a circuit board according to claim 6, characterized in that: The adsorption head (13) is adapted to the adjustment tank.

8. The universal suction cup device for mounting a circuit board according to claim 7, characterized in that: A plurality of heat dissipation holes (17) are arranged in an array around the installation box (2).

Citation Information

Patent Citations

  • Adsorption device with positioning function for circuit board and use method of adsorption device

    CN114828423A

  • Discharging device for cutting machine

    CN215702122U