A mounting device for chips of multiple sizes

Abstract

The present invention relates to the technical field of chip mounting equipment, and in particular to a mounting equipment for multi-size chips, comprising a chip mounting machine main body, an equipment seat fixedly installed in the chip mounting machine main body, a movable frame slidingly fitted on the equipment seat, a chip clamping mechanism provided on one side of the movable frame, a rotating frame rotatably connected to the chip clamping mechanism, an adjusting frame provided on the rotating frame, a chip pin repairing mechanism fixedly connected to the adjusting frame, and a chip pin correcting frame rotatably connected to the adjusting frame. Before the chip is mounted, a chip pin image is captured by a camera, deformed pins are identified by visual recognition technology, and then the deformed pins are automatically squeezed and corrected by using an upper pin repair frame and a lower pin repair frame. Deformed chip pins can be efficiently identified and repaired, which not only improves the chip mounting efficiency, but also significantly reduces quality problems caused by pin defects, thereby improving the reliability of the final product.

Description

Technical Field

[0001] The present invention relates to the technical field of chip mounting equipment, and in particular to a mounting equipment for chips of multiple sizes. Background Art

[0002] Chip placement equipment is an essential and important piece of equipment in the electronics manufacturing industry, placing chips and other components onto PCBs with high precision. Its working principle includes the following steps:

[0003] Identification and positioning: The equipment uses a camera system to identify and locate the components to be mounted, ensuring that the components are accurately placed in the predetermined position on the PCB. Suction and movement: A vacuum suction head or other mechanical device is used to pick up the chip and move it to the target position. Placement: The chip is placed on the PCB, usually using solder paste to ensure electrical connection. Inspection and correction: Some equipment has automatic detection functions that can monitor the placement quality in real time and make appropriate corrections. These devices are widely used in the production of mobile phones, computers, home appliances, and other electronic products.

[0004] Chip placement equipment primarily comes in the following types: Fully automatic placement machines: Suitable for large-scale production, they efficiently and quickly complete placement tasks. Their accuracy typically reaches micron levels. Semi-automatic placement machines: Suitable for small to medium-scale production, they are relatively simple to operate and are suitable for small batches and high-variety placement needs.

[0005] If a chip is subjected to excessive mechanical stress during installation, removal, or transportation, such as when twisting the chip with excessive force, the pins may deform. Traditional chip placement equipment cannot automatically adjust the shape of deformed pins, requiring manual intervention, increasing production time and labor costs. Existing chip placement equipment is not easy to identify and correct deformed pins on the chip, which may lead to poor contact or short circuits after placement, affecting the performance and reliability of the final product.

[0006] In summary, the prior art lacks a technology for automatically identifying and correcting deformed pins used in chip placement equipment. Summary of the Invention

[0007] The purpose of the present invention is to solve the shortcomings of the background technology and to propose a multi-size chip mounting device.

[0008] To achieve the above objectives, the technical solution adopted by the present invention is: a multi-size chip mounting equipment, including a chip mounting machine main body, an equipment seat is fixedly installed in the chip mounting machine main body, a movable frame is slidably provided on the equipment seat, a chip clamping mechanism is provided on one side of the movable frame, a rotating frame is rotatably connected to the chip clamping mechanism, an adjusting frame is provided on the rotating frame, a chip pin repair mechanism is fixedly connected to the adjusting frame, and a chip pin correction frame is rotatably connected to the adjusting frame.

[0009] Preferably, a threaded rod is rotatably connected to the equipment seat, one end of the threaded rod is fixedly connected to a motor A, the motor A is fixedly connected to the equipment seat, and the threaded rod is threadedly connected to the movable frame.

[0010] Preferably, the chip clamping mechanism includes a hydraulic rod, the hydraulic rod is connected and fixedly arranged through the movable frame, and the bottom end of the hydraulic rod is connected and fixedly arranged with a fixing seat.

[0011] Preferably, an electric push rod A is fixedly connected inside the fixing seat, and the output end of the electric push rod A is rotatably connected with two connecting rods, and the other end of the connecting rod is rotatably connected with a chip clamping rod, and the chip clamping rod is slidably matched with the fixing seat.

[0012] Preferably, the rotating frame is rotatably connected to the outer wall of the fixed seat, a driven wheel is fixedly connected to the rotating frame, a driving wheel is meshingly transmitted on one side of the driven wheel, a motor B is fixedly connected to the driving wheel, the motor B is fixedly connected to the fixed seat, and a camera is fixedly connected to the rotating frame.

[0013] Preferably, an electric push rod B is fixedly connected to one end of the adjustment frame, the electric push rod B is fixedly connected to the rotating frame, and two sliding grooves are provided on the adjustment frame.

[0014] Preferably, the chip pin repair mechanism includes an electric push rod C, which is fixedly connected to the adjustment frame, and a pin repair frame is fixedly connected to the electric push rod C, and a transmission rack is fixedly connected to the pin repair frame, and two guide rods are fixedly connected to the bottom of the pin repair frame.

[0015] Preferably, a rotating rod is provided on the lower side of the guide rod, and the rotating rod is rotatably connected to the adjusting frame. A guide groove is provided on the rotating rod, and the inner wall of the guide groove is slidingly matched with one end of the guide rod. The other end of the rotating rod is connected and fixedly provided with a push rod, and a pin lower repair frame is provided with sliding contact between the two push rods. Two sliding rods are connected and fixedly provided on one side of the pin lower repair frame, and the other end of the sliding rod is slidingly matched with the slide groove. A plurality of tension springs are connected and fixedly provided on the bottom of the pin lower repair frame, and the other end of the tension spring is fixedly connected to the adjusting frame.

[0016] Preferably, a worm gear is fixedly provided at one end of the chip pin correction frame, a worm is meshingly provided on the worm gear, the worm is rotatably connected to the adjustment frame, a universal joint is fixedly provided at one end of the worm, the other end of the universal joint is rotatably connected to the adjustment frame, a transmission wheel is fixedly provided on the universal joint, and the transmission wheel is meshingly provided with a transmission rack for transmission.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. Before chip placement, the chip pin image is captured by a camera, and deformed pins are identified using visual recognition technology. The upper and lower pin repair frames are then used to automatically squeeze and correct the deformed pins. This allows for efficient identification and repair of deformed chip pins, improving chip placement efficiency while significantly reducing quality issues caused by pin defects, thereby enhancing the reliability of the final product.

[0019] 2. While the chip pin repair mechanism is being used to repair the chip pins, the chip pin correction frame will be driven to swing, so that the chip pin correction frame can align and correct the chip pins with angle deviations, which can further effectively repair and align the deformed pins, thereby improving the accuracy and efficiency of chip placement.

[0020] 3. By setting up two adjustable chip clamping rods, the equipment can be convenient for mounting chips of various sizes, improving the practicality of the device. At the same time, by setting up a rotating frame, it is convenient to identify and correct the pins around the chip, thereby improving the efficiency of identification and correction. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the overall structure of a multi-size chip mounting device according to the present invention;

[0022] Figure 2 This is a schematic diagram of the structure of a device base and other components of a multi-size chip placement device according to the present invention;

[0023] Figure 3 This is a partial structural diagram of a multi-size chip mounting device according to the present invention;

[0024] Figure 4 This is a schematic diagram of the structure of a device base for mounting equipment for multi-size chips of the present invention;

[0025] Figure 5 This is a schematic structural diagram of a chip clamping mechanism of a multi-size chip placement device according to the present invention;

[0026] Figure 6 This is a schematic diagram of the structure of a rotating frame of a multi-size chip placement device according to the present invention;

[0027] Figure 7 This is a schematic structural diagram of an adjustment frame and a chip pin correction frame for a multi-size chip placement device of the present invention;

[0028] Figure 8 The present invention is a schematic diagram of the chip pin repair mechanism of a multi-size chip placement device.

[0029] 1. Chip placement machine body; 2. Equipment base; 3. Moving frame; 4. Chip clamping mechanism; 5. Rotating frame; 6. Adjusting frame; 7. Chip pin repair mechanism; 8. Chip pin correction frame; 201. Threaded rod; 202. Motor A; 401. Hydraulic rod; 402. Fixed seat; 403. Electric push rod A; 404. Connecting rod; 405. Chip clamping rod; 501. Driven pulley; 502. Driving pulley; 503. Motor B; 504, camera; 601, electric push rod B; 602, slide; 701, electric push rod C; 702, pin upper repair frame; 703, transmission rack; 704, guide rod; 705, rotating rod; 706, guide groove; 707, push rod; 708, pin lower repair frame; 709, slide; 710, tension spring; 801, worm gear; 802, worm; 803, universal joint; 804, transmission wheel. DETAILED DESCRIPTION

[0030] The following description is intended to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are merely examples, and those skilled in the art may conceive of other obvious variations.

[0031] like Figures 1-8 The shown embodiment is a multi-size chip mounting device, comprising a chip mounting machine body 1, in which an equipment seat 2 is fixedly installed, a movable frame 3 is slidably provided on the equipment seat 2, a chip clamping mechanism 4 is provided on one side of the movable frame 3, a rotating frame 5 is rotatably connected to the chip clamping mechanism 4, an adjusting frame 6 is provided on the rotating frame 5, a chip pin repair mechanism 7 is fixedly connected to the adjusting frame 6, and a chip pin correction frame 8 is rotatably provided on the adjusting frame 6.

[0032] like Figure 4As shown, a threaded rod 201 is rotatably connected to the equipment base 2, and a motor A202 is fixedly connected to one end of the threaded rod 201. The motor A202 is fixedly connected to the equipment base 2, and the threaded rod 201 is threadedly connected to the mobile frame 3. The motor A202 drives the threaded rod 201 to rotate, thereby driving the mobile frame 3 to move.

[0033] like Figure 5 As shown, the chip clamping mechanism 4 includes a hydraulic rod 401 , which is connected and fixed to the movable frame 3 , and a fixing seat 402 is fixedly connected to the bottom end of the hydraulic rod 401 .

[0034] An electric push rod A403 is fixedly connected to the fixed seat 402. The output end of the electric push rod A403 is rotatably connected to two connecting rods 404. The other end of the connecting rod 404 is rotatably connected to a chip clamping rod 405. The chip clamping rod 405 is slidably matched with the fixed seat 402. The electric push rod A403 drives the chip clamping rod 405 connected by the two connecting rods 404 to move and clamp the chip.

[0035] like Figure 6 As shown, the rotating frame 5 is rotatably connected to the outer wall of the fixed base 402. A driven wheel 501 is fixedly connected to the rotating frame 5. A driving wheel 502 is meshed and driven on one side of the driven wheel 501. A motor B503 is fixedly connected to the driving wheel 502. The motor B503 is fixedly connected to the fixed base 402. A camera 504 is fixedly connected to the rotating frame 5. The driving wheel 502 is driven by the motor B503 to rotate, which in turn drives the rotating frame 5 connected to the driven wheel 501 to rotate. This allows the camera 504 on the rotating frame 5 to capture images of the pins at various locations on the chip and identify deformed pins using visual recognition technology.

[0036] like Figure 7 As shown, one end of the adjustment frame 6 is connected and fixedly provided with an electric push rod B601, which is fixedly connected to the rotating frame 5, and two sliding grooves 602 are provided on the adjustment frame 6. The electric push rod B601 is used to drive the adjustment frame 6 to move close to the deformed pin.

[0037] like Figure 8 As shown, the chip pin repair mechanism 7 includes an electric push rod C701, which is fixedly connected to the adjustment frame 6. The electric push rod C701 is fixedly connected to the pin upper repair frame 702, and the pin upper repair frame 702 is fixedly connected to the transmission rack 703. The bottom of the pin upper repair frame 702 is fixedly connected to two guide rods 704. The electric push rod C701 drives the pin upper repair frame 702 to move closer to the upper side of the pin, and at the same time, the pin upper repair frame 702 slides on the inner wall of the guide groove 706 through the connected guide rods 704.

[0038] A rotating rod 705 is provided on the lower side of the guide rod 704. The rotating rod 705 is rotatably connected to the adjustment frame 6. A guide groove 706 is provided on the rotating rod 705. The inner wall of the guide groove 706 is slidably engaged with one end of the guide rod 704. A push rod 707 is fixedly connected to the other end of the rotating rod 705. A lower pin repair frame 708 is provided between the two push rods 707 in sliding contact. Two sliding rods 709 are fixedly connected to one side of the lower pin repair frame 708. The other ends of the sliding rods 709 are slidably engaged with the slide groove 602. A plurality of tension springs 710 are fixedly connected to the bottom of the lower pin repair frame 708. The other ends of the tension springs 710 are fixedly connected to the adjustment frame 6. The guide rod 704 slides on the inner wall of the guide groove 706, thereby driving the rotating rod 705 to rotate. The rotating rod 705 drives the connected push rod 707 to rotate, lifting the lower pin repair frame 708, and cooperating with the upper pin repair frame 702 to squeeze and correct the pin. The tension spring 710 will drive the pin lower repair frame 708 to move downward and reset, and the slide bar 709 realizes the stable movement of the pin lower repair frame 708. The guide groove 706 is set with a spiral structure at one end and a straight structure at the other end.

[0039] like Figure 7 As shown, a worm gear 801 is fixedly provided at one end of the chip pin correction frame 8, a worm 802 is meshingly provided on the worm gear 801, and the worm gear 802 is rotatably connected to the adjustment frame 6. A universal joint 803 is fixedly provided at one end of the worm gear 802, and the other end of the universal joint 803 is rotatably connected to the adjustment frame 6. A transmission wheel 804 is fixedly provided on the universal joint 803, and the transmission wheel 804 is meshingly provided with the transmission rack 703. When the repair frame 702 moves on the pin, the transmission rack 703 drives the transmission wheel 804 to rotate, so that the transmission wheel 804 drives the universal joint 803 to rotate. At this time, the universal joint 803 drives the worm gear 802 to rotate, so that the worm gear 802 drives the chip pin correction frame 8 connected to the worm gear 801 to rotate, so as to align and correct the pins with angular offset.

[0040] Working principle: When mounting a chip, the motor A202 is first used to drive the threaded rod 201 to rotate, thereby driving the movable frame 3 to move, and then the electric push rod A403 is used to drive the chip clamping rod 405 connected by the two connecting rods 404 to move and clamp the chip;

[0041] Then, the motor B503 is used to drive the driving wheel 502 to rotate, so that the driving wheel 502 drives the rotating frame 5 connected to the driven wheel 501 to rotate, so that the camera 504 on the rotating frame 5 can collect images of the pins at various positions of the chip and identify the deformed pins through visual recognition technology;

[0042] When a deformed pin is identified, the electric push rod B601 is used to drive the adjustment frame 6 to move close to the deformed pin, and then the electric push rod C701 is used to drive the pin upper repair frame 702 to move close to the upper side of the pin. At the same time, the pin upper repair frame 702 will slide on the inner wall of the guide groove 706 through the connected guide rod 704, thereby driving the rotating rod 705 to rotate, so that the rotating rod 705 drives the connected ejector rod 707 to rotate, and lifts the pin lower repair frame 708, and cooperates with the pin upper repair frame 702 to squeeze and correct the pin;

[0043] At the same time, when the repair frame 702 on the pin moves, the transmission rack 703 connected thereto will drive the transmission wheel 804 to rotate, causing the transmission wheel 804 to drive the universal joint 803 to rotate. At this time, the universal joint 803 will drive the connected worm 802 to rotate, causing the worm 802 to drive the chip pin correction frame 8 connected to the worm wheel 801 to rotate, and align and correct the pins with angle offset. After the chip pins are corrected, the hydraulic rod 401 is used to drive the chip to move down for mounting.

[0044] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions merely illustrate the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip placement device for multiple sizes, comprising a chip placement machine body (1), characterized in that: An equipment seat (2) is fixedly installed in the chip mounting machine body (1), a movable frame (3) is slidably provided on the equipment seat (2), a chip clamping mechanism (4) is provided on one side of the movable frame (3), a rotating frame (5) is rotatably connected to the chip clamping mechanism (4), a driven wheel (501) is fixedly provided on the rotating frame (5), a driving wheel (502) is meshed and driven on one side of the driven wheel (501), a motor B (503) is fixedly provided on the driving wheel (502), the motor B (503) is fixedly provided on the fixed seat (402), and the rotating frame (5) is fixedly provided. A camera (504) is provided, an adjusting frame (6) is provided on the rotating frame (5), a chip pin repair mechanism (7) is connected and fixedly provided on the adjusting frame (6), the chip pin repair mechanism (7) comprises an electric push rod C (701), the electric push rod C (701) is connected and fixedly provided with the adjusting frame (6), a pin upper repair frame (702) is connected and fixedly provided on the electric push rod C (701), a transmission rack (703) is connected and fixedly provided on the pin upper repair frame (702), two guide rods (704) are connected and fixedly provided at the bottom of the pin upper repair frame (702), and a rotating rod (703) is provided on the lower side of the guide rod (704). 05), the rotating rod (705) is rotatably connected to the adjustment frame (6), the rotating rod (705) is provided with a guide groove (706), the inner wall of the guide groove (706) is slidably matched with one end of the guide rod (704), the other end of the rotating rod (705) is connected and fixed with a top rod (707), and a pin lower repair frame (708) is provided between the two top rods (707) in sliding contact, one side of the pin lower repair frame (708) is connected and fixed with two sliding rods (709), and the bottom of the pin lower repair frame (708) is connected and fixed with multiple tension springs (710), and the other end of the tension spring (710) is connected to the adjustment frame (6 ) is connected and fixedly arranged, a chip pin correction frame (8) is rotatably connected to the adjustment frame (6), one end of the chip pin correction frame (8) is connected and fixedly arranged with a worm wheel (801), a worm (802) is meshingly arranged on the worm wheel (801), the worm (802) is rotatably connected to the adjustment frame (6), one end of the worm (802) is connected and fixedly arranged with a universal joint (803), the other end of the universal joint (803) is rotatably connected to the adjustment frame (6), a transmission wheel (804) is connected and fixedly arranged on the universal joint (803), and the transmission wheel (804) is meshingly arranged with the transmission rack (703).

2. The multi-size chip placement device according to claim 1, characterized in that: A threaded rod (201) is rotatably connected to the equipment seat (2), one end of the threaded rod (201) is fixedly connected to a motor A (202), the motor A (202) is fixedly connected to the equipment seat (2), and the threaded rod (201) is threadedly connected to the mobile frame (3).

3. The multi-size chip placement equipment according to claim 1, characterized in that: The chip clamping mechanism (4) comprises a hydraulic rod (401), the hydraulic rod (401) is connected and fixedly arranged through the movable frame (3), and the bottom end of the hydraulic rod (401) is connected and fixedly arranged with a fixing seat (402).

4. The multi-size chip placement device according to claim 3, characterized in that: An electric push rod A (403) is fixedly connected inside the fixing seat (402), and the output end of the electric push rod A (403) is rotatably connected to two connecting rods (404), and the other end of the connecting rod (404) is rotatably connected to a chip clamping rod (405), and the chip clamping rod (405) is slidably matched with the fixing seat (402).

5. The multi-size chip placement equipment according to claim 3, characterized in that: The rotating frame (5) is rotatably connected to the outer wall of the fixing seat (402).

6. The multi-size chip placement equipment according to claim 1, characterized in that: One end of the adjustment frame (6) is connected and fixedly provided with an electric push rod B (601), and the electric push rod B (601) is connected and fixedly provided with the rotating frame (5). Two sliding grooves (602) are provided on the adjustment frame (6), and the inner wall of the sliding groove (602) is slidably matched with the sliding rod (709).

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