Electronic equipment cooling base

Abstract

The present invention relates to a heat dissipation base of an electronic device, comprising a bracket, on which a heat dissipation component is arranged; the heat dissipation component comprises a circular bottom plate, a circular top plate and a cylindrical side plate, the top plate is arranged at the upper end of the side plate, the bottom plate is arranged at the lower end of the side plate, and the bottom plate, the side plate and the top plate surround a closed heat dissipation cavity; the inner wall of the top plate is provided with a first capillary structure layer, the inner wall of the side plate is provided with a second capillary structure layer, the second capillary structure layer is connected to the first capillary structure layer, and the heat dissipation cavity is filled with a working medium; a rotating shaft perpendicular to the bottom plate is arranged at the center of the bottom plate, a plurality of radially extending fan blades are arranged on the rotating shaft, the rotating shaft is connected to a driving mechanism for driving the rotating shaft to rotate, and when the fan blades rotate, the gas between two adjacent fan blades is driven to flow to the side plate. The present invention adopts the side plate as the cooling end, and the working medium flows directly from the side plate to the top plate after liquefaction, and the flow path is shorter, thereby saving the reflux time and shortening the working medium circulation time, so that the heat dissipation efficiency can be improved.

Description

Technical Field

[0001] The invention belongs to the technical field of heat dissipation, in particular to a heat dissipation base for electronic equipment. Background Art

[0002] Electronic devices, such as routers, laptops, and servers, generate heat when in operation, causing the temperature of various components inside the electronic devices to rise, affecting performance. In order to promote the heat dissipation of electronic devices, the electronic devices can be placed on a heat dissipation base. Traditional heat dissipation bases usually use air cooling, which is less efficient. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a heat dissipation base for an electronic device with high heat dissipation efficiency.

[0004] In order to solve the above problems, the technical solution adopted by the present invention is as follows: an electronic equipment heat dissipation base comprises a bracket, on which a heat dissipation component is arranged;

[0005] The heat dissipation assembly includes a circular bottom plate, a circular top plate and a cylindrical side plate, wherein the top plate is arranged at the upper end of the side plate, and the bottom plate is arranged at the lower end of the side plate, and the bottom plate, the side plate and the top plate form a closed heat dissipation cavity;

[0006] The inner wall of the top plate is provided with a first capillary structure layer, the inner wall of the side plate is provided with a second capillary structure layer, the second capillary structure layer is connected to the first capillary structure layer, and the heat dissipation cavity is filled with a working medium;

[0007] A rotating shaft perpendicular to the bottom plate is arranged at the center of the bottom plate, a plurality of radially extending fan blades are arranged on the rotating shaft, and the rotating shaft is connected to a driving mechanism for driving the rotating shaft to rotate. When the fan blades rotate, the gas between two adjacent fan blades is driven to flow to the side plate.

[0008] Furthermore, a cooling jacket is provided on the outside of the side plate, an annular cooling cavity is provided between the cooling jacket and the side plate, the cooling cavity is provided with an air inlet and an air outlet, and the air inlet is connected to a fan.

[0009] Furthermore, the bottom plate is rotatably matched with the lower ends of the side plates, the rotating shaft is fixedly connected to the bottom plate, and the upper ends of the side plates are fixedly connected to the cooling jacket; the driving mechanism includes an annular extension plate fixedly arranged on the edge of the bottom plate, the annular extension plate extends into the cooling jacket and cooperates with the gap of the bottom wall of the cooling jacket, a plurality of driving plates perpendicular to the extension plates are fixedly arranged on the upper surface of the extension plate, one side edge of the driving plate cooperates with the gap of the outer wall of the side plate, the other side edge of the driving plate cooperates with the gap of the inner wall of the cooling jacket, and the top edge of the driving plate cooperates with the gap of the top wall of the cooling jacket; the air inlet direction of the air inlet is perpendicular to the radial direction of the cooling jacket.

[0010] Furthermore, a thermally conductive silicone layer is provided on the upper surface of the top plate.

[0011] Furthermore, the working fluid is pure water.

[0012] Furthermore, a plurality of arc-shaped conveying strips are arranged in the heat dissipation cavity, and a third capillary structure layer is arranged on both side walls of the conveying strips, the lower end of the conveying strips is connected to the side walls of the side plates, the upper end of the conveying strips is connected to the center position of the top plate, and the third capillary structure layer at the lower end of the conveying strips is connected to the second capillary structure layer, and the third capillary structure layer at the upper end of the conveying strips is connected to the first capillary structure layer.

[0013] Furthermore, the conveying bar, the top plate and the side plate are copper plates, and the third capillary structure layer, the second capillary structure layer and the first capillary structure layer are sintered from a mixed powder of copper powder and tin powder.

[0014] Furthermore, there are multiple heat dissipation components.

[0015] The beneficial effects of the present invention are as follows: the present invention uses a plate-type heat pipe composed of a bottom plate, a side plate and a top plate to dissipate heat from electronic equipment, and utilizes the phase change of the working fluid in the heat pipe to transfer heat, with higher transmission efficiency.

[0016] Conventional plate-type heat pipes have a capillary structure layer set on the entire inner wall. Usually, the top plate is used as the heat-absorbing end and the bottom plate is used as the cooling end. The heat-absorbing end contacts the component that needs to dissipate heat, and the heat is transferred to the top plate, causing the working fluid in the capillary structure layer on the inner wall of the top plate to evaporate and absorb heat. The gaseous working fluid flows to the bottom plate, is pre-cooled and liquefied, and then flows to the top plate again under the action of the capillary structure layer to realize the circulation of the working fluid. Since there is a certain distance between the bottom plate and the top plate, the liquefied working fluid needs to move to the side plate first, and then move to the top plate along the capillary structure layer of the side plate. The movement path is long, resulting in a long reflux time for the liquid working fluid and a slow circulation speed, which in turn affects the heat dissipation efficiency.

[0017] Since the forming process of the capillary structure layer is relatively complicated, time-consuming and costly, the plate-type heat pipe of the present invention does not set the capillary structure layer on the inner wall of the bottom plate, thereby reducing the area of ​​the capillary structure layer on the inner wall of the plate-type heat pipe, thereby reducing the manufacturing cost and improving the manufacturing efficiency.

[0018] The plate-type heat pipe of the present invention uses the top plate as the heat absorption end and the side plate as the cooling end. By arranging fan blades inside, when the electronic device is cooled, the driving mechanism is used to drive the rotating shaft and the fan blades to rotate, and the top plate transfers heat to the first capillary structure layer. After the working medium in the first capillary structure layer is vaporized, it can quickly move to the side plate under the action of the fan blades, and is cooled and liquefied at the side plate, and then moves upward along the second capillary structure layer to the first capillary structure layer to achieve circulation. Since the present invention uses the side plate as the cooling end, the working medium flows directly from the side plate to the top plate after liquefaction, and the flow path is shorter, thereby saving the reflux time and shortening the working medium circulation time, so as to improve the heat dissipation efficiency. In addition, the fan blades also speed up the flow speed of the gaseous working medium and shorten the time for the working medium to flow to the cooling end after vaporization. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a top cross-sectional schematic diagram of the present invention;

[0020] Figure 2 yes Figure 1 A magnified schematic diagram of part A;

[0021] Figure 3 yes Figure 2 A schematic cross-sectional view of the middle BB;

[0022] Figure numerals: 1—bracket; 2—bottom plate; 3—top plate; 4—side plate; 5—first capillary structure layer; 6—second capillary structure layer; 7—rotating shaft; 8—fan blades; 9—cooling jacket; 10—air inlet; 11—air outlet; 12—fan; 13—annular extension plate; 14—driving plate; 15—thermal conductive silicone layer; 19—conveying bar; 20—third capillary structure layer. DETAILED DESCRIPTION

[0023] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0024] The electronic equipment heat dissipation base of the present invention is as follows Figures 1 to 3 As shown, it includes a bracket 1, and a heat dissipation component is arranged on the bracket 1. The bracket 1 is used to support the heat dissipation component and the electronic equipment, and various suitable frame structures can be used.

[0025] The heat dissipation assembly includes a circular bottom plate 2, a circular top plate 3 and a cylindrical side plate 4, the top plate 3 is arranged at the upper end of the side plate 4, the bottom plate 2 is arranged at the lower end of the side plate 4, and the bottom plate 2, the side plate 4 and the top plate 3 form a closed heat dissipation cavity.

[0026] The inner wall of the top plate 3 is provided with a first capillary structure layer 5, and the inner wall of the side plate 4 is provided with a second capillary structure layer 6. The second capillary structure layer 6 is connected to the first capillary structure layer 5. The heat dissipation cavity is filled with a working medium, and the working medium is pure water. The pure water is absorbed by the second capillary structure layer 6 and the first capillary structure layer 5 and stored in the second capillary structure layer 6 and the first capillary structure layer 5.

[0027] A rotating shaft 7 perpendicular to the bottom plate 2 is provided at the center of the bottom plate 2, and a plurality of radially extending fan blades 8 are provided on the rotating shaft 7. The fan blades 8 are rectangular and can be made of plastic or metal sheets. There is a gap between the upper end of the fan blade 8 and the top plate 3, and there is a gap between the lower end of the fan blade 8 and the bottom plate 2. One side of the fan blade 8 is fixedly connected to the rotating shaft 7, and there is a gap between the other side and the side plate 4. The rotating shaft 7 is connected to a driving mechanism for driving the rotating shaft 7 to rotate. When the rotating shaft 7 rotates, each fan blade 8 is driven to rotate. When the fan blade 8 rotates, the gas between two adjacent fan blades 8 is driven to flow to the side plate 4.

[0028] In the present invention, the bottom plate 2, the side plate 4 and the top plate 3 form a plate-type heat pipe, which transfers heat through the phase change cycle of the working fluid. Compared with fan heat dissipation, the heat dissipation efficiency is higher.

[0029] Compared with traditional plate-type heat pipes, the plate-type heat pipe of the present invention does not have a capillary structure layer on the upper surface of the base plate 2. Since the forming process of the capillary structure layer is relatively complicated, time-consuming, and costly, the present invention reduces the area of ​​the capillary structure layer under the same volume, thereby reducing manufacturing costs and improving manufacturing efficiency.

[0030] In addition, the plate-type heat pipe of the present invention uses the top plate 3 as the heat absorption end and the side plate 4 as the cooling end. By arranging the fan blades 8 inside, when the electronic device is cooled, the driving mechanism is used to drive the rotating shaft 7 and the fan blades 8 to rotate, and the top plate 3 transfers the heat to the first capillary structure layer 5. After the working medium in the first capillary structure layer 5 is vaporized, it can quickly move to the side plate 4 under the action of the fan blades 8, and cool and liquefy at the side plate 4, and then move upward along the second capillary structure layer 6 to the first capillary structure layer 5 to achieve circulation. Since the present invention uses the side plate 4 as the cooling end, the working medium flows directly from the side plate 4 to the top plate 3 after liquefaction, and the flow path is shorter, thereby saving the reflux time and shortening the working medium circulation time, so the heat dissipation efficiency can be improved. In addition, the fan blades 8 also speed up the flow speed of the gaseous working medium and shorten the time for the working medium to flow to the cooling end after vaporization.

[0031] In order to reduce the temperature of the side plate 4 and promote the rapid cooling and liquefaction of the gaseous working medium in the second capillary structure layer 6, the present invention is provided with a cooling jacket 9 on the outside of the side plate 4. The cooling jacket 9 includes a cylindrical sleeve, a circular upper plate is fixedly provided at the upper end of the sleeve, and a circular lower plate is fixedly provided at the lower end of the sleeve. An annular cooling cavity is provided between the cooling jacket 9 and the side plate 4. The cooling cavity is provided with an air inlet 10 and an air outlet 11. The air inlet 10 is connected to a fan 12. The fan 12 can transport the cold air from the outside to the cooling cavity through the air inlet 10. The cold air moves along the cooling cavity, takes away the heat of the side plate 4, reduces the temperature of the side plate 4, and ensures that the gaseous working medium is quickly liquefied when it moves to the side plate 4. The position of the air outlet 11 is close to the position of the air inlet 10, and the air inlet direction of the air inlet 10 is opposite to the air outlet 11, ensuring that the cold air flows to the air outlet 11 and is discharged after moving along the cooling cavity for nearly a circle.

[0032] The driving mechanism can be a motor, and the rotating shaft 7 is rotatably matched with the bottom plate 2. The motor is arranged below the bottom plate 2 and connected to the rotating shaft 7, and is used to drive the rotating shaft 7 to rotate. When the motor is running, it consumes electric energy, resulting in an increase in the energy consumption of the entire heat dissipation base. In addition, the purchase cost of the motor is high, which increases the overall cost of the heat dissipation base.

[0033] In order to reduce energy consumption and cost, in the present invention, the bottom plate 2 is rotatably matched with the lower end of the side plate 4, that is, when the side plate 4 is fixed, the bottom plate 2 can rotate around its own center. The rotating shaft 7 is fixedly connected to the bottom plate 2, and when the bottom plate 2 rotates, the rotating shaft 7 and the fan blades 8 can be driven to rotate synchronously. The upper end of the side plate 4 is fixedly connected to the cooling jacket 9, and when the bottom plate 2 rotates, the side plate 4 and the top plate 3 can remain fixed. The driving mechanism includes an annular extension plate 13 fixedly set on the edge of the bottom plate 2, the annular extension plate 13 can be integrally formed with the bottom plate 2, the annular extension plate 13 extends into the cooling jacket 9 and cooperates with the bottom wall gap of the cooling jacket 9, and the upper surface of the annular extension plate 13 is fixedly provided with a plurality of drive plates 14 perpendicular to the annular extension plate 13, and the drive plate 14 is a rectangular plate, and the plurality of drive plates 14 are evenly distributed around the side plate 4. One side of the driving plate 14 is matched with the gap of the outer wall of the side plate 4, the other side of the driving plate 14 is matched with the gap of the inner wall of the cooling jacket 9, and the top side of the driving plate 14 is matched with the gap of the top wall of the cooling jacket 9, so as to ensure that the driving plate 14 and the bottom plate 2 can rotate synchronously. The air inlet direction of the air inlet 10 is perpendicular to the radial direction of the cooling jacket 9, that is, the air inlet direction is perpendicular to the driving plate 14. When the cold air from the outside enters the cooling chamber through the air inlet 10, the cold air moves to the driving plate 14. Since the cold air has a certain kinetic energy, it can drive the driving plate 14 to rotate. The rotation center is the center of the bottom plate 2. When the driving plate 14 rotates, it can drive the bottom plate 2 to rotate, and the bottom plate 2 drives the rotating shaft 7 and the fan blades 8 to rotate, thereby driving the gaseous working medium between the fan blades 8 to flow to the inner wall of the side plate 4.

[0034] In the present invention, only one power device, the fan 12, is required to cool the side plate 4, and at the same time, the gaseous working medium in the plate-type heat pipe can flow quickly to the side plate 4, thereby improving the heat dissipation efficiency. At the same time, the manufacturing cost and operating energy consumption of the entire heat dissipation base are relatively low.

[0035] In order to ensure that the electronic device can transfer heat to the top plate 3 quickly and effectively, the present invention is provided with a thermally conductive silicone layer 15 on the upper surface of the top plate 3. The thermally conductive silicone layer 15 is flexible. After the electronic device is placed on the thermally conductive silicone layer 15, under the action of its own gravity, the lower surface of the electronic device can be tightly attached to the thermally conductive silicone layer 15, thereby quickly transferring heat to the thermally conductive silicone layer 15. The thermally conductive silicone layer 15 has good thermal conductivity, so the thermally conductive silicone layer 15 can quickly transfer heat to the top plate 3, thereby ensuring the heat dissipation effect of the electronic device.

[0036] The liquid working medium in the second capillary structure layer 6 must first flow to the first capillary structure layer 5 at the edge of the top plate 3, and then flow along the first capillary structure layer 5 to the center area of ​​the top plate 3. The flow path is long, resulting in more liquid working medium at the edge of the top plate 3, and less liquid working medium at the center, and the liquid working medium is unevenly distributed. In order to allow the liquid working medium in the second capillary structure layer 6 to flow to the edge and center area of ​​the top plate 3 more evenly, the present invention is provided with a plurality of arc-shaped conveying strips 19 in the heat dissipation cavity, and the conveying strips 19 are evenly distributed around the center line of the side plate 4. The two side walls of the conveying strip 19 are provided with a third capillary structure layer 20, the lower end of the conveying strip 19 is connected to the side wall of the side plate 4, and the upper end of the conveying strip 19 is connected to the center position of the top plate 3, and the third capillary structure layer 20 at the lower end of the conveying strip 19 is connected to the second capillary structure layer 6, and the third capillary structure layer 20 at the upper end of the conveying strip 19 is connected to the first capillary structure layer 5. After the gaseous working medium is liquefied in the second capillary structure layer 6, part of it flows to the first capillary structure layer 5 at the edge of the top plate 3 through the second capillary structure layer 6, and part of it flows to the first capillary structure layer 5 at the center of the top plate 3 through the third capillary structure layer 20. The conveying strip 19 can shorten the distance from the side plate 4 to the center area of ​​the top plate 3, so that the liquid working medium can move to the center area of ​​the top plate 3 faster, so that the distribution of the liquid working medium in each area of ​​the top plate 3 is more balanced.

[0037] In the present invention, the conveying bar 19, the top plate 3 and the side plate 4 are copper plates, and the third capillary structure layer 20, the second capillary structure layer 6 and the first capillary structure layer 5 are sintered from a mixed powder of copper powder and tin powder.

[0038] The specific sintering process is:

[0039] 1. Evenly mix copper powder and tin powder to obtain mixed powder, wherein the particle size ratio of copper powder to tin powder is 1: (0.2-0.5), and the weight ratio of copper powder to tin powder is 9: (0.9-3). A vacuum agitator can be used to stir and mix the copper powder and tin powder to prevent the copper powder from being oxidized.

[0040] 2. Spray the mixed powder evenly onto the two side surfaces of the conveying bar 19, the inner wall of the top plate 3 and the inner wall of the side plate 4.

[0041] 3. Sinter the conveyor bar 19, the top plate 3 and the side plate 4 at a sintering temperature of 235°C to 250°C. The tin powder in the mixed powder melts and connects the copper powder together. Sintering is performed in an inert gas atmosphere or a reducing gas atmosphere to prevent the copper powder from being oxidized. After sintering, cool the conveyor bar 19, the top plate 3 and the side plate 4 to room temperature.

[0042] Conventional capillary structure layers are usually sintered with pure copper powder. During the sintering process, the copper powder needs to be heated to a temperature slightly lower than the melting point of the copper powder so that the copper powder softens and adheres to each other, thereby forming a stable capillary structure layer. Since the melting point of copper powder is about 1083°C, the heat pipe and copper powder usually need to be heated to about 900°C during sintering. The sintering temperature is high and the energy consumption is high. Tin is a low melting point metal that will not be oxidized in the air and is commonly used for welding and connecting electronic components made of non-ferrous metal materials such as copper, silver, and tin. In the present invention, an appropriate amount of tin powder is mixed into the copper powder. Tin has the characteristics of welding copper materials, so melted tin is used to connect the metal powders together to form a stable capillary structure layer. Since the melting point of tin is about 231.89°C, which is much lower than the melting point of copper, it only needs to be heated to 235 to 250°C during sintering. The sintering temperature is greatly reduced compared to the traditional 900°C, thereby reducing the energy consumption of sintering. In addition, since the sintering temperature is lowered, the temperature can be raised to the sintering temperature in a shorter time, and after sintering, it can be cooled to room temperature faster, so the sintering efficiency is also improved.

[0043] In the present invention, the heat dissipation component can be one, that is, the plate-type heat pipe is one, or the heat dissipation component can be set to multiple according to the heat dissipation requirements, for example, two, three or four heat dissipation components are set, so that multiple locations with high heat generation of the electronic device can be cooled. When multiple heat dissipation components are set, only one fan 12 can be set, and the fan 12 is connected to the air inlet 10 of each heat dissipation component through an air supply duct.

[0044] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An electronic equipment heat dissipation base, comprising a bracket (1), wherein a heat dissipation component is arranged on the bracket (1); characterized in that: The heat dissipation assembly comprises a circular bottom plate (2), a circular top plate (3) and a cylindrical side plate (4), wherein the top plate (3) is arranged at the upper end of the side plate (4), and the bottom plate (2) is arranged at the lower end of the side plate (4), and the bottom plate (2), the side plate (4) and the top plate (3) form a closed heat dissipation cavity; The inner wall of the top plate (3) is provided with a first capillary structure layer (5), the inner wall of the side plate (4) is provided with a second capillary structure layer (6), the second capillary structure layer (6) is connected to the first capillary structure layer (5), and the heat dissipation cavity is filled with a working medium; A rotating shaft (7) perpendicular to the bottom plate (2) is arranged at the center of the bottom plate (2); a plurality of radially extending fan blades (8) are arranged on the rotating shaft (7); the rotating shaft (7) is connected to a driving mechanism for driving the rotating shaft (7) to rotate; when the fan blades (8) rotate, the gas between two adjacent fan blades (8) is driven to flow to the side plate (4); A cooling jacket (9) is provided on the outside of the side plate (4), an annular cooling cavity is provided between the cooling jacket (9) and the side plate (4), the cooling cavity is provided with an air inlet (10) and an air outlet (11), and the air inlet (10) is connected to a fan (12); The bottom plate (2) and the lower end of the side plate (4) are rotatably matched, the rotating shaft (7) is fixedly connected to the bottom plate (2), and the upper end of the side plate (4) is fixedly connected to the cooling jacket (9); the driving mechanism comprises an annular extension plate (13) fixedly arranged on the edge of the bottom plate (2), the annular extension plate (13) extends into the cooling jacket (9) and is gap matched with the bottom wall of the cooling jacket (9), and a plurality of driving plates (14) perpendicular to the extension plate (13) are fixedly arranged on the upper surface of the extension plate (13), one side edge of the driving plate (14) is gap matched with the outer wall of the side plate (4), the other side edge of the driving plate (14) is gap matched with the inner wall of the cooling jacket (9), and the top edge of the driving plate (14) is gap matched with the top wall of the cooling jacket (9); the air inlet direction of the air inlet (10) is perpendicular to the radial direction of the cooling jacket (9).

2. The electronic device heat dissipation base according to claim 1, characterized in that: A heat-conducting silica gel layer (15) is provided on the upper surface of the top plate (3).

3. The electronic equipment heat dissipation base according to claim 1, characterized in that: The working fluid is pure water.

4. The electronic device heat dissipation base according to claim 1, characterized in that: A plurality of arc-shaped conveying strips (19) are arranged in the heat dissipation cavity, and third capillary structure layers (20) are arranged on both side walls of the conveying strips (19). The lower end of the conveying strips (19) is connected to the side wall of the side plate (4), and the upper end of the conveying strips (19) is connected to the center position of the top plate (3). The third capillary structure layer (20) at the lower end of the conveying strips (19) is connected to the second capillary structure layer (6), and the third capillary structure layer (20) at the upper end of the conveying strips (19) is connected to the first capillary structure layer (5).

5. The electronic equipment heat dissipation base according to claim 4, characterized in that: The conveying strip (19), the top plate (3) and the side plate (4) are copper plates, and the third capillary structure layer (20), the second capillary structure layer (6) and the first capillary structure layer (5) are formed by sintering a mixed powder of copper powder and tin powder.

6. The electronic equipment heat dissipation base according to claim 1, characterized in that: There are multiple heat dissipation components.

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