Multi-point collaborative cutting control method and laser cutting device

Abstract

The present invention discloses a multi-point collaborative cutting control method and a laser cutting device, which relate to the field of laser cutting technology. The method comprises: collecting basic information of target materials; transmitting configuration parameters to a cutting control unit to generate reference laser focal length, power and speed; extracting material contour size division, and using the intersection as the target point; setting the height of the laser cutting head as a reference, placing the material and measuring the height of the target point; simulating the surface of the material as a basin, and dividing the cutting path by ridge lines; transmitting the path height to the control unit to correct the laser focal length; the control unit controls the laser cutting device to cut according to the corrected focal length, power and speed. The present application solves the technical problem of low cutting accuracy and poor efficiency caused by excessive cutting in depressions or insufficient cutting in protrusions due to the uneven surface of the material during the laser cutting process, and achieves the effect of determining the cutting control point through basin simulation, optimizing the cutting trajectory, and improving the cutting efficiency and cutting quality.

Description

Technical Field

[0001] The present application relates to the field of laser processing technology, specifically to the field of laser cutting technology, and in particular to a multi-point collaborative cutting control method and a laser cutting device. Background Art

[0002] With the increasing requirements of cutting accuracy and efficiency in modern manufacturing, especially when dealing with uneven material surfaces, the traditional single-point laser cutting control method has been unable to meet production needs. When laser cutting on uneven material surfaces, the focus control of the laser beam at different points becomes particularly critical. For depressions on the surface of the material, traditional cutting methods often face the problem of cutting too deep. This is because the shape of the depression makes it easier for the laser beam to focus on the area, resulting in excessive concentration of laser energy, or the depression will aggravate the absorption of the laser beam by the material, resulting in an increase in the cutting depth. This not only affects the cutting accuracy, but may also cause unnecessary damage to the material. Summary of the invention

[0003] The embodiments of the present application provide a multi-point collaborative cutting control method and a laser cutting device to solve the technical problem of low cutting accuracy and poor efficiency caused by excessive cutting in depressions or insufficient cutting in protrusions due to the uneven surface of the material during the laser cutting process.

[0004] In view of the above problems, an embodiment of the present application provides a multi-point collaborative cutting control method and a laser cutting device.

[0005] A first aspect of an embodiment of the present application provides a multi-point collaborative cutting control method, the method comprising:

[0006] Collecting basic information of the target material, the basic information including material surface properties, material reference thickness, material density and material melting point;

[0007] The surface properties of the material, the reference thickness of the material, the density of the material and the melting point of the material are transmitted to the cutting control unit for parameter configuration to generate a reference laser focal length, a reference laser power and a reference cutting speed;

[0008] Extract the material outline size in the basic information and divide it equally vertically and horizontally, and use multiple intersection points in the division result as multiple target points;

[0009] Taking the height set by the laser cutting head of the laser cutting device as the reference height, placing the target material horizontally on the cutting table, and using an optical rangefinder to measure the distance between the multiple target points and the reference height to generate multiple target material point heights;

[0010] Simulate the heights of the multiple target material points as multiple ground heights, and make a smooth transition between two adjacent target points, perform basin simulation on the surface of the target material, simulate watering the lowest points of the basins in the obtained simulated basins that are located in the first n positions from low to high, divide the simulated basins by ridge lines, and obtain multiple divided material surface areas and multiple split ridge lines, wherein there is a split ridge line between two adjacent divided material surface areas, and n is greater than or equal to 2;

[0011] The plurality of segmentation ridge lines are used as a plurality of cutting paths, and the plurality of target material heights of the plurality of cutting paths are respectively transmitted to a cutting control unit to calibrate the reference laser focal length to obtain a plurality of target reference laser focal lengths;

[0012] The cutting control unit controls the laser cutting device to cut the target material according to the multiple target reference laser focal lengths, reference laser powers and the reference cutting speeds.

[0013] A second aspect of the embodiments of the present application provides a laser cutting device with multi-point coordinated cutting control, the device comprising:

[0014] An information collection module, wherein the information collection module is used to collect basic information of the target material, wherein the basic information includes material surface properties, material reference thickness, material density and material melting point;

[0015] A parameter configuration module, wherein the information acquisition module is used to transmit the material surface properties, material reference thickness, material density and material melting point to the cutting control unit for parameter configuration, and to generate a reference laser focal length, a reference laser power and a reference cutting speed;

[0016] An equal division module, the information collection module is used to extract the material outline size in the basic information and divide it equally vertically and horizontally, and use multiple intersection points in the division result as multiple target points;

[0017] The distance measurement module is used to use the height set by the laser cutting head of the laser cutting device as the reference height, place the target material horizontally on the cutting table, and use an optical rangefinder to measure the distance between the multiple target points and the reference height to generate multiple target material point heights;

[0018] A ridge line division module, wherein the information collection module is used to simulate the heights of the multiple target material points as multiple ground heights, and to make a smooth transition between two adjacent target points, to perform basin simulation on the surface of the target material, to simulate watering the lowest points of the basins in the obtained simulated basins, which are located in the first n positions from low to high, to divide the simulated basins by ridge lines, to obtain multiple divided material surface areas and multiple split ridge lines, wherein there is a split ridge line between two adjacent divided material surface areas, and n is greater than or equal to 2;

[0019] A correction module, wherein the information acquisition module is used to use the multiple segmentation ridge lines as multiple cutting paths, and transmit the multiple target material heights of the multiple cutting paths to the cutting control unit to correct the reference laser focal length, so as to obtain multiple target reference laser focal lengths;

[0020] The cutting module, the information acquisition module is used for the cutting control unit to control the laser cutting device to cut the target material according to the multiple target reference laser focal lengths, reference laser powers and reference cutting speeds.

[0021] One or more technical solutions provided in this application have at least the following technical effects or advantages:

[0022] The above-mentioned multi-point collaborative cutting control method collects a series of basic information of the target material, including its surface properties, reference thickness, density and melting point. This information is crucial for subsequent parameter configuration. Subsequently, this basic information is transmitted to the cutting control unit to generate the reference parameters required for laser cutting, such as laser focal length, power and cutting speed. These parameters are the basis for the operation of the laser cutting device. After that, according to the contour size of the material, it is evenly divided vertically and horizontally, and multiple intersections are selected as target points. Then, the height of these target points relative to the laser cutting head is measured by an optical rangefinder to generate target material point height data. Based on these data, a basin simulation is performed on the surface of the target material. By dividing the simulated basin by ridge lines, multiple divided material surface areas and dividing ridge lines are obtained. Finally, the target material height data of these cutting paths are transmitted back to the cutting control unit, and the reference laser focal length is corrected to ensure that the laser beam can reach the optimal focal length at each cutting point. In this way, the cutting control unit can accurately control the laser cutting device to cut the target material according to the corrected laser focal length, reference laser power and cutting speed. The entire process achieves precise planning of the laser cutting path and fine adjustment of laser parameters, thereby improving cutting accuracy and efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 A schematic diagram of a multi-point collaborative cutting control method flow chart provided in an embodiment of the present application;

[0025] Figure 2 A schematic diagram of the structure of a laser cutting device with multi-point collaborative cutting control provided in an embodiment of the present application.

[0026] Explanation of the accompanying drawings: information collection module 1, parameter configuration module 2, equal division module 3, correction module 4, ridge line division module 5, distance measurement module 6, cutting module 7. DETAILED DESCRIPTION

[0027] The embodiments of the present application provide a multi-point collaborative cutting control method and a laser cutting device to solve the technical problem of low cutting accuracy and poor efficiency caused by excessive cutting at recessed parts or insufficient cutting at raised parts due to the uneven surface of the material during the laser cutting process.

[0028] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0029] It should be noted that the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or server that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or modules that are not explicitly listed or are inherent to these processes, methods, products or devices.

[0030] Embodiment 1

[0031] like Figure 1 As shown, the embodiment of the present application provides a multi-point collaborative cutting control method, wherein the method includes:

[0032] Collecting basic information of the target material, the basic information including material surface properties, material reference thickness, material density and material melting point;

[0033] Modern industrial production has increasing requirements for cutting accuracy and efficiency. Traditional single-point cutting control methods often fail to meet the needs of complex workpieces and high-precision cutting. Multi-point collaborative cutting control methods can control multiple cutting points at the same time to achieve more precise and efficient cutting, meeting the pursuit of high-quality and high-efficiency cutting in production.

[0034] In the embodiment of the present application, it is crucial for the system terminal to collect basic information of the target material for the laser cutting process, and this information covers multiple key characteristics of the material. First, the surface properties of the material, especially its reflectivity and absorptivity, have a direct impact on the effect of laser cutting. The reflectivity determines the proportion of the laser beam reflected on the surface of the material, while the absorptivity determines the degree to which the laser energy is absorbed by the material. The reflectivity and absorptivity of different materials vary greatly, which directly affects the energy transfer and cutting efficiency during the laser cutting process. In addition to the surface properties, the reference thickness, density and melting point of the material are also an indispensable part of the basic information. The reference thickness is the basic dimensional parameter of the material, which is crucial for determining the penetration depth of laser cutting. The material density is related to the interaction between the laser beam and the material, affecting the cutting speed and quality. The melting point of the material determines the minimum energy required for laser cutting and helps set the appropriate laser power. In summary, the accurate collection of these basic information is the basis for formulating a reasonable cutting plan and optimizing cutting parameters, and provides important data support for subsequent laser cutting operations.

[0035] The surface properties of the material, the reference thickness of the material, the density of the material and the melting point of the material are transmitted to the cutting control unit for parameter configuration to generate a reference laser focal length, a reference laser power and a reference cutting speed;

[0036] In one embodiment, the system terminal transmits the collected basic information to the cutting control unit. The cutting control unit is the core component of the laser cutting device. It is responsible for receiving and processing the incoming information such as material surface properties, material baseline thickness, material density and material melting, and configuring parameters based on this information. The cutting control unit generates key parameters such as reference laser focal length, reference laser power and reference cutting speed through internal algorithm logic. These parameters are the core guidance in the laser cutting process. They ensure that the laser beam can act on the material in the best state to achieve efficient and accurate cutting. In summary, the cutting control unit can formulate a set of benchmark solutions for the entire cutting process based on the characteristics of the material. Through this process, it can be ensured that the laser cutting device can achieve stable and efficient cutting on various materials, meeting the needs of modern industrial production for high-quality and high-efficiency cutting.

[0037] Extract the material outline size in the basic information and divide it equally vertically and horizontally, and use multiple intersection points in the division result as multiple target points;

[0038] In one embodiment, in the process of preparing for laser cutting, the system terminal first extracts the contour size of the target material from the collected basic information, which includes the length, width, and specific size of the curves or irregular shapes of the material. This step is crucial for the subsequent cutting path planning. After obtaining the contour size data, the system terminal divides the material equally in the longitudinal and transverse directions. The longitudinal division is performed in the length direction of the material, while the transverse division is performed in the width direction of the material. The determination of the division interval is based on the cutting accuracy requirements, the physical properties of the material, and the complexity of the cutting path. Finally, the material is divided equally in the length and width directions through the determined division interval, and the entire material surface is divided into several small areas of similar size. After completing the longitudinal and transverse equal division, the division lines will be intertwined to form multiple intersections. These intersections are the positions that the system terminal needs to pay special attention to during the cutting process, and are also the points where the laser beam needs to operate. Therefore, these intersections are used as target points, and their precise position information is recorded. These target points not only represent the key positions on the surface of the material, but also the places that need special attention in the subsequent laser cutting process. By determining these target points, the cutting path can be planned more accurately to ensure that the laser beam can cut according to the predetermined trajectory, thereby improving the cutting accuracy and efficiency.

[0039] Taking the height set by the laser cutting head of the laser cutting device as the reference height, placing the target material horizontally on the cutting table, and using an optical rangefinder to measure the distance between the multiple target points and the reference height to generate multiple target material point heights;

[0040] In one embodiment, during the laser cutting process, it is crucial to ensure the accurate distance between the laser cutting head and the material surface. To achieve this goal, the system terminal first sets the reference height of the laser cutting head, that is, the standard position of the laser cutting head when it is not working. Subsequently, the target material is placed horizontally on the cutting table, which ensures that the material surface is parallel to the cutting table and provides a stable reference for subsequent measurements. After that, the height of the determined multiple target points is measured using an optical rangefinder, a precision measuring tool. The optical rangefinder can accurately measure the straight-line distance between each target point and the reference height, and transmit the measured data to the system terminal, so that the system terminal obtains the target material point height. Through this step, the system terminal obtains the precise distance information between each target point and the laser cutting head. This information is crucial for subsequent cutting operations because it will be used to adjust the position of the laser cutting head to ensure that the laser beam can act on the material surface at the correct angle and distance, thereby achieving efficient and accurate cutting.

[0041] Simulate the heights of the multiple target material points as multiple ground heights, and make a smooth transition between two adjacent target points, perform basin simulation on the surface of the target material, simulate watering the lowest points of the basins in the obtained simulated basins that are located in the first n positions from low to high, divide the simulated basins by ridge lines, and obtain multiple divided material surface areas and multiple split ridge lines, wherein there is a split ridge line between two adjacent divided material surface areas, and n is greater than or equal to 2;

[0042] In one embodiment, in the laser cutting process, the system terminal adopts a basin simulation method in order to more accurately simulate and process the surface characteristics of the material. First, the system terminal regards the measured heights of multiple target material points as different height points on the ground. After that, a smooth transition is performed between two adjacent target points, so that the entire material surface can be simulated into a continuous basin terrain. After completing the basin simulation, simulate water filling in the basin. The system terminal focuses on the areas with lower heights in the basin, especially the lowest points located in the first n positions. By simulating water filling to these lowest points, the flow and accumulation of water in the basin can be observed. When the liquid surface converges, the system terminal calculates the difference in the basin heights of multiple basins where the liquid surface converges, and judges it with the preset threshold. This process helps the system terminal to form a segmentation ridge line according to the dividing line of the water flow. At the same time, these ridge lines separate the adjacent divided material surface areas, and divide different areas of the material surface, that is, the divided material surface areas. In this way, not only multiple divided material surface areas can be obtained, but also multiple segmentation ridge lines can be obtained. These ridge lines are of great significance for subsequent laser cutting path planning, because they can help the system terminal determine the boundaries and turning points in the cutting process, thereby achieving more accurate and efficient cutting operations. For example, the target material is an aluminum alloy plate with a thickness of 10mm, a material density of 2.7g / cm³, and a melting point of 660.3°C. The height data of 50 target points were obtained by an optical rangefinder, with the lowest point being 0.2mm and the highest point being 2mm. A smooth transition is made between adjacent target points to form a continuous basin terrain, and then the lowest three points (0.2mm, 0.3mm, and 0.4mm) are simulated for watering at a rate of 1mm / s. When the water level rises to 0.5mm, it is detected that the liquid surface intersects at two points of 0.2mm and 0.3mm, with a height difference of 0.1mm, which is lower than the threshold of 0.2mm, and the first segmentation ridge line is generated. Continue to fill the water to 1.0mm to generate the second segmentation ridge line, and finally obtain multiple segmentation ridge lines. In this way, not only the cutting accuracy can be improved, but also the efficiency and stability of the cutting path can be ensured.

[0043] Further, the heights of the multiple target material points are simulated as multiple ground heights, and a smooth transition is performed between two adjacent target points, a basin simulation is performed on the surface of the target material, and simulated water is poured into the lowest point of the obtained simulated basin to divide the simulated basin by ridge lines, and multiple divided material surface areas and multiple segmentation ridge lines are obtained, including:

[0044] The lowest point of the simulated basin height is used as the starting point of water filling, and water is filled in the simulated basin until the water level rises and the liquid levels of two or more basins intersect with the liquid levels of other basins, and the difference in the basin heights of the multiple basins where the liquid levels intersect is calculated to determine whether a preset difference threshold is met, and if so, continue to fill with water;

[0045] If not, a split ridge line is generated at the intersection of the liquid levels, and then water is continuously poured in, and the split ridge line rises with the water level until the water level submerges the edge of the basin with the maximum basin height, and then water is stopped to obtain multiple initial split ridge lines floating on the water surface;

[0046] Preferably, in the preparation for laser cutting, the system terminal uses a simulated water filling method to analyze and divide the surface area of ​​the material. First, the lowest point of the simulated basin is selected as the starting point of water filling. Starting from this starting point, simulate the filling of water into the basin and observe the changes in the water surface. As the water surface rises, when the liquid surfaces of two or more basins intersect with the liquid surfaces of other basins, the system terminal calculates the difference in the height of the basins at these intersections, and compares this difference with the preset difference threshold. If the threshold condition is met, it means that there is not much difference between these areas, and the system terminal continues to fill with water. If the threshold condition is not met, it means that there is a significant difference between these areas. At this time, a segmentation ridge line is generated at the intersection of the liquid surfaces. This segmentation ridge line will move as the water surface continues to rise, helping the system terminal to divide different material surface areas. When the water surface rises to the edge of the basin that exceeds the maximum value of the basin height, the system terminal stops filling with water. At this time, multiple initial segmentation ridge lines floating on the water surface are obtained. These initial segmentation ridge lines not only mark the boundaries of different areas on the material surface, but also provide important references for subsequent laser cutting operations. In this way, the cutting path and cutting sequence can be determined more accurately, ensuring the efficiency and accuracy of laser cutting.

[0047] Dividing the surface of the target material using the multiple initial segmentation ridge lines to obtain multiple initial segmented material surface regions;

[0048] Preferably, the system terminal divides the surface of the target material using a plurality of initial segmentation ridge lines obtained by the simulated water filling method. These segmentation ridge lines serve as boundaries of different regions, helping the system terminal to clearly distinguish various parts on the surface of the material. Specifically, the system terminal determines the position and orientation of the initial segmentation ridge lines obtained by the simulated water filling method. These ridge lines will serve as boundaries of different regions, so their accuracy is crucial. Subsequently, the surface of the target material begins to be divided according to the position and orientation of the initial segmentation ridge lines.

[0049] The system terminal uses the ridge line as the boundary, and divides the material surface into different areas, ensuring that each area is bounded by adjacent ridge lines and that different areas do not overlap, to obtain multiple initial divided material surface areas. Each area is bounded by adjacent dividing ridge lines, forming a clear boundary. These initial divided material surface areas not only reflect the topographical features of the material surface, but also provide an important reference for subsequent cutting operations. By using the initial dividing ridge line for division, the shape, size and position of each area can be determined more accurately. This is of great significance for formulating appropriate cutting strategies, optimizing cutting paths and improving cutting efficiency.

[0050] Adjacent regions are merged according to the sizes of the multiple initial divided material surface regions, and the multiple initial segmentation ridge lines are screened to obtain multiple segmentation ridge lines and multiple divided material surface regions.

[0051] Preferably, after obtaining multiple initial divided material surface areas and initial segmentation ridge lines, the system terminal further performs optimization processing. First, the area sizes of these areas are analyzed, and the adjacent areas are fused. This is mainly to eliminate those areas that are too small and not conducive to cutting operations, and merge them with adjacent larger areas. In this process, the system terminal compares the area of ​​the initial divided material surface area with the preset threshold to determine the initial divided material surface area that needs to be fused to improve cutting efficiency and material utilization. At the same time, the initial segmentation ridge lines are also screened. In this process, the system terminal deletes those ridge lines that are located in a smaller area or have little effect on the overall division, and retains those ridge lines that play a key role in the division and can clearly define different areas. After these optimization processes, multiple segmentation ridge lines and multiple divided material surface areas are finally obtained. These ridge lines more accurately define the boundaries of different areas, and the division of material surface areas is more reasonable and efficient, providing better guidance and support for subsequent laser cutting operations.

[0052] Furthermore, the adjacent regions are merged according to the area sizes of the multiple initial divided material surface regions, and the multiple initial segmentation ridge lines are screened to obtain multiple segmentation ridge lines and multiple divided material surface regions, including:

[0053] Determine whether the areas of the plurality of initially divided material surface areas meet a preset cut product area threshold, and if not, add them into a set of areas to be fused;

[0054] Eliminating the set of regions to be fused from the plurality of initially divided material surface regions to obtain a set of regions that can be fused;

[0055] Optionally, in the preparation for laser cutting, the system terminal needs to ensure that the area of ​​each divided material surface area meets the preset cutting product area threshold. This is to ensure that the material surface area is not too small to make it difficult to cut. Therefore, the system terminal first screens the area of ​​each initially divided material surface area. If it is found that the area of ​​a certain area does not meet the preset cutting product area threshold, the system terminal adds it to the set of areas to be fused. This set contains those areas whose areas do not meet the requirements, and they need to adjust the area by fusion with adjacent areas. Subsequently, the system terminal removes the set of areas to be fused from multiple initially divided material surface areas, so that the remaining areas are those areas that have met the requirements. The system terminal defines these areas that meet the requirements as a set of fusionable areas. These areas do not need to be adjusted in area and can be directly used for subsequent cutting operations. Through the above steps, the system terminal ensures that all material surface areas for cutting meet the preset area requirements, laying a solid foundation for subsequent laser cutting work. At the same time, it also provides the possibility of fusion adjustment for those areas whose areas do not meet the requirements, thereby improving the utilization rate of materials and cutting efficiency.

[0056] Extracting a first initially divided material surface region from the set of regions to be fused, and matching a plurality of adjacent initially divided material surface regions in the set of fused regions according to the position of the first initially divided material surface region;

[0057] The first initial divided material surface region is merged with the initial divided material surface region corresponding to the minimum area value in multiple adjacent initial divided material surface regions, and the initial segmentation ridge line in the middle of the region is eliminated to obtain a first fused divided material surface region.

[0058] Optionally, in the process of adjusting the material surface area to meet the area threshold of the finished product, the system terminal first selects an initial divided material surface area from the set of areas to be fused as the starting point, that is, the first initial divided material surface area. Subsequently, according to the location information of this area, multiple adjacent initial divided material surface areas are found in the set of fused areas. After finding multiple adjacent initial divided material surface areas, the system terminal compares their area sizes and finds the area with the smallest area. This step is to ensure that in the fusion process, as many areas as possible are selected to better adjust the overall area, while avoiding waste of materials and avoiding excessive surface areas. After determining the area to be fused, the system terminal fuses the first initial divided material surface area with the initial divided material surface area with the smallest area found, and merges the two areas into a larger area to meet the area threshold requirement. In the fusion process, the system terminal also removes the initial segmentation ridge line located between the two areas, because the existence of the ridge line will hinder the merging of the areas. After completing the above steps, the system terminal obtains a new, larger divided material surface area, that is, the first fused divided material surface area. This area not only meets the area threshold requirement, but also its shape and boundary are clearer and more reasonable by removing the ridge line in the middle. This process will be repeated until all the areas to be fused have been processed.

[0059] Further, after obtaining the first fused divided material surface area, the method includes:

[0060] Performing adjacent region fusion on the set of regions to be fused, and removing the initial segmentation ridge line in the middle of the corresponding regions, to generate multiple fused and divided material surface regions;

[0061] Generate a plurality of divided material surface regions according to the plurality of initial divided material surface regions remaining unfused in the fused region, the first fused divided material surface region and the plurality of fused divided material surface regions;

[0062] The multiple initial segmentation ridge lines that are not eliminated are used as multiple segmentation ridge lines.

[0063] Optionally, when processing the set of regions to be fused, the system terminal adopts a strategy of adjacent region fusion. Specifically, the system terminal selects one region in the set of regions to be fused, then searches for adjacent fused regions, and merges them into a larger region. During the fusion process, the system terminal removes the initial segmentation ridge lines located in the middle of the fused region, because these ridge lines no longer have a segmentation effect after fusion. By repeating this process continuously, multiple fused segmentation material surface regions are generated, which not only meet the preset cutting product area threshold in terms of area, but also have more reasonable shapes and boundaries. After completing the fusion of the regions to be fused, the system terminal combines the remaining unfused multiple initial segmentation material surface regions, the first fused segmentation material surface regions, and the generated multiple fused segmentation material surface regions in the fusion region, and finally determines multiple segmentation material surface regions. These regions will serve as the basic units of laser cutting to ensure the accuracy and efficiency of cutting. Finally, the system terminal uses the initial segmentation ridge lines that were not removed during the fusion process as the final multiple segmentation ridge lines. These ridge lines clearly define the boundaries of different segmentation material surface regions, providing clear guidance for subsequent cutting operations. Through this series of steps, the surface of the target material is successfully optimized and divided, and the appropriate dividing ridge line is determined, laying a solid foundation for subsequent laser cutting work.

[0064] The plurality of segmentation ridge lines are used as a plurality of cutting paths, and the plurality of target material heights of the plurality of cutting paths are respectively transmitted to a cutting control unit to calibrate the reference laser focal length to obtain a plurality of target reference laser focal lengths;

[0065] In one embodiment, during the laser cutting preparation process, accurate focal length control is essential to ensure cutting quality and efficiency. The system terminal uses the obtained multiple segmentation ridge lines as multiple cutting paths, calculates the expected values ​​and expected variances of these cutting paths, and obtains the target material heights of these cutting paths based on the calculation results. Subsequently, the system terminal transmits the height data to the cutting control unit, which corrects the reference laser focal length based on the height information. Doing so not only improves the cutting accuracy, but also helps to improve the overall work efficiency.

[0066] Furthermore, the plurality of segmentation ridge lines are used as a plurality of cutting paths, and a plurality of target material heights of the plurality of cutting paths are transmitted to a cutting control unit to correct the reference laser focal length to obtain a plurality of target reference laser focal lengths, including:

[0067] traversing and measuring a plurality of material position height sets on the plurality of cutting paths using the optical rangefinder;

[0068] Calculating expected values ​​and expected variances for the plurality of material position height sets respectively to obtain a plurality of position height expected values ​​and a plurality of position height expected variances;

[0069] It is determined whether the expected variances of the heights of the multiple positions meet a preset variance threshold, and if so, the expected values ​​of the heights of the multiple positions are used as the multiple target material heights.

[0070] Preferably, before laser cutting, in order to ensure the accuracy of cutting, the height of the material position on the cutting path needs to be accurately measured. The system terminal uses an optical rangefinder to traverse and measure multiple material positions on each cutting path, thereby obtaining a height data set for each position. With these data, the system terminal further performs statistical analysis on each material position height set. Specifically, the system terminal uses the calculation formula of the expected value, that is, the average value of all data points, for each material position height set. The system terminal traverses each data point in the set, adds them together, and then divides them by the total number of data points to obtain the expected value. This expected value represents the average level of the material position height in the set. Subsequently, the calculation formula of the expected variance is used, that is, the average value of the square of the difference between each data point and the expected value. The system terminal traverses each data point in the set, calculates its difference from the expected value, and squares the difference. Then add all the squared differences and divide them by the total number of data points to obtain the expected variance. The expected variance reflects the degree of dispersion of the data points in the set relative to the expected value. These expected values ​​and variance values ​​provide the system terminal with important information about the height distribution of the material surface. Afterwards, the system terminal determines whether the expected variances of these position heights meet the preset variance threshold. If the variance value is within an acceptable range, it means that the material surface height distribution is relatively uniform. At this time, the system terminal uses the expected value of the position height as the target material height for subsequent laser focal length correction. However, if the variance value exceeds the preset threshold, this means that there are large fluctuations or irregularities in the material surface height, which may have an adverse effect on the cutting quality. In this case, the system terminal will generate an early warning instruction to alert the user to this problem in order to deal with the uneven material surface. In summary, by measuring and statistically analyzing the material position height on the cutting path, the flatness of the material surface can be evaluated, and based on this, it can be determined whether an early warning or other measures are needed to ensure the accuracy and quality of laser cutting.

[0071] Furthermore, after taking the plurality of position height expected values ​​as the plurality of target material heights, the method further comprises:

[0072] Constructing a correction identifier and embedding the correction identifier in the cutting control unit;

[0073] The correction identifier is used to respectively correct the plurality of target material heights and the reference laser focal lengths to generate the plurality of target reference laser focal lengths.

[0074] Optionally, the correction identifier is a specially constructed neural network model that is embedded in the cutting control unit to achieve accurate correction of the target material height and the reference laser focal length. Specifically, the system terminal collects a large amount of historical cutting data on the material height and the corresponding laser focal length as data samples, and cleans the data samples to remove outliers and missing values. Subsequently, the neural network model is initialized, key parameters such as the number of layers of the network, the number of neurons in each layer, and the activation function are determined, and the network weights and biases are randomly initialized. After that, the neural network is trained using the preprocessed sample data, the network parameters are adjusted by the back propagation algorithm and the gradient descent method, and indicators such as the loss function and accuracy during the training process are monitored to evaluate the performance of the model. Then, the trained model is evaluated using the validation set to check its prediction accuracy and generalization ability, and the model is tuned according to the evaluation results, such as adjusting the network structure, adding regularization terms, etc. Further, the system terminal designs the data interface between the correction identifier and the cutting control unit to ensure that the two can exchange information smoothly, and determine the format and communication protocol of the input and output data. Subsequently, the trained correction identifier is embedded into the cutting control unit as an independent component of the control unit.

[0075] After the correction identifier is embedded, the system terminal passes multiple target material heights as input data to the correction identifier. The correction identifier uses its powerful learning and processing capabilities to analyze these height data and calculate the corresponding laser focal length corrections based on the pre-trained model parameters. These corrections are then applied to the reference laser focal length to generate multiple target reference laser focal lengths.

[0076] In summary, by embedding the correction identifier into the cutting control unit, the laser focal length can be automatically corrected and optimized, improving the accuracy and efficiency of laser cutting. This neural network-based correction method is highly flexible and adaptable, and can cope with the challenges of different materials and different cutting conditions, ensuring the stability and reliability of the laser cutting process.

[0077] The cutting control unit controls the laser cutting device to cut the target material according to the multiple target reference laser focal lengths, reference laser powers and the reference cutting speeds.

[0078] In one embodiment, the cutting control unit controls the laser cutting device to cut the target material accurately based on the multiple target reference laser focal lengths that have been calibrated, combined with the reference laser power and the reference cutting speed. In this way, the laser cutting device can work according to more precise parameters, thereby improving the accuracy and efficiency of cutting and ensuring that the target material is accurately cut into the desired shape and size.

[0079] Furthermore, surface state identification includes:

[0080] The surface of the target material after cutting is collected within a preset monitoring window to obtain a surface state feature set, wherein the surface state feature set includes a burr distribution feature and a debris accumulation feature;

[0081] Performing surface state identification based on the burr distribution characteristics and the debris accumulation characteristics to generate a first surface state factor;

[0082] Preferably, within the preset monitoring window, the system terminal performs detailed state acquisition on the surface of the target material after laser cutting, in order to obtain the surface state characteristics after cutting, which mainly include the distribution of burrs and the accumulation state of debris. These characteristics reflect possible problems or defects in the cutting process, such as poor cutting quality, improper parameter settings, etc. Subsequently, the system terminal identifies and analyzes these surface state characteristics, namely the burr distribution characteristics and debris accumulation characteristics, determines the number of areas where burrs and debris accumulation occur, and generates a comprehensive evaluation index, namely the first surface state factor. This factor is essentially a quantitative description of the degree of burrs and debris on the surface of the material after cutting. It can help users quickly understand the cutting effect and determine whether it is necessary to adjust the cutting parameters or take other measures to optimize the cutting quality.

[0083] Performing state authentication on the first surface state factor, and continuing cutting if the authentication passes;

[0084] If the authentication fails, a cleanup instruction is sent to the staff.

[0085] Preferably, after obtaining the first surface state factor, the system terminal completes state authentication by comparing it with a preset state threshold to determine whether the current cutting effect meets the standard. If the authentication is passed, that is, the first surface state factor meets the limit of the preset state threshold, it means that the cutting quality meets the requirements and the cutting operation will continue; but if the authentication is not passed, it means that there are many burrs and debris on the surface of the material after cutting, which does not meet the quality standards. At this time, the system terminal will automatically send a cleaning instruction to the staff to remind the staff to clean up in order to improve the cutting quality and adjust the cutting parameters.

[0086] In summary, the embodiments of the present application have at least the following technical effects:

[0087] The embodiment of the present application configures the cutting parameters by collecting the basic information of the target material. Subsequently, the surface of the material is divided into multiple target points, and their heights are measured. After that, the basin is simulated and the ridge line is divided to obtain multiple cutting paths. During the cutting process, the laser focal length is corrected according to the measured height of the target material to ensure the accuracy of the cutting. In addition, it also includes monitoring and identifying the surface state after cutting, and sending a cleaning instruction if an abnormality occurs. This method covers multiple steps to achieve efficient and accurate material cutting. These technical effects jointly solve the technical problems of low cutting accuracy and poor efficiency caused by excessive cutting in depressions or insufficient cutting in protrusions due to the uneven surface of the material during the laser cutting process, and achieve the effect of determining the cutting control point position through basin simulation, optimizing the cutting trajectory, and improving the cutting efficiency and cutting quality.

[0088] Embodiment 2

[0089] Based on the same inventive concept as the multi-point coordinated cutting control method in the aforementioned embodiment, Figure 2 As shown, the present application provides a laser cutting device with multi-point coordinated cutting control, and the device and method embodiments in the present application are based on the same inventive concept. The device includes:

[0090] An information acquisition module 1, wherein the information acquisition module 1 is used to acquire basic information of the target material, wherein the basic information includes material surface properties, material reference thickness, material density and material melting point;

[0091] Parameter configuration module 2, the information acquisition module 2 is used to transmit the material surface properties, material reference thickness, material density and material melting point to the cutting control unit for parameter configuration, and generate a reference laser focal length, a reference laser power and a reference cutting speed;

[0092] An equal division module 3, the information collection module 3 is used to extract the material outline size in the basic information and divide it equally vertically and horizontally, and use multiple intersection points in the division result as multiple target points;

[0093] The distance measurement module 4 is used to use the height set by the laser cutting head of the laser cutting device as the reference height, place the target material horizontally on the cutting table, and use an optical rangefinder to measure the distance between the multiple target points and the reference height to generate multiple target material point heights;

[0094] The ridge line division module 5 is used to simulate the heights of the multiple target material points as multiple ground heights, and to make a smooth transition between two adjacent target points, to simulate the surface of the target material as a basin, to simulate watering the lowest points of the basins in the obtained simulated basins according to the heights of the basins in the first n positions from low to high, to divide the simulated basins into ridge lines, to obtain multiple divided material surface areas and multiple split ridge lines, wherein there is a split ridge line between two adjacent divided material surface areas, and n is greater than or equal to 2;

[0095] The correction module 6 is used for taking the multiple segmentation ridge lines as multiple cutting paths, and transmitting the multiple target material heights of the multiple cutting paths to the cutting control unit to correct the reference laser focal length, so as to obtain multiple target reference laser focal lengths;

[0096] The cutting module 7, the information acquisition module is used for the cutting control unit to control the laser cutting device to cut the target material according to the multiple target reference laser focal lengths, reference laser powers and reference cutting speeds.

[0097] Furthermore, the ridge line division module 5 is used to perform the following method:

[0098] The lowest point of the simulated basin height is used as the starting point of water filling, and water is filled in the simulated basin until the water level rises and the liquid levels of two or more basins intersect with the liquid levels of other basins, and the difference in the basin heights of the multiple basins where the liquid levels intersect is calculated to determine whether a preset difference threshold is met, and if so, continue to fill with water;

[0099] If not, a split ridge line is generated at the intersection of the liquid levels, and then water is continuously poured in, and the split ridge line rises with the water level until the water level submerges the edge of the basin with the maximum basin height, and then water is stopped to obtain multiple initial split ridge lines floating on the water surface;

[0100] Dividing the surface of the target material using the multiple initial segmentation ridge lines to obtain multiple initial segmented material surface regions;

[0101] Adjacent regions are merged according to the sizes of the multiple initial divided material surface regions, and the multiple initial segmentation ridge lines are screened to obtain multiple segmentation ridge lines and multiple divided material surface regions.

[0102] Furthermore, the ridge line division module 5 is used to perform the following method:

[0103] Determine whether the areas of the plurality of initially divided material surface areas meet a preset cut product area threshold, and if not, add them into a set of areas to be fused;

[0104] Eliminating the set of regions to be fused from the plurality of initially divided material surface regions to obtain a set of regions that can be fused;

[0105] Extracting a first initially divided material surface region from the set of regions to be fused, and matching a plurality of adjacent initially divided material surface regions in the set of fused regions according to the position of the first initially divided material surface region;

[0106] The first initial divided material surface region is merged with the initial divided material surface region corresponding to the minimum area value in multiple adjacent initial divided material surface regions, and the initial segmentation ridge line in the middle of the region is eliminated to obtain a first fused divided material surface region.

[0107] Furthermore, the ridge line division module 5 is used to perform the following method:

[0108] Performing adjacent region fusion on the set of regions to be fused, and removing the initial segmentation ridge line in the middle of the corresponding regions, to generate multiple fused and divided material surface regions;

[0109] Generate a plurality of divided material surface regions according to the plurality of initial divided material surface regions remaining unfused in the fused region, the first fused divided material surface region and the plurality of fused divided material surface regions;

[0110] The multiple initial segmentation ridge lines that are not eliminated are used as multiple segmentation ridge lines.

[0111] Furthermore, the correction module 6 is used to perform the following method:

[0112] traversing and measuring a plurality of material position height sets on the plurality of cutting paths using the optical rangefinder;

[0113] Calculating expected values ​​and expected variances for the plurality of material position height sets respectively to obtain a plurality of position height expected values ​​and a plurality of position height expected variances;

[0114] It is determined whether the expected variances of the heights of the multiple positions meet a preset variance threshold, and if so, the expected values ​​of the heights of the multiple positions are used as the multiple target material heights.

[0115] Furthermore, the correction module 6 is used to perform the following method:

[0116] Constructing a correction identifier and embedding the correction identifier in the cutting control unit;

[0117] The correction identifier is used to respectively correct the plurality of target material heights and the reference laser focal lengths to generate the plurality of target reference laser focal lengths.

[0118] Furthermore, the cutting module 7 is used to perform the following method:

[0119] The surface of the target material after cutting is collected within a preset monitoring window to obtain a surface state feature set, wherein the surface state feature set includes a burr distribution feature and a debris accumulation feature;

[0120] Performing surface state identification based on the burr distribution characteristics and the debris accumulation characteristics to generate a first surface state factor;

[0121] Performing state authentication on the first surface state factor, and continuing cutting if the authentication passes;

[0122] If the authentication fails, a cleanup instruction is sent to the staff.

[0123] It should be noted that the above-mentioned sequence of the embodiments of the present application is only for description and does not represent the advantages and disadvantages of the embodiments. The processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0124] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

[0125] This specification and drawings are merely exemplary illustrations of the present application and are deemed to cover any and all modifications, variations, combinations or equivalents within the scope of the present application. Obviously, a person skilled in the art may make various modifications and variations to the present application without departing from the scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the present application and its equivalents, the present application intends to include these modifications and variations.

Claims

1. A multi-point collaborative cutting control method, characterized in that: The method comprises: Collecting basic information of the target material, the basic information including material surface properties, material reference thickness, material density and material melting point; The surface properties of the material, the reference thickness of the material, the density of the material and the melting point of the material are transmitted to the cutting control unit for parameter configuration to generate a reference laser focal length, a reference laser power and a reference cutting speed; Extract the material outline size in the basic information and divide it equally vertically and horizontally, and use multiple intersection points in the division result as multiple target points; Taking the height set by the laser cutting head of the laser cutting device as the reference height, placing the target material horizontally on the cutting table, and using an optical rangefinder to measure the distance between the multiple target points and the reference height to generate multiple target material point heights; Simulate the heights of the multiple target material points as multiple ground heights, and make a smooth transition between two adjacent target points, perform basin simulation on the surface of the target material, simulate watering the lowest points of the basins in the obtained simulated basins that are located in the first n positions from low to high, divide the simulated basins by ridge lines, and obtain multiple divided material surface areas and multiple split ridge lines, wherein there is a split ridge line between two adjacent divided material surface areas, and n is greater than or equal to 2; The plurality of segmentation ridge lines are used as a plurality of cutting paths, and the plurality of target material heights of the plurality of cutting paths are respectively transmitted to a cutting control unit to calibrate the reference laser focal length to obtain a plurality of target reference laser focal lengths; The cutting control unit controls the laser cutting device to cut the target material according to the multiple target reference laser focal lengths, reference laser powers and the reference cutting speeds.

2. The method according to claim 1, characterized in that The heights of the multiple target material points are simulated as multiple ground heights, and a smooth transition is performed between two adjacent target points, a basin simulation is performed on the surface of the target material, simulated water is poured to the lowest point of the obtained simulated basin, and the simulated basin is divided by ridge lines to obtain multiple divided material surface areas and multiple segmentation ridge lines. The method includes: The lowest point of the simulated basin height is used as the starting point of water filling, and water is filled in the simulated basin until the water level rises and the liquid levels of two or more basins intersect with the liquid levels of other basins, and the difference in the basin heights of the multiple basins where the liquid levels intersect is calculated to determine whether a preset difference threshold is met, and if so, continue to fill with water; If not, a split ridge line is generated at the intersection of the liquid levels, and then water is continuously poured in, and the split ridge line rises with the water level until the water level submerges the edge of the basin with the maximum basin height, and then water is stopped to obtain multiple initial split ridge lines floating on the water surface; Dividing the surface of the target material using the multiple initial segmentation ridge lines to obtain multiple initial segmented material surface regions; Adjacent regions are merged according to the sizes of the multiple initial divided material surface regions, and the multiple initial segmentation ridge lines are screened to obtain multiple segmentation ridge lines and multiple divided material surface regions.

3. The method according to claim 2, characterized in that According to the sizes of the multiple initial divided material surface areas, adjacent regions are merged, and the multiple initial segmentation ridge lines are screened to obtain multiple segmentation ridge lines and multiple divided material surface areas. The method includes: Determine whether the areas of the plurality of initially divided material surface areas meet a preset cut product area threshold, and if not, add them into a set of areas to be fused; Eliminating the set of regions to be fused from the plurality of initially divided material surface regions to obtain a set of regions that can be fused; Extracting a first initially divided material surface region from the set of regions to be fused, and matching a plurality of adjacent initially divided material surface regions in the set of fused regions according to the position of the first initially divided material surface region; The first initial divided material surface region is merged with the initial divided material surface region corresponding to the minimum area value in multiple adjacent initial divided material surface regions, and the initial segmentation ridge line in the middle of the region is eliminated to obtain a first fused divided material surface region.

4. The method according to claim 3, characterized in that After obtaining a first fused divided material surface area, the method further comprises: Performing adjacent region fusion on the set of regions to be fused, and removing the initial segmentation ridge line in the middle of the corresponding regions, to generate multiple fused and divided material surface regions; Generate a plurality of divided material surface regions according to the plurality of initial divided material surface regions remaining unfused in the fused region, the first fused divided material surface region and the plurality of fused divided material surface regions; The multiple initial segmentation ridge lines that are not eliminated are used as multiple segmentation ridge lines.

5. The method according to claim 1, characterized in that The plurality of segmentation ridge lines are used as a plurality of cutting paths, and a plurality of target material heights of the plurality of cutting paths are transmitted to a cutting control unit to correct the reference laser focal length to obtain a plurality of target reference laser focal lengths. The method comprises: Using the optical rangefinder to traverse and measure a plurality of material position height sets on the plurality of cutting paths; Calculating expected values ​​and expected variances for the plurality of material position height sets respectively to obtain a plurality of position height expected values ​​and a plurality of position height expected variances; It is determined whether the expected variances of the heights of the multiple positions meet a preset variance threshold, and if so, the expected values ​​of the heights of the multiple positions are used as the multiple target material heights.

6. The method according to claim 5, characterized in that The method further comprises: using the plurality of position height expected values ​​as the plurality of target material heights; and then: Constructing a correction identifier and embedding the correction identifier in the cutting control unit; The correction identifier is used to respectively correct the plurality of target material heights and the reference laser focal lengths to generate the plurality of target reference laser focal lengths.

7. The method according to claim 1, characterized in that The method comprises: The surface of the target material after cutting is collected within a preset monitoring window to obtain a surface state feature set, wherein the surface state feature set includes a burr distribution feature and a debris accumulation feature; Performing surface state identification based on the burr distribution characteristics and the debris accumulation characteristics to generate a first surface state factor; Performing state authentication on the first surface state factor, and continuing cutting if the authentication passes; If the authentication fails, a cleanup instruction is sent to the staff.

8. A laser cutting device with multi-point coordinated cutting control, characterized in that: The device comprises: Information collection module: collects basic information of the target material, including material surface properties, material reference thickness, material density and material melting point; Parameter configuration module: transmitting the material surface properties, material reference thickness, material density and material melting point to the cutting control unit for parameter configuration, generating a reference laser focal length, a reference laser power and a reference cutting speed; Equal division module: extracting the material outline size in the basic information and performing equal division in both vertical and horizontal directions, and taking multiple intersection points in the division result as multiple target points; Distance measurement module: taking the height set by the laser cutting head of the laser cutting device as the reference height, placing the target material horizontally on the cutting table, and using an optical rangefinder to measure the distance between the multiple target points and the reference height to generate multiple target material point heights; Ridge line division module: simulate the heights of the multiple target material points as multiple ground heights, and make a smooth transition between two adjacent target points, perform basin simulation on the surface of the target material, simulate watering the lowest points of the basins in the obtained simulated basins according to the heights of the basins in the first n positions from low to high, and divide the simulated basins into ridge lines to obtain multiple divided material surface areas and multiple split ridge lines, wherein there is a split ridge line between two adjacent divided material surface areas, and n is greater than or equal to 2; A correction module: using the multiple segmentation ridge lines as multiple cutting paths, and transmitting the multiple target material heights of the multiple cutting paths to a cutting control unit to correct the reference laser focal length, thereby obtaining multiple target reference laser focal lengths; Cutting module: The cutting control unit controls the laser cutting device to cut the target material according to the multiple target reference laser focal lengths, reference laser powers and reference cutting speeds.

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