A polishing device for surface processing of gallium antimonide wafer

Abstract

The present invention discloses a polishing device for surface processing of gallium antimonide wafers, which relates to the technical field of gallium antimonide wafer processing, and solves the problems of fixed size of the limit disk, low convenience of the limit disk engagement, disassembly and replacement, low effect of adjusting and cleaning the surface of the polishing disk, and low synchronization of automatic stirring and automatic scraping of the polishing liquid in the stirring barrel when polishing the gallium antimonide wafer. The processing platform includes a device body, a polishing disk, a stirring barrel, a connecting pump port, a connector, a delivery pipe, a connecting frame, a placement plate, a wafer body, a limit disk, a pressure plate, a positioning plate and an adjustment mechanism, and the outer wall of the device body is rotatably connected with a polishing disk; in the present invention, the engagement, disassembly and replacement of limit disks of different size contours can be completed at one time, the impurities on the surface of the polishing disk can be adjusted and cleaned, and the polishing liquid in the stirring barrel can be automatically stirred, and the polishing liquid adsorbed on the inner wall of the stirring barrel can be automatically scraped and stirred.

Description

Technical Field

[0001] The invention relates to the technical field of gallium antimonide wafer processing, in particular to a polishing device for gallium antimonide wafer surface processing. Background Art

[0002] In addition to having great potential application value in optical fiber communications, devices made of GaSb-based materials also have great potential application value in other fields, such as the production of multi-purpose infrared detection devices and infrared imaging devices in rockets and surveillance systems, sensors for fire alarms and environmental pollution detection, and sensors for monitoring the leakage of corrosive gases (such as HCl, etc.) and toxic gases in factories.

[0003] When processing and producing GaSb wafers, it is necessary to polish the surface of the GaSb wafers through a processing and polishing device to meet the needs of subsequent production and processing of the GaSb wafers, achieve the effect of fully utilizing the GaSb wafers, and improve the quality and precision of the GaSb wafers.

[0004] There is a Chinese patent application with publication number CN109500674A, which discloses a gallium antimonide single wafer grinding device with a dust removal function and adjustable cutting amount. The invention comprises a base, a cabinet is arranged at the upper left end thereof, a first linear guide is arranged at the upper end of the cabinet, a slider is installed on the first linear guide, the slider is connected to the propulsion mechanism, and a side grinding mechanism is installed on the upper end of the slider; a support seat is arranged at the upper right end of the base, a second linear guide is arranged on the support seat, a lifting seat is installed on the second linear guide, the lifting seat is connected to the lifting mechanism to achieve up and down lifting, a second motor is arranged on the lifting seat, the output shaft of the second motor is connected to the vacuum suction cup, and the gallium antimonide single crystal wafer is installed on the vacuum suction cup; it also comprises a dust collecting device, the invention has a simple structure and a high degree of automation, can quickly clamp the gallium antimonide single crystal wafer with a thickness of 2-5mm and quickly grind the side of the gallium antimonide single crystal wafer, and the cutting amount of the side of the gallium antimonide single crystal wafer can be quickly adjusted to improve the grinding efficiency and grinding effect, and at the same time, the dust generated during the grinding process can be absorbed by the dust collecting device to protect the surrounding production environment.

[0005] The existing Chinese patent application with publication number CN112077691B discloses a method for polishing a gallium antimonide single crystal wafer, comprising the following steps: 1) double-sided grinding of the gallium antimonide single crystal wafer to remove damage on the surface of the gallium antimonide single crystal wafer; 2) chemically mechanically polishing the ground gallium antimonide single crystal wafer using a polishing cloth and a polishing liquid; 3) removing the gallium antimonide single crystal wafer after chemical mechanical polishing and cleaning it. The invention realizes one-step polishing of the gallium antimonide single crystal wafer by selecting and optimizing the components and content of the polishing liquid and the polishing cloth used therewith, without the need for three-step polishing of rough polishing, medium polishing and fine polishing. The process is simple and the stability is good. The surface quality of the gallium antimonide single crystal wafer after polishing is high, without scratches and fogging defects, and the surface roughness is low, and the roughness value Ra can reach less than 0.15nm.

[0006] However, the processing platform has the following defects when used:

[0007] 1. When the existing polishing device is used to polish the GaSb single crystal wafer, although it can perform good polishing operation on the GaSb single crystal wafer, when the GaSb single crystal wafer is placed on the polishing plate for polishing, the size of the limit plate is not convenient for assembly and disassembly, so that when polishing different numbers of GaSb single crystal wafers, the limiting effect of the placement plate is unstable, which reduces the polishing accuracy of the GaSb single crystal surface, and the synchronous cleaning effect of impurities on the surface of the polishing plate is not high, so that when the subsequent GaSb single crystal wafer is placed for polishing, the polishing time of the GaSb single crystal wafer is increased, which reduces the polishing efficiency of the GaSb single crystal wafer;

[0008] 2. When the existing polishing device is used to polish the gallium antimonide single crystal wafer, the operator is often required to manually process the polishing liquid and then add the polishing liquid. The automatic stirring effect after the polishing liquid is added into the mixing barrel is not high. Moreover, when the mixing barrel is used for a long time, the effect of synchronous scraping and cleaning of the polishing liquid adhered to the inner wall of the mixing barrel is not high, resulting in a waste of the polishing liquid, thereby increasing the cost of using the polishing liquid, and increasing the workload of the staff for manually stirring the polishing liquid, thereby reducing the construction efficiency of the staff. Summary of the invention

[0009] The object of the present invention is to provide a polishing device for surface processing of gallium antimonide wafers to solve the problems raised in the above-mentioned background technology.

[0010] In order to achieve the above-mentioned invention object, the present invention adopts the following technical scheme:

[0011] The present invention provides a polishing device for surface processing of gallium antimonide wafers, comprising a device body, a polishing disc, a stirring barrel, a connecting pump port, a connecting head, a delivery pipe, a connecting frame, a placing disc, a wafer body, a limiting disc, a pressing plate, a positioning plate and an adjusting mechanism, wherein the outer wall of the device body is rotatably connected with the polishing disc, the outer wall of the device body is fixedly connected with the stirring barrel, the connecting pump port is arranged at the top of the stirring barrel, the inner wall of the connecting pump port is detachably connected with the connecting head, the outer wall of the connecting head is fixedly connected with the delivery pipe, the outer wall of the device body is fixedly connected with the connecting frame sleeved on the outer wall of the delivery pipe, the placing disc is placed on the surface of the polishing disc, the bottom of the placing disc is provided with the wafer body, the outer wall of the placing disc is sleeved with the limiting disc, the inner wall of the limiting disc is provided with a pressing plate that fits with the top of the placing disc, and the inner wall of the limiting disc is provided with a positioning plate located above the pressing plate;

[0012] The regulating mechanism comprises:

[0013] A sliding assembly, wherein the outer wall of the device body is rotatably connected to a first threaded rod, one end of the first threaded rod is fixedly connected to a first knob, the outer wall of the first threaded rod is threadedly connected to a moving rod slidably connected to the outer wall of the device body, and a sliding groove is provided at a connection portion between the outer wall of the device body and the moving rod;

[0014] A lifting component, wherein the outer wall of the moving rod is rotatably connected to a second threaded rod, one end of the second threaded rod is fixedly connected to a second knob, the outer wall of the second threaded rod is threadedly connected to a lifting block slidably connected to the outer wall of the moving rod, a fixing groove is provided at a connection portion between the outer wall of the moving rod and the lifting block, the outer wall of the lifting block is rotatably connected to a connecting block, and the outer wall of the connecting block is snap-connected to an adjusting disk;

[0015] Wherein, two ends of the adjustment disk are rotatably connected with auxiliary wheels which fit the outer wall of the placement disk.

[0016] As a preferred embodiment of the present invention, a filling port is provided on the top of the mixing barrel, an outer wall of the connector is provided with an outer spiral, and an inner spiral is provided at the connection portion between the inner wall of the connecting pump port and the outer spiral;

[0017] The outer spiral and the inner spiral are connected by threads, the outer wall of the connecting block is provided with a mounting mechanism, the outer wall of the device body is provided with a cleaning mechanism located on one side of the polishing disk, and the inner wall of the mixing barrel is provided with a mixing mechanism.

[0018] As a preferred solution of the present invention, the mounting mechanism comprises:

[0019] An installation box, the outer wall of the connecting block is fixedly connected to the installation box, the outer wall of the adjusting disk is fixedly connected to a plug rod slidably connected to the outer wall of the installation box, the outer wall of the plug rod is clamped and connected to a card block, the outer wall of the card block is fixedly connected to a telescopic rod slidably connected to the outer wall of the installation box, and the outer wall of the telescopic rod is sleeved with a first spring fixedly connected to the inner wall of the installation box;

[0020] A rotating rod, the outer wall of the block is rotatably connected to the rotating rod, one end of the rotating rod is rotatably connected to a connecting rod, the bottom of the connecting rod is fixedly connected to a second spring fixedly connected to the inner wall of the installation box, and the top of the connecting rod is fixedly connected to a pull rod slidably connected to the outer wall of the installation box;

[0021] The bottom of the adjusting disk is fixedly connected with an inserting block which is slidably connected with the outer wall of the connecting block, and a slot is provided at the connection position between the outer wall of the connecting block and the inserting block.

[0022] As a preferred solution of the present invention, the extrusion parts of the insertion rod and the clamping block are arc-shaped, and two groups of the clamping blocks and telescopic rods are provided, and the position distribution of the two groups of the clamping blocks and telescopic rods is symmetrical about the central axis of the insertion rod;

[0023] One end of the first spring is fixedly connected to the inner wall of the installation box, and the other end of the first spring is fixedly connected to the outer wall of the clamping block.

[0024] As a preferred solution of the present invention, the rotating rod forms a rotating structure through a clamping block and a connecting rod, and two groups of rotating rods are provided, and the positions of the two groups of rotating rods are distributed symmetrically about the central axis of the connecting rod.

[0025] As a preferred embodiment of the present invention, the cleaning mechanism comprises:

[0026] A fixed rod, the outer wall of the fixed rod is rotatably connected to a third threaded rod, one end of the third threaded rod is fixedly connected to a third knob, the outer wall of the third threaded rod is threadedly connected to a lifting rod slidably connected to the outer wall of the fixed rod, and a limiting groove is provided at the connection portion between the outer wall of the fixed rod and the lifting rod;

[0027] A fourth threaded rod, wherein the side wall of the lifting rod is rotatably connected to the fourth threaded rod, one end of the fourth threaded rod is fixedly connected to a servo motor, the outer wall of the fourth threaded rod is threadedly connected to an extension rod telescopically connected to the side wall of the lifting rod, a telescopic groove is provided at the connection portion between the side wall of the lifting rod and the extension rod, and one end of the extension rod is fixedly connected to a cleaning scraper.

[0028] As a preferred solution of the present invention, the lifting rod forms a lifting structure through the third threaded rod and the limiting groove, and the cleaning scraper forms a lifting structure through the lifting rod and the limiting groove;

[0029] Wherein, the cleaning scraper forms a telescopic structure through the fourth threaded rod and the extension rod and the telescopic slot.

[0030] As a preferred embodiment of the present invention, the stirring mechanism comprises:

[0031] A driving motor, wherein the outer wall of the device body is fixedly connected to the driving motor, the output end of the driving motor is fixedly connected to a rotating shaft rotatably connected to the inner wall of the mixing barrel, the outer wall of the rotating shaft is fixedly connected to a connecting block, and the outer wall of the connecting block is fixedly connected to a fixed scraper that fits the inner wall of the mixing barrel;

[0032] A telescopic block, the outer wall of the connecting block is slidably connected to the telescopic block, the outer wall of the telescopic block is rotatably connected to a swing rod, one end of the swing rod is rotatably connected to a telescopic scraper slidably connected to the inner wall of the fixed scraper, and the bottom of the telescopic scraper is fixedly connected to a lifting rod slidably connected to the inner wall of the fixed scraper.

[0033] As a preferred solution of the present invention, the telescopic block is driven by a micro moisture-proof electric pusher, and the outer wall profiles of the fixed scraper and the telescopic scraper are both cylindrical;

[0034] There are two groups of swing rods and telescopic scrapers, and the positions of the two groups of swing rods and telescopic scrapers are symmetrical with respect to the central axis of the fixed scraper.

[0035] As a preferred solution of the present invention, the lifting rod forms a telescopic structure with the fixed scraper through a telescopic block and a swing rod, and a connecting groove is provided at the connecting portion between the inner wall of the fixed scraper and the lifting rod.

[0036] Compared with the prior art, one or more of the above technical solutions have the following beneficial effects:

[0037] 1. A polishing device for surface processing of gallium antimonide wafers. When the surface of the gallium antimonide wafer is polished by the polishing device, in order to improve the stability of the outer wall limit of the placement plate with different outer wall contours and achieve the effect of stability of the rotational polishing of different numbers of gallium antimonide wafers, according to the need of the limit plate and the outer wall of the placement plate fitting the contour, the pull rod is pulled through the connection of the connecting rod to drive the second spring to perform synchronous stretching movement, and through the rotation connection of the rotating rod, the clamping block fixedly connected to the telescopic rod is driven to slide toward the outer wall of the installation box, and the first spring is squeezed to make the clamping block and the insertion rod not contact each other, and under the connection of the insertion rod, the limit plate is pulled out of the installation box, and the insertion block is pulled out synchronously along the inner wall of the slot, so as to achieve the effect of convenient assembly and disassembly of the limit plates with different outer wall contour diameters, and play the role of stability of polishing limit of different numbers of gallium antimonide wafers;

[0038] 2. A polishing device for processing the surface of a gallium antimonide wafer. When the surface of a gallium antimonide wafer is processed and produced by the polishing device, in order to improve the convenience of cleaning impurities on the surface of the polishing disc after the polishing disc has been rotated and polished for a long time, and to prevent the subsequent gallium antimonide wafer from absorbing impurities when placed on the polishing disc, thereby increasing the cumbersomeness of polishing the surface of the gallium antimonide wafer, the third knob can be regularly rotated to drive the lifting rod to slide along the inner wall of the limit groove through the rotation of the third threaded rod. The sliding of the lifting rod drives the cleaning scraper to fit the surface of the polishing disc, and under the rotation of the polishing disc, drives the cleaning scraper to clean the impurities on the surface of the polishing disc. At the same time, the servo motor can be turned on to drive the cleaning scraper to perform telescopic movement through the rotation of the fourth threaded rod, thereby playing the role of all-round rotational cleaning of the surface of the polishing disc, thereby achieving the effect of improving the cleanliness of the subsequent surface of the gallium antimonide wafer;

[0039] 3. In the polishing device for surface processing of gallium antimonide wafers, when the polishing liquid is added and stored through a stirring barrel, in order to improve the convenience of automatically adding and stirring the polishing liquid in the stirring barrel, after the polishing liquid is added from the filling port, the driving motor is turned on through the connection of the rotating shaft to drive the fixed scraper fixedly connected to the connecting block to perform synchronous rotational movement, and at the same time, the swing rod is driven to perform synchronous rotational movement along the rotation center of the rotating shaft, so as to achieve the effect of automatically stirring the polishing liquid added in the stirring barrel, thereby improving the work efficiency of the staff;

[0040] 4. This kind of polishing device for surface processing of gallium antimonide wafers, when the polishing liquid is added and stored through a stirring barrel, in order to improve the effect of synchronous scraping and cleaning of the polishing liquid adsorbed on the inner wall of the stirring barrel, the telescopic block can be driven to slide along the outer wall of the connecting block. The sliding of the telescopic block drives the telescopic scraper fixedly connected to the lifting rod to perform telescopic movement along the end of the fixed scraper through the rotation of the swing rod, thereby achieving the effect of effectively adjusting the scraping range of the inner wall of the stirring barrel and, at the same time, playing a role in fully utilizing the polishing liquid adsorbed to the stirring barrel. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The accompanying drawings in the specification, which constitute a part of the present invention, are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0042] In addition, the terms "installed", "set", "provided with", "connected", "connected", and "socketed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0043] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0044] Figure 2 It is a schematic structural diagram of the overall side view of the present invention;

[0045] Figure 3 It is a structural schematic diagram of the position distribution of the polishing disc of the present invention;

[0046] Figure 4 It is a structural schematic diagram of the position distribution of the limit plate of the present invention;

[0047] Figure 5 It is a schematic diagram of the structure of the explosion placing plate of the present invention;

[0048] Figure 6 It is a schematic diagram of the structure inside the installation box of the present invention;

[0049] Figure 7 It is a structural schematic diagram of the position distribution of the plug-in block and the slot of the present invention;

[0050] Figure 8 It is a schematic diagram of the structure of the cleaning scraper;

[0051] Fig. 9 It is a schematic diagram of the structure of the internal section of the mixing barrel;

[0052] Fig.10 It is a schematic diagram of the structure of the connection between the swing rod and the telescopic scraper;

[0053] Fig.11 It is a structural schematic diagram of the position distribution of the outer spiral and the inner spiral of the present invention;

[0054] In the figure:

[0055] 1. Device body;

[0056] 2. Polishing disc;

[0057] 3. Mixing barrel;

[0058] 4. Connect the pump port;

[0059] 5. Connector;

[0060] 6. Delivery pipe;

[0061] 7. Connecting frame;

[0062] 8. Place the plate;

[0063] 9. Wafer body;

[0064] 10. Limit plate;

[0065] 11. Pressing plate;

[0066] 12. Positioning plate;

[0067] 13. Sliding assembly; 1301. First threaded rod; 1302. First knob; 1303. Moving rod; 1304. Sliding groove;

[0068] 14. lifting assembly; 1401. second threaded rod; 1402. second knob; 1403. lifting block; 1404. connecting block; 1405. adjusting plate; 1406. fixing slot; 1407. auxiliary wheel;

[0069] 15. Installation mechanism; 1501. Installation box; 1502. Insertion rod; 1503. Block; 1504. Telescopic rod; 1505. First spring; 1506. Rotation rod; 1507. Connecting rod; 1508. Second spring; 1509. Pull rod; 1510. Insertion block; 1511. Slot;

[0070] 16. Cleaning mechanism; 1601. Fixed rod; 1602. Third threaded rod; 1603. Third knob; 1604. Lifting rod; 1605. Limiting groove; 1606. Fourth threaded rod; 1607. Servo motor; 1608. Extension rod; 1609. Telescopic groove; 1610. Cleaning scraper;

[0071] 17. stirring mechanism; 1701. driving motor; 1702. rotating shaft; 1703. connecting block; 1704. fixed scraper; 1705. lifting rod; 1706. telescopic block; 1707. swing rod; 1708. telescopic scraper;

[0072] 18. Filling port; 19. External spiral; 20. Internal spiral; 21. Adjustment mechanism. DETAILED DESCRIPTION

[0073] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0074] See also Figure 1-Figure 11A polishing device for surface processing of gallium antimonide wafers, comprising a device body 1, a polishing disc 2, a stirring barrel 3, a connecting pump port 4, a connecting head 5, a conveying pipe 6, a connecting frame 7, a placing plate 8, a wafer body 9, a limiting plate 10, a pressing plate 11, a positioning plate 12 and an adjusting mechanism 21, wherein the outer wall of the device body 1 is rotatably connected with the polishing disc 2, the outer wall of the device body 1 is fixedly connected with the stirring barrel 3, the connecting pump port 4 is arranged at the top of the stirring barrel 3, the inner wall of the connecting pump port 4 is detachably connected with the connecting head 5, and the connecting The outer wall of the joint 5 is fixedly connected with a conveying pipe 6, the outer wall of the device body 1 is fixedly connected with a connecting frame 7 sleeved on the outer wall of the conveying pipe 6, the placement plate 8 is placed on the surface of the polishing plate 2, the bottom of the placement plate 8 is provided with a wafer body 9, the outer wall of the placement plate 8 is sleeved with a limiting plate 10, the inner wall of the limiting plate 10 is placed with a pressing plate 11 that fits with the top of the placement plate 8, and the inner wall of the limiting plate 10 is placed with a positioning plate 12 located above the pressing plate 11; the adjustment mechanism 21 includes: a sliding component 13, a device body The outer wall of the lifting assembly 1 is rotatably connected to a first threaded rod 1301, one end of the first threaded rod 1301 is fixedly connected to a first knob 1302, the outer wall of the first threaded rod 1301 is threadedly connected to a moving rod 1303 slidably connected to the outer wall of the device body 1, and a sliding groove 1304 is provided at the connection portion between the outer wall of the device body 1 and the moving rod 1303; the lifting assembly 14, the outer wall of the moving rod 1303 is rotatably connected to a second threaded rod 1401, one end of the second threaded rod 1401 is fixedly connected to the first knob 1302, the outer wall of the first threaded rod 1301 is threadedly connected to a moving rod 1303 slidably connected to the outer wall of the device body 1, and a sliding groove 1304 is provided at the connection portion between the outer wall of the device body 1 and the moving rod 1303 The second knob 1402, the outer wall of the second threaded rod 1401 is threadedly connected with a lifting block 1403 which is slidably connected to the outer wall of the moving rod 1303, a fixing groove 1406 is provided at the connection position between the outer wall of the moving rod 1303 and the lifting block 1403, the outer wall of the lifting block 1403 is rotatably connected with a connecting block 1404, and the outer wall of the connecting block 1404 is snap-connected with an adjusting disk 1405; wherein, the two ends of the adjusting disk 1405 are rotatably connected with auxiliary wheels 1407 which fit with the outer wall of the placement disk 8.

[0075] The above working principle: when the surface of the gallium antimonide wafer is polished by the polishing device, in order to improve the stability of the outer wall limit of the placement plate 8 with different outer wall contours and achieve the effect of the stability of the rotational polishing of different numbers of gallium antimonide wafers, according to the need of the limit plate 10 and the outer wall of the placement plate 8 to fit the contour, the pull rod 1509 is pulled through the connection of the connecting rod 1507 to drive the second spring 1508 to perform synchronous stretching movement, and through the rotation connection of the rotating rod 1506, the second spring 1508 is driven to perform synchronous stretching movement. The fixedly connected clamping block 1503 slides toward the outer wall of the installation box 1501 and squeezes the first spring 1505, so that the clamping block 1503 and the insertion rod 1502 are not in contact with each other. Under the connection of the insertion rod 1502, the limit plate 10 is pulled out from the installation box 1501, and the insertion block 1510 is pulled out synchronously along the inner wall of the slot 1511, so as to achieve the effect of facilitating the engagement and disassembly of the limit plates 10 with different outer wall profile diameters, and play a role in the polishing limit stability of different numbers of gallium antimonide wafers.

[0076] Specific reference Fig.11 A filling port 18 is provided on the top of the mixing barrel 3, an outer wall of the connecting head 5 is provided with an outer spiral 19, and an inner spiral 20 is provided at the connecting portion between the inner wall of the connecting pump port 4 and the outer spiral 19; wherein, the outer spiral 19 and the inner spiral 20 are threadedly connected, an installation mechanism 15 is provided on the outer wall of the connecting block 1404, a cleaning mechanism 16 located on one side of the polishing disc 2 is provided on the outer wall of the device body 1, and a stirring mechanism 17 is provided on the inner wall of the mixing barrel 3.

[0077] The polishing device for surface processing of gallium antimonide wafers of the present invention is provided with an outer spiral 19 and an inner spiral 20, so that the polishing liquid delivery pipe 6 can be disassembled from the top of the stirring barrel 3, so as to achieve the effect of conveniently clearing and cleaning the residue inside the delivery pipe 6. At the same time, through the provision of the mounting mechanism 15 and the cleaning mechanism 16, the stability of limiting the placement plates 8 of different sizes is improved, and the surface cleanliness of the polishing plate 2 is improved.

[0078] Specific reference Figure 6The installation mechanism 15 includes: an installation box 1501, an outer wall of the connecting block 1404 is fixedly connected to the installation box 1501, an outer wall of the adjusting disk 1405 is fixedly connected to a plug rod 1502 which is slidably connected to the outer wall of the installation box 1501, an outer wall of the plug rod 1502 is snap-connected to a block 1503, an outer wall of the block 1503 is fixedly connected to a telescopic rod 1504 which is slidably connected to the outer wall of the installation box 1501, and an outer wall of the telescopic rod 1504 is sleeved with a first spring 1505 which is fixedly connected to the inner wall of the installation box 1501; a rotating rod 1506, a block 1503 The outer wall is rotatably connected to a rotating rod 1506, one end of the rotating rod 1506 is rotatably connected to a connecting rod 1507, the bottom of the connecting rod 1507 is fixedly connected to a second spring 1508 fixedly connected to the inner wall of the installation box 1501, the top of the connecting rod 1507 is fixedly connected to a pull rod 1509 slidably connected to the outer wall of the installation box 1501; an insert block 1510, the bottom of the adjusting disk 1405 is fixedly connected to an insert block 1510 slidably connected to the outer wall of the connecting block 1404, and a slot 1511 is provided at the connection between the outer wall of the connecting block 1404 and the insert block 1510.

[0079] In this embodiment, the extrusion parts of the insertion rod 1502 and the block 1503 are arc-shaped, and two groups of the block 1503 and the telescopic rod 1504 are provided. The position distribution of the two groups of the block 1503 and the telescopic rod 1504 is symmetrical about the central axis of the insertion rod 1502; wherein, one end of the first spring 1505 is fixedly connected to the inner wall of the installation box 1501, and the other end of the first spring 1505 is fixedly connected to the outer wall of the block 1503, which is beneficial to facilitate the installation of the limit plate 10 by setting the extrusion parts of the insertion rod 1502 and the block 1503 in an arc shape.

[0080] At the same time, in the present embodiment, the rotating rod 1506 forms a rotating structure through the clamping block 1503 and the connecting rod 1507. Two groups of rotating rods 1506 are provided. The position distribution of the two groups of rotating rods 1506 is symmetrical about the central axis of the connecting rod 1507, which is beneficial to the movement of the clamping block 1503 through the connection of the connecting rod 1507, thereby driving the rotating rod 1506 to rotate conveniently, thereby improving the stability of limiting the placement plates 8 of different sizes, and playing a role in improving the surface cleanliness of the polishing plate 2.

[0081] A polishing device for surface processing of gallium antimonide wafers of the present invention, when the surface of the gallium antimonide wafer is processed and produced by the polishing device, in order to improve the convenience of cleaning impurities on the surface of the polishing disc 2 after the polishing disc 2 is rotated and polished for a long time, and to prevent the subsequent gallium antimonide wafers from absorbing impurities when placed on the polishing disc 2, thereby increasing the cumbersomeness of polishing the surface of the gallium antimonide wafer, the third knob 1603 can be rotated regularly to drive the lifting rod 1604 to slide along the inner wall of the limiting groove 1605 through the rotational movement of the third threaded rod 1602, and the sliding of the lifting rod 1604 drives the cleaning scraper 1610 to fit the surface of the polishing disc 2, and under the rotational movement of the polishing disc 2, drives the cleaning scraper 1610 to clean the impurities on the surface of the polishing disc 2, and at the same time, the servo motor 1607 can be turned on to drive the cleaning scraper 1610 to perform telescopic movement through the rotation of the fourth threaded rod 1606, so as to play the role of all-round rotational cleaning of the surface of the polishing disc 2, thereby achieving the effect of improving the cleanliness of the subsequent gallium antimonide wafer surface polishing.

[0082] Specific reference Figure 8 The cleaning mechanism 16 includes: a fixed rod 1601, the outer wall of the fixed rod 1601 is rotatably connected to a third threaded rod 1602, one end of the third threaded rod 1602 is fixedly connected to a third knob 1603, the outer wall of the third threaded rod 1602 is threadedly connected to a lifting rod 1604 slidably connected to the outer wall of the fixed rod 1601, and a limiting groove 1605 is provided at the connection position between the outer wall of the fixed rod 1601 and the lifting rod 1604; a fourth threaded rod 1606, the side wall of the lifting rod 1604 is rotatably connected to the fourth threaded rod 1606, one end of the fourth threaded rod 1606 is fixedly connected to a servo motor 1607, the outer wall of the fourth threaded rod 1606 is threadedly connected to an extension rod 1608 telescopically connected to the side wall of the lifting rod 1604, a telescopic groove 1609 is provided at the connection position between the side wall of the lifting rod 1604 and the extension rod 1608, and one end of the extension rod 1608 is fixedly connected to a cleaning scraper 1610.

[0083] In this embodiment, the lifting rod 1604 forms a lifting structure through the third threaded rod 1602 and the limiting groove 1605, and the cleaning scraper 1610 forms a lifting structure through the lifting rod 1604 and the limiting groove 1605; wherein, the cleaning scraper 1610 forms a telescopic structure through the fourth threaded rod 1606 and the extension rod 1608 and the telescopic groove 1609, which is beneficial to the rotational movement of the third threaded rod 1602, driving the lifting rod 1604 to slide along the inner wall of the limiting groove 1605, thereby driving the cleaning scraper 1610 to conveniently adjust its height.

[0084] A polishing device for surface processing of gallium antimonide wafers of the present invention, when the polishing liquid is added and stored through the stirring barrel 3, in order to improve the convenience of automatically adding and stirring the polishing liquid in the stirring barrel 3, the polishing liquid can be added from the filling port 18, and then the driving motor 1701 is turned on through the connection of the rotating shaft 1702, so as to drive the fixed scraper 1704 fixedly connected to the connecting block 1703 to perform synchronous rotation movement, and at the same time, drive the swing rod 1707 to perform synchronous rotation movement along the rotation center of the rotating shaft 1702, so as to achieve the effect of automatically stirring the polishing liquid added in the stirring barrel 3, thereby improving the work efficiency of the staff.

[0085] 7. Specific reference Fig. 9 and Fig.10 The stirring mechanism 17 includes: a driving motor 1701, the driving motor 1701 is fixedly connected to the outer wall of the device body 1, the output end of the driving motor 1701 is fixedly connected to a rotating shaft 1702 rotatably connected to the inner wall of the stirring barrel 3, the outer wall of the rotating shaft 1702 is fixedly connected to a connecting block 1703, the outer wall of the connecting block 1703 is fixedly connected to a fixed scraper 1704 that fits the inner wall of the stirring barrel 3; a telescopic block 1706, the outer wall of the connecting block 1703 is slidably connected to the telescopic block 1706, the outer wall of the telescopic block 1706 is rotatably connected to a swing rod 1707, one end of the swing rod 1707 is rotatably connected to a telescopic scraper 1708 slidably connected to the inner wall of the fixed scraper 1704, and the bottom of the telescopic scraper 1708 is fixedly connected to a lifting rod 1705 slidably connected to the inner wall of the fixed scraper 1704.

[0086] In this embodiment, the telescopic block 1706 is driven by a micro moisture-proof electric pusher, and the outer wall contours of the fixed scraper 1704 and the telescopic scraper 1708 are both cylindrical; wherein, two groups of swing rods 1707 and telescopic scrapers 1708 are provided, and the position distributions of the two groups of swing rods 1707 and telescopic scrapers 1708 are symmetrical about the central axis of the fixed scraper 1704, which is beneficial to the cylindrical outer wall contours of the fixed scraper 1704 and the telescopic scraper 1708, so as to synchronously scrape off the stirring liquid adsorbed on the inner wall of the mixing barrel 3.

[0087] At the same time, in the present embodiment, the lifting rod 1705 forms a telescopic structure with the fixed scraper 1704 through the telescopic block 1706 and the swing rod 1707. A connecting groove is provided at the connecting portion between the inner wall of the fixed scraper 1704 and the lifting rod 1705, which is beneficial for the sliding of the telescopic block 1706 through the rotation of the swing rod 1707, thereby driving the lifting rod 1705 to perform telescopic movement along the inner wall of the fixed scraper 1704, thereby achieving the effect of effectively adjusting the scraping range of the inner wall of the mixing barrel 3, and at the same time, playing the role of fully utilizing the polishing liquid adsorbed to the mixing barrel 3.

[0088] The polishing device for surface processing of gallium antimonide wafers of the present invention, when the polishing liquid is added and stored for use through the stirring barrel 3, in order to improve the effect of synchronously scraping and cleaning the polishing liquid adsorbed on the inner wall of the stirring barrel 3, the telescopic block 1706 can be driven to slide along the outer wall of the connecting block 1703. The sliding of the telescopic block 1706 drives the telescopic scraper 1708 fixedly connected to the lifting rod 1705 to perform telescopic movement along the end of the fixed scraper 1704 through the rotation of the swing rod 1707, thereby achieving the effect of effectively adjusting the scraping range of the inner wall of the stirring barrel 3, and at the same time, playing a role in fully utilizing the polishing liquid adsorbed to the stirring barrel 3.

[0089] The above are only preferred specific implementation modes of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solutions and inventive concepts of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A polishing device for surface processing of gallium antimonide wafers, comprising a device body (1), a polishing plate (2), a stirring barrel (3), a connecting pump port (4), a connecting head (5), a delivery pipe (6), a connecting frame (7), a placement plate (8), a wafer body (9), a limiting plate (10), a pressing plate (11), a positioning plate (12) and an adjusting mechanism (21), characterized in that: The outer wall of the device body (1) is rotatably connected to a polishing disc (2), the outer wall of the device body (1) is fixedly connected to a stirring barrel (3), the connecting pump port (4) is arranged at the top of the stirring barrel (3), the inner wall of the connecting pump port (4) is detachably connected to a connector (5), the outer wall of the connector (5) is fixedly connected to a delivery pipe (6), the outer wall of the device body (1) is fixedly connected to a connecting frame (7) sleeved on the outer wall of the delivery pipe (6), the placement disc (8) is placed on the surface of the polishing disc (2), the bottom of the placement disc (8) is provided with a wafer body (9), the outer wall of the placement disc (8) is sleeved with a limiting disc (10), the inner wall of the limiting disc (10) is provided with a pressing plate (11) that fits with the top of the placement disc (8), and the inner wall of the limiting disc (10) is provided with a positioning plate (12) located above the pressing plate (11); The regulating mechanism (21) comprises: A sliding assembly (13), wherein the outer wall of the device body (1) is rotatably connected to a first threaded rod (1301), one end of the first threaded rod (1301) is fixedly connected to a first knob (1302), the outer wall of the first threaded rod (1301) is threadedly connected to a moving rod (1303) slidably connected to the outer wall of the device body (1), and a sliding groove (1304) is provided at a connection portion between the outer wall of the device body (1) and the moving rod (1303); A lifting assembly (14), wherein the outer wall of the moving rod (1303) is rotatably connected to a second threaded rod (1401), one end of the second threaded rod (1401) is fixedly connected to a second knob (1402), the outer wall of the second threaded rod (1401) is threadedly connected to a lifting block (1403) slidably connected to the outer wall of the moving rod (1303), a fixing groove (1406) is provided at a connection portion between the outer wall of the moving rod (1303) and the lifting block (1403), the outer wall of the lifting block (1403) is rotatably connected to a connecting block (1404), and the outer wall of the connecting block (1404) is snap-connected to an adjusting disk (1405); Wherein, two ends of the adjustment disk (1405) are rotatably connected with auxiliary wheels (1407) that fit the outer wall of the placement disk (8); The top of the mixing barrel (3) is provided with a filling port (18), the outer wall of the connecting head (5) is provided with an outer spiral (19), and the connecting portion between the inner wall of the connecting pump port (4) and the outer spiral (19) is provided with an inner spiral (20); The outer spiral (19) and the inner spiral (20) are connected by a threaded connection, the outer wall of the connecting block (1404) is provided with a mounting mechanism (15), the outer wall of the device body (1) is provided with a cleaning mechanism (16) located on one side of the polishing disc (2), and the inner wall of the stirring barrel (3) is provided with a stirring mechanism (17); The stirring mechanism (17) comprises: A driving motor (1701), the outer wall of the device body (1) being fixedly connected to the driving motor (1701), the output end of the driving motor (1701) being fixedly connected to a rotating shaft (1702) rotatably connected to the inner wall of the mixing barrel (3), the outer wall of the rotating shaft (1702) being fixedly connected to a connecting block (1703), the outer wall of the connecting block (1703) being fixedly connected to a fixed scraper (1704) in contact with the inner wall of the mixing barrel (3); A telescopic block (1706), wherein the outer wall of the connecting block (1703) is slidably connected to the telescopic block (1706), the outer wall of the telescopic block (1706) is rotatably connected to a swing rod (1707), one end of the swing rod (1707) is rotatably connected to a telescopic scraper (1708) slidably connected to the inner wall of the fixed scraper (1704), and the bottom of the telescopic scraper (1708) is fixedly connected to a lifting rod (1705) slidably connected to the inner wall of the fixed scraper (1704); The telescopic block (1706) is driven by a micro moisture-proof electric pusher, and the outer wall profiles of the fixed scraper (1704) and the telescopic scraper (1708) are both cylindrical; There are two groups of the swing rod (1707) and the telescopic scraper (1708), and the positions of the two groups of the swing rod (1707) and the telescopic scraper (1708) are symmetrical about the central axis of the fixed scraper (1704).

2. The polishing device for surface processing of gallium antimonide wafer according to claim 1, characterized in that: The mounting mechanism (15) comprises: an installation box (1501), the outer wall of the connecting block (1404) is fixedly connected to the installation box (1501), the outer wall of the adjusting disk (1405) is fixedly connected to an insertion rod (1502) slidably connected to the outer wall of the installation box (1501), the outer wall of the insertion rod (1502) is snap-connected to a clamping block (1503), the outer wall of the clamping block (1503) is fixedly connected to a telescopic rod (1504) slidably connected to the outer wall of the installation box (1501), and the outer wall of the telescopic rod (1504) is sleeved with a first spring (1505) fixedly connected to the inner wall of the installation box (1501); A rotating rod (1506), the outer wall of the clamping block (1503) is rotatably connected to the rotating rod (1506), one end of the rotating rod (1506) is rotatably connected to a connecting rod (1507), the bottom of the connecting rod (1507) is fixedly connected to a second spring (1508) fixedly connected to the inner wall of the installation box (1501), and the top of the connecting rod (1507) is fixedly connected to a pull rod (1509) slidably connected to the outer wall of the installation box (1501); The bottom of the adjustment disk (1405) is fixedly connected with an insert block (1510) which is slidably connected to the outer wall of the connection block (1404), and a slot (1511) is provided at the connection portion between the outer wall of the connection block (1404) and the insert block (1510).

3. The polishing device for surface processing of gallium antimonide wafer according to claim 2, characterized in that: The extrusion parts of the insertion rod (1502) and the clamping block (1503) are in an arc shape, and two groups of the clamping block (1503) and the telescopic rod (1504) are provided, and the positions of the two groups of the clamping block (1503) and the telescopic rod (1504) are distributed symmetrically with respect to the central axis of the insertion rod (1502); One end of the first spring (1505) is fixedly connected to the inner wall of the installation box (1501), and the other end of the first spring (1505) is fixedly connected to the outer wall of the clamping block (1503).

4. The polishing device for surface processing of gallium antimonide wafer according to claim 2, characterized in that: The rotating rod (1506) forms a rotating structure through the clamping block (1503) and the connecting rod (1507). Two groups of the rotating rod (1506) are provided, and the positions of the two groups of the rotating rod (1506) are symmetrical about the central axis of the connecting rod (1507).

5. The polishing device for surface processing of gallium antimonide wafer according to claim 1, characterized in that: The cleaning mechanism (16) comprises: A fixed rod (1601), the outer wall of the fixed rod (1601) being rotatably connected to a third threaded rod (1602), one end of the third threaded rod (1602) being fixedly connected to a third knob (1603), the outer wall of the third threaded rod (1602) being threadedly connected to a lifting rod (1604) slidably connected to the outer wall of the fixed rod (1601), and a limiting groove (1605) being provided at a connection portion between the outer wall of the fixed rod (1601) and the lifting rod (1604); A fourth threaded rod (1606), the side wall of the lifting rod (1604) is rotatably connected to the fourth threaded rod (1606), one end of the fourth threaded rod (1606) is fixedly connected to a servo motor (1607), the outer wall of the fourth threaded rod (1606) is threadedly connected to an extension rod (1608) telescopically connected to the side wall of the lifting rod (1604), a telescopic groove (1609) is provided at the connection portion between the side wall of the lifting rod (1604) and the extension rod (1608), and one end of the extension rod (1608) is fixedly connected to a cleaning scraper (1610).

6. The polishing device for surface processing of gallium antimonide wafer according to claim 5, characterized in that: The lifting rod (1604) forms a lifting structure through the third threaded rod (1602) and the limiting groove (1605), and the cleaning scraper (1610) forms a lifting structure through the lifting rod (1604) and the limiting groove (1605); The cleaning scraper (1610) forms a telescopic structure with the telescopic groove (1609) through the fourth threaded rod (1606) and the extension rod (1608).

7. The polishing device for surface processing of gallium antimonide wafer according to claim 1, characterized in that: The lifting rod (1705) forms a telescopic structure with the fixed scraper (1704) through the telescopic block (1706) and the swing rod (1707), and a connecting groove is provided at the connection position between the inner wall of the fixed scraper (1704) and the lifting rod (1705).

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