Chip stacking packaging film, preparation method and application thereof

Abstract

The present invention discloses a chip stacking packaging film, a preparation method and application thereof, wherein the raw materials of the chip stacking packaging film include: 40 to 45 parts by mass of inorganic filler, 22 to 25 parts by mass of polyether modified epoxy resin, 15 to 17 parts by mass of acrylic rubber modified epoxy resin, 5 to 15 parts by mass of CTBN modified epoxy resin, 10 to 12 parts by mass of bisphenol F type epoxy resin, 10 to 15 parts by mass of bisphenol F type benzoxazine, 2 to 6 parts by mass of curing agent, and 0.4 to 0.8 parts by mass of accelerator. The chip stacking packaging film of the present invention has excellent flexibility, fluidity and silicon wafer adhesion, as well as low storage modulus and low moisture absorption rate, and can be applied to multi-chip stacking packaging.

Description

Technical Field

[0001] The present application relates to the field of semiconductor chip packaging, and in particular to a chip stacking packaging film, a preparation method thereof, and applications thereof. Background Art

[0002] The chip stacking packaging film is used to fix the chip on the substrate. The method of use is: stick the packaging film on the chip, then cut the chip, stick the cut chip on the substrate through the packaging film, and after wire bonding, cover it with another cut chip, and realize multi-chip packaging by stacking layers. When packaging multiple chips, the welding wire needs to penetrate the packaging film to realize the interconnection between multiple layers of chips. Therefore, the chip stacking packaging film should have good wire embedding performance. The wire embedding performance is a comprehensive performance of fluidity and flexibility. Good wire embedding performance corresponds to good fluidity and good flexibility. However, the wire embedding performance of the chip stacking packaging film still needs to be further improved. In addition, in the multi-chip stacking package, the packaging film with a higher storage modulus will cause greater stress, which will cause the chip to break or detach, so the storage modulus of the packaging film needs to be further reduced. Summary of the invention

[0003] The purpose of the present application is to provide a chip stacking packaging film, a preparation method and application thereof, wherein the chip stacking packaging film has excellent flexibility, fluidity and silicon wafer adhesion, as well as low storage modulus and low moisture absorption rate.

[0004] On the one hand, the present application provides a chip stacking packaging film, whose raw materials include: 40 to 45 parts by mass of inorganic filler, 22 to 25 parts by mass of polyether modified epoxy resin, 15 to 17 parts by mass of acrylic rubber modified epoxy resin, 5 to 15 parts by mass of CTBN modified epoxy resin, 10 to 12 parts by mass of bisphenol F type epoxy resin, 10 to 15 parts by mass of bisphenol F type benzoxazine, 2 to 6 parts by mass of curing agent, and 0.4 to 0.8 parts by mass of accelerator.

[0005] In some embodiments, the raw materials of the chip stacking packaging film include:

[0006] 40-42 parts by mass of inorganic filler, 22-25 parts by mass of polyether modified epoxy resin, 15 parts by mass of acrylic rubber modified epoxy resin, 8-15 parts by mass of CTBN modified epoxy resin, 10 parts by mass of bisphenol F type epoxy resin, 10-15 parts by mass of bisphenol F type benzoxazine, 2-6 parts by mass of curing agent, and 0.4-0.8 parts by mass of accelerator.

[0007] In some embodiments, the raw materials of the chip stacking packaging film include:

[0008] 40 parts by mass of inorganic filler, 25 parts by mass of polyether modified epoxy resin, 15 parts by mass of acrylic rubber modified epoxy resin, 10-15 parts by mass of CTBN modified epoxy resin, 10 parts by mass of bisphenol F type epoxy resin, 10-15 parts by mass of bisphenol F type benzoxazine, 2-6 parts by mass of curing agent, and 0.4-0.8 parts by mass of accelerator.

[0009] In some embodiments, the acrylic rubber modified epoxy resin includes SR-828R10 acrylic rubber modified epoxy resin and YLER-200V30 acrylic rubber modified epoxy resin, wherein the SR-828R10 acrylic rubber modified epoxy resin is 0-12 parts by mass and the YLER-200V30 acrylic rubber modified epoxy resin is 5-15 parts by mass.

[0010] In some embodiments, the acrylic rubber modified epoxy resin includes SR-828R10 acrylic rubber modified epoxy resin and YLER-200V30 acrylic rubber modified epoxy resin, wherein the SR-828R10 acrylic rubber modified epoxy resin is 0-10 parts by weight and the YLER-200V30 acrylic rubber modified epoxy resin is 5-15 parts by weight.

[0011] In some embodiments, the acrylic rubber modified epoxy resin includes SR-828R10 acrylic rubber modified epoxy resin and YLER-200V30 acrylic rubber modified epoxy resin, wherein the SR-828R10 acrylic rubber modified epoxy resin is 0-5 parts by mass and the YLER-200V30 acrylic rubber modified epoxy resin is 10-15 parts by mass.

[0012] In some embodiments, the inorganic filler is selected from silica, preferably spherical silica with a particle size of 0.1-0.9 um.

[0013] In some embodiments, the curing agent is an amine curing agent, and the accelerator is an imidazole accelerator.

[0014] The second object of the present application is to provide a method for preparing the above-mentioned chip stacking packaging film, comprising:

[0015] The raw materials are taken according to the ratio and mixed, and the mixed raw materials are ground into a colloid by a bead mill, and then vacuum degassing is performed to obtain a glue liquid, and a coating machine is used to coat the glue liquid to obtain a packaging film.

[0016] The third objective of the present application is to provide application of the above chip stacking packaging film in multi-chip stacking packaging.

[0017] Compared with the prior art, this application has the following advantages and beneficial effects:

[0018] The chip stacking packaging film of the present application has excellent flexibility, fluidity and silicon wafer adhesion, and exhibits excellent wire embedding performance; the chip stacking packaging film of the present application also has low storage modulus and low moisture absorption rate. The packaging film has a low storage modulus, which can provide low-stress bonding between chips, avoid chip breakage or detachment in a multi-chip stacking package, and ensure that the chip does not move during the wire bonding process. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solutions and beneficial effects of the present application more clearly understood, the present application is further described in detail below in conjunction with embodiments.

[0020] The chip stacking packaging film provided in the embodiment of the present application comprises raw materials including: 40 to 45 parts by mass of inorganic filler, 22 to 25 parts by mass of polyether modified epoxy resin, 15 to 17 parts by mass of acrylic rubber modified epoxy resin, 5 to 15 parts by mass of CTBN modified epoxy resin, 10 to 12 parts by mass of bisphenol F type epoxy resin, 10 to 15 parts by mass of bisphenol F type benzoxazine, 2 to 6 parts by mass of curing agent, and 0.4 to 0.8 parts by mass of accelerator.

[0021] In some embodiments, the structure of the polyether-modified epoxy resin is as follows:

[0022] .

[0023] In some embodiments, the inorganic filler is 40-42 parts by mass or 42-45 parts by mass.

[0024] In some embodiments, the CTBN-modified epoxy resin is 5-8 parts by mass, 5-10 parts by mass, 5-12 parts by mass, 8-10 parts by mass, 8-12 parts by mass, 8-15 parts by mass, 10-12 parts by mass, 10-15 parts by mass, or 12-15 parts by mass.

[0025] In some embodiments, the curing agent is 4-5 parts by mass, and the accelerator is 0.65-0.7 parts by mass.

[0026] In some embodiments, the acrylic rubber modified epoxy resin includes SR-828R10 acrylic rubber modified epoxy resin and YLER-200V30 acrylic rubber modified epoxy resin, wherein the SR-828R10 acrylic rubber modified epoxy resin is 0-12 parts by mass, 0-5 parts by mass, 0-10 parts by mass, 5-10 parts by mass, 5-12 parts by mass or 10-12 parts by mass; the YLER-200V30 acrylic rubber modified epoxy resin is 5-15 parts by mass, 5-10 parts by mass or 10-15 parts by mass.

[0027] The raw materials used in the embodiments and comparative examples are as follows:

[0028] Inorganic filler: spherical silica with a particle size of 0.1~0.9um purchased from the market;

[0029] Polyether modified epoxy resin: YLSE-2000 polyether modified epoxy resin, epoxy equivalent 240~260g / eq, 25℃ viscosity 1500~3000cps, manufacturer: Nanjing Yuelai New Material Technology Co., Ltd.;

[0030] Acrylic rubber modified epoxy resin: SR-828R10 acrylic rubber modified epoxy resin, epoxy equivalent 200~220g / eq, 25℃ viscosity 17000-37000cps; YLER-200V30 acrylic rubber modified epoxy resin, epoxy equivalent 200~240g / eq, 25℃ viscosity 10000-50000cps; SR-828R10 and YLER-200V30 are both products of Nanjing Yuelai New Material Technology Co., Ltd.;

[0031] CTBN modified epoxy resin: YLSE-C15 type CTBN modified epoxy resin, epoxy equivalent 201g / eq, 25℃ viscosity 24700cps; Manufacturer: Nanjing Yuelai New Material Technology Co., Ltd.;

[0032] Bisphenol F epoxy resin: 8170 bisphenol F epoxy resin, epoxy equivalent 159g / eq, viscosity 1000cps at 25℃; Manufacturer: Nan Ya Epoxy Resin (Kunshan) Co., Ltd.

[0033] Bisphenol F type benzoxazine: CB4100 bisphenol F type benzoxazine, manufacturer: Chengdu Keyi Polymer Technology Co., Ltd.;

[0034] Curing agent: dicyandiamide DICY, hydroxyl equivalent 21g / eq;

[0035] Accelerator: 4,5-bis(hydroxymethyl)-2-phenyl-1H-imidazole.

[0036] The embodiments and comparative examples provided in this application are as follows:

[0037] Example 1

[0038] The raw materials of this embodiment include: 45 parts by mass of spherical silica; 22 parts by mass of YLSE-2000 polyether modified epoxy resin; 12 parts by mass of SR-828R10 acrylic rubber modified epoxy resin; 5 parts by mass of YLER-200V30 acrylic rubber modified epoxy resin; 5 parts by mass of YLSE-C15 CTBN modified epoxy resin; 10 parts by mass of 8170 bisphenol F type epoxy resin; 15 parts by mass of CB4100 bisphenol F type benzoxazine; 4 parts by mass of dicyandiamide; and 0.65 parts by mass of 4,5-di(hydroxymethyl)-2-phenyl-1H-imidazole.

[0039] Example 2

[0040] The raw materials of this embodiment include: 42 parts by mass of spherical silica; 22 parts by mass of YLSE-2000 polyether modified epoxy resin; 10 parts by mass of SR-828R10 acrylic rubber modified epoxy resin; 5 parts by mass of YLER-200V30 acrylic rubber modified epoxy resin; 8 parts by mass of YLSE-C15 CTBN modified epoxy resin; 10 parts by mass of 8170 bisphenol F type epoxy resin; 15 parts by mass of CB4100 bisphenol F type benzoxazine; 4 parts by mass of dicyandiamide; and 0.7 parts by mass of 4,5-di(hydroxymethyl)-2-phenyl-1H-imidazole.

[0041] Example 3

[0042] The raw materials of this embodiment include: 40 parts by mass of spherical silica; 22 parts by mass of YLSE-2000 polyether modified epoxy resin; 10 parts by mass of SR-828R10 acrylic rubber modified epoxy resin; 5 parts by mass of YLER-200V30 acrylic rubber modified epoxy resin; 8 parts by mass of YLSE-C15 CTBN modified epoxy resin; 10 parts by mass of 8170 bisphenol F type epoxy resin; 15 parts by mass of CB4100 bisphenol F type benzoxazine; 4 parts by mass of dicyandiamide; and 0.7 parts by mass of 4,5-di(hydroxymethyl)-2-phenyl-1H-imidazole.

[0043] Example 4

[0044] The raw materials of this embodiment include: 40 parts by mass of spherical silica; 22 parts by mass of YLSE-2000 polyether modified epoxy resin; 10 parts by mass of SR-828R10 acrylic rubber modified epoxy resin; 5 parts by mass of YLER-200V30 acrylic rubber modified epoxy resin; 10 parts by mass of YLSE-C15 CTBN modified epoxy resin; 10 parts by mass of 8170 bisphenol F type epoxy resin; 15 parts by mass of CB4100 bisphenol F type benzoxazine; 4 parts by mass of dicyandiamide; and 0.7 parts by mass of 4,5-di(hydroxymethyl)-2-phenyl-1H-imidazole.

[0045] Example 5

[0046] The raw materials of this embodiment include: 40 parts by mass of spherical silica; 25 parts by mass of YLSE-2000 polyether modified epoxy resin; 10 parts by mass of SR-828R10 acrylic rubber modified epoxy resin; 5 parts by mass of YLER-200V30 acrylic rubber modified epoxy resin; 10 parts by mass of YLSE-C15 CTBN modified epoxy resin; 10 parts by mass of 8170 bisphenol F type epoxy resin; 15 parts by mass of CB4100 bisphenol F type benzoxazine; 5 parts by mass of dicyandiamide; and 0.7 parts by mass of 4,5-di(hydroxymethyl)-2-phenyl-1H-imidazole.

[0047] Example 6

[0048] The raw materials of this embodiment include: 40 parts by mass of spherical silica; 25 parts by mass of YLSE-2000 polyether modified epoxy resin; 5 parts by mass of SR-828R10 acrylic rubber modified epoxy resin; 10 parts by mass of YLER-200V30 acrylic rubber modified epoxy resin; 10 parts by mass of YLSE-C15 CTBN modified epoxy resin; 10 parts by mass of 8170 bisphenol F type epoxy resin; 15 parts by mass of CB4100 bisphenol F type benzoxazine; 5 parts by mass of dicyandiamide; and 0.7 parts by mass of 4,5-di(hydroxymethyl)-2-phenyl-1H-imidazole.

[0049] Example 7

[0050] The raw materials of this embodiment include: 40 parts by mass of spherical silica; 25 parts by mass of YLSE-2000 polyether modified epoxy resin; 15 parts by mass of YLER-200V30 acrylic rubber modified epoxy resin; 10 parts by mass of YLSE-C15 CTBN modified epoxy resin; 10 parts by mass of 8170 bisphenol F type epoxy resin; 15 parts by mass of CB4100 bisphenol F type benzoxazine; 5 parts by mass of dicyandiamide; and 0.7 parts by mass of 4,5-di(hydroxymethyl)-2-phenyl-1H-imidazole.

[0051] Example 8

[0052] The raw materials of this embodiment include: 40 parts by mass of spherical silica; 25 parts by mass of YLSE-2000 polyether modified epoxy resin; 15 parts by mass of YLER-200V30 acrylic rubber modified epoxy resin; 12 parts by mass of YLSE-C15 CTBN modified epoxy resin; 10 parts by mass of 8170 bisphenol F type epoxy resin; 10 parts by mass of CB4100 bisphenol F type benzoxazine; 5 parts by mass of dicyandiamide; and 0.7 parts by mass of 4,5-di(hydroxymethyl)-2-phenyl-1H-imidazole.

[0053] Example 9

[0054] The raw materials of this embodiment include: 40 parts by mass of spherical silica; 25 parts by mass of YLSE-2000 polyether modified epoxy resin; 15 parts by mass of YLER-200V30 acrylic rubber modified epoxy resin; 15 parts by mass of YLSE-C15 CTBN modified epoxy resin; 10 parts by mass of 8170 bisphenol F type epoxy resin; 10 parts by mass of CB4100 bisphenol F type benzoxazine; 5 parts by mass of dicyandiamide; and 0.7 parts by mass of 4,5-di(hydroxymethyl)-2-phenyl-1H-imidazole.

[0055] Comparative Example 1

[0056] The raw materials of this comparative example include: 45 parts by mass of spherical silica; 15 parts by mass of YLSE-2000 polyether modified epoxy resin; 10 parts by mass of SR-828R10 acrylic rubber modified epoxy resin; 12 parts by mass of 8170 bisphenol F type epoxy resin; 18 parts by mass of CB4100 bisphenol F type benzoxazine; 2 parts by mass of dicyandiamide; and 0.5 parts by mass of 4,5-di(hydroxymethyl)-2-phenyl-1H-imidazole.

[0057] Comparative Example 2

[0058] The raw materials of this comparative example include: 45 parts by mass of spherical silica; 18 parts by mass of YLSE-2000 polyether modified epoxy resin; 10 parts by mass of SR-828R10 acrylic rubber modified epoxy resin; 12 parts by mass of 8170 bisphenol F type epoxy resin; 18 parts by mass of CB4100 bisphenol F type benzoxazine; 2 parts by mass of dicyandiamide; and 0.6 parts by mass of 4,5-di(hydroxymethyl)-2-phenyl-1H-imidazole.

[0059] Comparative Example 3

[0060] The raw materials of this comparative example include: 45 parts by mass of spherical silica; 18 parts by mass of YLSE-2000 polyether modified epoxy resin; 12 parts by mass of SR-828R10 acrylic rubber modified epoxy resin; 12 parts by mass of 8170 bisphenol F type epoxy resin; 18 parts by mass of CB4100 bisphenol F type benzoxazine; 3 parts by mass of dicyandiamide; and 0.6 parts by mass of 4,5-di(hydroxymethyl)-2-phenyl-1H-imidazole.

[0061] Comparative Example 4

[0062] The raw materials of this comparative example include: 45 parts by mass of spherical silica; 20 parts by mass of YLSE-2000 polyether modified epoxy resin; 12 parts by mass of SR-828R10 acrylic rubber modified epoxy resin; 12 parts by mass of 8170 bisphenol F type epoxy resin; 15 parts by mass of CB4100 bisphenol F type benzoxazine; 3 parts by mass of dicyandiamide; and 0.6 parts by mass of 4,5-di(hydroxymethyl)-2-phenyl-1H-imidazole.

[0063] Comparative Example 5

[0064] The raw materials of this comparative example include: 42 parts by mass of spherical silica; 20 parts by mass of YLSE-2000 polyether modified epoxy resin; 12 parts by mass of SR-828R10 acrylic rubber modified epoxy resin; 12 parts by mass of 8170 bisphenol F type epoxy resin; 15 parts by mass of CB4100 bisphenol F type benzoxazine; 4 parts by mass of dicyandiamide; and 0.65 parts by mass of 4,5-di(hydroxymethyl)-2-phenyl-1H-imidazole.

[0065] Comparative Example 6

[0066] The raw materials of this comparative example include: 42 parts by mass of spherical silica; 22 parts by mass of YLSE-2000 polyether modified epoxy resin; 15 parts by mass of SR-828R10 acrylic rubber modified epoxy resin; 10 parts by mass of 8170 bisphenol F type epoxy resin; 15 parts by mass of CB4100 bisphenol F type benzoxazine; 4 parts by mass of dicyandiamide; and 0.65 parts by mass of 4,5-di(hydroxymethyl)-2-phenyl-1H-imidazole.

[0067] Comparative Example 7

[0068] The raw materials of this comparative example include: 42 parts by mass of spherical silica; 22 parts by mass of YLSE-2000 polyether modified epoxy resin; 5 parts by mass of YLSE-C15 CTBN modified epoxy resin; 10 parts by mass of 8170 bisphenol F type epoxy resin; 15 parts by mass of CB4100 bisphenol F type benzoxazine; 4 parts by mass of dicyandiamide; and 0.65 parts by mass of 4,5-di(hydroxymethyl)-2-phenyl-1H-imidazole.

[0069] The above-mentioned examples and comparative examples are prepared by the following method: raw materials are taken according to the ratio and mixed, the mixed raw materials are ground into a colloid by a bead mill, and then a glue liquid is obtained by vacuum degassing, and the glue liquid is coated with a coating machine to obtain an encapsulation film.

[0070] The performance parameter detection methods of the products of the embodiments and comparative examples are as follows:

[0071] 1. Tensile strength and elongation at break:

[0072] Cut a film material (strip) with a size of 10mm*50mm from the film, tear off the light release film, stick both ends of the strip with tape, use the fixture of the universal material testing machine to clamp the tapes at both ends, tear off the heavy release film, and test the tensile strength and elongation at break of the film.

[0073] 2. Storage modulus:

[0074] With reference to the standard "ASTM E2254-2018 Test method for determination of storage modulus by dynamic mechanical analyzer", the film was made into a sample with a size of 25mm*6.5mm*0.25mm, cured at 170℃ for 1h, measuring mode: Tension: Film (film stretching), heated to 250℃ at 5℃ / min, and the storage modulus at 25℃ was taken.

[0075] 3. Rheological viscosity at elevated temperature:

[0076] Paste 40 layers of 25um thick film to make a circular sample with a thickness of 1mm and a diameter of 20mm. Test mode: Oscillation Temperature Ramp (oscillation mode temperature change); heat up to 200℃ at a heating rate of 5℃ / min, and take the viscosity value at 130℃.

[0077] 4. Moisture absorption rate:

[0078] Paste 20 layers of 25um thick film material, and then make 5 8cm×1cm sample strips, and weigh them after curing at 170℃ for 1h, and record the weight as Ma; then carry out pressure cooker cooking test, cook at 120℃ for 24h, wipe the surface moisture of the sample strip after completion, weigh it, record the weight as Mb, and calculate the water absorption rate (Mb-Ma) / Ma. The absorption rate of the 5 sample strips is averaged;

[0079] 5. Silicon wafer adhesion:

[0080] A single layer of 25um thick 3mm*3mm film was transferred to the silicon wafer, and another silicon wafer was covered on top of the film. After clamping, it was cured at 170℃ for 1h, and the shear bonding strength, that is, the adhesion of the silicon wafer, was tested using a universal tensile testing machine.

[0081] The test data of the performance of the above-mentioned embodiments and comparative examples are respectively listed in the following Tables 1 and 2. Table 1 is the test data of the performance of the embodiment products, and Table 2 is the test data of the performance of the comparative example products.

[0082] Table 1 Test data of product performance of the embodiment

[0083]

[0084] Table 2 Test data of comparative product performance

[0085]

[0086] The resin matrix of the present application includes polyether modified epoxy resin, acrylic rubber modified epoxy resin and CTBN modified epoxy resin. The polyether modified epoxy resin has low viscosity, excellent fluidity and flexibility; the acrylic rubber modified epoxy resin has excellent adhesion; the CTBN modified epoxy resin has a lower modulus; by combining the polyether modified epoxy resin, the acrylic rubber modified epoxy resin and the CTBN modified epoxy resin in a specific amount, the flexibility, fluidity and silicon wafer adhesion of the encapsulation film product can be further improved, and the modulus and moisture absorption rate can be reduced. It can also be seen from the performance parameter data of Tables 1 to 2 that compared with the products of Comparative Examples 1 to 7, the products of Examples 1 to 9 have excellent flexibility, fluidity and silicon wafer adhesion, lower modulus and moisture absorption rate, thereby showing a more excellent wire embedding performance.

[0087] The above embodiments are only for the purpose of clearly illustrating the embodiments, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above descriptions. It is not necessary and impossible to list all the implementation methods here, so the obvious changes or modifications derived are still within the protection scope of the invention.

Claims

1. A chip stacking packaging film, characterized in that: Its raw materials include: 40-45 parts by mass of inorganic filler, 22-25 parts by mass of polyether modified epoxy resin, 15-17 parts by mass of acrylic rubber modified epoxy resin, 5-15 parts by mass of CTBN modified epoxy resin, 10-12 parts by mass of bisphenol F type epoxy resin, 10-15 parts by mass of bisphenol F type benzoxazine, 2-6 parts by mass of curing agent, and 0.4-0.8 parts by mass of accelerator; The acrylic rubber modified epoxy resin includes SR-828R10 acrylic rubber modified epoxy resin and YLER-200V30 acrylic rubber modified epoxy resin, wherein the SR-828R10 acrylic rubber modified epoxy resin is 0-12 parts by mass, and the YLER-200V30 acrylic rubber modified epoxy resin is 5-15 parts by mass; SR-828R10 acrylic rubber modified epoxy resin, epoxy equivalent 200~220g / eq, viscosity 17000-37000cps at 25℃; YLER-200V30 acrylic rubber modified epoxy resin, epoxy equivalent 200~240g / eq, viscosity 10000-50000cps at 25℃; SR-828R10 and YLER-200V30 are both products of Nanjing Yuelai New Material Technology Co., Ltd.

2. The chip stacking packaging film according to claim 1, wherein: Its raw materials include: 40-42 parts by mass of inorganic filler, 22-25 parts by mass of polyether modified epoxy resin, 15 parts by mass of acrylic rubber modified epoxy resin, 8-15 parts by mass of CTBN modified epoxy resin, 10 parts by mass of bisphenol F type epoxy resin, 10-15 parts by mass of bisphenol F type benzoxazine, 2-6 parts by mass of curing agent, and 0.4-0.8 parts by mass of accelerator.

3. The chip stacking packaging film according to claim 1, wherein: Its raw materials include: 40 parts by mass of inorganic filler, 25 parts by mass of polyether modified epoxy resin, 15 parts by mass of acrylic rubber modified epoxy resin, 10-15 parts by mass of CTBN modified epoxy resin, 10 parts by mass of bisphenol F type epoxy resin, 10-15 parts by mass of bisphenol F type benzoxazine, 2-6 parts by mass of curing agent, and 0.4-0.8 parts by mass of accelerator.

4. The chip stacking packaging film according to any one of claims 2 to 3, characterized in that: The acrylic rubber modified epoxy resin includes SR-828R10 acrylic rubber modified epoxy resin and YLER-200V30 acrylic rubber modified epoxy resin, wherein the SR-828R10 acrylic rubber modified epoxy resin is 0-10 parts by weight and the YLER-200V30 acrylic rubber modified epoxy resin is 5-15 parts by weight.

5. The chip stacking packaging film according to any one of claims 2 to 3, characterized in that: The acrylic rubber modified epoxy resin includes SR-828R10 acrylic rubber modified epoxy resin and YLER-200V30 acrylic rubber modified epoxy resin, wherein the SR-828R10 acrylic rubber modified epoxy resin is 0-5 parts by weight and the YLER-200V30 acrylic rubber modified epoxy resin is 10-15 parts by weight.

6. The chip stacking packaging film according to any one of claims 1 to 3, characterized in that: The inorganic filler is selected from silicon dioxide.

7. The chip stacking packaging film according to any one of claims 1 to 3, characterized in that: The curing agent is an amine curing agent; and the accelerator is an imidazole accelerator.

8. The method for preparing a chip stacking packaging film according to any one of claims 1 to 7, characterized in that: include: The raw materials are taken according to the ratio and mixed, and the mixed raw materials are ground into a colloid by a bead mill, and then vacuum degassing is performed to obtain a glue liquid, and a coating machine is used to coat the glue liquid to obtain a packaging film.

9. Use of the chip stacking packaging film according to any one of claims 1 to 7 in multi-chip stacking packaging.

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