Temperature control test device

Abstract

The present invention relates to the field of electronic technology and automation control technology, and specifically, to a temperature control test device. The temperature control test device includes: a carrier, including a carrier board for placing a PCB board with a thermistor installed; a heating module, used to heat the PCB board placed on the carrier board; and a control and test component, used to control the operation of the heating module, the control and test component includes a temperature detection component installed on the heating module and a test terminal arranged on the carrier board to electrically contact the PCB board; wherein the carrier board has a supporting surface for supporting the PCB board, and a hollow portion is formed on the supporting surface, and the hollow portion forms an air isolation layer located below the PCB board. Compared with the prior art, the heat loss of the PCB board of the present application is reduced, and the temperature control test device helps to increase the temperature rise of the thermistor and achieve rapid detection.

Description

Technical Field

[0001] The invention relates to the field of electronic technology and automatic control technology, in particular to a temperature control test device. Background Art

[0002] NTC thermistor is a negative temperature coefficient (NTC) thermistor, whose resistance value decreases with the increase of temperature. NTC thermistor is generally used in series in AC circuits, and its main function is to act as a "current insurance" to prevent the electronic circuit from generating surge current at the moment of power-on. It can effectively suppress the surge current at power-on, and after completing the function of suppressing the surge current, its resistance value can drop to a very small level, which will not affect the normal working current. The reliability of the thermistor determines the stability of the circuit. In the prior art, before the circuit is put into use, a temperature control test device is usually used to perform a temperature control test on the thermistor, specifically: a circuit board with a thermistor installed is placed on a tooling, and during the test, the temperature control module gradually heats up the circuit board through heat conduction to detect the resistance value of the corresponding thermistor in different temperature sections. However, the existing temperature control test device has the following problems: when the temperature control module heats the circuit board, there is heat loss, which causes the thermistor on the circuit board to heat up slowly, affecting the test time. Summary of the invention

[0003] The object of the present invention is to provide a temperature control test device which can reduce heat loss, increase the temperature rise of thermistor and realize rapid detection.

[0004] To achieve the above object, the present invention provides the following technical solution: a temperature control test device, comprising:

[0005] A carrier, including a carrier plate for placing a PCB board on which the thermistor is mounted;

[0006] A heating module, used for heating the PCB board placed on the carrier board; and

[0007] A control and test assembly, used for controlling the operation of the heating module, the control and test assembly comprising a temperature detection member mounted on the heating module and a test terminal disposed on the carrier board to be in electrical contact with the PCB board;

[0008] The carrier plate has a supporting surface for supporting the PCB board, a hollow portion is formed on the supporting surface, and the hollow portion forms an air isolation layer located below the PCB board.

[0009] Furthermore, the hollowed-out portion includes a first hollowed-out portion extending downward from the supporting surface and a second hollowed-out portion penetrating the carrier plate, and the depth of the first hollowed-out portion is 1 / 6-1 / 4 of the thickness of the carrier plate.

[0010] Furthermore, the supporting surface has a supporting edge for supporting the bottom edge of the PCB board, and the first hollowed-out portion is formed by being concave from the supporting edge.

[0011] Furthermore, the carrier also includes a plurality of cylindrical limiting columns formed on the carrier plate, and the plurality of limiting columns are arranged to form a space for limiting the placement of the PCB board.

[0012] Further, every two of the plurality of limiting columns form a group, and the two limiting columns in each group are arranged to limit the positions of two side edges of the end point of the PCB board.

[0013] Furthermore, the heating module includes a heating plate and a heating rod for heating the heating plate, the heating plate has a heating surface facing the carrier plate and an abutment portion extending from the heating surface toward the carrier plate, the abutment portion is used to contact the PCB board, the abutment portion forms a frame structure for enclosing electronic components on the PCB board, and there is a gap between the heating surface and the PCB board.

[0014] Furthermore, the heating module also includes an insulation shell, the heating plate is located in the insulation shell, the side wall of the insulation shell is lower than the heating surface, and the carrier plate has an extension wall extending upward from the edge of the supporting surface, and the size formed by the extension wall is larger than the size of the insulation shell.

[0015] Furthermore, the carrier also includes a carrier seat, and the carrier plate is mounted on the carrier seat through a first buffer guide column.

[0016] Furthermore, the carrier also includes a fixed block arranged under the carrier plate, a floating block arranged above the fixed block, and a second buffer guide column arranged between the fixed block and the floating block to support the floating block, a vertical through hole is formed on the floating block, the contact end of the test terminal is located in the vertical through hole, the floating block has a first position under the action of an external force and a second position after the external force is removed, in the first position, the contact end is exposed above the vertical through hole, and in the second position, the contact end is located in the vertical through hole.

[0017] Furthermore, the temperature control test device also includes a displacement module, and the displacement module drives one of the carrier plate and the heating module to move relative to the other.

[0018] The beneficial effect of the present invention is that: the present application forms a hollow portion on the supporting surface, so that when the PCB board is placed on the supporting surface, when the PCB is heated, an air isolation layer is formed under the PCB through the hollow portion, thereby reducing the contact area between the PCB board and the supporting surface to reduce heat transfer, and at the same time, the heat transfer between the PCB board and the carrier plate is reduced through the air isolation layer. Compared with the prior art, since the heat transfer of the present application is reduced, the heat loss of the PCB board is reduced, which helps to increase the temperature rise of the thermistor and realize rapid detection.

[0019] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of a temperature control test device shown in one embodiment of the present invention;

[0021] Figure 2 for Figure 1 A schematic diagram of the structure of the temperature control test device shown in another direction;

[0022] Figure 3 for Figure 1 A schematic diagram of the structure of the tooling module;

[0023] Figure 4 for Figure 3 The structural schematic diagram of the temperature control module is shown. DETAILED DESCRIPTION

[0024] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0026] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical contact; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0028] See also Figures 1 to 4 The temperature control test device 100 shown in an embodiment of the present application is used to detect the resistance value of thermistors on a PCB board (not shown) at different temperature thresholds. In addition to thermistors installed on the PCB board, other electrical components are also installed to form an electric control module that can realize specific functions. The temperature control test device 100 includes a carrier 10, a heating module 20 located above the carrier 10, a displacement module 30 that drives the carrier 10 to move relative to the heating module 20, and a control and test component for controlling the operation of the heating module 20 and the displacement module 30. The carrier 10 is used to place a carrier plate 11 on which a PCB board with a thermistor is installed. The carrier plate 11 has a supporting surface 111 for supporting the PCB board. A hollow portion 112 is formed on the supporting surface 111, and the hollow portion 112 forms an air isolation layer located below the PCB board. The heating module 20 is used to heat the PCB board placed on the carrier plate 11. In this embodiment, the heating module 20 and the PCB board are mainly contact-heated. The control and test assembly is used to control the operation of the heating module 20 and the displacement module 30. The control and test assembly includes a temperature detection member 41 mounted on the heating module 20 and a test terminal 42 disposed on the carrier plate 11 to electrically contact the metal pin of the PCB board. The temperature detection member 41 is used to detect the temperature value of the thermistor, and the test terminal 42 is electrically contacted with the metal pin corresponding to the thermistor to detect the resistance value of the thermistor.

[0029] The present application forms a hollow portion 112 on the supporting surface 111, so that when the PCB board is placed on the supporting surface 111, when the PCB is heated, an air isolation layer is formed under the PCB through the hollow portion 112. While reducing the contact area between the PCB board and the supporting surface 111 to reduce heat transfer, the air isolation layer also reduces the heat transfer between the PCB board and the carrier plate 11. Compared with the prior art, since the heat transfer of the present application is reduced, the heat loss of the PCB board is reduced, which helps to increase the temperature rise of the thermistor and achieve rapid detection.

[0030] In this embodiment, the hollow portion 112 includes a first hollow portion 1121 extending downward from the supporting surface 111 and a second hollow portion 1122 penetrating the carrier plate 11. The depth of the first hollow portion 1121 is 1 / 6-1 / 4 of the thickness of the carrier plate 11. Specifically, the depth of the first hollow portion 1121 is 1 / 5 of the thickness of the carrier plate 11. By such an arrangement, it is ensured that the heat loss is reduced and the strength of the carrier plate 11 is also ensured. In order to further ensure the strength of the carrier plate 11, the supporting surface 111 has a supporting edge for supporting the bottom edge of the PCB board, and the first hollow portion 1121 is formed by being concave from the supporting edge.

[0031] The carrier 10 also includes a plurality of cylindrical limiting posts 12 formed on the carrier plate 11, and the plurality of limiting posts 12 are arranged to form a space (not numbered) for limiting the placement of the PCB board. Specifically, two limiting posts 12 in the plurality of limiting posts 12 form a group, and the two limiting posts 12 in each group are arranged to limit the positions of the two side edges of the end points of the PCB board. The limiting posts 12 are arranged to form a space for limiting the placement of the PCB board, so as to facilitate alignment detection. When the PCB board is placed in the placement space, the side of the PCB board contacts the side of the limiting post 12, and the contact is point contact, which helps to reduce heat loss.

[0032] The second hollowed-out portion 1122 is partially located between the two groups of limiting pillars in the width direction. In the length direction, the projection of the second hollowed-out portion 1122 of this portion is located outside the projection of the limiting pillar 12. In this way, the second hollowed-out portion 1122 of this portion also has an avoidance function, that is, when the PCB board is grasped by the grasping device, the second hollowed-out portion 1122 of this portion provides an avoidance space for the grasping device to prevent the grasping device from colliding with the carrier plate 11.

[0033] In this embodiment, the heating module 20 includes an insulation shell 21, a heating plate 22 disposed in the insulation shell 21, and a heating rod 23 for heating the heating plate 22. The heating plate 22 has a heating surface 231 facing the carrier plate 11 and an abutment portion 232 extending from the heating surface 231 toward the carrier plate 11, and the abutment portion 232 separates the heating surface 231 into an inner heating zone 2311 and an outer heating zone 2312. The abutment portion 232 is used to contact the PCB board, and the abutment portion 232 forms a frame structure for enclosing the electronic components on the PCB board. When the abutment portion 232 abuts against the PCB board, the inner heating zone 2311 covers all electronic components. The heating module 20 is connected to the PCB board through the abutting portion 232 to achieve direct heating of the PCB board. Moreover, since the abutting portion 232 abuts the PCB board, the abutting portion 232, the PCB board and the inner heating area 2311 are enclosed to form a closed heating space, and the PCB board is heated by thermal radiation through the closed heating space to achieve indirect heating. Due to the existence of the abutting portion 232, the electronic components on the PCB board will not directly contact the heating surface 231. In order to increase the heating speed, in this embodiment, the gap between the heating surface 231 and the electronic components on the PCB board is greater than 0 and less than 0.15mm.

[0034] In this embodiment, the side wall 211 of the insulation shell 21 is lower than the heating surface 231, and the carrier plate 11 has an extension wall 113 extending upward from the edge of the supporting surface 111. The size formed by the extension wall 113 is larger than the size of the insulation shell 21. With this arrangement, when the heating module 20 covers the PCB board, the external heating zone 2312, the side of the insulation shell 21, the carrier plate 11 and the abutment 232 form a sealed space. The sealed space is located on the outside of the heating space, so that the temperature isolation function is achieved through the sealed space. In addition, the size formed by the extension wall 113 is larger than the size of the insulation shell 21, so that when the abutment 232 abuts the PCB board, the side wall 211 of the insulation shell 21 is located on the inner side of the extension wall 113, and, in this embodiment, the inner side surface of the extension wall 113 contacts the outer side surface of the side wall 211, thereby preventing the side wall 211 part of the sealed space from being directly exposed to the outside, which helps to further achieve the temperature isolation function.

[0035] In this embodiment, the displacement module 30 drives the carrier 10 to move relative to the heating module 20, so as to facilitate the placement of the PCB board on the carrier plate 11 and the removal of the PCB board after inspection. In other embodiments, the displacement module 30 can also drive the heating module 20 to move relative to the carrier 10.

[0036] In one embodiment, the displacement module 30 drives the carrier 10 to move in a vertical direction (i.e., height direction) relative to the heating module 20. Specifically, the displacement module 30 further includes a base 31, a moving plate 32 located above the base 31, and a lifting cylinder 33 disposed between the base 31 and the moving plate 32 to drive the moving plate 32 to move relative to the base 31. The carrier 10 is mounted on the moving plate 32. The base 31 includes a bottom plate 311 and two support columns 312 disposed on the bottom plate 311. The lifting cylinder 33 is fixed on the bottom plate 311 and arranged between the two support columns 312.

[0037] In this embodiment, a detection member (not shown) is arranged below the carrier plate 11 to detect whether a PCB is placed on the carrier plate 11, and the detection member is fixed to the bottom plate 311 through the mounting plate 313. When the PCB is placed on the carrier plate 11, the control and test component controls the operation of the lifting cylinder 33 according to the signal detected by the detection member, and the lifting cylinder 33 drives the moving plate 32 to move toward the heating module 20 until the PCB on the carrier plate 11 abuts against the abutment portion 232 of the heating module 20, and then the control and test component controls the heating module 20 to start, thereby heating the PCB.

[0038] Since the carrier plate 11 and the heating module 20 need to move relative to each other to achieve the abutment between the abutting portion 232 and the PCB board, rigid impact may occur during the abutment and an indentation may be generated on the PCB board when the pressing portion 232 presses against the PCB board. In order to avoid the above problems, in this embodiment, the carrier 10 includes a carrier seat 13, and the carrier plate 11 is installed on the carrier seat 13 through a first buffer guide column 14. The first buffer guide column 14 generally includes a sleeved first cylinder and a second cylinder, a spring is arranged between the first cylinder and the second cylinder, and the first cylinder and the second cylinder can move relative to each other along the axial direction to achieve compression and reset of the spring. By adopting the first buffer guide column 14, when the carrier plate 11 and the supporting portion are in contact, the internal spring of the first buffer guide column 14 makes the two contact, and when the force of the supporting portion 232 on the PCB board exceeds the compression force of the spring, the carrier plate 11 can move downward relatively under the pressure of the supporting portion 232, so as to prevent rigid impact through the first buffer guide column 14 and avoid the supporting portion 232 from causing indentation on the PCB board.

[0039] In order to facilitate the placement and removal of the PCB board and reduce the overall height, the carrier 10 in this embodiment is not only moved in the vertical direction by the displacement module 30, but also moved in the horizontal direction by the displacement module 30. Specifically, the temperature control test device 100 also includes a carrier plate 50, on which the carrier 10, the displacement module 30 and the heating module 20 are all arranged. The displacement module 30 also includes a slide rail 35 arranged on the carrier plate 50, a slider 36 arranged below the bottom plate 311 and mounted on the slide rail 35, and an electric push-pull rod 37 connected to the bottom plate 311. One end of the electric push-pull rod 37 is connected to the carrier 10, and the other end is fixed to the carrier plate 50. In this way, the carrier 10 is driven to move along the longitudinal direction of the slide rail 35 on the carrier plate 50 by the push-pull rod. In other embodiments, the electric push-pull rod 37 can also be an electric cylinder. The heating module 20 is fixed above the carrier 10 by a bracket 34.

[0040] The carrier 10 also includes a fixed block 61 arranged below the carrier plate 11, a floating block 62 arranged above the fixed block 61, and a second buffer guide column 63 arranged between the fixed block 61 and the floating block 62 to support the floating block 62. The second buffer guide column 63 also includes a sleeved first cylinder and a second cylinder, and a spring is arranged between the first cylinder and the second cylinder. The first cylinder is fixed on the fixed block 61, and the floating block 62 is fixed on the second cylinder. A vertical through hole 621 is formed on the floating block 62, and the test terminal 42 is vertically fixed on the fixed block 61, and the contact end of the test terminal 42 is located in the vertical through hole 621. The floating block 62 has a first position under the action of an external force and a second position after the external force is removed. In the first position, the contact end is exposed above the vertical through hole 621 to electrically contact the metal pin on the back of the PCB board. In the second position, the contact end is located in the vertical through hole 621. The external force is the force exerted by the PCB board on the floating block 62 when the PCB board is placed on the carrier board 11. The force is greater than the force of the spring. By arranging the contact end of the test terminal 42 in the floating block 62, it is prevented that the contact end is exposed to the outside and worn by external equipment when the PCB board is not placed on the carrier board 11.

[0041] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0042] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A temperature control test device, characterized in that: include: A carrier, including a carrier plate for placing a PCB board on which the thermistor is mounted; A heating module, located above the carrier, for heating the PCB placed on the carrier; and A control and test assembly, used for controlling the operation of the heating module, the control and test assembly comprising a temperature detection member mounted on the heating module and a test terminal disposed on the carrier board to be in electrical contact with the PCB board; The carrier plate has a supporting surface for supporting the PCB board, a hollow portion is formed on the supporting surface, and the hollow portion forms an air isolation layer located below the PCB board; The hollowed-out portion includes a first hollowed-out portion extending downward from the supporting surface and a second hollowed-out portion penetrating the carrier plate, and the depth of the first hollowed-out portion is 1 / 6-1 / 4 of the thickness of the carrier plate.

2. The temperature control test device according to claim 1, characterized in that: The supporting surface has a supporting edge for supporting the bottom edge of the PCB board, and the first hollowed-out portion is formed by being concavely formed from the supporting edge.

3. The temperature control test device according to claim 1, characterized in that: The carrier also includes a plurality of cylindrical limiting columns formed on the carrier plate, and the plurality of limiting columns are arranged to form a space for limiting the placement of the PCB board.

4. The temperature control test device according to claim 3, characterized in that: Every two of the limiting columns among the plurality of limiting columns form a group, and the two limiting columns in each group are arranged to limit the positions of two side edges of the end point of the PCB board.

5. The temperature control test device according to claim 1, characterized in that: The heating module includes a heating plate and a heating rod for heating the heating plate, the heating plate has a heating surface facing the carrier plate and an abutment portion extending from the heating surface toward the carrier plate, the abutment portion is used to contact the PCB board, the abutment portion forms a frame structure for enclosing electronic components on the PCB board, and there is a gap between the heating surface and the PCB board.

6. The temperature control test device according to claim 5, characterized in that: The heating module also includes an insulation shell, the heating plate is located in the insulation shell, the side wall of the insulation shell is lower than the heating surface, and the carrier plate has an extension wall extending upward from the edge of the supporting surface, and the size formed by the extension wall is larger than the size of the insulation shell.

7. The temperature control test device according to claim 1, characterized in that: The carrier also includes a carrier seat, and the carrier plate is mounted on the carrier seat through a first buffer guide column.

8. The temperature control test device according to claim 1, characterized in that: The carrier also includes a fixed block arranged under the carrier plate, a floating block arranged above the fixed block, and a second buffer guide column arranged between the fixed block and the floating block to support the floating block. A vertical through hole is formed on the floating block, and the contact end of the test terminal is located in the vertical through hole. The floating block has a first position under the action of an external force and a second position after the external force is removed. In the first position, the contact end is exposed above the vertical through hole, and in the second position, the contact end is located in the vertical through hole.

9. The temperature control test device according to claim 1, characterized in that: The temperature control test device further includes a displacement module, which drives one of the carrier plate and the heating module to move relative to the other.

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