Apparatus and method for processing a carrier plate using a differential pressure method in combination with an exhaust jig
By combining the pressure difference method with the design of the exhaust fixture and utilizing the pressure difference between the airbag and the processing chamber, the warping problem of the packaging carrier caused by uneven thermal expansion is solved, and the flat shaping of the carrier is achieved, which is suitable for a variety of electronic packaging materials.
Patent Information
- Application Number
- CN202310628480.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-05-30
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2043-05-30
AI Technical Summary
In the prior art, uneven thermal expansion of the package carrier leads to warping, and the thermal stress cannot be completely eliminated, which affects the subsequent cutting process.
The pressure difference method is combined with an exhaust fixture. The pressure difference between the airbag and the processing chamber is used to offset the thermal stress through the inverse geometric surface of the exhaust fixture to achieve flat shaping of the carrier.
Effectively suppresses substrate warping during the manufacturing process, ensuring the substrate is flat after thermal processing. Suitable for a variety of electronic packaging materials.
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Figure CN119069379B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of electronic packaging, and in particular to a differential pressure method combined with an exhaust jig for processing a carrier plate, which utilizes the pressure difference between a gas bag and a processing chamber to suppress carrier plate warping, and the contact surface of the exhaust jig can be processed into an inverse geometric curve to offset thermal stress and make the carrier plate tend to be flat. BACKGROUND
[0002] The encapsulation material used in the encapsulation process of electronic packaging is different from the thermal expansion coefficient of the packaging carrier plate, so during the hardening process after encapsulation, the packaging carrier plate and the encapsulation material will produce different thermal expansion or thermal contraction with temperature changes, resulting in thermal stress and warping of the packaging carrier plate, and the higher the temperature or the longer the time when hardening, the greater the warping of the packaging carrier plate, making it difficult to perform subsequent cutting processes.
[0003] On the other hand, by applying force to the surface of the packaging carrier plate using existing differential pressure method technology, the warping phenomenon caused by uneven thermal expansion of the packaging carrier plate at high temperatures during the process can be resisted, but thermal stress still exists in the packaging carrier plate and is not completely eliminated, so when the process is over and the pressure disappears, thermal stress will still deform the packaging carrier plate, and there is a need for improvement.
[0004] Therefore, in view of the above-mentioned problems of warping of the existing packaging structure due to thermal stress, how to develop a structure and method for suppressing material warping that is more ideal and practical and takes into account economic benefits is a goal and direction for active research and development by relevant parties.
[0005] Therefore, in view of the above-mentioned problems of warping of the existing packaging structure due to thermal stress, how to develop a structure and method for suppressing material warping that is more ideal and practical and takes into account economic benefits is a goal and direction for active research and development by relevant parties. SUMMARY
[0006] The main purpose of the present application is to provide a differential pressure method combined with an exhaust jig for processing a carrier plate, which utilizes the pressure difference between a gas bag and a processing chamber to suppress warping of the carrier plate during the process, and the contact surface of the exhaust jig can be processed into an inverse geometric curve to offset thermal stress of the carrier plate after the process, making the carrier plate tend to be flat.
[0007] To achieve the above-mentioned purpose, the present application adopts the following technical solutions:
[0008] A differential pressure method combined with an exhaust jig for processing a carrier plate, characterized in that it comprises:
[0009] a processing chamber provided with a processing frame;
[0010] a plurality of carrier pressing devices, each of the carrier pressing devices being disposed parallel to one another inside the processing frame, the carrier pressing devices comprising at least one gas inlet, at least one gas outlet, at least one air bag, and at least one gas channel, the at least one gas inlet being connected to a pressure source, the carrier pressing device having a lower surface and an opposing upper surface, the at least one air bag being disposed on the lower surface, the at least one gas channel having one end connected to the at least one gas inlet and the at least one gas outlet and the other end connected to the at least one air bag, the air bag and the gas channel being connected to form a sealed space; and
[0011] A plurality of exhaust jigs are provided with a plurality of exhaust holes capable of exhausting the outside of the processing chamber. The exhaust jig is arranged on the upper surface of the carrier pressing device. The exhaust jig is composed of an upper contact portion and a lower base portion, wherein the surface of the upper contact portion is an upper contact surface. The upper contact portion is of a detachable design. A first surface of a carrier plate that has been previously heat-processed is simulated or actually measured to obtain surface data. The surface data is processed on the upper contact surface with corresponding relevant data of flat corresponding to flat, concave corresponding to convex, and convex corresponding to concave. The upper contact surface of the exhaust jig is used to place the carrier plate on the airbag on the carrier pressing device so that the first surface and the upper contact surface of the exhaust jig are in contact. During subsequent heat processing, the thermal stress of each carrier plate can be offset, so that each carrier plate tends to be flat after heat processing.
[0012] The device for processing carriers using the pressure difference method combined with an exhaust jig, wherein: each gas outlet is connected to a vacuum generator, through which the pressure in each gas channel and each airbag is reduced to a predetermined vacuum pressure, and each airbag is adsorbed on the lower surface of each carrier pressing device by vacuum suction, making it easy to remove each carrier.
[0013] The device for processing a carrier plate by combining the pressure difference method with an exhaust fixture, wherein: the carrier plate pressing device is slidably mounted on the inner side of the processing frame, and the lower surface of the carrier plate pressing device is fixed with at least one airbag through at least one sealing structure.
[0014] The device for processing a carrier board using the pressure difference method combined with an exhaust fixture, wherein: the airbag is made of polyimide or Teflon material.
[0015] The device for processing carrier plates using the pressure difference method combined with an exhaust jig, wherein: a placement plate is arranged parallel to each other on the inner side of the processing frame below the carrier plate pressing device at the bottom layer, and at least one carrier plate and at least one exhaust jig are placed on the upper surface of the placement plate corresponding to at least one airbag on the carrier plate pressing device at the bottom layer.
[0016] The device for processing a carrier board using the pressure difference method combined with an exhaust fixture, wherein: the carrier board is at least one of a printed circuit board, a substrate, a conductive bracket, a wafer, a silicon interposer, a package, a glass carrier board, and a flat plate with circuit wiring.
[0017] The device for processing a carrier plate using the pressure difference method combined with an exhaust jig, wherein: a plurality of supporting holes with a plurality of locking structures are provided downwardly around the periphery of the upper contact portion, and a plurality of threaded holes of the locking structure are provided on the lower base portion corresponding to the supporting holes. The supporting holes are aligned with the threaded holes and then fixed with a plurality of screws. The lower base portion is provided with an annular groove to which an O-ring can be assembled.
[0018] The device for processing a carrier plate using the pressure difference method combined with an exhaust jig, wherein: if the first surface of the carrier plate is simulated or actually measured as a concave surface, then the upper contact surface of the upper contact portion is a convex surface; if the first surface of the carrier plate is simulated or actually measured as a convex surface, then the upper contact surface of the upper contact portion is a concave surface; if the first surface of the carrier plate is simulated or actually measured as a wavy surface, then the upper contact surface of the upper contact portion is an anti-wavy surface; if the first surface of the carrier plate is simulated or actually measured as an irregular surface, then the upper contact surface of the upper contact portion is an anti-irregular surface.
[0019] The device for processing a carrier plate using the pressure difference method combined with an exhaust jig, wherein: a plurality of holes are provided on the upper contact portion of the exhaust jig, and at least one heat-resistant sealing layer is provided between the first surface of the carrier plate and the upper contact surface of the exhaust jig, wherein the heat-resistant sealing layer can partially cover or not cover the holes; and the heat-resistant sealing layer can withstand a processing temperature of above 40°C and below 1200°C.
[0020] A method for processing a carrier plate using a pressure differential method combined with an exhaust fixture, characterized by comprising the following steps:
[0021] A plurality of carrier plate pressing devices are prepared, each having a lower surface and an opposite upper surface, wherein at least one air bag is disposed on the lower surface;
[0022] After a carrier plate is deformed by thermal processing, actual surface data of the deformed first surface of the carrier plate is measured; or after a carrier plate is deformed by simulated thermal processing, surface data of the deformed first surface of the carrier plate is calculated;
[0023] Prepare a plurality of exhaust fixtures with detachable upper contact parts;
[0024] The processing machine can process the upper contact surface of the upper contact portion according to the surface data, with corresponding data of flat to flat, concave to convex, and convex to concave.
[0025] Placing a plurality of exhaust jigs containing a plurality of carriers on the upper surfaces of the carrier pressing devices in a processing chamber, with the first surfaces of the carriers facing the upper contact surfaces having the plurality of holes, and the exteriors of the air bags pressing against the second surfaces of the carriers;
[0026] Pressurizing the processing chamber, filling each air bag with gas through a pressure source, and exhausting each exhaust fixture to form a pressure difference between the first surface of each carrier plate and the second surface of each carrier plate, thereby pressing each carrier plate onto each exhaust fixture;
[0027] After the heat treatment, the thermal stress of each carrier plate can be offset, so that each carrier plate tends to be flat.
[0028] As can be seen from the above, the apparatus and method of the present invention for processing a carrier using a pressure differential method combined with an exhaust jig can suppress carrier warping during the process by utilizing the pressure difference between the airbag and the processing chamber. The contact surface on the exhaust jig can be processed into an inverse geometric surface to offset the thermal stress of the carrier after the process, making the carrier shape tend to be flat, which meets better industrial applicability.
[0029] With regard to the technology, means and effects adopted by the present invention, a preferred embodiment is now listed and described in detail with reference to the accompanying drawings. It is believed that the above-mentioned objectives, structures and features of the present invention can be deeply and specifically understood therefrom. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] Figure 1 It is a schematic diagram of the airbag pressing state of a preferred embodiment of the present invention.
[0031] Figure 2 It is a schematic exploded perspective view of an exhaust fixture according to one embodiment of the present invention.
[0032] Figure 3 It is a partial cross-sectional schematic diagram of an exhaust fixture according to one embodiment of the present invention.
[0033] Figure 4 Schematic diagram of a partial contact surface between a first surface of a carrier plate and an exhaust fixture according to an embodiment of the present invention.
[0034] Figure 5 Schematic diagram of another embodiment of a portion of the first surface of the carrier plate and a portion of the contact surface of the exhaust fixture according to the present invention.
[0035] Figure 6 Schematic diagram of another embodiment of a portion of the first surface of the carrier plate and a portion of the contact surface of the exhaust fixture according to the present invention.
[0036] Figure 7 2 is a schematic diagram of another embodiment of a portion of the first surface of the carrier plate and a portion of the contact surface of the exhaust fixture according to the present invention.
[0037] Figure 8 It is a block diagram of a method flow of one embodiment of the present invention.
[0038] Explanation of the reference numerals: 10-carrier; 11-first surface; 12-second surface; 20-carrier pressing device; 201-upper surface; 202-lower surface; 21-gas inlet; 22-gas outlet; 23-air bag; 24-sealing structure; 25-gas channel; 26-air pressure source; 27-vacuum generator; 28-storage plate; 30-processing frame; 31-slide; 40-processing chamber; 50-exhaust fixture; 51-hole; 52-upper contact portion; 521-upper contact surface; 522-supporting hole; 53-lower base portion; 531-threaded hole; 532-groove; 533-exhaust hole; 54-heat-resistant sealing layer; 61-screw; 62-O-ring; 70, 71, 72, 73, 74, 75, 76, 77-steps. DETAILED DESCRIPTION
[0039] The present invention provides a design of equipment and method for processing a carrier plate by combining a pressure difference method with an exhaust fixture.
[0040] In order to enable a further understanding and recognition of the purpose, features and effects of the present invention, the following is a detailed description with reference to the embodiments and accompanying drawings:
[0041] See Figures 1 to 3 As shown, the present invention provides a device for processing a substrate by using a pressure difference method combined with an exhaust fixture, comprising:
[0042] A processing frame 30 is provided in a processing chamber 40;
[0043] A plurality of carrier pressing devices 20 are disposed parallel to each other on a slide 31 inside the processing frame 30. The carrier pressing devices 20 include at least one gas inlet 21, at least one gas outlet 22, at least one air bag 23, and at least one gas channel 25. At least one gas inlet 21 is connected to a gas pressure source 26. The carrier pressing device 20 has a lower surface 202 and an opposing upper surface 201. The lower surface 202 is provided with at least one air bag 23. At least one gas channel 25 is connected to the at least one gas inlet 21 and the at least one gas outlet 22 at one end and to the at least one air bag 23 at the other end. The air bag 23 and the gas channel 25 are connected to form a sealed space.
[0044] A plurality of exhaust fixtures 50 are provided with a plurality of exhaust holes 533 capable of exhausting the outside of the processing chamber 40. The exhaust holes 533 can be connected to components such as a vacuum generator, a valve or a fan. The exhaust fixture 50 is arranged on the upper surface 201 of the carrier pressing device 20. The exhaust fixture 50 includes an upper contact portion 52 and a lower base portion 53, wherein the surface of the upper contact portion 52 is an upper contact surface 521. The upper contact portion 52 is a detachable design. A first surface 11 of a carrier 10 that has been previously heat-processed is simulated or actually measured to obtain surface data, wherein the upper or lower surface of the carrier 10 facing the upper contact surface 521 is defined as the first surface 11, and the other surface relative to the first surface 11 is defined as the second surface 12; the surface data can be obtained by corresponding flat to flat, concave to convex, and convex to concave. The relevant data is processed on the upper contact surface 521, and the upper contact surface 521 of the exhaust jig 50 places the carrier 10 corresponding to the air bag 23 on the carrier pressing device 20, so that the first surface 11 and the upper contact surface 521 of the exhaust jig 50 are in contact with each other. In addition, the upper surface 201 of the uppermost carrier pressing device 20 does not place the carrier 10 and the exhaust jig 50, and the processing chamber 40 is pressurized with gas. The air bag 23 is filled with gas through the air pressure source 26, and the exhaust jig 50 is exhausted to form a pressure difference between the first surface 11 of each carrier 10 and the second surface 12 of each carrier 10, so as to press each carrier 10 onto each exhaust jig 50, so as to offset the thermal stress of each carrier 10 during subsequent thermal processing, so that each carrier 10 after thermal processing tends to be flat.
[0045] The pressure difference method is combined with an exhaust jig to perform carrier processing, wherein each gas outlet 22 can be connected to a vacuum generator 27. Through the vacuum generator 27, the pressure in each gas channel 25 and each airbag 23 is reduced to a predetermined vacuum pressure. By vacuum suction, each airbag 23 is adsorbed on the lower surface 202 of each carrier pressing device 20, making it convenient to remove each carrier 10.
[0046] The pressure difference method is combined with an exhaust fixture to perform carrier processing, wherein the carrier pressing device 20 can be slidably mounted on the inner side of the processing frame 30, and the lower surface 202 of the carrier pressing device 20 is fixed with at least one airbag 23 through at least one sealing structure 24.
[0047] The pressure difference method is combined with an exhaust fixture to process the substrate, wherein the air bag 23 is made of polyimide or Teflon.
[0048] The apparatus for processing a carrier plate by combining the pressure difference method with an exhaust jig is characterized in that a storage plate 28 can be arranged parallel to each other on the inner side of the processing frame 30 below the carrier plate pressing device 20 at the bottom layer, and the upper surface of the storage plate 28 is provided with at least one carrier plate 10 and at least one exhaust jig 50 corresponding to at least one air bag 23 on the carrier plate pressing device 20 at the bottom layer.
[0049] The apparatus for processing a substrate using a pressure differential method combined with an exhaust fixture, wherein the substrate 10 can be at least one of a printed circuit board, a substrate, a lead frame, a wafer, a silicon interposer, a package, a glass carrier, and a flat plate with circuit wiring.
[0050] See also Figure 2 、 Figure 3 As shown, the pressure difference method is combined with an exhaust jig to perform plate processing on the device, wherein the upper contact portion 52 is provided with a plurality of supporting holes 522 of a plurality of locking structures downwardly around the periphery, and the lower base portion 53 is provided with a plurality of threaded holes 531 of the locking structure corresponding to the supporting holes 522. The supporting holes 522 can be aligned with the threaded holes 531, and then fixed by locking with a plurality of screws 61. The lower base portion 53 is provided with an annular groove 532 to assemble an O-ring 62.
[0051] See also Figures 4 to 7 As shown, the pressure difference method is combined with an exhaust jig to perform carrier processing, wherein the first surface 11 of the carrier 10 is simulated or actually measured to be a concave surface, and the upper contact surface 521 of the upper contact portion 52 is a convex surface; the first surface 11 of the carrier 10 is simulated or actually measured to be a convex surface, and the upper contact surface 521 of the upper contact portion 52 is a concave surface; the first surface 11 of the carrier 10 is simulated or actually measured to be a wavy surface, and the upper contact surface 521 of the upper contact portion 52 is an anti-wavy surface; the first surface 11 of the carrier 10 is simulated or actually measured to be an irregular surface, and the upper contact surface 521 of the upper contact portion 52 is an anti-irregular surface.
[0052] See Figure 1 To Figure 3 As shown, the pressure difference method is combined with an exhaust jig to perform carrier processing, wherein a plurality of holes 51 are provided on the upper contact portion 52 of the exhaust jig 50, and at least one heat-resistant sealing layer 54 is provided between the first surface 11 of the carrier 10 and the upper contact surface 521 of the exhaust jig 50, wherein the heat-resistant sealing layer 54 can partially cover or not cover the holes 51; the heat-resistant sealing layer 54 can withstand a processing temperature of more than 40°C and less than 1200°C.
[0053] See Figure 8 As shown, the present invention provides a method for processing a carrier plate using a pressure difference method combined with an exhaust fixture, the steps of which include:
[0054] Step 1 70: Prepare a plurality of carrier pressing devices, each having a lower surface and an opposite upper surface, wherein at least one airbag is disposed on the lower surface;
[0055] Step 2 A71: After a carrier plate is deformed by thermal processing, actually measuring surface data of the deformed first surface of the carrier plate; or
[0056] Step 2 B72: After a carrier plate is deformed by simulated thermal processing, surface data of the deformed first surface of the carrier plate is calculated;
[0057] Step 3 73: Prepare a plurality of exhaust fixtures with detachable upper contact portions;
[0058] Step 4 74: The processing machine can process the upper contact surface of the upper contact portion according to the surface data, with the corresponding data of flat to flat, concave to convex, and convex to concave.
[0059] Step 5 75: placing the exhaust fixture comprising a plurality of carriers on the upper surfaces of the carrier pressing devices in a processing chamber, with the first surfaces of the carriers facing the upper contact surfaces having the plurality of holes, and the exteriors of the airbags pressing against the second surfaces of the carriers;
[0060] Step 6 76 : Pressurizing the processing chamber with gas, filling each air bag with gas through a pressure source, and exhausting each exhaust fixture to form a pressure difference between the first surface of each carrier and the second surface of each carrier, thereby pressing each carrier against each exhaust fixture;
[0061] Step 77: After the heat treatment, the thermal stress of each carrier plate is offset, making each carrier plate flat. The upper or lower surface of the carrier plate facing the upper contact surface is defined as the first surface, and the other surface opposite to the first surface is defined as the second surface.
[0062] As can be seen from the above, the apparatus and method of the present invention for processing a carrier using a pressure differential method combined with an exhaust jig can suppress carrier warping during the process by utilizing the pressure difference between the airbag and the processing chamber. The contact surface on the exhaust jig can be processed into an inverse geometric surface to offset the thermal stress of the carrier after the process, making the carrier shape tend to be flat, which meets better industrial applicability.
[0063] The foregoing is a specific description of the technical features of the preferred embodiments of the present application; and those skilled in the art should be able to make changes and modifications to the present application without departing from the spirit and principles of the present application, and these changes and modifications shall be covered within the scope of protection of the present application.
Claims
1. A device for processing a carrier plate using a pressure difference method combined with an exhaust fixture, characterized in that: include: a processing chamber with a processing frame disposed therein; a plurality of carrier pressing devices, each of the carrier pressing devices being disposed parallel to one another inside the processing frame, the carrier pressing devices comprising at least one gas inlet, at least one gas outlet, at least one air bag, and at least one gas channel, the at least one gas inlet being connected to a pressure source, the carrier pressing device having a lower surface and an opposing upper surface, the at least one air bag being disposed on the lower surface, the at least one gas channel having one end connected to the at least one gas inlet and the at least one gas outlet and the other end connected to the at least one air bag, the air bag and the gas channel being connected to form a sealed space; and A plurality of exhaust jigs are provided with a plurality of exhaust holes capable of exhausting the outside of the processing chamber. The exhaust jig is arranged on the upper surface of the carrier pressing device. The exhaust jig is composed of an upper contact portion and a lower base portion, wherein the surface of the upper contact portion is an upper contact surface. The upper contact portion is of a detachable design. A first surface of a carrier plate that has been previously heat-processed is simulated or actually measured to obtain surface data. The surface data is processed on the upper contact surface with corresponding relevant data of flat corresponding to flat, concave corresponding to convex, and convex corresponding to concave. The upper contact surface of the exhaust jig is used to place the carrier plate on the airbag on the carrier pressing device so that the first surface and the upper contact surface of the exhaust jig are in contact. During subsequent heat processing, the thermal stress of each carrier plate can be offset, so that each carrier plate tends to be flat after heat processing.
2. The apparatus for processing a substrate using a pressure differential method combined with an exhaust fixture as claimed in claim 1, characterized in that: Each gas outlet is connected to a vacuum generator, through which the pressure in each gas channel and each airbag is reduced to a predetermined vacuum pressure. By vacuum suction, each airbag is adsorbed on the lower surface of each carrier pressing device, making it easy to remove each carrier.
3. The apparatus for processing a substrate using a pressure differential method combined with an exhaust fixture as claimed in claim 1, characterized in that: The carrier plate pressing device is slidably sleeved on the inner side of the processing frame, and the lower surface of the carrier plate pressing device is fixed with at least one air bag via at least one sealing structure.
4. The apparatus for processing a substrate using a pressure differential method combined with an exhaust fixture as claimed in claim 1, characterized in that: The airbag is made of polyimide or Teflon material.
5. The apparatus for processing a substrate using a pressure differential method combined with an exhaust fixture as claimed in claim 1, characterized in that: A storage plate is arranged parallel to each other on the inner side of the processing frame below the bottom carrier pressing device, and at least one carrier and at least one exhaust fixture are placed on the upper surface of the storage plate corresponding to at least one airbag on the bottom carrier pressing device.
6. The apparatus for processing a substrate using a pressure differential method combined with an exhaust fixture as claimed in claim 1, characterized in that: The carrier is at least one of a printed circuit board, a substrate, a conductive bracket, a wafer, a silicon intermediate layer, a package, a glass carrier, and a flat plate with circuit wiring.
7. The apparatus for processing a substrate using a pressure differential method combined with an exhaust fixture as claimed in claim 1, characterized in that: The upper contact portion is provided with a plurality of supporting holes with a plurality of locking structures downwardly around the periphery, and the lower base portion is provided with a plurality of threaded holes of the locking structure corresponding to the supporting holes. The supporting holes are aligned with the threaded holes and then fixed with a plurality of screws. The lower base portion is provided with an annular groove to which an O-ring can be assembled.
8. The apparatus for processing a substrate using a pressure differential method combined with an exhaust fixture as claimed in claim 1, characterized in that: If the first surface of the carrier plate is simulated or actually measured as a concave surface, the upper contact surface of the upper contact portion is a convex surface; if the first surface of the carrier plate is simulated or actually measured as a convex surface, the upper contact surface of the upper contact portion is a concave surface; if the first surface of the carrier plate is simulated or actually measured as a wavy surface, the upper contact surface of the upper contact portion is an anti-wavy surface; if the first surface of the carrier plate is simulated or actually measured as an irregular surface, the upper contact surface of the upper contact portion is an anti-irregular surface.
9. The apparatus for processing a substrate using a pressure differential method combined with an exhaust fixture as claimed in claim 1, characterized in that: A plurality of holes are provided on the upper contact portion of the exhaust fixture, and at least one heat-resistant sealing layer is provided between the first surface of the carrier plate and the upper contact surface of the exhaust fixture, wherein the heat-resistant sealing layer can partially cover or not cover the holes; the heat-resistant sealing layer can withstand a processing temperature of above 40°C and below 1200°C.
10. A method for processing a carrier plate using a pressure difference method combined with an exhaust fixture, characterized in that: The following steps are involved: A plurality of carrier plate pressing devices are prepared, each having a lower surface and an opposite upper surface, wherein at least one air bag is disposed on the lower surface; After a carrier plate is deformed by thermal processing, actual surface data of the deformed first surface of the carrier plate is measured; or after a carrier plate is deformed by simulated thermal processing, surface data of the deformed first surface of the carrier plate is calculated; Prepare a plurality of exhaust fixtures with detachable upper contact portions; The processing machine can process the upper contact surface of the upper contact portion according to the surface data, with corresponding data of flat to flat, concave to convex, and convex to concave. Placing a plurality of exhaust jigs containing a plurality of carriers on the upper surfaces of the carrier pressing devices in a processing chamber, with the first surfaces of the carriers facing the upper contact surfaces having the plurality of holes, and the exteriors of the air bags pressing against the second surfaces of the carriers; Pressurizing the processing chamber, filling each air bag with gas through a pressure source, and exhausting each exhaust fixture to form a pressure difference between the first surface of each carrier plate and the second surface of each carrier plate, thereby pressing each carrier plate onto each exhaust fixture; After the heat treatment, the thermal stress of each carrier plate can be offset, so that each carrier plate tends to be flat.
Citation Information
Patent Citations
Method for suppressing material warpage by means of pressure difference
CN107359140A
Apparatus and method for substrate handling
CN114823459A