Profile liquid cooling plate and battery

Abstract

The present disclosure provides a profile liquid cooling plate and a battery, wherein the profile liquid cooling plate comprises: a substrate assembly comprising a first substrate and a second substrate, a plurality of partitions are arranged in the first substrate and the second substrate to form flow channels, the plurality of partitions extend along a first direction and are arranged at intervals along a second direction; a first flow collector is arranged at a first end of the substrate assembly along the first direction, two end regions of the inlet flow channel in the first flow collector are provided with a first opening for guiding the cooling liquid into the flow channel of the first substrate and a second opening for guiding the cooling liquid into the flow channel of the second substrate; a blocking piece is arranged at a second end of the first substrate along the first direction to cover a partial length of the first substrate, so that a detour flow channel is formed between the plurality of partitions in the first substrate; and a second flow collector is arranged at a second end of the substrate assembly along the first direction to cover another partial length of the first substrate and the second substrate, the outlet flow channel in the second flow collector is provided with a third opening for the cooling liquid in the first substrate and the second substrate to flow out.

Description

Technical Field

[0001] The present disclosure relates to the technical field of heat dissipation systems, and in particular to a profile liquid cooling plate and a battery. Background Art

[0002] The flow channel of traditional profile liquid cooling plates is single in form. Generally, multiple flow channels are set in the plate layer structure. The flow channels are in a straight line form, and the water inlet and outlet are generally located at both ends of the flow channel.

[0003] With the development of the new energy industry, battery pack structural layouts are becoming increasingly demanding, and traditional profiled liquid cooling plates are unable to meet these requirements. When the battery pack structure requires the inlet and outlet to be perpendicular to the flow channel, only stamped and brazed liquid cooling plates can meet this requirement. However, stamped and brazed liquid cooling plates have low strength and poor load-bearing capacity, making them unsuitable for use in applications requiring high structural strength. Furthermore, milling is difficult to manufacture. Summary of the Invention

[0004] The present disclosure provides a profile liquid cooling plate and a battery, which can better meet the structural layout requirements of application products.

[0005] A first aspect of the present disclosure provides a profile liquid cooling plate, comprising:

[0006] A substrate assembly includes a first substrate and a second substrate, each of which is provided with a plurality of baffles to form a flow channel for a coolant, wherein the plurality of baffles extend along a first direction and are spaced apart along a second direction, the first substrate and the second substrate are spliced ​​and arranged in the same plane along the second direction, and both are formed by extrusion along the first direction, wherein the second direction is perpendicular to the first direction;

[0007] a first current collecting member connected to a first end of the substrate assembly along a first direction, having a liquid inlet channel therein, and a first opening and a second opening respectively provided in regions of the liquid inlet channel near both ends along a second direction, the first opening being used to guide the coolant into the channel of the first substrate, and the second opening being used to guide the coolant into the channel of the second substrate;

[0008] a blocking member connected to the second end of the first substrate along the first direction and covering a portion of the length of the first substrate, for forming a circuitous flow channel between the plurality of partitions in the first substrate; and

[0009] The second current collecting member is arranged at the second end of the substrate assembly along the first direction and covers another partial length section of the first substrate and the second substrate. A liquid outlet channel is provided in the second current collecting member, and a third opening is provided in the liquid outlet channel in an area close to one end of the blocking member for allowing the cooling liquid in the first substrate and the second substrate to flow out.

[0010] In some embodiments, the first opening and the second opening are in communication with only a single flow channel in the first substrate and the second substrate, and the third opening is in communication with two adjacent flow channels in the first substrate and the second substrate; or

[0011] The first opening and the second opening are both communicated with N adjacent flow channels in the first substrate and the second substrate, and the third opening is communicated with N adjacent flow channels in the first substrate and the second substrate, respectively, where N≥2.

[0012] In some embodiments, the adjacent partitions in the first substrate and the second substrate are first plates, the two first plates are arranged in close proximity, and the first ends of the two first plates are in contact with the first current collecting member, and the second ends of the two first plates are opposite to the middle area of ​​the third opening along the second direction, so that at least one flow channel on the side of the first plate is connected to the third opening.

[0013] In some embodiments, a portion of the partitions in the first and second substrates abut against the first current collecting member, another portion of the partitions abut against the blocking member and the second current collecting member, or only abut against the second current collecting member, to form a circuitous flow channel in the first and second substrates.

[0014] In some embodiments, the inner surface of the blocking member is lower than the inner surface of the second current collecting member, the first end of one of the partitions in the first substrate is spaced apart from the first current collecting member, the second end abuts against the blocking member and a groove is provided on the surface facing the second current collecting member, and the groove is embedded in the end of the second current collecting member.

[0015] In some embodiments, the adjacent partitions in the first substrate and the second substrate are first plates, and the two first plates are laminated together;

[0016] The profile liquid cooling plate is a first profile liquid cooling plate, the partition plate with a groove is a second plate, the profile liquid cooling plate is a second profile liquid cooling plate, the partition plate with a groove is a third plate, and the first profile liquid cooling plate and the second profile liquid cooling plate have different numbers of parallel flow channels;

[0017] The thickness of the first plate is t1, the thickness of the second plate and the third plate is t2, and the thickness of the remaining partitions is t3, t1>t3, and t2>t3.

[0018] In some embodiments, the first substrate and the second substrate have the same cross-sectional shape in a plane perpendicular to the first direction.

[0019] In some embodiments, the profile liquid cooling plate further includes a plurality of blocking members.

[0020] The liquid inlet channel is connected to both ends of the first fluid collecting member along the second direction, and is sealed by sealing members at both ends; and / or

[0021] The liquid outlet channel passes through both ends of the second collecting member along the second direction, and is sealed by sealing members at both ends.

[0022] In some embodiments, the ends of the first current collecting member and the second current collecting member away from the blocking member in the second direction both extend beyond the second substrate, the first current collecting member is provided with a liquid inlet connector on at least one side of the extending area along the thickness direction, and the second current collecting member is provided with a liquid discharge connector on at least one side of the extending area along the thickness direction.

[0023] A second aspect of the present disclosure provides a battery, comprising:

[0024] a battery layer comprising a plurality of battery cells; and

[0025] The profile liquid cooling plate of the above embodiment is used to cool the battery layer.

[0026] In some embodiments, two battery layers are spaced apart in the thickness direction, and three profile liquid cooling plates are provided, including a first profile liquid cooling plate and two second profile liquid cooling plates. The first profile liquid cooling plate is provided between the two battery layers, and the second profile liquid cooling plates are provided on the sides of the two battery layers away from each other. The number of parallel flow channels in the first profile liquid cooling plate is greater than the number of parallel flow channels in the second profile liquid cooling plate.

[0027] The liquid inlet joints of two adjacent profile liquid cooling plates are connected by a liquid inlet pipe, and a liquid inlet port is provided in the area of ​​the liquid inlet pipe close to the first profile liquid cooling plate; the liquid discharge joints of two adjacent profile liquid cooling plates are connected by a liquid discharge pipe, and a liquid discharge port is provided in the area of ​​the liquid discharge pipe close to the first profile liquid cooling plate.

[0028] The profiled liquid cooling plate of the disclosed embodiment utilizes a multi-part assembly to facilitate the fabrication of the flow channels, as well as the liquid inlet and outlet channels. This facilitates designing the liquid inlet and outlet directions perpendicular to the flow channels, reducing the space occupied along the length of the flow channels and better meeting the layout requirements of the profiled liquid cooling plate in different products. Furthermore, the flow channels can be individually fabricated for each assembled component. Since both ends of the first and second substrates along the first direction are through-holes, they can be formed by extrusion, reducing fabrication difficulty and improving load-bearing capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0030] Figure 1 Schematic diagram of the structure of some embodiments of the first profile liquid cooling plate disclosed in the present invention.

[0031] Figure 2 Schematic diagram of the structure of some embodiments of the second profile liquid cooling plate disclosed in the present invention.

[0032] Figure 3 This is a cross-sectional view of the internal flow channel of the first profile liquid cooling plate.

[0033] Figure 4 This is a cross-sectional view of the internal flow channel of the second profile liquid cooling plate.

[0034] Figure 5 Schematic diagram of the structure of the battery internal thermal management system. DETAILED DESCRIPTION

[0035] The following detailed description of the embodiments of the present disclosure is provided in conjunction with the accompanying drawings and examples. The detailed description of the following embodiments and the accompanying drawings are used to illustrate the principles of the present disclosure, but are not intended to limit the scope of the present disclosure, that is, the present disclosure is not limited to the described embodiments.

[0036] In the description of the embodiments of the present disclosure, the term "plurality" refers to more than two (including two), and similarly, "multiple groups" refers to more than two (including two) groups.

[0037] The present disclosure uses descriptions of directions or positional relationships indicated by “upper”, “lower”, “top”, “bottom”, “front”, “back”, “inside” and “outside”, etc., which are only for the convenience of describing the present disclosure, and do not indicate or imply that the device referred to must have a specific direction, be constructed and operate in a specific direction. Therefore, it should not be understood as limiting the scope of protection of the present disclosure.

[0038] Furthermore, the terms "first," "second," and "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. "Perpendicular" does not strictly refer to perpendicularity, but rather to positions within an acceptable range of error. "Parallel" does not strictly refer to parallelism, but rather to positions within an acceptable range of error. The directional terms used in the following description refer to directions shown in the figures and are not intended to limit the specific structures of this disclosure.

[0039] It should also be noted that, in the description of this disclosure, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to direct connections or indirect connections through an intermediary. Those skilled in the art will understand the specific meanings of these terms in this disclosure depending on the specific circumstances.

[0040] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least some embodiments of the present disclosure. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0041] like Figures 1 to 5 As shown, in some embodiments, the profile liquid cooling plate of the present disclosure includes:

[0042] A substrate assembly includes a first substrate 1 and a second substrate 2, each of which is provided with a plurality of baffles 10 to form a flow channel for a coolant, wherein the plurality of baffles 10 extend along a first direction x and are spaced apart along a second direction y. The first substrate 1 and the second substrate 2 are spliced ​​and arranged in the same plane along the second direction y, and are both formed by extrusion along the first direction x, wherein the second direction y is perpendicular to the first direction x.

[0043] A first current collecting member 3 is connected to the first end of the substrate assembly along the first direction x, and has a liquid inlet channel 31 therein. The liquid inlet channel 31 has a first opening 32 and a second opening 33 respectively formed near the two ends along the second direction y. The first opening 32 is used to guide the coolant into the flow channel of the first substrate 1, and the second opening 33 is used to guide the coolant into the flow channel of the second substrate 2.

[0044] a blocking member 4 connected to the second end of the first substrate 1 along the first direction x and covering a portion of the length of the first substrate 1 , for forming a circuitous flow channel between the plurality of partitions 10 in the first substrate 1 ; and

[0045] The second current collecting member 5 is arranged at the second end of the substrate assembly along the first direction x, and covers another partial length section of the first substrate 1 and the second substrate 2. A liquid outlet channel 51 is provided in the second current collecting member 5, and the liquid outlet channel 51 is provided with a third opening 52 in an area close to one end of the blocking member 4 for allowing the cooling liquid in the first substrate 1 and the second substrate 2 to flow out.

[0046] The lengths of the plurality of partitions 10 may be different, and flow channels are formed between adjacent partitions 10. The first substrate 1 and the second substrate 2 are spliced ​​and arranged in the same plane along the second direction y, and can be fixed together, for example, by stir friction welding or the like. The first substrate 1 and the second substrate 2 can be formed by extrusion along the first direction x, such as Figure 3 and Figure 4 Both ends of the first substrate 1 and the second substrate 2 are through structures, so extrusion molding can be achieved.

[0047] The first current collecting member 3 can be a long, plate-like structure connected to the first end of the baseplate assembly along the first direction x. For example, friction stir welding can be used. Some separators 10 abut the first current collecting member 3, while other separators 10 are spaced apart from the first current collecting member 3. Multiple separators 10 form a circuitous, integrated flow channel.

[0048] A liquid inlet channel 31 is provided in the first current collecting member 3, and the liquid inlet channel 31 extends along the second direction y, and a first opening 32 and a second opening 33 are respectively provided in the area near the two ends along the second direction y on the side of the liquid inlet channel 31 facing the substrate assembly. The first opening 32 is used to guide the coolant into at least one channel of the first substrate 1, and the second opening 33 is used to guide the coolant into at least one channel of the second substrate 2.

[0049] The blocking member 4 and the second current collecting member 5 can both be elongated, plate-like structures and are jointly located at the second end of the substrate assembly along the first direction x. The blocking member 4 covers a portion of the length of the first substrate 1, while the second current collecting member 5 covers another portion of the length of the first substrate 1 and the second substrate 2. A liquid outlet channel 51 is defined within the second current collecting member 5. This channel 51 extends along the second direction y, and a third opening 52 is defined on the side of the channel 51 near the substrate assembly, in an area near one end of the blocking member 4. Cooling liquid, after heat exchange within the first and second substrates 1 and 2, flows out through the third opening 52.

[0050] The first substrate 1 , the second substrate 2 , the first current collecting member 3 , the blocking member 4 and the second current collecting member 5 are all spliced ​​together, for example, by friction stir welding, to ultimately form an integral flat plate structure.

[0051] refer to Figure 3 and Figure 4 After the cooling liquid enters the liquid inlet channel 31, it enters the flow channels of the first substrate 1 and the second substrate 2 respectively through the first opening 32 and the second opening 33. The cooling liquid forms a circuitous S-shaped flow channel between the multiple partitions of the first substrate 1 and the second substrate 2, and flows along the second direction y toward the adjacent side of the first substrate 1 and the second substrate 2, and finally flows out from the third opening 52.

[0052] This embodiment allows the profiled liquid cooling plate to be designed as a multi-part assembly, facilitating the fabrication of the flow channels, as well as the inlet and outlet channels. This facilitates designing the inlet and outlet directions perpendicular to the flow channels, reducing the space occupied along the length of the flow channels and better meeting the layout requirements of profiled liquid cooling plates in different products (e.g., batteries). Furthermore, the flow channels can be individually fabricated for each assembled component. Since both ends of the first and second substrates along the first direction are through-holes, they can be formed by extrusion, reducing fabrication difficulty and improving load-bearing capacity.

[0053] In some embodiments, as Figure 4As shown, the first opening 32 and the second opening 33 are in communication with only a single flow channel in the first substrate 1 and the second substrate 2, and the third opening 52 is in communication with two adjacent flow channels in the first substrate 1 and the second substrate 2. For example, the first opening 32 and the second opening 33 are in communication with the outermost flow channels in the first substrate 1 and the second substrate 2, respectively, the third opening 52 is in communication with the adjacent flow channels in the first substrate 1 and the second substrate 2, and the abutting position of the first substrate 1 and the second substrate 2 is located at the middle position of the third opening 52. This embodiment can achieve a greater cooling liquid flow resistance.

[0054] In other embodiments, as shown in FIG. 2, the first opening 32 and the second opening 33 are in communication with N adjacent flow channels in the first substrate 1 and the second substrate 2, respectively, and the third opening 52 is in communication with the respective N adjacent flow channels in the first substrate 1 and the second substrate 2, respectively, where N≥2. Figure 3

[0055] For example, the first opening 32 and the second opening 33 are in communication with the outermost N flow channels in the first substrate 1 and the second substrate 2, respectively, and when the cooling liquid flows, the N flow channels flow in parallel, and when flowing along the first direction x to the flow channel end point, the cooling liquid flows from the next group of N flow channels in sequence, the third opening 52 is in communication with the respective N adjacent flow channels in the first substrate 1 and the second substrate 2, and the abutting position of the first substrate 1 and the second substrate 2 is located at the middle position of the third opening 52. This embodiment can achieve a smaller cooling liquid flow resistance. Thus, by setting the number of parallel flow channels, different cooling liquid flow resistances can be achieved.

[0056] In some embodiments, as shown in FIG. 3, Figure 3 and Figure 4 The adjacent partitions 10 in the first substrate 1 and the second substrate 2 are first plates 13, the two first plates 13 are arranged in abutment, the first ends of the two first plates 13 are in abutment with the first current collector 3, and the second ends of the two first plates 13 are opposite the middle region of the third opening 52 along the second direction y, so that at least one flow channel on the side of the first plate 13 is in communication with the third opening 52. This arrangement facilitates the splicing of the first substrate 1 and the second substrate 2, and also facilitates the outflow of the cooling liquid after heat exchange in the first substrate 1 and the second substrate 2 from the third opening 52.

[0057] In some embodiments, a portion of the partitions 10 in the first substrate 1 and the second substrate 2 are in abutment with the first current collector 3, and another portion of the partitions 10 are in abutment with the blocking piece 4 and the second current collector 5, or only with the second current collector 5, so as to form a detour flow channel in the first substrate 1 and the second substrate 2. By setting whether the partitions 10 are in abutment with the first current collector 3, the blocking piece 4, and the second current collector 5, a flow channel structure form that meets the requirements can be formed.

[0058] In some embodiments, as shown in FIG. 4, Figure 3 and​ Figure 4 As shown, the inner surface of the blocking member 4 is lower than the inner surface of the second current collecting member 5, the first end of one of the partitions 10 in the first substrate 1 is spaced apart from the first current collecting member 3, the second end abuts against the blocking member 4 and a groove 121 is provided on the surface facing the second current collecting member 5, and the groove 121 is embedded in the end of the second current collecting member 5.

[0059] The thickness of the blocking member 4 along the first direction x is less than the thickness of the second current collecting member 5 along the first direction x, and the outer surface of the blocking member 4 and the second current collecting member 5 along the first direction x are flush. Figure 3 As shown, the second end of the second plate 11 abuts against the blocking member 4 and a groove 121 is provided on the surface facing the second current collecting member 5. The portion of the second current collecting member 5 that is higher than the blocking member 4 is embedded in the groove 121. Figure 4 As shown, the second end of the third plate 12 abuts against the blocking member 4 and a groove 121 is provided on the surface facing the second current collecting member 5. The portion of the second current collecting member 5 that is higher than the blocking member 4 is embedded in the groove 121. Figure 3 The length of the middle blocking member 4 is shorter than Figure 4 The length of the middle barrier 4, therefore Figure 3 The second plate 11 and Figure 4 Compared with the third plate 12 in the figure, it is closer to the outside of the first substrate 1.

[0060] The structure of this embodiment can not only enable the partition plate 10 to be connected to the blocking member 4 , but also achieve a positioning connection with the second current collecting member 5 .

[0061] In some embodiments, the adjacent partitions 10 in the first substrate 1 and the second substrate 2 are first plates 13 , and the two first plates 13 are laminated together;

[0062] The profiled liquid cooling plate is a first profiled liquid cooling plate 100, and the partition 10 with the groove 121 is a second plate 11; the profiled liquid cooling plate is a second profiled liquid cooling plate 200, and the partition 10 with the groove 121 is a third plate 12. The first profiled liquid cooling plate 100 and the second profiled liquid cooling plate 200 have different numbers of parallel flow channels.

[0063] The thickness of the first plate 13 is t1, the thickness of the second plate 11 and the third plate 12 is t2, and the thickness of the remaining separators 10 is t3, t1>t3, and t2>t3. Optionally, t1=t2.

[0064] This embodiment takes into account that the adjacent first plates 13 of the first substrate 1 and the second substrate 2 need to be connected by welding, and setting them to have a larger thickness is conducive to welding the two first plates 13, which can improve the connection strength of the first substrate 1 and the second substrate 2.

[0065] Moreover, setting the second plate 11 and the third plate 12 to a larger thickness is conducive to setting the groove 121 to match and fix the end position of the second current collecting member 5. Without the groove 121, there is also sufficient thickness to connect with the blocking member 4, which is conducive to welding, such as stir friction welding.

[0066] If the product is provided with both the first profile cooling plate 100 and the second profile cooling plate 200, since the number of parallel flow channels of the two profile cooling plates is different, the position of the partition 10 where the groove 121 is set is different, that is, the second plate 11 or the third plate 12 needs to be set to a larger thickness. By setting the second plate 11 and the third plate 12 to a larger thickness at the same time, the structural versatility of the first base 1 can be achieved.

[0067] In some embodiments, the cross-sectional shapes of the first substrate 1 and the second substrate 2 in a plane perpendicular to the first direction x are the same, that is, the cross-sectional shapes of the first substrate 1 and the second substrate 2 are symmetrical with respect to the adjacent surfaces.

[0068] For example, a first plate 13 , a second plate 11 and a third plate 12 with relatively large thickness are provided in the first substrate 1 , and three spacers 10 with relatively large thickness are also symmetrically provided in the second substrate 2 .

[0069] In this embodiment, the first substrate 1 and the second substrate 2 can be processed by a unified extrusion die, which can reduce production costs.

[0070] In some embodiments, as Figure 3 and Figure 4 As shown, the profile liquid cooling plate also includes a plurality of blocking members 6, wherein:

[0071] The liquid inlet channel 31 passes through both ends of the first fluid collecting member 3 along the second direction y, and is sealed by the blocking member 6 at both ends; and / or

[0072] The liquid outlet channel 51 passes through both ends of the second collecting member 5 along the second direction y, and is sealed by the blocking members 6 at both ends.

[0073] In this embodiment, the liquid inlet channel 31 and the liquid outlet channel 51 are designed to be through-connected at both ends, which is convenient for processing. After processing, they are sealed by the sealing member 6, which can meet the sealing requirements of the channel and allow the coolant to flow along the predetermined path.

[0074] In some embodiments, the ends of the first current collecting member 3 and the second current collecting member 5 away from the blocking member 4 in the second direction y both extend beyond the second substrate 2, the first current collecting member 3 is provided with a liquid inlet connector 7 on at least one side of the extending area along the thickness direction z, and the second current collecting member 5 is provided with a liquid discharge connector 7' on at least one side of the extending area along the thickness direction z.

[0075] Among them, such as Figure 1As shown, the first manifold 3 is provided with a liquid inlet connector 7 and a liquid outlet connector 7' on both sides, that is, the coolant can be introduced through the liquid inlet connector 7 on both sides, and the discharged coolant can be discharged through the liquid outlet connector 7' on both sides. This structure can increase the coolant flow rate and improve the heat exchange capacity. The double-sided arrangement is suitable for substrate assemblies with a large number of parallel flow channels. Figure 2 As shown, the first flow collecting member 3 is provided with a liquid inlet joint 7 and a liquid outlet joint 7' on one side, which is suitable for a substrate assembly with a small number of parallel flow channels or a single flow channel.

[0076] In this embodiment, a liquid inlet joint 7 and a liquid outlet joint 7' can be provided on at least one side according to the required cooling capacity to achieve the required heat exchange capacity.

[0077] Secondly, the present disclosure provides a battery, comprising:

[0078] a battery layer comprising a plurality of battery cells; and

[0079] The profile liquid cooling plate of the above embodiment is used to cool the battery layer.

[0080] This embodiment can cool the battery layer by fitting the profile liquid cooling plate to the battery layer, remove the heat generated by the battery layer during operation, and improve the performance and reliability of the battery operation.

[0081] In some embodiments, as Figure 5 As shown, two battery layers are spaced apart along the thickness direction z, and three profile liquid cooling plates are provided, including a first profile liquid cooling plate 100 and two second profile liquid cooling plates 200. The first profile liquid cooling plate 100 is arranged between the two battery layers, and the second profile liquid cooling plates 200 are respectively arranged on the sides of the two battery layers away from each other. The number of parallel flow channels in the first profile liquid cooling plate 100 is greater than the number of parallel flow channels in the second profile liquid cooling plate 200; for example, the number of parallel flow channels in the first profile liquid cooling plate 100 is 3, and the number of parallel flow channels in the second profile liquid cooling plate 200 is 1.

[0082] The liquid inlet joints 7 of two adjacent profile liquid cooling plates are connected through a liquid inlet pipe 8, and a liquid inlet port 9 is provided in the area of ​​the liquid inlet pipe 8 near the first profile liquid cooling plate 100; the liquid discharge joints 7' of two adjacent profile liquid cooling plates are connected through a liquid discharge pipe 8', and a liquid discharge port 9' is provided in the area of ​​the liquid discharge pipe 8' near the first profile liquid cooling plate 100.

[0083] The distance between two adjacent profiled liquid cooling plates is equal to the thickness of the battery layer. The liquid inlet connector 7 and the liquid drain connector 7' are located on the sides of the first and second current collectors 3 and 5, respectively. This facilitates the connection of the liquid inlet connectors 7 of two adjacent profiled liquid cooling plates by the liquid inlet pipe 8, and the connection of the liquid drain connectors 7' of two adjacent profiled liquid cooling plates by the liquid drain pipe 8'. The liquid inlet pipe 8 and the liquid drain pipe 8' can be corrugated tubes to adapt to the thickness of the battery layer.

[0084] This embodiment takes into account the three-layer profile liquid cooling plate sandwiching two battery layers. The middle first profile liquid cooling plate 100 contacts the surfaces of both battery layers simultaneously. As a result, the heat dissipation demand of the first profile liquid cooling plate 100 is twice that of the second profile liquid cooling plate 200. Therefore, the first profile liquid cooling plate 100 has a large number of parallel flow channels and a smaller coolant flow resistance, which can improve heat exchange efficiency. The second profile liquid cooling plate 200 has a small number of parallel flow channels and a greater coolant flow resistance, which can save coolant consumption. Through this layout, the coolant flow rate can be distributed according to the heat dissipation requirements.

[0085] like Figure 5 As shown, the coolant enters the liquid inlet channel 31 of the upper and lower second profile liquid cooling plates 200 through the liquid inlet 9 , and simultaneously enters the liquid inlet channel 31 of the first profile liquid cooling plate 100 .

[0086] like Figure 3 The figure shows a cross-sectional view of a first-profile liquid cooling plate 100. Coolant enters the inlet channel 31 of the first current collector 3 through the inlet connector 7 and splits into two paths: one path enters the three outermost channels of the first substrate 1 through the first opening 32, and the other path enters the three outermost channels of the second substrate 2 through the second opening 33. After a circuitous flow path, the coolant in the first and second substrates 1 and 2 ultimately merges in the outlet channel 51 through the third opening 52 and flows out through the drain connector 7'. The first and second substrates 1 and 2 have the same cross-section and can be extruded through the same extrusion die. The first and second current collectors 3 and 5 also have the same cross-section and can be extruded through the same extrusion die. They are then welded together via friction stir welding.

[0087] The thickness of the second plate 11 in the first substrate 1 is 8 mm, wherein the depth of the groove 121 is 2 mm for positioning with the second current collecting member 5 , and the remaining 6 mm is used for friction stir welding with the blocking member 4 .

[0088] like Figure 4 As shown in FIG. 2 , a cross-sectional view of a second profile liquid cooling plate 200 is shown. The coolant enters the liquid inlet channel 31 of the first current collector 3 through the liquid inlet connector 7 and is divided into two paths. One path enters the outermost flow channel of the first substrate 1 through the first opening 32, and the other path enters the outermost flow channel of the second substrate 2 through the second opening 33. The two paths of fluid no longer branch when passing through the first substrate 1 and the second substrate 2, resulting in greater flow resistance. After a circuitous flow path, the coolant in the first substrate 1 and the second substrate 2 finally merges in the liquid outlet channel 51 through the third opening 52 and flows out from the drain connector 7 ′.

[0089] The thickness of the third plate 12 in the first substrate 1 is 8 mm, wherein the depth of the groove 121 is 2 mm for positioning with the second current collecting member 5 , and the remaining 6 mm is used for friction stir welding with the blocking member 4 .

[0090] In both flow passage forms of the cold plate, the thickness of the second plate 11 and the third plate 12 is designed to be 8 mm. Unification of the mold is achieved.

[0091] Although the present disclosure has been described with reference to the preferred embodiments, various modifications can be made to it without departing from the scope of the present disclosure and equivalents thereof can be substituted for the components therein. In particular, the technical features mentioned in each of the embodiments can be combined in any manner as long as there is no structural conflict. The present disclosure is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A profile liquid cooling plate, characterized in that: include: A substrate assembly comprises a first substrate (1) and a second substrate (2), each of which is provided with a plurality of partitions (10) to form a flow channel for a coolant to flow, wherein the plurality of partitions (10) extend along a first direction (x) and are spaced apart along a second direction (y), wherein the first substrate (1) and the second substrate (2) are spliced ​​and arranged along the second direction (y) in the same plane, and are both formed by extrusion along the first direction (x), and the second direction (y) is perpendicular to the first direction (x); A first current collecting member (3) is connected to the first end of the substrate assembly along the first direction (x), and is provided with a liquid inlet channel (31). The liquid inlet channel (31) is provided with a first opening (32) and a second opening (33) in areas near both ends along the second direction (y), respectively. The first opening (32) is used to guide the cooling liquid into the flow channel of the first substrate (1), and the second opening (33) is used to guide the cooling liquid into the flow channel of the second substrate (2); a blocking member (4) connected to the second end of the first substrate (1) along the first direction (x) and covering a portion of the length of the first substrate (1), and used to form a circuitous flow channel between the plurality of partitions (10) in the first substrate (1); and A second current collecting member (5) is provided at the second end of the substrate assembly along the first direction (x) and covers another portion of the length of the first substrate (1) and the second substrate (2); a liquid outlet channel (51) is provided in the second current collecting member (5), and a third opening (52) is provided in the liquid outlet channel (51) in a region close to one end of the blocking member (4) for allowing the cooling liquid in the first substrate (1) and the second substrate (2) to flow out; wherein the adjacent partitions (10) in the first substrate (1) and the second substrate (2) are first plates (13), the two first plates (13) are arranged in close contact, and the first ends of the two first plates (13) are in contact with the first current collecting member (3), and the second ends of the two first plates (13) are aligned with the middle area of ​​the third opening (52) along the second direction (y), so that at least one flow channel on the side of the first plate (13) is in communication with the third opening (52); A portion of the partition (10) in the first substrate (1) and the second substrate (2) abuts against the first current collecting member (3), and another portion of the partition (10) abuts against the blocking member (4) and the second current collecting member (5), or only abuts against the second current collecting member (5), so as to form a circuitous flow channel in the first substrate (1) and the second substrate (2).

2. The profile liquid cooling plate according to claim 1, characterized in that: The first opening (32) and the second opening (33) are in communication with only a single flow channel in the first substrate (1) and the second substrate (2), and the third opening (52) is in communication with two adjacent flow channels in the first substrate (1) and the second substrate (2); or The first opening (32) and the second opening (33) are both in communication with N adjacent flow channels in the first substrate (1) and the second substrate (2), and the third opening (52) is in communication with N adjacent flow channels in the first substrate (1) and the second substrate (2), respectively, where N is greater than or equal to 2.

3. The profile liquid cooling plate according to claim 1, characterized in that: The inner surface of the blocking member (4) is lower than the inner surface of the second current collecting member (5); the first end of one of the partitions (10) in the first substrate (1) is spaced apart from the first current collecting member (3); the second end abuts against the blocking member (4) and is provided with a groove (121) on the surface facing the second current collecting member (5); the groove (121) is engaged with the end of the second current collecting member (5).

4. The profile liquid cooling plate according to claim 3, characterized in that: The adjacent partitions (10) in the first substrate (1) and the second substrate (2) are first plates (13), and the two first plates (13) are arranged in a laminated manner; The profile liquid cooling plate is a first profile liquid cooling plate (100), the partition plate (10) provided with the groove (121) is a second plate (11), the profile liquid cooling plate is a second profile liquid cooling plate (200), the partition plate (10) provided with the groove (121) is a third plate (12), and the first profile liquid cooling plate (100) and the second profile liquid cooling plate (200) have different numbers of parallel flow channels; The thickness of the first plate (13) is t1, the thickness of the second plate (11) and the third plate (12) is t2, and the thickness of the remaining partitions (10) is t3, t1>t3, and t2>t3.

5. The profile liquid cooling plate according to claim 1, characterized in that: The first substrate (1) and the second substrate (2) have the same cross-sectional shape in a plane perpendicular to the first direction (x).

6. The profile liquid cooling plate according to any one of claims 1 to 5, characterized in that: It also includes a plurality of blocking members (6), wherein: The liquid inlet channel (31) is connected to both ends of the first current collecting member (3) along the second direction (y), and is sealed by the blocking member (6) at both ends; and / or The liquid outlet channel (51) is connected to both ends of the second collecting member (5) along the second direction (y), and is sealed by the blocking member (6) at both ends.

7. The profile liquid cooling plate according to any one of claims 1 to 5, characterized in that: Ends of the first current collecting member (3) and the second current collecting member (5) away from the blocking member (4) in the second direction (y) both extend beyond the second substrate (2); the first current collecting member (3) is provided with a liquid inlet joint (7) on at least one side of the extending region along the thickness direction (z); and the second current collecting member (5) is provided with a liquid discharge joint (7') on at least one side of the extending region along the thickness direction (z).

8. A battery, characterized in that: include: a battery layer, comprising a plurality of battery cells; and The profile liquid cooling plate according to any one of claims 1 to 7 is used to cool the battery layer.

9. The battery according to claim 8, characterized in that Two battery layers are spaced apart in a thickness direction (z), three profile liquid cooling plates are provided, and include a first profile liquid cooling plate (100) and two second profile liquid cooling plates (200), the first profile liquid cooling plate (100) is arranged between the two battery layers, and the second profile liquid cooling plates (200) are respectively arranged on mutually distant sides of the two battery layers, and the number of parallel flow channels in the first profile liquid cooling plate (100) is greater than the number of parallel flow channels in the second profile liquid cooling plate (200); The liquid inlet joints (7) of two adjacent profile liquid cooling plates are connected via a liquid inlet pipe (8), and a liquid inlet port (9) is provided in an area of ​​the liquid inlet pipe (8) close to the first profile liquid cooling plate (100); the liquid discharge joints (7') of two adjacent profile liquid cooling plates are connected via a liquid discharge pipe (8'), and a liquid discharge port (9') is provided in an area of ​​the liquid discharge pipe (8') close to the first profile liquid cooling plate (100).

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