A 3D superstructure enhanced absorption and penetration integrated metamaterial

Abstract

The present invention discloses a 3D superstructure enhanced absorption and penetration integrated metamaterial, belonging to the field of microwave technology. The metamaterial comprises a 3D superstructure, a dielectric structure layer I, an electromagnetic loss metasurface I, an electromagnetic loss metasurface I substrate, a dielectric structure layer II, an electromagnetic loss metasurface II, an electromagnetic loss metasurface II substrate, a dielectric structure layer III, a lossless bandpass type metasurface, and a lossless bandpass type metasurface substrate, which are arranged in sequence from top to bottom; the electromagnetic loss metasurface I is composed of a plurality of conductive units I, and the conductive unit I comprises a conductive Minkowski ring and four conductive inner square rings located at the four corners of the conductive Minkowski ring. The 3D superstructure enhanced absorption and penetration integrated metamaterial provided by the present invention can solve the technical problems that the traditional absorbing coating has a narrow absorption band, the circuit simulation absorber has no transmission band, and is not compatible with antenna work.

Description

Technical Field

[0001] The present invention belongs to the field of microwave technology, and in particular relates to a 3D superstructure enhanced absorption and penetration integrated metamaterial. Background Art

[0002] Electromagnetic metamaterials are a new type of artificial electromagnetic material that has electromagnetic properties that traditional materials in nature do not have. These properties are achieved by designing specific geometric shapes in the microstructure of the material, the size of which is usually smaller than the wavelength of electromagnetic waves, thus giving the material a special electromagnetic response on a macroscopic level.

[0003] The absorbent-transmitter metamaterial is an important branch of electromagnetic metamaterials, combining the characteristics of frequency selective surfaces and circuit simulation absorbers. Frequency selective surfaces can achieve efficient transmission of electromagnetic waves within a specific frequency range, and show reflection characteristics outside the band, while circuit simulation absorbers absorb electromagnetic waves within the band. The absorbent-transmitter metamaterial can achieve high transmittance of electromagnetic waves within the working frequency band, and effectively absorb electromagnetic waves outside the band. This characteristic makes it of great value in applications such as reducing radar cross-section and enhancing electromagnetic compatibility.

[0004] Traditional absorption-transmission metamaterials often only contain one transmission band and one absorption band, which limits their application scope. To expand the application scenarios, researchers have developed a new absorption-transmission metamaterial with two absorption bands and a transmission band in between. This design not only improves the functionality of the material, but also provides more flexibility for the regulation of electromagnetic waves. However, existing absorption-transmission metamaterials still face some challenges, such as narrow absorption bandwidth, excessive insertion loss in the transmission band, and large transition band. Summary of the invention

[0005] The purpose of the present invention is to provide a 3D superstructure enhanced absorption and penetration integrated metamaterial, which can solve the technical problems that traditional absorbing coatings have narrow absorption bandwidth, circuit simulation absorbers do not have a transparent band, and are incompatible with antenna work.

[0006] In order to solve the above technical problems, the technical solution adopted by the present invention is as follows:

[0007] A 3D superstructure enhanced absorption and penetration integrated metamaterial comprises, arranged in sequence from top to bottom, a 3D superstructure, a dielectric structure layer I, an electromagnetic loss supersurface I, an electromagnetic loss supersurface I substrate, a dielectric structure layer II, an electromagnetic loss supersurface II, an electromagnetic loss supersurface II substrate, a dielectric structure layer III, a lossless bandpass type metasurface, and a lossless bandpass type metasurface substrate.

[0008] Preferably, the electromagnetic lossy metasurface I is composed of a plurality of conductive units I, wherein the conductive unit I includes a conductive Minkowski ring and conductive inner square rings located at the four corners of the conductive Minkowski ring;

[0009] The four corners of the conductive Minkowski ring are all loaded with a first resistor; the conductive inner square ring is loaded with a second resistor;

[0010] The electromagnetic lossy metasurface II is composed of a number of conductive units II, and the conductive unit II includes a conductive square ring;

[0011] The conductive square rings are all loaded with a third resistor and an inductor, wherein the third resistor is loaded in the middle of the edge of the conductive square ring, and the inductor is loaded at the vertex of the conductive square ring;

[0012] The lossless bandpass metasurface is composed of a plurality of conductive units three, wherein the conductive unit three includes a composite conductive square ring structure and a conductive grid structure, wherein the composite conductive square ring structure is formed by nesting a plurality of small square conductive rings.

[0013] Preferably, the material of the 3D superstructure is one of PLA, ABS, and PET, with a relative dielectric constant of 2-3 and a thickness of 1.4-1.6 mm;

[0014] The materials of the dielectric structure layer I, the dielectric structure layer II and the dielectric structure layer III are materials with a relative dielectric constant between 1.01 and 1.2, and the thickness thereof is 3.0 to 4.5 mm.

[0015] Preferably, the materials of the electromagnetic loss metasurface I substrate, the electromagnetic loss metasurface II substrate, and the lossless bandpass metasurface substrate are all one of PI film, PEN film, FR4 board, and F4B board, and their relative dielectric constants are 2-3.6 and their thicknesses are 0.1-0.6 mm.

[0016] Preferably, the structural unit period of the electromagnetic loss metasurface I is 18-22 mm, the outer ring length of the conductive Minkowski ring is 14-16 mm, and its line width is 0.2-0.6 mm, and the outer ring length of the conductive inner square ring is 3.5-5.5 mm, and its line width is 0.2-0.6 mm;

[0017] The gap between the conductive Minkowski ring and the resistor loaded at the corresponding position on the conductive inner square ring is 0.1-1mm; the resistance of the first resistor loaded on the conductive Minkowski ring is 350-380Ω, and the resistance of the second resistor loaded on the conductive inner square ring is 130-160Ω.

[0018] Preferably, the conductive Minkowski ring and the conductive inner square ring are made of one of gold, silver and copper metal materials;

[0019] Conductive Minkowski rings and conductive inner square rings are prepared on electromagnetic lossy metasurface I substrate by inkjet printing, electrochemical etching or magnetron sputtering;

[0020] The first resistor and the second resistor are both lumped chip resistor elements or equivalent resistors obtained by magnetron sputtering, screen printing, inkjet printing or any combination thereof.

[0021] Preferably, the structural unit period of the electromagnetic loss metasurface II is 18-22 mm, the outer ring length of the conductive square ring is 3.5-5.5 mm, and its line width is 0.2-0.6 mm; the gap on the conductive square ring for loading the third resistor is 0.1-1 mm; the resistance value of the third resistor is 40-60Ω, and the inductance value loaded by the conductive square ring is 0.2-0.6 nH.

[0022] Preferably, the conductive square ring is made of one of gold, silver and copper metal materials;

[0023] The conductive square rings are prepared on the electromagnetic lossy metasurface II substrate by inkjet printing, electrochemical etching or magnetron sputtering;

[0024] The third resistor is a lumped chip resistor element or an equivalent resistor obtained by one or any combination of magnetron sputtering, screen printing, and inkjet printing; the inductor is a lumped chip inductor element.

[0025] Preferably, the lossless bandpass metasurface unit period is 9-11mm, the outer diameter of the conductive composite square ring structure is 5.5-7.5mm, and its line width is 0.1-1mm; the outer diameter of the conductive grid structure is 9-11mm, and its line width is 0.4-1.2mm; the materials of the composite conductive square ring structure and the conductive grid structure are both copper or silver.

[0026] Preferably, the multi-layer structure of the metamaterial is manufactured by single-layer hot pressing molding or integral hot pressing molding.

[0027] Compared with the prior art, the present invention has the following beneficial effects:

[0028] (1) The 3D superstructure enhanced absorption-transmission integrated metamaterial provided by the present invention has a high transmission band located between strong absorption bands, which can achieve a bandwidth of more than 0.8 GHz with a transmittance above -1 dB in the range of 8.5-11 GHz, and a bandwidth of more than 2 GHz with a transmittance above -2 dB in the range of 8.5-11 GHz.

[0029] (2) The metamaterial of the present invention has two strong absorption bands, which can achieve more than 90% absorption between 3.7 GHz and 5.8 GHz, and more than 90% absorption between 13.7 GHz and 18 GHz.

[0030] (3) The reflectivity of the 3D superstructure enhanced absorption and penetration integrated metamaterial of the present invention is lower than -10dB at 3.4GHz-18GHz.

[0031] (4) The 3D superstructure enhanced absorption and transmission integrated metamaterial provided by the present invention still has excellent wave transmission and absorption performance when the oblique incident angle is 60°.

[0032] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 3D superstructure enhanced absorption and penetration integrated metamaterial structure schematic diagram provided in Example 1;

[0034] Figure 2 Schematic diagram of the unit structure of the 3D superstructure enhanced absorption and penetration integrated metamaterial provided in Example 1;

[0035] Figure 3 is a schematic diagram of the 3D superstructure unit structure provided in Example 1;

[0036] Figure 4 is a schematic diagram of the unit structure of the electromagnetic loss metasurface I provided in Example 1;

[0037] Figure 5 is a schematic diagram of the unit structure of the electromagnetic loss metasurface II provided in Example 1;

[0038] Figure 6 is a schematic diagram of a unit structure of a lossless bandpass metasurface provided in Example 1;

[0039] Figure 7 is the transmittance and reflectivity curve of the electromagnetic loss metasurface I of Example 1 when the electromagnetic wave is incident vertically;

[0040] Figure 8 is the transmittance and reflectivity curve of the electromagnetic loss metasurface II of Example 1 when the electromagnetic wave is incident vertically;

[0041] Fig. 9 is the transmittance and reflectivity curve of the lossless bandpass metasurface of Example 1 when the electromagnetic wave is incident vertically;

[0042] Fig.10 is the transmittance and reflectivity curves of the electromagnetic lossy metasurface II, the dielectric structure layer III and the lossless bandpass metasurface cascaded in Example 1 when the electromagnetic wave is incident vertically;

[0043] Fig.11 is a reflectivity curve of the cascaded electromagnetic loss metasurface I, dielectric structure layer II, electromagnetic loss metasurface II, dielectric structure layer III and lossless bandpass metasurface of Example 1 when the incident angle of the electromagnetic wave changes from 0° to 60°;

[0044] Fig.12is the transmittance curve of the electromagnetic loss metasurface I, dielectric structure layer II, electromagnetic loss metasurface II, dielectric structure layer III and lossless bandpass metasurface cascaded in Example 1 when the incident angle of the electromagnetic wave changes from 0° to 60°;

[0045] Fig.13 is the wave absorption curve of the electromagnetic loss metasurface I, dielectric structure layer II, electromagnetic loss metasurface II, dielectric structure layer III and lossless bandpass metasurface cascaded in Example 1 when the incident angle of the electromagnetic wave changes from 0° to 60°;

[0046] Fig.14 is the reflectivity curve of the 3D superstructure enhanced absorption-transmission integrated metamaterial provided in Example 1 when the incident angle of the electromagnetic wave changes from 0° to 60°, wherein: Fig.14 a in the figure is the reflectivity curve under TE polarization. Fig.14 b in the figure is the reflectivity curve under TM polarization;

[0047] Fig.15 is the transmittance curve of the 3D superstructure enhanced absorption-transmission integrated metamaterial provided in Example 1 when the incident angle of the electromagnetic wave changes from 0° to 60°, wherein: Fig.15 a in the figure is the transmittance curve under TE polarization. Fig.15 b in the figure is the transmittance curve under TM polarization;

[0048] Fig.16 is the wave absorption rate curve of the 3D superstructure enhanced absorption and penetration integrated metamaterial provided in Example 1 when the incident angle of the electromagnetic wave changes from 0° to 60°, wherein, Fig.16 a in the figure is the absorption rate curve under TE polarization. Fig.16 The b in the figure is the absorption curve under TM polarization.

[0049] Description of Reference Numerals

[0050] 1. 3D superstructure; 2. Dielectric structure layer I; 3. Electromagnetic loss supersurface I; 4. Electromagnetic loss supersurface substrate I; 5. Dielectric structure layer II; 6. Electromagnetic loss supersurface II; 7. Electromagnetic loss supersurface substrate II; 8. Dielectric structure layer III; 9. Lossless bandpass supersurface; 10. Lossless bandpass supersurface substrate; 11. Conductive Minkowski ring; 12. Conductive inner square ring; 13. First resistor; 14. Second resistor; 15. Conductive square ring; 16. Third resistor; 17. Inductor loaded on the conductive square ring; 18. Conductive composite square ring structure; 19. Conductive grid structure. DETAILED DESCRIPTION

[0051] The technical solution of the present invention is further described below through the accompanying drawings and embodiments.

[0052] Unless otherwise defined, the technical terms or scientific terms used in the present invention should be understood by people with ordinary skills in the field to which the present invention belongs. The words "first", "second" and similar words used in the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0053] Example 1

[0054] like Figure 1 As shown, the 3D superstructure enhanced absorption and penetration integrated metamaterial includes several layers of structure, and is composed of a 3D superstructure 1, a dielectric structure layer I 2, an electromagnetic loss metasurface I 3, an electromagnetic loss metasurface I substrate 4, a dielectric structure layer II 5, an electromagnetic loss metasurface II 6, an electromagnetic loss metasurface II substrate 7, a dielectric structure layer III 8, a lossless bandpass metasurface 9, and a lossless bandpass metasurface substrate 10, which are arranged in sequence from top to bottom.

[0055] The unit structure schematic diagram of the present invention is as follows Figure 2 As shown, the conductive unit 1 of the electromagnetic lossy metasurface Ⅰ3 includes a conductive Minkowski ring 11 and four conductive inner square rings 12 located at the four corners of the conductive Minkowski ring 11. Figure 4 ; Three first resistors 13 are evenly loaded on the four corners of the conductive Minkowski ring 11; and three second resistors 14 are loaded on the four conductive inner square rings 12 respectively.

[0056] The conductive unit 2 of the electromagnetic loss metasurface II 6 includes four conductive square rings 15, and the four conductive square rings are uniformly loaded with four third resistors 16 and four inductors 17. Figure 5 .

[0057] The conductive unit 3 of the lossless bandpass metasurface 6 includes a composite conductive square ring structure 18 and a conductive grid structure 19. Figure 6 .

[0058] In this embodiment, the 3D superstructure 1 is PLA with a relative dielectric constant of 2.3 and a thickness of 1.6 mm.

[0059] The dielectric structure layer Ⅰ2 is PMI foam with a relative dielectric constant of 1.05 and a thickness of 3.0 mm.

[0060] The period of the structural unit of the electromagnetic lossy metasurface I3 is 19mm, the outer ring length of the conductive Minkowski ring 11 is 16mm, and its line width is 0.3mm; the outer ring length of the conductive inner square ring 12 is 4.5mm, and its line width is 0.3mm; the gap between the conductive Minkowski ring and the resistor loaded at the corresponding position on the conductive inner square ring is 0.3mm; the first resistor 13 loaded on the conductive Minkowski ring 11 is 365Ω, and the second resistor 14 loaded on the conductive inner square ring 12 is 150Ω; the conductive Minkowski ring 11 and the conductive inner square ring 12 are made of copper; they are prepared on the electromagnetic lossy metasurface I substrate by electrochemical corrosion; the first resistor and the second resistor are both lumped chip resistor elements.

[0061] The electromagnetic loss metasurface I substrate 4 is a PTFE plate with a relative dielectric constant of 2.1 and a thickness of 0.3 mm.

[0062] The dielectric structure layer II5 is a PMI foam with a relative dielectric constant of 1.05 and a thickness of 4.5 mm.

[0063] The period of the structural unit of the electromagnetic loss metasurface II 6 is 19 mm, the outer ring length of the conductive square ring 15 is 4.0 mm, and its line width is 0.3 mm; the gap on the conductive square ring 15 for loading the third resistor is 0.3 mm; the resistance of the third resistor 16 loaded by the conductive square ring 15 is 55Ω, and the inductance of the inductor 17 loaded by the conductive square ring 15 is 0.3 nH; the material of the conductive square ring is copper; the conductive square ring is prepared on the electromagnetic loss metasurface II substrate by electrochemical corrosion; the third resistor is a lumped chip resistor element; and the inductor is a lumped chip inductor element.

[0064] The electromagnetic loss metasurface II substrate 7 is a FR-4 board with a relative dielectric constant of 4.3 and a thickness of 0.3 mm.

[0065] The dielectric structure layer III8 is PMI foam with a relative dielectric constant of 1.05 and a thickness of 4.5 mm.

[0066] The unit period of the lossless bandpass metasurface 9 is 9.5mm, the outer diameter of the conductive composite square ring structure 18 is 6mm, and its line width is 0.3mm; the outer diameter of the conductive grid structure 19 is 9.5mm, and its line width is 0.6mm. The materials of the composite conductive square ring structure and the conductive grid structure are both copper.

[0067] The lossless bandpass metasurface substrate 10 is a PTFE plate with a relative dielectric constant of 2.1 and a thickness of 0.3 mm.

[0068] The 10-layer structure of the 3D superstructure enhanced absorbent integrated metamaterial of this embodiment is prepared by integrated hot pressing molding.

[0069] The following test was conducted to verify the effect of the 3D superstructure enhanced absorption and penetration integrated metamaterial provided in Example 1.

[0070] 1. When electromagnetic waves are incident vertically, the transmittance and reflectivity of electromagnetic loss metasurface I are measured. The results are as follows: Figure 7 shown.

[0071] Depend on Figure 7 It can be seen that the transmittance of the electromagnetic loss metasurface I structure is greater than -1dB in the frequency band of 8.70-11.14GHz.

[0072] 2. When electromagnetic waves are incident vertically, the transmittance and reflectivity of electromagnetic loss metasurface II are measured. The results are as follows: Figure 8 shown.

[0073] Depend on Figure 8 It can be seen that the transmittance of the electromagnetic loss metasurface II structure is greater than -1dB in the 2.00-11.25GHz frequency band.

[0074] 3. When electromagnetic waves are incident vertically, the transmittance and reflectivity of the lossless bandpass metasurface are measured. The results are as follows: Fig. 9 As shown,

[0075] Depend on Fig. 9 It can be seen that the transmittance of the lossless bandpass metasurface structure is greater than -1dB in the 8.80-11.60GHz frequency band, and the reflectivity is greater than -1dB in the 2.00-5.46GHz and 14.32-18.00GHz bands.

[0076] 4. When electromagnetic waves are incident vertically, the transmittance and reflectivity of the electromagnetic loss metasurface II, dielectric structure layer III and lossless bandpass metasurface after cascading are measured. The results are as follows: Fig.10 shown.

[0077] Depend on Fig.10 It can be seen that the electromagnetic lossy metasurface II, dielectric structure layer III and lossless bandpass metasurface cascade structure have a transmittance greater than -1dB in the 9.21-11.52GHz frequency band and a reflectivity less than -10dB in the 9.20-18.00GHz frequency band.

[0078] 5. When the incident angle of electromagnetic wave changes from 0° to 60°, the reflectivity of electromagnetic loss metasurface I, dielectric structure layer II, electromagnetic loss metasurface II, dielectric structure layer III and lossless bandpass metasurface after cascading is measured. The results are as follows: Fig.11 shown.

[0079] Depend on Fig.11It can be seen that when the incident angle is 0°, the reflectivity of the electromagnetic loss metasurface I, dielectric structure layer II, electromagnetic loss metasurface II, dielectric structure layer III and lossless bandpass metasurface cascade structure is less than -10dB in the 3.56-12.12GHz and 13.97-17.04GHz frequency bands; when the incident angle is 30°, the structure still has a reflectivity of less than -10dB in most frequency bands; when the incident angle is 60°, the reflectivity of the structure is greater than -10dB in most frequency bands.

[0080] 6. When the incident angle of electromagnetic wave changes from 0° to 60°, the transmittance of electromagnetic loss metasurface I, dielectric structure layer II, electromagnetic loss metasurface II, dielectric structure layer III and lossless bandpass metasurface cascade is measured. The results are as follows: Fig.12 shown.

[0081] Depend on Fig.12 It can be seen that when the incident angle is 0°, the electromagnetic loss metasurface I, dielectric structure layer II, electromagnetic loss metasurface II, dielectric structure layer III and lossless bandpass metasurface cascade structure have a transmittance greater than -1dB in the 10.08-10.42GHz frequency band, and a transmittance greater than -2dB in the 8.51-10.24GHz frequency band; when the incident angle is 30°, the structure has a transmittance greater than -2dB in the 8.68-10.88GHz frequency band; when the incident angle is 60°, the structure does not have a frequency band with a transmittance greater than -2dB.

[0082] 7. When the incident angle of electromagnetic wave changes from 0° to 60°, the absorption rate of electromagnetic loss metasurface I, dielectric structure layer II, electromagnetic loss metasurface II, dielectric structure layer III and lossless bandpass metasurface after cascading is measured. The results are as follows: Fig.13 shown.

[0083] Depend on Fig.13 It can be seen that when the incident angle is 0°, the frequency bands in which the absorption rate of the electromagnetic loss metasurface I, dielectric structure layer II, electromagnetic loss metasurface II, dielectric structure layer III and lossless bandpass metasurface cascade structure are greater than 90% are 4.03-5.64GH and 14.31-17.00GH, and the frequency bands in which the absorption rate is greater than 80% are 3.27-6.94GH and 13.78-18.00GH; when the incident angle is 30°, the frequency bands in which the absorption rate of the structure is greater than 80% are 3.43-7.01GH and 13.73-17.17GH; when the incident angle is 60°, the frequency bands in which the absorption rate of the structure is greater than 80% are 5.45-6.10GH and 11.83-16.11GH.

[0084] 8. When the incident angle of electromagnetic wave changes from 0° to 60°, the reflectivity of the 3D superstructure enhanced absorption and penetration integrated metamaterial provided in Example 1 is measured under TE and TM polarization. The results are as follows: Fig.14 shown.

[0085] Depend on Fig.14 It can be seen that under vertical incidence, the reflectivity of the metamaterial in the 3.39-18.00GHz band is less than -10dB; under TE polarization, when the incident angle is 30°, the reflectivity of the metamaterial in the 3.57-11.33GHz and 12.56-18.00GHz bands is less than -10dB; when the incident angle is 60°, the reflectivity of the metamaterial in the 10.07-18.00GHz band is less than -10dB. Under TM polarization, when the incident angle is 30°, the reflectivity of the metamaterial in the 4.00-18.00GHz band is less than -10dB; when the incident angle is 60°, the reflectivity of the metamaterial in the 7.74-11.22GHz band is less than -10dB.

[0086] 9. When the incident angle of electromagnetic wave changes from 0° to 60°, the transmittance of the 3D superstructure enhanced absorption and penetration integrated metamaterial provided in Example 1 is measured under TE and TM polarization. The results are as follows: Fig.15 shown.

[0087] Depend on Fig.15 It can be seen that at vertical incidence, the transmittance of the metamaterial is greater than -1dB in the 9.47-10.33GHz frequency band, and the transmittance is greater than -2dB in the 8.53-11.12GHz frequency band; under TE polarization, when the incident angle is 30°, the transmittance of the metamaterial is greater than -2dB in the 8.84-10.70GHz frequency band; when the incident angle is 60°, the transmittance of the metamaterial is greater than -2dB in the 9.78-10.79GHz frequency band. Under TM polarization, when the incident angle is 30°, the transmittance of the metamaterial is greater than -1dB in the 9.66-10.48GHz band, and the transmittance is greater than -2dB in the 8.68-11.26GHz band; when the incident angle is 60°, the transmittance of the metamaterial is greater than -1dB in the 9.22-10.67GHz band, and the transmittance is greater than -2dB in the 8.27-11.54GHz band.

[0088] 10. When the incident angle of electromagnetic wave changes from 0° to 60°, the absorption rate of the 3D superstructure enhanced absorption and penetration integrated metamaterial provided in Example 1 is measured. The results are as follows: Fig.16 shown.

[0089] Depend on Fig.16It can be seen that at vertical incidence, the frequency bands where the metamaterial absorption rate is greater than 90% are 3.79-5.83GH and 13.75-18.00GH, and the frequency bands where the absorption rate is greater than 80% are 3.13-6.79GH and 13.23-18.00GH; under TE polarization, when the incident angle is 30°, the frequency bands where the metamaterial absorption rate is greater than 90% are 4.02-6.29GH and 13.52-18.00GH, and the frequency bands where the absorption rate is greater than 80% are 3.23-7.03GH and 12.98-18. 00GH; when the incident angle is 60°, the frequency bands in which the metamaterial absorption rate is greater than 80% are 4.54-6.19GH and 11.77-18.00GH; under TM polarization, when the incident angle is 30°, the frequency band in which the metamaterial absorption rate is greater than 90% is 13.74-17.49GH, and the frequency band in which the absorption rate is greater than 80% is 3.71-6.42GH and 13.07-17.67GH; when the incident angle is 60°, the frequency band in which the metamaterial absorption rate is greater than 80% is 13.70-17.05GH.

[0090] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that they can still modify or replace the technical solution of the present invention with equivalents, and these modifications or equivalent replacements cannot cause the modified technical solution to deviate from the spirit and scope of the technical solution of the present invention.

Claims

1. A 3D superstructure enhanced absorption and penetration integrated metamaterial, characterized in that: It includes a 3D superstructure, a dielectric structure layer I, an electromagnetic loss supersurface I, an electromagnetic loss supersurface I substrate, a dielectric structure layer II, an electromagnetic loss supersurface II, an electromagnetic loss supersurface II substrate, a dielectric structure layer III, a lossless bandpass type supersurface, and a lossless bandpass type supersurface substrate, which are arranged in sequence from top to bottom.

2. The 3D superstructure enhanced absorption and penetration integrated metamaterial according to claim 1, characterized in that: The electromagnetic lossy metasurface I is composed of a plurality of conductive units I, wherein the conductive unit I includes a conductive Minkowski ring and conductive inner square rings located at the four corners of the conductive Minkowski ring; The four corners of the conductive Minkowski ring are all loaded with a first resistor; the conductive inner square ring is loaded with a second resistor; The electromagnetic lossy metasurface II is composed of a number of conductive units II, and the conductive unit II includes a conductive square ring; The conductive square rings are all loaded with a third resistor and an inductor, wherein the third resistor is loaded at the vertex of the conductive square ring edge, and the inductor is loaded in the middle of the conductive square ring; The lossless bandpass metasurface is composed of a plurality of conductive units three, wherein the conductive unit three includes a composite conductive square ring structure and a conductive grid structure, wherein the composite conductive square ring structure is formed by nesting a plurality of small square conductive rings.

3. The 3D superstructure enhanced absorption and penetration integrated metamaterial according to claim 1, characterized in that: The material of the 3D superstructure is one of PLA, ABS, and PET, with a relative dielectric constant of 2-3 and a thickness of 1.4-1.6 mm; The materials of the dielectric structure layer I, the dielectric structure layer II and the dielectric structure layer III are materials with a relative dielectric constant between 1.01 and 1.2, and the thickness thereof is 3.0 to 4.5 mm.

4. The 3D superstructure enhanced absorption and penetration integrated metamaterial according to claim 1, characterized in that: The materials of electromagnetic loss metasurface I substrate, electromagnetic loss metasurface II substrate and lossless bandpass metasurface substrate are all one of PI film, PEN film, FR4 board and F4B board, with a relative dielectric constant of 2-3.6 and a thickness of 0.1-0.6mm.

5. The 3D superstructure enhanced absorption and penetration integrated metamaterial according to claim 2, characterized in that: The structural unit period of the electromagnetic loss metasurface I is 18-22 mm, the outer ring length of the conductive Minkowski ring is 14-16 mm, and the line width is 0.2-0.6 mm. The outer ring length of the conductive inner square ring is 3.5-5.5 mm, and its line width is 0.2-0.6 mm; The gap between the conductive Minkowski ring and the resistor loaded at the corresponding position on the conductive inner square ring is 0.1-1mm; the resistance of the first resistor loaded on the conductive Minkowski ring is 350-380Ω, and the resistance of the second resistor loaded on the conductive inner square ring is 130-160Ω.

6. The 3D superstructure enhanced absorption and penetration integrated metamaterial according to claim 5, characterized in that: The conductive Minkowski ring and the conductive inner square ring are made of one of gold, silver and copper metal materials; Conductive Minkowski rings and conductive inner square rings are prepared on electromagnetic lossy metasurface I substrate by inkjet printing, electrochemical etching or magnetron sputtering. The first resistor and the second resistor are both lumped chip resistor elements or equivalent resistors obtained by magnetron sputtering, screen printing, inkjet printing or any combination thereof.

7. The 3D superstructure enhanced absorption and penetration integrated metamaterial according to claim 2, characterized in that: The structural unit period of the electromagnetic loss metasurface II is 18-22mm, the outer ring length of the conductive square ring is 3.5-5.5mm, and its line width is 0.2-0.6mm; the gap on the conductive square ring for loading the third resistor is 0.1-1mm; the resistance value of the third resistor is 40-60Ω, and the inductance value loaded by the conductive square ring is 0.2-0.6nH.

8. The 3D superstructure enhanced absorption and penetration integrated metamaterial according to claim 7, characterized in that: The conductive square ring is made of one of gold, silver and copper metal materials; The conductive square rings are prepared on the electromagnetic lossy metasurface II substrate by inkjet printing, electrochemical etching or magnetron sputtering; The third resistor is a lumped chip resistor element or an equivalent resistor obtained by one or any combination of magnetron sputtering, screen printing, and inkjet printing; the inductor is a lumped chip inductor element.

9. The 3D superstructure enhanced absorption and penetration integrated metamaterial according to claim 2, characterized in that: The unit period of the lossless bandpass metasurface is 9-11mm, the outer diameter of the composite conductive square ring structure is 5.5-7.5mm, and its line width is 0.1-1mm; the outer diameter of the conductive grid structure is 9-11mm, and its line width is 0.4-1.2mm; the materials of the composite conductive square ring structure and the conductive grid structure are both copper or silver.

10. The 3D superstructure enhanced absorption and penetration integrated metamaterial according to claim 1, characterized in that: The multi-layer structure of the metamaterial is manufactured by single-layer hot pressing molding or integrated hot pressing molding.

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