Control method, control device, computer device and storage medium for vehicle change

Abstract

The present disclosure relates to the technical field of semiconductor, and particularly relates to a control method and control device of carrier replacement, computer equipment and storage medium, the control method is used for a first sorting station, a second process station and a third sorting station in continuous processing, and the control method comprises the following steps: after a first identification is performed on a wafer of a target batch according to a station attribute of the first sorting station, the first sorting station performs carrier exchange processing on the wafer of the target batch; in response to that the second process station ends process processing on the wafer of the target batch, a preset station attribute of the third sorting station is acquired; the cleanliness requirement of the third sorting station on a target carrier to be selected during process processing is determined according to the station attribute of the third sorting station; and the third sorting station is configured with the target carrier according to the cleanliness requirement and the result of the first identification. The control method reduces the error rate of selection of the target carrier in the production process, and improves the overall production efficiency and the flexibility of the production process.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor technology, and in particular to a control method, control device, computer equipment, and storage medium for carrier replacement. Background Technology

[0002] In semiconductor manufacturing processes, specialized wet cleaning machines, due to their unique cleaning requirements and complex operating environment, often cannot directly support the automatic exchange of production line carriers with dedicated carriers within the machine. Therefore, to ensure production continuity and product quality stability, sorting stations need to be added before and after the wet cleaning machine station to specifically handle carrier exchange. At the sorting station, the equipment can automatically transfer wafers from one carrier to another, thus meeting the specific carrier requirements of the wet cleaning machine.

[0003] However, when the wafers come out of the special wet cleaning machine and enter the sorting station in the subsequent process, if the carrier is not selected properly at the sorting station, such as using a carrier that has not been cleaned or treated, it is easy to contaminate the cleaned wafers, thereby affecting the quality of the final wafer product. Summary of the Invention

[0004] This disclosure provides a carrier replacement control method, control device, computer equipment, and storage medium to reduce the problem of cross-contamination of wafers in a target batch.

[0005] In a first aspect, this disclosure provides a control method for carrier replacement, the control method being used for a first sorting station, a second process station, and a third sorting station with continuous processing, comprising:

[0006] After assigning a first identifier to the wafers of the target batch based on the site attributes of the first sorting station, the first sorting station performs carrier exchange processing on the wafers of the target batch.

[0007] In response to the completion of the process processing of the target batch of wafers at the second process station, the preset station attributes of the third sorting station are obtained;

[0008] The cleanliness requirements of the target vehicle to be selected when the third sorting station is processed for vehicle exchange are determined based on the station attributes of the third sorting station.

[0009] The target vehicle is configured at the third sorting station based on the cleanliness requirements and the result of the first identification.

[0010] In some embodiments, the method further includes: when the cleanliness requirement is greater than or equal to the first cleanliness, configuring the target vehicle for the third sorting station as a cleaned vehicle.

[0011] In some embodiments, it also includes:

[0012] When the cleanliness requirement is greater than or equal to the first cleanliness, the wafers in the target batch are given a second identifier;

[0013] The step of configuring the target vehicle for the third sorting station as a cleaned vehicle includes: configuring the cleaned vehicle for the third sorting station according to the second identifier.

[0014] In some embodiments, the method further includes: before the second process station processes the wafers of the target batch, assigning a first identifier to the first carrier selected by the first sorting station based on the station attributes of the first sorting station;

[0015] When the cleanliness requirement is less than the first cleanliness, determine the result of the first identifier of the wafer in the corresponding target batch;

[0016] When the result of the first identification of the wafers corresponding to the target batch is a reserved state, the first carrier that has been identified as first meets the preset usability standard to obtain the detection result.

[0017] The step of configuring the target carrier for the third sorting station according to the cleanliness requirements and the result of the first identification includes: configuring the target carrier for the third sorting station according to the result of the first identification of the wafers corresponding to the target batch and the detection result of the detection of the first carrier.

[0018] In some embodiments, after the step of determining the result of the first identifier of the wafers corresponding to the target batch, the method further includes:

[0019] When the result of the first identifier corresponding to the target batch of wafers is a non-reserved state, the target vehicle configured for the third sorting station is a random vehicle.

[0020] In some embodiments, the step of configuring the target vehicle for the third sorting station based on the result of the first identifier corresponding to the target batch of wafers and the detection result of the detection performed on the first vehicle includes:

[0021] When the result of the first identification of the wafers corresponding to the target batch is a reserved state, and the first carrier that has been identified by the first identification meets the preset availability criteria, the target carrier is selected from the first carrier that has been identified by the first identification.

[0022] When the result of the first identification of the wafers corresponding to the target batch is a reserved state, and the first carrier that has been identified does not meet the preset availability criteria, the target carrier shall select a random carrier.

[0023] In some embodiments, it also includes:

[0024] When the first vehicle that has been identified by the first identifier does not meet the preset availability criteria, an alarm signal is generated.

[0025] In some embodiments, the step of detecting whether the first vehicle that has been identified by the first identifier meets a preset availability criterion includes:

[0026] Obtain historical information about the first vehicle that has been identified by the first identifier, the historical information including at least one of the number of times the first vehicle has been cleaned, the cleaning time, and the remaining valid usage times;

[0027] Based on the historical information, it is determined whether the first vehicle meets the preset availability criteria.

[0028] In some embodiments, the second process station is a wet cleaning station.

[0029] Secondly, a control device for vehicle replacement is also provided, the processing device being applied to a first sorting station, a second process station, and a third sorting station for continuous processing, comprising:

[0030] The first marking module is used to mark the wafers of the target batch according to the site attributes of the first sorting station, and then the first sorting station performs carrier exchange processing on the wafers of the target batch.

[0031] The site attribute acquisition module is used to acquire the preset site attributes of the third sorting station in response to the second process station finishing the process processing of the wafers in the target batch.

[0032] The cleanliness requirement determination module is used to determine the cleanliness requirement of the target vehicle to be selected when the third sorting station is processing the exchange vehicle, based on the station attributes of the third sorting station.

[0033] The first vehicle configuration module is used to configure the target vehicle for the third sorting station according to the cleanliness requirements and the result of the first identification.

[0034] Thirdly, this disclosure provides a computer device including a memory, a processor, and a computer program stored in the memory, wherein the processor executes the computer program to implement the steps of the method described in the foregoing aspects.

[0035] Fourthly, this disclosure provides a computer-readable storage medium having a computer program stored thereon that, when executed by a processor, implements the steps of the methods described in the above aspects.

[0036] Fifthly, this disclosure provides a computer program product, including a computer program / instructions that, when executed by a processor, implement the steps of the methods described in the foregoing aspects.

[0037] This disclosure provides a control method, control device, computer equipment, and storage medium for carrier replacement. The method assigns a first identifier to the target batch of wafers based on the site attributes of the first sorting station. It then configures the target carrier for the third sorting station based on the cleanliness requirements of the target carrier to be selected and the result of the first identifier. This provides a unified criterion for selecting a more suitable target carrier for production needs and can reduce cross-contamination introduced to the target batch of wafers by the third sorting station during carrier exchange processing. Attached Figure Description

[0038] The present disclosure will be described in more detail below based on embodiments and with reference to the accompanying drawings:

[0039] Figure 1 A schematic flowchart illustrating a vehicle replacement control method provided in an embodiment of this disclosure;

[0040] Figure 2 This is a schematic diagram of a process site distribution structure provided in an embodiment of the present disclosure;

[0041] Figure 3 A schematic flowchart illustrating another vehicle replacement control method provided in this embodiment of the disclosure;

[0042] Figure 4 This is a block diagram of the internal structure of a vehicle replacement control device provided in an embodiment of the present disclosure.

[0043] In the accompanying drawings, the same parts are referred to by the same reference numerals, and the drawings are not drawn to scale. Detailed Implementation

[0044] To enable those skilled in the art to better understand the technical solutions of this disclosure, and to fully understand and implement the process of how this disclosure applies technical means to solve technical problems and achieve corresponding technical effects, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, not all embodiments. The embodiments of this disclosure and the various features within them can be combined with each other without conflict, and the resulting technical solutions are all within the protection scope of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without creative effort should fall within the protection scope of this disclosure.

[0045] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this disclosure are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this disclosure described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0046] It should be noted that the steps shown in the flowchart in the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions, and although a logical order is shown in the flowchart, in some cases the steps shown or described may be executed in a different order than that shown here.

[0047] Example 1

[0048] Figure 1 This is a flowchart illustrating a vehicle replacement control method provided in an embodiment of this disclosure. Figure 1 As shown, a control method for carrier replacement is provided for continuous processing at a first sorting station, a second process station, and a third sorting station, comprising:

[0049] Step 110: After assigning a first identifier to the wafers of the target batch according to the site attributes of the first sorting station, the first sorting station performs carrier exchange processing on the wafers of the target batch.

[0050] Step 120: In response to the completion of the process processing of the target batch of wafers by the second process station, obtain the preset station attributes of the third sorting station;

[0051] Step 130: Determine the cleanliness requirement of the target vehicle to be selected when the third sorting station is processing the exchange vehicle based on the station attributes of the third sorting station.

[0052] Step 140: Configure the target vehicle for the third sorting station according to the cleanliness requirements and the result of the first identification.

[0053] In this embodiment, the wafers of the target batch are first identified according to the site attributes of the first sorting station. The target carriers of the third sorting station are configured according to the cleanliness requirements of the target carriers to be selected and the results of the first identification. This provides a unified judgment basis for selecting target carriers that are more suitable for production needs and can reduce cross-contamination of the wafers of the target batch when the third sorting station exchanges carriers.

[0054] In this embodiment, the first sorting station, the second process station, and the third sorting station for continuous processing refer to the target batch of wafers passing through the first sorting station, the second process station, and the third sorting station sequentially in the process flow.

[0055] The first sorting station handles the carrier exchange for the target batch of wafers. Specifically, when the target batch of wafers enters the second process station from the first sorting station, it needs to be removed from the first carrier at the first sorting station and loaded into the second carrier configured at the second process station before being sent to the second process station for processing. After the process flow at the second process station is completed, when the wafers enter the third sorting station, they need to be removed from the second carrier and loaded into the target carrier configured at the third sorting station. Therefore, correctly selecting appropriate carriers at each process station can significantly improve the yield and product quality of the target batch of wafers.

[0056] The site attributes of the first sorting station are determined based on the manufacturing process requirements of the target batch of wafers and are set in advance before production. These site attributes may include the required process environment (e.g., vacuum level, temperature), specific requirements for the wafer state of the target batch (e.g., surface particle-free, specific chemical residue levels), and specific process materials or technologies used at that station. In this embodiment, the site attributes of the first sorting station can be used to indicate the first identification of the target batch of wafers. During the first identification, characters or numbers can be added to the target batch information for identification, thus simplifying the control process.

[0057] In this embodiment, by assigning a first identifier to the wafers of the target batch, the result of the first identifier can be used as the basis for judging the state of the first carrier and as the basis for selecting the target carrier.

[0058] The site attributes of the third sorting station are also pre-set according to the production process requirements of the target batch of wafers. In response to the completion of the process at the second process station for the target batch of wafers, the system obtains the pre-set site attributes of the third sorting station and selects the target carrier accordingly. By reading the site attributes of the third sorting station, the system can determine the cleanliness requirements of the target carrier for the third sorting station and then select a suitable target carrier based on those cleanliness requirements.

[0059] Semiconductor manufacturing involves various process steps and stations, each with unique process requirements and characteristics. By comprehensively considering the results of the first identification and the cleanliness requirements of the target carrier at the third sorting station, diverse process needs can be addressed more flexibly, ensuring the smooth operation of the entire production process. Different target batches of wafers may have varying sensitivities to contaminants during processing. The first identification reflects the specific state or characteristics of the target batch of wafers after processing at the first sorting station, which may directly affect its processing effectiveness at the third sorting station. Therefore, selecting target carriers by combining the first identification and the cleanliness requirements of the third sorting station ensures that the target batch of wafers is not unnecessarily contaminated during transport and processing, thereby maintaining process quality.

[0060] In summary, the carrier replacement control method provided in this disclosure first identifies the wafers of the target batch based on the site attributes of the first sorting station, and configures the target carrier for the third sorting station based on the cleanliness requirements of the target carrier to be selected and the result of the first identification. This provides a unified judgment criterion for selecting a target carrier that is more suitable for production needs and can reduce cross-contamination introduced to the wafers of the target batch by the third sorting station when exchanging carriers.

[0061] Furthermore, in semiconductor manufacturing, wafer carriers are valuable resources that require rational allocation and use. By comprehensively considering cleanliness requirements and primary identification, the most suitable target wafer carrier for the current target batch and process requirements can be selected, avoiding the use of overly clean (wasteful) or insufficiently clean (affecting quality) carriers, thereby optimizing resource utilization. If the target carrier is selected solely based on cleanliness requirements, the specific needs of the target batch of wafers may be overlooked, leading to problems in subsequent process handling and increasing rework and debugging time. Therefore, combining primary identification with a comprehensive judgment allows for more accurate matching of target carriers and reduces unnecessary delays.

[0062] In one embodiment, when the cleanliness requirement is greater than or equal to the first cleanliness level, the target vehicle configured for the third sorting station is a cleaned vehicle.

[0063] In this embodiment, when the cleanliness requirement is greater than or equal to the first cleanliness, it indicates that the target vehicle to be configured at the third sorting station has a high cleanliness requirement and requires the use of a cleaned vehicle. A cleaned vehicle refers to a vehicle that has been cleaned and has not been used to carry other structures after cleaning.

[0064] In one embodiment, the second process station is a wet cleaning station. When selecting a target carrier for the third sorting station, the choice can be made in conjunction with subsequent process stations. For example, if a fourth process station follows the third sorting station, this fourth process station could be a gate oxide station for depositing the gate oxide layer. Because the gate oxide layer is highly sensitive to contamination, even tiny particles or impurities can severely impact its quality, thereby affecting the performance and reliability of the entire target batch of wafers. Therefore, the third sorting station needs to use a target carrier with higher cleanliness to deliver the semiconductor to the gate oxide station, reducing the introduction of impurities during gate oxide layer growth or processing. Correspondingly, the cleanliness requirement for the third sorting station's station attributes must be greater than or equal to the first cleanliness requirement.

[0065] When setting site attributes, they can be a string of letters or a string of numbers to represent different cleanliness requirements; there are no specific restrictions here.

[0066] In one embodiment, when the cleanliness requirement is greater than or equal to the first cleanliness, the wafers of the target batch are given a second identifier; when the wafers of the target batch with the second identifier are transferred to the third sorting station, the target carrier is used to perform carrier exchange processing on the wafers of the target batch.

[0067] In this embodiment, a second identifier is assigned to the wafers of the target batch to guide the configuration of the cleaned carrier for the wafers of the target batch. This can bind the carrier selection requirements of the wafers of the target batch to the corresponding target carrier, thereby reducing the probability of errors in the selection of the target carrier.

[0068] In actual production, the first carrier that is replaced is usually reassigned to another location for use or for cleaning. Therefore, the supply of target carriers may be interrupted. For example, after configuring a cleaned carrier at the third sorting station, when the carrier handling equipment tries to grab the cleaned carrier based on the configuration information, there may be a shortage of cleaned carriers, requiring a production halt until new cleaned carriers are available. To ensure that the production of other target batches of wafers is not affected, the production line may be changed. When there are enough cleaned carriers and the original production line is restored, the system can quickly identify the target batch of wafers that requires cleaned carriers by recognizing the second identifier of the wafers in that original production line (original batch).

[0069] Therefore, by assigning a second identifier to the wafers of the target batch and configuring the cleaned carrier at the third sorting station based on the second identifier, the carrier selection requirements of the target batch of wafers can be bound to the corresponding target carrier, reducing the probability of errors in target carrier selection and improving the flexibility and reliability of production.

[0070] In one embodiment, the specific value of the second identifier is a string of characters used to indicate that the marked target vehicle needs to select a cleaned vehicle.

[0071] In one embodiment, the method further includes: before the second process station processes the wafers of the target batch, assigning a first identifier to the first carrier configured at the first sorting station based on the station attributes of the first sorting station; when the cleanliness requirement is less than a first cleanliness requirement, determining the result of the first identifier of the wafers corresponding to the target batch; when the result of the first identifier of the wafers corresponding to the target batch is a reserved state, detecting whether the first carrier that has been assigned the first identifier meets a preset availability standard; wherein, the step of configuring the target carrier at the third sorting station based on the cleanliness requirement and the result of the first identifier includes: configuring the target carrier at the third sorting station based on the result of the first identifier of the wafers corresponding to the target batch and the detection result of the detection of the first carrier.

[0072] In this embodiment, when the first sorting station processes the wafers of the target batch using a carrier exchange, it assigns a first identifier to the first carrier based on the specific attributes and process requirements of the first sorting station. The first identifier may contain information about the state, characteristics, or special considerations of the wafers of the target batch after processing at the first sorting station. In this embodiment, the first identifier marks the wafers of the target batch and the first carrier as "reserved," meaning that these semiconductor junctions and the first carrier require special or priority processing in subsequent processes, and the first carrier cannot be used by other process stations temporarily.

[0073] When the cleanliness requirement of the third sorting station is lower than the preset first cleanliness requirement, the first identification result of the corresponding target batch of wafers needs to be further determined. If the first identification of the target batch of wafers after the first sorting station is "reserved," then the first carrier marked with the reserved status should be used first. When the first identification result of the target batch of wafers is reserved, the system will further check whether the first carrier marked with the first identification meets the preset availability criteria. The availability criteria may include multiple aspects such as the cleanliness, integrity, and compatibility of the first carrier with the current target batch of wafers. Based on a comprehensive consideration of the first identification result and the detection results of the availability criteria, a more suitable target carrier is selected to further reduce cross-contamination between the target carrier and the target batch of wafers.

[0074] In some embodiments, the step of configuring the target carrier for the third sorting station based on the result of the first identifier of the wafers corresponding to the target batch and the detection result of the detection of the first carrier includes: when the result of the first identifier of the wafers corresponding to the target batch is in a reserved state, and the first carrier that has been identified by the first identifier meets a preset availability standard, the target carrier is the first carrier that has been identified by the first identifier; when the result of the first identifier of the wafers corresponding to the target batch is in a reserved state, and the first carrier that has been identified by the first identifier does not meet the preset availability standard, the target carrier is a random carrier.

[0075] In this embodiment, when the result of the first identifier is a reserved status, it indicates that the first carrier needs to be reserved for use at the third sorting station. If the first carrier has already completed the previous process steps together with the wafers of the target batch, and the first carrier is still available (i.e., meets the preset availability criteria), then continuing to use the first carrier can reduce the risk of introducing new sources of contamination due to carrier replacement.

[0076] When the first vehicle does not meet the preset availability criteria, the system can quickly switch to a randomly configured vehicle as the target vehicle. This flexibility ensures that production continuity can be maintained even in unexpected situations.

[0077] In some embodiments, the method further includes: generating an alarm signal when the first vehicle that has performed the first identification does not meet a preset availability standard.

[0078] In this embodiment, if the first vehicle does not meet the usage criteria, the system will issue a reminder to inform the user that the first vehicle is unusable and take corresponding solutions.

[0079] In some embodiments, the step of detecting whether the first vehicle that has been identified by the first identification meets a preset availability standard includes: obtaining historical information about the first vehicle that has been identified by the first identification, the historical information including at least one of the number of cleanings, cleaning time and remaining effective usage times of the first vehicle; and detecting whether the first vehicle meets the preset availability standard based on the historical information.

[0080] In this embodiment, by detecting whether the number of cleaning cycles of the first carrier meets the standard, or whether the remaining valid cycles meet the standard, the quality of the first carrier can be further controlled, the contamination of the semiconductor products by the first carrier can be reduced, and the stability of production can be improved.

[0081] In one embodiment, after the step of determining the result of the first identifier of the wafer corresponding to the target batch, the method further includes: when the result of the first identifier of the wafer corresponding to the target batch is a non-reserved state, the target vehicle configured for the third sorting station is a random vehicle.

[0082] In this embodiment, if the cleanliness requirement of the third sorting station is less than that of the first cleanliness station, and the first identification result is in a non-reserved state, it means that the first vehicle does not need to be reserved for use at the third sorting station. In this state, the selection requirements of the target vehicle at the third sorting station are relatively low, and the system can randomly select a vehicle to be configured for the third sorting station.

[0083] In summary, the selection of target vehicles at the third sorting station includes at least the following situations:

[0084] 1. When the cleanliness requirement is greater than or equal to the first cleanliness level, the cleaned vehicle shall be selected as the target vehicle.

[0085] 2. When the cleanliness requirement is less than the first cleanliness requirement, if the result of the first identification is a reserved state, further check whether the first vehicle meets the usability standard. If it meets the standard, the first vehicle is selected as the target vehicle. If it does not meet the standard, a vehicle is randomly selected as the target vehicle.

[0086] 3. When the result of the first identifier is a non-reserved state, a vehicle is randomly selected as the target vehicle.

[0087] This embodiment sets cleanliness requirements as the primary condition for selecting target carriers, and comprehensively configures target carriers by combining the first identifier and the usage of the first carrier. This enables the third sorting station to flexibly respond to the different cleanliness requirements of carriers for different target batches of wafers or process steps, quickly and accurately determine and select suitable target carriers, reduce contamination of target batches of wafers, and reduce the waiting time of target batches of wafers between process stations, thereby improving overall production efficiency.

[0088] like Figure 2 and Figure 3 As shown, this embodiment provides an application example. Figure 2 In this embodiment, the first sorting station, the second process station, and the third sorting station are defined. The second process station is a wet cleaning station. The system determines the station attributes of the third sorting station to control its selection of target carriers, minimizing the need for batch-to-batch carrier changes and reducing the probability of cross-contamination due to the wet cleaning machine's inability to automatically exchange production line carriers and internal carriers. Specifically:

[0089] Step 1: At the first sorting station, during the carrier exchange process on the system, the station's attributes are read. If the attribute value is "reservation required," the batch information of the wafers in the current target batch and the relevant data of the first carrier are obtained. A first identifier is then applied to both the batch information and the first carrier, with the result being "reservation status," thus reserving the first carrier for use at the third sorting station. If the station attribute value of the first sorting station is not "reservation required," the status of the first carrier and the batch information of the wafers in the current target batch will not be modified.

[0090] Step 2: After the first sorting station, the process flow of the second process station is carried out normally according to the preset procedure.

[0091] Step 3: After the processing at the second process station is completed, the vehicle exchange process at the third sorting station is executed. The station attributes of the current station are obtained, and the cleanliness requirement is determined based on the station attributes to see if it is greater than or equal to the first cleanliness requirement.

[0092] 1. When the cleanliness requirement is greater than or equal to the first cleanliness requirement, it indicates that the fourth process station after the third sorting station in the current process has a higher cleanliness requirement for the carrier, for example, the fourth process station is a gate oxide station. In this case, a second identifier will be added to the batch information of the wafers in this target batch. When querying for available target carriers for the wafers in this target batch, the second identifier will be used as a filter condition for adding new carriers to the query, so as to select carriers that have been cleaned but have not been used as target carriers.

[0093] 2. When the cleanliness requirement is less than the first cleanliness level, the first identifier in the target batch of wafers in the current batch information will be obtained, and it will be determined whether the result of the first identifier is a reserved state:

[0094] 2.1 If not in a reserved state, randomly select a target vehicle to perform a vehicle swap;

[0095] 2.2 If it is in a reserved state, it means that the first sorting station reserved the first carrier. The status of the first carrier is updated to "free" and then the first carrier is bound to the carrier exchange process of the third sorting station. At this time, the target carrier has been selected as the bound first carrier and cannot be modified. When the user assigns work in the system, after selecting the batch information of the target batch of wafers, the system will verify whether the selected target carrier is available.

[0096] 2.2.1 When the verification result indicates that the target vehicle is unavailable, a pop-up window will prompt the user to unbind the target vehicle. After the unbinding relationship is successfully unbound, the information of the target vehicle will be cleared, and the user will be prompted to reselect the target vehicle according to step 2.1 before proceeding to step 4.

[0097] 2.2.2 If the verification result indicates that the target vehicle is available, proceed to step four normally.

[0098] Step 4: After selecting the target carrier, dispatch the wafers according to the normal dispatching process, load the target batch of wafers onto the target carrier, and send them to the fourth process station.

[0099] The control method of this embodiment has at least the following beneficial effects:

[0100] 1. When passing through a wet cleaning station, the probability of cross-contamination caused by batches being able to change vehicles at will is reduced.

[0101] 2. When the first carrier that has been identified as the first target carrier malfunctions and becomes unusable, the target carrier can be changed to another carrier, and the binding relationship between the target carrier and the wafers of the target batch can also be released, which improves the flexibility of target carrier selection.

[0102] 3. The system can provide alerts when abnormalities occur during the target vehicle selection process, enabling users to handle abnormal situations promptly.

[0103] like Figure 4 As shown, another embodiment of this application provides a processing apparatus for continuous processing of a first sorting station, a second process station, and a third sorting station, comprising:

[0104] The first marking module 410 is used to mark the wafers of the target batch according to the site attributes of the first sorting station, and then the first sorting station performs carrier exchange processing on the wafers of the target batch.

[0105] The site attribute acquisition module 420 is used to acquire the preset site attributes of the third sorting station in response to the second process station finishing the process processing of the wafers of the target batch.

[0106] The cleanliness requirement determination module 430 is used to determine the cleanliness requirement of the target vehicle to be selected when the third sorting station is processing the exchange vehicle, based on the station attributes of the third sorting station.

[0107] The vehicle configuration module 440 is used to configure the target vehicle for the third sorting station according to the cleanliness requirements and the result of the first identification.

[0108] In some embodiments, the vehicle configuration module 440 is further configured to configure the target vehicle for the third sorting station as a cleaned vehicle when the cleanliness requirement is greater than or equal to the first cleanliness.

[0109] In some embodiments, the system further includes: a second marking module, configured to assign a second identifier to the wafers of the target batch when the cleanliness requirement is greater than or equal to the first cleanliness; wherein the carrier configuration module 440 is further configured to configure the cleaned carrier to the third sorting station according to the second identifier.

[0110] In some embodiments, the carrier marking module 440 is further configured to assign a first identifier to the first carrier selected by the first sorting station based on the station attributes of the first sorting station before the target batch of wafers is processed at the second process station.

[0111] In some embodiments, the device further includes: a judgment module, configured to judge the result of the first identifier of the wafers in the corresponding target batch when the cleanliness requirement is less than the first cleanliness; and an availability detection module, configured to detect whether the first carrier that has been marked with the first identifier meets the preset availability standard when the result of the first identifier of the wafers in the corresponding target batch is a reserved state.

[0112] The carrier configuration module 440 is further configured to configure the target carrier for the third sorting station based on the result of the first identifier of the wafer corresponding to the target batch and the detection result of the detection of the first carrier.

[0113] In some embodiments, the carrier configuration module 440 is further configured to configure the target carrier for the third sorting station as a random carrier when the result of the first identifier corresponding to the target batch of wafers is a non-reserved state.

[0114] In some embodiments, the carrier configuration module 440 is configured to configure the first carrier that has been marked as first as the target carrier when the result of the first marking of the wafers corresponding to the target batch is a reserved state and the first carrier that has been marked as first as meets a preset availability standard; the carrier configuration module 440 is further configured to configure a random carrier for the target carrier when the result of the first marking of the wafers corresponding to the target batch is a reserved state and the first carrier that has been marked as first as does not meet the preset availability standard.

[0115] In some embodiments, the system further includes an alarm module, configured to generate an alarm signal when the first vehicle that has been identified by the first identifier does not meet a preset availability standard.

[0116] In some embodiments, the system further includes: a historical information acquisition unit, configured to acquire historical information of the first vehicle that has been identified by the first identification, the historical information including at least one of the number of cleanings, cleaning time and remaining effective usage times of the first vehicle; and a detection micro-unit, configured to detect whether the first vehicle meets a preset usability standard based on the historical information.

[0117] For specific limitations regarding the processing device, please refer to the limitations regarding the processing method above, which will not be repeated here. Each unit in the aforementioned processing device can be implemented entirely or partially through software, hardware, or a combination thereof. Each of these units can be embedded in hardware within or independently of the processor in the computer device, or stored in software in the memory of the computer device, so that the processor can invoke and execute the operations corresponding to each of these units.

[0118] Another embodiment of this application provides a computer device, including a memory, a processor, and a computer program stored in the memory, wherein the processor executes the computer program to implement the steps of the method described in the above embodiments.

[0119] Other embodiments of this example provide a readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of the methods described in the above embodiments.

[0120] Other embodiments of this example provide a computer program product, including a computer program / instructions, which, when executed by a processor, implements the steps of the methods described in the above embodiments.

[0121] The processor may include, but is not limited to, one or more processors or microprocessors. Each processor may be implemented as an Application Specific Integrated Circuit (ASIC), Digital Signal Processor (DSP), Digital Signal Processing Device (DSPD), Programmable Logic Device (PLD), Field Programmable Gate Array (FPGA), controller, microcontroller, microprocessor, or other electronic component, for executing the methods described in the above embodiments.

[0122] Computer-readable storage media can be implemented by any type of volatile or non-volatile storage device or a combination thereof. Computer-readable storage media may include, but are not limited to, random access memory (RAM), read-only memory (ROM), flash memory, EPROM memory, EEPROM memory, registers, and computer storage media (e.g., hard disks, floppy disks, solid-state drives, removable disks, Blu-ray discs, etc.).

[0123] Computer-readable storage media may also store at least one computer-executable program / instruction, such as computer-readable instructions. Computer-readable storage media include, but are not limited to, volatile memory and / or non-volatile memory. Volatile memory may include, for example, random access memory (RAM) and / or cache memory. Computer-readable storage media may include, for example, read-only memory (ROM), hard disk, flash memory, etc. For example, a non-transitory computer-readable storage medium may be connected to a computing device such as a computer, and then, when the computing device executes the computer-readable instructions stored on the computer-readable storage medium, the various methods described above can be performed.

[0124] In addition, the computer device may include (but is not limited to) a data bus, an input / output (I / O) bus, a display, and input / output devices (e.g., keyboard, mouse, speakers, etc.).

[0125] The processor can communicate with external devices via the I / O bus through wired or wireless networks.

[0126] In one embodiment, the at least one computer-executable instruction may also be compiled into or comprise a software product / computer program product, wherein one or more computer-executable instructions are executed by a processor to perform the steps of the various functions and / or methods in the embodiments described herein.

[0127] In the embodiments provided in this disclosure, it should be understood that the disclosed apparatus and methods can also be implemented in other ways. The apparatus embodiments described above are merely illustrative; for example, the flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of apparatus, methods, and computer program products according to various embodiments of this disclosure. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than those marked in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in a block diagram and / or flowchart, and combinations of blocks in block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or action, or using a combination of dedicated hardware and computer instructions.

[0128] It should be noted that, in this disclosure, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element limited by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0129] While the embodiments disclosed herein are as described above, the foregoing content is merely for the purpose of facilitating understanding of this disclosure and is not intended to limit this disclosure. Any person skilled in the art to which this disclosure pertains may make any modifications and changes in form and detail of the implementation without departing from the spirit and scope of this disclosure; however, the scope of patent protection of this disclosure shall still be determined by the scope defined in the appended claims.

Claims

1. A control method for carrier changing, the control method being used for a first sorting station, a second process station, and a third sorting station with continuous processing, characterized in that, include: After assigning a first identifier to the wafers of the target batch based on the site attributes of the first sorting station, the first sorting station performs carrier exchange processing on the wafers of the target batch. In response to the completion of the process processing of the target batch of wafers at the second process station, the preset station attributes of the third sorting station are obtained; The cleanliness requirements of the target vehicle to be selected when the third sorting station is processed for vehicle exchange are determined based on the station attributes of the third sorting station. The target vehicle is configured at the third sorting station based on the cleanliness requirements and the result of the first identification.

2. The control method according to claim 1, characterized in that, Also includes: When the cleanliness requirement is greater than or equal to the first cleanliness level, the target vehicle configured for the third sorting station is the cleaned vehicle.

3. The control method according to claim 2, characterized in that, Also includes: When the cleanliness requirement is greater than or equal to the first cleanliness, the wafers in the target batch are given a second identifier; When the wafers of the target batch with the second identifier are transferred to the third sorting station, the target carrier is used to perform exchange carrier processing on the wafers of the target batch.

4. The control method according to claim 1, characterized in that, Also includes: Before the target batch of wafers is processed at the second process station, the first carrier selected by the first sorting station is identified according to the station attributes of the first sorting station. When the cleanliness requirement is less than the first cleanliness, determine the result of the first identifier of the wafer in the corresponding target batch; When the result of the first identification of the wafers corresponding to the target batch is a reserved state, it is detected whether the first carrier that has been identified meets the preset availability standard. The step of configuring the target carrier for the third sorting station according to the cleanliness requirements and the result of the first identification includes: configuring the target carrier for the third sorting station according to the result of the first identification of the wafers corresponding to the target batch and the detection result of the detection of the first carrier.

5. The control method according to claim 4, characterized in that, After the step of determining the result of the first identifier of the wafers corresponding to the target batch, the method further includes: When the result of the first identifier corresponding to the target batch of wafers is a non-reserved state, the target vehicle configured for the third sorting station is a random vehicle.

6. The control method according to claim 4, characterized in that, The step of configuring the target vehicle for the third sorting station based on the result of the first identifier corresponding to the target batch of wafers and the detection result of the detection performed on the first carrier includes: When the result of the first identification of the wafers corresponding to the target batch is a reserved state, and the first carrier that has been identified by the first identification meets the preset availability criteria, the target carrier is selected from the first carrier that has been identified by the first identification. When the result of the first identification of the wafers corresponding to the target batch is a reserved state, and the first carrier that has been identified does not meet the preset availability criteria, the target carrier shall select a random carrier.

7. The control method according to claim 6, characterized in that, Also includes: When the first vehicle that has been identified by the first identifier does not meet the preset availability criteria, an alarm signal is generated.

8. The control method according to claim 4, characterized in that, The steps for detecting whether the first vehicle that has been identified as having the first identifier meets the preset availability criteria include: Obtain historical information about the first vehicle that has been identified by the first identifier, the historical information including at least one of the number of times the first vehicle has been cleaned, the cleaning time, and the remaining valid usage times; Based on the historical information, it is determined whether the first vehicle meets the preset availability criteria.

9. The control method according to any one of claims 1-8, characterized in that, The second process station is a wet cleaning station.

10. A control device for carrier changing, said control device being applied to a first sorting station, a second process station, and a third sorting station in continuous processing, characterized in that, include: The first marking module is used to mark the wafers of the target batch according to the site attributes of the first sorting station, and then the first sorting station performs carrier exchange processing on the wafers of the target batch. The site attribute acquisition module is used to acquire the preset site attributes of the third sorting station in response to the second process station finishing the process processing of the wafers in the target batch. The cleanliness requirement determination module is used to determine the cleanliness requirement of the target vehicle to be selected when the third sorting station performs vehicle exchange processing based on the station attributes of the third sorting station. The vehicle configuration module is used to configure the target vehicle for the third sorting station according to the cleanliness requirements and the result of the first identification.

11. A computer device, comprising a memory, a processor, and a computer program stored in the memory, characterized in that, The processor executes the computer program to implement the steps of the control method according to any one of claims 1 to 9.

12. A readable storage medium having a computer program stored thereon, characterized in that, When executed by a processor, the computer program implements the steps of the control method according to any one of claims 1 to 9.

13. A computer program product comprising a computer program / instructions, characterized in that, When executed by a processor, the computer program implements the steps of the control method according to any one of claims 1 to 9.

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