Laser heating control system and method, device, equipment and medium

Abstract

The invention discloses a laser heating control system and method, a device, equipment and a medium, and belongs to the technical field of laser heating. The system comprises a laser device, a temperature controller connected with the laser device, a temperature measurement detector, a laser heating head connected with the light emitting side of the laser device and internally provided with a first reflection lens, an assembly line conveying mechanism located on the light emitting side of the laser heating head and used for placing a to-be-machined part, and a control system connected with the laser device and the assembly line conveying mechanism, and the temperature controller and the temperature measurement detector are connected with the control processor. According to the invention, based on the temperature measurement detector and the first reflection lens, the first detection light emitted by the temperature measurement detector and the target laser emitted by the laser device are coaxially emitted, so that it is ensured that the actual heating temperature of the target laser emitted to the target processing area is measured by the first detection light; and the laser emission power of the laser is timely adjusted based on the actual heating temperature and the preset heating temperature, so that non-uniform heating of the to-be-processed part caused by target laser fluctuation is avoided, and the product processing yield is guaranteed.

Description

Technical Field

[0001] The present application relates to but is not limited to the field of laser heating technology, and in particular to a laser heating control system and method, device, equipment, and medium. Background Art

[0002] Laser heating technology can emit a light spot of a specific shape onto the surface of the product to be processed, and use the heat generated in the light spot area to perform surface heat treatment, surface strengthening and other processes on the surface of the product to be processed. Laser heating technology has the advantages of non-contact, low energy consumption, high heating efficiency, and precise temperature control, and has been widely used in various processing fields.

[0003] Because the key parameters of the laser light source, such as output power and wavelength, will fluctuate within a certain range when it is working continuously or in a specific period of time, and the fluctuation of the laser light source has a great influence on the laser heating temperature range. For example, if the fluctuation range of the laser light source output power or wavelength is 5%, it will cause the laser heating temperature to fluctuate within the range of hundreds of degrees Celsius. As a result, in the process of using laser heating technology to perform surface treatment on the moving parts to be processed on the assembly line, the processing temperatures at different positions of the parts to be processed are different, affecting the processing yield. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the embodiments of the present application provide a laser heating control system and method, device, equipment, and medium, which can effectively ensure that the parts to be processed are heated evenly, thereby improving the product yield of the parts to be processed.

[0005] In a first aspect, an embodiment of the present application provides a laser heating control system, the system comprising:

[0006] A laser, wherein the laser is used to emit a target laser;

[0007] A temperature controller electrically connected to the laser

[0008] A temperature measuring detector, the temperature measuring detector is used to emit a first detection light;

[0009] A laser heating head, the laser heating head is connected to the light emitting side of the laser, a first reflecting lens is arranged inside the laser heating head, the first reflecting lens is a half-reflecting half-mirror and is installed at an angle of 45 degrees, and the first reflecting lens is located on the light emitting side of the temperature measuring detector;

[0010] An assembly line conveying mechanism, the assembly line conveying mechanism is located at the light-emitting side of the laser heating head, and the assembly line conveying mechanism is placed with the parts to be processed;

[0011] A control processor, the control processor is electrically connected to the laser, the temperature controller and the temperature measuring detector respectively;

[0012] Among them, the target laser is emitted to the target processing area of ​​the part to be processed through the first reflecting lens, and the first detection light emitted by the temperature measuring detector is reflected by the first reflecting lens and then emitted coaxially with the target laser to the target processing area of ​​the part to be processed.

[0013] In some embodiments, the laser heating control system further comprises:

[0014] A CCD detection device, the CCD detection device is electrically connected to the control processor, and the CCD detection device is used to emit a second detection light; a second reflecting lens is also arranged inside the laser heating head, the second reflecting lens is located above the first reflecting lens, the second reflecting lens is a half-reflecting half-mirror and is installed at an angle of 45 degrees, the second reflecting lens is parallel to the first reflecting lens and is centered, and the reflecting surface of the second reflecting lens faces the first reflecting lens;

[0015] Among them, the second detection light emitted by the CCD detection device is reflected by the second reflection lens, and then emitted coaxially with the target laser and the first detection light through the first reflection lens to the target processing area of ​​the part to be processed.

[0016] In some embodiments, a coated semi-mirror is disposed inside the temperature measuring detector, and the temperature measuring frequency of the temperature measuring detector is 10KHZ.

[0017] In a second aspect, an embodiment of the present application provides a laser heating control method, which is applied to a control processor of a laser heating control system provided by any embodiment of the first aspect, and the method includes:

[0018] Determine a first laser power corresponding to a preset temperature value, and control the laser to emit the target laser based on the first laser power;

[0019] Controlling the temperature measuring detector to emit the first detection light based on a preset first period, and obtaining a first detection temperature value fed back by the temperature measuring detector;

[0020] When the temperature deviation between the first detected temperature value and the preset temperature value is greater than a preset difference threshold, controlling the temperature controller to adjust the first laser power of the laser to obtain an adjusted second laser power;

[0021] The laser is controlled to re-emit the target laser based on the second laser power.

[0022] In a third aspect, an embodiment of the present application provides a control device, comprising at least one control processor and a memory for communicating with the at least one control processor; the memory stores instructions that can be executed by the at least one control processor, and the instructions are executed by the at least one control processor so that the at least one control processor can execute the laser heating control method as described in the second aspect.

[0023] In a fourth aspect, an embodiment of the present application further provides an electronic device, comprising the control device of the third aspect.

[0024] In a fifth aspect, an embodiment of the present application further provides a computer-readable storage medium storing computer-executable instructions, wherein the computer-executable instructions are used to execute the laser heating control method as described in the first aspect.

[0025] The embodiment of the present application provides a laser heating control system and method, device, equipment, and medium, the system comprising: a laser, the laser being used to emit a target laser; a temperature controller, the temperature controller being electrically connected to the laser; a temperature measuring detector, the temperature measuring detector being used to emit a first detection light; a laser heating head, the laser heating head being connected to the light-emitting side of the laser, a first reflecting lens being arranged inside the laser heating head, the first reflecting lens being a half-reflective half-mirror and being installed at an angle of 45 degrees, the first reflecting lens being located at the light-emitting side of the temperature measuring detector; an assembly line conveying mechanism, the assembly line conveying mechanism being located at the light-emitting side of the laser heating head, the assembly line conveying mechanism being placed with a part to be processed; a control processor, the control processor being electrically connected to the laser, the temperature controller, and the temperature measuring detector, respectively; wherein the target laser is emitted to a target processing area of ​​the part to be processed through the first reflecting lens, and the first detection light emitted by the temperature measuring detector is reflected by the first reflecting lens and emitted coaxially with the target laser to the target processing area of ​​the part to be processed. The present application is based on a temperature measuring detector and a first reflecting lens so that the first detection light is emitted coaxially with the target laser, thereby ensuring that the first detection light measures the actual heating temperature of the target laser emitted to the target processing area, and timely adjusts the laser emission power of the laser based on the actual heating temperature and the preset heating temperature, thereby avoiding uneven heating of the parts to be processed caused by fluctuations in the target laser and ensuring the product processing yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a structural schematic diagram of a laser heating control system provided by an embodiment of the present application;

[0027] Figure 2 is a flowchart of the steps of a laser heating control method provided by another embodiment of the present application;

[0028] Figure 3 It is a structural diagram of a control device provided in another embodiment of the present application.

[0029] Description of reference numerals:

[0030] Laser 110; target laser 111; laser heating head 120; second reflecting lens 121; first reflecting lens 122; temperature controller 130; CCD detection device 140; second detection light 141; temperature measuring detector 150; first detection light 151; assembly line transmission mechanism 160; part to be processed 200. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0032] It is understood that although the functional modules are divided in the device schematic diagram and the logical order is shown in the flow chart, in some cases, the steps shown or described may be performed in a different order than the module division in the device or the order in the flow chart. The terms "first", "second", etc. in the specification, claims or the above drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0033] Laser heating technology can emit a light spot of a specific shape onto the surface of the product to be processed, and use the heat generated in the light spot area to perform surface heat treatment, surface strengthening and other processes on the surface of the product to be processed. Laser heating technology has the advantages of non-contact, low energy consumption, high heating efficiency, and precise temperature control, and has been widely used in various processing fields.

[0034] Because the key parameters of the laser light source, such as output power and wavelength, will fluctuate within a certain range when it is working continuously or in a specific period of time, and the fluctuation of the laser light source has a great influence on the laser heating temperature range. For example, if the fluctuation range of the laser light source output power or wavelength is 5%, it will cause the laser heating temperature to fluctuate within the range of hundreds of degrees Celsius. As a result, in the process of using laser heating technology to perform surface treatment on the moving parts to be processed on the assembly line, the processing temperatures at different positions of the parts to be processed are different, affecting the processing yield.

[0035] To solve the above-mentioned problems, the embodiments of the present application provide a laser heating control system and method, device, equipment, and medium, wherein the system includes: a laser, the laser being used to emit a target laser; a temperature controller, the temperature controller being electrically connected to the laser; a temperature measuring detector, the temperature measuring detector being used to emit a first detection light; a laser heating head, the laser heating head being connected to the light-emitting side of the laser, a first reflecting lens being arranged inside the laser heating head, the first reflecting lens being a half-reflective half-mirror and being installed at an angle of 45 degrees, the first reflecting lens being located at the light-emitting side of the temperature measuring detector; an assembly line conveying mechanism, the assembly line conveying mechanism being located at the light-emitting side of the laser heating head, the assembly line conveying mechanism being placed with a part to be processed; a control processor, the control processor being electrically connected to the laser, the temperature controller, and the temperature measuring detector, respectively; wherein the target laser is emitted to a target processing area of ​​the part to be processed through the first reflecting lens, and the first detection light emitted by the temperature measuring detector is reflected by the first reflecting lens and emitted coaxially with the target laser to the target processing area of ​​the part to be processed. The present application is based on a temperature measuring detector and a first reflecting lens so that the first detection light is emitted coaxially with the target laser, thereby ensuring that the first detection light measures the actual heating temperature of the target laser emitted to the target processing area, and timely adjusts the laser emission power of the laser based on the actual heating temperature and the preset heating temperature, thereby avoiding uneven heating of the parts to be processed caused by fluctuations in the target laser and ensuring the product processing yield.

[0036] The embodiments of the present application are further described below in conjunction with the accompanying drawings.

[0037] refer to Figure 1 , Figure 1 : is a schematic diagram of the structure of a laser heating control system provided by an embodiment of the present application. The embodiment of the present application provides a laser heating control system, which includes but is not limited to:

[0038] A laser 110, the laser 110 is used to emit a target laser 111;

[0039] The temperature controller 130 is electrically connected to the laser 110.

[0040] A temperature measuring detector 150, the temperature measuring detector 150 is used to emit a first detection light 151;

[0041] The laser heating head 120 is connected to the light emitting side of the laser 110. A first reflecting lens 122 is disposed inside the laser heating head 120. The first reflecting lens 122 is a semi-reflective and semi-mirror lens and is installed at an angle of 45 degrees. The first reflecting lens 122 is located at the light emitting side of the temperature measuring detector 150.

[0042] The assembly line conveying mechanism 160 is located at the light-emitting side of the laser heating head 120 , and the assembly line conveying mechanism 160 is placed with the parts 200 to be processed;

[0043] A control processor, the control processor is electrically connected to the laser 110, the temperature controller 130 and the temperature measuring detector 150 respectively;

[0044] Among them, the target laser 111 is emitted to the target processing area of ​​the part to be processed 200 through the first reflecting lens 122, and the first detection light 151 emitted by the temperature measuring detector 150 is reflected by the first reflecting lens 122 and emitted coaxially with the target laser 111 to the target processing area of ​​the part to be processed 200.

[0045] It should be noted that, in some embodiments, a coated half-mirror is provided inside the temperature measuring detector 150 of this embodiment. The coated half-mirror can achieve the effects of light splitting, enhancing signal strength, reducing interference and improving measurement accuracy, thereby improving the performance of the temperature measuring detector.

[0046] The present application does not limit the specific operating parameters of the temperature measuring detector 150. For example, the response speed of the temperature measuring detector 150 is 1ms, and the temperature measuring frequency is 10KHZ. Those skilled in the art can adjust and select the specific structure and specific operating parameters according to actual conditions.

[0047] It should be noted that, in some embodiments, the present application does not limit the specific structure of the laser heating head 120 and the laser 110. The laser heating head 120 can be a surface-emitting laser head or a point-emitting laser head, and the laser 110 can be a continuous light-emitting laser 110. Those skilled in the art can select according to actual needs.

[0048] Understandably, reference Figure 1 Since the first reflecting lens 122 of the present embodiment is a semi-reflective and semi-transmissive optical lens, and the first reflecting lens 122 is installed inside the laser heating head 120 at an angle of 45 degrees, the reflecting surface of the first reflecting lens 122 faces the temperature measuring detector 150. Based on this installation relationship, the first reflecting lens 122 can achieve the effects of reflecting temperature measurement, visual light and transparent laser light. Specifically, the target laser 111 emitted by the laser 110 can pass through the first reflecting lens 122 and be emitted to the target processing area of ​​the part to be processed 200. At the same time, the first detection light 151 emitted by the temperature measuring detector 150 is reflected by the first reflecting lens 122 and emitted coaxially with the target laser 111 to the target processing area, which can ensure that the temperature measuring detector 150 accurately measures the actual heating temperature of the heating point where the target laser 111 is emitted to the target processing area.

[0049] It should be noted that the first reflecting lens 122 can determine the reflection band and the light transmission band by coating. In this embodiment, the A surface of the first reflecting lens 122 is transparent to laser light, and the B surface is used to reflect the temperature measurement band of the temperature measurement detector 150.

[0050] In addition, it can be understood that the temperature measuring detector 150 of the embodiment of the present application has a built-in temperature measurement curve of the detection area preset by the upper computer software. When the laser 110 emits the target laser 111, the temperature measuring detector 150 will emit the corresponding temperature measurement light based on the preset temperature measurement curve to achieve temperature measurement. When the control processor detects that the difference between the measured temperature and the preset temperature is greater than the preset temperature deviation threshold, the temperature controller 130 sends an analog signal to the laser 110 in real time. After receiving the signal, the laser 110 adjusts the power of the laser 110 to balance the temperature of the heating zone, ensuring that the temperature of the heating point in the target processing area is always within the set range, thereby effectively avoiding uneven heating of the part 200 to be processed caused by fluctuations in the target laser 111 and ensuring the product processing yield.

[0051] In addition, it should be noted that the reference Figure 1 The laser heating control system of the embodiment of the present application also includes a CCD detection device 140, which is electrically connected to the control processor and is used to emit a second detection light 141; a second reflecting lens 121 is also arranged inside the laser heating head 120, and the second reflecting lens 121 is located above the first reflecting lens 122. The second reflecting lens 121 is a semi-reflective and semi-mirror lens and is installed at an angle of 45 degrees. The second reflecting lens 121 and the first reflecting lens 122 are parallel to each other and centered, and the reflecting surface of the second reflecting lens 121 faces the first reflecting lens 122; wherein, the second detection light 141 emitted by the CCD detection device 140 is reflected by the second reflecting lens 121, and then emitted coaxially with the target laser 111 and the first detection light 151 through the first reflecting lens 122 to the target processing area of ​​the part to be processed 200.

[0052] It is understandable that the first detection light 151 can be made coaxial with the target laser 111 through the first reflecting lens 122, thereby achieving coaxial temperature measurement and improving the accuracy of temperature detection. The specific optical principle will not be repeated here. Similarly, the second detection light 141 can be made coaxial with the target laser 111 through the first reflecting mirror and the second reflecting lens 121, thereby achieving coaxial CCD detection and improving the accuracy of CCD detection. It should be noted that the detection principle of the CCD detection device 140 is not within the scope of improvement of this embodiment. It is sufficient to make the second detection light 141 coaxial with the target laser 111 only by improving the position of the optical device. After the abnormal signal is fed back based on the second detection light 141, that is, the CCD detection device 140 detects that the current heating point is abnormal, the control device of this embodiment generates an abnormal prompt information in response to the abnormal signal, prompting the processing personnel to make timely corrections to ensure the processing quality.

[0053] refer to Figure 2 , Figure 2 : is a flowchart of a laser heating control method provided by an embodiment of the present application. The method is applied to a control processor of a laser heating control system of any of the above embodiments. The method includes but is not limited to the following steps:

[0054] Step S110, determining a first laser power corresponding to a preset temperature value, and controlling the laser 110 to emit a target laser 111 based on the first laser power;

[0055] Step S120, controlling the temperature measuring detector 150 to emit the first detection light 151 based on a preset first cycle, and obtaining a first detection temperature value fed back by the temperature measuring detector 150;

[0056] Step S130, when the temperature deviation between the first detected temperature value and the preset temperature value is greater than the preset difference threshold, controlling the temperature controller 130 to adjust the first laser power of the laser 110 to obtain an adjusted second laser power;

[0057] Step S140 , controlling the laser 110 to re-emit the target laser 111 based on the second laser power.

[0058] It should be noted that the first period and the second period can be set according to actual needs, and the specific values ​​are not limited here.

[0059] It should be noted that the preset difference threshold of this embodiment is the deviation range of the heating temperature value that can be guaranteed to have a processing yield when the laser heating technology is applied to the component 200 to be processed. The specific value of the preset difference threshold of the embodiment of the present application can be ±1 degree Celsius. No restrictions are imposed here, as long as it can ensure that the limit detection temperature is much smaller than the temperature difference caused by the laser fluctuation.

[0060] It is understandable that when the component 200 to be processed is laser processed using a laser heating control system, the system will pre-set the heating temperature (i.e., the preset temperature value) for the target processing area of ​​the component 200 to be processed, and determine the first laser power of the laser 110 corresponding to the preset temperature value, and control the laser 110 to emit the target laser 111 based on the first laser power; however, since the key parameters of the laser light source such as output power and wavelength will fluctuate within a certain range during continuous operation or a specific time period, and the fluctuation of the laser light source has a greater impact on the laser heating temperature range, that is, it will cause fluctuations in the heating temperature, thereby causing uneven heating of the component 200 to be processed, affecting the processing effect of the component 200 to be processed. Based on this, the embodiment of the present application sets a first reflecting lens 122 inside the laser heating head 120, and the reflecting surface of the first reflecting lens 122 faces the temperature measuring detector 150. Based on this structure and installation relationship, the first reflecting lens 122 can achieve the effects of reflecting temperature measurement, visual light and transparent laser. Specifically, the target laser 111 emitted by the laser 110 can be emitted through the first reflecting lens 122 to the target processing area of ​​the part to be processed 200. At the same time, the control processor controls the first detection light 151 emitted by the temperature measuring detector 150 to be coaxial with the target laser 111 after being reflected by the first reflecting lens 122 based on the preset first period. When the target laser 111 is emitted to the target processing area, it can ensure that the temperature measuring detector 150 can accurately measure the actual heating temperature (i.e., the first detected temperature value) of the heating point where the target laser 111 is emitted to the target processing area. When it is detected that the temperature deviation value between the first detected temperature value and the preset temperature value is greater than the preset difference threshold, it can be determined that the energy of the target laser 111 fluctuates, and the laser power of the laser 110 needs to be adjusted to ensure that the heating temperature meets the requirements. In this embodiment, the temperature difference greater than the preset difference threshold is used as a trigger signal to adjust the laser power of the target laser 111. When the first detected temperature value is greater than the preset temperature value, the laser power can be lowered, and vice versa.

[0061] At the same time, it should be noted that the present application does not involve improvement of the detection principle of the temperature measuring detector 150, but only improves the position of the optical device to make the first detection light 151 coaxial with the target laser 111. The specific detection principle will not be repeated here.

[0062] Additionally, in some embodiments, Figure 1 Step S130 includes but is not limited to the following steps:

[0063] Step S131, obtaining a preset power adjustment value;

[0064] Step S132, when the first detected temperature value is greater than the preset temperature value, determining the difference between the first laser power and the power adjustment value as the second laser power;

[0065] or,

[0066] Step S133: when the first detected temperature value is less than the preset temperature value, the sum of the first laser power and the power adjustment value is determined as the second laser power.

[0067] In addition, in some embodiments, when executing Figure 1 After step S140, the laser heating control method provided in the embodiment of the present application further includes but is not limited to the following steps:

[0068] Step S151, re-controlling the temperature measuring detector 150 to emit the first detection light 151 based on the first cycle, and obtaining the second detection temperature value fed back by the temperature measuring detector 150;

[0069] Step S152, when the temperature deviation between the second detected temperature value and the preset temperature value is less than the preset difference threshold, adjusting the second laser power based on the power adjustment value to obtain an adjusted third laser power;

[0070] Step S153 , controlling the laser 110 to re-emit the target laser 111 based on the third laser power.

[0071] It should be noted that the preset temperature value of this embodiment is an ideal temperature value for laser heating the workpiece 200 to be processed. This embodiment does not limit the specific temperature value, and those skilled in the art can adjust it according to actual needs.

[0072] It is understandable that the laser 110 can output the target laser 111 within a certain power range to achieve different heating temperatures. The laser 110 will attenuate during long-term use, so the power of the output target laser 111 is not necessarily equal to the set power. As a result, after the target laser 111 is emitted at a pre-set laser power, the temperature value at the heating point of the target processing area of ​​the component 200 to be processed fails to meet the ideal requirements, making it difficult to ensure the product yield of the component 200 to be processed. Based on this, in order to effectively improve the product yield of the component 200 to be processed, the embodiment of the present application adjusts the laser power of the target laser 111 based on a preset power adjustment value. After obtaining the power adjustment value, the first detected temperature is compared with the preset temperature value. When the first detected temperature value is greater than the preset temperature value, the difference between the first laser power and the power adjustment value is determined as the second laser power, and the laser 110 is controlled to re-emit the target laser 111 based on the second laser power; when the first detected temperature value is less than the preset temperature value, the sum of the first laser power and the power adjustment value is taken as the second laser power, and the laser 110 is controlled to re-emit the target laser 111 based on the second laser power; and after re-emitting the target laser 111, the temperature measuring detector 150 is continuously periodically or in real time controlled to re-emit the first detection light 151 based on the first period, and the second detected temperature value fed back by the temperature measuring detector 150 is obtained, as long as the temperature deviation value between the second detected temperature value and the preset temperature value is less than the preset difference threshold, indicating that the temperature difference caused by the current laser energy fluctuation meets the requirement, and the second laser power continues to be adjusted based on the power adjustment value to obtain the adjusted third laser power (similar to the above embodiment, when the second detected temperature value is greater than the preset temperature value, the laser power of the target laser 111 emitted by the laser 110 can be gradually reduced based on the power adjustment value, and vice versa) until it is detected that the temperature deviation value between the second detected temperature value and the preset temperature value is greater than the preset difference threshold, and step S132 or step S133 is re-triggered. That is to say, each adjustment of the laser power of the target laser 111 in the present application is determined based on the difference between the laser power obtained in the last adjustment and the preset temperature value, and the laser power of the re-emitted target laser 111 changes dynamically during the continuous adjustment process to ensure that the temperature value of the attenuated target laser 111 emitted at the heating point of the target processing area of ​​the part to be processed 200 can meet the processing requirements.

[0073] In addition, in some embodiments, reference Figure 1The laser heating control system also includes a CCD detection device 140, which is electrically connected to the control processor and is used to emit a second detection light 141; a second reflecting lens 121 is also arranged inside the laser heating head 120, and the second reflecting lens 121 is located above the first reflecting lens 122, the second reflecting lens 121 is a semi-reflective and semi-mirror lens and is installed at an angle of 45 degrees, the second reflecting lens 121 and the first reflecting lens 122 are parallel to each other and centered, and the reflecting surface of the second reflecting lens 121 faces the first reflecting lens 122, wherein the second detection light 141 emitted by the CCD detection device 140 is reflected by the second reflecting lens 121, and then coaxially emitted with the target laser 111 and the first detection light 151 through the first reflecting lens 122 to the target processing area of ​​the part to be processed 200. Based on this structure, the laser heating control method provided in the embodiment of the present application also includes but is not limited to the following steps:

[0074] Step S161, controlling the CCD detection device 140 to emit a second detection light 141 based on a preset second period;

[0075] Step S162: when the abnormal signal fed back by the CCD detection device 140 is obtained, abnormal prompt information is generated.

[0076] It can be understood that, referring to the description of the above-mentioned laser heating control system embodiment, the second detection light 141 emitted by the CCD detection device 140 can realize the second detection light 141, the first detection light 151 and the target laser 111 through the second reflection lens 121 and the first reflection mirror in sequence, and the three beams of light are coaxial, thereby realizing coaxial temperature measurement and coaxial CCD detection, improving the accuracy of temperature detection while improving the accuracy of CCD detection. The specific optical principle is not repeated here. It should be noted that the detection principle of the CCD detection device 140 is not within the scope of improvement of this embodiment. It is only necessary to make the second detection light 141 coaxial with the target laser 111 by improving the position of the optical device. After the abnormal signal is fed back based on the second detection light 141, that is, the CCD detection device 140 detects that the current heating point is abnormal, the control device of this embodiment generates an abnormal prompt information in response to the abnormal signal, prompting the processing personnel to make corrections in time to ensure the processing quality.

[0077] like Figure 3 As shown, Figure 3 : is a structural diagram of a control device provided by an embodiment of the present application. The present invention also provides a control device 300, including:

[0078] The processor 310 may be implemented by a general-purpose central processing unit (CPU), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of the present application;

[0079] The memory 320 can be implemented in the form of a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory 320 can store an operating system and other application programs. When the technical solution provided in the embodiment of this specification is implemented by software or firmware, the relevant program code is stored in the memory 320, and the processor 310 calls and executes the laser heating control method of the embodiment of this application;

[0080] Input / output interface 330, used to implement information input and output;

[0081] Communication interface 340, used to realize communication interaction between the apparatus and other devices, which can be realized by wired means (such as USB, network cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.);

[0082] bus 350 , which transmits information between the various components of the device (e.g., processor 310 , memory 320 , input / output interface 330 , and communication interface 340 );

[0083] The processor 310 , the memory 320 , the input / output interface 330 and the communication interface 340 are connected to each other in communication within the device via the bus 350 .

[0084] In addition, an embodiment of the present application further provides an electronic device, including the control device 300 of the above embodiment.

[0085] In addition, an embodiment of the present application further provides a storage medium, which is a computer-readable storage medium and stores a computer program. When the computer program is executed by a processor, the above-mentioned laser heating control method is implemented.

[0086] As a non-transient computer-readable storage medium, the memory can be used to store non-transient software programs and non-transient computer executable programs. In addition, the memory may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage devices. In some embodiments, the memory may optionally include a memory remotely arranged relative to the processor, and these remote memories may be connected to the processor via a network. Examples of the above-mentioned networks include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and a combination thereof. The device embodiments described above are merely schematic, wherein the units described as separate components may or may not be physically separated, and are implemented to be located in one place, or may also be distributed to multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the present embodiment.

[0087] It will be appreciated by those skilled in the art that all or some of the steps and systems in the disclosed method above may be implemented as software, firmware, hardware and appropriate combinations thereof. Some physical components or all physical components may be implemented as software executed by a processor, such as a central processing unit, a digital signal processor or a microprocessor, or may be implemented as hardware, or may be implemented as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on a computer-readable medium, which may include a computer storage medium (or a non-transitory medium) and a communication medium (or a temporary medium). As known to those skilled in the art, the term computer storage medium includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules or other data). Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tapes, disk storage or other magnetic storage devices, or any other medium that may be used to store desired information and may be accessed by a computer. Furthermore, it is well known to those skilled in the art that communication media typically include computer readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media.

[0088] The above is a specific description of the preferred implementation of the present invention, but the present invention is not limited to the above-mentioned implementation mode. Technical personnel familiar with the field can also make various equivalent deformations or substitutions under the shared conditions without violating the spirit of the present invention. These equivalent deformations or substitutions are all included in the scope defined by the claims of the present invention.

Claims

1. A laser heating control system, It is characterized in that include: A laser, wherein the laser is used to emit a target laser; A temperature controller electrically connected to the laser A temperature measuring detector, the temperature measuring detector is used to emit a first detection light; A laser heating head, the laser heating head is connected to the light emitting side of the laser, a first reflecting lens is arranged inside the laser heating head, the first reflecting lens is a half-reflecting half-mirror and is installed at an angle of 45 degrees, and the first reflecting lens is located on the light emitting side of the temperature measuring detector; An assembly line conveying mechanism, the assembly line conveying mechanism is located at the light-emitting side of the laser heating head, and the assembly line conveying mechanism is placed with the parts to be processed; A control processor, the control processor is electrically connected to the laser, the temperature controller and the temperature measuring detector respectively; Among them, the target laser is emitted to the target processing area of ​​the part to be processed through the first reflecting lens, and the first detection light emitted by the temperature measuring detector is reflected by the first reflecting lens and then emitted coaxially with the target laser to the target processing area of ​​the part to be processed.

2. The laser heating control system according to claim 1, It is characterized in that It also includes a CCD detection device, which is electrically connected to the control processor and is used to emit a second detection light; a second reflecting lens is also arranged inside the laser heating head, the second reflecting lens is located above the first reflecting lens, the second reflecting lens is a half-reflecting half-mirror and is installed at an angle of 45 degrees, the second reflecting lens is parallel to the first reflecting lens and is centrally aligned, and the reflecting surface of the second reflecting lens faces the first reflecting lens; Among them, the second detection light emitted by the CCD detection device is reflected by the second reflection lens, and then emitted coaxially with the target laser and the first detection light through the first reflection lens to the target processing area of ​​the part to be processed.

3. The laser heating control system according to claim 1, It is characterized in that A coated semi-mirror is arranged inside the temperature measuring detector, and the temperature measuring frequency of the temperature measuring detector is 10KHZ.

4. A laser heating control method, It is characterized in that A control processor applied to a laser heating control system according to any one of claims 1 to 3, wherein the laser heating control method comprises: Determine a first laser power corresponding to a preset temperature value, and control the laser to emit the target laser based on the first laser power; Controlling the temperature measuring detector to emit the first detection light based on a preset first cycle, and obtaining a first detection temperature value fed back by the temperature measuring detector; When the temperature deviation between the first detected temperature value and the preset temperature value is greater than a preset difference threshold, controlling the temperature controller to adjust the first laser power of the laser to obtain an adjusted second laser power; The laser is controlled to re-emit the target laser based on the second laser power.

5. The laser heating control method according to claim 4, It is characterized in that Controlling the temperature controller to adjust the first laser power of the laser to obtain an adjusted second laser power includes: Obtaining a preset power adjustment value; When the first detected temperature value is greater than the preset temperature value, determining the difference between the first laser power and the power adjustment value as the second laser power; or, When the first detected temperature value is less than the preset temperature value, the sum of the first laser power and the power adjustment value is determined as the second laser power.

6. The laser heating control method according to claim 5, It is characterized in that After controlling the laser to re-emit the target laser based on the second laser power, the method further includes: controlling the temperature measuring detector to emit the first detection light again based on the first cycle, and obtaining a second detection temperature value fed back by the temperature measuring detector; When the temperature deviation between the second detected temperature value and the preset temperature value is less than the preset difference threshold, adjusting the second laser power based on the power adjustment value to obtain an adjusted third laser power; The laser is controlled to re-emit the target laser based on the third laser power.

7. The laser heating control method according to claim 4, It is characterized in that The laser heating control system also includes a CCD detection device, which is electrically connected to the control processor and is used to emit a second detection light; a second reflecting lens is also provided inside the laser heating head, the second reflecting lens is located above the first reflecting lens, the second reflecting lens is a semi-reflective and semi-mirror lens and is installed at an angle of 45 degrees, the second reflecting lens is parallel to the first reflecting lens and is centered, and the reflecting surface of the second reflecting lens faces the first reflecting lens, wherein the second detection light emitted by the CCD detection device is reflected by the second reflecting lens, and then emitted coaxially with the target laser and the first detection light through the first reflecting lens to the target processing area of ​​the part to be processed, and the method also includes: Controlling the CCD detection device to emit the second detection light based on a preset second period; When an abnormal signal fed back by the CCD detection device is obtained, abnormal prompt information is generated.

8. A control device, It is characterized in that It includes at least one control processor and a memory for communicating with the at least one control processor; the memory stores instructions that can be executed by the at least one control processor, and the instructions are executed by the at least one control processor so that the at least one control processor can execute the laser heating control method as described in any one of claims 4 to 7.

9. An electronic device, It is characterized in that Includes the control device as claimed in claim 8.

10. A computer-readable storage medium, It is characterized in that The computer-readable storage medium stores computer-executable instructions, and the computer-executable instructions are used to enable a computer to execute the laser heating control method according to any one of claims 4 to 7.

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