Display device

Abstract

The invention discloses a display device. The display device comprises a substrate, a plurality of light-emitting elements, a back plate and a bearing part. The plurality of light-emitting elements are arranged on the substrate. The backboard is arranged corresponding to the substrate. The bearing piece is arranged between the substrate and the back plate. The absolute value of the difference between the thermal expansion coefficient of the bearing piece and the thermal expansion coefficient of the substrate is smaller than or equal to the absolute value of the difference between the thermal expansion coefficient of the bearing piece and the thermal expansion coefficient of the back plate.

Description

Technical Field

[0001] The present invention relates to a display device, and in particular to a display device comprising a carrier. Background Art

[0002] Electronic products including display devices, such as screens, smartphones, tablets, notebook computers and televisions, have become indispensable necessities in modern society. With the booming development of such electronic products, consumers have high expectations for the quality, functions or prices of these electronic products.

[0003] Typically, a display device includes a plurality of films, layers and / or components. However, the connection between the plurality of films, layers and / or components may affect the structural strength of the display device. Therefore, these electronic products do not meet the expectations of consumers in all aspects, and there are still some problems with the electronic products. Developing a display device that can improve the connection between the plurality of films, layers and / or components is still one of the current goals. Summary of the invention

[0004] In some embodiments, a display device is provided. The display device includes a substrate, a plurality of light-emitting elements, a backplane, and a carrier. The substrate has a first thermal expansion coefficient. The plurality of light-emitting elements are disposed on the substrate. The backplane is disposed corresponding to the substrate and has a second thermal expansion coefficient. The carrier is disposed between the substrate and the backplane and has a third thermal expansion coefficient. The absolute value of the difference between the third thermal expansion coefficient and the first thermal expansion coefficient is less than or equal to the absolute value of the difference between the third thermal expansion coefficient and the second thermal expansion coefficient.

[0005] In some embodiments, a display device is provided. The display device includes a substrate, a plurality of light-emitting elements, a backplane, and a carrier. The substrate has a first coefficient of thermal expansion (CTE). The plurality of light-emitting elements are disposed on the substrate. The backplane is disposed corresponding to the substrate and has a second coefficient of thermal expansion. The carrier is disposed between the substrate and the backplane and has a third coefficient of thermal expansion. The third coefficient of thermal expansion is between the first coefficient of thermal expansion and the second coefficient of thermal expansion.

[0006] The display device of the present invention can be applied to various types of electronic devices. In order to make the features and advantages of the present invention more obvious and easy to understand, various embodiments are given below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Through the following detailed description with the attached drawings, we can better understand the viewpoints of the embodiments of the present invention. It is worth noting that according to standard practice in the industry, some components (features) may not be drawn according to scale. In fact, in order to clearly discuss, the sizes of different components may be increased or reduced.

[0008] Figure 1 Schematic cross-sectional view of a display device according to some embodiments of the present invention;

[0009] FIG. 2A to FIG. 2D They are respectively schematic top views of the first adhesive layer of some embodiments of the present invention;

[0010] Figure 3 is a schematic top view of a display device according to some embodiments of the present invention;

[0011] Figure 4 is a schematic top view of a backplane of some embodiments of the present invention;

[0012] Figure 5 Schematic cross-sectional view of a display device according to some embodiments of the present invention;

[0013] Figure 6 Schematic cross-sectional view of a display device according to some embodiments of the present invention;

[0014] Figure 7 is a schematic top view of a display device according to some embodiments of the present invention;

[0015] Figure 8 Schematic cross-sectional view of a display device according to some embodiments of the present invention;

[0016] Fig. 9 Schematic cross-sectional view of a display device according to some embodiments of the present invention;

[0017] FIG. 10A to FIG. 10E They are respectively schematic top views of the second adhesive layer in some embodiments of the present invention.

[0018] Explanation of symbols

[0019] 1,2,3,4: Display device

[0020] 10:Substrate

[0021] 12: Light-emitting element

[0022] 14: First adhesive layer

[0023] 16: Second adhesive layer

[0024] 20: Bearing

[0025] 22,34: Holes

[0026] 30: Back panel

[0027] 32: Limiting piece

[0028] 36: Groove

[0029] 38: Air Gap

[0030] 40a, 40b: Connecting piece

[0031] A-A',B-B',C-C',D-D': Line segment

[0032] D1: First direction

[0033] D2: Second direction

[0034] D3: Third direction

[0035] R1: First Area

[0036] R2: Second Area

[0037] R3: The third area

[0038] s1,s2,s3,s4,s5,s5',s6: spacing

[0039] t10: first thickness

[0040] t20: second thickness DETAILED DESCRIPTION

[0041] The following is a detailed description of the display device of each embodiment of the present invention. It should be understood that the following description provides many different embodiments for implementing different aspects of some embodiments of the present invention. The specific elements and arrangements described below are only for simple and clear description of some embodiments of the present invention. Of course, these are only used as examples and are not intended to limit the present invention. In addition, similar and / or corresponding element symbols may be used in different embodiments to indicate similar and / or corresponding elements to clearly describe the present invention. However, the use of these similar and / or corresponding element symbols is only for the simple and clear description of some embodiments of the present invention, and does not represent any correlation between the different embodiments and / or structures discussed.

[0042] It should be understood that relative terms, such as "lower" or "bottom" or "upper" or "top", may be used in various embodiments to describe the relative relationship of one element of the drawings to another element. It is understood that if the device in the drawings is turned upside down, the element described on the "lower" side will become the element on the "upper" side. The embodiments of the present invention may be used in conjunction with the attached drawings. Figure 1 It is also understood that the drawings of the present invention are also considered as part of the disclosure.

[0043] Furthermore, when a first material layer is said to be located on or over a second material layer, it may include a situation where the first material layer is in direct contact with the second material layer, or the first material layer and the second material layer may not be in direct contact, that is, there may be one or more other material layers between the first material layer and the second material layer. However, if the first material layer is directly located on the second material layer, it means that the first material layer and the second material layer are in direct contact.

[0044] In addition, it should be understood that the ordinal numbers used in the specification and claims, such as "first", "second", etc., are used to modify the elements, and they are not intended to imply any previous ordinal numbers of the (or those) elements, nor do they represent the order of one element and another element, or the order of the manufacturing method. The use of these ordinal numbers is only used to make the element with a certain name clearly distinguishable from another element with the same name. The claims and the specification may not use the same words, for example, the first element in the specification may be the second element in the claims.

[0045] In some embodiments of the present invention, terms related to bonding and connection, such as "connect", "interconnect", "bond", etc., unless otherwise defined, may refer to two structures being in direct contact, or may also refer to two structures not being in direct contact, wherein another structure is disposed between the two structures. Such terms related to connection and bonding may also include situations where both structures are movable, or both structures are fixed. In addition, the terms "electrically connected" or "electrically coupled" include any direct and indirect electrical connection means.

[0046] In the text, the terms "approximate", "about", "substantially" usually mean within 10%, or within 5%, or within 3%, or within 2%, or within 1%, or within 0.5% of a given value or range. The number given here is an approximate number, that is, in the absence of a specific description of "about", "approximately", "substantially", the meaning of "about", "approximately", "substantially" can still be implied. The term "range is between a first value and a second value" means that the range includes the first value, the second value and other values ​​between them. Furthermore, any two values ​​or directions used for comparison may have a certain error. If the first value is equal to the second value, it implies that there may be an error of about 10%, or within 5%, or within 3%, or within 2%, or within 1%, or within 0.5% between the first value and the second value. If the first direction is perpendicular to the second direction, the angle between the first direction and the second direction may be between 80 degrees and 100 degrees. If the first direction is parallel to the second direction, the angle between the first direction and the second direction may be between 0 degrees and 10 degrees.

[0047] Certain words are used throughout the specification and claims of the present invention to refer to specific components. It should be understood by those of ordinary skill in the art that electronic equipment manufacturers may refer to the same components by different names. This document does not intend to distinguish between components that have the same function but different names. In the following specification and claims, words such as "comprise", "contain", "have" are open-ended words, and therefore should be interpreted as "including but not limited to..." Therefore, when the terms "comprise", "contain" and / or "have" are used in the description of the present invention, they specify the existence of corresponding parts, areas, steps, operations and / or elements, but do not exclude the existence of one or more corresponding parts, areas, steps, operations and / or elements.

[0048] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings as commonly understood by those of ordinary skill in the art. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and the present invention, and should not be interpreted in an idealized or overly formal manner unless specifically defined in the embodiments of the present invention.

[0049] In the present invention, each direction is not limited to three axes such as the X-axis, Y-axis and Z-axis of the rectangular coordinate system, and can be interpreted in a broader sense. For example, the X-axis, Y-axis and Z-axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other, but are not limited thereto. For ease of explanation, in the following, the X-axis direction is the first direction D1 (width direction), the Y-axis direction is the second direction D2 (length direction), and the Z-axis direction is the third direction D3 (height direction). In some embodiments, the cross-sectional schematic diagram described herein is a cross-sectional schematic diagram for observing the XZ plane or the YZ plane. In some embodiments, the top view schematic diagram described herein is a top view schematic diagram for observing the XY plane.

[0050] It should be understood that according to embodiments of the present invention, an optical microscope (OM), a scanning electron microscope (SEM), an α-step, an ellipsometer, or other suitable methods may be used to measure the depth, thickness, width, or height of each element, or the spacing or distance between elements. According to some embodiments, a scanning electron microscope may be used to obtain a cross-sectional structural image including the element to be measured, and measure the depth, thickness, width, or height of each element, or the spacing or distance between elements.

[0051] It should be understood that according to an embodiment of the present invention, an infrared spectrum analyzer (IR), an energy-dispersive X-ray spectroscopy (EDS), or other suitable methods can be used to perform material analysis and / or element analysis on the component to obtain the composition of the component. Then, the corresponding coefficient of thermal expansion (CTE) of the component can be obtained by looking up the table to obtain the thermal expansion coefficient of the component. The thermal expansion coefficient of the component affects the expansion and contraction degree of the component, such as deformation. When the thermal expansion coefficient of the component is larger, the deformation of the component with temperature is larger, and when the thermal expansion coefficient of the component is smaller, the deformation of the component with temperature is smaller.

[0052] In the present invention, the electronic device may include a display device, a backlight device, an antenna device, a sensing device or a splicing device, but is not limited thereto. The electronic device may be a bendable or flexible electronic device. The display device may be a non-self-luminous display device or a self-luminous display device. The antenna device may be a liquid crystal antenna device or a non-liquid crystal antenna device, and the sensing device may be a sensing device for sensing capacitance, light, heat or ultrasound, but is not limited thereto. The electronic components may include passive components and active components, such as capacitors, resistors, inductors, diodes, transistors, etc. The diode may include a light emitting diode or a photodiode. The light emitting diode may, for example, include an organic light emitting diode (OLED), a sub-millimeter light emitting diode (mini LED), a micro light emitting diode (micro LED) or a quantum dot light emitting diode (quantum dot LED), but is not limited thereto. The splicing device may, for example, be a display splicing device or an antenna splicing device, but is not limited thereto. It should be noted that the electronic device may be any combination of the foregoing, but is not limited thereto. The present invention will be described below using a display device, but the present invention is not limited thereto.

[0053] In addition, the shape of the electronic device can be rectangular, circular, polygonal, with curved edges or other suitable shapes. The electronic device can have peripheral systems such as processing system, driving system, control system, light source system, shelf system, etc. to support the display device or splicing device.

[0054] Reference Figure 1 , which shows a cross-sectional schematic diagram of a display device 1 according to some embodiments of the present invention. It should be understood that for the sake of clarity, some elements of the display device 1 are omitted in the drawings, and some elements are schematically depicted. In some embodiments, additional components may be added to the display device 1 described below. In other embodiments, some components of the display device 1 described below may be replaced or omitted.

[0055] like Figure 1As shown, in some embodiments, the display device 1 includes a substrate 10, a plurality of light-emitting elements 12, a carrier 20 and a backplane 30. In some embodiments, the substrate 10 may include a rigid substrate, a flexible substrate or a combination thereof, but the present invention is not limited thereto. In some embodiments, the material of the substrate 10 may include or may be a wafer, glass, quartz, ceramics, sapphire, plastic, other suitable materials or a combination thereof, but the present invention is not limited thereto. In some embodiments, the material of the substrate 10 may include or may be polycarbonate (PC), polyimide (PI), polypropylene (PP), polyethylene terephthalate (PET), other suitable materials or a combination thereof, but the present invention is not limited thereto. In some embodiments, the substrate 10 may be a single-layer or multi-layer structure. In some embodiments, the substrate 10 may include or may be a light-transmitting substrate, a semi-transmitting substrate or an opaque substrate.

[0056] like Figure 1 As shown, a plurality of light emitting elements 12 may be disposed on the substrate 10. The plurality of light emitting elements 12 may be disposed on the substrate 10 in an array. For example, along the first direction D1 and / or the second direction D2, the plurality of light emitting elements 12 may be arranged at intervals. In the present invention, the light emitting element 12 may include an organic light emitting diode (OLED), a sub-millimeter light emitting diode (mini LED), a micro LED, or a quantum dot light emitting diode (quantumdot LED), but the present invention is not limited thereto.

[0057] like Figure 1As shown, the back plate 30 may be disposed corresponding to the substrate 10. For example, in the normal direction along the substrate 10 (i.e., the third direction D3), the back plate 30 may be disposed below the substrate 10, that is, the substrate 10 may be disposed between the light emitting element 12 and the back plate 30. In some embodiments, the back plate 30 may include a metal, an alloy, or a combination thereof, but the present invention is not limited thereto. For example, the metal may include copper (Cu), aluminum (Al), molybdenum (Mo), silver (Ag), tin (Sn), tungsten (W), gold (Au), chromium (Cr), nickel (Ni), platinum (Pt), other suitable metals, the like, or a combination thereof, but the present invention is not limited thereto. For example, the alloy may include a magnesium alloy, an aluminum alloy, a magnesium-aluminum alloy, other suitable alloys, the like, or a combination thereof, but the present invention is not limited thereto. The back plate 30 may be formed by a pressure casting, a stamping process, other suitable processes, similar processes, or a combination thereof, but the present invention is not limited thereto.

[0058] The display device 1 further includes a carrier 20. The configuration of the carrier 20 can reduce or prevent the risk of damage (such as cracking) of the substrate 10 during operation of the display device 1, thereby improving the reliability of the display device 1. Figure 1 As shown, in the normal direction of the substrate 10, the carrier 20 may be disposed below the substrate 10 so that the carrier 20 is disposed between the substrate 10 and the back plate 30. For example, the carrier 20 may resist or block the external force from the back plate 30, thereby protecting the substrate 10 from damage. In some embodiments, multiple temperature cycle tests (e.g., 80 cycles, but not limited thereto) may be performed under a temperature condition of about -40 degrees Celsius to 90 degrees Celsius to check the damage risk of the substrate 10.

[0059] In some embodiments, the carrier 20 may include a metal, an alloy, or a combination thereof, but the invention is not limited thereto. For example, the metal may include iron (Fe), carbon (C), chromium (Cr), nickel (Ni), titanium (Ti), manganese (Mn), aluminum (Al), molybdenum (Mo), other suitable metals, the like, or a combination thereof, but the invention is not limited thereto. For example, the alloy may include stainless steel, invar (also known as nickel steel alloy), other suitable alloys, the like, or a combination thereof, but the invention is not limited thereto. In some embodiments, the carrier 20 may be formed by a stamping process, other suitable manufacturing processes, the like, or a combination thereof, but the invention is not limited thereto.

[0060] Objects composed of different materials or elements (such as substrate 10, carrier 20, back plate 30) have different thermal expansion coefficients, and therefore the degree of deformation in the same environment (for example, corresponding to the same high or low temperature conditions) is different. In some embodiments, by selecting substrate 10, carrier 20, and back plate 30 with suitable material composition, the risk of damage to substrate 10 can be reduced. For example, the thermal expansion coefficient CTE of substrate 10 can be selected. 10 The coefficient of thermal expansion CTE of the carrier 20 20 The display device 1 is made of materials with a small difference. In some embodiments, the thermal expansion coefficient CTE of the carrier 20 is 20 The thermal expansion coefficient CTE of the substrate 10 10 The difference (CTE 20 -CTE 10 ) can be less than or equal to 7×10 -6 K - 1 and greater than or equal to 0K-1. For example, the coefficient of thermal expansion CTE 10 Coefficient of thermal expansion CTE 20 The difference can be 7×10 -6 K -1 , 6×10 -6 K -1 , 5×10 -6 K -1 , 4×10 -6 K -1 , 3×10 -6 K -1 , 2×10 -6 K -1 , 1×10 -6 K -1 ,0K -1 Or any value between the aforementioned values ​​or a numerical range consisting of any values, but the present invention is not limited thereto. For example, the carrier 20 can be made of stainless steel.

[0061] Accordingly, when the thermal expansion coefficient CTE of the substrate 10 is 10 The coefficient of thermal expansion CTE of the carrier 20 20 When approaching, the deformation of the substrate 10 and the carrier 20 are close, so that the deformation difference between the substrate 10 and the components adjacent to the substrate 10 is too large to cause the substrate 10 to break. Therefore, the risk of damage to the substrate 10 can be reduced by the carrier 20.

[0062] In some embodiments, the coefficient of thermal expansion CTE of the carrier 20 is 20 The thermal expansion coefficient CTE of the substrate 10 may be 10 The thermal expansion coefficient CTE of the back plate 30 30For example, compared with the direct contact between the substrate 10 and the back plate 30, the thermal expansion coefficient CTE between 10 Coefficient of thermal expansion CTE 30 The coefficient of thermal expansion CTE 20 The carrier 20 can be used as an intermediate material. Thus, the carrier 20 disposed between the substrate 10 and the back plate 30 can prevent the substrate 10 from breaking due to a large difference in deformation between the substrate 10 and the components adjacent to the substrate 10. In some embodiments, the coefficient of thermal expansion CTE 10 Coefficient of thermal expansion CTE 20 The absolute value of the difference is less than or equal to the coefficient of thermal expansion CTE 20 Coefficient of thermal expansion CTE 30 The absolute value of the difference (i.e., |CTE 10 -CTE 20 |≤|CTE 20 -CTE 30 |). By improving the matching degree between the substrate 10 and the carrier 20, the substrate 10 and the carrier 20 can better resist or block the external force from the back plate 30, thereby reducing the risk of damage to the substrate 10. In some embodiments, the thermal expansion coefficient CTE of the carrier 20 is 20 The coefficient of thermal expansion CTE of the substrate 10 may be greater than or equal to 10 and may be less than or equal to the coefficient of thermal expansion CTE of the back plate 30 30 For example, the carrier 20 may include stainless steel.

[0063] In some embodiments, the carrier 20 may have a low coefficient of thermal expansion, so that the carrier 20 does not substantially deform with temperature, or reduces the degree of deformation caused by temperature changes. Accordingly, the carrier 20 can block the influence of different deformations of the substrate 10 and the back plate 30. In some embodiments, the carrier 20 may have, for example, the lowest coefficient of thermal expansion, and the coefficient of thermal expansion CTE 10 Coefficient of thermal expansion CTE 20 The absolute value of the difference is less than or equal to the coefficient of thermal expansion CTE 20 Coefficient of thermal expansion CTE 30 The absolute value of the difference (i.e., |CTE 10 -CTE 20 |≤|CTE 20 -CTE 30 In some embodiments, the coefficient of thermal expansion CTE of the carrier 20 is 20 Can be less than or equal to 4.5×10 -6 K -1 For example, the coefficient of thermal expansion CTE of the carrier 20 is 20Can be less than or equal to 4.5×10 -6 K -1 , 4.3×10 -6 K -1 , 4×10 -6 K -1 , 3.5×10 -6 K -1 , 3×10 -6 K -1 , 2.5×10 -6 K -1 , 2×10 -6 K -1 , 1.5×10 -6 K -1 , 1×10 -6 K -1 , 5×10 -7 K -1 , or any value between the aforementioned values ​​or a numerical range consisting of any values, but the present invention is not limited thereto. When the deformation of the carrier 20 disposed between the substrate 10 and the back plate 30 is low, the substrate 10 can be prevented from being affected by the deformation of the back plate 30, and the risk of damage to the substrate 10 can be reduced by the carrier 20. In other embodiments, the carrier 20 may include a material that does not substantially deform with temperature. For example, the carrier 20 may include Invar alloy.

[0064] In some embodiments, the strength of the carrier 20 may be greater than the strength of the substrate 10, so that the strength of the carrier 20 is sufficient to replace the substrate 10 to resist the deformation of the back plate 30. The strength may be compressive strength, tensile strength, yield strength, bending strength, or strength defined in other ways, but the present invention is not limited thereto. For example, the carrier 20 may include stainless steel.

[0065] like Figure 1As shown, in the normal direction of the substrate 10, the substrate 10 has a first thickness t10, and the carrier 20 has a second thickness t20. When the display device 1 is a flat display device, since the deformation amount (single-dimensional deformation amount) of the substrate 10 and the carrier 20 is relatively low, the first thickness t10 of the substrate 10 and the second thickness t20 of the carrier 20 can be adjusted according to the use requirements. When the display device 1 is a curved display device, since the deformation amount (multi-dimensional deformation amount) of the substrate 10 and the carrier 20 is relatively high, the ratio of the second thickness t20 of the carrier 20 to the first thickness t10 of the substrate 10 (second thickness t20 / first thickness t10) can be less than or equal to 2. For example, the ratio of the second thickness t20 to the first thickness t10 may be 2, 1.9, 1.8, 1.7, 1.6, 1.5, 1.4, 1.3, 1.2, 1.1, 1, 0.9, 0.8, 0.7, 0.6, 0.5, 0.4, 0.33, 0.3, 0.2, 0.1, or any value between the aforementioned values ​​or a numerical range consisting of any values, but the present invention is not limited thereto. In some embodiments, when the second thickness t20 of the carrier 20 is too small, the carrier 20 is difficult to effectively block the deformation of the substrate 10 and the back plate 30, and when the second thickness t20 of the carrier 20 is too large, the carrier 20 is not easy to be applied to a display device with a curved surface.

[0066] In some embodiments, a plurality of light-emitting elements 12 may be formed on the substrate 10 first. Then, a first bonding process is performed to bond the substrate 10 to the carrier 20 through a first bonding member, so that the substrate 10 is disposed between the light-emitting elements 12 and the carrier 20. Then, a second bonding process is performed to bond the carrier 20 to the back plate 30 through a second bonding member, so that the carrier 20 is disposed between the substrate 10 and the back plate 30. Accordingly, since the carrier 20 is disposed between the substrate 10 and the back plate 30, the manufacturing process margin of performing the first bonding process and the second bonding process can be improved, so that the bonding method of the substrate 10 and the back plate 30 is more flexible.

[0067] For example, the first bonding process and / or the second bonding process may use a chemical bonding method, a physical bonding method or a combination thereof, but the present invention is not limited thereto. For example, the first bonding member and / or the second bonding member may include an adhesive layer, a screw, buckles, a slot, other suitable bonding members, the like or a combination thereof, but the present invention is not limited thereto. Thus, the carrier 20 can enhance the wide selection of the first bonding member and the second bonding member.

[0068] like Figure 1As shown, in some embodiments, the display device 1 further includes a first adhesive layer 14. In some embodiments, the first adhesive layer 14 is disposed between the substrate 10 and the carrier 20. In some embodiments, the first adhesive layer 14 can be used as a first bonding member to connect the substrate 10 and the carrier 20. In some embodiments, the first adhesive layer 14 can include an organic material or an inorganic material. In some embodiments, the first adhesive layer 14 can include solid glue, liquid glue, other suitable adhesive materials, the like or a combination thereof, but the present invention is not limited thereto. For example, the solid glue can include a double sided tape with a substrate (with base material) or a double sided tape without a substrate (without base material), and the substrate can be polyethylene terephthalate (poly (ethyl benzene-1,4-dicarboxylate) PET), a composite material, other suitable substrates, the like or a combination thereof, but the present invention is not limited thereto. For example, the liquid adhesive may include pressure sensitive adhesives (PSA), silicon-based adhesives such as epoxy resins, other suitable liquid adhesive materials, the like, or a combination thereof, but the present invention is not limited thereto. In other embodiments, the first adhesive layer 14 may be replaced or partially replaced (i.e., used in combination) by screws, buckles, slots, other suitable joints, or the like. In some embodiments, the first adhesive layer 14 may be formed by spin coating, dispensing, pasting, other suitable methods, or a combination thereof.

[0069] like Figure 1 As shown, in the first direction D1, the edge of the substrate 10 is spaced apart from the edge of the back plate 30 by a spacing s1, the edge of the first adhesive layer 14 is spaced apart from the edge of the back plate 30 by a spacing s2, and the edge of the carrier 20 is spaced apart from the edge of the back plate 30 by a spacing s3. The area of ​​the carrier 20 may be larger than the area of ​​the substrate 10, so that the spacing s3 may be smaller than the spacing s1. Therefore, it is beneficial to assemble the carrier 20 with the substrate 10, thereby reducing the risk of damage to the substrate 10, improving the bonding margin between the carrier 20 and the substrate 10, and / or improving the reliability of the display device 1. In some embodiments, the area of ​​the carrier 20 may be smaller than the area of ​​the back plate 30. In some embodiments, the area of ​​the first adhesive layer 14 may be smaller than the area of ​​the substrate 10, so that the spacing s2 may be larger than the spacing s1.

[0070] Reference FIG. 2A to FIG. 2D , which respectively show the top views of the first adhesive layer 14 and the carrier 20 according to some embodiments of the present invention. For the convenience of explanation, FIG. 2A to FIG. 2DOnly the first adhesive layer 14 and the carrier 20 are shown, and other components are omitted. FIG. 2A to FIG. 2D One or more of the first adhesive layers 14 shown in the drawings may be used in combination with any display device (eg, display device 1 and / or display devices 2, 3, and / or 4 described below). Figure 2A As shown, the first adhesive layer 14 is disposed in a block shape on the carrier 20. Figure 2B and Figure 2C As shown, the first adhesive layer 14 is disposed on the carrier 20 in a strip shape. For example, the first adhesive layer 14 may extend along the first direction D1 and be arranged at intervals along the second direction D2. Alternatively, the first adhesive layer 14 may extend along the second direction D2 and be arranged at intervals along the first direction D1. Figure 2D As shown, the first adhesive layer 14 can be disposed on the carrier 20 in any shape. For example, the first adhesive layer 14 can be linear, curved, annular, wavy, other suitable shapes, similar shapes or combinations thereof.

[0071] Reference Figure 3 , which shows a schematic top view of a display device 2 according to some embodiments of the present invention. Figure 3 The cross-sectional view taken by the line segment A-A' shown is similar to Figure 1 The cross-sectional view shown is as follows Figure 3 The cross-sectional view taken along the line segment BB' is shown in Figure 5 In, and along Figure 3 The cross-sectional view taken along the line segment CC' is shown in Figure 6 In. Figure 3 As shown, in the normal direction of the substrate 10 , the carrier 20 may be disposed on the back plate 30 , the substrate 10 may be disposed on the carrier 20 , and a plurality of light emitting elements 12 may be disposed on the substrate 10 .

[0072] Figure 4 A schematic top view of a back plate 30 according to some embodiments of the present invention is shown. Figure 4 As shown, the back plate 30 may include a first region R1 overlapping with the substrate 10 in the third direction D3, a second region R2 overlapping with the carrier 20 and not overlapping with the substrate 10 in the third direction D3, and a remaining third region R3. In some embodiments, the back plate 30 may further include a stopper 32, a hole 34 and / or a groove 36, and the stopper 32, the hole 34 and / or the groove 36 are described with reference to the following figures.

[0073] Figure 5 A cross-sectional schematic diagram of a display device 2 according to some embodiments of the present invention is shown. Figure 3 , Figure 4 and Figure 5As shown, the back plate 30 may further include a stopper 32 disposed on the back plate 30 to correspond to the carrier 20. The stopper 32 may be disposed in the second region R2 of the back plate 30 (eg, Figure 3 , Figure 4 and Figure 5 As shown) or disposed at least partially around the second region R2, so that the alignment accuracy can be improved when the back plate 30 and the carrier 20 are assembled. In some embodiments, the stopper 32 may be a convex block, and the stopper 32 may have a cylindrical shape, an angular column shape, a rectangular column shape, other suitable shapes or a combination thereof, but the present invention is not limited thereto. In some embodiments, the carrier 20 may have a hole 22 corresponding to the stopper 32, so that the stopper 32 can pass through the carrier 20 through the hole 22 to connect the back plate 30 and the carrier 20, reducing the problem of sliding and alignment difficulties of the back plate 30 and the carrier 20. In some embodiments, in the first direction D1, the stopper 32 is spaced apart from the edge of the substrate 10 by a spacing s4 to avoid damaging the substrate 10 during the process of setting the stopper 32. For example, compared with damaging the substrate 10 by setting a hole on the substrate 10, setting a hole 22 on the carrier 20 can reduce the risk of damage to the substrate 10.

[0074] Figure 6 A cross-sectional schematic diagram of a display device 2 according to some embodiments of the present invention is shown. Figure 3 , Figure 4 and Figure 6 As shown, the display device 2 may further include a connector 40a, and the back plate 30 may further include a hole 34 disposed in the second region R2, so that the hole 34 of the back plate 30 corresponds to the connector 40a, thereby connecting the back plate 30 and the carrier 20. In some embodiments, the connector 40a may be a screw to provide fixation in a two-dimensional direction. In some embodiments, in the second direction D2, the connector 40a is spaced apart from the edge of the substrate 10 by a spacing s5 to avoid damaging the substrate 10 during the process of setting the connector 40a or avoiding the connector 40a covering the light-emitting element 12. In some embodiments, the back plate 30 may further include a groove 36 disposed in the first region R1, and the groove 36 may serve as a reinforcing rib of the back plate 30. In some embodiments, the display device 2 may include an air gap 38 disposed in the groove 36, and the air gap 38 is between the back plate 30 and the carrier 20. In some embodiments, at least one of the plurality of light-emitting elements 12 may overlap the air gap 38.

[0075] Reference Figure 7 , which shows a schematic top view of a display device 3 according to some embodiments of the present invention. Figure 7 The cross-sectional view taken along the line segment D-D' is shown in Figure 8 In. Reference Figure 8, which shows a cross-sectional schematic diagram of a display device 3 according to some embodiments of the present invention. In some embodiments, the display device 3 may further include a connector 40b to connect the back plate 30 and the carrier 20. In some embodiments, the connector 40b may serve as a second joint. The connector 40b may be disposed on the carrier 20 and cover the side surface and the top surface of the carrier 20. In some embodiments, the connector 40b may include a buckle. In some embodiments, the connector 40b and the back plate 30 may be formed as an integral whole, so that the back plate 30 and the carrier 20 are connected by the curved portion of the back plate 30 (that is, the connector 40b) to provide fixation in a three-dimensional direction. In some embodiments, in the second direction D2, the connector 40b is spaced apart from the edge of the substrate 10 by a spacing s5' to avoid damaging the substrate 10 during the process of setting the connector 40b or avoiding the connector 40b covering the light-emitting element 12. In some embodiments, the display device 3 may include a stopper 32, a connector 40a, a connector 40b, or a combination thereof, but the present invention is not limited thereto. For example, a connecting member 40 a may be disposed at a corner of the back plate 30 , and a limiting member 32 and a connecting member 40 b may be disposed on a side of the back plate 30 .

[0076] Fig. 9 A cross-sectional schematic diagram of a display device 4 according to some embodiments of the present invention is shown. In some embodiments, the display device 4 also includes a second adhesive layer 16. In some embodiments, the second adhesive layer 16 is disposed between the carrier 20 and the back plate 30. In some embodiments, the second adhesive layer 16 can be used as a second bonding member. The second adhesive layer 16 can be replaced or partially replaced (that is, used in combination) by screws, buckles, slots, other suitable bonding members or the like to connect the carrier 20 and the back plate 30. In some embodiments, the material and formation method of the second adhesive layer 16 may be the same or different from the material and formation method of the first adhesive layer 14, so it is not repeated here. In some embodiments, the edge of the second adhesive layer 16 is spaced apart from the edge of the back plate 30 by a spacing s6. The area of ​​the second adhesive layer 16 may be smaller than the area of ​​the carrier 20, so that the spacing s6 may be greater than the spacing s3.

[0077] FIG. 10A to FIG. 10E Schematic top views of the second adhesive layer 16 and the back plate 30 according to some embodiments of the present invention are shown respectively. For ease of description, FIG. 10A to FIG. 10E Only the second adhesive layer 16 and the back plate 30 are shown, and other components are omitted. FIG. 10A to FIG. 10E One or more of the second adhesive layers 16 shown in FIG. 1 may be used in conjunction with any display device (eg, display devices 1 , 2 , 3 , and / or 4 ). FIG. 10A to FIG. 10E The second adhesive layer 16 shown in FIG. FIG. 2A to FIG. 2D The second adhesive layer 16 may be, for example, in block form ( Fig. 10A ), strips( Fig. 10B , Fig. 10C ), array-wise ( Fig. 10D ) or any shape ( Fig. 10E ) is disposed on the back plate 30. In some embodiments, the second adhesive layer 16 may be spaced apart from the groove 36 by a distance.

[0078] In summary, according to an embodiment of the present invention, a display device is provided, and by a carrier disposed between a substrate and a backplane, the risk of damage to the substrate is reduced, thereby improving the reliability of the display device. In detail, the risk of damage to the substrate is reduced by adjusting the thermal expansion coefficient of the carrier, the relationship between the thermal expansion coefficient of the carrier and other elements, and / or the strength of the carrier. Furthermore, since the carrier is disposed between the substrate and the backplane, the wide range of choices of the first bonding member (e.g., the first adhesive layer 14) between the substrate and the carrier and the second bonding member (e.g., the second adhesive layer 16, the connector 40a, the connector 40b) between the carrier and the backplane can be improved.

[0079] The features between the embodiments of the present invention can be mixed and matched as long as they do not violate the spirit of the invention or conflict with each other. In addition, the scope of protection of the present invention is not limited to the manufacturing process, machine, manufacture, material composition, device, method and steps in the specific embodiment described in the specification. Any ordinary technician in the relevant technical field can understand the current or future developed manufacturing process, machine, manufacture, material composition, device, method and steps from the disclosure of the present invention. As long as substantially the same function can be implemented in the embodiments described herein or substantially the same results can be obtained, they can be used according to the present invention. Therefore, the scope of protection of the present invention includes the above-mentioned manufacturing process, machine, manufacture, material composition, device, method and steps. The scope of protection of the present invention shall be determined by the scope of the claims. Any embodiment or claim of the present invention is not required to achieve all the purposes, advantages and / or features disclosed by the present invention.

[0080] Several embodiments are summarized above so that those skilled in the art can better understand the concepts of the embodiments of the present invention. Those skilled in the art should understand that they can design or modify other manufacturing processes and structures based on the embodiments of the present invention to achieve the same purposes and / or advantages as the embodiments introduced herein. Those skilled in the art should also understand that such equivalent manufacturing processes and structures do not deviate from the spirit and scope of the present invention, and they can make various changes, substitutions and replacements without violating the spirit and scope of the present invention.

Claims

1. A display device, include: a substrate having a first coefficient of thermal expansion; A plurality of light emitting elements are disposed on the substrate; A back plate, arranged corresponding to the substrate and having a second thermal expansion coefficient; and A carrier, disposed between the substrate and the back plate, and having a third thermal expansion coefficient; The absolute value of the difference between the third thermal expansion coefficient and the first thermal expansion coefficient is less than or equal to the absolute value of the difference between the third thermal expansion coefficient and the second thermal expansion coefficient.

2. The display device according to claim 1, further comprising: include: The first adhesive layer is disposed between the substrate and the carrier.

3. The display device as claimed in claim 1, wherein the difference between the third thermal expansion coefficient and the first thermal expansion coefficient is less than or equal to 7×10 -6 K -1 And greater than or equal to 0K -1 .

4. The display device as claimed in claim 1, wherein the third thermal expansion coefficient of the carrier is less than or equal to 4.5×10 -6 K -1 . 5 . The display device as claimed in claim 1 , wherein the substrate has a first thickness, the carrier has a second thickness, and a ratio of the second thickness to the first thickness is less than or equal to 2. 6 . The display device as claimed in claim 1 , wherein an area of ​​the carrier is larger than an area of ​​the substrate.

7. A display device, include: a substrate having a first coefficient of thermal expansion; A plurality of light emitting elements are disposed on the substrate; A back plate, arranged corresponding to the substrate and having a second thermal expansion coefficient; The carrier is disposed between the substrate and the back plate and has a third thermal expansion coefficient. The third thermal expansion coefficient is between the first thermal expansion coefficient and the second thermal expansion coefficient.

8. The display device as claimed in claim 7, wherein the difference between the first thermal expansion coefficient and the third thermal expansion coefficient is less than or equal to 7×10 -6 K -1 And greater than or equal to 0K -1 . 9 . The display device as claimed in claim 7 , wherein an absolute value of a difference between the third coefficient of thermal expansion and the first coefficient of thermal expansion is less than or equal to an absolute value of a difference between the third coefficient of thermal expansion and the second coefficient of thermal expansion. 10 . The display device as claimed in claim 7 , wherein the substrate has a first thickness, the carrier has a second thickness, and a ratio of the second thickness to the first thickness is less than or equal to 2.

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