An image acquisition device and detection system

Abstract

The application relates to the technical field of machine vision, and provides an image acquisition device and a detection system, the image acquisition device comprising: an image acquisition unit. The image acquisition unit comprises a shell, a circuit board and an image acquisition device, the shell has a containing cavity, and the shell wall of the shell has an acquisition area; the image acquisition device and the circuit board are located in the containing cavity, the acquisition end of the image acquisition device faces the acquisition area, and the acquisition end of the image acquisition device extends along the length direction of the image acquisition unit. A light module is arranged on the circuit board, the light module and the image acquisition device are electrically connected, and signals are transmitted. Through the arrangement, the width of the image acquisition device can be improved, and the signal transmission rate of the image acquisition device can also be improved.

Description

Technical Field

[0001] This application relates to the field of machine vision technology, and in particular to an image acquisition device and detection system. Background Technology

[0002] Wide-field industrial cameras (Contact Image Sensors, CIS) have a large imaging field of view and resolution, and are increasingly being used in real-time inspection systems in various industrial fields.

[0003] As the detection field of view increases, increasing the width of the individual CIS unit can meet the requirements of the detection field of view. At the same time, this also places higher demands on the signal transmission of the CIS unit. Therefore, there is an urgent need to design a CIS that can improve the transmission rate. Summary of the Invention

[0004] This application provides an image acquisition device and a detection system that can improve signal transmission rate.

[0005] To achieve the above objectives, this application adopts the following technical solution:

[0006] This application provides an image acquisition device, including:

[0007] An image acquisition unit includes a housing, a circuit board, and an image acquisition device. The housing has a receiving cavity, and the housing wall has a acquisition area. The image acquisition device and the circuit board are both located within the receiving cavity. The acquisition end of the image acquisition device faces the acquisition area and extends along the length of the image acquisition unit.

[0008] An optical module is installed on the circuit board. The optical module and the image acquisition device are electrically connected and transmit signals.

[0009] As one possible implementation, there are at least two optical modules on the circuit board, and the at least two optical modules are arranged sequentially along the length of the image acquisition unit.

[0010] In one possible implementation, each circuit board is equipped with a controller and a signal receiver;

[0011] The image acquisition device, the signal receiver, the controller, and the optical module are electrically connected in sequence.

[0012] In one possible implementation, there are multiple signal receivers on the circuit board, and the multiple signal receivers are arranged in an array on the circuit board;

[0013] Each of the signal receivers is electrically connected to the controller, and at least some of the signal receivers are electrically connected to the image acquisition unit.

[0014] As one possible implementation, there are at least two circuit boards, which are arranged sequentially along the length of the image acquisition unit, and adjacent circuit boards are electrically connected.

[0015] The image acquisition device and at least a portion of the circuit boards are electrically connected.

[0016] As one possible implementation, there are at least two image acquisition devices, and the at least two image acquisition devices are arranged sequentially along the length of the image acquisition unit;

[0017] The image acquisition device and the circuit board are configured in a one-to-one correspondence and electrically connected.

[0018] In one possible implementation, there are multiple image acquisition units, and the multiple image acquisition units are arranged in an array;

[0019] The circuit boards of adjacent image acquisition units are electrically connected;

[0020] The acquisition ends of the image acquisition devices in each of the aforementioned image acquisition units are oriented in the same direction.

[0021] As one possible implementation, the image acquisition unit further includes an illumination assembly located within the accommodating cavity, and the illumination assembly is electrically connected to the circuit board;

[0022] The lighting component is configured to illuminate the acquisition area.

[0023] In one possible implementation, the housing includes a top cover, a body, and a baffle, the top cover covering one side of the body, and the baffle being detachably connected to the end of the body along the length of the image acquisition unit;

[0024] The upper cover, the main body, and the baffle together form the accommodating cavity;

[0025] The collection area is located on the side of the main body away from the top cover.

[0026] As one possible implementation, a heat-conducting element is provided on the upper cover, the heat-conducting element is located on the side of the upper cover away from the body, and the heat-conducting element and the accommodating cavity are thermally connected.

[0027] As one possible implementation, the image acquisition unit further includes a fan assembly disposed on the side of the upper cover away from the main body, the fan assembly being configured to dissipate heat from the upper cover.

[0028] The image acquisition device provided in this application has its image acquisition unit and circuit board housed within a cavity of a casing. The casing wall protects the image acquisition unit and circuit board, enhancing the device's safety and extending its lifespan. The acquisition end of the image acquisition unit extends along its length, providing a wider field of view. The image acquisition unit and circuit board are electrically connected, forming an information transmission path for the acquired image. An optical module is mounted on the circuit board for signal transmission, improving the signal transmission rate of the image acquisition device. Thus, this image acquisition device can meet various width requirements and achieve faster and better signal transmission.

[0029] Secondly, this application provides a detection system, including a terminal and the image acquisition device described in the first aspect, wherein the terminal and the image acquisition device are electrically connected.

[0030] The detection system provided in this application, by including the image acquisition device in the aforementioned embodiments, can improve the signal transmission rate. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 Schematic diagram of the image acquisition device provided in the embodiments of this application Figure 1 ;

[0033] Figure 2 A top view of the circuit board in the image acquisition device provided in the embodiments of this application;

[0034] Figure 3 Schematic diagram of the image acquisition device provided in the embodiments of this application Figure 2 ;

[0035] Figure 4 The circuit diagram of the image acquisition device provided in the embodiments of this application is shown.

[0036] Explanation of reference numerals in the attached figures:

[0037] 100 - Image acquisition equipment;

[0038] 200 - Image acquisition unit;

[0039] 210 - Housing; 211 - Top cover; 212 - Body; 213 - Baffle; 214 - Heat-conducting component; 215 - Fan assembly;

[0040] 220 - Circuit board;

[0041] 221-Connector; 222-Controller; 223-Signal Receiver; 224-Optical Module; 225-Output Terminal;

[0042] 230 - Image Acquisition Device. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0044] Wide-field industrial cameras (Contact Image Sensors, CIS) have a large imaging field of view and resolution, and are increasingly being used in real-time inspection systems in various industrial fields.

[0045] As the detection field of view increases, increasing the width of the individual CIS unit can meet the requirements of the detection field of view. At the same time, this also places higher demands on the signal transmission of the CIS unit. Therefore, there is an urgent need to design a CIS that can improve the transmission rate.

[0046] To overcome the shortcomings of existing technologies, this application provides an image acquisition device and a detection system. The image acquisition device includes an image acquisition unit, which comprises a housing, a circuit board, and an image acquisition unit. The housing has a cavity, within which the circuit board and the image acquisition unit are located. The housing wall has an acquisition area, and the acquisition end of the image acquisition unit faces this acquisition area. The acquisition end of the image acquisition unit extends along its length, increasing the field of view of the image acquisition unit. An optical module is mounted on the circuit board, electrically connected to the image acquisition unit and transmitting signals. This structural arrangement improves both the field of view of the image acquisition device and the signal transmission rate.

[0047] The contents of this application will now be described in detail with reference to the accompanying drawings, so that those skilled in the art can have a clearer and more detailed understanding of the contents of this application.

[0048] Figure 1 Schematic diagram of the image acquisition device provided in the embodiments of this application Figure 1 . Figure 2 This is a top view of the circuit board in the image acquisition device provided in an embodiment of this application. Figure 3 Schematic diagram of the image acquisition device provided in the embodiments of this application Figure 2 . Figure 4 The circuit diagram of the image acquisition device provided in the embodiments of this application is shown.

[0049] like Figures 1-4 As shown, this application provides an image acquisition device 100, including an image acquisition unit 200. It should be noted that the image acquisition unit 200 in this application can be a CIS unit, and the acquisition end of the image acquisition unit 200 can acquire an image of the object to be acquired.

[0050] The image acquisition unit 200 includes a housing 210, a circuit board 220, and an image acquisition device 230. The housing 210 has a receiving cavity, and the housing wall of the housing 210 has a acquisition area. The image acquisition device 230 and the circuit board 220 are both located in the receiving cavity. The acquisition end of the image acquisition device 230 faces the acquisition area and extends along the length direction of the image acquisition unit 200.

[0051] The circuit board 220 is equipped with an optical module 224, which is electrically connected to the image acquisition unit 230 and transmits signals.

[0052] According to the image acquisition device 100 provided in this application embodiment, the image acquisition unit 230 and the circuit board 220 are located within the accommodating cavity of the housing 210, so that the housing wall of the housing 210 provides protection for the image acquisition unit 230 and the circuit board 220, thereby improving the safety of the image acquisition device 100 and extending its service life. The acquisition end of the image acquisition unit 230 extends along the length direction of the image acquisition unit 200, so that the image acquisition device 100 has a large field of view. The image acquisition unit 230 and the circuit board 220 are electrically connected to form an information transmission path for the acquired image between the image acquisition unit 230 and the circuit board 220. An optical module 224 is provided on the circuit board 220, and signal transmission is performed through the optical module 224, thereby improving the signal transmission rate of the image acquisition device 100. Thus, the signal transmission rate is improved while simultaneously increasing the field of view of the image acquisition device 100.

[0053] The specific structure of the image acquisition device 100 and various possible implementation methods are described in detail below.

[0054] For example, the housing 210 in this embodiment can be a cylindrical housing 210. The cross-section of the cylindrical housing 210 can be circular, square, or polygonal, etc., and this part does not make specific requirements. The shell wall of the housing 210 can have a light-transmitting or transparent part, which forms a sampling area. The acquisition end of the image acquisition device 230 samples through this sampling area to obtain image signals. Of course, the shell wall of the housing 210 can have an opening, which forms a sampling area. The acquisition end of the image acquisition device 230 samples through this sampling area to obtain image sampling information.

[0055] The acquisition end of the image acquisition device 230 extends along the length of the image acquisition unit 200. The width of the image acquisition device 230 varies with the length of extension. Thus, the image acquisition device 100 has different widths to adapt to different detection needs and improve the applicability of the image acquisition device 100.

[0056] Furthermore, after the image acquisition device 230 acquires the image signal, it needs to transmit it to the terminal, so that the staff can analyze the image signal received by the terminal.

[0057] Specifically, the image acquisition unit 200 also includes a circuit board 220, which is located in the accommodating cavity of the housing 210. The accommodating cavity of the housing 210 protects the circuit board 220, preventing dust and other impurities from affecting the operation of the circuit board 220 and improving the working stability and safety of the image acquisition device 100.

[0058] The circuit board 220 is equipped with an optical module 224, which is electrically connected to the image acquisition unit 230 and transmits signals.

[0059] In the specific implementation process, the circuit board 220 is also provided with an output terminal 225, which is electrically connected to the optical module 224. By setting the optical module 224, the image signal acquired from the image acquisition unit 230 is converted into an optical signal, and then output through the output terminal 225, thereby improving the signal transmission rate.

[0060] For example, optical module 224 can be an SPF+ optical port (Small Form-factor Pluggables, SPF+). The output bandwidth of a single optical module 224 can reach 10Gbps.

[0061] When the width of the image acquisition unit 230 is relatively large, in order to further improve the signal transmission rate, there are at least two optical modules 224 on the circuit board 220, and at least two optical modules 224 are arranged sequentially along the length of the image acquisition unit 200.

[0062] In some implementations, there are two optical modules 224, each electrically connected to the image acquisition unit 230. Each optical module 224 corresponds to an output terminal 225. Both optical modules 224 can transmit signals to the terminal simultaneously through the output terminal 225, or only one of them can transmit signals to the terminal. This allows for the distribution of output bandwidths from image acquisition units 230 with varying widths.

[0063] Understandably, when there are three or more optical modules 224, the three or more optical modules 224 are electrically connected to the image acquisition unit 230 respectively, and each optical module 224 corresponds to an output terminal 225. The three or more optical modules 224 can transmit signals to the terminal simultaneously through the output terminal 225, or they can transmit signals to the terminal through only one or a portion of the optical modules 224. This can meet the output bandwidth of the image acquisition unit 230 with different widths.

[0064] For example, each circuit board 220 is equipped with a controller 222 and a signal receiver 223; the image acquisition unit 230, the signal receiver 223, the controller 222, and the optical module 224 are electrically connected in sequence. In this way, the image acquisition unit 230 transmits the acquired image signal to the controller 222 through the signal receiver 223, and then transmits the signal to the terminal through the optical module 224.

[0065] It should be noted that a high-speed communication channel can be established between the optical module 224 and the terminal, further improving the signal transmission rate and stability. This communication channel can be adapted to different standard communication protocols.

[0066] In some implementations, the signal receiver 223 may be a low-voltage differential signaling (LVDS) receiver. The timing of the LVDS receiver is precise, which enables the effective and accurate transmission of the signal, thereby improving the transmission accuracy and transmission rate of the acquired image signal and further improving the overall transmission rate of the image acquisition device 100.

[0067] Possibly, there are multiple signal receivers 223 on the circuit board 220, and the multiple signal receivers 223 are arranged in an array on the circuit board 220; each signal receiver 223 is electrically connected to the controller 222, and at least some of the signal receivers 223 are electrically connected to the image acquisition unit 230.

[0068] Understandably, the acquisition end of the image acquisition unit 230 extends along the length of the image acquisition unit 200. As the width of the image acquisition unit 230 increases, the more image signals the image acquisition unit 230 acquires, the more signal receivers 223 are needed to complete the signal reception.

[0069] Meanwhile, when there are multiple signal receivers 223 on the circuit board 220, such a circuit board 220 can be compatible with image acquisition devices 230 with smaller widths, which helps in the flexible design of the image acquisition device 100. The multiple signal receivers 223 are arrayed on the circuit board 220, which facilitates the modular design of the circuit board 220.

[0070] Possibly, there are at least two circuit boards 220, and at least two circuit boards 220 are arranged sequentially along the length of the image acquisition unit 200, with adjacent circuit boards 220 being electrically connected; wherein, the image acquisition unit 230 and at least a portion of the circuit boards 220 are electrically connected.

[0071] Understandably, there can be two circuit boards 220. The two circuit boards 220 are arranged sequentially along the length of the image acquisition unit 200, which effectively utilizes the accommodating cavity of the housing 210, improves space utilization, and reduces the space ratio of the image acquisition unit 200.

[0072] The two circuit boards 220 are electrically connected to each other, and the image acquisition unit 230 is electrically connected to at least one of the two circuit boards 220, forming a transmission path for the acquired image signal. It can be understood that when the image acquisition unit 230 is electrically connected to one of the circuit boards 220, the acquired image signal can be transmitted to the terminal via the optical module 224 on that circuit board 220, or via the optical module 224 on the other circuit board 220 that is electrically connected to that circuit board 220.

[0073] It is easy to understand that the image acquisition unit 230 can be electrically connected to both circuit boards 220, and the acquired image signal can be transmitted to the terminal through the optical module 224 on one of the circuit boards 220.

[0074] Of course, when there are multiple circuit boards 220, the multiple circuit boards 220 are arranged sequentially along the length direction of the image acquisition unit 200, and adjacent circuit boards 220 are electrically connected. Some of the multiple circuit boards 220 are electrically connected to the image acquisition unit 230.

[0075] It should be noted that the image acquisition device 230 in this embodiment can be one or multiple. When there is one image acquisition device 230, one image acquisition device 230 can be electrically connected to one of at least two circuit boards 220, or to a portion of the at least two circuit boards 220, or to all of the circuit boards 220.

[0076] When there are multiple image collectors 230, the multiple image collectors 230 can be set and electrically connected to the circuit board 220 one by one, or some of the multiple image collectors 230 are electrically connected to the same circuit board 220.

[0077] Further, a connector 221 is provided on each circuit board 220, and adjacent circuit boards 220 are electrically connected through the connector 221. In this way, the signal transmission between adjacent circuit boards 220 is achieved through the connection of the connector 221. At the same time, each circuit board 220 forms a series relationship, and the signal output is completed through one of the circuit boards 220.

[0078] In some embodiments, there are at least two image collectors 230, and at least two image collectors 230 are arranged in sequence along the length direction of the image collection unit 200; the image collectors 230 and the circuit boards 220 are set and electrically connected one by one. In this way, through the setting of multiple image collectors 230, the width of the image collection unit 200 is increased, and the overall width of the image collection unit 200 is further improved. The multiple image collectors 230 are arranged on the same housing 210, reducing the difficulty of position calibration between the image collectors 230 to improve the overall economy of the image collection device 100. At the same time, each image collector 230 corresponds to a circuit board 220, and the signal transmission is completed through the optical module on the circuit board to ensure the rate and stability of information transmission between each image collection unit 200 and the terminal.

[0079] Possibly, there are multiple image collection units 200, and the multiple image collection units 200 are arranged in an array; the circuit boards 220 of adjacent image collection units 200 are electrically connected; the collection ends of the image collectors 230 of each image collection unit 200 face the same direction. In this way, through the array arrangement of multiple image collection units 200, the width of the image collection device 100 is increased, and the circuit boards 220 are electrically connected to each other, realizing the connection of the signal transmission paths of each image collection unit 200 to improve the overall signal transmission stability and transmission rate of the image collection device 100.

[0080] In addition, when multiple image collection units 200 are arranged in an array, since the circuit boards 220 of each image collection unit 200 are electrically connected, one or a partial number of image collection units 200 can be selected to output optical signals.

[0081] It should be noted that when multiple image collection units 200 are arranged in an array, they can be arranged in sequence along the length direction of the image collection unit 200 to form a linear curve or a linear straight line. For example, multiple image collection units 200 are arranged in a "one" shape, or each image collection unit 200 is arranged in a "pin" shape.

[0082] Possibly, the image acquisition unit 200 also includes an illumination assembly located within the accommodating cavity, electrically connected to the circuit board 220; the illumination assembly is configured to illuminate the acquisition area. This reduces the complexity of setting up the lighting environment for the image acquisition device 100, increases the flexibility of the image acquisition device 100, and facilitates its relocation.

[0083] Possibly, the housing 210 includes a top cover 211, a body 212, and a baffle 213. The top cover 211 covers one side of the body 212, and the baffle 213 is detachably connected to the end of the body 212 along the length of the image acquisition unit 200. The top cover 211, body 212, and baffle 213 together form an accommodating cavity. The acquisition area is located on the side of the body 212 opposite to the top cover 211. This facilitates the assembly and production of the image acquisition unit 200. Furthermore, when multiple image acquisition units 200 are spliced ​​together, only the baffle 213 at one end of the body 212 needs to be removed. After electrically connecting the circuit boards 220 of two adjacent image acquisition units 200, the baffle 213 and the body 212 are then connected, isolating the interior of each image acquisition unit 200 from the outside world and protecting the components within the image acquisition unit 200.

[0084] Possibly, a heat-conducting element 214 is provided on the upper cover 211, located on the side of the upper cover 211 away from the main body 212, and the heat-conducting element 214 is thermally connected to the accommodating cavity. In this way, the heat-conducting element 214 dissipates heat from the housing 210, preventing the heat generated by the circuit board 220 during operation from causing a decrease in signal transmission rate, thereby improving the stability of signal transmission.

[0085] For example, the heat-conducting element 214 may be a finned structure, etc., and this section does not make specific requirements for it.

[0086] Furthermore, the image acquisition unit 200 also includes a fan assembly 215, which is disposed on the side of the upper cover 211 away from the main body 212 and is configured to dissipate heat from the upper cover 211. In this way, the fan assembly 215 accelerates the heat dissipation of the upper cover 211, improving the heat dissipation efficiency and effect, so as to ensure the stable operation of each image acquisition device 100.

[0087] Secondly, this application may also provide a detection system, including a terminal and an image acquisition device 100 in the foregoing embodiments, wherein the terminal and the image acquisition device 100 are electrically connected.

[0088] It should be noted that the terminal in this embodiment can be a processor, a display, or a computer, etc.

[0089] The detection system provided in this embodiment, by including the image acquisition device 100 in the aforementioned embodiment, can improve the signal transmission rate.

[0090] It should be noted that the terms "one embodiment," "embodiment," "exemplary embodiment," "some embodiments," etc., mentioned in the specification indicate that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0091] Generally speaking, terms should be understood at least in part by their use in context. For example, at least in part by context, the term "one or more" as used in the text can be used to describe any feature, structure, or characteristic of the singular meaning, or a combination of features, structures, or characteristics of the plural meaning. Similarly, at least in part by context, terms such as "a" or "the" can also be understood to convey either singular or plural usage.

[0092] It should be readily understood that the terms “on,” “above,” and “on top of” in this application should be interpreted in the broadest possible sense, such that “on” means not only “directly on something” but also “on something” with an intermediate feature or layer therebetween, and that “above” or “on top of” means not only “on top of something” but also “on top of something” without an intermediate feature or layer therebetween (i.e., directly on something).

[0093] Furthermore, for ease of explanation, spatially relative terms such as "below," "below," "under," "above," and "above" may be used to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation other than those shown in the figures. The device may have other orientations (rotated 90° or in other orientations), and the spatially relative descriptive terms used herein may be interpreted accordingly.

[0094] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An image acquisition device (100), characterized in that, include: An image acquisition unit (200) includes a housing (210), a circuit board (220), and an image acquisition device (230). The housing (210) has a receiving cavity, and the shell wall of the housing (210) has a collection area, which is a light-transmitting portion or opening on the shell wall. The image acquisition device (230) and the circuit board (220) are both located in the receiving cavity. The collection end of the image acquisition device (230) faces the collection area and extends along the length direction of the image acquisition unit (200). The circuit board (220) is provided with an optical module (224), a controller (222), a signal receiver (223), and an output terminal (225). The image acquisition device (230), the signal receiver (223), the controller (222), the optical module (224), and the output terminal (225) are electrically connected in sequence. The image acquisition device (230) transmits the acquired image signal to the controller (222) through the signal receiver (223), and then converts the acquired image signal into an optical signal through the optical module (224), and transmits it to the terminal through the output terminal (225).

2. The image acquisition device (100) according to claim 1, characterized in that, There are at least two optical modules (224) on the circuit board (220), and at least two optical modules (224) are arranged sequentially along the length of the image acquisition unit (200).

3. The image acquisition device (100) according to claim 1, characterized in that, The circuit board (220) has multiple signal receivers (223), and the multiple signal receivers (223) are arranged in an array on the circuit board (220); Each of the signal receivers (223) is electrically connected to the controller (222), and at least some of the signal receivers (223) are electrically connected to the image acquisition unit (230).

4. The image acquisition device (100) according to any one of claims 1-3, characterized in that, There are at least two circuit boards (220), and at least two circuit boards (220) are arranged sequentially along the length direction of the image acquisition unit (200), and adjacent circuit boards (220) are electrically connected; The image acquisition unit (230) and at least part of the circuit board (220) are electrically connected.

5. The image acquisition device (100) according to claim 4, characterized in that, Each of the circuit boards (220) is provided with a connector (221), and adjacent circuit boards (220) are electrically connected through the connector (221).

6. The image acquisition device (100) according to claim 4, characterized in that, The image acquisition unit (230) is at least two, and the at least two image acquisition units (230) are arranged sequentially along the length direction of the image acquisition unit (200); The image acquisition unit (230) and the circuit board (220) are configured and electrically connected in a one-to-one correspondence.

7. The image acquisition device (100) according to any one of claims 1-3, characterized in that, There are multiple image acquisition units (200), and the multiple image acquisition units (200) are arranged in an array; The circuit boards (220) of adjacent image acquisition units (200) are electrically connected; The image acquisition terminals of the image acquisition units (200) of each of the aforementioned image acquisition units (200) are oriented in the same direction.

8. The image acquisition device (100) according to any one of claims 1-3, characterized in that, The image acquisition unit (200) also includes an illumination component, which is located within the accommodating cavity and is electrically connected to the circuit board (220); The lighting component is configured to illuminate the acquisition area.

9. The image acquisition device (100) according to any one of claims 1-3, characterized in that, The housing (210) includes a top cover (211), a body (212), and a baffle (213). The top cover (211) covers one side of the body (212), and the baffle (213) is detachably connected to the end of the body (212) along the length direction of the image acquisition unit (200). The upper cover (211), the body (212), and the baffle (213) together form the accommodating cavity; The collection area is located on the side of the main body (212) away from the upper cover (211).

10. The image acquisition device (100) according to claim 9, characterized in that, A heat-conducting element (214) is provided on the upper cover (211). The heat-conducting element (214) is located on the side of the upper cover (211) away from the body (212). The heat-conducting element (214) and the accommodating cavity are thermally connected.

11. The image acquisition device (100) according to claim 10, characterized in that, The image acquisition unit (200) also includes a fan assembly (215), which is disposed on the side of the upper cover (211) away from the body (212) and is configured to dissipate heat from the upper cover (211).

12. A detection system, characterized in that, It includes a terminal and an image acquisition device (100) as described in any one of claims 1-11, wherein the terminal and the image acquisition device (100) are electrically connected.

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