Display substrate and display device

Abstract

According to the display substrate and the display device, the back metal layer is arranged in the isolation area and located between the isolation column and the substrate, after the back metal layer is connected with the positive electrode power source, the back metal layer can be positively charged, the isolation area is arranged around the opening area, so that the isolation area forms a positive electric field, and the display effect is improved. Under the action of a positive electric field, the isolation columns are positively charged, so that K < + > ions in POL can be repelled when a reliability test is carried out on a product, and electrochemical corrosion can be effectively reduced and hole black spots can be avoided in a power-on process of the display substrate.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display substrate and a display device. Background Art

[0002] The screens of some OLED (Organic Light Emitting Diode) display products adopt an AA Hole design, that is, a hole is made in the AA area (Active Area) so that sensors such as cameras can be placed in the hole of the AA area.

[0003] OLED products are developing towards narrow bezels and smaller AA holes. However, during the production process of organic light-emitting display devices, GDS (Growing Dark Spot) will be generated, which will lead to poor display of OLED products.

[0004] Therefore, how to reduce the generation of GDS is an urgent problem to be solved. Summary of the invention

[0005] The purpose of the embodiments of the present application is to provide a display substrate and a display device to reduce the generation of GDS. The specific technical solution is as follows:

[0006] In a first aspect, an embodiment of the present application provides a display substrate, wherein a display area of ​​the display substrate includes an effective display area, an opening area, and an isolation area arranged around the opening area; an organic light-emitting functional layer is arranged in the effective display area and extends to the isolation area, and is isolated at the position of the isolation column;

[0007] The isolation region includes a back metal layer and an isolation column;

[0008] The back metal layer is arranged between the isolation column and the substrate;

[0009] The back metal layer is connected to a positive power source.

[0010] In a possible implementation manner, the display substrate includes a non-display area, and the positive power supply is arranged in the non-display area.

[0011] In a possible implementation, the display substrate includes a non-display area, the non-display area includes a first frame area and a second frame area, and the first frame area and the second frame area are arranged on both sides of the display area; the positive power supply includes a first positive power supply and a second positive power supply; wherein the first positive power supply is arranged in the first frame area, and the second positive power supply is arranged in the second frame area;

[0012] The first positive power source and the second positive power source are connected through the back metal layer.

[0013] In a possible implementation manner, the isolation region includes an inner isolation region and an outer isolation region, the outer isolation region is arranged around the opening region, and the inner isolation region is arranged around the outer isolation region; the isolation column includes an outer isolation column and an inner isolation column; the inner isolation column is arranged in the inner isolation region, and the outer isolation column is arranged in the outer isolation region;

[0014] The back metal layer is disposed in the outer isolation region.

[0015] In a possible implementation manner, the back metal layer is a mesh structure.

[0016] In a possible embodiment, the cross-section of the mesh structure includes at least a first structure, wherein the first structure includes a plurality of annular structures, wherein the annular structures are arranged in order from large to small, with the small annular structure being arranged inside the large annular structure, and two adjacent annular structures are connected by at least one line.

[0017] In a possible implementation manner, the display substrate further includes an interlayer dielectric layer, a gate insulating layer, and an inorganic layer;

[0018] The inorganic layer is arranged on a side of the back metal layer away from the substrate;

[0019] The gate insulating layer is arranged on a side of the inorganic layer away from the substrate;

[0020] The interlayer dielectric layer is arranged on a side of the gate insulating layer away from the substrate;

[0021] The isolation column is arranged on a side of the interlayer dielectric layer away from the substrate.

[0022] In a possible implementation, a first level is provided with a via, and the back metal layer is connected to the positive power supply through the via, and the first level is a level on the back metal layer away from the substrate.

[0023] In a possible implementation manner, the projection of the via hole on the substrate is located within the projection range of the back metal layer on the substrate.

[0024] In a second aspect, an embodiment of the present application provides a display device, comprising the display substrate described in any one of the first aspects.

[0025] Beneficial effects of the embodiments of the present application:

[0026] In a display substrate and a display device provided by an embodiment of the present application, a back metal layer is arranged in an isolation area and is located between an isolation column and a substrate. After the back metal layer is connected to a positive power supply, the back metal layer can be positively charged. Because the isolation area is arranged around the opening area, a positive electric field is formed in the isolation area. Under the action of the positive electric field, the isolation column is also positively charged, so that when the product is subjected to reliability testing, K+ ions in the POL are repelled. During the power-on process of the display substrate, the generation of electrochemical corrosion can be effectively reduced to avoid the generation of hole black spots.

[0027] Of course, implementing any product or method of the present application does not necessarily require achieving all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other embodiments can also be obtained based on these drawings.

[0029] Figure 1-1 This is a first schematic diagram showing a substrate in the related art;

[0030] Figure 1-2 It is a second schematic diagram showing a substrate in the related art;

[0031] Figure 2 An experimental schematic diagram provided for an embodiment of the present application;

[0032] Figure 3 A first schematic diagram of a display substrate provided in an embodiment of the present application;

[0033] Figure 4 A second schematic diagram of a display substrate provided in an embodiment of the present application;

[0034] Figure 5 A schematic diagram of a mesh structure provided in an embodiment of the present application;

[0035] Figure 6 A third schematic diagram of a display substrate provided in an embodiment of the present application;

[0036] Figure 7 This is a fourth schematic diagram of the display substrate provided in an embodiment of the present application. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field based on the present application belong to the scope of protection of the present application.

[0038] OLED perforated screen refers to a screen with a hole in the operable area of ​​the screen, where sensors such as cameras are placed. OLED products use OCA (Optically Clear Adhesive, a special double-sided adhesive with an optically transparent layer without substrate) integrated cutting technology. This method cuts POL (polarizer) and PNL (Panel, substrate) together. When the product is tested for reliability, the presence of water vapor in the environment becomes a carrier for the migration of K+ ions (positive ions), which will cause the K+ ions in the POL to follow the carbonized edge to the PNL cutting edge, and the negative charge carried by the hole area will attract the K+ ions to stay in the area near the isolation column of the hole area and gather. When the substrate is powered on, water vapor enters and electrolyzes to produce hydroxide ions, and an electrochemical reaction occurs: e-+H2O→OH-+H2↑, K++OH- forms a strong alkaline environment, and the insulating layer is corroded by SiO2+2OH-→SiO3(2-)+H2O, resulting in voids in the insulating layer, which causes packaging failure and produces hole black spots.

[0039] like Figure 1-1 As shown, the display substrate includes an effective display area 10, an opening area 20, and an isolation area 30. The organic light-emitting functional layer is arranged in the effective display area 10 and extends to the isolation area and is interrupted by isolation columns. Figure 1-2 The figure shows the schematic diagram of the existing isolation column structure distribution. PI is the substrate, gate1 is the first gate electrode, gate2 is the second gate electrode, GI1 is the first gate insulation layer, GI2 is the second gate insulation layer, Barrier is the barrier layer, Buffer is the buffer layer, ILD is the interlayer dielectric layer, and PVX is the protection layer. PLN is the flat layer, Dam is the dam structure. SD is the source and drain electrode, EL is the electroluminescent layer, and CTD is the cathode layer. Cutting Line refers to the cutting line cut out to place the camera.

[0040] The applicant conducts experimental design and reproduction of the electrochemical corrosion conditions of the product in the laboratory.

[0041] The test method is as follows:

[0042] like Figure 3 As shown, Figure 3 In the figure, FPC is a flexible circuit board, IC is a circuit board, CG is a cover board, SCF is a composite film, and there is ELVSS (voltage) on the FPC (flexible circuit board), such as Figure 3 The circuit is built as described in the experiment. One end of ELVSS is connected to -20V, and one end of SCF (composite film) is connected to 0V. A is the hole area. A 5% NaCl solution is manually applied to the hole area. When there is leakage current in the hole area, the product is turned on and there is a leakage current loop. This experiment can quickly stimulate electrochemical corrosion. In the experiment, it can be seen that the isolation column has obvious traces of water and oxygen corrosion, accompanied by gas overflow.

[0043] In this experiment, the ELVSS voltage value was gradually adjusted, and it can be seen that the electrochemical reaction slowed down in sequence. When ELVSS>-2V, the reaction was completely terminated. When ELVSS was 2V, the reaction almost stopped completely.

[0044] According to the laboratory test results, it can be seen that when ELVSS is negatively charged, it attracts K+ ions in POL, causing electrochemical corrosion, thereby leading to GDS, but when ELVSS is positively charged, these ions are repelled, so the chemical reaction almost completely stops.

[0045] Based on the above tests, in order to improve the problem of generating hole black spots, in the first aspect, the embodiment of the present application provides a display substrate, wherein the display area of ​​the display substrate includes an effective display area 10, an opening area 20, and an isolation area 30 arranged around the opening area 20; the organic light-emitting functional layer is arranged in the effective display area 10 and extends to the isolation area 30, and is isolated at the position of the isolation column;

[0046] The isolation region includes a back metal layer 120 and an isolation column 130;

[0047] The back metal layer 120 is disposed between the isolation column 130 and the substrate 110;

[0048] The back metal layer 120 is connected to a positive power source.

[0049] The back metal layer is a conductive metal layer, which is made of metal material and can conduct electricity. The positive power supply can be the positive power supply of GOA (Gate Driver on Array) of the display substrate, such as VgH power supply. Because the back metal layer is arranged in the isolation area and is located between the isolation column and the substrate 110, after the back metal layer is connected to the positive power supply, the back metal layer can be positively charged. Because the isolation area is arranged around the opening area, a positive electric field is formed in the isolation area. Under the action of the positive electric field, the isolation column is also positively charged, so that when the product is tested for reliability, the K+ ions in the POL will be repelled, and the display substrate can effectively reduce the generation of electrochemical corrosion during the power-on process to avoid the generation of hole black spots.

[0050] The positive power supply may be located in a non-display area of ​​the display substrate, such as a frame area. A GOA circuit is provided in the frame area, and the positive power supply of the GOA may be connected to the back metal layer. In order to realize the back metal layer, a hole may be opened in the isolation area, and the connection between the positive power supply of the GOA and the back metal layer may be realized through the hole. For the sake of clarity of the scheme and layout, another embodiment is described in detail below.

[0051] In a possible implementation manner, the display substrate includes a non-display area, and the positive power supply is arranged in the non-display area.

[0052] The GOA is located in the non-display area. Since the GOA includes a positive power source, the back metal layer can be connected to the positive power source of the GOA.

[0053] In a possible implementation, the display substrate includes a non-display area, the non-display area includes a first frame area and a second frame area, and the first frame area and the second frame area are arranged on both sides of the display area; the positive power supply includes a first positive power supply and a second positive power supply; wherein the first positive power supply is arranged in the first frame area, and the second positive power supply is arranged in the second frame area;

[0054] The first positive power source and the second positive power source are connected through the back metal layer.

[0055] The frame area of ​​the display substrate is arranged around the display area. In one example, a first frame area and a second frame area are arranged on both sides of the display area, and a positive power source is provided in each frame area. For example, the first positive power source is arranged in the first frame area, and the second positive power source is arranged in the second frame area. The two positive power sources in the frame areas can be overlapped through the back technical layer.

[0056] The back metal layer is connected to the first positive power source and the second positive power source. When one of the positive power sources fails to provide positive electricity, the other one can continue to provide it, thereby improving the reliability of the product.

[0057] like Figure 4 As shown, VgH1 is the first positive power supply, VgH2 is the second positive power supply, and the two positive power supplies can be overlapped through the back metal layer. In this way, the back metal layer can be positively charged. Because the isolation area is arranged around the opening area, a positive electric field is formed in the isolation area. Under the action of the positive electric field, the isolation column is also positively charged, so that when the product is subjected to reliability testing, the K+ ions in the POL will be repelled, showing that the substrate can effectively reduce the occurrence of electrochemical corrosion during the power-on process.

[0058] In a possible implementation manner, the isolation region includes an inner isolation region and an outer isolation region, the outer isolation region is arranged around the opening region, and the inner isolation region is arranged around the outer isolation region; the isolation column includes an outer isolation column and an inner isolation column; the inner isolation column is arranged in the inner isolation region, and the outer isolation column is arranged in the outer isolation region;

[0059] The back metal layer is disposed in the outer isolation region.

[0060] The isolation area can be divided into an inner isolation area and an outer isolation area. The outer isolation area is arranged around the opening area, and the inner isolation area is arranged around the outer isolation area, that is, the outer isolation area is closer to the opening area. The cross section of the outer isolation area can be annular, and the cross section of the inner isolation area can also be annular. The opening area can be a structure such as a groove or an opening. Because the outer isolation area is close to the hole area, the back metal layer can be arranged only in the outer isolation area. In this way, after the back metal layer is connected to the positive power supply, the back metal layer can be positively charged. Because the outer isolation area is arranged around the opening area, a positive electric field is formed in the outer isolation area. Under the action of the positive electric field, the isolation column is also positively charged, so that when the product is subjected to reliability testing, the K+ ions in the POL will be repelled, and the display substrate can effectively reduce the occurrence of electrochemical corrosion during the power-on process.

[0061] In addition, resources can be saved by only providing a back metal layer in the outer isolation region.

[0062] In a possible implementation manner, the isolation region includes an inner isolation region and an outer isolation region, the outer isolation region is arranged around the opening region, and the inner isolation region is arranged around the outer isolation region; the isolation column includes an outer isolation column and an inner isolation column; the inner isolation column is arranged in the inner isolation region, and the outer isolation column is arranged in the outer isolation region;

[0063] The back metal layer is disposed in the outer isolation region and the inner isolation region.

[0064] The isolation area can be divided into an inner isolation area and an outer isolation area. The outer isolation area is arranged around the opening area, and the inner isolation area is arranged around the outer isolation area. The cross section of the outer isolation area can be annular, and the cross section of the inner isolation area can also be annular. The opening area can be a structure such as a groove or an opening. Because both the inner isolation area and the outer isolation area are provided with isolation columns, a back metal layer can be provided in both the inner isolation area and the outer isolation area. In this way, after the back metal layer is connected to the positive power supply, the back metal layer can be positively charged. Because the inner isolation area and the outer isolation area form a positive electric field, under the action of the positive electric field, the isolation column is also positively charged, so that when the product is subjected to a reliability test, the K+ ions in the POL will be repelled, and the display substrate can effectively reduce the occurrence of electrochemical corrosion during the power-on process.

[0065] In a possible implementation manner, the back metal layer is a mesh structure.

[0066] The back metal layer adopts a mesh structure for wiring, so that when a certain section of the back metal layer is broken, it can still maintain normal functions, thereby improving the reliability of the display substrate.

[0067] In a possible embodiment, the cross-section of the mesh structure includes a first structure, which includes a plurality of annular structures of different sizes, wherein the annular structures are arranged in order from large to small, with the small annular structure arranged inside the large annular structure, and two adjacent annular structures are connected by at least one line.

[0068] The annular structure may be a circular structure or an elliptical structure. The number of the annular structures may be set based on actual conditions and is not limited here.

[0069] The small ring structure is arranged inside the large ring structure, indicating that there is a spacing between adjacent ring structures. The mesh structure may include multiple ring structures, and the ring structure may be a circular structure or an elliptical structure. In an example, Figure 5 As shown, the ring structure is a circular structure. The back metal layer of the mesh structure can be connected to a positive power supply, such as VgH of GOA. In a possible implementation, each circular structure is a concentric circle. In a possible implementation, each concentric circle is arranged at equal intervals.

[0070] The lines can be straight lines or curved lines. In one example, two adjacent ring structures are connected by multiple lines, so that when some of the lines are broken, the normal function can still be maintained, thereby improving the reliability of the display substrate.

[0071] In a possible embodiment, the cross-section of the mesh structure includes a second structure, which includes a plurality of polygonal structures of different sizes, wherein the polygonal structures are arranged in order from large to small, with the small polygonal structure arranged inside the large polygonal structure, and two adjacent polygonal structures are connected by at least one line.

[0072] The polygon can be a triangle, a quadrilateral, or a hexagon, which can be set based on the actual situation. The line can be a straight line or a curve.

[0073] In a possible implementation manner, the display substrate further includes an interlayer dielectric layer, a gate insulating layer, and an inorganic layer;

[0074] The inorganic layer is arranged on a side of the back metal layer away from the substrate;

[0075] The gate insulating layer is arranged on a side of the inorganic layer away from the substrate;

[0076] The interlayer dielectric layer is arranged on a side of the gate insulating layer away from the substrate;

[0077] The isolation column is arranged on a side of the interlayer dielectric layer away from the substrate.

[0078] The display substrate also includes an ILD (interlayer dielectric layer), a GI (gate insulating layer), an inorganic layer, and a barrier+buffer layer.

[0079] The back metal layer is arranged on the substrate, the inorganic layer is arranged on the side of the back metal layer away from the substrate; the gate insulating layer is arranged on the side of the inorganic layer away from the substrate; the interlayer dielectric layer is arranged on the side of the gate insulating layer away from the substrate; and the isolation column is arranged on the side of the interlayer dielectric layer away from the substrate.

[0080] Based on the above embodiments, see Figure 6 , Figure 6 A schematic diagram of the structure of a display substrate provided in an embodiment of the present application. The display substrate includes a substrate 110, a back metal layer 120, a barrier+buffer layer, a GI1+GI2 layer, and an ILD+PVX layer, wherein PVX is a passivation layer.

[0081] The back metal layer set on the display substrate is connected to the anode power supply, so that a positive electric field is formed in the isolation area. Under the action of the positive electric field, the isolation column is also positively charged, so that when the product is subjected to reliability testing, the K+ ions in the POL are repelled, and the display substrate can effectively reduce the occurrence of electrochemical corrosion during the power-on process.

[0082] In a possible implementation, the display substrate is provided with a via, and the back metal layer is connected to the positive power supply through the via.

[0083] A via hole may be provided on the display substrate, and then the back metal layer is connected to the positive power supply through the via hole.

[0084] In a possible implementation, a via hole is provided on a first level, the projection of the via hole on the substrate is located within the projection range of the back metal layer on the substrate, and the first level is a level on the back metal layer away from the substrate.

[0085] You can drill vias on the first level. The vias can be cylindrical, conical, or rectangular. The shape of the vias is not set and can be set based on actual conditions. Figure 7 As shown, Figure 7 140 in the figure is a via hole, through which wiring is performed, and then the positive power supply is connected to the back metal layer. The first level is a level on the back metal layer away from the substrate.

[0086] In addition, you can drill one via or multiple vias at the first level, and the specific setting can be based on actual conditions.

[0087] In one example, multiple vias can be drilled in the first layer to connect the positive power supply to different positions of the back metal layer. This can prevent the normal function from being maintained when some leads are broken, thereby improving the reliability of the display substrate.

[0088] In addition, the back metal layer of the present application can also be used as a bottom shielding metal layer, which can be used to provide ground guidance to shield static electricity and reduce signal crosstalk and interference. In this way, without adding a mask, it can effectively reduce the occurrence of electrochemical corrosion and avoid the formation of hole black spots, and can also shield static electricity and reduce signal crosstalk and interference.

[0089] In a second aspect, an embodiment of the present application provides a display device, comprising the display substrate described in any one of the first aspects.

[0090] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0091] Each embodiment in this specification is described in a related manner, and the same or similar parts between the embodiments can be referenced to each other, and each embodiment focuses on the differences from other embodiments.

[0092] The above description is only a preferred embodiment of the present application and is not intended to limit the protection scope of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application are included in the protection scope of the present application.

Claims

1. A display substrate, characterized in that: The display area of ​​the display substrate includes an effective display area, an opening area, and an isolation area arranged around the opening area; the organic light-emitting functional layer is arranged in the effective display area and extends to the isolation area, and is isolated at the position of the isolation column; The isolation region includes a back metal layer and an isolation column; The back metal layer is arranged between the isolation column and the substrate; The back metal layer is connected to a positive power source.

2. The display substrate according to claim 1, characterized in that: The display substrate includes a non-display area, and the positive power source is arranged in the non-display area.

3. The display substrate according to claim 1, characterized in that: The display substrate includes a non-display area, the non-display area includes a first frame area and a second frame area, the first frame area and the second frame area are arranged on both sides of the display area; the positive power supply includes a first positive power supply and a second positive power supply; wherein the first positive power supply is arranged in the first frame area, and the second positive power supply is arranged in the second frame area; The first positive power source and the second positive power source are connected through the back metal layer.

4. The display substrate according to claim 1, characterized in that: The isolation region includes an inner isolation region and an outer isolation region, the outer isolation region is arranged around the opening region, and the inner isolation region is arranged around the outer isolation region; the isolation column includes an outer isolation column and an inner isolation column; the inner isolation column is arranged in the inner isolation region, and the outer isolation column is arranged in the outer isolation region; The back metal layer is disposed in the outer isolation region.

5. The display substrate according to any one of claims 1 to 4, characterized in that: The back metal layer is a mesh structure.

6. The display substrate according to claim 5, characterized in that: The cross section of the mesh structure includes at least a first structure, wherein the first structure includes a plurality of annular structures, wherein the annular structures are arranged in order from large to small, the small annular structure is arranged inside the large annular structure, and two adjacent annular structures are connected by at least one line.

7. The display substrate according to any one of claims 1 to 4, characterized in that: The display substrate shown also includes an interlayer dielectric layer, a gate insulating layer, and an inorganic layer; The inorganic layer is arranged on a side of the back metal layer away from the substrate; The gate insulating layer is arranged on a side of the inorganic layer away from the substrate; The interlayer dielectric layer is arranged on a side of the gate insulating layer away from the substrate; The isolation column is arranged on a side of the interlayer dielectric layer away from the substrate.

8. The display substrate according to claim 7, characterized in that: A via hole is provided at the first level, and the back metal layer is connected to the positive power supply through the via hole. The first level is a level on the back metal layer away from the substrate.

9. The display substrate according to claim 8, characterized in that: The projection of the via hole on the substrate is located within the projection range of the back metal layer on the substrate.

10. A display device, characterized in that: The display substrate comprises any one of claims 1 to 9.

Images