Die machining method and workpiece polishing method and system

Abstract

The invention discloses a die machining method and a workpiece polishing method and system. The mold machining method comprises the steps that first surface information of a first mold is obtained, and the first mold is manufactured based on initial machining information; obtaining compensation information based on the first surface information and target surface information; generating target processing information based on the initial processing information and the compensation information; and preparing a standard mold based on the target processing information, wherein the standard mold comprises a mold body and a covering layer. According to the mold machining method, the mold machining precision and consistency can be improved. A workpiece polishing method includes determining at least a first polishing region and a second polishing region of a workpiece; a first polishing mold is used for polishing the first polishing area; a second polishing mold is used for polishing the second polishing area; and the curvature radius of the polishing surface of the first polishing mold is different from that of the polishing surface of the second polishing mold. The workpiece polishing method can realize standardized batch polishing.

Description

A mold processing method and workpiece polishing method and system thereof

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Chinese patent application No. 202210650123.4 filed on June 10, 2022, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present application relates to the technical field of grinding and polishing processes, and in particular to a mold processing method and a workpiece polishing method and a system thereof. Background Art

[0004] Polishing dies are important tools in the crystal polishing process. Due to factors such as the wear of the polishing rubber, the service life of the polishing dies is relatively short. After polishing 20 to 30 crystals, the polishing dies need to be replaced with new ones.

[0005] The general processing method of polishing molds requires relying on processing equipment (such as lathes, engraving machines, etc.) to turn the original mold, and then veneer and grind the original mold to make a polished mold.

[0006] On the one hand, due to the systematic errors that may occur in the processing equipment after maintenance or upkeep, the original molds turned by it cannot meet the precision requirements of the polished crystal. Therefore, a time-consuming original mold correction process is required during the polishing mold processing. The original mold correction process generally includes: making a coupling mold with diamond pellets attached to couple with the original mold; making a correction mold after correcting the coupling mold based on a qualified polishing mold; using the correction mold to correct the original mold; using the corrected original mold to make a polishing mold, perform crystal polishing, and test the polishing accuracy. The above correction process has no correction standard and usually requires repeated correction and debugging until the crystal polishing accuracy meets the requirements.

[0007] On the other hand, since the original mold skinning process generally uses manual pressing of the polishing skin onto the heated original mold, the polishing skin in different areas of the polishing mold may have uneven thickness due to factors such as temperature control and pressure uniformity.

[0008] These issues lead to poor product consistency and machining accuracy in the polishing mold process, as well as a low degree of standardization in the machining process, which in turn limits the accuracy and efficiency of crystal polishing. Therefore, there is a need to provide a mold machining method and workpiece polishing method and system that can improve machining accuracy and consistency.

[0009] Summary of the Invention

[0010] One or more embodiments of this specification provide a mold processing method. The method includes: obtaining first surface information of a first mold, the first mold being manufactured based on initial processing information; obtaining compensation information based on the first surface information and target surface information; generating target processing information based on the initial processing information and the compensation information; and preparing a standard mold based on the target processing information, the standard mold including a mold body and a covering layer.

[0011] In some embodiments, the preparation of the standard mold based on the target processing information includes: turning the initial mold based on the target processing information to obtain the mold body; attaching the covering layer to the mold body; and turning the covering layer based on the target processing information to obtain the standard mold.

[0012] In some embodiments, attaching the covering layer to the mold body includes: heating the mold body; and pressing the covering layer and the heated mold body to adhere the covering layer to the mold body.

[0013] In some embodiments, the mold body is heated by a heating coil, and the mold body to be heated is placed in the heating coil.

[0014] In some embodiments, the heating temperature of the heating coil is 160°C to 200°C.

[0015] In some embodiments, the covering layer and the heated mold body are compacted by a pressurized pressure plate tooling, and the curvature of the pressure-applying surface of the pressure plate tooling matches the curvature of the pressure-bearing surface of the mold body.

[0016] In some embodiments, the pressure range of the pressure plate tooling is 0.1 MPa to 0.8 MPa.

[0017] In some embodiments, the compensation information includes main body compensation information and edge extension information; the compensation information obtained based on the first surface information and the target surface information includes: obtaining the main body compensation information corresponding to the first mold main body based on the comparison of the first surface information and the target surface information; and obtaining the edge extension information corresponding to the edge of the first mold based on the data trend of the first surface information.

[0018] In some embodiments, generating target processing information based on the initial processing information and the compensation information includes: generating processing information to be verified based on the initial processing information and the compensation information; obtaining second surface information of a second mold, the second mold being made based on the processing information to be verified; based on the second surface information and the target surface information, determining whether the surface error of the second mold is within a preset value range; if so, determining that the processing information to be verified is target processing information.

[0019] One or more embodiments of the present disclosure provide a mold processing system. The system includes: a surface information acquisition module configured to acquire first surface information of a first mold, the first mold being manufactured based on initial processing information; a compensation information acquisition module configured to obtain compensation information based on the first surface information and target surface information; a processing information generation module configured to generate target processing information based on the initial processing information and the compensation information; and a processing module configured to prepare a standard mold based on the target processing information, the standard mold comprising a mold body and a covering layer.

[0020] One or more embodiments of the present disclosure provide a workpiece polishing method. The method includes: determining at least a first polishing region and a second polishing region of a workpiece; polishing the first polishing region using a first polishing mold; and polishing the second polishing region using a second polishing mold; wherein the polishing surface of the first polishing mold and the polishing surface of the second polishing mold have different curvature radii.

[0021] In some embodiments, the curvature of the surface to be polished in the first polishing region matches the curvature of the polishing surface of the first polishing mold; the curvature of the surface to be polished in the second polishing region matches the curvature of the polishing surface of the second polishing mold.

[0022] In some embodiments, the first polishing mold has first polishing parameters, which include at least a first swing parameter and a first pressure parameter; the second polishing mold has second polishing parameters, which include at least a second swing parameter and a second pressure parameter; the first polishing parameters are different from the second polishing parameters.

[0023] In some embodiments, the first polishing mold and / or the second polishing mold is a standard mold, and the standard mold includes a mold body and a covering layer.

[0024] In some embodiments, the preparation of the standard mold includes: obtaining first surface information of a first mold, the first mold being prepared based on initial processing information; obtaining compensation information based on the first surface information and target surface information; generating target processing information based on the initial processing information and the compensation information; and preparing a standard mold based on the target processing information, the standard mold including a mold body and a covering layer.

[0025] In some embodiments, the preparation of the standard mold based on the target processing information includes: turning the initial mold based on the target processing information to obtain the mold body; attaching the covering layer to the mold body; and turning the covering layer based on the target processing information to obtain the standard mold.

[0026] In some embodiments, determining at least the first polishing area and the second polishing area of ​​the workpiece includes: determining the shape characteristics of the polishing area of ​​the workpiece; pre-polishing the polishing area of ​​a test workpiece based on the shape characteristics, the test workpiece being selected from the workpiece; and determining at least the first polishing area and the second polishing area of ​​the workpiece based on the pre-polishing result.

[0027] In some embodiments, the pre-polishing result includes parameter information of the polishing area of ​​the test workpiece after pre-polishing; the parameter information includes a polishing removal rate; and the parameter information is determined by comparing shape features of the polishing area of ​​the test workpiece before and after pre-polishing.

[0028] In some embodiments, pre-polishing the polishing area of ​​the test workpiece based on the shape feature includes: pre-polishing the polishing area of ​​the test workpiece based on an overall polishing strategy to produce a first test workpiece; and obtaining first parameter information of the first test workpiece.

[0029] In some embodiments, determining at least the first polishing region and the second polishing region of the workpiece based on the pre-polishing result includes: determining at least the first polishing region and the second polishing region of the workpiece based on the first parameter information and a preset threshold condition.

[0030] In some embodiments, pre-polishing the polishing area of ​​the test workpiece based on the shape feature further comprises:

[0031] Based on the first parameter information and a preset threshold condition, a first partition polishing strategy is generated; based on the first partition polishing strategy, the polishing area of ​​the test workpiece is pre-polished to produce a second test workpiece; and second parameter information of the second test workpiece is obtained.

[0032] In some embodiments, determining at least the first polishing area and the second polishing area of ​​the workpiece based on the pre-polishing result includes: judging whether the second parameter information meets a preset threshold condition; if so, determining at least the first polishing area and the second polishing area of ​​the workpiece based on the first partition polishing strategy.

[0033] In some embodiments, the pre-polishing of the test workpiece is performed by using a pre-polishing tool, and the shape characteristics of the polishing surface of the pre-polishing tool are determined based on the shape characteristics of the polishing area of ​​the workpiece and the corresponding polishing strategy.

[0034] One or more embodiments of the present disclosure provide a workpiece polishing system. The system includes: a polishing region determination module configured to determine at least a first polishing region and a second polishing region of a workpiece; and a polishing module configured to polish the first polishing region using a first polishing mold and to polish the second polishing region using a second polishing mold; wherein the polishing surface of the first polishing mold and the polishing surface of the second polishing mold have different curvature radii. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] This specification will be further described in the form of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting, and in these embodiments, like numbers represent like structures, wherein:

[0036] FIG1 is a schematic diagram of exemplary hardware and / or software of a mold processing system according to some embodiments of the present specification;

[0037] 2 is a schematic diagram of exemplary hardware and / or software of a workpiece polishing system according to some embodiments of the present specification;

[0038] FIG3 is a schematic diagram of an exemplary process of a mold processing method according to some embodiments of this specification;

[0039] FIG4 is a schematic diagram of an exemplary flow chart of a compensation information acquisition process according to some embodiments of this specification;

[0040] FIG5 is a schematic diagram of an exemplary flow chart of a target processing information generation process according to some embodiments of this specification;

[0041] FIG6 is a schematic diagram of an exemplary process of preparing a standard mold according to some embodiments of this specification;

[0042] FIG7 is a schematic diagram of an exemplary structure of a pressing plate tooling pressing a cladding die according to some embodiments of this specification;

[0043] FIG8 is a schematic diagram of an exemplary process of a workpiece polishing method according to some embodiments of the present specification;

[0044] FIG9 is a schematic diagram illustrating an exemplary structure of a polishing process of a first polishing area according to some embodiments of this specification;

[0045] FIG10 is a schematic diagram illustrating an exemplary structure of a polishing process of a second polishing region according to some embodiments of this specification;

[0046] Figure numerals: 10 - standard mold; 10' - initial mold; 10" - coating mold; 11 - mold body; 12 - covering layer; 20 - workpiece; 21 - first polishing area; 22 - second polishing area; 30 - platen fixture; 40 - driving device; 41 - driving rod; 10a - first polishing mold; 10b - second polishing mold; 13a, 13b - polishing surface. DETAILED DESCRIPTION

[0047] To more clearly illustrate the technical solutions of the embodiments of this specification, the following briefly describes the drawings required for describing the embodiments. Obviously, the drawings described below are merely examples or embodiments of this specification. Those skilled in the art can apply this specification to other similar scenarios based on these drawings without inventive effort. Unless otherwise apparent from the context or otherwise noted, the same reference numerals in the figures represent the same structure or operation.

[0048] It should be understood that the terms "system", "device", "unit" and / or "module" used herein are a method for distinguishing different components, elements, parts, portions or assemblies at different levels. However, if other terms can achieve the same purpose, the terms may be replaced by other expressions.

[0049] As used in this specification and claims, unless the context clearly indicates otherwise, the words "a," "an," "an kind," and / or "the" are not intended to refer to the singular but may include the plural. Generally speaking, the terms "comprises" and "include" only indicate the inclusion of the steps and elements specifically identified, and these steps and elements do not constitute an exclusive list. A method or apparatus may also include other steps or elements.

[0050] Flowcharts are used throughout this specification to illustrate the operations performed by systems according to embodiments of this specification. It should be understood that preceding or following operations do not necessarily need to be performed in exact order. Instead, the steps may be processed in reverse order or simultaneously. Furthermore, other operations may be added to these processes, or one or more operations may be removed from these processes.

[0051] FIG. 1 is a schematic diagram of exemplary hardware and / or software of a mold machining system according to some embodiments.

[0052] As shown in FIG. 1 , the mold processing system 100 may include a control module 110 , a surface information acquisition module 120 , a compensation information acquisition module 130 , a processing information generation module 140 , a processing module 150 , a storage module 160 , a communication module 170 and an input / output module 180 .

[0053] The control module 110 can be associated with other modules to process information and data related to the mold processing system 100. In some embodiments, the control module 110 can control the operating status of other modules (e.g., the surface information acquisition module 120, the compensation information acquisition module 130, the processing information generation module 140, the processing module 150, etc.). In some embodiments, the control module 110 can manage the data acquisition or transmission process in the communication module 170.

[0054] The surface information acquisition module 120 can be used to acquire surface information of a mold. In some embodiments, the surface information acquisition module 120 can detect first surface information of a first mold and send the surface information of the first mold to the control module 110 and / or the compensation information acquisition module 130. In some embodiments, the surface information acquisition module 120 can detect second surface information of a second mold and send the surface information of the second mold to the control module 110 and / or the processing information generation module 140. In some embodiments, the surface information acquisition module 120 can send the first surface information and / or the second surface information to the storage module 160 for storage, so that other modules can access the information. In some embodiments, the surface information acquisition module 120 includes a device for performing profile detection to obtain surface information, such as a contact profilometer or a non-contact profilometer.

[0055] The compensation information acquisition module 130 can be used to obtain compensation information that reflects mold processing errors. In some embodiments, the compensation information acquisition module 130 can retrieve the first surface information obtained by the surface information acquisition module 120 and the target surface information stored by the storage module 160 to obtain compensation information based on the first and target surface information. In some embodiments, the compensation information acquisition module 130 can send the obtained compensation information to the control module 110. In some embodiments, the compensation information acquisition module 130 can also send the obtained compensation information to the storage module 160 for storage, ready for access by the control module 110 and / or the processing information generation module 140.

[0056] The processing information generation module 140 can be used to generate target processing information capable of correcting mold processing errors. In some embodiments, the processing information generation module 140 can access the compensation information acquired by the compensation information acquisition module 130 and the initial processing information stored in the storage module 160 to generate the verification processing information based on the compensation information and the initial processing information. In some embodiments, the processing information generation module 140 can access the second surface information acquired by the surface information acquisition module 120 and the target surface information stored in the storage module 160. The second surface information is surface information of a second mold prepared based on the verification processing information. Based on the second surface information and the target surface information, the module determines whether the second mold meets the error limit requirements. If so, the verification processing information is determined to be the target processing information. In some embodiments, the compensation information acquisition module 130 can send the generated target processing information to the control module 110. In some embodiments, the compensation information acquisition module 130 can also send the generated target processing information to the storage module 160 for storage, ready for access by the control module 110 and / or the processing module 150.

[0057] Processing module 150 can be used to process finished or semi-finished molds. In some embodiments, processing module 150, under the control of control module 110, can prepare a standard mold based on the target processing information generated by processing information generation module 140. In some embodiments, processing module 150 includes a turning submodule, a heating submodule, and a press-fitting submodule.

[0058] The turning submodule can be used to turn the mold. In some embodiments, based on the verification processing information sent by the processing information generation module 140, the control module 110 can control the turning submodule to turn the raw material to produce the second mold. In some embodiments, based on the target processing information sent by the processing information generation module 140, the control module 110 can control the turning submodule to turn the initial mold 10' into the mold body 11 of the standard mold 10. In some embodiments, the turning submodule includes equipment for turning, such as a lathe, a precision engraving machine, etc.

[0059] The heating submodule can be used to heat the mold. In some embodiments, based on heating parameters pre-stored in the storage module 160, the control module 110 can control the heating submodule to heat the mold body 11 being turned by the turning submodule to a preset temperature. In some embodiments, the heating submodule includes heating equipment, such as a high-frequency induction coil.

[0060] The press-fitting submodule can be used to press-fit the mold. In some embodiments, based on pressure parameters pre-stored in the storage module 160, the control module 110 can control the press-fitting submodule to compact the mold body 11 and the covering layer 12 to produce the cladding mold. In some embodiments, the press-fitting submodule includes equipment for press-fitting, such as a press platen tool.

[0061] The storage module 160 can be used to store instructions and / or data of each module of the mold processing system 100 (for example, the control module 110, the surface information acquisition module 120). For example, the storage module 160 can store the initial processing information of the processing module 150. For another example, the storage module 160 can store the first surface information of the first mold and the second surface information of the second mold detected by the surface information acquisition module 120. For another example, the storage module 160 can store user input information received by the communication module 170, such as the heating parameters of the heating submodule input by the user or the error preset value used for judging the surface error of the second mold. In some embodiments, the storage module 160 may include a large-capacity storage, a removable storage, a volatile read-write memory, a read-only memory (ROM), etc., or any combination thereof.

[0062] The communication module 170 can be used to exchange information or data. In some embodiments, the communication module 170 can be used for communication between components within the mold processing system 100, such as the control module 110, the surface information acquisition module 120, the compensation information acquisition module 130, the processing information generation module 140, the processing module 150, the storage module 160, the communication module 170, and / or the input / output module 180.

[0063] The input / output module 180 can acquire, transmit, and send signals. The input / output module 180 can connect or communicate with other components in the mold processing system 100. Other components in the mold processing system 100 can connect or communicate through the input / output module 180. In some embodiments, the input / output module 180 can connect to a network and obtain information through the network. In some embodiments, the input / output module 180 can obtain user input information through the network or communication module 170 for input. In some embodiments, the input / output module 180 can obtain control instructions or reminders from the control module 110 through the network or communication module 170.

[0064] It should be noted that the above description of the mold processing system 100 is for illustrative purposes only and does not limit the scope of application of this specification. Those skilled in the art will be able to make various modifications and alterations to the mold processing system 100 under the guidance of this specification. However, such modifications and alterations remain within the scope of this specification. For example, the processing information generation module 140 and the processing module 150 may be a single module, which may have the functions of determining target processing information and preparing the standard mold 10 based on the target processing information. Such variations are within the scope of one or more embodiments of this specification.

[0065] 2 is a schematic diagram of exemplary hardware and / or software of a workpiece polishing system according to some embodiments.

[0066] As shown in FIG. 2 , the workpiece polishing system 200 may include a control module 210 , a polishing region determination module 220 , a polishing module 230 , a storage module 240 , a communication module 250 , and an input / output module 260 .

[0067] The control module 210 can be associated with other modules to process information and data related to the workpiece polishing system 200. In some embodiments, the control module 210 can control the operating status of other modules (e.g., the polishing area determination module 220, the polishing module 230, etc.). In some embodiments, the control module 210 can manage the data acquisition or transmission process in the communication module 250.

[0068] The polishing region determination module 220 is used to determine sub-polishing regions of the workpiece. In some embodiments, the control module 210 sends the workpiece polishing region information stored in the storage module 240 to the polishing region determination module 220. The polishing region determination module 220 determines two or more sub-polishing regions of the workpiece based on the polishing region information.

[0069] Polishing module 230 is used to polish a workpiece. In some embodiments, based on the sub-polishing regions determined by polishing region determination module 220, control module 210 can control the corresponding polishing molds in polishing module 230 to polish each sub-polishing region of the workpiece according to the polishing parameters of the corresponding polishing molds. The polishing parameters can be retrieved from storage module 240. In some embodiments, polishing module 230 includes one or more polishing devices for manipulating the polishing molds to polish the workpiece.

[0070] The storage module 240 is used to store instructions and / or data for each module of the workpiece polishing system 200 (e.g., the control module 210 and the polishing area determination module 220). For example, the storage module 240 can store polishing parameters corresponding to each polishing mold of the polishing module 230. For another example, the storage module 240 can store polishing area information of a workpiece input by a user, so that the polishing area determination module 220 can use this polishing area information to determine the sub-polishing areas of the workpiece. In some embodiments, the storage module 240 can include mass storage, removable storage, volatile read-write memory, read-only memory (ROM), etc., or any combination thereof. In some embodiments, the storage module 240 and the storage module 160 can be the same module.

[0071] The communication module 250 can be used to exchange information or data. In some embodiments, the communication module 250 can be used for communication between components within the workpiece polishing system 200, such as the control module 210, the polishing region determination module 220, the polishing module 230, the storage module 240, the communication module 250, and the input / output module 260. In some embodiments, the communication module 250 and the communication module 170 can be the same module.

[0072] The input / output module 260 can acquire, transmit, and send signals. The input / output module 260 can connect or communicate with other components in the workpiece polishing system 200. Other components in the workpiece polishing system 200 can connect or communicate through the input / output module 260. In some embodiments, the input / output module 260 can be connected to a network and obtain information through the network. In some embodiments, the input / output module 260 can obtain user input information through the network or communication module 250. In some embodiments, the input / output module 260 can obtain control instructions or reminders from the control module 210 through the network or communication module 250. In some embodiments, the input / output module 260 and the input / output module 180 can be the same module.

[0073] FIG. 3 is a schematic flow chart of an exemplary mold processing method according to some embodiments.

[0074] As shown in Figure 3, the mold processing process 300 may include steps 310 to 340. In some embodiments, the mold processing process 300 may be executed by a control device (such as the control module 110).

[0075] In step 310 , first surface information of a first mold is obtained, where the first mold is manufactured based on initial processing information. In some embodiments, step 310 may be performed by the surface information obtaining module 120 .

[0076] Initial processing information refers to information related to the mold manufacturing process of the processing equipment. In some embodiments, the initial processing information can be an initial processing program set by the processing equipment. In some embodiments, the initial processing information can be initial operating parameters set by the processing equipment.

[0077] The first mold refers to a mold produced by a processing device that has not been error-corrected. In some embodiments, the first mold can serve as a vehicle for displaying the processing errors of the processing device. For example, if the processing device experiences processing errors due to factors such as maintenance and repair, the first mold, produced based on the initial processing information of the processing device, can visualize the processing errors of the processing device, manifesting them as surface deformation of the processed surface.

[0078] Surface information refers to information reflecting the three-dimensional surface morphology of an object. Correspondingly, the first surface information refers to information corresponding to the three-dimensional surface morphology of the first mold. In some embodiments, the first surface information may include two-dimensional data representing the actual surface curve of the first mold. For example, the first mold is a mold made by rotary turning using a CNC lathe, so that the machined surface of the first mold is a rotating surface. The first surface information includes two-dimensional data representing the characteristics of the rotating surface, such as the axis of rotation, the main line, the meridian, the weft circle and other data. In some embodiments, the first surface information may include three-dimensional data representing the actual surface shape of the first mold.

[0079] In some embodiments, the first surface information can be obtained by profile detection. In some embodiments, the device capable of performing profile detection to obtain the first surface information includes a contact profilometer and a non-contact profilometer. For example, the contact profilometer may include an inductive profilometer, a piezoelectric profilometer, and an inductive profilometer, and the non-contact profilometer may include an optical profilometer.

[0080] In some embodiments, the first surface information may be raw surface information obtained through contour detection. In some embodiments, the first surface information may be obtained based on preprocessing of the raw surface information. The raw surface information is obtained directly through contour detection. In some embodiments, the control module 110 controls the contact profilometer of the surface information acquisition module 120 to perform surface contour detection on the first mold to obtain two-dimensional raw surface curve data. The surface information acquisition module 120 then performs preprocessing on the raw surface curve data to eliminate some errors and obtain the first surface information.

[0081] In some embodiments, the pre-processing may include filtering. In some embodiments, the filtering may include but is not limited to average filtering, high-pass filtering, low-pass filtering, linear interpolation, clipping filtering, or median filtering.

[0082] Taking average filtering as an example, the raw surface curve data of the first mold obtained by the surface information acquisition module 120 includes a series of data points, each of which has the data format (X, Y). Starting from the initial data point, the X and Y values ​​of every 1000 data points are averaged to replace the value of the current data point to obtain the first surface information.

[0083] Taking high-pass filtering as an example, the surface roughness of the first mold is lower than the first threshold (such as Ra12.5 or Ra6.3), and the surface of the first mold is relatively smooth. After the surface information acquisition module 120 obtains the original surface curve data of the first mold obtained by contour detection, a high-pass filter (such as an ideal high-pass filter, a Butterworth high-pass filter, a Gaussian high-pass filter, etc.) can be used to filter the original surface curve data.

[0084] Taking low-pass filtering as an example, the surface roughness of the first mold is higher than the first threshold (such as Ra12.5 or Ra6.3) and lower than the second threshold (such as Ra100 or Ra50), and the surface of the first mold is relatively rough. After the surface information acquisition module 120 obtains the original surface curve data of the first mold obtained by contour detection, it can use a high-pass filter and a low-pass filter (such as an ideal low-pass filter, a Butterworth low-pass filter, a Gaussian low-pass filter, etc.) to filter the original surface curve data.

[0085] In some embodiments, linear interpolation may include linear interpolation, circular interpolation, parabolic interpolation, spline interpolation, etc. For example, if the surface of the first mold has defects such as burrs or protrusions that can be detected by machine vision or naked eye observation, the surface information acquisition module 120 performs linear interpolation on the original surface curve data corresponding to the defect location.

[0086] In some embodiments, the first mold is a mold without a covering layer. The mold processing methods of some embodiments of this specification can be used to process polishing molds. The polishing mold surface has a porous, flexible covering layer (such as polishing leather) to facilitate the attachment of polishing powder. This flexible covering layer affects the accuracy of contour detection. If the first mold is a mold without a covering layer, accurate and reliable first surface information can be obtained through contour detection.

[0087] In some embodiments, the first mold is made of a metal material, such as a pure metal or an alloy. The properties and processing characteristics of the metal material make the first mold easy to process and provide a desired surface roughness, thereby facilitating contour detection and preprocessing of the first surface information. In some embodiments, the first mold is preferably made of brass.

[0088] In step 320 , compensation information is obtained based on the first surface information and the target surface information. In some embodiments, step 320 may be performed by the compensation information obtaining module 130 .

[0089] Target surface information refers to information reflecting the theoretically generated three-dimensional surface topography of a target mold. The target mold is a theoretically generated mold. In some embodiments, the target surface information may include two-dimensional data reflecting the theoretical surface curve of the target mold. For example, if the theoretical processing surface of the target mold is an ellipsoid, the target surface information may include two-dimensional data representing the characteristics of the ellipsoid, such as the center coordinates, major axis, and minor axis.

[0090] In some embodiments, the target surface information is generated using a mathematical prediction model based on the initial processing information. For example, the compensation information acquisition module 130 may retrieve the initial processing information stored in the storage module 160 and use the mathematical prediction model to generate the target surface information. In some embodiments, the target surface information is determined based on user input. For example, the control module 110 may receive the target surface information input by the user via the input / output module 180 and store it in the storage module 160.

[0091] Compensation information refers to information related to the processing errors of the processing equipment. In some embodiments, the processing errors are systematic errors. For example, maintenance or repair of the processing equipment may cause systematic errors, making the initial processing information determined before the maintenance or repair no longer applicable to the processing equipment after the maintenance or repair. Consequently, the error between the first mold produced by the processing equipment based on the initial processing information and the target mold exceeds the allowable range.

[0092] In some embodiments, compensation information is obtained by comparing the first surface information with the target surface information. For example, the theoretical processing surface of the target mold is a surface of revolution, and its theoretical generatrix is ​​a parabola. The target surface information includes two-dimensional data representing the theoretical generatrix, and the target surface information is stored in the storage module 160. The actual generatrix of the first mold processing surface measured by the surface information acquisition module 120 is another parabola. The first surface information includes two-dimensional data representing the actual generatrix, wherein the difference between the maximum curvature radius of each point on the theoretical generatrix and the actual generatrix can be greater than a preset threshold. The compensation information acquisition module 130 can call the two-dimensional data of the theoretical generatrix and the actual generatrix for comparative calculation to obtain compensation information.

[0093] Some embodiments of this specification obtain compensation information based on the first surface information and the target surface information, and reflect the processing error of the first mold through the compensation information, so that the mold processing process can be corrected based on the compensation information, thereby improving the processing accuracy.

[0094] For more information about compensation information acquisition, please refer to Figure 4 and its description.

[0095] In step 330 , target processing information is generated based on the initial processing information and the compensation information. In some embodiments, step 330 may be performed by the processing information generating module 140 .

[0096] In some embodiments, the target processing information is generated after the initial processing information is compensated once or multiple times. In some embodiments, the target processing information can be a target processing program or a target processing parameter.

[0097] In some embodiments, the initial processing information is an initial processing program, and a first compensation program can be generated based on the initial processing program and the compensation information. The control module 110 invokes the first compensation program generated by the processing information generation module 140 and controls the processing equipment of the processing module 150 to produce a mold. If the mold meets the error limit requirements, the first compensation program becomes the target processing program. If the mold produced by the processing equipment of the processing module 150 using the first compensation program does not meet the error limit requirements, steps 320 and 330 are repeated, causing the processing information generation module 140 to iterate the initial processing program multiple times until the target processing program is generated.

[0098] In some embodiments, the initial processing information is an initial processing parameter, and a first compensation parameter can be generated based on the initial processing parameter and the compensation information. For example, if the processing equipment is a lathe, its initial processing parameters may include a feed amount, a feed angle, and a feed speed. Based on the compensation information and the initial processing parameters, a first compensation feed amount, a first compensation feed angle, and a first compensation feed speed can be generated. The control module 110 calls the first compensation parameter generated by the processing information generation module 140. The control module 110 resets the processing equipment of the processing module 150 based on the first compensation parameter and produces a mold. If the mold produced after the reset parameters meets the error limit requirements, the first compensation parameter is the target processing parameter; otherwise, steps 320 and 330 are repeated to update the initial processing parameters multiple times until the target processing parameters are generated.

[0099] For more information about target processing information generation, please refer to Figure 5 and its description.

[0100] In step 340 , a standard mold 10 is prepared based on the target processing information, wherein the standard mold 10 includes a mold body 11 and a cover layer 12 . In some embodiments, step 340 may be performed by the processing module 150 .

[0101] The standard mold 10 is a mold that meets the tolerance-related limit requirements. In some embodiments, the mold body 11 of the standard mold 10 is made of a hard material, such as a metal or alloy. The mold body 11 provides structural support for the standard mold 10, and the hard material of the mold body 11 facilitates machining. In some embodiments, the hard materials that can be used to machine the mold body 11 include, but are not limited to, brass, aluminum, stainless steel, cast iron, and the like. In some embodiments, the hard material used to machine the mold body 11 is preferably brass.

[0102] In some embodiments, the cover layer 12 of the standard mold 10 is made of a flexible material, such as a polymer. Depending on the application scenario, the cover layer 12 of the standard mold 10 has different functions. For example, if the standard mold 10 is used for polishing, its cover layer 12 assists in polishing. The cover layer 12 is provided with a number of holes to facilitate the entry and adhesion of polishing powder. In some embodiments, flexible materials that can be used to process the cover layer 12 include, but are not limited to, polyurethane, damping cloth, and synthetic organic compounds. In some embodiments, the flexible material used to process the cover layer 12 is preferably polyurethane.

[0103] In some embodiments, the standard mold 10 is prepared by processing the mold body 11 and the cover layer 12 in separate steps.

[0104] In some embodiments, the mold body 11 is produced by turning based on the target processing information. For example, the control module 110 may call a target processing program generated by the processing information generation module 140. The control module 110 may control the turning device of the turning submodule to turn the raw material based on the target processing program or target processing parameters to produce the mold body 11.

[0105] In some embodiments, after the cover layer 12 is bonded to the mold body 11, the cover layer 12 is polished to produce the standard mold 10. The control module 110 can control the processing module 150 to polish the cover layer 12 bonded to the processing surface of the mold body 11 to reduce or eliminate wrinkles and / or undulations in the cover layer 12 caused by bonding.

[0106] In some embodiments, after the covering layer 12 is bonded to the mold body 11, the standard mold 10 is produced by lathing the covering layer 12. The control module 110 can control the lathing submodule of the processing module 150 to lathe the covering layer 12 bonded to the processing surface of the mold body 11 based on the target processing information. The cladding mold formed after the covering layer 12 is bonded to the mold body 11 cannot be analyzed for error and controlled for processing accuracy through contour detection or other means (the flexible covering layer affects detection accuracy). Compared to the grinding process, which is difficult to quantify and standardize, standardized lathing based on the target processing information can ensure processing accuracy and consistency of the finished mold, and improve the yield rate.

[0107] For more information on standard mold preparation, please refer to Figures 6 and 7 and their descriptions.

[0108] Some embodiments of this specification prepare standard molds based on target processing information, which can enable standardized batch processing of the standard molds with high processing accuracy and finished product consistency.

[0109] FIG4 is a schematic diagram illustrating an exemplary flow of a compensation information obtaining process according to some embodiments.

[0110] When using a contour detection device to detect the three-dimensional surface topography of a mold, data distortion or missing data may occur at the edges of the corresponding surface topography. For example, control module 110 controls the contact profilometer of surface information acquisition module 120 to detect the first mold. Because the contact profilometer performs contour detection based on a preset activation range, the edges of the first mold must remain outside this preset activation range to ensure that the probe of the contact profilometer remains in contact with the surface of the first mold during detection. As a result, the first surface information of the first mold obtained by surface information acquisition module 120 lacks data related to the edges of the first mold, resulting in increased errors in the compensation information at the edges of the first mold.

[0111] As shown in FIG4 , compensation information acquisition process 400 may include steps 410 and 420. In some embodiments, compensation information acquisition process 400 may be executed by a control device (e.g., control module 110). In some embodiments, compensation information acquisition process 400 may perform compensation and expansion on the main body and edges of the first mold to reduce errors.

[0112] In step 410 , body compensation information corresponding to the first mold body is obtained based on a comparison between the first surface information and the target surface information. In some embodiments, step 410 may be performed by a body compensation submodule of the compensation information acquisition module 130 .

[0113] In some embodiments, the main body and edge of the first mold can be determined based on the range of contour detection. As an example only, the surface to be measured (processing surface) of the first mold is a rotating surface, and its cross-sectional diameter perpendicular to the rotation axis is In the range of 0mm to 50mm. Among them, the detection range of the contact profilometer can be the cross-sectional diameter of the first mold The surface area within the range of 1mm to 49mm corresponds to the main body of the first mold; the cross-sectional diameter of the first mold The surface areas within the range of 0 mm to 1 mm and within the range of 49 mm to 50 mm correspond to the edges of the first mold.

[0114] In some embodiments, the main body of the first mold can be determined based on user input. For example, before the control module 110 controls the surface information acquisition module 120 to detect the first mold to obtain the first surface information, the user can send the start and end position information of the contour detection to the control module 110 via the input / output module 180. The control module 110 determines the main body range of the first mold based on the start and end position information input by the user and controls the surface information acquisition module 120 to perform contour detection.

[0115] In some embodiments, the main body of the first mold can be determined based on preset rules. For example, in combination with the aforementioned example where the machining surface of the first mold is a revolving surface, the generatrix of the revolving surface can be an arc, and the control module 110 controls the contour detector of the surface information acquisition module 120 to perform contour detection along the generatrix of the revolving surface. The control module 110 can determine based on preset rules that the distance between the starting position of the contour detection and the first end of the generatrix is ​​a first predetermined value (such as 1mm, 3mm, 5mm, etc.), and the distance between the end position of the contour detection and the second end of the generatrix is ​​a first predetermined value, then the area between the starting position and the end position of the contour detection corresponds to the main body of the first mold. In some embodiments, the preset rules can be stored in the storage module 160.

[0116] In some embodiments, the main body compensation information corresponding to the first mold body can be obtained based on the comparison of the first surface information and the target surface information. There may be an error between the first surface information and the target surface information, and the main body compensation information obtained by comparing the two can reflect the error. For example, in conjunction with the aforementioned example where the first mold processing surface is a rotational surface, the first surface information includes two-dimensional curve data on the busbar of the first mold corresponding to the first mold body, and the target surface information includes two-dimensional curve data on the busbar of the target mold corresponding to the target mold body. By comparing the first surface information and the target surface information, the difference in X value and / or Y value between each point on the busbar of the first mold and the corresponding point on the target mold can be obtained, that is, the main body compensation information is obtained.

[0117] In step 420 , edge extension information corresponding to the first mold edge is obtained based on the data trend of the first surface information. In some embodiments, step 420 may be performed by the edge compensation submodule of the compensation information acquisition module 130 .

[0118] In some embodiments, the first surface information can reflect the three-dimensional morphological changes of the main body of the first mold. Based on the data trend of the first surface information, numerical fitting is performed to obtain edge surface information corresponding to the edge of the first mold. For example, in combination with the aforementioned example where the first mold processing surface is a revolving surface, the generatrix of the revolving surface can be a broken line, and the control module 110 controls the contour detector of the surface information acquisition module 120 to perform contour detection along the generatrix of the revolving surface. The first surface information of the first mold includes curve data on the generatrix of the first mold corresponding to the main body of the first mold. The curve data (such as end data) can be used to perform linear fitting (such as univariate linear regression fitting) to obtain edge surface information corresponding to the edge of the first mold.

[0119] In some embodiments, edge extension information can be further obtained based on the comparison of edge surface information and target surface information. There may be an error between the edge surface information and the target surface information, and the edge extension information obtained by comparing the two can reflect the error. For example, in conjunction with the aforementioned example in which the first mold processing surface is a revolving surface, the edge surface information includes two-dimensional curve data on the busbar of the first mold corresponding to the edge of the first mold, and the target surface information includes two-dimensional curve data on the busbar of the target mold corresponding to the edge of the target mold. By comparing the edge surface information and the target surface information, the difference in X value and / or Y value between each point on the busbar of the first mold and the corresponding point on the target mold can be obtained, that is, the edge extension information is obtained.

[0120] FIG. 5 is a schematic diagram illustrating an exemplary flow of a process for generating target processing information according to some embodiments.

[0121] 5 , the target processing information generation process 500 may include steps 510 to 540. In some embodiments, the process 500 may be executed by a control device (eg, the control module 110).

[0122] In step 510, verification processing information is generated based on the initial processing information and the compensation information. In some embodiments, step 510 may be performed by the processing information generation module 140. In some embodiments, the verification processing information may be used to verify processing errors, thereby ensuring the error correction effect of the generated target processing information and guaranteeing processing accuracy.

[0123] In step 520 , second surface information of a second mold is obtained, where the second mold is manufactured based on the processing information to be inspected. In some embodiments, step 520 may be performed by the surface information acquisition module 120 .

[0124] In some embodiments, the second surface information refers to information reflecting the three-dimensional surface topography of the second mold. In some embodiments, the second surface information can be obtained by performing contour detection by the surface information acquisition module 120; the second mold can be manufactured by the processing module 150. For example, the control module 110 calls the unverified processing information generated by the processing information generation module 140 and controls the turning submodule of the processing module 150 to turn the second mold based on the unverified processing information, wherein the machined surface of the second mold obtained by turning is a rotary surface. The control module 110 controls the contact profilometer of the surface information acquisition module 120 to perform surface contour detection on the machined surface of the second mold to obtain two-dimensional surface curve data.

[0125] In step 530 , based on the second surface information and the target surface information, it is determined whether the surface error of the second mold is within a preset value range. In some embodiments, step 530 may be performed by the processing information generation module 140 .

[0126] In some embodiments, the second surface information and the target surface information are both two-dimensional surface curve data, and the surface error of the second mold can be calculated based on the second surface information and the target surface information. The surface error of the second mold refers to the error between each point on the machining surface of the second mold, or a representative series of feature points, and each corresponding point on the target mold. For example, the second surface information includes the two-dimensional coordinates of a series of detection points on the surface of the second mold, and the target surface information includes the two-dimensional coordinates of a series of simulation points on the surface of the target mold. The surface error value corresponding to the detection point can be obtained by calculating the distance between the detection point and the corresponding simulation point.

[0127] In some embodiments, the surface error of the second mold being within a preset range may mean that the maximum surface error is less than a preset value. The surface errors at various locations on the second mold may be the same or different, and if the maximum surface error is less than a specific preset value, the second mold is considered to meet the error limit requirements.

[0128] In some embodiments, the preset value is a default value stored in storage module 160 and available for retrieval. For example, the preset value may be 10 μm. In some embodiments, the preset value may be determined based on user input. For example, before processing information generation module 140 determines whether the surface error of the second mold is within a preset value range, control module 110 sends a query to the user via input / output module 180, asking whether to set the preset value. After the user responds, control module 110 receives the preset value entered by the user and sends it to processing information generation module 140.

[0129] In step 540 , target processing information is determined based on the surface error determination result of the second mold. In some embodiments, step 540 may be performed by the processing information generation module 140 .

[0130] In some embodiments, step 540 further includes determining that the surface error of the second mold is within a preset range, then determining that the to-be-verified processing information corresponding to the second mold is target processing information. The target processing information corrects the system errors of the processing equipment (e.g., a lathe) of the processing module 150, enabling the processing module 150 to perform high-precision, standardized mold processing based on the target processing information, thereby accommodating batch processing of molds.

[0131] In some embodiments, step 540 further includes: if it is determined that the surface error of the second mold is not within a preset value range, then the current round of process 500 is terminated and the next round of step 320 and process 500 is executed, until the target processing information is generated. For example, if the processing information generation module 140 determines that the surface error of the second mold is not within a preset value range, the control module 110 controls the processing information generation module 140 to terminate the currently executing target processing information generation process 500. The control module 110 transmits the second surface information measured by the surface information acquisition module 120 to the compensation information acquisition module 130. The control module 110 controls the compensation information acquisition module 130 to execute step 320, obtain compensation information for a second time based on the second surface information and the target surface information, transmit this second obtained compensation information to the processing information generation module 140, and control the processing information generation module 140 to execute the second round of process 500. If the second round of process 500 determines that the surface error of the third mold is not within the preset range, the control module 110 terminates the second round of process 500 and continues to loop through the next round of step 320 and process 500 until the target processing information is generated.

[0132] The target processing information generation process of some embodiments of this specification corrects the system error of the processing equipment (such as the turning sub-module of the processing module 150). The processing equipment can perform mold processing in batches based on the target processing information generated by the target processing information generation process, which can improve the processing accuracy and standardization.

[0133] FIG. 6 is a schematic diagram illustrating an exemplary process flow of a standard mold preparation process according to some embodiments.

[0134] As shown in Figure 6, the standard mold preparation process 600 may include steps 610 to 630. In some embodiments, the process 600 may be executed by a control device (such as the control module 110).

[0135] In step 610, the initial mold 10' is turned based on the target processing information to obtain the mold body 11. In some embodiments, step 610 can be performed by the processing module 150 (eg, the turning submodule).

[0136] In some embodiments, the initial mold 10' is a material to be processed. For example, the initial mold 10' can be a cylindrical metal material, the surface to be processed of the initial mold 10' is a plane, and the mold body 11 is turned based on the surface to be processed of the initial mold 10', and the processed surface of the mold body 11 is an inner spherical surface.

[0137] In some embodiments, the initial mold 10' can be directly turned based on the target processing information to obtain the mold body 11. For example, the turning submodule of the processing module 150 calls the target processing program generated by the processing information generation module 140 to turn the initial mold 10' to obtain the mold body 11.

[0138] In step 620 , the cover layer 12 is attached to the mold body 11 . In some embodiments, step 620 may be performed by a heating submodule and a pressing submodule of the processing module 150 .

[0139] In some embodiments, step 620 further includes a heating step in which the mold body 11 is heated. In some embodiments, the heating step may be performed by a heating submodule of the processing module 150 .

[0140] In some embodiments, the mold body 11 can be heated by a heating coil. Preferably, the heating coil is a high-frequency induction coil. The heating coil can generate eddy currents in the mold body 11, which is an electrical conductor, and quickly heat the mold body 11 through electromagnetic induction.

[0141] In some embodiments, controlling the heating position of the heating coil relative to the mold body 11 during the heating process can adjust the heating uniformity of the mold body and improve the heating efficiency. In some embodiments, the heating position of the heating coil relative to the mold body 11 can be determined based on the size of the mold body, for example, the heating position can be determined based on the diameter and / or height of the mold body. In a specific example, the diameter of the mold body 11 is less than a preset value (for example, 100 mm), and the heating coil can be arranged on the circumference of the mold body 11. When the height of the mold body 11 is greater than the height of the heating coil, the bottom surface of the heating coil can be flush with the bottom surface of the mold body 11. When the height of the mold body 11 is less than or equal to the height of the heating coil, the top surface of the heating coil can be flush with the top surface of the mold body 11. In another specific example, the diameter of the mold body 11 is greater than or equal to a preset value (for example, 100 mm), and the heating coil can be arranged at the bottom of the mold body 11. In some embodiments, the mold body 11 can be heated more evenly by rotating the mold body 11.

[0142] In some embodiments, the axis of the heating coil passes through the mold body 11 to be heated. In some preferred embodiments, the mold body 11 can be a rotating body, and the axis of the heating coil coincides with the axis of the mold body 11 to be heated to improve the heating effect.

[0143] In some embodiments, the heating temperature of the heating coil is 160° C. to 200° C., for example, the heating temperature may be approximately 160° C., 165° C., 170° C., 175° C., 180° C., 185° C., 190° C., 195° C., or 200° C. In some embodiments, the heating temperature of the heating coil is preferably 170° C. to 190° C. Heating the mold body 11 to an appropriate temperature facilitates bonding of the cover layer 12.

[0144] In some embodiments, step 620 further includes a pressing step in which the cover layer 12 is pressed against the heated mold body 11 to adhere the cover layer 12 to the mold body 11. In some embodiments, the pressing step may be performed by a pressing submodule of the processing module 150.

[0145] In some embodiments, the covering layer 12 can be bonded to the heated mold body 11 based on its physical properties. For example, the covering layer 12 can be made of a flexible polymer material, such as polyurethane. The mold body 11 is heated to within the melting point of the polyurethane, causing the portion of the covering layer 12 contacting the mold body 11 to melt. This melted portion tightly bonds to the mold body 11, allowing the covering layer 12 to adhere to the mold body 11.

[0146] In some embodiments, an adhesive medium is pre-applied to the surface of the heated mold body 11, and the cover layer 12 is bonded to the heated mold body 11 via the adhesive medium. For example, a predetermined amount of polyurethane is pre-melted and applied to the heated mold body 11. The polyurethane cover layer 12 is then placed on the mold body 11, and the cover layer 12 and the mold body 11 are bonded together by the pre-melted polyurethane. In some embodiments, the adhesive medium can be the material used to make the cover layer 12, or it can be another adhesive material, which is not limited in this embodiment.

[0147] In some embodiments, the covering layer 12 and the heated mold body 11 are compacted by a pressurized platen tooling 30 to produce a cladding mold 10". Exemplarily, as shown in FIG7 , the heated mold body 11 is placed on a tooling base, and the covering layer 12 is placed on the pressure-bearing surface of the mold body 11. The driving device 40 of the platen tooling 30 is installed above the mold body 11 through a tooling bracket, and the platen tooling 30 is fixed on the driving rod 41 of the driving device 40. The platen tooling 30, the covering layer 12 and the heated mold body 11 are aligned in the vertical direction, and the platen tooling 30 moves in the vertical direction to pressurize the covering layer 12 and the heated mold body 11, so that the covering layer 12 and the heated mold body 11 are compacted to produce a cladding mold 10".

[0148] In some embodiments, the curvature of the pressure-applying surface of the pressure plate fixture 30 matches the curvature of the pressure-bearing surface of the mold body 11. This curvature matching ensures that when the pressure-applying surface of the pressure plate fixture 30 is aligned with the pressure-bearing surface of the mold body 11, the pressure-applying surface and the pressure-bearing surface are substantially parallel. That is, the difference in curvature radius between each point on the pressure-bearing surface and the corresponding point on the pressure-applying surface is within a preset threshold range (e.g., no more than 1 mm). This ensures that the covering layer 12 placed on the pressure-bearing surface of the mold body 11 is uniformly stressed, thereby ensuring that the covering layer 12 is evenly adhered to the pressure-bearing surface of the mold body 11.

[0149] In some embodiments, the pressure range of the pressure plate fixture 30 is 0.1Mpa to 0.8Mpa. For example, the pressure surface of the pressure plate fixture 30 can apply a pressure of about 0.1Mpa, 0.2Mpa, 0.3Mpa, 0.4Mpa, 0.5Mpa, 0.6Mpa, 0.7Mpa or 0.8Mpa to the pressure-bearing surface of the mold body 11, so that the covering layer 12 is compacted and fitted with the mold body 11. In some preferred embodiments, the pressure range of the pressure plate fixture 30 is 0.3Mpa to 0.6Mpa. For example, if the pressure-bearing surface (i.e., the processing surface) of the mold body 11 is a rotating surface, and the maximum cross-sectional diameter of the rotating surface is ≤50mm, the pressure applied by the pressure plate fixture 30 can be about 0.3Mpa. For another example, the pressure-bearing surface (ie, the processing surface) of the mold body 11 is a rotary surface, and the maximum cross-sectional diameter of the rotary surface is ≤80 mm and ≥51 mm. The pressure applied by the pressure plate fixture 30 can be approximately 0.6 MPa.

[0150] In some embodiments, the driving device 40 of the pressure plate fixture 30 may be a pneumatic cylinder or a hydraulic cylinder. In some embodiments, the driving device 40 of the pressure plate fixture 30 may be other devices having a driving function, which is not limited in this embodiment.

[0151] In step 630 , the cover layer 12 is turned based on the target processing information to produce the standard mold 10 . In some embodiments, step 630 may be performed by a turning submodule of the processing module 150 .

[0152] In some embodiments, after the covering layer 12 is compacted with the mold body 11, unpredictable and uncontrollable unevenness may occur on the surface of the covering layer 12. Turning the covering layer 12 of the cladding mold 10" based on the target machining information can reduce or eliminate the errors caused by these unevenness. For example, the control module 110 calls the target machining program generated by the machining information generation module 140 and controls the turning submodule of the machining module 150 to turn the covering layer 12 of the cladding mold 10" using the target machining program to eliminate uneven wrinkles on the surface of the covering layer 12 that do not meet the error limit requirements, thereby producing a standard mold 10.

[0153] In some embodiments, the turning of the covering layer 12 based on the target processing information to obtain the standard mold 10 may further include: generating coating compensation information based on the target processing information and the coating information; turning the covering layer 12 of the coating mold 10" based on the coating compensation information to obtain the standard mold 10. The influence of the coating 12 is excluded when generating the target processing information. The coating compensation information can introduce a correction corresponding to the coating 12 when processing the standard mold 10 to avoid excessive turning of the coating 12. For example, the processing information generation module 140 performs coating correction on the target processing program (such as offsetting the entire processing surface by a predetermined distance) based on the coating information (such as thickness) input by the user to obtain a coating compensation program; the control module 110 calls the coating compensation program generated by the processing information generation module 140, and uses the coating compensation program to control the turning sub-module of the processing module 150 to turn the coating 12 of the coating mold 10" to obtain the standard mold 10.

[0154] During the preparation of the standard mold in some embodiments of this specification, the covering layer 12 of the cladding mold 10" is turned based on the target processing information to obtain the standard mold 10. Compared with the grinding process, turning the cladding mold 10" is easier to achieve standardized batch processing, with short processing time and high consistency of the finished product.

[0155] The standard molds prepared by the mold processing methods of some embodiments of this specification can be used to polish workpieces, which helps to achieve standardization of the workpiece polishing process. The polishing process of the workpiece usually uses a separate polishing mold to polish all polishing areas of the workpiece, which needs to be achieved by frequently adjusting the polishing parameters (such as swing amplitude, pressure, etc.) of the polishing equipment. This not only makes the production of the polishing mold more difficult, but also limits the polishing accuracy because it is difficult to fully take into account the polishing of all polishing areas. In addition, frequent adjustment of polishing parameters also makes the adjustment of the polishing equipment difficult and time-consuming, which limits the standardization of the polishing process. In some embodiments of this specification, by using multiple standard molds to perform partitioned polishing of the workpiece, when the polishing requirements remain unchanged, the polishing parameters of the polishing equipment corresponding to each standard mold remain unchanged, and the corresponding partitions of the same type of workpiece can be batched, standardized, and high-precision polished without frequent adjustment, thereby reducing the time cost brought by the adjustment of the polishing equipment. At the same time, partitioned polishing of multiple standard molds can reduce the processing difficulty of a single standard mold, ensure the processing accuracy of a single standard mold, and further improve the polishing accuracy.

[0156] FIG. 8 is a schematic flow chart illustrating an exemplary method of polishing a workpiece according to some embodiments.

[0157] As shown in FIG8 , workpiece polishing process 800 may include steps 810 to 830. In some embodiments, workpiece polishing process 800 may be executed by a control device (e.g., control module 210). In some embodiments, workpiece polishing process 800 may be performed by differentiating the polishing process for different polishing areas of the workpiece, thereby reducing the difficulty of polishing the mold while improving polishing accuracy and efficiency.

[0158] In some embodiments, the workpiece 20 may include a polishing region to be zoned and polished, such as a single-sided lens including a single convex or concave polishing region. In some embodiments, the workpiece may include multiple polishing regions to be zoned and polished, with the multiple polishing regions having non-overlapping distributions on the workpiece surface, such as a double-sided lens including two convex or concave polishing regions. Process 800 may be independently executed for each of the one or more polishing regions of the workpiece to perform zoned polishing.

[0159] In step 810 , at least a first polishing region 21 and a second polishing region 22 of the workpiece 20 are determined. In some embodiments, step 810 may be performed by the polishing region determination module 220 .

[0160] In some embodiments, the workpiece 20 may have two sub-polishing regions, such as a first polishing region 21 and a second polishing region 22. The two sub-polishing regions of the workpiece 20 may cover the polishing region of the workpiece 20. In some embodiments, the workpiece 20 may further include a third polishing region, and fourth to Nth polishing regions. The two or more sub-polishing regions of the workpiece 20 may cover the polishing region of the workpiece 20. This embodiment does not limit the number of sub-polishing regions.

[0161] In some embodiments, different sub-polishing regions of the workpiece 20 may be determined based on the curvature radius of the polishing region, such as determining at least a first polishing region 21 and a second polishing region 22 .

[0162] As an example only, the workpiece 20 is a single-sided lens to be polished, and its polishing area is an aspheric surface of revolution (convex surface). The projection of its axial section in the axial-radial coordinate system is a parabola, and the curvature radius of the polishing area is between 5mm and 35mm. The polishing area determination module 220 can determine the first polishing area 21 as an area with a polishing area curvature radius of 5mm to 10mm based on the curvature radius range of the polishing area of ​​the workpiece 20, and determine the second polishing area 22 as an area with a polishing area curvature radius of 10mm to 35mm. The curvature radius range of each sub-polishing area of ​​the workpiece 20 can be set according to actual processing requirements and is not limited in this embodiment.

[0163] In some embodiments, each polishing region of the workpiece 20 is partitioned based on a radius of curvature, with each sub-polishing region having different radii of curvature. For example, the workpiece 20 has an aspherical polishing region, where a first polishing region 21 and a second polishing region 22 overlap the polishing region of the workpiece 20. The first polishing region 21 and the second polishing region 22 have different radii of curvature. Partitioned polishing facilitates standardized batch polishing.

[0164] In some embodiments, different sub-polishing regions of the workpiece 20 may be determined based on a pre-polishing process, such as determining at least a first polishing region 21 and a second polishing region 22. The pre-polishing process may include a shape feature determination step, a pre-polishing step, and a sub-polishing region determination step.

[0165] In the feature determination step, shape features of the polishing area of ​​the workpiece 20 may be determined. In some embodiments, the shape features may include a radius of curvature, a rate of change of a radius of curvature, a curved surface shape, or any combination thereof.

[0166] In the pre-polishing step, the polishing region of the test workpiece may be pre-polished based on the shape characteristics of the polishing region of the workpiece 20 , and the test workpiece is selected from the workpiece 20 .

[0167] Pre-polishing is the process of obtaining polishing results of a test workpiece under a predetermined polishing strategy (e.g., an overall polishing strategy and / or a partitioned polishing strategy). In some embodiments, one or more workpieces 20 produced in the same batch can be selected as test workpieces for pre-polishing.

[0168] The polishing results can be used to guide the polishing of the subareas of the workpiece 20. In some embodiments, the polishing results include parameter information of the polished areas of the test workpiece after pre-polishing. The parameter information can be used to reflect changes in the shape characteristics of the test workpiece before and after pre-polishing. In some embodiments, the parameter information is determined by comparing the shape characteristics of the polished areas of the test workpiece before and after pre-polishing.

[0169] In some embodiments, the parameter information includes a polishing removal rate. After pre-polishing of a test workpiece, there may be differences in the polishing removal rates of two or more regions. This difference in polishing removal rates may indicate the optimization direction of the polishing strategy for the workpiece 20. In some embodiments, the polishing removal rate of the test workpiece after pre-polishing can be obtained by profile detection. For example, before and after pre-polishing, profile detection is performed on the polishing region of the test workpiece to obtain pre-pre-polishing curve (or surface) data and post-pre-polishing curve (or surface) data. Based on the comparison of the pre-pre-polishing curve (or surface) data and the post-pre-polishing curve (or surface) data, the polishing removal rate of each region after pre-polishing is determined.

[0170] In some embodiments, the pre-polishing step further includes: pre-polishing a polishing area of ​​the test workpiece based on an overall polishing strategy to produce a first test workpiece; and obtaining first parameter information of the first test workpiece.

[0171] The first test workpiece can be used to simulate the polishing effect of the workpiece 20 under the overall polishing strategy. In some embodiments, there can be one or more first test workpieces; and the first parameter information can be determined after comprehensive analysis of parameter information of multiple first test workpieces.

[0172] The first parameter information can be used to reflect the change in shape characteristics of the test workpiece before and after the overall pre-polishing. In some embodiments, the first reference information can be obtained based on the detection and analysis of one or more first test workpieces.

[0173] In some embodiments, pre-polishing of the test workpiece is performed using a pre-polishing tool, and the shape characteristics of the polishing surface of the pre-polishing tool are determined based on the shape characteristics of the polishing area of ​​the workpiece 20 and the corresponding polishing strategy. The first test workpiece is produced by pre-polishing the entire test workpiece using a first polishing tool, and the polishing surface characteristics of the first pre-polishing tool are determined based on the shape characteristics of the polishing area of ​​the workpiece 20 and the overall polishing strategy.

[0174] In one specific example, the surfaces to be polished of the workpiece 20 and the test workpiece are aspherical surfaces. The polishing surface of the first pre-polishing fixture can be another aspherical surface that fits into the aspherical surface to be polished. Alternatively, the polishing surface of the first pre-polishing fixture can be a spherical surface that contacts and fits with the aspherical surface to be polished. For example, the radius of curvature of the spherical polishing surface can be the average of the radius of curvature of the aspherical surface to be polished. In another specific example, the surfaces to be polished of the workpiece 20 and the test workpiece are spherical surfaces. The polishing surface of the first pre-polishing fixture can be another spherical surface that fits into the spherical surface to be polished. Alternatively, the polishing surface of the first pre-polishing tool can be a non-spherical surface that contacts and cooperates with the spherical surface to be polished. For example, the polishing surface can be an ellipsoidal surface or other arc-shaped rotational surface. The inner side of the ellipsoidal surface or other arc-shaped rotational surface can be connected to a spherical circle of a specific radius on the outer side of the spherical surface to be polished, and the difference in the curvature radius of the connecting part between the two is within a preset threshold range (for example, not more than 0.01mm, 0.03mm, 0.05mm or 0.08mm).

[0175] In some embodiments, the pre-polishing step further includes: generating a first partition polishing strategy based on the first parameter information and a preset threshold condition; pre-polishing the polishing area of ​​the test workpiece based on the first partition polishing strategy to produce a second test workpiece; and obtaining second parameter information of the second test workpiece.

[0176] The preset threshold condition can be used to classify / screen sub-polishing areas with different polishing results in the polishing area. In some embodiments, the preset threshold condition includes a polishing removal rate threshold. For example, after the polishing area of ​​the test workpiece is pre-polished, the polishing removal rate of some sub-polishing areas may be low, which can be considered as not being effectively polished. It is suitable to use the polishing removal rate threshold to set the classification condition of the sub-polishing area to perform partition optimization of the polishing strategy. In some embodiments, the polishing removal rate threshold can be fixed, for example, it can be calculated based on the maximum polishing removal rate and / or the minimum polishing removal rate. For example, the polishing removal rate threshold can be the average of the maximum polishing removal rate and the minimum polishing removal rate, or it can be the product of the minimum polishing removal rate and an empirical coefficient (e.g., 1.1, 1.2, 1.3, or 1.5). In other embodiments, the polishing removal rate threshold can be an empirical value based on user input.

[0177] In some embodiments, the preset threshold condition also includes a polishing removal rate difference threshold. For example, after pre-polishing a polishing area of ​​a test workpiece, there may be a difference in polishing removal rates between two or more sub-polishing areas. If the polishing removal rates of all sub-polishing areas are greater than or equal to the polishing removal rate threshold, the difference in polishing removal rate between one or more sub-polishing areas and the sub-polishing area with the highest polishing removal rate may be too large, indicating that the polishing accuracy of these sub-polishing areas needs to be optimized. Therefore, the polishing removal rate difference threshold can be used to set the classification conditions for the sub-polishing areas to optimize the polishing strategy.

[0178] In some embodiments, overall pre-polishing may not ensure that the first test workpiece meets the polishing accuracy requirements. The polishing area can be partitioned by comparing the first parameter information with a preset threshold condition, thereby formulating a targeted first partitioned polishing strategy. For example, for the polishing area of ​​the first test workpiece, sub-polishing areas with a polishing removal rate greater than or equal to a polishing removal rate threshold can be marked as Class 1 areas, and sub-polishing areas with a polishing removal rate less than the polishing removal rate threshold can be marked as Class 2 areas. Based on these partitions, a first partitioned polishing strategy is generated. For another example, if the polishing removal rate difference of some sub-polishing areas in the aforementioned Class 2 area exceeds the difference threshold, these areas can be separated from Class 2 areas and marked as Class 3 areas. Based on these partitions, a first partitioned polishing strategy is generated.

[0179] The second test workpiece is used to simulate the polishing effect of the workpiece 20 under the partitioned polishing strategy. In some embodiments, the second test workpiece is produced by pre-polishing the test workpiece using a second polishing fixture. The shape characteristics of the polishing surface of the second polishing fixture are determined based on the shape characteristics of the polishing area of ​​the workpiece 20 and the first partitioned polishing strategy. For example, the surfaces to be polished of the workpiece 20 and the test workpiece are aspherical surfaces. The first partitioned polishing strategy divides the polishing area of ​​the test workpiece into Class 1 and Class 2 areas. Class 1 and Class 2 areas are pre-polished using different second pre-polishing fixtures. The polishing surface of any one of the two second pre-polishing fixtures can be: a spherical surface that contacts and cooperates with the corresponding surface to be polished; or, a non-spherical surface that fits in with the corresponding surface to be polished. For another example, the surfaces to be polished of the workpiece 20 and the test workpiece are spherical surfaces. The polishing surface of any one of the two second pre-polishing fixtures can be: a non-spherical surface (for example, an ellipsoid or other arc-shaped surface of revolution) that contacts and cooperates with the corresponding surface to be polished; or, a spherical surface that fits in with the corresponding surface to be polished. For more information about the second pre-polishing tool, please refer to other parts of this specification (for example, the relevant description of the first pre-polishing tool).

[0180] It should be noted that in the pre-polishing step, pre-polishing based on different polishing strategies is performed using different test workpieces. Specifically, there may be multiple test workpieces, and the pre-polishing step may be performed using one of the multiple test workpieces to produce a first test workpiece, and another of the multiple test workpieces may be used to perform pre-polishing to produce a second test workpiece.

[0181] The second parameter information is used to reflect the change in shape characteristics of the test workpiece before and after the partition pre-polishing. In some embodiments, the second reference information can be obtained based on the detection and analysis of one or more first test workpieces.

[0182] In the sub-polishing region determining step, at least a first polishing region and a second polishing region of the workpiece 20 may be determined based on the pre-polishing result.

[0183] In some embodiments, the sub-polishing region determination step may further include determining at least a first polishing region and a second polishing region of the workpiece 20 based on the first parameter information and a preset threshold condition. In some embodiments, one or more rounds of overall polishing can be performed on the test workpiece based on the overall polishing strategy, and a partitioned polishing strategy (e.g., a first partitioned polishing strategy) can be obtained based on a comprehensive analysis of the polishing results of the overall polishing to determine the sub-polishing regions of the workpiece 20. For more information on obtaining the partitioned polishing strategy, please refer to other sections of this specification (e.g., the description of the first partitioned polishing strategy).

[0184] In some embodiments, the sub-polishing area determination step may further include: determining whether the second parameter information of the second test workpiece meets a preset threshold condition; if so, determining at least a first polishing area and a second polishing area of ​​the workpiece based on the first partitioned polishing strategy.

[0185] In some embodiments, a preset threshold condition can also be used to determine whether the polishing result meets the polishing accuracy requirements. The sub-polishing region determination step can verify whether the second parameter information obtained based on the first partitioned polishing strategy meets the polishing accuracy requirements before determining the sub-polishing region of the workpiece 20. If the second parameter information meets the preset threshold condition, the sub-polishing region of the workpiece 20 can be determined based on the first partitioned polishing strategy. If the second parameter information does not meet the preset threshold condition, a second or more rounds of partitioned pre-polishing can be performed until the corresponding partitioned polishing strategy obtained can ensure that the polishing result of the test workpiece (and the workpiece 20) meets the polishing accuracy requirements. In some embodiments, the second round of partitioned pre-polishing includes: generating a second partitioned polishing strategy based on the second parameter information and the predicted polishing conditions; pre-polishing the polishing region of the test workpiece based on the first partitioned polishing strategy to produce a second test workpiece; and obtaining second parameter information for the second test workpiece.

[0186] Some embodiments of this specification determine different sub-polishing areas of a workpiece as a basis for partitioned polishing. If the polishing accuracy of the workpiece does not meet the standard, the sub-polishing areas that need to be optimized can be accurately located to facilitate adjustment of polishing parameters and / or polishing molds.

[0187] In step 820 , the first polishing region 21 is polished using the first polishing mold 10 a. In some embodiments, step 820 may be performed by a first polishing sub-module of the polishing module 230 .

[0188] The first polishing mold 10a is used to polish the first polishing region 21. In some embodiments, the curvature of the polishing surface of the first polishing mold 10a matches the curvature of the surface to be polished in the first polishing region 21. For example, the first polishing region 21 is a portion of an aspherical polishing region, and the polishing surface of the first polishing mold 10a is a spherical surface. The difference in curvature radius between each point on the polishing surface of the first polishing mold 10a and the corresponding point on the surface to be polished in the first polishing region 21 is within a preset threshold range (e.g., no more than 0.01 mm, 0.03 mm, 0.05 mm, or 0.08 mm). When the polishing surface 13a of the first polishing mold 10a is aligned with the surface to be polished in the first polishing region 21, the surface to be polished can be closely aligned with the polishing surface 13a for polishing. For another example, the first polishing region 21 is a portion of a spherical polishing region, and the polishing surface of the first polishing mold 10a is an aspherical surface (e.g., an ellipsoid or other arc-shaped surface of revolution). The polishing surface of the first polishing mold 10a is connected to the surface to be polished of the first polishing area 21, and the difference in the curvature radius of the connecting portion is within a preset threshold range (for example, not exceeding 0.01mm, 0.03mm, 0.05mm or 0.08mm), so that the surface to be polished can be tightly fitted with the polishing surface at the connecting portion for polishing during the polishing process.

[0189] In some embodiments, the first polishing region 21 may be polished by at least one of axial rotation of the first polishing mold 10 a , rotational swing of the first polishing mold 10 a , and axial rotation of the workpiece 20 .

[0190] Figure 9 is a schematic diagram illustrating an exemplary structure of a polishing process for a first polishing region according to some embodiments. In one specific embodiment, as shown in Figure 9 , control module 210 controls the first polishing submodule of polishing module 230 to polish a first polishing region 21 of a workpiece 20, wherein the surface to be polished of the workpiece 20 is aspherical, and the polishing surface 13a of the first polishing mold 10a is spherical. Based on control instructions from control module 210, the first polishing submodule controls the first polishing mold 10a to perform rotational oscillation along direction w1 with O1 as the origin, axial rotation along direction n'1 with L2 as the axis, and axial rotation along direction n1 with L1 as the axis. The curvature of the first polishing region 21 matches that of the polishing surface 13a of the first polishing mold 10a. During these rotational oscillations and axial rotations, the first polishing mold 10a continuously applies pressure P1 to the workpiece 20, ensuring a close contact and friction between the polishing surface 13a and the first polishing region 21, thereby polishing the first polishing region 21.

[0191] In some embodiments, the first polishing mold 10a has first polishing parameters, which include at least a first swing amplitude parameter and a first pressure parameter. In some embodiments, the first polishing parameters may also include a first mold rotation parameter and / or a first workpiece rotation parameter.

[0192] Some embodiments of this specification utilize different polishing molds and polishing parameters to polish different sub-polishing areas of a workpiece, reducing the difficulty of adjusting the polishing equipment. Once the workpiece polishing accuracy meets the required requirements, once the polishing mold is assembled and the polishing parameters are set for the corresponding polishing mold, the polishing equipment no longer needs to be reconfigured, thus avoiding frequent adjustments that affect polishing efficiency.

[0193] In step 830 , the second polishing area 22 is polished using a second polishing mold 10 b . The polishing surface 13 a of the first polishing mold 10 a and the polishing surface 13 b of the second polishing mold 10 b have different curvature radii. In some embodiments, step 830 may be performed by the second polishing submodule of the polishing module 230 .

[0194] The second polishing mold 10b is used to polish the second polishing region 22. In some embodiments, the curvature of the polishing surface 13b of the second polishing mold 10b matches the curvature of the surface to be polished in the second polishing region 22. For example, the second polishing region 22 is a portion of an aspherical polishing region, and the polishing surface of the second polishing mold 10b is a spherical surface. The difference in curvature radius between each point on the polishing surface of the second polishing mold 10b and the corresponding point on the surface to be polished in the second polishing region 22 is within a preset threshold range (e.g., no more than 0.01 mm, 0.03 mm, 0.05 mm, or 0.08 mm). When the polishing surface 13b of the second polishing mold 10b is aligned with the surface to be polished in the second polishing region 22, the surface to be polished can be closely aligned with the polishing surface 13b for polishing. For another example, the second polishing region 22 is a portion of a spherical polishing region, and the polishing surface of the second polishing mold 10b is an aspherical surface (e.g., an ellipsoid or other arc-shaped surface of revolution). The polishing surface of the second polishing mold 10b is connected to the surface to be polished in the second polishing area 22, and the difference in the curvature radius of the connecting portion is within a preset threshold range (for example, not exceeding 0.01mm, 0.03mm, 0.05mm or 0.08mm), so that the surface to be polished can be tightly fitted with the polishing surface at the connecting portion for polishing during the polishing process.

[0195] In some embodiments, the second polishing region 22 may be polished by at least one of axial rotation of the second polishing mold 10 b , rotational swing of the second polishing mold 10 b , and axial rotation of the workpiece 20 .

[0196] Figure 10 is a schematic diagram illustrating an exemplary structure of a polishing process for a second polishing region according to some embodiments. In one specific embodiment, as shown in Figure 10 , control module 210 controls the second polishing submodule of polishing module 230 to polish a second polishing region 22 of a workpiece 20, wherein the surface to be polished of the workpiece 20 is aspherical, and the polishing surface 13b of the second polishing mold 10b is spherical. Based on control instructions from control module 210, the second polishing submodule controls the second polishing mold 10b to perform rotational oscillation about O2 as the origin and in direction w2, axial rotation about L3 as the axis and in direction n'2, and axial rotation about L1 as the axis and in direction n2. The curvature of the second polishing region 22 matches that of the polishing surface 13b of the second polishing mold 10b. During these rotational oscillations and axial rotations, the second polishing mold 10b continuously applies pressure P2 to the workpiece 20, ensuring a close contact and friction between the polishing surface 13b and the second polishing region 22, thereby polishing the second polishing region 22.

[0197] In some embodiments, the second polishing mold 10b has second polishing parameters, which include at least a second swing amplitude parameter and a second pressure parameter. In some embodiments, the second polishing parameters may also include a second mold rotation parameter and / or a second workpiece rotation parameter.

[0198] In some embodiments, the polishing parameters of different polishing molds are different. For example, the first polishing parameters of the first polishing mold 10a are different from the second polishing parameters of the second polishing mold 10b. Different polishing parameters mean that at least one of the multiple polishing parameters is different. For example, the first polishing parameter is different from the second polishing parameter, wherein the first swing amplitude parameter is different from the second swing amplitude parameter, and the first pressure parameter is the same as the second pressure parameter.

[0199] In some embodiments, the first polishing mold 10a and the second polishing mold 10b each polish different sub-polishing regions of the workpiece 20. The polishing surface 13a of the first polishing mold 10a and the polishing surface 13b of the second polishing mold 10b have different radii of curvature. For example, as shown in Figures 9 and 10, the first polishing mold 10a and the second polishing mold 10b polish the aspherical polishing regions of the workpiece 20 in different regions. The polishing surface 13a of the first polishing mold 10a has a curvature radius of 45 mm, and the first polishing mold 10a polishes the first polishing region 21 of the workpiece 20. The polishing surface 13b of the second polishing mold 10b has a curvature radius of 60 mm, and the second polishing mold 10b polishes the second polishing region 22 of the workpiece 20.

[0200] In some embodiments, the first polishing mold 10a and the second polishing mold 10b respectively polish different sub-polishing regions of the workpiece 20, and the polishing surface 13a of the first polishing mold 10a and the polishing surface 13b of the second polishing mold 10b have different rates of change in curvature radius. For example, the first polishing mold 10a and the second polishing mold 10b polish spherical polishing regions of the workpiece 20 in different zones. The polishing surface 13a of the first polishing mold 10a and the polishing surface 13b of the second polishing mold 10b can be aspherical surfaces (e.g., ellipsoids or other curved surfaces of revolution). The curvature radius of the connecting portion between the polishing surface 13a and the surface to be polished in the first polishing area 21 and the curvature radius of the connecting portion between the polishing surface 13b and the surface to be polished in the second polishing area 21 can be the same or similar, but from the overall perspective, the curvature radius change rate of the polishing surface 13a of the first polishing mold 10a is different from the curvature radius change rate of the polishing surface 13b of the second polishing mold 10b, and the curvature radius of the polishing surface 13a of the first polishing mold 10a and the polishing surface 13b of the second polishing mold 10b are also different, so as to accurately fit the sub-polishing areas at different positions on the spherical surface.

[0201] In some embodiments, process 800 may further include a third polishing area polishing step, a fourth polishing area polishing step, to an Nth polishing area polishing step. Each polishing area uses a corresponding polishing mold that matches the curvature of the surface to be polished, and polishing parameters are set based on different polishing areas.

[0202] In some embodiments, the standard mold prepared in mold processing process 300 can be used as the polishing mold for the sub-polishing area, for example, the standard mold prepared in process 300 can be used as the first polishing mold and / or the second polishing mold. For more details about the structure and processing method of the standard mold that can be used as the first polishing mold and / or the second polishing mold, please refer to the relevant descriptions of Figures 3 to 8 and will not be repeated here.

[0203] The workpiece polishing methods described in some embodiments of this specification utilize multiple polishing molds with varying curvature radii to perform zoned polishing of a workpiece, reducing the difficulty of machining the polishing molds for each sub-polishing area. Specifically, after determining the polishing molds and polishing parameters corresponding to the multiple sub-polishing areas of a workpiece using this workpiece polishing method, the polishing equipment can perform standardized batch polishing of the workpiece without the need for further equipment adjustment, thereby improving the polishing accuracy and efficiency of the workpiece.

[0204] The mold processing method and workpiece polishing method disclosed in this specification may bring beneficial effects including but not limited to: (1) the mold processing method of the embodiment of this specification performs one or more compensation corrections on the initial processing information to obtain the target processing information. The standard mold processed based on the target processing information can effectively reduce or eliminate the influence of the system error of the processing equipment; (2) the mold processing method of the embodiment of this specification can realize the batch production of standardized molds, with good consistency of finished products, high mold processing accuracy and processing efficiency; (3) the workpiece polishing method of the embodiment of this specification divides the workpiece into different sub-polishing areas, different polishing molds, and different polishing parameters for fine polishing. Compared with using a single polishing mold to complete the overall polishing of the workpiece, this fine polishing can improve the polishing accuracy of the workpiece; (4) compared with using a single polishing mold to complete the overall polishing of the workpiece, using the workpiece polishing method of the embodiment of this specification, multiple polishing equipment can be used for continuous polishing operations without the need for mid-machine adjustment, thereby reducing the difficulty of polishing and improving the polishing efficiency; (5) the workpiece polishing method of the embodiment of this specification uses different polishing molds to perform partitioned polishing of the workpiece, thereby reducing the processing difficulty of a single polishing mold. It should be noted that different embodiments may produce different beneficial effects. In different embodiments, the beneficial effects that may be produced may be any one or a combination of the above, or any other possible beneficial effects.

[0205] Those skilled in the art will appreciate that the above embodiments are intended only to illustrate the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, and variations made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A mold processing method, characterized in that: include: Acquiring first surface information of a first mold, where the first mold is manufactured based on initial processing information; obtaining compensation information based on the first surface information and target surface information; generating target processing information based on the initial processing information and the compensation information; A standard mold is prepared based on the target processing information, where the standard mold includes a mold body and a covering layer.

2. The mold processing method according to claim 1, characterized in that: The preparing a standard mold based on the target processing information includes: Turning the initial mold based on the target processing information to obtain the mold body; attaching the covering layer to the mold body; The covering layer is turned based on the target processing information to obtain the standard mold.

3. The mold processing method according to claim 2, characterized in that: The step of attaching the covering layer to the mold body comprises: heating the mold body; The covering layer is pressed against the heated mold body so that the covering layer is adhered to the mold body.

4. The mold processing method according to claim 3, characterized in that: The mold body is heated by a heating coil, and the mold body to be heated is placed in the heating coil.

5. The mold processing method according to claim 4, characterized in that: The heating temperature of the heating coil is 160°C to 200°C.

6. The mold processing method according to claim 3, characterized in that: The covering layer and the heated mold body are compacted by a pressurized pressure plate fixture, and the curvature of the pressure-applying surface of the pressure plate fixture matches the curvature of the pressure-bearing surface of the mold body.

7. The mold processing method according to claim 6, characterized in that: The pressure range of the pressure plate tooling is 0.1Mpa to 0.8Mpa.

8. The mold processing method according to claim 1, wherein: The compensation information includes main body compensation information and edge extension information; and obtaining the compensation information based on the first surface information and the target surface information includes: obtaining body compensation information corresponding to the first mold body based on a comparison between the first surface information and the target surface information; Based on a data trend of the first surface information, edge extension information corresponding to the first mold edge is obtained.

9. The mold processing method according to claim 1, wherein: Generating target processing information based on the initial processing information and the compensation information includes: generating processing information to be verified based on the initial processing information and the compensation information; acquiring second surface information of a second mold, where the second mold is manufactured based on the processing information to be inspected; Based on the second surface information and the target surface information, determining whether a surface error of the second mold is within a preset value range; If so, it is determined that the processing information to be verified is target processing information.

10. A mold processing system, characterized in that: The system comprises: a surface information acquisition module configured to acquire first surface information of a first mold, wherein the first mold is manufactured based on initial processing information; a compensation information acquisition module, configured to obtain compensation information based on the first surface information and target surface information; a processing information generating module configured to generate target processing information based on the initial processing information and the compensation information; and The processing module is configured to prepare a standard mold based on the target processing information, wherein the standard mold includes a mold body and a covering layer.

11. A workpiece polishing method, characterized in that: The method comprises: determining at least a first polishing region and a second polishing region of a workpiece; polishing the first polishing area using a first polishing mold; and polishing the second polishing area using a second polishing mold; Wherein, the polishing surface of the first polishing mold and the polishing surface of the second polishing mold have different curvature radii.

12. The workpiece polishing method according to claim 11, wherein: The curvature of the surface to be polished in the first polishing area matches the curvature of the polishing surface of the first polishing mold; the curvature of the surface to be polished in the second polishing area matches the curvature of the polishing surface of the second polishing mold.

13. The workpiece polishing method according to claim 11, wherein: The first polishing mold has first polishing parameters, which include at least a first swing parameter and a first pressure parameter; the second polishing mold has second polishing parameters, which include at least a second swing parameter and a second pressure parameter; the first polishing parameters are different from the second polishing parameters.

14. The workpiece polishing method according to claim 11, wherein: The first polishing mold and / or the second polishing mold is a standard mold, and the standard mold includes a mold body and a covering layer.

15. The workpiece polishing method according to claim 14, wherein: The preparation of the standard mold includes: Acquiring first surface information of a first mold, where the first mold is manufactured based on initial processing information; obtaining compensation information based on the first surface information and target surface information; generating target processing information based on the initial processing information and the compensation information; A standard mold is prepared based on the target processing information, where the standard mold includes a mold body and a covering layer.

16. The workpiece polishing method according to claim 15, wherein: The preparing a standard mold based on the target processing information includes: Turning the initial mold based on the target processing information to obtain the mold body; attaching the covering layer to the mold body; The covering layer is turned based on the target processing information to obtain the standard mold.

17. The workpiece polishing method according to claim 11, wherein: Determining at least a first polishing area and a second polishing area of ​​the workpiece includes: determining shape characteristics of a polished area of ​​the workpiece; pre-polishing a polishing area of ​​a test workpiece based on the shape feature, the test workpiece being selected from the workpiece; At least a first polishing region and a second polishing region of the workpiece are determined based on the pre-polishing result.

18. The workpiece polishing method according to claim 17, wherein: The pre-polishing result includes parameter information of the polishing area of ​​the test workpiece after pre-polishing; the parameter information includes a polishing removal rate; and the parameter information is determined by comparing shape features of the polishing area of ​​the test workpiece before and after pre-polishing.

19. The workpiece polishing method according to claim 18, wherein: Pre-polishing the polishing area of ​​the test workpiece based on the shape feature includes: Pre-polishing the polishing area of ​​the test workpiece based on the overall polishing strategy to produce a first test workpiece; First parameter information of the first test artifact is obtained.

20. The workpiece polishing method according to claim 19, wherein: The determining of at least a first polishing area and a second polishing area of ​​the workpiece based on the pre-polishing result comprises: At least a first polishing region and a second polishing region of the workpiece are determined based on the first parameter information and a preset threshold condition.

21. The workpiece polishing method according to claim 19, wherein: The pre-polishing of the polishing area of ​​the test workpiece based on the shape feature further comprises: generating a first partition polishing strategy based on the first parameter information and a preset threshold condition; Pre-polishing the polishing area of ​​the test workpiece based on the first partition polishing strategy to produce a second test workpiece; Second parameter information of the second test artifact is obtained.

22. The workpiece polishing method according to claim 21, wherein: The determining of at least a first polishing area and a second polishing area of ​​the workpiece based on the pre-polishing result comprises: Determining whether the second parameter information meets a preset threshold condition; If so, at least a first polishing region and a second polishing region of the workpiece are determined based on a first zoned polishing strategy.

23. The workpiece polishing method according to any one of claims 19 to 22, wherein: The pre-polishing of the test workpiece is performed by using a pre-polishing tool, and the shape characteristics of the polishing surface of the pre-polishing tool are determined based on the shape characteristics of the polishing area of ​​the workpiece and the corresponding polishing strategy.

24. A workpiece polishing system, characterized in that: The system comprises: The polishing area determination module is configured to: determining at least a first polishing region and a second polishing region of a workpiece; The polishing module is configured to: polishing the first polishing area using a first polishing mold; polishing the second polishing area using a second polishing mold; Wherein, the polishing surface of the first polishing mold and the polishing surface of the second polishing mold have different curvature radii.

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