Power module and electronic device having the same

Abstract

A power module and an electronic device having the same are provided. The power module comprises a packaging body, a heat dissipation substrate arranged in the packaging body, and a plurality of power chips. The packaging body is provided with a first surface and a second surface which are oppositely arranged along the thickness direction of the power module, and comprises one or more residual parts located on the first surface. The heat dissipation substrate is provided with a third surface and a fourth surface which are oppositely arranged along the thickness direction of the power module. The heat dissipation substrate comprises a conductive layer, the surface, close to the first surface, of the conductive layer is a third surface, and the fourth surface is flush with the second surface, so that the fourth surface is exposed by the packaging body. The plurality of power chips are arranged on the conductive layer and are arranged at intervals along the length direction of the power module. Wherein the orthographic projection of the edge of the one or more residual parts on the conductive layer and the orthographic projection of the edge of the power chip on the conductive layer are staggered from each other.

Description

Power module and electronic device having the same

[0001] This application claims priority to Chinese patent applications with application number 202211442177.8 filed on November 17, 2022, application number 202310495887.5 filed on April 28, 2023, and application number 202321635269.8 filed on June 26, 2023, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the technical field of electronic equipment, and in particular to a power module and an electronic device having the same. Background Art

[0003] Intelligent Power Modules (IPMs) feature high current density, low saturation voltage, low drive power, high switching frequency, high functional integration, and high reliability. They are widely used in electronics, automotive, rail transportation, industrial equipment, new energy, smart grids, and other fields. Power modules typically use resin to encapsulate their internal power cores and control chips to achieve their high integration.

[0004] Summary of the Invention

[0005] On the one hand, a power module is provided, comprising a package body, a heat dissipation substrate arranged in the package body, and a plurality of power chips. The package body has a first surface and a second surface arranged relative to each other along the thickness direction of the power module, and includes one or more residual portions located on the first surface. The heat dissipation substrate has a third surface and a fourth surface arranged relative to each other along the thickness direction of the power module. The heat dissipation substrate includes a conductive layer, wherein the surface of the conductive layer close to the first surface is the third surface, and the fourth surface is flush with the second surface, so that the fourth surface is exposed by the package body. A plurality of power chips are arranged on the conductive layer and spaced apart along the length direction of the power module. The orthographic projections of the edges of the one or more residual portions on the conductive layer are staggered with the orthographic projections of the edges of the power chips on the conductive layer.

[0006] On the other hand, an electronic device is provided, comprising the above-mentioned power module. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] FIG1 is a structural diagram of a power module in the related art;

[0008] FIG2 is a structural diagram of a power module according to some embodiments of the present disclosure;

[0009] FIG3 is another structural diagram of a power module according to some embodiments of the present disclosure;

[0010] FIG4 is another structural diagram of a power module according to some embodiments of the present disclosure;

[0011] FIG5 is a plan view of a power module according to some embodiments of the present disclosure;

[0012] FIG6 is an enlarged view of the N region in the power module shown in FIG5 ;

[0013] FIG7 is a front packaging effect diagram of a power module according to some embodiments of the present disclosure;

[0014] FIG8 is a perspective view of a power module according to some embodiments of the present disclosure;

[0015] FIG9 is an enlarged view of the M region in the power module shown in FIG8 ;

[0016] FIG10 is another plan view of a power module according to some embodiments of the present disclosure;

[0017] FIG11 is another plan view of a power module according to some embodiments of the present disclosure;

[0018] FIG12 is another plan view of a power module according to some embodiments of the present disclosure;

[0019] FIG13 is another plan view of a power module according to some embodiments of the present disclosure;

[0020] FIG14 is a backside packaging effect diagram of a power module according to some embodiments of the present disclosure;

[0021] FIG15 is a perspective view of a power module according to some embodiments of the present disclosure;

[0022] 16-18 are schematic diagrams of a packaging process of a power module according to some embodiments of the present disclosure;

[0023] FIG19 is a schematic diagram of an annular indentation on a first surface of a power module according to some embodiments of the present disclosure;

[0024] FIG20 is another structural diagram of a power module according to some embodiments of the present disclosure;

[0025] FIG21 is a schematic diagram of a packaging mold corresponding to the power module shown in FIG20 ;

[0026] FIG22 is a block diagram of an electronic device according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0027] The following will be combined with the accompanying drawings to clearly and completely describe some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0028] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0029] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0030] When describing some embodiments, the term "connected" and its derivatives may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other. The embodiments disclosed herein are not necessarily limited to the embodiments disclosed herein.

[0031] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0032] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value, where the acceptable range of deviation is determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0033] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thicknesses of layers and regions are exaggerated for clarity. The exemplary embodiments disclosed herein should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0034] Electronic devices are usually built with power modules inside to realize their functional applications. In related technologies, the package of the power module can usually be obtained by encapsulating the driver chip and the power chip using an injection molding process. Figure 1 shows a structural diagram of a power module. The power module 10 may include a heat dissipation substrate 100, a power chip 200 arranged on the heat dissipation substrate 100, a drive frame 300, a driver chip 400 arranged on the drive frame 300, and a package 500 configured to encapsulate the heat dissipation substrate 100, the power chip 200, the drive frame 300 and the driver chip 400.

[0035] During the injection molding process, the heat dissipation substrate 100 provided with the power chip 200 and the drive frame 300 provided with the drive chip 400 can be fixed in the cavity of the packaging mold, and then the resin is injected into the cavity through the resin injection port of the packaging mold, and the mold is demolded after the resin is solidified, thereby completing the packaging of the power module. However, during the process of injecting resin, the non-fixed end of the heat dissipation substrate 100 cannot perfectly fit with the surface of the packaging mold, and the heat dissipation substrate 100 may warp when heated, and the flowing resin may also impact the heat dissipation substrate 100, all of which will affect the fit between the heat dissipation substrate 100 and the packaging mold, causing the flowing resin to overflow to the back of the heat dissipation substrate 100 (the surface away from the power chip 200), thereby causing glue overflow on the back of the substrate, affecting the performance of the power module 10.

[0036] Based on this, an embodiment of the present disclosure provides a power module, which can be an intelligent power module (IPM). As shown in Figures 2 to 5, the power module 10 includes a heat dissipation substrate 100, a plurality of power chips 200 arranged on the heat dissipation substrate 100, and a package body 500 arranged outside the heat dissipation substrate 100 and the power chips 200. The heat dissipation substrate 100 may include a conductive layer 110, which is configured to arrange a plurality of power chips 200 thereon, that is, the conductive layer 110 can be used as a pad for the power chip 200. The plurality of power chips 200 are arranged on the conductive layer 110 and are spaced apart along the length direction X of the power module 10.

[0037] The package body 500 has a first surface 501 and a second surface 502 that are opposite to each other in the thickness direction Z of the power module 10. The first surface 501 is located on the side of the power chip 200 away from the heat dissipation substrate 100 and can be referred to as the top surface of the package body 500. The second surface 502 is located on the side of the heat dissipation substrate 100 away from the power chip 200 and can be referred to as the bottom surface of the package body 500.

[0038] The heat dissipation substrate 100 is located inside the package 500 and has a third surface 101 and a fourth surface 102 that are opposite to each other in the thickness direction Z of the power module 10. The third surface 101 is the surface of the heat dissipation substrate 100 that is close to the first surface 501, and the fourth surface 102 is the surface of the heat dissipation substrate 100 that is close to the second surface 502. The fourth surface 102 is flush with the second surface 502, so that the fourth surface 102 is exposed by the second surface 502 (e.g., the bottom surface) of the package 500. Among them, the surface of the conductive layer 110 that is close to the first surface 501 is the third surface 101 of the heat dissipation substrate 100. In other words, the conductive layer 110 is the film layer closest to the first surface 501 (e.g., located at the top) in the heat dissipation substrate 100.

[0039] It is understandable that the area of ​​the fourth surface 102 of the heat dissipation substrate 100 is smaller than the area of ​​the second surface 502 of the package body 500 . Therefore, when the fourth surface 102 is flush with the second surface 502 , the fourth surface 102 only occupies a portion of the second surface 502 .

[0040] It should be noted that the description of the structure of the power module 10 refers to the length direction X, width direction Y, and thickness direction Z of the power module 10. The thickness direction Z of the power module 10 refers to a direction perpendicular to the plane of the heat dissipation substrate 100, and both the length direction X and width direction Y of the power module 10 are directions parallel to the plane of the heat dissipation substrate 100. The length direction X of the power module 10 refers to the arrangement direction of multiple pads configured to accommodate multiple power chips 200, while the width direction Y of the power module 10 refers to the extension direction of any pad.

[0041] On this basis, to prevent glue overflow from the backside of the heat dissipation substrate 100 during the packaging process of the power module 10, as shown in Figures 7 to 13, one or more residual portions 510 are provided on the first surface 501 of the package body 500. The orthographic projections of the edges of the residual portions 510 on the conductive layer 110 are offset from the orthographic projections of the edges of the power chip 200 on the conductive layer 110. It should be understood that the residual portions 510 refer to indentations left on the surface of the package body 500 by the ejector pins of the packaging mold after the power module 10 is packaged.

[0042] For example, Figure 16 is a schematic diagram of the ejector pin of the packaging module pressing the heat dissipation substrate in the injection molding process, Figure 17 is a schematic diagram of the ejector pin starting to reset in the injection molding process, and Figure 18 is a schematic diagram of the ejector pin completely reset in the injection molding process. As shown in Figures 16 to 18, when the main structure of the power module 10 is packaged, the ejector pin 810 of the packaging mold can be used to pass through the ejector plate and the sleeve to press the heat dissipation substrate 100 from above (the side where the power chip 200 is provided), so that the heat dissipation substrate 100 is pressed downward. During the process of injecting resin into the cavity 820 of the packaging mold, the position of the heat dissipation substrate 100 can remain stable. When the resin is almost cured, the ejector pin 810 is controlled to start resetting, and the packaging mold is completely removed after the packaging is completed, so that the heat dissipation substrate 100 can be controlled to be close to the surface of the packaging mold during the entire packaging process. As can be seen, the ejector pins 810 of the packaging mold can be retractable. When the resin is injected, the ejector pins 810 extend from the sleeve to secure the heat sink 100. When the resin filling is complete and the pressure is maintained, the ejector pins 810 retract to complete the entire molding process. In this way, the ejector pins 810 can extend and retract within the space defined by the sleeve, which helps improve the accuracy of the ejector pins' upward and downward movement.

[0043] It should be noted that when the ejector pin 810 is used to fix the heat dissipation substrate 100, the ejector pin 810 can pass through the ejector plate and the sleeve and be fixed by the base plate, and the oil circuit provides power to the ejector rod to eject the ejector pin 810. After the oil circuit power is cut off, the return spring or the reverse oil circuit action causes the ejector pin 810 to reset.

[0044] Because the reset positions of the ejector pin and sleeve are closer to the heat dissipation substrate 100 than the cavity surface of the packaging mold to prevent resin from filling into the interior of the sleeve, two mutually nested annular indentations (e.g., circular annular indentations) are ultimately formed on the first surface 501 of the package body 500. The reset position of the ejector pin 810 is closer to the heat dissipation substrate 100 than the reset position of the sleeve. Therefore, as shown in Figures 9 and 19, the annular indentation ultimately formed on the first surface 501 of the package body 500 is a stepped hole 512 formed jointly by the sleeve and the ejector pin 810. The edge of the sleeve corresponds to the outer circular portion of the annular indentation (i.e., the edge of the sleeve corresponding to the indentation 511), and the edge of the ejector pin corresponds to the inner circular portion of the annular indentation (i.e., the edge of the residual portion 510 described above). The depth of the residual portion 510 is greater than the depth of the indentation 511 corresponding to the sleeve.

[0045] In this way, during the resin filling process, ejector pins 810 can apply pressure to heat sink substrate 100, preventing it from tilting easily due to the impact of flowing resin. This ensures the stability of heat sink substrate 100 and prevents the injected resin from overflowing onto the back of heat sink substrate 100. When ejector pins 810 are removed, the resin has already solidified, thus maintaining the stability of heat sink substrate 100. This ensures that heat sink substrate 100 is tightly attached to the bottom of the packaging mold, preventing glue from overflowing onto the back of heat sink substrate 100.

[0046] In the power module 10 provided in the embodiment of the present disclosure, the package body 500 is formed after the resin injected into the cavity of the packaging mold is solidified. During the packaging process of the power module 10, the top surface of the heat dissipation substrate 100 is pressed by the ejector pins of the packaging mold, so that the heat dissipation substrate 100 can be tightly attached to the bottom surface of the packaging mold without tilting during the resin injection process, thereby preventing the resin from overflowing to the back of the heat dissipation substrate 100, which is conducive to the packaging of the power module 10. Based on this, the formed power module 10 will have one or more residual portions 510 on the first surface 501 of the package body 500, and the fourth surface 102 of the heat dissipation substrate 100 away from the power chip 200 can be flush with the second surface 502 (bottom surface) of the package body 500, so that the fourth surface 102 of the heat dissipation substrate 100 is exposed at the bottom surface of the package body 500, thereby ensuring that the power module 10 has a good packaging effect. In addition, when the ejector pin presses the heat dissipation substrate 100, by controlling the position of the ejector pin to be staggered with the position of the power chip 200 on the heat dissipation substrate 100, the orthographic projection of the residual portion 510 on the conductive layer 110 of the heat dissipation substrate 100 and the orthographic projection of the edge of the power chip 200 on the conductive layer 110 can be staggered with each other. This can ensure that the ejector pin and the power chip 200 do not contact each other during the packaging process, avoid interference between the ejector pin and the power chip 200, and thus avoid damage to the power chip 200, which is conducive to ensuring the normal operation of the power chip 200 and further ensuring the normal use of the power module 10.

[0047] For ease of description, in conjunction with Figures 5 and 10 to 15 , the two sides of the power module 10 along its width direction Y may be referred to as the drive side 10A and the power side 10B, respectively. In some embodiments, the power module 10 may include a heat dissipation substrate 100, a plurality of power chips 200 disposed on the heat dissipation substrate 100, a plurality of power pins 600 connected to the heat dissipation substrate 100, a drive frame 300, at least one drive chip 400 disposed on the drive frame 300, a plurality of drive pins 700 connected to the drive frame 300, and a package 500. The plurality of power pins 600 are spaced apart along the length direction X of the power module 10, one end of which is connected to the heat dissipation substrate 100 and the other end of which extends outside the package 500. The plurality of drive pins 700 are spaced apart along the length direction X of the power module 10, one end of which is connected to the drive frame 300 and the other end of which extends outside the package 500. The plurality of driving pins 700 and the plurality of power pins 600 are located on both sides of the power module 10 along the width direction Y thereof. The side where the plurality of driving pins 700 are located is called the driving side 10A, and the side where the plurality of power pins 600 are located is called the power side 10B.

[0048] The driver chip 400 is electrically connected to the power chip 200 and is configured to drive the power chip 200 to operate, thereby realizing the functions of the power module 10. For example, the driver chip 400 may include a low-voltage driver chip and a high-voltage driver chip. Some of the multiple driver pins 700 are electrically connected to the low-voltage driver chip, and another portion of the driver pins are electrically connected to the high-voltage driver chip. When the power module 10 is operating, the multiple driver pins 700 and the multiple power pins 600 can be connected to an external controller, thereby achieving electrical connection between the internal circuit of the power module 10 and the external circuit, thereby realizing normal use of the power module 10.

[0049] The heat dissipation substrate 100, the power chip 200, the driving frame 300, and the driving chip 400 are all disposed within a package 500. The package 500 may be, for example, a protective shell formed of an encapsulation resin, and is configured to provide protection for its internal structures, thereby making the assembly of the driving frame 300 and the heat dissipation substrate 100 more reliable, and providing good protection for the driving chip 400 and the power chip 200, thereby improving the performance and reliability of the power module 10.

[0050] In the embodiments of the present disclosure, as shown in Figures 5 and 10 to 13, the conductive layer 110 may include a plurality of base islands spaced apart along the length direction X of the power module 10, such as a first base island 111, a second base island 112, a third base island 113, and a fourth base island 114 spaced apart in sequence. A plurality of power chips 200 are disposed on the plurality of base islands. The number of power chips 200 disposed on each base island can be designed based on actual needs.

[0051] It should be noted that the areas of the first base island 111, the second base island 112, the third base island 113 and the fourth base island 114 can be different, so the number of power chips 200 set on each base island may also be different. For example, the areas of the first base island 111, the second base island 112 and the third base island 113 are all smaller than the area of ​​the fourth base island 114, that is, the area of ​​the fourth base island 114 is the largest. In this case, one power chip 200, such as a low-voltage power chip, can be set on each of the first base island 111, the second base island 112 and the third base island 113, while three power chips 200, such as high-voltage power chips, can be set on the fourth base island 114, and the low-voltage power chip and the high-voltage power chip are both located at a position close to the drive side 10A of the base island. In this way, multiple high-voltage power chips are integrated on the fourth base island 114, which can save space and improve the structural compactness of the power module 10. In addition, the spacing between low-voltage power chips and high-voltage power chips can not only meet the power requirements of different circuits, but also avoid mutual interference between different power areas, thereby ensuring the stability and reliability of the power chips.

[0052] For example, the power chip 200 may include a MOS (metal-oxide-semiconductor) chip, an IGBT (Insulated Gate Bipolar Transistor) chip, an FRD (Fast Recovery Diode) chip, two chips consisting of an IGBT chip and an FRD chip, or an RC-IGBT (Reverse-Conducting Insulated Gate Bipolar Transistor) chip in which the FRD chip is built into the IGBT chip. In this way, at least one of the IGBT chip, FRD chip, and RC-IGBT chip can be selected according to needs, thereby improving the convenience of use.

[0053] Based on the above embodiment, one or more residual portions 510 are provided on the first surface 501 of the package body 500. Considering that the residual portions 510 are indentations left on the surface of the package body 500 by ejector pins during the packaging process, and that the ejector pins are provided to prevent glue overflow from the backside of the heat dissipation substrate 100, it can be seen that the number and distribution of the ejector pins are related to the size of the heat dissipation substrate 100.

[0054] In some embodiments, as shown in Figures 10 and 11, the dimension of the heat dissipation substrate 100 along the length direction X of the power module 10 is L, and the number of one or more residual portions 510 is n. When L≤40mm, 2≤n≤4, where L and n are both positive integers. That is, when the length of the heat dissipation substrate 100 is less than or equal to 40mm, the number of residual portions 510 provided is between 2 and 4. At this time, these residual portions 510 may include at least two residual portions 510 located at both ends along the length direction X of the power module 10, and along the thickness direction Z of the power module 10, the two residual portions 510 respectively correspond to the two base islands located at both ends along the length direction X of the power module 10 among the multiple base islands.

[0055] It should be noted that the correspondence between the residual portion 510 and the base island means that in the thickness direction Z of the power module 10, the orthographic projection of the residual portion 510 on the conductive layer 110 of the heat dissipation substrate 100 is at least partially located on the base island, that is, the orthographic projection of the residual portion 510 on the conductive layer 110 overlaps with the base island.

[0056] For example, the conductive layer 110 of the heat dissipation substrate 100 includes a first base island 111, a second base island 112, a third base island 113, and a fourth base island 114, which are sequentially spaced along the length direction X of the power module 10. The length L of the heat dissipation substrate 100 is less than or equal to 40 m. Two, three, or four residual portions 510 are disposed on the first surface 501 of the package body 500, spaced along the length direction X of the power module 10. The orthographic projections of the two residual portions 510 located at the ends of these residual portions 510 on the conductive layer 110 overlap with the first base island 111 and the fourth base island 114, respectively.

[0057] In this way, when the dimension L of the heat dissipation substrate 100 along the length direction X of the power module 10 does not exceed 40 mm, two to four ejector pins can be used to secure the heat dissipation substrate 100 during the packaging process. In this case, two to four residual portions 510 will be formed on the first surface 501 of the package body 500. Because the heat dissipation substrate 100 is relatively small, the two islands at the two ends of the plurality of islands along the length direction X of the power module 10 each correspond to a residual portion 510. That is, during the packaging process, the two islands at the two ends will be pressed by their corresponding ejector pins. This allows the smaller heat dissipation substrate 100 to fit more closely to the surface of the packaging mold, thereby preventing glue overflow from the back of the heat dissipation substrate 100, which helps ensure the packaging effect of the power module 10 and improves the reliability of the power module 10.

[0058] In some examples, as shown in FIG10 , when L ≤ 25 mm, n = 2. That is, when the length of the heat dissipation substrate 100 is less than or equal to 25 mm, the number of residual portions 510 provided is two. The orthographic projections of the two residual portions 510 on the conductive layer 110 overlap with two of the multiple islands located at opposite ends (e.g., the first island 111 and the fourth island 114). During the packaging process, the ejector pins, for example, press against the first island 111 and the fourth island 114.

[0059] For example, when the size of the heat dissipation substrate 100 is less than 25×12 mm (for example, the maximum size of the package body 500 is 35.6 mm×18.8 mm, and the size of the heat dissipation substrate 100 is 22.7 mm×9.15 mm), the heat dissipation substrate 100 can be fixed by a two-point fixing method (i.e., using two ejector pins). These two ejector pins can be pressed on the non-fixed ends of the first base island 111 and the fourth base island 114 (located at the end of the driving side 10A), for example, the conductive layer 110 is located at the two top corners of the driving side 10A.

[0060] In this case, only the two base islands at both ends need to be fixed, so that the heat dissipation substrate 100 with a size L less than or equal to 25 mm can be well attached to the surface of the packaging mold, and the packaging speed of the power module 10 can also be improved.

[0061] On this basis, the minimum spacing between two adjacent power chips 200 is B, and the maximum cross-sectional dimension of the residual portion 510 is C. B and C satisfy the following relationship: B < C + 0.8 mm. For example, the minimum spacing between the power chip 200 disposed on the first base island 111 and the power chip 200 disposed on the second base island 112 is B. The residual portion 510 is in the shape of a ring with an outer diameter of C, and B < C + 0.8 mm.

[0062] When B = C + 0.8 mm, the spacing B between two adjacent power chips 200 can keep the distance between the edge of the ejector pin and the power chip 200 within a safe range during packaging. In other words, when no ejector pin is installed between two adjacent power chips 200, B < C + 0.8 mm can be satisfied, that is, the spacing between two adjacent power chips 200 is smaller. This arrangement is suitable for heat dissipation substrates 100 with smaller dimensions in the length direction X of the power module 10, thereby facilitating the miniaturization of the power module 10.

[0063] Furthermore, the maximum cross-sectional dimension C of the residual portion 510 can satisfy C = 1.2 mm, and the minimum spacing B between two adjacent power chips 200 can satisfy B < 2 mm. For example, if the end surface of the ejector pin 810 is circular and the diameter C of the ejector pin 810 is 1.2 mm, the minimum spacing B between two adjacent power chips 200 in the length direction X of the power module 10 is less than 2 mm. This configuration can reduce the distance between two adjacent power chips 200, thereby reducing the size of the power module 10 along its length direction X.

[0064] In other examples, as shown in FIG11 , when 25 mm < L ≤ 32 mm, n = 3. That is, when the length of the heat dissipation substrate 100 is greater than 25 mm and less than or equal to 32 mm, the number of residual portions 510 provided is three. Of these three residual portions 510, the orthographic projection of the residual portion 510 located in the middle along the length direction X of the power module 10 on the conductive layer 110 overlaps with two adjacent islands (e.g., the second island 112 and the third island 113, or the third island 113 and the fourth island 114) among the multiple islands, and the orthographic projections of the two residual portions 510 located at the two ends along the length direction X of the power module 10 on the conductive layer 110 overlap with two islands (e.g., the first island 111 and the fourth island 114) located at the two ends of the multiple islands. During the packaging process, the ejector pins, for example, press the first island 111, the fourth island 114, and at least one island in the middle.

[0065] For example, when the size of the heat dissipation substrate 100 is between 25mm×12mm and 32mm×15mm (for example, the maximum size of the package body 500 is 38mm×24mm, and the size of the heat dissipation substrate 100 is 30.2mm×14.2mm), the heat dissipation substrate 100 can be fixed by a three-point fixing method (i.e., using three ejector pins). The three ejector pins can be pressed on the two top corners and the middle position of the non-fixed end of the heat dissipation substrate 100. One of the ejector pins can be pressed on the middle position of the edge of the heat dissipation substrate 100 located on the driving side 10A, which corresponds to two adjacent base islands, so that the two base islands can be fixed at the same time. The other two ejector pins can be pressed on the two top corners of the heat dissipation substrate 100 located on the driving side 10A, so as to fix the two ends of the heat dissipation substrate 100.

[0066] In this case, by fixing the two base islands at both ends and an intermediate position of the conductive layer 110 along the length direction X of the power module 10, the heat dissipation substrate 100 with a size L greater than 25 mm and less than or equal to 32 mm can be well fitted to the surface of the packaging mold. In addition, the centers of the three residual portions 510 can be set on the same straight line. In this way, when the three ejector pins are pressed on the heat dissipation substrate 100 at the same time, the force on the non-fixed end of the heat dissipation substrate 100 can be kept uniform, thereby avoiding the deformation of the heat dissipation substrate 100 caused by the stress generated during the resin flow process, and further improving the fit between the heat dissipation substrate 100 and the packaging mold.

[0067] In some other examples, when 32 mm < L ≤ 40 mm, n = 4. That is, when the length of the heat dissipation substrate 100 is greater than 32 mm and less than or equal to 40 mm, the number of residual portions 510 provided is 4. Of these 4 residual portions 510, the orthographic projections of the two residual portions 510 located in the middle along the length direction X of the power module 10 on the conductive layer 110 overlap with the two base islands located in the middle among the multiple base islands (for example, the second base island 112 and the third base island 113), and the orthographic projections of the two residual portions 510 located at both ends along the length direction X of the power module 10 on the conductive layer 110 overlap with the two base islands located at both ends among the multiple base islands (for example, the first base island 111 and the fourth base island 114). During the packaging process, the ejector pins can press the first base island 111, the second base island 112, the third base island 113, and the fourth base island 114.

[0068] For example, when the size of the heat dissipation substrate 100 is between 32mm×15mm and 40mm×16mm, the heat dissipation substrate 100 can be fixed by a four-point fixing method (i.e., using four ejector pins). The four ejector pins can be pressed on the two top corners of the non-fixed end and two positions in the middle of the heat dissipation substrate 100. Two of the ejector pins can be pressed on the two top corners of the heat dissipation substrate 100 on the driving side 10A to fix the base islands at both ends, and the other two ejector pins can be pressed on the edges of the two base islands in the middle of the heat dissipation substrate 100 on the driving side 10A to fix the base island in the middle.

[0069] In this case, by fixing each base island, the heat dissipation substrate 100 with a size L greater than 32 mm and less than or equal to 40 mm can be well fitted with the surface of the packaging mold, and the packaging speed of the power module 10 can also be improved.

[0070] In other embodiments, as shown in Figures 12 and 13 , the heat dissipation substrate 100 has a dimension L along the length direction X of the power module 10, and the number of one or more residual portions 510 is n. When L > 40 mm, n > 4, where both L and n are positive integers. That is, when the length of the heat dissipation substrate 100 is greater than 40 mm, the number of residual portions 510 provided is greater than 4. In this case, along the thickness direction Z of the power module 10, each island corresponds to at least one residual portion 510.

[0071] It is understood that "each island has at least one residual portion 510" means that, for any island, the orthographic projection of at least one residual portion 510 on the conductive layer 110 of the heat dissipation substrate 100 overlaps with the island. The number of residual portions 510 corresponding to each island can be the same or different.

[0072] For example, the conductive layer 110 of the heat dissipation substrate 100 includes a first island 111, a second island 112, a third island 113, and a fourth island 114, which are sequentially spaced along the length direction X of the power module 10. The area of ​​the fourth island 114 is larger than that of the other islands. The length L of the heat dissipation substrate 100 is greater than 40 m. Five, six, or more residual portions 510 are disposed on the first surface 501 of the package body 500, spaced along the length direction X of the power module 10. Of these residual portions 510, at least one residual portion 510 has its orthographic projection on the conductive layer 110 overlap with the first island 111, at least one residual portion 510 has its orthographic projection on the conductive layer 110 overlap with the second island 112, at least one residual portion 510 has its orthographic projection on the conductive layer 110 overlap with the third island 113, and at least two residual portions 510 have their orthographic projections on the conductive layer 110 overlap with the fourth island 114.

[0073] In this way, when the dimension L of the heat dissipation substrate 100 along the length direction X of the power module 10 is greater than 40 mm, more than five ejector pins can be used to secure the heat dissipation substrate 100 during the packaging process. In this case, more than two residual portions 510 will be formed on the first surface 501 of the package body 500. Because the heat dissipation substrate 100 is relatively large, each island corresponds to at least one residual portion 510. That is, during the packaging process, each island will be pressed by at least one corresponding ejector pin. This allows the larger heat dissipation substrate 100 to fit more closely with the surface of the packaging mold, thereby preventing glue overflow from the back of the heat dissipation substrate 100, which helps ensure the packaging effect of the power module 10 and improves the reliability of the power module 10.

[0074] In some examples, as shown in FIG12 , when L>40 mm, n=5. That is, when the length of the heat dissipation substrate 100 is greater than 40 mm, the number of residual portions 510 provided is five. Of these five residual portions 510, the orthographic projections of three residual portions 510 on the conductive layer 110 overlap with the first base island 111, the second base island 112, and the third base island 113, respectively. The orthographic projections of the other two residual portions 510 on the conductive layer 110 overlap with the fourth base island 114.

[0075] For example, when the size of the heat dissipation substrate 100 is greater than 40 mm × 16 mm (for example, the maximum size of the package body 500 is 52.5 mm × 31 mm, and the size of the heat dissipation substrate 100 is 40.9 mm × 17.3 mm), five ejector pins can be used to press the two corners and three locations in the middle of the non-fixed end of the heat dissipation substrate 100. One ejector pin can press the edge of the first base island 111 located on the driving side 10A near the corner, one ejector pin can press the edge of the second base island 112 located on the driving side 10A near the corner, one ejector pin can press the edge of the third base island 113 located on the driving side 10A near the corner, and the other two ejector pins can press the middle of the edge of the fourth base island 114 located on the driving side 10A.

[0076] During the packaging process, ejector pins press against the first, second, third, and fourth islands 111, 112, 113, and 114. Because the area of ​​fourth island 114 is larger than that of first, second, and third islands 111, 112, and 113, the number of ejector pins pressing against fourth island 114 is also greater than the number of ejector pins pressing against the other islands. In this case, by pressing against each island and applying multiple pressure points to larger islands, a larger heat dissipation substrate 100 can be securely bonded to the surface of the packaging mold.

[0077] In other examples, as shown in FIG13 , when L>40 mm, n>5. That is, when the length of the heat dissipation substrate 100 is greater than 40 mm, the number of residual portions 510 provided is greater than 5. Among these residual portions 510, the orthographic projection of one residual portion 510 on the conductive layer 110 overlaps with the edge of the first base island 111 on the side away from the second base island 112, the orthographic projection of one residual portion 510 on the conductive layer 110 overlaps with the edges of the first base island 111 and the second base island 112 that are close to each other, the orthographic projection of one residual portion 510 on the conductive layer 110 overlaps with the edges of the second base island 112 and the third base island 113 that are close to each other, the orthographic projection of one residual portion 510 on the conductive layer 110 overlaps with the edges of the third base island 113 and the fourth base island 114 that are close to each other, and the orthographic projections of the remaining residual portions 510 on the conductive layer 110 overlap with the fourth base island 114.

[0078] For example, when the size of the heat dissipation substrate 100 is greater than 40 mm × 16 mm (for example, the maximum size of the package body 500 is 52.5 mm × 31 mm, and the size of the heat dissipation substrate 100 is 40.9 mm × 17.3 mm), five or more, for example seven, ejector pins can be used to press multiple locations in the middle between the non-fixed end and the fixed end of the heat dissipation substrate 100. One ejector pin can be pressed at the middle of the edge of the first base island 111 away from the second base island 112, one ejector pin can be pressed at the middle of the edge between the first base island 111 and the second base island 112, one ejector pin can be pressed at the middle of the edge between the second base island 112 and the third base island 113, one ejector pin can be pressed at the middle of the edge between the third base island 113 and the fourth base island 114, one ejector pin can be pressed at the middle of the edge of the fourth base island 114 away from the third base island 113, and the other two ejector pins can be pressed at the middle position of the fourth base island 114.

[0079] During the packaging process, ejector pins press against any adjacent islands among the first, second, third, and fourth islands 111, 112, 113, and 114, along the middle portion of the heat dissipation substrate 100 along the width direction Y of the power module 10, the edge of the first island 111 away from the fourth island 114, and the fourth island 114. Because the area of ​​the fourth island 114 is larger than that of the first, second, and third islands 111, the number of ejector pins pressing against the fourth island 114 is also greater than the number of ejector pins pressing against the other islands. In this case, by pressing against the middle portions of the edges of multiple islands, and applying multiple pressures to larger islands, the larger heat dissipation substrate 100 can be well bonded to the surface of the packaging mold.

[0080] In some embodiments, as shown in Figures 7 to 12 , when the number n of residual portions 510 disposed on the first surface 501 of the package body 500 is less than or equal to 5 (n≤5), the orthographic projections of the n residual portions 510 on the conductive layer 110 coincide with the edges of the plurality of base islands located on the driving side 10A. As shown in Figure 13 , when the number n of residual portions 510 disposed on the first surface 501 of the package body 500 is greater than 5 (n>5), the orthographic projections of the n residual portions 510 on the conductive layer 110 are located in the middle of the plurality of base islands along the width direction Y of the power module 10. This arrangement prevents warping of a larger heat dissipation substrate 100 in the middle along the width direction Y of the power module 10, thereby enabling more stable fixing of the heat dissipation substrate 100 and preventing glue overflow from the back surface of the heat dissipation substrate 100.

[0081] On this basis, as shown in Figures 7 to 11, when the number n of residual portions 510 provided on the first surface 501 of the package body 500 is less than or equal to 5 (n≤5), the orthographic projections of the centers of the two residual portions 510 located at both ends on the conductive layer 110 respectively coincide with the vertices of the two corners of the conductive layer 110 located on the driving side 10A. In this way, not only can the ejector pins be ensured to stably press the conductive layer 110 during the packaging process, but the area of ​​the base island occupied by the ejector pins can also be minimized, thereby increasing the area of ​​the base island configured for arranging the power chip 200. It can be understood that this arrangement of the residual portions 510 can be applied to heat dissipation substrates 100 of any size, and the smaller the size of the heat dissipation substrate 100, the more obvious the advantages of this arrangement.

[0082] For example, as shown in Figures 7 to 10, two residual portions 510 are provided on the first surface 501 of the package body 500, and the orthographic projections of the centers of the two residual portions 510 on the conductive layer 110 respectively coincide with the vertices of two corners of the conductive layer 110 located on the driving side 10A. Taking the example of a circular outer contour of the residual portion 510, the orthographic projection of the center of one residual portion 510 on the conductive layer 110 coincides with the vertex of the first base island 111 located on the driving side 10A and away from the fourth base island 114, and the orthographic projection of the center of the other residual portion 510 on the conductive layer 110 coincides with the vertex of the fourth base island 114 located on the driving side 10A and away from the first base island 111.

[0083] In this way, during the packaging process, both ends of the conductive layer 110 along the length direction X of the power module 10 will be pressed by the ejector pins, so that the heat dissipation substrate 100 is not easily offset at the positions close to the first base island 111 and the fourth base island 114, ensuring that the fourth surface 102 of the heat dissipation substrate 100 and the second surface 502 of the packaging body 500 are in the same plane, thereby better preventing glue overflow from the back of the heat dissipation substrate 100.

[0084] Based on the above embodiments, it can be seen that the size of the heat dissipation substrate 100 is different for power modules 10 of different sizes. According to the dimension L of the heat dissipation substrate 100 along the length direction X of the power module 10, the number n of residual portions 510 corresponding to each base island (i.e., the number of ejector pins corresponding to each base island) and the distribution position of the residual portion 510 (i.e., the position where the ejector pin presses the base island) are designed. This can solve the problem of fitting between the heat dissipation substrate 100 and the packaging mold in power modules 10 of different sizes in a targeted manner, thereby avoiding glue overflow on the back of the heat dissipation substrate 100, thereby obtaining a good packaging effect. In addition, the process steps for removing glue overflow from the surface of the heat dissipation substrate 100 can be reduced, which is conducive to improving production efficiency.

[0085] In some embodiments, as shown in Figures 5 and 6, the minimum distance A between the orthographic projection of the power chip 200 closest to the residual portion 510 among the multiple power chips 200 on the conductive layer 110 and the orthographic projection of the edge of the residual portion 510 on the conductive layer 110 satisfies: A>0.45mm.

[0086] For example, a residual portion 510 is formed on the first surface 501 of the package body 500 at a position corresponding to the top corner of the first base island 111 located on the driving side 10A and away from the fourth base island 114. A power chip 200 close to the residual portion 510 is arranged on the first base island 111. The minimum distance between the upper left vertex of the power chip 200 (refer to Figure 5) and the edge of the positive projection of the residual portion 510 on the conductive layer 110 is A, and A>0.45mm.

[0087] When the minimum distance A between the power chip 200 closest to the residual portion 510 among the multiple power chips 200 and the residual portion 510 is less than 0.45 mm, the distance between the orthographic projection of the residual portion 510 on the conductive layer 110 and the power chip 200 is small. That is, during the packaging process, the distance between the edge of the end face of the ejector pin and the power chip 200 is small. In this case, if the position of the ejector pin deviates, it is easy for the ejector pin to contact the power chip 200, which may cause the ejector pin to crush the power chip 200. Therefore, the embodiment of the present disclosure sets the minimum distance A between the power chip 200 closest to the residual portion 510 and the edge of the orthographic projection of the residual portion 510 on the conductive layer 110 to satisfy A>0.45 mm. When the end of the ejector pin contacts the conductive layer 110, the distance between the edge of the ejector pin and the power chip 200 can be controlled within a safe range, thereby preventing the ejector pin from contacting the power chip 200 and avoiding the risk of the ejector pin crushing the power chip 200.

[0088] In some embodiments, as shown in Figures 14 and 15, a plurality of demolding portions 520 are provided on the second surface 502 of the package body 500. For example, the demolding portions 520 may be blind holes, which are indentations left on the second surface 502 of the package body 500 during the demolding process. By providing multiple demolding portions 520, the force applied to the package body 500 during the demolding process can be dispersed, thereby preventing damage to the package body 500 and preventing deformation of the package body 500.

[0089] In some examples, the plurality of demolding portions 520 may include a plurality of first demolding portions 521 and a plurality of second demolding portions 522. The plurality of first demolding portions 521 and the plurality of second demolding portions 522 are respectively located at two edges of the second surface 502 along the width direction Y of the power module 10, and the plurality of first demolding portions 521 and the plurality of second demolding portions 522 are arranged at intervals along the length direction X of the power module 10. For example, the plurality of demolding portions 520 may include three first demolding portions 521 arranged at intervals along the length direction X of the power module 10 and three second demolding portions 522 arranged at intervals along the length direction X of the power module 10, the first demolding portions 521 being located on the drive side 10A of the power module 10, and the second demolding portions 522 being located on the power side 10B of the power module 10.

[0090] In this way, after the power module 10 is packaged, the demolding pins provided at the positions corresponding to the first demolding portion 521 and the second demolding portion 522 can be extended to disengage the package body 500 from the mold, thereby facilitating demolding of the power module 10. In addition, by providing multiple first demolding portions 521 and multiple second demolding portions 522, the package body 500 has demolding pins at multiple positions corresponding to the length direction X and the width direction Y of the power module 10, thereby improving the demolding stability of the package body 500.

[0091] In other examples, the plurality of demolding portions 520 may further include a plurality of third demolding portions 523 and a plurality of fourth demolding portions 524. The plurality of third demolding portions 523 and the plurality of fourth demolding portions 524 are located between the plurality of first demolding portions 521 and the plurality of second demolding portions 522 along the width direction Y of the power module 10. Along the length direction X of the power module 10, the package body 500 has a first side surface 503 and a second side surface 504 that are opposite to each other. The plurality of third demolding portions 523 are located between the heat dissipation substrate 100 and the first side surface 503 of the package body 500, and the plurality of fourth demolding portions 524 are located between the heat dissipation substrate 100 and the second side surface 504 of the package body 500. For example, the multiple demolding parts 520 may include two third demolding parts 523 and two fourth demolding parts 524 located between the first demolding part 521 and the second demolding part 522 in the width direction Y of the power module 10, the two third demolding parts 523 are located between the first base island 111 and the first side surface 503 of the package body 500 along the length direction X of the power module 10 and are spaced apart along the width direction Y of the power module 10, and the two fourth demolding parts 524 are located between the fourth base island 114 and the second side surface 504 of the package body 500 along the length direction X of the power module 10 and are spaced apart along the width direction Y of the power module 10.

[0092] In this way, after the power module 10 is packaged, the demolding pins provided at the positions corresponding to the third demolding portion 523 and the fourth demolding portion 524 can be extended to disengage the package body 500 from the mold, thereby facilitating demolding of the power module 10. In addition, the first demolding portion 521 and the second demolding portion 522 are provided at the edge of the package body 500, and the third demolding portion 523 and the fourth demolding portion 524 are provided in the middle of the package body 500. This allows demolding pins to be provided at both the edge and the middle of the package body 500, thereby further improving the stability of demolding the package body 500.

[0093] In some embodiments, as shown in Figures 14 and 15 , the plurality of third mold release portions 523 and the plurality of fourth mold release portions 524 are planarly symmetrical about the center of the package body 500 along the width direction Y of the power module 10; that is, the plurality of third mold release portions 523 and the plurality of fourth mold release portions 524 are symmetrical along the vertical direction in Figure 17 . Furthermore, / or, the plurality of third mold release portions 523 and the plurality of fourth mold release portions 524 are planarly symmetrical about the center of the package body 500 along the length direction X of the power module 10; that is, the plurality of third mold release portions 523 and the plurality of fourth mold release portions 524 are symmetrical along the horizontal direction in Figure 17 .

[0094] This arrangement ensures that the power module 10 is subjected to uniform force during the demoulding process, so that the power module 10 can be demoulded smoothly. In addition, the symmetrical arrangement of the third demoulding portion 523 and the fourth demoulding portion 524 is also conducive to processing.

[0095] It is understood that the first surface 501 of the package body 500 is also provided with a plurality of demolding portions 520, which are indentations left on the first surface 501 of the package body 500 during the demolding process. The plurality of demolding portions 520 are evenly distributed on the first surface 501 to ensure uniform force on the package body 500 during the demolding process, thereby preventing damage to the package body 500 and preventing deformation of the package body 500.

[0096] Based on the above, it can be seen that the multiple first demolding parts 521 and the multiple second demolding parts 522 are relatively far away from the central axis ab of the power module 10 along its width direction Y, and the multiple third demolding parts 523 and the multiple fourth demolding parts 524 are relatively close to the central axis ab of the power module 10 along its width direction Y.

[0097] In some embodiments, as shown in Figures 7, 8, 14, and 15, the package body 500 may further include two notches 530. The two notches 530 may be located at both ends of the package body 500 along the length direction X of the power module 10 to facilitate securing the package body 500. For example, the notches 530 may be circular or U-shaped to facilitate assembly of the power module 10 with other components. The centers of the two notches 530 may be located on the central axis ab of the power module 10 along its width direction Y.

[0098] On this basis, there are two third mold release portions 523 and two fourth mold release portions 524. Along the width direction Y of the power module 10, the two third mold release portions 523 are located on both sides of the notch 530 close to the first side surface 503 of the package body 500, and the two fourth mold release portions 524 are located on both sides of the notch 530 close to the second side surface 504 of the package body 500.

[0099] For example, when the centers of the two notches 530 are located on the central axis ab of the power module 10 along its width direction Y, the two third demolding portions 523 are located on both sides of the central axis ab and are symmetrical with respect to the central axis ab, and the two fourth demolding portions 524 are also located on both sides of the central axis ab and are symmetrical with respect to the central axis ab. This prevents deformation or damage to the package body 500 during the demolding process, thereby extending the service life of the package mold.

[0100] In some embodiments, as shown in Figure 14, the intersection of the line between the two third demolding parts 523 and the central axis ab is located between the center of the notch 530 near the first side 503 and the intersection of the notch 530 and the central axis ab; the intersection of the line between the two fourth demolding parts 524 and the central axis ab is located between the center of the notch 530 near the second side 504 and the intersection of the notch 530 and the central axis ab.

[0101] Taking the power module 10 shown in FIG14 as an example, the orthographic projections of the centers of the two notches 530 on the surface of the package 500 are points a and b, respectively (the line connecting the two is the aforementioned central axis ab). The centers of the two third demolding portions 523 are points c and d, respectively. Point a is closer to points c and d than point b. The intersection of the notch 530 and the central axis ab is point e, and the intersection of the line connecting points c and d with the central axis ab is point f, which is located between points a and e. Based on this, in the longitudinal direction X of the power module 10, the two third demolding portions 523 are closer to the center of the package 500 relative to the center a of the notch 530 on the left end. Similarly, in the longitudinal direction X of the power module 10, the two fourth demolding portions 524 are closer to the center of the package 500 relative to the center b of the notch 530 on the right end.

[0102] In this way, compared with the notches 530 located at both ends of the package body 500, the third demolding portion 523 and the fourth demolding portion 524 are closer to the center of the package body 500, which can improve the demolding stability of the power module 10 and avoid damage to the package body 500 during the demolding process, thereby extending the service life of the packaging mold.

[0103] Based on the above embodiment, it can be seen that the heat dissipation substrate 100 has a third surface 101 and a fourth surface 102, and the fourth surface 102 of the heat dissipation substrate 100 is flush with the second surface 502 of the package body 500. As shown in Figures 2 to 4, the surface of the conductive layer 110 on which the power chip 200 is located is the third surface 101. In addition to the conductive layer 110, the heat dissipation substrate 100 may also include other film layers.

[0104] In some embodiments, as shown in FIG3 , the heat dissipation substrate 100 may further include a ceramic layer 120 and a heat dissipation layer 130. Along the thickness direction Z of the power module 10, the conductive layer 110 and the heat dissipation layer 130 are located on either side of the ceramic layer 120. The surface of the heat dissipation layer 130 that is away from the conductive layer 110 is flush with the second surface 502 of the package body 500. In other words, the surface of the heat dissipation layer 130 that is away from the conductive layer 110 is the fourth surface 102.

[0105] For example, the conductive layer 110 can be made of a metal material with good conductivity, such as copper, the heat dissipation layer 130 can be made of a metal material with good heat dissipation, such as copper, and the ceramic layer 120 can be made of an insulating resin material to prevent current dissipation. Based on this, the conductive layer 110, the ceramic layer 120, and the heat dissipation layer 130 can be a copper layer, a ceramic layer, and a copper layer, and the three together form a DBC (Direct Bond Copper) structure.

[0106] In this way, the heat generated by the power chip 200 during operation can be dissipated in a timely manner through the conductive layer 110, the ceramic layer 120 and the heat dissipation layer 130 to achieve heat dissipation of the power module 10, thereby ensuring the reliability of the power chip 200 and improving the performance of the power module 10.

[0107] In other embodiments, as shown in FIG4 , the heat dissipation substrate 100 may further include a ceramic layer 120 located on a side of the conductive layer 110 away from the first surface 501. The surface of the ceramic layer 120 away from the conductive layer 110 is flush with the second surface 502 of the package body 500. In other words, the surface of the ceramic layer 120 away from the conductive layer 110 is the fourth surface 102.

[0108] For example, the conductive layer 110 can be made of a metal material with good conductivity, such as copper, and the ceramic layer 120 can be made of an insulating material with good heat dissipation. Based on this, the conductive layer 110 and the ceramic layer 120 can form a single-sided copper-clad ceramic board, wherein the ceramic layer 120 has both insulation and heat dissipation functions.

[0109] In this way, the heat generated by the power chip 200 during operation can be dissipated promptly through the conductive layer 110 and the ceramic layer 120 to achieve heat dissipation of the power module 10, thereby ensuring the reliability of the power chip 200 and improving the performance of the power module 10.

[0110] In yet other embodiments, as shown in FIG2 , the conductive layer 110 and the power pin 600 are integrally formed. Specifically, the conductive layer 110 includes a portion located within the package 500 and a portion extending outside the package 500. The portion of the conductive layer 110 located within the package 500 can serve as a solder pad for the power chip 200, while the portion of the conductive layer 110 extending outside the package 500 can serve as a power pin 600. Furthermore, the heat dissipation substrate 100 can further include an insulating resin heat sink located on a side of the conductive layer 110 away from the first surface 501. The insulating resin heat sink is formed by connecting one side of an insulating resin sheet 140 to a heat sink 150. The other side of the insulating resin sheet 140 is connected to the conductive layer 110, which serves as the solder pad for the power chip 200. The surface of the heat sink 150 away from the conductive layer 110 is flush with the second surface 502 of the package 500. In other words, the surface of the heat sink 150 away from the conductive layer 110 serves as the fourth surface 102. For example, the heat sink 150 may be a copper sheet, and the insulating resin heat sink is usually an insulating resin copper sheet.

[0111] In some embodiments, as shown in Figures 14 and 15, the package body 500 may further include a first step portion 540 and a second step portion 550 that are recessed inward relative to both side surfaces of the package body 500 in the width direction Y of the power module 10. The first step portion 540 and the second step portion 550 are disposed opposite each other. Here, the recessed first step portion 540 and the second step portion 550 mean that the first step portion 540 and the second step portion 550 are recessed toward the interior of the package body 500.

[0112] The first stepped portion 540 is located on a side of the lead-out portion of the plurality of driver pins 700 close to the second surface 502 of the package body 500 and is recessed in a direction from the plurality of driver pins 700 toward the plurality of power pins 600. The first stepped portion 540 has a first stepped surface 541 and a first connecting surface 542 connected between the first stepped surface 541 and the second surface 502.

[0113] The second stepped portion 550 is located on a side of the lead-out portion of the power pins 600 that is close to the second surface 502 of the package body 500 and is recessed in a direction from the power pins 600 toward the driver pins 700. The second stepped portion 550 has a second stepped surface 551 and a second connecting surface 552 connected between the second stepped surface 551 and the second surface 502.

[0114] In this way, the setting of the first step portion 540 and the second step portion 550 can reduce the space between the side of the heat dissipation substrate 100 and the cavity of the packaging mold corresponding to the side where the drive pin 700 is located, and the side of the heat dissipation substrate 100 and the side where the power pin 600 is located, so as to reduce the amount of resin accumulated in these two positions during the resin injection process, thereby reducing the risk of resin overflowing from the bottom surface of the heat dissipation substrate 100 and generating burrs.

[0115] On this basis, as shown in Figures 14 and 15, a plurality of first demolding portions 521 and a plurality of second demolding portions 522 can be respectively disposed on the first step surface 541 of the first step portion 540 and the second step surface 551 of the second step portion 550, and a plurality of third demolding portions 523 and a plurality of fourth demolding portions 524 can be disposed on the second surface 502. This arrangement can ensure stable demolding of the package body 500.

[0116] In some embodiments, the heat dissipation substrate 100 may adopt the aforementioned DBC structure or single-sided copper clad structure. In this case, as shown in FIG20 , the package 500 may further include a resin injection portion 560 located on the side of the package 500 where the power pin 600 is located. Along the thickness direction Z of the power module 10, the distance H1 from the second step surface 551 of the second step portion 550 to the second surface 502 of the package 500 is less than the distance H0 from the resin injection portion 560 to the second surface 502 of the package 500, and the distance H1 from the second step surface 551 of the second step portion 550 to the second surface 502 of the package 500 is less than the distance H5 from the surface of the power chip 200 away from the conductive layer 110 to the second surface 502 of the package 500.

[0117] During the encapsulation process of the main structure of the power module 10, as shown in FIG21 , the main structure of the power module 10 can be placed in a mold cavity 820 of a packaging mold. The mold has a resin injection port A. Liquid resin is injected into the mold cavity 820 through the resin injection port A and fills the space between the main structure of the power module 10 and the cavity wall. After the resin solidifies, the package body 500 shown in FIG20 is formed. The portion of the package body 500 corresponding to the resin injection port A is the resin injection portion 560. The roughness of the resin injection portion 560 is greater than that of the other portions of the package body 500.

[0118] It is understandable that the shape of the cavity wall of the packaging mold matches the outer shape of the package body 500. Therefore, it can be seen that the cavity 820 of the packaging mold has a first step 821 corresponding to the first step portion 540 of the package body 500 and a second step 822 corresponding to the second step portion 550 of the package body 500. The distance H1' from the step surface of the second step 822 to the bottom surface of the cavity is less than the distance from the surface of the power chip 200 away from the conductive layer 110 to the bottom surface of the cavity, and the distance H1' from the step surface of the second step 822 to the bottom surface of the cavity is less than the height of the resin injection port A (i.e., the distance from the resin injection port A to the bottom surface of the cavity) H0'.

[0119] In this way, when resin is injected into the mold cavity of the packaging mold through the resin injection port A, the liquid resin first falls onto the second step 822. This second step 822 acts as a buffer for the liquid resin, reducing the height of the resin flowing toward the heat sink substrate 100 and reducing the downward impact force of the resin on the heat sink substrate 100. Furthermore, because the height of the second step 822 is less than the distance from the top surface of the power chip 200 to the bottom surface of the mold cavity, the resin flows from a low point to a high point toward the power chip 200. This results in a smoother flow of resin, further reducing the impact force of the resin on the heat sink substrate 100 and the power chip 200. This prevents glue overflow from the back of the heat sink substrate 100 and alleviates the problem of potential displacement of the heat sink substrate 100.

[0120] In some embodiments, as shown in FIG20 , along the thickness direction Z of the power module 10, a distance H1 from the second step surface 551 of the second step portion 550 to the second surface 502 of the package body 500 is substantially equal to a distance H2 from the first step surface 541 of the first step portion 540 to the second surface 502 of the package body 500. Furthermore, as shown in FIG15 , along the width direction Y of the power module 10, a distance H3 from the second connection surface 552 of the second step portion 550 to the third side surface 505 of the package body 500 proximate to the power pin 600 extending outside the package is substantially equal to a distance H4 from the first connection surface 541 of the first step portion 540 to the fourth side surface 506 of the package body 500 proximate to the driver pin 700 extending outside the package is substantially equal. This configuration can simplify the manufacturing process based on the buffer resin.

[0121] In some embodiments, as shown in Figures 15 and 20, the first step portion 540 may include a first main body portion extending along the length direction X of the power module 10, a first end portion extending along the width direction Y of the power module 10, and a first guide portion 545 connected between the first main body portion and the first end portion; and / or, the second step portion 550 may include a second main body portion extending along the length direction X of the power module 10, a second end portion extending along the width direction Y of the power module 10, and a second guide portion 555 connected between the second main body portion and the second end portion.

[0122] The first guide portion 545 and the second guide portion 555 can each be chamfered, rounded, grooved, or other structures that can achieve resin diversion. Providing guide portions at the corners of the first step 540 and / or the second step 550 can generate a force component that directs the resin toward the opposite side, thereby promoting resin flow and preventing resin from stagnating and accumulating at the corners, thereby preventing the formation of resin voids.

[0123] For example, the first step portion 540 may include only one first guide portion 545 , or may include two first guide portions 545 , each of which is connected between the first end portion and the first main body portion.

[0124] For another example, the second step portion 550 may include only one second guide portion 555 , or may include two second guide portions 555 , where each second guide portion 555 is connected between the second end portion and the second main body portion.

[0125] It should be noted that, in addition to forming a guide portion at the corner position of the first step portion 540 and / or the second step portion 550, a guide portion can also be formed at the corner position between any two adjacent side surfaces among the first side surface 503, the second side surface 504, the third side surface 505 and the fourth side surface 506 of the package body 500.

[0126] As a result, when liquid resin flows to the corner of the cavity corresponding to the guide, the guide promotes the flow of resin, thereby preventing resin stagnation and accumulation, which could result in resin voids. Furthermore, the provision of the guide reduces the amount of resin accumulated, further reducing the risk of resin overflowing from the bottom surface of the heat dissipation substrate 100 and causing burrs.

[0127] The embodiments of the present disclosure provide an electronic device, and the power module of at least one of the above embodiments can be applied to the electronic device. As shown in FIG22 , the electronic device 1000 may include a power module 10 and a controller 20 connected to the power module 10 .

[0128] For example, the controller 20 can generate a control signal according to a user instruction and send the control signal to the power module 10. The power module 10 can generate a driving signal according to the control signal and output it to the corresponding driven component to achieve the corresponding function.

[0129] It should be noted that the electronic device provided by the embodiment of the present disclosure has the same technical effects as the power module in the above-mentioned embodiment included therein, which will not be described in detail here.

[0130] In the description of the present disclosure, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature therebetween. A first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is at a higher level than the second feature.

[0131] In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation.

[0132] Although the embodiments of the present disclosure have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the claims and their equivalents.

[0133] Those skilled in the art will understand that the scope of the disclosure of the present invention is not limited to the specific embodiments described above, and that certain elements of the embodiments may be modified and replaced without departing from the spirit of the present application. The scope of the disclosure of the present application is limited by the appended claims.

Claims

1. A power module, comprising: A package body having a first surface and a second surface disposed opposite to each other along a thickness direction of the power module; the package body including one or more residual portions located on the first surface; a heat dissipation substrate disposed within the package and having a third surface and a fourth surface disposed opposite to each other along the thickness direction of the power module; the heat dissipation substrate comprising a conductive layer, a surface of the conductive layer close to the first surface being the third surface, and the fourth surface being flush with the second surface such that the fourth surface is exposed by the package; A plurality of power chips are arranged on the conductive layer and spaced apart along the length direction of the power module; The orthographic projections of the edges of the one or more residual portions on the conductive layer and the orthographic projections of the edges of the power chip on the conductive layer are staggered.

2. The power module according to claim 1, wherein: A minimum distance A between an orthographic projection of a power chip closest to the residual portion among the plurality of power chips and an orthographic projection of an edge of the residual portion on the conductive layer satisfies: A>0.45 mm.

3. The power module according to claim 1 or 2, wherein: The conductive layer includes a plurality of base islands spaced apart along a length direction of the power module, and the plurality of power chips are arranged on the plurality of base islands; The heat dissipation substrate has a dimension L along the length direction of the power module, the one or more residual portions are n residual portions, L≤40 mm and 2≤n≤4, and L and n are both positive integers; Among them, the n residual portions include at least two residual portions located at both ends along the length direction of the power module; along the thickness direction of the power module, the two residual portions located at both ends correspond to the two base islands located at both ends along the length direction of the power module among the multiple base islands.

4. The power module according to claim 3, wherein: When L≤25mm, n=2; the minimum distance between two adjacent power chips is B, the maximum cross-sectional dimension of the residual portion is C, and B and C satisfy: B<C+0.8mm; When 25 mm < L ≤ 32 mm, n = 3; a residual portion located in the middle along the length direction of the power module among the n residual portions has an orthographic projection on the conductive layer that overlaps with two adjacent base islands among the plurality of base islands; When 32mm<L≤40mm, n=4; the orthographic projections of two of the n residual portions located in the middle along the length direction of the power module on the conductive layer overlap with two of the multiple base islands located in the middle, respectively.

5. The power module according to claim 1 or 2, wherein: The conductive layer includes a plurality of base islands spaced apart along a length direction of the power module, and the plurality of power chips are arranged on the plurality of base islands; The heat dissipation substrate has a dimension L along the length direction of the power module, the one or more residual portions are n residual portions, L>40 mm and n>4, and L and n are both positive integers; Wherein, along the thickness direction of the power module, each base island corresponds to at least one residual portion.

6. The power module according to claim 5, wherein: n=5, the plurality of base islands include a first base island, a second base island, a third base island, and a fourth base island sequentially spaced along the length direction of the power module; the area of ​​the fourth base island is larger than that of the first base island, the second base island, and the third base island; Among them, the orthographic projections of three of the n residual parts on the conductive layer overlap with the first base island, the second base island and the third base island respectively, and the orthographic projections of the other two of the n residual parts on the conductive layer overlap with the fourth base island.

7. The power module according to claim 5, wherein: n>5, the plurality of base islands include a first base island, a second base island, a third base island, and a fourth base island sequentially spaced along the length direction of the power module; the area of ​​the fourth base island is larger than that of the first base island, the second base island, and the third base island; Among the n residual parts, the orthographic projection of one residual part on the conductive layer overlaps with the edge of the first base island on the side away from the second base island, and the orthographic projections of the other three residual parts on the conductive layer overlap with the edges of the first base island and the second base island, respectively. The mutually adjacent edges of the first base island and the second base island, the mutually adjacent edges of the second base island and the third base island, and the mutually adjacent edges of the third base island and the fourth base island overlap, and the positive projection of the remaining residual portion on the conductive layer overlaps with the fourth base island.

8. The power module according to any one of claims 1 to 7, wherein: The two sides of the power module along its width direction are respectively a driving side and a power side; the conductive layer includes a plurality of base islands spaced apart along the length direction of the power module, and the one or more residual portions are n residual portions; When n≤5, the orthographic projections of the n residual portions on the conductive layer coincide with the edges of the plurality of base islands located on the driving side; When n>5, the orthographic projections of the n residual portions on the conductive layer are located in the middle of the plurality of base islands along the width direction of the power module.

9. The power module according to claim 8, wherein: When n≤5, the orthographic projections of the centers of the two residual portions located at both ends along the length direction of the power module on the conductive layer respectively coincide with the vertices of the two corners of the conductive layer located on the driving side.

10. The power module according to any one of claims 1 to 9, wherein: The package body further includes a plurality of demoulding portions located on the second surface; the plurality of demoulding portions include: a plurality of first demolding portions and a plurality of second demolding portions, respectively located at two edges of the second surface along the width direction of the power module; the plurality of first demolding portions are arranged at intervals along the length direction of the power module, and the plurality of second demolding portions are arranged at intervals along the length direction of the power module; A plurality of third demolding parts and a plurality of fourth demolding parts are located between the plurality of first demolding parts and the plurality of second demolding parts along the width direction of the power module; along the length direction of the power module, the plurality of third demolding parts are located between the heat dissipation substrate and the first side surface of the package body, and the plurality of fourth demolding parts are located between the heat dissipation substrate and the second side surface of the package body.

11. The power module according to claim 10, wherein: The plurality of third demolding portions are plane-symmetrical about the center of the package body along the width direction of the power module, and the plurality of fourth demolding portions are plane-symmetrical about the center of the package body along the width direction of the power module; and / or The plurality of third mold-releasing portions and the plurality of fourth mold-releasing portions are plane-symmetrical with respect to a center of the package body along a length direction of the power module.

12. The power module according to claim 11, wherein: The package body includes two notches, and the two notches are located at two ends of the package body along the length direction of the power module; The plurality of third demolding portions are two third demolding portions; along the width direction of the power module, the two third demolding portions are located on both sides of the notch close to the first side surface; The plurality of fourth demolding portions are two fourth demolding portions; along the width direction of the power module, the two fourth demolding portions are located on both sides of the notch close to the second side surface.

13. The power module according to claim 12, wherein: The centers of the two notches are located on the central axis of the power module along its width direction; The intersection of the line connecting the two third demolding portions and the central axis is located between the center of the notch close to the first side surface and the intersection of the notch and the central axis; The intersection point of the line connecting the two fourth demoulding portions and the central axis is located between the center of the notch close to the second side surface and the intersection point of the notch and the central axis.

14. The power module according to any one of claims 1 to 13, wherein: The heat dissipation substrate further includes a ceramic layer and a heat dissipation layer; along the thickness direction of the power module, the conductive layer and the heat dissipation layer are respectively located on both sides of the ceramic layer; the surface of the heat dissipation layer away from the conductive layer is the fourth surface; or The heat dissipation substrate further includes a ceramic layer located on a side of the conductive layer away from the first surface, and a surface of the ceramic layer away from the conductive layer is the fourth surface.

15. The power module according to any one of claims 1 to 14, further comprising: A driving frame is disposed in the packaging body; At least one driver chip, disposed on the driver frame; The at least one driver chip is electrically connected to the plurality of power cores; A plurality of driving pins are arranged at intervals along the length direction of the power module; one end of the driving pin is connected to the driving frame, and the other end extends out of the package body; A plurality of power pins are spaced apart along the length direction of the power module; one end of each power pin is connected to the conductive layer, and the other end extends out of the package; The plurality of driving pins and the plurality of power pins are located on both sides of the power module along the width direction thereof.

16. The power module according to claim 15, wherein: The package further comprises: a second step portion, located on a side of a portion of the plurality of power pins extending out of the package body and close to the second surface of the package body, and recessed in a direction in which the plurality of power pins point toward the plurality of drive pins; the second step portion having a second step surface and a second connecting surface connected between the second step surface and the second surface; Along the thickness direction of the power module, a distance from the second step surface of the second step portion to the second surface of the package body is smaller than a distance from a surface of the power chip away from the conductive layer to the second surface of the package body.

17. The power module according to claim 16, wherein: The package body further includes: a first step portion, located on a side of a portion of the plurality of driving pins extending out of the package body and close to the second surface of the package body, and recessed in a direction in which the plurality of driving pins point toward the plurality of power pins; the first step portion has a first step surface and a first connecting surface connected between the first step surface and the second surface; Multiple demoulding sections, including: a plurality of first demolding portions located on the first step surface, wherein the plurality of first demolding portions are arranged at intervals along the length direction of the power module; a plurality of second demolding portions located on the second step surface, wherein the plurality of second demolding portions are arranged at intervals along the length direction of the power module; A plurality of third demolding portions and a plurality of fourth demolding portions are located on the second surface; along the length direction of the power module, the plurality of third demolding portions are located between the heat dissipation substrate and the first side surface of the package body, and the plurality of fourth demolding portions are located between the heat dissipation substrate and the second side surface of the package body.

18. The power module according to claim 17, wherein: Along the thickness direction of the power module, a distance from the second step surface of the second step portion to the second surface of the package body is substantially equal to a distance from the first step surface of the first step portion to the second surface of the package body; And / or, along the width direction of the power module, the distance from the second connection surface of the second step portion to the third side surface of the package body close to the power pin extending outside the package body is approximately equal to the distance from the first connection surface of the first step portion to the fourth side surface of the package body close to the drive pin extending outside the package body.

19. The power module according to claim 18, wherein: The first step portion includes a first air guide portion located at a corner; and / or the second step portion includes a second air guide portion located at a corner.

20. An electronic device comprising the power module according to any one of claims 1 to 19.

Images