Power module and device

Abstract

The power module comprises a packaging body, and a power chip, a control chip and a heat dissipation substrate which are positioned in the packaging body, and a power pin and a control pin which are respectively led out from a first side surface and a second side surface of the packaging body. The power chip is disposed on the heat dissipation substrate. The bottom surface of the heat dissipation substrate is flush with the bottom surface of the packaging body and is exposed out of the packaging body. The packaging body comprises a resin injection part and a first step part, and the first step part is located on the side, close to the bottom face of the packaging body, of the part, extending out of the packaging body, of the power pin. Along the width direction of the packaging body, the side surface of the first step part is closer to the heat dissipation substrate relative to the first side surface; and along the thickness direction of the packaging body, the step surface of the first step part is closer to the part, extending out of the packaging body, of the power pin relative to the bottom surface of the packaging body, and the distance from the step surface of the first step part to the bottom surface of the packaging body is smaller than the distance from the resin injection part to the bottom surface of the packaging body.

Description

Power modules and devices

[0001] This application claims priority to Chinese patent application No. 202211442177.8 filed on November 17, 2022, Chinese patent application No. 202211458029.5 filed on November 17, 2022, and Chinese patent application No. 202211442180.X filed on November 17, 2022, all of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the technical field of electronic devices, and in particular to a power module and a device. Background Art

[0003] Power modules (PMs) feature high current density, low saturation voltage, low drive power, high switching frequency, high functional integration, ease of use, and excellent reliability. They are widely used in consumer electronics, home appliances, automobiles, rail transportation, industrial equipment, new energy, smart grids, and many other fields. Typically, power modules use resin to encapsulate the power chip and control chip to achieve high integration.

[0004] Summary of the Invention

[0005] In one aspect, a power module is provided. The power module includes a package, a power chip, a control chip, power pins, control pins, and a heat dissipation substrate. The power chip and the control chip are electrically connected and both are disposed within the package. The power pins extend from a first side surface of the package and are electrically connected to the power chip; the control pins extend from a second side surface of the package and are electrically connected to the control chip; the first side surface and the second side surface are disposed opposite each other. The heat dissipation substrate is disposed within the package, and the power chip is disposed on the heat dissipation substrate. The bottom surface of the heat dissipation substrate is flush with the bottom surface of the package and is exposed outside the package.

[0006] The package body includes a resin injection portion; along the thickness direction of the power module, a distance from the resin injection portion to the bottom surface of the package body is greater than a distance from the top surface of the power chip to the bottom surface of the package body.

[0007] The package body also includes a recessed first step portion, which is located on a side of the portion of the power pin extending out of the package body close to the bottom surface of the package body, and along the thickness direction of the power module, the distance from the step surface of the first step portion to the bottom surface of the package body is smaller than the distance from the resin injection portion to the bottom surface of the package body.

[0008] On the other hand, a device is provided, including a controller and the power module provided in the above embodiment, wherein the power module is connected to the controller. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] FIG1A is a schematic cross-sectional view of a power module in the related art along the width direction;

[0010] FIG1B is a schematic structural diagram of a transfer molding method used in the related art to encapsulate the main structure of a power module;

[0011] FIG2A is a schematic cross-sectional view of a power module along a width direction according to some embodiments;

[0012] FIG2B is a schematic structural diagram of encapsulating the main structure of a power module by using a transfer molding method according to some embodiments;

[0013] FIG2C is a schematic cross-sectional view of a power module along a width direction according to some embodiments;

[0014] 2D is a schematic cross-sectional view of a power module along a width direction according to some embodiments;

[0015] FIG2E is a schematic cross-sectional view of a power module along a width direction according to some embodiments;

[0016] FIG3 is a side view of a power module according to some embodiments;

[0017] FIG4 is a top view of a power module according to some embodiments;

[0018] FIG5 is a perspective view of a power module according to some embodiments;

[0019] FIG6 is a top view of a power module according to some embodiments;

[0020] FIG7 is a perspective view of a power module according to some embodiments;

[0021] FIG8 is a top view of a power module according to some embodiments;

[0022] FIG9 is a bottom view of a power module according to some embodiments;

[0023] FIG10 is a partial enlarged view of the power module shown in FIG9 ;

[0024] FIG11 is a perspective view of a power module according to some embodiments;

[0025] FIG12 is a bottom view of a power module according to some embodiments;

[0026] FIG13 is a side view of a power module according to some embodiments;

[0027] FIG14 is a top view of a power module according to some embodiments;

[0028] FIG15 is a partial enlarged view of position A1 of the power module in FIG14 ;

[0029] FIG16 is a schematic structural diagram of a power module according to some embodiments;

[0030] FIG17 is a partial enlarged view of position B1 of the power module in FIG16 ;

[0031] FIG18 is a partial enlarged view of position B1 of the power module in FIG16 ;

[0032] FIG19 is a schematic diagram of the structure of a device according to some embodiments. DETAILED DESCRIPTION

[0033] The following will be combined with the accompanying drawings to clearly and completely describe some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0034] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0035] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. As used in this specification and the appended claims, the singular forms "a" and "the" also include plural referents unless the content clearly indicates otherwise. In the description of the embodiments of the present disclosure, unless otherwise stated, "a plurality" means two or more.

[0036] When describing some embodiments, the term "connected" and its derivatives may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other. The embodiments disclosed herein are not necessarily limited to the embodiments disclosed herein.

[0037] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0038] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0039] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0040] As used herein, "about," "approximately," or "substantially" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0041] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thicknesses of layers and regions are exaggerated for clarity. The exemplary embodiments disclosed herein should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0042] In related art, as shown in FIG1A , a power module (PM) 100' integrates and packages, for example, a power chip 2' and a control chip 3' within a package 1'. During operation, a high current flows through the power chip 2', resulting in a high heat generation. Therefore, to ensure the effectiveness of the power module, the power module 100' also includes a heat sink 4' for dissipating heat from the power chip 2'. The heat sink 4' is typically located at the bottom of the power module 100', with the bottom surface of the heat sink 4' exposed from the bottom surface of the package 1' to enhance heat dissipation.

[0043] Transfer molding is typically used for packaging. As shown in FIG1B , the main structure of a power module 100 ′, such as the power chip 2 ′, the control chip 3 ′, the heat sink substrate 4 ′, and the lead frame, is placed in a cavity 1011 ′ of a mold 101 ′. Liquid packaging resin is then injected into the mold cavity 1011 ′. After the packaging resin solidifies, the mold 101 ′ is removed to obtain the power module 100 ′ shown in FIG1A .

[0044] However, in the related art, as shown in FIG1B , the mold has an upper shell and a lower shell, which are fastened together to form an internal cavity, and the power pin 20' is led out from the position where the upper shell and the lower shell are fastened together. The resin injection port A' for injecting the encapsulation resin into the mold cavity 1011' is usually set on the side of the mold 101' corresponding to the power pin 20', and is located near the position where the upper shell and the lower shell are fastened together. For example, along the thickness direction of the mold, the height h1 of the resin injection port is approximately equal to, slightly higher than, or slightly lower than the height of the position where the power pin 20' is led out of the package body 1'. In addition, the height h1 of the resin injection port is higher than the height h2 of the upper surface of the power chip 2' provided on the heat dissipation substrate 4' to ensure that the resin can completely encapsulate the power chip 2; in other words, the height h1 of the resin injection port is higher than the height of the upper surface of the heat dissipation substrate 4'. Therefore, when the encapsulation resin is injected, it will rush toward the heat dissipation substrate 4' in an oblique downward direction (as shown by the dotted arrow in FIG1B ), generating a large impact force on the heat dissipation substrate 4', which may easily cause displacement defects of the heat dissipation substrate 4' and affect the electrical safety and stability of the power module.

[0045] Based on this, an embodiment of the present disclosure provides a power module. As shown in Figures 2A to 2E, the main structure of the power module 100 includes a power chip 20, a control chip 30, a power pin 40 electrically connected to the power chip 20, a control pin 50 electrically connected to the control chip 30, and a heat dissipation substrate 60. The power pin 40 is used to connect the power chip 20 to an external driving component, and the control pin 50 is used to connect the control chip 30 to an external controller. The power chip 20 is also electrically connected to the control chip 30, and the control chip 30 is used to drive the power chip 20. The power chip 20 is arranged on the heat dissipation substrate 60, and the heat dissipation substrate 60 is used to dissipate heat for the power chip 20 to ensure the normal operation of the power chip 20, thereby ensuring the effectiveness of the power module 100.

[0046] The power module 100 also includes a package body 10 for encapsulating the main structure. The package body 10 has a first side surface 10A and a second side surface 10B, which are oppositely disposed and extend along the package body's length direction X. A portion (hereinafter referred to as the first portion) 401 of the power pin 40 extends from the first side surface 10A of the package body 10, while another portion (hereinafter referred to as the second portion) 402 is electrically connected to the power chip 20. A portion (hereinafter referred to as the first portion) 501 of the control pin 50 extends from the second side surface 10B of the package body 10, while another portion (hereinafter referred to as the second portion) 502 is electrically connected to the control chip 30. The bottom surface 60A of the heat sink substrate is flush with the bottom surface 10E of the package body and is exposed outside the package body 10 to enhance heat dissipation.

[0047] It should be noted that the surface of the heat dissipation substrate 60 on which the power chip 20 is provided is called the top surface of the heat dissipation substrate 60, and the surface of the heat dissipation substrate 60 opposite to its top surface and without the power chip is called the bottom surface 60A of the heat dissipation substrate 60; the surface of the package 10 on which the heat dissipation substrate 60 is provided is called the bottom surface 10E of the package 10, and the bottom surface 10E of the package 10 is the heat dissipation surface of the power module 100.

[0048] As shown in FIG. 4 to FIG. 9 , FIG. 11 and FIG. 12 , there are multiple power pins 40 and multiple control pins 50 , and the length direction X of the package is the direction in which the multiple power pins 40 or the multiple control pins 50 are arranged.

[0049] As shown in FIG. 2A , FIG. 3 , FIG. 4 , and FIG. 13 , the package body 10 includes a resin injection portion 11 .

[0050] In the disclosed embodiment, transfer molding is used to encapsulate the main structure of the power module 100 to form a package 10. Specifically, as shown in FIG2B , the main structure of the power module 100 is placed in a cavity 1011 of a mold 101. The mold 101 has a resin injection port A. Liquid resin is injected into the mold cavity 1011 through the resin injection port A and fills the space between the main structure of the power module located in the cavity and the cavity wall. After the resin solidifies, the package 10 shown in FIG2A is formed, providing cover and protection for the power chip 20 and the control chip 30, thereby improving the structural reliability of the power module 100.

[0051] Therefore, it can be understood that the portion of the package 10 corresponding to the resin injection port A is the resin injection portion 11 of the package 10 , and the roughness of the resin injection portion 11 is greater than that of other portions of the package 10 .

[0052] For example, along the thickness direction Z of the power module 100, the distance H0 from the resin injection portion 11 to the bottom surface 10E of the package body is greater than the distance H2 from the top surface 20A of the power chip 20 (i.e., the surface away from the heat dissipation substrate 60) to the bottom surface 10E of the package body. In this way, when the resin is injected into the cavity 1011, it can be ensured that the injected resin can submerge the power chip 20, thereby better encapsulating the power chip 20 in the package body 10.

[0053] In addition, the package body 10 further includes a recessed first step portion 12 located on a side of the first portion 401 of the power pin 40 extending outward from the package body 10 and close to the bottom surface 10E of the package body.

[0054] Here, the recessed first step portion 12 means that the first step portion 12 is recessed toward the interior of the package body 10. That is, the first step portion 12 has a step surface 12A and a side surface 12B. Along the width direction Y of the package body 10, the side surface 12B of the first step portion 12 is closer to the heat dissipation substrate 60 than the first side surface 10A of the package body 10; and along the thickness direction Z of the package body 10, the step surface 12A of the first step portion 12 is closer to the first portion 401 of the power pin 40 extending outward from the package body 10 than the bottom surface 10E of the package body.

[0055] Along the thickness direction Z of the power module 100, a distance H1 from the stepped surface 12A of the first stepped portion 12 to the bottom surface 10E of the package body is shorter than a distance H40 from the first portion 401 of the power pin 40 extending outward from the package body 10 to the bottom surface 10E of the package body. Furthermore, the distance H1 from the stepped surface 12A of the first stepped portion 12 to the bottom surface 10E of the package body is shorter than a distance H0 from the resin injection portion 11 to the bottom surface 10E of the package body.

[0056] It should be noted that, as shown in Figure 2A, a surface of the package body 10 opposite to its bottom surface 10E is called the top surface 10F of the package body, the direction from the bottom surface 10E of the package body to the top surface 10F is called the thickness direction Z of the package body, and the direction from the first side surface 10A of the package body to the second side surface 10B is called the width direction of the package body.

[0057] It is understood that the shape of the cavity 1011 formed by the mold 101 should match the outer shape of the package 10 of the power module 100 of the present disclosure. In other words, the cavity 1011 of the mold 101 should have a cavity wall structure corresponding to the outer shape of the package 10.

[0058] Therefore, as shown in Figure 2B, the cavity 1011 of the mold 101 has a first cavity wall step 1012 corresponding to the first step portion 12 of the package body 10, and the first cavity wall step 1012 is located on the side of the resin injection port A close to the bottom of the mold, that is, the distance H11 from the step surface of the first cavity wall step 1012 to the bottom surface of the cavity is less than the height of the resin injection port A (that is, the distance from the resin injection port A to the bottom surface of the cavity) H01.

[0059] In this way, when the resin is injected into the mold cavity through the resin injection port, the resin first falls on the first cavity wall step 1012. The first cavity wall step 1012 has a certain buffering effect on it, reducing the height of the resin rushing toward the heat dissipation substrate 60, and reducing the oblique downward impact force of the resin on the heat dissipation substrate 60, so that the resin can flow toward the heat dissipation substrate 60 as smoothly as possible, thereby alleviating the problem of displacement defects of the heat dissipation substrate 60 and improving the electrical safety and stability of the power module.

[0060] Furthermore, by providing the first cavity wall step 1012, the space between the heat dissipation substrate 60 and the side of the corresponding power pin 40 of the cavity (i.e., the space between the heat dissipation substrate 60 and the first cavity wall step 1012) is reduced, thereby reducing the amount of resin accumulation in the space when injecting resin, and reducing the risk of resin overflowing from the bottom surface of the heat dissipation substrate 60 and generating burrs.

[0061] 2B , mold 101 includes an upper shell and a lower shell, which are fastened together to form an internal cavity 1011. Therefore, as shown in FIG3 , the side surface of package 10 formed by this mold has a resin parting surface F corresponding to the fastening position of the upper shell and the lower shell of mold 101.

[0062] For example, referring to FIG2B , the resin injection port A can be positioned near the snap-fit ​​position between the upper and lower shells. For example, the resin injection port A can be positioned at the snap-fit ​​position between the upper and lower shells, or the resin injection port A can be positioned slightly above or slightly below the snap-fit ​​position between the upper and lower shells. Correspondingly, for the power module 100 , as shown in FIG3 , the resin injection portion 11 can be positioned near the resin parting surface F, for example, above or below the resin parting surface F, or positioned corresponding to the resin parting surface F. Such a configuration can facilitate mold processing.

[0063] In some examples, referring to FIG2B , the resin injection port A can be provided on the side of the mold 101 where the power pins 40 are led out; that is, correspondingly, as shown in FIG4 , the resin injection portion 11 can be located on the first side 10A of the package body 10 . In other examples, the resin injection port A can be provided on another side of the mold adjacent to the side where the power pins 40 are led out; that is, correspondingly, as shown in FIG4 , the resin injection portion 11 can be located on the side of the package body 10 adjacent to the first side 10A (e.g., the fourth side 10D extending along the width direction Y of the package body 10 ). The present disclosure is not limited to this, as long as the resin can be injected into the cavity of the mold 101 through the resin injection port A to form the package body.

[0064] In the embodiment of the present disclosure, the heat dissipation substrate 60 may be a double-sided copper-clad ceramic plate or a single-sided copper-clad ceramic plate or a ceramic substrate or an insulating heat dissipation copper sheet in an integrated structure, and no specific limitation is made here.

[0065] In some examples, as shown in FIG2A , the heat dissipation substrate 60 is a double-sided copper-clad ceramic substrate (also referred to as a direct bond copper (DBC) ceramic substrate) in an integrated structure, including a ceramic plate 61 and a copper layer 62 and another copper layer 63 located on either side. The power chip 20 can be disposed on the copper layer 62 of the double-sided copper-clad ceramic plate. For example, the copper layer 62 of the double-sided copper-clad ceramic plate can be provided with power pads (not shown), and the power chip 20 is disposed on the copper layer 62 of the double-sided copper-clad ceramic plate via the power pads. The power pins 40 are connected to the copper layer 62. The other copper layer 63 of the double-sided copper-clad ceramic plate is flush with the bottom surface 10E of the package 10 and is exposed outside the package 10. That is, the surface of the other copper layer 63 of the double-sided copper-clad ceramic plate, away from the ceramic plate 61, is flush with the bottom surface 10E of the package 10 and is exposed outside the package 10. In this embodiment, the double-sided copper-clad ceramic plate can achieve both conductive connection to the power chip 20 and thermal conductivity to the power chip 20 .

[0066] In other examples, as shown in FIG2C , the heat dissipation substrate 60 is a single-sided copper-clad ceramic plate with an integrated structure, including a ceramic plate 61 and a copper layer 62 located on one side of the ceramic plate 61. The power chip 20 can be arranged on the copper layer 62 of the single-sided copper-clad ceramic plate; for example, a power pad (not shown in the figure) can be provided on the copper layer 62 of the single-sided copper-clad ceramic plate, and the power chip 20 is arranged on the copper layer 62 of the single-sided copper-clad ceramic plate through the power pad; the power pin 40 is connected to the copper layer 62. The bottom surface of the ceramic plate 61 of the single-sided copper-clad ceramic plate (i.e., the surface of the ceramic plate 61 without the copper layer) is flush with the bottom surface 10E of the package body 10 and is exposed outside the package body 10. In this embodiment, the single-sided copper-clad ceramic plate can achieve both conductive connection to the power chip 20 and thermal conductivity to the power chip 20.

[0067] In yet other examples, as shown in FIG2D , the heat dissipation substrate 60 is a ceramic substrate. The upper surface of the ceramic substrate (i.e., the surface proximal to the power chip 20) is aligned with the lower surface of the second portion 402 of the power pin 40 located within the package 10 (i.e., the surface distal to the power chip 20). The power chip 20 is disposed on the first portion 401 of the power pin 40 located within the package 10. The bottom surface of the ceramic substrate (i.e., the surface distal to the power chip 20) is flush with the bottom surface 10E of the package 10 and is exposed outside the package 10. In this embodiment, the second portion 402 of the power pin 40 located within the package 10 serves as a power pad frame to achieve an electrically conductive connection with the power chip 20 and, in conjunction with the ceramic substrate, to conduct heat to the power chip 20. The ceramic substrate may be a single piece or comprised of multiple, uniformly-heightened ceramic plates disposed on the side of the power pad frame distal to the power chip 20.

[0068] In yet other examples, in the power module 100 shown in FIG2E , the heat dissipation substrate 60 is a double-sided copper-clad ceramic plate having an integrated structure as shown in FIG2A , which is not described in detail here. In this case, the power module 100 further includes a printed circuit board (PCB) encapsulated within the package body 10 , which can serve as control pads for mounting the control chip 30 , i.e., the control chip 30 is mounted on the PCB; the control pins 50 can be soldered to the PCB.

[0069] In some embodiments, as shown in FIG2A , a distance H1 from a stepped surface 12A of the first stepped portion 12 to the bottom surface 10E of the package body is less than a distance H2 from the top surface 20A of the power chip 20 to the bottom surface 10E of the package body 10. Correspondingly, as shown in FIG2B , a distance H11 from a stepped surface of a cavity wall step 1012 provided in the mold cavity to the bottom surface of the cavity is less than a distance from the top surface 20A of the power chip 20 to the bottom surface of the cavity.

[0070] In this way, when the resin is injected into the mold cavity through the resin injection port A, the resin flows to the heat dissipation substrate 60 and the power chip 20 through the cavity wall step 1012. At this time, the resin tends to flow gently toward the heat dissipation substrate 60 in the horizontal direction, greatly reducing the impact force of the resin on the heat dissipation substrate 60, thereby further reducing the displacement defects caused by the impact force of the resin on the heat dissipation substrate 60.

[0071] Moreover, when the distance H1 from the step surface 12A of the first step portion 12 to the bottom surface 10E of the package body 10 is smaller, the space between the heat dissipation substrate 60 and the side surface of the corresponding power pin of the cavity is also smaller, which can further reduce the amount of resin accumulated in the space, thereby further reducing the risk of resin overflowing from the bottom surface of the heat dissipation substrate 60 and generating burrs.

[0072] In some embodiments, as shown in FIG2C , a distance S from the end of the heat dissipation substrate 60 close to the power pin 40 to the side surface 12B of the first step portion 12 is greater than or equal to 0.5 times the thickness H3 of the heat dissipation substrate 60 and less than or equal to 1.5 times the thickness H3 of the heat dissipation substrate 60 , that is, 0.5H3≤S≤1.5H3.

[0073] For example, the thickness H3 of the heat dissipation substrate 60 may be 1.05 mm.

[0074] For example, the distance S from the end of the heat dissipation substrate 60 close to the power pin 40 to the side surface 12B of the first step portion 12 satisfies: S=0.5H3, or S=1.0H3, or S=1.5H3.

[0075] For example, the distance S between the end of the heat dissipation substrate 60 close to the power pin 40 and the side surface 12B of the first step portion 12 may be set to 0.869 mm or 1.2 mm.

[0076] The distance S from the end of the heat dissipation substrate 60 close to the power pin 40 to the side 12B of the first step portion 12 is larger. When the resin is injected into the mold cavity, the resin can more easily fill the space, thereby avoiding the defect of resin voids; the distance S from the end of the heat dissipation substrate 60 close to the power pin 40 to the side 12B of the first step portion 12 is smaller. When the resin is injected into the mold cavity, the amount of resin accumulated in the space is smaller, thereby avoiding the resin overflowing from the bottom of the heat dissipation substrate 60 and causing burr defects.

[0077] Therefore, in this embodiment, the distance S between the end of the heat sink substrate 60 near the power pin 40 and the side surface 12B of the first step 12 is set to be greater than or equal to 0.5 times the thickness H3 of the heat sink substrate 60 and less than or equal to 1.5 times the thickness H3 of the heat sink substrate 60. This allows the resin to more easily fill the space between the heat sink substrate 60 and the side surface of the cavity corresponding to the power pin 40 when injecting resin into the mold cavity, thereby avoiding the formation of resin voids. Furthermore, the amount of resin accumulated in this space can be reduced, thereby preventing the formation of burr defects. This further ensures the insulation stability of the power module 100 and improves its electrical safety.

[0078] In some embodiments, as shown in Figures 5 to 8 and 11, the first step portion 12 includes a main portion 121 extending along the length direction X of the package body 10 and at least one end portion 122 extending along the width direction Y of the package body 10. For example, there can be one end portion 122, which is located on one side of the main portion 121 along the length direction X of the package body 10. For another example, there can be two end portions 122, which are respectively located on both sides of the main portion 121 along the length direction X of the package body 10.

[0079] In this case, the first step portion 12 further includes a first guide portion 1031 connecting the main portion 121 and the end portion 122 of the first step portion 12. The first guide portion 1031 is configured to achieve a resin guide function.

[0080] For example, when the first step portion 12 includes only one end portion 122, the first step portion 12 includes only one first guide portion 1031. For another example, when the first step portion 12 includes two end portions 122, the first step portion 12 may include two first guide portions 1031, with one first guide portion 1031 connecting one end portion 122 and the main body portion 121.

[0081] It is understandable that when the first step portion 12 includes the first guide portion 1031 , the first cavity wall step corresponding to the first step portion in the mold cavity forming the package body 10 also has a guide structure corresponding to the first guide portion 1031 .

[0082] In this way, when the resin is injected into the mold cavity, when the resin flows to the corner in the mold cavity corresponding to the first guide portion 1031, the guide structure in the mold cavity corresponding to the first guide portion 1031 can generate a component force to guide the resin to the opposite side, so as to improve the fluidity of the resin here and guide the resin to flow forward, thereby avoiding stagnation of the resin here, thereby further reducing the generation of resin gaps; and, it can also further reduce the amount of resin accumulated here, which can further avoid the risk of resin overflowing from the bottom surface of the heat dissipation substrate 60 and generating burrs.

[0083] In some examples, the first guide portion 1031 may be a chamfer, a convex portion, or a concave portion.

[0084] For example, as shown in Figures 5 to 8, the first guide portion 1031 may be chamfered. Here, the chamfer may be understood as a surface that is formed by cutting off a sharp edge and connecting the side surfaces of the main body portion 121 and the end portion 122 included in the first step portion 12, and that is at a certain angle to the side surfaces of the main body portion 121 and the end portion 122 included in the first step portion 12.

[0085] Regarding the specific settings of the chamfer angle and side length and the effects that can be produced when the first guide portion 1031 is set as a chamfer, please refer to the following description of the second guide portion 1032, which will not be described in detail here.

[0086] For another example, the first guide portion 1031 may be a convex portion or a concave portion. For example, as shown in FIG11 , the first guide portion 1031 is an arc-shaped surface convex toward the outside of the package body 10 .

[0087] Regarding the effects produced when the first air guide portion 1031 is configured as a convex portion or a concave portion, reference may be made to the following description of the second air guide portion 1032 , which will not be described in detail here.

[0088] In some embodiments, as shown in Figures 5 to 9 , the power module 100 further includes a second guide portion 1032 , which is disposed at a corner of the package 10 on the side leading out the power pins 40 (i.e., the first side surface 10A of the package) at the end thereof along the package's length direction X. The second guide portion 1032 is configured to guide resin.

[0089] For example, there can be only one second guide portion 1032. The second guide portion 1032 can be provided at a corner of one end of the first side surface 10A of the package body 10 along the longitudinal direction X of the package body, that is, at the corner where the first side surface 10A and the fourth side surface 10D are connected. Alternatively, the second guide portion 1032 can be provided at a corner of the other end of the first side surface 10A of the package body 10 along the longitudinal direction X of the package body, that is, at the corner where the first side surface 10A and the third side surface 10C (that is, the other side surface adjacent to the first side surface 10A except the fourth side surface 10D) are connected.

[0090] As another example, as shown in Figures 5 to 9, there can be two second guide portions 1032, which are respectively arranged at the corners of the two ends of the first side surface 10A of the package body 10 along the length direction X of the package body, that is, respectively arranged at the corner where the first side surface 10A is connected to the fourth side surface 10D and the corner where the first side surface 10A is connected to the third side surface 10C.

[0091] In this way, when injecting resin, the structure corresponding to the second guide part 1032 in the cavity can generate a component force to guide the resin to the opposite side, so as to improve the fluidity of the resin here and guide the resin to flow forward, thereby reducing the stagnation and accumulation of resin at the corner of the package body in the cavity, and reducing the generation of resin gaps, thereby ensuring the electrical safety of the power module.

[0092] In some examples, as shown in Figures 5 to 9, the second guide portion 1032 may be chamfered. Here, the chamfer may be understood as a surface connecting the first side surface 10A and the third side surface 10C (or the fourth side surface 10D) by cutting off a sharp edge, and forming a surface at a certain angle to both the first side surface 10A and the third side surface 10C (or the fourth side surface 10D).

[0093] For example, the resin injection port is located on the side where the power pin of the mold is led out (i.e., the side corresponding to the first side 10A of the package body 10), and resin is injected into the cavity through the resin injection port. When the resin flows to the position corresponding to the second guide portion 1032 in the cavity, as shown in Figure 9, the corresponding chamfered structure in the cavity will generate a component force Fy obliquely toward the opposite side (e.g., the second side 10B) for the resin at this location, thereby allowing the resin in the cavity that flows to the corner to flow forward, avoiding stagnation and accumulation at the corner, and reducing the generation of resin gaps.

[0094] As can be seen from the above, the chamfer angle can affect the diversion effect of the diversion portion. For example, as shown in Figure 10, the chamfer angle θ can meet 50°≤θ≤70°. This ensures a high diversion capacity of the chamfer while saving raw materials. For example, the chamfer angle θ can be 50°, 60°, or 70°, etc., and this is not limited in the embodiments of the present disclosure.

[0095] For example, as shown in FIG10 , the chamfered side length L can be greater than 1.2 mm to further improve the chamfered flow conductivity. For example, the chamfered side length L can be 1.2 mm, 1.4 mm, or 1.6 mm, etc., and this is not limited in the present embodiment. As shown in FIG8 , the chamfered side length L is 1.4 mm.

[0096] Since the second air guide 1032 is disposed at the corner between the first side surface 10A and the third side surface 10C (or the fourth side surface 10D), and is typically installed in the middle along the width direction Y when used in a power module, it is understood that the side length L of the chamfer will not exceed 0.5 times the dimension of the third side surface 10C (or the fourth side surface 10D) along the width direction of the package body 10.

[0097] Similarly, in other examples, the second guide portion 1032 may also be a convex portion, for example, an arc surface protruding toward the outside of the package body 10, which can also achieve the effect of guiding the resin at the corner where the second guide portion 1032 of the package body 10 is located in the cavity forward, avoiding stagnation and accumulation of resin at the corner, reducing the generation of resin gaps, and improving the electrical safety of the power module.

[0098] In other examples, the second guide portion 1032 can also be a recessed portion. This not only guides the resin in the cavity at the corner where the second guide portion 1032 of the package body 10 is located, but also prevents resin from stagnating and accumulating in the corner, reduces the formation of resin voids, and saves raw materials. Of course, the shape of the second guide portion 1032 is not limited to this, and the present disclosure does not impose any restrictions on this.

[0099] In some embodiments, as shown in Figures 5 to 9 , the power module 100 further includes a third guide 1033. The third guide 1033 can be disposed at a corner of the package 10 on the side where the control pins 50 are led out (i.e., the second side surface 10B of the package) along the package's length direction X. The third guide 1033 is configured to guide resin flow.

[0100] For example, there may be one third guide portion 1033. The third guide portion 1033 may be provided at a corner at one end of the second side surface 10B of the package body 10 along the longitudinal direction X of the package body, that is, at the corner where the second side surface 10B and the fourth side surface 10D meet. Alternatively, the third guide portion 1033 may be provided at a corner at the other end of the second side surface 10B of the package body 10 along the longitudinal direction X of the package body, that is, at the corner where the second side surface 10B and the third side surface 10C meet.

[0101] As another example, as shown in Figures 5 to 9, there can be two third guide portions 1033, which are respectively arranged at the corners of the two ends of the second side surface 10B of the package body 10 along the length direction X of the package body, that is, respectively arranged at the corner where the second side surface 10B is connected to the fourth side surface 10D and the corner where the second side surface 10B is connected to the third side surface 10C.

[0102] In this way, when the injected resin flows to the corner in the cavity corresponding to the third guide portion 1033, the structure in the cavity corresponding to the third guide portion 1033 can generate an oblique middle component force (the component force Fx as shown in Figure 9) for the resin flowing toward this location, so as to guide the resin flowing toward this position to flow toward the middle of the cavity, thereby reducing the stagnation and accumulation of resin at this corner, reducing the generation of resin gaps, and ensuring the electrical safety of the power module.

[0103] In some examples, the third guide portion 1033 may be a chamfer, a convex portion, or a concave portion.

[0104] 5 and 6 , the third air guide portion 1033 is chamfered. The angle and side length of the chamfer can be referred to the above description of the second air guide portion 1032 and will not be repeated here.

[0105] For another example, the third guide portion 1033 may also be a convex portion, such as an arc surface that bulges outward of the package body (not shown in the figure).

[0106] As another example, as shown in Figures 7 and 8, the third guide portion 1033 is a recessed portion. Similarly, the structure corresponding to the recessed portion in the mold cavity can squeeze the resin flowing to the corner, so that the resin flows toward the center of the mold cavity. This prevents the stagnation and accumulation of resin at the corner, thereby reducing the generation of resin voids and further saving raw materials.

[0107] In some embodiments, when the third guide portion 1033 is a recess, the third guide portion 1033 can be a recess (such as the third guide portion 1033 located at the corner of the second side 10B and the fourth side 10D in Figure 8), or the third guide portion 1033 can be two consecutive first recesses 10331 and second recesses 10332 (such as the third guide portion 1033 located at the corner of the second side 10B and the third side 10C in Figure 8).

[0108] In some embodiments, as shown in FIG. 2A , FIG. 2C to FIG. 2E , the package body 10 further includes a recessed second step portion 13 located on a side of the first portion 501 of the control pin 50 extending outward from the package body 10 close to the bottom surface 10E of the package body.

[0109] Here, similar to the recessed first step portion 12, the recessed second step portion 13 means that the second step portion 13 is recessed toward the interior of the package body 10. That is, the second step portion 13 has a step surface 13A and a side surface 13B. Along the width direction Y of the package body 10, the side surface 13B of the second step portion 13 is closer to the heat dissipation substrate 60 than the second side surface 10B of the package body 10; and along the thickness direction Z of the package body 10, the step surface 13A of the second step portion 13 is closer to the first portion 501 of the control pin 50 extending outward from the package body 10 than the bottom surface 10E of the package body.

[0110] Along the thickness direction Z of the package body 10 , a distance H13 from the step surface 13A of the second step portion 13 to the bottom surface 10E of the package body is smaller than a distance H501 from the first portion 501 of the control pin 50 extending outward from the package body 10 to the bottom surface 10E of the package body.

[0111] In some embodiments of the present disclosure, a second step portion 13 is provided on a side of the first portion 501 of the control pin 50 extending outward from the package body 10, close to the bottom surface 10E of the package body 10. Accordingly, as shown in FIG2B , the cavity 1011 of the mold 101 has a second cavity wall step 1013 corresponding to the second step portion 13 of the package body 10. Thus, the provision of the second cavity wall step 1013 can reduce the space between the heat dissipation substrate 60 and the side of the cavity corresponding to the control pin 50 (i.e., the space between the heat dissipation substrate 60 and the second cavity wall step 1013), thereby reducing the amount of resin accumulated in this space and further reducing the risk of resin overflowing from the bottom surface of the heat dissipation substrate 60 and generating burrs.

[0112] In some examples, as shown in FIG2A , the height of the second step portion 13 is equal to the height of the first step portion 12. That is, along the thickness direction Z of the package body 10, the distance H13 from the step surface 13A of the second step portion 13 to the bottom surface 10E of the package body is equal to the distance H1 from the step surface 12A of the first step portion 12 to the bottom surface 10E of the package body 10.

[0113] In other examples, as shown in FIG2C , the depth of the second step 13 is equal to the depth of the first step 12. That is, along the width direction Y of the package body 10, the distance D2 from the side surface 13B of the second step 13 to the side surface of the package body 10 (i.e., the second side surface 10B from which the control pin 50 is led) is equal to the distance D1 from the side surface 12B of the first step 12 to the side surface of the package body 10 (i.e., the first side surface 10A from which the power pin is led).

[0114] In yet other examples, along the thickness direction Z of the package body 10, a distance H13 from the step surface 13A of the second step portion 13 to the bottom surface 10E of the package body is equal to a distance H1 from the step surface 12A of the first step portion 12 to the bottom surface 10E of the package body 10. Furthermore, as shown in FIG2C , along the width direction Y of the package body 10, a distance D2 from the side surface 13B of the second step portion 13 to the side surface of the package body 10 (i.e., the second side surface 10B from which the control pin 50 is led) is also equal to a distance D1 from the side surface 12B of the first step portion 12 to the side surface of the package body 10 (i.e., the first side surface 10A from which the power pin is led). That is, as shown in FIG2A and FIG2C to FIG2E , the second step portion 13 and the first step portion 12 are symmetrically arranged along the width direction Y of the package body 10.

[0115] Such an arrangement not only simplifies the manufacturing process, but also allows the resin to more easily fill the space between the heat dissipation substrate 60 and the side of the cavity corresponding to the control pin 50, thereby avoiding the defect of resin gaps in the space.

[0116] In some embodiments, as shown in FIG. 2A , FIG. 2C to FIG. 2E , the package body 10 further includes a recessed third step portion 14 located on a side of the first portion 501 of the control pin 50 extending toward the outside of the package body 10 away from the bottom surface 10E of the package body.

[0117] Here, similar to the recessed first step portion 12, the recessed third step portion 14 means that the third step portion 14 is recessed toward the interior of the package body 10. That is, the third step portion 14 has a step surface 14A and a side surface 14B; along the width direction Y of the package body, the side surface 14B of the third step portion 14 is closer to the heat dissipation substrate 60 than the second side surface 10B of the package body; and along the thickness direction Z of the package body, the step surface 14A of the third step portion 14 is closer to the first portion 501 of the control pin 50 extending outward from the package body 10 than the top surface 10F of the package body.

[0118] As shown in FIG2A , along the thickness direction Z of the package body 10 , the distance H14 from the step surface 14A of the third step portion 14 to the top surface 10F of the package body is smaller than the distance H502 from the first portion 501 of the control pin 50 extending outward from the package body 10 to the top surface 10F of the package body.

[0119] It should be noted that the surface of the package 10 that is perpendicular to the thickness direction thereof and on which the heat dissipation substrate 60 is not provided is referred to as the top surface 10F of the package 10 .

[0120] Since the side of the cavity where the control pin 50 is provided is far away from the resin injection port, by respectively providing a second step portion 13 and a third step portion 14 on both sides of the first portion 501 of the package body 10 extending outward from the package body 10 and located at the control pin 50, the mold flow speed of the resin on the side of the cavity where the control pin 50 is provided can be adjusted when injecting the resin, so that the mold flow speed in the entire cavity is more balanced and the generation of gaps is avoided; and the resin injection time can also be accelerated.

[0121] In some examples, as shown in Figures 2A, 2C to 2E, the distance H14 from the step surface 14A of the third step portion 14 to the top surface 10F of the package body is smaller than the distance H13 from the step surface 13A of the second step portion 13 to the bottom surface 10E of the package body and / or the distance H1 from the step surface 12A of the first step portion 12 to the bottom surface 10E of the package body.

[0122] In this way, under the premise of ensuring that the resin can completely submerge the control chip 30, the mold flow speed of the resin on one side of the control pin in the cavity can be further adjusted to make the mold flow speed in the entire cavity more balanced and avoid the generation of gaps.

[0123] 5 to 8 , when the package body 10 further includes a recessed second step portion 13, a fourth guide portion 1034 is further provided at a corner of the second step portion 13. The fourth guide portion 1034 is configured to guide the resin.

[0124] As shown in Figures 6 and 8, the second stepped portion 13 includes a main portion 131 extending along the length direction X of the package body 10 and at least one end portion 132 extending along the width direction Y of the package body 10. In this case, the second stepped portion 13 also includes a fourth guide portion 1034 connecting the main portion 131 and the end portion 132 of the second stepped portion 13.

[0125] For example, there may be only one end portion 132 located at one side of the main body 131 along the length direction X of the package body 10 . In this case, the second step portion 13 includes only one fourth guide portion 1034 .

[0126] For another example, there may be two end portions 132 , located on both sides of the main portion 131 along the length direction X of the package body 10 . In this case, the second step portion 13 may include two fourth guide portions 1034 , each connecting one end portion 132 and the main portion 131 .

[0127] In some examples, the fourth air guide portion 1034 may be a chamfer, a convex portion, or a concave portion.

[0128] For example, as shown in Figures 5 to 8, the fourth guide portion 1034 may be chamfered. The angle and side length of the chamfer can be referred to the description of the first guide portion 1031 in some of the above embodiments and will not be repeated here. For another example, the fourth guide portion 1034 may be a convex portion. For example, as shown in Figure 11, the fourth guide portion 1034 is an arc-shaped circular surface that bulges outward from the package body 10.

[0129] Similar to the function of the third guide portion 1033 in some of the above embodiments, when the resin flows to the corner in the cavity corresponding to the fourth guide portion 1034, the structure in the cavity corresponding to the fourth guide portion 1034 can generate a component force to guide the resin to the middle of the cavity, so that the resin flows to the middle of the cavity, avoiding stagnation and accumulation at the corner, and reducing the generation of resin voids.

[0130] 12 , when the package body 10 further includes a recessed third step portion 14, a fifth guide portion 1035 is further provided at a corner of the third step portion 14. The fifth guide portion 1035 is configured to guide resin.

[0131] As shown in FIG12 , the third step portion 14 includes a main portion 141 extending along the length direction X of the package body 10 and at least one end portion 142 extending along the width direction Y of the package body 10. In this case, the third step portion 14 further includes a fifth guide portion 1035 connecting the main portion 141 and the end portion 142 of the third step portion 14.

[0132] For example, there may be only one end portion 142 located at one side of the main body 141 along the length direction X of the package body 10 . In this case, the third step portion 14 includes only one fifth guide portion 1035 .

[0133] For another example, there may be two end portions 132 , located on both sides of the main portion 141 along the length direction X of the package body 10 . In this case, the third step portion 14 may include two fifth guide portions 1035 , each connecting one end portion 142 and the main portion 141 .

[0134] In some examples, as shown in FIG. 12 , the fifth air guide portion 1035 may be chamfered. The angle and side length of the chamfer may refer to the description of the second air guide portion 1032 in some of the above embodiments, and will not be repeated here.

[0135] In other examples, the fifth guide portion 1035 may be a convex portion, such as an arc-shaped surface protruding toward the outside of the package body 10 , or the fifth guide portion 1035 may be a concave portion.

[0136] Similar to the function of the third guide portion 1033 in some of the above embodiments, when the resin flows to the corner in the mold cavity corresponding to the fifth guide portion 1035, the structure in the mold cavity corresponding to the fifth guide portion 1035 can generate a component force to guide the resin to the middle of the mold cavity, so that the resin flows to the middle of the mold cavity, avoids stagnation and accumulation at the corner, and reduces the generation of resin voids.

[0137] In embodiments of the present disclosure, the mold used to form the package 10 using transfer molding can have multiple resin injection ports, which can be spaced apart on one side of the mold where the multiple power pins are led out. For example, along the length of the mold (i.e., the length of the package), each resin injection port can be located between two power pins. Accordingly, in some embodiments, the package 10 has multiple resin injection portions 11, which can be spaced apart on the first side surface 10A of the package.

[0138] 13 , the package body 10 has two resin injection portions 11, such as a first resin injection portion 1021 and a second resin injection portion 1022. Along the length direction X of the package body 10, the first resin injection portion 1021 and the second resin injection portion 1022 are evenly located on the first side surface 10A of the package body 10. That is, along the length direction X of the package body 10, a distance H101 between the first resin injection portion 1021 and its closest corner, a distance H102 between the first resin injection portion 1021 and the second resin injection portion 1022, and a distance H103 between the second resin injection portion 1022 and its closest corner are approximately equal.

[0139] In this way, when injecting resin, the resin can flow more evenly to the left and right sides and the middle of the cavity, which is beneficial to the uniformity of resin filling in the cavity and can also achieve the effect of reducing resin voids.

[0140] In the power module 100 provided by the embodiment of the present disclosure, there are multiple control pins 50 , which are led out from the second side surface 10B of the package body 10 extending along the length direction X thereof, that is, the multiple control pins 50 are arranged along the second side surface 10B.

[0141] In some embodiments, as shown in Figures 8, 12, 14 and 16, the power module 100 also includes a first dummy pin 70 extending from the third side 10C of the package body 10, the third side 10C is adjacent to the second side 10B and extends along the width direction Y of the package body 10.

[0142] The multiple control pins 50 include a first function pin 501 and a second function pin 502; along the length direction X of the package body 10, the second function pin 502 is close to the middle of the second side surface 10B of the package body 10, and the first function pin 501 is located on the side of the second function pin 502 away from the first dummy pin 70.

[0143] That is, the first functional pin 501, the second functional pin 502 and the first dummy pin 70 are respectively arranged roughly evenly along the length direction X of the package body 10, and are led out from different sides of the package body 10, and are configured to support the power module 100 from different sides of the power module 100 to improve the stability of the power module 100.

[0144] In this way, the first functional pin 501, the second functional pin 502 and the first dummy pin 70 can support the power module 100 as a whole from both sides of the power module 100, thereby avoiding the shaking problem caused by supporting the power module 100 from one side, improving the stability of the power module 100, and preventing the power module 100 from deformation.

[0145] In addition, the first dummy pin 70 is led out from the third side surface 10C of the package body 10, which can avoid increasing the space occupied by the power module 100 along the length direction X and wasting materials, and can make the arrangement of each pin used to support the power module 100 more reasonable and compact, thereby reducing the volume of the power module 100 and improving the miniaturization of the power module 100.

[0146] In addition, the first functional pin 501 and the second functional pin 502 are led out from the second side 10B of the package body 10, and the first dummy pin 70 is led out from the third side 10C of the package body 10, which can also increase the insulation distance between these pins, thereby further improving the safety performance of the power module 100.

[0147] In some embodiments, as shown in FIG16 , the power module 100 further includes a control pad 90 , and the control chip 30 is disposed on the control pad 90 . This ensures the stability and reliability of the installation of the control chip 30 and improves the performance of the control chip 30 .

[0148] The first function pin 501, the second function pin 502, and the first dummy pin 70 are connected to the control pad 90 as an integral structure. Alternatively, it can be understood that different parts of the control pad 90 respectively form pads for mounting the control chip 30, and the first function pin 501, the second function pin 502, and the first dummy pin 70.

[0149] The first function pin 501 and the second function pin 502 are led out from the second side surface 10B of the package body 10 and are both electrically connected to peripheral circuits. They not only ensure the normal operation of the power module 100, but also support the power module 100 and ensure the reliable installation of the power module 100. The first dummy pin 70 is led out from the third side surface 10C of the package body 10 to support the power module 100 from a side different from that from which the control pin 50 is led, thereby ensuring the reliable installation of the power module 100.

[0150] It can be seen from this that in the power module 100 provided in some embodiments of the present disclosure, the solder pads in the power module 100 for mounting the control chip 30 can be used to form pins for supporting the power module 100, without the need to add additional pins for supporting the power module, thereby reducing the space occupied by the pins supporting the power module and improving the miniaturization of the power module 100.

[0151] In some embodiments, as shown in FIG16 , a power module 100 includes multiple control chips 30, such as a first control chip 301 and a second control chip 302. Depending on the application of the power module 100, the first control chip 301 can be used as a low-voltage chip, and the second control chip can be used as a high-voltage chip, thereby improving the operating performance of the power module 100.

[0152] In this case, the control pads 90 include an integrally formed first die pad 901 and a second die pad 902, which are sequentially connected along the length direction X of the package body 10. The first control chip 301 is disposed on the first die pad 901, and the second control chip 302 is disposed on the second die pad 902, thereby improving the structural compactness of the power module 100.

[0153] In some examples, the first function pin 501 is electrically connected to the first control chip 301 and can be used to provide a ground voltage to the first control chip 301. The first function pin 501 is arranged on one side of the first die pad 901 along the length direction of the power module (i.e., the length direction X of the package body), the first dummy pin 70 is arranged on the side of the second die pad 902 along the length direction X of the power module away from the first die pad 901, and the second function pin 502 is arranged at a middle position of the second die pad 902 close to the first die pad 901. In this way, the first function pin 501, the second function pin 502, and the first dummy pin 70 can be more evenly distributed within the package body 10, thereby making the support force of the first function pin 501, the second function pin 502, and the first dummy pin 70 on the power module 100 more evenly distributed, thereby improving the reliability and stability of the power module 100.

[0154] In some embodiments, as shown in FIG. 16 , the plurality of control pins 50 further include a third function pin 503 . The third function pin 503 is electrically connected to the second control chip 302 and can be used to provide a high voltage to the second control chip 302 .

[0155] In this case, as shown in Figures 8, 12, 14, and 16, the power module 100 further includes a second dummy pin 80 extending from the third side surface 10C of the package 10. The third function pin 503 is integrally connected to the second dummy pin 80. Furthermore, along the package's length direction X, the third function pin 503 is located on a side of the second function pin 502 that is farther from the first function pin 501, and is located near the center of the second side surface 10B of the package 10. That is, the third function pin 503 is positioned midway between the first die pad 901 and the second die pad 902.

[0156] In this way, the third functional pin 503 and the second dummy pin 80 can also support the power module 100 from two directions, thereby assisting the first functional pin 501, the second functional pin 502 and the first dummy pin 70 in supporting the power module 100, and further improving the stability of the power module 100.

[0157] In addition, the second dummy pin 80 is led out from the side of the power module extending along the width direction (i.e., the width direction Y of the package body), which can avoid increasing the space occupied by the power module 100 along the length direction X, thereby reducing the volume of the power module 100 and further improving the miniaturization of the power module 100.

[0158] At the same time, the third functional pin 503 and the second dummy pin 80 are connected as an integrated structure. This can be understood as follows: utilizing the pin that provides high voltage to the control chip 30, one end of the pin is led out from the second side surface as a high-voltage pin (i.e., the third functional pin 503), and the other end extends along the length direction X of the power module 100 and is led out from the third side surface as a non-functional pin (i.e., the second dummy pin 80), which together with the high-voltage pin achieves the function of supporting the power module. In this way, there is no need to add additional pins to support the power module, thereby further improving the miniaturization of the power module 100 while ensuring the support stability of the power module.

[0159] In the power module 100 provided in some embodiments of the present disclosure, the power module 100 includes a third air guide 1033 located at a corner of the second side surface 10B of the package body 10 at an end portion along the longitudinal direction X of the package body 10. The third air guide 1033 includes at least one recess. This configuration not only reduces the volume of the package body 10, conserves the resin material required for encapsulation, and reduces the production cost of the power module 100, but also makes the structure of the power module 100 more compact, reduces the volume of the power module 100, and improves the miniaturization of the power module 100, while ensuring that the package body 100 protects the main structure of the power module 100.

[0160] In some embodiments, the third guide portion 1033 includes a recess. In this case, the first dummy lead 70 and the second dummy lead 80 are led out from a side surface of the recess extending along the width direction Y of the package body 10 .

[0161] In other embodiments, the third flow guide portion 1033 includes two continuous recesses. As shown in Figures 8, 12, and 14 to 18, the third flow guide portion 1033 includes two continuous first recesses 10331 and second recesses 10332. The first recess 10331 extends entirely along the length direction X of the package 10, and the second recess 10332 extends entirely along the width direction Y of the package 10. This simplifies the production process of the package 10 and reduces the difficulty of producing the package 10.

[0162] As can be seen, the second recess 10332 is further away from the control pin 50 than the first recess 10331. Therefore, leading the first dummy pin 70 and the second dummy pin 80 out from the side surface of the second recess 10332 extending along the width direction Y of the package body 10 can not only improve the miniaturization of the power module, but also extend the insulation length between these pins.

[0163] In addition, as shown in Figures 14 and 15 , for example, the length of the first dummy pin 70 and the second dummy pin 80 extending out of the package body 10 does not exceed the depth of the second recess 10332. That is, along the length direction X of the package body 10, the ends of the first dummy pin 70 and the second dummy pin 80 extending out of the package body 10 do not exceed the third side surface 10C of the package body 10. This not only increases the creepage distance between the first dummy pin 70 and the second dummy pin 80 and their corresponding functional pins, but also prevents the exposed first dummy pin 70 and the second dummy pin 80 from contacting external devices located on the third side surface 10C of the package body 10, thereby causing electrical shock or damage.

[0164] In some examples, as shown in FIG17 , the first recess 10331 and the second recess 10332 are both in the shape of an elongated strip, and the length d1 of the first recess 10331 and the length d2 of the second recess 10332 satisfy the relationship: d1 ≥ d2. This simplifies the shape design of the first recess 10331 and the second recess 10332, facilitates the molding of the first recess 10331 and the second recess 10332, and further reduces the difficulty of manufacturing the package 10.

[0165] In addition, the lengths of the first recess 10331 and the second recess 10332 can be matched with the lengths of the first side surface 10A and the third side surface 10C to which they are located, thereby further optimizing the structural design of the package body 10. While saving the resin material required for the package and improving the compactness of the structure, the structure of the package body 10 can be made more stable and reliable, thereby further improving the structural reliability of the power module 100.

[0166] In the power module 100 provided in some embodiments of the present disclosure, as shown in Figures 15 and 18, the first recess 10331 may mainly include a first sub-side surface 311 and a second sub-side surface 312, wherein the first sub-side surface 311 extends along the width direction Y of the package body 10, and the second sub-side surface 312 extends along the length direction X of the package body 10. The first sub-side surface 311 is connected (e.g., can be perpendicularly connected) between the second sub-side surface 312 and the second side surface 10B of the package body. The length of the first sub-side surface 311 (i.e., the dimension along the width direction Y of the package body 10) is greater than the length of the second sub-side surface 312 (i.e., the dimension along the length direction X of the package body 10).

[0167] The second recess 10332 may mainly include a third sub-side surface 321 and a fourth sub-side surface 322. The third sub-side surface 321 extends along the length direction X of the package body 10, and the fourth sub-side surface 322 extends along the width direction Y of the package body 10. The third sub-side surface 321 is connected (e.g., may be perpendicular to) the fourth sub-side surface 322 and the third side surface 10C of the package body.

[0168] In this way, the structures of the first recess 10331 and the second recess 10332 can be simplified to realize the long strip structure of the first recess 10331 and the second recess 10332 , and the production difficulty of the third guide portion 1033 can be reduced.

[0169] For example, as shown in Figures 15 and 18 , the first recess 10331 further includes a first transition arc surface 313 between the first sub-side surface 311 and the second sub-side surface 312. This allows for a more uniform stress distribution at the junction of the first sub-side surface 311 and the second sub-side surface 312 of the first recess 10331, thereby preventing stress concentration at the junction of the first sub-side surface 311 and the second sub-side surface 312 from causing fracture. This improves the fatigue safety factor of the package 10 at the first recess 10331, thereby enhancing the structural reliability of the package 10 and, consequently, the power module 100.

[0170] For example, as shown in Figures 15 and 18 , the second recess 10332 further includes a second transition arc surface 323 between the third sub-side surface 321 and the fourth sub-side surface 322. This allows for a more uniform stress distribution at the junction of the third sub-side surface 321 and the fourth sub-side surface 322 of the second recess 10332, thereby preventing stress concentration at the junction of the third sub-side surface 321 and the fourth sub-side surface 322 from causing fracture. This improves the fatigue safety factor of the package 10 at the second recess 10332, thereby enhancing the structural reliability of the package 10 and, more generally, the power module 100.

[0171] In some embodiments, the first dummy pin 70 and the second dummy pin 80 may each include a first pin segment, a second pin segment, and a third pin segment connected in sequence.

[0172] As shown in Figures 16 and 18, the first dummy pin 70 may include a first pin segment 71, a second pin segment 72 and a third pin segment 73 connected in sequence; the first pin segment 71 extends along the length direction X of the package body 10; the second pin segment 72 is connected to the end of the first pin segment 71 away from the second control chip 302, and extends along the width direction Y of the package body 10; the third pin segment 73 is connected to the end of the second pin segment 72 away from the first pin segment 71, and is bent and extended along the length direction X of the package body 10, and the end of the third pin segment 73 away from the second pin segment 72 is led outward from the third side surface 10C of the package body 10 (for example, the fourth sub-side surface 322 of the second recess 10332).

[0173] The second dummy pin 80 may include a first pin segment 81, a second pin segment 82, and a third pin segment 83 connected in sequence. The connection method of the first pin segment 81, the second pin segment 82, and the third pin segment 83 of the second dummy pin 80 is similar to the connection method of the first pin segment 71, the second pin segment 72, and the third pin segment 73 of the first dummy pin 70, and will not be repeated here.

[0174] Such a setting can make the first dummy pin 70 and the second dummy pin 80 match the structure of the package body 10, not only ensuring that the first dummy pin 70 and the second dummy pin 80 are led outward from the third side surface 10C of the package body 10 (for example, the fourth sub-side surface 322 of the second recess 10332) to ensure the supporting effect of the first dummy pin 70 and the second dummy pin 80 on the power module 100; but also making the first dummy pin 70 and the second dummy pin 80 away from the screw fixing slot on the power module 100 through their respective first pin segments and second pin segments, avoiding interference or being too close to the screws, resulting in the inability to ensure the electrical insulation requirements of the power module 100, thereby improving the reliability of the power module 100.

[0175] In some examples, the width of the second lead segment 82 of the second dummy lead 80 is greater than the width of the second lead segment 72 of the first dummy lead 70 . Here, the width refers to the dimension along the length direction X of the package body 10 .

[0176] In this way, the second pin segment 82 of the second dummy pin 80 and the second pin segment 72 of the first dummy pin 70 can make full use of the available space on the control pad 90, enhance the structural stability of the second dummy pin 80 and the first dummy pin 70, and thus improve the stability of the second dummy pin 80 and the first dummy pin 70 in supporting the power module 100.

[0177] Some embodiments of the present disclosure further provide a device, and the power module provided by the above embodiments is applied to the device.

[0178] As shown in FIG. 19 , the device 1000 includes a controller 200 and a power module 100 provided in any one of the above embodiments, and the power module 100 is connected to the controller 200 .

[0179] In some embodiments, there may be one or more power modules 100 , and the device 1000 may include but is not limited to an inverter device or a rectifier device, for example, a motor drive controller.

[0180] For example, the controller 200 can generate a control signal according to user instructions and send the control signal to the power module 100. The power module 100 generates a drive signal according to the control signal and outputs it to the corresponding drive component to achieve drive control or inversion or rectification conversion, etc.

[0181] By adopting the power module 100 of the above embodiment, the insulation withstand voltage and insulation reliability of the device 1000 provided by the embodiment of the present disclosure are improved, and the electrical safety of the device is improved.

[0182] Those skilled in the art will understand that the scope of the present invention is not limited to the above specific embodiments, and that certain elements of the embodiments may be modified and replaced without departing from the spirit of the present application. The scope of the present invention is limited by the appended claims.

Claims

1. A power module, comprising: Encapsulation; A power chip disposed in the package; A control chip disposed in the package and electrically connected to the power chip; A power pin extending from a first side surface of the package body, the power pin being electrically connected to the power chip; a control pin extending from a second side surface of the package body, the first side surface and the second side surface being arranged opposite to each other, the control pin being electrically connected to the control chip; and A heat dissipation substrate is located in the package body; the power chip is arranged on the heat dissipation substrate, the bottom surface of the heat dissipation substrate is flush with the bottom surface of the package body and is exposed outside the package body; wherein, The package body includes a resin injection portion and a first step portion, the first step portion is located on the side of the portion of the power pin extending out of the package body close to the bottom surface of the package body, and the first step portion has a step surface and a side surface; along the width direction of the package body, the side surface of the first step portion is closer to the heat dissipation substrate than the first side surface of the package body; and along the thickness direction of the package body, the step surface of the first step portion is closer to the portion of the power pin extending out of the package body than the bottom surface of the package body, and the distance from the step surface of the first step portion to the bottom surface of the package body is smaller than the distance from the resin injection portion to the bottom surface of the package body.

2. The power module according to claim 1, wherein: The distance from the step surface of the first step portion to the bottom surface of the package body is smaller than the distance from the top surface of the power chip to the bottom surface of the package body.

3. The power module according to claim 1 or 2, wherein: A distance from an end portion of the heat dissipation substrate close to the power pin to a side surface of the first step portion is greater than or equal to 0.5 times the thickness of the heat dissipation substrate and less than or equal to 1.5 times the thickness of the heat dissipation substrate.

4. The power module according to any one of claims 1 to 3, wherein: The first step portion includes a main portion extending along the length direction of the package body and an end portion extending along the width direction of the package body; wherein the first step portion further includes: A first guide portion connects the main body portion and the end portion of the first step portion.

5. The power module according to any one of claims 1 to 4, further comprising: a second guide portion, located at a corner of an end portion of the first side surface of the package body along the length direction of the package body; and / or The third guide portion is located at a corner of an end portion of the second side surface of the package body along the length direction of the package body.

6. The power module according to claim 5, wherein: The second guide portion includes a chamfer, a convex portion or a concave portion; and / or The third guide portion includes a chamfer, a convex portion or at least one concave portion.

7. The power module according to any one of claims 1 to 6, wherein: The package body also includes a second step portion, which is located on the side of the portion of the control pin extending out of the package body close to the bottom surface of the package body; the second step portion has a step surface and a side surface; along the width direction of the package body, the side surface of the second step portion is closer to the heat dissipation substrate relative to the second side surface of the package body; and along the thickness direction of the package body, the step surface of the second step portion is closer to the portion of the control pin extending out of the package body relative to the bottom surface of the package body.

8. The power module according to claim 7, wherein: Along the thickness direction of the package body, the distance from the step surface of the second step portion to the bottom surface of the package body is approximately equal to the distance from the step surface of the first step portion to the bottom surface of the package body, and / or along the width direction of the package body, the distance from the side surface of the second step portion to the side surface of the package body is approximately equal to the distance from the side surface of the first step portion to the side surface of the package body.

9. The power module according to claim 7 or 8, wherein: The second step portion includes a main portion extending along the length direction of the package body and an end portion extending along the width direction of the package body; wherein the second step portion further includes: A fourth guide portion connects the main body portion and the end portion of the second step portion.

10. The power module according to any one of claims 7 to 9, wherein: The package body also includes a third step portion, which is located on the side of the portion of the control pin extending out of the package body away from the bottom surface of the package body; the third step portion has a step surface and a side surface; along the width direction of the package body, the side surface of the third step portion is closer to the heat dissipation substrate than the second side surface of the package body; and along the thickness direction of the package body, the step surface of the third step portion is closer to the portion of the control pin extending out of the package body than the top surface of the package body.

11. The power module according to claim 10, wherein: A height from the step surface of the third step portion to the top surface of the package body is smaller than a height from the step surface of the second step portion to the bottom surface of the package body and / or a height from the step surface of the first step portion to the bottom surface of the package body.

12. The power module according to claim 10 or 11, wherein: The third step portion includes a main portion extending along the length direction of the package body and an end portion extending along the width direction of the package body; wherein the third step portion further includes: A fifth guide portion connects the main body portion and the end portion of the third step portion.

13. The power module according to any one of claims 1 to 12, further comprising: A first dummy lead extending from a third side surface of the package body adjacent to the second side surface; wherein, The control pin includes a first function pin and a second function pin; along the length direction of the package body, the second function pin is close to the middle of the second side surface, and the first function pin is located on a side of the second function pin away from the first dummy pin; The first function pin, the second function pin, and the first dummy pin are configured to support the power module from different sides of the power module.

14. The power module according to claim 13, further comprising: A control pad, the control chip is arranged on the control pad; wherein the first function pin, the second function pin and the first dummy pin are connected to the control pad as an integrated structure; and A second dummy pin is led out from the third side surface; wherein, The control pin further includes a third function pin, and along the length direction of the package body, the third function pin is located on a side of the second function pin away from the first function pin and close to the middle of the second side surface; wherein, The second dummy pin and the third functional pin are connected into an integrated structure.

15. The power module according to claim 14, further comprising a third air guide located at a corner of an end portion of the second side surface of the package body along the length direction of the package body. The third guide portion includes a recess, and the first dummy pin and the second dummy pin are led out from the recess; or The third guide portion includes two continuous first recesses and a second recess, the first recess extends along the length direction of the package body, and the second recess extends along the width direction of the package body; the first dummy lead and the second dummy lead are both led out from the second recess.

16. The power module according to claim 14 or 15, wherein: The first pseudo pin and the second pseudo pin each include a first pin segment, a second pin segment and a third pin segment connected in sequence; the first pin segment extends along the length direction of the package body, the second pin segment extends along the width direction of the package body, and the third pin segment extends along the length direction of the package body and extends out of the package body from the third side surface of the package body.

17. The power module according to claim 16, wherein: The width of the second pin segment of the second dummy pin is greater than the width of the second pin segment of the first dummy pin.

18. The power module according to any one of claims 1 to 17, wherein: The resin injection portion is located on the first side surface of the package body or a fourth side surface adjacent to the first side surface.

19. The power module according to any one of claims 1 to 18, wherein: The heat dissipation substrate comprises: A double-sided copper-clad ceramic board with an integrated structure, comprising a ceramic board and copper layers located on both sides of the ceramic board; the power chip is arranged on one copper layer of the double-sided copper-clad ceramic board, and the power pins are connected to the copper layer, and the other copper layer is flush with the bottom surface of the package body and exposed outside the package body; or A single-sided copper-clad ceramic board with an integrated structure, comprising a ceramic board and a copper layer located on one side of the ceramic board; the power chip is disposed on the copper layer, and the power pins are connected to the copper layer; the bottom surface of the ceramic board is flush with the bottom surface of the package body and is exposed outside the package body; or A ceramic substrate, the portion of the power pin located within the package body is adhered to the ceramic substrate, the power chip is arranged on a side of the portion of the power pin located within the package body away from the ceramic substrate, and the bottom surface of the ceramic substrate is flush with the bottom surface of the package body and exposed outside the package body.

20. A device comprising a controller and the power module according to any one of claims 1 to 19, wherein the power module is connected to the controller.

Images