A method for laser cutting material plate

Abstract

The present invention provides a method for laser cutting a material plate, which is characterized by comprising four steps: S1: determining laser parameters, scanning paths, and protective gases according to materials, processing equipment, and environment; S2: determining the optimal focus increment; S3: determining the optimal laser beam incident angle; S4: using the above-determined optimal laser parameters, scanning paths, protective gases, optimal focus increments, and optimal laser beam incident angles to complete the laser cutting. The present invention adopts layered removal, and achieves efficient and high-quality removal of materials by considering the matching of the focus drop distance (focus increment) of each laser scanning layer and the actual laser ablation depth. After obtaining a high-quality, high-flatness cutting surface, the taper-free processing of the cutting surface is achieved by adjusting the incident angle. The present invention is suitable for efficient, high-quality, taper-free cutting of all materials, including material cutting, blind hole making, and through hole making.

Description

Technical Field

[0001] The present invention relates to a laser cutting process, and in particular to a laser layered scanning cutting process for materials, which is applied to SiC f / Laser processing of all materials including SiC composites, especially for thick plates and structures with large aspect ratios. Background Art

[0002] Layered scanning is SiC f / The common process of laser cutting and hole making of SiC thick plates, its challenges come from laser damage, low efficiency and surface taper caused by uncontrollable processing, and it is more obvious in cutting thick plates and processing structures with large aspect ratios. The process of laser layered scanning removal is a dynamic process, and the difference between the distance the laser descends (focus increment) and the actual ablation depth for each layer scanned is the fundamental reason why this dynamic process is uncontrollable. Researchers have carried out a lot of work on laser parameters and scanning paths (which essentially changes the actual ablation depth), but none of them consider the influence of focus increment. And a fixed value is set in advance, which limits the universality of experimental results and conclusions. Regarding the taper problem of the cutting surface, most studies attribute it to the incident angle of the beam, but practice shows that this is not feasible on thick plates. Therefore, the existing laser cutting theory is generally vague. For laser cutting, there is a lack of clear guidance on how to balance efficiency and quality and make the dynamic processing process controllable.

[0003] In the prior art, the invention with application number CN202410828733.8 discloses a laser cutting path optimization method, but the disadvantages are: it only optimizes the laser scanning path, does not take into account both efficiency and quality, and has a taper problem. It is not suitable for processing thick plates and structures with large aspect ratios.

[0004] The invention with application number CN202410515987.4 discloses a laser cutting method, which has the following disadvantages: the process is cumbersome, it is difficult to balance efficiency and quality, and there is a taper on the processed surface, which is not suitable for processing thick plates and structures with a large aspect ratio.

[0005] The invention with application number CN202311653657.3 discloses a laser cutting method for improving the quality of aluminum nitride section. The disadvantages are: it is impossible to determine the optimal focus increment, efficiency and quality cannot be taken into account at the same time, and there is a taper on the cutting surface. Summary of the invention

[0006] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a clear technical route for laser layered removal of cutting materials to solve the technical problems of low efficiency, poor quality and taper.

[0007] To achieve the above-mentioned purpose of the invention, the technical solution of the present invention is as follows:

[0008] A method for laser cutting a sheet of material, such as Figure 1 , which includes four steps:

[0009] S1: Determine laser parameters, scanning path, and protective gas based on materials, processing equipment, and environment. The standard is to complete material removal under these conditions and maximize equipment performance while reducing laser influence.

[0010] S2: Determine the best focus increment:

[0011] According to the conditions in S1, multiple focus increment parameters are set to compare the cutting performance. The cutting efficiency and cutting surface quality are used as the standards. The focus increment corresponding to the highest cutting efficiency and the best cutting surface quality is the optimal focus increment.

[0012] Among them, the cutting efficiency is judged by the time it takes to cut the material, and the shortest time means the best cutting efficiency;

[0013] The quality of the cutting surface is judged by surface morphology, surface roughness, and surface element analysis. The best cutting result is when there is no recast layer, oxide, and the roughness is the lowest.

[0014] S3: Determine the optimal laser beam incident angle:

[0015] After obtaining the cutting surface through the S2 best focus increment, the laser incident angle is adjusted until a taper-free surface is achieved. The taper is measured by an optical microscope or profilometer using the angle between the cutting surface and the upper surface of the material. When the angle between the two is 90°, it is a taper-free surface.

[0016] S4: Use the optimal laser parameters, scanning path, shielding gas, optimal focus increment, and optimal laser beam incident angle determined above to complete the laser cutting.

[0017] As a preferred embodiment, the scanning interval of the scanning path in step S1 ensures that the ablation area of ​​the laser spot covers the entire processing area; the scanning width is equal to the diameter of the laser beam at the light outlet of the galvanometer.

[0018] As a preferred method, in step S1, in the selection of protective gas and laser power, the morphology of the laser processed surface under different protective gases is compared, and the protective gas with a relatively lower degree of surface oxidation is selected as the protective gas;

[0019] For different laser powers, a relatively larger laser power is selected to improve the material removal rate without causing deterioration of the oxidation degree of the laser processed surface;

[0020] Selection of laser scanning speed: Under the condition that the oxidation degree of the laser processed surface does not deteriorate, a relatively smaller laser scanning speed should be selected to improve the material removal rate;

[0021] The laser energy density LAED satisfies the following formula:

[0022] LAED=P / vd spot ;

[0023] LAED is the laser energy density; P is the laser power; v is the laser scanning speed; d spot is the laser spot diameter;

[0024] Based on the above formula, a greater laser power and / or a smaller laser scanning speed will result in an increase in laser energy density, thereby improving the material removal rate.

[0025] As a preferred embodiment, during straight-line cutting, in step S1, the scanning path adopts a unidirectional multi-straight-line scanning mode.

[0026] As a preferred method, S2: if the cutting of the material is to be ensured first, and there is no requirement for efficiency and quality, a relatively smaller focus increment is selected.

[0027] As a preferred mode, in S2, for a laser processing system with a variable focus position, the focus increment refers to the distance the focus drops each time the laser scans a layer. If the laser processing system cannot adjust the focus position, the focus increment corresponds to the displacement of the workpiece.

[0028] As a preferred method, S2: the cutting efficiency is judged by the material removal rate MRR of the cutting process, where the material removal rate MRR = removed material volume V / removal time t.

[0029] As a preferred embodiment, the method is suitable for cutting material plates of any thickness, and is more suitable for material plates with a thickness greater than or equal to 5 mm.

[0030] As a preferred mode, the multi-linear scanning path includes sequential scanning and interlaced scanning.

[0031] As a preferred embodiment, when drilling is performed using the cutting method, the scanning path is an arc-shaped path.

[0032] The beneficial effects of the present invention are as follows: the present invention relates to the field of laser processing, and in particular to a high-quality, high-efficiency and taper-free laser cutting method. The present invention adopts layered removal, and by considering the matching of the focus drop distance (focus increment) of each laser scanning layer and the actual laser ablation depth, the efficient and high-quality removal of the material is achieved. On this basis, the taper-free processing of the cutting surface is achieved by adjusting the incident angle of the laser beam. The present invention is suitable for efficient, high-quality and taper-free cutting of all materials, including material cutting, blind hole making and through hole making. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 This is a laser high-efficiency and high-quality cutting SiC f / Method and process of SiC thick plate;

[0034] Figure 2 This is a schematic diagram of the principle of adjusting the laser incident angle by changing the processing position of the present invention;

[0035] Figure 3 The 2.5D SiC at different powers of the present invention f Surface morphology, local magnification and EDS images of laser ablated SiC in air and nitrogen atmospheres: (a) air, 3W; (b) air, 9W; (c) air, 15W; (d) nitrogen, 3W; (e) nitrogen, 9W; (f) nitrogen, 15W;

[0036] Figure 4 is the total cut-off time corresponding to different focus increments of the MLLS of the present invention;

[0037] Figure 5 The macroscopic morphology, processing time and cutting depth of the processing process corresponding to different focus increments of the present invention are as follows: (a) d3 = 1 μm; (b) d3 = 38 μm; (c) d3 = 75 μm; (d) d3 = 112 μm; (e) d3 = 149 μm; (f) d3 = 186 μm;

[0038] Figure 6 is the material removal rate MRR at different stages under different zoom increments of the present invention;

[0039] Figure 7 is the SEM image of the cut surface corresponding to different focus increments of MLLS of the present invention;

[0040] Figure 8 It is the EDS analysis of the cut surface corresponding to different focus increments of MLLS of the present invention;

[0041] Fig. 9 is the cutting surface roughness corresponding to different focus increments of MLLS of the present invention;

[0042] Fig.10 The top surface and cutting surface contours corresponding to different processing positions of the present invention and the angle calibration diagram of the optical microscope are: (a) +20mm; (b) +15mm; (c) +10mm; (d) +5mm; (e) 0mm; (f) -5mm. DETAILED DESCRIPTION

[0043] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0044] The embodiment provides a method for laser cutting a material plate, comprising four steps:

[0045] S1: Determine laser parameters, scanning path, and protective gas based on materials, processing equipment, and environment. The standard is to complete material removal under these conditions and maximize equipment performance while reducing laser influence.

[0046] S2: Determine the best focus increment:

[0047] According to the conditions in S1, multiple focus increment parameters are set to compare the cutting performance. The cutting efficiency and cutting surface quality are used as the standards. The focus increment corresponding to the highest cutting efficiency and the best cutting surface quality is the optimal focus increment.

[0048] Among them, the cutting efficiency is judged by the time it takes to cut the material, and the shortest time means the best cutting efficiency;

[0049] The quality of the cutting surface is judged by surface morphology, surface roughness, and surface element analysis. The best cutting result is when there is no recast layer, oxide, and the roughness is the lowest.

[0050] S3: Determine the optimal laser beam incident angle:

[0051] After obtaining the cutting surface through the S2 best focus increment, the laser incident angle is adjusted until a taper-free surface is achieved. The taper is measured by an optical microscope or profilometer using the angle between the cutting surface and the upper surface of the material. When the angle between the two is 90°, it is a taper-free surface.

[0052] S4: Use the optimal laser parameters, scanning path, shielding gas, optimal focus increment, and optimal laser beam incident angle determined above to complete the laser cutting.

[0053] In some embodiments, the scanning interval of the scanning path in step S1 ensures that the ablation area of ​​the laser spot covers the entire processing area; the scanning width is equal to the beam diameter of the laser beam at the galvanometer light outlet.

[0054] In some embodiments, in step S1, in selecting the protective gas and the laser power, the morphology of the laser processed surface under different protective gases is compared, and the protective gas with a relatively lower degree of surface oxidation is selected as the protective gas;

[0055] For different laser powers, a relatively larger laser power is selected to improve the material removal rate without causing deterioration of the oxidation degree of the laser processed surface;

[0056] Selection of laser scanning speed: Under the condition that the oxidation degree of the laser processed surface does not deteriorate, a relatively smaller laser scanning speed should be selected to improve the material removal rate;

[0057] The laser energy density LAED satisfies the following formula:

[0058] LAED=P / vd spot；

[0059] LAED is the laser energy density; P is the laser power; v is the laser scanning speed; d spot is the laser spot diameter;

[0060] Based on the above formula, a greater laser power and / or a smaller laser scanning speed will result in an increase in laser energy density, thereby improving the material removal rate.

[0061] In some embodiments, during straight-line cutting, in step S1 , the scanning path adopts a unidirectional multi-straight-line scanning mode.

[0062] In some embodiments, S2: if the cutting of the material is ensured first, and there is no requirement for efficiency and quality, a relatively smaller focus increment is selected.

[0063] In some embodiments, in S2, for a laser processing system with a variable focus position, the focus increment refers to the distance the focus drops each time the laser scans a layer. If the laser processing system cannot adjust the focus position, then the focus increment corresponds to the displacement of the workpiece.

[0064] In some embodiments, S2: cutting efficiency is determined by the material removal rate MRR of the cutting process, where the material removal rate MRR=removed material volume V / removal time t.

[0065] In some embodiments, the method is applicable to cutting material plates of any thickness, and is more applicable to material plates with a thickness greater than or equal to 5 mm.

[0066] In some embodiments, when drilling is performed using the cutting method, the scanning path is an arc-shaped path.

[0067] In some embodiments, when cutting is performed using the cutting method, the scanning path is a multi-linear sequential scanning path or a multi-linear interlaced scanning path.

[0068] Example 1

[0069] In step S1, the scanning path adopts a unidirectional multi-linear scanning mode. In this embodiment, the scanning pitch is 30 μm and the scanning width is 0.5 mm. The scanning pitch and scanning width can be freely selected according to the processing effect. The selection basis of laser parameters and protective gas is also selected according to the processing effect.

[0070] In step S2, by selecting multiple focus increment values, as shown in Table 1, 6 groups of experiments were conducted using the single factor variable method. In addition, the above 6 groups of parameter combinations were selected at processing times of 30 seconds, 65 seconds, and 100 seconds (the time of each stage was obtained based on the previous exploratory experiments) as the cutting time of SiC f / SiC processing in the early, middle and late stages to reveal the material removal rate MRR at different stages under different parameter combinations. The processing time of each group of experiments was recorded. The best matching focus increment was selected based on the processing efficiency and processing quality. The present invention determined that the value was 75μm.

[0071] Table 1 Experimental parameters of the effects of different focus increments on MMLS cutting

[0072] parameter symbol unit value Focus Increment <![CDATA[d3]]> μm 1,38,75,112,149,186

[0073] In step S3, the laser incident angle is adjusted by changing the processing position, such as Figure 2 At the above set width, the edge position of the laser beam is vertically aligned with the workpiece surface during cutting (position 1'). In addition, the adjustment of the laser processing position reveals the effect of the laser incident angle on the taper of the cut surface, as shown in Figure 2 The scanning positions corresponding to specific points y1 and y2 in FIG. 2 affect the incident angle of the laser on the cutting surface (positions 2' and 3'). The optical axis of the laser is the incident direction of the laser beam. The optimal laser incident angle is determined by adjusting different processing positions. The experimental parameters are shown in Table 2.

[0074] Table 2 Experimental parameters of the influence of different machining positions on taper

[0075] parameter symbol unit value Scan speed v mm / s 100 Focus Increment <![CDATA[d3]]> μm 75 Processing position y μm +20、+15、+10、+5、0、-5

[0076] In step S1, in terms of the selection of protective gas and laser power, we compared the surface morphology characteristics of the processed surfaces under the UV nanosecond laser power of 3, 9, and 15 W in nitrogen and air. Figure 3 . Under nitrogen, the degree of oxidation on the material surface is small, so nitrogen is selected as the protective gas. Furthermore, under nitrogen, the degree of oxidation on the material surface does not increase with the increase of power. In order to obtain high removal efficiency, the maximum power value of the equipment (15W, corresponding to a repetition frequency of 50kHz) is selected, and the speed is selected as the minimum scanning speed of the equipment (100 mm / s).

[0077] Figure 3 The SiC nanostructured carbon nanotubes were fabricated in air (gas pressure 0.05 MPa, outlet diameter 2 mm) and nitrogen (gas pressure 0.05 MPa, outlet diameter 2 mm) at UV nanosecond laser powers of 3, 9, and 15 W, respectively. f / SiC surface morphology SEM and EDS images, such as Figure 3 As shown in the figure, after single-layer multi-line scanning at different laser powers in an air environment, the morphological changes on the workpiece surface are clearly visible. By averaging the elemental composition of three randomly selected points, it was found that there was significant particle accumulation on the ablated surface. According to EDS analysis, these particles are mainly composed of solid SiO2. The ablation products are mainly concentrated at the edge of the laser scanning path. This phenomenon can be attributed to the UV laser ablation process, the recoil pressure generated by which drives the ejection of decomposed silicon and carbon ions. Silicon ions easily react with oxygen in the atmosphere to form white, re-solidified SiO2 particles, while carbon ions are usually emitted in the form of CO or CO2. In an air environment, when the laser power is set to 3 W, the average size of these white particles is about 1-2 microns. As the laser power increases to 9 W, more particles accumulate on the ablated surface, and these particles gradually aggregate to form larger structures. When the laser power reaches 15 W, as shown in Figure 3 As shown in (c), due to the intensification of the oxidation reaction, the particle size expanded to about 10 μm. f The surface oxidation reaction of the / SiC composite material was significantly inhibited.

[0078] In step S2, the total processing efficiency is obtained by comparing the total cutting time. The total processing time at different zoom distances is as follows: Figure 4 , the shorter the processing time, the greater the total processing rate. It can be seen that when the focus increment is 75μm, the processing time is the smallest and the processing efficiency is the largest.

[0079] Figure 5 The macroscopic features of the ablated area at different ablation stages, focus increments, and scanning speeds are shown. Detailed data of cutting time and ablation depth were extracted using MM3D and Dragonfly software, respectively. The ablation depth was significantly affected by the focus increment, with the maximum value occurring at 75 microns. Figure 5 (c) Comparison Figure 5 (a) and Figure 5 (c) When the focus increment increases from 1 μm to 75 μm, the ablation depth increases by 13.7%, 53.6%, and 97.0% at different processing stages, respectively. Similarly, when the focus increment decreases from 186 μm to 75 μm, the ablation depth increases by 32.8%, 46.5%, and 64.5%, respectively. Adjusting the focus increment up or down will cause the processed surface to deviate from the focal position, forming a positive or negative defocus state. As the ablation depth increases, this defocus effect intensifies, resulting in a decrease in energy density and ablation rate, which in turn reduces the depth of the processed area. In general, a reduction in ablation depth is associated with an increase in the cone angle of the ablated surface, especially when processing thick materials or high aspect ratio structures.

[0080] The stability of processing efficiency is obtained by the material removal rate in the three stages of processing: before, during, and after. In order to reveal the influence of the difference between the focus increment and the actual laser ablation depth on the processing efficiency, the material removal rate (MRR) of each stage was calculated using the formula MRR = V / t, where V represents the volume of the ablation area and t represents the ablation time of each stage. Figure 6 The MRR variation process under various parameter combinations at different ablation stages is shown. As the processing progresses, the shielding effect of debris and plasma on the laser energy leads to a decrease in MRR. It is worth noting that when the focus increment is set to 75 microns, the MRR remains at a high level throughout the ablation process and only shows a slight decrease in the middle and late stages.

[0081] Figure 7 The cut surface morphology under different processing conditions is shown, and the top, middle and bottom areas of the cut surface are observed in detail. The corresponding energy dispersive spectroscopy (EDS) analysis results are shown in Figure 8 As shown. The optimized focus increment not only improves the cutting efficiency, but also significantly improves the surface quality. The cut surface shows a clear distribution of fibers, matrix phases and interfaces, with no obvious laser heat affected zone. Both the fiber and matrix phases show a flat and smooth surface. In addition, surface oxidation is significantly reduced, with only a small amount of evenly distributed spherical particles. Figure 3 As previously described, these SiO2 particles with a diameter less than 1 micron are the result of a slight oxidation reaction. Figure 7 Show, in addition to SiC f In addition to the SiC substrate and SiO2 particles, a local graphitized layer is formed on the surface due to the high ablation temperature and recoil pressure. Figure 7 Parallel ripples with a spacing of about 2 μm can be seen in (c).

[0082] Figure 7 It was also shown that the mismatch between focus increment and actual ablation depth may lead to surface damage and residue adhesion. Figure 7(a) and 7(b) show the surface morphology when the focus increment is adjusted to 38 μm and 1 μm, respectively. This adjustment leads to an increase in surface residues, and recast layers and debris are observed on the entire cut surface. This effect is particularly evident in the middle and bottom regions, where debonding occurs at the fiber-matrix interface. The corrugation pattern becomes irregular and blurred due to the adhesion of the residues. Figure 8 The relatively high carbon content in the EDS results indicates the presence of an amorphous layer caused by excessive ablation, especially in Figure 7 This is particularly evident in the middle and bottom regions of (a).

[0083] However, the increase in focus increment, e.g. Figure 7 (d) and 7(e), resulting in the obvious reappearance of residues on the cut surface. Figure 8 EDS analysis in the 2018 2019-03-08 shows significant changes, including an increase in oxygen content, indicating that oxidation during cutting has become more severe. The oxides are mainly concentrated around the original pores on the cut surface and flow down along the cut surface, becoming more obvious as the focus increment increases. When the focus increment increases to 149 microns, incomplete cutting marks appear at the bottom of the surface, significantly reducing the surface quality and increasing the cutting taper.

[0084] The roughness of the cut surface was obtained by averaging the measured values ​​at nine locations, e.g. Fig. 9 As shown. Under the optimal ablation conditions, the cut surface is relatively smooth, with arithmetic mean roughness (Sa) and root mean square roughness (Sq) of 366.92 nm and 474.27 nm, respectively. However, when the focus increment is reduced from 75 μm to 1 μm, the surface roughness increases significantly: Sa increases by 293.82% and Sq increases by 281.42%. Similarly, when the focus increment is increased from 75 μm to 149 μm, Sa roughness increases by 877.64% and Sq roughness increases by 880.52%. These results clearly show that mismatched focus increments and ablation depths not only cause problems such as recast layers, surface damage, and oxidation particles, but also aggravate the appearance of parallel ripples, significantly affecting the surface morphology.

[0085] The influence of different incident angles on the cone angle of the cutting surface was further studied. Fig.10 As shown. The profiles of the upper surface and the cutting surface were measured and the angles were calibrated using an optical microscope. The results show that the processing position has a significant effect on the taper of the workpiece surface. When the processing position is gradually adjusted from +20 mm to -5 mm, the taper angle gradually decreases and reaches the minimum value at -5 mm, at which time the angle between the upper surface of the material and the cutting surface is 90°, achieving taper-free cutting.

[0086] S4: Use the optimal laser parameters, scanning path, shielding gas, optimal focus increment, and optimal laser beam incident angle determined above to complete the laser cutting.

[0087] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A method for laser cutting a material plate, characterized in that There are four steps: S1: Determine the laser parameters, scanning path, and protective gas according to the material, processing equipment, and environment, and select the laser parameters, scanning path, and protective gas that can complete material removal and maximize the performance of the equipment while reducing the impact of the laser; In the selection of shielding gas, the morphology of the laser processed surface under different shielding gases is compared, and the shielding gas with relatively lower surface oxidation degree is selected as the shielding gas; For different laser powers, a relatively larger laser power is selected without causing deterioration of the oxidation degree of the laser processed surface; Selection of laser scanning speed: Select a relatively smaller laser scanning speed without causing deterioration of the oxidation degree of the laser processed surface; The laser energy density LAED satisfies the following formula: CEILING=P / vd spot ; LAED is the laser energy density; P is the laser power; v is the laser scanning speed; d spot is the laser spot diameter; S2: Determine the best focus increment: According to the conditions in S1, multiple focus increment parameters are set to compare the cutting performance. The focus increment corresponding to the highest cutting efficiency and the best cutting surface quality is the optimal focus increment; Among them, the cutting efficiency is judged by the time it takes to cut the material, and the shortest time means the best cutting efficiency; The quality of the cutting surface is judged by surface morphology, surface roughness, and surface element analysis. The best cutting surface quality is when there is no recast layer, oxide, and the roughness is the lowest. S3: Determine the optimal laser beam incident angle: After obtaining the cutting surface through the S2 best focus increment, the laser incident angle is adjusted until a taper-free surface is achieved. The taper is measured by an optical microscope or profilometer using the angle between the cutting surface and the upper surface of the material. When the angle between the two is 90°, it is a taper-free surface. S4: Use the optimal laser parameters, scanning path, shielding gas, optimal focus increment, and optimal laser beam incident angle determined above to complete the laser cutting.

2. A method for laser cutting a material plate according to claim 1, characterized in that: The scanning interval of the scanning path in step S1 ensures that the ablation area of ​​the laser spot covers the entire processing area; the scanning width is equal to the beam diameter of the laser beam at the light outlet of the galvanometer.

3. The method for laser cutting a material plate according to claim 1, characterized in that: During straight-line cutting, in step S1, the scanning path adopts a unidirectional multi-straight-line scanning mode.

4. The method for laser cutting a material plate according to claim 1, characterized in that: S2: If the material cutting is to be ensured first, and there is no requirement for efficiency and quality, a relatively smaller focus increment should be selected.

5. The method for laser cutting a material plate according to claim 1, characterized in that: In S2, for a laser processing system with a variable focus position, the focus increment refers to the distance the focus drops each time the laser scans a layer. If the laser processing system cannot adjust the focus position, then the focus increment corresponds to the displacement of the workpiece.

6. The method for laser cutting a material plate according to claim 1, characterized in that: S2: Cutting efficiency is determined by the material removal rate MRR of the cutting process, where material removal rate MRR = removed material volume V / removal time t.

7. The method for laser cutting a material plate according to claim 1, characterized in that: The method is applicable to material plates with a thickness greater than or equal to 5 mm.

8. The method for laser cutting a material plate according to claim 3, characterized in that: Multi-line scanning modes include progressive scanning and interlaced scanning.

9. The method for laser cutting a material plate according to claim 1, characterized in that: When drilling is performed using the laser cutting method for a material plate, the scanning path is an arc-shaped path.

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