A device for detecting flatness of wafer after grinding

Abstract

The invention discloses a device for detecting the flatness of a wafer after grinding, relates to the field of flatness detection, and solves the problem that the existing flatness detection device is prone to causing chipping of the wafer edge. The device comprises: a device base and a moving platform fixedly installed on the top of the device base, a base frame fixedly installed on the moving end of the moving platform, a placing seat fixedly installed on the top of the base frame, a mounting frame fixedly installed on the top of the device base, an electric telescopic rod fixedly installed on the outer side of the mounting frame, and a detection probe fixedly installed on the output end of the electric telescopic rod; and further comprises: a material fixing mechanism for positioning and adsorbing the wafer on the placing seat, the material fixing mechanism being installed on the inner side of the placing seat; the invention can fix the wafer on the placing seat on the placing seat through the material fixing mechanism, so that the moving platform can drive the placing seat on the base frame to move horizontally below the detection probe, thereby solving the problem of collision of the side edge of the wafer, thereby achieving the effect of improving the detection accuracy and facilitating material taking.

Description

Technical Field

[0001] The invention relates to the field of flatness detection, and in particular to a device for detecting the flatness of a wafer after grinding. Background Art

[0002] A wafer refers to a silicon chip used to make silicon semiconductor circuits. Its original material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, which are then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing, and slicing, the silicon crystal rod forms a silicon wafer, or wafer.

[0003] Flatness is a key parameter of wafers, which directly affects the quality of wafers. If the wafer flatness is insufficient or there are defects on the surface, it will lead to inferior products in the manufacturing process such as etching and packaging, which will further affect the subsequent application of chips made from wafers. The existing Chinese public patent document: CN217058784U discloses a glass wafer flatness detection device. The glass wafer can be placed more stably through the placement groove and will not move during the detection process, making the detection result more reliable and true. The setting of the limit block ensures that a safe distance is maintained between the detection probe and the glass wafer to be detected, and the setting of the rubber pad can provide buffering to protect the glass wafer from damage. However, after the wafer is detected, since the wafer is a hard and brittle material, if there is squeezing between the side of the wafer and the placement seat when taking the material, it is easy to cause the edge of the wafer to collapse. Summary of the invention

[0004] The object of the present invention is to provide a device for detecting the flatness of a wafer after grinding, so as to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A device for detecting the flatness of a wafer after grinding comprises: a device base and a moving platform fixedly mounted on the top of the device base, a base frame fixedly mounted on the moving end of the moving platform, a placement seat fixedly mounted on the top of the base frame, a mounting frame fixedly mounted on the top of the device base, an electric telescopic rod fixedly mounted on the outer side of the mounting frame, and a detection probe fixedly mounted on the output end of the electric telescopic rod; further comprising: a material fixing mechanism for positioning and adsorbing the wafer on the placement seat, the material fixing mechanism being mounted on the inner side of the placement seat; a material lifting mechanism for lifting the wafer on the placement seat for material removal, the material lifting mechanism being mounted on the inner side of the placement seat; a material protection mechanism for providing material removal protection for the wafer on the placement seat, the material protection mechanism being mounted on the top of the placement seat.

[0007] Preferably, the material fixing mechanism includes a slide table slidably mounted on the inner side of the placement seat, a convex ring is provided on the outer side of the slide table, the convex ring contacts the inner side of the placement seat, the placement seat is a hollow structure, a positioning plate is fixedly mounted on the inner side of the placement seat, a screw is rotatably mounted between the bottom of the positioning plate and the bottom of the placement seat, four push rods symmetrically distributed in the center are fixedly mounted on the bottom of the slide table, the push rods slide through the positioning plate, and a moving block matching the screw is fixedly mounted between the bottom ends of the four push rods, so that when the screw rotates, the slide table can be driven by the moving block and the push rod. It moves up and down along the inner side of the placement seat, and a motor is fixedly installed on the inner side of the mounting frame, and the output end of the motor is fixedly connected to the bottom end of the screw, and the motor can drive the screw to rotate, and four suction pipes are fixedly installed on the inner side of the slide and are symmetrically distributed, and a sleeve extending to the bottom of the slide is slidably installed on the outer side of the suction pipe, and an electric air pump is fixedly installed on the bottom of the positioning plate, and the electric air pump is connected to the four sleeves through a connecting pipe, so that the electric air pump can adsorb and fix the wafer on the slide through the sleeve and the suction pipe, and a sealing component for closing the suction pipe is also provided on the inner side of the sleeve.

[0008] Preferably, the lifting mechanism includes a push rod slidably mounted on the inner side of the slide, a top plate is fixedly mounted on the top of the push rod, a rubber plate is arranged on the top of the slide, suction holes corresponding to the four suction pipes are provided on the surface of the rubber plate, so that the suction pipe can adsorb the wafer on the rubber plate, four plug rods symmetrically distributed in the center are fixedly mounted on the bottom of the rubber plate, a slot for limiting the insertion of the plug rods is provided on the top of the slide, a slip ring is fixedly mounted on the outer side of the push rod, a spring is fixedly mounted between the top of the slip ring and the inner side of the slide to facilitate the resetting of the slip ring, and four slidably mounted on the inner side of the slide A push block is symmetrically distributed around the center, and a push rod is fixedly installed on one side of the push block close to the push rod, and a triangular block is fixedly installed on one end of the push rod. The bottom end of the push rod is an arc-shaped structure and contacts with the inclined surface of the triangular block, so that the triangular block can push the push rod upward when moving, so that the top plate pushes the bottom of the rubber plate to realize the top bulge of the rubber plate. Four push blocks are fixedly installed on the inner side of the placement seat, which are respectively located directly above the four push blocks. The bottom of the push block is an inclined surface structure, and the side of the push block close to the push block is an arc structure, so that when the push block contacts with the inclined surface of the push block, it can move along the inner side of the slide.

[0009] Preferably, the material protecting mechanism includes four movable rods rotatably mounted on the convex ring of the slide table in a centrally symmetrical manner, the top of the placement seat is provided with a through hole for limiting the sliding of the movable rod, a positioning ring is provided on the outer side of the movable rod, the positioning ring is fixedly mounted on the top inner wall of the placement seat, and two spiral strips symmetrically mounted on the inner side of the positioning ring are fixedly mounted

[0010] Preferably, the sealing assembly includes a circular block arranged at the bottom of the sleeve, the circular block is connected to the inner side of the sleeve through four protrusions, a support rod extending to the inner side of the suction pipe is fixedly installed on the top of the circular block, a sealing ball is fixedly installed on the top of the support rod, a sealing ring is arranged on the outer side of the support rod, the sealing ring is fixedly installed on the inner side of the suction pipe, a spherical groove for limiting the insertion of the sealing ball is opened on the top of the sealing ring, and the sealing ball can seal the sealing ring when inserted into the spherical groove, and the inner diameter of the sealing ring is larger than the outer diameter of the support rod, so that when the sealing ball is away from the sealing ring, the electric air pump can adsorb the wafer through the sleeve and the suction pipe.

[0011] Preferably, the outer diameter of the circular block corresponds to the inner diameter of the sleeve, and the outer side of the circular block is made of rubber material, which facilitates sealing the bottom of the sealing ring.

[0012] Preferably, a plurality of guide rods are fixedly installed between the top of the positioning plate and the top inner wall of the placement seat and slide through the convex ring of the slide in a centrally symmetrical manner, so as to improve the stability of the movement of the slide.

[0013] Preferably, the insert rod is made of rubber, and a columnar protrusion is provided at the bottom end of the insert rod to facilitate installation and fixation of the rubber plate.

[0014] Preferably, a positioning plate is slidably mounted on the outer side of the push rod, and a second spring is fixedly mounted between the positioning plate and the push block to facilitate resetting of the push block.

[0015] Preferably, the top of the top plate is an arc-shaped structure, and the bottom of the rubber plate is fixedly connected to the top of the top plate, so as to facilitate pushing the top bulge of the rubber plate.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] The present invention uses a material fixing mechanism and an air suction adsorption method to fix the wafer on the placement seat, so that the moving table can drive the placement seat on the base frame to move horizontally under the detection probe, thereby improving the accuracy of wafer detection. After the detection is completed, the wafer is pushed to move upward to facilitate material removal and solve the problem of collision of the side of the wafer, thereby achieving the effect of improving detection accuracy and facilitating material removal.

[0018] The present invention uses a lifting mechanism and an air suction pipe to adsorb the wafer onto the rubber plate, thereby improving the stability of wafer fixation. When the slide table is reset upward, the top plate can push the bottom of the rubber plate to make the top of the rubber plate bulge, which is convenient for separating the wafer from the end of the air suction pipe. By utilizing the distance difference between the rubber plate and the wafer, the staff can pick up the wafer and turn it over, which is convenient for continuous inspection of the wafer, thereby achieving the effect of improving the wafer inspection efficiency.

[0019] The present invention uses a material protection mechanism to move four rubber protection strips toward the outside of the wafer when the round table is reset upward, thereby providing protection for the side edges of the wafer and preventing the wafer from falling from the slide table. In addition, a worker can pick up the wafer through the two symmetrical rubber protection strips, thereby achieving the effect of safe material retrieval. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 This is a schematic diagram of the structure of the chassis and the detection probe in the present invention;

[0022] Figure 3 It is a schematic diagram of the structure of the slide table and the placement seat in the present invention;

[0023] Figure 4 It is a schematic diagram of the suction pipe and the sleeve in the present invention;

[0024] Figure 5 It is a schematic diagram of the push block and the resisting block structure in the present invention;

[0025] Figure 6 for Figure 4 Schematic diagram of the enlarged structure of the middle A area;

[0026] Figure 7 It is a schematic diagram of the triangular block and the top rod structure in the present invention;

[0027] Figure 8 It is a schematic diagram of the structure of the baffle and the rubber protective strip in the present invention.

[0028] In the figure: 1. device base; 2. moving platform; 3. bottom frame; 4. placement seat; 5. mounting frame; 6. electric telescopic rod; 7. detection probe; 8. slide; 9. positioning plate; 10. screw rod; 11. push rod; 12. moving block; 13. sleeve; 14. electric air pump; 15. push rod; 16. top plate; 17. rubber plate; 18. plug rod; 19. slip ring; 20. spring one; 21. push block; 22. push rod; 23. triangular block; 24. push block; 25. movable rod; 26. positioning ring; 27. spiral strip; 28. baffle; 29. ​​rubber protective strip; 30. pull plate; 31. motor; 32. round block; 33. support rod; 34. sealing ball; 35. sealing ring; 36. guide rod; 37. positioning plate; 38. spring two; 39. suction pipe. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] Example 1: Please refer to Figure 1-Figure 8 The device for detecting the flatness of a wafer after grinding shown in the figure comprises a device base 1 and a moving platform 2 fixedly mounted on the top of the device base 1, a base frame 3 is fixedly mounted on the moving end of the moving platform 2, a placement seat 4 is fixedly mounted on the top of the base frame 3, a mounting frame 5 is fixedly mounted on the top of the device base 1, an electric telescopic rod 6 is fixedly mounted on the outer side of the mounting frame 5, and a detection probe 7 is fixedly mounted on the output end of the electric telescopic rod 6; it also comprises: a material fixing mechanism for positioning and adsorbing the wafer on the placement seat 4, the material fixing mechanism is mounted on the inner side of the placement seat 4; a material lifting mechanism for lifting the wafer on the placement seat 4 for material removal, the material lifting mechanism is mounted on the inner side of the placement seat 4; a material protection mechanism for providing material removal protection for the wafer on the placement seat 4, the material protection mechanism is mounted on the top of the placement seat 4.

[0031] The material setting mechanism includes a slide 8 slidably mounted on the inner side of the placement seat 4, a convex ring is arranged on the outer side of the slide 8, the convex ring contacts the inner side of the placement seat 4, the placement seat 4 is a hollow structure, a positioning plate 9 is fixedly mounted on the inner side of the placement seat 4, a screw 10 is rotatably mounted between the bottom of the positioning plate 9 and the bottom of the placement seat 4, four push rods 11 symmetrically distributed in the center are fixedly mounted on the bottom of the slide 8, the push rods 11 slide through the positioning plate 9, and a moving block 12 matched with the screw 10 is fixedly mounted between the bottom ends of the four push rods 11, so that the screw 10 When rotating, the slide 8 can be driven to move up and down along the inner side of the placement seat 4 through the moving block 12 and the push rod 11. A motor 31 is fixedly installed on the inner side of the mounting frame 5. The output end of the motor 31 is fixedly connected to the bottom end of the screw 10. The motor 31 can drive the screw 10 to rotate. Four suction pipes 39 distributed symmetrically in the center are fixedly installed on the inner side of the slide 8. A sleeve 13 extending to the bottom of the slide 8 is slidably installed on the outer side of the suction pipe 39. An electric air pump 14 is fixedly installed at the bottom of the positioning plate 9. The electric air pump 14 is connected to the four The sleeve 13 is docked, so that the electric air pump 14 can adsorb and fix the wafer on the slide 8 through the sleeve 13 and the suction pipe 39. A sealing component for closing the suction pipe 39 is also provided on the inner side of the sleeve 13. The sealing component includes a circular block 32 provided at the bottom of the sleeve 13. The circular block 32 is docked with the inner side of the sleeve 13 through four protrusions. A support rod 33 extending to the inner side of the suction pipe 39 is fixedly installed on the top of the circular block 32. A sealing ball 34 is fixedly installed on the top of the support rod 33. A sealing ring 35 is provided on the outer side of the support rod 33. The sealing ring 35 It is fixedly installed on the inner side of the suction pipe 39. A spherical groove is provided on the top of the sealing ring 35 for the sealing ball 34 to be inserted and limited. When the sealing ball 34 is inserted into the spherical groove, it can seal the sealing ring 35. The inner diameter of the sealing ring 35 is larger than the outer diameter of the support rod 33. When the sealing ball 34 is away from the sealing ring 35, the electric air pump 14 can adsorb the wafer through the sleeve 13 and the suction pipe 39. The outer diameter of the circular block 32 corresponds to the inner diameter of the sleeve 13. The outer side of the circular block 32 is made of rubber material, which is convenient for sealing the bottom of the sealing ring 35.

[0032] When the motor 31 is running, it can drive the screw 10 to rotate, so that the screw 10 drives the slide 8 to move upward along the inner side of the placement seat 4 through the moving block 12 and the push rod 11. The slide 8 drives the suction pipe 39 to move along the inner side of the sleeve 13, so that the sealing ball 34 is inserted into the spherical groove of the sealing ring 35 to seal the bottom of the suction pipe 39. The staff can then place the wafer on the top of the slide 8. The motor 31 drives the screw 10 to rotate in the opposite direction, so that the slide 8 is reset downward, and the sealing ball 34 can be away from the spherical groove of the sealing ring 35. By opening the bottom of the suction pipe 39, the electric air pump 14 can extract the gas in the suction pipe 39 through the sleeve 13, and adsorb the wafer on the slide 8. The slide 8 can stably put the wafer into the top of the placement seat 4, so that when the movable table 2 drives the base frame 3 to move, the wafer on the placement seat 4 can move smoothly along the bottom of the detection probe 7, thereby improving the accuracy of wafer detection. After the detection is completed, the slide 8 is reset upward to facilitate the staff to take out the wafer, thereby achieving the effect of improving the detection accuracy and facilitating material retrieval.

[0033] The material lifting mechanism includes a push rod 15 slidably mounted on the inner side of the slide 8, a top plate 16 is fixedly mounted on the top of the push rod 15, a rubber plate 17 is arranged on the top of the slide 8, and suction holes corresponding to four suction pipes 39 are provided on the surface of the rubber plate 17, so that the suction pipes 39 can adsorb the wafer on the rubber plate 17, four plug rods 18 symmetrically distributed in the center are fixedly mounted on the bottom of the rubber plate 17, and a slot for limiting the insertion of the plug rods 18 is provided on the top of the slide 8, a slip ring 19 is fixedly mounted on the outer side of the push rod 15, and a spring 20 is fixedly mounted between the top of the slip ring 19 and the inner side of the slide 8 to facilitate the resetting of the slip ring 19, and four push rods symmetrically distributed in the center are slidably mounted on the inner side of the slide 8. Block 21, a push rod 22 is fixedly installed on one side of the push block 21 close to the push rod 15, and a triangular block 23 is fixedly installed on one end of the push rod 22. The bottom end of the push rod 15 is an arc-shaped structure and contacts the inclined surface of the triangular block 23, so that the triangular block 23 can push the push rod 15 to move upward when moving, so that the top plate 16 pushes the bottom of the rubber plate 17 to realize the top bulge of the rubber plate 17. Four push blocks 24 are fixedly installed on the inner side of the placement seat 4, which are respectively located directly above the four push blocks 21. The bottom of the push block 24 is an inclined surface structure, and the side of the push block 21 close to the push block 24 is an arc-shaped structure, so that when the push block 21 contacts the inclined surface of the push block 24, the push block 21 can move along the inner side of the slide 8;

[0034] When the slide 8 moves, it can drive the push block 21 to move along the inner side of the placement seat 4. When the push block 21 contacts the stop block 24, the arc surface of the push block 21 moves along the inclined surface of the stop block 24, so that the push block 21 moves along the inner side of the slide 8. The push block 21 pushes the triangular block 23 to move through the stop rod 22, so that the inclined surface of the triangular block 23 pushes the push rod 15 to move upward along the inner side of the slide 8. The push rod 15 can push the top protrusion of the rubber plate 17 through the top plate 16, so that the rubber plate 17 pushes the wafer away from the top of the suction pipe 39, which is convenient for the wafer to be separated from the suction pipe 39, so that the staff can pick up the wafer and turn the wafer over, which is convenient for continuous detection of the wafer, thereby achieving the effect of improving the wafer detection efficiency.

[0035] Working principle: First, the staff starts the motor 31, and the motor 31 drives the screw 10 to rotate. The screw 10 pushes the four push rods 11 to move upward along the inner side of the positioning plate 9 through the moving block 12. The push rods 11 drive the slide 8 to move synchronously along the inner side of the placement seat 4. At the same time, the slide 8 drives the suction pipe 39 to move along the inner side of the sleeve 13, so that the spherical groove of the sealing ring 35 contacts the sealing ball 34, and the bottom of the suction pipe 39 is sealed. Then, the staff puts the wafer on the rubber plate 17 and starts the motor 31 again. The motor 31 drives the screw 10 to rotate in the opposite direction, so that the slide 8 moves along the inner side of the sleeve 13. As the inner side of the placement seat 4 is reset downward, the suction pipe 39 drives the sealing ring 35 away from the sealing ball 34, so that the bottom of the suction pipe 39 is opened, and the electric air pump 14 can extract the gas in the suction pipe 39 through the sleeve 13, so that the wafer is adsorbed on the rubber plate 17, so that the slide 8 stably puts the wafer into the top of the placement seat 4, and then the staff starts the electric telescopic rod 6, so that the electric telescopic rod 6 drives the detection probe 7 to lean against the wafer. At this time, the staff starts the moving table 2, so that the moving table 2 drives the base frame 3 to move, and the base frame 3 drives the slide 8 to move through the placement seat 4, so that the wafer is stably placed along the detection probe 7. The bottom of the measuring probe 7 moves to realize the flatness detection of the wafer. After the detection is completed, the staff resets the detection probe 7 through the electric telescopic rod 6 and starts the motor 31 again to reset the slide 8 upward along the inner side of the placement seat 4. At the same time, the slide 8 drives the push block 21 to move along the inner side of the placement seat 4, so that the arc-shaped end of the push block 21 contacts the inclined surface of the stop block 24, so that the stop block 24 pushes the push block 21 to move along the inner side of the slide 8, and the push block 21 pushes the triangular block 23 to move through the stop rod 22, so that the inclined surface of the triangular block 23 pushes the push rod 15 to move upward along the inner side of the slide 8. The rod 15 drives the top plate 16 to move synchronously, so that the top plate 16 lifts the bottom of the rubber plate 17. Under the fixation of the rubber plate 17 by the insertion rod 18 and the slide 8, the top of the rubber plate 17 is raised, and the rubber plate 17 can push the middle position of the wafer to make the wafer away from the top of the suction pipe 39, so as to facilitate the separation of the wafer from the suction pipe 39. In addition, by using the distance between the bottom of the wafer and the rubber plate 17, the staff can quickly turn the wafer over and perform flatness detection on the bottom of the wafer, thereby improving the convenience of detection, thereby achieving a smooth and accurate detection effect, and facilitating loading and unloading of materials.

[0036] Example 2: Please refer to Figure 5 and Figure 8, this embodiment further explains the first embodiment, the material protection mechanism shown in the figure includes four movable rods 25 rotatably mounted on the convex ring of the slide table 8, the top of the placement seat 4 is provided with a through hole for the movable rod 25 to limit the sliding, the outer side of the movable rod 25 is provided with a positioning ring 26, the positioning ring 26 is fixedly mounted on the top inner wall of the placement seat 4, and two spiral strips 27 symmetrically mounted on the inner side of the positioning ring 26 are fixedly mounted, and the outer side of the movable rod 25 is provided with a spiral groove matched with the spiral strip 27, so that when the movable rod 25 moves, the spiral groove can move along The outer side of the spiral strip 27 moves to realize the rotation of the movable rod 25. A baffle 28 located above the slide 8 is fixedly installed on the top of the movable rod 25. A rubber protective strip 29 is arranged on the outer side of the baffle 28. The rubber protective strip 29 has an arc-shaped structure to reduce the contact area with the wafer. A storage groove for the baffle 28 is provided on the top of the placement seat 4. A pull plate 30 is fixedly installed on the side of the rubber protective strip 29 close to the movable rod 25. The bottom of the pull plate 30 is in contact with the top of the baffle 28. A U-shaped card slot for the pull plate 30 to limit the insertion is provided on the top of the baffle 28, which is convenient for installing the pull plate 30.

[0037] In this embodiment: when the slide 8 moves upward, it can drive the four movable rods 25 to move upward synchronously, so that the movable rod 25 moves along the inner side of the positioning ring 26, and the spiral groove on the outer side of the movable rod 25 moves along the spiral strip 27 on the inner side of the positioning ring 26, so that the movable rod 25 is in a state of self-rotation while moving, and the movable rod 25 can drive the baffle 28 to rotate synchronously, so that the baffle 28 drives the rubber protective strip 29 to move to the outside of the wafer, providing protection for the wafer to prevent the wafer from falling when the staff is taking the material, and the staff can insert their fingers into the inner side of the two symmetrical pulling plates 30, remove the rubber protective strip 29 from the baffle 28, and pick up the wafer through the two rubber protective strips 29, which is convenient for taking the material, and the wafer can also be directly flipped over, which is convenient for the flatness detection of the bottom of the wafer, thereby improving the convenience and safety of the detection.

[0038] Example 3: Please refer to Figure 3 , Figure 4 and Figure 7 This embodiment further illustrates other embodiments. A plurality of guide rods 36 are fixedly installed between the top of the positioning plate 9 and the top inner wall of the placement seat 4, which are centrally symmetrically slidable and penetrate the convex ring of the slide 8, so as to improve the stability of the movement of the slide 8. The insertion rod 18 is made of rubber. A columnar protrusion is provided at the bottom end of the insertion rod 18, which is convenient for installing and fixing the rubber plate 17. A positioning plate 37 is slidably installed on the outer side of the push rod 22. A spring 38 is fixedly installed between the positioning plate 37 and the push block 21, which is convenient for resetting the push block 21. The top of the top plate 16 is an arc-shaped structure. The bottom of the rubber plate 17 is fixedly connected to the top of the top plate 16, which is convenient for pushing the top protrusion of the rubber plate 17.

[0039] In this embodiment: when the slide 8 moves, the convex ring on its outer side can move along the outer side of the guide rod 36, thereby improving the stability of the movement of the slide 8. When installing the rubber plate 17, the staff can insert the columnar protrusion on the insertion rod 18 into the slot at the top of the slide 8, so that the columnar protrusion of the insertion rod 18 can be stuck in the bottom of the slot, thereby improving the convenience of installing the rubber plate 17, and when the top plate 16 pushes the bottom of the rubber plate 17, it can provide a pulling force for the rubber plate 17, so that when the push block 21 is away from the stop block 24, the rebound force of the spring 2 38 can be used to push the push block 21 to reset, so that the push block 21 can pull the triangular block 23 away from the top rod 15 through the stop rod 22, which is convenient for the top plate 16 to reset, thereby improving the durability of the spring 1 20, and when the top plate 16 moves upward, it can push the top protrusion of the rubber plate 17 through the arc surface on its outer side, thereby improving the durability of the rubber plate 17.

[0040] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0041] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A device for detecting the flatness of a wafer after grinding, characterized in that: include: A device base (1) and a mobile platform (2) fixedly mounted on the top of the device base (1); a base frame (3) is fixedly mounted on the mobile end of the mobile platform (2); a placement seat (4) is fixedly mounted on the top of the base frame (3); a mounting frame (5) is fixedly mounted on the top of the device base (1); an electric telescopic rod (6) is fixedly mounted on the outer side of the mounting frame (5); and a detection probe (7) is fixedly mounted on the output end of the electric telescopic rod (6); Also includes: A material fixing mechanism is used for positioning and adsorbing the wafer on the placement seat (4), the material fixing mechanism is installed on the inner side of the placement seat (4), the material fixing mechanism comprises a slide table (8) slidably installed on the inner side of the placement seat (4), a convex ring is arranged on the outer side of the slide table (8), the convex ring contacts the inner side of the placement seat (4), the placement seat (4) is a hollow structure, a positioning plate (9) is fixedly installed on the inner side of the placement seat (4), a screw (10) is rotatably installed between the bottom of the positioning plate (9) and the bottom of the placement seat (4), four push rods (11) are fixedly installed on the bottom of the slide table (8) and are distributed symmetrically with respect to the center, the push rods (11) slide through the positioning plate (9), and the four push rods A moving block (12) matched with the screw rod (10) is fixedly installed between the bottom ends of the two screw rods (11), a motor (31) is fixedly installed on the inner side of the mounting frame (5), the output end of the motor (31) is fixedly connected to the bottom end of the screw rod (10), four suction pipes (39) distributed symmetrically in the center are fixedly installed on the inner side of the slide (8), a sleeve (13) extending to the bottom of the slide (8) is slidably installed on the outer side of the suction pipe (39), an electric air pump (14) is fixedly installed on the bottom of the positioning plate (9), the electric air pump (14) is connected to the four sleeves (13) through a connecting pipe, and a sealing component for closing the suction pipe (39) is also provided on the inner side of the sleeve (13); A material lifting mechanism is used to lift the wafer on the placement seat (4) to remove the material, and the material lifting mechanism is installed on the inner side of the placement seat (4). The material lifting mechanism includes a push rod (15) slidably installed on the inner side of the slide (8), and a top plate (16) is fixedly installed on the top of the push rod (15). A rubber plate (17) is arranged on the top of the slide (8), and the surface of the rubber plate (17) is provided with suction holes corresponding to the four suction pipes (39). Four insertion rods (18) distributed symmetrically with the center are fixedly installed on the bottom of the rubber plate (17). A slot for limiting the insertion of the insertion rod (18) is opened on the top of the slide (8). A slip ring (19) is fixedly installed on the outer side of the push rod (15). A spring (20) is fixedly installed between the top of the ring (19) and the inner side of the slide (8); four push blocks (21) are slidably installed on the inner side of the slide (8) and are symmetrically distributed in the center; a push rod (22) is fixedly installed on the side of the push block (21) close to the push rod (15); a triangular block (23) is fixedly installed on one end of the push rod (22); the bottom end of the push rod (15) is an arc-shaped structure and contacts the inclined surface of the triangular block (23); four push blocks (24) are fixedly installed on the inner side of the placement seat (4) and are respectively located directly above the four push blocks (21); the bottom of the push block (24) is an inclined surface structure, and the side of the push block (21) close to the push block (24) is an arc structure; A material protection mechanism is used to provide material removal protection for the wafer on the placement seat (4), the material protection mechanism is installed on the top of the placement seat (4), the material protection mechanism includes four movable rods (25) installed on the convex ring of the slide table (8) in a centrally symmetrical rotation manner, the top of the placement seat (4) is provided with a through hole for the movable rod (25) to limit the sliding, the outer side of the movable rod (25) is provided with a positioning ring (26), the positioning ring (26) is fixedly installed on the inner wall of the top of the placement seat (4), the inner side of the positioning ring (26) is fixedly installed with two spiral strips (27) that are respectively centrally symmetrical, and the outer side of the movable rod (25) is provided with a A spiral groove is provided to match the spiral strip (27); a baffle (28) located above the slide (8) is fixedly installed on the top of the movable rod (25); a rubber protective strip (29) is provided on the outer side of the baffle (28); the rubber protective strip (29) is in an arc-shaped structure; a storage groove for receiving the baffle (28) is provided on the top of the placement seat (4); a pull plate (30) is fixedly installed on the side of the rubber protective strip (29) close to the movable rod (25); the bottom of the pull plate (30) is in contact with the top of the baffle (28); and a U-shaped card slot for limiting the insertion of the pull plate (30) is provided on the top of the baffle (28).

2. The device for detecting the flatness of a wafer after grinding according to claim 1, characterized in that: The sealing assembly comprises a circular block (32) arranged at the bottom of the sleeve (13), the circular block (32) being butted against the inner side of the sleeve (13) via four protrusions, a support rod (33) extending to the inner side of the air intake pipe (39) being fixedly mounted on the top of the circular block (32), a sealing ball (34) being fixedly mounted on the top of the support rod (33), a sealing ring (35) being arranged on the outer side of the support rod (33), the sealing ring (35) being fixedly mounted on the inner side of the air intake pipe (39), a spherical groove for limiting and inserting the sealing ball (34) being provided on the top of the sealing ring (35), and an inner diameter of the sealing ring (35) being larger than an outer diameter of the support rod (33).

3. The device for detecting the flatness of a wafer after grinding according to claim 2, characterized in that: The outer diameter of the circular block (32) corresponds to the inner diameter of the sleeve (13), and the outer side of the circular block (32) is made of rubber material.

4. The device for detecting the flatness of a wafer after grinding according to claim 1, characterized in that: A plurality of guide rods (36) are fixedly mounted between the top of the positioning plate (9) and the top inner wall of the placement seat (4) and are symmetrically slidable through the convex ring of the slide table (8).

5. The device for detecting the flatness of a wafer after grinding according to claim 1, characterized in that: The insertion rod (18) is made of rubber material, and a columnar protrusion is provided at the bottom end of the insertion rod (18).

6. The device for detecting the flatness of a wafer after grinding according to claim 1, characterized in that: A positioning plate (37) is slidably mounted on the outer side of the push rod (22), and a second spring (38) is fixedly mounted between the positioning plate (37) and the push block (21).

7. The device for detecting the flatness of a wafer after grinding according to claim 1, characterized in that: The top of the top plate (16) is an arc-shaped structure, and the bottom of the rubber plate (17) is fixedly connected to the top of the top plate (16).

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