Sensor with housing and silicone filling

Abstract

A sensor having a housing and a silicone filler. A sensor (1) is provided comprising a sensor element (2) and an electrical lead (3), whereby the sensor element (2) is connected to the electrical lead (3). Furthermore, a housing (4) is provided, whereby the housing (4) has an opening and the sensor element (2) is arranged in the housing (4) such that the electrical lead (3) protrudes through the opening. The housing (4) is filled with a silicone (5) and the sensor element (2) and the electrical lead (3) are fixed in the housing by means of the silicone (5).

Description

[0001] The invention relates to a sensor. Furthermore, the invention relates to an arrangement using the sensor and a method for assembling the sensor.

[0002] Sensors are used in most electronic devices today. Considering only smart sensors, worldwide sales have increased from 6 billion sensors in mid-2010 to an estimated 26 billion in mid-2019. It is foreseeable that this number will increase even more with the growth of the Internet of Things and the demand for smarter devices. Disposal will also become a challenge in the future, as ecologically problematic materials are often used in sensors.

[0003] Modern smartphones typically have at least a built-in proximity sensor, brightness sensor, tilt sensor, rotation sensor, accelerometer, GPS sensor, magnetic sensor, and thermometer.

[0004] With regard to sensors, it is desirable on the one hand to provide reliable, reproducible measurements of the sensor while at the same time making the sensor sustainable and not very polluting.

[0005] It is an object of the present invention to provide a sensor which is robust, protected, allows for reliable measurements and is environmentally friendly.

[0006] This object is solved by a sensor according to claim 1. Further advantageous designs and potential arrangements can be found in the dependent claims.

[0007] A sensor is provided, which includes a sensor element and an electrical lead. The electrical lead is connected to the sensor element. In addition, a housing is provided. The housing has an opening and the sensor element and the electrical lead are arranged in the housing so that the electrical lead protrudes through the opening. The housing is filled with silicone resin and the sensor element and the electrical lead are fixed in the housing by the silicone resin.

[0008] Common filling materials for sensors, such as, for example, alumina or silica, require solvents such as toluene, xylene or IPA to handle. As a result, voids, vesicles and bubbles appear after curing, which cannot be avoided. These inclusions lead to an inhomogeneous surrounding of the sensor element used. As a result, the measurements performed with the sensor fluctuate strongly depending on the number and spatial distribution of inhomogeneities in the filling material. Therefore, in these sensors, the response time and the measured values ​​vary and do not allow reliable measurements. By using polymer resins, such as silicone or epoxy resins, as filling and fixing materials in the housing of the sensor, voids, vesicles and other inhomogeneities are avoided. Polymer resins provide uniform heat transfer from the environment to the sensor element, resulting in a fast thermal response of the sensor and a small change in the response time. Therefore, the reliability of the measurement of the sensor according to the present invention is improved.

[0009] In applications where the sensor has to withstand temperature increases, the filling resin will expand due to the thermal expansion coefficient. The confinement of the resin as a housing for the sensor causes thermomechanical stresses on the encapsulated sensor element during temperature changes. Relatively low thermomechanical stresses can already interfere with the measurements of the sensor. This is even more true if the sensor element is pressure-sensitive. High thermomechanical stresses can lead to failed sensors due to disconnection of the connection between the electrical leads to the sensor element or due to breaking the sensor element itself. Since silicone has a much higher elastic modulus compared to metal oxides or epoxies, it exerts less stress on the sensor element and the electrical leads at temperature gradients, resulting in a more robust sensor.

[0010] Furthermore, silicones can tolerate higher long-term temperatures than epoxies. Continuous operating temperatures up to 200°C are feasible for silicones, whereas epoxies degrade at 150°C. Therefore, silicone-enabled sensors are excellent for applications that generate or are exposed to high temperatures.

[0011] In addition, silicone is inert and does not react with other chemicals, elements or compounds even at high temperatures. There are no known health hazards of silicone. Silicone is not biodegradable, however it can be easily recycled and downcycled. Therefore, silicone is more ecologically friendly than other alternatives.

[0012] The silicone resin may be a hard silicone material. The hard silicone resin is more rigid than the soft silicone resin. Therefore, the sensor element is more accurately fixed in the housing, and the position of the sensor element inside the housing does not change. In addition, the hard silicone resin may provide more protection for the sensor element.

[0013] In one embodiment, the sensor element can be encapsulated in a silicone material, and the housing can be filled with the same silicone material, and the encapsulated sensor element can be fixed to the housing by the same silicone material. By using the same material to encapsulate the sensor element and fix the sensor element in the housing, the boundary surface that would occur if two different materials were used is omitted. This boundary surface and can hinder and interfere with the measurement.

[0014] The sensor element can be connected to the electrical leads by lead-free solder. Lead can easily form low melting temperature alloys with many metals that can be used in electrical leads. For example, Sn plating on the electrical leads can produce a low temperature melting SnPb alloy with lead solder. The use of lead-free solder eliminates the risk of forming such alloys during the soldering process and thereby ensures proper function of the sensor up to 200°C. In addition, lead is a toxic metal that pollutes the environment and can cause significant health problems. By omitting the leads used to make the electrical leads contact the sensor element, the sensor becomes more environmentally friendly.

[0015] For example, the solder may include Sn-Cu or Sn-Ag-Cu (SAC) solder. Those solder alloys exhibit much higher melting points than lead solder and enable the sensor to operate at higher temperatures. The melting point of Sn-Cu or Sn-Ag-Cu (SAC) solder is at about 220°C. Therefore, the sensor using the proposed solder and silicone can withstand higher temperatures. A content of less than 1% Cu is preferred. It is also possible to add Ni to the solder alloy to avoid void formation and cracking.

[0016] In a preferred embodiment, the housing can be made of metal oxide or ceramic. It is beneficial to make the housing from metal oxide because metal oxides have the advantageous properties of high stability and relatively high thermal conductivity. In addition, they are also good electrical insulators, making sensors with such housings suitable for high voltage applications. However, voltages of several kV can cause short circuits, mainly between protruding leads and the housing, especially if the housing is composed of an electrical conductor such as metal. Forming the housing from metal oxide enables the sensor to operate at voltages of up to 5 kV. With metal oxide or ceramic housings, the sensor is suitable for applications under harsh operating conditions and is resistant to aggressive media such as acids and bases.

[0017] The sensor element may be an NTC sensor element. Since NTC sensors are used to measure the temperature of the surroundings, it is necessary to enable direction-independent measurements. Especially in safety systems that are triggered by temperature increases, reliable and direction-independent measurements need to be considered. Alternatively, the sensor element may be a PTC sensor element or a temperature-dependent sensor element using the resistance of platinum.

[0018] The wall thickness of the housing can be less than 2 mm. On the one hand, the wall thickness of the housing should be thick enough to protect the sensor element in the housing. On the other hand, the housing should not isolate the environment from the sensor element so as not to impair the sensitivity of the sensor. A wall thickness of less than 2 mm has proven to be advantageous. A wall thickness of less than 1 mm and greater than 0.5 mm is particularly advantageous.

[0019] In addition, the electrical leads may be kinked in a portion of the electrical leads located inside the housing. By kinking the leads, it can be ensured that the two leads do not touch each other and do not short-circuit. In addition, kinking the wires may induce lateral forces to support latching the electrical leads in potential grooves on the interior of the housing. Likewise, the elastic tension of the electrical leads generated by the kink helps to handle the sensor element during the potting process, where the sensor element is stored in the housing, and helps to handle the entire sensor if the sensor is installed or placed in an application.

[0020] The housing may have two grooves at the inner surface of the housing. The grooves may extend from the opening along the longitudinal axis into the housing. In the grooves, electrical leads connected to the sensor element may be arranged. In this way, the orientation of the sensor element in the housing is fixed relative to the housing.

[0021] In addition, the outer shape of the housing can be radially asymmetric. Moreover, the housing may have a longitudinal axis and the housing may not be radially symmetric relative to a rotation angle other than 180 ° around its longitudinal axis. Therefore, the direction in which the sensor element faces in the housing and the direction of the housing in the device can be determined, and the direction in which the sensor element faces in the housing and the direction of the housing in the device are fixed relative to rotational asymmetry. The signal output of the sensor element usually depends not only on the distance to the measured event, but also on the angle at which the sensor element faces the event. For example, an NTC sensor element directly facing a heat source will be exposed to more thermal energy than an NTC sensor oriented perpendicular to the heat source. By determining the direction of the sensor element in the housing and the direction of the housing in the device by its outer shape, it is ensured that the sensor element works and measures reliable and reproducible values. In addition, the housing with a radially asymmetric outer shape complies with pokayoke. When assembling a device in which a sensor is used, errors can be avoided by using an appropriate connection with the housing. In addition, the outer shape of the housing can have at least two flat sections relative to each other. The sensor can be securely picked at the flat section, since the flat section provides a means for a stable grip. Therefore, the sensor can also be easily installed and placed in the device by a pick-and-place machine.

[0022] In a preferred embodiment, the housing can be divided into two parts, including a first part of the opening and a second part opposite to the side of the opening and connected to the first part. The second part can have a smaller diameter than the first part and the sensor element can be arranged in the second part of the housing. The sensor element arranged in the second part has less material surrounding it than the first part. This allows for higher measurement accuracy and shorter response times of the sensor. At the same time, the first part of the housing with a larger diameter provides a means for better manipulation of the sensor and stabilizes the leads connected to the sensor element. Another advantage of the shape of the housing with two parts is that the sensor and the direction it faces can be easily recognized by machines such as pick-and-place machines, and can therefore be easily processed. In this way, the processing time for placing the sensor in the device can be reduced due to automation.

[0023] It may be advantageous if the housing has a smaller wall thickness in the second part than in the first part. Since the sensor element is located in the second part, the smaller wall thickness may increase, for example, the thermal coupling to the environment and optimize the response time and sensitivity of the sensor.

[0024] An arrangement may comprise a sensor according to the invention and a socket. The socket may have an internal shape adapted to the external shape of the sensor, and the sensor may be arranged in the socket. Thus, the arrangement complies with error-proofing, minimizing errors when assembling the arrangement. The sensor element is located in the same position not only relative to the housing but also relative to the socket. Therefore, replacing the sensor does not change the measurement result, because the orientation and position of the sensor element remain the same.

[0025] The socket may have a hole which extends greater than the extension of the second part of the sensor. In a further arrangement, the sensor may be arranged in the socket in such a way that the second part of the sensor protrudes through the hole. Thus, the sensor element located in the second part may more directly measure properties outside the socket, while maintaining the advantages given by the socket, such as reliable position and orientation of the sensor element. Thus, this arrangement may allow for more accurate measurements.

[0026] Another arrangement may include a sensor or arrangement according to the invention and a printed circuit board (PCB), whereby a socket or sensor may be arranged on the PCB and the sensor may be electrically connected to the PCB. The PCB is equipped with a large number of heat generating components, such as resistors, coils or chips such as processors. Being able to monitor properties such as temperature of this component improves safety, since the device using the PCB can be shut down after the temperature rises. The sensor according to the invention is particularly suitable because it measures more reliably.

[0027] Likewise, a smart power meter comprising a sensor according to the invention or an arrangement comprising a sensor according to the invention may be suitable. In a smart power meter, in particular for buildings, high currents and voltages occur when electricity from the grid is distributed to different households. For this reason, any disaster such as a broken wire or corrosion can lead to a catastrophic failure such as a fire. Therefore, a sensor that can reliably measure disturbances such as heating can be used to warn or shut down the power supply.

[0028] An advantage of the sensor is that its assembly can be done in a safe way.

[0029] The method comprises the following steps:

[0030] a) connecting the sensor element to the electrical leads by, for example, lead-free soldering,

[0031] b) Immerse the sensor element in silicone,

[0032] c) curing the silicone resin on the sensor element,

[0033] d) arranging the sensor in a housing having an opening such that the electrical leads protrude through the opening,

[0034] e) filling the housing with silicone resin,

[0035] f) Curing the silicone in the shell.

[0036] This process minimizes losses and failure rates during assembly. By immersing the sensor element in silicone and then curing it in steps b) and c), the connection strength between the sensor element and the electrical leads is improved. Therefore, when the sensor element is arranged in the housing in step d), the connection between the sensor element and the leads has a lower risk of breaking. In addition, since the same material, namely silicone, is used to encapsulate the sensor element with the electrical leads and fill the housing, the sensitivity of the sensor is improved. By using the same material, no obvious boundary surface occurs compared to the case where two different materials are used. Therefore, the sensor element is more sensitive and has a shorter response time to, for example, temperature differences that occur.

[0037] Hereinafter, embodiments and manufacturing methods of the present invention are described with reference to the accompanying drawings. One or more identical parts having the same effect are denoted by the same reference numeral.

[0038] The drawings serve only to illustrate the invention and are therefore only schematic and not drawn to scale. Some parts may be enlarged or deformed in size. Therefore, neither absolute nor relative dimensions can be derived from the drawings. Identical or identically functioning parts have the same reference numerals.

[0039] Figure 1 A simplified cross section of the sensor is shown;

[0040] Figure 2 shows a cross section of a housing for a sensor;

[0041] Figure 3 shows a plan view of the housing of the sensor;

[0042] Figure 4 shows a perspective view of the housing of the sensor;

[0043] Figure 5 Shown is a socket arranged in a socket having a hole Figure 1 Simplified cross section of a sensor.

[0044] exist Figure 1 , a simplified cross section of a sensor 1 according to a first embodiment of the invention is shown. The sensor 1 comprises a sensor element 2 and electrical leads 3. The sensor element 2 is connected to the electrical leads 3 by means of, for example, lead-free solder 11.

[0045] Lead forms a low melting temperature alloy with many metals, which is often used as solder 11. Some examples of such alloys are babbitt, cerrosafe, tin telluride, leaded copper, linotype, molybdochalkos, queen metal or rose metal. The melting point of such alloys is about 150°C, and thus will limit the temperature range in which the sensor 1 can be used. By adopting a lead-free solder 11, such as Sn-Cu or Sn-Ag-Cu (SAC) solder 11, the sensor 1 can operate at a higher temperature, because the melting point of Sn-Cu or Sn-Ag-Cu (SAC) solder is at about 220°C. Moreover, lead is a toxic element that is destructive to the environment. It causes health problems in humans and animals, such as lead poisoning. Lead is also easily absorbed by plants and is thereby introduced into the food cycle. By omitting the lead solder 11 in the sensor 1, the sensor 1 is becoming more eco-friendly.

[0046] In the housing 4 having an opening, the sensor element 2 is arranged so that the electrical leads 3 protrude through the opening of the housing 4. Therefore, the sensor 1 can be easily placed and connected in the device. The housing 4 is filled with silicone 5 and the sensor element 2 and the electrical leads 3 are fixed in the housing 4 by the silicone 5.

[0047] In particular, the sensor element 2 connected to the electrical lead 3 is first immersed in silicone and cured, which forms a silicone encapsulation 5a. Then, the encapsulated sensor element 2 is arranged in the housing 4 and the housing 4 is filled with a silicone filler 5b. The silicone encapsulation 5a and the silicone filler 5b together form the silicone 5 inside the housing 4. In this way, the material encapsulating the sensor element 2 is the same material that contacts the inside of the housing 4 and fixes the sensor element 2 inside the housing 4. By using silicone for encapsulation and filling of the housing 4, the formation of boundary surfaces is reduced, whereas if two different materials are used, the formation of boundary surfaces will be strongly developed.

[0048] Compared to metal oxides widely used for encapsulation, polymer materials such as silicone as encapsulation materials avoid the formation of bubbles and voids. These inclusions cause an inhomogeneous surrounding of the sensor element 2, leading to unreliable measurements, because the measured value depends on the spatial distribution of the inhomogeneities in the filling material. The sensor 1 with silicone 5 as the filling and fixing material in the housing 4 avoids inhomogeneities and thereby increases the reliability and reproducibility of the measurements of the sensor 1. In addition, the silicone 5 can withstand moisture, increasing the voltage suitable for the sensor 1.

[0049] Compared to epoxy resin, which is also a polymer material, silicone resin has some significant advantages. First, silicone resin 5 has a larger elastic modulus, resulting in less thermomechanical stress on sensor element 2 or electrical leads 3 in housing 4, especially in applications where high temperature gradients or high temperatures occur. Second, silicone resin 5 tolerates higher temperatures than epoxy resin, which makes sensor 1 using silicone resin 5 even more suitable for high temperature applications, especially in combination with lead-free solder 11. In addition, silicone resin 5 is inert and therefore does not react with its environment even at high temperatures. Therefore, since silicone resin 5 is non-toxic, it is also more ecologically friendly.

[0050] Figure 1 The sensor element 2 in is an NTC sensor element 2. The NTC sensor element 2 measures the temperature of the environment. Therefore, for NTC sensors, a direction-independent measurement is required. In particular, safety systems that are triggered by a temperature increase require reliable and direction-independent measurements to provide reproducible behavior in emergency situations.

[0051] Inside the housing 4, two grooves 9 are arranged at the inner surface of the housing 4, which extend from the opening along the longitudinal axis to the bottom of the housing 4. Alternatively, the grooves may be only in a portion of the housing 4, such as in the first portion 6 forming the opening. In addition, each of the electrical leads 3 has two kinks 10 in the portion inside the housing 4. In this way, the electrical leads 3 form a spring-like element that is forced to separate from each other. As a result, the two electrical leads 3 are stretched apart and are less likely to short-circuit. Likewise, the lateral forces caused by the kinks 10 of the electrical leads 3 press the electrical leads 3 into the grooves 9 inside the housing 4. In this way, the orientation of the sensor element 2 is fixed relative to the housing 4. In addition, the lateral forces applied to the electrical leads 3 are convenient during the packaging or mounting process because they facilitate the manipulation of the sensor 1 or the sensor element 2.

[0052] exist Figure 2 In FIG. 1 , a cross section of a housing 4 of a sensor 1 according to the invention is shown. The housing 4 has two parts, a first part 6 comprising an opening on the upper side, and a second part 7 opposite the side of the opening and connected thereto, whereby the second part 7 has a smaller diameter than the first part 6. A groove 9 extends from the opening all the way down to the bottom at the inner surface of the housing 4. The sensor element 2 is arranged in the second part 7 of the housing 4 having a smaller diameter. Since the sensor element 2 has less material surrounding it than the second part 7, a higher measurement accuracy and a faster response time are provided for the sensor 1. The first part 6 of the housing 4 having a larger diameter is stably connected to the electrical leads 3 of the sensor element 2.

[0053] Furthermore, the wall thickness of the second part 7 of the housing 4 is smaller than the wall thickness of the first housing 4 in order to improve the heat conduction from the surroundings to the sensor element 2 and to improve the response time of the sensor 1 . Figure 2 The wall thickness of the housing 4 shown in FIG is 0.7 mm. The wall thickness of the housing 4 should be robust enough to withhold the pressure applied to the sensor 1 when the sensor is placed or mounted to protect the sensor element 2. In addition, the housing 4 needs to thermally connect the environment to the sensor element 2 to provide high sensitivity. A wall thickness of less than 2 mm has been shown to be advantageous, especially for temperature sensors. A wall thickness of less than 1 mm and greater than 0.5 mm, such as 0.7 mm, is particularly advantageous.

[0054] exist Figure 3 , a plan view of a housing 4 for a sensor 1 is shown. It shows a first part 6 of the housing 4, which forms a circular opening in the middle. The outer shape and profile of the first part 6 are radially asymmetrical. The profile of the housing 4 has two flat sections 8 that are opposite to each other. In this way, the sensor 1 can be firmly grasped at the flat sections 8, because the flat sections 8 provide means for a stable grip. Therefore, the sensor 1 can also be easily installed and placed in the device by a pick-and-place machine.

[0055] By adopting a non-radially symmetrical housing 4, the direction that the sensor element 2 faces in the housing 4 and the direction of the housing 4 in the device are determined and fixed. Therefore, the position and orientation of the sensor 1 in the device are exactly the same. The sensor elements 2 depend on the angle and distance of the event they are facing that they should measure. As an example, a planar temperature sensor element 2 facing a heat source with its large surface will absorb more thermal energy than an NTC sensor oriented perpendicular to the heat source. By determining the direction of the sensor element 2 in the housing 4 and the direction of the housing 4 in the device via its external shape and contour, it is ensured that the sensor element 2 and thus the sensor 1 itself works and measures reliable and reproducible values. The groove 9 is located in the center relative to the flat section 8 that is part of the outer contour of the housing 4. Since the electrical lead 3 is considered to be locked in the groove 9 and the groove is fixed compared to the flat section 8, the orientation of the sensor element 2 in the housing 4 is predetermined relative to the flat section 8. In this way, it is ensured that the sensor 1 measures reproducible in a given environment of the orientation and position of the specified housing.

[0056] Figure 4 A perspective view of the housing 4 is shown. As mentioned above, the housing 4 has two parts, is radially asymmetric and has two flat sections 8 on the first part 6. It is made of alumina, which is a metal oxide with 96% aluminum and 4% oxygen. Metal oxides provide high stability and relatively high thermal conductivity. Furthermore, metal oxides are electrical insulators. Therefore, the sensor 1 with a housing 4 made of metal oxide allows for use in high voltage applications. Furthermore, since the silicone 5 is moisture-proof, this will reduce the breakdown voltage of the sensor. If high voltages are applied to the electrical leads a short circuit may occur, especially between protruding electrical leads 3 and the housing 4. A housing 4 made of an electrical insulator may be beneficial. Adopting a housing 4 made of metal oxide Figure 4 The sensor 1 with the housing 4 shown in FIG. 4 can be operated at voltages of up to 5 kV.

[0057] Figure 5 Shows Figure 1 Simplified cross section of a sensor 1 arranged in a socket 12 having a hole. The sensor element 2 is arranged in a second part 7 of the housing 4 protruding through the hole. Thus, the sensor 1 can measure properties of the outside of the socket 12 while maintaining the advantages given by the socket 12, such as reliable positioning and orientation of the sensor element. The socket 12 has an internal shape adapted to the external shape of the housing 4, which is shaped like a flat section 8. Thus, the arrangement complies with error-proofing and reduces errors such as wrong orientation during assembly. Moreover, there is little risk in replacing the sensor 1 or disassembling the arrangement for repairs.

[0058] Reference List

[0059] 1Sensor

[0060] 2Sensor element

[0061] 3 electrical leads

[0062] 4 Shell

[0063] 5. Silicone

[0064] 5a Silicone resin encapsulation

[0065] 5b Silicone filling

[0066] 6 Part 1

[0067] 7 Part 2

[0068] 8 flat segments

[0069] 9 grooves

[0070] 10 Kinks

[0071] 11. Solder

[0072] 12 sockets

Claims

1. A sensor (1), comprising: - sensor element (2); - electrical leads (3), The electrical leads (3) are connected to the sensor element (2), wherein the sensor element (2) is connected to the electrical leads (2) by lead-free solder (11); - a housing (4), The housing (4) has an opening and the sensor element (2) is arranged in the housing (4) so ​​that the electrical lead (3) protrudes through the opening, wherein the housing (4) is divided into two parts, including a first part (6) of the opening and a second part (7) opposite the opening and connected to the first part (6), and the second part (7) has an extension smaller than the extension of the first part (6) and the sensor element (2) is arranged in the second part (7) of the housing (4); as well as - Silicone (5), which fills the housing (4), so that the sensor element (2) and the electrical leads (3) are fixed in the housing (4).

2. The sensor (1) according to the preceding claim, Silicone (5) is a hard silicone material.

3. The sensor (1) according to claim 1, The sensor element (2) is encapsulated in a silicone (5) material, and The housing (4) is filled with the same silicone (5) material, and The encapsulated sensor element (2) is fixed to the housing (4) by means of the same silicone (5) material.

4. The sensor (1) according to the preceding claim, The solder (11) includes Sn-Cu or Sn-Ag-Cu (SAC) solder (11).

5. The sensor (1) according to claim 1, The housing (4) is made of metal oxide or ceramic.

6. The sensor (1) according to one of the preceding claims, The sensor element (2) is an NTC sensor element (2).

7. The sensor (1) according to one of the preceding claims, The wall thickness of the housing (4) is less than 2 mm.

8. The sensor (1) according to one of the preceding claims, The electrical lead (3) has a kink (10) in the portion located inside the housing (4).

9. The sensor (1) according to one of the preceding claims, The housing (4) is provided with two grooves (9) on the inner surface of the housing (4), in, The groove (9) extends from the opening along the longitudinal axis into the housing (4).

10. The sensor (1) according to one of the preceding claims, The outer shape of the housing (4) is radially asymmetric.

11. The sensor (1) according to the preceding claim, The housing (4) has a wall thickness in the second portion (7) that is smaller than the wall thickness in the first portion (6).

12. An arrangement comprising: - A sensor (1) according to one of the preceding claims - a socket (12), The socket (12) has an inner shape adapted to the outer shape of the sensor, and the sensor (1) is arranged in the socket.

13. An arrangement comprising: - A sensor (1) according to claim 10 or 11, - a socket (12), The socket (12) has a hole, which is greater in extension than the extension of the second portion (7), and, The sensor (1) is arranged in the socket (12) in such a way that the second part (7) of the sensor (1) protrudes through the hole.

14. The arrangement according to claim 12 or 13, further comprising: - Printed Circuit Board (PCB), The socket (12) is arranged on the PCB and the sensor (1) is electrically connected to the PCB.

15. An intelligent power meter comprising a sensor (1) according to one of claims 1 to 11 or an arrangement according to one of claims 12 to 14.

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