Optical element and temperature control method thereof

Abstract

The invention provides an optical element and a surface shape control method thereof, and relates to the field of optical devices, the optical element is used for reflecting laser emitted by a laser light source, and the optical element comprises a reflector body and a temperature control device; the semiconductor chilling plate contained in the cooling device in the optical element is used for cooling the reflecting mirror body, so that a light spot central area formed by laser in the reflecting surface can be cooled, and a light spot edge area formed by the laser in the reflecting surface can be heated by using the heating device; therefore, the heat of the reflecting surface area of the reflector body is uniformly distributed, and the temperature of the light spot area of the reflector body is automatically adjusted by using the transmitting power of the laser light source.

Description

Technical Field

[0001] The present invention relates to the field of optical devices, and in particular to an optical element and a temperature control method thereof. Background Art

[0002] For synchrotron radiation sources and free electron laser sources, due to the high demand for wavefront coherent transmission, high requirements are placed on the surface accuracy of optical components related to the light source. The surface shape of the reflector in the optical component is affected by many aspects during operation, such as optical processing, clamping, heat load, cooling and gravity. When the reflector absorbs high heat load, a temperature gradient will be generated on the reflector, resulting in thermal deformation of the mirror surface, which will have an adverse effect on the performance of the laser light source.

[0003] The existing technology mainly adopts a heating solution to compensate for the temperature of the reflector. By performing temperature compensation on the edge of the light spot in the reflector, the temperature of the edge of the light spot is kept consistent with the temperature of the center of the light spot. However, such a solution will keep the reflector in a high temperature working state for a long time, affecting the life of the reflector. The existing technology also adopts a cooling solution to compensate for the temperature of the reflector. However, the cooling solution in the existing technology is only for specific scenarios of specific laser light sources and cannot perform multi-degree-of-freedom control on the cooling process of the reflector surface.

[0004] It can be seen that in the prior art, in the temperature compensation process for the reflector spot area of ​​the synchrotron radiation light source and the free electron laser light source, there are still problems such as a single compensation mode and a low degree of automation of the compensation control means. Summary of the invention

[0005] The purpose of the present invention is to provide an optical element and a method for controlling its surface shape. The semiconductor refrigeration plate contained in a cooling device in the optical element can be used to cool the temperature of the reflector body, so that the central area of ​​the light spot formed by the laser in the reflecting surface can be cooled, and the edge area of ​​the light spot formed by the laser in the reflecting surface can be heated by a heating device, so that the heat of the reflecting surface area of ​​the reflector body is evenly distributed, and the temperature of the light spot area of ​​the reflector body can be automatically adjusted by using the emission power of the laser light source, thereby solving the problems existing in the prior art.

[0006] In a first aspect, an embodiment of the present invention provides an optical element, which is used to reflect laser light emitted by a laser light source, and the optical element includes: a reflector body and a temperature control device; wherein the reflector body is a rectangular parallelepiped structure, and a reflective surface is provided on one surface of the reflector body;

[0007] The temperature control device is arranged in the adjacent surface of the reflecting surface; the temperature control device includes a cooling device and a heating device; the heating device is arranged in the edge area of ​​the adjacent surface; the cooling device is arranged in the central area of ​​the adjacent surface;

[0008] The heating device includes an electric heating plate; the electric heating plate is fixed to a heating area of ​​an adjacent surface, and the heating area corresponds to an edge area of ​​a light spot in the reflecting surface; the electric heating plate heats the heating area of ​​the reflector body based on a heating instruction corresponding to the emission power of the laser light source;

[0009] The cooling device includes a semiconductor refrigeration plate; the semiconductor refrigeration plate is fixed in a refrigeration area of ​​an adjacent surface, and the refrigeration area corresponds to the center area of ​​the light spot in the reflecting surface; the semiconductor refrigeration plate cools down the refrigeration area of ​​the reflector body based on a refrigeration instruction corresponding to the emission power of the laser light source.

[0010] In one embodiment, the optical element further comprises a first water cooling device; wherein the first water cooling device is in contact with the temperature control device, and the temperature control device is between the reflector body and the first water cooling device;

[0011] The first water cooling device includes a first water cooling channel and a first cooling copper plate; the first cooling copper plate is a rectangular parallelepiped structure, and the first water cooling channel is a cylindrical tube structure. The first water cooling channel dissipates heat in the temperature control device through flowing coolant.

[0012] In one embodiment, the optical element further comprises a second water cooling device; wherein the second water cooling device is in contact with the reflector body, and the second water cooling device is arranged on the opposite side of the temperature control device;

[0013] The second water cooling device includes a second water cooling channel and a second cooling copper plate; the second cooling copper plate is a rectangular parallelepiped structure, and the second water cooling channel is a cylindrical tube structure. The second water cooling channel dissipates the heat in the reflector body through the flowing coolant.

[0014] In one embodiment, the second cooling copper plate is provided with a protrusion, and the protrusion is in contact with the reflector body through a heat-conducting medium.

[0015] In one embodiment, the reflector body is provided with a cooling groove, the cooling groove is filled with an indium gallium solution, and the protrusion is inserted into the indium gallium solution.

[0016] In one embodiment, a stress relief groove is further provided in the reflector body; the extension direction of the stress relief groove is the same as the extension direction of the light spot formed by the laser in the reflective surface.

[0017] In one embodiment, the temperature control device comprises a first indium sheet; the first indium sheet is arranged between the electric heating sheet and the heating area.

[0018] In one embodiment, the temperature control device comprises a second indium sheet; the second indium sheet is arranged between the semiconductor refrigeration sheet and the refrigeration area.

[0019] In one embodiment, a first control port is provided in the cooling device, and a second control port is provided in the heating device; the first control port and the second control port are both connected to the control end of the laser light source through a connecting line.

[0020] In a second aspect, an embodiment of the present invention provides a surface shape control method, which is applied to the optical element mentioned in the first aspect, the optical element is used to reflect the laser emitted by the laser light source; the optical element includes: a reflector body and a temperature control device; the temperature control device includes a cooling device and a heating device;

[0021] The method includes:

[0022] Obtain the emission power of the laser light source;

[0023] Determine a first calorific value of a center area of ​​a light spot in a reflector body and a second calorific value of an edge area of ​​the light spot based on the emission power; determine a cooling capacity of a semiconductor refrigeration plate in a temperature control device according to the first calorific value, and determine a heating capacity of an electric heating plate in the temperature control device according to the second calorific value;

[0024] Determine the cooling instruction of the semiconductor cooling sheet according to the cooling capacity, and determine the heating instruction of the electric heating sheet according to the heating capacity;

[0025] The semiconductor refrigeration plate is controlled by the cooling instruction to cool the reflector body, and the electric heating plate is controlled by the heating instruction to heat the reflector body, so that the temperature of the center area of ​​the light spot in the reflector body is kept consistent with that of the edge area of ​​the light spot.

[0026] An optical element and a surface shape control method thereof provided in an embodiment of the present invention, wherein the optical element is used for reflecting laser light emitted by a laser light source; the optical element comprises: a reflector body and a temperature control device; wherein the reflector body is a rectangular parallelepiped structure, and a reflective surface is arranged in one surface of the reflector body; the temperature control device is arranged in a surface adjacent to the reflective surface; the temperature control device comprises a cooling device and a heating device; the heating device is arranged in an edge area of ​​the adjacent surface; the cooling device is arranged in a central area of ​​the adjacent surface; the heating device comprises an electric heating plate; the electric heating plate is fixed in a heating area of ​​the adjacent surface, and the heating area corresponds to an edge area of ​​a light spot in the reflective surface; the electric heating plate heats the heating area of ​​the reflector body based on a heating instruction corresponding to the emission power of the laser light source; the cooling device comprises a semiconductor cooling plate; the semiconductor cooling plate is fixed in a cooling area of ​​the adjacent surface, and the cooling area corresponds to a central area of ​​a light spot in the reflective surface; the semiconductor cooling plate cools the cooling area of ​​the reflector body based on a cooling instruction corresponding to the emission power of the laser light source. When the optical element is used to reflect the laser emitted by the laser light source, the laser will form a light spot on the reflecting surface. The temperature of the central area of ​​the light spot is higher, and the temperature of the edge area is lower. Therefore, the temperature of the light spot area needs to be adjusted to keep its temperature consistent. Specifically, the emission power of the laser light source is obtained, and the first heating value of the central area of ​​the light spot in the reflector body and the second heating value of the edge area of ​​the light spot are determined based on the emission power. The cooling capacity of the semiconductor refrigeration plate in the temperature control device is determined according to the first heating value, and the heating capacity of the electric heating plate in the temperature control device is determined according to the second heating value. Then, the cooling instruction of the semiconductor refrigeration plate is determined according to the cooling capacity, and the heating instruction of the electric heating plate is determined according to the heating amount. The cooling instruction is used to control the semiconductor refrigeration plate to cool the reflector body, and the heating instruction is used to control the electric heating plate to heat the reflector body, so that the temperature of the central area of ​​the light spot and the edge area of ​​the light spot in the reflector body are kept consistent. This solution uses a semiconductor refrigeration plate contained in a cooling device in the optical element to cool the reflector body, which can cool the central area of ​​the light spot formed by the laser in the reflecting surface, and can use a heating device to heat the edge area of ​​the light spot formed by the laser in the reflecting surface, so that the heat in the reflecting surface area of ​​the reflector body is evenly distributed, and it realizes automatic adjustment and control of the temperature of the light spot area of ​​the reflector body by using the emission power of the laser light source.

[0027] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description, claims and drawings.

[0028] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 A schematic structural diagram of a first optical element provided by an embodiment of the present invention;

[0031] Figure 2 A schematic structural diagram of a second optical element provided by an embodiment of the present invention;

[0032] Figure 3 A schematic structural diagram of a third optical element provided by an embodiment of the present invention;

[0033] Figure 4 A flow chart of a surface shape control method provided by an embodiment of the present invention.

[0034] icon:

[0035] 10-reflector body; 11-reflecting surface; 12-stress relief groove; 20-temperature control device; 21-cooling device; 22-heating device; 23-first indium sheet; 24-second indium sheet;

[0036] 30-first water cooling device; 31-first water cooling channel; 32-first cooling copper plate;

[0037] 40 - second water cooling device; 41 - second water cooling channel; 42 - second cooling copper plate; 42a - protrusion; 10a - cooling groove. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution of the present invention will be clearly and completely described in combination with the embodiments below. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] For diffraction limit ring light sources or free electron laser light sources, due to the high demand for wavefront-related transmission, the surface shape of the reflector requires a height error RMS value of several nm and a slope error RMS value of less than 100 nrad; some even require a height error RMS value of sub-nm and a slope error RMS value of less than 50 nrad. Such a high-precision reflector surface shape is not only reflected in the processing technology, but also in the influence of temperature on the surface shape during operation.

[0040] Specifically, the mirror's surface shape during operation is affected by many factors, such as optical processing, clamping, thermal load, cooling, and gravity. When the mirror absorbs high thermal load, a temperature gradient will be generated on the mirror, resulting in thermal deformation of the mirror surface, which will eventually have an adverse effect on the performance of the laser light source.

[0041] The existing technology mainly adopts a heating solution to compensate for the temperature of the reflector. By performing temperature compensation on the edge of the light spot in the reflector, the temperature of the edge of the light spot is kept consistent with the temperature of the center of the light spot. However, such a solution will keep the reflector in a high temperature working state for a long time, affecting the life of the reflector. The existing technology also adopts a cooling solution to compensate for the temperature of the reflector. However, the cooling solution in the existing technology is only for specific scenarios of specific laser light sources and cannot perform multi-degree-of-freedom control on the cooling process of the reflector surface.

[0042] It can be seen that in the prior art, there are still problems of single compensation mode and low degree of automation of compensation control means in the temperature compensation process of the reflector spot area of ​​synchrotron radiation light source and free electron laser light source. Based on this, the present invention provides an optical element and its surface shape control method, wherein the semiconductor cooling plate contained in the cooling device of the optical element is used to cool down the reflector body, the center area of ​​the spot formed by the laser on the reflective surface can be cooled down, and the edge area of ​​the spot formed by the laser on the reflective surface can be heated up by the heating device, so that the heat of the reflective surface area of ​​the reflector body is evenly distributed, and the temperature of the spot area of ​​the reflector body is automatically adjusted by using the emission power of the laser light source, thereby solving the problems existing in the prior art.

[0043] To facilitate understanding of this embodiment, the first optical element disclosed in the embodiment of the present invention is first described in detail. The optical element is used to reflect the laser light emitted by the laser light source. Figure 1 As shown, the optical element includes: a reflector body 10 and a temperature control device 20; wherein the reflector body 10 is a rectangular parallelepiped structure, and a reflective surface 11 is provided on one surface of the reflector body 10; the laser emitted by the laser light source will form a light spot on the reflective surface.

[0044] The temperature control device 20 is arranged in the adjacent surface of the reflecting surface; the temperature control device 20 includes a cooling device 21 and a heating device 22; the heating device 22 is arranged in the edge area of ​​the adjacent surface; the cooling device 21 is arranged in the central area of ​​the adjacent surface;

[0045] The heating device 22 includes an electric heating plate; the electric heating plate is fixed to the heating area of ​​the adjacent surface, and the heating area corresponds to the edge area of ​​the light spot in the reflecting surface; the electric heating plate heats the heating area of ​​the reflector body based on the heating instruction corresponding to the emission power of the laser light source;

[0046] The cooling device 21 includes a semiconductor refrigeration plate; the semiconductor refrigeration plate is fixed in a refrigeration area of ​​an adjacent surface, and the refrigeration area corresponds to the center area of ​​the light spot in the reflecting surface; the semiconductor refrigeration plate cools down the refrigeration area of ​​the reflector body based on a refrigeration instruction corresponding to the emission power of the laser light source.

[0047] Specifically, the laser emitted by the laser light source forms a light spot in the reflecting surface 11 of the reflector body 10. The temperature of the central area of ​​the light spot is higher, and the temperature of the edge area is lower. The temperature of the central area of ​​the light spot is lowered by the cooling device 21, and the temperature of the edge area of ​​the light spot can be increased by the heating device 22, so that the temperature of the light spot area remains consistent, thereby making the deformation of the reflecting surface 11 consistent.

[0048] The cooling device 21 is used to take away the heat generated by the light spot of the reflector body 10, and the specific control process of heat dissipation is realized by a semiconductor refrigeration sheet, and its cooling is controlled according to the Peltier effect of the semiconductor refrigeration sheet. The cooling instruction of the semiconductor refrigeration sheet is generated based on the emission power of the laser light source. Since the temperature of the reflector body 10 will rise after the laser light source is irradiated on the reflecting surface 11, there is a specific corresponding relationship between the emission power of the laser light source and the temperature rise amplitude of the reflector body 10. The corresponding cooling requirement can be obtained by the temperature rise amplitude of the center area of ​​the light spot, so that the cooling instruction of the semiconductor refrigeration sheet can be determined, and automatic control is realized.

[0049] The heating device 22 is used to increase the temperature of the edge area of ​​the light spot of the reflector body 10, so that the temperature of the edge area of ​​the light spot is consistent with the temperature of the center area of ​​the light spot, and the temperature increase control process is achieved through the electric heating plate. The heating instruction of the electric heating plate is generated based on the emission power of the laser light source. Similarly, since the temperature of the reflector body 10 will increase after the laser light source is irradiated on the reflecting surface 11, there will be a specific corresponding relationship between the emission power of the laser light source and the temperature increase amplitude of the reflector body 10. The corresponding temperature increase requirement can be obtained through the temperature increase amplitude of the edge area of ​​the light spot, so that the heating instruction of the electric heating plate can be determined, and automatic control is achieved.

[0050] like Figure 2As shown in the side view and the front view (one side of the reflective surface), in one embodiment, the optical element further includes a first water cooling device 30; wherein the first water cooling device 30 is in contact with the temperature control device 20, and the temperature control device 20 is between the reflector body and the first water cooling device 30;

[0051] The first water cooling device 30 includes a first water cooling channel 31 and a first cooling copper plate 32; the first cooling copper plate 32 is a rectangular parallelepiped structure, and the first water cooling channel 31 is a cylindrical tube structure. The first water cooling channel 31 dissipates heat in the temperature control device 20 through flowing coolant.

[0052] In one embodiment, the optical element also includes a second water cooling device 40; wherein the second water cooling device 40 is in contact with the reflector body 10, and the second water cooling device 40 is arranged on the opposite side of the temperature control device 20; the second water cooling device 40 includes a second water cooling channel 41 and a second cooling copper plate 42; the second cooling copper plate 42 is a rectangular parallelepiped structure, and the second water cooling channel 41 is a cylindrical tube structure, and the second water cooling channel 41 dissipates the heat in the reflector body 10 through the flowing coolant.

[0053] In one embodiment, the second cooling copper plate 42 is provided with a protrusion 42 a , and the protrusion 42 a is in contact with the reflector body 10 through a heat-conducting medium.

[0054] In one embodiment, the reflector body 10 is provided with a cooling groove 10 a , the cooling groove 10 a is filled with an indium gallium solution, and the protrusion 42 a is inserted into the indium gallium solution.

[0055] like Figure 3 As shown, in one embodiment, a stress relief groove 12 is further provided in the reflector body; the extension direction of the stress relief groove 12 is the same as the extension direction of the light spot formed by the laser in the reflective surface.

[0056] In one embodiment, the temperature control device 20 comprises a first indium sheet 23, which is disposed between the electric heating sheet and the heating area. The temperature control device 20 comprises a second indium sheet 24, which is disposed between the semiconductor cooling sheet and the cooling area.

[0057] In one embodiment, a first control port is provided in the cooling device 21, and a second control port is provided in the heating device 22; the first control port and the second control port are both connected to the control end of the laser light source through a connecting line.

[0058] It can be seen that the optical element in the embodiment of the present application can cool the reflector body by using the semiconductor refrigeration plate included in the cooling device of the optical element, and can cool the central area of ​​the light spot formed by the laser in the reflecting surface, and can use the heating device to heat the edge area of ​​the light spot formed by the laser in the reflecting surface, so that the heat in the reflecting surface area of ​​the reflector body is evenly distributed.

[0059] like Figure 4 As shown, an embodiment of the present invention provides a surface shape control method, which is applied to the optical element mentioned in the above embodiment, and the optical element is used to reflect the laser emitted by the laser light source; the optical element includes: a reflector body and a temperature control device; the temperature control device includes a cooling device and a heating device;

[0060] like Figure 4 As shown, the method includes:

[0061] Step S401, obtaining the emission power of the laser light source;

[0062] Step S402, determining a first calorific value of a center area of ​​the light spot in the reflector body and a second calorific value of an edge area of ​​the light spot based on the transmission power; determining a cooling capacity of a semiconductor refrigeration plate in a temperature control device according to the first calorific value, and determining a heating capacity of an electric heating plate in the temperature control device according to the second calorific value;

[0063] Step S403, determining a cooling instruction of the semiconductor cooling plate according to the cooling capacity, and determining a heating instruction of the electric heating plate according to the heating capacity;

[0064] Step S404, using a cooling instruction to control the semiconductor cooling plate to cool the reflector body, and using a heating instruction to control the electric heating plate to heat the reflector body, so that the temperature of the center area of ​​the light spot and the edge area of ​​the light spot in the reflector body remain consistent.

[0065] In actual scenarios, the cooling capacity of the semiconductor refrigeration chip is Q c ; Calculated by the following formula:

[0066]

[0067] Among them, Q c is the cooling capacity; I is the current value; S is the temperature difference electromotive force; T C is the cold end temperature of the semiconductor refrigeration chip; R is the total thermal resistance; K is the heat transfer coefficient of the semiconductor refrigeration chip; ΔT is the hot end T of the semiconductor refrigeration chip h With cold end T c The temperature difference of R is the voltage on both sides of the semiconductor cooling chip.

[0068] Specifically, the thermoelectric emf Total thermal resistance Heat transfer coefficient Among them, U max ,I max , ΔT max are the maximum voltage, maximum current and maximum temperature difference at that temperature.

[0069] It can be seen that the surface shape control method cools down the reflector body through the semiconductor cooling plate contained in the cooling device of the optical element, and can cool down the central area of ​​the light spot formed by the laser in the reflecting surface, and can use the heating device to heat the edge area of ​​the light spot formed by the laser in the reflecting surface, so that the heat of the reflecting surface area of ​​the reflector body is evenly distributed, and the laser light source emission power is used to automatically adjust the temperature of the light spot area of ​​the reflector body, thereby solving the problems of single compensation mode and low degree of automation of compensation control means in the prior art.

[0070] The optical element in the embodiment of the present invention has the same implementation principle and technical effects as those in the aforementioned optical element embodiment. For the sake of brief description, for matters not mentioned in the device embodiment, reference may be made to the corresponding contents in the aforementioned optical element embodiment.

[0071] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0072] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0073] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0074] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a non-volatile computer-readable storage medium that is executable by a processor. Based on this understanding, the technical solution of the present invention can essentially or in other words, the part that contributes to the prior art or the part of the technical solution can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in each embodiment of the present invention. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0075] Finally, it should be noted that the above-described embodiments are only specific implementations of the present invention, which are used to illustrate the technical solutions of the present invention, rather than to limit them. The protection scope of the present invention is not limited thereto. Although the present invention is described in detail with reference to the above-described embodiments, ordinary technicians in the field should understand that any technician familiar with the technical field can still modify the technical solutions recorded in the above-described embodiments within the technical scope disclosed by the present invention, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. An optical element, characterized in that: The optical element is used to reflect the laser light emitted by the laser light source, and the optical element comprises: a reflector body and a temperature control device; wherein the reflector body is a rectangular parallelepiped structure, and a reflective surface is provided on one surface of the reflector body; The temperature control device is arranged in the adjacent surface of the reflecting surface; the temperature control device comprises a cooling device and a heating device; the heating device is arranged in the edge area of ​​the adjacent surface; the cooling device is arranged in the central area of ​​the adjacent surface; The heating device comprises an electric heating plate; the electric heating plate is fixed to a heating area of ​​the adjacent surface, and the heating area corresponds to an edge area of ​​the light spot in the reflecting surface; the electric heating plate heats the heating area of ​​the reflector body based on a heating instruction corresponding to the emission power of the laser light source; The cooling device includes a semiconductor refrigeration plate; the semiconductor refrigeration plate is fixed in a refrigeration area of ​​the adjacent surface, and the refrigeration area corresponds to the central area of ​​the light spot in the reflecting surface; the semiconductor refrigeration plate cools the refrigeration area of ​​the reflector body based on a refrigeration instruction corresponding to the emission power of the laser light source.

2. The optical element according to claim 1, characterized in that The optical element further comprises a first water cooling device; wherein the first water cooling device is in contact with the temperature control device, and the temperature control device is between the reflector body and the first water cooling device; The first water cooling device includes a first water cooling channel and a first cooling copper plate; the first cooling copper plate is a rectangular parallelepiped structure, the first water cooling channel is a cylindrical tube structure, and the first water cooling channel dissipates heat in the temperature control device through flowing coolant.

3. The optical element according to claim 1, characterized in that The optical element further includes a second water cooling device; wherein the second water cooling device is in contact with the reflector body, and the second water cooling device is arranged on the opposite side of the temperature control device; The second water cooling device includes a second water cooling channel and a second cooling copper plate; the second cooling copper plate is a rectangular parallelepiped structure, the second water cooling channel is a cylindrical tube structure, and the second water cooling channel dissipates the heat in the reflector body through flowing coolant.

4. The optical element according to claim 3, characterized in that The second cooling copper plate is provided with a protrusion, and the protrusion is in contact with the reflector body through a heat-conducting medium.

5. The optical element according to claim 4, characterized in that The reflector body is provided with a cooling groove, the cooling groove is filled with an indium gallium solution, and the protrusion is inserted into the indium gallium solution.

6. The optical element according to claim 1, characterized in that A stress relief groove is also provided in the reflector body; the extension direction of the stress relief groove is the same as the extension direction of the light spot formed by the laser on the reflective surface.

7. The optical element according to claim 1, characterized in that The temperature control device comprises a first indium sheet; the first indium sheet is arranged between the electric heating sheet and the heating area.

8. The optical element according to claim 1, characterized in that The temperature control device comprises a second indium sheet; the second indium sheet is arranged between the semiconductor refrigeration sheet and the refrigeration area.

9. The optical element according to claim 1, characterized in that The cooling device is provided with a first control port, and the heating device is provided with a second control port; the first control port and the second control port are both connected to the control end of the laser light source through a connecting line.

10. A surface shape control method, characterized in that: The method is applied to the optical element according to any one of claims 1 to 9, wherein the optical element is used to reflect laser light emitted by a laser light source; The optical element comprises: a reflector body and a temperature control device; the temperature control device comprises a cooling device and a heating device; The method comprises: Obtaining the emission power of the laser light source; Determine a first calorific value of a center area of ​​a light spot in the reflector body and a second calorific value of an edge area of ​​the light spot based on the emission power; determine a cooling capacity of a semiconductor refrigeration plate in the temperature control device according to the first calorific value, and determine a heating capacity of an electric heating plate in the temperature control device according to the second calorific value; Determining a cooling instruction of the semiconductor cooling plate according to the cooling capacity, and determining a heating instruction of the electric heating plate according to the heating capacity; The semiconductor refrigeration plate is controlled by the cooling instruction to cool the reflector body, and the electric heating plate is controlled by the heating instruction to heat the reflector body, so that the temperature of the center area of ​​the light spot and the edge area of ​​the light spot in the reflector body remain consistent.

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