Hard disk storage systems, servers and computer equipment

Abstract

The present invention provides a hard disk storage system, a server, and a computer device, and relates to the field of hard disk storage technology. The hard disk storage system includes: a first mainboard, a second mainboard, a backplane, and an E3 hard disk, the first mainboard is connected to the backplane via a first high-density connector, the second mainboard is connected to the backplane via a second high-density connector, and the E3 hard disk is connected to the backplane via a hard disk connector, wherein the hard disk connector is located between the first high-density connector and the second high-density connector. The hard disk storage system, the server, and the computer device provided by the present invention, the first mainboard and the second mainboard are each connected to the backplane using a high-density connector, and the E3 hard disk is connected to the backplane via a hard disk connector. By arranging the hard disk connector between the first high-density connector and the second high-density connector, the connection position of the first high-density connector and the second high-density connector on the backplane will not interfere with the hard disk connector, ensuring that both the E3 hard disk and the mainboard can be installed on the backplane.

Description

Technical Field

[0001] The present invention relates to the field of hard disk storage technology, and in particular to a hard disk storage system, a server and a computer device. Background Art

[0002] Centralized storage typically consists of multiple controllers to improve system availability and load sharing through parallel processing, thereby improving overall system processing performance. Multiple controllers are typically connected to the backplane via high-density connectors. For dual-controller models, the motherboard and backplane are connected using high-density connectors. The mounting holes of the high-density connectors on the backplane conflict with the pins of the hard drive connectors, resulting in a lack of suitable placement for the E3 hard drive connectors. Summary of the Invention

[0003] The present invention provides a hard disk storage system, a server and a computer device, which are used to solve the defect in the prior art that the hard disk connector of an E3 hard disk in the hard disk storage system interferes with the high-density connector when they are installed on a backplane.

[0004] In a first aspect, the present invention provides a hard disk storage system, comprising: a first mainboard, a second mainboard, a backplane and an E3 hard disk, wherein the first mainboard is connected to the backplane via a first high-density connector, the second mainboard is connected to the backplane via a second high-density connector, and the E3 hard disk is connected to the backplane via a hard disk connector, wherein the hard disk connector is located between the first high-density connector and the second high-density connector.

[0005] The first mainboard and the second mainboard are each connected to the backplane using a high-density connector, and the E3 hard drive is connected to the backplane through the hard drive connector. By arranging the hard drive connector between the first high-density connector and the second high-density connector, the connection positions of the first high-density connector and the second high-density connector on the backplane will not interfere with the hard drive connector, ensuring that both the E3 hard drive and the mainboard can be installed on the backplane.

[0006] According to a hard disk storage system provided by the present invention, the backplane has a first high-density connector male head and a second high-density connector male head, the first mainboard has a first high-density connector female head, the second mainboard has a second high-density connector female head, the first high-density connector male head is crimped to the first high-density connector female head, and the second high-density connector male head is crimped to the second high-density connector female head. The first high-density connector male head and the first high-density connector female head, as well as the second high-density connector male head and the second high-density connector female head, are connected by crimping. Electrical connection is achieved by mechanical cooperation between the high-density connector male head and the high-density connector female head. Compared with the traditional welding method, the crimping connection method can ensure the consistency and high density of electronic products.

[0007] According to a hard disk storage system provided by the present invention, the first high-density connector male head and the second high-density connector male head are both perpendicular to the backplane. The first high-density connector male head and the second high-density connector male head are arranged perpendicular to the backplane to facilitate docking of the first high-density connector male head and the second high-density connector male head.

[0008] According to a hard disk storage system provided by the present invention, the E3 hard disk has a connection structure, the first end of the hard disk connector is connected to the backplane, and the second end of the hard disk connector is connected to the connection structure.

[0009] According to a hard disk storage system provided by the present invention, the second end of the hard disk connector and the connection structure are located on the same horizontal plane.

[0010] According to a hard disk storage system provided by the present invention, the hard disk connector includes a first connecting section, an intermediate section, and a second connecting section. The first connecting section, the intermediate section, and the second connecting section are sequentially connected. The first connecting section and the second connecting section both extend horizontally. The first connecting section is connected to the backplane, and the second connecting section is connected to the E3 hard disk.

[0011] The first connecting section and the second connecting section are arranged parallel to each other, wherein the middle section forms an obtuse angle with the first connecting section, and the second connecting section forms an obtuse angle with the middle section;

[0012] The end of the first connecting section away from the middle section is connected to the back plate by crimping;

[0013] The end of the second connecting section away from the middle section is connected to the E3 hard disk by crimping.

[0014] According to a hard disk storage system provided by the present invention, the hard disk connector is provided with a fixing hole, and a fastener is passed through the fixing hole to fixedly connect the back plate and the hard disk connector.

[0015] According to a hard disk storage system provided by the present invention, a metal spring is provided at one end of the hard disk connector connected to the E3 hard disk, and the metal spring is an integrated structure with the crimping pin inside the hard disk connector.

[0016] In a second aspect, the present invention further provides a server comprising the hard disk storage system as described in the first aspect.

[0017] In a third aspect, the present invention further provides a computer device comprising the server as described in the second aspect.

[0018] In the hard disk storage system, server, and computer equipment provided by the present invention, the first mainboard and the second mainboard are each connected to the backplane using a high-density connector, and the E3 hard disk is connected to the backplane via the hard disk connector. By arranging the hard disk connector between the first high-density connector and the second high-density connector, the connection positions of the first high-density connector and the second high-density connector on the backplane will not interfere with the hard disk connector, ensuring that both the E3 hard disk and the mainboard can be installed on the backplane. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the present invention or the prior art, a brief introduction is given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 It is a structural diagram of the hard disk storage system provided by the present invention.

[0021] Reference numerals:

[0022] 11. First motherboard; 12. Second motherboard; 20. Backplane; 311. First high-density female connector; 312. First high-density male connector; 321. Second high-density female connector; 322. Second high-density male connector; 40. Hard disk connector; 50. E3 hard disk; 51. Connection structure. DETAILED DESCRIPTION

[0023] To make the objectives, technical solutions, and advantages of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0024] The terms "first" and "second" in the specification and claims of the present invention may explicitly or implicitly refer to one or more of the features. In the description of the present invention, unless otherwise specified, "plurality" means two or more. Furthermore, the term "and / or" in the specification and claims refers to at least one of the connected entities, and the character " / " generally indicates an "or" relationship between the connected entities.

[0025] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0026] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0027] E3 hard drives include E3.S hard drives and E3.L hard drives. Taking the E3.S hard drive as an example, the shape of the E3.S hard drive is similar to that of the U.2 hard drive, and traditional servers can more easily transition to the E3 form through compatible design. The E3.S has two thickness specifications of 7.5mm and 16.8mm, and can be installed vertically in a 2U server or horizontally in a 1U server. The thickness of the U.2 hard drive is 15mm. In a traditional 2U server, the maximum number of front-mounted U.2 hard drives is 24; the thickness of the E3.S / 2T is 16.8mm, and the number of E3.S / 2Ts that can be placed in a 2U server is 23. The E3.S / 1T can have up to 46 hot-swappable positions, and its density advantage is quite obvious.

[0028] In a 1U chassis, E3.S drives need to be placed horizontally. A 16.8mm E3.S drive can hold 10 in a 1U chassis, the same number as a U.2 drive. A 7.5mm E3.S drive can hold 20, double the number of U.2 drives. With the advent of PCIe 5.0, the bandwidth, performance, and electrical characteristics of U.2 and M.2 drives are no longer sufficient, making the switch to E3 an inevitable trend.

[0029] To this end, an embodiment of the present invention provides a hard disk storage system including an E3 hard disk. Figure 1 The hard disk storage system of the present invention is described.

[0030] An embodiment of the present invention provides a hard disk storage system, such as Figure 1 As shown, it includes a first mainboard 11, a second mainboard 12, a backplane 20, and an E3 hard drive 50. The first mainboard 11 is connected to the backplane 20 via a first high-density connector, the second mainboard 12 is connected to the backplane 20 via a second high-density connector, and the E3 hard drive 50 is connected to the backplane 20 via a hard drive connector 40. The hard drive connector 40 is located between the first high-density connector and the second high-density connector.

[0031] The hard disk storage system includes two main boards, a first main board 11 and a second main board 12, wherein the main boards integrate the main circuit systems of the computer equipment. For example, electrical components such as the BIOS chip and the I / O control chip are installed on the main board. Optionally, the first main board 11 is the main control board, and the second main board 12 is the backup control board. When the main control board is operating normally, the backup control board is in standby mode. Therefore, through the mutual cooperation of the first main board 11 and the second main board 12, when the main control board fails, it automatically switches to the backup control board, ensuring the continuity and stability of the system. In some cases, the first main board 11 and the second main board 12 can work in parallel to jointly process business and data, thereby improving the overall performance of the system.

[0032] The first mainboard 11 is connected to the backplane 20 via a first high-density connector, and the second mainboard 12 is connected to the backplane 20 via a second high-density connector. High-density connectors have a large number of pins and inherently high density characteristics. Therefore, in a compact space, high-density connectors can realize the layout of multiple connection points, improving connection efficiency and space utilization. Optionally, the first high-density connector and the second high-density connector adopt a contact probe structure, which can be completed without applying force during insertion and removal, simplifying the operation process. In addition, the mainboard and the backplane are connected using a high-density connector, which can have lower crosstalk and attenuation during signal transmission, thereby improving signal stability and accuracy.

[0033] like Figure 1 As shown, the first high-density connector and the second high-density connector are located on the first side of the backplane 20, and the hard disk connector 40 is connected to the second side of the backplane 20, wherein the hard disk connector 40 is located between the first high-density connector and the second high-density connector, so that the connection position of the first high-density connector and the backplane 20, the connection position of the second high-density connector and the backplane 20, and the connection position of the hard disk connector 40 and the backplane 20 are staggered on the backplane 20, ensuring that the connection position of the first high-density connector and the second high-density connector on the backplane 20 will not interfere with the connection between the hard disk connector 40 and the backplane 20.

[0034] It is understandable that the hard disk storage system can have multiple E3 hard disks 50, with multiple E3 hard disks 50 stacked and arranged, each E3 hard disk 50 connected to the backplane 20 via a hard disk connector 40. The connection point between each hard disk connector 40 and the backplane 20 is located between two high-density connectors. In one embodiment, the connection points between the multiple hard disk connectors 40 and the backplane 20 are at the same height, thereby forming a single row of multiple hard disk connectors 40. In another embodiment, the hard disk connectors 40 installed on adjacent E3 hard disks 50 are staggered, thereby forming two, three, or more rows of multiple hard disk connectors 40, with multiple hard disk connectors 40 in the same row at the same height and hard disk connectors 40 in different rows at different heights. This is sufficient as long as the connection point between each hard disk connector 40 and the backplane 20 is between two high-density connectors.

[0035] The hard drive connector 40 is either a 1C connector or a 2C connector. A 1C connector is one that complies with the SFF-TA-1002 standard and supports the x4 PCIe interface. It offers flexibility, supports multiple configurations, and maintains the robustness of the SFF-TA-1002 standard, ensuring excellent signal integrity during high-speed data transmission. Optionally, the 1C connector is an EDSFF 1C connector, a connector specification based on the Enterprise and Data Center SSD Form Factor (EDSFF) standard. This connector provides enterprises and data centers with higher capacity, scalability, performance, and heat dissipation for SSD solutions. A 2C connector is one that complies with the SFF-TA-1002 standard and supports the x8 PCIe interface. During installation, select the appropriate hard drive connector 40 based on the specific interface configuration of the connection structure 51 on the E3 hard drive 50.

[0036] In the hard disk storage system provided by an embodiment of the present invention, the first main board 11 and the second main board 12 are each connected to the backplane 20 using a high-density connector, and the E3 hard disk 50 is connected to the backplane 20 through the hard disk connector 40. By arranging the hard disk connector 40 between the first high-density connector and the second high-density connector, the connection positions of the first high-density connector and the second high-density connector on the backplane 20 will not interfere with the hard disk connector 40, ensuring that the E3 hard disk 50 and the main board can both be installed on the backplane 20.

[0037] like Figure 1As shown, the backplane 20 has a first high-density connector male head 312 and a second high-density connector male head 322, the first mainboard 11 has a first high-density connector female head 311, and the second mainboard 12 has a second high-density connector female head 321. The first high-density connector male head 312 is docked with the first high-density connector female head 311, and the second high-density connector male head 322 is docked with the second high-density connector female head 321.

[0038] The first high-density connector male connector 312 and the second high-density connector male connector 322 are spaced apart along the same horizontal plane of the backplane 20. The first mainboard 11 and the second mainboard 12 are connected to the two high-density connector male connectors in a one-to-one correspondence. Optionally, the first high-density connector male connector 312 and the second high-density connector male connector 322 have the same structure.

[0039] Among them, the structures of the first high-density connector and the second high-density connector can be the same or different. Among them, the first high-density connector includes four pairs of pins, which is suitable for applications that need to transmit four groups of differential signals or four independent signals. Alternatively, the first high-density connector includes six pairs of pins, which has more signal transmission capabilities and is suitable for scenarios that need to transmit six groups of differential signals or six independent signals, etc. with higher density signal transmission. Similarly, the second high-density connector includes four pairs of pins, which is suitable for applications that need to transmit four groups of differential signals or four independent signals. Alternatively, the second high-density connector includes six pairs of pins, which has more signal transmission capabilities and is suitable for scenarios that need to transmit six groups of differential signals or six independent signals, etc. with higher density signal transmission. Of course, the first high-density connector and the second high-density connector can also use high-density connectors with other numbers of pins as needed.

[0040] Optionally, the first high-density female connector 311 is connected to the first mainboard 11 using a press-fit process, so that the high-speed signals of the first mainboard 11 are transmitted to the backplane 20 through the cooperation of the first high-density female connector 311 and the first high-density male connector 312. Similarly, the second high-density female connector 321 is connected to the second mainboard 12 using a press-fit process, so that the high-speed signals of the second mainboard 12 are transmitted to the backplane 20 through the cooperation of the second high-density female connector 321 and the second high-density male connector 322.

[0041] Based on the above embodiment, the first high-density connector male head 312 is crimped to the first high-density connector female head 311 , and the second high-density connector male head is crimped to the second high-density connector female head 321 .

[0042] In an optional embodiment, the first high-density connector male head 312 and the second high-density connector male head 322 are pins, and the first high-density connector female head 311 and the second high-density connector female head 321 are jacks. The pins are inserted into the jacks to achieve electrical connection between the high-density connector male head and the high-density connector female head. In another optional embodiment, the first high-density connector male head 312 and the second high-density connector male head 322 are jacks, and the first high-density connector female head 311 and the second high-density connector female head 321 are pins. Optionally, the pins are rigid pins or elastically deformable pins, and the jacks are metallized holes. After the pins are inserted into the jacks, a close contact point is formed between the pins and the metallized holes, and electrical interconnection is achieved by mechanical connection.

[0043] In the hard disk storage system provided by an embodiment of the present invention, the first high-density connector male head 312 and the first high-density connector female head 311, as well as the second high-density connector female head 321 and the second high-density connector male head 322 are connected by crimping, thereby achieving electrical connection through the mechanical fit of the high-density connector male head and the high-density connector female head. Compared with the traditional welding method, the crimping connection method can adapt to the requirements of electronic products for consistency and high density.

[0044] In addition, the structures of the first high-density connector male connector 312 and the second high-density connector male connector 322 can also be different. For example, one of the first high-density connector male connector 312 and the second high-density connector male connector 322 is a socket and the other is a pin; correspondingly, one of the first high-density connector female connector 311 and the second high-density connector female connector 321 is a socket and the other is a socket. As long as the first high-density connector male connector 312 and the first high-density connector female connector 311 are compatible, the second high-density connector male connector 322 and the second high-density connector female connector 321 can also be compatible.

[0045] Optionally, the first high-density connector male head 312 and the second high-density connector male head 322 are both perpendicular to the backplane 20. Figure 1 As shown, the backplane 20 is a vertical plate, which is vertically arranged between the mainboard and the E3 hard disk 50.

[0046] In addition, the backplane 20 can also be an L-shaped plate, including a horizontal plate and a vertical plate. The first mainboard 11 and the second mainboard 12 are both connected to the vertical plate, and the E3 hard disk 50 is connected to the other side of the vertical plate. The horizontal plate is used to be fixed in the box structure of the server.

[0047] The first mainboard 11 and the second mainboard 12 are arranged in parallel, and correspondingly, the first high-density connector female head 311 and the second high-density connector female head 321 are arranged in parallel. The first high-density connector male head 312 and the second high-density connector male head 322 are arranged perpendicular to the surface of the backplane 20, so that the first high-density connector male head 312 and the second high-density connector male head 322 are both vertically arranged on the backplane 20, and the second high-density connector male head 322 is arranged vertically on the backplane 20 to facilitate docking with the second high-density connector female head 321. When the first high-density connector female head 311 and the first high-density connector male head 312 are press-fitted together, the first high-density connector male head 312, which is vertically arranged on the backplane 20, is conveniently press-fitted with the first high-density connector female head 311, and the second high-density connector male head 322, which is vertically arranged on the backplane 20, is conveniently press-fitted with the second high-density connector female head 321.

[0048] The E3 hard disk 50 has a connection structure 51 . A first end of the hard disk connector 40 is connected to the backplane 20 , and a second end of the hard disk connector 40 is connected to the connection structure 51 .

[0049] The connection structure 51 is used to connect to the hard disk connector 40. In the case of multiple E3 hard disks 50, each E3 hard disk 50 is provided with a connection structure 51. The multiple connection structures 51 are spaced apart along the length direction of the backplane 20, and each connection structure 51 can be connected to a hard disk connector 40.

[0050] During installation, multiple E3 hard drives 50 are placed in a one-to-one correspondence with multiple hard drive connectors 40. The number of connection structures 51 is the same as the number of hard drive connectors 40. The connection locations of different hard drive connectors 40 and the backplane 20 are staggered vertically to facilitate installation of the hard drive connectors 40. Alternatively, the connection locations of different hard drive connectors 40 and the backplane 20 are arranged along the same vertical line of the backplane 20.

[0051] When the connection positions of multiple hard disk connectors 40 and the backplane 20 are staggered vertically to form multiple rows. For example, the connection positions of multiple hard disk connectors 40 and the backplane 20 are staggered vertically to form two rows. At this time, when installing the first E3 hard disk 50, the connection structure 51 of the E3 hard disk 50 can be connected to the end of the hard disk connector 40 in the top row; when installing the second E3 hard disk 50, the connection structure 51 of the second E3 hard disk 50 can be connected to the end of the hard disk connector 40 in the second row; the second E3 hard disk 50 here refers to the E3 hard disk 50 adjacent to the first E3 hard disk 50. The hard disk connector 40 in the second row refers to the hard disk connector 40 adjacent to the hard disk connector 40 in the top row and located at the first position in the second row. Similarly, when installing the third E3 hard disk 50, the connection structure 51 of the third E3 hard disk 50 can be connected to the end of the hard disk connector 40 in the second position in the top row. When installing the fourth E3 hard disk 50, the connection structure 51 of the fourth E3 hard disk 50 can be connected to the end of the hard disk connector 40 located in the second position of the second row. This process can be deduced by analogy until all E3 hard disks 50 are connected to the hard disk connectors 40.

[0052] Preferably, the connection structures 51 are arranged in the same manner and position on multiple E3 hard disks 50. During installation, there is no need to distinguish the E3 hard disks 50, which can avoid errors in the installation of multiple E3 hard disks 50 and improve the accuracy and efficiency of assembly.

[0053] If there are multiple E3 hard drives 50, they are arranged along the length of the backplane 20. Space is reserved on the backplane 20 for heat dissipation holes in the area between adjacent E3 hard drives 50 to dissipate heat from the motherboard. Specifically, if there are multiple E3 hard drives 50, multiple hard drive connectors 40 are provided. To facilitate installation, the hard drive connectors 40 installed on two adjacent E3 hard drives 50 are staggered vertically, thereby forming multiple rows of hard drive connectors 40 along the height of the backplane 20. The hard drive connectors 40 in each row are arranged at the same height. Along the height of the backplane 20, the overlapping portion of the hard drive connectors 40 in two adjacent rows can be less than half the height of a single hard drive connector 40. Alternatively, the overlapping portion can be half the height of a single hard drive connector 40, or slightly greater than half the height of a single hard drive connector 40, or other values. The specific value is determined based on actual conditions and is not further described here.

[0054] By staggering the upper and lower adjacent rows of hard disk connectors 40, the height dimension occupied by the two rows of hard disk connectors 40 in the height direction of the back panel 20 can be further reduced, and the two adjacent rows of hard disk connectors 40 can be further partially overlapped in the height direction of the back panel 20, further reducing the height dimension occupied by the two rows of hard disk connectors 40 in the height direction of the back panel 20, so as to achieve the installation of more hard disk connectors 40 while ensuring the spacing distance between the two adjacent hard disk connectors 40 to reserve space for setting heat dissipation holes.

[0055] It should be noted that in this specific embodiment, the upper and lower adjacent rows of hard disk connectors 40 have overlapping parts in the height direction of the back panel 20, and the upper and lower adjacent rows of hard disk connectors 40 are staggered. This arrangement will squeeze the space used to set up the heat dissipation holes. Therefore, the overlapping dimensions of the upper and lower adjacent rows of hard disk connectors 40 in the height direction of the back panel 20 need to be strictly calculated and determined based on actual conditions.

[0056] In one embodiment, the spacing between adjacent rows of hard drive connectors 40 is the same. Specifically, the spacing between adjacent hard drive connectors 40 in the upper row is equal to the spacing between adjacent hard drive connectors 40 in the lower row. Heat dissipation holes are provided in the area between adjacent hard drive connectors 40 on the backplane 20 to ensure adequate heat dissipation from the first and second main boards 11 and 12. Therefore, the spacing between adjacent hard drive connectors 40 should not be too small. The specific spacing is determined based on actual conditions and will not be elaborated upon here.

[0057] In this embodiment, the spacing between adjacent hard drive connectors 40 in each row is the same, ensuring a neat and even distribution of the hard drive connectors 40. This ensures that the spacing between adjacent hard drive connectors 40 is the same, facilitating the provision of evenly distributed heat dissipation holes, thereby evenly dissipating heat from all parts of the first and second mainboards 11, 12. Furthermore, during the installation of E3 hard drives 50, the spacing between adjacent E3 hard drives 50 can be made the same, improving the neatness of the installation process.

[0058] In a specific embodiment, the offset size of the two adjacent rows of hard disk connectors 40 is half of the distance between the two adjacent hard disk connectors 40; the hard disk connector 40 in the lower row is just located in the middle position between the two adjacent hard disk connectors 40 in the upper row. During the actual installation of the E3 hard disk 50, the spacing sizes between the two adjacent hard disk connectors 40 can be ensured to be the same, which facilitates the setting of evenly distributed heat dissipation holes to ensure uniform heat dissipation of various parts of the controller; at the same time, during the installation of the E3 hard disk 50, the spacing sizes between the two adjacent E3 hard disks 50 can be made the same, thereby improving the integrity of the installation process of the E3 hard disk 50.

[0059] The heat dissipation holes are provided between two adjacent hard disk connectors 40. For example, two rows of hard disk connectors 40 are provided on the back panel 20, and the two rows of hard disk connectors 40 are centrally arranged, and heat dissipation holes are provided between two adjacent hard disk connectors 40 in the two rows of hard disk connectors 40. The heat dissipation holes between two adjacent hard disk connectors 40 in the upper row of hard disk connectors 40 can be used to dissipate heat for the first mainboard 11, and the heat dissipation holes 6 between two adjacent hard disk connectors 40 in the lower row of hard disk connectors 40 can be used to dissipate heat for the second mainboard 12, so that the first mainboard 11 and the second mainboard 12 can achieve uniform heat dissipation.

[0060] It should be noted that when the number of hard disk connectors 40 is other values, the size of the hard disk connector 40 in the length direction of the back panel 20 can be shortened so that two rows of hard disk connectors 40 can be set at the same height position of the back panel 20. Of course, multiple hard disk connectors 40 can also be stacked and set, which depends on the actual situation.

[0061] The back plate 20 is provided with heat dissipation holes that penetrate through the thickness direction of the back plate 20. The heat dissipation holes are used to dissipate heat for the first main board 11 and the second main board 12. In this specific embodiment, since the hard disk connector 40 is arranged in the middle position in the height direction of the back plate 20, the heat dissipation holes are also arranged in the middle position in the height direction of the back plate 20, so that the first main board 11 and the second main board 12 arranged above and below can dissipate heat evenly.

[0062] Specifically, the shapes and dimensions of the heat dissipation holes are identical. For example, the heat dissipation holes may be square, oval, circular, polygonal, or other shapes that meet the requirements. The specific shape is determined based on actual conditions and is not detailed here. Of course, the shapes and dimensions of the heat dissipation holes may only partially be identical. For example, some heat dissipation holes may be circular, while others may be square or oval. In another example, some heat dissipation holes may be circular with an aperture diameter of R1, while others may be circular with an aperture diameter of R2, with R1 and R2 being different sizes.

[0063] Optionally, the second end of the hard drive connector 40 and the connecting structure 51 are located at the same horizontal plane, facilitating connection between the hard drive connector 40 and the E3 hard drive 50. Each E3 hard drive 50 is provided with a connecting structure 51. For multiple E3 hard drives 50, multiple connecting structures 51 are provided in a one-to-one correspondence with multiple hard drive connectors 40, and the corresponding connecting structures 51 are located at the same horizontal plane as the second end of the hard drive connector 40. It is understood that the connecting structure 51 and the second end of the hard drive connector 40 can also be located at different horizontal planes. In this case, a transfer structure can be provided at the end of the E3 hard drive 50 to ensure that the second end of the hard drive connector 40 and the connecting structure 51 are aligned at the same horizontal plane. If there are multiple E3 hard drives 50, only some of the connecting structures 51 of the E3 hard drives 50 can be aligned at the same horizontal plane as the second end of the corresponding hard drive connector 40, while the remaining connecting structures 51 are aligned at the same horizontal plane via the transfer structure.

[0064] In one embodiment, the hard drive connector 40 is curved and includes a first connecting end, a middle section, and a second connecting section, which are sequentially connected. The first connecting section connects to the backplane 20, and the second connecting section connects to the E3 hard drive 50. The middle section forms an obtuse angle with the first connecting section, and the second connecting section forms an obtuse angle with the middle section. In this case, the first connecting section is perpendicular to the backplane 20, enabling direct connection to the backplane 20. The second connecting section is on the same horizontal plane as the connecting structure 51, facilitating direct docking.

[0065] Specifically, the connection structure 51 is a gold finger. It should be noted that, when there are multiple E3 hard disks 50, the connection structures 51 of the multiple E3 hard disks 50 are all gold fingers, or the connection structures 51 of some E3 hard disks 50 are gold fingers.

[0066] Specifically, a gold finger is provided at the end of the E3 hard drive 50 as a connection structure 51. The gold finger includes multiple golden conductive contacts. Gold fingers are formed by electroplating a layer of gold onto a copper-clad laminate. Gold's strong oxidation resistance protects the internal circuitry from corrosion, and its strong electrical conductivity prevents signal loss. Gold also exhibits exceptional ductility, which, under appropriate pressure, allows for a larger contact area between contacts, thereby reducing contact resistance and improving signal transmission efficiency. In this embodiment of the present invention, the gold finger meets the SFF-TA-1002 1C specification. Using gold fingers ensures better signal quality between the E3 hard drive 50 and the backplane 20.

[0067] In combination with the previous embodiment, the gold finger and the end of the hard disk connector 40 are located at the same horizontal plane. In the case where the hard disk connector 40 is bent and includes a first connecting end, a middle section, and a second connecting section connected in sequence, the second connecting section and the gold finger are located at the same horizontal plane, facilitating direct docking.

[0068] In one embodiment, the hard drive connector 40 includes a first connecting section, a middle section, and a second connecting section, which are sequentially connected. The first connecting section is connected to the backplane 20, and the second connecting section is connected to the E3 hard drive 50. The middle section forms an obtuse angle with the first connecting section, and the second connecting section forms an obtuse angle with the middle section.

[0069] The first connecting segment has a connector at one end away from the middle segment, and the second connecting segment has a connector at one end away from the middle segment. The connector is a pin or socket structure. The connector at the end of the first connecting segment is used to connect to the backplane 20, and the connector at the end of the second connecting segment is used to connect to the E3 hard drive 50.

[0070] The middle section can be a flexible connecting line. For example, the middle section includes a flexible body and rigid structures disposed at both ends of the flexible body. One rigid structure is connected to the first connecting section, and the other rigid structure is connected to the second connecting section. The rigid structures enhance the connection strength between the first and second connecting sections. Accordingly, the angle between the first connecting section and the middle section refers to the angle between the first connecting section and the length of the flexible body; the angle between the second connecting section and the middle section refers to the angle between the second connecting section and the length of the flexible body.

[0071] In an optional embodiment, the first connecting section and the second connecting section are both connecting heads, and reinforcing ribs are respectively provided at both ends of the middle section. The reinforcing ribs improve the connection strength between the connecting head and the middle section, thereby improving the bending resistance and durability of the entire hard disk connector. Correspondingly, the angle between the first connecting section and the middle section refers to the angle between the connecting head forming the first connecting section and the extension direction of the reinforcing rib; the angle between the second connecting section and the middle section refers to the angle between the connecting head forming the second connecting section and the extension direction of the reinforcing rib. In another optional embodiment, hard rings are respectively provided at the connection between the middle section and the first connecting section and at the connection between the middle section and the second connecting section, and the hard rings are used to prevent the connection from breaking.

[0072] The hard drive connector 40 is curved and comprises a first connecting section, a middle section, and a second connecting section, which are sequentially connected. It should be noted that the first and second connecting sections extend horizontally and are arranged in parallel, making it easier to connect the first connecting section to the upright backplane 20 and the second connecting section to the E3 hard drive 50.

[0073] It should be noted that the hard disk connector 40 may include other connecting segments in addition to the first connecting segment, the middle segment and the second connecting segment, as long as the first connecting segment and the second connecting segment are arranged in parallel and extend in the horizontal direction.

[0074] In one embodiment, the hard disk connector 40 is connected to the backplane 20 by crimping. The connection position of the hard disk connector 40 and the backplane 20 is staggered with the connection position of the high-density connector and the backplane 20. The hard disk connector 40 can be connected to the backplane 20 by crimping.

[0075] Optionally, the first and second connecting segments have the same interface configuration, and the interface opening direction of the first and second connecting segments is the same. During installation, it is possible to connect one connecting segment to the backplane 20 and the other connecting segment to the E3 hard drive 50 without distinguishing between the first and second connecting segments. Thus, by setting the interfaces of the first and second connecting segments to the same configuration, the need to distinguish between the first and second connecting segments during installation, which can affect installation efficiency, is avoided.

[0076] Specifically, electrical sockets are provided at the ends of the first connecting section and the second connecting section, and electrical pins are provided on the backplane 20 and the E3 hard drive 50. The electrical pins are inserted into the corresponding electrical sockets to achieve the connection between the first connecting section and the backplane 20, and the connection between the second connecting section and the E3 hard drive 50. Alternatively, electrical pins are provided at the ends of the first connecting section and the second connecting section, and electrical sockets are provided on the backplane 20 and the E3 hard drive 50. The connection between the electrical sockets and the electrical pins achieves the press-fit connection between the hard drive connector 40 and the backplane 20, and the press-fit connection between the hard drive connector 40 and the E3 hard drive 50.

[0077] In addition, the end interface of the first connecting segment and the end interface of the second connecting segment can also be different in form. For example, the end interface of the first connecting segment is an electrical pin, and the end interface of the second connecting segment is an electrical jack. Alternatively, the end interface of the first connecting segment is an electrical jack, and the end interface of the second connecting segment is an electrical pin. By setting different forms of end interfaces, the first connecting segment and the second connecting segment can be distinguished. During installation, the first connecting segment and the second connecting segment are distinguished according to the different forms of end interfaces set. The first connecting segment is connected to the backplane 20 and the second connecting segment is connected to the E3 hard drive 50.

[0078] The hard disk storage system provided by an embodiment of the present invention improves the convenience of installation by crimping the first high-density connector male head with the first high-density connector female head, and the second high-density connector male head with the second high-density connector female head. At the same time, the signal communication quality between the first mainboard 11 and the second mainboard 12 and the backplane 20 can be improved by crimping.

[0079] In order to improve the stability of the connection between the hard disk connector 40 and the back plate 20 , the hard disk connector 40 is provided with a fixing hole, and a fastener is passed through the fixing hole to fix the back plate 20 and the hard disk connector 40 together.

[0080] Optionally, the fixing holes are screw holes, and the fasteners are screws, which pass through the screw holes to connect the backplate 20 to the hard disk connector 40. For example, the end interface of the hard disk connector 40 is an electrical pin, and the outer shell of the electrical pin has a lug with a fixing hole provided on the lug. When the hard disk connector 40 is connected to the backplate 20, the electrical pin is inserted into the electrical jack. At the same time, the outer shell of the electrical pin is connected to the backplate 20 through the fixing hole by screws or other fasteners, thereby stably connecting the backplate 20 and the hard disk connector 40 together and preventing external vibration from loosening the connection between the backplate 20 and the hard disk connector 40.

[0081] That is, a fixing hole is provided outside the interface of one end of the first connecting section away from the middle section, so as to enhance the stability of the connection between the first connecting section and the back plate 20 by means of the fixing hole.

[0082] Optionally, there are multiple fixing holes, evenly spaced along the circumference of the hard disk connector 40, and multiple fasteners are installed in corresponding fixing holes in a one-to-one correspondence, thereby fastening the hard disk connector 40 to the backplane 20 and improving the uniformity of the force distribution between the hard disk connector 40 and the backplane 20. For example, the end shell of the hard disk connector 40 has an outer edge circumferentially, and the multiple fixing holes are spaced along the outer edge. Alternatively, the end of the hard disk connector 40 has multiple lugs, each of which has a fixing hole.

[0083] The hard disk storage system provided by the embodiment of the present invention improves the stability of the connection between the backplane 20 and the hard disk connector 40 by adding a fixing hole to the hard disk connector 40 and using a fastener provided through the fixing hole. Furthermore, the fastening effect of the fastener can also maintain the stability of the signal transmission quality between the hard disk connector 40 and the backplane 20, preventing the connection between the hard disk connector 40 and the backplane 20 from becoming loose due to external vibration and affecting the signal transmission quality.

[0084] As described above, the end of the E3 hard drive 50 connected to the hard drive connector 40 is a gold finger-shaped connection structure 51. Correspondingly, the end of the hard drive connector 40 connected to the E3 hard drive 50 is provided with a metal spring. The metal spring and the crimping pin inside the hard drive connector 40 are an integrated structure.

[0085] Specifically, one end of the hard disk connector 40 connected to the E3 hard disk 50 is the second connecting section. In order to adapt to the gold finger at the end of the E3 hard disk 50, a metal spring adapted to the gold finger is set at the end interface of the second connecting section. The metal spring is an integrated structure with the crimping pin inside the hard disk connector 40 to improve the signal quality.

[0086] If the metal shrapnel and the crimping pins are provided separately, the connection between the metal shrapnel and the crimping pins is prone to loosening or improper assembly, affecting the quality of signal transmission. In the case of a large number of E3 hard drives 50, it is difficult to locate the fault location and maintenance is inconvenient. In the hard drive storage system provided by the embodiment of the present invention, the metal shrapnel provided at the end of the hard drive connector 40 and the crimping pins inside the hard drive connector 40 are integrated into a structure. Compared with the method of providing the metal shrapnel and the crimping pins separately, it can avoid signal transmission interruption and improve the stability and effectiveness of signal transmission.

[0087] The connection end of the hard disk connector 40 and the E3 hard disk 50 meets the definition of SFF-TA-1002 specification. Among them, the E3 hard disk 50 is a hard disk that meets the E3.S and E3.L definitions of SFF-TA-1002 specification.

[0088] The hard disk storage system provided by an embodiment of the present invention includes a first mainboard 11, a second mainboard 12, a backplane 20, and an E3 hard disk 50. The first mainboard 11 is provided with a first high-density female connector 311, which mates with a first high-density male connector 312 provided on the backplane 20; the second mainboard 12 is provided with a second high-density female connector 321, which mates with a second high-density male connector 322 provided on the backplane 20. The connection position between the hard disk connector 40 and the backplane 20 is located between the first high-density male connector 312 and the second high-density male connector 322, so that the high-density connector and the hard disk connector are staggered to avoid interference when connected to the backplane 20.

[0089] Specifically, the hard drive connector 40 is curved and includes a first connecting section, a middle section, and a second connecting section, which are connected in sequence. The first connecting section is connected to the backplane 20, and the second connecting section is connected to the E3 hard drive 50. The first and second connecting sections are parallel, and the second connecting section and the connecting structure 51 provided on the E3 hard drive 50 are located on the same horizontal plane to facilitate docking. Optionally, the connecting structure 51 is a gold finger, and a metal spring is provided at the end of the second connecting section away from the middle section to cooperate with the gold finger. This metal spring is integrated with the crimping pins inside the hard drive connector 40.

[0090] Among them, the hard disk connector 40 and the E3 hard disk 50 are connected by crimping, and the first mainboard 11 and the backplane 20 as well as the second mainboard 12 and the backplane 20 are connected by crimping respectively, which improves the convenience of installation and communication quality.

[0091] In addition to the above-mentioned hard disk storage system, the present invention also provides a server including the hard disk storage system disclosed in the above-mentioned embodiment. For the structures of other parts of the server, please refer to the prior art and will not be described in detail herein.

[0092] In a specific embodiment, the server includes a housing structure and the aforementioned hard disk storage system disposed within the housing structure. Specifically, the hard disk storage system can be detachably disposed within the housing structure. For example, the hard disk storage system can be fastened to the housing structure using screws, or the hard disk storage system can be secured to the housing structure using a plug-in structure such as a snap. Other connection methods between the hard disk storage system and the housing structure are also possible, depending on actual circumstances and not detailed here.

[0093] In one embodiment, the server further includes a power supply unit, and the first mainboard 11 and the second mainboard 12 are both electrically connected to the power supply unit, so that the first mainboard 11 and the second mainboard 12 are powered by the power supply unit.

[0094] The server provided by an embodiment of the present invention adopts the above-mentioned hard disk storage system, and the first mainboard 11 and the second mainboard 12 are respectively connected to the backplane 20 through a high-density connector, and the E3 hard disk 50 is connected to the backplane 20 through the hard disk connector 40. The connection position of the hard disk connector 40 and the backplane 20 is located between the first high-density connector and the second high-density connector, thereby avoiding pin conflicts between the high-density connector and the hard disk connector, and ensuring that the hard disk connector 40 can be installed in a suitable position.

[0095] In addition to the above-mentioned server, the present invention also provides a computer device including the server disclosed in the above-mentioned embodiment. For the structures of other parts of the computer device, please refer to the prior art and will not be described in detail herein.

[0096] In a specific embodiment, the computer device includes a display, an external input device and the above-mentioned server. The server can be a separate structure, or the server and the display can be set as an integrated structure. The specific structure is determined according to actual conditions and will not be elaborated here.

[0097] In a specific embodiment, the computer device further includes a radiator for dissipating heat from the first mainboard 11 and the second mainboard 12. The computer device further includes a graphics card, and the radiator includes a first radiator and a second radiator. The first radiator is for dissipating heat from the first mainboard 11 and the second mainboard 12, and the second radiator is for dissipating heat from the graphics card. The first radiator and the second radiator can be cooling fans, heat pipe radiators, or water-cooled radiators.

[0098] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A hard disk storage system, characterized in that: include: A first main board, a second main board, a backplane and an E3 hard drive, wherein the first main board is connected to the backplane via a first high-density connector, the second main board is connected to the backplane via a second high-density connector, and the E3 hard drive is connected to the backplane via a hard drive connector, wherein the first high-density connector and the second high-density connector are located on the first side of the backplane, the hard drive connector is connected to the second side of the backplane, and the hard drive connector is located between the first high-density connector and the second high-density connector, so that the connection position of the first high-density connector and the backplane, the connection position of the second high-density connector and the backplane, and the connection position of the hard drive connector and the backplane are staggered on the backplane.

2. The hard disk storage system according to claim 1, wherein: The backplane has a first high-density connector male head and a second high-density connector male head, the first mainboard has a first high-density connector female head, and the second mainboard has a second high-density connector female head. The first high-density connector male head is crimped to the first high-density connector female head, and the second high-density connector male head is crimped to the second high-density connector female head.

3. The hard disk storage system according to claim 2, wherein: The first high-density connector male head and the second high-density connector male head are both perpendicular to the backplane.

4. The hard disk storage system according to claim 1, wherein: The E3 hard disk has a connection structure, a first end of the hard disk connector is connected to the backplane, and a second end of the hard disk connector is connected to the connection structure.

5. The hard disk storage system according to claim 4, wherein: The second end of the hard disk connector and the connecting structure are located on the same horizontal plane.

6. The hard disk storage system according to claim 1, 4 or 5, characterized in that: The hard drive connector includes a first connecting section, a middle section, and a second connecting section. The first connecting section, the middle section, and the second connecting section are connected in sequence. The first connecting section and the second connecting section both extend horizontally. The first connecting section is connected to the backplane, and the second connecting section is connected to the E3 hard drive. The first connecting section and the second connecting section are arranged parallel to each other, wherein the middle section forms an obtuse angle with the first connecting section, and the second connecting section forms an obtuse angle with the middle section; The end of the first connecting section away from the middle section is connected to the back plate by crimping; The end of the second connecting section away from the middle section is connected to the E3 hard disk by crimping.

7. The hard disk storage system according to claim 1, wherein: The hard disk connector is provided with a fixing hole, and a fastener is passed through the fixing hole to fix the back plate and the hard disk connector.

8. The hard disk storage system according to claim 1 or 7, characterized in that: A metal spring is provided at one end of the hard disk connector connected to the E3 hard disk, and the metal spring and the crimping pin inside the hard disk connector are an integrated structure.

9. A server, characterized in that: Comprising the hard disk storage system according to any one of claims 1 to 8.

10. A computer device, characterized in that: Comprising the server as claimed in claim 9.

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