Wafer non-destructive composite ultrasonic cleaning system and its working and regulation method

Abstract

A wafer non-destructive composite ultrasonic cleaning system and its working and regulation method, the data processing and analysis module (10) adjusts the working state of the transduction module (4) in time according to the ultrasonic cavitation effect and cleaning liquid working condition in the water tank (7) collected by the sound wave collection module (5) and the water pressure collection module (8) in real time; the data processing and analysis module solves the problem that the cavitation negative pressure in the wafer cleaning process is difficult to regulate according to the ultrasonic cavitation effect and cleaning liquid working condition in the water tank collected by the sound wave collection module and the water pressure collection module in real time, and overcomes the defect that the cleaning power is difficult to determine in the traditional ultrasonic cleaning device. At the same time, the damage to the microstructure of the wafer caused by the traditional cleaning method is avoided, the purity of the wafer surface is ensured, and the performance and structure of the transistor are not damaged. The steady-state cavitation intensity and transient cavitation intensity of the cavitation generated by the transduction module ultrasonic cleaning are measured, so that the transduction module is in the best working state.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of devices specially adapted for handling wafers during the manufacture or treatment of semiconductor or electrical solid state devices or components, under the IPC classification H01L21 / 67, and more particularly relates to a technique for ultrasonic cleaning of wafers that significantly improves the process and reduces processing damage. BACKGROUND

[0002] A wafer is a basic material used in the production of silicon semiconductor circuits, and its raw material is silicon. The wafer, also known as a silicon chip or silicon wafer, is formed by dissolving high-purity polycrystalline silicon into a silicon crystal seed and then slowly pulling it out to form a cylindrical single-crystal silicon. After grinding, polishing, slicing, and other processes, a silicon wafer, i.e., a wafer, is finally formed.

[0003] During the production of integrated circuits, semiconductor wafers often need to go through multiple process steps, such as thin film deposition, etching, polishing, etc., and these steps often produce various contaminants. If these contaminants are not removed in time, they can cause circuit short circuits, open circuits, and other problems, seriously affecting the quality and yield of integrated circuits. The cleanliness of the wafer surface directly determines the performance and reliability of the final product.

[0004] The reduction in size of nanostructures and the stacking of different crystal layers leads to a decrease in the mechanical strength of the material, making it more susceptible to external stress, and the hetero-interface can cause local stress concentration; this makes the wafer cleaning need to meet higher requirements, not only to ensure the purity of the wafer surface, but also to ensure that the performance and structure of the transistor are not damaged.

[0005] Traditional wafer cleaning methods include chemical cleaning, ultrasonic cleaning, and water washing, etc. These methods have some obvious limitations; chemical cleaning or jet cleaning may leave chemical residues on the wafer surface, which can negatively affect the performance of semiconductor devices, especially on micro-nano scale wafers.

[0006] The application of ultrasonic technology can be roughly divided into two categories: one that requires relatively large or considerable power, which uses the characteristics of ultrasonic reflection, refraction, bunching, and direction to achieve the power application of objects or changes in objects, called power ultrasound, and the other that uses ultrasonic information collection to obtain information application, called detection ultrasound. The application of power ultrasound technology is very extensive. Wafer ultrasonic cleaning is a kind of power ultrasound technology. Ultrasonic cleaning does not require the use of a large amount of chemical reagents, reducing environmental pollution and wastewater treatment costs. Ultrasonic cleaning is a non-contact cleaning method that does not cause significant physical damage or scratches to the wafer surface.

[0007] Most of the generators currently used in the ultrasonic cleaning industry work in an open-loop mode, that is, the output parameters of the ultrasonic generator cannot change with changes in the cleaning environment. Especially for the changes in the temperature, level of the cleaning liquid in the cleaning tank, and the cleaning solvent itself, the overall load changes. This will cause a big difference in the output power of the ultrasonic generator, resulting in unstable cleaning effect. For example:

[0008] Chinese patent application CN202210988411.0 discloses a groove type ultrasonic cleaning device for semiconductor wafer processing, which modifies the vibration of the internal connecting piece, but does not modify the vibration received by the annular connecting seat. The two vibrations converge at high efficiency due to the inconsistency of the vibrations, so that the parts of the wafer in the two different vibrations can be cleaned by different ultrasonic vibrations, and the vibration at the intersection is more violent due to the complete difference in the direction of the two vibrations, so that the vibration at the intersection disturbs the water body more violently, thereby cleaning the surface of the wafer more thoroughly. However, this method uses the high energy generated by the collision of the sound waves of the ultrasonic vibration when the sound waves converge to wash and clean the wafer, and the disturbance of the water body during the cleaning process is not easy to control. The cleaning effect of the wafer is not good in the part with small disturbance degree; too large disturbance degree may damage the microstructure of the wafer and cause deformation of the wafer structure, affecting the performance of the wafer.

[0009] Chinese patent application CN202111622810.7 proposes a megasonic emission device for wafer cleaning and an acoustic cleaning system. The device includes a shell, a transducer device; the transducer device is connected to the inner wall of the shell away from the oscillator side, and a gap is provided between the transducer device and the oscillator, so that the transducer device and the oscillator do not fall off. However, this method has too many transducer devices and shells, and is subject to the walls of the container. The scattering and reflection of the ultrasonic waves by the walls affect the actual ultrasonic wave intensity and waveform.

[0010] There are many improved technologies, among which, for example, most of the methods for realizing non-destructive cleaning of devices using ultrasonic cleaning mainly add different structures to selectively remove non-perpendicular ultrasonic / megasonic energy.

[0011] Including but not limited to:

[0012] Chinese patent application 202210153983.7 discloses a system and method for measuring the cavitation intensity of an ultrasonic cleaning transducer. The system includes an ultrasonic cleaning transducer for ultrasonic cleaning; a measuring water tank for placing the ultrasonic cleaning transducer; a signal source for outputting a single-frequency continuous signal to the ultrasonic cleaning transducer and causing the ultrasonic cleaning transducer to output an ultrasonic signal at low power; a power amplifier for amplifying the signal from the signal source; a hydrophone for scanning and measuring the sound pressure on a line perpendicular to the center of the ultrasonic cleaning transducer's radiating surface; a motion control system for controlling the movement of the hydrophone; and a data acquisition and analysis system for signal acquisition and data analysis.

[0013] Separately, Chinese patent application CN201610740883.9 discloses a non-damaging ultrasonic / megasonic cleaning device for patterned wafers. The device comprises an ultrasonic / megasonic generating mechanism and a bottom quartz component, positioned in close proximity within a sealed housing cavity. The device selectively removes ultrasonic / megasonic energy whose propagation direction is not perpendicular to the wafer surface through a quartz micro-resonance cavity array. Furthermore, the distance between the bottom quartz sheet and the patterned wafer surface is dynamically varied to evenly distribute the ultrasonic / megasonic energy on the patterned wafer surface. This allows for uniform, non-damaging cleaning of any area within the entire patterned wafer within a given cleaning time. However, while the aforementioned patent utilizes a quartz micro-resonance cavity array to selectively remove ultrasonic / megasonic energy that is not perpendicular to the wafer surface, while this helps reduce damage to the patterned wafer, it also results in the loss of some ultrasonic energy. This can reduce overall cleaning efficiency, requiring the device to generate higher initial energy to compensate for this loss, thereby increasing energy consumption. While the design aims to remove ultrasonic / megasonic energy that is not perpendicular to the wafer surface, physical limitations in actual operation may prevent the device from completely eliminating this energy. This unremoved wave energy can create interference effects on the wafer surface, increasing unnecessary energy loss and potentially causing uneven cleaning. While the non-destructive cleaning device may be optimized for a specific type or size of patterned wafer, due to the diversity of wafer patterns and materials, the device may not provide accurate cleaning results in all cases. For example, varying wafer surface characteristics such as roughness and material hardness can lead to variations in cleaning results, making it impossible for the same device to accurately clean all wafer types. Summary of the Invention

[0014] The present application aims to solve the above problems and technical needs, and proposes a wafer non-destructive composite ultrasonic cleaning system and its working and regulation method, aiming to solve the problem of difficult regulation of cavitation negative pressure in the wafer cleaning process, overcome the defect that the cleaning power is not easy to determine in the traditional ultrasonic cleaning device, improve the cleaning efficiency, avoid the damage to the microstructure of the wafer caused by the traditional cleaning method, ensure the purity of the wafer surface, and ensure that the performance and structure of the transistor are not damaged.

[0015] Therefore, the present application provides a wafer non-destructive composite ultrasonic cleaning system, which comprises an ultrasonic wave generating module, a sound wave collecting module, a clamping support, a water tank, a water pressure collecting module, a data processing and analysis module, a cleaning liquid management module and a control module. The ultrasonic wave generating module comprises a power oscillation module, a signal amplification module, an impedance matching module and a transduction module. The transduction module is arranged on one side of the water tank, and the water pressure collecting module is arranged on the opposite side of the water tank. The clamping support is arranged on the upper side of the water tank. The transduction module is connected to the control module through the sound wave collecting module and the data processing and analysis module in sequence. The control module is connected to the transduction module in series through the power oscillation module, the signal amplification module and the impedance matching module in sequence for signal transmission and conversion. The cleaning liquid management module is installed on the outer wall of the water tank. The lower end of the clamping support extends into the water tank. The data processing and analysis module adopts a cavitation noise spectrum analysis method to timely regulate the working state of the transduction module according to the ultrasonic cavitation effect in the water tank and the cleaning liquid working condition collected by the sound wave collecting module and the water pressure collecting module, and the cleaning effect of the wafer surface clamped by the lower end of the clamping support. The ultrasonic wave generating module is also provided with a digital-to-analog converter DAC and a voltage-controlled oscillator VCO. The working process comprises:

[0016] 1) Inject cleaning liquid into the water tank, and clamp the wafer using the clamping support;

[0017] 2) Submerge the wafer below the liquid surface of the cleaning liquid, and adjust the part to be cleaned of the wafer to the side of the transduction module emitting sound waves;

[0018] 3) The power oscillation module sends an electrical signal with a preset voltage to the signal amplification module and the impedance matching module. After amplification by the signal amplifier and impedance matching, the high-focusing ultrasonic sensor of the transduction module receives and converts the signal into a specific frequency sound signal;

[0019] 4) The transduction module emits sound signals and causes ultrasonic cavitation in the cleaning liquid, thereby realizing ultrasonic cavitation cleaning of the wafer surface.

[0020] The power oscillation module comprises an input unit for setting the power and frequency working range of the power oscillation module, a control unit for adjusting the output frequency of the PWM signal according to the instruction input by the input unit, a power generation unit for power amplification and inversion of the PWM signal output by the control unit, and a matching unit for receiving the electric signal output by the power generation unit and converting the electric signal into ultrasonic waves; the input unit, the control unit, the power generation unit and the matching unit are electrically connected in sequence; in addition, the power oscillation module further comprises a sampling unit, the input end of the sampling unit is electrically connected with the matching unit, and the output end of the sampling unit is electrically connected with the control unit; after the power oscillation module is started, the instruction containing the preset values of the output power, the frequency, the start and stop information of the generator of the power oscillation module is input by the input unit; then, the control unit receives the start signal and adjusts the middle frequency of the frequency range and transmits the PWM signal to the power generation unit according to the instruction input by the input unit; the power generation unit transmits the signal into the matching unit through power amplification and inversion; the matching unit and the cleaning tank form a resonant circuit to generate ultrasonic waves for cleaning; meanwhile, the current and voltage signals of the matching unit are collected by the sampling unit, and the corresponding power value is obtained through the multiplier and fed back to the control unit; the control unit collects the feedback power value through the AD port and compares it with the input power of the input unit; if the two values are not equal, the control unit adjusts the output PWM frequency; the input power is gradually approached through the adjustment of the PWM frequency and the comparison of the input power and the actual power, and finally the constant power output is realized; it should be noted that the maximum range of the PWM frequency adjustment is the frequency range input by the input unit; the sampling unit comprises a current transformer, a voltage transformer and a multiplier circuit; the current transformer collects the current signal of the matching unit and inputs the current signal into the multiplier circuit; the voltage transformer collects the voltage signal of the matching unit and inputs the voltage signal into the multiplier circuit; the multiplier obtains the corresponding power value according to the current signal and the voltage signal and feeds back the power value to the control unit; the input unit comprises function buttons and a display; the function buttons are connected with the I / O port of the control unit; the display communicates with the control unit through the SPI bus; the power generation unit comprises a half-bridge inverter circuit composed of MOS tubes and MOSFETs; the matching unit comprises a resonant circuit composed of an inductor and a transducer; and the control unit is a single-chip microcomputer.

[0021] The cleaning liquid management module comprises a liquid level sensor and a liquid supplementing system, and is used for monitoring and adjusting the liquid level of the cleaning liquid in real time; the cleaning liquid management module comprises, in sequence, a liquid storage unit, a concentration liquid level detection unit, a control unit and an execution unit; the liquid storage unit is used for storing the cleaning liquid; the concentration liquid level detection unit is used for detecting the concentration and liquid level of the cleaning liquid in the liquid storage unit and transmitting the detected concentration data and liquid level data to the control unit; the control unit is used for generating a corresponding control signal according to the concentration data and liquid level data and sending the control signal to the execution unit; and the execution unit is used for performing the discharge of the cleaning liquid in the liquid storage unit, the supplement of the chemical agent in the liquid storage unit, the supplement of water in the liquid storage unit, the replacement of the cleaning liquid in the liquid storage unit, the recovery of the cleaning liquid in the reaction cavity and the liquid supply to the reaction cavity according to the control signal.

[0022] The data processing and analysis module is used for receiving real-time data from the sound wave acquisition module and the water pressure acquisition module, processing and analyzing the sound wave and pressure data by using the built-in algorithm of the control module, feeding back the state in the cleaning process in real time, automatically sending a control instruction to the control module, adjusting the voltage and frequency parameters of the sound wave emitting device and ensuring the cleaning effect; the data processing and analysis module is used for signal acquisition and data analysis, and the harmonic noise level of the corresponding harmonic generated by cavitation is calculated in the form of line spectrum extraction by analyzing the cavitation noise spectrum; the data processing and analysis module comprises a peak detection circuit, a low-peak coupling compensation circuit and a feedback amplitude modulation circuit; the peak detection circuit detects the signal in the Internet of Things data transmission channel in real time; when the peak value is less than the lower limit standard signal of 0.5V, the low-peak signal enters the low-peak coupling compensation circuit and is subjected to difference operation with the upper limit standard signal of +5V and is coupled into the peak detection circuit; when the peak value is higher than or equal to the upper limit standard signal of +5V, the three-stage step-by-step conduction circuit composed of the triodes Q1, Q2 and Q3 is step-by-step conducted; the step-by-step conduction of the triodes can change the amplification multiple of the proportional amplification circuit with AR3 as the core; and the standard signal of 0.5V to +5V is output after the voltage stabilization of the voltage stabilization circuit.

[0023] The control module is composed of a PLC or an embedded controller, can automatically adjust the operation of the power oscillation module, the sound wave acquisition module, the water pressure acquisition module, the cleaning liquid management module and the clamping support according to the collected sound wave, pressure and liquid level data, automatically adjusts the voltage, frequency and gain of the control module control system through real-time feedback to adapt to different cleaning conditions and requirements, and ensures the efficiency and stability of the cleaning process.

[0024] Further, to achieve the above-mentioned purpose, the application is provided as:

[0025] Especially, the sound wave acquisition module is a multi-point acquisition device, which simultaneously acquires and analyzes the sound pressure and sound wave signals of multiple points.

[0026] Especially, the clamping support is equipped with a position sensor and an electric actuator, which automatically adjusts the position of the clamping support to ensure that the wafer surface is in the best cleaning area.

[0027] Especially, the signal amplification module includes an automatic gain control function, and the amplification multiple is adjusted by the control module; the signal amplification module structure includes a signal amplifier and a power supply module, the power supply module is electrically connected with the signal amplifier, the power supply module includes a power adapter and a battery, the power adapter is electrically connected with two external power sources at the same time, the battery is electrically connected with the power adapter, and the power adapter is provided with a storage circuit and a switching switch for switching the two external power sources. The switching switch can switch the two external power sources, so that when one of the external power sources fails to supply power, the other external power source can continue to supply power to the signal amplifier, and when both of the external power sources cannot supply power at the same time, the storage circuit supplies power to the signal amplifier in the first time, and then the battery continues to supply power to the signal amplifier, so that the signal amplifier always maintains a normal use state without interruption time, and the use of the signal amplification device is more reliable.

[0028] Especially, the transducer module has temperature compensation and automatic calibration functions, which can automatically adjust under different environmental conditions to ensure accurate conversion and emission of sound signals; the transducer module receives different period electric signals, converts them into corresponding frequency sound signals and emits them; a high-focus ultrasonic sensor is arranged in the transducer module, and the high-focus ultrasonic sensor has an outer diameter of 64mm and a focal length of 63.2mm.

[0029] In particular, the impedance matching module includes three varactor diodes and at least one PI-type circuit with a fixed inductor; the varactor diodes perform impedance adjustment according to a bias voltage.

[0030] In particular, the acoustic wave acquisition module has an automatic pressure calibration function, which can automatically calibrate the pressure sensor according to the characteristics of the cleaning fluid; the acoustic wave acquisition module has waveform analysis and intelligent filtering functions, which can automatically adjust under different environmental conditions to ensure the accurate conversion and emission of acoustic signals; the acoustic wave acquisition module has the function of collecting acoustic signals and outputting acoustic signal waveforms; the acoustic wave acquisition module is a multi-point acquisition device, which simultaneously collects and analyzes the sound pressure and acoustic wave signals of multiple points.

[0031] The cleaning and control methods of the wafer non-destructive composite ultrasonic cleaning system include:

[0032] (a) A cleaning method comprising the following steps:

[0033] (1) Pour cleaning fluid into the water tank, use a clamping bracket to clamp the wafer, and monitor the cleaning fluid level in real time through the cleaning fluid management module. The module detects the cleaning fluid level through a liquid level sensor. When the liquid level is lower than the set value, the control system automatically triggers the refill system to maintain the cleaning fluid at an appropriate level;

[0034] (2) Immerse the wafer in the cleaning liquid and adjust the portion of the wafer to be cleaned to the side where the transducer emits sound waves. Through the automatic positioning of the clamping bracket, the position sensor detects the size and position of the wafer, and the control system automatically adjusts the height and angle of the clamping bracket based on the feedback, so that the wafer surface is always located in the optimal cleaning area;

[0035] (3) The sound wave generating device emits an electrical signal of a preset voltage, which is amplified and impedance matched by the signal amplifying device, and then received by the transducer device and converted into an acoustic signal of a specific frequency. The sound wave generating device emits an electrical signal of a preset voltage according to the instructions of the control system. The signal is amplified by the signal amplifying device, and after the signal transmission is optimized by the impedance matching device, it is transmitted to the transducer device for acoustic signal conversion. The control system monitors the feedback signals from the sound wave collecting device and the water pressure collecting device in real time, and automatically adjusts the voltage, transmission frequency and gain value to ensure that the ultrasonic wave maintains the best transmission conditions throughout the cleaning process;

[0036] (4) The transducer emits an acoustic signal, and ultrasonic cavitation occurs in the cleaning fluid, thereby achieving ultrasonic cavitation cleaning of the wafer surface. During the cleaning process, the water pressure acquisition device and the acoustic wave acquisition device monitor the acoustic pressure and acoustic signal in real time. The control system automatically adjusts the intensity and frequency of the acoustic wave emission based on the feedback to ensure the stability and efficiency of the cleaning effect.

[0037] (b) The control method mainly controls the preset voltage and includes the following steps:

[0038] (1) Inject cleaning liquid into the sink, use the clamping bracket to clamp the wafer, and place the water pressure collection device in the cleaning liquid. At this time, the control system will monitor the pressure environment of the cleaning liquid through the water pressure collection device, and prepare to start the sound wave emission process;

[0039] (2) Adjust the position of the water pressure collection device, and the control system automatically adjusts the probe position of the water pressure collection device through the feedback signal to ensure accurate positioning in the sound wave emission area of the transducer device. This step is crucial to ensure that the water pressure collection device can effectively capture the sound pressure data generated during the sound wave emission process;

[0040] (3) Emit original sinusoidal electrical signal pulses: the control system emits 3-5 cycles of sinusoidal electrical signal pulses according to the preset voltage parameters through the sound wave generating device. The electrical signal is amplified through the signal amplification device, and then adjusted through the impedance matching device to reduce reflection and loss, ensuring transmission efficiency. Finally, the signal is received by the transducer device and converted into a corresponding frequency sound wave signal;

[0041] (4) The transducer device emits sound wave signals, causing ultrasonic cavitation phenomenon in the cleaning liquid. At this time, the water pressure collection device starts to detect the negative pressure changes in the sound wave emission area. The water pressure collection device feeds back the measured negative pressure data to the control system in real time. According to this feedback, the control system can automatically adjust the voltage, frequency and other emission parameters of the sound wave generating device to ensure the effectiveness of the cavitation phenomenon;

[0042] (5) Reflection sound wave signal monitoring and processing: the sound wave collection device is placed on the side of the transducer device to capture the reflected sound wave signal. The sound wave collection device receives the reflected signal in real time and outputs the corresponding waveform data. The control system analyzes the waveform to determine whether the reflected waveform amplitude has reached the preset threshold value. If the reflected waveform amplitude exceeds 1.5 times that of the non-cavitation state, the control system automatically determines that cavitation has occurred;

[0043] (6) Automatic judgment of cavitation phenomenon: the control system compares the amplitude of the reflected waveform with the preset amplitude threshold value to determine whether cavitation has occurred. If the reflected signal amplitude reaches or exceeds the set 1.5 times threshold value, the system confirms that cavitation has occurred and automatically records the number of cavitation occurrences. If the threshold value is not reached, the system will determine that cavitation has not occurred and adjust the voltage or frequency emission parameters.

[0044] (7) Calculate cavitation probability: the system automatically calculates the cavitation probability based on the number of cavitation occurrences and the number of emission pulses. This probability is used to judge the effectiveness of the cleaning process. The system can adjust in real time according to the frequency of cavitation phenomenon to ensure that the cleaning effect reaches the best level.

[0045] (8) Voltage and frequency adjustment: The system gradually increases or decreases the voltage of the electric signal of the sound wave generating device according to the preset voltage interval. After each voltage adjustment, the system will repeat steps (3) to (7) to automatically measure the cavitation probability under different negative pressure conditions.

[0046] (9) Generating cavitation probability curve and determining optimal cleaning parameters: The system generates a cavitation probability curve according to the cavitation probability data under different voltages and negative pressures. With negative pressure as the horizontal coordinate and cavitation probability as the vertical coordinate, the system automatically analyzes the negative pressure value when the cavitation probability reaches 50%, i.e. the cavitation threshold. The sound wave emission voltage corresponding to the negative pressure at this time will be set as the preset voltage of the cleaning system, ensuring the best cleaning efficiency under this voltage.

[0047] Compared with the prior art, the beneficial effects of the present application are:

[0048] By accurately collecting the cavitation negative pressure during cleaning, the influence of the water tank container wall is reduced. The cavitation occurrence under different pressures is detected to obtain the cavitation threshold of the cleaning liquid and the wafer, and then precise regulation and control under cavitation cleaning is implemented. The optimized ultrasonic vibration can penetrate into the small gaps and structures on the wafer surface, effectively removing difficult-to-reach contaminants and improving cleaning efficiency. At the same time, the structure damage to the wafer surface during cleaning is reduced, and the system has high flexibility and adaptability. The ultrasonic cleaning energy consumption is relatively low, which helps to save energy and reduce consumption, and can be applied to different sizes and types of wafer cleaning requirements. The relative positions of the sound wave collection module, the clamping support and the water pressure collection module are reasonably set, the operation is simple, and the implementation is convenient; the severity of the cavitation activity generated by the transduction module is more clearly and intuitively measured and controlled. Not only the purity of the wafer surface is ensured, but also the processing quality and structure of the wafer are protected from damage. BRIEF DESCRIPTION OF DRAWINGS

[0049] The following drawings are illustrative and should not be construed as limiting the present application in any way. By referring to the following drawings, the reader can gain a better understanding of the embodiments of the present application, and further understand the advantages and technical features of the present application.

[0050] Figure 1 The figure is a schematic diagram of the ultrasonic emission system structure for wafer cleaning in the embodiment of the present application.

[0051] Figure 2 The figure is a schematic diagram of the working process of the embodiment of the present application.

[0052] Figure 3 The figure is a schematic diagram of the ultrasonic wave generating module structure in the embodiment of the present application.

[0053] Figure 4 The figure is a schematic diagram of the signal amplification module structure in the embodiment of the present application.

[0054] Fig. 5(a), (b) is an impedance matching module and circuit structure schematic diagram in the embodiment of the present application.

[0055] Figure 6 Fig. 4 is a transduction module structure schematic diagram in the embodiment of the present application.

[0056] Figure 7 Fig. 3 is a sound wave collection module schematic diagram in the embodiment of the present application.

[0057] Figure 8 Fig. 2 is a water pressure collection module structure schematic diagram in the embodiment of the present application.

[0058] Figure 9 Fig. 1 is a data processing analysis module structure schematic diagram in the embodiment of the present application.

[0059] Figure 10 Fig. 1 is a data processing analysis module circuit structure schematic diagram in the embodiment of the present application.

[0060] Figure 11 Fig. 1 is a cleaning liquid management module structure schematic diagram in the embodiment of the present application.

[0061] The reference signs include:

[0062] 1-power oscillation module, 2-signal amplification module, 3-impedance matching module, 4-transduction module, 5-sound wave collection module, 6-clamping support, 7-water tank, 8-water pressure collection module, 9-wafer, 10-data processing analysis module, 11-cleaning liquid management module, 12-control module. DETAILED DESCRIPTION

[0063] It should be noted that:

[0064] The terms "comprising" and "having" and any variations thereof are intended to cover a possibility of a process, method, system, product, or apparatus that comprises a series of steps or units not necessarily listed clearly, but can include other steps or units not listed clearly or inherent to these processes, methods, products, or apparatus.

[0065] In the description of the present application, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship when the product of the present application is usually placed, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0066] In the description of the present application, it is also necessary to explain that, unless otherwise explicitly specified and limited, the terms "set", "install", "connect", "join" should be understood broadly, for example, can be fixedly connected, can also be detachably connected, or integrally connected; can be mechanically connected, can also be electrically connected; can be directly connected, can also be indirectly connected through an intermediate medium, can be the communication inside two elements. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0067] In order for those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments.

[0068] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. When there is a conflict between the definitions in the specification and the definitions in the art, the definitions in the specification prevail.

[0069] Although the ultrasonic cleaning technology performs well in improving the removal efficiency of contaminants, it inevitably causes damage to the wafer. This phenomenon is mainly due to the fact that when the ultrasonic wave propagates, the transverse force generated by the energy acting on the surface of the wafer 9 is often greater than the adhesion force on the surface of the wafer 9, resulting in the destruction of the pattern structure on the surface of the wafer 9 during the cleaning process. In the process of using ultrasonic cleaning, the energy of the emitted sound wave cannot be accurately controlled, and the non-destructive cleaning of the pattern wafer cannot be achieved.

[0070] Ultrasonic non-destructive cleaning of wafers utilizes the cavitation effect of ultrasonic waves in cleaning liquid to generate powerful shock waves and micro-jets for non-contact cleaning of wafer surfaces. This cleaning method removes contaminants on the surface of the wafer through physical action without the use of strong acids, strong bases and other corrosive chemicals, thereby avoiding damage and pollution problems that may be caused by chemical cleaning. Ultrasonic non-destructive cleaning of wafers is a high-efficiency, environmentally friendly and non-destructive cleaning method, which has wide application prospects and important practical value in the field of semiconductor manufacturing.

[0071] Among the practical applications of power ultrasound, ultrasonic cleaning is one of the most widely used. Ultrasonic cleaning utilizes the physical effects, chemical effects, thermal effects and cavitation effects of ultrasound, among which the cavitation effect plays a key role. When ultrasound acts on the liquid medium in the cleaning tank, due to the action of driving ultrasound, pressure fluctuations will occur in the acoustic field in the cleaning tank. With the increase of the power of the ultrasonic transducer, the pressure fluctuations in the acoustic field also increase, and negative pressure is generated in some areas, and cavitation occurs. The expansion, contraction and collapse of the cavitation bubbles in the cleaning tank will produce mechanical impact force around them, which can strip off the impurities, oil stains and other contaminants on the surface of the cleaned devices, so as to achieve the cleaning effect. The gas cavity and bubble formed under the action of alternating pressure field (acoustic field) are called acoustic cavitation, and such gas cavity and bubble are called cavitation bubble. Acoustic cavitation can include a cavitation or a group of moving cavitation bubbles formed by the acoustic field. According to the lifetime and radius change rate of the cavitation bubble in the liquid medium, there are mainly two types of acoustic cavitation: transient cavitation and steady-state cavitation. The gas bubbles of steady-state cavitation exist for a long time and are independently and dispersedly distributed in the water tank. In the acoustic field environment of the ultrasonic cleaning tank, after the bubbles are generated, most of them oscillate at a fixed position with small amplitude. A small part of the bubbles oscillate with a larger amplitude, or move in the acoustic field to the boundary and then collapse. Transient cavitation is related to cavitation effect, which can produce extreme physical conditions and jetting phenomenon in the liquid medium, although it can promote cleaning, but its destructive power is very strong and needs to be paid attention to. In common acoustic cavitation, transient cavitation is included.

[0072] The cavitation threshold is the minimum pressure amplitude that can cause cavitation in the liquid medium, and reflects the difficulty of cavitation. The higher the cavitation threshold, the higher the required pressure amplitude, and the more difficult it is to cavitate; on the contrary, it is easier. Under ideal conditions, the cavitation threshold that overcomes the van der Waals force to cavitate is called ideal cavitation threshold. In real liquids, there are small impurities, and there are gaps on the surface of these impurity particles, and there is a small amount of gas in the gaps. The gas in the gaps of these impurity particles, the gas in the gaps on the container wall and the micro-bubbles in the liquid are called cavitation nuclei, and the cavitation caused by the cavitation nuclei due to pressure fluctuations is called nuclear cavitation.

[0073] Cavitation noise is due to the linear and nonlinear pulsation of cavitation bubbles, the formation and collapse of cavitation bubbles, and the interaction between cavitation bubbles, etc. It always accompanies the cavitation process. Under the action of high-power ultrasound, a large number of cavitation bubbles will be generated in the compact liquid medium, and they will pulsate greatly. The large amplitude pulsation of the cavitation bubble is highly nonlinear, which makes the sound spectrum of the noise radiated by it very complex, containing harmonic, subharmonic, superharmonic and other components. The process of cavitation bubble collapse is more complex than the steady-state oscillation, which brings more complex spectral components. Due to the oscillation of the bubble and the expansion and contraction of the bubble wall, microflows appear around the bubble. At the same time, the cavitation noise contains harmonics, subharmonics, and with the increase of cavitation intensity, superharmonics also appear. Transient cavitation usually appears in the form of clusters, bubbles are generated and quickly collapsed, and bubble clouds are formed in a certain area. When transient cavitation occurs, wideband noise is produced, and cavitation noise must contain harmonics, subharmonics, superharmonics and continuous spectrum symbolizing the existence of transient cavitation.

[0074] Cavitation noise spectrum analysis method is a method for obtaining cavitation intensity by measuring and analyzing cavitation noise. Cavitation noise is an important feature of the liquid medium, i.e. the cleaning liquid in the water tank 7, when cavitation occurs. Cavitation noise is due to the linear and nonlinear pulsation of cavitation bubbles, the formation and collapse of cavitation bubbles, and the interaction between cavitation bubbles, etc. It always accompanies the cavitation process. When ultrasonic cavitation occurs, the acoustic field is the superposition of the driving ultrasonic field and the cavitation noise. Because cavitation noise contains complex and diverse components, and the sources of these components are different, measuring cavitation noise and analyzing cavitation noise spectrum components can understand each part of the cavitation process, including the initiation, intensity and other information of cavitation.

[0075] The principle of the present application is that the data processing and analysis module 10 adjusts the working state of the transduction module 4 in time according to the ultrasonic cavitation effect and the working condition of the cleaning liquid in the water tank 7 collected by the sound wave collection module 5 and the water pressure collection module 8, and the cleaning effect of the surface of the wafer 9 clamped by the lower end of the clamping support 6, using the cavitation noise spectrum analysis method. The intensity of cavitation activity generated by the transduction module 4 can be more clearly and intuitively represented, the steady-state cavitation intensity and transient cavitation intensity of the ultrasonic cleaning cavitation generated by the transduction module 4 are measured, and the transduction module 4 is in the best working state.

[0076] The present application will be further described below in conjunction with the drawings and examples.

[0077] Although the embodiments of the present application are described in conjunction with the drawings, various modifications and variations can be made by those skilled in the art without departing from the spirit and scope of the present application, and such modifications and variations fall within the scope defined by the appended claims.

[0078] Reference Attachment Figure 1 As shown, the wafer non-destructive hybrid ultrasonic cleaning system of the present invention comprises an ultrasonic generator module, an acoustic wave acquisition module 5, a clamping bracket 6, a water tank 7, a water pressure acquisition module 8, a data processing and analysis module 10, a cleaning fluid management module 11, and a control module 12. The ultrasonic generator module comprises a power supply oscillation module 1, a signal amplification module 2, an impedance matching module 3, and a transducer module 4. The transducer module 4 is positioned on one side of the water tank 7, while the water pressure acquisition module 8 is positioned on the opposite side of the water tank 7. The clamping bracket 6 is positioned above the water tank 7. The transducer module 4 is connected to the control module 12 via the acoustic wave acquisition module 5 and the data processing and analysis module 10, respectively. The control module 12 is connected in series to the transducer module 4 via the power supply oscillation module 1, the signal amplification module 2, and the impedance matching module 3, respectively, for signal transmission and conversion. The cleaning fluid management module 11 is mounted on the outer wall of the water tank 7. The lower end of the clamping bracket 6 extends into the cleaning fluid in the water tank 7 and clamps the wafer 9.

[0079] The present invention may be more readily understood by referring to the following preferred embodiments and the included Examples. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which the present invention belongs. In the event of a conflict, the definitions in this specification shall prevail.

[0080] Example 1: As shown in the attached Figure 2 As shown in the figure, the workflow of the wafer non-destructive composite ultrasonic cleaning system includes:

[0081] 1) Pour cleaning liquid into the water tank 7 and use the clamping bracket 6 to clamp the wafer 9;

[0082] 2) Immerse the wafer 9 in the cleaning solution and adjust the portion of the wafer 9 to be cleaned to the side where the transducer module 4 emits sound waves;

[0083] 3) The power oscillation module 1 sends an electrical signal of a preset voltage to the signal amplification module 2 and the impedance matching module 3. After amplification and impedance matching by the signal amplifier, the signal is received by the highly focused ultrasonic sensor of the transducer module 4 and converted into an acoustic signal of a specific frequency;

[0084] 4) The transducer module 4 emits an acoustic signal and generates ultrasonic cavitation in the cleaning liquid, thereby achieving ultrasonic cavitation cleaning of the surface of the wafer 9 .

[0085] The ultrasonic generator module also includes a digital-to-analog converter (DAC) and a voltage-controlled oscillator (VCO). Specifically, the module regulates the signal voltage amplitude between 2mVpp and 10Vpp, with an output frequency between 1uHz and 10MHz. The cavitation threshold of the ultrasonic generator module is 1.5MPa, with a preset voltage of 0.32Vpp.

[0086] In the embodiment of the present invention, the power oscillation module 1 adopts an automatic voltage control mode, and automatically adjusts the signal voltage through the control module 12 to adapt to different cleaning needs. The power oscillation module 1 can generate electric pulse signals of different periods and change the signal size by adjusting the voltage. Figure 3 As shown, the power oscillation module 1 includes an input unit for setting the power and frequency operating range of the power oscillation module 1, a control unit for adjusting the output frequency of the PWM signal according to the instruction input by the input unit, a power generation unit for power amplifying and inverting the PWM signal input by the control unit, and a matching unit for receiving the electric signal output by the power generation unit and converting the electric signal into ultrasonic wave. The input unit, the control unit, the power generation unit and the matching unit are electrically connected in sequence. In addition, a sampling unit is included, the input end of the sampling unit is connected to the battery cell of the matching unit, and the output end of the sampling unit is electrically connected to the control unit. After the power oscillation module 1 is started, the input end of the sampling unit is connected to the battery cell of the matching unit, and the output end of the sampling unit is electrically connected to the control unit. The unit input setting includes instructions for preset values ​​such as the output power, frequency, start and stop information of the power oscillation module 1, and then the control unit selects the middle frequency of the frequency range and transmits it to the power generation unit through the PWM signal according to the instructions input by the input unit after receiving the start signal. The power generation unit sends the signal to the matching unit through power amplification and inversion. The matching unit and the cleaning sink form a resonant circuit to generate ultrasonic waves for cleaning. At the same time, the current and voltage signals of the matching unit are collected through the sampling unit, and the corresponding power value is obtained through the multiplier and fed back to the control unit; the control unit collects the feedback power value through the AD port and compares it with the power input by the input unit. If the two values ​​are not equal, the control unit adjusts the output PWM frequency; by adjusting the PWM frequency, comparing the input power and the actual power, and then adjusting again, it gradually approaches the input power and ultimately achieves constant power output. It should be noted that the maximum range of PWM frequency adjustment is the frequency range of the input unit input. The sampling unit includes a current transformer, a voltage transformer, and a multiplier circuit. The current transformer collects the current signal of the matching unit and inputs it into the multiplier circuit. The voltage transformer collects the voltage signal of the matching unit and inputs it into the multiplier circuit. The multiplier derives the corresponding power value based on the current signal and the voltage signal and feeds it back to the control unit. The input unit includes function keys and a display. The function keys are connected to the I / O port of the control unit, and the display communicates with the control unit via the SPI bus. The power generation unit includes a half-bridge inverter circuit composed of MOS tubes and MOSFETs. The matching unit includes a resonant circuit composed of an inductor and a transducer. The control unit is a single-chip microcomputer. In particular, the power oscillation module 1 uses a sinusoidal electrical signal pulse with 3 to 5 cycles and a frequency of 1.1 Hz.

[0087] When the power oscillation module 1 starts, the preset values including the output power, frequency, start and stop information of the generator, etc. of the ultrasonic generator are inputted through the input unit, and then the control unit receives the start signal and selects the middle frequency of the frequency range according to the inputted instruction of the input unit, and transmits the PWM signal to the power generation unit, the power generation unit sends the signal into the matching unit through power amplification and inversion, the matching unit and the cleaning tank form a resonant circuit to generate ultrasonic waves for cleaning, at the same time, the current and voltage signals of the matching unit are collected through the sampling unit, and the corresponding power value is obtained through the multiplier and fed back to the control unit. The control unit collects the feedback power value through the AD port and compares it with the input power of the input unit; if the two values are not equal, the control unit adjusts the output PWM frequency; by adjusting the PWM frequency, the input power and the actual power are compared and adjusted again, gradually approaching the input power, and finally realizing constant power output; it should be pointed out that the maximum range of PWM frequency adjustment is the frequency range inputted by the input unit.

[0088] In the embodiment of the present application, the signal amplification module 2 includes an automatic gain control function, which adjusts the amplification multiple through the control module to ensure the stability of the signal strength. The signal amplification module 2 amplifies the electrical signal sent by the power oscillation module 1 and has an adjustable amplification multiple. Further, as shown in the accompanying Figure 4 As shown in the accompanying drawings, the signal amplification module 2 structure includes a signal amplifier and a power supply module, the power supply module is electrically connected with the signal amplifier, the power supply module includes a power adapter and a battery, the power adapter is electrically connected with two external power sources at the same time, the battery is electrically connected with the power adapter, and the power adapter is provided with a storage circuit and a switching switch for switching the two external power sources. The switching switch can switch the two external power sources, so that when one of the external power sources fails to supply power, the other external power source can continue to supply power to the signal amplifier, and when both of the external power sources cannot supply power at the same time, the storage circuit supplies power to the signal amplifier first, and then the battery continues to supply power to the signal amplifier, ensuring that the signal amplifier always maintains a normal use state without interruption time, making the use of the signal amplification device more reliable. In particular, the working frequency of the signal amplification module 2 is 10 kHz to 10 MHz, and the maximum output amplitude is 28Vpp.

[0089] In the embodiment of the present application, further, as shown in the accompanying drawings 5(a), (b), the impedance matching module 3 can make the transmitted electrical signal not produce signal reflection, ensuring the accurate transmission of the signal. The impedance matching module 3 includes three varactor diodes and at least one PI type circuit with fixed inductance; the varactor diode adjusts the impedance according to the bias voltage. It can realize full-range automatic impedance matching, and has the advantages of simple implementation, small size and low cost. In particular, the maximum working frequency of the impedance matching module 3 is 2 GHz.

[0090] In the embodiment of the present application, the transducer module 4 has temperature compensation and automatic calibration functions, and can be automatically adjusted under different environmental conditions to ensure accurate conversion and transmission of sound signals. Further, the transducer module 4 receives electrical signals of different periods, converts them into sound signals of corresponding frequencies and transmits them. The structure and working principle of the transducer module 4 are shown in the attached Figure 6

[0091] In the foregoing, the transducer module 4 is a transducer, which refers to a device that converts electrical energy and sound energy. It is commonly used in echo sounders, Doppler log and acoustic correlation log. The main performance indicators of the transducer module 4 include: operating frequency, frequency bandwidth, electrical-acoustical frequency, impedance at resonance frequency, beam width, directivity and sensitivity, etc. According to physical properties and use materials, transducers can be divided into two categories: magnetostrictive transducers and electrostrictive transducers. The transducer module 4 converts electrical energy into sound energy, which is called a transmitting transducer. Transmitting and receiving transducers are usually used separately, but they can also share one. The former applies the magnetostrictive effect of ferromagnetic materials, which is usually made of nickel or nickel-iron alloy; the latter applies the electrostrictive effect and piezoelectric effect, which is usually made of barium titanate ceramic and lead titanate ceramic dielectric materials. Preferably, a high-focusing ultrasonic sensor is arranged in the transducer module 4, which has an outer diameter of 64 mm, a geometric focal length of 63.2 mm, a rated operating frequency of 1.1 MHz, a central focusing area of 4 mm2, and a theoretical central magnification of 40.09 times. The high-focusing ultrasonic sensor is installed in the cleaning liquid at the lower end of the transducer module 4 in the water tank 7, the front end of the high-focusing ultrasonic sensor faces the concave surface of the sound emission, and the wafer 9 is in the focal point area of the high-focusing ultrasonic sensor. The directivity of the high-focusing ultrasonic sensor can be represented by beam width or half divergence angle.

[0092] In the embodiment of the present application, the sound wave acquisition module 5 has the function of acquiring sound signals and outputting sound signal waveforms. The sound wave acquisition module 5 has an automatic pressure calibration function, which can automatically calibrate the pressure sensor according to the characteristics of the cleaning liquid. The sound wave acquisition module 5 has waveform analysis and intelligent filtering functions, which can be automatically adjusted under different environmental conditions to ensure accurate conversion and transmission of sound signals. The sound wave acquisition module 5 has the function of acquiring sound signals and outputting sound signal waveforms. The sound wave acquisition module 5 is a multi-point acquisition device that simultaneously acquires and analyzes the sound pressure and sound wave signals of multiple points. Further, as shown in the attached Figure 7 ​As shown, the sound wave collecting module 5 is structured, including a sleeve joint 501 with a through-hole structure inside, a stepped gap and a stepped groove are arranged on the ring of the sleeve joint 501, the bottom of the stepped gap is provided with a piezoelectric component 507, the outer side of the piezoelectric component 507 is fixedly provided with an end cover 503, the inner bottom surface of the end cover 503 is provided with a convex ring supported on the surface of the piezoelectric component 507, a wire passing groove is arranged in the convex ring close to the stepped groove, the wire passing groove is communicated with the stepped groove through a wire passing hole on the sleeve joint 501, a single-core socket 505 is arranged in the small-diameter groove of the stepped groove, a socket cover 504 is fixedly arranged in the medium-diameter groove of the stepped groove, the top end of the single-core socket 505 extends to the outside of the inner end cover of the socket cover 504 and is fixed by a nut 506, the wire of the piezoelectric component 507 extends into the stepped groove through the wire groove and the wire passing hole and is connected with the positive electrode at the upper end of the single-core socket 505, the end cover 503 and the sleeve joint 501 are gap-fitted, the sleeve joint 501, the end cover 503, the socket cover 504, the single-core socket 505 and the piezoelectric component 507 are metal components; the piezoelectric component 507 includes a metal base, a piezoelectric ceramic sheet is pasted in the bottom groove of the metal base 512, the negative end surface of the piezoelectric ceramic sheet is attached to the inner bottom surface of the bottom groove of the metal base, a wire is connected to the positive end surface of the piezoelectric ceramic sheet, the wire passes through the wire passing hole of the metal base, and an insulating paint is arranged on the outer end surface of the piezoelectric ceramic sheet and the metal base. The metal base piezoelectric component is adopted, the infiltrated gas can be released through the gap between the end cover and the sleeve joint, the negative end of the piezoelectric component is prevented from being pressed and corroded by corrosive gas, the service life of the piezoelectric component is effectively improved, and the problem that the microphone sensitivity is reduced or even fails due to high-pressure gas leakage is solved. Especially, the output signal waveform of the sound wave collecting module 5 has a sampling rate of 1 GSa / s and a time base range of 50 s to 10 ns.

[0093] In the embodiment of the present application, the clamping support 6 is used for clamping the wafer 9 and can move up and down. The clamping support 6 is equipped with a position sensor and an electric actuator, which automatically adjusts the position of the clamping support to ensure that the surface of the wafer 9 is in the best cleaning area. The precision of the movement of the clamping support 6 is 1 mm.

[0094] In the embodiment of the present application, the water pressure collecting module 8 can detect the sound pressure intensity in water. The water pressure collecting module 8 has an automatic pressure calibration function and can automatically calibrate the pressure sensor according to the characteristics of the cleaning liquid. The water pressure collecting module 8 can be configured as a multi-point collecting device to collect and analyze the sound pressure and sound wave signals of multiple points at the same time. As shown in FIG. 6, the water pressure collecting module 8 is arranged on the cleaning tank 2, and the water pressure collecting module 8 is connected to the control system 7 through a cable. Figure 8As shown, the water pressure acquisition module 8 can detect the sound pressure intensity in water. The water pressure acquisition module 8 comprises a connecting joint 82 detachably connected with a water pressure output nozzle 81 of the fire gun buckle water pressure tester, and a signal acquisition transceiver unit 83 detachably connected with the connecting joint 82 to communicate with the water pressure output nozzle 81 of the fire gun buckle water pressure tester through the connecting joint 82; a connecting channel 821 is arranged on the connecting joint 82 to communicate with the water pressure output nozzle 81 of the fire gun buckle water pressure tester, and a detection channel 832 is arranged on the signal acquisition transceiver unit 83 to communicate with the connecting channel 821, so that the detection water output from the water pressure output nozzle 81 of the fire gun buckle water pressure tester can be transported into the detection channel 832 through the connecting channel 821; a pressure sensor 833 for detecting the water pressure in the detection channel is arranged in the detection channel 832 of the signal acquisition transceiver unit 83, and a pressure signal acquisition module 834, an AD conversion module 835 and a wireless communication transceiver module 836 are further arranged in the signal acquisition transceiver unit 83; a pressure signal output end of the pressure sensor 833 is connected with a signal acquisition end of the pressure signal acquisition module 834 for pressure signal acquisition; an output end of the pressure signal acquisition module 834 is connected with a data input end of the wireless communication transceiver module 836 through the AD conversion module 835, for sending the collected pressure signal to the wireless communication transceiver module 836 for external transmission after analog-digital conversion; and an instruction receiving end of the pressure sensor 833 is further connected with a data return end of the wireless communication transceiver module 836 for receiving external pressure acquisition control instructions through the wireless communication transceiver module 836.When the water pressure acquisition module 8 collects the water pressure at the fire gun buckle water pressure tester, first, the fire gun buckle water pressure tester is started and preheated for 3 minutes; then a connecting joint 82 suitable for the fire gun buckle water pressure tester is selected, the pressure sensor 8033 is installed in the detection channel 832 of the signal acquisition transceiver unit 83, then the signal acquisition transceiver unit 83 and the connecting joint 82 are connected, and finally the connecting joint 802 is connected to the water pressure output nozzle 81 of the fire gun buckle water pressure tester. At this time, the water pressure of the fire gun buckle water pressure tester can be collected. When collecting, first, the sealing property and strength of the fire gun buckle water pressure tester itself are detected, then the values on the fire gun buckle water pressure tester and the pressure sensor are cleared, at this time, the fire gun buckle water pressure tester is slowly pressurized, at this time, the detection water is output from the water pressure output nozzle 81 of the fire gun buckle water pressure tester to the detection channel 832 through the connecting channel, the detection water in the detection channel 832 exerts pressure on the pressure sensor, the pressure of the pressure sensor 833 is stabilized to the first detection point, then the fire gun buckle water pressure tester is continuously pressurized until the upper limit of measurement, and at least 5 detection points are uniformly selected from zero to the upper limit of measurement. When pressurized to the upper limit of measurement, the return calibration is performed until zero, thereby the water pressure acquisition at the fire gun buckle water pressure tester is completed by using the pressure sensor 833. After the pressure data is collected by the pressure sensor 833, the pressure data collected by the pressure sensor 833 is transmitted to the pressure signal acquisition module 834, the pressure signal acquisition module 834 further transmits the pressure data to the AD conversion module 835, the AD conversion module 835 performs analog-digital conversion on the received pressure data, and the pressure data after digital signal conversion is further transmitted externally through the wireless communication transceiver module 836. At the same time, the instruction receiving end of the pressure sensor 833 is also connected with the data returning end of the wireless communication transceiver module 836 for data transmission, so that the pressure acquisition control instruction can be sent to the pressure sensor 833 through the wireless communication transceiver module 836, so that the pressure sensor 833 completes the detection of the pressure data at the specified detection point. The collected pressure data is used to determine whether the technical parameters of the fire gun buckle water pressure tester meet the requirements. When detecting, the detection personnel inputs the maximum allowable error and other related data into the host computer data processing unit before detection, and the pressure data detected by the water pressure acquisition device is transmitted to the host computer data processing unit, and then AI technology calculation, comparison and analysis are performed on the maximum allowable error and other data stored in advance. If the measured error is within the allowable error range, it is judged that the detection result meets the standard, otherwise it is judged that the standard is not met. Especially, the water pressure acquisition module 8 is a needle hydrophone, and the detectable negative pressure range is 0-5 MPa.

[0095] In the embodiment of the present application, the data processing and analysis module 10 is configured to receive real-time data from the sound wave collecting device and the water pressure collecting device, and process and analyze the sound wave and pressure data by using the built-in algorithm of the control system. The data processing and analysis module 10 feeds back the state in the cleaning process in real time, and automatically sends a control instruction to the control module to adjust the voltage, frequency and other parameters of the sound wave emitting device, so as to ensure the cleaning effect. The data processing and analysis module 10 is configured to collect signals and analyze data, and calculate the harmonic noise level of the corresponding harmonic generated by cavitation in a line spectrum extraction manner by analyzing the cavitation noise spectrum. According to the characteristics of ultrasonic cavitation and cavitation noise, the cavitation intensity is represented by the difference between the harmonic noise level corresponding to different types of cavitation and the harmonic noise level corresponding to the cavitation threshold, which more clearly and directly represents the intensity of the cavitation activity generated by the ultrasonic cleaning of the transducing module 4; the steady-state cavitation intensity and the transient cavitation intensity of the cavitation generated by the ultrasonic cleaning of the transducing module 4 are measured, and the ultrasonic cleaning power of the transducing module 4 can be adjusted according to the measurement results, so that the working state of the transducing module 4 is optimized; the spatial average of the harmonic noise level is used to represent the cavitation intensity, which better represents the overall situation of the cavitation in the water tank 7.

[0096] Further, as shown in the accompanying drawings Figure 9As shown, the data processing analysis module 10 structure includes peak detection circuit, low peak coupling compensation circuit, feedback amplitude modulation circuit, the peak detection circuit real-time detection of signal in the Internet of Things data transmission channel, peak less than 0.5V lower limit standard signal, low peak signal into low peak coupling compensation circuit, and +5V upper limit standard signal difference operation, coupled to the peak detection circuit, peak higher than or equal to +5V upper limit standard signal, the three-stage step-by-step conduction circuit composed of three triodes Q1, Q2, Q3 step-by-step conduction, one to three triode step-by-step conduction can change the amplification of the proportional amplifier circuit with AR3 as the core, the output of the voltage stabilizing circuit is 0.5V~+5V standard signal. Can real-time detect the peak value of signal in data transmission channel, low peak coupling compensation, high peak proportion adjustment, output stable 0.5V~+5V standard signal to terminal server, effectively solve the problem that signal distortion cannot be effectively received by terminal server.The peak detection circuit detects the signal in the Internet of Things data transmission channel of the agricultural greenhouse data processing and analysis system, filters out interference through a π-type filter circuit composed of an inductor L1, a capacitor C1, and a capacitor C2, and then enters a peak detection circuit composed of an operational amplifier AR1, an operational amplifier AR2, a resistor R1, a resistor R2, a diode D1, a diode D2, and a capacitor C3. When the peak value is less than the 0.5V lower limit standard signal, the diode D1 is forward biased, and the low peak signal enters the low peak coupling compensation circuit. The low peak coupling compensation circuit enters the non-inverting input terminal of the operational amplifier AR4 after voltage division and unidirectional conduction, and performs differential analysis with the inverting input terminal +5V upper limit standard signal. The output terminal of the operational amplifier AR4 outputs a difference voltage which is coupled to the non-inverting input terminal of the operational amplifier AR1 in the peak detection circuit. When the peak value is higher than or equal to the +5V upper limit standard signal, the diode D2 is forward biased, and the voltage of the operational amplifier AR2 follows and is output. The voltage is then amplified by the proportional amplifier circuit with the operational amplifier AR3 as the core and output after voltage stabilization by the voltage regulator circuit with the transistor Q4 as the core. The feedback amplitude modulation circuit collects the output signal after voltage stabilization and proportionally amplifies it. The greater the amplitude of the signal higher than the +5V upper limit standard signal, the more conduction stages the three-stage progressive conduction circuit composed of the transistors Q1, Q2, and Q3 will have. The progressive conduction of the transistors from the first to the third stage can change the operational amplifier AR3 to The amplification factor of the core proportional amplifier circuit makes the output voltage stable between 0.5V and +5V standard signals; in the feedback amplitude modulation circuit, when the output signal after voltage stabilization is higher than the +5V upper limit standard signal, the potentiometer RW2 and the resistor R11 form a sampling circuit voltage triggering diode D5 to turn on, and the proportional amplifier circuit with the operational amplifier AR3 as the core amplifies the amplified signal and enters the three-stage step-by-step conduction circuit composed of transistors Q1, Q2, and Q3. When the output signal after voltage stabilization is 5.0V-5.7V, the transistor Q1 is turned on, the relay K1 coil is energized, the normally open contact is closed, and the resistor R15 is connected in parallel to the two ends of the feedback resistor R9 of the operational amplifier AR3, stabilizing the voltage. When the output signal after voltage regulation is 5.8V-6.4V, transistors Q1 and Q2 are turned on, the coils of relays K1 and K2 are energized, and the normally open contacts are closed. Resistors R15 and R16 are connected in parallel to both ends of the feedback resistor R9 of op amp AR3. When the output signal after voltage regulation is higher than 6.4V, transistors Q1, Q2, and Q3 are turned on, the coils of relays K1, K2, and K3 are energized, and the normally open contacts are closed. Resistors R15, R16, and R17 are connected in parallel to both ends of the feedback resistor R9 of op amp AR3, thereby changing the amplification factor of the proportional amplifier circuit with op amp AR3 as the core, so that the output voltage is stabilized at a standard signal of 0.5V~+5V.

[0097] In the embodiment of the present invention, the cleaning liquid management module 11 is composed of a liquid level sensor and a refilling system, which is used to monitor and adjust the liquid level of the cleaning liquid in real time. The liquid level sensor can detect the liquid level of the cleaning liquid in the water tank and feed it back to the refilling system. The refilling system can receive the signal from the liquid level sensor and automatically refill the cleaning liquid in the water tank. Figure 10As shown, the cleaning liquid management module 11 comprises a storage unit 111, a concentration liquid level detection unit 112, a control unit 113 and an execution unit 114 connected in sequence. The storage unit 111 is used for storing cleaning liquid. The concentration liquid level detection unit 112 is used for detecting the concentration and liquid level of the cleaning liquid in the storage unit 111 and transmitting the detected concentration data and liquid level data to the control unit 113. The control unit 113 is used for generating corresponding control signals according to the concentration data and liquid level data and sending the control signals to the execution unit 114. The execution unit 114 is used for performing the actions of discharging the cleaning liquid of the storage unit 111, supplementing the chemical agent of the storage unit 111, supplementing the water of the storage unit 111, replacing the cleaning liquid of the storage unit 111, recovering the cleaning liquid of the reaction cavity and supplying the liquid to the reaction cavity according to the control signals. Through the combination with the reaction cavity control device, the automatic management of the cleaning liquid is realized, and the continuous cleaning process is realized without the management of the cleaning liquid by the technician. The concentration liquid level detection unit 112 comprises a liquid level sensor and a chemical analyzer used for detecting the concentration data. The detection tube on the chemical analyzer extends into the storage unit 111, and the liquid level sensor is arranged on the side wall of the storage unit 111. The liquid level sensor and the chemical analyzer are connected with the control unit 113. The execution unit 114 comprises a cleaning liquid pipe, a liquid supplementing pipe, a water supplementing pipe, a waste liquid pipe, a liquid supplying pipe, a liquid replacing pipe and a recovery pipe. The outlet of the liquid supplementing pipe, the outlet of the water supplementing pipe, the outlet of the liquid replacing pipe and the outlet of the recovery pipe all extend into the storage unit 111. The cleaning liquid pipe is arranged at the bottom end of the storage unit 111. A liquid delivery pump is arranged on the cleaning liquid pipe. The cleaning liquid pipe is connected with the inlet of the liquid supplying pipe and the inlet of the waste liquid pipe through a tee joint. The inlet of the waste liquid pipe is provided with a pneumatic valve. The inlet of the liquid supplying pipe is provided with a pneumatic valve. The outlet of the liquid supplying pipe is provided with a pneumatic valve. The outlet of the liquid supplementing pipe is provided with a pneumatic valve. The outlet of the water supplementing pipe is provided with a pneumatic valve. The outlet of the liquid replacing pipe is provided with a pneumatic valve. The outlet of the recovery pipe is provided with a pneumatic valve. All the pneumatic valves on the liquid supplementing pipe, the water supplementing pipe, the waste liquid pipe, the liquid supplying pipe, the liquid replacing pipe and the recovery pipe are connected with the control unit 113. The liquid delivery pump is connected with the control unit 113. A filter is arranged on the liquid supplying pipe. The device further comprises a temperature detection unit 115 connected with the control unit 113, which is used for detecting the temperature data of the cleaning liquid in the storage unit 111 and sending the temperature data to the control unit 113. The control unit 113 is further used for generating corresponding control signals according to the temperature data and sending the control signals to the execution unit 114. The execution unit 114 is further used for performing the action of automatically circulating and heating the cleaning liquid of the storage unit 111 according to the control signals.The temperature detection unit (5) comprises a temperature detector, the detection tube of the temperature detector extends into the liquid storage unit 111, and the temperature detector is connected with the control unit.

[0098] In the embodiment of the present application, the control module 12 is composed of PLC or embedded controller, which can automatically adjust the operation of the power oscillation module 1, the sound wave acquisition module 5, the water pressure acquisition module 8, the cleaning liquid management module 11 and the clamping support 6 according to the collected sound wave, pressure and liquid level data. Through real-time feedback, the control module 12 controls the system to automatically adjust the voltage, frequency and gain to adapt to different cleaning conditions and needs, ensuring the efficiency and stability of the cleaning process. The control module 12 is composed of PLC or embedded controller, which can automatically adjust the operation of the ultrasonic emission module, the signal acquisition module, the cleaning liquid management module and the clamping support according to the sound wave, pressure and liquid level data collected by the sensor. Through real-time feedback, the control system automatically adjusts the voltage, frequency and gain to adapt to different cleaning conditions and needs, ensuring the efficiency and stability of the cleaning process.

[0099] In the embodiment of the present application, impedance matching refers to the mutual adaptation of load impedance and internal impedance of the excitation source to obtain a working state of maximum power output. The load impedance is equal to the internal impedance of the signal source, that is, their modulus and argument are equal, so that undistorted voltage transmission can be obtained on the load impedance. The load impedance is equal to the conjugate value of the internal impedance of the signal source, that is, their modulus is equal and the sum of their arguments is zero. At this time, maximum power can be obtained on the load impedance. This matching condition is called conjugate matching. If the internal impedance of the signal source and the load impedance are both purely resistive, the two matching conditions are equivalent.

[0100] The main function of the impedance matching module 3 is to ensure that the signal will not be reflected during transmission, thereby improving energy efficiency and signal quality. By matching the characteristic impedance of the transmission line with the load impedance, the impedance matching module can reduce energy loss during signal transmission and ensure efficient signal transmission. The transduction module 4 refers to a device that converts electrical energy into other forms of energy, such as mechanical energy, thermal energy, etc. In electronic systems, the transduction module usually involves the processing of high-frequency signals, so impedance matching becomes particularly important. Through impedance matching, it can be ensured that the signal will not be reflected during transmission due to impedance mismatch, thereby affecting the stability and efficiency of the signal. When connecting the impedance matching module 3 and the transduction module 4, the following points need to be noted:

[0101] Calculation and Measurement: First, the effective frequency of the signal and the length of the trace need to be calculated to determine if impedance matching is required. If the effective wavelength of the signal is greater than 6 times the length of the signal trace, impedance matching needs to be considered.

[0102] Design and Implementation: Impedance matching can be achieved by adjusting the characteristic impedance of the transmission line or using impedance matching circuits such as LC circuits. Specific methods include adjusting the physical length of the transmission line or connecting capacitors, inductors, and other components in series.

[0103] Testing and Verification: In practical applications, testing is required to verify the effectiveness of impedance matching, ensuring that there is no significant reflection and energy loss during signal transmission.

[0104] Through the above steps, the impedance matching module can be effectively connected with the transduction module, ensuring the efficient and stable operation of the system.

[0105] In the embodiment of the present application, in order to strengthen the regulation function of the cleaning liquid in the water tank 7, a liquid supplementing system is installed in the water tank 7. The liquid supplementing system can accept signals from the liquid level sensor and supplement the cleaning liquid in the water tank. The signal acquisition module installed in the water tank 7 includes but is not limited to the sound wave acquisition module 5 and the water pressure acquisition module 8. Further, a liquid level sensor, a thermometer, and a high-definition camera or a scanning electron microscope can also be installed in the water tank 7. The liquid level sensor can detect the real-time liquid level of the cleaning liquid in the water tank 7 and feed back to the liquid supplementing system.

[0106] In the embodiment of the present application, the data processing and analysis module 10 and the cleaning liquid management module 11 adopt a digital power control loop of DSPIC series single-chip microcomputer combined with a multiplier.

[0107] The embodiment of the present application has the following effects in application:

[0108] 1) Ensure the stability and uniformity of cavitation cleaning; the scattering and reflection of ultrasonic waves generated by the transduction module 4 on the walls of the water tank 7 affect the actual cavitation cleaning negative pressure, causing instability of the cavitation negative pressure in water. The sound wave acquisition module 5 monitors the cavitation negative pressure in the cleaning process in the water tank 7 in real time, accurately collects and feeds back pressure data, and reduces the interference of the container wall of the water tank 7 on the cavitation effect.

[0109] 2) Self-adaptive regulation to improve cleaning efficiency; the system can dynamically adjust the cleaning parameters according to the real-time data of the sound wave acquisition module 5, the water pressure acquisition module 8, the data processing and analysis module 10, and the cleaning liquid management module 11, adopt composite ultrasonic technology, ensure the flexibility and efficiency of the cleaning process, and significantly improve the cleaning efficiency by automatically adjusting the sound wave emission frequency, intensity, and power.

[0110] In the embodiment, the wafer non-destructive composite ultrasonic cleaning system and its working and regulation method include the following steps:

[0111] Pre-cleaning: Before ultrasonic cleaning, a preliminary pre-cleaning is performed to remove most of the particles and loose contaminants on the surface of the wafer 9.

[0112] Ultrasonic cleaning: Place the wafer 9 into the water tank 7 filled with cleaning solution, turn on the power oscillation module 1, and the microbubbles generated by the ultrasonic vibration of the transducer module 4 continuously form and break in the cleaning solution, forming cavitation shock waves and microjets, which deeply clean the surface of the wafer 9.

[0113] Rinsing: After cleaning, take out the wafer 9 and place it in pure water for rinsing to remove residual cleaning solution and small particles.

[0114] Drying: Finally, the rinsed wafer 9 is dried to ensure that there is no water stain left on the surface.

[0115] In this embodiment, the cleaning and control method of the wafer non-destructive composite ultrasonic cleaning system includes:

[0116] The cleaning method includes the following steps:

[0117] Inject cleaning solution into the water tank, use the clamping support to clamp the wafer, and monitor the cleaning solution level in real time through the cleaning solution management module. This module detects the liquid level of the cleaning solution through a liquid level sensor. When the liquid level is below the set value, the control system automatically triggers the liquid replenishment system to maintain the cleaning solution at the appropriate level;

[0118] Submerge the wafer in the cleaning solution, adjust the part of the wafer to be cleaned to the side of the transducer device emitting sound waves. Through the automatic positioning of the clamping support, the position sensor detects the size and position of the wafer, and the control system automatically adjusts the height and angle of the clamping support according to the feedback, so that the wafer surface is always located in the best cleaning area;

[0119] The sound wave generating device sends an electrical signal of a preset voltage, which is amplified by a signal amplification device and impedance matching device, and then received by the transducer device and converted into a specific frequency sound signal. The sound wave generating device sends an electrical signal of a preset voltage according to the instructions of the control system, the signal is amplified by the signal amplification device, and then transmitted to the transducer device for sound signal conversion after being optimized by the impedance matching device. The control system monitors the feedback signals from the sound wave collection device and water pressure collection device in real time, automatically adjusts the voltage, emission frequency and gain value to ensure that the ultrasonic waves maintain the best emission conditions throughout the cleaning process;

[0120] The transducer device emits acoustic signals and causes ultrasonic cavitation in the cleaning liquid, thereby achieving ultrasonic cavitation cleaning of the wafer surface. During the cleaning process, the water pressure collection device and the acoustic wave collection device monitor the acoustic pressure and acoustic signals in real time, and the control system automatically adjusts the intensity and frequency of acoustic wave emission according to the feedback to ensure the stability and efficiency of the cleaning effect.

[0121] The control method mainly controls the preset voltage, including the following steps:

[0122] Inject cleaning liquid into the sink, use the clamping support to clamp the wafer, and place the water pressure collection device in the cleaning liquid. At this time, the control system will monitor the pressure environment of the cleaning liquid through the water pressure collection device and prepare to start the acoustic wave emission process;

[0123] Adjust the position of the water pressure collection device, and the control system automatically adjusts the probe position of the water pressure collection device through the feedback signal to ensure its accurate positioning in the acoustic wave emission area of the transducer device. This step is crucial to ensure that the water pressure collection device can effectively capture the acoustic pressure data generated during the acoustic wave emission process;

[0124] Emit original sinusoidal electrical signal pulses: the control system emits 3-5 cycles of sinusoidal electrical signal pulses according to the preset voltage parameters through the acoustic wave generating device. The electrical signal is amplified through the signal amplification device, and then adjusted through the impedance matching device to reduce reflection and loss, ensuring transmission efficiency. Finally, the signal is received by the transducer device and converted into acoustic wave signals of the corresponding frequency;

[0125] The transducer device emits acoustic wave signals, causing ultrasonic cavitation in the cleaning liquid. At this time, the water pressure collection device starts to detect the negative pressure changes in the acoustic wave emission area. The water pressure collection device feeds back the measured negative pressure data to the control system in real time. According to this feedback, the control system can automatically adjust the voltage, frequency and other emission parameters of the acoustic wave generating device to ensure the effectiveness of the cavitation phenomenon;

[0126] Reflection acoustic signal monitoring and processing: the acoustic wave collection device is placed on one side of the transducer device to capture the reflected acoustic signals. The acoustic wave collection device receives the reflected signals in real time and outputs the corresponding waveform data. The control system analyzes the waveform to determine whether the amplitude of the reflected waveform has reached the preset threshold value. If the amplitude of the reflected waveform exceeds 1.5 times that of the non-cavitation state, the control system automatically determines that cavitation has occurred;

[0127] Automatic judgment of cavitation phenomenon: the control system compares the amplitude of the reflected waveform with the preset amplitude threshold value to determine whether cavitation has occurred. If the amplitude of the reflected signal reaches or exceeds the set 1.5 times threshold value, the system confirms that cavitation has occurred and automatically records the number of cavitation occurrences. If the threshold value is not reached, the system will determine that cavitation has not occurred and adjust the emission parameters such as voltage or frequency.

[0128] Calculate cavitation probability: the system automatically calculates the cavitation probability according to the number of cavitation phenomenon and the number of emission pulse. This probability is used to determine the effectiveness of the cleaning process. The system can adjust in real time according to the frequency of cavitation phenomenon to ensure that the cleaning effect reaches the best level.

[0129] Voltage and frequency adjustment: according to the preset voltage interval, the system gradually increases or decreases the voltage of the electric signal of the sound wave generating device. After each voltage adjustment, the system will repeat steps (3) to (7) to automatically measure the cavitation probability under different negative pressure conditions.

[0130] Generate cavitation probability curve and determine the best cleaning parameters: the system generates a cavitation probability curve according to the cavitation probability data under different voltages and negative pressures. With negative pressure as the horizontal coordinate and cavitation probability as the vertical coordinate, the system automatically analyzes the negative pressure value when the cavitation probability reaches 50%, which is the cavitation threshold. The sound wave emission voltage corresponding to the negative pressure at this time will be set as the preset voltage of the cleaning system, ensuring that the cleaning efficiency is best at this voltage.

[0131] The present application is widely used in the process of semiconductor manufacturing, such as pre-diffusion cleaning, post-etch cleaning, pre-oxidation cleaning, etc. It can significantly improve the cleanliness and flatness of the wafer surface, reduce the defect rate and improve the yield, and also help to improve the performance and reliability of semiconductor devices, providing strong support for the development of semiconductor industry.

[0132] Based on the above examples in the present application, all other examples obtained by those of ordinary skill in the art without creative labor shall belong to the scope of protection of the present application. In order to avoid exhaustive enumeration of all embodiments that are not required and cannot be fully listed.

Claims

1. A wafer non-destructive composite ultrasonic cleaning system, comprising an ultrasonic generating module, an acoustic wave collecting module (5), a clamping bracket (6), a water tank (7), a water pressure collecting module (8), a data processing and analysis module (10), a cleaning liquid management module (11) and a control module (12); characterized in that: The ultrasonic generating module comprises a power oscillation module (1), a signal amplification module (2), an impedance matching module (3) and a transducer module (4); the transducer module (4) is arranged on one side of a water tank (7), and a water pressure acquisition module (8) is arranged on the other side of the water tank (7); a clamping bracket (6) is arranged on the upper side of the water tank (7); the transducer module (4) is connected to the control module (12) in sequence through the sound wave acquisition module (5) and the data processing and analysis module (10); the control module (12) is connected to the control module (12) in sequence through the power oscillation module (1), the signal amplification module (2) and the impedance matching module (3). The matching module (3) is connected in series to the transducer module (4) for signal transmission and conversion; a cleaning liquid management module (11) is installed on the outer wall of the water tank (7); the lower end of the clamping bracket (6) extends into the water tank (7); the data processing and analysis module (10) uses a cavitation noise spectrum analysis method to timely adjust the working state of the transducer module (4) based on the ultrasonic cavitation effect and cleaning liquid working condition in the water tank (7) collected in real time by the sound wave collection module (5) and the water pressure collection module (8), as well as the surface cleaning effect of the wafer (9) clamped by the lower end of the clamping bracket (6); the working process includes: 1) Pour cleaning liquid into the water tank (7) and use the clamping bracket (6) to clamp the wafer (9); 2) immersing the wafer (9) below the level of the cleaning liquid, and adjusting the portion of the wafer (9) to be cleaned to the side of the transducer module (4) emitting the sound waves; 3) The power oscillation module (1) sends an electrical signal of a preset voltage to the signal amplification module (2) and the impedance matching module (3); after amplification by the signal amplifier and impedance matching, the signal is received by the highly focused ultrasonic sensor of the transducer module (4) and converted into an acoustic signal of a specific frequency; 4) The transducer module (4) emits an acoustic signal and generates ultrasonic cavitation in the cleaning liquid, thereby achieving ultrasonic cavitation cleaning of the surface of the wafer (9).

2. The wafer non-destructive composite ultrasonic cleaning system according to claim 1, characterized in that: The ultrasonic generating module is also equipped with a digital-to-analog converter DAC and a voltage-controlled oscillator VCO.

3. The wafer non-destructive composite ultrasonic cleaning system according to claim 1, characterized in that: The power oscillation module (1) comprises an input unit for setting the power and frequency operating range of the power oscillation module (1), a control unit for adjusting the output frequency of the PWM signal according to the instruction input by the input unit, a power generation unit for power amplifying and inverting the PWM signal input by the control unit, and a matching unit for receiving the electric signal output by the power generation unit and converting the electric signal into an ultrasonic wave. The input unit, the control unit, the power generation unit and the matching unit are electrically connected in sequence. In addition, a sampling unit is included, the input end of the sampling unit is connected to the battery cell of the matching unit, and the output end of the sampling unit is electrically connected to the control unit. After the power oscillation module (1) is started, an instruction including the output power, frequency, start and stop information preset values ​​of the power oscillation module (1) is input through the input unit. Then, after receiving the start signal, the control unit selects the middle frequency of the frequency range according to the instruction input by the input unit and transmits it to the power generation unit through the PWM signal. The power generation unit sends the signal to the matching unit through power amplification and inversion. The matching unit and the cleaning water tank form a resonant circuit to generate ultrasonic waves for cleaning. At the same time, the matching unit collects the matching information through the sampling unit. The current and voltage signals of the matching unit are collected and the corresponding power value is obtained through a multiplier and fed back to the control unit; the control unit collects the fed-back power value through the AD port and compares it with the power input by the input unit; if the two values ​​are not equal, the control unit adjusts the output PWM frequency; by adjusting the PWM frequency, comparing the input power and the actual power, and then adjusting again, gradually approaching the input power, and finally achieving constant power output; it should be noted that the maximum range of PWM frequency adjustment is the frequency range of the input unit input; the sampling unit includes a current transformer, a voltage transformer and a multiplier circuit, the current transformer collects the current signal of the matching unit and inputs it into the multiplier circuit, the voltage transformer collects the voltage signal of the matching unit and inputs it into the multiplier circuit, the multiplier obtains the corresponding power value based on the current signal and the voltage signal and feeds it back to the control unit; the input unit includes function keys and a display, the function keys are connected to the I / O port of the control unit, and the display communicates with the control unit via an SPI bus; the power generation unit includes a half-bridge inverter circuit composed of MOS tubes and MOSFETs; the matching unit includes a resonant circuit composed of an inductor and a transducer; and the control unit is a single-chip microcomputer.

4. The wafer non-destructive composite ultrasonic cleaning system according to claim 1, characterized in that: The cleaning liquid management module (11) comprises a liquid level sensor and a liquid replenishing system, and is used for real-time monitoring and adjusting the liquid level of the cleaning liquid; the cleaning liquid management module (11) structure comprises: a liquid storage unit (111), a concentration liquid level detection unit (112), a control unit (113) and an execution unit (114) connected in sequence, wherein the liquid storage unit (111) is used for storing the cleaning liquid; the concentration liquid level detection unit (112) is used for detecting the concentration and liquid level of the cleaning liquid in the liquid storage unit (111), and transmitting the detected concentration data and liquid level data to the execution unit (114). The control unit (113) is configured to generate a corresponding control signal according to the concentration data and the liquid level data, and send the control signal to the execution unit (114); the execution unit (114) is configured to execute the actions of discharging the cleaning liquid of the liquid storage unit (111), replenishing the chemical agent of the liquid storage unit (111), replenishing the water of the liquid storage unit (111), replacing the cleaning liquid of the liquid storage unit (111), recovering the cleaning liquid of the reaction chamber, and supplying liquid to the reaction chamber according to the control signal.

5. The wafer non-destructive composite ultrasonic cleaning system according to claim 1, characterized in that: The data processing and analysis module (10) is used to receive real-time data from the sound wave acquisition module (5) and the water pressure acquisition module (8), and to process and analyze the sound wave and pressure data using the built-in algorithm of the control module (12); the module provides real-time feedback on the state of the cleaning process, automatically issues a control instruction to the control module, and adjusts the voltage and frequency parameters of the sound wave emission device to ensure the cleaning effect; the data processing and analysis module (10) is used for signal acquisition and data analysis, and calculates the harmonic noise level of the corresponding harmonic generated by cavitation by analyzing the cavitation noise spectrum in a line spectrum extraction manner; The data processing and analysis module (10) comprises a peak detection circuit, a low-peak coupling compensation circuit, and a feedback amplitude modulation circuit. The peak detection circuit detects the signal in the data transmission channel of the Internet of Things in real time. When the peak value is less than the 0.5V lower limit standard signal, the low-peak signal enters the low-peak coupling compensation circuit, performs a difference operation with the +5V upper limit standard signal, and is coupled to the peak detection circuit. When the peak value is higher than or equal to the +5V upper limit standard signal, the three-stage step-by-step conduction circuit composed of transistors Q1, Q2, and Q3 is turned on step by step. The first to third stage transistors are turned on step by step to change the amplification factor of the proportional amplifier circuit with the operational amplifier AR3 as the core. The voltage stabilization circuit outputs a 0.5V to +5V standard signal after voltage stabilization.

6. The wafer non-destructive composite ultrasonic cleaning system according to claim 1, characterized in that: The control module (12) is composed of a PLC or an embedded controller, and can automatically adjust the operation of the power oscillation module (1), the sound wave acquisition module (5), the water pressure acquisition module (8), the cleaning liquid management module (11) and the clamping bracket (6) according to the collected sound wave, pressure and liquid level data; through real-time feedback, the control module (12) control system automatically adjusts the voltage, frequency and gain to adapt to different cleaning conditions and requirements, thereby ensuring the high efficiency and stability of the cleaning process; the control module (12) is composed of a PLC or an embedded controller, and can automatically adjust the operation of the power oscillation module (1), the sound wave acquisition module (5), the water pressure acquisition module (8), the cleaning liquid management module (11) and the clamping bracket (6) according to the collected sound wave, pressure and liquid level data; through real-time feedback, the control module (12) control system automatically adjusts the voltage, frequency and gain to adapt to different cleaning conditions and requirements, thereby ensuring the high efficiency and stability of the cleaning process.

7. The wafer non-destructive composite ultrasonic cleaning system according to claim 1, characterized in that: The sound wave collection module (5) is a multi-point collection device that collects and analyzes sound pressure and sound wave signals at multiple points simultaneously.

8. The wafer non-destructive composite ultrasonic cleaning system according to claim 1, characterized in that: The clamping bracket (6) is equipped with a position sensor and an electric actuator to automatically adjust the position of the clamping bracket to ensure that the wafer surface is in the optimal cleaning area.

9. The wafer non-destructive composite ultrasonic cleaning system according to claim 1, characterized in that: The signal amplification module (2) includes an automatic gain control function, and the amplification factor is adjusted by the control module; the structure of the signal amplification module (2) includes a signal amplifier and a power supply module, the power supply module is electrically connected to the signal amplifier, the power supply module includes a power adapter and a battery, the power adapter is electrically connected to two external power supplies at the same time, the battery is electrically connected to the power adapter, and the power adapter is provided with a storage circuit and a switching switch for switching the two external power supplies; the switching switch switches the two external power supplies, so that when one of the external power supplies fails to supply power, the other external power supply continues to supply power to the signal amplifier; when the two external power supplies fail to supply power at the same time, the storage circuit first supplies power to the signal amplifier, and then the battery continues to supply power to the signal amplifier, ensuring that the signal amplifier always maintains a normal use state without interruption time, making the use of the signal amplification device more reliable.

10. The wafer non-destructive composite ultrasonic cleaning system according to claim 1, characterized in that: The transducer module (4) has temperature compensation and automatic calibration functions, and can automatically adjust under different environmental conditions to ensure accurate conversion and emission of acoustic signals; the transducer module (4) receives electrical signals of different periods, converts them into acoustic signals of corresponding frequencies, and emits them; a high-focus ultrasonic sensor is provided in the transducer module (4), and the high-focus ultrasonic sensor has an outer diameter of 64 mm and a focal length of 63.2 mm.

11. The wafer non-destructive composite ultrasonic cleaning system according to claim 1, characterized in that: The impedance matching module (3) comprises three variable capacitance diodes and at least one PI-type circuit with a fixed inductance; the variable capacitance diodes perform impedance adjustment according to a bias voltage.

12. The wafer non-destructive composite ultrasonic cleaning system according to claim 1, characterized in that: The acoustic wave acquisition module (5) has an automatic pressure calibration function and can automatically calibrate the pressure sensor according to the characteristics of the cleaning fluid; the acoustic wave acquisition module (5) has waveform analysis and intelligent filtering functions and can automatically adjust under different environmental conditions to ensure accurate conversion and emission of acoustic signals; the acoustic wave acquisition module (5) has the function of collecting acoustic signals and outputting acoustic signal waveforms; the acoustic wave acquisition module (5) is a multi-point acquisition device that simultaneously collects and analyzes the sound pressure and acoustic wave signals of multiple points.

13. The wafer non-destructive composite ultrasonic cleaning system according to claim 1, characterized in that: The cleaning and control methods of the wafer non-destructive composite ultrasonic cleaning system include: (a) A cleaning method comprising the following steps: (1) Pour cleaning fluid into the water tank, use a clamping bracket to clamp the wafer, and monitor the cleaning fluid level in real time through the cleaning fluid management module; the module detects the cleaning fluid level through the liquid level sensor. When the liquid level is lower than the set value, the control system automatically triggers the refill system to maintain the cleaning fluid at an appropriate level; (2) Immerse the wafer in the cleaning liquid and adjust the portion of the wafer to be cleaned to the side where the transducer emits the sound waves; through the automatic positioning of the clamping bracket, the position sensor detects the size and position of the wafer, and the control system automatically adjusts the height and angle of the clamping bracket based on the feedback, so that the wafer surface is always located in the optimal cleaning area; (3) The sound wave generating device emits an electrical signal of a preset voltage, which is amplified and impedance matched by the signal amplifying device, and then received by the transducer device and converted into an acoustic signal of a specific frequency; the sound wave generating device emits an electrical signal of a preset voltage according to the instruction of the control system, and the signal is amplified by the signal amplifying device, and after the signal transmission is optimized by the impedance matching device, it is transmitted to the transducer device for acoustic signal conversion; the control system monitors the feedback signals from the sound wave collecting device and the water pressure collecting device in real time, and automatically adjusts the voltage, emission frequency and gain value to ensure that the ultrasonic wave maintains the optimal emission conditions throughout the cleaning process; (4) The transducer device emits an acoustic signal, and ultrasonic cavitation occurs in the cleaning liquid, thereby achieving ultrasonic cavitation cleaning of the wafer surface; during the cleaning process, the water pressure collection device and the acoustic wave collection device monitor the acoustic pressure and acoustic signal in real time, and the control system automatically adjusts the intensity and frequency of the acoustic wave emission based on the feedback to ensure the stability and efficiency of the cleaning effect; (b) The control method mainly controls the preset voltage and includes the following steps: (1) Pour cleaning fluid into the water tank, use a clamping bracket to clamp the wafer, and place the water pressure acquisition device in the cleaning fluid; at this time, the control system will monitor the pressure environment of the cleaning fluid through the water pressure acquisition device and prepare to start the acoustic wave emission process; (2) Adjust the position of the water pressure acquisition device. The control system automatically adjusts the probe position of the water pressure acquisition device through feedback signals to ensure that it is accurately positioned in the sound wave emission area of ​​the transducer device. This step is crucial to ensure that the water pressure acquisition device can effectively capture the sound pressure data generated during the sound wave emission process. (3) Emitting original sinusoidal electrical signal pulses: The control system emits 3-5 cycles of sinusoidal electrical signal pulses through the acoustic wave generating device according to the preset voltage parameters; the electrical signal is amplified by the signal amplifying device and then adjusted by the impedance matching device to reduce reflection and loss and ensure transmission efficiency; finally, the signal is received by the transducer device and converted into an acoustic wave signal of the corresponding frequency; (4) The transducer device emits a sound wave signal, causing ultrasonic cavitation to occur in the cleaning liquid; at this time, the water pressure acquisition device begins to detect the negative pressure change in the sound wave emission area; the water pressure acquisition device feeds back the measured negative pressure data to the control system in real time; based on this feedback, the control system automatically adjusts the voltage and frequency emission parameters of the sound wave generating device to ensure the effectiveness of the cavitation phenomenon; (5) Reflected sound wave signal monitoring and processing: The sound wave acquisition device is placed on one side of the transducer device to capture the sound wave reflection signal; the sound wave acquisition device receives the reflection signal in real time and outputs the corresponding waveform data; the control system analyzes the waveform to determine whether the amplitude of the reflected waveform has reached a preset threshold; if the amplitude of the reflected waveform exceeds 1.5 times that of the amplitude when no cavitation occurs, the control system automatically determines that cavitation has occurred; (6) Automatic determination of cavitation: The control system determines whether cavitation has occurred by comparing the amplitude of the reflected waveform with a preset amplitude threshold. If the amplitude of the reflected signal reaches or exceeds 1.5 times the preset threshold, the system confirms that cavitation has occurred and automatically records the number of cavitation occurrences. If the threshold is not reached, the system determines that cavitation has not occurred and adjusts the voltage or frequency transmission parameters. (7) Calculation of cavitation probability: The system automatically calculates the cavitation probability based on the number of cavitation phenomena and the number of pulses emitted. This probability is used to determine the effectiveness of the cleaning process. The system can adjust in real time according to the frequency of cavitation phenomena to ensure that the cleaning effect reaches the best level. (8) Voltage and frequency adjustment: The system gradually increases or decreases the electrical signal voltage of the acoustic wave generator according to the preset voltage interval; after each voltage adjustment, the system will repeat steps (3) to (7) to automatically measure the cavitation probability under different negative pressure conditions; (9) Generate cavitation probability curve and determine optimal cleaning parameters: The system generates a cavitation probability curve based on the cavitation probability data under different voltages and negative pressures; with negative pressure as the horizontal axis and cavitation probability as the vertical axis, the system automatically analyzes and obtains the negative pressure value when the cavitation probability reaches 50%, which is the cavitation threshold; the acoustic wave emission voltage corresponding to the negative pressure at this time will be set as the preset voltage of the cleaning system to ensure the best cleaning efficiency at this voltage.

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