Display module and preparation method thereof

Abstract

The embodiment of the invention provides a display module and a preparation method of the display module. The display module comprises a first heat dissipation part, a circuit board, a display driving chip, a miniature light-emitting chip, a conductive area and a second heat dissipation part, the circuit board and the display driving chip are arranged on the same side of the first heat dissipation part, and the side, away from the first heat dissipation part, of the display driving chip is bonded with the miniature light-emitting chip. The conductive area is used for electrically connecting the display driving chip with the circuit board, and the second heat dissipation part is arranged on the side, away from the first heat dissipation part, of the display driving chip.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to the field of display technology, and in particular, to a display module and a method for preparing the display module. Background Art

[0002] As the latest display technology on the market, Micro LED is gaining more and more attention from the industry for its application prospects due to its tiny pixel size and ultra-high luminous brightness.

[0003] Since the pixel chip size of Micro LED is very small, the chip's luminous efficiency is more easily affected by temperature. When the temperature rises, the luminous efficiency will drop significantly. How to enhance the heat dissipation capacity of Micro LED display modules is a difficult problem that needs to be solved. Summary of the invention

[0004] The embodiments described herein provide a display module, a display device, and a method for manufacturing the display module.

[0005] According to a first aspect of the present disclosure, a display module is provided, which includes a first heat dissipation component, a circuit board, a display driver chip, a micro-light-emitting chip, a conductive area, and a second heat dissipation component. The circuit board and the display driver chip are arranged on the same side of the first heat dissipation component, the display driver chip is bonded to the micro-light-emitting chip on a side away from the first heat dissipation component, the conductive area electrically connects the display driver chip and the circuit board, and the second heat dissipation component is arranged on a side of the display driver chip away from the first heat dissipation component.

[0006] In some embodiments of the present disclosure, the second heat dissipation component includes a middle hollow area that is as large as the micro-light-emitting chip, and the middle hollow area is arranged in alignment with the micro-light-emitting chip.

[0007] In some embodiments of the present disclosure, the display driver chip and the first heat dissipation component and the display driver chip and the second heat dissipation component are bonded together by an adhesive thermal conductive adhesive layer.

[0008] In some embodiments of the present disclosure, the adhesive thermal conductive adhesive layer between the display driving chip and the second heat dissipation component is disposed in a peripheral area surrounding the micro light emitting chip.

[0009] In some embodiments of the present disclosure, the surface of the second heat dissipation component is black.

[0010] In some embodiments of the present disclosure, the first heat dissipation component is a heat dissipation substrate formed integrally with the circuit board, and the circuit board includes a portion extending from the heat dissipation substrate.

[0011] According to a second aspect of the present disclosure, a method for preparing a display module is provided, which includes: providing a first heat dissipation component, a circuit board, a display driver chip, and a micro-light-emitting chip, wherein the circuit board is arranged on one side of the first heat dissipation component, and the display driver chip is bonded to the micro-light-emitting chip on a side facing away from the first heat dissipation component; laminating the side of the display driver chip facing away from the micro-light-emitting chip with the side of the first heat dissipation component facing the circuit board; making a conductive area for electrically connecting the display driver chip and the circuit board; and laminating the second heat dissipation component on the side of the display driver chip facing away from the first heat dissipation component.

[0012] In some embodiments of the present disclosure, the second heat dissipation component includes a middle hollow area as large as the micro-light-emitting chip, and the second heat dissipation component is attached to the side of the display driver chip away from the first heat dissipation component, including: aligning the middle hollow area with the micro-light-emitting chip during attachment.

[0013] In some embodiments of the present disclosure, the above-mentioned bonding of the side of the display driver chip facing away from the micro-light-emitting chip with the side of the first heat dissipation component facing the circuit board includes: making an adhesive thermal conductive adhesive layer on the side of the first heat dissipation component facing the circuit board; using the adhesive thermal conductive adhesive layer to bond the side of the display driver chip facing away from the micro-light-emitting chip with the side of the first heat dissipation component facing the circuit board; and the above-mentioned bonding of the second heat dissipation component on the side of the display driver chip facing away from the first heat dissipation component also includes: making an adhesive thermal conductive adhesive layer in the peripheral area surrounding the micro-light-emitting chip on the side of the display driver chip facing away from the first heat dissipation component; using the adhesive thermal conductive adhesive layer to bond the second heat dissipation component on the side of the display driver chip facing away from the first heat dissipation component.

[0014] In some embodiments of the present disclosure, the preparation method further comprises: performing a black brushing treatment on the surface of the second heat dissipation component.

[0015] In various embodiments of the present disclosure, a first heat dissipation component and a second heat dissipation component are respectively disposed on both sides of the display driver chip, forming a dual-channel heat dissipation structure, thereby enhancing the heat dissipation effect on the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly described below. It should be noted that the drawings described below only relate to some embodiments of the present disclosure, but are not intended to limit the present disclosure, wherein:

[0017] Figures 1A-1D are schematic side and top views of the structure of a display module provided according to various embodiments of the present disclosure;

[0018] Figures 2A-2C is a schematic flow chart of a method for preparing a micro display device according to various embodiments of the present disclosure;

[0019] It should be noted that the elements in the drawings are schematic and not drawn to scale. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by those skilled in the art without creative work also fall within the scope of protection of the present disclosure.

[0021] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings as those commonly understood by those skilled in the art to which the subject matter of the present disclosure belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of the specification and the relevant technology, and will not be interpreted in an idealized or overly formal form unless otherwise clearly defined herein. As used herein, statements that two or more parts are "connected" or "coupled" together should refer to these parts being directly combined together or combined through one or more intermediate components. In addition, terms such as "first" and "second" are only used to distinguish one component (or a part of a component) from another component (or another part of a component).

[0022] For ease of description, spatially relative terms such as "upper", "lower", "left", "right", "top", "bottom", etc. may be used here to describe the spatial positional relationship between a device or element and other devices or elements as shown in the figure. For example, the terms "on...", "above...", "above...", "on the upper surface of...", "above", "positioned on..." or "positioned on top of..." etc. mean that a first element such as a first structure exists on a second element such as a second structure, wherein there may or may not be an intermediate element between the first element and the second element. The term "contact" means connecting a first element such as a first structure and a second element such as a second structure, and there may or may not be other elements at the interface of the two elements. It should be understood that spatially relative terms are intended to include different orientations in use or operation other than the orientation of the device described in the figure. For example, if the device in the figure is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures" afterwards. Thus, the exemplary term "above..." may include both "above..." and "below..." orientations. The device may be otherwise oriented, rotated 90 degrees or at other orientations and the spatially relative descriptors used herein interpreted accordingly.

[0023] In existing micro-display technologies, display modules usually do not have a heat dissipation structure or only have a single-channel heat dissipation structure, resulting in a small heat dissipation area and poor heat dissipation effect when the Micro LED is working, which easily affects the display performance of the entire Micro LED display module.

[0024] An embodiment of the present disclosure proposes a display module, which realizes a dual-channel heat dissipation design by arranging a heat dissipation component on each side of a display driver chip. The dual-channel heat dissipation design formed significantly increases the heat dissipation area and improves the heat dissipation effect compared with the single-channel heat dissipation design.

[0025] Figure 1A The side view schematic diagram of the structure of the display module 100 according to the embodiment of the present disclosure is shown. The display module 100 may include a first heat dissipation component 101, a circuit board 102, a display driver chip 103, a micro light emitting chip 104, a conductive area 105, and a second heat dissipation component 106.

[0026] In this embodiment, the circuit board 102 and the display driver chip 103 are arranged on the same side of the first heat dissipation component 101. Optionally, the circuit board 102 and the display driver chip 103 are spaced apart on the same side of the first heat dissipation component 101, that is, the two are not in direct contact. Optionally, the circuit board 102 can adopt a flexible printed circuit (Flexible Printed Circuit, referred to as FPC), which is a highly reliable and excellently flexible printed circuit board made of polyimide or polyester film as a substrate, and has the characteristics of high wiring density, light weight, thin thickness, and good bendability.

[0027] The display driver chip 103 is bonded to the micro-light emitting chip 104 on the side away from the first heat dissipation component 101. The micro-light emitting chip 104 may include a plurality of micro-light emitting units that can emit light independently, and the plurality of micro-light emitting units are arranged in an array. The display driver chip 103 can perform display driving on the micro-light emitting chip 104. Optionally, the micro-light emitting chip 104 covers a part of the area on the side of the display driver chip 103 away from the first heat dissipation component 101, that is, there is still a part of the area on this side that is not covered by the micro-light emitting chip 104. Generally, areas such as the display driver chip 103 and the micro-light emitting chip 104 generate more heat when the display module is working, and the heat dissipation demand of the relevant areas is relatively strong.

[0028] The conductive area 105 electrically connects the display driver chip 103 and the circuit board 102. That is, the display driver chip 103 and the circuit board 102 can be electrically connected through the conductive area 105. Optionally, the conductive area can be any medium that can transmit electrical signals. Figure 1A The conductive area 105 described in the figure is only an example, and the conductive area 105 can be in various forms, including but not limited to conductive lines and conductive layers. The number of the conductive area 105 can be one or more.

[0029] The second heat dissipation component 106 is disposed on the side of the display driver chip 103 away from the first heat dissipation component 101. The second heat dissipation component 106 can be made of a metal or non-metal material with high thermal conductivity. Figure 1A The specific position, shape and number of the second heat dissipation component 106 shown in the figure are only examples. The second heat dissipation component 106 can be any shape that satisfies the description. The number of the second heat dissipation component 106 can be one or more. Optionally, since the second heat dissipation component 106 is disposed on the side of the display driver chip 103 away from the first heat dissipation component 101, that is, it is located on the same side of the display driver chip 103 as the micro-light emitting chip 104. Optionally, the micro-light emitting chip 104 and the second heat dissipation component 106 on the same side of the display driver chip 103 may be in contact or not.

[0030] Optionally, a transparent cover plate 107 may be provided on the side of the micro-light emitting chip 104 away from the display driver chip 103. The transparent cover plate 107 can effectively block dust, moisture and other harmful substances to ensure that the micro-light emitting chip 104 works stably in various environments. In addition, the transparent cover plate 107 allows the light emitted by the micro-light emitting chip 104 to pass through, which can enhance the transmittance and uniformity of the light and improve the luminous effect.

[0031] In this embodiment, the display driver chip uses a first heat dissipation component shared with the circuit board on one side for heat dissipation, and a second heat dissipation component is set on the other side for heat dissipation, forming an upward and downward dual-channel heat dissipation structure for the display module, especially the display driver chip, which increases the heat dissipation area and significantly improves the heat dissipation effect compared to the single-channel structure. In addition, the first heat dissipation component can be shared by the display driver chip and the circuit board to achieve heat dissipation for the display driver chip and the circuit board at the same time, which increases the heat dissipation performance while reducing the use of additional heat dissipation components and simplifying the product structure.

[0032] In some embodiments of the present disclosure, the second heat dissipation component 106 includes a middle hollow area that is as large as the micro-light-emitting chip 104, and the middle hollow area is arranged in alignment with the micro-light-emitting chip 104. The side view and top view of the relevant structure can be referred to respectively. Figure 1A and Figure 1B .like Figure 1A and 1B As shown, the second heat dissipation component 106 is set as a middle hollow structure, wherein the middle hollow area of ​​the second heat dissipation component 106 is the same size as the micro-light-emitting chip 104, and the middle hollow area is aligned with the micro-light-emitting chip 104. The alignment setting can make the projection of the middle hollow area overlap with the micro-light-emitting chip 104, that is, the light emitted by the micro-light-emitting chip 104 can just be irradiated to the outside through the middle hollow area of ​​the second heat dissipation component 106. With this middle hollow structure, on the one hand, the middle hollow area can allow the light of the micro-light-emitting chip 104 to be smoothly emitted without blocking the light path, and on the other hand, the second heat dissipation component 106 with this middle hollow structure can directly dissipate heat for the peripheral area surrounding the light-emitting chip on one side of the display driver chip, and can increase the heat dissipation area as much as possible, thereby further improving the heat dissipation effect of the dual-channel heat dissipation structure. For example, the second heat dissipation component can be designed as a rectangular ring structure with a middle hollow, and its hollowed middle area is a rectangle of the same size as the micro-light-emitting chip.

[0033] Optionally, the display module may further include a transparent cover plate 107, which may be disposed in the hollow area of ​​the second heat dissipation component 106. In this way, the display driver chip in the non-luminous area may use the dual-channel heat dissipation structure of the first heat dissipation component and the second heat dissipation component for heat dissipation, and the luminous area, i.e., the micro-luminous chip, may also use the glass cover plate 107 for heat dissipation, thereby further improving the overall heat dissipation effect.

[0034] In some embodiments of the present disclosure, the display driver chip 103 and the first heat dissipation component 101 and the display driver chip 103 and the second heat dissipation component 106 are bonded together by bonding a thermally conductive adhesive layer 108. Figure 1C .like Figure 1C As shown, a bonding thermally conductive adhesive layer 108 is provided between the display driver chip 103 and the first heat dissipation component 101 and between the display driver chip 103 and the second heat dissipation component 106. The bonding thermally conductive adhesive layer 108 can use various colloid materials with bonding and high thermal conductivity effects. It should be noted that the bonding thermally conductive adhesive layer 108 used between the display driver chip 103 and the first heat dissipation component 101 and the bonding thermally conductive adhesive layer 108 used between the display driver chip 103 and the second heat dissipation component 106 can use the same colloid material or different colloid materials. In the display modules of these embodiments, on the one hand, the bonding thermally conductive adhesive layer 108 has a bonding effect, which can realize a fixed connection between different structures. On the other hand, the bonding thermally conductive adhesive layer 108 also has a thermally conductive effect, which can better transfer the heat of the display driver chip to the first heat dissipation component 101 and the second heat dissipation component 106, so as to better dissipate heat through the first heat dissipation component 101 and the second heat dissipation component 106, and achieve a better overall heat dissipation effect.

[0035] In some embodiments of the present disclosure, the thermally conductive adhesive layer 108 between the display driving chip 103 and the second heat dissipation component 106 is disposed in a peripheral area surrounding the micro light emitting chip 104 . Figure 1C and Figure 1D The side view and top view of the structure of the display module 100 in this embodiment are shown respectively. In order to facilitate observation of the position and structure of the bonding thermal conductive adhesive layer 108, Figure 1D The second heat dissipation component 106 is omitted in the figure, and the focus is on the adhesive thermal conductive adhesive layer 108 between the display driver chip 103 and the second heat dissipation component 106. Figure 1DAs shown, the display driver chip 103 is away from the side of the first heat dissipation component 101, and there is a peripheral area that is not covered by the micro-light-emitting chip 104. In these peripheral areas, an adhesive thermal conductive adhesive layer 108 can be set, and the adhesive thermal conductive adhesive layer 108 is used to achieve the bonding of the display driver chip 103 and the second heat dissipation component 106. In the technical solution of this embodiment, the adhesive thermal conductive adhesive layer surrounds the micro-light-emitting chip, which can increase the contact area with the display driver chip as much as possible, and enhance the heat dissipation effect that can be conducted to the second heat dissipation component through the adhesive thermal conductive adhesive layer. Optionally, there is a spacing area between the adhesive thermal conductive adhesive layer 108 and the micro-light-emitting chip array 104, that is, the adhesive thermal conductive adhesive layer 108 and the micro-light-emitting chip 104 are not in contact, thereby avoiding the potential influence of the adhesive thermal conductive adhesive layer 108 on the photoelectric performance of the micro-light-emitting chip 104.

[0036] In some embodiments of the present disclosure, the surface of the second heat dissipation component 106 is black. Compared with other colors, black can better dissipate heat to the air when in contact with the air. In this embodiment, the second heat dissipation component is located above the driver chip and the micro-light-emitting chip array and can be in contact with the air. Designing its surface to be black is conducive to further improving the heat dissipation effect to the air. Optionally, the second heat dissipation component 106 can be made by pre-brushing the surface black.

[0037] In some embodiments of the present disclosure, the first heat dissipation component 101 is a heat dissipation substrate integrally formed with the circuit board 102, and the circuit board 102 includes a portion 109 extending from the heat dissipation substrate. Figure 1C and 1DThe corresponding part in the heat dissipation substrate. The heat dissipation substrate can be a substrate with heat dissipation capability, and the bottom of the display driver chip can be arranged on the heat dissipation substrate. On the one hand, it can play the bearing role that the substrate can have, and on the other hand, it also has heat dissipation capability. Optionally, the heat dissipation substrate can adopt a monomer structure of a material with high heat dissipation performance and bearing performance, including but not limited to an aluminum substrate, a copper substrate, and a ceramic substrate. In this embodiment, the first heat dissipation component 101 adopts a heat dissipation substrate, which is equivalent to integrating the heat dissipation function and the bearing function into one component, which is conducive to reducing the overall structural complexity. In addition, the first heat dissipation component 101 is formed integrally with the circuit board 102, which is also conducive to further reducing the process difficulty of combining with other components to manufacture the display module in the later stage. In addition, the circuit board 102 includes a portion 109 extending from the heat dissipation substrate, and the extended portion 109 can also be used to connect with other electronic components, so that the overall structural availability is further increased. That is, in this embodiment, the heat dissipation and bearing functions are realized simultaneously using the heat dissipation substrate, the integrated forming of the heat dissipation substrate and the circuit board, and the portion of the circuit board design extending from the heat dissipation substrate can further reduce the structural complexity and manufacturing difficulty of the display module while improving the heat dissipation effect.

[0038] The present disclosure also provides a display device, which includes a display module 100. The structure of the display module 100 can refer to Figures 1A-1D In addition, the display device may also include other components, which are not limited here. The display device can be applied to any product with a display function, such as electronic paper, mobile phones, tablet computers, televisions, laptops, digital photo frames, wearable devices or navigators.

[0039] Figure 2A A schematic flow chart of a method 20 for preparing a display module according to an embodiment of the present disclosure is shown.

[0040] In step 201, a first heat dissipation component, a circuit board, a display driver chip, and a micro light-emitting chip are provided. The circuit board is arranged on one side of the first heat dissipation component, and the display driver chip is bonded to the micro light-emitting chip on a side away from the first heat dissipation component.

[0041] In this embodiment, the circuit board and the first heat dissipation component can be prefabricated and integrated together. Optionally, in the prefabricated structure, the circuit board can be arranged in a partial area on one side of the first heat dissipation component. Optionally, the two can be combined together in various ways.

[0042] The display driver chip is bonded to the micro light-emitting chip on the side facing away from the first heat dissipation component. That is, the side of the display driver chip can be pre-bonded to the backlight side of the micro light-emitting chip to form a light-emitting module. Optionally, in the formed module, the micro light-emitting chip can be arranged in a partial area on the side of the display driver chip.

[0043] In step 202, a side of the display driver chip facing away from the micro-light-emitting chip is attached to a side of the first heat dissipation component facing the circuit board.

[0044] In this embodiment, when the display driver chip is bonded to the first heat dissipation component, the bonding area of ​​the display driver chip is on the side away from the micro-light-emitting chip, and the bonding area of ​​the first heat dissipation component is on the side facing the circuit board. That is, after the two are bonded, the display driver chip and the circuit board are arranged on the same side of the first heat dissipation component.

[0045] Optionally, the display driver chip and the circuit board may be spaced apart, that is, they are not in contact with each other, so as to avoid interference between them.

[0046] In step 203, a conductive area for electrically connecting the display driver chip and the circuit board is manufactured.

[0047] In this embodiment, for the display driver chip and the circuit board, a conductive area for electrically connecting the two can be made. The specific process and method of making the conductive area can be determined according to actual functional requirements. Optionally, the made conductive area can be a conductive metal wire.

[0048] Optionally, the conductive area can be electrically connected to the side of the display driver chip away from the first heat dissipation component and the side of the circuit board away from the first heat dissipation component. This method of making the conductive area is easier to implement, which is conducive to reducing the overall manufacturing difficulty and cost of the display module. Optionally, when making the conductive area, ensure that the conductive area does not contact the second heat dissipation component to avoid interference of the second heat dissipation component with the electrical signal of the display module.

[0049] In step 204, a second heat dissipation component is attached to a side of the display driver chip that is away from the first heat dissipation component.

[0050] In this embodiment, the second heat dissipation component is attached to the side of the display driving chip away from the first heat dissipation component.

[0051] In the display module prepared by the preparation method of this embodiment, a first heat dissipation component shared with the circuit board is used on one side of the display driver chip for heat dissipation, and a second heat dissipation component is set on the other side for heat dissipation, forming a dual-channel heat dissipation structure for the display module, especially the display driver chip, which increases the heat dissipation area and significantly improves the heat dissipation effect compared to the single-channel structure. In addition, the first heat dissipation component can be shared by the display driver chip and the circuit board for heat dissipation, which also reduces the use of additional heat dissipation components and simplifies the product structure.

[0052] Optionally, the preparation method 20 may further include: attaching a transparent cover plate to the side of the micro light-emitting chip away from the display driver chip. The transparent cover plate can effectively block dust, moisture and other harmful substances to protect the light-emitting chip while allowing light from the light-emitting chip to pass through.

[0053] In some embodiments of the present disclosure, the second heat dissipation component includes a middle hollow area as large as the micro-light-emitting chip, and step 204 may include: aligning the middle hollow area with the micro-light-emitting chip during lamination. In these embodiments, the second heat dissipation component includes a middle hollow area. That is, when the second heat dissipation component is pre-made, it can be designed as a middle hollow structure. The middle hollow area is as large as the micro-light-emitting chip, that is, the middle hollow area and the micro-light-emitting chip are the same in shape and size. Optionally, the micro-light-emitting chip is a rectangular structure, and the middle hollow area included in the second heat dissipation component can be a rectangular structure with the same size as the micro-light-emitting chip. For example, the second heat dissipation component can be designed as a rectangular ring structure, and its hollowed middle area is a rectangular structure with the same size as the micro-light-emitting chip. When laminating in step 204, the middle hollow area is aligned with the micro-light-emitting chip. That is, the light-emitting area of ​​the micro-light-emitting chip can be completely emitted through the hollow area without being blocked. In this embodiment, the contact area between the second heat dissipation component and the display driver chip can be maximized without blocking the micro-light-emitting chip, thereby maximizing the heat dissipation effect. Optionally, when attaching the transparent cover plate, the transparent cover plate may be attached to the middle hollow area of ​​the second heat dissipation component.

[0054] In some embodiments of the present disclosure, step 202 may include: Figure 2B The various sub-steps shown in step 204 may include the following: Figure 2CSub-steps shown. Specifically, step 202 may include: sub-step 2021, making an adhesive thermal conductive adhesive layer on the side of the first heat dissipation component facing the circuit board; sub-step 2022, using the adhesive thermal conductive adhesive layer to bond the side of the display driver chip away from the micro-light-emitting chip to the side of the first heat dissipation component facing the circuit board. Step 204 may also include: sub-step 2041, making an adhesive thermal conductive adhesive layer in the peripheral area surrounding the micro-light-emitting chip on the side of the display driver chip away from the first heat dissipation component; sub-step 2042, using the adhesive thermal conductive adhesive layer to bond the second heat dissipation component on the side of the display driver chip away from the first heat dissipation component; step 2043, aligning the middle hollow area with the micro-light-emitting chip during bonding. In this embodiment, the display driver chip can be bonded to the first heat dissipation component and the second heat dissipation component respectively by means of the manufactured adhesive thermal conductive adhesive layer. On the one hand, the adhesive thermal conductive adhesive layer can play a bonding and fixing role. On the other hand, the high thermal conductivity of the adhesive thermal conductive adhesive layer can also enhance the heat dissipation performance of the display driver chip to the first heat dissipation component and the second heat dissipation component, thereby achieving a better heat dissipation effect. In addition, the adhesive thermal conductive adhesive layer is manufactured in the peripheral area surrounding the micro light-emitting chip, which can also further improve the bonding and thermal conductivity area of ​​the adhesive thermal conductive adhesive layer, thereby achieving a better bonding and heat dissipation effect.

[0055] In some embodiments of the present disclosure, the preparation method 20 further includes: brushing the surface of the second heat dissipation component with black. Optionally, the brushing the surface of the second heat dissipation component with black in step 205 can be performed before step 201 or after step 201. Compared with other colors, black can better dissipate heat to the air when in contact with the air. In the display module prepared by the preparation method of this embodiment, the second heat dissipation component is located above the driving chip and the micro-light-emitting chip array and can be in contact with the air. After the surface of the second heat dissipation component is brushed with black, the black second heat dissipation component is conducive to further improving the heat dissipation effect to the air.

[0056] In some embodiments of the present disclosure, the manufacturing method 20 of the display module may further include: preparing an integrated circuit board and a first heat dissipation component, the first heat dissipation component is a heat dissipation substrate, and the circuit board includes a portion extending from the heat dissipation substrate. In this embodiment, the integrated design of heat dissipation and carrying in the heat dissipation substrate, the integrated molding of the heat dissipation substrate and the circuit board, and the portion of the circuit board design extending from the heat dissipation substrate can further reduce the structural complexity and manufacturing difficulty of the display module while improving the heat dissipation effect, and can improve the usability.

[0057] The flow chart and block diagram in the accompanying drawings show the possible architecture, function and operation of the device and method according to multiple embodiments of the present disclosure. In this regard, each square box in the flow chart or block diagram can represent a part of a module, a program segment or an instruction, and a part of the module, a program segment or an instruction includes one or more executable instructions for realizing the specified logical function. In some alternative implementations, the functions marked in the square box can also occur in a sequence different from that marked in the accompanying drawings. For example, two continuous square boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each square box in the block diagram and / or flow chart, and the combination of the square boxes in the block diagram and / or flow chart can be implemented with a dedicated hardware-based system that performs a specified function or action, or can be implemented with a combination of special hardware and computer instructions.

[0058] Unless the context clearly indicates otherwise, the singular form of the words used herein and in the appended claims includes the plural and vice versa. Thus, when referring to the singular, the plural form of the corresponding term is generally included. Similarly, the words "comprise" and "include" are to be interpreted as inclusive rather than exclusive. Likewise, the terms "include" and "or" should be interpreted as inclusive unless such interpretation is expressly prohibited herein. Where the term "example" is used herein, particularly when it is located after a group of terms, the "example" is merely exemplary and illustrative and should not be considered exclusive or comprehensive.

[0059] Further aspects and scopes of adaptability become apparent from the description provided herein. It should be understood that various aspects of the present application can be implemented individually or in combination with one or more other aspects. It should also be understood that the description and specific embodiments herein are intended for purposes of illustration only and are not intended to limit the scope of the present application.

[0060] Several embodiments of the present disclosure are described in detail above, but it is obvious that those skilled in the art can make various modifications and variations to the embodiments of the present disclosure without departing from the spirit and scope of the present disclosure. The protection scope of the present disclosure is defined by the attached claims.

Claims

1. A display module, characterized in that: The display module includes a first heat dissipation component, a circuit board, a display driver chip, a micro-light-emitting chip, a conductive area, and a second heat dissipation component. The circuit board and the display driver chip are arranged on the same side of the first heat dissipation component, the display driver chip is bonded to the micro-light-emitting chip on a side away from the first heat dissipation component, the conductive area electrically connects the display driver chip and the circuit board, and the second heat dissipation component is arranged on a side of the display driver chip away from the first heat dissipation component.

2. The display module according to claim 1, characterized in that: The second heat dissipation component includes a middle hollow area that is as large as the micro light-emitting chip, and the middle hollow area is arranged in alignment with the micro light-emitting chip.

3. The display module according to claim 2, characterized in that: The display driver chip and the first heat dissipation component are bonded together, as well as the display driver chip and the second heat dissipation component are bonded together by a thermally conductive adhesive layer.

4. The display module according to claim 3, characterized in that: The adhesive thermal conductive adhesive layer between the display driving chip and the second heat dissipation component is arranged in a peripheral area surrounding the micro light emitting chip.

5. The display module according to any one of claims 1 to 4, characterized in that: The surface of the second heat dissipation component is black.

6. The display module according to any one of claims 1 to 4, characterized in that: The first heat dissipation component is a heat dissipation substrate formed integrally with the circuit board, and the circuit board includes a portion extending from the heat dissipation substrate.

7. A method for preparing a display module, characterized in that: The preparation method comprises: A first heat dissipation component, a circuit board, a display driver chip, and a micro light-emitting chip are provided, wherein the circuit board is arranged on one side of the first heat dissipation component, and one side of the display driver chip is bonded to the micro light-emitting chip; Laying the side of the display driver chip away from the micro-light-emitting chip to the side of the first heat dissipation component facing the circuit board; Making a conductive area for electrically connecting the display driver chip to the circuit board; A second heat dissipation component is attached to a side of the display driving chip away from the first heat dissipation component.

8. The preparation method according to claim 7, characterized in that: The second heat dissipation component includes a middle hollow area as large as the micro light-emitting chip, and A second heat dissipation component is attached to a side of the display driver chip away from the first heat dissipation component, comprising: During lamination, the middle hollow area is aligned with the micro light-emitting chip.

9. The preparation method according to claim 8, characterized in that: The step of attaching a side of the display driver chip facing away from the micro-light-emitting chip to a side of the first heat dissipation component facing the circuit board includes: Making a bonding thermal conductive adhesive layer on the side of the first heat dissipation component facing the circuit board; Using the adhesive thermal conductive adhesive layer to bond the side of the display driver chip away from the micro light-emitting chip to the side of the first heat dissipation component facing the circuit board; and The second heat dissipation component is attached to the side of the display driver chip away from the first heat dissipation component, and further includes: Making a bonding thermal conductive adhesive layer in a peripheral area surrounding the micro light-emitting chip on a side of the display driving chip away from the first heat dissipation component; The second heat dissipation component is attached to the side of the display driving chip away from the first heat dissipation component by using the adhesive thermal conductive adhesive layer.

10. The preparation method according to any one of claims 7 to 9, characterized in that: The preparation method further comprises: The surface of the second heat dissipation component is subjected to black brushing treatment.

Images