Light-emitting diode (LED) flat foot support structure

Abstract

The invention relates to the technical field of packaging, and particularly discloses an LED (light-emitting diode) flat-foot support structure, which comprises a substrate, a plurality of LED flat-foot supports and a plurality of LED flat-foot supports, wherein a bonding pad is arranged in the substrate, pins are arranged on two sides of the bonding pad, and the pins extend to the outside of the substrate; a cup body is arranged on one side of the substrate, the substrate is smaller than the cup body, and the pins are located below the cup body, do not make contact with the cup body and are flush with the bottom of the substrate; through the design of the cup body, additional protection and packaging can be provided for electronic elements on the substrate, meanwhile, the pins are located below the cup body but not in contact with the cup body, it is ensured that connection between the pins and an external circuit is not interfered, and the bottom is flat, so that installation is more convenient and smoother.

Description

Technical Field

[0001] The invention belongs to the technical field of packaging, and in particular relates to an LED flat-leg bracket structure. Background Art

[0002] In the field of electronic equipment, substrates are important components that connect and support various electronic components. Their design and manufacturing technology has always been the focus of the industry.

[0003] Traditional substrate designs often focus only on basic electrical connection functions, while ignoring ease of use, stability, and reliability in practical applications. Pins are the primary way to connect the substrate to external circuits, and their design and layout directly affect the performance and stability of the entire electronic device. However, in traditional substrate designs, pins are often directly exposed to the outside and are easily interfered with and damaged by the external environment, thus affecting the stability of the electrical connection.

[0004] Therefore, in order to solve the above problems, the present invention proposes a new substrate design method. Summary of the Invention

[0005] The object of the present invention is to provide an LED flat-leg bracket structure to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] An LED flat-leg bracket structure, comprising:

[0008] A substrate, wherein a pad is provided inside the substrate, pins are provided on both sides of the pad, and the pins extend to the outside of the substrate;

[0009] A cup body is provided on one side of the substrate. The substrate is smaller than the cup body. The pins are located below the cup body and do not contact the cup body and are flush with the bottom of the substrate.

[0010] Preferably, a cup cavity is provided through the interior of the cup body, and an inner groove is provided on the edge of the cup cavity.

[0011] Preferably, an IC chip and an LED chip are arranged on the pad.

[0012] Preferably, a stepped groove is provided at the end of the pin.

[0013] Preferably, the surface of the pin is covered with a metallized protective layer.

[0014] Preferably, a fool-proof mark is provided at the bottom of the substrate, and the fool-proof mark is at least one of a rounded corner / a right angle and a "T / ▲" shape.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] (1) The cup design can provide additional protection and packaging for the electronic components on the substrate. At the same time, the pins are located under the cup but do not touch it, ensuring that the connection between the pins and the external circuit is not disturbed. The flat bottom also makes it more convenient and flat to install.

[0017] (2) The provision of the stepped groove helps to improve the contact stability and firmness between the pin and the external connector, thereby improving the reliability of the electrical connection. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is one of the three-dimensional diagrams of the present invention;

[0019] Figure 2 An exploded view of the present invention;

[0020] Figure 3 This is the second stereogram of the present invention;

[0021] Figure 4 This is a schematic diagram of the four-legged state of the present invention;

[0022] In the figure: 1. Substrate; 2. Solder pad; 3. Cup body; 4. Pin; 5. Cup cavity; 6. Inner groove; 7. IC chip; 8. LED chip. DETAILED DESCRIPTION

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0024] Example 1:

[0025] See also Figure 1-Figure 3 As shown, an LED flat-leg bracket structure includes:

[0026] A substrate 1 is provided with a pad 2 inside the substrate 1, and pins 4 are provided on both sides of the pad 2. The pins 4 extend to the outside of the substrate 1, and the number of pins 4 is four or six;

[0027] A cup body 3 is provided on one side of the substrate 1 . The substrate 1 is smaller than the cup body 3 . The pins 4 are located below the cup body 3 and do not contact the cup body 3 . The pins 4 are flush with the bottom of the substrate 3 .

[0028] In one embodiment of the present invention, a cup cavity 5 is formed through the interior of the cup body 3 , and an inner groove 6 is provided on the edge of the cup cavity 5 .

[0029] In one embodiment of the present invention, an IC chip 7 and an LED chip 8 are disposed on the pad 2 .

[0030] In one embodiment of the present invention, a stepped groove is provided at the end of the pin 4 .

[0031] In one embodiment of the present invention, the surface of the pin 4 is covered with a metallized protective layer.

[0032] In one embodiment of the present invention, a fool-proof mark is provided on the bottom of the substrate 1, and the fool-proof mark is at least one of a rounded corner / a right angle and a "T / ▲" shape.

[0033] As can be seen from the above, the design of the cup body 3 can provide additional protection and packaging for the electronic components on the substrate 1. At the same time, the pins 4 are located below the cup body 3 but do not touch it, ensuring that the connection between the pins 4 and the external circuit is not disturbed.

[0034] The inner groove 6 is used to increase the contact area after packaging and improve the packaging effect;

[0035] This layout enables the IC chip 7 and the LED chip 8 to be tightly integrated on the substrate 1, contributing to a more compact design and potentially improving the performance and response speed of the electronic device;

[0036] The stepped groove helps to improve the contact stability and firmness between pin 4 and the external connector, thereby improving the reliability of the electrical connection;

[0037] The metallized protective layer may provide additional corrosion and wear resistance, extend the service life of pin 4, and may improve the stability of the electrical connection;

[0038] The fool-proofing mark helps to correctly identify and align the substrate 1 during the assembly or installation process, reducing errors and rework, thereby improving production efficiency and product quality.

[0039] All standard parts used in the present invention can be purchased commercially, and special-shaped parts can be customized according to the description in the specification and drawings. The specific connection methods of each part adopt conventional means such as bolts, rivets, welding, etc. that are mature in the prior art. The machinery, parts and equipment all adopt conventional models in the prior art. In addition, the circuit connections adopt conventional connection methods in the prior art and will not be described in detail here. Any matters not described in detail in this specification belong to the prior art known to professionals in this field.

[0040] In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. "Multiple" means two or more, unless otherwise specifically defined.

[0041] In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "connect," "fixed," etc. should be understood broadly. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0042] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0043] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0044] In the drawings of the embodiments disclosed in the present invention, only the structures related to the embodiments disclosed in the present invention are involved. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present invention can be combined with each other.

[0045] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A LED flat foot bracket structure, It is characterized in that include: A substrate (1), wherein a solder pad (2) is arranged inside the substrate (1), pins (4) are arranged on both sides of the solder pad (2), and the pins (4) extend to the outside of the substrate (1); A cup body (3) is provided on one side of the substrate (1); the substrate (1) is smaller than the cup body (3); the pin (4) is located below the cup body (3) and does not contact the cup body (3), and is flush with the bottom of the substrate (3).

2. The LED flat-leg bracket structure according to claim 1, Features: A cup cavity (5) is provided through the interior of the cup body (3), and an inner groove (6) is provided on the edge of the cup cavity (5).

3. The LED flat-leg bracket structure according to claim 1, Features: An IC chip (7) and an LED chip (8) are arranged on the soldering pad (2).

4. The LED flat-leg bracket structure according to claim 1, Features: A stepped groove is provided at the end of the pin (4).

5. The LED flat-leg bracket structure according to claim 1, Features: The surface of the pin (4) is covered with a metallized protective layer.

6. The LED flat-leg bracket structure according to claim 1, Features: The bottom of the substrate (1) is provided with an anti-fool mark, and the anti-fool mark is at least one of a rounded corner / a right angle and a "T / ▲" shape.

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