Low-residual-pressure high-voltage discharge tube and its production process

By improving the structure of the ring electrode and conductive carbon wire, and combining specific process gases and electronic powder coatings, the environment inside the discharge chamber was optimized, solving the problem of high residual voltage in the discharge tube during EMC surge testing. This enabled the production of low residual voltage high-voltage discharge tubes, protecting the core chips of subsequent circuits.

CN119134047BActive Publication Date: 2026-03-24JIANGSU LIANQUN ELECTRONIC TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-09-02
Publication Date
2026-03-24

AI Technical Summary

Technical Problem

Existing discharge tubes exhibit high residual voltage and slow response speed during EMC surge tests, leading to problems such as power supply motherboard crashes and resets, indicating weak protection capabilities.

Method used

By employing a ring electrode and conductive carbon wire structure, combined with a specific process gas and electronic powder coating formulation, the environment inside the discharge chamber is optimized, residual pressure is reduced, and reaction rate is increased.

Benefits of technology

It effectively reduces residual voltage, improves the response speed of the discharge tube, protects the core chip of the subsequent circuit, and meets the requirements of the terminal circuit.

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Abstract

The application is suitable for the technical field of gas discharge tube, and provides a low-residual-pressure high-voltage discharge tube and a production and manufacturing process thereof. The low-residual-pressure high-voltage discharge tube comprises a metallized ceramic tube and two ring electrodes. At least one conductive carbon wire is fixedly arranged on the inner side wall of the metallized ceramic tube. The two ring electrodes are fixedly arranged at the two end openings of the metallized ceramic tube, respectively. The ring electrodes and the metallized ceramic tube form a sealed discharge chamber through a packaging device. The discharge chamber is filled with process gas, which comprises argon, nitrogen, hydrogen, helium and the like. The protruding part of the ring electrode is high-temperature solidified to set electronic powder coating. The electronic powder coating is prepared by mixing a plurality of metal salt powders and metal powders. Through the improvement of the electronic powder coating formula of the discharge end of the ring electrode and the improvement of the process gas formula in the discharge chamber, the residual pressure is reduced, and the residual pressure is close to the direct current voltage.
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Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of gas discharge tube, and provides a low-residual-voltage high-voltage discharge tube and a production and manufacturing process thereof. BACKGROUND

[0002] The discharge tube is a high-voltage protection element used at the input end of equipment. When the voltage at both ends of the discharge tube is higher than the protection specification value, a short circuit phenomenon occurs in the discharge tube, and the input overvoltage is absorbed. In the EMC surge test of the current market, the residual voltage of the ordinary discharge tube is generally 1000V-1500V higher than the direct current breakdown voltage. The product has a slow response, which leads to weak protection capability and causes problems such as power mainboard crash and reset. Therefore, it is necessary to design a new type of low-residual-voltage high-voltage discharge tube to effectively reduce the residual voltage in the EMC surge test, improve the response speed, and effectively protect the core chip of the subsequent circuit. SUMMARY

[0003] Therefore, the application provides a low-residual-voltage high-voltage discharge tube and a production and manufacturing process thereof. The residual voltage is reduced by improving the formula of the electronic powder coating on the annular electrode discharge end and improving the formula of the process gas in the discharge chamber, so that the residual voltage is close to the direct current voltage.

[0004] In order to achieve the above-mentioned purpose, the application provides the following technical scheme: a low-residual-voltage high-voltage discharge tube, comprising:

[0005] A metalized ceramic tube, at least one conductive carbon wire is fixedly arranged on the inner side wall of the metalized ceramic tube;

[0006] Two annular electrodes are fixedly arranged at the two end openings of the metalized ceramic tube, respectively, the two annular electrodes and the metalized ceramic tube form a sealed discharge chamber, the discharge chamber is filled with process gas, the annular electrode comprises a protruding part, the protruding part is arranged in the discharge chamber, and the protruding part is fixedly provided with an electronic powder coating.

[0007] Further, the process gas is mixed by at least the following volume fractions of gas: 1-3 parts of argon, 5-6 parts of nitrogen, 0.5-1.5 parts of hydrogen, and 0.5 parts of helium.

[0008] Further, the electronic powder coating is prepared by mixing at least the following weight fractions of metal salt powder or metal powder: 20-30 parts of sodium bromide, 5-10 parts of sodium silicate, 2-8 parts of titanium dioxide, 6-8 parts of potassium silicate, 1-6 parts of zirconium oxide, 1-3 parts of cesium carbonate, 1-3 parts of cesium tungstate, 1-3 parts of cesium silicate, 1-3 parts of potassium chloride, 2 parts of nickel powder, and 2 parts of aluminum powder.

[0009] Further, the number of the conductive carbon wires is four, and the four conductive carbon wires are arranged in a ring array on the inner side wall of the metalized ceramic tube with an interval of 90 degrees.

[0010] Further, a grid slot is arranged at the middle position of the end surface of the convex part, and the electronic powder coating is arranged in the grid slot.

[0011] Meanwhile, a production process of the low-residual-voltage high-voltage discharge tube is also provided, which comprises the following steps:

[0012] S1. The electronic coating is applied in the grid slot of the convex part of the two ring electrodes by a coating tool, and then the two ring electrodes are placed in an oven for baking to solidify the electronic coating;

[0013] S2. A plurality of conductive carbon wires are arranged on the inner side wall of the metalized ceramic tube, and then the two ring electrodes prepared in the step S1 are respectively installed at two ends of the metalized ceramic tube;

[0014] S3. The metalized ceramic tube and the two ring electrodes assembled in the step S2 are placed in a vacuum packaging device for packaging, in which the air in the discharge chamber is first extracted, then the process gas is injected into the discharge chamber, and finally the connection position of the metalized ceramic tube and the two ring electrodes is sealed and connected.

[0015] Further, in the step S3, the packaging temperature is 820-850 DEG C.

[0016] Further, in the step S3, the connection position of the metalized ceramic tube and the two ring electrodes is sealed and connected by welding.

[0017] Compared with the prior art, the beneficial effects of the present application are:

[0018] 1. In the present application, the ring electrode is adopted to increase the through-flow capacity, change the pulse discharge gap, reduce the residual voltage, and effectively reduce the residual voltage by optimizing the electronic powder coating formula of the discharge end of the ring electrode and the formula of the process gas in the discharge chamber.

[0019] 2. The conductive carbon wires are arranged on the inner side wall of the metalized ceramic tube to effectively reduce the pulse breakdown voltage, and four conductive carbon wires are arranged to prevent the remaining conductive carbon wires from working when a single conductive carbon wire fails, thereby ensuring the effect of reducing the pulse breakdown voltage. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 is a decomposition structure diagram of the low-residual-voltage high-voltage discharge tube mentioned in the present application;

[0021] Figure 2It is an internal structure cutaway schematic view of a low residual voltage high voltage discharge tube mentioned in the present application.

[0022] In the figure: 1, metalized ceramic tube, 2, ring electrode, 21, protruding part, 3, electronic powder coating, 4, conductive carbon wire. DETAILED DESCRIPTION

[0023] The preferred embodiments of the present application are described below in conjunction with the accompanying drawings, it should be understood that the preferred embodiments described here are only used to illustrate and explain the present application, and are not used to limit the present application.

[0024] Example 1, refer to the attached Figure 1 ~ attached Figure 2 The present application provides a low residual voltage high voltage discharge tube, including a metalized ceramic tube 1 and two ring electrodes 2, four conductive carbon wires 4 are fixedly arranged on the inner side wall of the metalized ceramic tube 1, the two ring electrodes 2 are fixedly arranged at the two end openings of the metalized ceramic tube 1, the four conductive carbon wires 4 are arranged in a ring array at the middle part of the inner side wall of the metalized ceramic tube 1 at intervals of 90°, the conductive carbon wire 4 can effectively reduce the pulse breakdown voltage, the four conductive carbon wires 4 are all single working, in the case of failure of one or more conductive carbon wires 4, the remaining conductive carbon wires 4 can still achieve the effect of reducing the pulse breakdown voltage; the two ring electrodes 2 are fixedly arranged at the two end openings of the metalized ceramic tube 1, the two ring electrodes 2 and the inner space of the metalized ceramic tube 1 form a sealed discharge chamber, the discharge chamber is filled with process gas, the process gas is prepared by mixing a plurality of gases, including argon, nitrogen, hydrogen and helium, while realizing the product direct current voltage, the residual voltage can be effectively reduced, the ring electrode 2 includes a protruding part 21, the protruding part 21 is arranged in the discharge chamber, a grid groove is arranged at the middle position of the end face of the protruding part 21, an electronic powder coating 3 is added in the grid groove, the structure of the grid groove is used to increase the adhesion of the electronic powder coating 3 and improve its service life, and the electronic powder coating 3 is prepared by mixing a plurality of metal salt powders and metal powders, including sodium bromide, sodium silicate, titanium dioxide, potassium silicate, zirconium oxide, cesium carbonate, cesium tungstate, cesium silicate, potassium chloride, nickel powder and aluminum powder, which can improve the flow capacity and reduce the pulse voltage.

[0025] Meanwhile, the present embodiment also provides a production and manufacturing process of a low residual voltage high voltage discharge tube, including the following steps:

[0026] S1. The electronic coating is applied in the grid groove of the protruding part 21 of the two ring electrodes 2 by coating tool, and then the two ring electrodes 2 are put into the oven for baking to solidify the electronic coating;

[0027] S2. A plurality of conductive carbon wires 4 are arranged on the inner side wall of the metalized ceramic tube 1, and then the two annular electrodes 2 prepared in the step S1 are respectively mounted to the two ends of the metalized ceramic tube 1;

[0028] S3. The metalized ceramic tube 1 and the two annular electrodes 2 assembled together in the step S2 are put into a vacuum packaging device for packaging, and the packaging temperature is 820-850°C. In the packaging process, the air in the discharge chamber is first pumped out, then the process gas is injected into the discharge chamber, and finally the connection position of the metalized ceramic tube 1 and the two annular electrodes 2 is sealed and connected by welding.

[0029] The following lists three process gas formulations used in different embodiments (each gas is in volume fraction):

[0030] Process gas formulation A: argon 3 parts, nitrogen 5 parts, hydrogen 0.5 parts, helium 0.5 parts;

[0031] Process gas formulation B: argon 2 parts, nitrogen 6 parts, hydrogen 0.5 parts, helium 0.5 parts;

[0032] Process gas formulation C: argon 1 part, nitrogen 6 parts, hydrogen 1.5 parts, helium 0.5 parts.

[0033] The following lists five electronic powder coating 3 formulations used in different embodiments (each component is in mass fraction):

[0034] Electronic powder coating 3 formulation A: sodium bromide 20 parts, sodium silicate 5 parts, titanium dioxide 2 parts, potassium silicate 8 parts, zirconium oxide 1 part, cesium carbonate 1 part, cesium tungstate 1 part, cesium silicate 1 part, potassium chloride 3 parts, nickel powder 2 parts, aluminum powder 2 parts;

[0035] Electronic powder coating 3 formulation B: sodium bromide 25 parts, sodium silicate 5 parts, titanium dioxide 3 parts, potassium silicate 6 parts, zirconium oxide 2 parts, cesium carbonate 2 parts, cesium tungstate 2 parts, cesium silicate 2 parts, potassium chloride 1 part, nickel powder 2 parts, aluminum powder 2 parts;

[0036] Electronic powder coating 3 formulation C: sodium bromide 25 parts, sodium silicate 8 parts, titanium dioxide 3 parts, potassium silicate 8 parts, zirconium oxide 6 parts, cesium carbonate 3 parts, cesium tungstate 3 parts, cesium silicate 3 parts, potassium chloride 1 part, nickel powder 2 parts, aluminum powder 2 parts;

[0037] Electronic powder coating 3 formulation D: sodium bromide 30 parts, sodium silicate 5 parts, titanium dioxide 2 parts, potassium silicate 8 parts, zirconium oxide 1 part, cesium carbonate 1 part, cesium tungstate 1 part, cesium silicate 1 part, potassium chloride 3 parts, nickel powder 2 parts, aluminum powder 2 parts;

[0038] Electronic powder coating 3 formula E: sodium bromide 30 parts, sodium silicate 10 parts, titanium dioxide 8 parts, potassium silicate 8 parts, zirconium oxide 1 part, cesium carbonate 1 part, cesium tungstate 1 part, cesium silicate 1 part, potassium chloride 3 parts, nickel powder 2 parts, aluminum powder 2 parts.

[0039] Through the combination of different process gas formulas and electronic powder coating 3 formulas, 15 kinds of low residual pressure high voltage discharge tubes of example 1 to example 15 are obtained, and the test data obtained by simulating the working conditions of the 15 kinds of low residual pressure high voltage discharge tubes of example 1 to example 15 are shown in the following table:

[0040]

[0041] From the above table, it can be seen that the combination of the process gas formula and the electronic powder coating 3 formula in the 15 examples can meet the requirement that the residual pressure is less than 4000V, which meets the requirement of terminal line use, wherein the increase of hydrogen content in the process gas can reduce the residual pressure, and the increase of potassium silicate, cesium carbonate, cesium silicate and cesium tungstate in the electronic powder coating 3 formula can also effectively reduce the residual pressure. According to the above results, the scheme of electronic powder coating 3 formula C and process gas formula C in example 9 (i.e. electronic powder coating 33 formula C: sodium bromide 25 parts, sodium silicate 8 parts, titanium dioxide 3 parts, potassium silicate 8 parts, zirconium oxide 6 parts, cesium carbonate 3 parts, cesium tungstate 3 parts, cesium silicate 3 parts, potassium chloride 1 part, nickel powder 2 parts, aluminum powder 2 parts; and process gas formula C: argon 1 part, nitrogen 6 parts, hydrogen 1.5 parts, helium 0.5 parts.) has the optimal value in the test results of 4KV mixed wave residual pressure value and 6KV mixed wave residual pressure value, and has the minimum between the direct current breakdown voltage, so that example 9 is the best embodiment of the present application. The low residual pressure high voltage discharge tube in the embodiment realizes extremely low residual pressure, and the residual pressure is close to the direct current voltage. By changing the gap of the surge pulse discharge tube, changing the electronic powder coating 3 formula and the process gas formula, the target of effectively reducing the residual pressure is achieved.

[0042] In the description of the present application, it should be understood that the orientation words such as "front, rear, upper, lower, left, right", "transverse, vertical, perpendicular, horizontal" and "top, bottom" and the like indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description. Without making the opposite statement, these orientation words do not indicate and imply that the indicated device or element must have a specific orientation or be constructed and operated in a specific orientation, so it cannot be understood as a limitation on the scope of protection of the present application. The orientation words "inner, outer" refer to the inner and outer of the contour of each component itself.

[0043] The above merely is the preferred embodiment of the present application, any skilled person in the art can modify the present application by using the above-mentioned technical solutions or modify it into equivalent technical solutions. Therefore, any simple modification or equivalent replacement according to the technical solutions of the present application is within the scope of the present application.

Claims

1. A manufacturing process for a low residual voltage high-voltage discharge tube, characterized in that, The low residual voltage high-voltage discharge tube includes: Metallized ceramic tube (1), at least one conductive carbon wire (4) is fixedly provided on the inner wall of the metallized ceramic tube (1); the number of conductive carbon wires (4) is four, and the aforementioned four conductive carbon wires (4) are arranged in a ring array at 90° intervals on the inner wall of the metallized ceramic tube (1); Two annular electrodes (2) are fixedly disposed at the two ends of the metallized ceramic tube (1). The two annular electrodes (2) and the metallized ceramic tube (1) form a sealed discharge chamber, which is filled with process gas. The process gas is composed of at least the following gas mixtures in volume parts: 1-3 parts argon, 5-6 parts nitrogen, 0.5-1.5 parts hydrogen, and 0.5 parts helium. The annular electrodes (2) include a protrusion (21), which is disposed in the discharge chamber. The protrusion (21) is fixedly disposed at the two ends of the tube. An electronic powder coating (3) is provided; the electronic powder coating (3) is prepared by mixing at least the following parts by weight of metal salt powder or metal powder: 20-30 parts of sodium bromide, 5-10 parts of sodium silicate, 2-8 parts of titanium dioxide, 6-8 parts of potassium silicate, 1-6 parts of zirconium oxide, 1-3 parts of cesium carbonate, 1-3 parts of cesium tungstate, 1-3 parts of cesium silicate, 1-3 parts of potassium chloride, 2 parts of nickel powder, and 2 parts of aluminum powder; a grid groove is provided at the middle position of the end face of the protrusion (21), and the electronic powder coating (3) is disposed in the grid groove; The manufacturing process includes the following steps: S1. Apply the electronic powder coating to the grid groove of the protrusion (21) of the two annular electrodes (2) using a coating tool, and then place the two annular electrodes (2) into an oven to bake and cure the electronic coating. S2. Several conductive carbon wires (4) are set on the inner wall of the metallized ceramic tube (1), and then the two annular electrodes (2) obtained in step S1 are respectively installed at both ends of the metallized ceramic tube (1). S3. The metallized ceramic tube (1) and two annular electrodes (2) assembled in step S2 are placed into a vacuum sealing device and sealed at a temperature of 820℃~850℃. During the sealing process, the air in the discharge chamber is first extracted, and then the process gas is injected into the discharge chamber. Finally, the connection between the metallized ceramic tube (1) and the two annular electrodes (2) is sealed by welding. The low residual voltage high-voltage discharge tube obtained through the above manufacturing process uses a ring electrode, which increases the current carrying capacity and changes the pulse discharge gap to reduce the residual voltage. At the same time, by optimizing the formula of the electron powder coating at the discharge end of the ring electrode and the formula of the process gas in the discharge chamber, the residual voltage is effectively reduced. The pulse breakdown voltage is effectively reduced by adding conductive carbon wires to the inner wall of the metallized ceramic tube. The reason for setting four conductive carbon wires at the same time is to ensure that if a single conductive carbon wire fails, the remaining conductive carbon wires can still continue to work, thus ensuring the effect of reducing the pulse breakdown voltage.

Citation Information

Patent Citations

  • Discharge tube and surge absorbing device

    CN1762079A