Circuit board welding control method and system

Abstract

The present invention proposes a circuit board welding control method and system, wherein the method includes: obtaining the maximum temperature setting, the minimum temperature setting and the furnace passing speed of each temperature zone of the reflow furnace, detecting the temperature of each temperature zone through a sensor, and adjusting the transfer speed of the circuit board in each temperature zone based on the obtained and detected parameters; predicting the temperature of the circuit board in different temperature zones through a temperature prediction model based on the transfer speed of the circuit board in each temperature zone; dynamically adjusting the conveyor belt speed through real-time temperature data collected by the temperature sensor and the output temperature of the prediction model; feeding back the adjustment result to the control system, training a control model based on the behavior of the control system, and compiling the control model into the control system of the reflow furnace. Through this method and the corresponding system, the temperature can be accurately controlled and the speed can be adjusted in time to reduce solder joint defects, such as cold welding and incomplete welding, thereby improving the overall welding quality.

Description

Technical Field

[0001] The present invention provides a circuit board welding control method and system, and relates to the technical field of welding control. Background Art

[0002] In the manufacturing process of electronic products such as integrated circuit boards, a key step is feeding printed circuit boards (PCBs) densely packed with electronic components into a reflow oven, where heat energy is used to automatically solder the components to the PCB. Maintaining precise temperatures within process specifications in each zone of the reflow oven is crucial for improving final product quality. However, traditional methods for controlling and optimizing temperature in this process rely heavily on experimental trial-and-error adjustments. These methods fail to establish theoretical models that deeply analyze the PCB's furnace temperature profile during heating and soldering, and assess the allowable conveyor speed within different temperature ranges to optimize production conditions, reduce unnecessary energy consumption and processing losses, and ensure consistent product quality. Summary of the Invention

[0003] The present invention provides a circuit board welding control method and system to solve the above-mentioned problems:

[0004] The present invention provides a circuit board welding control method, the method comprising:

[0005] Obtain the maximum and minimum temperature settings of each temperature zone of the reflow oven, as well as the furnace speed of each temperature zone, detect the temperature of each temperature zone through sensors, and adjust the transfer speed of the circuit board in each temperature zone based on the obtained and detected parameters;

[0006] Based on the transfer speed of the circuit board in each temperature zone, the temperature of the circuit board in different temperature zones is predicted by the temperature prediction model;

[0007] The conveyor belt speed is dynamically adjusted using the real-time temperature data collected by the temperature sensor and the output temperature of the prediction model;

[0008] The adjustment result is fed back to the control system, a control model is trained based on the behavior of the control system, and the control model is compiled into the control system of the reflow furnace.

[0009] Furthermore, the maximum temperature setting, minimum temperature setting and furnace speed of each temperature zone of the reflow furnace are obtained, the temperature of each temperature zone is detected by a sensor, and the transfer speed of the circuit board in each temperature zone is adjusted based on the obtained and detected parameters, including:

[0010] Obtain the maximum and minimum temperature settings of each temperature zone in the reflow furnace, the minimum furnace speed of each temperature zone, and the number of temperature zones in the reflow furnace, and detect the actual temperature of each temperature zone through sensors;

[0011] The speed of the conveyor belt in the reflow furnace is adjusted based on the acquired and detected parameters through a dynamic temperature-speed adjustment model. The speed of the conveyor belt in the reflow furnace is adjusted through a dynamic temperature-speed adjustment model. Specifically, the dynamic temperature-speed adjustment model is:

[0012]

[0013] in, represents the conveyor belt speed at time t, n represents the number of temperature zones that the soldered circuit board passes through, Indicates the adjustment coefficient of the i-th temperature zone, which affects the sensitivity of speed adjustment. Represents the power coefficient of the i-th temperature zone, which adjusts the nonlinear response of the speed change. Indicates the maximum temperature setting of the i-th temperature zone, Indicates the minimum temperature setting of the ith temperature zone, represents the actual temperature of the ith temperature zone at time t, Indicates the minimum furnace speed in the i-th temperature zone.

[0014] Furthermore, based on the transfer speed of the circuit board in each temperature zone, the temperature of the circuit board in different temperature zones is predicted by a temperature prediction model, including:

[0015] Obtain the heat transfer efficiency of the soldered circuit board, the position x of the circuit board in the reflow oven, and detect the ambient temperature through a temperature sensor;

[0016]

[0017] in, represents the temperature prediction of the soldered circuit board at position x and time t, represents the heat transfer efficiency parameter of the soldered circuit board, q(x,t,v(t)) represents the heat flow input of the soldered circuit board at position x and time t affected by the conveyor speed v(t), and h c (T,v(t)) represents the heat transfer coefficient depending on the velocity v(t) at position x, time t and temperature T, Indicates the ambient temperature.

[0018] Furthermore, the conveyor belt speed is dynamically adjusted based on the real-time temperature data collected by the temperature sensor and the output temperature of the prediction model, including:

[0019] The real-time temperature T in the reflow oven is detected by the temperature sensor i (t), compare the real-time temperature and the predicted temperature, and obtain the deviation e(t)= -T i (t);

[0020] Based on the existing deviation, a PID control strategy is used to adjust v(t) using the proportional, integral and derivative control parameters:

[0021]

[0022] in, is the adjustment value of the conveyor belt speed, represents the proportionality coefficient, represents the integral coefficient, represents the differential coefficient.

[0023] Furthermore, the adjustment result is fed back to the control system, a control model is trained based on the behavior of the control system, and the control model is compiled into the control system of the reflow furnace, including:

[0024] Feedback the adjustment results to the control system;

[0025] Acquire real-time environmental data during the circuit board soldering process, including temperature, humidity, conveyor belt speed in each area of the reflow oven, and soldering current;

[0026] Clean these data and align them after cleaning;

[0027] Divide the aligned data into training and test sets;

[0028] Using the training set to train the regulation model, and then using the test set to verify and evaluate the regulation model;

[0029] The control model is then compiled into the control system of the reflow furnace to control the environment of the circuit board welding process.

[0030] The present invention provides a circuit board welding control system, the system comprising:

[0031] The speed adjustment module is used to obtain the maximum temperature setting, minimum temperature setting and the furnace speed of each temperature zone of the reflow furnace, detect the temperature of each temperature zone through sensors, and adjust the transfer speed of the circuit board in each temperature zone based on the obtained and detected parameters;

[0032] A temperature prediction module is used to predict the temperature of the circuit board in different temperature zones based on the transfer speed of the circuit board in each temperature zone through a temperature prediction model;

[0033] Dynamic speed adjustment module, used to dynamically adjust the conveyor belt speed through the real-time temperature data collected by the temperature sensor and the output temperature of the prediction model;

[0034] The training model module is used to feed back the adjustment results to the control system, train the control model based on the behavior of the control system, and compile the control model into the control system of the reflow furnace.

[0035] Furthermore, the speed adjustment module includes:

[0036] Obtain the parameters module in the reflow furnace, which is used to obtain the maximum temperature setting, minimum temperature setting, minimum furnace speed of each temperature zone and the number of temperature zones in the reflow furnace, and detect the actual temperature of each temperature zone through the sensor;

[0037] The temperature calculation and adjustment module is used to adjust the speed of the conveyor belt in the reflow furnace based on the acquired and detected parameters through a dynamic temperature-speed adjustment model. Specifically, the dynamic temperature-speed adjustment model is:

[0038]

[0039] in, represents the conveyor belt speed at time t, n represents the number of temperature zones that the soldered circuit board passes through, Indicates the adjustment coefficient of the i-th temperature zone, which affects the sensitivity of speed adjustment. Represents the power coefficient of the i-th temperature zone, which adjusts the nonlinear response of the speed change. Indicates the maximum temperature setting of the i-th temperature zone, Indicates the minimum temperature setting of the ith temperature zone, represents the actual temperature of the ith temperature zone at time t, Indicates the minimum furnace speed in the i-th temperature zone.

[0040] Furthermore, the temperature prediction module includes:

[0041] The module for obtaining real-time parameters of the circuit board is used to obtain the efficiency of heat transfer of the soldered circuit board, the position x of the circuit board in the reflow furnace, and detect the ambient temperature through the temperature sensor;

[0042] The calculation and prediction temperature module is used to predict the temperature of the circuit board in different temperature zones through a temperature prediction model based on the acquired and detected parameters. Specifically, the temperature prediction model is:

[0043]

[0044] in, represents the temperature prediction of the soldered circuit board at position x and time t, represents the heat transfer efficiency parameter of the soldered circuit board, q(x,t,v(t)) represents the heat flow input of the soldered circuit board at position x and time t affected by the conveyor speed v(t), and hc (T,v(t)) represents the heat transfer coefficient depending on the velocity v(t) at position x, time t and temperature T, Indicates the ambient temperature.

[0045] Furthermore, the dynamic speed adjustment module includes:

[0046] Obtain deviation module, used to detect the real-time temperature T in the reflow oven through the temperature sensor i (t), compare the real-time temperature and the predicted temperature, and obtain the deviation e(t)= -T i (t)

[0047] The module calculates the dynamic adjustment speed value, which is used to adjust v(t) based on the existing deviation using the PID control strategy using the proportional, integral and derivative control parameters:

[0048]

[0049] in, is the adjustment value of the conveyor belt speed, represents the proportionality coefficient, represents the integral coefficient, represents the differential coefficient.

[0050] Furthermore, the training model module includes:

[0051] A feedback module, used for feeding back the adjustment result to the control system;

[0052] A welding process parameter acquisition module is used to obtain real-time environmental data during the circuit board welding process, including temperature, humidity, conveyor belt speed of each area in the reflow furnace, and welding current;

[0053] The preprocessing module is used to clean the data and align the data after cleaning;

[0054] The dataset partitioning module is used to divide the aligned data into training sets and test sets;

[0055] A training control model module is used to train the control model using the training set, and then verify and evaluate the control model using the test set;

[0056] The compiling module is used to compile the control model into the control system of the reflow furnace to regulate the environment of the circuit board welding process.

[0057] The beneficial effects of the present invention are as follows: improving welding quality, precise temperature control and timely speed adjustment can reduce solder joint defects such as cold welding, incomplete welding, etc., thereby improving the overall welding quality; increasing production efficiency, by dynamically adjusting the conveyor belt speed and optimizing temperature control, reducing production delays and rework caused by inappropriate temperature, thereby effectively improving the operating efficiency of the production line; reducing operating costs, the system reduces energy waste through real-time monitoring and self-adjustment, and reduces material costs by reducing scrap and rework; enhancing the system's adaptability, the control system can learn real-time data and self-optimize, and has better adaptability to environmental changes and small-scale changes on the production line. Through intelligent control and automated adjustment, this technical solution provides an effective method for the circuit board manufacturing industry to optimize the welding process, improve product quality and production efficiency, and reduce costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0058] Figure 1 This is a schematic diagram of a circuit board welding control method according to the present invention. DETAILED DESCRIPTION

[0059] In order to more clearly understand the above-mentioned objects, features and advantages of the present invention, the present invention is described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments of the present application and the features therein may be combined with each other.

[0060] The following description sets forth numerous specific details to facilitate a thorough understanding of the present invention. The embodiments described are merely a portion of the embodiments of the present invention, not all of them. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without inventive effort are intended to fall within the scope of protection of the present invention.

[0061] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in this specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0062] Obtain the maximum and minimum temperature settings of each temperature zone of the reflow oven, as well as the furnace speed of each temperature zone. Detect the temperature of each temperature zone through sensors, and adjust the transfer speed of the circuit board in each temperature zone based on the obtained and detected parameters.

[0063] Based on the transfer speed of the circuit board in each temperature zone, the temperature of the circuit board in different temperature zones is predicted by the temperature prediction model;

[0064] The conveyor belt speed is dynamically adjusted using the real-time temperature data collected by the temperature sensor and the output temperature of the prediction model;

[0065] The adjustment result is fed back to the control system, a control model is trained based on the behavior of the control system, and the control model is compiled into the control system of the reflow furnace.

[0066] One embodiment of the present invention provides a circuit board welding control method, the method comprising:

[0067] The working principle and effect of the above technical solution are as follows: initially set the maximum and minimum temperature standards for each temperature zone, and use temperature sensors to monitor the actual temperature of each temperature zone in real time to ensure that the temperature is within the set range; adjust the transfer speed of the circuit board according to the optimal temperature requirements of the circuit board in each temperature zone so that it can achieve the ideal temperature curve in each temperature zone; use the temperature prediction model to predict the temperature response of the circuit board in different temperature zones based on the transfer speed of the circuit board, which helps to optimize the temperature control settings and transmission speed; dynamically adjust the conveyor belt speed based on the real-time temperature data collected by the sensor and the output of the prediction model to ensure the temperature stability and consistency of the circuit board during the welding process. The adjustment results will be fed back to the control system for training and optimizing the control model to further improve the efficiency and accuracy of the control strategy; after real-time data training and optimization, the control model is compiled and updated to the control system of the reflow furnace, so that it can use the latest data and models to achieve more precise control.

[0068] Improve welding quality. Precise temperature control and timely speed adjustment can reduce solder joint defects such as cold welding and incomplete welding, thereby improving the overall welding quality. Increase production efficiency. By dynamically adjusting the conveyor speed and optimizing temperature control, production delays and rework caused by inappropriate temperature are reduced, thereby effectively improving the operating efficiency of the production line. Reduce operating costs. The system reduces energy waste through real-time monitoring and self-adjustment, and reduces material costs by reducing scrap and rework. Enhance the system's adaptability. The control system can learn real-time data and self-optimize, and has better adaptability to environmental changes and small-scale changes on the production line. Through intelligent control and automated adjustment, this technical solution provides the circuit board manufacturing industry with an effective method to optimize the welding process, improve product quality and production efficiency, and reduce costs.

[0069] One embodiment of the present invention provides a circuit board soldering control method, which obtains the maximum temperature setting, minimum temperature setting, and furnace speed of each temperature zone of a reflow furnace, detects the temperature of each temperature zone using a sensor, and adjusts the transfer speed of the circuit board in each temperature zone based on the obtained and detected parameters, including:

[0070] Obtain the maximum and minimum temperature settings of each temperature zone in the reflow furnace, the minimum furnace speed of each temperature zone, and the number of temperature zones in the reflow furnace, and detect the actual temperature of each temperature zone through sensors;

[0071] The speed of the conveyor belt in the reflow furnace is adjusted based on the acquired and detected parameters through a dynamic temperature-speed adjustment model. The speed of the conveyor belt in the reflow furnace is adjusted through a dynamic temperature-speed adjustment model. Specifically, the dynamic temperature-speed adjustment model is:

[0072]

[0073] in, represents the conveyor belt speed at time t, n represents the number of temperature zones that the soldered circuit board passes through, Indicates the adjustment coefficient of the i-th temperature zone, which affects the sensitivity of speed adjustment. Represents the power coefficient of the i-th temperature zone, which adjusts the nonlinear response of the speed change. Indicates the maximum temperature setting of the i-th temperature zone, Indicates the minimum temperature setting of the ith temperature zone, represents the actual temperature of the ith temperature zone at time t, Indicates the minimum furnace speed in the ith temperature zone, Although the technical solution is literally defined as "maximum temperature setting", its actual function refers to the target temperature setting of the i-th temperature zone.

[0074] The working principle and effect of the above technical solution are as follows: the dynamic temperature-speed regulation model monitors the actual temperature of each temperature zone in real time and compares it with the set maximum and minimum temperature thresholds. The model can dynamically adjust the conveyor belt speed. This rapid response mechanism helps to immediately correct any temperature changes that deviate from the expected temperature, ensuring accurate temperature control during the welding process, thereby improving product quality. The parameter α used in the model i and β iThis design allows for varying degrees of sensitivity and nonlinear adjustment in different temperature zones. Each zone may have different temperature accuracy requirements depending on the material and soldering requirements. This makes adjustments more flexible and precise, better adapting to diverse and complex production needs. By optimizing the circuit board's furnace speed, thermal energy is used more efficiently, reducing energy consumption. This ensures that the circuit board receives appropriate heating and cooling in each temperature zone, reducing defective product rates due to improper temperature control, thereby improving production efficiency and saving costs. The integration of temperature control and speed regulation improves the system's stability and robustness to external disturbances (such as equipment aging and environmental changes). The system can automatically adapt to these changes, eliminating the need for frequent manual intervention and reducing the burden on operators. The model combines real-time data with predetermined mathematical relationships to enable data-driven decision-making. This data-based approach can provide a more reliable and accurate control strategy. As time accumulates and data increases, the model's predictive and adjustment capabilities can be further enhanced. By precisely controlling the temperature of the circuit board during the soldering process, the quality of the solder joints can be significantly improved, and soldering defects such as cold solder joints or over-soldering can be reduced, ensuring the high reliability and performance of the final product. Such a design not only promotes the optimization of the production process, but also meets strict industrial standards by stabilizing and enhancing product quality, providing a scalable and sustainable solution to the challenges of the modern electronics manufacturing industry.

[0075] One embodiment of the present invention provides a circuit board soldering control method, which predicts the temperature of the circuit board in different temperature zones using a temperature prediction model based on the transfer speed of the circuit board in each temperature zone, including:

[0076] Obtain the heat transfer efficiency of the soldered circuit board, the position x of the circuit board in the reflow oven, and detect the ambient temperature through a temperature sensor;

[0077]

[0078] in, represents the temperature prediction of the soldered circuit board at position x and time t, represents the heat transfer efficiency parameter of the soldered circuit board, q(x,t,v(t)) represents the heat flow input of the soldered circuit board at position x and time t affected by the conveyor speed v(t), and h c (T,v(t)) represents the heat transfer coefficient depending on the velocity v(t) at position x, time t and temperature T, Indicates the ambient temperature.

[0079]

[0080] Where P is the power of the heating source, λ is a decay coefficient indicating how quickly heat is reduced with distance, and x−v(t)⋅t is the heat influence distance from the heating source to position x at time t, taking into account the movement of the conveyor belt.

[0081] One embodiment of the present invention provides a circuit board soldering control method, which dynamically adjusts the conveyor belt speed based on real-time temperature data collected by a temperature sensor and the output temperature of a prediction model, including:

[0082] The real-time temperature T in the reflow oven is detected by the temperature sensor i (t), compare the real-time temperature and the predicted temperature, and obtain the deviation e(t)= -T i (t);

[0083] Based on the existing deviation, a PID control strategy is used to adjust v(t) using the proportional, integral and derivative control parameters:

[0084]

[0085] in, is the adjustment value of the conveyor belt speed, represents the proportionality coefficient, represents the integral coefficient, represents the differential coefficient.

[0086] One embodiment of the present invention provides a circuit board soldering control method, which feeds back adjustment results to a control system, trains a control model based on the behavior of the control system, and compiles the control model into the control system of a reflow furnace, including:

[0087] Feedback the adjustment results to the control system;

[0088] Acquire real-time environmental data during the circuit board soldering process, including temperature, humidity, conveyor belt speed in each area of the reflow oven, and soldering current;

[0089] Clean these data and align them after cleaning;

[0090] Divide the aligned data into training and test sets;

[0091] Using the training set to train the regulation model, and then using the test set to verify and evaluate the regulation model;

[0092] The control model is then compiled into the control system of the reflow furnace to control the environment of the circuit board welding process.

[0093] One embodiment of the present invention provides a circuit board welding control system, the system comprising:

[0094] The speed adjustment module is used to obtain the maximum temperature setting, minimum temperature setting and the furnace speed of each temperature zone of the reflow furnace, detect the temperature of each temperature zone through sensors, and adjust the transfer speed of the circuit board in each temperature zone based on the obtained and detected parameters;

[0095] A temperature prediction module is used to predict the temperature of the circuit board in different temperature zones based on the transfer speed of the circuit board in each temperature zone through a temperature prediction model;

[0096] Dynamic speed adjustment module, used to dynamically adjust the conveyor belt speed through the real-time temperature data collected by the temperature sensor and the output temperature of the prediction model;

[0097] The training model module is used to feed back the adjustment results to the control system, train the control model based on the behavior of the control system, and compile the control model into the control system of the reflow furnace.

[0098] In one embodiment of the present invention, a circuit board welding control system is provided, wherein the speed adjustment module includes:

[0099] Obtain the parameters module in the reflow furnace, which is used to obtain the maximum temperature setting, minimum temperature setting, minimum furnace speed of each temperature zone and the number of temperature zones in the reflow furnace, and detect the actual temperature of each temperature zone through the sensor;

[0100] The temperature calculation and adjustment module is used to adjust the speed of the conveyor belt in the reflow furnace based on the acquired and detected parameters through a dynamic temperature-speed adjustment model. Specifically, the dynamic temperature-speed adjustment model is:

[0101]

[0102] in, represents the conveyor belt speed at time t, n represents the number of temperature zones that the soldered circuit board passes through, Indicates the adjustment coefficient of the i-th temperature zone, which affects the sensitivity of speed adjustment. Represents the power coefficient of the i-th temperature zone, which adjusts the nonlinear response of the speed change. Indicates the maximum temperature setting of the i-th temperature zone, Indicates the minimum temperature setting of the ith temperature zone, represents the actual temperature of the ith temperature zone at time t, Indicates the minimum furnace speed in the i-th temperature zone.

[0103] In one embodiment of the present invention, a circuit board welding control system is provided, wherein the temperature prediction module includes:

[0104] The module for obtaining real-time parameters of the circuit board is used to obtain the efficiency of heat transfer of the soldered circuit board, the position x of the circuit board in the reflow furnace, and detect the ambient temperature through the temperature sensor;

[0105] The calculation and prediction temperature module is used to predict the temperature of the circuit board in different temperature zones through a temperature prediction model based on the acquired and detected parameters. Specifically, the temperature prediction model is:

[0106]

[0107] in, represents the temperature prediction of the soldered circuit board at position x and time t, represents the heat transfer efficiency parameter of the soldered circuit board, q(x,t,v(t)) represents the heat flow input of the soldered circuit board at position x and time t affected by the conveyor speed v(t), and h c (T,v(t)) represents the heat transfer coefficient depending on the velocity v(t) at position x, time t and temperature T, Indicates the ambient temperature.

[0108] In one embodiment of the present invention, a circuit board welding control system is provided, wherein the dynamic speed adjustment module includes:

[0109] Obtain deviation module, used to detect the real-time temperature T in the reflow oven through the temperature sensor i (t), compare the real-time temperature and the predicted temperature, and obtain the deviation e(t)= -T i (t);

[0110] The module calculates the dynamic adjustment speed value, which is used to adjust v(t) based on the existing deviation using the PID control strategy using the proportional, integral and derivative control parameters:

[0111]

[0112] in, is the adjustment value of the conveyor belt speed, represents the proportionality coefficient, represents the integral coefficient, represents the differential coefficient.

[0113] In one embodiment of the present invention, a circuit board welding control system is provided, wherein the training model module includes:

[0114] A feedback module, used for feeding back the adjustment result to the control system;

[0115] A welding process parameter acquisition module is used to obtain real-time environmental data during the circuit board welding process, including temperature, humidity, conveyor belt speed of each area in the reflow furnace, and welding current;

[0116] The preprocessing module is used to clean the data and align the data after cleaning;

[0117] The dataset partitioning module is used to divide the aligned data into training sets and test sets;

[0118] A training control model module is used to train the control model using the training set, and then verify and evaluate the control model using the test set;

[0119] The compiling module is used to compile the control model into the control system of the reflow furnace to regulate the environment of the circuit board welding process.

[0120] Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such changes and modifications fall within the scope of the claims and their equivalents, the present invention is intended to include such changes and modifications.

Claims

1. A circuit board welding control method, characterized in that: The method comprises: Obtain the maximum and minimum temperature settings of each temperature zone of the reflow oven, as well as the furnace speed of each temperature zone. Detect the temperature of each temperature zone through sensors, and adjust the transfer speed of the circuit board in each temperature zone based on the obtained and detected parameters. Based on the transfer speed of the circuit board in each temperature zone, the temperature of the circuit board in different temperature zones is predicted by the temperature prediction model; The conveyor belt speed is dynamically adjusted using the real-time temperature data collected by the temperature sensor and the output temperature of the prediction model; The adjustment result is fed back to the control system, a control model is trained based on the behavior of the control system, and the control model is compiled into the control system of the reflow furnace.

2. A circuit board welding control method according to claim 1, characterized in that: Obtain the maximum and minimum temperature settings and the speed of each temperature zone in the reflow oven. Detect the temperature of each temperature zone through sensors. Adjust the speed of the circuit board in each temperature zone based on the acquired and detected parameters, including: Obtain the maximum and minimum temperature settings of each temperature zone in the reflow furnace, the minimum furnace speed of each temperature zone, and the number of temperature zones in the reflow furnace, and detect the actual temperature of each temperature zone through sensors; The speed of the conveyor belt in the reflow furnace is adjusted based on the acquired and detected parameters through a dynamic temperature-speed adjustment model. The speed of the conveyor belt in the reflow furnace is adjusted through a dynamic temperature-speed adjustment model. Specifically, the dynamic temperature-speed adjustment model is: in, represents the conveyor belt speed at time t, n represents the number of temperature zones that the soldered circuit board passes through, Indicates the adjustment coefficient of the i-th temperature zone, which affects the sensitivity of speed adjustment. Represents the power coefficient of the i-th temperature zone, which adjusts the nonlinear response of the speed change. Indicates the maximum temperature setting of the i-th temperature zone, Indicates the minimum temperature setting of the ith temperature zone, represents the actual temperature of the ith temperature zone at time t, Indicates the minimum furnace speed in the i-th temperature zone.

3. A circuit board welding control method according to claim 1, characterized in that: Based on the transfer speed of the circuit board in each temperature zone, the temperature prediction model is used to predict the temperature of the circuit board in different temperature zones, including: Obtain the heat transfer efficiency of the soldered circuit board, the position x of the circuit board in the reflow oven, and detect the ambient temperature through the temperature sensor in, represents the temperature prediction of the soldered circuit board at position x and time t, represents the heat transfer efficiency parameter of the soldered circuit board, q(x,t,v(t)) represents the heat flow input of the soldered circuit board at position x and time t affected by the conveyor speed v(t), and h c (T,v(t)) represents the heat transfer coefficient depending on the velocity v(t) at position x, time t and temperature T, Indicates the ambient temperature.

4. A circuit board welding control method according to claim 1, characterized in that: The conveyor belt speed is dynamically adjusted through the real-time temperature data collected by the temperature sensor and the output temperature of the prediction model, including: detecting the real-time temperature T in the reflow oven through the temperature sensor i (t), compare the real-time temperature and the predicted temperature, and obtain the deviation e(t)= -T i (t); Based on the existing deviation, a PID control strategy is used to adjust v(t) using the proportional, integral and derivative control parameters: in, is the adjustment value of the conveyor belt speed, represents the proportionality coefficient, represents the integral coefficient, represents the differential coefficient.

5. A circuit board welding control method according to claim 1, characterized in that: Feedback the adjustment results to the control system, train a control model based on the behavior of the control system, and compile the control model into the control system of the reflow furnace, including: Feedback the adjustment results to the control system; Acquire real-time environmental data during the circuit board soldering process, including temperature, humidity, conveyor belt speed in each area of the reflow oven, and soldering current; Clean these data and align them after cleaning; Divide the aligned data into training and test sets; Using the training set to train the regulation model, and then using the test set to verify and evaluate the regulation model; The control model is then compiled into the control system of the reflow furnace to control the environment of the circuit board welding process.

6. A circuit board welding control system, characterized in that: The system comprises: The speed adjustment module is used to obtain the maximum temperature setting, minimum temperature setting and the furnace speed of each temperature zone of the reflow furnace, detect the temperature of each temperature zone through sensors, and adjust the transfer speed of the circuit board in each temperature zone based on the obtained and detected parameters; A temperature prediction module is used to predict the temperature of the circuit board in different temperature zones based on the transfer speed of the circuit board in each temperature zone through a temperature prediction model; Dynamic speed adjustment module, used to dynamically adjust the conveyor belt speed through the real-time temperature data collected by the temperature sensor and the output temperature of the prediction model; The training model module is used to feed back the adjustment results to the control system, train the control model based on the behavior of the control system, and compile the control model into the control system of the reflow furnace.

7. A circuit board welding control system according to claim 6, characterized in that: The speed adjustment module includes: Obtain the parameters module in the reflow furnace, which is used to obtain the maximum temperature setting, minimum temperature setting, minimum furnace speed of each temperature zone and the number of temperature zones in the reflow furnace, and detect the actual temperature of each temperature zone through the sensor; The temperature calculation and adjustment module is used to adjust the speed of the conveyor belt in the reflow furnace based on the acquired and detected parameters through a dynamic temperature-speed adjustment model. Specifically, the dynamic temperature-speed adjustment model is: in, represents the conveyor belt speed at time t, n represents the number of temperature zones that the soldered circuit board passes through, Indicates the adjustment coefficient of the i-th temperature zone, which affects the sensitivity of speed adjustment. Represents the power coefficient of the i-th temperature zone, which adjusts the nonlinear response of the speed change. Indicates the maximum temperature setting of the i-th temperature zone, Indicates the minimum temperature setting of the ith temperature zone, represents the actual temperature of the ith temperature zone at time t, Indicates the minimum furnace speed in the i-th temperature zone.

8. A circuit board welding control system according to claim 6, characterized in that: The temperature prediction module includes: The module for obtaining real-time parameters of the circuit board is used to obtain the efficiency of heat transfer of the soldered circuit board, the position x of the circuit board in the reflow furnace, and detect the ambient temperature through the temperature sensor; The calculation and prediction temperature module is used to predict the temperature of the circuit board in different temperature zones through a temperature prediction model based on the acquired and detected parameters. Specifically, the temperature prediction model is: in, represents the temperature prediction of the soldered circuit board at position x and time t, represents the heat transfer efficiency parameter of the soldered circuit board, q(x,t,v(t)) represents the heat flow input of the soldered circuit board at position x and time t affected by the conveyor speed v(t), and h c (T,v(t)) represents the heat transfer coefficient depending on the velocity v(t) at position x, time t and temperature T, Indicates the ambient temperature.

9. A circuit board welding control system according to claim 6, characterized in that: The dynamic speed adjustment module includes: Obtain deviation module, used to detect the real-time temperature T in the reflow oven through the temperature sensor i (t), compare the real-time temperature and the predicted temperature, and obtain the deviation e(t)= -T i (t); The module calculates the dynamic adjustment speed value, which is used to adjust v(t) based on the existing deviation using the PID control strategy using the proportional, integral and derivative control parameters: in, is the adjustment value of the conveyor belt speed, represents the proportionality coefficient, represents the integral coefficient, represents the differential coefficient.

10. A circuit board welding control system according to claim 6, characterized in that: The training model module includes: A feedback module, used for feeding back the adjustment result to the control system; A welding process parameter acquisition module is used to obtain real-time environmental data during the circuit board welding process, including temperature, humidity, conveyor belt speed of each area in the reflow furnace, and welding current; The preprocessing module is used to clean the data and align the data after cleaning; The dataset partitioning module is used to divide the aligned data into training and test sets; A training control model module is used to train the control model using the training set, and then verify and evaluate the control model using the test set; The compiling module is used to compile the control model into the control system of the reflow furnace to regulate the environment of the circuit board welding process.

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