Method, system and apparatus for electromagnetic shielding

Abstract

Methods, systems, and apparatus are provided for electromagnetic shielding, in particular for semiconductor packages and / or printed circuit boards. For example, an optical device covered by an RF cover may be attached to a substrate. The RF cover may have a first aperture for an optical path of the optical device. The deposited layer may provide electromagnetic shielding in combination with the RF cap. The deposited layer may include one or more portions deposited simultaneously, including a first portion having an aperture that narrows the aperture of the RF mask. The deposition layer may be cured after deposition. The deposited layer and the RF cap may provide electromagnetic shielding for the optical device.

Description

Technical Field

[0001] Example embodiments of the present disclosure generally relate to electromagnetic shielding for semiconductor packages and / or printed circuit boards. Background Art

[0002] Components on a semiconductor package and / or a printed circuit board (PCB) may be exposed to electromagnetic interference (EMI), which may cause the components on the semiconductor package and / or the PCB to malfunction or operate at reduced efficiency.

[0003] The inventors have discovered many improvements in existing technologies and techniques that are the subject of the embodiments described herein. Through hard work, ingenuity, and innovation, many of these deficiencies, challenges, and problems have been addressed by developing solutions included in the embodiments of the present disclosure, some examples of which are described in detail herein. Summary of the invention

[0004] Various embodiments described herein relate to electromagnetic shielding for semiconductor packages and / or printed circuit boards.

[0005] According to some embodiments of the present disclosure, an example method is provided. The method can be used to manufacture electromagnetic shielding, and the method may include: providing a substrate with an optical device and an RF cover attached, wherein the RF cover includes a first hole aligned with the optical axis of the optical device; depositing a deposition layer, wherein the deposition layer includes at least a first portion of the deposition layer and a second portion of the deposition layer, wherein the first portion of the deposition layer is deposited across the first hole of the RF cover and includes a second hole narrower than the first hole and aligned with the optical axis, wherein the second portion of the deposition layer is deposited on the RF cover and the first terminal of the substrate, and wherein the first portion of the deposition layer is not connected to the second portion of the deposition layer; curing the deposition layer; and wherein the cured deposition layer is electrically coupled to the RF cover and the first terminal of the substrate to provide a first electromagnetic shielding member for at least the optical device.

[0006] According to some embodiments of the present disclosure, an example system is provided. The system includes: a substrate; an optical device attached to the substrate; an RF shield attached to the substrate, wherein the RF shield includes a first hole aligned with an optical axis of the optical device; a deposited layer, including at least a first portion of the deposited layer and a second portion of the deposited layer, wherein the first portion of the deposited layer is deposited across the first hole of the RF shield and includes a second hole narrower than the first hole and aligned with the optical axis, wherein the second portion of the deposited layer is deposited on the RF shield and a first terminal of the substrate, and wherein the first portion of the deposited layer is not connected to the second portion of the deposited layer; and wherein the deposited layer is cured and electrically couples the RF shield to the first terminal of the substrate to provide a first electromagnetic shield for at least the optical device.

[0007] In some embodiments, a first semiconductor package is attached to a substrate and located at a first distance from an RF shield; wherein the deposited layer includes a third portion deposited on the semiconductor package and at least a second terminal of the substrate; and wherein the cured deposited layer is electrically coupled to the second terminal of the substrate to provide a second electromagnetic shield for at least the semiconductor package.

[0008] In some embodiments, the deposited layer includes copper paste.

[0009] In some embodiments, the deposited layer includes silver paste.

[0010] In some embodiments, the deposited layer includes a dielectric ink.

[0011] In some embodiments, the RF shield comprises metal.

[0012] In some embodiments, the RF shield comprises a non-metallic conductive material.

[0013] In some embodiments, the first portion of the deposited layer is formed in a pattern.

[0014] In some embodiments, the second portion of the deposited layer is formed as a stripe.

[0015] In some embodiments, a first portion of the deposited layer is formed in a first pattern and a second portion of the deposited layer is formed in a second pattern.

[0016] The above summary is provided only for the purpose of summarizing some example embodiments to provide a basic understanding of some aspects of the present disclosure. Therefore, it will be understood that the above embodiments are merely examples and should not be interpreted as narrowing the scope or spirit of the present disclosure in any way. It will also be understood that in addition to those embodiments summarized here, the scope of the present disclosure also includes many potential embodiments, some of which will be further described below. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Having described certain example embodiments of the present disclosure in a general sense, reference will now be made to the accompanying drawings, which are not necessarily drawn to scale, and in which:

[0018] Figure 1 A cross-sectional diagram illustrating a block diagram of a first system according to one or more embodiments of the present disclosure;

[0019] Figure 2 illustrates a top view of a first embodiment of a first system according to one or more embodiments of the present disclosure;

[0020] Figure 3A-3B illustrates a top view of a second embodiment of the first system according to one or more embodiments of the present disclosure;

[0021] Figure 4A cross-sectional diagram illustrating a block diagram of a second system according to one or more embodiments of the present disclosure;

[0022] Figure 5 illustrates a top view of a second embodiment of a second system according to one or more embodiments of the present disclosure;

[0023] Figure 6A-6E illustrates an example embodiment of a deposited layer according to one or more embodiments of the present disclosure;

[0024] Figure 7 An example flow chart illustrating operations for manufacturing an electromagnetic shield according to one or more embodiments of the present disclosure; and

[0025] Figure 8 An example flow diagram for providing operation of a system according to one or more embodiments of the present disclosure is illustrated. DETAILED DESCRIPTION

[0026] Some embodiments of the present disclosure will now be described more fully herein with reference to the accompanying drawings, in which some but not all embodiments of the present disclosure are shown. Indeed, the various embodiments of the present disclosure may be implemented in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will satisfy applicable legal requirements. Like reference numerals refer to like elements throughout.

[0027] As used herein, the term "comprising" means including but not limited to, and should be interpreted in the manner commonly used in the patent context. The use of broader terms such as including, comprising, and having should be understood to provide support for narrower terms such as consisting of, consisting essentially of, and consisting substantially of.

[0028] The phrases "in various embodiments," "in one embodiment," "according to one embodiment," "in some embodiments," and the like generally mean that the particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present disclosure, and may be included in more than one embodiment of the present disclosure (importantly, these phrases do not necessarily refer to the same embodiment).

[0029] The word “example” or “exemplary” is used herein to mean “serving as an example, instance, or illustration.” Any implementation described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other implementations.

[0030] If the specification states that a component or feature "may", "can", "might", "should", "would", "preferably", "likely", "usually", "optionally", "for example", "often", or "might" (or other such language) be included or have a property, it is not required that the particular component or feature be included or have that property. Such components or features may optionally be included in some embodiments, or may be excluded.

[0031] The use of the term "circuit" (as used herein with respect to components of a system or device) should be understood to include specific hardware configured to perform the functions associated with the specific circuits described herein. The term "circuit" should be broadly understood to include hardware, and in some embodiments, software for configuring the hardware. For example, in some embodiments, a "circuit" may include processing circuits, communication circuits, input / output circuits, and the like. In some embodiments, other elements may provide or supplement the functionality of a particular circuit.

[0032] Overview

[0033] Various embodiments of the present disclosure are directed to improved methods, systems, and devices for electromagnetic shielding, particularly for semiconductor package-level devices and / or printed circuit board package-level devices.

[0034] Various semiconductor devices and / or PCB components may require shields or shielding to prevent electromagnetic interference (EMI) from interfering with their operation and / or causing them to operate inefficiently. Such EMI can come from other components and / or devices, including components and / or devices located on the same PCB. Shielding prevents EMI from sources external to the shield from interfering with the interior of the shield, including preventing cross talk between components on the PCB and / or substrate.

[0035] A radio frequency (RF) can be used to shield devices and / or components inside the RF can from EMI from sources outside the RF can. The RF can shield optical devices (e.g., lasers, image sensors, etc.). However, in order to perform the desired functions of the optical device, the optical device requires an aperture in the RF can for the optical path. Such a hole weakens the shielding provided by the RF can based on the size of the hole in the RF can. Due to one or more operations performed through the RF can hole (such as electrically coupling the optical device to one or more terminals on the substrate using one or more wire bonds), the size of the hole in the RF can is set to be larger than the size required for the optical path. Additionally or alternatively, some components can utilize shielding from a conformal coating, but this coating is applied using a non-selective operation (e.g., sputtering, spraying, or plating), which requires multiple steps and an exposed ground plane. Various embodiments can integrate these alternatives to EMI shielding, including using them in combination with EMI shielding according to one or more embodiments described herein.

[0036] According to the embodiments described herein, various embodiments may utilize shields formed by deposited layers. The deposited layers may be applied in one or more operations in which the deposited layers are selectively deposited. The deposited layers do not require masks or associated operations, which allows for higher manufacturing efficiency. The deposited layers may be selectively applied to one or more parts of a semiconductor package, a PCB, and / or a component on a PCB in one or more portions. The deposited layers may include paste. In various embodiments, the deposition of the portions may include multiple strips and / or patches deposited simultaneously at selected locations. In various embodiments, this may be referred to as pulse printing.

[0037] The deposited layers of various embodiments may include one or more portions that span and / or extend across gaps and / or openings in and / or between semiconductor packages, PCBs, and / or components on the PCB. The deposited layers may also be wrapped around and / or applied to multiple sides of components on the semiconductor package and / or PCB, including around edges. Additionally or alternatively, multiple deposited portions of a deposited layer may be used to apply multiple strips that overlap another deposited layer, including without the need to apply any mask or other layer (e.g., laminate, film, etc.).

[0038] It should be readily appreciated that the embodiments of the methods, systems, and apparatus described herein may be configured in various additional and alternative ways besides those explicitly described herein.

[0039] Exemplary Systems and Apparatus

[0040] Embodiments of the present disclosure herein include systems and devices for electromagnetic shielding as described herein, which may be implemented in a variety of embodiments.

[0041] Figure 1 A cross-sectional view of a block diagram of a first system according to one or more embodiments of the present disclosure is illustrated. The first semiconductor package includes a substrate 110 having an optical device 120 attached thereto. The optical device may be, for example, a laser (e.g., LCSP, VCSEL, etc.) or an optical sensor. The optical sensor 120 may be electrically coupled to one or more terminals or signal pads on the substrate 110 via one or more wire bonds 160. The RF cover 130 is attached to the substrate 110 by one or more attachment layers 134 (e.g., glue, epoxy, paste, etc.). The RF cover 130 may be aligned so that the hole 152 of the RF cover 130 is aligned with the optical axis 122 of the optical sensor 120. Thus, the optical device 120 may emit and / or receive light along its optical path. In various embodiments, the hole 150 may be larger than the optical path and / or sized to allow the optical sensor to be mounted and / or attached (e.g., via wire bonds 160) to the substrate 110 after the RF cover 130 is attached to the substrate 110. The deposition layer 140 may include a first portion 142 and / or a second portion 144, the first portion 142 having an aperture 154 narrower than the RF shield aperture 152 (eg, as shown in FIG. 1 ). Figure 2 ), the second portion 144 electrically couples the RF shield to the terminal 112A on the substrate 110.

[0042] The RF shield 130 may provide some EMI shielding, but the aperture 152 in the RF shield 130 may not provide shielding for this portion of the RF shield 130. However, the RF shield 130 may act as a conductor to conduct signals generated in the deposited layer 140 by the shielded EMI to one or more grounds, such as through the RF shield 130, through the second portion 144 of the deposited layer 140, and to the terminal 112A, which may be grounded.

[0043] In various embodiments, the RF cover can be electrically coupled to one or more terminals 112 on the substrate 110. For example, the RF cover 130 can be electrically coupled to the terminal 112B via the attachment layer 134B. The terminal 112B can be configured as a ground plane or configured to be electrically coupled to the ground plane of a larger system. Alternatively, the RF cover 130 can be attached to the substrate 110 at one or more attachment layers 134 that are not electrically coupled to ground. For example, the RF cover 130 can be attached to the substrate 110 at the attachment layer 134A, and the attachment layer 134A is not electrically coupled to the terminal 112 of the substrate. However, the terminal 112 can be located on the substrate 110, close to the RF cover 130, such as the terminal 112A.

[0044] In various embodiments, the substrate 110 , the RF shield 130 , and / or other components, systems, and / or circuits on the substrate 110 may be subjected to a pre-treatment (eg, a plasma treatment) to improve coupling with the deposited layer 140 .

[0045] Figure 2 FIG. 2 illustrates a top view of a first embodiment of a first semiconductor package according to one or more embodiments of the present disclosure. Figure 2 As shown, the aperture of the first portion 142 of the deposition layer 140 may include an aperture 154 of the first portion 142 of the deposition layer 140. The aperture 154 of the first portion 142 may be narrower than the aperture 152 of the RF shield.

[0046] The deposition layer 140 may be a paste and / or ink. In various embodiments, the paste may be an epoxy resin and / or an ink, such as a dielectric ink. The paste may also be a metal paste (e.g., including copper, silver, etc.). After deposition, the deposition layer 140 may be cured (e.g., sintered, etc.). When the deposition layer 140 is deposited onto the RF cover 130 and / or the substrate 110, the deposition layer 140 may be electrically coupled to the RF cover 130 and / or the substrate 110, including one or more terminals 112 electrically coupled to the substrate 110. Therefore, the deposition layer may be used to shield the optical sensor 120 from the effects of EMI.

[0047] Figure 3A-3B FIG. 3 shows a top view of a second embodiment of the first system according to one or more embodiments of the present disclosure. The deposition layer 340 may be applied with multiple deposition portions. For example, the first deposition portion may deposit Figure 3A 152. The first deposition layer may include a plurality of strips 344A-D. The second deposition portion may deposit a second plurality of strips 344E, 344F. The deposition layer including strips 344C, 344D, 344E, and 344F may be formed in a pattern around the hole 152. The pattern of these strips 344C-344F may form a hole 154, which may narrow the hole 152. As will be appreciated, the strips 344C-344F cover one or more portions of the hole 152 where the strips 344C-344F are not supported by the RF cover 130. In addition, the strips 344A and 344B may be deposited together with the first deposition layer. The strips 344A, 344B may electrically couple the RF cover to one or more terminals in the substrate 110.

[0048] Figure 4A cross-sectional view of a block diagram of a second system according to one or more embodiments of the present disclosure is illustrated. The second system includes the first system on the substrate 110 and a plurality of additional components on the substrate 110. These components may include a sensor 410A, a semiconductor package 410B (e.g., WLSCP, etc.), and / or other package or PCB level components and / or circuits. The sensor 410A may be electrically coupled to one or more terminals (e.g., 112D) on the substrate 110 via one or more wire bonds 162. The semiconductor package 410B may be electrically coupled to one or more terminals 112 (e.g., 112G, 112H) of the substrate 110 via one or more terminals (e.g., 434A, 434B) of the semiconductor package.

[0049] An electrical connection may be provided to the sensor 410A through the third portion 446 of the deposited layer 140. For example, the third portion 446 may be deposited to attach to the sensor 410A (including the terminals) and the terminals 112D of the substrate 110.

[0050] Additionally or alternatively, the semiconductor package 410B may lack all or part of the EMI shielding. While applying the other parts of the deposition layer 140, the deposition layer 140 may be used to provide shielding. For example, the fourth portion 448 of the deposition layer 140 may be used to provide shielding for the semiconductor package 410B. The fourth portion 448 of the deposition layer 140 may completely cover the semiconductor package 410B. The fourth portion 448 of the deposition layer 140 may be electrically coupled to one or more terminals 112 of the substrate 110 (e.g., 112E for the third portion and 112F and 112I for the fourth portion) to ground the deposition layer 140 and provide a path for EMI absorption to the ground.

[0051] Figure 5 A top view of a second embodiment of the first system according to one or more embodiments of the present disclosure is illustrated. The top view illustrates how the third portion 446 can serve as a strip that electrically couples one or more terminals of the sensor 410A to one or more terminals 112 (112D) of the substrate. The top view also illustrates how the fourth portion 448 can completely cover the semiconductor package 410B.

[0052] Figure 6A-6E An example embodiment of a deposition layer according to one or more embodiments of the present disclosure is illustrated. Deposition layer 140 includes a paste layer that can be deposited in multiple locations simultaneously. The multiple locations of the deposition layer do not need to be connected. Therefore, deposition layer 140 can include multiple parts (e.g., 142, 144) that are positioned separately. In addition, the shape of each part of deposition layer 140 can be the same, similar, or different. Figure 6A-6E The diagrams illustrate different embodiments that a portion of the deposition layer 140 may take. However, it will be understood that the deposition layer 140 may take on a plurality of different embodiments in addition to the embodiment in FIG. Figure 6A-6E Other shapes and / or patterns than those shown in .

[0053] Fig. 6A Illustrated is a top view of a strip of deposited layer 140. Strip 610 may have a height and a length.

[0054] Figure 6B A top view of a first pattern of the deposition layer 140 is illustrated. The cross-shaped first pattern 610 may have a first height and a first width.

[0055] Figure 6C A second pattern of the deposition layer 140 is shown. The second pattern 630 has a block or strip shape having holes 632.

[0056] Fig.6D A cross-sectional view of a strip for depositing layer 140 is illustrated. Strip 640 may have a height that allows strip 640 to have a 3D structure. Strip 640 may span a gap and / or hole created between first side 644A and second side 644B. ​​For example, strip 640 may have a height and span a hole of an RF shield (e.g., 130), which may be a bridge structure.

[0057] Fig. 6E A cross-sectional view of a strip of deposited layer 140 is illustrated. Strip 650 may be deposited simultaneously to attach to one or more surfaces, such as the side and top surfaces of a component (e.g., 654). Alternatively or additionally, strip 650 may be attached around corners and / or edges of a component (e.g., 654).

[0058] In various embodiments, the deposition layer 140 may have a 3D shape and / or structure, which may include a complex 3D shape with air gaps, steps, and / or openings.

[0059] It should be readily appreciated that the embodiments of the systems and apparatus described herein may be configured in a variety of additional and alternative ways besides those explicitly described herein.

[0060] Exemplary Methods

[0061] Figure 7 An example flow chart of operations for manufacturing an electromagnetic shield is illustrated in accordance with one or more embodiments of the present disclosure.

[0062] At operation 702 , a system is provided. The system may include a substrate 110 with an optical device 120 and an RF cover 130 attached. The optical device 120 may have an optical axis 122 aligned with an aperture 152 of the RF cover 130 .

[0063] At operation 704, a deposition layer is deposited. The deposition layer 140 may be deposited in one or more portions (e.g., 142, 144, etc.). The one or more portions may include a first portion 142 that is deposited in a pattern that partially covers the hole 152 of the RF cover 130. The first portion 142 may include a hole 154 that is narrower than the hole 152 of the RF cover 130. The optical axis 122 of the optical device 120 may also be aligned with the hole 154 of the first portion 142 of the deposition layer 140. The deposition layer 140 may also include one or more additional portions 144 that are deposited simultaneously with the first portion 142. The second portion 144 may electrically couple the RF cover 130 to one or more terminals 112A of the substrate 110, which may be grounded or configured for grounding.

[0064] At operation 706, the deposit is cured. The deposited layer 140 may be cured, such as by sintering the deposited layer 140. Curing the deposited layer 140 may be by curing a paste of the deposited layer 140 into a fixed position through hardening via sintering.

[0065] Figure 8 An example flow diagram for providing operation of a system according to one or more embodiments of the present disclosure is illustrated.

[0066] At operation 802 , a substrate is provided. The substrate may be substrate 110 .

[0067] At operation 804, the optical device is attached to the substrate. The optical device 120 may be attached to the substrate 110. The optical device 120 may be attached by die attach.

[0068] At operation 806, an RF cover having a hole is attached to the substrate. An RF cover 130 having a hole 154 may be attached to the substrate 110. The hole 154 of the RF cover 130 may be aligned with the optical axis 122 of the optical device 120 to allow the optical device 120 to transmit and / or receive light. The RF cover 130 may be attached using surface mount technology.

[0069] At operation 808, one or more wire bonds are created between the optical device and the substrate through the aperture of the RF cover. One or more wire bonds 160 may be created to electrically couple one or more terminals and / or signal pads of the optical device 120 to one or more terminals and / or signal pads of the substrate 110. The wire bonds may be created through the aperture 152 of the RF cover 130.

[0070] At operation 810 , one or more additional components are attached to the substrate. One or more additional components (such as sensor 410A, semiconductor package, etc.) may be attached to substrate 110 .

[0071] At operation 812, the exposed surfaces are pre-treated. One or more exposed surfaces of the substrate 110, RF shield 130, sensor 410A, semiconductor package 410B, and / or other attached components may be pre-treated, such as using plasma treatment or the like.

[0072] Various embodiments may omit one or more operations described herein. Additionally or alternatively, various embodiments may repeat one or more operations described herein.

[0073] in conclusion

[0074] The operations and / or functions of the present disclosure have been described herein, such as in flow charts. Although the operations and / or functions are illustrated in a particular order in the accompanying drawings, this should not be understood as requiring such operations and / or functions to be performed in the particular order shown or in a sequential order, or requiring that all illustrated operations be performed to achieve the desired results. In some cases, it may be advantageous to perform the operations and / or functions in an alternative order. In some cases, the actions recited in the claims can be performed in a different order and still achieve the desired results. Therefore, although specific embodiments of the subject matter have been described, other embodiments are within the scope of the subsequent claims.

[0075] Although this specification contains many specific embodiments and implementation details, these should not be interpreted as limiting the scope of any disclosed or potentially claimed content, but rather as a description of the specific features of a specific disclosed specific embodiment. Certain features described herein in the context of a separate embodiment may also be implemented in combination in a single embodiment. On the contrary, the various features described in the context of a single embodiment may also be implemented individually or in any suitable sub-combination in multiple embodiments. In addition, although features may be described above as acting in certain combinations, even initially claimed as such, one or more features from the claimed combination may be deleted from the combination in some cases, and the claimed combination may be directed to a sub-combination or a variation of the sub-combination.

[0076] Similarly, although operations are illustrated in a particular order in the drawings, this should not be understood as requiring that the operations be performed in the particular order shown or in a sequential order, or requiring that all illustrated operations be performed, in order to achieve the desired results. In some cases, it may be advantageous to use operations in an alternative order. In some cases, the actions recited in the claims may be performed in a different order and still achieve the desired results.

[0077] Although the detailed description sets forth certain embodiments of the invention, the appended claims cover other embodiments of the invention according to various modifications and improvements that differ from the described embodiments.

[0078] In the following claims, unless the specific terms "means for" or "step for" are used in a given claim, it is not intended that the claim be interpreted under 35 USC §112, paragraph 6.

Claims

1. A method for manufacturing an electromagnetic shield, comprising: providing a substrate having an optical device and an RF cover attached thereto, wherein the RF cover includes a first hole aligned with an optical axis of the optical device; depositing a deposition layer, wherein the deposition layer includes at least a first portion of the deposition layer and a second portion of the deposition layer, wherein the first portion of the deposition layer is deposited across a first aperture of the RF shield and includes a second aperture that is narrower than the first aperture and aligned with the optical axis, wherein the second portion of the deposition layer is deposited on the RF shield and the first terminal of the substrate, and wherein the first portion of the deposition layer is not connected to the second portion of the deposition layer; solidifying the deposited layer; and The cured deposited layer is electrically coupled to the RF shield and the first terminal of the substrate to provide a first electromagnetic shield for at least the optical device.

2. A method for manufacturing an electromagnetic shield according to claim 1, wherein a first semiconductor package is attached to a substrate and is located at a first distance from the RF shield; wherein the deposited layer includes a third portion, the third portion is deposited on the semiconductor package and at least a second terminal of the substrate; and wherein the cured deposited layer is electrically coupled to the second terminal of the substrate to provide a second electromagnetic shielding member for at least the semiconductor package.

3. The method for manufacturing an electromagnetic shield according to claim 1, wherein the deposited layer comprises a copper paste.

4. The method for manufacturing an electromagnetic shield according to claim 1, wherein the deposited layer is composed of a silver paste.

5. The method of manufacturing an electromagnetic shield according to claim 1, wherein the deposited layer comprises a dielectric ink.

6. The method of manufacturing an electromagnetic shield of claim 1, wherein the RF shield comprises metal.

7. The method of manufacturing an electromagnetic shield of claim 1, wherein the RF shield comprises a non-metallic conductive material.

8. The method of manufacturing an electromagnetic shield according to claim 1, wherein the first portion of the deposited layer is formed in a pattern.

9. The method of manufacturing an electromagnetic shield according to claim 1, wherein the second portion of the deposited layer is formed into a strip.

10. The method of manufacturing an electromagnetic shield according to claim 1, wherein the first portion of the deposited layer is formed in a first pattern, and the second portion of the deposited layer is formed in a second pattern.

11. A system comprising: substrate; an optical device attached to the substrate; an RF cover attached to the substrate, wherein the RF cover includes a first hole aligned with an optical axis of the optical device; a deposited layer comprising at least a first portion of the deposited layer and a second portion of the deposited layer, wherein the first portion of the deposited layer is deposited across a first aperture of the RF shield and comprises a second aperture narrower than the first aperture and aligned with the optical axis, wherein the second portion of the deposited layer is deposited on the RF shield and the first terminal of the substrate, and wherein the first portion of the deposited layer is not connected to the second portion of the deposited layer; and Therein, the deposited layer is cured and the RF shield is electrically coupled to the first terminal of the substrate to provide a first electromagnetic shield for at least the optical device.

12. The system of claim 11, wherein the first semiconductor package is attached to the substrate and is located at a first distance from the RF shield; wherein the deposited layer includes a third portion, the third portion is deposited on the semiconductor package and at least the second terminal of the substrate; and wherein the cured deposited layer is electrically coupled to the second terminal of the substrate to provide a second electromagnetic shield for at least the semiconductor package.

13. The system of claim 11, wherein the deposited layer comprises copper paste.

14. The system of claim 11, wherein the deposited layer comprises a silver paste.

15. The system of claim 11, wherein the deposited layer comprises a dielectric ink.

16. The system of claim 11, wherein the RF shield comprises metal.

17. The system of claim 11, wherein the RF shield comprises a non-metallic dielectric material.

18. The system of claim 11, wherein the first portion of the deposited layer is formed in a pattern.

19. The system of claim 11, wherein the second portion of the deposited layer is formed as a strip.

20. The system of claim 11, wherein a first portion of the deposited layer is formed in a first pattern and a second portion of the deposited layer is formed in a second pattern.

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