A ball-holding structure test stand

Abstract

This invention provides a ball-holding structure test socket. The connecting terminal is Y-shaped, with its upper end forked to form two elastic fastening tabs. The opposing upper surfaces of the elastic fastening tabs are arc-shaped. An array of limiting holes is provided on the upper cover corresponding to the elastic fastening tabs. The elastic fastening tabs pass through these limiting holes. During pressing down or springing up, the upper cover drives the two arc-shaped structures of the connecting terminal to separate or engage through the limiting holes. The two arc-shaped structures are tightly attached to and electrically connected to the solder balls of the chip under test. This overcomes the technical problem in the prior art where the connecting terminal easily fatigues during long-term repeated pressing, and insufficient elasticity leads to failure to form electrical contact with the solder balls.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, and more specifically to a pressure test socket for chip testing. Background Technology

[0002] Integrated circuit chips are the core of the hardware circuits in various electronic products. During and after chip manufacturing, various performance and quality tests are required. For automated chip testing equipment, the chip test socket is a key component for placing, fixing, and electrically connecting the chip under test. How to reliably and stably connect the testing equipment to the chip under test is a key technology in this field.

[0003] Patent document CN217931942U discloses a chip testing pressure test socket, including an upper cover and a base. The upper cover is a square frame structure with openings at the top and bottom. The upper cover and the base are slidably connected. The upper side of the base is provided with a mounting groove aligned with the opening of the upper cover. A probe assembly is installed in the mounting groove. Fasteners for pressing the chip onto the upper side of the probe assembly are rotatably connected to the opposite sides of the mounting groove on the base. The rotation of the fasteners is driven by the up and down movement of the upper cover. The probe assembly is provided with a movable cavity. A stamped spring pin is installed in the movable cavity. The upper and lower ends of the stamped spring pin pass through the movable cavity through the upper and lower connecting holes, respectively, and are positioned above and below the probe assembly. The middle part of the upper end of the stamped spring pin is recessed downward to form a claw head.

[0004] The above solution uses the claws of the stamped spring pin to electrically connect with the solder balls of the chip under test, which improves the stability of the connection to a certain extent. However, there are some problems: the stamped spring pin generates elastic force through its curved part in the middle, so that the claws at the upper end do not bring strong impact force when they contact the solder balls. However, the curved part in the middle of the stamped spring pin is prone to fatigue during long-term repeated pressing. When the elastic force is insufficient, the stamped spring pin will not be able to form an electrical contact with the solder balls. On the other hand, each claw and each solder ball need to be precisely aligned to achieve a good electrical connection. Since the chip test socket itself is very small, the alignment of the claws and solder balls is prone to deviation due to the limited processing precision of the chip test socket itself, which affects the stability of the electrical connection. Summary of the Invention

[0005] To address the aforementioned technical problems in the existing technology, the present invention provides a ball-holding structure test base with higher stability.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution:

[0007] This invention provides a ball-holding structure test socket, including an upper cover, a base, multiple arrays of connecting terminals, and a fixing mechanism for fixing the chip under test. The upper cover and the base are slidably connected vertically. The lower end of the connecting terminal is fixed inside the base, and its lower top is electrically connected to the test equipment. The connecting terminal has a Y-shaped structure, and the upper end of the connecting terminal is forked to form two elastic fastening pieces. The opposite upper surfaces of the elastic fastening pieces are arc-shaped structures. The upper cover is provided with an array of limiting holes corresponding to the elastic fastening pieces. During the pressing down or springing up process, the upper cover drives the two arc-shaped structures of the connecting terminal to separate or fasten through the limiting holes. The two arc-shaped structures are tightly attached to and electrically connected to the solder balls of the chip under test.

[0008] Specifically, the top cover is square in shape, and the limiting hole is a rectangular hole, with the long side of the limiting hole being obliquely set to the straight side of the top cover.

[0009] Specifically, the long side of the limiting hole is set at a 45-degree angle to the straight side of the upper cover.

[0010] Specifically, the fixing mechanism includes two fasteners. The front end of the fastener is a fixing part, the middle part has a rotating shaft, and the rear end is a clamping part. The fastener is fixed in the base through the rotating shaft. The fixing part is used to fix the chip under test. The upper cover has a lower pressure plate. After the lower pressure plate moves downward with the upper cover, it abuts against the clamping part and opens the fixing part.

[0011] Specifically, the base has a guide groove on its side and the top cover has a guide piece on its side, with the guide piece nested in the guide groove.

[0012] Specifically, the base consists of an upper shell and a lower shell, which together form a cavity for accommodating the fastener, the connecting terminal, and the chip under test.

[0013] Specifically, a return spring is provided between the upper cover and the base.

[0014] The beneficial effects of this invention are as follows: The connecting terminal is Y-shaped, with its upper end forked to form two elastic fastening tabs. The opposing surfaces of the upper ends of the elastic fastening tabs are arc-shaped. The upper cover is provided with an array of limiting holes corresponding to the elastic fastening tabs. The elastic fastening tabs pass through the limiting holes. During the pressing or springing process, the upper cover drives the two arc-shaped structures of the connecting terminal to separate or engage through the limiting holes. The two arc-shaped structures are tightly attached to and electrically connected to the solder balls of the chip under test. This overcomes the technical problem in the prior art where the connecting terminal is prone to fatigue during long-term repeated pressing, and insufficient elasticity leads to failure to form electrical contact with the solder balls. Furthermore, the interlocking connection between the two arc-shaped structures of the connecting terminal and the solder balls makes precise alignment easier to achieve, thus ensuring a good electrical connection. This overcomes the disadvantage in the prior art where misalignment between the claw and the solder balls easily occurs, affecting the stability of the electrical connection. Attached Figure Description

[0015] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0016] Figure 1 This is a first-view overall structural diagram of the ball-holding structure test stand of the embodiment;

[0017] Figure 2 This is a second-view overall structural diagram of the ball-holding structure test stand in the embodiment;

[0018] Figure 3 This is a first-view exploded view of the ball-holding structure test stand of the embodiment;

[0019] Figure 4 This is an exploded view of the second-angle structure of the ball-shaped test stand in the embodiment.

[0020] Figure 5 This is a structural diagram of the connection terminals;

[0021] Figure 6 This is a structural diagram of the combination of the connection terminal and the solder ball in the embodiment;

[0022] Figure 7 This is a structural diagram of the fastener in the embodiment;

[0023] In the diagram: 1. Top cover; 11. Limiting hole; 12. Lower pressure plate; 13. Guide plate; 2. Base; 21. Guide groove; 22. Upper shell; 23. Lower shell; 3. Connecting terminal; 31. Arc-shaped structure; 4. Chip under test; 41. Solder ball; 5. Movable plate; 6. Fastener; 61. Fixing part; 62. Rotating shaft; 63. Clamping part; 7. Return spring. Detailed Implementation

[0024] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0025] For a first-view overall structural diagram of the ball-shaped test stand in this embodiment, please refer to the attached diagram. Figure 1 For a second-person view of the overall structure, please refer to the attached diagram. Figure 2 See the attached first-person perspective exploded view diagram. Figure 3 See the attached diagram for a second-person structural breakdown. Figure 4 See attached diagram for connection terminal structure. Figure 5 See attached structural cross-sectional view of the ball-holding test stand. Figure 6 Specifically, it includes an upper cover 1, a base 2, multiple arrays of connection terminals 3, and a fixing mechanism for fixing the chip under test 4. The upper cover 1 and the base 2 are slidably connected. The lower end of the connection terminal 3 is fixed inside the base 2, and its lower top is electrically connected to the test equipment. The connection terminal 3 has a Y-shaped structure, and the upper end of the connection terminal 3 is forked to form two elastic fastening pieces. The opposite surface of the upper end of the elastic fastening pieces is an arc-shaped structure 31. The upper cover 1 is provided with an array of limiting holes 11 corresponding to the elastic fastening pieces. During the pressing down or springing up process, the upper cover 1 drives the two arc-shaped structures 31 of the connection terminal 3 to separate or fasten through the limiting holes 11. The two arc-shaped structures 31 are tightly attached to and electrically connected to the solder balls 41 of the chip under test 4.

[0026] In this embodiment, the upper cover 1 and the base 2 are rectangular structures. The elastic fastening piece passes through the limiting hole 11. During the up-and-down movement of the upper cover 1, the two arc-shaped structures 31 of the connecting terminal 3 are driven to separate or fasten through the limiting hole 11. The limiting hole 11 is rectangular, and the long side of the limiting hole 11 forms a 45-degree angle with the straight side of the upper cover 1. The advantage of setting a 45-degree angle is that, since the chip under test is very small and the solder ball is also very small, the processing precision requirements of the internal components of the ball-holding structure test socket are very high. Compared with the movement along the straight side of the upper cover 1, the 45-degree angle between the long side of the limiting hole 11 and the straight side of the upper cover 1 increases the movement stroke of the limiting hole and the elastic fastening piece, reduces the processing precision, and thus improves stability and yield.

[0027] In this embodiment, the fixing mechanism includes two fasteners 6. See attached diagram for the structural diagram of the fasteners. Figure 7The fastener 6 has a fixing part 61 at the front end, a rotating shaft 62 in the middle, and a clamping part 63 at the rear end. The fastener 6 is fixed in the base 2 by the rotating shaft 62. The fixing part 63 is used to fix the chip under test 4. The upper cover 1 has a lower pressure plate 12. After the upper cover 1 moves downward, the lower pressure plate 12 abuts against the clamping part 63 and opens the fixing part 63. As a specific embodiment, a torsion spring (not shown in the figure) is provided on the outside of the rotating shaft 62. When the upper cover 1 moves upward under the action of the return spring 7, the fixing part 63 closes under the action of the torsion spring and thus clamps and fixes the chip under test 4 in the base.

[0028] In this embodiment, a guide groove 21 is provided on the side of the base 2, and a guide piece 13 is provided on the side of the upper cover 1. The guide piece 13 is nested within the guide groove 21. The guide piece 13 and the guide groove 21 can improve the stability and fatigue resistance of the upper cover 1 under repeated pressing and prevent misalignment.

[0029] In this embodiment, the base 2 consists of an upper shell 22 and a lower shell 23. The upper shell 22 and the lower shell 23 are combined to form a receiving cavity for accommodating the fastener 6, the connecting terminal 3, and the chip under test 4. Specifically, four return springs 7 are provided at the four corners between the upper cover 1 and the base 2 to realize the reset after the upper cover 1 is pressed down.

[0030] The working principle of the test socket in this embodiment is as follows: First, the upper cover 1 is pressed down by a robotic arm or manual operation. Its pressing plate 12 abuts against the fastening part 63 of the fastener 6. After the fastening part 63 is pressed down, it drives the fixing part 61 to open, placing the chip under test 4 above the movable plate 2. At the same time, during the pressing process, the upper cover 1 drives the elastic fastening piece of the connecting terminal 3 to open through the movement of the limiting hole 11. After the chip under test 4 is placed, the upper cover 1 returns to its original position under the action of the return spring 7. After the limiting hole 11 rises, the elastic fastening piece returns to its original position. The two arc-shaped structures 31 of the elastic fastening piece snap together and tightly fit with the solder ball 41 of the chip under test 4 to achieve electrical connection. Compared with the existing technology where the top of the connecting terminal moves upward to meet the solder ball, this method of fastening the solder ball from the side in this embodiment has higher stability. Through the limiting hole 11, the connecting terminal and the solder ball are less likely to misalign.

[0031] The beneficial effects of this invention are as follows: The connecting terminal is Y-shaped, with its upper end forked to form two elastic fastening tabs. The opposing surfaces of the upper ends of the elastic fastening tabs are arc-shaped. The upper cover is provided with an array of limiting holes corresponding to the elastic fastening tabs. The elastic fastening tabs pass through the limiting holes. During the pressing or springing process, the upper cover drives the two arc-shaped structures of the connecting terminal to separate or engage through the limiting holes. The two arc-shaped structures are tightly attached to and electrically connected to the solder balls of the chip under test. This overcomes the technical problem in the prior art where the connecting terminal is prone to fatigue during long-term repeated pressing, and insufficient elasticity leads to failure to form electrical contact with the solder balls. Furthermore, the interlocking connection between the two arc-shaped structures of the connecting terminal and the solder balls makes precise alignment easier to achieve, thus ensuring a good electrical connection. This overcomes the disadvantage in the prior art where misalignment between the claw and the solder balls easily occurs, affecting the stability of the electrical connection.

[0032] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A ball-shaped test fixture, comprising an upper cover (1), a base (2), multiple arrays of connecting terminals (3), and a fixing mechanism for fixing a chip under test (4), wherein the upper cover (1) and the base (2) are slidably connected vertically, and the lower end of the connecting terminal (3) is fixed inside the base (2) and its lower top end is electrically connected to a test device, characterized in that: The connecting terminal (3) is a Y-shaped structure. The upper end of the connecting terminal (3) is forked to form two elastic fastening pieces. The opposite surface of the upper end of the elastic fastening pieces is an arc-shaped structure (31). The upper cover (1) is provided with an array of limiting holes (11) corresponding to the elastic fastening pieces. The elastic fastening pieces pass through the limiting holes (11). During the pressing down or springing up process, the upper cover (1) drives the two arc-shaped structures (31) of the connecting terminal (3) to separate or fasten through the limiting holes (11). The two arc-shaped structures (31) are closely attached to and electrically connected to the solder balls (41) of the chip under test (4). The upper cover (1) is square in shape. The limiting holes (11) are rectangular holes. The long side of the limiting hole (11) is obliquely set to the straight side of the upper cover (1). The long side of the limiting hole (11) is set at a 45-degree angle to the straight side of the upper cover (1).

2. The ball-holding type test stand according to claim 1, characterized in that, The fixing mechanism includes two fasteners (6). The front end of the fastener (6) is a fixing part (61), the middle part has a rotating shaft (62), and the rear end is a clamping part (63). The fastener (6) is fixed in the base (2) by the rotating shaft (62). The fixing part (61) is used to fix the chip under test (4). The upper cover (1) has a lower pressure plate (12). After the lower pressure plate (12) moves downward with the upper cover (1), it abuts against the clamping part (63) and causes the fixing part (61) to open.

3. The ball-holding type test stand according to claim 1, characterized in that, The base (2) has a guide groove (21) on its side, and the top cover (1) has a guide piece (13) on its side. The guide piece (13) is nested in the guide groove (21).

4. The ball-holding structure test stand according to claim 2, characterized in that, The base (2) consists of an upper shell and a lower shell, which together form a cavity for accommodating the fastener (6), the connecting terminal (3), and the chip under test (4).

5. A ball-holding type test stand according to claim 1, characterized in that, A reset spring is provided between the upper cover (1) and the base (2).

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