Electronic device

Abstract

The invention provides an electronic device which comprises a light scattering switching assembly, a light absorption switching assembly and a thermal resistance layer, the light absorption switching assembly is arranged relative to the light scattering switching assembly, the thermal resistance layer is arranged between the light scattering switching assembly and the light absorption switching assembly, and the thermal conductivity of the thermal resistance layer is smaller than 50 * 10 <-3 > W.m <-1 >. K <-1 >.

Description

Technical Field

[0001] The present disclosure relates to an electronic device, and more particularly to an electronic device that can be applied to an outdoor smart window and has display and projection functions. Background Art

[0002] Existing smart windows can be absorption-type dimming windows or scattering-type dimming windows. Smart windows take into account the needs of heat insulation and projection, and need to provide a novel electronic device to meet the above needs. Summary of the invention

[0003] The present disclosure provides an electronic device, comprising: a light scattering switching component; a light absorbing switching component, arranged relative to the light scattering switching component; and a thermal resistance layer, arranged between the light scattering switching component and the light absorbing switching component, wherein the thermal conductivity of the thermal resistance layer is less than 50×10 -3 W·m -1 ·K -1 .

[0004] According to one embodiment of the present disclosure, a frame is also included, the light scattering switching component is attached to one side of the frame through a first attachment, and the light absorption switching component is attached to the other side of the frame through a second attachment, wherein a accommodating space is formed among the light scattering switching component, the light absorption switching component, the frame, the first attachment and the second attachment, and the thermal resistance layer is located in the accommodating space.

[0005] According to an embodiment of the present disclosure, the light scattering switching component and the light absorbing switching component are arranged along a direction, and the thickness of the accommodating space in the direction is greater than 3 mm.

[0006] According to an embodiment of the present disclosure, the thermal resistance layer comprises an inert gas.

[0007] According to an embodiment of the present disclosure, the light scattering switching component includes a first substrate, a first attachment layer, a light scattering panel, a second attachment layer and a second substrate stacked in sequence.

[0008] According to an embodiment of the present disclosure, the light absorption switching component includes a third substrate, a third attachment layer, a light absorption panel, a fourth attachment layer and a fourth substrate stacked in sequence.

[0009] According to an embodiment of the present disclosure, a first decorative layer is disposed on a surface of the light scattering switching component away from the frame, and a second decorative layer is disposed on a surface of the light absorbing switching component away from the frame.

[0010] According to an embodiment of the present disclosure, an anti-glare layer is further provided on a surface of the light absorption switching component away from the frame.

[0011] According to an embodiment of the present disclosure, another light absorption switching component is further included and is disposed on a surface of the light absorption switching component away from the frame.

[0012] According to one embodiment of the present disclosure, it also includes a frame member, which is adhesive, wherein the light scattering switching component is attached to one side of the frame member, and the light absorption switching component is attached to the other side of the frame member, and a accommodating space is formed between the light scattering switching component, the light absorption switching component and the frame member, and the thermal resistance layer is located in the accommodating space. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1A FIG. 4 is a three-dimensional schematic diagram of an electronic device according to an embodiment of the present disclosure.

[0014] Figure 1B for Figure 1A A cross-sectional view of the electronic device along line segment L-L'.

[0015] Figure 2A The assembly process and the assembled structure of the light scattering switching assembly of the electronic device according to the present disclosure are shown.

[0016] Figure 2B The assembly process and the assembled structure of the light absorption switching component of the electronic device according to the present disclosure are shown.

[0017] Figure 3A The structure and operation schematic diagram of the light absorption panel of the electronic device according to the present disclosure is shown.

[0018] Figure 3B A schematic diagram showing the structure and operation of a light scattering panel of an electronic device according to the present disclosure is shown.

[0019] Figure 4 The process of assembling the light scattering switching component and the light absorbing switching component of the electronic device according to the present disclosure into an insulating glass window is shown.

[0020] Figure 5 The flowchart of introducing inert gas between the light scattering switching component, the light absorbing switching component and the frame of the electronic device according to the present disclosure is shown.

[0021] Figure 6 FIG. 4 is a schematic diagram of an electronic device according to another embodiment of the present disclosure.

[0022] Figure 7 FIG. 4 is a schematic diagram of an electronic device according to another embodiment of the present disclosure.

[0023] Description of Reference Numerals

[0024] 10: Electronic devices

[0025] 11: Light scattering switching component

[0026] 12: Light absorption switching component

[0027] 13: Frame

[0028] 14: First attachment

[0029] 15: Second attachment

[0030] 16: Thermal resistance layer

[0031] 19: Projector

[0032] 131: Opening

[0033] 101: Accommodation Space

[0034] 111: Light scattering panel 111

[0035] 112a, 112b, 122a, 122b: Wire

[0036] 1141: First substrate

[0037] 1142: Second substrate

[0038] 1131: First attachment layer

[0039] 1132: Second attachment layer

[0040] 115: First decorative layer

[0041] 121: Light absorbing panel

[0042] 1241: The third substrate

[0043] 1242: Fourth substrate

[0044] 1231: Third attachment layer

[0045] 1232: Fourth attachment layer

[0046] 125: Second decorative layer

[0047] 1211:Substrate

[0048] 1212a, 1212b: Electrode

[0049] 1112a, 1112b: Electrode

[0050] 1213: Liquid crystal molecules

[0051] 1214: Dye molecules

[0052] 1111a, 1111b: Substrate

[0053] 1211a, 1211b: Substrate

[0054] 1113: Light scattering materials

[0055] 51: Transmission tube

[0056] 531: First side

[0057] 532: Second side

[0058] 52: Protective glue

[0059] 61: Anti-glare layer

[0060] D: Thickness DETAILED DESCRIPTION

[0061] The following disclosure provides many different embodiments or examples for implementing different components in the provided display device. Specific examples of each component and its configuration are described below to simplify the embodiments of the present disclosure. Of course, these are merely examples and are not intended to limit the present disclosure. For example, if the description mentions that a first component is formed on a second component, it may include an embodiment in which the first and second components are in direct contact, and it may also include an embodiment in which an additional component is formed between the first and second components so that they are not in direct contact. In addition, the embodiments of the present disclosure may repeat component symbols and / or characters in different examples. Such repetition is for simplicity and clarity, and is not used to represent the relationship between the different embodiments and / or forms discussed.

[0062] Directional terms mentioned herein, such as "upper", "lower", "front", "back", "left", "right" and the like, are only used to refer to the directions of the drawings. Therefore, the directional terms used are used to illustrate rather than to limit the present disclosure.

[0063] In some embodiments of the present disclosure, terms related to bonding and connection, such as "connection", "interconnection" and similar terms, unless otherwise defined, may refer to two structures being in direct contact, or may also refer to two structures not being in direct contact, with other structures being disposed between the two structures. Terms related to bonding and connection may also include situations where both structures are movable, or where both structures are fixed. In addition, the terms "electrically connected" and "coupled" include any direct and indirect electrical connection means.

[0064] The ordinal numbers used in the specification and claims, such as "first", "second", etc., are used to modify components. They themselves do not imply or represent any previous ordinal numbers of the (or those) components, nor do they represent the order of one component and another component, or the order of the manufacturing method. The use of these ordinal numbers is only used to make the component with a certain name clearly distinguishable from another component with the same name. The same words may not be used in the claims and the specification. Accordingly, the first component in the specification may be the second component in the claims. The terms "approximately", "equal", "equal" or "same", "substantially" or "approximately" are generally interpreted as within 20% of a given value or range, or as within 10%, 5%, 3%, 2%, 1% or 0.5% of a given value or range.

[0065] In addition, any two values ​​or directions used for comparison may have a certain error. If the first value is equal to the second value, it implies that there may be an error of about 10% between the first value and the second value; if the first direction is perpendicular or "approximately" perpendicular to the second direction, the angle between the first direction and the second direction may be between 80 degrees and 100 degrees; if the first direction is parallel or "approximately" parallel to the second direction, the angle between the first direction and the second direction may be between 0 degrees and 10 degrees.

[0066] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings as those commonly understood by those skilled in the art. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and the present disclosure, and should not be interpreted in an idealized or overly formal manner unless specifically defined in the embodiments of the present disclosure.

[0067] Some variations of the embodiments are described below. In the various drawings and illustrated embodiments, similar component symbols are used to indicate similar components. It is understood that additional operations may be provided before, during, or after the method, and some of the described operations may be replaced or deleted for other embodiments of the method.

[0068] It should be understood that according to the embodiments of the present disclosure, an optical microscope (OM), a scanning electron microscope (SEM), an α-step, an ellipsometer, or other suitable methods may be used to measure the depth, thickness, width, or height of each component, or the spacing or distance between components. According to some embodiments, a scanning electron microscope may be used to obtain a cross-sectional structural image including the components to be measured, and measure the depth, thickness, width, or height of each component, or the spacing or distance between components.

[0069] In addition, the electronic device may be rectangular, circular, polygonal, have curved edges or other suitable shapes. The electronic device may have peripheral systems such as a processing system, a driving system, a control system, a light source system, a shelf system, etc. to support the display device or the splicing device.

[0070] It should be noted that the electronic device can be any arrangement or combination of the above, but is not limited thereto. It should be understood that the following embodiments can replace, reorganize, or mix the features of several different embodiments to complete other embodiments without departing from the spirit of the present disclosure. The features of each embodiment can be mixed and matched as long as they do not violate the spirit of the invention or conflict with each other.

[0071] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings as commonly understood by those skilled in the art to which the present disclosure belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and the present disclosure, and should not be interpreted in an idealized or overly formal manner unless specifically defined in the embodiments of the present disclosure.

[0072] Please refer to Figure 1A and Figure 1B , Figure 1A is a three-dimensional schematic diagram of an electronic device 10 according to an embodiment of the present disclosure. Figure 1B for Figure 1A The electronic device 10 is a cross-sectional view of the line segment L-L'. The electronic device 10 includes a light scattering switching component 11, a light absorbing switching component 12, a frame 13, a first attachment 14, a second attachment 15 and a thermal resistance layer 16, wherein the light scattering switching component 11 and the light absorbing switching component 12 are arranged along a direction (X direction), and the light absorbing switching component 12 is arranged relative to the light scattering switching component 11, and the thermal resistance layer 16 is arranged between the light scattering switching component 11 and the light absorbing switching component 12, and the thermal conductivity of the thermal resistance layer 16 is less than 50×10 -3 W·m -1 ·K -1 In some embodiments, the thermal conductivity of the thermal resistance layer 16 is less than 40×10 -3 W·m -1 ·K -1 or 35×10 -3 W·m -1 ·K -1 In some embodiments, the thermal conductivity of the thermal resistance layer 16 is greater than or equal to 1 W·m -1 ·K -1 And less than 40×10 -3 W·m -1·K -1 , but not limited thereto. In the embodiment, the electronic device 10 is used as an insulation window as an example for illustration, but not limited thereto, and the electronic device 10 may have other product applications. The light absorption switching component 12 of the electronic device 10 is, for example, disposed on the outdoor side of the insulation window, and the light scattering switching component 11 is, for example, disposed on the indoor side of the insulation window. A projector 19 may be disposed indoors, and the projector 19 projects a picture on the insulation window, for example, but not limited thereto.

[0073] like Figure 2A The light scattering switching assembly 11 is shown as an assembly process and a structure after assembly. The light scattering switching assembly 11 is assembled to provide a light scattering panel 111. The light scattering panel 111 is formed by assembling a substrate 1111a and a substrate 1111b. A light scattering material 1113 is disposed between the substrate 1111a and the substrate 1111b (see the following). Figure 3B The thickness of the substrate 1111a or the substrate 1111b may be between 1 mm and 0.2 mm, but is not limited thereto. Wires 112a and 112b (such as thin metal wires, but not limited thereto) are respectively disposed on the peripheral circuit regions (not shown) of the substrates 1111a and 1111b of the light scattering panel 111. The wires 112a and 112b receive signals provided by an external circuit (not shown) to drive the light scattering panel 111 for dimming. The signals received by the wires 112a and 112b are, for example, different. Figure 2AFor example, the peripheral circuit areas (not shown) of the substrate 1111a and the substrate 1111b are located on opposite sides, but not limited thereto. Next, the first substrate 1141 is attached to one side of the light scattering panel 111 through the first attachment layer 1131, and the second substrate 1142 is attached to the other side of the light scattering panel 111 through the second attachment layer 1132, wherein the first attachment layer 1131 and the second attachment layer 1132 include ethylene-vinyl acetate copolymer (EVA) or other suitable attachment layers, and the first substrate 1141 and / or the second substrate 1142 may include a hard substrate with a thickness of about 2 mm to 10 mm (2 mm ≤ thickness ≤ 10 mm), but not limited thereto. The first substrate 1141 and / or the second substrate 1142 are, for example, architectural glass, but not limited thereto. By attaching the light scattering panel 111 between the first substrate 1141 and / or the second substrate 1142, the overall rigidity can be improved. Accordingly, the light scattering switching assembly 11 is formed by sequentially stacking the first substrate 1141, the first attachment layer 1131, the light scattering panel 111, the second attachment layer 1132, and the second substrate 1142. In addition, a first decorative layer 115 can be selectively provided on the surface of the light scattering switching assembly 11 away from the frame 13. For example, the first decorative layer 115 is provided on the side of the first substrate 1141 opposite to the light scattering panel 111 to cover the wire 112 to achieve an aesthetic effect, but not limited thereto. The first decorative layer 115, for example, includes a light shielding material, such as ink, black photoresist, absorbent glue, other suitable materials, or a combination thereof.

[0074] like Figure 2B The light absorption switching component 12 is shown in the assembly process and the assembled structure. The light absorption switching component 12 is assembled to provide a light absorption panel 121. The light absorption panel 121 is formed by assembling a substrate 1211a and a substrate 1211b. Liquid crystal molecules 1213 and dye molecules 1214 are arranged between the substrates 1211a and 1211b (refer to the subsequent Figure 3A Description). The thickness of the substrate 1211a or the substrate 1211b may be between 1 mm and 0.2 mm, but is not limited thereto. Similar to the light scattering switching component 11, the substrates 1211a and 1211b of the light absorbing panel 121 are provided with wires 122a and 122b (for example, thin metal wires, but not limited thereto) on the peripheral circuit areas (not shown), respectively. The wires 122a and 122b receive signals provided by an external circuit (not shown) to drive the light absorbing panel 121 to dim. For example, the signals received by the wires 122a and 122b are different. Figure 2BFor example, the peripheral circuit areas (not shown) of the two substrates 1211a and 1211b are located on opposite sides, but not limited thereto. Next, the third substrate 1241 is attached to one side of the light absorbing panel 121 through the third adhesive layer 1231, and the fourth substrate 1242 is attached to the other side of the light absorbing panel 121 through the fourth adhesive layer 1232, wherein the third adhesive layer 1231 and the fourth adhesive layer 1232 include polyvinyl butyral (PVB) or other suitable adhesive layers, and the third substrate 1241 and the fourth substrate 1242 include a hard substrate, and the thickness thereof is approximately between 2 mm and 10 mm (2 mm ≤ thickness ≤ 10 mm), but not limited thereto. The third substrate 1241 and the fourth substrate 1242 are, for example, architectural glass, but not limited thereto. By attaching the light absorption panel 121 between the third substrate 1241 and the fourth substrate 1242, the overall rigidity can be improved. Accordingly, the light absorption switching component 12 is formed by stacking the third substrate 1241, the third attachment layer 1231, the light absorption panel 121, the fourth attachment layer 1232 and the fourth substrate 1242 in sequence. In addition, a second decorative layer 125 can be selectively provided on the surface of the light absorption switching component 12 away from the frame 13, for example, the second decorative layer 125 is provided on the side of the third substrate 1241 opposite to the light absorption panel 121, so as to cover the wire 122 and achieve an aesthetic effect. The second decorative layer 125, for example, includes a light shielding material, such as ink, black photoresist, absorption glue, other suitable materials or a combination thereof.

[0075] Figure 3AThe structure and operation schematic diagram of the aforementioned light absorption panel 121 is shown, wherein the light absorption panel 121 includes a substrate 1211a, a substrate 1211b, an electrode 1212a (e.g., a transparent conductive electrode) and an electrode 1212b (e.g., a transparent conductive electrode) disposed on the substrate 1211a and the substrate 1211b, respectively, and liquid crystal molecules 1213 and dye molecules 1214 disposed between the electrode 1211a and the electrode 1212b. The light absorption panel 121 in this embodiment is a negative liquid crystal, but this is only an example and not a limitation. In other embodiments (not shown), the electrode design or selected liquid crystal material of the light absorption panel 121 can be adjusted according to needs. As shown in the figure, when no voltage V is applied between the electrode 1212a and the electrode 1212b (i.e., no potential difference exists), the axial directions of the liquid crystal molecules 1213 and the dye molecules 1214 are arranged, for example, substantially perpendicular to the surface direction (X direction) of the substrate 1211a or the substrate 1211b. At this time, the degree of light absorption by the dye molecules 1214 is small, and the light absorption panel 121 is in a transparent state; and when a voltage V is applied between the electrode 1212a and the electrode 1212b (i.e., there is a potential difference) to generate an electric field E, the axial directions of the liquid crystal molecules 1213 and the dye molecules 1214 rotate due to the influence of the electric field E, and the rotation amplitude is modulated according to the size of the electric field E. When a larger electric field E is provided, the axial directions of the liquid crystal molecules 1213 and the dye molecules 1214 are arranged substantially parallel to the surface direction (Y direction) of the substrate 1211a or the substrate 1211b. At this time, the degree of light absorption by the dye molecules 1214 is large, and the light absorption panel 121 is in a dark state. By changing the magnitude of the applied voltage V to generate electric fields E of different magnitudes to adjust the degree of the dark state, different grayscale states can be provided to meet various dimming requirements.

[0076] Figure 3BThe structure and operation schematic diagram of the aforementioned light scattering panel 111 is shown, wherein the light scattering panel 111 includes a substrate 1111a, a substrate 1111b, an electrode 1112a and an electrode 1112b respectively disposed on the substrate 1111a and the substrate 1111b, and a light scattering material 1113 disposed between the electrode 1112a and the electrode 1112b. In other embodiments (not shown), the electrode design or the selected liquid crystal material of the light absorbing panel 121 can be adjusted according to needs. As shown in the figure, when no voltage V is applied between the electrode 1112a and the electrode 1112b (i.e., there is no potential difference), the axial direction of the light scattering material 1113 is, for example, randomly arranged, and the ambient light incident on the light scattering panel 111 is, for example, mostly scattered, so that the light scattering panel 111 is in a foggy state; and when a voltage V is applied between the electrode 1112a and the electrode 1112b (i.e., there is a potential difference) to generate an electric field E, the light scattering material 1113 rotates due to the influence of the electric field E, and the amplitude of the rotation is modulated according to the size of the electric field E. When the axial direction of the light scattering material 1113 is substantially perpendicular to the surface direction of the substrate 1211a or the substrate 1211b due to the influence of the electric field E, most of the ambient light incident on the light scattering panel 111 can penetrate the light scattering panel 111, so that the light scattering panel 111 is in a transparent state. By changing the size of the applied voltage V to generate different sizes of the electric field E to adjust the degree of the dark state, different fog or transparent states can be provided to meet various different dimming requirements.

[0077] Please refer to Figure 1BWith the assembled light scattering switching component 11 and light absorbing switching component 12, the light scattering switching component 11 and the light absorbing switching component 12 can be attached to opposite sides of the frame 13 through the first attachment 14 and the second attachment 15, respectively, wherein the frame 13 is, for example, a ring-shaped structure. In other words, the frame 13 is, for example, a frame body, with an opening 131 in the middle of the frame body, the light scattering switching component 11 is attached to one side of the frame 13 through the first attachment 14, and the light absorbing switching component 12 is attached to the other side of the frame 13 through the second attachment 15. The first attachment 14 and / or the second attachment 15 may include, for example, solidified liquid glue or double-sided adhesive, but not limited thereto. The light scattering switching component 11 and the light absorbing switching component 12 are attached to both sides of the frame 13 by the first attachment 14 and / or the second attachment 15. Thus, a receiving space 101 may be formed between the light scattering switching component 11, the light absorbing switching component 12, the frame 13, the first attachment 14 and the second attachment 15 to receive the thermal resistance layer 16. The thickness of the receiving space 101 may vary with the size of the heat insulating glass window. For example, the light scattering switching component 11 and the light absorbing switching component 12 are arranged along the X direction, and the thickness D of the receiving space 101 in the X direction may be, for example, greater than 3 mm, greater than 4 mm, greater than 5 mm or greater than 6 mm, but not limited thereto. Since the thermal conductivity of the thermal resistance layer 16 in the receiving space 101 is less than 50×10 -3 W·m -1 ·K -1 Therefore, the thermal resistance layer 16 can effectively block the conductive heat, so that the light scattering switching element 11 is less affected by the heat. In one embodiment, the accommodating space 101 is filled with an inert gas as the thermal resistance layer 16. The inert gas has a thermal conductivity of 17.72×10 -3 W·m -1 ·K -1 of argon or other suitable inert gas.

[0078] Figure 4 The process of assembling an electronic device (for example, a heat-insulating window, but not limited thereto) with the light-scattering switching component 11 and the light-absorbing switching component 12 is described. As shown in the figure, for example, the light-scattering switching component 11 is first attached or fixed to one side of the frame 13 through the first attachment 14, and then the light-absorbing switching component 12 is attached or fixed to the other side of the frame 13 through the second attachment 15, thereby completing the assembly of the electronic device. In addition, the assembly of the aforementioned electronic device may also be performed by first attaching or fixing the light-absorbing switching component 12, and then attaching or fixing the light-scattering switching component 11, or by attaching or fixing the light-scattering switching component 11 and the light-absorbing switching component 12 at the same time. The present disclosure does not limit the order of the aforementioned assembly. Figure 5The process of introducing a thermal resistance layer (e.g., an inert gas) between the light scattering switching component 11, the light absorbing switching component 12, and the frame 13 is described. As shown in the figure, first, when the light scattering switching component 11 and the light absorbing switching component 12 are attached or fixed to the frame 13, at least one transmission tube 51 can be inserted between the light scattering switching component 11 and the frame 13 or between the light absorbing switching component 12 and the frame 13. For the convenience of description, the figure shows that the transmission tube 51 is inserted between the light absorbing switching component 12 and the frame 13, and the thermal resistance layer (e.g., an inert gas) is introduced. ) is passed into the accommodating space 101 through at least one transmission tube 51; then, the transmission tube 51 is shortened to be roughly flush with the edge of the frame 13, and a sieve (not shown) is inserted into the transmission tube 51 to prevent the thermal resistance layer (such as inert gas) from leaking out; further, a protective glue 52 is provided on the first side 531 of the electronic device 10 where the transmission tube 51 is inserted to protect the sieve inserted into the transmission tube 51 from falling off, and the protective glue 52 can also be applied on a second side 532 relative to the first side 531 of the electronic device 10 to make the appearance of the insulating glass window symmetrical. The above method is only an example, and the thermal resistance layer (such as inert gas) can also be introduced by other means. In another embodiment, the light scattering switching component 11, the light absorbing switching component 12 and the frame 13 can be directly assembled into the transmission tube in an environment filled with inert gas or in a machine to achieve the purpose of providing inert gas between the light scattering switching component 11, the light absorbing switching component 12 and the frame 13 of the electronic device 10. The electronic device 10 used as a heat-insulating window can provide various usage modes including penetration, shading and projection by controlling the penetration state, shading state and grayscale state of the light absorption switching component 12 and the penetration state and fog state of the light scattering switching component 11, as shown in Table 1 below:

[0079] Table 1

[0080] Through Mode Shade mode Projection Mode Projector 19 close close open Light absorption switching component 12 Penetration Light-shielded state Suitable grayscale Light scattering switching component 11 Penetration Mist Mist

[0081] Accordingly, in the penetration mode, the electronic device 10 can be used as a light-transmitting window; in the light-shielding mode, the electronic device 10 can provide a sunshade effect; in the projection mode, the electronic device 10 can be used as a projection screen, thereby meeting the different needs of users in various usage scenarios.

[0082] Figure 6 is a schematic diagram of an electronic device 10 according to another embodiment of the present disclosure. Figure 1B The embodiment of the present invention is different in that it further includes an anti-glare layer 61 disposed on the surface of the light absorption switching component 12 away from the frame 13. The anti-glare layer 61 may include a polarizing film, thereby reducing the generation of glare and effectively improving the quality of the heat-insulating glass window. In other embodiments, Figure 1BIn the embodiment, another light absorbing switching component is attached to the surface of the light absorbing switching component 12 away from the frame 13 by transparent adhesive to enhance the shading effect of the heat insulating window. Figure 7 FIG. 1 is a schematic diagram of an electronic device 10 according to another embodiment of the present disclosure, wherein the electronic device 10 includes a light scattering switching component 11, a light absorbing switching component 12, a frame 13 and a thermal resistance layer 16, similar to FIG. Figure 1B However, this embodiment does not have an attachment, but the frame 13 (such as a ring-shaped attachment) provides the function of the attachment, that is, the frame 13 has adhesiveness, and the light scattering switching component 11 is attached to one side of the frame 13, and the light absorption switching component 12 is attached to the other side of the frame 13 through the frame 13, so that an accommodating space 101 is formed between the light scattering switching component 11, the light absorption switching component 12 and the frame 13, and the thermal resistance layer 16 is located in the accommodating space 101.

[0083] From the above description, it can be seen that the electronic device disclosed in the present invention has a stacked structure in which the light scattering switching component and the light absorbing switching component are integrated into a frame. Therefore, it can be applied to outdoor smart windows to provide good heat insulation effects and can also have display projection functions.

[0084] The features of the various embodiments of the present disclosure may be mixed and matched as desired as long as they do not violate the spirit of the invention or conflict with each other.

[0085] The above embodiments are merely examples for the convenience of explanation. The scope of rights protected by the present disclosure shall be based on the scope of the patent application, and is not limited to the above embodiments.

Claims

1. An electronic device, characterized in that: include: a light scattering switching component; a light absorbing switching component, disposed relative to the light scattering switching component; as well as a thermal resistance layer disposed between the light scattering switching component and the light absorbing switching component, The thermal conductivity of the thermal resistance layer is less than 50×10 -3 W·m -1 ·K -1 .

2. The electronic device according to claim 1, characterized in that: It also includes a frame, the light scattering switching component is attached to one side of the frame through a first attachment, and the light absorption switching component is attached to the other side of the frame through a second attachment, wherein an accommodation space is formed among the light scattering switching component, the light absorption switching component, the frame, the first attachment and the second attachment, and the thermal resistance layer is located in the accommodation space.

3. The electronic device according to claim 2, characterized in that: The light scattering switching component and the light absorbing switching component are arranged along a direction, and the thickness of the accommodating space in the direction is greater than 3 mm.

4. The electronic device according to claim 1, characterized in that: The thermal resistance layer comprises an inert gas.

5. The electronic device according to claim 1, characterized in that: The light scattering switching component includes a first substrate, a first attachment layer, a light scattering panel, a second attachment layer and a second substrate which are stacked in sequence.

6. The electronic device according to claim 1, characterized in that: The light absorption switching component includes a third substrate, a third attachment layer, a light absorption panel, a fourth attachment layer and a fourth substrate stacked in sequence.

7. The electronic device according to claim 1, characterized in that: A first decoration layer is disposed on a surface of the light scattering switching component away from the frame, and a second decoration layer is disposed on a surface of the light absorbing switching component away from the frame.

8. The electronic device according to claim 1, characterized in that: The invention also comprises an anti-glare layer which is arranged on a surface of the light absorption switching component away from the frame.

9. The electronic device according to claim 1, characterized in that: Another light absorption switching component is also included and is arranged on a surface of the light absorption switching component away from the frame.

10. The electronic device according to claim 1, characterized in that: It also includes a frame member, which is adhesive, wherein the light scattering switching component is attached to one side of the frame member, and the light absorption switching component is attached to the other side of the frame member, and a containing space is formed between the light scattering switching component, the light absorption switching component and the frame member, and the thermal resistance layer is located in the containing space.

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