Embedded computer board card heat dissipation structure

Abstract

The invention belongs to the technical field of computer heat dissipation, and particularly relates to an embedded computer board card heat dissipation structure which comprises a water cooling box. The mounting plate is arranged at one end of the side wall of the water-cooling box; the circuit board card is arranged at the top of the mounting plate; a water tank is arranged in the water cooling box, a water pump is arranged at the position, adjacent to the water tank, of the water cooling box, the input end of the water pump communicates with the water tank, and the output end of the water pump communicates with a flat pipe. Cooling water in the water tank is conveyed into the flat pipe through the water pump, when the cooling water flows in the flat pipe, heat of the circuit board card can be absorbed, the flat shape of the flat pipe can be better attached to the circuit board card, and therefore the contact area between the flat pipe and the circuit board card is increased, the heat exchange effect is improved, and the service life of the circuit board card is prolonged. In addition, the first fins arranged at the bottoms of the flat pipes can increase the heat exchange area of the flat pipes, and therefore the heat dissipation speed is increased.

Description

Technical Field

[0001] The invention belongs to the technical field of computer heat dissipation, in particular to a heat dissipation structure of an embedded computer board. Background Art

[0002] Embedded computer boards are highly integrated computer hardware, usually designed to perform specific tasks or functions and embedded in larger systems or devices. These boards usually contain components such as processors, memory, and input and output interfaces. In high-intensity working environments such as lightning and electronic warfare, embedded computer boards often generate a lot of heat because they need to process large amounts of data and run high-power components. Therefore, it is particularly important to develop an efficient and reliable heat dissipation structure.

[0003] After searching, a Chinese patent with publication number CN209962195U discloses a new type of water-cooled heat dissipation computer board, which relates to the field of computer heat dissipation technology. In order to solve the problem that the computer heat dissipation system in the prior art performs heat dissipation treatment on the inside of the entire chassis, and the temperature of some internal circuit boards is too high, and the traditional method cannot quickly cool them down, one end of the computer circuit board is provided with a data wiring board, the outer surface of the data wiring board is provided with an external port, the other end of the computer circuit board is provided with a water-cooled machine box, the outer surface of the water-cooled machine box is provided with a heat sink, and there are multiple heat sinks, the inside of the water-cooled machine box is provided with a circulating refrigeration pipe, one end of the circulating refrigeration pipe is provided with a first delivery pump head, one side of the first delivery pump head is provided with a water-cooled liquid outlet, the other end of the circulating refrigeration pipe is provided with a second delivery pump head, and one side of the second delivery pump head is provided with a water-cooled liquid return port;

[0004] In the above technology, although the design of the circulating refrigeration pipe and the annular cooling pipe allows the liquid water coolant to circulate and absorb the heat emitted by the board, after the liquid water coolant in the annular cooling pipe absorbs the heat of the board, its own temperature will rise, which will reduce the subsequent cooling effect. Although the above technology uses the circulating refrigeration pipe to cool the heated liquid cooling water, the cooling process takes a certain amount of time, and the liquid water coolant always flows in the circulating refrigeration pipe and the annular cooling pipe. Therefore, the heated liquid water coolant will flow into the annular cooling pipe when it is not fully cooled, which will reduce the cooling effect on the board;

[0005] To this end, the present invention provides a heat dissipation structure for an embedded computer board. Summary of the invention

[0006] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0007] The technical solution adopted by the present invention to solve the technical problem is: an embedded computer board heat dissipation structure described in the present invention comprises: a water cooling box;

[0008] A mounting plate, arranged at one end of the side wall of the water cooling box;

[0009] A circuit board card is arranged on the top of the mounting plate;

[0010] A water tank is arranged inside the water cooling box, and a water pump is arranged on the water cooling box adjacent to the water tank, the water pump input end is connected with the water tank, and the water pump output end is connected with a flat tube, and the flat tube is arranged between the mounting plate and the circuit board card, and a through hole is arranged in the middle of the mounting plate, and a plurality of first fins are arranged at the bottom of the flat tube at the through hole, and the first fins are wavy, and an air cooling box is fixedly connected to the side wall of one end of the water cooling box away from the mounting plate, a heat dissipation pipe is arranged in the air cooling box, and a plurality of second fins are fixedly connected to the surface of the heat dissipation pipe, and two fan blades are rotatably connected to the top of the air cooling box, and the end of the flat tube away from the water pump is connected with the heat dissipation pipe, and one end of the heat dissipation pipe is connected with the water tank.

[0011] Preferably, an air guide cover is fixedly connected to the top of the air cooling box at the fan blade, a connecting rod is fixedly connected to the inner wall of the air guide cover, a rotating shaft is fixedly connected to the middle of the fan blade, and the rotating shaft is rotatably connected to the connecting rod.

[0012] Preferably, a synchronous wheel is fixedly connected to the top of the rotating shaft, and the two synchronous wheels are driven by a synchronous belt. A motor is fixedly connected to one end of the top of the air-cooling box, and the output end of the motor is fixedly connected to the synchronous wheel. A plurality of heat dissipation holes are provided at the bottom of the air-cooling box.

[0013] Preferably, the water pump input end is connected to the water tank through a water inlet pipe, the water pump output end is connected to a water supply pipe, one end of the water supply pipe is connected to a first three-way pipe, one end of the first three-way pipe is connected to a first connecting pipe, and one end of the first connecting pipe is connected to the flat tube.

[0014] Preferably, one end of the flat tube is connected to a second connecting tube, one end of the second connecting tube is connected to a second three-way tube, one end of the second three-way tube is connected to a third connecting tube, one end of the third connecting tube is connected to a heat dissipation pipe, one end of the heat dissipation pipe is connected to a water tank through a return pipe, and the second three-way tube is connected to the first three-way tube through a branch pipe.

[0015] Preferably, a first baffle is fixedly connected to one end of the water pipe inside the first three-way pipe, a first water hole is provided in the middle of the first baffle, a hydraulic cylinder is fixedly connected to the top end of the first three-way pipe, a T-frame is fixedly connected to the output end of the hydraulic cylinder, a blocking block is fixedly connected to the top of the T-frame, the blocking block is located directly below the branch pipe input port, a gate plate is fixedly connected to the bottom end of the T-frame, and the gate plate is slidably connected to the first baffle plate.

[0016] Preferably, a second baffle is fixedly connected to one end of the second connecting pipe inside the second three-way pipe, a second water hole is provided in the middle of the second baffle, a third baffle is fixedly connected to one end of the branch pipe inside the second three-way pipe, a third water hole is provided in the middle of the third baffle, a cover plate is hinged at one end of the top of the second baffle, a first protrusion is fixedly connected to the side wall of the cover plate at one end of the second baffle, and a second protrusion is fixedly connected to the side wall of the cover plate at one end of the third baffle.

[0017] Preferably, L-shaped plates are fixedly connected to both ends of the top of the mounting plate, the two L-shaped plates are symmetrically arranged, the circuit board card is slidably connected to the L-shaped plates, and one end of the top of the L-shaped plate is threadedly connected to a fastening screw.

[0018] The beneficial effects of the present invention are as follows:

[0019] 1. The heat dissipation structure of an embedded computer board described in the present invention transports cooling water in a water tank to a flat tube through a water pump. When the cooling water flows in the flat tube, the heat of the circuit board can be absorbed. The flat shape of the flat tube can fit the circuit board better, thereby increasing the contact area between the flat tube and the circuit board, thereby improving the heat exchange effect. In addition, the first fins arranged at the bottom of the flat tube can increase the heat exchange area of ​​the flat tube, thereby accelerating the heat dissipation speed. The first fins are arranged in a wave shape, thereby further increasing the heat exchange area of ​​the flat tube, thereby further accelerating the heat dissipation speed of the flat tube.

[0020] 2. The heat dissipation structure of an embedded computer board described in the present invention cools and dissipates the cooling water that absorbs the heat of the circuit board through the design of the heat pipe, thereby ensuring that the cooling water has a better cooling effect in subsequent use, wherein the heat exchange area of ​​the heat pipe can be increased by the second fin, thereby accelerating the heat dissipation speed of the cooling water inside the heat pipe, and the two fan blades can be driven to rotate by the motor, thereby accelerating the speed of air flow on the surface of the heat pipe, thereby accelerating the heat dissipation speed of the cooling water inside the heat pipe;

[0021] 3. The heat dissipation structure of an embedded computer board described in the present invention can control the flow path of cooling water by arranging a gate plate in the first three-way pipe. When the circuit board needs to be cooled and cooled, the T-frame is first driven upward by the hydraulic cylinder, thereby driving the gate plate and the block to move upward. At this time, the first water hole will be opened, and the water inlet of the branch pipe will be blocked by the block. At this time, the cooling water can only flow from the water tank into the flat pipe and will not flow into the branch pipe. The cooling water flowing out of the flat pipe will drive the cover plate to rotate, thereby blocking the third water hole at the output end of the branch pipe, so that the cooling water will flow in the water tank and the flat pipe. The cooling water circulates between the heat pipe and the water tank. Since it takes a certain amount of time for the heated cooling water to dissipate heat, the hydraulic rod drives the T-frame to move downward when the cooling water is dissipating heat, so that the gate blocks the first water hole. At this time, the water inlet of the branch pipe is connected to the first three-way pipe. At this time, the cooling water delivered by the water pump will flow into the branch pipe, and the cooling water flowing out of the branch pipe will drive the cover plate to rotate, thereby blocking the second water hole. At this time, the cooling water will circulate in the heat pipe and the water tank for a long time, so that the heated cooling water can be used for sufficient time to dissipate heat and cool down, thereby ensuring the subsequent cooling effect on the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present invention will be further described below in conjunction with the accompanying drawings.

[0023] Figure 1 It is a three-dimensional structural schematic diagram of the present invention;

[0024] Figure 2 yes Figure 1 Another perspective structural diagram of;

[0025] Figure 3 It is a schematic diagram of the internal structure of the water cooling box and the air cooling box in the present invention;

[0026] Figure 4 It is a schematic diagram of the connection structure between the heat dissipation pipe and the water tank in the present invention;

[0027] Figure 5 It is a schematic diagram of the side cross-section structure of the air guide cover in the present invention;

[0028] Figure 6 is a schematic diagram of the side cross-sectional structure of the first three-way pipe in the present invention;

[0029] Figure 7 is a schematic diagram of the side cross-sectional structure of the second three-way pipe in the present invention;

[0030] Figure 8 It is a schematic diagram of the cover plate structure in the present invention.

[0031] In the figure: 1, water cooling box; 2, mounting plate; 201, through hole; 202, L-shaped plate; 203, fastening screw; 3, circuit board card; 4, water tank; 5, water pump; 6, flat tube; 601, first fin; 7, air cooling box; 701, heat dissipation hole; 8, heat dissipation pipe; 801, second fin; 9, fan blade; 10, air guide cover; 11, connecting rod; 12, rotating shaft; 13, synchronous wheel; 14, synchronous belt; 15, motor; 16, water inlet pipe; 17, water delivery pipe; 18, first three-way pipe; 180 1. First baffle; 1802. First water hole; 1803. Hydraulic cylinder; 1804. T-frame; 1805. Block; 1806. Gate; 19. First connecting pipe; 20. Second connecting pipe; 21. Second three-way pipe; 2101. Second baffle; 2102. Second water hole; 2103. Third baffle; 2104. Third water hole; 2105. Cover plate; 2106. First protrusion; 2107. Second protrusion; 22. Third connecting pipe; 23. Return pipe; 24. Branch pipe. DETAILED DESCRIPTION

[0032] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0033] like Figures 1 to 8 As shown, an embedded computer board heat dissipation structure described in an embodiment of the present invention includes: a water cooling box 1; a mounting plate 2, which is arranged at one end of the side wall of the water cooling box 1; a circuit board card 3, which is arranged on the top of the mounting plate 2; a water tank 4 is arranged inside the water cooling box 1, and a water pump 5 is arranged on the water cooling box 1 adjacent to the water tank 4, the input end of the water pump 5 is connected to the water tank 4, and the output end of the water pump 5 is connected to a flat tube 6, which is arranged between the mounting plate 2 and the circuit board card 3, a through hole 201 is arranged in the middle of the mounting plate 2, and a plurality of first fins 601 are arranged at the bottom of the flat tube 6 at the through hole 201, and the first fins 601 are wavy, and an air cooling box 7 is fixedly connected to the side wall of the water cooling box 1 away from the mounting plate 2, and an air cooling box 7 is arranged inside the air cooling box 7 There is a heat dissipation pipe 8, and a plurality of second fins 801 are fixedly connected to the surface of the heat dissipation pipe 8. Two fan blades 9 are rotatably connected to the top of the air-cooling box 7. One end of the flat tube 6 away from the water pump 5 is connected to the heat dissipation pipe 8, and one end of the heat dissipation pipe 8 is connected to the water tank 4. An air guide cover 10 is fixedly connected to the top of the air-cooling box 7 at the fan blade 9, and a connecting rod 11 is fixedly connected to the inner wall of the air guide cover 10. A rotating shaft 12 is fixedly connected to the middle of the fan blade 9, and the rotating shaft 12 is rotatably connected to the connecting rod 11. A synchronous wheel 13 is fixedly connected to the top of the rotating shaft 12, and the two synchronous wheels 13 are driven by a synchronous belt 14. A motor 15 is fixedly connected to one end of the top of the air-cooling box 7, and the output end of the motor 15 is fixedly connected to the synchronous wheel 13. A plurality of heat dissipation holes 701 are provided at the bottom of the air-cooling box 7.

[0034] In this embodiment, when the circuit board card 3 needs to be cooled, the water pump 5 is turned on. Under the action of the water pump 5, the cooling water in the water tank 4 will flow into the flat tube 6. When the cooling water flows in the flat tube 6, the heat generated by the circuit board card 3 can be absorbed. The flat shape of the flat tube 6 can fit the circuit board card 3 more closely, thereby increasing the contact area between the flat tube 6 and the circuit board card 3, thereby improving the heat exchange effect. In addition, the first fin 601 provided at the bottom of the flat tube 6 can increase the heat exchange area of ​​the flat tube 6, thereby accelerating the heat dissipation speed. By setting the first fin 601 to a wave shape, the heat exchange area of ​​the flat tube 6 can be further increased, thereby further accelerating the heat dissipation speed of the flat tube 6. After the cooling water flows out of the flat tube 6, it will flow into the heat dissipation tube 8 for heat dissipation, thereby ensuring that the subsequent cooling water has a better cooling effect when used. When the cooling water flows in the heat dissipation tube 8, the motor 15 is turned on, thereby driving one of the synchronous wheels 13 to rotate. Since the two synchronous wheels 13 are connected together through the synchronous belt 14, when the motor 15 is turned on, the two synchronous wheels 13 will rotate at the same time, thereby driving the two rotating shafts 12 to rotate, and then driving the two fan blades 9 to rotate, thereby accelerating the speed of air flow on the surface of the heat dissipation tube 8, and then accelerating the heat dissipation speed of the cooling water inside the heat dissipation tube 8. The second fin 801 can increase the heat exchange area of ​​the heat dissipation tube 8, thereby further accelerating the heat dissipation speed of the cooling water inside the heat dissipation tube 8.

[0035] like Figure 4 and Figure 6 As shown, the input end of the water pump 5 is connected to the water tank 4 through the water inlet pipe 16, and the output end of the water pump 5 is connected to the water delivery pipe 17, one end of the water delivery pipe 17 is connected to the first three-way pipe 18, one end of the first three-way pipe 18 is connected to the first connecting pipe 19, and one end of the first connecting pipe 19 is connected to the flat tube 6;

[0036] In this embodiment, through the design of the water inlet pipe 16, the input end of the water pump 5 can be smoothly connected to the water tank 4, and through the design of the first three-way pipe 18 and the first connecting pipe 19, the output end of the water pump 5 can be smoothly connected to the flat tube 6.

[0037] like Figure 4 and Figure 7 As shown, one end of the flat tube 6 is connected to the second connecting tube 20, one end of the second connecting tube 20 is connected to the second three-way tube 21, one end of the second three-way tube 21 is connected to the third connecting tube 22, one end of the third connecting tube 22 is connected to the heat dissipation tube 8, one end of the heat dissipation tube 8 is connected to the water tank 4 through the return pipe 23, and the second three-way tube 21 is connected to the first three-way tube 18 through the branch pipe 24;

[0038] In this embodiment, through the design of the second connecting tube 20, the second three-way tube 21 and the third connecting tube 22, the flat tube 6 can be smoothly connected to the heat dissipation tube 8, and through the design of the branch tube 24, the first three-way tube 18 and the second three-way tube 21 can be smoothly connected together.

[0039] like Figures 6 to 8 As shown, inside the first three-way pipe 18, a first baffle 1801 is fixedly connected to one end of the water pipe 17, a first water hole 1802 is provided in the middle of the first baffle 1801, a hydraulic cylinder 1803 is fixedly connected to one end of the top of the first three-way pipe 18, a T-shaped frame 1804 is fixedly connected to the output end of the hydraulic cylinder 1803, a blocking block 1805 is fixedly connected to the top of the T-shaped frame 1804, the blocking block 1805 is located directly below the input port of the branch pipe 24, a gate plate 1806 is fixedly connected to one end of the bottom of the T-shaped frame 1804, and the gate plate 1806 is slidably connected to the first baffle 1801; the second three-way pipe 2 1 is fixedly connected to a second baffle plate 2101 at one end of the second connecting pipe 20, and a second water hole 2102 is provided in the middle of the second baffle plate 2101; a third baffle plate 2103 is fixedly connected to an end of the branch pipe 24 inside the second three-way pipe 21, and a third water hole 2104 is provided in the middle of the third baffle plate 2103; a cover plate 2105 is hingedly connected to a top end of the second baffle plate 2101, and a first convex block 2106 is fixedly connected to the side wall of the cover plate 2105 located at one end of the second baffle plate 2101; and a second convex block 2107 is fixedly connected to the side wall of the cover plate 2105 located at one end of the third baffle plate 2103;

[0040] In this embodiment, when the circuit board card 3 needs to be cooled and cooled, the T-shaped frame 1804 is first driven upward by the hydraulic cylinder 1803, thereby driving the gate plate 1806 and the block 1805 to move upward. At this time, the first water hole 1802 will be opened, and the water inlet of the branch pipe 24 will be blocked by the block 1805. At this time, when the water pump 5 is turned on, the cooling water will flow into the flat tube 6 through the water inlet pipe 16, the water delivery pipe 17, the first three-way pipe 18 and the first connecting pipe 19, and will not The cooling water flows into the branch pipe 24, and the cooling water flowing out of the flat tube 6 flows into the second three-way pipe 21 through the second connecting pipe 20. When the cooling water passes through the second water hole 2102 in the second three-way pipe 21, the flow force generated will drive the cover plate 2105 to rotate. When the cover plate 2105 rotates, the third water hole 2104 of the branch pipe 24 will be covered, and the second protrusion 2107 on the cover plate 2105 will be embedded in the third water hole 2104 of the branch pipe 24, thereby blocking it. It will circulate between the water tank 4, the flat tube 6 and the heat dissipation tube 8. Since it takes a certain amount of time for the heated cooling water to dissipate heat, when the cooling water is dissipating heat, the T-shaped frame 1804 is driven downward by the hydraulic rod, so that the gate plate 1806 blocks the first water hole 1802. At this time, the block 1805 will be separated from the water inlet of the branch pipe 24, so that the water inlet of the branch pipe 24 is connected to the first three-way pipe 18. At this time, the cooling water delivered by the water pump 5 will flow into the branch pipe 24, and The cooling water will not flow into the flat tube 6 through the first connecting tube 19. The cooling water flowing out from the branch pipe 24 will drive the cover plate 2105 to rotate, thereby blocking the second water hole 2102, wherein the first protrusion 2106 on the cover plate 2105 will be embedded in the second water hole 2102, thereby blocking it. At this time, the cooling water will circulate in the heat dissipation tube 8 and the water tank 4, so that the heated cooling water can be used for sufficient time to dissipate heat and cool down, thereby ensuring the subsequent cooling effect on the circuit board card 3.

[0041] like Figure 1 and Figure 3 As shown, L-shaped plates 202 are fixedly connected to the two ends of the top of the mounting plate 2, and the two L-shaped plates 202 are symmetrically arranged. The circuit board card 3 is slidably connected to the L-shaped plates 202, and a fastening screw 203 is threadedly connected to one end of the top of the L-shaped plate 202. Through the design of the L-shaped plate 202 and the fastening screw 203, the installation and disassembly of the circuit board card 3 is very convenient.

[0042] Working principle: When the circuit board card 3 needs to be cooled and dissipated, the T-frame 1804 is first driven upward by the hydraulic cylinder 1803, thereby driving the gate plate 1806 and the block 1805 to move upward. At this time, the first water hole 1802 will be opened, and the water inlet of the branch pipe 24 will be blocked by the block 1805. At this time, when the water pump 5 is turned on, the cooling water will flow into the flat tube 6 through the water inlet pipe 16, the water pipe 17, the first three-way pipe 18 and the first connecting pipe 19, and will not flow into the branch pipe 24. The cooling water flowing out of the flat tube 6 will flow into the second three-way pipe 21 through the second connecting pipe 20. When the cooling water passes through the second water hole 2102 in the second three-way pipe 21, the flow force generated will drive the cover plate 2105 to rotate. When the cover plate 2105 rotates When the cooling water flows in the flat tube 6, the heat generated by the circuit board card 3 can be absorbed. The flat shape of the flat tube 6 can fit the circuit board card 3 better, thereby increasing the contact area between the flat tube 6 and the circuit board card 3, and thus improving the heat exchange effect. In addition, the first fin 601 provided at the bottom of the flat tube 6 can increase the heat exchange area of ​​the flat tube 6, thereby accelerating the heat dissipation speed. By setting the first fin 601 to a wave shape, the heat exchange area of ​​the flat tube 6 can be further increased. The heat exchange area of ​​the flat tube 6 is increased, thereby further accelerating the heat dissipation speed of the flat tube 6. After the cooling water flows out of the flat tube 6, it will flow into the heat dissipation tube 8 for heat dissipation, thereby ensuring that the subsequent cooling water is used for a better cooling effect when in use. When the cooling water flows in the heat dissipation tube 8, the motor 15 is turned on, thereby driving one of the synchronous wheels 13 to rotate. Since the two synchronous wheels 13 are connected together through the synchronous belt 14, when the motor 15 is turned on, the two synchronous wheels 13 will rotate at the same time, thereby driving the two rotating shafts 12 to rotate, and then driving the two fan blades 9 to rotate, thereby accelerating the speed of air flow on the surface of the heat dissipation tube 8, and then accelerating the heat dissipation speed of the cooling water inside the heat dissipation tube 8. The heat exchange area of ​​the heat dissipation tube 8 can be increased by the second fin 801. Thereby, the heat dissipation speed of the cooling water inside the heat dissipation pipe 8 is further accelerated. Since it takes a certain amount of time for the cooling water to dissipate heat after heating, when the cooling water is dissipated, the T-frame 1804 is driven downward by the hydraulic rod, so that the gate plate 1806 blocks the first water hole 1802. At this time, the block 1805 will be detached from the water inlet of the branch pipe 24, so that the water inlet of the branch pipe 24 is connected to the first three-way pipe 18. At this time, the cooling water delivered by the water pump 5 will flow into the branch pipe 24, and will not flow into the flat tube 6 through the first connecting pipe 19. The cooling water flowing out of the branch pipe 24 will drive the cover plate 2105 to rotate, thereby blocking the second water hole 2102, wherein the first protrusion 2106 on the cover plate 2105 will be embedded in the second water hole 2102.Thus, it is blocked, and the cooling water will circulate in the heat pipe 8 and the water tank 4 for a long time, so that the heated cooling water can be used for sufficient time to dissipate heat and cool down, thereby ensuring the subsequent cooling effect on the circuit board card 3.

[0043] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. An embedded computer board heat dissipation structure, comprising: Water cooling box (1); A mounting plate (2) is arranged at one end of a side wall of the water cooling box (1); A circuit board card (3) is arranged on the top of the mounting plate (2); Features: The water cooling box (1) is provided with a water tank (4) inside, and the water cooling box (1) is provided with a water pump (5) at a position adjacent to the water tank (4); the input end of the water pump (5) is connected to the water tank (4), and the output end of the water pump (5) is connected to a flat tube (6); the flat tube (6) is provided between the mounting plate (2) and the circuit board card (3); a through hole (201) is provided in the middle of the mounting plate (2), and a plurality of first fins (60) are provided at the bottom of the flat tube (6) at the through hole (201). 1), the first fin (601) is wavy, the side wall of the water-cooling box (1) at one end away from the mounting plate (2) is fixedly connected to an air-cooling box (7), a heat dissipation pipe (8) is arranged inside the air-cooling box (7), a plurality of second fins (801) are fixedly connected to the surface of the heat dissipation pipe (8), two fan blades (9) are rotatably connected to the top of the air-cooling box (7), the end of the flat tube (6) away from the water pump (5) is connected to the heat dissipation pipe (8), and one end of the heat dissipation pipe (8) is connected to the water tank (4).

2. The heat dissipation structure of an embedded computer board according to claim 1, characterized in that: The top of the air cooling box (7) is fixedly connected to an air guide cover (10) at the fan blade (9), the inner wall of the air guide cover (10) is fixedly connected to a connecting rod (11), the middle of the fan blade (9) is fixedly connected to a rotating shaft (12), and the rotating shaft (12) is rotatably connected to the connecting rod (11).

3. The heat dissipation structure of an embedded computer board according to claim 2, characterized in that: A synchronous wheel (13) is fixedly connected to the top of the rotating shaft (12), and the two synchronous wheels (13) are driven via a synchronous belt (14). A motor (15) is fixedly connected to one end of the top of the air cooling box (7), and the output end of the motor (15) is fixedly connected to the synchronous wheel (13). A plurality of heat dissipation holes (701) are provided at the bottom of the air cooling box (7).

4. The heat dissipation structure of an embedded computer board according to claim 1, characterized in that: The input end of the water pump (5) is connected to the water tank (4) via a water inlet pipe (16); the output end of the water pump (5) is connected to a water delivery pipe (17); one end of the water delivery pipe (17) is connected to a first three-way pipe (18); one end of the first three-way pipe (18) is connected to a first connecting pipe (19); one end of the first connecting pipe (19) is connected to the flat pipe (6).

5. The heat dissipation structure of an embedded computer board according to claim 1, characterized in that: One end of the flat tube (6) is connected to a second connecting tube (20), one end of the second connecting tube (20) is connected to a second three-way tube (21), one end of the second three-way tube (21) is connected to a third connecting tube (22), one end of the third connecting tube (22) is connected to a heat dissipation tube (8), one end of the heat dissipation tube (8) is connected to a water tank (4) via a return pipe (23), and the second three-way tube (21) is connected to the first three-way tube (18) via a branch pipe (24).

6. The heat dissipation structure of an embedded computer board according to claim 4, characterized in that: A first baffle (1801) is fixedly connected to one end of the water delivery pipe (17) inside the first three-way pipe (18); a first water hole (1802) is provided in the middle of the first baffle (1801); a hydraulic cylinder (1803) is fixedly connected to one end of the top of the first three-way pipe (18); a T-shaped frame (1804) is fixedly connected to the output end of the hydraulic cylinder (1803); a blocking block (1805) is fixedly connected to the top of the T-shaped frame (1804); the blocking block (1805) is located directly below the input port of the branch pipe (24); a gate plate (1806) is fixedly connected to one end of the bottom of the T-shaped frame (1804); and the gate plate (1806) is slidably connected to the first baffle plate (1801).

7. The heat dissipation structure of an embedded computer board according to claim 5, characterized in that: A second baffle (2101) is fixedly connected to one end of the second connecting pipe (20) inside the second three-way pipe (21), and a second water hole (2102) is provided in the middle of the second baffle (2101); a third baffle (2103) is fixedly connected to one end of the branch pipe (24) inside the second three-way pipe (21), and a third water hole (2104) is provided in the middle of the third baffle (2103); a cover plate (2105) is hingedly connected to one end of the top of the second baffle (2101); a first convex block (2106) is fixedly connected to the side wall of the cover plate (2105) located at one end of the second baffle (2101); and a second convex block (2107) is fixedly connected to the side wall of the cover plate (2105) located at one end of the third baffle (2103).

8. The heat dissipation structure of an embedded computer board according to claim 1, characterized in that: The two ends of the top of the mounting plate (2) are respectively fixedly connected with L-shaped plates (202), the two L-shaped plates (202) are symmetrically arranged, the circuit board card (3) is slidably connected to the L-shaped plate (202), and one end of the top of the L-shaped plate (202) is threadedly connected with a fastening screw (203).

Images