Display module and display device

Abstract

The invention discloses a display module and a display device, the display module comprises a display panel and a plurality of functional layers, and the display panel is provided with a light emitting surface and a backlight surface which are oppositely arranged; the multiple functional layers are sequentially arranged on the side, away from the light emitting surface, of the backlight surface in a stacked mode, the display module is provided with a first through hole penetrating through the multiple functional layers, the multiple functional layers comprise the first functional layer, the first functional layer comprises a second through hole, the second through hole comprises a first area and a second area, the first area penetrates through the first functional layer, and the second area penetrates through the second functional layer. The orthographic projection of the first area on the display panel is overlapped with the orthographic projection of the first through hole on the display panel; the second region surrounds at least a portion of the first region. According to the embodiment, when the area where the first through hole of the display panel is located is impacted by external force, stress accumulated in the display panel can be released through the second area, and damage to the display panel in the area is reduced or avoided.

Description

Technical Field

[0001] The present application relates to the field of display panels, and in particular to a display module and a display device. Background Art

[0002] With the development of science and technology, display devices have been developing towards larger display areas, thinner and lighter, and more portable. In display devices, display panels and other modules are stacked. When the display module is subjected to external force, part of the display module is blocked by other modules, resulting in the inability to effectively release the accumulated stress in the part, causing damage to the part and affecting the display effect. Summary of the invention

[0003] The embodiments of the present application provide a display module and a display device, the purpose of which is to reduce or avoid the problem of poor display effect caused by the inability to effectively release internal stress when the display module is subjected to external force.

[0004] An embodiment of the first aspect of the present application provides a display module, the display module comprising:

[0005] A display panel having a light emitting surface and a backlight surface arranged opposite to each other;

[0006] A plurality of functional layers are stacked in sequence on a side of a backlight surface away from a light emitting surface, and a display module has a first through hole penetrating the plurality of functional layers. The plurality of functional layers include a first functional layer, the first functional layer includes a second through hole, and the second through hole includes a first region and a second region, wherein the first region penetrates the first functional layer, and an orthographic projection of the first region on the display panel overlaps with an orthographic projection of the first through hole on the display panel; and the second region surrounds at least a portion of the first region.

[0007] According to an embodiment of the first aspect of the present application, the second region penetrates the first functional layer.

[0008] According to an implementation of the first aspect of the present application, the second region is arranged around the circumference of the first region.

[0009] According to an implementation of the first aspect of the present application, the maximum width of the second region is W, wherein 0.8 mm ≤ W ≤ 3 mm.

[0010] According to an implementation of the first aspect of the present application, the multiple functional layers include a circuit board and an adhesive layer, the circuit board is electrically connected to the display panel, and the adhesive layer is arranged on a side of the circuit board close to the display panel.

[0011] According to an implementation of the first aspect of the present application, the first functional layer includes an adhesive layer; the second region located in the adhesive layer is sub-region one; and sub-region one runs through the adhesive layer.

[0012] According to an implementation of the first aspect of the present application, sub-region one is arranged around the circumference of the first region.

[0013] According to an implementation of the first aspect of the present application, the maximum width of sub-region one is H1, wherein 0.8 mm≤H1≤3 mm.

[0014] According to an implementation of the first aspect of the present application, the orthographic projection of the adhesive layer on the display panel is located within the orthographic projection of the circuit board on the display panel.

[0015] According to the implementation of the first aspect of the present application, in the second direction, the distance between the side wall of the adhesive layer away from the second through hole and the side wall of the circuit board away from the first through hole is H2, H1>H2; the second direction is the width direction of the display module;

[0016] According to an embodiment of the first aspect of the present application, a distance between a side wall of the adhesive layer away from the second through hole and a side wall of the circuit board away from the first through hole is H2, and H2≤0.3 mm;

[0017] According to the implementation of the first aspect of the present application, the circuit board has a first connection part, a device part, and a second connection part. The display panel, the first connection part, the device part, and the second connection part are connected in sequence along the first direction. The first through hole runs through the device part; the adhesive layer is stacked on one side of the device part, and the orthographic projection of the adhesive layer on the display panel is located within the orthographic projection of the device part on the display panel. The first direction is the length direction of the display module.

[0018] According to an implementation of the first aspect of the present application, the first functional layer includes a circuit board.

[0019] According to the implementation of the first aspect of the present application, the second area located on the circuit board is sub-area two, and the surface of the circuit board close to the display panel is recessed in a direction away from the display panel to form sub-area two.

[0020] According to an implementation of the first aspect of the present application, the orthographic projection of sub-region one on the display panel and the orthographic projection of sub-region two on the display panel at least partially overlap.

[0021] According to an implementation of the first aspect of the present application, the orthographic projection of sub-region one on the display panel overlaps with the orthographic projection of sub-region two on the display panel.

[0022] According to an implementation of the first aspect of the present application, a first buffer is provided in the second region;

[0023] According to an implementation of the first aspect of the present application, the thickness of the second region is h1, and the thickness of the first buffer component is h2, wherein h1≥h2.

[0024] According to an embodiment of the first aspect of the present application, the first buffer component includes foam.

[0025] According to the implementation of the first aspect of the present application, the circuit board has multiple dielectric layers and at least two conductive layers, the at least two conductive layers are arranged at intervals along the direction from the display panel to the circuit board, and the conductive layers are arranged between adjacent dielectric layers.

[0026] According to the implementation of the first aspect of the present application, the second sub-region penetrates at least one dielectric layer close to a side of the display panel.

[0027] According to an implementation of the first aspect of the present application, sub-region two penetrates at least one dielectric layer and at least one conductive layer.

[0028] According to the implementation scheme of the first aspect of the present application, at least two conductive layers include at least one first conductive layer and at least one second conductive layer, the first conductive layer is located on a side of the second conductive layer close to the display panel, and sub-region two penetrates the first conductive layer and exposes a portion of the dielectric layer located between the first conductive layer and the second conductive layer.

[0029] According to an implementation of the first aspect of the present application, the orthographic projection of the first through hole on the display panel includes a first edge and a second edge, and at least a partial orthographic projection of the sub-region 2 on the display panel is provided on one side of the second edge.

[0030] According to an implementation of the first aspect of the present application, the first edge and the second edge are arranged opposite to each other.

[0031] According to the implementation of the first aspect of the present application, the orthographic projection of the first through hole on the display panel also includes a third edge and a fourth edge arranged opposite to each other, and one side of the third edge and / or the fourth edge is provided with a partial orthographic projection of the sub-region two on the display panel.

[0032] According to the implementation of the first aspect of the present application, the width of the orthographic projection of sub-region 2 located on the second edge side on the display panel is W1, and the width of the orthographic projection of sub-region 2 located on the third edge and / or fourth edge side on the display panel is W2, W1>W2.

[0033] According to an implementation scheme of the first aspect of the present application, the circuit board has a first connecting portion, a device portion, and a second connecting portion, the first connecting portion, the device portion, and the second connecting portion are connected in sequence along a first direction, and the first connecting portion is connected to the display panel; the first edge and the second edge are arranged opposite to each other along the first direction, and the third edge and the fourth edge are arranged opposite to each other along the second direction, wherein the first direction and the second direction are arranged to intersect, and the first direction is the length direction of the display module.

[0034] According to an embodiment of the first aspect of the present application, the second region includes a plurality of sub-grooves, the sub-grooves are connected to the first through hole, at least parts of adjacent sub-grooves are separated by protrusions, and the protrusions are formed by the first functional layer protruding toward the side wall of the second through hole;

[0035] According to an implementation of the first aspect of the present application, at least a portion of an orthographic projection of a side wall of the first functional layer facing the second through hole on the display panel is a wavy line.

[0036] According to an embodiment of the first aspect of the present application, the plurality of functional layers further includes a support layer.

[0037] According to an embodiment of the first aspect of the present application, the first functional layer includes a support layer.

[0038] The display panel comprises a substrate, a driving array layer and a light emitting device layer which are stacked in sequence, and the supporting layer is arranged on a side of the substrate away from the driving array layer.

[0039] According to an embodiment of the first aspect of the present application, the supporting layer includes an adhesive sublayer, a first buffer sublayer and a supporting sublayer, and the second region penetrates at least one of the adhesive sublayer, the first buffer sublayer and the supporting sublayer.

[0040] According to an implementation scheme of the first aspect of the present application, the adhesive sublayer includes grid glue; the first buffer sublayer includes foam; and the supporting sublayer includes copper.

[0041] According to an embodiment of the first aspect of the present application, the support layer includes a second buffer sublayer and a support sublayer, and the second region penetrates at least one of the second buffer sublayer and the support sublayer.

[0042] According to an implementation of the first aspect of the present application, the second buffer sublayer includes silicone gel; and the supporting sublayer includes copper.

[0043] According to an implementation of the first aspect of the present application, the display module further includes a first buffer member, and the first buffer member is disposed in the second area;

[0044] According to an implementation of the first aspect of the present application, an orthographic projection of the first buffer member on the display panel does not overlap with an orthographic projection of the first through hole on the display panel;

[0045] According to an implementation of the first aspect of the present application, the thickness of the second region is h1, and the thickness of the first buffer is h2, wherein h1≥h2;

[0046] According to an implementation of the first aspect of the present application, in the first functional layer, a surface close to the display panel is flush with a surface of the first buffer member close to the display panel;

[0047] Alternatively, in the first functional layer, a surface close to the display panel is protruding toward the display panel compared to a surface of the first buffer component close to the display panel.

[0048] According to an implementation of the first aspect of the present application, the display panel includes a first display area and a second display area, the light transmittance of the first display area is greater than that of the second display area, and the orthographic projection of the first through hole on the display panel is located in the first display area.

[0049] In a second aspect, a display module is provided, the display module comprising:

[0050] A display panel having a light emitting surface and a backlight surface arranged opposite to each other;

[0051] A plurality of functional layers are stacked in sequence on a side of a backlight surface away from a light emitting surface, wherein the plurality of functional layers at least include a first functional layer and a second functional layer which are stacked; a second through hole is arranged on the first functional layer, a third through hole is arranged on the second functional layer, the third through hole is connected with the second through hole, and an orthographic projection of the third through hole on the display panel is located within an orthographic projection of the second through hole on the display panel.

[0052] According to an implementation of the second aspect of the present application, a maximum distance between an edge of an orthographic projection of the third through hole and an edge of an orthographic projection of the display panel and the second through hole is W, wherein 0.8 mm ≤ W ≤ 3 mm.

[0053] According to an implementation of the second aspect of the present application, the first functional layer includes an adhesive layer; the second functional layer includes a circuit board, and the adhesive layer is disposed on a side of the circuit board close to the display panel;

[0054] Alternatively, the first functional layer includes an adhesive layer and a circuit board, the second functional layer includes a support layer, the display panel, the support layer, the adhesive layer and the circuit board are stacked in sequence; or the circuit board has multiple dielectric layers and at least two conductive layers, the at least two conductive layers are arranged at intervals along the direction from the display panel to the circuit board, the conductive layer is arranged between adjacent dielectric layers, the first functional layer includes an adhesive layer, at least one dielectric layer and at least one conductive layer, and the second functional layer includes at least one dielectric layer and at least one conductive layer;

[0055] Alternatively, the first functional layer includes a supporting layer, the second functional layer includes a circuit board, and the display panel, the supporting layer and the circuit board are stacked in sequence.

[0056] In a third aspect, a display device is provided, the display device comprising:

[0057] The display module provided in the first aspect or the second aspect;

[0058] A light sensing component, wherein the orthographic projection of the light sensing component on the display panel is located within the orthographic projection of the second through hole on the display panel.

[0059] According to an implementation of the third aspect of the present application, the display device includes:

[0060] A mounting frame, disposed on a side of the plurality of functional layers away from the display panel;

[0061] A second buffer member is disposed between the mounting frame and the display panel, and the second buffer member is disposed at least around a portion of the light sensing member;

[0062] According to an implementation of the third aspect of the present application, an orthographic projection of the second buffer member on the display panel partially overlaps with an orthographic projection of the second through hole on the display panel;

[0063] According to an implementation of the third aspect of the present application, the second buffer component includes foam.

[0064] In the display module and display device provided in the embodiments of the present application, when an external force impacts the area corresponding to the first through hole or the third through hole in the display panel, due to the second through hole in the multiple functional layers, the stress accumulated in the display panel can be released through the second through hole, thereby avoiding stress accumulation in the area of ​​the display panel corresponding to the first through hole or the third through hole, avoiding or reducing damage to the display panel corresponding to the area, and thus avoiding display abnormalities in the area. BRIEF DESCRIPTION OF THE DRAWINGS

[0065] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features and the accompanying drawings are not drawn to scale.

[0066] Figure 1 It is a schematic diagram of a planar structure of a display module provided by an embodiment of the first aspect of the present application;

[0067] Figure 2 is a schematic cross-sectional structure diagram of a display device provided by an embodiment of the third aspect of the present application;

[0068] Figure 3 is a schematic cross-sectional structure diagram of a display module provided by an embodiment of the first aspect of the present application;

[0069] Figure 4 is a schematic cross-sectional structure diagram of a display module provided by an embodiment of the first aspect of the present application;

[0070] Figure 5 is a schematic cross-sectional structure diagram of a display module provided by an embodiment of the first aspect of the present application;

[0071] Figure 6 It is a schematic diagram of the cross-sectional structure of a circuit board provided in an embodiment of the first aspect of the present application;

[0072] Figure 7 It is a partial planar structural schematic diagram of a display module provided by an embodiment of the first aspect of the present application;

[0073] Figure 8 It is a partial planar structural schematic diagram of a display module provided by an embodiment of the first aspect of the present application;

[0074] Fig. 9 is a schematic cross-sectional structure diagram of a display module provided by an embodiment of the first aspect of the present application;

[0075] Fig.10 is a schematic cross-sectional structure diagram of a display module provided by an embodiment of the first aspect of the present application;

[0076] Fig.11 is a schematic cross-sectional structure diagram of a display module provided by an embodiment of the first aspect of the present application;

[0077] Fig.12 It is a schematic diagram of a planar structure of a display module provided by an embodiment of the first aspect of the present application;

[0078] Fig.13 It is a schematic diagram of a planar structure of a display module provided by an embodiment of the second aspect of the present application;

[0079] Fig.14 It is a schematic diagram of the cross-sectional structure of a display device provided in an embodiment of the third aspect of the present application.

[0080] Description of reference numerals:

[0081] 10. display module; 1. display panel; 11. light emitting surface; 12. backlight surface; 2. functional layer; 2a. first functional layer; 2b. second functional layer; 21. first through hole; 211. first edge; 212. second edge; 213. third edge; 214. fourth edge; 22. second through hole; A1. first area; A2. second area; 221. sub-groove; 23. circuit board; 231. first connecting portion; 232 , device portion; 233, second connection portion; 234, dielectric layer; 235, conductive layer; 235a, first conductive layer; 235b, second conductive layer; 236, sub-region II; 24, adhesive layer; 241, sub-region I; 25, protrusion; 26, support layer; 261, adhesive sub-layer; 262, first buffer sub-layer; 263, support sub-layer; 264, second buffer sub-layer; 27, first buffer member; 291, third through hole;

[0082] 20. Light sensing element; 30. Mounting frame; 40. Second buffer element;

[0083] Y, first direction; X, second direction; Z, third direction; AA1, first display area; AA2, second display area. DETAILED DESCRIPTION

[0084] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0085] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0086] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being located on the "side" or "square" of another layer or another region, it may mean that it is directly located on the side of another layer or another region, or that other layers or regions are included between it and the other layer or another region. In addition, if the component is turned over, the layer or the region will be located "below" or "beneath" another layer or another region.

[0087] In the process of realizing the present invention, the inventors found the following problems in the related art. In the display device of the related art, the display module and other modules are stacked. When the display module is subjected to external force, since part of the area of ​​the display module is blocked by other modules, the accumulated stress in the part of the area cannot be effectively released, and the signal routing in the part of the area is damaged, affecting the display effect of the display module. For example: the first display area of ​​the display module and the light sensing module (such as fingerprint sensing module, camera module) are stacked, and the first display area of ​​the display module is designed with an opening to facilitate sensing by the light sensing module. When the first display area of ​​the display module is subjected to external force, since there is no good stress release area between the area around the light sensing module and the first display area of ​​the display module, the stress in the first display area continues to accumulate, which may cause damage to the first display area, making it easy for bright lines or broken bright spots to appear in the first display area, affecting the display effect of the display panel.

[0088] The existing solutions cannot solve the above technical problems well. To solve the above problems, the embodiments of the present application provide a display module and a display device. The embodiments of the display module and the display device will be described below in conjunction with the accompanying drawings.

[0089] See also Figure 1 and Figure 2 The first aspect of the application embodiment provides a display module 10, the display module 10 includes a display panel 1 and multiple functional layers 2, the display panel 1 has a light-emitting surface 11 and a backlight surface 12 that are relatively arranged; the multiple functional layers 2 are stacked in sequence on the side of the backlight surface 12 away from the light-emitting surface 11, the display module 10 has a first through hole 21 that penetrates the multiple functional layers 2, the multiple functional layers 2 include a first functional layer 2a, the first functional layer 2a includes a second through hole 22, the second through hole 22 includes a first area A1 (the dotted area in the figure) and a second area A2, wherein the first area A1 penetrates the first functional layer 2a, and the orthographic projection of the first area A1 on the display panel 1 overlaps with the orthographic projection of the first through hole 21 on the display panel 1; the second area A2 surrounds at least part of the first area A1.

[0090] The display panel 1 includes a light emitting surface 11 and a backlight surface 12 that are arranged opposite to each other. The light emitted by the display panel 1 can be emitted from the light emitting surface 11 , and the plurality of functional layers 2 can be sequentially attached and formed on the backlight surface 12 of the display panel 1 .

[0091] refer to Figure 3, the multiple functional layers 2 may include a support layer 26, an adhesive layer 24, a circuit board 23, etc. For example, the support layer 26 may include a silicone gel layer, a foam layer, etc. The support layer 26 may buffer external forces to buffer the pressure on the display panel 1. The adhesive layer 24 includes a viscous material so that the adhesive layer 24 can bond and fix adjacent functional layers 2. One end of the circuit board 23 may be electrically connected to the drive array layer 14 of the display panel 1, and the other end may be electrically connected to an external control circuit. The external control circuit may be a control mainboard, a control chip, etc. of the display module 10.

[0092] Each functional layer 2 can be stacked in sequence along the third direction Z, which is the thickness direction of the display module 10. A first through hole 21 is formed along the third direction Z, so that at least part of other modules stacked on one side of the display module 10 can extend into the first through hole 21, thereby reducing the overall thickness of the stacked display module 10 and other modules. Exemplarily, the other module is a fingerprint recognition module, which includes a second buffer 40 and a light sensing component 20, at least part of which extends into the first through hole 21, and the second buffer 40 is arranged around the light sensing component 20 and stacked between the light sensing component 20 and the display module 10.

[0093] The first functional layer 2a may include only one functional layer 2, or may include multiple functional layers 2. When the first functional layer 2a includes one functional layer 2, the second through hole 22 may be formed by the functional layer 2 being recessed in a direction away from the first through hole 21; when the first functional layer 2a includes multiple functional layers 2, the second through hole 22 may be formed by the multiple functional layers 2 being recessed in a direction away from the first through hole 21, respectively.

[0094] The first area A1 penetrates the first functional layer 2a, and the orthographic projection of the first area A1 on the display panel 1 overlaps with the orthographic projection of the first through hole 21 on the display panel 1, that is, the first area A1 is a part of the first through hole 21. The second area A2 surrounds at least part of the first area A1, that is, the first area and the second area are connected to form a second through hole 22. The second area can be understood as the surface of the first functional layer defining the first area being concave in a direction away from the first through hole 21, and the second area can be in the form of a through hole penetrating the first functional layer, or in the form of a groove.

[0095] In the display module 10 provided in the present application, when an external force impacts the area corresponding to the first through hole 21 in the display panel 1, since the first functional layer 2a has the second through hole 22, the stress accumulated in the display panel 1 can be released through the second through hole 22, thereby avoiding stress accumulation in the area of ​​the display panel 1 corresponding to the first through hole 21, thereby avoiding display abnormalities in this area.

[0096] In some embodiments, the second area A2 penetrates the first functional layer 2 a .

[0097] The first through hole 21 penetrates the plurality of functional layers 2 along the third direction Z, and the third direction Z may be a direction from the display panel to the functional layer 2, or a thickness direction of the display panel. The first area A1 penetrates the first functional layer 2a along the third direction Z, and the second area A2 may also penetrate the first functional layer 2a along the third direction Z. The thickness of the second area A2 along the third direction Z is equal to the thickness of the first area A1 along the third direction Z, and the thickness of the second area A2 along the third direction Z is less than the thickness of the first through hole 21 along the third direction Z.

[0098] The second region A2 penetrates the first functional layer 2a, thereby maximizing the thickness of the second region A2 that can be formed by the first functional layer 2a.

[0099] In some embodiments, the second area A2 is disposed around the circumference of the first area A1, that is, the second area A2 is disposed around the first area A1.

[0100] The periphery of the first area A1 is connected to the second area A2, so that the stress accumulated in the periphery of the display panel 1 corresponding to the first through hole 2121 can be released through the second area A2.

[0101] In some embodiments, the maximum width of the second area A2 is W, where 0.8 mm ≤ W ≤ 3 mm. For example, the maximum width W is 0.8 mm, 1 mm, 1.1 mm, 1.3 mm, 1.5 mm, 1.8 mm, 2 mm, 2.2 mm, 2.5 mm, 2.8 mm or 3 mm, etc.

[0102] The width of the second region A2 can be the maximum distance from the wall of the second region A2 away from the first through hole 21 to the junction of the first region A1 and the second region A2 in a direction perpendicular to and passing through the central axis of the first through hole 21. If the width of the second region A2 is too large, the contact area between the first functional layer 2a and the adjacent layer structure will be reduced, affecting the stability of the connection between the first functional layer 2a and the adjacent layer structure; if the width of the second region A2 is too small, the area of ​​the second region A2 will be insufficient, affecting the release of the accumulated stress in the display panel through the second region A2. 0.8mm≤W≤3mm is set to balance the stability of the connection between the first functional layer 2a and the adjacent layer structure, and the release of the accumulated stress in the display panel.

[0103] In some embodiments, the plurality of functional layers 2 include a circuit board 23 and an adhesive layer 24 . The circuit board 23 is electrically connected to the display panel 1 , and the adhesive layer 24 is disposed on a side of the circuit board 23 close to the display panel 1 .

[0104] The display panel 1 includes a display area and a non-display area, and the non-display area is arranged around at least a portion of the display area. One end of the circuit board 23 can be electrically connected to the drive array layer 14 in the non-display area, and the other end of the circuit board 23 is electrically connected to an external circuit so that the external circuit can control the display of the display area.

[0105] Optionally, the circuit board 23 is a flexible circuit board, and the adhesive layer 24 is a double-sided adhesive. The circuit board 23 is fixed by the adhesive layer 24 to improve the stability of the electrical connection between the circuit board 23 and the display panel 1.

[0106] Combination Figure 3 In some embodiments, the first functional layer 2a includes an adhesive layer 24 ; the second region A2 located in the adhesive layer 24 is a sub-region 1 241 (shown by a dotted line in the figure); and the sub-region 1 241 penetrates the adhesive layer 24 .

[0107] The sub-region 1 241 penetrates the adhesive layer 24, that is, when the first functional layer 2a only includes the adhesive layer, the functional layer 2 and the circuit board 23 located on the adhesive layer 24 close to the display panel 1 are spaced apart by the sub-region 1 241. The stress accumulated in the display panel 1 can be released through the sub-region 1 241.

[0108] Exemplarily, the plurality of functional layers 2 include a supporting layer 26 , an adhesive layer 24 and a circuit board 23 which are connected in sequence, and the supporting layer 26 and the circuit board 23 are spaced apart by a sub-region 1 241 .

[0109] In some embodiments, the first sub-region 241 is disposed around a portion of the first through hole 21 .

[0110] The larger the area of ​​the adhesive layer 24 used to form the sub-region 1 241, the smaller the contact area between the adhesive layer 24 and the circuit board 23, which is not conducive to the fixation of the circuit board 23 and the display panel 1, but is conducive to the display module 10 releasing stress through the sub-region 1 241. The sub-region 1 241 is arranged around a portion of the first through hole 21 to balance the contact area between the adhesive layer 24 and the circuit board 23, and the ability of the display module 10 to release stress through the sub-region 1 241.

[0111] In some embodiments, the sub-region 1 241 is disposed around the circumference of the first through hole 21 , that is, the sub-region 1 241 is disposed around the first through hole 21 in a circle.

[0112] The circumference of the first through hole 21 is the direction around the first through hole 21. The sub-region 1 241 is arranged around the circumference of the first through hole 21, so that the region of the display panel 1 corresponding to the first through hole 21 and the edge region around the region can effectively release the accumulated stress.

[0113] In some embodiments, the maximum width of sub-region one is H1, where 0.8 mm≤H1≤3 mm.

[0114] 0.8mm≤H1≤3mm is set to balance the stability of the connection between the adhesive layer and the circuit board and the release of the accumulated stress in the display panel. Optionally, H1 is 0.8mm, 0.9mm, 1mm, 1.2mm, 1.5mm, 2mm, 2.3mm, 2.6mm, 2.8mm, 3mm.

[0115] In some embodiments, the orthographic projection of the adhesive layer 24 on the display panel 1 is located within the orthographic projection of the circuit board 23 on the display panel 1 to prevent the adhesive layer 24 from overflowing the circuit board 23 and to prevent the overflowing adhesive layer 24 from adhering to other components and interfering with the operation of other components.

[0116] In some embodiments, in the second direction X, the distance between the side wall of the adhesive layer 24 away from the second through hole 22 and the side wall of the circuit board 23 away from the first through hole 21 is H2, H1>H2; the second direction X is the width direction of the display module.

[0117] The area of ​​the adhesive layer 24 attached to the device portion 232 is smaller than the area of ​​the device portion 232. By setting H2, the adhesive layer 24 is prevented from overflowing outside the device portion 232. By setting H1, a sub-region 1 241 with a suitable size is formed.

[0118] By setting H1>H2, the contact area between the adhesive layer 24 and the circuit board 23 is increased, and a sufficient area is reserved for releasing the stress accumulated in the display panel 1 through the sub-area 1 241 .

[0119] In some embodiments, the distance between the side wall of the adhesive layer 24 away from the second through hole 22 and the side wall of the circuit board 23 away from the first through hole 21 is H2, H2≤0.3 mm;

[0120] H2 is set to be less than or equal to 0.25 mm to ensure the contact area between the adhesive layer 24 and the circuit board 23. Optionally, H2 is 0 mm, 0.05 mm, 0.1 mm, 0.2 mm, or 0.3 mm.

[0121] Please refer to Figure 1 and Figure 4 In some embodiments, the circuit board 23 has a first connection portion 231, a device portion 232, and a second connection portion 233. The display panel 1, the first connection portion 231, the device portion 232, and the second connection portion 233 are electrically connected in sequence along the first direction Y. The first through hole 21 passes through the device portion 232. The adhesive layer 24 is stacked on one side of the device portion 232. The orthographic projection of the adhesive layer 24 on the display panel 1 is located within the orthographic projection of the device portion 232 on the display panel 1. The first direction Y is the length direction of the display module.

[0122] Signal traces are provided in the first connection portion 231, the device portion 232, and the second connection portion 233. The device portion 232 may be connected to the support layer 26 through the adhesive layer 24, so that the circuit board 23 and the display panel 1 can remain relatively fixed, which is conducive to improving the stability of the electrical connection between the circuit board 23 and the display panel 1. The second connection portion 233 may be non-fixedly connected to the display panel 1 to facilitate the second connection portion 233 to connect to an external circuit. The width of the second connection portion 233 along the second direction X may be smaller than the width of the first connection portion 231 along the second direction X to facilitate the one-to-one connection between the first connection portion 231 and the signal lines in the display panel 1, and the second connection portion 233 is connected to an external circuit.

[0123] In some embodiments, the height of the adhesive layer 24 along the direction from the display panel 1 to the circuit board 23 is H3, and the height of the sub-region 1 241 along the direction from the display panel 1 to the circuit board 23 is H3, 50 microns ≤ H3 ≤ 80 microns. Optionally, H3 is 50 microns, 60 microns, 75 microns, or 80 microns.

[0124] See also Figure 5 In some embodiments, the first functional layer 2 a includes a circuit board 23 , that is, the circuit board 23 and the adhesive layer 24 together form the second through hole 22 , thereby increasing the height of the second through hole 22 .

[0125] refer to Figure 6 In some embodiments, the second area A2 located on the circuit board 23 is a sub-area 236 ( Figure 5 (as shown by the middle dotted line), the surface of the circuit board 23 close to the display panel 1 is recessed in a direction away from the display panel 1 to form a sub-region 236.

[0126] The surface of the circuit board 23 close to the display panel 1 is recessed in a direction away from the display panel 1 to form a sub-region 236, that is, a portion of the circuit board 23 is thinned to form the sub-region 236, so that signal routing can be set in the circuit board 23 on one side of the sub-region 236, and the display panel 1 can also release accumulated stress through the sub-region 236.

[0127] In some embodiments, the orthographic projection of the sub-region 1 241 on the display panel 1 and the orthographic projection of the sub-region 2 236 on the display panel 1 at least partially overlap.

[0128] The sub-region 1 241 and the sub-region 236 can be connected to form a groove structure connected to the first through hole 21. The surface of the circuit board 23 close to the display panel 1 is recessed in the direction away from the display panel 1 to form the sub-region 236, so that the sub-region 1 241 and the sub-region 236 are spaced between the circuit board 23 and the functional layer 2 located on the side of the adhesive layer 24 close to the display panel 1, and the spacing distance between the circuit board 23 and the functional layer 2 located on the side of the adhesive layer 24 close to the display panel 1 is increased, which is beneficial to the release of stress of the display panel 1.

[0129] Optionally, the orthographic projection of the sub-region 1 241 on the display panel 1 overlaps with the orthographic projection of the sub-region 2 236 on the display panel 1 .

[0130] Please refer to Fig.11 In some embodiments, a first buffer member 27 is provided in the second area A2.

[0131] The first buffer member 27 can support adjacent layer structures and provide buffering between adjacent layer structures, which is beneficial to stress release of the display panel 1 .

[0132] In some embodiments, the thickness of the second area A2 is h1, and the thickness of the first buffer member 27 is h2, wherein h1 ≥ h2.

[0133] When h1=h2, the surface of the first functional layer 2a close to the display panel 1 is flush with the surface of the first buffer 27 close to the display panel 1, so as to avoid the first buffer 27 being squeezed between adjacent layer structures and improve the deformability of the first buffer 27. When h1>h2, the surface of the first functional layer 2a close to the display panel 1 is closer to the display panel 1 than the surface of the first buffer 27 close to the display panel 1, that is, there is a gap between the first buffer 27 and the functional layer 2 or the display panel 1 located on the side of the first functional layer 2a close to the display panel 1, and the display panel 1 subjected to external force can undergo a recoverable deformation toward the gap and then contact the first buffer 27.

[0134] In some specific embodiments, the first buffer component 27 is foam. Since the first buffer component 27 is arranged in the second area A2, when h1=h2, the first buffer component 27 can be in a compressed state or in a non-compressed state; for the compressed state, the first buffer component 27 is limited by the thickness of the second area A2, and the actual thickness of the first buffer component 27 can be greater than h1, for example, greater than or equal to 1.5h1; for the non-compressed state, the actual thickness of the first buffer component 27 is equal to h1.

[0135] See also Figure 5 and Figure 6In some embodiments, the circuit board 23 has multiple dielectric layers 234 and at least two conductive layers 235. The at least two conductive layers 235 are arranged at intervals along the direction from the display panel 1 to the circuit board 23, and the conductive layers 235 are arranged between adjacent dielectric layers 234. The dielectric layer 234 is made of insulating material. The dielectric layer 234 may include a substrate layer and a coating layer. When the circuit board 23 has two conductive layers 235, the coating layer, the conductive layer 235, the substrate layer, the conductive layer 235, and the coating layer are stacked in sequence. When the circuit board 23 has three conductive layers 235, the coating layer, the conductive layer 235, the substrate layer, the conductive layer 235, the substrate layer, the conductive layer 235, and the coating layer are stacked in sequence.

[0136] In some embodiments, the second sub-region 236 penetrates at least one dielectric layer 234 close to a side of the display panel 1 .

[0137] Taking the circuit board 23 having 4 dielectric layers 234 and 3 conductive layers 235 as an example, sub-region two 236 penetrates at least one dielectric layer 234, and it can be that sub-region two 236 penetrates one dielectric layer 234, and the conductive layer 235 located on the side of the dielectric layer 234 away from the display panel 1 is exposed from sub-region two 236.

[0138] In some embodiments, the second sub-region 236 penetrates at least one dielectric layer 234 and at least one conductive layer 235 .

[0139] Taking the circuit board 23 having four dielectric layers 234 and three conductive layers 235 as an example, the sub-region 236 penetrates at least one dielectric layer 234 and at least one conductive layer 235, and the sub-region 236 may penetrate one dielectric layer 234 and one conductive layer 235. Alternatively, the sub-region 236 may penetrate two dielectric layers 234 and two conductive layers 235, or the sub-region 236 may penetrate four dielectric layers 234 and three conductive layers 235.

[0140] By setting the second sub-region 236 to penetrate at least one dielectric layer 234 and at least one conductive layer 235 , the circuit board 23 can be thinned in layers as needed to form the second sub-regions 236 of different depths.

[0141] In some embodiments, at least two conductive layers 235 include at least one first conductive layer 235a and at least one second conductive layer 235b, the first conductive layer 235a is located on a side of the second conductive layer 235b close to the display panel 1, and sub-region two 236 penetrates the first conductive layer 235a and exposes a portion of the dielectric layer 234 located between the first conductive layer 235a and the second conductive layer 235b.

[0142] When the circuit board 23 has two conductive layers 235, one of the conductive layers 235 is the first conductive layer 235a, and the other conductive layer 235 is the second conductive layer 235b. When the circuit board 23 has three conductive layers 235, the conductive layer 235 in the middle may be the first conductive layer 235a, the conductive layer 235 on the side of the conductive layer 235 away from the display panel 1 may be the second conductive layer 235b, and the conductive layer 235 on the side of the conductive layer 235 close to the display panel 1 may be the first conductive layer 235a. Alternatively, the conductive layer 235 in the middle may be the second conductive layer 235b, the conductive layer 235 on the side of the conductive layer 235 away from the display panel 1 may be the second conductive layer 235b, and the conductive layer 235 on the side of the conductive layer 235 close to the display panel 1 may be the first conductive layer 235a. By analogy, among the multiple conductive layers 235 in the circuit board 23, one or more sequentially arranged conductive layers 235 are the first conductive layer 235a, and one or more sequentially arranged conductive layers 235 located on the side of the first conductive layer 235a away from the display panel 1 are the second conductive layer 235b.

[0143] The second conductive layer 235 b is retained in the circuit board 23 for signal transmission, so as to reduce the changes in the design of the circuit board 23 caused by setting the second sub-region 236 .

[0144] Please refer to Figure 1 , Figure 6 and Figure 7 In some embodiments, the orthographic projection of the first through hole 21 on the display panel 1 includes a first edge 211 and a second edge 212, and at least a partial orthographic projection of the second sub-region 236 on the display panel 1 is provided on one side of the second edge 212, that is, the orthographic projection of the second sub-region 236 on the display panel 1 is at least partially located on a side of the second edge 212 away from the first edge 211; Figure 7 As shown, a partial orthographic projection of the sub-region 236 on the display panel 1 is located on one side of the second edge 212. Of course, in other embodiments, the entire orthographic projection of the sub-region 236 on the display panel 1 is located on one side of the second edge 212.

[0145] The first edge 211 not surrounded by the second sub-region 236 has enough space to set signal wiring in the circuit board 23 to ensure signal connectivity of the display panel 1 .

[0146] In some embodiments, the first edge 211 and the second edge 212 are arranged opposite to each other, the orthographic projection of the first through hole 21 on the display panel 1 has a third edge 213 and a fourth edge 214 arranged opposite to each other, and a partial orthographic projection of the second sub-region 236 on the display panel 1 is arranged on one side of the third edge 213 and / or the fourth edge 214; that is, the orthographic projection of the second sub-region 236 on the display panel 1 is also located on one side of the third edge 213 and / or the fourth edge 214. Figure 7It is shown in FIG. 2 that the orthographic projection of the sub-region 236 on the display panel 1 is located on one side of the second edge 212 , the third edge 213 and the fourth edge 214 .

[0147] When the first through hole 21 is a rectangular hole, the first edge 211 , the third edge 213 , the second edge 212 and the fourth edge 214 are connected and wound in sequence.

[0148] In some embodiments, the width of the orthographic projection of the sub-region 236 located on the second edge 212 on the display panel 1 is W1, and the width of the orthographic projection of the sub-region 236 located on the third edge 213 and / or the fourth edge 214 on the display panel 1 is W2, W1>W2.

[0149] A signal line extension may be provided on the side of the sub-region 236 disposed at the third edge 213 or the fourth edge 214 away from the first through hole 21. Compared with the third edge 213 or the fourth edge 214, the signal line density distributed in the second edge 212 is lower, and W1>W2 is set to provide a larger sub-region 236.

[0150] In some embodiments, the circuit board 23 has a first connecting portion 231, a device portion 232 and a second connecting portion 233, the first connecting portion 231, the device portion 232 and the second connecting portion 233 are electrically connected in sequence along the first direction Y, the first connecting portion 231 is electrically connected to the display panel 1, the first edge 211 and the second edge 212 are relatively arranged along the first direction Y, the third edge 213 and the fourth edge 214 are relatively arranged along the second direction X, wherein the first direction Y and the second direction X are arranged to intersect, and the first direction Y is the length direction of the display module. Figure 7 It is shown that the first direction Y and the second direction X are perpendicular to each other.

[0151] The second sub-region 236 extends along the second edge 212, so that the signal routing extending from the first connection portion 231 can extend to the first edge 211 along the direction from the device portion 232 to the second connection portion 233, and then bend around the first through hole 21 to the side of the first through hole 21 away from the first connection portion 231. Compared with the first edge 211, the density of signal routing distributed in the second edge 212 is lower, and the second sub-region 236 is set to extend along the second edge 212 to reduce the influence of the second sub-region 236 on the signal routing.

[0152] See also Figure 8 In some embodiments, the second through hole 22 includes a plurality of sub-grooves 221 , which are connected to the first through hole 21 , and at least portions of adjacent sub-grooves 221 are separated by protrusions 25 , which are formed by the first functional layer 2a protruding toward the side wall of the second through hole 22 .

[0153] Taking the first functional layer 2a as an adhesive layer 24 as an example, the adhesive layer 24 includes a main body and a protruding portion 25, the main body is arranged around the first through hole 21, the protruding portion 25 protrudes toward the first through hole 21 to the main body, and sub-grooves 221 are formed between adjacent protruding portions 25. The protruding portion 25 and the main body have the same adhesive effect, and by providing a plurality of protruding portions 25, the contact area between the adhesive layer 24 and the circuit board 23 is increased, and by providing a plurality of sub-grooves 221, the area around the first through hole 21 in the display panel 1 can release stress through each sub-groove 221.

[0154] The protrusions 25 may have different shapes, for example, a plurality of protrusions 25 may form a sawtooth shape. In some embodiments, the orthographic projection of the side wall of the first functional layer 2a facing the second through hole 22 on the display panel 1 is at least partially a wavy line.

[0155] The boundary line is a wavy line, that is, the second through hole 22 has an arc-shaped side wall.

[0156] See also Fig. 9 In some embodiments, the plurality of functional layers 2 further include a support layer 26 .

[0157] The support layer 26 can be made of a hard material, which is not easily deformed when subjected to force. The support layer 26 can well ensure that the display panel 1 has a desired shape.

[0158] In some embodiments, the first functional layer 2a includes a support layer 26 , the display panel 1 includes a substrate 13 , a drive array layer 14 and a light emitting device layer 15 stacked in sequence, and the support layer 26 is stacked on a side of the substrate 13 away from the drive array layer 14 .

[0159] In the case where the display panel 1 is a flexible display panel 1, the substrate 13 may have properties such as being stretchable, bendable or flexible, and its material includes but is not limited to polyimide material (PI for short) or polycarbonate material (PC for short) or polyethylene terephthalate material (PET for short) etc. During the preparation of the display panel 1, each layer structure of the display panel 1 may be formed on the substrate 13.

[0160] The light-emitting device layer 15 is located on one side of the substrate 13, and the light-emitting device layer 15 includes a plurality of light-emitting units; the drive array layer 14 is located on the side of the light-emitting device layer 15 close to the substrate 13, and the drive array layer 14 is electrically connected to the light-emitting units in the light-emitting device layer to control the light-emitting units to emit light. Exemplarily, in the embodiment of the present application, an organic light-emitting diode (OLED) can be selected to prepare each of the above-mentioned light-emitting units. Alternatively, the light-emitting unit can also be set as a micro light-emitting diode (Micro Light Emitting Diode, Micro-LED) or a quantum dot light-emitting diode (Quantum Light Emitting Diode, QLED). The drive array layer 14 may include a drive circuit, which is used to control the light-emitting unit to emit light. The display panel of this embodiment may also include a cover plate, an optical glue, a polarizer, a touch layer, etc., which will not be repeated here.

[0161] In some embodiments, the substrate 13 is a light-shielding substrate.

[0162] In some embodiments, the supporting layer 26 includes an adhesive sublayer 261 , a first buffer sublayer 262 , and a supporting sublayer 263 , and the second region A2 penetrates at least one of the adhesive sublayer 261 , the first buffer sublayer 262 , and the supporting sublayer 263 .

[0163] The support sublayer 263 can provide support for the support layer 26. The support sublayer 263 may include metal materials and / or non-metal materials. The metal material may be copper foil, aluminum foil, stainless steel, etc. The non-metal material may be at least one of polyethylene terephthalate (PET), acrylonitrile-butadiene-styrene copolymer (ABS), polyimide (PI), polyethylene (PE), polymethacrylate (PMMA), polycarbonate (PC) and polypropylene (PP). When the support sublayer 263 includes a metal material, the support sublayer 263 also has the function of shielding electrical signals and shading. Optionally, the material of the support sublayer 263 includes copper foil.

[0164] The adhesive sublayer 261 can bond the substrate 13 and the first buffer sublayer 262, and the adhesive sublayer 261 can be a grid glue. Before being attached to the substrate 13, the grid glue in the support layer 26 is in a grid shape. After the support layer 26 is attached to the substrate 13 through the grid glue, the grid glue gradually flows flat and is evenly distributed between the first buffer sublayer 262 and the substrate 13.

[0165] The first buffer sublayer 262 has a buffering function and is made of a deformable material, such as foam. The first buffer sublayer 262 can provide buffering capacity for the display panel 1 to reduce or prevent the display panel 1 from being damaged by external forces.

[0166] The second area A2 penetrates at least one of the adhesive sublayer 261, the first buffer sublayer 262 and the supporting sublayer 263, so that when the display panel 1 is squeezed by external force in the area corresponding to the first through hole 21, the display panel 1 can release stress through the second through hole 22 in the supporting layer 26 to avoid the signal line near the first through hole 21 from breaking.

[0167] Optionally, the adhesive sublayer 261 includes mesh glue; the first buffer sublayer 262 includes foam; and the supporting sublayer 263 includes copper.

[0168] See also Fig.10 In some embodiments, the support layer 26 includes a second buffer sublayer 264 and a support sublayer 263 , and the second area A2 penetrates at least one of the second buffer sublayer 264 and the support sublayer 263 .

[0169] The second buffer sublayer 264 has a buffering effect, and the second buffer sublayer 264 is made of a material with deformation ability, such as one or more of silicone gel and acrylic resin. The second buffer sublayer 264 can provide buffering capacity for the display panel 1, reducing or preventing the display panel 1 from being damaged by external forces. The second buffer sublayer 264 can also be viscous, so that the second buffer sublayer 264 can bond the substrate 13 and the supporting sublayer 263. Optionally, the second buffer sublayer 264 is silicone gel, the supporting sublayer 263 includes copper, and the silicone gel is a low cross-linking density silicone rubber. Silicone gel has low mechanical strength, is resistant to high and low temperatures, and has vibration absorption ability.

[0170] See also Fig.11 In some embodiments, the display module 10 further includes a first buffer member 27 , and the first buffer member 27 is disposed in the second area A2 .

[0171] When the display module 10 is provided with the second through hole 22, a first buffer 27 can be provided in the second area A2 of the second through hole 22. The first buffer 27 can support adjacent layer structures and provide buffering between adjacent layer structures, which is beneficial to stress release of the display panel 1. Optionally, the first buffer 27 is foam.

[0172] In some embodiments, the orthographic projection of the first buffer 27 on the display panel 1 does not overlap with the orthographic projection of the first through hole 21 on the display panel 1 to prevent the first buffer 27 from extending into the first through hole 21 and affecting the light sensing element installed corresponding to the first through hole 21 .

[0173] In some embodiments, a surface of the first functional layer 2 a close to the display panel 1 is flush with a surface of the first buffer member 27 close to the display panel 1 .

[0174] When only one functional layer 2 has the second through hole 22, the surface of the first functional layer 2a close to the display panel 1 is the surface close to the display panel 1. When multiple functional layers 2 have the second through hole 22, the surface of the multiple functional layers 2 having the second through hole 22 close to the display panel 1 is the surface close to the display panel 1. The surface close to the display panel 1 is set flush with the surface of the first buffer 27 close to the display panel 1 to avoid the first buffer 27 being squeezed between adjacent layer structures, thereby improving the deformability of the first buffer 27.

[0175] In some embodiments, a surface of the first functional layer 2 a close to the display panel 1 is protruded toward the display panel 1 compared to a surface of the first buffer member 27 close to the display panel 1 .

[0176] The surface close to the display panel 1 protrudes toward the display panel 1 compared to the surface of the first buffer member 27 close to the display panel 1, that is, there is a gap between the first buffer member 27 and the functional layer 2 located on the side of the first functional layer 2a close to the display panel 1 or the display panel 1. When the display panel 1 is squeezed by external force, it can undergo a recoverable deformation toward the gap and then contact the first buffer member 27.

[0177] See also Fig.12 In some embodiments, the display panel 1 includes a first display area AA1 and a second display area AA2, the light transmittance of the first display area AA1 is greater than the light transmittance of the second display area AA2, and the orthographic projection of the first through hole 21 on the display panel 1 is located in the first display area AA1.

[0178] The light transmittance of the first display area AA1 can be improved by setting the distribution density of the light-emitting units in the first display area AA1 to be smaller than the distribution density in the second display area AA2, and the projection area of ​​the light-emitting units in the first display area AA1 can be smaller than the projection area of ​​the light-emitting units in the second display area AA2. The light transmittance of the first display area AA1 is greater than the light transmittance of the second display area AA2, so that the light sensing element 20 is appropriately placed on one side of the first display area AA1. The light sensing element 20 can be a fingerprint identifier, an infrared sensor, or a camera.

[0179] Second, combining Fig.13The embodiment of the present application also provides a display module 10, which includes a display panel 1 and multiple functional layers 2. The display panel 1 has a light-emitting surface 11 and a backlight surface 12 that are arranged opposite to each other; the multiple functional layers 2 are stacked in sequence on the side of the backlight surface 12 that is away from the light-emitting surface 11, and the multiple functional layers 2 at least include a first functional layer 2a and a second functional layer 2b that are stacked; a second through hole 22 is provided on the first functional layer 2a, and a third through hole 291 (the area where the dotted line is in the figure) is provided on the second functional layer 2b, the second through hole 22 is connected to the third through hole 291, and the orthographic projection of the third through hole 291 on the display panel is located within the orthographic projection of the second through hole 22 on the display panel 1.

[0180] The second through hole 22 involved in the second aspect can be set with reference to the second through hole 22 in some embodiments of the first aspect. The third through hole 291 involved in the second aspect can be set with reference to the first through hole 21 in some embodiments of the first aspect. The third through hole 291 can be all or part of the first through hole 21 in the embodiments of the first aspect.

[0181] In the display module 10 provided in the present application, when an external force impacts the area corresponding to the third through hole 291 in the display panel 1, since the first functional layer 2a has the second through hole 22, the stress accumulated in the display panel 1 can be released through the second through hole 22, thereby avoiding stress accumulation in the area of ​​the display panel 1 corresponding to the third through hole 291, thereby avoiding display abnormalities in this area.

[0182] In some embodiments, the maximum distance between the edge of the orthographic projection of the third through hole 291 on the display panel 1 and the edge of the orthographic projection of the second through hole 22 on the display panel 1 is W, where 0.8mm≤W≤3mm; for example, the maximum distance W is 0.8mm, 1mm, 1.1mm, 1.3mm, 1.5mm, 1.8mm, 2mm, 2.2mm, 2.5mm, 2.8mm or 3mm, etc.

[0183] In some embodiments, the first functional layer 2 a includes an adhesive layer 24 , the second functional layer 2 b includes a circuit board 23 , the circuit board 23 is electrically connected to the display panel 1 , and the adhesive layer 24 is disposed on a side of the circuit board 23 close to the display panel 1 .

[0184] The second through hole 22 penetrates the adhesive layer 24 , and the stress accumulated in the display panel 1 can be released through the second through hole 22 .

[0185] In some embodiments, the first functional layer 2a includes an adhesive layer 24 and a circuit board 23, the second functional layer 2b includes a support layer 26, and the display panel 1, the support layer 26, the adhesive layer 24 and the circuit board 23 are stacked in sequence.

[0186] The second through hole 22 penetrates the adhesive layer 24 and the circuit board 23 , and the stress accumulated in the display panel 1 can be released through the second through hole 22 .

[0187] In some embodiments, the circuit board 23 has multiple dielectric layers 234 and at least two conductive layers 235, the at least two conductive layers 235 are arranged at intervals along the direction from the display panel 1 to the circuit board 23, and the conductive layers 235 are arranged between adjacent dielectric layers 234, the first functional layer 2a includes an adhesive layer 24, at least one dielectric layer 234 and at least one conductive layer 235, and the second functional layer 2b includes at least one dielectric layer 234 and at least one conductive layer 235.

[0188] The second through hole 22 penetrates the adhesive layer 24 , the at least one dielectric layer 234 and the at least one conductive layer 235 . The stress accumulated in the display panel 1 can be released through the second through hole 22 .

[0189] In some embodiments, the first functional layer 2a includes a supporting layer 26, the second functional layer 2b includes a circuit board 23, and the display panel 1, the supporting layer 26 and the circuit board 23 are stacked in sequence.

[0190] The second through hole 22 penetrates the supporting layer 26 , and the stress accumulated in the display panel 1 can be released through the second through hole 22 .

[0191] In a third aspect, the present application also provides a display device, see Fig.14 The display device includes a light sensing element 20 and the display module 10 provided in the first aspect, and the orthographic projection of the light sensing element 20 on the display panel 1 is located within the orthographic projection of the second through hole 22 on the display panel 1 .

[0192] The display device can be a mobile phone, tablet computer, laptop computer, PDA, etc. with a display panel 1, and can also be a personal computer (PC), television (TV), ATM or self-service machine, etc., which is not specifically limited in the embodiments of the present application.

[0193] The light sensing element 20 can realize photoelectric signal conversion, and the light sensing element 20 can be a fingerprint identifier, an infrared sensor, or a camera. The light sensing element 20 is at least partially disposed in the first through hole 21, and light enters the display panel 1 from the light emitting surface, and then is emitted from the backlight surface 12 to the first through hole 21. The light sensing element 20 can receive the light in the first through hole 21 and generate an electrical signal.

[0194] In the display device provided in the embodiment of the present application, the related structure of the aforementioned display panel 1 is provided. Please refer to the display panel 1 provided in each embodiment, which has all the beneficial effects of the aforementioned display surface and will not be repeated here.

[0195] In some embodiments, the display device includes a mounting frame 30 and a second buffer member 40, the mounting frame 30 is arranged on the side of the multi-functional layer away from the display panel 1; the second buffer member 40 is arranged between the mounting frame 30 and the display panel 1, and the second buffer member 40 is arranged at least around a portion of the light sensing element 20.

[0196] The second buffer member 40 is disposed between the mounting frame 30 and the display panel 1 . The second buffer member 40 is disposed at least around a portion of the light sensing member 20 , so that the mounting frame 30 , the second buffer member 40 , and the circuit board 23 are stacked in sequence.

[0197] The second buffer member 40 is provided to stabilize the relative positions of the light sensing member 20 and the display module 10 .

[0198] In some embodiments, the orthographic projection of the second buffer member 40 on the display panel 1 partially overlaps with the orthographic projection of the second through hole 22 on the display panel 1 .

[0199] The orthographic projection of the second buffer member 40 on the display panel 1 may partially fall within the orthographic projection of the first through hole 21 on the display panel 1, and partially fall within the orthographic projection of the second area A2 on the display panel 1, so that the area covered by the second buffer member 40 on the display panel 1 can release the accumulated stress through the second through hole 22. Optionally, the second buffer member 40 includes foam.

[0200] According to the embodiments of the present application, these embodiments do not describe all the details in detail, nor do they limit the invention to specific embodiments. Obviously, many modifications and changes can be made based on the description. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can make good use of the present application and the modifications based on the present application. The present application is limited only by the claims and their full scope and equivalents.

Claims

1. A display module, It is characterized in that The display module comprises: A display panel having a light emitting surface and a backlight surface arranged opposite to each other; A plurality of functional layers are stacked in sequence on a side of the backlight surface away from the light emitting surface, the display module has a first through hole penetrating the plurality of functional layers, the plurality of functional layers include a first functional layer, the first functional layer includes a second through hole, the second through hole includes a first area and a second area, wherein the first area penetrates the first functional layer, and an orthographic projection of the first area on the display panel overlaps with an orthographic projection of the first through hole on the display panel; and the second area surrounds at least a portion of the first area.

2. The display module according to claim 1, It is characterized in that The second region penetrates the first functional layer; Preferably, the second area is arranged around the circumference of the first area; Preferably, the maximum width of the second region is W, wherein 0.8 mm ≤ W ≤ 3 mm.

3. The display module according to claim 1, It is characterized in that The plurality of functional layers include a circuit board and an adhesive layer, the circuit board is electrically connected to the display panel, and the adhesive layer is arranged on a side of the circuit board close to the display panel; Preferably, the first functional layer includes the adhesive layer; the second region located in the adhesive layer is sub-region one; the sub-region one runs through the adhesive layer; Preferably, the sub-region 1 is arranged around the circumference of the first region; Preferably, the maximum width of the sub-region 1 is H1, wherein 0.8 mm ≤ H1 ≤ 3 mm; Preferably, the orthographic projection of the adhesive layer on the display panel is located within the orthographic projection of the circuit board on the display panel; Preferably, in the second direction, the distance between the side wall of the adhesive layer away from the second through hole and the side wall of the circuit board away from the first through hole is H2, H1>H2; the second direction is the width direction of the display module; Preferably, the distance between the side wall of the adhesive layer away from the second through hole and the side wall of the circuit board away from the first through hole is H2, and H2≤0.3 mm; Preferably, the circuit board has a first connecting part, a device part and a second connecting part, the display panel, the first connecting part, the device part and the second connecting part are connected in sequence along a first direction, and the first through hole passes through the device part; the adhesive layer is stacked on one side of the device part, the orthographic projection of the adhesive layer on the display panel is located within the orthographic projection of the device part on the display panel, and the first direction is the length direction of the display module.

4. The display module according to claim 3, It is characterized in that The first functional layer includes the circuit board; Preferably, the second area located on the circuit board is sub-area 2, and the surface of the circuit board close to the display panel is recessed in a direction away from the display panel to form sub-area 2; Preferably, the orthographic projection of the sub-region 1 on the display panel and the orthographic projection of the sub-region 2 on the display panel at least partially overlap; Preferably, the orthographic projection of the sub-region 1 on the display panel overlaps with the orthographic projection of the sub-region 2 on the display panel; Preferably, a first buffer is provided in the second area; Preferably, the thickness of the second region is h1, and the thickness of the first buffer is h2, wherein h1≥h2; Preferably, the first buffer member comprises foam.

5. The display module according to claim 4, It is characterized in that The circuit board comprises a plurality of dielectric layers and at least two conductive layers, wherein the at least two conductive layers are arranged at intervals along a direction from the display panel to the circuit board, and the conductive layer is arranged between adjacent dielectric layers; Preferably, the second sub-region penetrates at least one layer of the dielectric layer close to a side of the display panel; Preferably, the second sub-region penetrates at least one layer of the dielectric layer and at least one layer of the conductive layer; Preferably, the at least two conductive layers include at least one first conductive layer and at least one second conductive layer, the first conductive layer is located on a side of the second conductive layer close to the display panel, and the sub-region two penetrates the first conductive layer and exposes a portion of the dielectric layer located between the first conductive layer and the second conductive layer.

6. The display module according to claim 5, It is characterized in that The orthographic projection of the first through hole on the display panel includes a first edge and a second edge, and at least a part of the orthographic projection of the second sub-region on the display panel is provided on one side of the second edge; Preferably, the first edge and the second edge are arranged opposite to each other; Preferably, the orthographic projection of the first through hole on the display panel further includes a third edge and a fourth edge arranged opposite to each other, and a partial orthographic projection of the second sub-region on the display panel is arranged on one side of the third edge and / or the fourth edge; Preferably, the width of the orthographic projection of the sub-region 2 located at one side of the second edge on the display panel is W1, and the width of the orthographic projection of the sub-region 2 located at one side of the third edge and / or the fourth edge on the display panel is W2, W1>W2; Preferably, the circuit board has a first connecting part, a device part and a second connecting part, the first connecting part, the device part and the second connecting part are connected in sequence along a first direction, and the first connecting part is connected to the display panel; the first edge and the second edge are arranged opposite to each other along the first direction, and the third edge and the fourth edge are arranged opposite to each other along the second direction, wherein the first direction and the second direction are arranged to intersect, and the first direction is the length direction of the display module.

7. The display module according to claim 1, It is characterized in that The second region includes a plurality of sub-grooves, the sub-grooves are connected to the first through hole, and at least parts of adjacent sub-grooves are separated by protrusions, wherein the protrusions are formed by the first functional layer protruding toward the side wall of the second through hole; Preferably, at least a portion of an orthographic projection of a side wall of the first functional layer facing the second through hole on the display panel is a wavy line.

8. The display module according to claim 1, It is characterized in that The plurality of functional layers further comprises a support layer; Preferably, the first functional layer includes the support layer; The display panel comprises a substrate, a driving array layer and a light emitting device layer which are stacked in sequence, and the supporting layer is arranged on a side of the substrate away from the driving array layer; Preferably, the support layer comprises an adhesive sublayer, a first buffer sublayer and a support sublayer, and the second region penetrates at least one of the adhesive sublayer, the first buffer sublayer and the support sublayer; Preferably, the adhesive sublayer comprises grid glue; the first buffer sublayer comprises foam; the supporting sublayer comprises copper; Preferably, the support layer includes a second buffer sublayer and a support sublayer, and the second region penetrates at least one of the second buffer sublayer and the support sublayer; Preferably, the second buffer sublayer comprises silicone gel; and the supporting sublayer comprises copper.

9. The display module according to claim 1, It is characterized in that The display module further includes a first buffer member, and the first buffer member is disposed in the second area; Preferably, the orthographic projection of the first buffer member on the display panel does not overlap with the orthographic projection of the first through hole on the display panel; Preferably, the thickness of the second region is h1, and the thickness of the first buffer is h2, wherein h1≥h2; Preferably, in the first functional layer, the surface close to the display panel is flush with the surface of the first buffer member close to the display panel, or, in the first functional layer, the surface close to the display panel protrudes toward the display panel compared to the surface of the first buffer member close to the display panel.

10. The display module according to claim 1, It is characterized in that The display panel includes a first display area and a second display area. The light transmittance of the first display area is greater than that of the second display area. The orthographic projection of the first through hole on the display panel is located in the first display area.

11. A display module, It is characterized in that The display module comprises: A display panel having a light emitting surface and a backlight surface arranged opposite to each other; A plurality of functional layers are stacked in sequence on a side of the backlight surface away from the light emitting surface, wherein the plurality of functional layers at least include a first functional layer and a second functional layer which are stacked; a second through hole is arranged on the first functional layer, a third through hole is arranged on the second functional layer, the third through hole is connected with the second through hole, and an orthographic projection of the third through hole on the display panel is located within an orthographic projection of the second through hole on the display panel.

12. The display module according to claim 11, It is characterized in that The maximum distance between the edge of the orthographic projection of the third through hole on the display panel and the edge of the orthographic projection of the second through hole on the display panel is W, wherein 0.8 mm ≤ W ≤ 3 mm; Preferably, the first functional layer includes an adhesive layer, the second functional layer includes a circuit board, the circuit board is electrically connected to the display panel, and the adhesive layer is arranged on a side of the circuit board close to the display panel; Alternatively, the first functional layer includes an adhesive layer and a circuit board, the second functional layer includes a supporting layer, and the display panel, the supporting layer, the adhesive layer and the circuit board are stacked in sequence; Alternatively, the circuit board has multiple dielectric layers and at least two conductive layers, the at least two conductive layers are arranged at intervals along the direction from the display panel to the circuit board, the conductive layers are arranged between adjacent dielectric layers, the first functional layer includes an adhesive layer, at least one dielectric layer and at least one conductive layer, and the second functional layer includes at least one dielectric layer and at least one conductive layer; Alternatively, the first functional layer includes a supporting layer, the second functional layer includes a circuit board, and the display panel, the supporting layer and the circuit board are stacked in sequence.

13. A display device, It is characterized in that The display device comprises: The display module according to any one of claims 1 to 12; A light sensing component, wherein the orthographic projection of the light sensing component on the display panel is located within the orthographic projection of the first and second through holes on the display panel.

14. The display device according to claim 13, It is characterized in that The display device comprises: A mounting frame, disposed on a side of the plurality of functional layers away from the display panel; A second buffer member is disposed between the mounting frame and the display panel, and the second buffer member is disposed at least around a portion of the light sensing member; Preferably, the orthographic projection of the second buffer member on the display panel overlaps with the orthographic projection of the second through hole on the display panel; Preferably, the second buffer member comprises foam.

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