Dielectric Cavity Resonator and Filter

Abstract

This application relates to the field of communications and provides a dielectric cavity resonator and a filter. The dielectric cavity resonator includes a resonator housing and a dielectric resonator. The resonator housing has a first plate member and a second plate member disposed opposite to each other. The dielectric resonator is disposed inside the resonator housing. One end of the dielectric resonator is connected to the first plate member, and the other end of the dielectric resonator is spaced apart from the second plate member. The dielectric resonator is provided with an opening structure for increasing the resonance frequency of the TE mode so that the resonance frequency of the TE mode and the resonance frequency of the TM mode are in the same frequency band. The dielectric cavity resonator can couple at least two resonance modes of the TE mode and the TM mode in a single cavity. The dielectric cavity resonator is convenient for constructing a coupling relationship with resonators such as metal coaxial resonators and has a better coupling effect. The usability, applicability, and practicality of the dielectric cavity resonator are better.

Description

Technical Field

[0001] This application belongs to the field of communication technologies, and particularly relates to a dielectric cavity resonator and a filter. Background Art

[0002] A dual-mode resonator is a resonator that can simultaneously generate two oscillation signals with stable frequencies. The dual-mode resonator can support two resonance modes within its passband range. Currently, the common dual-mode resonator is the HE dual-mode resonator. However, the HE dual-mode resonator utilizes two orthogonal modes, namely HE (Hybrid Electromagnetic Mode), and it is difficult to couple the HE mode with modes such as the TEM (Transverse Electric and Magnetic Field) mode. As a result, it is difficult to couple and construct the HE dual-mode resonator with resonators such as metal coaxial resonators, and the coupling effect is not good, leading to poor usability and applicability of the HE dual-mode resonator. Summary of the Invention

[0003] Embodiments of this application provide a dielectric cavity resonator and a filter, aiming to solve the problems that it is difficult to couple and construct the existing dual-mode resonator with resonators such as metal coaxial resonators, and the coupling effect is not good, resulting in poor usability and applicability.

[0004] To achieve the above object, the technical solutions adopted in the embodiments of this application are as follows:

[0005] In a first aspect, a dielectric cavity resonator is provided, including:

[0006] A resonator housing having a first plate member and a second plate member disposed opposite to each other;

[0007] A dielectric resonator member disposed within the resonator housing, one end of the dielectric resonator member being connected to the first plate member, the other end of the dielectric resonator member being spaced apart from the second plate member, and the dielectric resonator member being provided with an opening structure for increasing the resonance frequency of the TE mode so that the resonance frequency of the TE mode and the resonance frequency of the TM mode are in the same frequency band.

[0008] In some embodiments, the opening structure is disposed near the outer peripheral surface of the dielectric resonator member and away from the central axis of the dielectric resonator member.

[0009] In some embodiments, the opening structure includes at least one of an opening hole and a groove.

[0010] In some embodiments, the opening structure axially communicates with at least one end surface of the dielectric resonator member.

[0011] In some embodiments, the opening structure includes a first opening formed on an end face of the dielectric resonator, and the first opening is disposed between the outer peripheral surface of the dielectric resonator and the central axis of the dielectric resonator;

[0012] and / or, the opening structure includes a second opening formed on a peripheral edge of the dielectric resonator, and the second opening communicates with the outer peripheral surface of the dielectric resonator and at least one end face of the dielectric resonator;

[0013] and / or, the opening structure includes a third opening formed on the outer peripheral surface of the dielectric resonator, and the third opening is disposed between two end faces of the dielectric resonator.

[0014] In some embodiments, the first plate member has a grounding component, the opening structure includes an annular recess, the annular recess continuously or discontinuously surrounds to form a ring shape, the central axis of the annular recess coincides with the central axis of the dielectric resonator, the bottom of the annular recess is closed, and the grounding component closes the notch of the annular recess so that the resonance frequency of the HE dual mode is in the same frequency band as the resonance frequencies of the TE mode and the TM mode.

[0015] In some embodiments, the dielectric resonator includes a plurality of dielectric layers arranged in sequence along its axial direction; in a direction approaching the first plate member, the cross-sectional dimensions of each dielectric layer are tapered.

[0016] In some embodiments, the first plate member protrudes with a bottom platform, and the dielectric resonator is connected to the bottom platform.

[0017] In some embodiments, the opening structure is formed on the peripheral edge of the dielectric resonator, and the opening structure communicates with the end face of the dielectric resonator facing the first plate member; or,

[0018] the opening structure is formed on the end face of the dielectric resonator facing the first plate member.

[0019] In some embodiments, the dielectric cavity resonator includes a ceramic base, and the ceramic base is separately connected between the dielectric resonator and the first plate member.

[0020] In some embodiments, a receiving groove is formed on a side of the ceramic base facing the dielectric resonator, a fastening hole penetrates through the bottom of the receiving groove, the ceramic base is connected to the first plate member through a fastener passing through the fastening hole, the fastener does not protrude from the notch of the receiving groove, and the ceramic base abuts against and is fixedly connected to the dielectric resonator.

[0021] In some embodiments, the dielectric resonator is a rotationally symmetric structure.

[0022] In some embodiments, the dielectric cavity resonator includes an adjusting screw threadedly connected to the resonator housing for adjusting the resonance frequency of the TM mode.

[0023] In some embodiments, the dielectric cavity resonator includes a metal disk and an insulating member. The metal disk and the dielectric resonator are arranged opposite to each other along the axial direction of the dielectric resonator. The metal disk is connected to the second plate member through the insulating member, and the distance between the metal disk and the dielectric resonator is adjustable for adjusting the resonance frequency of the TE mode.

[0024] In some embodiments, the metal disk is in the shape of a circular disk, and the outer peripheral wall of the insulating member is provided with external threads. The insulating member is connected to the center of the metal disk and is threadedly connected to the second plate member.

[0025] In a second aspect, a filter is provided, which includes the dielectric cavity resonator provided by the embodiments of the present application.

[0026] The beneficial effects of the dielectric cavity resonator provided by the present application are as follows:

[0027] The dielectric cavity resonator provided by the embodiments of the present application can set an opening structure on the dielectric resonator so that the dielectric resonator is locally thinned, especially the thickness of the part of the dielectric resonator corresponding to the opening structure along its axial and radial directions is reduced or even zeroed. Thereby, the resonance frequency of the TE mode can be increased, the resonance frequency of the TE mode can be made closer to the resonance frequency of the TM mode, and the resonance frequencies of the TE mode and the TM mode can be made to be within the passband range and close to the same frequency band. Thus, the dielectric cavity resonator can couple at least two orthogonal high-Q (Quality Factor) resonance modes of the TE mode and the TM mode in a single cavity, and can construct a coupling relationship with resonators such as metal coaxial resonators based on the TE mode and the TM mode, and the coupling effect will be better. Therefore, the usability, applicability, and practicality of the dielectric cavity resonator are better. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0029] Figure 1 It is a three-dimensional schematic diagram of the dielectric cavity resonator provided by some embodiments of the present application;

[0030] Figure 2 For Figure 1 The cross-sectional view of the provided dielectric cavity resonator;

[0031] Figure 3 For Figure 2 The exploded schematic diagram of the dielectric resonator, ceramic base and fastener provided, wherein the opening structure includes a first opening, and the first opening includes a plurality of first holes;

[0032] Figure 4 The cross-sectional view of the dielectric cavity resonator provided for some other embodiments of the present application, wherein the opening structure includes a first opening and a second opening, the first opening includes a first annular groove, and the second opening includes a second annular groove;

[0033] Figure 5 For Figure 4 The three-dimensional schematic diagram of the dielectric resonator provided;

[0034] Figure 6 The cross-sectional view of the dielectric cavity resonator provided for some other embodiments of the present application, wherein the opening structure includes a second opening, and the second opening includes a second annular groove;

[0035] Figure 7 For Figure 6 The three-dimensional schematic diagram of the dielectric resonator provided;

[0036] Figure 8 The three-dimensional schematic diagram of the dielectric resonator provided for some other embodiments of the present application, wherein the opening structure includes a second opening, and the second opening includes a plurality of strip grooves;

[0037] Figure 9 The cross-sectional view of the dielectric cavity resonator provided for some other embodiments of the present application, wherein the opening structure includes a third opening, and the third opening includes a second hole;

[0038] Figure 10 The cross-sectional view of the dielectric cavity resonator provided for some other embodiments of the present application, wherein the opening structure includes a third opening, and the third opening includes a third annular groove.

[0039] Wherein, each reference numeral in the figure:

[0040] 10 - Resonator housing, 11 - First plate, 111 - Bottom platform, 12 - Second plate, 121 - First threaded hole, 122 - Second threaded hole, 13 - Resonant cavity; 20 - Dielectric resonator, 21 - Opening structure, 211 - First opening, 212 - Second opening, 213 - Third opening, 2111 - First hole, 2112 - First annular groove, 2121 - Second annular groove, 2122 - Strip groove, 2131 - Second hole, 2132 - Third annular groove, 22 - Dielectric layer, 23 - Central hole; 30 - Ceramic base, 31 - Receiving groove, 32 - Fastening hole, 40 - Fastener, 50 - Adjusting screw, 60 - Metal disc, 61 - Through hole, 70 - Insulating member, y - First direction, L - Central axis of the dielectric resonator. Detailed implementation manners

[0041] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clear and understood, the present application will be described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application. Without special instructions, all implementation manners and optional implementation manners of the present application can be combined with each other to form a new technical solution. Without special instructions, all technical features and optional technical features of the present application can be combined with each other to form a new technical solution.

[0042] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0043] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, the meaning of "plurality" is two or more unless otherwise specifically defined.

[0044] In this application, unless otherwise clearly defined and limited, terms such as "installation", "connection", "linkage", "fixation" shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0045] In this application, the "central axis" refers to the line passing through the geometric center line of the corresponding structure.

[0046] In this application, the "axial direction" refers to the extension direction of the central axis of the corresponding structure, the "radial direction" refers to any direction passing through the central axis and perpendicular to the central axis of the corresponding structure, and the "circumferential direction" refers to the circumferential direction of the outer peripheral surface of the corresponding structure.

[0047] A single-mode resonator only supports one resonant mode within its passband (such as TE (Transverse Electric) mode, TM (Transverse Magnetic) mode, TEM (Transverse Electric and Magnetic Field) mode, etc.). By way of example, a metal coaxial resonator is a single-mode resonator, and a metal coaxial resonator only supports the TEM mode within its passband.

[0048] A dual-mode resonator is a resonator that can simultaneously generate two oscillation signals with stable frequencies. A dual-mode resonator can support two resonant modes within its passband. Currently, the common dual-mode resonator is the HE dual-mode resonator. However, the HE dual-mode resonator utilizes two orthogonal HE (Hybrid Electromagnetic Mode) modes. The coupling between the HE mode and modes such as the TEM mode, TM mode, and TE mode is relatively difficult, resulting in difficulties in coupling and constructing a dual-mode resonator with resonators such as metal coaxial resonators, and the coupling effect is not good, so the usability and applicability of the HE dual-mode resonator are relatively poor.

[0049] Therefore, the embodiments of this application provide a dielectric cavity resonator. This dielectric cavity resonator can couple at least two orthogonal resonant modes of TE mode and TM mode in a single cavity. This dielectric cavity resonator is convenient for constructing a coupling relationship with resonators such as metal coaxial resonators, and the coupling effect is better. The usability, applicability, and practicality of this dielectric cavity resonator are better.

[0050] The following describes the specific implementation of this application in detail with specific embodiments:

[0051] Please refer toFigure 1 , Figure 2 , Figure 3 , some embodiments of the present application provide a dielectric cavity resonator. The dielectric cavity resonator includes a resonator housing 10 and a dielectric resonator 20. The resonator housing 10 has a first plate member 11 and a second plate member 12 disposed opposite to each other. The dielectric resonator 20 is disposed inside the resonator housing 10. One end of the dielectric resonator 20 is connected to the first plate member 11, and the other end of the dielectric resonator 20 is spaced apart from the second plate member 12. The dielectric resonator 20 is provided with an opening structure 21, and the opening structure 21 is used to increase the resonance frequency of the TE mode so that the resonance frequency of the TE mode and the resonance frequency of the TM mode are in the same frequency band.

[0052] It should be noted that the dielectric cavity resonator provided by the present application can couple at least two orthogonal resonance modes of the single-cavity TE mode and the TM mode, that is, while the dielectric cavity resonator couples the TE mode and the TM mode, the dielectric cavity resonator can also couple other modes except the TE mode and the TM mode, or can not couple other modes except the TE mode and the TM mode. When the dielectric cavity resonator only couples the TE mode and the TM mode in a single cavity, the dielectric cavity resonator is a TE-TM dual-mode resonator; when the dielectric cavity resonator couples the TE mode and the TM mode in a single cavity and also couples other resonance modes (such as the HE mode), the dielectric cavity resonator is a multi-mode resonator (such as a triple-mode resonator, a quadruple-mode resonator).

[0053] It should also be noted that the inside of the resonator housing 10 has a resonance cavity 13 (which can be an air cavity), and the resonance cavity 13 can be but is not limited to a rectangular resonance cavity, a square resonance cavity, a polygonal columnar resonance cavity, a cylindrical resonance cavity, etc. The resonance cavity 13 can accommodate the dielectric resonator 20. Optionally, the dielectric resonator 20 can be centrally arranged in the resonance cavity 13. The resonator housing 10 can achieve a shielding function to prevent signal leakage.

[0054] One of the plate members on one side of the resonator housing 10 is the first plate member 11, and the plate member on the side of the resonator housing 10 opposite to the first plate member 11 is the second plate member 12. In an actual application scenario, the resonator housing 10 can be placed with the second plate member 12 facing up, and can also be placed with the second plate member 12 facing left, right, front, or back. In addition, the shape, size, material, etc. of the resonator housing 10 can be flexibly set as required.

[0055] It should also be noted that the dielectric resonator 20 is a resonator made of a dielectric material. The dielectric resonator 20 can be a ceramic dielectric resonator or a dielectric resonator of other materials.

[0056] One end of the dielectric resonator 20 along its axial direction is connected to the first plate 11. The other end of the dielectric resonator 20 along its axial direction (i.e., the end of the dielectric resonator 20 close to the second plate 12) is spaced apart from the second plate 12. The dielectric resonator 20 can be directly connected and fixed to the first plate 11 by, but not limited to, welding, bonding, riveting, crimping, plugging, screwing, threading, clamping, etc., or can be indirectly connected and fixed to the first plate 11 by other structures connected thereto (e.g., base 111, ceramic base 30, coupling ribs, etc.).

[0057] The dielectric resonator 20 may be in a shape of, but not limited to, a column, a block, a rod, etc., the cross-sectional shape of the dielectric resonator 20 perpendicular to its axial direction may be in a shape of, but not limited to, a circle, a rectangle, a square, a polygon, a petal, a cross, etc., the cross-sectional shape of the dielectric resonator 20 parallel to its axial direction may also be in a shape of, but not limited to, a circle, a rectangle, a square, a polygon, a petal, a cross, etc. A center hole 23 may be provided at the center axis L of the dielectric resonator 20, or may not be provided.

[0058] It should also be noted that the spacing arrangement direction of the first plate 11 and the second plate 12 is defined as the first direction y. In the present application, after the dielectric resonator 20 is installed in the resonant cavity 13, the central axis L of the dielectric resonator 20 is parallel to or substantially parallel to the first direction y. That is, after the dielectric resonator 20 is installed in the resonant cavity 13, the axial direction of the dielectric resonator 20 is parallel to or substantially parallel to the first direction y.

[0059] It should also be noted that in the present application, the two end faces of the dielectric resonator 20 refer to two end faces opposite to each other along the axial direction of the dielectric resonator 20 , and the outer peripheral surface of the dielectric resonator 20 refers to the peripheral surface connected to the two end faces of the dielectric resonator 20 .

[0060] It should also be noted that when the dielectric resonator 20 is not provided with the opening structure 21, the resonant frequency of the TE mode will be at a low frequency, and the resonant frequency of the TM mode will be at a high frequency, that is, the resonant frequency of the TE mode is lower than the resonant frequency of the TM mode and is outside the passband range.

[0061] In order to make the resonance frequency of the TE mode close to the resonance frequency of the TM mode, in this embodiment, an opening structure 21 is provided on the dielectric resonator 20, so that the portion of the dielectric resonator 20 where the opening structure 21 is provided is hollowed out.

[0062] Since the electric field of the TE mode is distributed in a horizontal (i.e., parallel to the orientation of the first plate member 11) circular pattern and the magnetic field is distributed in a vertical (i.e., perpendicular to the orientation of the first plate member 11) circular pattern, the electric field of the TE mode will be more concentrated around the circumferential side of the dielectric resonator 20. Also, since the magnetic field of the TM mode is distributed in a horizontal circular pattern and the electric field is distributed in a vertical circular pattern, the electric field of the TM mode will be more concentrated at the central axis L of the dielectric resonator 20.

[0063] Therefore, based on the opening structure 21, the dielectric resonator 20 can be locally thinned, especially the thickness (i.e., the axial dimension) of the part of the dielectric resonator 20 corresponding to the opening structure 21 along its axis can be reduced or even zeroed, so as to increase the resonance frequency of the TE mode. Correspondingly, when the dimension of the part of the dielectric resonator 20 corresponding to the opening structure 21 along its axis is reduced, the dimension of the part of the dielectric resonator 20 corresponding to the opening structure 21 along its radial direction is also reduced accordingly. Based on this, by precisely designing the form (such as groove-shaped, hole-shaped, etc.), shape (such as annular, circular, rectangular, elliptical, etc.), dimension (such as depth, width, length, etc.), position, etc. of the opening structure 21, the resonance frequency of the TE mode can be finely increased, so as to make the resonance frequency of the TE mode close to that of the TM mode, and close to the same frequency band and within the passband range.

[0064] In summary, for the dielectric cavity resonator provided by the embodiment of the present application, by setting the opening structure 21 on the dielectric resonator 20, the dielectric resonator 20 can be locally thinned, especially the thickness of the part of the dielectric resonator 20 corresponding to the opening structure 21 along its axis and radial direction can be reduced or even zeroed, so as to increase the resonance frequency of the TE mode, make the resonance frequency of the TE mode close to that of the TM mode, and make the resonance frequencies of the TE mode and the TM mode within the passband range and close to the same frequency band. Thus, the dielectric cavity resonator can couple at least two orthogonal high-Q resonance modes of the TE mode and the TM mode in a single cavity, and can be based on the TE mode and the TM mode to easily construct a coupling relationship with resonators such as metal coaxial resonators and the coupling effect will be better, so that the usability, applicability and practicality of the dielectric cavity resonator are better.

[0065] Moreover, since the dielectric cavity resonator can achieve at least two-order filtering effects, which is equivalent to the filtering effect of at least two single-mode resonators connected in series, that is, equivalent to the filtering effect of at least two microwave resonators, the performance and space utilization rate of the dielectric cavity resonator can be improved. And the size of the dielectric cavity resonator is small, which is conducive to miniaturization and lightweight design.

[0066] Moreover, when the dielectric cavity resonator only couples two resonant modes, namely the TE mode and the TM mode, that is, when the dielectric cavity resonator is a TE-TM dual-mode resonator, the opening structure 21 not only has the effect of increasing the resonant frequency of the TE mode, but also has the effect of pushing away the resonant frequency of the HE mode. Based on this, the resonant frequency of the HE mode originally outside the passband range can be further pushed away to reduce the interference from the HE mode, so that the TE-TM dual-mode resonator can only couple the TE mode and the TM mode, without coupling the HE mode, and the performance of the dielectric cavity resonator can be optimized when the dielectric cavity resonator is a TE-TM dual-mode resonator.

[0067] Please refer to Figure 3 、 Figure 4 , in some embodiments of the present application, the opening structure 21 is disposed near the outer peripheral surface of the dielectric resonator 20 and away from the central axis L of the dielectric resonator 20.

[0068] It should be noted that the opening structure 21 is relatively close to the outer peripheral surface of the dielectric resonator 20 and relatively far from the central axis L of the dielectric resonator 20. That is, the distance between the opening structure 21 and the outer peripheral surface of the dielectric resonator 20 is less than the distance between the opening structure 21 and the central axis L of the dielectric resonator 20.

[0069] Since the electric field of the TE mode will be more concentrated around the periphery of the dielectric resonator 20, and since the electric field of the TM mode will be more concentrated at the central axis L of the dielectric resonator 20. By adopting the above scheme, by making the opening structure 21 close to the outer peripheral surface of the dielectric resonator 20 and away from the central axis L of the dielectric resonator 20, the opening structure 21 can be made relatively close to the main distribution region of the TE mode electric field and relatively far from the main distribution region of the TM mode electric field. Based on this, on the basis of increasing the resonant frequency of the TE mode through the opening structure 21, the influence of the opening structure 21 on the resonant frequency of the TM mode can be reduced, so as to facilitate the precise design of "the resonant frequency of the TE mode and the resonant frequency of the TM mode are within the passband range and close to the same frequency band", and facilitate the improvement of the performance of the dielectric cavity resonator.

[0070] Please refer to Figure 3 、 Figure 4 , in some embodiments of the present application, the opening structure 21 includes at least one of an opening and a groove.

[0071] It should be noted that, in some embodiments, the opening structure 21 may include an opening. In other embodiments, the opening structure 21 may include a groove. In other embodiments, the opening structure 21 may include an opening and a groove. That is, the embodiments of the opening and the embodiments of the groove can be set separately or in combination.

[0072] Among them, the opening can be a blind hole or a through hole. The opening can be a circular hole, a rectangular hole, a kidney-shaped hole, an irregular-shaped hole, etc. The opening can be formed on any end face of the dielectric resonator 20 along its own axis, or on the outer peripheral surface of the dielectric resonator 20.

[0073] Among them, the groove can be a straight groove, a curved groove, an arc groove, an annular groove, etc. The groove can be formed on any end face of the dielectric resonator 20 along its own axis, or on the outer peripheral surface of the dielectric resonator 20.

[0074] By adopting the above solution, the opening structure 21 can adopt the form of an opening or a groove to improve the structural regularity of the opening structure 21. Based on this, on the one hand, it is convenient to design the mold, and it is convenient to integrally form the dielectric resonator 20 and its opening structure 21 in the form of an opening or a groove through the mold, which can improve the forming convenience and forming accuracy of the dielectric resonator 20 and its opening structure 21. On the other hand, the form of the opening and the groove is convenient for accurately adjusting the size, shape and position to accurately control the resonance frequency of the TE mode, so as to facilitate the accurate design of "the resonance frequency of the TE mode and the resonance frequency of the TM mode are within the passband range and close to the same frequency band", which is convenient to improve the performance of the dielectric cavity resonator. And, the form of the opening and the groove can accurately reduce the weight of the dielectric resonator 20, so that the weight of the dielectric cavity resonator can be reduced on the premise of optimizing the performance, which is beneficial to the lightweight of the dielectric cavity resonator.

[0075] Please refer to Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 , in some embodiments of the present application, the opening structure 21 axially communicates with at least one end face of the dielectric resonator 20 along the axis of the dielectric resonator 20.

[0076] It should be noted that the opening structure 21 axially communicates with at least one end face of the dielectric resonator 20 along the axis of the dielectric resonator 20, which includes both the case where "the opening structure 21 is formed on the end face of the dielectric resonator 20 and the opening structure 21 is located between the outer peripheral surface of the dielectric resonator 20 and the central axis L of the dielectric resonator 20" (for example Figure 3 the first hole 2111 shown, for example Figure 4 the first annular groove 2112 shown), and the case where "the opening structure 21 is formed on the circumference of the dielectric resonator 20 and the opening structure 21 communicates with the outer peripheral surface of the dielectric resonator 20 and at least one end face of the dielectric resonator 20" (for example Figure 4 the second annular groove 2121 shown, for example Figure 8 the strip groove 2122 shown).

[0077] It should also be noted that, regardless of whether the opening structure 21 is in the form of an opening or a groove, the opening structure 21 axially communicates with at least one end face of the dielectric resonator 20 along the axis of the dielectric resonator 20, and the depth direction of the opening structure 21 (for example, the hole depth direction of the opening or the groove depth direction of the groove) corresponds to (i.e., is substantially parallel to) the axis of the dielectric resonator 20. Among them, the opening structure 21 can axially communicate with only one end face of the dielectric resonator 20 along the axis of the dielectric resonator 20, or the opening structure 21 can axially communicate with two opposite end faces of the dielectric resonator 20 along the axis of the dielectric resonator 20.

[0078] By adopting the above solution, by making the opening structure 21 axially communicate with at least one end face of the dielectric resonator 20 along the axis of the dielectric resonator 20, the depth direction of the opening structure 21 can correspond to the axis of the dielectric resonator 20, which is convenient for directly thinning a specific area of the dielectric resonator 20 along the axis of the dielectric resonator 20. In particular, based on the depth design of the opening structure 21, the thickness of the part of the dielectric resonator 20 corresponding to the opening structure 21 in the axial direction can be directly, flexibly and accurately thinned to the expected value (even to zero), so as to conveniently, controllably and accurately increase the resonant frequency of the TE mode, improve the adjustment convenience and adjustment accuracy of the resonant frequency of the TE mode, facilitate the precise design that "the resonant frequency of the TE mode and the resonant frequency of the TM mode are within the passband range and close to the same frequency band", and facilitate the improvement of the performance and design flexibility of the dielectric cavity resonator.

[0079] Moreover, based on the setting of this embodiment, the opening of the opening structure 21 can communicate with the end face of the dielectric resonator 20, and the opening structure 21 can be extended axially along the dielectric resonator 20. Based on this, it is convenient to design the mold, and it is convenient to integrally form the dielectric resonator 20 and its opening structure 21 via the mold. In particular, the demolding convenience of the mold after forming the dielectric resonator 20 can be improved (demolding can be carried out along the axis of the dielectric resonator 20), the forming convenience and forming accuracy of the dielectric resonator 20 can be improved, and the mold cost and the processing cost of the dielectric resonator 20 can be reduced.

[0080] Please refer to Figure 3 、 Figure 4 and Figure 5 , in some embodiments of the present application, the opening structure 21 includes a first opening 211 formed on the end face of the dielectric resonator 20, and the first opening 211 is provided between the outer peripheral surface of the dielectric resonator 20 and the central axis L of the dielectric resonator 20.

[0081] It should be noted that regardless of whether the first opening 211 is in the form of an opening or a groove, the first opening 211 is formed on the end face of the dielectric resonator 20 and is located between the outer peripheral surface of the dielectric resonator 20 and the central axis L of the dielectric resonator 20. Among them, between the outer peripheral surface of the dielectric resonator 20 and the central axis L of the dielectric resonator 20, the first opening 211 can be exactly centered, or can be arranged to be biased towards the outer peripheral surface of the dielectric resonator 20 or towards the central axis L of the dielectric resonator 20.

[0082] Exemplarily, as Figure 2 , Figure 3 shown, in a possible embodiment, the first opening 211 includes at least one first hole 2111. The first hole 2111 is formed on the end face of the dielectric resonator 20, and the hole depth direction of the first hole 2111 corresponds to the axial direction of the dielectric resonator 20. The first hole 2111 is provided between the outer peripheral surface of the dielectric resonator 20 and the central axis L of the dielectric resonator 20. The first hole 2111 can be a through hole or a blind hole. In the case where the first hole 2111 is a blind hole, the first hole 2111 can be formed on the end face of the dielectric resonator 20 facing the first plate member 11, or can be formed on the end face of the dielectric resonator 20 facing the second plate member 12. The first hole 2111 can be a circular hole, a rectangular hole, a waist-shaped hole, an irregular hole, etc. In the case where there are multiple first holes 2111, the multiple first holes 2111 can be provided on the same circumference, or can be flexibly arranged; in the case where the multiple first holes 2111 are provided on the same circumference, the multiple first holes 2111 can be arranged in an equiangular circular arrangement around the central axis L of the dielectric resonator 20, or can be arranged in a non-equiangular circular arrangement. In the case where there are multiple first holes 2111, the multiple first holes 2111 can be of the same type of hole, or can be a combination of different types of holes; in the case where the multiple first holes 2111 are of the same type of hole, the sizes of the multiple first holes 2111 can be the same or different. In the case where there are multiple first holes 2111, the multiple first holes 2111 can all be formed on the same end face of the dielectric resonator 20, or can be respectively formed on the opposite two end faces of the dielectric resonator 20.

[0083] Among them, the more the number of the first holes 2111, the higher the resonance frequency of the TE mode; the deeper the hole depth of the first hole 2111, the higher the resonance frequency of the TE mode; the larger the aperture of the first hole 2111, the higher the resonance frequency of the TE mode; the closer the position of the first hole 2111 is to the outer peripheral side of the dielectric resonator 20, the higher the resonance frequency of the TE mode. Based on this, it is convenient to accurately adjust the number, size, shape and position of the first holes 2111 to accurately control the resonance frequency of the TE mode, so as to facilitate the accurate design of "the resonance frequency of the TE mode and the resonance frequency of the TM mode are within the passband range and close to the same frequency band", and facilitate improving the performance of the dielectric cavity resonator.

[0084] Exemplarily, as Figure 4, Figure 5 As shown, in another possible embodiment, the first opening 211 includes at least one first annular groove 2112. The first annular groove 2112 may be formed on the end face of the dielectric resonator 20 facing the first plate member 11, or may be formed on the end face of the dielectric resonator 20 facing the second plate member 12. The first annular groove 2112 is provided between the outer peripheral surface of the dielectric resonator 20 and the central axis L of the dielectric resonator 20. The first annular groove 2112 surrounds the outer periphery of the central axis L of the dielectric resonator 20. The central axis (i.e., the surrounding axis) of the first annular groove 2112 is parallel to the central axis L of the dielectric resonator 20. The central axis of the first annular groove 2112 and the central axis L of the dielectric resonator 20 may be arranged to coincide, or may be arranged at intervals. The shape of the surrounding path of the first annular groove 2112 may be the same as or different from the cross-sectional shape of the dielectric resonator 20 perpendicular to its own central axis L. The groove depth direction of the first annular groove 2112 corresponds to the axial direction of the dielectric resonator 20. The shape of the first annular groove 2112 may be in the shape of a cylindrical groove, a conical groove, a tabletop groove, a stepped surface groove or other shapes. In the case where there are multiple first annular grooves 2112, the multiple first annular grooves 2112 may be arranged at intervals in sequence from the inside to the outside. In the case where there are multiple first annular grooves 2112, the multiple first annular grooves 2112 may all be formed on the same end face of the dielectric resonator 20, or may be respectively formed on the opposite two end faces of the dielectric resonator 20.

[0085] Among them, the more the number of the first annular grooves 2112, the higher the resonance frequency of the TE mode; the deeper the groove depth of the first annular groove 2112, the higher the resonance frequency of the TE mode; the wider the groove width of the first annular groove 2112, the higher the resonance frequency of the TE mode; the longer the extending path of the first annular groove 2112 along its own circumferential direction, the higher the resonance frequency of the TE mode; the closer the position of the first annular groove 2112 is to the outer peripheral side of the dielectric resonator 20, the higher the resonance frequency of the TE mode. Based on this, it is convenient to accurately adjust the number, size, shape and position of the first annular groove 2112 to accurately control the resonance frequency of the TE mode, so as to facilitate the accurate design of "the resonance frequency of the TE mode and the resonance frequency of the TM mode are within the passband range and close to the same frequency band", and facilitate improving the performance of the dielectric cavity resonator.

[0086] Of course, in other possible embodiments, the first annular groove 2112 may be changed to a straight groove, a curved groove, an arc groove, etc. The number of groove structures such as straight grooves, curved grooves, and arc grooves may be one or multiple. In the case where the number of groove structures such as straight grooves, curved grooves, and arc grooves is multiple, the multiple groove structures may be of the same type of groove, or may be a combination of different types of grooves; in the case where the multiple groove structures are of the same type of groove, the sizes of the multiple groove structures may be the same or different.

[0087] By adopting the above solution, by opening a first opening 211 on the end face of the dielectric resonator 20 and making the first opening 211 located between the outer peripheral surface of the dielectric resonator 20 and the central axis L of the dielectric resonator 20, the depth direction of the first opening 211 corresponds to the axial direction of the dielectric resonator 20, which facilitates directly thinning a specific area of the dielectric resonator 20 along the axial direction of the dielectric resonator 20, thereby conveniently, controllably and precisely increasing the resonance frequency of the TE mode.

[0088] Moreover, since the electric field of the TE mode will be more concentrated around the periphery of the dielectric resonator 20, when the opening structure 21 is on the outer periphery of the dielectric resonator 20, the influence on the resonance frequency of the TE mode is the greatest; when the opening structure 21 is on the central axis L of the dielectric resonator 20, the influence on the resonance frequency of the TE mode is the smallest. By setting the first opening 211 between the outer peripheral surface of the dielectric resonator 20 and the central axis L of the dielectric resonator 20, the first opening 211 can avoid the outer peripheral surface of the dielectric resonator 20, and the first opening 211 will not have too large an impact on the resonance frequency of the TE mode resulting in a sudden increase in frequency; at the same time, the first opening 211 avoids the central axis L of the dielectric resonator 20, and the first opening 211 will not have too small an impact on the resonance frequency of the TE mode resulting in an inability to significantly increase the frequency. Based on this, it is convenient to more finely regulate the resonance frequency of the TE mode, that is, while increasing the resonance frequency of the TE mode, the resonance frequency of the TE mode can be increased more precisely, finely and stably, and the resonance frequency of the TE mode can be more accurately controlled. At the same time, the electric field of the TM mode is more concentratedly distributed at the central axis L of the dielectric resonator 20. The first opening 211 avoids the central axis L of the dielectric resonator 20, and can also greatly reduce the influence of the first opening 211 on the resonance frequency of the TM mode, thereby facilitating the precise design of "the resonance frequency of the TE mode and the resonance frequency of the TM mode are within the passband range and close to the same frequency band", and facilitating the improvement of the performance of the dielectric cavity resonator.

[0089] Moreover, the first opening 211 is opened on the end face of the dielectric resonator 20, which is convenient for designing the mold, and is convenient for integrally forming the dielectric resonator 20 and its first opening 211 via the mold. In particular, it can improve the demolding convenience of the mold after forming the dielectric resonator 20 (demolding can be carried out along the axial direction of the dielectric resonator 20), improve the forming convenience and forming accuracy of the dielectric resonator 20, and reduce the mold cost and the processing cost of the dielectric resonator 20.

[0090] Please refer to Figure 4 、 Figure 6 、 Figure 8 , in some embodiments of the present application, the opening structure 21 includes a second opening 212 opened on the periphery of the dielectric resonator 20, and the second opening 212 communicates with the outer peripheral surface of the dielectric resonator 20 and at least one end face of the dielectric resonator 20.

[0091] It should be noted that regardless of whether the second opening 212 is in the form of an opening or a groove, the second opening 212 is provided on the periphery of the dielectric resonator 20, and the second opening 212 is simultaneously connected to the outer peripheral surface and at least one end surface of the dielectric resonator 20. The depth direction of the second opening 212 (for example, the hole depth direction of the opening or the groove depth direction of the groove) corresponds to (i.e., is substantially parallel to) both the radial direction and the axial direction of the dielectric resonator 20. Among them, the second opening 212 can be connected to the corresponding end surface of the dielectric resonator 20 along one side of the axial direction of the dielectric resonator 20, and the second opening 212 can also be connected to the opposite two end surfaces of the dielectric resonator 20 along the opposite two sides of the axial direction of the dielectric resonator 20.

[0092] Exemplarily, as Figure 4 , Figure 5 , Figure 6 , Figure 7 shown, in a possible embodiment, the second opening 212 includes a second annular groove 2121. The second annular groove 2121 is provided on the periphery of the dielectric resonator 20, and the second annular groove 2121 is connected to the outer peripheral surface and one end surface of the dielectric resonator 20. The second annular groove 2121 surrounds the outer periphery of the central axis L of the dielectric resonator 20, and the central axis (i.e., the surrounding axis) of the second annular groove 2121 can be parallel to or intersect with the central axis L of the dielectric resonator 20. The central axis of the second annular groove 2121 and the central axis L of the dielectric resonator 20 can be coincidentally arranged or spaced apart. The shape of the second annular groove 2121 can be in the shape of a cylindrical groove, a conical groove, a tabletop groove, a stepped surface groove or other shapes. For example, in Figure 4 the shape of the second annular groove 2121 is in the shape of a cylindrical groove, and for example, in Figure 6 the shape of the second annular groove 2121 is in the shape of a stepped surface groove.

[0093] Among them, the deeper the groove depth of the second annular groove 2121 along the axial direction of the dielectric resonator 20, the higher the resonant frequency of the TE mode; the deeper the groove depth of the second annular groove 2121 along the radial direction of the dielectric resonator 20, the higher the resonant frequency of the TE mode. Based on this, it is convenient to accurately adjust the size and shape of the second annular groove 2121 to accurately control the resonant frequency of the TE mode, so as to facilitate the accurate design of "the resonant frequency of the TE mode and the resonant frequency of the TM mode are within the passband range and close to the same frequency band", which is convenient to improve the performance of the dielectric cavity resonator.

[0094] Exemplarily, as Figure 8As shown, in another possible embodiment, the second opening 212 includes at least one strip groove 2122, and the strip groove 2122 is formed on the periphery of the dielectric resonator 20. The strip groove 2122 communicates with the outer peripheral surface of the dielectric resonator 20 and at least one end surface of the dielectric resonator 20. The strip groove 2122 can be a straight groove, and the extending direction of the strip groove 2122 can be parallel to (or inclined to) the axial direction of the dielectric resonator 20. The two ends of the strip groove 2122 along its extending direction can be through, or one end can be closed and the other end can communicate with the corresponding end surface of the dielectric resonator 20. In the case where there are multiple strip grooves 2122, along the circumferential direction of the dielectric resonator 20, the multiple strip grooves 2122 can be arranged in an equiangular circle, or can be arranged in a non-equiangular circle. In the case where there are multiple strip grooves 2122, the sizes of the multiple strip grooves 2122 can be the same or different.

[0095] Among them, the more the number of the strip grooves 2122, the higher the resonant frequency of the TE mode; the deeper the groove depth of the strip groove 2122 along the axial direction of the dielectric resonator 20, the higher the resonant frequency of the TE mode; the deeper the groove depth of the strip groove 2122 along the radial direction of the dielectric resonator 20, the higher the resonant frequency of the TE mode; the wider the groove width of the strip groove 2122, the higher the resonant frequency of the TE mode. Based on this, it is convenient to accurately adjust the number, size and shape of the second annular groove 2121 to accurately control the resonant frequency of the TE mode, so as to facilitate the accurate design of "the resonant frequency of the TE mode and the resonant frequency of the TM mode are within the passband range and close to the same frequency band", which is convenient to improve the performance of the dielectric cavity resonator.

[0096] Of course, in other possible embodiments, the strip groove 2122 can be changed to a curve groove, an arc groove, etc. The number of groove structures such as curve grooves and arc grooves can be one or multiple. In the case where the number of groove structures such as curve grooves and arc grooves is multiple, the multiple groove structures can be of the same type of groove, or can be a combination of different types of grooves; in the case where the multiple groove structures are of the same type of groove, the sizes of the multiple groove structures can be the same or different.

[0097] By adopting the above solution, by forming the second opening 212 on the periphery of the dielectric resonator 20 and making the second opening 212 communicate with the outer peripheral surface of the dielectric resonator 20 and at least one end surface of the dielectric resonator 20, so that the depth direction of the second opening 212 corresponds to the axial and radial directions of the dielectric resonator 20, it is convenient to thin a specific area of the dielectric resonator 20 along the axial and radial directions of the dielectric resonator 20, thereby conveniently, controllably and accurately increasing the resonant frequency of the TE mode.

[0098] Moreover, since the electric field of the TE mode is more concentrated around the peripheral side of the dielectric resonator 20, the second opening 212 is located at the periphery of the dielectric resonator 20 and communicates with the outer peripheral surface of the dielectric resonator 20. Therefore, the second opening 212 has the greatest influence on the resonance frequency of the TE mode. Based on this, a relatively significant increase in the resonance frequency of the TE mode can be achieved through the second opening 212, facilitating the convenient and rapid regulation of the resonance frequency of the TE mode, increasing the range of the resonance frequency of the TE mode that can be increased, and making it easier to increase the resonance frequency of the TE mode to the required range. At the same time, since the electric field of the TM mode is more concentratedly distributed at the central axis L of the dielectric resonator 20, based on the settings of this embodiment, the influence of the second opening 212 formed at the periphery of the dielectric resonator 20 on the resonance frequency of the TM mode can also be significantly reduced, realizing the convenient and controllable increase of the resonance frequency of the TE mode while basically keeping the resonance frequency of the TM mode stable. Thus, the adjustment convenience and adjustment accuracy of the resonance frequency of the TE mode can be improved, facilitating the precise design of "the resonance frequency of the TE mode and the resonance frequency of the TM mode are within the passband range and close to the same frequency band", and facilitating the improvement of the performance and design flexibility of the dielectric cavity resonator.

[0099] Moreover, the second opening 212 communicates with at least one end surface of the dielectric resonator 20, which is convenient for designing the mold, facilitating the integral molding of the dielectric resonator 20 and its second opening 212 via the mold. In particular, it can improve the demolding convenience of the mold after the dielectric resonator 20 is molded (demolding can be performed along the axial direction of the dielectric resonator 20), improve the molding convenience and molding accuracy of the dielectric resonator 20, and reduce the mold cost and the processing cost of the dielectric resonator 20.

[0100] Please refer to Figure 9 、 Figure 10 In some embodiments of the present application, the opening structure 21 includes a third opening 213 formed on the outer peripheral surface of the dielectric resonator 20, and the third opening 213 is provided between two end surfaces of the dielectric resonator 20.

[0101] It should be noted that regardless of whether the third opening 213 is in the form of an opening or a groove, the third opening 213 is formed on the outer peripheral surface of the dielectric resonator 20 and is located between two opposite end surfaces of the dielectric resonator 20 along the axial direction, that is, along the axial direction of the dielectric resonator 20, the third opening 213 does not communicate with any end surface of the dielectric resonator 20, and both opposite ends of the third opening 213 in the axial direction of the dielectric resonator 20 are closed.

[0102] Exemplarily, such as Figure 9As shown, in a possible embodiment, the third opening 213 includes at least one second hole 2131. The second hole 2131 is opened on the outer peripheral surface of the dielectric resonator 20. The depth direction of the second hole 2131 corresponds to the radial direction of the dielectric resonator 20. The second hole 2131 is provided between the two end faces of the dielectric resonator 20. The second hole 2131 may be a blind hole. The second hole 2131 may be a circular hole, a rectangular hole, an oval hole, an irregular hole, etc. In the case where there are multiple second holes 2131, the multiple second holes 2131 may be provided at the same axial height or may be flexibly arranged; in the case where the multiple second holes 2131 are provided at the same axial height, the multiple second holes 2131 may be arranged in an equiangular circular pattern or a non-equiangular circular pattern along the circumferential direction of the dielectric resonator 20. In the case where there are multiple second holes 2131, the multiple second holes 2131 may be of the same type or a combination of different types of holes; in the case where the multiple second holes 2131 are of the same type, the sizes of the multiple second holes 2131 may be the same or different.

[0103] Among them, the more the number of the second holes 2131, the higher the resonant frequency of the TE mode; the deeper the depth of the second hole 2131, the higher the resonant frequency of the TE mode; the larger the aperture of the second hole 2131, the higher the resonant frequency of the TE mode. Based on this, it is convenient to accurately adjust the number, size, shape and position of the second holes 2131 to accurately control the resonant frequency of the TE mode, so as to facilitate the accurate design of "the resonant frequency of the TE mode and the resonant frequency of the TM mode are within the passband range and close to the same frequency band", and facilitate improving the performance of the dielectric cavity resonator.

[0104] Exemplarily, as Figure 10 As shown, in another possible embodiment, the third opening 213 includes at least one third annular groove 2132. The third annular groove 2132 is opened on the outer peripheral surface of the dielectric resonator 20. The third annular groove 2132 is provided between the two end faces of the dielectric resonator 20. The third annular groove 2132 surrounds the outer circumference of the central axis L of the dielectric resonator 20. The central axis of the third annular groove 2132 (i.e., the circumferential axis) may be parallel to, intersect with or coincide with the central axis L of the dielectric resonator 20. The central axis of the third annular groove 2132 and the central axis L of the dielectric resonator 20 may be coincidentally arranged or spaced apart. The depth direction of the third annular groove 2132 corresponds to the radial direction of the dielectric resonator 20. The shape of the third annular groove 2132 may be in the shape of a cylindrical groove, a conical groove, a tabletop groove, a stepped surface groove or other shapes. In the case where there are multiple third annular grooves 2132, the multiple third annular grooves 2132 may be spaced apart along the axial direction of the dielectric resonator 20.

[0105] Among them, the more the number of the third annular grooves 2132, the higher the resonant frequency of the TE mode; the deeper the groove depth of the third annular grooves 2132, the higher the resonant frequency of the TE mode; the wider the groove width of the third annular grooves 2132, the higher the resonant frequency of the TE mode. Based on this, it is convenient to accurately adjust the number, size, shape and position of the third annular grooves 2132 to accurately control the resonant frequency of the TE mode, so as to facilitate the accurate design of "the resonant frequency of the TE mode and the resonant frequency of the TM mode are within the passband range and close to the same frequency band", which is beneficial to improving the performance of the dielectric cavity resonator.

[0106] Certainly, in other possible embodiments, the third annular grooves 2132 can be changed to straight grooves, strip grooves, curved grooves, arc grooves, etc. The number of groove structures such as straight grooves, strip grooves, curved grooves, arc grooves, etc. can be one or multiple. In the case where the number of groove structures such as straight grooves, strip grooves, curved grooves, arc grooves, etc. is multiple, the multiple groove structures can be of the same type of groove or a combination of different types of grooves; in the case where the multiple groove structures are of the same type of groove, the sizes of the multiple groove structures can be the same or different. In the case where there are multiple groove structures such as straight grooves, strip grooves, curved grooves, arc grooves, etc., along the circumferential direction of the dielectric resonator 20, the multiple groove structures can be arranged in an equiangular circular pattern or a non-equiangular circular pattern.

[0107] By adopting the above solution, by opening the third opening 213 on the outer peripheral surface of the dielectric resonator 20 and making the third opening 213 be arranged between the two end faces of the dielectric resonator 20, so that the depth direction of the third opening 213 corresponds to the radial direction of the dielectric resonator 20, it is convenient to thin a specific area of the dielectric resonator 20 along the radial direction of the dielectric resonator 20, thereby conveniently, controllably and accurately increasing the resonant frequency of the TE mode.

[0108] Moreover, since the electric field of the TE mode is more concentrated around the peripheral side of the dielectric resonator 20, when the third opening 213 is located on the outer peripheral surface of the dielectric resonator 20, the third opening 213 has the greatest impact on the resonance frequency of the TE mode. Therefore, a relatively significant increase in the resonance frequency of the TE mode can be achieved through the third opening 213, facilitating convenient and rapid adjustment of the resonance frequency of the TE mode, increasing the range of the resonance frequency of the TE mode that can be increased, and more easily increasing the resonance frequency of the TE mode to the required range. At the same time, since the electric field of the TM mode is more concentratedly distributed at the central axis L of the dielectric resonator 20, based on the settings of this embodiment, the impact of the third opening 213 formed on the outer peripheral surface of the dielectric resonator 20 on the resonance frequency of the TM mode can also be reduced to a large extent. It is possible to conveniently and controllably increase the resonance frequency of the TE mode while basically keeping the resonance frequency of the TM mode stable. Thus, the adjustment convenience and adjustment accuracy of the resonance frequency of the TE mode can be improved, facilitating the precise design of "the resonance frequency of the TE mode and the resonance frequency of the TM mode are within the passband range and close to the same frequency band", and facilitating the improvement of the performance and design flexibility of the dielectric cavity resonator.

[0109] In this application, the above-mentioned related embodiments regarding the "first opening 211", "second opening 212", and "third opening 213" can be implemented separately, in pairs, or all together. For example, in Figure 3 the illustrated embodiment, the dielectric resonator 20 may be provided with only the first opening 211; for example, in Figure 4 the illustrated embodiment, the dielectric resonator 20 may be provided with both the first opening 211 and the second opening 212; for another example, in Figure 6 the illustrated embodiment, the dielectric resonator 20 may be provided with only the second opening 212.

[0110] Please refer to Figure 4 、 Figure 5 、 Figure 10 , in some embodiments of this application, the above-mentioned embodiments of the second opening 212 and / or the embodiments of the third opening 213 are combined with the embodiments of the first opening 211. That is, the opening structure 21 of the dielectric resonator 20 includes the first opening 211 and the second opening 212; or, the opening structure 21 of the dielectric resonator 20 includes the first opening 211 and the third opening 213; or, the opening structure 21 of the dielectric resonator 20 includes the first opening 211, the second opening 212, and the third opening 213.

[0111] Since the electric field of the TE mode will be more concentrated around the peripheral side of the dielectric resonator 20, the second opening 212 is located at the periphery of the dielectric resonator 20 and communicates with the outer peripheral surface of the dielectric resonator 20, and the third opening 213 is located on the outer peripheral surface of the dielectric resonator 20. Therefore, the second opening 212 and the third opening 213 have the greatest influence on the resonant frequency of the TE mode, and the influence of the second opening 212 and the third opening 213 on the resonant frequency of the TE mode is more significant. And the first opening 211 avoids the outer peripheral surface of the dielectric resonator 20. Therefore, compared with the second opening 212 and the third opening 213, the first opening 211 has a smaller influence on the resonant frequency of the TE mode. Also, the first opening 211 avoids the central axis L of the dielectric resonator 20, and the first opening 211 will not lose the effect of increasing the frequency due to too small an influence on the resonant frequency of the TE mode.

[0112] By adopting the above solution, the resonant frequency of the TE mode can be significantly increased by a large margin through the second opening 212 and / or the third opening 213. At the same time, the resonant frequency of the TE mode is also slightly increased by the first opening 211. Based on this, on the basis of "facilitating the convenient and rapid regulation of the resonant frequency of the TE mode, increasing the range of the resonant frequency of the TE mode that can be improved, and making it easier to increase the resonant frequency of the TE mode to the required range", a more refined regulation of the resonant frequency of the TE mode can be achieved. That is, the resonant frequency of the TE mode can be greatly increased to near the required range through the second opening 212 and / or the third opening 213, and then the resonant frequency of the TE mode can be accurately and slightly increased to the required range through the first opening 211. In this way, a more refined regulation of the resonant frequency of the TE mode can be achieved, and while significantly increasing the resonant frequency of the TE mode by a large margin, the resonant frequency of the TE mode can be increased more accurately, precisely and stably, and the resonant frequency of the TE mode can be more accurately controlled, thus facilitating the precise design of "the resonant frequency of the TE mode and the resonant frequency of the TM mode are within the passband range and close to the same frequency band", and facilitating the improvement of the performance and design flexibility of the dielectric cavity resonator.

[0113] In some embodiments of the present application, the first plate 11 has a grounding component, and the opening structure 21 includes an annular recess. The annular recess continuously or intermittently surrounds to form a ring, and the central axis of the annular recess coincides with the central axis L of the dielectric resonator 20. The bottom of the annular recess is closed, and the grounding component closes the notch of the annular recess so that the resonant frequency of the HE dual mode is in the same frequency band as the resonant frequency of the TE mode and the resonant frequency of the TM mode.

[0114] The annular recess can be continuously or discontinuously annular along its own circumferential direction as a whole. The central axis of the annular recess (i.e., the circumferential axis) coincides with the central axis L of the dielectric resonator 20. In some embodiments, the annular recess can be a complete continuous annular structure, such as an annular groove. In other embodiments, the annular recess can also be a discontinuous and overall annular structure formed by a plurality of parts. For example, a plurality of arc-shaped grooves surround the axis and jointly form the annular recess, or a plurality of blind holes surround the axis and jointly form the annular recess, or a plurality of straight grooves surround the axis and jointly form the annular recess. The bottom of the annular recess is closed, that is, the annular recess does not include a through-hole structure. The annular recess can be provided on any end face, peripheral edge or outer peripheral surface of the dielectric resonator 20.

[0115] Among them, when the annular recess is a complete continuous annular groove, the notch of the annular recess is the notch of the annular groove. When the annular recess is a discontinuous and overall annular structure formed by a plurality of parts, the notch of the annular recess includes the openings of each part. For example, the notch of the annular recess includes the notches of each arc-shaped groove, or the annular recess includes the orifices of each blind hole, or the notch of the annular recess includes the notches of each straight groove, and so on.

[0116] It should be noted that the opening structure 21 can only include the annular recess; the opening structure 21 can also include both the annular recess and other structures other than the annular recess. For example, the opening structure 21 further includes Figure 3 the first hole 2111 which is a through-hole in. When the opening structure 21 includes both the annular recess and other structures other than the annular recess, it can be understood that the other structures other than the annular recess may not be annular, may also communicate with the opposite ends of the dielectric resonator 20, and the central axis of its structure may not coincide with the central axis L of the dielectric resonator 20.

[0117] The grounding component can be the first plate 11 itself, that is, the first plate 11 itself can serve as the grounding component, and the notch of the closed annular recess on the inner side of the first plate 11 itself; the grounding component can also be a metal grounding ring, a metal grounding post or a base 111 protruding from the first plate 11, and the notch of the closed annular recess is closed by the inner side of the metal grounding ring, the column surface of the metal grounding post or the end face of the base 111. The grounding component closes the notch of the annular recess, so that the grounding component and the annular recess can enclose at least one closed air cavity. In the air cavity, the electric field path of the HE dual mode will be vertically distributed and have no substantial transmission effect. Most of the electric field paths of the HE dual mode need to bend around the air cavity and have a substantial transmission effect. Based on this, the electric field path of the HE dual mode can be extended, the resonance frequency of the HE dual mode can be lowered and reduced, the resonance frequency of the HE dual mode can be made close to the resonance frequencies of the TE mode and the TM mode, and the resonance frequencies of the HE dual mode, the TE mode and the TM mode can all be within the passband range and close to the same frequency band. That is, the dielectric cavity resonator of this embodiment is a four-mode resonator.

[0118] The opening structure 21 includes an annular recess, that is, the annular recess has the relevant effects of the opening structure 21. The annular recess can make the dielectric resonator 20 locally thinner, especially the thickness of the part of the dielectric resonator 20 corresponding to the annular recess along its axis can be reduced, and the size of the part of the dielectric resonator 20 corresponding to the annular recess along its radial direction can also be reduced accordingly. Based on this, the resonance frequency of the TE mode can be increased, and by precisely designing the specific structure (such as annular grooves, multiple blind holes, multiple arc grooves, multiple straight grooves, etc.), size (such as depth, width, length, etc.), position, etc. of the annular recess, the resonance frequency of the TE mode can be finely increased, so as to make the resonance frequency of the TE mode close to the resonance frequency of the TM mode, close to the same frequency band, and within the passband range. Among them, the more the number of blind holes and grooves included in the annular recess, the higher the resonance frequency of the TE mode; the deeper the depth of each part of the annular recess, the higher the resonance frequency of the TE mode; the wider the width of each part of the annular recess, the higher the resonance frequency of the TE mode; the longer the extension path of the annular recess, the higher the resonance frequency of the TE mode; the closer the position of the annular recess is to the outer peripheral surface of the dielectric resonator 20, the higher the resonance frequency of the TE mode; and so on.

[0119] By adopting the above solution, the notch of the annular recess can be closed by the grounding component, so that the grounding component and the annular recess can enclose at least one closed air cavity. Through the air cavity, the electric field path of the HE dual mode therein is made to be vertically distributed, and most of the electric field, even all of the electric field paths of the HE dual mode need to bend around the air cavity, thereby extending the electric field path of the HE dual mode, lowering and reducing the resonance frequency of the HE dual mode, making the resonance frequency of the HE dual mode close to the resonance frequencies of the TE mode and the TM mode, and making the resonance frequencies of the HE dual mode, the TE mode, and the TM mode all within the passband range and close to the same frequency band. Thus, the dielectric cavity resonator can achieve four resonance modes of single-cavity coupling of the TE mode, the TM mode, and the HE dual mode, that is, the dielectric cavity resonator of this embodiment is a four-mode resonator. The dielectric cavity resonator of this embodiment can achieve a fourth-order filtering effect, which is equivalent to the filtering effect of four single-mode resonators connected in series, thereby optimizing and improving the performance and space utilization rate of the dielectric cavity resonator.

[0120] Moreover, the annular recess can also make the dielectric resonator 20 locally thinner, especially reducing the thickness of the part of the dielectric resonator 20 corresponding to the annular recess along its axial and radial directions, thereby increasing the resonance frequency of the TE mode, making the resonance frequency of the TE mode close to the resonance frequency of the TM mode, and making the resonance frequencies of the TE mode and the TM mode within the passband range and close to the same frequency band.

[0121] Moreover, compared with existing multi-mode resonators, the method of the dielectric cavity resonator to achieve four modes does not require a significant increase in the size of the dielectric resonator 20, which is beneficial to the miniaturization of the overall size of the dielectric cavity resonator, enabling the dielectric cavity resonator to meet the requirements of high performance and miniaturization.

[0122] Moreover, since the dielectric cavity resonator has four resonance modes of single-cavity coupling of the TE mode, the TM mode, and the HE dual mode, it is convenient to establish a coupling relationship between the dielectric cavity resonator and a resonator with any mode of the TE mode, the TM mode, the HE mode, and the TEM mode, and the coupling effect will be better, so that the usability, applicability, and practicality of the dielectric cavity resonator are better.

[0123] Moreover, in the actual application scenario, the dielectric cavity resonator can shorten the electric field path of the HE dual mode by making the grounding component not close the notches of all the annular recesses, so that the electric field path of the HE dual mode can directly pass through the annular recess, making all the annular recesses have the functions of "increasing the resonance frequency of the TE mode" and "pushing the resonance frequency of the HE dual mode away", and pushing the resonance frequency of the HE dual mode outside the passband range. Based on this, the dielectric cavity resonator can conveniently, quickly, and flexibly switch between a four-mode resonator and a TE-TM dual-mode resonator. Thus, the use flexibility and convenience of the dielectric cavity resonator are better.

[0124] Please refer to Figure 6 and Figure 7 In some embodiments of the present application, the dielectric resonator 20 includes a plurality of dielectric layers 22 arranged in sequence along its axial direction. Along the direction approaching the first plate 11, the cross-sectional dimensions of the dielectric layers 22 are tapered.

[0125] It should be noted that the dielectric resonator 20 includes a plurality of dielectric layers 22, and the plurality of dielectric layers 22 are arranged in sequence along the axial direction of the dielectric resonator 20 and are coaxially arranged.

[0126] Along the direction approaching the first plate 11, the cross-sectional dimensions of the dielectric layers 22 of the dielectric resonator 20 are tapered, that is, one end of the dielectric resonator 20 close to the first plate 11 is thinner, while the other end is thicker. Among them, the "cross-section" is a cross-section perpendicular to the central axis of the corresponding structure. Based on this, in each of the dielectric layers 22 of the dielectric resonator 20, a step is formed between every two adjacent dielectric layers 22. The outer periphery of each dielectric layer 22 and the end face of each dielectric layer 22 enclose the second annular groove 2121.

[0127] By adopting the above solution, by making the cross-sectional dimensions of the dielectric layers 22 of the dielectric resonator 20 tapered along the direction approaching the first plate 11, it can be promoted that one end of the dielectric resonator 20 close to the first plate 11 is thinner while the other end is thicker. Based on this, on the one hand, it can be promoted that the thickness of the dielectric resonator 20 decreases from its center to its periphery, so as to evenly and finely increase the resonance frequency of the TE mode, and can reduce the influence on the resonance frequency of the TM mode, and can basically keep the resonance frequency of the TM mode stable, so as to facilitate the precise design of "the resonance frequency of the TE mode and the resonance frequency of the TM mode are within the passband range and close to the same frequency band", and can facilitate the improvement of the performance and design flexibility of the dielectric cavity resonator. On the other hand, it can reduce the occupied space of one end of the dielectric resonator 20 close to the first plate 11, and can promote that one end of the dielectric resonator 20 close to the first plate 11 can vacate space for arranging coupling structures such as coupling ribs, so as to facilitate the planning design, construction of coupling, and can facilitate the improvement of the performance and design flexibility of the dielectric cavity resonator.

[0128] Of course, in other embodiments, along the direction approaching the first plate 11, the cross-sectional dimensions of the dielectric layers 22 of the dielectric resonator 20 can be tapered (that is, one end of the dielectric resonator 20 close to the first plate 11 is thicker, while the other end is thinner), or can be tapered first and then tapered (that is, the middle of the dielectric resonator 20 is thinner, while both ends are thicker), or can be tapered first and then tapered (that is, the middle of the dielectric resonator 20 is thicker, while both ends are thinner).

[0129] Please refer to Figure 2 and Figure 4 and Figure 6, in some embodiments of the present application, the first plate member 11 is convexly provided with a bottom platform 111, and the dielectric resonator 20 is connected to the bottom platform 111.

[0130] It should be noted that the bottom platform 111 is convexly provided on the side of the first plate member 11 facing the second plate member 12, that is, the inner side of the first plate member 11. The shape and size of the bottom platform 111 can be set as required. The bottom platform 111 can be used to position and install the dielectric resonator 20, raise the position of the dielectric resonator 20, and stabilize the installation position and installation state of the dielectric resonator 20. Among them, the dielectric resonator 20 can be directly connected and fixed to the bottom platform 111 by, but not limited to, welding, bonding, riveting, pressing, plugging, screw fastening, threaded connection, snap connection, etc., or can be indirectly connected and fixed to the bottom platform 111 through other structures (such as the ceramic base 30, etc.) connected thereto.

[0131] Since the magnetic field of the TM mode is horizontally annularly distributed and the electric field is vertically annularly distributed, the electric field of the TM mode will be more concentratedly distributed near the central axis L of the dielectric resonator 20 and the second plate member 12. Therefore, the bottom platform 111 can also be used to raise the resonance position of the TM mode.

[0132] By adopting the above solution, the dielectric resonator 20 can be connected to the bottom platform 111 to stably install the dielectric resonator 20 conveniently and quickly, thereby improving the assembly convenience and assembly efficiency of the dielectric resonator 20 and the assembly efficiency of the dielectric cavity resonator. And, through the bottom platform 111, an accurate installation position can be provided for the dielectric resonator 20 to promote the accurate positioning of the dielectric resonator 20 in the resonator housing 10. Based on this, the performance fluctuations caused by the inaccurate installation position of the dielectric resonator 20 can be reduced, and the stability and consistency of the performance of the dielectric cavity resonator can be improved. And, the position of the dielectric resonator 20 and the resonance position of the TM mode can be raised through the bottom platform 111 to strengthen the resonance index and optimize the resonance characteristics of the TM mode, which is beneficial to optimizing and improving the performance of the dielectric cavity resonator.

[0133] Of course, in other embodiments, the bottom platform 111 can be omitted, and the dielectric resonator 20 can be directly connected to the inner side surface of the first plate member 11, or can be indirectly connected and fixed to the inner side surface of the first plate member 11 through other structures (such as the ceramic base 30, etc.) connected thereto. This situation can be compatible with any of the above embodiments regarding the opening structure 21.

[0134] Please refer to Figure 2 、 Figure 3 、 Figure 4 、 Figure 6, in some embodiments of the present application, when the dielectric resonator 20 is connected to the bottom platform 111, the opening structure 21 is formed on the periphery of the dielectric resonator 20, and the opening structure 21 communicates with the end face of the dielectric resonator 20 facing the first plate 11; or, the opening structure 21 is formed on the end face of the dielectric resonator 20 facing the first plate 11.

[0135] It should be noted that since the bottom platform 111 is a protruding metal platform, the bottom platform 111 may affect the electric field directivity and electric field uniformity.

[0136] Therefore, when the dielectric resonator 20 is connected to the bottom platform 111, the opening structure 21 can be formed on the end face of the dielectric resonator 20 facing the first plate 11, so that the opening structure 21 has an opening facing the first plate 11. Alternatively, the opening structure 21 can be formed on the periphery of the dielectric resonator 20, and the side of the opening structure 21 close to the first plate 11 communicates with the end face of the dielectric resonator 20 facing the first plate 11, so that the opening structure 21 has a communication port facing the first plate 11.

[0137] Based on this, by adopting the above scheme, it can be promoted that the opening structure 21 has an opening or a communication port facing the first plate 11, the installation position of the opening structure 21 can be close to the main distribution area of the TE-mode electromagnetic field and far from the main distribution area of the TM-mode electromagnetic field, the distribution of the electromagnetic field and the refraction during the electromagnetic wave transmission can be stabilized in the case where the bottom platform 111 affects the electric field directivity and electric field uniformity, the risk of change in the distribution of the electromagnetic field and the refraction during the electromagnetic wave transmission can be reduced, so that the promotion effect of the opening structure 21 on the TE-mode resonance frequency can meet the expected effect, it is convenient to accurately design that "the resonance frequency of the TE mode and the resonance frequency of the TM mode are within the passband range and close to the same frequency band", and the performance of the dielectric cavity resonator can be optimized and improved.

[0138] Please refer to Figure 2 、 Figure 3 、 Figure 4 、 Figure 6 , in some embodiments of the present application, the dielectric cavity resonator includes a ceramic base 30, and the ceramic base 30 is separately connected between the dielectric resonator 20 and the first plate 11.

[0139] It should be noted that the ceramic base 30 is made of ceramic material, and the ceramic base 30 is a non-metallic part. In some embodiments, the ceramic base 30 can be an alumina base. Since both the ceramic base 30 and the dielectric resonator 20 are non-metallic parts, it is convenient to connect and fix the ceramic base 30 and the dielectric resonator 20, and the connection strength, connection reliability and connection stability between the ceramic base 30 and the dielectric resonator 20 can be improved. Among them, the connection between the ceramic base 30 and the dielectric resonator 20 can be realized by, but not limited to, bonding, welding and other methods.

[0140] Moreover, since the ceramic base 30 has better strength and impact resistance, it is convenient to connect and fix the ceramic base 30 to the first metal plate 11, and the risk of damage to the dielectric resonator 20 due to the connection operation can be reduced. Among them, the connection between the ceramic base 30 and the first plate 11 can be achieved by, but not limited to, bonding, welding, riveting, screw fastening and other methods.

[0141] By adopting the above scheme, it is convenient to connect and fix the ceramic base 30 and the dielectric resonator 20, both of which are non-metallic parts. The connection strength, reliability and stability between the ceramic base 30 and the dielectric resonator 20 can be improved, the risk of damage to the dielectric resonator 20 due to the connection operation can be reduced, and the connection difficulty and cost between the ceramic base 30 and the dielectric resonator 20 can be reduced. In addition, it is convenient to connect and fix the ceramic base 30 with better strength and impact resistance to the first metal plate 11, the risk of damage to the dielectric resonator 20 due to the connection operation can be reduced, and the connection convenience, strength, reliability and stability between the ceramic base 30 and the first plate 11 can be improved. Thus, the connection and fixation between the dielectric resonator 20 and the first plate 11 can be conveniently, quickly and reliably realized through the ceramic base 30.

[0142] Please refer to Figure 2 、 Figure 3 、 Figure 4 、 Figure 6 In some embodiments of the present application, a receiving groove 31 is formed on one side of the ceramic base 30 facing the dielectric resonator 20, and a fastening hole 32 penetrates through the bottom of the receiving groove 31. The ceramic base 30 is connected to the first plate 11 through a fastener 40 passing through the fastening hole 32. The fastener 40 does not protrude from the notch of the receiving groove 31, and the ceramic base 30 abuts against the dielectric resonator 20 and is fixedly connected.

[0143] It should be noted that the ceramic base 30 is provided with a receiving groove 31 and a fastening hole 32. The notch of the receiving groove 31 faces the dielectric resonator 20, and the shape, size, etc. of the receiving groove 31 can be set as required. The fastening hole 32 penetrates through the bottom of the receiving groove 31, and the fastening hole 32 can be, but not limited to, a circular hole. The fastener 40 passes through the fastening hole 32 and is fastened to the first plate 11 to fasten the ceramic base 30 to the first plate 11. The fastener 40 can be, but not limited to, a screw.

[0144] The receiving groove 31 is used to accommodate the fastener 40 so that the fastener 40 does not protrude from the notch of the receiving groove 31, facilitating the side surface of the ceramic base 30 facing the dielectric resonator 20 to abut against and be fixedly connected to the dielectric resonator 20. Among them, the fixed connection method between the ceramic base 30 and the dielectric resonator 20 can be, but not limited to, bonding, welding and other methods.

[0145] By adopting the above - mentioned solution, the fastener 40 can be passed through the fastening hole 32 and fixedly connected to the first plate member 11, so as to conveniently, quickly and reliably construct the connection between the ceramic base 30 and the first plate member 11, thereby improving the connection convenience, connection strength, connection reliability and connection stability between the ceramic base 30 and the first plate member 11. Moreover, the fastener 40 can be received in the receiving groove 31, so that the fastener 40 does not protrude from the notch of the receiving groove 31, which is convenient for the side surface of the ceramic base 30 facing the dielectric resonator 20 to abut against and be fixedly connected to the dielectric resonator 20. Thus, the risk of the dielectric resonator 20 being unstably connected due to the part of the fastener 40 protruding from the notch of the receiving groove 31 abutting against the dielectric resonator 20 can be reduced, and the connection convenience, connection strength, connection reliability and connection stability between the ceramic base 30 and the dielectric resonator 20 can be improved.

[0146] Based on this embodiment, in a specific application example, the dielectric resonator 20 has a central hole 23. Based on this, during the assembly process, the side surface of the ceramic base 30 facing the dielectric resonator 20 can be first abutted against and fixedly connected to the dielectric resonator 20, and then the fastener 40 can be passed through the fastening hole 32 from the central hole 23 of the dielectric resonator 20 and fixedly connected to the first plate member 11.

[0147] In another specific application example, regardless of whether the dielectric resonator 20 has a central hole 23, during the assembly process, the fastener 40 can be first passed through the fastening hole 32 and fixedly connected to the first plate member 11, and then the side surface of the ceramic base 30 facing the dielectric resonator 20 can be abutted against and fixedly connected to the dielectric resonator 20.

[0148] Of course, in other embodiments, in the case where the dielectric resonator 20 has a central hole 23, the receiving groove 31 can be omitted, and the fastener 40 can be directly received through the central hole 23 of the dielectric resonator 20, so as to facilitate the side surface of the ceramic base 30 facing the dielectric resonator 20 to abut against and be fixedly connected to the dielectric resonator 20.

[0149] In other embodiments, other methods (such as welding, riveting, etc.) can be adopted to realize the connection between the ceramic base 30 and the first plate member 11.

[0150] It should be noted that the "ceramic base 30" embodiment is suitable for being combined with the "base 111" embodiment, so that the ceramic base 30 is separately connected between the dielectric resonator 20 and the base 111. The "ceramic base 30" embodiment and the "base 111" embodiment can also be selectively set. Even, the dielectric resonator 20 can be directly connected to the inner side surface of the first plate member 11, and the base 111 and the ceramic base 30 can be omitted.

[0151] Please refer to Figure 3 、 Figure 5 、Figure 7 , Figure 8 In some embodiments of the present application, the dielectric resonator 20 has a rotationally symmetric structure.

[0152] It should be noted that the dielectric resonator 20 has a rotationally symmetric structure about its central axis L. For example, the dielectric resonator 20 can be a circular rod, a circular column, a regular polygon rod (such as a square rod), a regular polygon column, and so on. In the case where the dielectric resonator 20 is provided with an opening structure 21, the opening structure 21 also has a rotationally symmetric structure about the central axis L of the dielectric resonator 20.

[0153] As Figure 3 shown, in a specific application example, the opening structure 21 includes six first holes 2111, and the six first holes 2111 are arranged in an equiangular circular array around the central axis L of the dielectric resonator 20.

[0154] As Figure 8 shown, in another specific application example, the opening structure 21 includes four strip-shaped grooves 2122, and the four strip-shaped grooves 2122 are arranged in an equiangular circular array around the central axis L of the dielectric resonator 20.

[0155] As Figure 5 shown, in another specific application example, the opening structure 21 includes a first annular groove 2112 and a second annular groove 2121. The central axis L of the second annular groove 2121 and the central axis L of the first annular groove 2112 both coincide with the central axis L of the dielectric resonator 20. The second annular groove 2121 has a rotationally symmetric structure about the central axis L of the dielectric resonator 20, and the first annular groove 2112 has a rotationally symmetric structure about the central axis L of the dielectric resonator 20.

[0156] As Figure 7 shown, in another specific application example, the opening structure 21 includes a second annular groove 2121. The central axis L of the second annular groove 2121 coincides with the central axis L of the dielectric resonator 20, and the second annular groove 2121 has a rotationally symmetric structure about the central axis L of the dielectric resonator 20.

[0157] By adopting the above scheme, by making the dielectric resonator 20 have a rotationally symmetric structure, the structure, electromagnetic field distribution, etc. of the dielectric resonator 20 can be made substantially the same in different directions around the central axis L of the dielectric resonator 20, without directionality. Based on this, when the dielectric resonator 20 is assembled into the resonator housing 10, there is no need to consider the assembly angle and the limiting problem, and the assembly can be completed directly and quickly, thereby improving the assembly convenience and assembly efficiency of the dielectric resonator 20 and improving the assembly efficiency of the dielectric cavity resonator. Moreover, the performance fluctuation caused by inaccurate assembly angle of the dielectric resonator 20 can be reduced, and the stability and consistency of the performance of the dielectric cavity resonator can be improved.

[0158] Of course, in other embodiments, the dielectric resonator 20 may have a non-rotationally symmetric structure.

[0159] Please refer to Figure 2 , Figure 4 , Figure 6 , in some embodiments of the present application, the dielectric cavity resonator includes an adjusting screw 50, which is threadedly connected to the resonator housing 10 and is used to adjust the resonance frequency of the TM mode.

[0160] It should be noted that the number of adjusting screws 50 can be one or more. The adjusting screw 50 can be threadedly connected to any plate of the resonator housing 10 (such as the second plate 12, the first plate 11 or other side plates). The adjusting screw 50 can be directly threadedly connected to the threaded hole opened in the corresponding plate (such as the first threaded hole 121 of the second plate 12); or, the corresponding plate can be embedded with a first mounting member (not shown in the figure), and the adjusting screw 50 can be threadedly connected to the threaded hole of the first mounting member. The adjusting screw 50 is grounded based on its connection to the resonator housing 10.

[0161] The installation position of the adjusting screw 50 is not limited. Along the axial direction of the dielectric resonator 20, the adjusting screw 50 and the dielectric resonator 20 can be arranged in alignment or misalignment.

[0162] By adopting the above solution, it is convenient to adjust the adjusting screw 50 by screwing it in or out, so as to conveniently and quickly adjust the length of the part of the adjusting screw 50 extending into the resonator housing 10. Based on this, by adjusting the length of the part of the adjusting screw 50 extending into the resonator housing 10, the electric field of the TM mode can be affected, so as to independently adjust and finely adjust the resonance frequency of the TM mode, and the tuning is convenient, fast and accurate. That is, in this embodiment, the resonance frequency of the TM mode can be independently tuned through the grounded adjusting screw 50, and the resonance frequency of the TE mode is basically not affected. Among them, the longer the length of the part of the adjusting screw 50 extending into the resonator housing 10, the lower the resonance frequency of the TM mode; on the contrary, the shorter the length of the part of the adjusting screw 50 extending into the resonator housing 10, the higher the resonance frequency of the TM mode.

[0163] In some embodiments, the adjusting screw 50 is threadedly connected to the second plate 12. Such a setting can optimize the tuning effect of the adjusting screw 50 on the resonance frequency of the TM mode and can expand the tuning range of the adjusting screw 50 on the resonance frequency of the TM mode. In particular, when the adjusting screw 50 is threadedly connected to the second plate 12 and the adjusting screw 50 and the dielectric resonator 20 are arranged in alignment along the axial direction of the dielectric resonator 20, the tuning effect of the adjusting screw 50 on the resonance frequency of the TM mode is the best.

[0164] In some embodiments, if the dielectric resonator 20 has a central hole 23, and the adjusting screw 50 is axially opposite to the central hole 23 of the dielectric resonator 20, the central hole 23 of the dielectric resonator 20 can be used for the adjusting screw 50 to extend into it. With such a setting, when the length of the part of the adjusting screw 50 extending into the resonator housing 10 is relatively long, the adjusting screw 50 is allowed to extend into the central hole 23 of the dielectric resonator 20, so that the tuning range of the adjusting screw 50 can be correspondingly expanded, the adjustable range of the resonance frequency of the TM mode can be correspondingly expanded, and the performance index of the resonator can be correspondingly improved.

[0165] Please refer to Figure 2 、 Figure 4 、 Figure 6 In some embodiments of the present application, the dielectric cavity resonator includes a metal disk 60 and an insulating member 70. The metal disk 60 is axially opposite to the dielectric resonator 20. The metal disk 60 is connected to the second plate member 12 through the insulating member 70. The distance between the metal disk 60 and the dielectric resonator 20 is adjustable, and is used to adjust the resonance frequency of the TE mode.

[0166] It should be noted that the metal disk 60 is in a disk structure. The metal disk 60 can be made of a metal material, or the metal disk 60 can be made by covering a metal material on the surface of an insulating disk structure. The metal disk 60 can be a circular disk, a polygonal disk or other shapes. Axially along the dielectric resonator 20, the metal disk 60 is oppositely arranged and directly opposite to the dielectric resonator 20. The metal disk 60 is connected to the second plate member 12 through the insulating member 70, so that the metal disk 60 is insulated from the second plate member 12, so that the metal disk 60 is not grounded, so that the metal disk 60 is suspended between the second plate member 12 and the dielectric resonator 20, so that the metal disk 60 can compress the magnetic field of the TE mode. Among them, the insulating member 70 can be, but is not limited to, a plastic part, a plastic part, a wooden part, a ceramic part, a quartz part, a glass part, etc.

[0167] Among them, in some embodiments, the metal disk 60 can be penetrated with a through hole 61, and the insulating member 70 can be penetrated through the through hole 61 to connect the metal disk 60. Of course, in other embodiments, the metal disk 60 can omit the through hole 61, and the insulating member 70 can be connected to the metal disk 60 by means of bonding, welding, clamping, etc.

[0168] Among them, the insulating member 70 is penetrated through the second plate member 12, and the insulating member 70 can axially move relative to the second plate member 12 to drive the metal disk 60 to move in a direction close to or away from the dielectric resonator 20, so as to adjust the distance between the metal disk 60 and the dielectric resonator 20. As the distance between the metal disk 60 and the dielectric resonator 20 decreases, the metal disk 60 can enhance its compression effect on the magnetic field of the TE mode, thereby increasing the resonance frequency of the TE mode.

[0169] By adopting the above solution, relative to the second plate 12, the insulating member 70 can be axially moved along its axis, so as to drive the ungrounded metal disk 60 to approach or move away from the dielectric resonator 20 via the insulating member 70, thereby conveniently and quickly adjusting the distance between the metal disk 60 and the dielectric resonator 20. Based on this, by adjusting the distance between the metal disk 60 and the dielectric resonator 20, the compression effect of the metal disk 60 on the magnetic field of the TE mode can be adjusted, so as to independently adjust and finely adjust the resonance frequency of the TE mode, and the tuning is convenient, fast and accurate. That is, in this embodiment, the resonance frequency of the TE mode can be independently tuned via the ungrounded metal disk 60, and the resonance frequency of the TM mode is basically not affected. Among them, the smaller the distance between the metal disk 60 and the dielectric resonator 20, the more the metal disk 60 compresses the magnetic field of the TE mode, and the higher the resonance frequency of the TE mode; on the contrary, the larger the distance between the metal disk 60 and the dielectric resonator 20, the weaker the compression effect of the metal disk 60 on the magnetic field of the TE mode, and the lower the resonance frequency of the TE mode.

[0170] In addition, the resonance frequency of the TE mode can be increased by replacing the metal disk 60 with a larger area to enhance the compression effect of the metal disk 60 on the magnetic field of the TE mode.

[0171] Please refer to Figure 2 , Figure 4 , Figure 6 , in some embodiments of the present application, the shape of the metal disk 60 is a circular disk, the outer peripheral wall of the insulating member 70 is provided with an external thread, the insulating member 70 is connected to the center of the metal disk 60, and is threadedly connected to the second plate 12.

[0172] It should be noted that the shape of the metal disk 60 is a circular disk, that is, the metal disk 60 has a rotationally symmetric structure around its central axis.

[0173] Exemplarily, the insulating member 70 can be an insulating screw or an insulating screw rod, such as a plastic screw or a plastic screw rod. The insulating member 70 is connected to the center of the metal disk 60, so that the insulating member 70 and the metal disk 60 together have a rotationally symmetric structure around the central axis of the metal disk 60. The insulating member 70 is threadedly connected to the second plate 12, so as to axially move the insulating member 70 relative to the second plate 12 by screwing the insulating member 70 in or out. Among them, the insulating member 70 can be directly threadedly connected to the second threaded hole 122 of the second plate 12; or, the second plate 12 can be embedded with a second mounting member (not shown in the figure), and the insulating member 70 can be threadedly connected to the threaded hole of the second mounting member.

[0174] By adopting the above solution, by making the shape of the metal disk 60 a circular disk shape and connecting the insulating member 70 to the center of the metal disk 60, the insulating member 70 and the metal disk 60 can be made to have a rotationally symmetric structure around the central axis of the metal disk 60, which can promote the structure of the metal disk 60 and the compression effect on the TE-mode magnetic field to be basically the same in different directions around the central axis of the metal disk 60 and have no directionality. On this basis, by threadedly connecting the insulating member 70 to the second plate member 12, it is convenient to adjust the axial movement stroke of the insulating member 70 by screwing the insulating member 70 in or out, so as to conveniently, quickly, accurately and controllably drive the metal disk 60 to approach or move away from the dielectric resonator 20, and conveniently, quickly, stably, accurately and controllably adjust the distance between the metal disk 60 and the dielectric resonator 20. Moreover, the processing convenience and processing accuracy of the disk are relatively high. Thus, the tuning stability, tuning controllability and tuning accuracy of the resonance frequency of the TE mode can be effectively improved.

[0175] Of course, in other embodiments, the metal disk 60 may not be a disk.

[0176] In other embodiments, the insulating member 70 may be passed through the second plate member 12, that is, the insulating member 70 and the second plate member 12 are not threadedly connected. The insulating member 70 can directly move axially relative to the second plate member 12 to drive the metal disk 60 to approach or move away from the dielectric resonator 20, so as to adjust the distance between the metal disk 60 and the dielectric resonator 20. In this case, the second plate member 12 is provided with a mounting hole, and the insulating member 70 can be snap-fitted into the mounting hole. For example, the insulating member 70 can be deformed along its radial direction, and the insulating member 70 realizes the fixation and detachment from the mounting hole of the second plate member 12 through the deformation in its own radial direction. During each operation of detaching from the mounting hole and fixing to the mounting hole, the axial movement of the insulating member 70 relative to the second plate member 12 can be controlled directly; for another example, the hole wall of the mounting hole is provided with a clamping groove, and the outer peripheral wall of the insulating member 70 is provided with a plurality of beads arranged at intervals along its axial direction. The axial movement of the insulating member 70 relative to the second plate member 12 can be realized by driving different beads of the insulating member 70 to be fixed in the clamping groove.

[0177] Please refer to Figure 1 , some embodiments of the present application provide a filter, including the dielectric cavity resonator provided by the embodiments of the present application.

[0178] It should be noted that the filter may include one or more resonators, and at least one resonator adopts the dielectric cavity resonator provided by the embodiments of the present application. In the case where there are multiple resonators, the multiple resonators can be arranged and designed, and a coupling relationship can be constructed between adjacent two resonators as required.

[0179] By adopting the above solution, the filter can adopt the dielectric cavity resonator provided by the embodiments of the present application to improve the performance and power capacity of the filter, reduce the insertion loss, and reduce the size such as the volume.

[0180] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, or improvements made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A dielectric cavity resonator, characterized in that, Comprising: A resonator housing having a first plate member and a second plate member disposed opposite to each other; A dielectric resonator disposed within the resonator housing, one end of the dielectric resonator being connected to the first plate member, the other end of the dielectric resonator being spaced from the second plate member, the dielectric resonator being provided with an opening structure for raising the resonance frequency of the TE mode such that the resonance frequency of the TE mode and the resonance frequency of the TM mode are in the same frequency band; The first plate member has a grounding component, the opening structure includes an annular recess that continuously or discontinuously surrounds to form a ring, the central axis of the annular recess coincides with the central axis of the dielectric resonator, and the bottom of the annular recess is closed; The grounding component closes the notch of the annular recess such that the resonance frequency of the HE dual mode is in the same frequency band as the resonance frequency of the TE mode and the resonance frequency of the TM mode; or, the grounding component does not close the notch of the annular recess such that the resonance frequency of the HE dual mode is far from the resonance frequency of the TE mode and the resonance frequency of the TM mode.

2. The dielectric cavity resonator according to claim 1, characterized in that, The opening structure is disposed near the outer peripheral surface of the dielectric resonator and away from the central axis of the dielectric resonator.

3. The dielectric cavity resonator according to claim 1, wherein The opening structure includes at least one of an opening and a groove.

4. The dielectric cavity resonator according to claim 1, characterized in that, The opening structure axially communicates with at least one end face of the dielectric resonator.

5. The dielectric cavity resonator according to claim 1, characterized in that, The opening structure includes a first opening formed on the end face of the dielectric resonator, and the first opening is disposed between the outer peripheral surface of the dielectric resonator and the central axis of the dielectric resonator; And / or, the opening structure includes a second opening formed on the periphery of the dielectric resonator, and the second opening communicates with the outer peripheral surface of the dielectric resonator and at least one end face of the dielectric resonator; And / or, the opening structure includes a third opening formed on the outer peripheral surface of the dielectric resonator, and the third opening is disposed between the two end faces of the dielectric resonator.

6. The dielectric cavity resonator according to claim 1, wherein, The dielectric resonator includes a plurality of dielectric layers sequentially arranged along its axis; in the direction approaching the first plate member, the cross-sectional dimensions of each of the dielectric layers are tapered.

7. The dielectric cavity resonator according to claim 1, wherein The first plate member protrudes with a bottom platform, and the dielectric resonator is connected to the bottom platform.

8. The dielectric cavity resonator according to claim 7, characterized in that, The opening structure is formed on the periphery of the dielectric resonator, and the opening structure communicates with the end face of the dielectric resonator facing the first plate member; Or, The opening structure is formed on the end face of the dielectric resonator facing the first plate member.

9. The dielectric cavity resonator according to any one of claims 1-8, characterized in that, The dielectric cavity resonator includes a ceramic base, and the ceramic base is separately connected between the dielectric resonator and the first plate member.

10. The dielectric cavity resonator according to claim 9, wherein On the side of the ceramic base facing the dielectric resonator, a receiving groove is formed, a fastening hole penetrates through the bottom of the receiving groove, the ceramic base is connected to the first plate member by a fastener passing through the fastening hole, the fastener does not protrude from the notch of the receiving groove, and the ceramic base abuts against and is fixedly connected to the dielectric resonator.

11. The dielectric cavity resonator according to any one of claims 1-8, characterized in that, The dielectric resonator is a rotationally symmetric structure.

12. The dielectric cavity resonator according to any one of claims 1-8, characterized in that, The dielectric cavity resonator includes an adjusting screw threadedly connected to the resonator housing for adjusting the resonance frequency of the TM mode.

13. The dielectric cavity resonator according to any one of claims 1-8, characterized in that, The dielectric cavity resonator includes a metal disk and an insulator. The metal disk and the dielectric resonator are disposed opposite to each other along the axial direction of the dielectric resonator. The metal disk is connected to the second plate member through the insulator, and the distance between the metal disk and the dielectric resonator is adjustable for adjusting the resonance frequency of the TE mode.

14. The dielectric cavity resonator according to claim 13, characterized in that, The shape of the metal disk is a circular disk, and the outer peripheral wall of the insulator is provided with an external thread. The insulator is connected to the center of the metal disk and is threadedly connected to the second plate member.

15. A filter, characterized in that, It includes the dielectric cavity resonator according to any one of claims 1-14.

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